Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of reducing the consumption of a processing liquid.SOLUTION: A substrate processing device 100 includes a processing block PB1 and a transfer block TB. The processing block PB1 includes an upper substrate holding part 2A, a moving mechanism 220A, a processing cup row L, and an elevating mechanism 210A. The upper substrate holding part 2A holds the substrate W horizontally. The moving mechanism 220A moves the upper substrate holding part PB1 in a first direction D3 that is a direction parallel to a direction D1 in which the substrate W moves between the transport block TB and the processing block 2A. The processing cup row L includes a plurality of processing cup portions 6 aligned on the D1 in the first direction. The raising / lowering mechanism 210A raises and lowers at least one of the upper substrate holding portion 2A and the processing cup portion 6. The plurality of processing cup portions 6 include a first processing cup portion 61. The first processing cup portion 61 processes the substrate W while holding the processing liquid in contact with the substrate W located inside the first processing cup portion 61.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] Known substrate processing apparatuses for processing substrates include batch-type apparatuses that process multiple substrates at once, and single-wafer-type apparatuses that process substrates one by one. Batch-type substrate processing apparatuses process multiple substrates at once by immersing the substrates in a processing liquid. Single-wafer-type substrate processing apparatuses process substrates by holding the substrates horizontally and rotating them, and supplying a processing liquid to the rotating substrates (see, for example, Patent Document 1). Generally, single-wafer-type substrate processing apparatuses can be made smaller than batch-type substrate processing apparatuses, and therefore can consume less processing liquid. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-126886 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in single-wafer processing apparatuses, since the processing liquid is continuously supplied to the substrates, the consumption of the processing liquid cannot be reduced significantly when long-term processing is required. Therefore, there is room for further improvement in single-wafer processing apparatuses.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus capable of reducing the consumption of processing liquid. [Means for solving the problem]

[0006] According to one aspect of the present invention, a substrate processing apparatus includes a processing block and a transfer block. The processing block processes a substrate. The transfer block is disposed adjacent to the processing block. The transfer block includes a transfer device. The transfer device transfers the substrate between the transfer block and the processing block. The processing block includes an upper substrate holding unit, a movement mechanism, a processing cup array, and a lifting mechanism. The upper substrate holding unit holds the substrate horizontally. The movement mechanism moves the upper substrate holding unit in a first direction that is parallel to the direction in which the substrate moves between the transfer block and the processing block. The processing cup array includes a plurality of processing cup units lined up in the first direction. The lifting mechanism lifts and lowers at least one of the upper substrate holding unit and the corresponding processing cup unit so that the position of the substrate held by the upper substrate holding unit changes from one upper position among the respective upper positions of the processing cup units to a position inside the corresponding processing cup unit. The plurality of processing cup units includes a first processing cup unit. The first processing cup holds a processing liquid that is in contact with the substrate located inside the first processing cup to process the substrate.

[0007] In one embodiment, the plurality of processing cups include a plurality of first processing cups, each of which has a support portion for supporting the substrate, and the upper substrate holder transfers the different substrates between the support portions of the first processing cups.

[0008] In one embodiment, the substrate processing apparatus further includes a drainage unit. The processing liquid includes a chemical liquid. The substrate is processed with the chemical liquid in the first processing cup. The drainage unit drains the chemical liquid from the first processing cup. The upper substrate holding unit has an upper nozzle unit. The upper nozzle unit ejects a rinse liquid toward the substrate. The upper nozzle unit ejects the rinse liquid toward the substrate located inside the first processing cup from which the chemical liquid has been ejected by the drainage unit.

[0009] In one embodiment, the upper substrate holding unit includes an upper holding unit and an upper rotating unit. The upper holding unit holds the substrate horizontally. The upper rotating unit rotates the substrate integrally with the upper holding unit. After the discharge of the rinse liquid stops, the upper rotating unit rotates the substrate positioned inside the first processing cup unit to dry the substrate.

[0010] In one embodiment, the upper nozzle portion ejects gas toward the substrate when drying the substrate.

[0011] In one embodiment, the processing cup further includes a second processing cup. The second processing cup receives rinse liquid discharged from the substrate. The lifting mechanism changes the position of the processed substrate, which is the substrate processed in the first processing cup, from a position inside the first processing cup to a position above the first processing cup. The moving mechanism moves the upper substrate holding part, which holds the processed substrate, to an opposing position facing the second processing cup. The lifting mechanism changes the position of the processed substrate from a position above the second processing cup to a position inside the second processing cup.

[0012] In one embodiment, the upper substrate holder has an upper nozzle that discharges the rinse liquid toward the processed substrate located inside the second processing cup.

[0013] In one embodiment, the upper substrate holding unit includes an upper holding unit and an upper rotating unit. The upper holding unit holds the substrate horizontally. The upper rotating unit rotates the substrate integrally with the upper holding unit. After the discharge of the rinse liquid stops, the upper rotating unit rotates the processed substrate located inside the second processing cup unit to dry the processed substrate.

[0014] In one embodiment, the upper nozzle portion ejects gas toward the processed substrate when drying the processed substrate.

[0015] In one embodiment, the plurality of processing cups include a plurality of the first processing cups and one of the second processing cups. The processing liquid includes a chemical liquid. The substrate is processed in each of the first processing cups with a different type of chemical liquid. The movement mechanism moves the upper substrate holder according to a processing procedure that indicates a procedure for processing the substrate.

[0016] In one embodiment, each of the first processing cup parts includes a support part for supporting the substrate.

[0017] In one embodiment, the plurality of processing cups includes a plurality of the first processing cups and a plurality of the second processing cups. The processing liquid includes a chemical liquid. The substrate is processed in each of the first processing cups with a different type of chemical liquid. The plurality of first processing cups and the plurality of second processing cups are arranged according to a processing sequence that indicates a procedure for processing the substrate.

[0018] In one embodiment, each of the first processing cups has a support portion for supporting the substrate, and the second processing cup sandwiched between the first processing cups has a support portion for supporting the substrate.

[0019] In one embodiment, the processing sequence includes a final rinse process and a drying process for drying the substrate. The rinse process refers to a process for washing the chemical solution off the substrate processed in the first processing cup. The first processing cups include a third processing cup in which the process just before the final rinse process is performed. The second processing cups include a fourth processing cup in which the final rinse process and the drying process are performed. The upper substrate holding unit includes a first upper substrate holding unit and a second upper substrate holding unit. The moving mechanism includes a first moving mechanism and a second moving mechanism. The first moving mechanism moves the first upper substrate holding unit so that the substrate moves between the processing cups other than the fourth processing cup. The second moving mechanism moves the second upper substrate holding unit so that the substrate moves between the third processing cup and the fourth processing cup.

[0020] In one embodiment, the substrate processing apparatus further includes a control unit. The upper substrate holding unit includes an upper holding unit and an upper rotation unit. The upper holding unit holds the substrate. The upper rotation unit rotates the substrate integrally with the upper holding unit. The control unit controls the rotation of the substrate by the upper rotation unit. The movement mechanism moves the upper substrate holding unit holding the processed substrate in the first direction. When the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup unit to a position above the first processing cup unit and the movement mechanism moves the upper substrate holding unit holding the processed substrate in the first direction, the control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the processing liquid is supported on the upper surface of the processed substrate.

[0021] In one embodiment, the substrate processing apparatus further includes a control unit. The upper substrate holding unit has an upper holding unit, an upper rotation unit, and an upper nozzle unit. The upper holding unit holds the substrate. The upper rotation unit rotates the substrate integrally with the upper holding unit. The upper nozzle unit ejects a rinse liquid. The control unit controls the rotation of the substrate by the upper rotation unit. The upper nozzle unit ejects the rinse liquid toward the processed substrate located inside the first processing cup unit to form a liquid film of the rinse liquid on the upper surface of the processed substrate. The movement mechanism moves the upper substrate holding unit holding the processed substrate in the first direction. The control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the rinse liquid is supported on the upper surface of the processed substrate when the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup portion to a position above the first processing cup portion and the moving mechanism moves the upper substrate holding portion that holds the processed substrate in the first direction.

[0022] In one embodiment, the substrate processing apparatus further includes a moving nozzle and a nozzle movement unit. The second processing cup unit has a lower holding unit, a lower rotation unit, and a guard unit. The lower holding unit holds the substrate horizontally. The lower rotation unit rotates the substrate integrally with the lower holding unit. The guard unit surrounds the substrate held in the lower holding unit and receives chemical liquid discharged from the substrate. The upper substrate holding unit transfers the substrate to the lower holding unit after being processed in the first processing cup unit. The moving nozzle ejects the chemical liquid toward the substrate held in the lower holding unit. The nozzle movement unit moves the moving nozzle horizontally. The moving nozzle ejects the chemical liquid while moving in the horizontal direction.

[0023] In one embodiment, the first processing cup has a support portion that horizontally supports the plurality of substrates, and the first processing cup holds a processing liquid that is in contact with the plurality of substrates positioned inside the first processing cup to process the plurality of substrates.

[0024] In one embodiment, the processing block includes a plurality of the upper substrate holding units, a plurality of the movement mechanisms, and a plurality of the lifting mechanisms, the plurality of movement mechanisms corresponding to the plurality of upper substrate holding units, and the plurality of lifting mechanisms corresponding to at least one of the plurality of upper substrate holding units and the plurality of processing cup units.

[0025] In one embodiment, the processing block has a plurality of rows of processing cups arranged in a direction perpendicular to the first direction, an upper substrate holding portion provided for each row of processing cups, a moving mechanism provided for each row of processing cups, and a lifting mechanism provided for each row of processing cups.

[0026] In one embodiment, the processing block further includes an inter-row transport device that transports the substrate between the plurality of processing cup rows.

[0027] In one embodiment, the substrate processing apparatus further includes a lid member, the first processing cup having an upper surface opening through which the substrate passes, and the lid member covering the upper surface opening.

[0028] In one embodiment, the substrate processing apparatus further includes a cylindrical member. The upper substrate holding unit includes an upper base member and an upper gripping member. The upper gripping member is attached to the upper base member and grips the substrate horizontally. The first processing cup has an inner periphery. The inner periphery forms an upper opening through which the substrate passes. A side surface of the upper base member is positioned opposite the inner periphery when the substrate is positioned inside the first processing cup. The cylindrical member is positioned in a gap between the inner periphery and the upper base member when the substrate is positioned inside the first processing cup.

[0029] In one embodiment, the upper substrate holding section includes an upper base member and an upper gripping member. The upper gripping member is attached to the upper base member and grips the substrate horizontally. The first processing cup section includes an inner peripheral edge and an annular inner wall. The inner peripheral edge forms an upper opening through which the substrate passes. The inner wall is located below the inner peripheral edge. When the substrate is positioned inside the first processing cup section, the side surface of the upper base member covers the gap between the inner peripheral edge and the inner wall.

[0030] In one embodiment, the first processing cup includes an immersion tank that stores the processing liquid, and the substrate is immersed in the processing liquid in the immersion tank.

[0031] In one embodiment, the upper substrate holding unit has an upper holding unit and an upper rotating unit. The upper holding unit holds the substrate horizontally. The upper rotating unit rotates the substrate integrally with the upper holding unit. The immersion tank has a lower brush member that contacts the underside of the substrate. The upper rotating unit rotates the substrate immersed in the processing liquid and in contact with the lower brush member.

[0032] In one embodiment, the substrate processing apparatus further includes a brush processing unit. The brush processing unit brushes the upper surface of the substrate immersed in the processing liquid. The first processing cup unit has a lower substrate holding unit. The lower substrate holding unit holds the substrate horizontally inside the immersion tank. The upper substrate holding unit transfers the substrate to the lower substrate holding unit. The brush processing unit has an upper brush member and a brush rotation unit. The upper brush member contacts the upper surface of the substrate held by the lower substrate holding unit. The brush rotation unit rotates the upper brush member. The brush rotation unit rotates the upper brush member while the upper brush member is in contact with the upper surface of the substrate immersed in the processing liquid.

[0033] In one embodiment, the first processing cup includes a lower substrate holding portion. The lower substrate holding portion holds the substrate horizontally inside the immersion tank. The upper substrate holding portion includes an upper base member, an upper gripping member, an upper brush member, and an upper rotating portion. The upper gripping member is attached to the upper base member and grips the substrate. The upper brush member is attached to the upper base member and contacts the upper surface of the substrate held by the lower substrate holding portion. The upper rotating portion rotates the upper brush member and the upper gripping member integrally with the upper base member. The upper substrate holding portion transfers the substrate from the upper gripping member to the lower substrate holding portion. The upper rotating portion rotates the upper brush member while it is in contact with the upper surface of the substrate immersed in the processing liquid.

[0034] In one embodiment, the substrate processing apparatus further includes an undiluted liquid supply unit, the processing liquid includes a chemical liquid, the immersion tank stores the chemical liquid, and the undiluted liquid supply unit supplies the undiluted chemical liquid to the immersion tank.

[0035] In one embodiment, the first processing cup includes a support portion and a ring-shaped member, the support portion supports the substrate, and the ring-shaped member holds a liquid film of the processing liquid in contact with an upper surface of the substrate supported by the support portion.

[0036] In one embodiment, the first processing cup includes a support portion, a lower base member, and a lower nozzle portion. The support portion supports the substrate. The lower base member faces the lower surface of the substrate supported by the support portion. The lower nozzle portion is provided on the lower base member. The lower nozzle portion ejects the processing liquid. The processing liquid ejected from the lower nozzle portion is held in the gap between the lower surface of the substrate and the lower base member and comes into contact with the lower surface of the substrate. [Effects of the Invention]

[0037] According to the substrate processing apparatus of the present invention, the consumption of processing liquid can be reduced. [Brief explanation of the drawings]

[0038] [Figure 1] 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment. [Figure 2] 1 is a schematic plan view showing an enlarged view of a part of the substrate processing apparatus of Embodiment 1. FIG. [Figure 3] 1 is a block diagram of a substrate processing apparatus according to a first embodiment. [Figure 4] 1 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in the substrate processing apparatus of Embodiment 1. FIG. [Figure 5] FIG. 2 is an enlarged view schematically showing a cross section of the transfer unit and the immersion tank as viewed from the left side. [Figure 6] 1 is a diagram showing a part of the configuration of a substrate processing apparatus according to a first embodiment. [Figure 7] FIG. 3 is a diagram showing an example of an operation flow of the substrate processing apparatus according to the first embodiment. [Figure 8] 1(a) to 1(f) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus according to the first embodiment. [Figure 9] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 10] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 11] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 12] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 13] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 14] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 15]FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 16] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 17] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 18] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 19] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 20] FIG. 10 is a diagram showing the operation of the first processing block when one substrate is processed in the first processing cup row of the first processing block. [Figure 21] 10 is a schematic plan view showing an enlarged view of a part of the substrate processing apparatus of Modification 1. FIG. [Figure 22] 10 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a second modification. FIG. [Figure 23] FIG. 10 is a schematic plan view showing an enlarged view of a part of the substrate processing apparatus according to the second embodiment. [Figure 24] 10 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a second embodiment. FIG. [Figure 25] FIG. 11 is a schematic plan view showing an enlarged view of a part of the substrate processing apparatus according to the third embodiment. [Figure 26] 10 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a third embodiment. FIG. [Figure 27] FIG. 10 is a diagram showing a process of immersing a substrate in a first chemical liquid. [Figure 28] 11 is another cross-sectional view schematically showing a part of the configuration of the first processing block included in the substrate processing apparatus of Embodiment 3. FIG. [Figure 29]11 is yet another cross-sectional view schematically showing a part of the configuration of the first processing block included in the substrate processing apparatus of Embodiment 3. FIG. [Figure 30] FIG. 10 is a diagram showing an example of the flow of operations of the substrate processing apparatus according to the third embodiment. [Figure 31] FIG. 10 is a diagram showing an example of the flow of operations of the substrate processing apparatus according to the third embodiment. [Figure 32] 10(a) to 10(f) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus according to the third embodiment. [Figure 33] FIG. 10 is a diagram showing another example of the operation flow of the substrate processing apparatus according to the third embodiment. [Figure 34] 10(a) to 10(e) are diagrams schematically illustrating another example of the operation of the substrate processing apparatus according to the third embodiment. [Figure 35] FIG. 10 is a diagram showing a process of lifting the substrate from the first chemical liquid. [Figure 36] FIG. 10 is a diagram showing a process of lifting the substrate from the first chemical liquid. [Figure 37] 11 is a schematic plan view showing an enlarged view of a part of a substrate processing apparatus according to a third modification. FIG. [Figure 38] FIG. 11 is a diagram showing an example of an operation flow of the substrate processing apparatus according to Modification 3. [Figure 39] 10(a) to 10(d) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus of Modification 3. FIG. [Figure 40] 10(a) to 10(f) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus of Modification 4. FIG. [Figure 41] 10(a) to 10(d) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus of the fifth modified example. [Figure 42] 13 is a schematic plan view showing an enlarged view of a part of a substrate processing apparatus according to a sixth modification. FIG. [Figure 43] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a sixth modification. FIG. [Figure 44] 13(a) to 13(f) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus of the sixth modification. [Figure 45] 13 is a schematic plan view showing an enlarged view of a part of a substrate processing apparatus according to a seventh modification. FIG. [Figure 46] 13 is a schematic plan view showing an enlarged view of a part of a substrate processing apparatus according to Modification 8. FIG. [Figure 47] FIG. 13 is a block diagram of a substrate processing apparatus according to an eighth modification. [Figure 48] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a ninth modification. FIG. [Figure 49] 13 is a schematic plan view showing an enlarged view of a part of a substrate processing apparatus according to a tenth modification. FIG. [Figure 50] FIG. 23 is a block diagram of a substrate processing apparatus according to a tenth modification. [Figure 51] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a tenth modification. FIG. [Figure 52] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to an eleventh modification. FIG. [Figure 53] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a twelfth modification. FIG. [Figure 54] 23 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a thirteenth modification. FIG. [Figure 55] 13 is a cross-sectional view schematically showing the configuration of an immersion tank included in a substrate processing apparatus according to a fourteenth modification. FIG. [Figure 56] 10 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to Embodiment 4. FIG. [Figure 57] 10 is another cross-sectional view schematically showing a part of the configuration of the first processing block included in the substrate processing apparatus of Embodiment 4. FIG. [Figure 58] 10 is yet another cross-sectional view schematically showing a part of the configuration of the first processing block included in the substrate processing apparatus of Embodiment 4. FIG. [Figure 59] 10 is yet another cross-sectional view schematically showing a part of the configuration of the first processing block included in the substrate processing apparatus of Embodiment 4. FIG. [Figure 60] FIG. 10 is a diagram illustrating another example of puddle processing. [Figure 61]FIG. 10 is a diagram illustrating another example of puddle processing. [Figure 62] FIG. 10 is a diagram illustrating another example of puddle processing. [Figure 63] FIG. 10 is a schematic plan view showing an enlarged view of a part of the substrate processing apparatus according to the fifth embodiment. [Figure 64] FIG. 10 is a block diagram of a substrate processing apparatus according to a fifth embodiment. [Figure 65] 10(a) to 10(d) are diagrams schematically illustrating an example of the operation of the substrate processing apparatus according to the fifth embodiment. [Figure 66] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a fifth embodiment. FIG. [Figure 67] FIG. 13 is a schematic plan view showing an enlarged view of a part of the substrate processing apparatus according to the sixth embodiment. [Figure 68] FIG. 13 is a block diagram of a substrate processing apparatus according to a sixth embodiment. [Figure 69] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a sixth embodiment. FIG. [Figure 70] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in a substrate processing apparatus according to a seventh embodiment. FIG. [Figure 71] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in the substrate processing apparatus of Embodiment 8. FIG. [Figure 72] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in the substrate processing apparatus of Embodiment 9. FIG. [Figure 73] 13 is a cross-sectional view schematically showing a part of the configuration of a first processing block included in the substrate processing apparatus of Embodiment 10. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0039] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described with reference to the drawings (FIGS. 1 to 73). However, the present invention is not limited to the following embodiments, and can be implemented in various forms without departing from the spirit of the present invention. Note that where explanations are redundant, they may be omitted as appropriate. Furthermore, in the drawings, the same or equivalent parts are designated by the same reference numerals, and explanations will not be repeated.

[0040] The "substrate" to be processed in the substrate processing apparatus according to the present invention can be a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for an FED (Field Emission Display), a substrate for an optical disk, a substrate for a magnetic disk, or a substrate for a magneto-optical disk. The following description of an embodiment of the present invention will be primarily focused on a case where a disk-shaped semiconductor wafer is the substrate to be processed. However, the substrate processing apparatus according to the present invention can be similarly applied to various substrates other than the semiconductor wafers described above. Furthermore, the shape of the substrate is not limited to a disk shape, and the substrate processing apparatus according to the present invention can be applied to substrates of various shapes.

[0041] In this specification, for ease of understanding, the front-rear direction, left-right direction, and up-down direction are defined. The front-rear direction and left-right direction are parallel to the horizontal direction, and the up-down direction is parallel to the vertical direction. In this embodiment, for example, the side where multiple load ports LP are arranged relative to the load-unload block IB is the front side, and the side where the transport block TB is arranged relative to the load-unload block IB is the rear side (see FIG. 1). Also, the side where the first processing block PB1 is arranged relative to the transport block TB is the right side, and the side where the second processing block PB2 is arranged relative to the transport block TB is the left side (see FIG. 1). Also, the side where the support arm 201A is arranged relative to the upper substrate holder 2A is the upper side, and the side where the support plate 11 is arranged relative to the immersion tank 61a is the lower side (see FIG. 4).

[0042] [Embodiment 1] First, a first embodiment of the present invention will be described with reference to Figures 1 to 22. Figure 1 is a schematic plan view of a substrate processing apparatus 100 according to the first embodiment.

[0043] The substrate processing apparatus 100 is a single-wafer processing apparatus that processes substrates W one by one using a processing liquid. For example, the substrate processing apparatus 100 performs at least one of the following substrate processing on the substrates W: etching, surface treatment, property imparting, film formation, at least partial film removal, and cleaning. The processing liquid includes a chemical liquid and a rinse liquid.

[0044] The chemical solution includes, for example, dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acids (e.g., citric acid, oxalic acid), organic alkalis (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), surfactants, or corrosion inhibitors.

[0045] The rinse liquid is water such as pure water. The pure water may be, for example, deionized water (DIW). More specifically, the DIW may be ultrapure water. In this embodiment, the rinse liquid is DIW.

[0046] As shown in FIG. 1, the substrate processing apparatus 100 includes a plurality of load ports LP, a load / unload block IB, a transfer block TB, a first processing block PB1, a second processing block PB2, and a controller 101.

[0047] A cassette CA is placed on each load port LP. The cassette CA accommodates one or more stacked substrates W. The cassette CA may be, for example, a FOUP (Front Opening Unified Pod), a SMIF (Standard Mechanical Interface) pod, or an OC (Open Cassette).

[0048] The load ports LP are arranged adjacent to the front side of the loader / unloader block IB. Substrates W are loaded into the loader / unloader block IB from cassettes CA. Also, substrates W are unloaded from the loader / unloader block IB to the cassettes CA.

[0049] The transport block TB is disposed adjacent to the rear side of the load-in / load-out block IB. Substrates W are loaded into the transport block TB from the load-in / load-out block IB. The substrates W are unloaded from the transport block TB to the load-in / load-out block IB.

[0050] In this embodiment, the loading / unloading block IB has an indexer robot IR, and the transport block TB has a transport robot TR.

[0051] The indexer robot IR transports the substrate W between the cassette CA and the load / unload block IB. The indexer robot IR also transports the substrate W between the load / unload block IB and the transport block TB. Specifically, the indexer robot IR transports the substrate W between the cassette CA and the transport robot TR.

[0052] The transport robot TR transports the substrate W between the load / unload block IB and the transport block TB. The transport robot TR also transports the substrate W between the transport block TB and the first processing block PB1 and the second processing block PB2. Specifically, the transport robot TR transports the substrate W between the indexer robot IR and the first processing block PB1 and the second processing block PB2. The transport robot TR is an example of a "transport device."

[0053] In addition, a mounting table (path) on which the substrate W is temporarily placed may be provided between the indexer robot IR and the transport robot TR, and the device may be configured to indirectly transfer the substrate W between the indexer robot IR and the transport robot TR via the mounting table.

[0054] The first processing block PB1 is disposed adjacent to the right side of the transport block TB. The second processing block PB2 is disposed adjacent to the left side of the transport block TB. In other words, the transport block TB is disposed adjacent to the first processing block PB1 and the second processing block PB2. The transport block TB is also disposed between the first processing block PB1 and the second processing block PB2. The substrate processing apparatus 100 may include a plurality of first processing blocks PB1 stacked vertically and a plurality of second processing blocks PB2 stacked vertically.

[0055] The transport robot TR transports the substrate W received from the indexer robot IR into the first processing block PB1 or the second processing block PB2. The first processing block PB1 and the second processing block PB2 process the substrate W using a processing solution. The transport robot TR unloads the substrate W processed in the first processing block PB1 from the first processing block PB1 and hands it over to the indexer robot IR. Similarly, the transport robot TR unloads the substrate W processed in the second processing block PB2 from the second processing block PB2 and hands it over to the indexer robot IR.

[0056] In this embodiment, the first processing block PB1 has multiple processing cup rows L. In embodiment 1, the first processing block PB1 has four processing cup rows L (a first processing cup row L1, a second processing cup row L2, a third processing cup row L3, and a fourth processing cup row L4).

[0057] Each processing cup row L includes a plurality of processing cup sections 6 aligned in a first direction D1. In embodiment 1, each processing cup row L includes three processing cup sections 6. The first direction D1 indicates a direction parallel to the direction D3 in which the substrate W moves between the transport block TB and the first processing block PB1. Hereinafter, the direction D3 in which the substrate W moves between the transport block TB and the first processing block PB1 may be referred to as the "movement direction D3." In this embodiment, the movement direction D3 is parallel to the left-right direction. Furthermore, the first direction D1 is parallel to the left-right direction.

[0058] The movement direction D3 includes the direction in which the substrate W moves from the transport block TB to the inside of the first processing block PB1 (loading direction) and the direction in which the substrate W moves from the first processing block PB1 to the inside of the transport block TB (unloading direction). The first direction D1 includes the direction approaching the transport block TB and the direction away from the transport block TB.

[0059] The multiple processing cup rows L are aligned in the second direction D2. The second direction D2 is a direction perpendicular to the first direction D1. In other words, the second direction D2 is a direction perpendicular to the direction in which the substrate W moves between the transport block TB and the first processing block PB1 (movement direction D3). In this embodiment, the second direction D2 is parallel to the front-rear direction. The second direction D2 includes a direction approaching the load-in / load-out block IB and a direction away from the load-in / load-out block IB. In other words, the second direction D2 includes a direction approaching the load port LP and a direction away from the load port LP.

[0060] More specifically, the first processing block PB1 has a processing chamber 9, a plurality of upper substrate holders 2A, a plurality of substrate processing units PU, and a plurality of rail members 8. As will be described later with reference to FIGS. 2 and 3, the first processing block PB1 also has a plurality of moving members 200A. The rail members 8 and the moving members 200A are provided for each processing cup row L. Each of the plurality of substrate processing units PU includes a processing cup portion 6. In the first embodiment, the first processing block PB1 further has a plurality of mounting tables 7. The mounting tables 7 are provided for each processing cup row L.

[0061] Similar to the first processing block PB1, the second processing block PB2 has multiple processing cup rows L. Specifically, similar to the first processing block PB1, the second processing block PB2 has a processing chamber 9, multiple upper substrate holders 2A, multiple substrate processing units PU, multiple rail members 8, multiple moving parts 200A, and multiple mounting tables 7. The configuration of the second processing block PB2 is substantially the same as that of the first processing block PB1. Therefore, the following description will focus on the configuration of the first processing block PB1, and will omit a description of the second processing block PB2 as appropriate.

[0062] The control device 101 controls the operation of each part of the substrate processing apparatus 100. For example, the control device 101 controls the load port LP, the indexer robot IR, the transport robot TR, the plurality of substrate processing units PU, and the plurality of upper substrate holders 2A. The control device 101 also controls the plurality of moving parts 200A, which will be described later with reference to FIGS. 2 and 3. The control device 101 includes a control unit 102 and a memory unit 103.

[0063] The control unit 102 controls the operation of each unit of the substrate processing apparatus 100 based on various information stored in the storage unit 103. The control unit 102 has, for example, a processor. The processor of the control unit 102 includes a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). Alternatively, the control unit 102 may have a general-purpose computing unit or a dedicated computing unit.

[0064] The memory unit 103 stores various information for controlling the operation of the substrate processing apparatus 100. For example, the memory unit 103 stores data and computer programs. The data includes various recipe data. The recipe data includes process recipes. The process recipes are data that define processing procedures. The processing procedures indicate procedures for processing the substrate W. The control unit 102 controls the operation of each part of the substrate processing apparatus 100 in accordance with the processing procedures. The processing of the substrate W includes chemical processing, rinsing processing, and drying processing. For example, when processing the substrate W using one type of chemical liquid, the chemical processing, rinsing processing, and drying processing are performed on one substrate W in this order.

[0065] The storage unit 103 includes a main storage device. The main storage device includes, for example, a semiconductor memory. The storage unit 103 may further include an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 103 may also include removable media.

[0066] Next, the substrate processing apparatus 100 of embodiment 1 will be described with reference to Figures 1 to 3. Figure 2 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of embodiment 1. Figure 3 is a block diagram of the substrate processing apparatus 100 of embodiment 1.

[0067] As shown in FIG. 2, the first processing block PB1 further includes a moving part 200A provided for each processing cup row L. Each moving part 200A includes a support arm 201A. The processing chamber 9 has a generally box-like shape. In the first embodiment, the processing chamber 9 accommodates a plurality of upper substrate holders 2A, a plurality of processing cup parts 6 included in each processing cup row L, a plurality of support arms 201A, a plurality of mounting stages 7, and a plurality of rail members 8.

[0068] Each mounting table 7 supports a substrate W. Each mounting table 7 may support the substrate W horizontally. Specifically, each mounting table 7 has a plurality of support portions 7a and a support base 7b. Each support portion 7a protrudes from the upper surface of the support base 7b. The support portion 7a may be, for example, cylindrical. More specifically, the plurality of support portions 7a are arranged on the same circumference and support the peripheral edge of the substrate W.

[0069] Each mounting table 7 is arranged in a line in the first direction D1 (left-right direction) together with the multiple processing cup parts 6 included in the corresponding processing cup row L. Specifically, in the first processing block PB1, each mounting table 7 is arranged on the left side of the corresponding processing cup row L. In other words, each mounting table 7 is arranged in a position closer to the transport block TB than the corresponding processing cup row L. Similarly, in the second processing block PB2 shown in FIG. 1, each mounting table 7 is arranged in a position closer to the transport block TB than the corresponding processing cup row L.

[0070] The processing chamber 9 has a sidewall 91. The sidewall 91 refers to the wall of the processing chamber 9 on the transport block TB side. Specifically, the sidewall 91 of the first processing block PB1 is the left sidewall. The sidewall 91 of the second processing block PB2 shown in FIG. 1 is the right sidewall. Each mounting table 7 is located between the corresponding processing cup row L and the sidewall 91. Therefore, each mounting table 7 is located closer to the sidewall 91 than the corresponding processing cup row L.

[0071] The side wall 91 has a plurality of loading / unloading ports (not shown). Each loading / unloading port is an opening formed in the side wall 91. A loading / unloading port is provided for each processing cup row L. In the first embodiment, a loading / unloading port is provided for each mounting table 7. Specifically, each loading / unloading port is provided at a position adjacent to the corresponding mounting table 7 in the left-right direction.

[0072] The transport robot TR accesses the interior of the first processing block PB1 through each loading / unloading port. For example, the transport robot TR loads a substrate W into the interior of the first processing block PB1 through the loading / unloading port corresponding to the first processing cup row L1, and places the substrate W on the mounting table 7 corresponding to the first processing cup row L1. Specifically, the transport robot TR places the substrate W on a plurality of supports 7a. As a result, the substrate W is supported by the plurality of supports 7a.

[0073] Specifically, the transport robot TR is movable in the second direction D2 (front-rear direction). The substrate processing apparatus 100 further includes a movement mechanism (not shown) for moving the transport robot TR in the second direction D2 (front-rear direction).

[0074] The movement mechanism that moves the transport robot TR may include, for example, a ball screw mechanism and a reversible electric motor. The control unit 102 controls the movement mechanism to move the transport robot TR between positions adjacent to each of the loading / unloading ports in the left-right direction. In other words, the control unit 102 controls the movement mechanism to move the transport robot TR between positions corresponding to each mounting table 7. In other words, the control unit 102 controls the movement mechanism to move the transport robot TR between positions corresponding to each processing cup row L.

[0075] An upper substrate holding part 2A is provided for each processing cup row L. Each upper substrate holding part 2A holds a substrate W horizontally. Specifically, each upper substrate holding part 2A has a plurality of upper chuck members 31. The plurality of upper chuck members 31 grip the substrate W. The substrate W is held horizontally by the plurality of upper chuck members 31 gripping the substrate W. Specifically, the plurality of upper chuck members 31 are arranged on the same circumference and grip the peripheral edge of the substrate W. The upper chuck members 31 are an example of an "upper gripping member."

[0076] Each moving unit 200A moves the corresponding upper substrate holding unit 2A in the first direction D1 (left-right direction). Each support arm 201A supports the corresponding upper substrate holding unit 2A. Each rail member 8 guides the lifting mechanism 210A (see FIG. 3) coupled to the corresponding support arm 201A in the first direction D1 (left-right direction). Therefore, each upper substrate holding unit 2A is freely movable in the first direction D1 (left-right direction).

[0077] Each upper substrate holding part 2A moves in a first direction D1 (left-right direction) between the space above the corresponding mounting table 7 and the space above the corresponding processing cup row L. In the first embodiment, the upper substrate holding part 2A corresponding to the first processing cup row L1 moves between a facing position group including a facing position facing the mounting table 7 corresponding to the first processing cup row L1 and facing positions P1 (see FIG. 10) facing each of the multiple processing cup parts 6 included in the first processing cup row L1. The same applies to each upper substrate holding part 2A corresponding to the second processing cup row L2 to the fourth processing cup row L4.

[0078] Note that the opposing position facing the mounting table 7 refers to a position facing the mounting table 7 in the vertical direction. More specifically, the opposing position facing the mounting table 7 is a position above the mounting table 7. Similarly, the opposing position P1 facing the processing cup section 6 refers to a position facing the processing cup section 6 in the vertical direction. More specifically, the opposing position P1 facing the processing cup section 6 is a position above the processing cup section 6. Hereinafter, the opposing position facing the mounting table 7 may be referred to as the "opposing position of the mounting table 7." Similarly, the opposing position P1 facing the processing cup section 6 may be referred to as the "opposing position P1 of the processing cup section 6."

[0079] In this embodiment, each upper substrate holding part 2A is movable up and down. Each upper substrate holding part 2A descends from a position facing the corresponding mounting table 7 to a transfer position P11 (see FIG. 9) to grip a substrate W supported on the corresponding mounting table 7. The upper substrate holding part 2A corresponding to the first processing cup row L1 descends from a position facing one of the processing cup parts 6 included in the first processing cup row L1 (see FIG. 10) to move the substrate W to a position inside that one processing cup part 6. The same applies to the upper substrate holding parts 2A corresponding to the second processing cup row L2 to the fourth processing cup row L4. The transfer position P11 indicates a position in the vertical direction.

[0080] The plurality of processing cup parts 6 included in each processing cup row L includes a first processing cup part 61. In embodiment 1, all of the processing cup parts 6 are first processing cup parts 61. The substrate W is processed inside the first processing cup part 61. In other words, substrate processing is performed inside the first processing cup part 61. Specifically, the first processing cup part 61 holds the processing liquid in contact with the substrate W located inside the first processing cup part 61 to process the substrate W. Specifically, the substrate processing unit PU and the upper substrate holding part 2A work together to process the substrate W.

[0081] Each moving unit 200A is controlled by the control unit 102 to move the corresponding upper substrate holding unit 2A. In this embodiment, each moving unit 200A has a moving mechanism 220A and an elevating mechanism 210A. The moving mechanism 220A and the elevating mechanism 210A are controlled by the control unit 102.

[0082] Each lifting mechanism 210A raises and lowers the corresponding support arm 201A, thereby raising and lowering the corresponding upper substrate holding part 2A. For example, each lifting mechanism 210A raises and lowers the corresponding support arm 201A, thereby raising and lowering the corresponding upper substrate holding part 2A between the position facing the corresponding mounting table 7 and a transfer position P11 (see FIG. 9). The transfer position P11 is a position where the substrate W is transferred between the mounting table 7 and the upper substrate holding part 2A. Furthermore, the lifting mechanism 210A corresponding to the first processing cup row L1 lowers the corresponding support arm 201A, thereby lowering the corresponding upper substrate holding part 2A so that the position of the substrate W held by the corresponding upper substrate holding part 2A changes from a position above one of the processing cup parts 6 included in the first processing cup row L1 to a position inside that one processing cup part 6. The same applies to the lifting mechanisms 210A corresponding to the second to fourth processing cup rows L2 to L4.

[0083] Each moving mechanism 220A moves the corresponding lifting mechanism 210A along the corresponding rail member 8, thereby moving the corresponding support arm 201A in the first direction D1 (left-right direction). As a result, the corresponding upper substrate holding part 2A moves in the first direction D1 (left-right direction). In the first embodiment, each moving mechanism 220A moves the corresponding upper substrate holding part 2A between a facing position group including the facing position of the corresponding mounting table 7 and each facing position P1 (see FIG. 10) of the corresponding plurality of processing cup parts 6.

[0084] Next, the substrate processing apparatus 100 of the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 4 is a cross-sectional view schematically illustrating a portion of the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of the first embodiment. FIG. 4 is a cross-sectional view schematically illustrating the moving part 200A and the immersion tank 61a as viewed from the left side. FIG. 5 is an enlarged view schematically illustrating the cross-section of the moving part 200A and the immersion tank 61a as viewed from the left side. FIG. 4 shows the moving part 200A, the upper substrate holding part 2A, the first liquid supply part 12, and the substrate processing unit PU corresponding to the first processing cup row L1 of the first processing block PB1. FIG. 5 also shows the moving part 200A, the upper substrate holding part 2A, and the immersion tank 61a corresponding to the first processing cup row L1 of the first processing block PB1.

[0085] 4, in the first embodiment, the first processing block PB1 includes, in addition to the plurality of upper substrate holders 2A, the plurality of mounting stages 7, the plurality of rail members 8, the processing chamber 9, the plurality of processing cup rows L, and the plurality of moving parts 200A described with reference to FIGS. 1 to 3, a support plate 11, a first liquid supply unit 12, a second liquid supply unit 13, a first drainage unit 14, a second drainage unit 15, and an exhaust unit 17. Specifically, each of the substrate processing units PU described with reference to FIGS. 1 and 2 includes a first processing cup unit 61, a second liquid supply unit 13, a first drainage unit 14, a second drainage unit 15, and an exhaust unit 17. In other words, the first processing block PB1 includes the second liquid supply unit 13, the first drainage unit 14, the second drainage unit 15, and the exhaust unit 17 for each first processing cup unit 61.

[0086] In addition to a plurality of upper substrate holding portions 2A, a plurality of processing cup rows L, a plurality of mounting tables 7, and a plurality of rail members 8, the processing chamber 9 further accommodates a plurality of moving portions 200A, a support plate 11, a portion of each first liquid supply portion 12, a portion of each second liquid supply portion 13, a portion of each first drainage portion 14, a portion of each second drainage portion 15, and a portion of each exhaust portion 17.

[0087] The support plate 11 supports a plurality of processing cup sections 6 (see FIGS. 1 and 2) included in each processing cup row L. In the first embodiment, the support plate 11 also supports a plurality of mounting tables 7 (see FIGS. 1 and 2). Specifically, each processing cup section 6 is supported horizontally by the support plate 11. Each mounting table 7 is similarly supported horizontally by the support plate 11. The support plate 11 may be fixed to the side wall of the processing chamber 9, for example, or may be supported by a support column. The support plate 11 divides the interior of the processing chamber 9 into an upper space and a lower space.

[0088] Each upper substrate holding portion 2A is located below the corresponding support arm 201 A. Each upper substrate holding portion 2A has an upper holding portion 3, an upper rotating portion 4, and an upper nozzle portion 5A.

[0089] The upper holding unit 3 horizontally holds the substrate W. Specifically, the upper holding unit 3 further includes an upper spin base 32 in addition to the plurality of upper chuck members 31 described with reference to Fig. 2. The upper spin base 32 is an example of an "upper base member."

[0090] The multiple upper chuck members 31 described with reference to Fig. 2 are provided on the upper spin base 32. Specifically, the upper spin base 32 is substantially disk-shaped and supports the multiple upper chuck members 31 in a horizontal position. The multiple upper chuck members 31 are arranged on the periphery of the upper spin base 32 and protrude downward from the upper spin base 32. The multiple upper chuck members 31 grip the substrate W below the upper spin base 32. Therefore, the substrate W is held horizontally by the multiple upper chuck members 31 below the upper spin base 32. The operation of the multiple upper chuck members 31 is controlled by the control unit 102.

[0091] The upper rotation unit 4 rotates the substrate W integrally with the upper holding unit 3. The operation of the upper rotation unit 4 is controlled by the control unit 102. The upper rotation unit 4 has, for example, an upper shaft 41 and an upper motor body 42.

[0092] The lower end of the upper shaft 41 is coupled to the upper spin base 32. The upper shaft 41 protrudes upward from the upper spin base 32. The upper end of the upper shaft 41 is rotatably supported by the support arm 201A. A portion of the upper shaft 41 may be housed inside the support arm 201A.

[0093] The upper motor body 42 rotates the upper shaft 41. As a result, the upper spin base 32 rotates. The operation of the upper motor body 42 is controlled by the control unit 102. The upper motor body 42 is, for example, an electric motor. The upper motor body 42 may be housed inside the support arm 201A.

[0094] The upper nozzle unit 5A ejects the processing liquid downward. Specifically, the upper nozzle unit 5A has a tip. The upper nozzle unit 5A ejects the processing liquid from the tip surface of the upper nozzle unit 5A. In this embodiment, the tip of the upper nozzle unit 5A protrudes from the lower surface of the upper spin base 32. Note that the tip surface of the upper nozzle unit 5A may be flush with the lower surface of the upper spin base 32. Alternatively, the tip of the upper nozzle unit 5A may be located inside the upper spin base 32.

[0095] In the first embodiment, the first processing cup 61 includes an immersion tank 61a. The immersion tank 61a stores a processing liquid. Specifically, the immersion tank 61a is a container-like structure with an open top, and the processing liquid is stored in the internal space of the immersion tank 61a. The substrate W is immersed in a horizontal position in the processing liquid stored in the immersion tank 61a. More specifically, the immersion tank 61a stores at least a chemical liquid and a rinse liquid. By immersing the substrate W in the chemical liquid in the immersion tank 61a, the upper surface Wa and lower surface Wb of the substrate W are processed by the chemical liquid.

[0096] The immersion tank 61a may have an outer shape, for example, a substantially circular shape in plan view. The top surface of the immersion tank 61a has an opening. The immersion tank 61a may have a cylindrical shape with a bottom. Specifically, the immersion tank 61a has a bottom wall portion 611, a side wall portion 612, and an inner wall portion 613.

[0097] The bottom wall 611 may be, for example, substantially disk-shaped. The side wall 612 protrudes upward from the bottom wall 611. The side wall 612 is annular. The side wall 612 may be, for example, annular. The side wall 612 may be connected to the peripheral edge of the bottom wall 611. The upper end of the side wall 612 forms the top opening of the immersion tank 61a. In other words, the upper end of the side wall 612 constitutes the edge (inner peripheral edge) of the top opening of the immersion tank 61a. The substrate W passes through the top opening of the immersion tank 61a and moves inside the immersion tank 61a. The substrate W also passes through the top opening of the immersion tank 61a and moves outside the immersion tank 61a.

[0098] The inner wall portion 613 is provided inside the side wall portion 612 and protrudes upward from the bottom wall portion 611. The inner wall portion 613 is provided at a position away from the side wall portion 612. The upper end of the inner wall portion 613 is located lower than the upper end of the side wall portion 612. The inner wall portion 613 is annular. The inner wall portion 613 may have, for example, a circular ring shape. The processing liquid is stored inside the inner wall portion 613. Therefore, the substrate W is immersed in the processing liquid inside the inner wall portion 613. The processing liquid overflowing from the inner wall portion 613 flows out between the inner wall portion 613 and the side wall portion 612.

[0099] The immersion tank 61a has a lower nozzle section 5B. The lower nozzle section 5B ejects the processing liquid upward. Specifically, the lower nozzle section 5B has a tip. The lower nozzle section 5B ejects the processing liquid from the tip surface of the lower nozzle section 5B. In this embodiment, the tip of the lower nozzle section 5B protrudes from the bottom wall section 611 of the immersion tank 61a. Note that the tip surface of the lower nozzle section 5B may be flush with the upper surface of the bottom wall section 611. Alternatively, the tip of the lower nozzle section 5B may be located inside the bottom wall section 611.

[0100] The first liquid supply unit 12 supplies a processing liquid to the upper nozzle unit 5A. In the first embodiment, the first liquid supply unit 12 selectively supplies one of a chemical liquid and a rinse liquid (DIW in this embodiment) to the upper nozzle unit 5A. Specifically, the first liquid supply unit 12 has a chemical liquid piping unit 121, a rinse liquid piping unit 122, a common piping unit 123, a first opening / closing valve 125, and a second opening / closing valve 126.

[0101] The chemical liquid piping section 121, the rinse liquid piping section 122, and the common piping section 123 are tubular members through which fluids flow. A first on-off valve 125 is provided in the chemical liquid piping section 121. A second on-off valve 126 is provided in the rinse liquid piping section 122. The first on-off valve 125 and the second on-off valve 126 can be opened and closed freely. The opening and closing operations of the first on-off valve 125 and the second on-off valve 126 are controlled by the control section 102.

[0102] The chemical liquid is supplied to the upstream end of the chemical liquid piping section 121. The downstream end of the chemical liquid piping section 121 is connected to the common piping section 123. The first on-off valve 125 opens and closes the flow path in the chemical liquid piping section 121. When the first on-off valve 125 opens, the chemical liquid flows through the chemical liquid piping section 121 to the common piping section 123. As a result, the chemical liquid is supplied to the common piping section 123. When the first on-off valve 125 closes, the flow of the chemical liquid through the chemical liquid piping section 121 stops. As a result, the supply of the chemical liquid to the common piping section 123 stops.

[0103] The rinse liquid is supplied to the upstream end of the rinse liquid piping section 122. The downstream end of the rinse liquid piping section 122 is connected to the common piping section 123. The second on-off valve 126 opens and closes the flow path in the rinse liquid piping section 122. When the second on-off valve 126 opens, the rinse liquid flows through the rinse liquid piping section 122 to the common piping section 123. As a result, the rinse liquid is supplied to the common piping section 123. When the second on-off valve 126 closes, the flow of the rinse liquid through the rinse liquid piping section 122 stops. As a result, the supply of the rinse liquid to the common piping section 123 stops.

[0104] The downstream end of the common pipe 123 is connected to the upper nozzle 5A. The control unit 102 controls the first on-off valve 125 and the second on-off valve 126 to selectively allow one of the chemical liquid and the rinse liquid to flow into the common pipe 123. Therefore, the common pipe 123 selectively supplies one of the chemical liquid and the rinse liquid to the upper nozzle 5A. When the chemical liquid is supplied to the upper nozzle 5A via the common pipe 123, the chemical liquid is ejected from the upper nozzle 5A. Similarly, when the rinse liquid is supplied to the upper nozzle 5A via the common pipe 123, the rinse liquid is ejected from the upper nozzle 5A.

[0105] The second liquid supply unit 13 supplies a processing liquid to the lower nozzle unit 5B. In the first embodiment, the second liquid supply unit 13 selectively supplies one of a chemical liquid and a rinse liquid (DIW in this embodiment) to the lower nozzle unit 5B. Specifically, the second liquid supply unit 13 has a chemical liquid piping unit 131, a rinse liquid piping unit 132, a common piping unit 133, a first opening / closing valve 135, and a second opening / closing valve 136. The configuration of the second liquid supply unit 13 is similar to that of the first liquid supply unit 12, and therefore a detailed description thereof will be omitted.

[0106] The first drainage unit 14 discharges the processing liquid stored in the immersion tank 61a to the outside of the immersion tank 61a. In this embodiment, the first drainage unit 14 discharges the processing liquid stored inside the inner wall unit 613 to the outside of the first processing block PB1.

[0107] Specifically, the first drainage section 14 includes a common pipe section 141 , a drainage pipe section 142 , a recovery pipe section 143 , a first opening / closing valve 145 , and a second opening / closing valve 146 .

[0108] The common piping section 141, the drainage piping section 142, and the recovery piping section 143 are tubular members through which fluid flows. A first opening / closing valve 145 is provided in the drainage piping section 142. A second opening / closing valve 146 is provided in the recovery piping section 143. The first opening / closing valve 145 and the second opening / closing valve 146 can be opened and closed freely. The opening and closing operations of the first opening / closing valve 145 and the second opening / closing valve 146 are controlled by the control section 102.

[0109] The upstream end of the common piping section 141 is connected to the bottom wall 611 of the immersion tank 61a inside the inner wall 613 and communicates with the internal space of the immersion tank 61a. The processing liquid stored inside the inner wall 613 flows into the upstream end of the common piping section 141. The upstream end of the drainage piping section 142 is connected to the downstream end of the common piping section 141. The downstream end of the drainage piping section 142 is connected to a drain tank (not shown). The drain tank is installed outside the first processing block PB1.

[0110] The first on-off valve 145 opens and closes the flow path in the drainage piping section 142. When the first on-off valve 145 opens, the processing liquid stored inside the inner wall section 613 is discharged to the drainage piping section 142 via the common piping section 141. The processing liquid that flows from the immersion tank 61a through the common piping section 141 into the drainage piping section 142 is collected in a drain tank (not shown) via the drainage piping section 142. The drain tank stores the processing liquid discharged from the immersion tank 61a. The processing liquid discharged from the immersion tank 61a may be guided by the drainage piping section 142 to a waste liquid facility in a factory where the substrate processing apparatus 100 is installed.

[0111] The upstream end of the recovery piping section 143 is connected to the downstream end of the common piping section 141. The downstream end of the recovery piping section 143 is connected to the chemical tank 18, which will be described later with reference to FIG. 5. The second on-off valve 146 opens and closes the flow path in the recovery piping section 143. When the second on-off valve 146 opens, the processing liquid stored inside the inner wall section 613 is discharged to the recovery piping section 143 via the common piping section 141. The processing liquid that flows into the recovery piping section 143 from the immersion tank 61a via the common piping section 141 is recovered in the chemical tank 18 via the recovery piping section 143.

[0112] When discharging the processing liquid stored inside the inner wall portion 613 from the immersion tank 61a, the control unit 102 opens one of the first opening / closing valve 145 and the second opening / closing valve 146 and closes the other. When storing the processing liquid inside the inner wall portion 613, the control unit 102 closes both the first opening / closing valve 145 and the second opening / closing valve 146.

[0113] The second drainage unit 15 drains the processing liquid collected between the inner wall 613 and the side wall 612 of the immersion tank 61a from the immersion tank 61a. Specifically, the second drainage unit 15 has a drainage pipe 151 and an on-off valve 152. The drainage pipe 151 is a tubular member through which a fluid flows. The on-off valve 152 is provided in the drainage pipe 151. The on-off valve 152 can be opened and closed freely. The opening and closing operation of the on-off valve 152 is controlled by the control unit 102.

[0114] The upstream end of the drainage pipe 151 is connected to the bottom wall 611 of the immersion tank 61a between the inner wall 613 and the side wall 612, and communicates with the inner space of the immersion tank 61a. The processing liquid collected between the inner wall 613 and the side wall 612 flows into the drainage pipe 151. The downstream end of the drainage pipe 151 is connected to a drain tank (not shown). Therefore, the processing liquid collected between the inner wall 613 and the side wall 612 of the immersion tank 61a is discharged to the outside of the first processing block PB1.

[0115] The on-off valve 152 opens and closes the flow path in the drainage pipe section 151. When the on-off valve 152 opens, the processing liquid collected between the inner wall section 613 and the side wall section 612 is discharged through the drainage pipe section 151 to a drain tank (not shown).

[0116] The exhaust unit 17 exhausts gas from the space inside the immersion tank 61a to the outside of the first processing block PB1. Specifically, the exhaust unit 17 has an exhaust piping unit 171. The exhaust piping unit 171 is a tubular member through which a fluid flows.

[0117] The upstream end of the exhaust piping section 171 is connected to the side wall 612 of the immersion tank 61a and communicates with the space inside the immersion tank 61a. The downstream end of the exhaust piping section 171 may be connected to, for example, an exhaust device (not shown) provided in a factory in which the substrate processing apparatus 100 is installed. The exhaust device constantly sucks gas from the exhaust piping section 171 from the downstream end of the exhaust piping section 171. As a result, gas is sucked from the space inside the immersion tank 61a to the upstream end of the exhaust piping section 171.

[0118] The gas drawn to the upstream end of the exhaust piping section 171 flows through the exhaust piping section 171 and is sucked into an exhaust device (not shown). As a result, the gas inside the immersion tank 61a is exhausted to the outside of the first processing block PB1.

[0119] As shown in FIG. 5, in this embodiment, the rail members 8 include a first rail member 8a, a second rail member 8b, a third rail member 8c, a fourth rail member 8d, and a fifth rail member 8e.

[0120] The first rail member 8a and the second rail member 8b are fixed to the upper surface of the support plate 11. The third rail member 8c and the fourth rail member 8d are fixed to the lower surface of the support plate 11. The fifth rail member 8e is fixed to the floor surface of the processing chamber 9 (see FIG. 4).

[0121] The moving unit 200A includes a support arm 201A, a lifting mechanism 210A, and a moving mechanism 220A. The lifting mechanism 210A includes a housing 211, an upper plate 212, a lower plate 213, a screw shaft 214, a nut 215, an electric motor 216, a drive belt 217, and an elastic member 218.

[0122] The housing 211 is disposed below the support plate 11. The corresponding third rail member 8c and fourth rail member 8d engage with the upper wall portion of the housing 211. The corresponding fifth rail member 8e engages with the lower wall portion of the housing 211. Therefore, the housing 211 is guided in the first direction D1 (see FIG. 1) by the corresponding third rail member 8c, fourth rail member 8d, and fifth rail member 8e.

[0123] The lower plate 213 is disposed on the upper surface of the support plate 11. The lower plate 213 is engaged with the corresponding first rail member 8a and second rail member 8b. Therefore, the lower plate 213 is guided in the first direction D1 (see FIG. 1) by the corresponding first rail member 8a and second rail member 8b.

[0124] A through-hole through which the threaded shaft 214 is inserted is formed in the upper wall of the housing 211. The threaded shaft 214 extends in the vertical direction and protrudes from the inside of the housing 211 upward.

[0125] An elongated hole 11a extending in a first direction D1 (see FIG. 1) is formed in the support plate 11. The screw shaft 214 protruding from the housing 211 is inserted into the elongated hole 11a of the support plate 11.

[0126] The lower plate 213 is a plate-like member having a through-hole in the center. In other words, the lower plate 213 is annular in plan view. The lower plate 213 is disposed at a position where the through-hole of the lower plate 213 overlaps with the elongated hole 11a of the support plate 11. The screw shaft 214 protruding from the elongated hole 11a of the support plate 11 is inserted into the through-hole of the lower plate 213. The first rail member 8a is disposed in front of the elongated hole 11a of the support plate 11. The second rail member 8b is disposed behind the elongated hole 11a of the support plate 11.

[0127] The upper plate 212 is fixed to the lower surface of the support arm 201A. Like the lower plate 213, the upper plate 212 is a plate-like member having a through-hole in the center. In other words, the upper plate 212 is annular in plan view. The upper plate 212 is disposed at a position where the through-hole of the upper plate 212 overlaps with the through-hole of the lower plate 213 in plan view. The upper end of the screw shaft 214 protruding from the through-hole of the lower plate 213 is inserted into the through-hole of the upper plate 212 and fixed to the support arm 201A.

[0128] The screw shaft 214 is covered by the telescopic member 218 between the support plate 11 and the support arm 201A. Specifically, the upper end of the telescopic member 218 is fixed to the upper plate 212. The lower end of the telescopic member 218 is fixed to the lower plate 213. The screw shaft 214 protruding from the support plate 11 is housed inside the telescopic member 218. As a result, the screw shaft 214 protruding from the support plate 11 is covered by the telescopic member 218. The telescopic member 218 is freely expandable and contractible in the vertical direction. The telescopic member 218 is, for example, a bellows.

[0129] The screw shaft 214 and the nut 215 constitute a ball screw mechanism. More specifically, a screw groove is formed on the outer circumferential surface of the screw shaft 214. The nut 215 is housed in the housing 211. The nut 215 has a plurality of balls that contact the screw groove of the screw shaft 214. When the nut 215 rotates around the central axis of the screw shaft 214, the screw shaft 214 moves up and down. As a result, the support arm 201A moves up and down, and the upper substrate holding part 2A moves up and down.

[0130] The electric motor 216 is housed in the housing 211. The electric motor 216 generates a driving force that rotates the nut 215. In other words, the electric motor 216 generates a driving force that moves the screw shaft 214 in the up and down direction. Specifically, the electric motor 216 has a motor body 216a that can rotate forward and backward, a motor shaft 216b, and a motor pulley 216c. The motor body 216a may be fixed to, for example, an inner wall surface of the housing 211. The motor body 216a rotates the motor shaft 216b. The motor pulley 216c is fixed to, for example, the tip of the motor shaft 216b.

[0131] The drive belt 217 is housed in the housing 211. The drive belt 217 is wound around the outer circumferential surfaces of the motor pulley 216c and the nut 215. The drive belt 217 transmits the rotational force of the motor pulley 216c to the nut 215. The rotation of the motor pulley 216c causes the nut 215 to rotate.

[0132] Each movement mechanism 220A moves the corresponding lifting mechanism 210A in a first direction D1 (see FIG. 1). When the movement mechanism 220A moves the lifting mechanism 210A in the first direction D1 (see FIG. 1), the upper substrate holding part 2A moves in the first direction D1 (see FIG. 1). The movement mechanism 220A may, for example, have a ball screw mechanism and an electric motor that drives the ball screw mechanism, similar to the lifting mechanism 210A.

[0133] Next, the upper substrate holding unit 2A will be described with reference to Fig. 5. As shown in Fig. 5, the multiple upper chuck members 31 are arranged so that the center of the substrate W faces the center of the upper spin base 32. Therefore, when the upper holding unit 3 (the multiple upper chuck members 31) holds the substrate W, the center of the substrate W faces the center of the upper spin base 32.

[0134] The upper rotating unit 4 rotates the substrate W and the upper holding unit 3 together around a first rotation axis AX1 that extends in the vertical direction. More specifically, the first rotation axis AX1 passes through the center of the upper spin base 32. Therefore, the upper spin base 32 rotates around the center of the upper spin base 32. As a result, the substrate W rotates around the center of the substrate W.

[0135] The tip surface of the upper nozzle unit 5A faces the center of the substrate W held by the upper holding unit 3. Therefore, the processing liquid is discharged from the upper nozzle unit 5A toward the center of the substrate W. Specifically, the upper substrate holding unit 2A has a through hole 41a. The through hole 41a passes through the upper shaft 41 and the upper spin base 32 in the vertical direction along the first rotation axis AX1. The upper nozzle unit 5A is housed in the through hole 41a.

[0136] The upper substrate holding unit 2A further includes an upper chuck driving mechanism 50 that rotates the plurality of upper chuck members 31. For example, the upper chuck driving mechanism 50 includes a driving magnet 51, a driven magnet 52, and a lifting plate 53.

[0137] The drive magnet 51 is disposed inside the support arm 201A. The drive magnet 51 may be annular in plan view. In this case, the drive magnet 51 is disposed so as to surround the first rotation axis AX1. Alternatively, the upper chuck drive mechanism 50 may have a plurality of drive magnets 51. In this case, the plurality of drive magnets 51 are disposed around one circumference so as to surround the first rotation axis AX1.

[0138] The driven magnet 52 and the lifting plate 53 are disposed inside the upper spin base 32. The lifting plate 53 is annular in plan view. The lifting plate 53 is disposed so as to surround the periphery of the first axis of rotation AX1. The lifting plate 53 is biased upward by a biasing member (not shown).

[0139] The driven magnet 52 is fixed to the lift plate 53. The driven magnet 52 is disposed directly below the drive magnet 51. The driven magnet 52 may be annular in plan view. In this case, the driven magnet 52 is disposed so as to surround the first rotation axis AX1. Alternatively, the upper chuck drive mechanism 50 may have a plurality of driven magnets 52. In this case, the plurality of driven magnets 52 are disposed around one circumference so as to surround the first rotation axis AX1.

[0140] The drive magnet 51 moves up and down by an elevator mechanism (not shown). The elevator mechanism that raises and lowers the drive magnet 51 is controlled by the control unit 102. As the drive magnet 51 rises and lowers, the driven magnet 52 and the elevator plate 53 rise and lower.

[0141] The lifting plate 53 is provided with a cam or link mechanism that rotates each upper chuck member 31 between a holding position and a non-holding position. Therefore, when the lifting plate 53 moves up and down, each upper chuck member 31 rotates between the holding position and the non-holding position. When each of the plurality of upper chuck members 31 rotates from the non-holding position to the holding position, the substrate W is gripped by the plurality of upper chuck members 31. When each of the plurality of upper chuck members 31 rotates from the holding position to the non-holding position, the grip of the substrate W by the plurality of upper chuck members 31 is released.

[0142] Next, the immersion tank 61a will be described with reference to Fig. 5. As shown in Fig. 5, the side wall portion 612 includes an upper wall portion 612a and a lower wall portion 612b. The lower wall portion 612b extends upward from the bottom wall portion 611. The upper wall portion 612a is inclined inwardly from the upper end of the lower wall portion 612b.

[0143] In this embodiment, the upper wall portion 612a (inclined portion) extends to a position facing the inner wall portion 613 in the vertical direction. The upper end of the upper wall portion 612a (the upper end of the side wall portion 612) is located higher than the upper end of the inner wall portion 613. The upper end of the upper wall portion 612a (the upper end of the side wall portion 612) faces the inner wall portion 613 in the vertical direction. Therefore, a gap (space) is formed between the upper end of the upper wall portion 612a (the upper end of the side wall portion 612) and the upper end of the inner wall portion 613.

[0144] The immersion tank 61a further has a plurality of supports 614. The supports 614 protrude from the bottom wall 611 of the immersion tank 61a. Specifically, the supports 614 are arranged inside the inner wall 613. The supports 614 may be, for example, cylindrical. The supports 614 support the substrate W horizontally. Specifically, the supports 614 are arranged on the same circumference and support the peripheral edge of the substrate W.

[0145] The upper end of each support portion 614 is located lower than the upper end of the inner wall portion 613. In other words, the height of each support portion 614 from the bottom wall portion 611 is lower than the height of the inner wall portion 613 from the bottom wall portion 611. The substrate W supported by the multiple support portions 614 is immersed in the processing liquid stored inside the inner wall portion 613.

[0146] The upper substrate holding part 2A (upper holding part 3) transfers the substrate W between the plurality of supports 614. Specifically, the upper substrate holding part 2A (upper holding part 3) places the substrate W on the plurality of supports 614. As a result, the substrate W is supported by the plurality of supports 614. Furthermore, the upper substrate holding part 2A (upper holding part 3) grips the peripheral edge of the substrate W supported by the plurality of supports 614 with the plurality of upper chuck members 31. As a result, the substrate W is held by the upper substrate holding part 2A (upper holding part 3).

[0147] Next, the substrate processing apparatus 100 of the first embodiment will be described with reference to Fig. 6. Fig. 6 is a diagram showing a portion of the configuration of the substrate processing apparatus 100 of the first embodiment. Fig. 6 also shows the support arm 201A, the upper substrate holder 2A, and the immersion tank 61a corresponding to the fourth processing cup row L4 of the first processing block PB1. As shown in Fig. 6, the substrate processing apparatus 100 further includes a chemical tank 18, a circulation pipe 181, a circulation pump 182, a circulation heater 183, and a circulation filter 184.

[0148] The chemical liquid is stored in the chemical liquid tank 18. The circulation pipe 181 is a tubular member through which a fluid flows. One end and the other end of the circulation pipe 181 are connected to the chemical liquid tank 18. The circulation pump 182 is provided in the circulation pipe 181. The circulation pump 182 sends the chemical liquid so that the chemical liquid flows inside the circulation pipe 181 from one end to the other end of the circulation pipe 181. As a result, the chemical liquid circulates through the circulation pipe 181 via the chemical liquid tank 18. The circulation pump 182 is controlled by the control unit 102.

[0149] One end of a recovery pipe 143 is further connected to the chemical tank 18. The other end of the recovery pipe 143 is connected to the bottom wall 611 of the immersion tank 61a via the common pipe 141. Therefore, when the second on-off valve 146 is opened, the chemical discharged from the immersion tank 61a is recovered into the chemical tank 18 via the common pipe 141 and the recovery pipe 143.

[0150] The circulation heater 183 is provided in the circulation pipe 181. The circulation heater 183 heats the chemical liquid circulating through the circulation pipe 181 to a target temperature. The circulation filter 184 is provided in the circulation pipe 181. The circulation filter 184 removes foreign matter from the chemical liquid circulating through the circulation pipe 181.

[0151] One end of chemical liquid pipe section 121 is connected to circulation pipe 181. The other end of chemical liquid pipe section 121 is connected to upper nozzle section 5A via common pipe section 123. When first on-off valve 125 is opened, the chemical liquid that has flowed from circulation pipe 181 into chemical liquid pipe section 121 flows through chemical liquid pipe section 121 and common pipe section 123 toward upper nozzle section 5A. As a result, the chemical liquid is discharged from upper nozzle section 5A.

[0152] Similarly, one end of chemical liquid piping section 131 is connected to circulation piping 181. The other end of chemical liquid piping section 131 is connected to lower nozzle section 5B via common piping section 133. When first on-off valve 135 is opened, the chemical liquid that has flowed from circulation piping 181 into chemical liquid piping section 131 flows through chemical liquid piping section 131 and common piping section 133 toward lower nozzle section 5B. As a result, the chemical liquid is ejected from lower nozzle section 5B.

[0153] The chemical solution discharged from the immersion tank 61a does not have to be recovered in the chemical solution tank 18. In this case, the recovery pipe section 143 and the second opening / closing valve 146 of the first drainage section 14 may be omitted.

[0154] As described above with reference to FIGS. 1 to 6 , according to the first embodiment, the chemical liquid can be supplied to the upper nozzle unit 5A and the lower nozzle unit 5B from the same circulation pipe 181. Specifically, the substrate processing apparatus 100 of the first embodiment processes a single substrate W by immersing the substrate W in a horizontal position in the chemical liquid. Therefore, it is not necessary to continuously supply the chemical liquid to the substrate W. Therefore, the flow rate of the chemical liquid supplied to the upper nozzle unit 5A and the lower nozzle unit 5B (the amount of the chemical liquid flowing per unit time) can be reduced compared to a configuration in which the chemical liquid is continuously supplied to the substrate W. As a result, the chemical liquid can be supplied to the upper nozzle unit 5A and the lower nozzle unit 5B from the same circulation pipe 181.

[0155] Furthermore, according to the first embodiment, the chemical liquid can be supplied to the upper nozzle portion 5A and the lower nozzle portion 5B from the same circulation pipe 181, which allows the device to be made smaller.

[0156] Next, with reference to FIGS. 1 to 7 and 8(a) to 8(f), an example of the operation of the substrate processing apparatus 100 of the first embodiment will be described using the first processing cup row L1 of the first processing block PB1 as an example. FIG. 7 is a diagram showing an example of the flow of the operation of the substrate processing apparatus 100 of the first embodiment. Specifically, FIG. 7 shows an example of the flow of the process executed by the control unit 102 when three substrates W (first substrate W1, second substrate W2, and third substrate W3) are processed in the first processing cup row L1 of the first processing block PB1. FIGS. 8(a) to 8(f) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of the first embodiment. Specifically, FIGS. 8(a) to 8(f) show an example of the operation of the first processing block PB1 when three substrates W (first substrate W1, second substrate W2, and third substrate W3) are processed in the first processing cup row L1 of the first processing block PB1. In the following, the three immersion tanks 61a included in the first processing cup row L1 of the first processing block PB1 may be referred to as the "first immersion tank 61a1," "second immersion tank 61a2," and "third immersion tank 61a3," in order from the left (in order from closest to the mounting table 7).

[0157] The process shown in Fig. 7 includes steps S1 to S18. The process shown in Fig. 7 starts when the transport robot TR places the first substrate W1 on the mounting table 7. As shown in Figs. 7 and 8(a), the control unit 102 controls the transport robot TR to place the first substrate W1 on the mounting table 7, and then controls the movement unit 200A (elevation mechanism 210A and movement mechanism 220A) and the upper substrate holding unit 2A (upper chuck drive mechanism 50) to grip the first substrate W1 placed on the mounting table 7 with the multiple upper chuck members 31. As a result, the first substrate W1 is held horizontally by the upper substrate holding unit 2A (upper holding unit 3) (step S1).

[0158] 7 and 8(b), when the first substrate W1 is held by the upper substrate holding unit 2A (upper holding unit 3), the control unit 102 controls the moving unit 200A (elevating mechanism 210A and moving mechanism 220A) to immerse the first substrate W1, which is held horizontally by the upper substrate holding unit 2A (upper holding unit 3), in the chemical solution stored in the first immersion tank 61a1 (step S2). As a result, the upper surface Wa and lower surface Wb of the first substrate W1 are treated with the chemical solution. Specifically, the moving unit 200A moves the first substrate W1, which is held by the upper substrate holding unit 2A (upper holding unit 3), to a position where it contacts the upper surfaces of the plurality of supports 614 provided in the first immersion tank 61a1.

[0159] When the first substrate W1 held by the upper substrate holding part 2A (upper holding part 3) is immersed in the chemical solution in the first immersion tank 61a1, the control part 102 controls the upper substrate holding part 2A (upper chuck driving mechanism 50) to release the grip of the first substrate W1 by the multiple upper chuck members 31. As a result, the first substrate W1 is supported by the supports 614 of the first immersion tank 61a1, and the first substrate W1 is left in the first immersion tank 61a1 (step S3). The first substrate W1 left in the first immersion tank 61a1 is immersed in the chemical solution.

[0160] The control unit 102 controls the transport robot TR to place the second substrate W2 on the mounting table 7 while the first substrate W1 is moving from the mounting table 7 to the inside of the first immersion tank 61a1, or after the first substrate W1 has moved to the inside of the first immersion tank 61a1.

[0161] After the transfer robot TR places the second substrate W2 on the mounting table 7, the control unit 102 causes the upper substrate holding unit 2A (upper holding unit 3) to hold the second substrate W2 (step S4), similar to step S1.

[0162] When the second substrate W2 is held by the upper substrate holding part 2A (upper holding part 3), the control part 102 immerses the second substrate W2 in the chemical solution stored in the second immersion tank 61a2 (step S5), similar to step S2. As a result, the upper surface Wa and the lower surface Wb of the second substrate W2 are treated with the chemical solution.

[0163] When the second substrate W2 held by the upper substrate holding part 2A (upper holding part 3) is immersed in the chemical solution in the second immersion tank 61a2, the control part 102 causes the second substrate W2 to remain in the second immersion tank 61a2 (step S6), as in step S3.

[0164] The control unit 102 controls the transport robot TR to place the third substrate W3 on the mounting table 7 while the second substrate W2 is moving from the mounting table 7 to the inside of the second immersion tank 61a2, or after the second substrate W2 has moved to the inside of the second immersion tank 61a2.

[0165] After the transport robot TR places the third substrate W3 on the mounting table 7, the control unit 102 causes the upper substrate holding unit 2A (upper holding unit 3) to hold the third substrate W3 (step S7), similar to steps S1 and S4.

[0166] When the third substrate W3 is held by the upper substrate holding part 2A (upper holding part 3), the control part 102 immerses the third substrate W3 in the chemical solution stored in the third immersion tank 61a3 (step S8), similar to steps S2 and S5, so that the upper surface Wa and lower surface Wb of the third substrate W3 are treated with the chemical solution.

[0167] When the third substrate W3 held by the upper substrate holding part 2A (upper holding part 3) is immersed in the chemical solution in the third immersion tank 61a3, the control part 102 causes the third substrate W3 to remain in the third immersion tank 61a3 (step S9), similar to steps S3 and S6. As a result, as shown in Fig. 8(c), the first substrate W1, the second substrate W2, and the third substrate W3 are immersed in the chemical solutions in the first immersion tank 61a1, the second immersion tank 61a2, and the third immersion tank 61a3, respectively, and chemical solution treatments are performed on the first substrate W1, the second substrate W2, and the third substrate W3 in parallel.

[0168] 7 and 8(d), when the time that has elapsed since the first substrate W1 was immersed in the chemical solution reaches or exceeds a predetermined time (predetermined chemical solution processing time), the control unit 102 controls the moving unit 200A (lifting mechanism 210A and moving mechanism 220A) and the upper substrate holding unit 2A (upper chuck driving mechanism 50) to cause the first substrate W1, which is supported by the plurality of supports 614 of the first immersion tank 61a1, to be gripped by the plurality of upper chuck members 31. Then, the control unit 102 controls the first processing block PB1 so that a rinse process is performed on the first substrate W1 inside the first immersion tank 61a1 (step S10).

[0169] The rinsing process refers to a process of rinsing the chemical liquid from the upper surface Wa and the lower surface Wb of the substrate W. In the first embodiment, the control unit 102 causes the upper nozzle unit 5A and the lower nozzle unit 5B to eject a rinsing liquid toward the upper surface Wa and the lower surface Wb of the substrate W, thereby rinsing the chemical liquid from the upper surface Wa and the lower surface Wb of the substrate W. In detail, the control unit 102 controls the moving unit 200A (lifting mechanism 210A), the upper substrate holding unit 2A (upper motor body 42), the first liquid supply unit 12 (second on-off valve 126), the second liquid supply unit 13 (second on-off valve 136), and the first drainage unit 14 (first on-off valve 145 or second on-off valve 146) to perform the rinsing process.

[0170] When the time that has elapsed since the start of the rinsing process of the first substrate W1 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 controls the first processing block PB1 so that a drying process of the first substrate W1 is performed inside the first immersion tank 61a1 (step S11).

[0171] The drying process refers to a process for drying the substrate W. In the first embodiment, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W at high speed, thereby drying the substrate W.

[0172] 7 and 8(e), when the time elapsed since the start of the drying process of the first substrate W1 reaches or exceeds a predetermined time (predetermined drying process time), the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the first substrate W1. Then, the control unit 102 controls the movement unit 200A (lifting mechanism 210A and movement mechanism 220A) and the upper substrate holding unit 2A (upper chuck drive mechanism 50) to place the first substrate W1 on the mounting table 7. Once the first substrate W1 has been placed on the mounting table 7, the control unit 102 controls the transfer robot TR to unload the first substrate W1 from the first processing block PB1 (step S12).

[0173] As shown in Figures 7 and 8(f), when the time that has elapsed since the second substrate W2 was immersed in the chemical solution reaches or exceeds a predetermined time (predetermined chemical solution processing time), the control unit 102 controls the first processing block PB1 so that a rinse process is performed on the second substrate W2 inside the second immersion tank 61a2, as in step S10 (step S13).

[0174] When the time that has elapsed since the start of the rinsing process of the second substrate W2 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 controls the first processing block PB1 so that a drying process of the second substrate W2 is performed inside the second immersion tank 61a2, as in step S11 (step S14).

[0175] When the time that has elapsed since the start of the drying process of the second substrate W2 reaches or exceeds a predetermined time (predetermined drying process time), the control unit 102 causes the second substrate W2 to be unloaded from the first processing block PB1 (step S15), similar to step S12.

[0176] When the time that has elapsed since the third substrate W3 was immersed in the chemical solution reaches or exceeds a predetermined time (predetermined chemical solution processing time), the control unit 102 controls the first processing block PB1 so that a rinse process is performed on the third substrate W3 inside the third immersion tank 61a3, similar to steps S10 and S13 (step S16).

[0177] When the time that has elapsed since the start of the rinsing process of the third substrate W3 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 controls the first processing block PB1 so that a drying process of the third substrate W3 is performed inside the third immersion tank 61a3, similar to steps S11 and S14 (step S17).

[0178] When the time that has elapsed since the start of the drying process of the third substrate W3 reaches or exceeds a predetermined time (predetermined drying process time), the control unit 102 causes the third substrate W3 to be unloaded from the first processing block PB1 (step S18), similar to steps S12 and S15, thereby completing the operation shown in FIG.

[0179] 1 to 7 and 8(a) to 8(f), according to the first embodiment, the first processing block PB1 has a plurality of immersion tanks 61a, which allows chemical processing of a plurality of substrates W in parallel.

[0180] Next, the operation of the substrate processing apparatus 100 of embodiment 1 will be described with reference to Figs. 9 to 20. Figs. 9 to 20 are views showing the operation of the first processing block PB1 when processing one substrate W in the first processing cup row L1 of the first processing block PB1. Fig. 9 schematically shows a cross section of the moving part 200A as viewed from the left side. Figs. 10 to 20 also schematically show cross sections of the moving part 200A and the immersion tank 61a as viewed from the left side.

[0181] 9 shows the upper chuck members 31 that grip the substrate W placed on the mounting table 7. As shown in FIG. 9, when the substrate W is placed on the mounting table 7, the control unit 102 controls the moving mechanism 220A to move the upper substrate holding part 2A to a position facing the mounting table 7, and then controls the lifting mechanism 210A to lower the upper substrate holding part 2A to the delivery position P11. The control unit 102 then controls the upper chuck drive mechanism 50 to grip the substrate W with the plurality of upper chuck members 31. Note that when the substrate W placed on the mounting table 7 is held by the upper substrate holding part 2A, the first opening / closing valve 125 and the second opening / closing valve 126 of the first liquid supply unit 12 are in a closed state.

[0182] Fig. 10 shows the upper substrate holding part 2A that has moved to position P1 opposite one of the multiple immersion tanks 61a included in the first processing cup row L1. As shown in Fig. 10, the control part 102 causes the multiple upper chuck members 31 to grip the substrate W placed on the mounting table 7, and then controls the lifting mechanism 210A and the moving mechanism 220A to move the upper substrate holding part 2A to position P1 opposite the immersion tank 61a. When the upper substrate holding part 2A is located at position P1 opposite the immersion tank 61a, the substrate W held by the upper substrate holding part 2A is located above the immersion tank 61a. At this time, the first opening / closing valve 125 and the second opening / closing valve 126 of the first liquid supply section 12 and the first opening / closing valve 135 and the second opening / closing valve 136 of the second liquid supply section 13 are in a closed state, and the first opening / closing valve 145 of the first drainage section 14 and the opening / closing valve 152 of the second drainage section 15 are in an open state.

[0183] 11 shows the upper substrate holder 2A lowered from the opposing position P1 in the immersion tank 61a to the first processing position P2. Note that the first processing position P2 indicates a position in the up-down direction.

[0184] 11, the control unit 102 moves the upper substrate holding unit 2A to a position P1 facing the immersion tank 61a, and then controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the position P1 facing the immersion tank 61a to a first processing position P2. When the upper substrate holding unit 2A lowers to the first processing position P2, the substrate W lowers from a position above the immersion tank 61a to a position inside the immersion tank 61a. Therefore, when the upper substrate holding unit 2A is located at the first processing position P2, the substrate W is located inside the inner wall 613. Furthermore, when the upper substrate holding unit 2A is located at the first processing position P2, the substrate W is located above the multiple supports 614.

[0185] 12 shows the first processing block PB1 when the chemical liquid is stored in the immersion tank 61a. As shown in FIG. 12, after the upper substrate holder 2A is moved to the first processing position P2, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 and the first opening / closing valve 135 of the second liquid supply unit 13 from a closed state to an open state, and closes the first opening / closing valve 145 and the second opening / closing valve 146 of the first drainage unit 14. The control unit 102 also controls the upper rotation unit 4 (upper motor body 42) to rotate the substrate W. As a result, the chemical liquid is ejected from the upper nozzle unit 5A toward the center of the upper surface Wa of the substrate W, and the chemical liquid is ejected from the lower nozzle unit 5B toward the center of the lower surface Wb of the substrate W. The chemical liquid flowing down from the upper surface Wa and the lower surface Wb of the substrate W is stored inside the inner wall 613.

[0186] Furthermore, by discharging the chemical liquid from the upper nozzle unit 5A and the lower nozzle unit 5B toward the rotating substrate W, the chemical liquid quickly spreads over the entire upper surface Wa and lower surface Wb of the substrate W. As a result, for example, it is possible to prevent the processing time with the chemical liquid from differing between the center and the outer periphery of the substrate W. Furthermore, by discharging the chemical liquid from the upper nozzle unit 5A and the lower nozzle unit 5B, it is possible to prevent the processing time with the chemical liquid from differing between the upper surface Wa and lower surface Wb of the substrate W.

[0187] 13 shows the substrate W immersed in the chemical solution stored in the immersion tank 61a. As shown in FIG. 13, the substrate W is immersed in the chemical solution stored inside the inner wall portion 613. Specifically, when the liquid level of the chemical solution rises to a position above the upper surface Wa of the substrate W, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 and the first opening / closing valve 135 of the second liquid supply unit 13 from the open state to the closed state, thereby stopping the discharge of the chemical solution from the upper nozzle unit 5A and the lower nozzle unit 5B. As a result, the substrate W is immersed in the chemical solution inside the immersion tank 61a. For example, the control unit 102 may stop the discharge of the chemical solution when a predetermined time has elapsed since the upper nozzle unit 5A and the lower nozzle unit 5B started discharging the chemical solution.

[0188] When the control unit 102 stops the discharge of the chemical solution, it controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the substrate W. Then, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the first processing position P2 to the second processing position P3. The second processing position P3 indicates a position in the up-down direction. The second processing position P3 is a position where the substrate W comes into contact with the upper surfaces of the multiple supports 614.

[0189] The timing to stop the discharge of the chemical liquid is not particularly limited as long as it is the timing when the liquid level of the chemical liquid rises to a position above the upper surface Wa of the substrate W. For example, the discharge of the chemical liquid may be stopped after the chemical liquid starts to overflow the inner wall portion 613. Furthermore, the timing to stop the rotation of the substrate W is not particularly limited as long as it is before the upper substrate holding portion 2A reaches the second processing position P3 (before the substrate W comes into contact with the upper surfaces of the multiple supports 614).

[0190] Fig. 14 shows the substrate W left in the immersion tank 61a. As shown in Fig. 14, the control unit 102 moves the upper substrate holding unit 2A from the first processing position P2 to the second processing position P3, and then controls the upper chuck drive mechanism 50 to release the grip of the substrate W by the multiple upper chuck members 31. After releasing the grip of the substrate W by the multiple upper chuck members 31, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the second processing position P3 to the opposing position P1 in the immersion tank 61a.

[0191] Fig. 15 shows the first processing block PB1 before the discharge of the chemical solution starts. As shown in Fig. 15, before the discharge of the chemical solution starts, the control unit 102 controls the moving unit 200A (elevating mechanism 210A and moving mechanism 220A) to move the upper substrate holding unit 2A to the second processing position P3. Then, the control unit 102 controls the upper chuck driving mechanism 50 to cause the plurality of upper chuck members 31 to grip the substrate W supported by the plurality of supports 614.

[0192] Fig. 16 shows the first processing block PB1 while the chemical solution is being discharged. As shown in Fig. 16, after the control unit 102 causes the multiple upper chuck members 31 to grip the substrate W, it controls the lifting mechanism 210A to raise the upper substrate holding unit 2A from the second processing position P3 to the first processing position P2. Then, the control unit 102 switches one of the first opening / closing valve 145 and the second opening / closing valve 146 of the first drainage unit 14 from a closed state to an open state. As a result, the chemical solution is discharged from the immersion tank 61a.

[0193] Furthermore, while the chemical liquid is being discharged, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W, and switches the first opening / closing valve 125 of the first liquid supply unit 12 and the first opening / closing valve 135 of the second liquid supply unit 13 from a closed state to an open state. As a result, while the chemical liquid is being discharged, the chemical liquid is discharged from the upper nozzle unit 5A and the lower nozzle unit 5B toward the upper surface Wa and the lower surface Wb of the rotating substrate W, so that the chemical liquid spreads over the upper surface Wa and the lower surface Wb of the substrate W. This prevents the substrate W from drying, thereby preventing the pattern from collapsing and the generation of particles. Note that the total flow rate of the chemical liquid discharged from the upper nozzle unit 5A and the lower nozzle unit 5B is less than the flow rate of the chemical liquid discharged through the first drainage unit 14.

[0194] 17 is a diagram showing the first step of the rinse process. As shown in Fig. 17, when a predetermined time has elapsed since the start of discharge of the chemical liquid, the control unit 102 switches the first on-off valve 125 of the first liquid supply unit 12 and the first on-off valve 135 of the second liquid supply unit 13 from an open state to a closed state, and switches the second on-off valve 126 of the first liquid supply unit 12 and the second on-off valve 136 of the second liquid supply unit 13 from a closed state to an open state. As a result, the rinse liquid is ejected from the upper nozzle unit 5A and the lower nozzle unit 5B toward the upper surface Wa and the lower surface Wb of the rotating substrate W, so that the rinse liquid spreads over the upper surface Wa and the lower surface Wb of the substrate W, and the chemical liquid adhering to the upper surface Wa and the lower surface Wb of the substrate W is washed away from the substrate W by the rinse liquid.

[0195] Fig. 18 is a diagram showing the second step of the rinse process. As shown in Fig. 18, when a predetermined time has elapsed since the start of the discharge of the rinse liquid, the control unit 102 closes the first opening / closing valve 145 and the second opening / closing valve 146 of the first drainage unit 14. As a result, the rinse liquid is stored inside the inner wall portion 613, and the substrate W is immersed in the rinse liquid. The control unit 102 continues to rotate the substrate W from the first step to the second step of the rinse process.

[0196] In this embodiment, even after the space inside the inner wall portion 613 is filled with the rinse liquid, the upper nozzle portion 5A and the lower nozzle portion 5B continue to discharge the rinse liquid. Therefore, the rinse liquid overflows the inner wall portion 613 and flows into the space between the side wall portion 612 and the inner wall portion 613. As a result, the surface that forms the space between the side wall portion 612 and the inner wall portion 613 is cleaned by the overflowing rinse liquid. The rinse liquid collected in the space between the side wall portion 612 and the inner wall portion 613 is discharged from the immersion tank 61a via the second drain portion 15.

[0197] When a predetermined time has elapsed since the start of storing the rinse liquid, the control unit 102 switches the first opening / closing valve 145 of the first drainage unit 14 from the closed state to the open state, causing the rinse liquid to be discharged from the immersion tank 61a.

[0198] As with the discharge of the chemical liquid, while the rinsing liquid is being discharged, the control unit 102 rotates the substrate W and causes the upper nozzle unit 5A and the lower nozzle unit 5B to discharge the rinsing liquid. This process prevents the substrate W from drying, and can prevent pattern collapse and particle generation.

[0199] Fig. 19 is a diagram showing the third step of the rinsing process. As shown in Fig. 19, after the rinsing liquid is discharged, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding part 2A from the first processing position P2 to the third processing position P4. Note that the third processing position P4 indicates a position in the up-down direction.

[0200] Specifically, the control unit 102 raises the upper substrate holding unit 2A to the third processing position P4 while continuing the discharge of the rinsing liquid from the upper nozzle unit 5A and the lower nozzle unit 5B and the rotation of the substrate W. This processing prevents the substrate W from drying, thereby making it possible to prevent pattern collapse and particle generation. Note that the timing at which the upper substrate holding unit 2A starts to rise is not particularly limited, as long as it is after the liquid level of the rinsing liquid has dropped to a position lower than the lower surface Wb of the substrate W.

[0201] When the upper substrate holder 2A rises from the first processing position P2 to the third processing position P4, the substrate W rises to a position where the side surface of the substrate W faces the side wall 612 in the horizontal direction. More specifically, the side surface of the substrate W faces a position between the upper end of the inner wall 613 and the upper end of the side wall 612 in the horizontal direction. Therefore, the rinsing liquid splashed from the substrate W in the third step of the rinsing process is received by the side wall 612. As a result, the rinsing liquid is collected in the space between the side wall 612 and the inner wall 613. The rinsing liquid collected in the space between the side wall 612 and the inner wall 613 is discharged from the immersion tank 61a via the second drain 15.

[0202] 20 is a diagram showing the drying process. As shown in FIG. 20, when a predetermined time has elapsed since the upper substrate holding unit 2A was moved to the third processing position P4, the control unit 102 switches the second opening / closing valve 126 of the first liquid supply unit 12 and the second opening / closing valve 136 of the second liquid supply unit 13 from the open state to the closed state. Then, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to increase the rotation speed of the substrate W. As a result, the rinse liquid is blown off the substrate W by centrifugal force, and the substrate W is dried. After a predetermined time has elapsed since the rotation speed of the substrate W was increased, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the substrate W.

[0203] 9 to 20, in the first embodiment, a chemical liquid process, a rinse process, and a drying process are performed on one substrate W inside one immersion tank 61a. Specifically, the upper nozzle unit 5A and the lower nozzle unit 5B eject a rinse liquid toward the substrate W located inside the immersion tank 61a from which the chemical liquid has been discharged by the first drainage unit 14. After the ejection of the rinse liquid stops, the upper rotation unit 4 increases the rotation speed of the substrate W located inside the immersion tank 61a to dry the substrate W.

[0204] 1 to 20, the first embodiment has been described above. According to the first embodiment, a single substrate W in a horizontal position is immersed in the chemical solution stored in the immersion tank 61a to process the substrate W, thereby reducing the consumption of the chemical solution. Furthermore, according to the first embodiment, the substrates W are immersed in the chemical solution one by one, thereby suppressing the generation of particles compared to a batch-type apparatus in which multiple substrates W are immersed simultaneously in the chemical solution in one processing tank.

[0205] Furthermore, according to the first embodiment, the substrates W are supported on the supports 614 of the immersion tank 61a and immersed in the chemical solution, so that chemical solution processing can be performed in parallel on a plurality of substrates W. This reduces the waiting time for the timing to start the chemical solution processing.

[0206] In the first embodiment, the upper substrate holding unit 2A is raised and lowered, but the processing cup unit 6 may be raised and lowered, or the upper substrate holding unit 2A and the processing cup unit 6 may be raised and lowered together. Similarly, the mounting table 7 may be raised and lowered, or the mounting table 7 and the upper substrate holding unit 2A may be raised and lowered together. That is, each of the first processing block PB1 and the second processing block PB2 may have, for each processing cup row L, a lifting mechanism that individually raises and lowers the processing cup unit 6 and a lifting mechanism that raises and lowers the mounting table 7.

[0207] Specifically, in the first embodiment, upper substrate holding part 2A is raised and lowered so that the position of the substrate W held by upper substrate holding part 2A changes from an upper position of one of the upper positions of the corresponding processing cup part 6 to a position inside that one processing cup part 6, but one processing cup part 6 may be raised and lowered, or one processing cup part 6 and upper substrate holding part 2A may be raised and lowered so that the position of the substrate W held by upper substrate holding part 2A changes from an upper position of one of the upper positions of the corresponding processing cup part 6 to a position inside that one processing cup part 6. The same applies to mounting table 7.

[0208] In the first embodiment, the substrate W is immersed in the rinse liquid in the second step of the rinse process (see FIG. 18), but the second step of the rinse process may be omitted. Alternatively, the second and third steps of the rinse process may be omitted, or the first and second steps of the rinse process may be omitted.

[0209] Furthermore, in the first embodiment, the first drainage section 14 has the recovery pipe section 143 and the second opening / closing valve 146, but the recovery pipe section 143 and the second opening / closing valve 146 may be omitted.

[0210] Furthermore, in embodiment 1, the substrate W was transferred indirectly between each upper substrate holding part 2A and the transport robot TR via the mounting table 7, but the substrate W may also be transferred directly between each upper substrate holding part 2A and the transport robot TR.

[0211] In addition, in the first embodiment, three processing cup sections 6 are provided in one processing cup row L, but the number of processing cup sections 6 provided in one processing cup row L is not limited to three. Two or four or more processing cup sections 6 may be provided in one processing cup row L.

[0212] [Variation 1] Next, the substrate processing apparatus 100 of Modification 1 will be described with reference to Fig. 21. However, only matters different from the embodiment described with reference to Figs. 1 to 20 will be described, and descriptions of matters that are the same as those in the embodiment described with reference to Figs. 1 to 20 will be omitted.

[0213] Fig. 21 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of Modification 1. In detail, Fig. 21 shows the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of Modification 1. Although not shown, the configuration of a second processing block PB2 is similar to the configuration of the first processing block PB1.

[0214] In the embodiment described with reference to FIGS. 1 to 20, each of the first processing block PB1 and the second processing block PB2 has one upper substrate holding part 2A for each processing cup row L, but the number of upper substrate holding parts 2A is not limited to one. Each of the first processing block PB1 and the second processing block PB2 may have a plurality of upper substrate holding parts 2A for each processing cup row L. For example, as shown in FIG. 21, two upper substrate holding parts 2A may be provided for each processing cup row L. Alternatively, three or more upper substrate holding parts 2A may be provided for each processing cup row L.

[0215] Specifically, each of the first processing block PB1 and the second processing block PB2 may have, for each processing cup row L, a plurality of upper substrate holding parts 2A, a plurality of rail members 8 corresponding to each of the upper substrate holding parts 2A, and a moving part 200A corresponding to each of the upper substrate holding parts 2A. The lifting mechanism 210A of the moving part 200A raises and lowers each of the corresponding upper substrate holding parts 2A. Furthermore, the moving mechanism 220A of the moving part 200A moves each of the corresponding upper substrate holding parts 2A between a group of facing positions that includes a position facing the corresponding mounting table 7 and each of facing positions P1 of the corresponding plurality of processing cup parts 6.

[0216] When one of the upper substrate holding units 2A corresponding to the first processing cup row L1 is moved in the first direction D1, the vertical positions of the upper substrate holding unit 2A and support arm 201A to be moved are different from the vertical positions of the other upper substrate holding units 2A and support arms 201A corresponding to the first processing cup row L1. This prevents the upper substrate holding units 2A corresponding to the first processing cup row L1 from interfering with each other. Similarly, it prevents the support arms 201A corresponding to the first processing cup row L1 from interfering with each other. The same applies when moving the upper substrate holding units 2A corresponding to the second processing cup row L2, the third processing cup row L3, and the fourth processing cup row L4.

[0217] According to the first modification, the rinsing process and the drying process can be performed in parallel on a plurality of substrates W for each processing cup row L. This reduces the waiting time for the timing to start the rinsing process and the drying process.

[0218] [Variation 2] Next, the substrate processing apparatus 100 of Modification 2 will be described with reference to Fig. 22. However, only differences from the embodiment described with reference to Figs. 1 to 21 will be described, and a description of the same points as in the embodiment described with reference to Figs. 1 to 21 will be omitted. Fig. 22 is a cross-sectional view schematically showing a part of the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Modification 2. Fig. 22 schematically shows a cross section of the moving part 200A and the immersion tank 61a as viewed from the left side.

[0219] 1 to 21, the same type of chemical solution is stored in the multiple immersion tanks 61a included in each processing cup row L, but different types of chemical solutions may be stored in some immersion tanks 61a and other immersion tanks 61a among the multiple immersion tanks 61a included in the same processing cup row L. For example, different types of chemical solutions may be stored in the multiple immersion tanks 61a included in the same processing cup row L.

[0220] 22 differs from the substrate processing apparatus 100 described with reference to Figures 1 to 21 in that the first liquid supply unit 12 can supply two types of chemical liquids to the upper nozzle unit 5A. The substrate processing apparatus 100 shown in Figure 22 also differs from the substrate processing apparatus 100 described with reference to Figures 1 to 21 in that the second liquid supply unit 13 can supply two types of chemical liquids to the lower nozzle unit 5B.

[0221] In the example shown in FIG. 22, first liquid supply unit 12 selectively supplies any one of a first chemical liquid, a second chemical liquid, and a rinse liquid to upper nozzle unit 5A. Specifically, as shown in FIG. 22, first liquid supply unit 12 further includes chemical liquid piping unit 124 and a third on-off valve 127. Hereinafter, chemical liquid piping unit 121 may be referred to as "first chemical liquid piping unit 121," and chemical liquid piping unit 124 may be referred to as "second chemical liquid piping unit 124." Second chemical liquid piping unit 124 is a tubular member through which a fluid flows. Third on-off valve 127 can be opened and closed freely, similar to first on-off valve 125 and second on-off valve 126.

[0222] 22, a first chemical liquid is supplied to the upstream end of first chemical liquid piping section 121. A second chemical liquid, which is a different type from the first chemical liquid, is supplied to the upstream end of second chemical liquid piping section 124. The downstream end of second chemical liquid piping section 124 is connected to common piping section 123, similar to first chemical liquid piping section 121. Third opening / closing valve 127 is provided in second chemical liquid piping section 124. Third opening / closing valve 127 is controlled by control section 102 to open and close the flow path inside second chemical liquid piping section 124.

[0223] 22, second liquid supply unit 13 selectively supplies any one of the first chemical liquid, the second chemical liquid, and the rinse liquid to lower nozzle unit 5B. Specifically, second liquid supply unit 13 further includes chemical liquid piping unit 134 and third opening / closing valve 137. The configuration of second liquid supply unit 13 is similar to that of first liquid supply unit 12, and therefore a detailed description thereof will be omitted.

[0224] According to Modification 2, chemical liquid processing using the first chemical liquid and chemical liquid processing using the second chemical liquid can be performed in parallel. Furthermore, according to Modification 2, one of the first chemical liquid and the second chemical liquid can be selectively stored in one immersion tank 61a. Therefore, the chemical liquid processing to be performed in one immersion tank 61a can be selected between chemical liquid processing using the first chemical liquid and chemical liquid processing using the second chemical liquid.

[0225] 22, a configuration has been illustrated in which first liquid supply unit 12 is capable of supplying two types of chemical liquid to upper nozzle unit 5A, but first liquid supply unit 12 may be capable of supplying three or more types of chemical liquid to upper nozzle unit 5A. Similarly, second liquid supply unit 13 may be capable of supplying three or more types of chemical liquid to lower nozzle unit 5B.

[0226] [Embodiment 2] Next, a second embodiment of the present invention will be described with reference to Figures 23 and 24. However, differences from the embodiment described with reference to Figures 1 to 22 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 22 will be omitted. The second embodiment differs from the embodiment described with reference to Figures 1 to 22 in that a cleaning tank 63 is included in the multiple processing cup sections 6 of each processing cup row L.

[0227] Fig. 23 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of embodiment 2. In detail, Fig. 23 shows the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of embodiment 2. Although not shown, the configuration of the second processing block PB2 is similar to the configuration of the first processing block PB1.

[0228] 23, the plurality of processing cup sections 6 in each processing cup row L includes a cleaning tank 63. Each cleaning tank 63 may be, for example, located at the rightmost position among the corresponding plurality of processing cup sections 6. However, the position of the cleaning tank 63 is not particularly limited. For example, each cleaning tank 63 may be located at the leftmost position among the corresponding plurality of processing cup sections 6. In other words, each cleaning tank 63 may be located next to (to the right of) the corresponding mounting table 7.

[0229] Specifically, each of the first processing block PB1 and the second processing block PB2 further includes a cleaning unit CU for each processing cup row L. The cleaning unit CU cleans the upper chuck members 31. The cleaning unit CU includes a cleaning tank 63. The cleaning tank 63 is a tank for cleaning the upper chuck members 31 of the upper substrate holding part 2A. A rinse liquid (here, DIW) is stored in the cleaning tank 63.

[0230] Figure 24 is a cross-sectional view schematically illustrating a portion of the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Embodiment 2. Specifically, Figure 24 illustrates the first liquid supply unit 12, upper substrate holding unit 2A, movable unit 200A, cleaning unit CU, and first to fifth rail members 8a to 8e, which correspond to the first processing cup row L1 of the first processing block PB1. Figure 24 also illustrates a cross section of the movable unit 200A and cleaning tank 63 as viewed from the left side. As shown in Figure 24, the cleaning unit CU further includes a liquid supply unit 13a and a drainage unit 14a in addition to the cleaning tank 63.

[0231] The cleaning tank 63 is a container-like container with an open top. The upper chuck member 31 is immersed in the rinse liquid stored in the cleaning tank 63 without holding the substrate W. As a result, the upper chuck member 31 is cleaned by the rinse liquid. In this embodiment, the control unit 102 rotates the upper spin base 32 while the upper chuck member 31 is immersed in the rinse liquid. This process can improve the cleaning effect on the upper chuck member 31.

[0232] The cleaning tank 63 has a bottom wall 611, a side wall 612, and a lower nozzle 5B. The cleaning tank 63 has the same structure as the immersion tank 61a described with reference to Figures 1 to 22, except that it does not have the inner wall 613 and the plurality of support members 614, and therefore a detailed description thereof will be omitted.

[0233] Liquid supply unit 13a is controlled by control unit 102 to supply a rinse liquid to lower nozzle unit 5B of cleaning tank 63. Specifically, liquid supply unit 13a has rinse liquid piping unit 131a and an open / close valve 135a.

[0234] The rinsing liquid pipe section 131a is a tubular member through which a fluid flows. The opening and closing valve 135a is provided in the rinsing liquid pipe section 131a. The opening and closing valve 135a can be freely opened and closed. The opening and closing operation of the opening and closing valve 135a is controlled by the control section 102.

[0235] The rinse liquid is supplied to the upstream end of the rinse liquid piping section 131a. The downstream end of the rinse liquid piping section 131a is connected to the lower nozzle section 5B of the cleaning tank 63. The on-off valve 135a opens and closes the flow path in the rinse liquid piping section 131a. When the on-off valve 135a is opened, the rinse liquid flows through the rinse liquid piping section 131a and is supplied to the cleaning tank 63. As a result, the rinse liquid is stored in the cleaning tank 63. When the on-off valve 135a is closed, the flow of the rinse liquid via the rinse liquid piping section 131a stops. As a result, the supply of the rinse liquid to the cleaning tank 63 stops.

[0236] The drain unit 14a discharges the rinse liquid stored in the cleaning tank 63 to the outside of the cleaning tank 63. In this embodiment, the drain unit 14a discharges the rinse liquid stored in the cleaning tank 63 to the outside of the first processing block PB1. Specifically, the drain unit 14a includes a drain pipe 141a and an open / close valve 145a.

[0237] The drainage pipe section 141a is a tubular member through which a fluid flows. The on-off valve 145a is provided in the drainage pipe section 141a. The on-off valve 145a can be opened and closed freely. The opening and closing operation of the on-off valve 145a is controlled by the control section 102.

[0238] The upstream end of the drainage pipe 141a is connected to the bottom wall 611 of the cleaning tank 63 and communicates with the internal space of the cleaning tank 63. The downstream end of the drainage pipe 141a is connected to a drain tank (not shown). The open / close valve 145a opens and closes the flow path in the drainage pipe 141a. When the open / close valve 145a is opened, the rinse liquid stored in the cleaning tank 63 is discharged into the drain tank (not shown) via the drainage pipe 141a.

[0239] Here, the flow of the process executed by the control unit 102 when cleaning the plurality of upper chuck members 31 will be described.

[0240] The control unit 102 controls the moving mechanism 220A to move the upper substrate holding part 2A to a position P1 facing the cleaning tank 63, and then controls the lifting mechanism 210A to lower the upper substrate holding part 2A from the position P1 facing the cleaning tank 63 to a cleaning position P5. As a result, the multiple upper chuck members 31 of the upper substrate holding part 2A are immersed in the rinse liquid in the cleaning tank 63. The cleaning position P5 indicates a position in the up-down direction.

[0241] The control unit 102 lowers the upper substrate holding unit 2A from the opposing position P1 to the cleaning position P5 of the cleaning tank 63, and then controls the upper rotating unit 4 (upper motor body 42) to rotate the upper spin base 32. As a result, the plurality of upper chuck members 31 rotate in the rinse liquid.

[0242] When a predetermined time has elapsed since the start of rotation of the plurality of upper chuck members 31, the control unit 102 controls the upper rotation unit 4 (upper motor body 42) to stop the rotation of the upper spin base 32 (the plurality of upper chuck members 31). Then, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the cleaning position P5 to a position P1 facing the cleaning tank 63.

[0243] 23 and 24, the second embodiment of the present invention has been described. According to the second embodiment, the amount of chemical liquid consumed can be reduced, similarly to the embodiments described with reference to FIGS. 1 to 22. Furthermore, according to the second embodiment, the upper chuck member 31 can be cleaned, and therefore the chemical liquid and the like adhering to the upper chuck member 31 can be removed from the upper chuck member 31. Therefore, the substrate W can be gripped by the clean upper chuck member 31.

[0244] For example, as described with reference to FIG. 22 , if at least one of the multiple immersion tanks 61a stores a different type of chemical liquid from those stored in the other immersion tanks 61a, when a substrate W is immersed in a first chemical liquid and then the next substrate W is immersed in a second chemical liquid, the first chemical liquid adhering to the upper chuck member 31 may be mixed with the second chemical liquid. In contrast, according to the second embodiment, after the substrate W is immersed in the first chemical liquid, the upper chuck member 31 can be cleaned in the cleaning tank 63. Therefore, the next substrate W can be gripped by the cleaned upper chuck member 31 and immersed in the second chemical liquid. This reduces the possibility of the first chemical liquid being mixed with the second chemical liquid. As a result, the possibility of the substrate W being contaminated can be reduced.

[0245] In the second embodiment, the plurality of upper chuck members 31 are immersed in the rinse liquid stored in the cleaning tank 63 to clean the plurality of upper chuck members 31, but the configuration for cleaning the plurality of upper chuck members 31 is not limited to this configuration. For example, a spray cleaning nozzle may be provided in the cleaning tank 63. In this case, the rinse liquid is sprayed from the spray cleaning nozzle toward the plurality of upper chuck members 31 located inside the cleaning tank 63 to clean the plurality of upper chuck members 31. For example, when cleaning the plurality of upper chuck members 31, the upper spin base 32 may be rotated, and the rinse liquid may be sprayed from one spray cleaning nozzle toward the rotating plurality of upper chuck members 31.

[0246] [Embodiment 3] Next, a third embodiment of the present invention will be described with reference to Figures 25 to 55. However, only the differences from the embodiment described with reference to Figures 1 to 24 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 24 will be omitted. The third embodiment differs from the embodiment described with reference to Figures 1 to 24 in that the multiple processing cup portions 6 in each processing cup row L include a second processing cup portion 62.

[0247] Fig. 25 is a schematic plan view showing an enlarged view of a portion of the substrate processing apparatus 100 of embodiment 3. In detail, Fig. 25 shows the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of embodiment 3. Although not shown, the configuration of a second processing block PB2 is similar to the configuration of the first processing block PB1.

[0248] 25, in the third embodiment, the multiple processing cup parts 6 of each processing cup row L include multiple first processing cup parts 61, one second processing cup part 62, and one cleaning tank 63. Each second processing cup part 62 receives processing liquid discharged from the substrate W held in the corresponding upper substrate holding part 2A.

[0249] The multiple first processing cup parts 61, second processing cup parts 62, and cleaning tank 63 are aligned in the first direction D1 (left-right direction). The second processing cup part 62 is located on the leftmost side of the multiple processing cup parts 6. In other words, the second processing cup part 62 is located at a position closest to the corresponding mounting table 7 among the multiple processing cup parts 6. The cleaning tank 63 is located at the rightmost side of the multiple processing cup parts 6. In other words, the cleaning tank 63 is located at a position farthest from the corresponding mounting table 7 among the multiple processing cup parts 6.

[0250] Specifically, the plurality of first processing cup sections 61 include two immersion tanks 61b. The second processing cup section 62 includes a rinse-dry cup section 62a. Hereinafter, one of the two immersion tanks 61b may be referred to as the "first immersion tank 61b1." The other of the two immersion tanks 61b may be referred to as the "second immersion tank 61b2." The mounting table 7, the two immersion tanks 61b (the first immersion tank 61b1 and the second immersion tank 61b2), one rinse-dry cup section 62a, and one cleaning tank 63 are arranged in the following order from the left: mounting table 7, rinse-dry cup section 62a, first immersion tank 61b1, second immersion tank 61b2, cleaning tank 63.

[0251] A chemical liquid is stored in the immersion tank 61b. The substrate W is immersed in the chemical liquid in the immersion tank 61b. Therefore, chemical processing is performed in the immersion tank 61b. For example, different types of chemical liquids are stored in the two immersion tanks 61b. The rinse-dry cup portion 62a receives the rinse liquid discharged from the substrate W held by the upper substrate holder 2A.

[0252] Specifically, each of the first processing block PB1 and the second processing block PB2 has a rinse-dry processing unit PUD, two chemical processing units PUC, and a cleaning unit CU for each processing cup row L. The rinse-dry processing unit PUD has a rinse-dry cup section 62a. The chemical processing unit PUC has an immersion tank 61b.

[0253] The rinse-dry processing unit PUD cooperates with the upper substrate holding part 2A to perform rinsing and drying processes inside the rinse-dry cup part 62a. Therefore, the rinse-dry cup part 62a receives the rinse liquid discharged from the substrate W held by the upper substrate holding part 2A.

[0254] Next, with reference to FIG. 26, a first liquid supply unit 12 and a chemical liquid processing unit PUC included in the substrate processing apparatus 100 of the third embodiment will be described. FIG. 26 is a cross-sectional view schematically showing a portion of the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of the third embodiment. In detail, FIG. 26 shows the first liquid supply unit 12, the upper substrate holding unit 2A, the moving unit 200A, the chemical liquid processing unit PUC, and the first to fifth rail members 8a to 8e corresponding to the first processing cup row L1 of the first processing block PB1. FIG. 26 also shows a cross section of the moving unit 200A and the immersion tank 61b as viewed from the left side.

[0255] 26, in the third embodiment, the first liquid supply unit 12 selectively supplies one of the first chemical liquid, the second chemical liquid, and the rinse liquid (here, DIW) to the upper nozzle unit 5A. The configuration of the first liquid supply unit 12 shown in FIG. 26 is similar to the configuration of the first liquid supply unit 12 described with reference to FIG. 22, and therefore a detailed description thereof will be omitted.

[0256] The chemical liquid processing unit PUC has a second liquid supply part 13b, a first liquid drain part 14b, a second liquid drain part 15b, and an exhaust part 17 in addition to the immersion tank 61b.

[0257] The immersion tank 61b has a structure similar to that of the immersion tank 61a described with reference to FIGS. 4 and 5, and therefore a detailed description thereof will be omitted.

[0258] Second liquid supply unit 13b selectively supplies one of a chemical liquid and a rinse liquid (here, DIW) to lower nozzle unit 5B of immersion tank 61b. The configuration of second liquid supply unit 13b is similar to that of second liquid supply unit 13 described with reference to Figure 4, and therefore detailed description thereof will be omitted.

[0259] The first drainage section 14b discharges the processing liquid (chemical liquid) stored in the immersion tank 61b to the outside of the immersion tank 61b. The configuration of the first drainage section 14b is similar to that of the first drainage section 14 described with reference to Figure 4, so a detailed description thereof will be omitted. Note that the chemical liquid discharged from the immersion tank 61b does not have to be recovered in the chemical liquid tank. In this case, the recovery piping section 143 and the second opening / closing valve 146 of the first drainage section 14b can be omitted.

[0260] The configuration of the second drainage section 15b is similar to the configuration of the second drainage section 15 described with reference to FIG. 4, and therefore a description thereof will be omitted.

[0261] The substrate W may or may not be left in the immersion tank 61b. When chemical treatment is performed without leaving the substrate W in the immersion tank 61b, the upper substrate holding part 2A (upper holding part 3) holds the substrate W and is positioned at the first treatment position P2 until a predetermined time (predetermined chemical treatment time) has elapsed since the substrate W was immersed in the chemical solution. Furthermore, when the substrate W is not left in the immersion tank 61b, the control part 102 may control the upper rotation part 4 (upper motor main body 42) to rotate the substrate W while the substrate W is immersed in the chemical solution.

[0262] As shown in FIG. 26, the chemical liquid treatment unit PUC includes a first chemical liquid treatment unit PU1. The first chemical liquid treatment unit PU1 has a first immersion tank 61b1 (immersion tank 61b). A first chemical liquid is stored in the first immersion tank 61b1. Therefore, chemical liquid treatment (first chemical liquid treatment) using the first chemical liquid is performed in the first immersion tank 61b1. Specifically, the first chemical liquid treatment unit PU1 has, in addition to the first immersion tank 61b1, a second liquid supply unit 13b1 (second liquid supply unit 13b), a first drainage unit 14b1 (first drainage unit 14b), a second drainage unit 15b1 (second drainage unit 15b), and an exhaust unit 17.

[0263] Second liquid supply unit 13b1 selectively supplies either the first chemical liquid or the rinse liquid to lower nozzle 5B of first immersion tank 61b1. The first chemical liquid is supplied to the upstream end of chemical liquid piping 131 of second liquid supply unit 13b1. The downstream end of recovery piping 143 of first drainage unit 14b1 is connected to the first chemical liquid tank.

[0264] During the first chemical liquid treatment, the substrate W may or may not be left in the first immersion tank 61b1. If the substrate W is not left in the first immersion tank 61b1, the control unit 102 may control the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W while the substrate W is immersed in the first chemical liquid.

[0265] Next, referring to Figure 27, a process for immersing a substrate W in a chemical liquid will be described using the process for immersing a substrate W in a first chemical liquid as an example. Figure 27 is a diagram showing the process for immersing a substrate W in a first chemical liquid. Note that Figure 27 also shows the first liquid supply section 12 corresponding to the first processing cup row L1 of the first processing block PB1, the upper substrate holding section 2A, part of the moving section 200A, the first chemical liquid processing unit PU1, and the first rail member 8a to the fifth rail member 8e. Figure 27 also shows a schematic cross section of the moving section 200A and the first immersion tank 61b1 as viewed from the left side.

[0266] In the first embodiment, after the substrate W is moved inside the immersion tank 61a, the chemical liquid is discharged from the upper nozzle portion 5A and the lower nozzle portion 5B to store the chemical liquid in the immersion tank 61a, thereby immersing the substrate W in the chemical liquid, but in the third embodiment, the first chemical liquid is stored in the first immersion tank 61b1 before the substrate W is immersed in the first chemical liquid. Therefore, the substrate W is submerged in the first chemical liquid stored in the first immersion tank 61b1, thereby immersing the substrate W in the first chemical liquid.

[0267] 27, before the substrate W is immersed in the first chemical liquid, the upper substrate holder 2A is located at a position P1 facing the first immersion tank 61b1. Therefore, before the substrate W is immersed in the first chemical liquid, the substrate W is located at a position above the first immersion tank 61b1 and faces the liquid surface of the first chemical liquid in the first immersion tank 61b1.

[0268] When the substrate W is immersed in the first chemical liquid, the control unit 102 controls the upper rotation unit 4 (upper motor body 42) to rotate the substrate W. The control unit 102 also switches the first opening / closing valve 135 of the second liquid supply unit 13b1 from a closed state to an open state to discharge the first chemical liquid from the lower nozzle unit 5B of the first immersion tank 61b1. Therefore, the first chemical liquid overflows from the inner wall unit 613.

[0269] The control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the opposing position P1 in the first immersion tank 61b1 to the first processing position P2 (see FIG. 26). As a result, the substrate W is immersed in the first chemical liquid. In this way, by discharging the first chemical liquid from the lower nozzle unit 5B while rotating the substrate W, the substrate W can be submerged in the first chemical liquid.

[0270] Note that the first chemical liquid may be discharged from the upper nozzle unit 5A when the substrate W is immersed in the first chemical liquid. Specifically, when the substrate W moves to a position inside the first immersion tank 61b1, the control unit 102 may switch the first opening / closing valve 125 of the first liquid supply unit 12 from a closed state to an open state, thereby discharging the first chemical liquid from the upper nozzle unit 5A.

[0271] Furthermore, when the substrate W is to be left in the first immersion tank 61b1, the control unit 102 controls the lifting mechanism 210A to move the upper substrate holding part 2A from the first processing position P2 to the second processing position P3, and then controls the upper chuck drive mechanism 50 to release the grip of the substrate W by the multiple upper chuck members 31. Then, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding part 2A from the second processing position P3 to the opposing position P1 of the first immersion tank 61b1. As a result, the substrate W is supported by the multiple supports 614 of the first immersion tank 61b1, and the substrate W is left in the first immersion tank 61b1.

[0272] Next, the process of lifting the substrate W from the first chemical liquid will be described using the process of lifting the substrate W from the first chemical liquid as an example. In the first embodiment, after the substrate W was treated with the chemical liquid, the chemical liquid was discharged from the immersion tank 61a, and a rinsing process and a drying process were performed in the immersion tank 61a from which the chemical liquid was discharged. In contrast, in the third embodiment, the first chemical liquid is not discharged from the first immersion tank 61b1, and the substrate W is lifted from the first chemical liquid. Note that the first chemical liquid is discharged from the first immersion tank 61b1, for example, when cleaning the first immersion tank 61b1.

[0273] Specifically, when the first chemical liquid processing is performed without leaving the substrate W in the first immersion tank 61b1, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W when lifting the substrate W from the first chemical liquid. The control unit 102 also switches the first opening / closing valve 135 of the second liquid supply unit 13b1 from a closed state to an open state to discharge the first chemical liquid from the lower nozzle unit 5B of the first immersion tank 61b1. The control unit 102 then controls the lifting mechanism 210A to lift the upper substrate holder 2A from the first processing position P2 (see FIG. 26) to a position P1 facing the first immersion tank 61b1. In this way, the substrate W can be lifted from the first chemical liquid by discharging the first chemical liquid from the lower nozzle unit 5B of the first immersion tank 61b1 while rotating the substrate W. When the substrate W is pulled up from the first chemical liquid, the first chemical liquid overflows from the inner wall portion 613.

[0274] Furthermore, when the substrate W is left in the first immersion tank 61b1 and the first chemical liquid treatment is performed, as described with reference to Fig. 15, the control unit 102 moves the upper substrate holding unit 2A to the second treatment position P3 and causes the upper chuck members 31 to grip the substrate W supported by the plurality of supports 614 of the first immersion tank 61b1. Then, as described with reference to Fig. 16, the control unit 102 raises the upper substrate holding unit 2A from the second treatment position P3 to the first treatment position P2. Thereafter, the control unit 102 performs the above-described lifting process.

[0275] When the substrate W is pulled up from the first chemical liquid, the control unit 102 may switch the first opening / closing valve 125 of the first liquid supply unit 12 from the closed state to the open state, thereby discharging the first chemical liquid from the upper nozzle unit 5A. In this case, before the substrate W moves to the outside (upward) of the first immersion tank 61b1, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 from the open state to the closed state, thereby stopping the discharging of the first chemical liquid from the upper nozzle unit 5A.

[0276] Next, with reference to FIG. 28, the second chemical liquid processing unit PU2 included in the substrate processing apparatus 100 of the third embodiment will be described. FIG. 28 is another cross-sectional view schematically showing a part of the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of the third embodiment. In detail, FIG. 28 shows the first liquid supply unit 12, the upper substrate holding unit 2A, the moving unit 200A, the second chemical liquid processing unit PU2, and the first to fifth rail members 8a to 8e corresponding to the first processing cup row L1 of the first processing block PB1. FIG. 28 also shows a cross section of the moving unit 200A and the immersion tank 61b (second immersion tank 61b2) as viewed from the left side.

[0277] As shown in FIG. 28, the chemical liquid treatment unit PUC includes a second chemical liquid treatment unit PU2. The second chemical liquid treatment unit PU2 has a second immersion tank 61b2 (immersion tank 61b). A second chemical liquid is stored in the second immersion tank 61b2. Therefore, chemical liquid treatment using the second chemical liquid (second chemical liquid treatment) is performed in the second immersion tank 61b2. Specifically, the second chemical liquid treatment unit PU2 has, in addition to the second immersion tank 61b2, a second liquid supply unit 13b2 (second liquid supply unit 13b), a first drainage unit 14b2 (first drainage unit 14b), a second drainage unit 15b2 (second drainage unit 15b), and an exhaust unit 17.

[0278] Second liquid supply unit 13b2 selectively supplies either the second chemical liquid or a rinse liquid (here, DIW) to lower nozzle 5B of second immersion tank 61b2. The second chemical liquid is supplied to the upstream end of chemical liquid piping 131 of second liquid supply unit 13b2. The downstream end of recovery piping 143 of first drainage unit 14b2 is connected to the second chemical liquid tank.

[0279] In the third embodiment, the second chemical liquid is stored in the second immersion tank 61b2 before the substrate W is immersed in the second chemical liquid. Therefore, the substrate W is submerged in the second chemical liquid stored in the second immersion tank 61b2 to immerse the substrate W in the second chemical liquid. The process of immersing the substrate W in the second chemical liquid is similar to the process of immersing the substrate W in the first chemical liquid, and therefore a detailed description thereof will be omitted.

[0280] Furthermore, in the third embodiment, after the substrate W is treated with the second chemical liquid, the second chemical liquid is not discharged from the second immersion tank 61b2. Therefore, the substrate W is pulled up from the second chemical liquid. The process of pulling up the substrate W from the second chemical liquid is similar to the process of pulling up the substrate W from the first chemical liquid, and therefore a detailed description thereof will be omitted.

[0281] Furthermore, as in the case of the first chemical liquid treatment, the substrate W may or may not be left in the second immersion tank 61b2. If the substrate W is not left in the second immersion tank 61b2, the control unit 102 may control the upper rotation unit 4 (upper motor main body 42) to rotate the substrate W while the substrate W is immersed in the second chemical liquid.

[0282] Next, with reference to FIG. 29, a rinse-dry processing unit PUD included in the substrate processing apparatus 100 of the third embodiment will be described. FIG. 29 is yet another cross-sectional view schematically showing a portion of the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of the third embodiment. In detail, FIG. 29 shows the first liquid supply unit 12, the upper substrate holding unit 2A, the movable unit 200A, the rinse-dry processing unit PUD, and the first to fifth rail members 8a to 8e, which correspond to the first processing cup row L1 of the first processing block PB1. FIG. 29 also shows a cross section of the movable unit 200A and the rinse-dry cup unit 62a as viewed from the left side.

[0283] 29, the rinse-dry processing unit PUD has, in addition to a rinse-dry cup section 62a, a second liquid supply section 13c, a drain section 14c, and an exhaust section 17. The rinse-dry cup section 62a has a bottom wall section 611, a side wall section 612, and a lower nozzle section 5B. The rinse-dry cup section 62a has the same structure as the immersion tank 61b except that it does not have an inner wall section 613 and a plurality of support sections 614, and therefore a detailed description thereof will be omitted.

[0284] The second liquid supply unit 13c supplies a rinse liquid (here, DIW) to the lower nozzle unit 5B of the rinse drying cup unit 62a. Specifically, the second liquid supply unit 13c has a rinse liquid piping unit 131c and an open / close valve 135c. The configuration of the second liquid supply unit 13c is similar to the configuration of the liquid supply unit 13a described with reference to FIG. 24, and therefore a detailed description thereof will be omitted.

[0285] The drainage unit 14c discharges the rinse liquid collected in the rinse-dry cup unit 62a to the outside of the rinse-dry cup unit 62a. In the third embodiment, the drainage unit 14c discharges the rinse liquid collected in the rinse-dry cup unit 62a to the outside of the first processing block PB1. Specifically, the drainage unit 14c includes a drainage pipe unit 141c and an open / close valve 145c. The configuration of the drainage unit 14c is similar to the configuration of the drainage unit 14a described with reference to FIG. 24, and therefore a detailed description thereof will be omitted.

[0286] In the third embodiment, the rinse and dry cup section 62a performs a rinse process on the substrate W after immersion in the first chemical liquid (the substrate W after the first chemical liquid process).

[0287] Specifically, when a predetermined time (predetermined first chemical liquid processing time) has elapsed since the substrate W was immersed in the first chemical liquid, the control unit 102 moves the substrate W from the first immersion bath 61b1 to the rinse-dry cup unit 62a.

[0288] In detail, the control unit 102 executes a lifting process to raise the upper substrate holding part 2A holding the substrate W from the first processing position P2 (see FIG. 26) or the second processing position P3 (see FIG. 15) to a position P1 facing the first immersion tank 61b1. As a result, the substrate W after being processed in the first immersion tank 61b1 is raised from a position inside the first immersion tank 61b1 to a position above the first immersion tank 61b1.

[0289] The control unit 102 raises the upper substrate holding unit 2A to position P1 facing the first immersion bath 61b1, and then controls the movement mechanism 220A to move the upper substrate holding unit 2A from position P1 facing the first immersion bath 61b1 to position P1 facing the rinse-dry cup unit 62a. The control unit 102 then controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from position P1 facing the rinse-dry cup unit 62a to the third processing position P4. As a result, the substrate W after the first chemical liquid processing moves to a position inside the rinse-dry cup unit 62a.

[0290] When the substrate W moves to a position inside the rinse-dry cup section 62a, the control section 102 controls the upper rotation section 4 (upper motor main body 42) to rotate the substrate W. The control section 102 also switches the second opening / closing valve 126 of the first liquid supply section 12 and the opening / closing valve 135c of the second liquid supply section 13c from a closed state to an open state, causing the upper nozzle section 5A and the lower nozzle section 5B of the rinse-dry cup section 62a to eject the rinse liquid toward the upper surface Wa and lower surface Wb of the rotating substrate W. As a result, a rinse process is performed on the substrate W after the first chemical liquid process inside the rinse-dry cup section 62a. More specifically, the rinse liquid spreads over the upper surface Wa and lower surface Wb of the substrate W, and the first chemical liquid adhering to the upper surface Wa and lower surface Wb of the substrate W is washed away from the substrate W by the rinse liquid.

[0291] The first chemical liquid and the rinse liquid discharged from the rotating substrate W are received by and collected in the rinse dry cup portion 62a. The processing liquid collected in the rinse dry cup portion 62a is discharged from the rinse dry cup portion 62a via the drain portion 14c.

[0292] In the third embodiment, the rinse-dry cup section 62a performs a rinse process on the substrate W after immersion in the second chemical liquid (the substrate W after the second chemical liquid processing). The rinse process on the substrate W after the second chemical liquid processing is the same as the rinse process on the substrate W after the first chemical liquid processing, and therefore a description thereof will be omitted.

[0293] In the third embodiment, the rinse-dry cup portion 62a performs a drying process on the substrate W. The drying process is the same as the drying process described with reference to Fig. 20, and therefore a description thereof will be omitted.

[0294] Next, with reference to FIGS. 25 to 31 and 32(a) to 32(f), an example of the operation of the substrate processing apparatus 100 of embodiment 3 will be described using the first processing cup row L1 of the first processing block PB1 as an example. FIGS. 30 and 31 are diagrams showing an example of the flow of the operation of the substrate processing apparatus 100 of embodiment 3. Specifically, FIGS. 30 and 31 show an example of the flow of the process executed by the control unit 102 when two substrates W (first substrate W1 and second substrate W2) are processed in the first processing cup row L1 of the first processing block PB1. FIGS. 32(a) to 32(f) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of embodiment 3. Specifically, FIGS. 32(a) to 32(f) show an example of the operation of the first processing block PB1 when two substrates W (first substrate W1 and second substrate W2) are processed in the first processing cup row L1 of the first processing block PB1.

[0295] 30 and 31 includes steps S21 to S42. Each substrate W is processed according to the processing procedure by the processing shown in Fig. 30 and 31. Specifically, each substrate W is subjected to a first chemical liquid processing, a rinsing processing, a second chemical liquid processing, a rinsing processing, and a drying processing in this order.

[0296] The process shown in Figures 30 and 31 begins when the transport robot TR loads the first substrate W1 into the first processing block PB1 through the loading / unloading port corresponding to the first processing cup row L1 of the first processing block PB1.

[0297] As shown in FIG. 30, the control unit 102 controls the transport robot TR to load the first substrate W1 into the first processing block PB1, and then controls the upper substrate holding unit 2A (upper chuck driving mechanism 50) to grip the first substrate W1 supported by the hand of the transport robot TR with the plurality of upper chuck members 31. As a result, the upper substrate holding unit 2A receives the first substrate W1 from the transport robot TR (step S21). Furthermore, as the plurality of upper chuck members 31 grip the first substrate W1, the first substrate W1 is held horizontally by the upper substrate holding unit 2A (upper holding unit 3). In the third embodiment, the upper substrate holding unit 2A receives the first substrate W1 from the transport robot TR above the rinse-dry cup unit 62a. Note that before the first substrate W1 is loaded into the first processing block PB1, the upper substrate holding unit 2A waits at a position P1 facing the rinse-dry cup unit 62a.

[0298] Once the upper substrate holding part 2A holds the first substrate W1, the control part 102 controls the moving part 200A (moving mechanism 220A) to move the upper substrate holding part 2A to the opposing position P1 in the first immersion tank 61b1 (FIG. 32(a)). Then, as described with reference to FIG. 27, the control part 102 submerges the first substrate W1 in the first chemical liquid in the first immersion tank 61b1, thereby immersing the first substrate W1 in the first chemical liquid (step S22). Immersing the first substrate W1 in the first chemical liquid performs a first chemical liquid treatment on the first substrate W1.

[0299] When the time that has elapsed since the first substrate W1 was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid processing time), the control unit 102 moves the first substrate W1 after the first chemical liquid processing from the first immersion tank 61b1 to the rinse drying cup unit 62a (step S23).

[0300] More specifically, the upper substrate holding part 2A holds the first substrate W1 while the first chemical liquid treatment is being performed on the first substrate W1. Therefore, when the first chemical liquid treatment on the first substrate W1 is completed, the upper substrate holding part 2A still holds the first substrate W1. Therefore, the control part 102 executes a pull-up process when the time that has elapsed since the first substrate W1 was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid treatment time). As a result, the upper substrate holding part 2A rises to position P1 opposite the first immersion tank 61b1, and the first substrate W1 that has been subjected to the first chemical liquid treatment moves to a position above the first immersion tank 61b1.

[0301] The control unit 102 may perform the shaking-off process by raising the upper substrate holding unit 2A to the third processing position P4 (see FIG. 19) before raising the upper substrate holding unit 2A to the opposing position P1 of the first immersion tank 61b1. The shaking-off process is a process in which the processing liquid is discharged from the substrate W by rotating the substrate W to an extent that the substrate W does not dry out.

[0302] 32(b), the control unit 102 raises the upper substrate holding unit 2A to a position P1 facing the first immersion tank 61b1, and then controls the movement mechanism 220A to move the upper substrate holding unit 2A from the position P1 facing the first immersion tank 61b1 to a position P1 facing the rinse-dry cup unit 62a. Then, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the position P1 facing the rinse-dry cup unit 62a to the third processing position P4 (see FIG. 29). As a result, the first substrate W1 moves from above the rinse-dry cup unit 62a to inside the rinse-dry cup unit 62a.

[0303] After moving the first substrate W1 inside the rinse-dry cup part 62a, the control part 102 executes the rinse process (step S24) as described with reference to Fig. 29. Specifically, while rotating the first substrate W1, the control part 102 causes the upper nozzle part 5A and the lower nozzle part 5B of the rinse-dry cup part 62a to eject the rinse liquid toward the upper surface Wa and the lower surface Wb of the first substrate W1 located inside the rinse-dry cup part 62a.

[0304] When the time that has elapsed since the start of the rinsing process reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 moves the rinsed first substrate W1 from the rinse and dry cup unit 62a to the second immersion tank 61b2 and immerses the rinsed first substrate W1 in the second chemical liquid in the second immersion tank 61b2 (step S25). By immersing the first substrate W1 in the second chemical liquid, the first substrate W1 is subjected to the second chemical liquid process.

[0305] 32(c), the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the third processing position P4 (see FIG. 29) to a position P1 facing the rinse-dry cup unit 62a, and then controls the moving mechanism 220A to move the upper substrate holding unit 2A from the position P1 facing the rinse-dry cup unit 62a to the position P1 facing the second immersion tank 61b2. Then, the control unit 102 submerges the first substrate W1 in the second chemical liquid in the second immersion tank 61b2, as in step S22, to immerse the first substrate W1 in the second chemical liquid.

[0306] The control unit 102 may perform the shaking-off process before raising the upper substrate holding unit 2A to the position P1 facing the rinse-dry cup unit 62a.

[0307] In the example described with reference to Figures 30, 31 and 32(a) to 32(f), when the control unit 102 immerses the first substrate W1 in the second chemical liquid, it leaves the first substrate W1 in the second immersion tank 61b2 (step S26), as described with reference to Figure 27.

[0308] After leaving the first substrate W1 in the second immersion tank 61b2, the control unit 102 cleans the multiple upper chuck members 31 of the upper substrate holding unit 2A (step S27). Specifically, as shown in FIG. 32(d), after leaving the first substrate W1 in the second immersion tank 61b2, the control unit 102 controls the lifting mechanism 210A to lift the upper substrate holding unit 2A from the second processing position P3 to a facing position P1 in the second immersion tank 61b2, and then controls the moving mechanism 220A to move the upper substrate holding unit 2A to a facing position P1 in the cleaning tank 63. Then, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A to a cleaning position P5 (see FIG. 24), thereby immersing the multiple upper chuck members 31 of the upper substrate holding unit 2A in the rinse liquid in the cleaning tank 63. In this embodiment, the control unit 102 rotates the upper spin base 32 while the upper chuck member 31 is immersed in the rinse liquid.

[0309] When a predetermined time (predetermined cleaning time) has elapsed since the upper chuck member 31 was immersed in the rinse liquid in the cleaning tank 63, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the upper spin base 32, and then controls the lifting mechanism 210A to raise the upper substrate holding unit 2A from the cleaning position P5 to a position P1 facing the cleaning tank 63. Then, the control unit 102 controls the moving mechanism 220A to move the upper substrate holding unit 2A from the position P1 facing the cleaning tank 63 to the position P1 facing the rinse drying cup unit 62a.

[0310] After moving the upper substrate holding part 2A to position P1 facing the rinse-drying cup part 62a, the control part 102 controls the transport robot TR to load the second substrate W2 into the first processing block PB1. Then, similar to step S21, the control part 102 causes the second substrate W2 supported by the hand of the transport robot TR to be gripped by the multiple upper chuck members 31. As a result, the upper substrate holding part 2A receives the second substrate W2 from the transport robot TR (step S28).

[0311] 32(e), once the upper substrate holding part 2A holds the second substrate W2, the control part 102 controls the moving part 200A (moving mechanism 220A) to move the upper substrate holding part 2A to the opposing position P1 in the first immersion tank 61b1. Then, similar to step S22, the control part 102 submerges the second substrate W2 in the first chemical liquid in the first immersion tank 61b1, thereby immersing the second substrate W2 in the first chemical liquid (step S29).

[0312] After the control unit 102 has immersed the second substrate W2 in the first chemical liquid, the control unit 102 leaves the second substrate W2 in the first immersion tank 61b1 (step S30), as in step S26. After the control unit 102 leaves the second substrate W2 in the first immersion tank 61b1, the control unit 102 immerses the upper chuck member 31 in the rinse liquid in the cleaning tank 63 to clean the upper chuck member 31 (step S31), as in step S27, as shown in Fig. 32(f).

[0313] When a predetermined time (predetermined cleaning time) has elapsed since the upper chuck member 31 was immersed in the rinse liquid in the cleaning tank 63, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to stop the rotation of the upper spin base 32, and then controls the lifting mechanism 210A to raise the upper substrate holding unit 2A from the cleaning position P5 to a position P1 facing the cleaning tank 63. Then, the control unit 102 controls the moving mechanism 220A to move the upper substrate holding unit 2A from the position P1 facing the cleaning tank 63 to a position P1 facing the second immersion tank 61b2.

[0314] When the time that has elapsed since the first substrate W1 was immersed in the second chemical liquid reaches or exceeds a predetermined time (predetermined second chemical liquid processing time), the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the opposing position P1 in the second immersion tank 61b2 to the second processing position P3, and then controls the upper chuck driving mechanism 50 to cause the first substrate W1 (first substrate W1 after the second chemical liquid processing) supported by the plurality of supports 614 in the second immersion tank 61b2 to be gripped by the plurality of upper chuck members 31. After causing the plurality of upper chuck members 31 to grip the first substrate W1, the control unit 102 moves the first substrate W1 after the second chemical liquid processing from the second immersion tank 61b2 to the rinse-dry cup unit 62a (step S32), as in step S23.

[0315] The control unit 102 may perform the shake-off process before raising the upper substrate holding unit 2A to the opposing position P1 of the second immersion tank 61b2.

[0316] After moving the first substrate W1 into the rinse and dry cup part 62a, the control part 102 executes a rinse process (step S33) in the same manner as in step S24.

[0317] When the time that has elapsed since the start of the rinsing process of the first substrate W1 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 executes the drying process (step S34) as described with reference to Fig. 20. Specifically, the control unit 102 stops the discharge of the rinsing liquid and then increases the rotation speed of the first substrate W1 positioned inside the rinse-dry cup unit 62a.

[0318] When the time that has elapsed since the start of the drying process reaches or exceeds a predetermined time (predetermined drying time), the control unit 102 stops the rotation of the first substrate W1 and ends the drying process, resulting in the first substrate W1 being dried.

[0319] When the drying process is completed, the control unit 102 controls the lifting mechanism 210A to raise the upper substrate holding unit 2A to a position P1 facing the rinse-drying cup unit 62a. After raising the upper substrate holding unit 2A to the position P1 facing the rinse-drying cup unit 62a, the control unit 102 causes the hand of the transfer robot TR to enter the first processing block PB1 through the loading / unloading opening corresponding to the first processing cup row L1. The control unit 102 then controls the upper chuck driving mechanism 50 to release the first substrate W1 from the multiple upper chuck members 31, causing the hand of the transfer robot TR to support the first substrate W1, and then controls the transfer robot TR to withdraw the hand of the transfer robot TR to the outside of the first processing block PB1. As a result, the first substrate W1 processed by the first processing block PB1 is unloaded from the first processing block PB1 (step S35).

[0320] After the control unit 102 removes the first substrate W1 from the first processing block PB1, it controls the moving mechanism 220A to move the upper substrate holding unit 2A from the opposing position P1 of the rinse drying cup unit 62a to the opposing position P1 of the first immersion tank 61b1.

[0321] When the time that has elapsed since the second substrate W2 was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid processing time), the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the opposing position P1 in the first immersion tank 61b1 to the second processing position P3, and then controls the upper chuck driving mechanism 50 to cause the second substrate W2 (second substrate W2 after the first chemical liquid processing) supported by the plurality of supports 614 in the first immersion tank 61b1 to be gripped by the plurality of upper chuck members 31. After causing the plurality of upper chuck members 31 to grip the second substrate W2, the control unit 102 moves the second substrate W2 after the first chemical liquid processing from the first immersion tank 61b1 to the rinse-dry cup unit 62a (step S36), as in step S23.

[0322] The control unit 102 may perform the shake-off process before raising the upper substrate holding unit 2A to the opposing position P1 of the first immersion tank 61b1.

[0323] As shown in FIG. 31, the control unit 102 moves the second substrate W2 into the rinse and dry cup part 62a, and then performs a rinse process (step S37) in the same manner as in step S24.

[0324] When the time that has elapsed since the start of the rinse process reaches or exceeds a predetermined time (predetermined rinse process time), the control unit 102 moves the rinsed second substrate W2 from the rinse drying cup unit 62a to the second immersion tank 61b2, as in step S25, and immerses the rinsed second substrate W2 in the second chemical liquid in the second immersion tank 61b2 (step S38). Immersing the second substrate W2 in the second chemical liquid performs the second chemical liquid treatment on the second substrate W2. Note that the upper substrate holding unit 2A holds the second substrate W2 while the second chemical liquid treatment is being performed on the second substrate W2.

[0325] The control unit 102 may perform the shaking-off process before raising the upper substrate holding unit 2A to the position P1 facing the rinse-dry cup unit 62a.

[0326] When the time that has elapsed since the second substrate W2 was immersed in the second chemical liquid reaches or exceeds a predetermined time (predetermined second chemical liquid processing time), the control unit 102 moves the second substrate W2 after the second chemical liquid processing from the second immersion tank 61b2 to the rinse drying cup section 62a (step S39), as in step S23.

[0327] The control unit 102 may perform the shake-off process before raising the upper substrate holding unit 2A to the opposing position P1 of the second immersion tank 61b2.

[0328] After moving the second substrate W2 into the rinse and dry cup part 62a, the control part 102 performs a rinse process (step S40) in the same manner as in step S24.

[0329] When the time that has elapsed since the start of the rinsing process of the second substrate W2 reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 executes a drying process similar to step S34 (step S41). As a result, the second substrate W2 is dried. When the drying process ends, the control unit 102 causes the second substrate W2 to be unloaded from the first processing block PB1 (step S42), similar to step S35. As a result, the process shown in FIGS. 30 and 31 ends.

[0330] As explained above with reference to Figures 30, 31 and 32(a) to 32(f), the first immersion tank 61b1 and the second immersion tank 61b2 each have a support portion 614, so that two substrates W can be immersed in the chemical solution in parallel.

[0331] Next, with reference to FIGS. 25 to 29, 33, and 34(a) to 34(e), another example of the operation of the substrate processing apparatus 100 of the third embodiment will be described using the first processing cup row L1 of the first processing block PB1 as an example. FIG. 33 is a diagram showing another example of the flow of the operation of the substrate processing apparatus 100 of the third embodiment. Specifically, FIG. 33 shows an example of the flow of the process executed by the control unit 102 when processing one substrate W in the first processing cup row L1 of the first processing block PB1. FIGS. 34(a) to 34(e) are diagrams schematically showing another example of the operation of the substrate processing apparatus 100 of the third embodiment. Specifically, FIGS. 34(a) to 34(e) show an example of the operation of the first processing block PB1 when processing one substrate W in the first processing cup row L1 of the first processing block PB1. Note that the cleaning tank 63 is omitted in FIGS. 34(a) to 34(e) for ease of understanding.

[0332] The process shown in Fig. 33 includes steps S51 to S59. One substrate W is processed in accordance with the processing procedure by the process shown in Fig. 33. Specifically, one substrate W is subjected to a first chemical liquid process, a rinse process, a second chemical liquid process, a rinse process, and a drying process in this order.

[0333] The process shown in FIG. 33 starts when the transport robot TR loads the substrate W into the first processing block PB1 through the loading / unloading port corresponding to the first processing cup row L1 of the first processing block PB1.

[0334] 33 and 34(a), the control unit 102 controls the transport robot TR to load the substrate W into the first processing block PB1, and then, similar to step S21 in Fig. 30, the control unit 102 causes the substrate W supported by the hand of the transport robot TR to be gripped by the plurality of upper chuck members 31. As a result, the upper substrate holder 2A receives the substrate W from the transport robot TR (step S51).

[0335] As shown in Figures 33 and 34(b), when the upper substrate holding part 2A holds the substrate W, the control part 102 submerges the substrate W in the first chemical liquid in the first immersion tank 61b1, as in step S22 of Figure 30, and immerses the substrate W in the first chemical liquid (step S52).

[0336] As shown in Figures 33 and 34(c), when the time that has elapsed since the substrate W was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid processing time), the control unit 102 moves the substrate W after the first chemical liquid processing from the first immersion tank 61b1 to the rinse-dry cup section 62a (step S53), similar to step S23 in Figure 30.

[0337] As shown in FIG. 33, when the control unit 102 moves the substrate W into the rinse-dry cup unit 62a, it performs a rinse process (step S54) in the same manner as step S24 in FIG.

[0338] 33 and 34(d), when the time that has elapsed since the start of the rinse process reaches or exceeds a predetermined time (predetermined rinse process time), the control unit 102 moves the rinsed substrate W from the rinse and dry cup unit 62a to the second immersion tank 61b2, and immerses the rinsed substrate W in the second chemical liquid in the second immersion tank 61b2 (step S55), similar to step S25 in Fig. 30. In the example described with reference to Fig. 33 and Fig. 34(a) to Fig. 34(e), the upper substrate holding unit 2A holds the substrate W during the second chemical liquid treatment.

[0339] As shown in Figures 33 and 34(e), when the time that has elapsed since the substrate W was immersed in the second chemical liquid reaches or exceeds a predetermined time (predetermined second chemical liquid processing time), the control unit 102 moves the substrate W after the second chemical liquid processing from the second immersion tank 61b2 to the rinse-dry cup section 62a (step S56), similar to step S32 in Figure 30.

[0340] After moving the substrate W into the rinse-dry cup part 62a, the control part 102 performs a rinse process (step S57) in the same manner as step S33 in FIG.

[0341] When the time that has elapsed since the start of the rinsing process of the substrate W reaches or exceeds a predetermined time (predetermined rinsing process time), the control unit 102 executes a drying process (step S58) in the same manner as step S34 in Fig. 30. As a result, the substrate W is dried.

[0342] When the drying process is completed, the control unit 102 causes the substrate W to be unloaded from the first processing block PB1 (step S59), similarly to step S35 in Fig. 30. As a result, the process shown in Fig. 33 is completed.

[0343] As described above with reference to FIG. 33 and FIGS. 34(a) to 34(e), the control unit 102 controls the moving unit 200A to move the upper substrate holding unit 2A in accordance with the processing procedure.

[0344] 33 and 34(a) to 34(e), when substrates W are processed one by one in one processing cup row L, the upper chuck member 31 does not need to be cleaned during substrate processing. Therefore, when substrates W are processed one by one in one processing cup row L, the cleaning unit CU may be omitted. However, the upper chuck member 31 may be cleaned during substrate processing.

[0345] 33 and 34(a) to 34(e), the process of leaving the substrate W behind can be omitted when processing the substrates W one by one in one processing cup row L. Therefore, when processing the substrates W one by one in one processing cup row L, the support portion 614 may be omitted. However, the process of leaving the substrate W behind may be performed.

[0346] Next, with reference to FIGS. 35 and 36, an example of a process for moving a substrate W from one processing cup section 6 to another will be described, taking as an example the case of moving a substrate W from the first immersion bath 61b1 to the rinse-dry cup section 62a. FIGS. 35 and 36 are views showing a process for lifting a substrate W from a first chemical liquid. Note that FIGS. 35 and 36 also show the first liquid supply section 12, the upper substrate holder 2A, part of the moving section 200A, the first chemical liquid processing unit PU1, and the first to fifth rail members 8a to 8e, all of which correspond to the first processing cup row L1 of the first processing block PB1. Also, FIGS. 35 and 36 schematically show cross sections of the moving section 200A and the first immersion bath 61b1 as viewed from the left.

[0347] As shown in Figure 35, when the substrate W is pulled up from the first chemical liquid by the pulling-up process, the control unit 102 switches the first opening / closing valve 125 of the first liquid supply unit 12 from a closed state to an open state, causing the first chemical liquid to be ejected from the upper nozzle unit 5A.

[0348] When the control unit 102 raises the upper substrate holding unit 2A to the third processing position P4, it switches the first opening / closing valve 125 of the first liquid supply unit 12 from an open state to a closed state to stop the upper nozzle unit 5A from discharging the first chemical liquid, and performs a puddle process to support a liquid film of the first chemical liquid on the upper surface Wa of the substrate W.

[0349] Specifically, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to reduce the rotation speed of the substrate W to a rotation speed at which the first chemical liquid is not discharged from the substrate W. For example, the control unit 102 may reduce the rotation speed of the substrate W to 10 rpm. As a result, a liquid film of the first chemical liquid is supported on the upper surface Wa of the substrate W. Hereinafter, the state in which the processing liquid is supported on the upper surface Wa of the substrate W may be referred to as a "puddle state."

[0350] 36, the control unit 102 controls the lifting mechanism 210A to move the upper substrate holding part 2A from the third processing position P4 to an opposing position P1 in the first immersion tank 61b1 while maintaining the paddle state. That is, the control unit 102 raises the substrate W from inside the first immersion tank 61b1 to a position above the first immersion tank 61b1 while rotating the substrate W at a rotational speed that causes a liquid film of the first chemical liquid to be maintained on the upper surface Wa of the substrate W.

[0351] Thereafter, while maintaining the puddle state, the control unit 102 controls the moving unit 200A to move the substrate W from a position above the first immersion bath 61b1 to a position inside the rinse-dry cup unit 62a.

[0352] The timing at which the upper nozzle unit 5A starts discharging the first chemical liquid is not particularly limited, as long as it is before the substrate W moves above (outside) the first immersion tank 61b1. For example, the control unit 102 may start discharging the first chemical liquid from the upper nozzle unit 5A while the substrate W is immersed in the first chemical liquid.

[0353] Furthermore, in the puddle process described with reference to Figures 35 and 36, the rotation speed of the substrate W was reduced to a rotation speed at which the first chemical liquid was not discharged from the substrate W to form a puddle state, but the control unit 102 may also stop the rotation of the substrate W and cause a liquid film of the first chemical liquid to be supported on the upper surface Wa of the substrate W.

[0354] 35 and 36, by supporting a liquid film of the first chemical liquid on the upper surface Wa of the substrate W, it is possible to prevent the upper surface Wa of the substrate W from drying while the substrate W is being moved from the first immersion tank 61b1 to the rinse-dry cup section 62a. As a result, it is possible to prevent the pattern from collapsing and particles from being generated.

[0355] In the example shown in Figures 35 and 36, the substrate W is moved from the first immersion tank 61b1 to the rinse-dry cup section 62a with a liquid film of the first chemical liquid supported (held) on the upper surface Wa of the substrate W, but the substrate W may also be moved from the first immersion tank 61b1 to the rinse-dry cup section 62a with a liquid film of the rinse liquid supported (held) on the upper surface Wa of the substrate W.

[0356] Similarly, when the substrate W is moved from the rinse-dry cup section 62a to the second immersion tank 61b2, a liquid film of the rinse liquid or the second chemical liquid may be supported (held) on the upper surface Wa of the substrate W, or when the substrate W is moved from the second immersion tank 61b2 to the rinse-dry cup section 62a, a liquid film of the second chemical liquid or the rinse liquid may be supported (held) on the upper surface Wa of the substrate W.

[0357] The third embodiment of the present invention has been described above with reference to Figures 25 to 36. According to the third embodiment, similar to the embodiments described with reference to Figures 1 to 24, a single substrate W in a horizontal position is immersed in a chemical solution stored in an immersion tank 61b to process the substrate W, thereby reducing the consumption of the chemical solution.

[0358] Furthermore, according to the third embodiment, the substrate W can be immersed in the chemical solution by submerging it in the chemical solution stored in the immersion tank 61b. Therefore, it is not necessary to drain the chemical solution from the immersion tank 61b every time a substrate W is processed, which further reduces the amount of chemical solution consumed. However, the chemical solution may be drained from the immersion tank 61b every time a substrate W is processed.

[0359] In the third embodiment, the first processing block PB1 and the second processing block PB2 each have one upper substrate holding part 2A for each processing cup row L, but the number of upper substrate holding parts 2A is not limited to one. As described with reference to FIG. 21 , the first processing block PB1 and the second processing block PB2 may each have a plurality of upper substrate holding parts 2A for each processing cup row L.

[0360] Furthermore, in the third embodiment, the first liquid supply unit 12 is configured to be able to supply two types of chemical liquid to the upper nozzle unit 5A, but the first liquid supply unit 12 may be configured to be able to supply three or more types of chemical liquid to the upper nozzle unit 5A. Similarly, the second liquid supply units 13b1 and 13b2 may be configured to be able to supply two or three or more types of chemical liquid to the lower nozzle unit 5B.

[0361] Furthermore, in the third embodiment, the plurality of processing cup units 6 in each processing cup row L include two first processing cup units 61, but the number of first processing cup units 61 is not limited to two. For example, the plurality of processing cup units 6 in each processing cup row L may include one first processing cup unit 61, or three or more first processing cup units 61. Specifically, in the third embodiment, the plurality of processing cup units 6 in each processing cup row L include two immersion tanks 61b, but the plurality of processing cup units 6 in each processing cup row L may include one immersion tank 61b, or three or more immersion tanks 61b.

[0362] In addition, in the third embodiment, the first immersion tank 61b1 has the inner wall portion 613, but the inner wall portion 613 of the first immersion tank 61b1 may be omitted. In this case, one of the first drainage portion 14b1 and the second drainage portion 15b1 may be omitted.

[0363] Similarly, in the third embodiment, the second immersion tank 61b2 has the inner wall portion 613, but the inner wall portion 613 of the second immersion tank 61b2 may be omitted. In this case, one of the first drainage portion 14b2 and the second drainage portion 15b2 may be omitted.

[0364] Furthermore, in embodiment 3, when the rinsing process was performed inside the rinse-dry cup portion 62a, the substrate W was not immersed in the rinsing liquid, but as described with reference to Figure 18, the rinsing process may include a step of immersing the substrate W in the rinsing liquid.

[0365] In addition, in the third embodiment, the rinse-drying cup portion 62a does not have the inner wall portion 613, but the rinse-drying cup portion 62a may have the inner wall portion 613.

[0366] In addition, in the third embodiment, the rinse-drying cup portion 62a is not provided with a plurality of support portions 614, but the rinse-drying cup portion 62a may have a plurality of support portions 614.

[0367] In addition, in the third embodiment, the cleaning tanks 63 are arranged at the rightmost positions of the corresponding processing cups 6, but the positions of the cleaning tanks 63 are not particularly limited. For example, the cleaning tanks 63 may be arranged at the leftmost positions of the corresponding processing cups 6.

[0368] Furthermore, although no mounting table 7 is provided in the third embodiment, a mounting table 7 may be provided for each processing cup row L, similar to the embodiment described with reference to FIGS.

[0369] [Variation 3] Next, the substrate processing apparatus 100 of Modification 3 will be described with reference to Figures 37, 38, and 39(a) to 39(d). However, only matters different from the embodiment described with reference to Figures 1 to 36 will be described, and descriptions of matters that are the same as those in the embodiment described with reference to Figures 1 to 36 will be omitted.

[0370] 25 to 36, the multiple processing cup sections 6 in each processing cup row L include one second processing cup section 62, but the multiple processing cup sections 6 in each processing cup row L may include multiple second processing cup sections 62. Modification 3 differs from the embodiment described with reference to FIGS. 1 to 36 in that the multiple processing cup sections 6 in each processing cup row L include multiple second processing cup sections 62.

[0371] Fig. 37 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of Modification 3. In detail, Fig. 37 shows the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Modification 3. Although not shown, the configuration of the second processing block PB2 is similar to the configuration of the first processing block PB1.

[0372] 37, in Modification 3, the multiple processing cup sections 6 of each processing cup row L include multiple first processing cup sections 61 and multiple second processing cup sections 62. In the example shown in FIG. 37, a mounting table 7 is provided for each processing cup row L.

[0373] The first processing cup parts 61 and the second processing cup parts 62 are arranged alternately in the first direction D1 (left-right direction). One of the second processing cup parts 62 may be disposed on the rightmost side of the multiple processing cup parts 6.

[0374] Specifically, the plurality of first processing cup sections 61 include two immersion tanks 61b (a first immersion tank 61b1 and a second immersion tank 61b2). The plurality of second processing cup sections 62 include two rinse-drying cup sections 62a. Hereinafter, one of the two rinse-drying cup sections 62a may be referred to as the "first rinse-drying cup section 62a1." Furthermore, the other of the two rinse-drying cup sections 62a may be referred to as the "second rinse-drying cup section 62a2." The two immersion tanks 61b (first immersion tank 61b1 and second immersion tank 61b2) and the two rinse-dry cup sections 62a (first rinse-dry cup section 62a1 and second rinse-dry cup section 62a2) are arranged in the following order from left to right: first immersion tank 61b1, first rinse-dry cup section 62a1, second immersion tank 61b2, second rinse-dry cup section 62a2.

[0375] Specifically, each of the first processing block PB1 and the second processing block PB2 has, for each processing cup row L, two rinse-dry processing units PUD and two chemical liquid processing units PUC.

[0376] Next, with reference to FIGS. 37, 38, and 39(a) to 39(d), an example of the operation of the substrate processing apparatus 100 of Modification 3 will be described using the first processing cup row L1 of the first processing block PB1 as an example. FIG. 38 is a diagram showing an example of the flow of the operation of the substrate processing apparatus 100 of Modification 3. Specifically, FIG. 38 shows an example of the flow of the process executed by the control unit 102 when two substrates W (first substrate W1 and second substrate W2) are processed in the first processing cup row L1 of the first processing block PB1. FIGS. 39(a) to 39(d) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of Modification 3. Specifically, FIGS. 39(a) to 39(d) show an example of the operation of the first processing block PB1 when two substrates W (first substrate W1 and second substrate W2) are processed in the first processing cup row L1 of the first processing block PB1.

[0377] The process shown in Fig. 38 includes steps S61 to S74. Each substrate W is processed according to the processing procedure by the process shown in Fig. 38. In Modification 3, the same type of chemical liquid is stored in each of the first immersion tank 61b1 and the second immersion tank 61b2, and each substrate W is subjected to chemical liquid processing, rinsing processing, and drying processing in this order.

[0378] 38 begins when the first substrate W1 is placed on the mounting table 7 corresponding to the first processing cup row L1. As shown in Fig. 38, when the first substrate W1 is placed on the mounting table 7, the control unit 102 causes the upper substrate holding unit 2A to hold the first substrate W1 (step S61).

[0379] 39(a), the control unit 102 causes the upper substrate holding unit 2A to hold the first substrate W1, and then causes the first substrate W1 to be immersed in the chemical solution in the first immersion tank 61b1 (step S62). Then, the control unit 102 causes the first substrate W1 to remain in the first immersion tank 61b1 (step S63).

[0380] When the second substrate W2 is placed on the mounting table 7 before the chemical liquid treatment on the first substrate W1 is completed, the control unit 102 causes the upper substrate holding unit 2A to hold the second substrate W2 (step S64).

[0381] As shown in Fig. 39(b), after the control unit 102 has the upper substrate holding unit 2A hold the second substrate W2, it immerses the second substrate W2 in the chemical solution in the second immersion tank 61b2 (step S65). Then, the control unit 102 leaves the second substrate W2 in the second immersion tank 61b2 (step S66). As a result, as shown in Fig. 39(c), chemical solution treatment is performed on the two substrates W (the first substrate W1 and the second substrate W2) in parallel.

[0382] 39(d), when a predetermined time (predetermined chemical treatment time) has elapsed since the first substrate W1 was immersed in the chemical solution, the control unit 102 moves the first substrate W1 from the first immersion tank 61b1 to the first rinse-dry cup unit 62a1 (step S67). Then, the control unit 102 performs a rinse process on the first substrate W1 after the chemical treatment inside the first rinse-dry cup unit 62a1 (step S68).

[0383] When a predetermined time (predetermined rinse time) has elapsed since the start of the rinse process on the first substrate W1, the control unit 102 ends the rinse process and performs a drying process inside the first rinse drying cup unit 62a1 (step S69). As a result, the first substrate W1 is dried. When the drying process is completed, the control unit 102 causes the first substrate W1 to be unloaded from the first processing block PB1 (step S70).

[0384] When a predetermined time (predetermined chemical treatment time) has elapsed since the second substrate W2 was immersed in the chemical solution, the control unit 102 moves the second substrate W2 from the second immersion tank 61b2 to the second rinse-dry cup unit 62a2 (step S71). Then, the control unit 102 performs a rinse process on the second substrate W2 after the chemical treatment inside the second rinse-dry cup unit 62a2 (step S72).

[0385] When a predetermined time (predetermined rinsing time) has elapsed since the start of the rinsing process on the second substrate W2, the control unit 102 ends the rinsing process and performs a drying process inside the second rinse drying cup unit 62a2 (step S73). As a result, the second substrate W2 is dried. When the drying process is completed, the control unit 102 causes the second substrate W2 to be unloaded from the first processing block PB1 (step S74).

[0386] 37 to 39(a) to 39(d), the substrate processing apparatus 100 of Modification 3 has been described. According to Modification 3, chemical liquid processing can be performed on a plurality of substrates W in parallel.

[0387] In the third modification, the two immersion tanks 61b store the same type of chemical solution, but the two immersion tanks 61b may store different types of chemical solutions. In this case, the first processing block PB1 and the second processing block PB2 may each have a cleaning unit CU (cleaning tank 63) for each processing cup row L.

[0388] Furthermore, in the third modification, a mounting table 7 is provided for each processing cup row L, but the mounting table 7 may be omitted.

[0389] [Variation 4] Next, the substrate processing apparatus 100 of Modification 4 will be described with reference to Figures 40(a) to 40(f). However, only the points different from the embodiment described with reference to Figures 1 to 39 will be described, and the points that are the same as those in the embodiment described with reference to Figures 1 to 39 will not be described.

[0390] Figures 40(a) to 40(f) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of Modification 4. In detail, Figures 40(a) to 40(f) show an example of the operation of the first processing block PB1 when processing one substrate W in the first processing cup row L1 of the first processing block PB1.

[0391] In the embodiment described with reference to FIGS. 25 to 39, the multiple processing cup units 6 include two immersion tanks 61b. However, the multiple processing cup units 6 may include three or more immersion tanks 61b. In Modification 4, as shown in FIG. 40(a), the multiple processing cup units 6 include three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3) and one rinse-dry cup unit 62a. The three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3) store different types of chemical liquids (first chemical liquid to third chemical liquid). Hereinafter, an example of the operation of the substrate processing apparatus 100 when the multiple processing cup units 6 include three or more immersion tanks 61b will be described using the configuration shown in FIGS. 40(a) to 40(f) as an example.

[0392] 40(a), the control unit 102 causes the upper substrate holding unit 2A to hold the substrate W that has been carried into the first processing block PB1 by the transport robot TR. Then, the control unit 102 causes the substrate W to be immersed in the first chemical liquid in the first immersion tank 61b1.

[0393] 40(b), when a predetermined time (predetermined first chemical liquid processing time) has elapsed since the substrate W was immersed in the first chemical liquid, the control unit 102 moves the substrate W from the first immersion tank 61b1 to the rinse-dry cup unit 62a. Then, the control unit 102 performs a rinse process on the substrate W after the first chemical liquid processing inside the rinse-dry cup unit 62a.

[0394] As shown in Figure 40(c), when a predetermined time (predetermined rinse time) has elapsed since starting the rinse process on the substrate W after the first chemical liquid process, the control unit 102 terminates the rinse process and immerses the substrate W after the rinse process in the second chemical liquid in the second immersion tank 61b2.

[0395] 40(d), when a predetermined time (predetermined second chemical liquid processing time) has elapsed since the substrate W was immersed in the second chemical liquid, the control unit 102 moves the substrate W from the second immersion tank 61b2 to the rinse-dry cup unit 62a. Then, the control unit 102 performs a rinse process on the substrate W after the second chemical liquid processing inside the rinse-dry cup unit 62a.

[0396] As shown in Figure 40(e), when a predetermined time (predetermined rinse time) has elapsed since starting the rinse process on the substrate W after the second chemical liquid process, the control unit 102 terminates the rinse process and immerses the substrate W after the rinse process in the third chemical liquid in the third immersion tank 61b3.

[0397] 40(f), when a predetermined time (predetermined third chemical liquid processing time) has elapsed since the substrate W was immersed in the third chemical liquid, the control unit 102 moves the substrate W from the third immersion tank 61b3 to the rinse-dry cup unit 62a. Then, the control unit 102 performs a rinse process on the substrate W after the third chemical liquid processing inside the rinse-dry cup unit 62a.

[0398] When a predetermined time (predetermined rinse time) has elapsed since the start of the rinse process on the substrate W after the third chemical liquid process, the control unit 102 ends the rinse process and performs a drying process inside the rinse-dry cup unit 62a.

[0399] 40(a) to 40(f), the substrate processing apparatus 100 of Modification 4 has been described. According to Modification 4, a larger number of immersion tanks 61b can be arranged in a limited space. Therefore, substrates W can be processed using three or more types of chemical solutions.

[0400] Although no mounting table 7 is provided in the fourth modified example, a mounting table 7 may be provided for each processing cup row L, similar to the embodiment described with reference to FIGS.

[0401] [Variation 5] Next, the substrate processing apparatus 100 of Modified Example 5 will be described with reference to Figures 41(a) to 41(d). However, only the differences from the embodiment described with reference to Figures 1 to 39 and 40(a) to 40(f) will be described, and the same details as those of the embodiment described with reference to Figures 1 to 39 and 40(a) to 40(f) will not be described.

[0402] Figures 41(a) to 41(d) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of Modification 5. In detail, Figures 41(a) to 41(d) show an example of the operation of the first processing block PB1 when three substrates W (first substrate W1 to third substrate W3) are processed in the first processing cup row L1 of the first processing block PB1.

[0403] In Modification 5, similar to Modification 4, the processing cup units 6 include three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3) and one rinse-drying cup unit 62a. Also, in Modification 5, the same type of chemical solution is stored in the three immersion tanks 61b (first immersion tank 61b1 to third immersion tank 61b3).

[0404] 41(a), in Modification 5, the first substrate W1 to the third substrate W3 are left in the first immersion tank 61b1 to the third immersion tank 61b3, respectively. Therefore, the first substrate W1 to the third substrate W3 are subjected to chemical liquid treatment in parallel.

[0405] As shown in Figure 41(b), for example, when the time that has elapsed since the first substrate W1 was immersed in the chemical solution in the first immersion tank 61b1 exceeds a predetermined time (predetermined chemical solution processing time), the control unit 102 moves the first substrate W1 from the first immersion tank 61b1 to the rinse and dry cup section 62a, performs rinsing and drying processes on the first substrate W1, and then transports the first substrate W1 out of the first processing block PB1.

[0406] Similarly, when the time that has elapsed since the second substrate W2 was immersed in the chemical solution in the second immersion tank 61b2 reaches or exceeds a predetermined time (predetermined chemical solution treatment time), the control unit 102 moves the second substrate W2 from the second immersion tank 61b2 to the rinse-dry cup unit 62a, performs rinsing and drying treatments on the second substrate W2, and then unloads the second substrate W2 from the first processing block PB1, as shown in Fig. 41(c). Furthermore, when the time that has elapsed since the third substrate W3 was immersed in the chemical solution in the third immersion tank 61b3 reaches or exceeds a predetermined time (predetermined chemical solution treatment time), the control unit 102 moves the third substrate W3 from the third immersion tank 61b3 to the rinse-dry cup unit 62a, performs rinsing and drying treatments on the third substrate W3, and then unloads the third substrate W3 from the first processing block PB1, as shown in Fig. 41(d).

[0407] Modification 5 has been described above with reference to Figures 41(a) to 41(d). According to Modification 5, chemical liquid processing can be performed in parallel on a plurality of substrates W. This reduces the wait time for the timing to start chemical liquid processing.

[0408] In the fifth modification, the first to third immersion tanks 61b1 to 61b3 store the same type of chemical liquid, but different types of chemical liquid may be stored in the first to third immersion tanks 61b1 to 61b3. In this case, the first processing block PB1 and the second processing block PB2 may each have a cleaning unit CU (cleaning tank 63) for each processing cup row L.

[0409] Furthermore, although no mounting table 7 is provided in the fifth modified example, a mounting table 7 may be provided for each processing cup row L, similar to the embodiment described with reference to FIGS.

[0410] [Variation 6] Next, a substrate processing apparatus 100 according to Modification 6 will be described with reference to Figures 42, 43, and 44(a) to 44(f). However, only differences from the embodiment described with reference to Figures 1 to 39, 40(a) to 40(f), and 41(a) to 41(d) will be described, and descriptions of the same differences as in the embodiment described with reference to Figures 1 to 39, 40(a) to 40(f), and 41(a) to 41(d) will be omitted. Modification 6 differs from the embodiment described with reference to Figures 25 to 39, 40(a) to 40(f), and 41(a) to 41(d) in that each processing cup row L includes a rinse cup portion 62b.

[0411] Fig. 42 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of Modification 6. In detail, Fig. 42 shows the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Modification 6. Although not shown, the configuration of the second processing block PB2 is similar to the configuration of the first processing block PB1.

[0412] 42, in Modification 6, the multiple processing cup portions 6 of each processing cup row L include multiple first processing cup portions 61 and multiple second processing cup portions 62. In the example shown in FIG. 42, the multiple processing cup portions 6 of each processing cup row L include two first processing cup portions 61 and two second processing cup portions 62.

[0413] Specifically, the first processing cups 61 include two immersion tanks 61b (a first immersion tank 61b1 and a second immersion tank 61b2). The second processing cups 62 include one rinse-dry cup 62a and one rinse cup 62b.

[0414] The two immersion tanks 61b (first immersion tank 61b1 and second immersion tank 61b2), one rinse-dry cup section 62a, and one rinse cup section 62b are arranged in accordance with the processing procedure. Specifically, the first immersion tank 61b1, the second immersion tank 61b2, the rinse-dry cup section 62a, and the rinse cup section 62b are arranged in the following order from the left: first immersion tank 61b1, rinse cup section 62b, second immersion tank 61b2, and rinse-dry cup section 62a. The rinse-dry cup section 62a is arranged on the rightmost side of the multiple processing cup sections 6. The rinse cup section 62b is arranged between the two immersion tanks 61b (two first processing cup sections 61).

[0415] Specifically, the substrate W is subjected to a first chemical liquid treatment, a rinse treatment, a second chemical liquid treatment, a rinse treatment, and a drying treatment in this order. The first immersion tank 61b1 stores the first chemical liquid. The second immersion tank 61b2 stores the second chemical liquid. The rinse cup portion 62b is used for the rinse treatment after the first chemical liquid treatment. The rinse cup portion 62b receives the rinse liquid discharged from the substrate W held by the upper substrate holder 2A.

[0416] Fig. 43 is a cross-sectional view schematically showing a portion of the configuration of a first processing block PB1 included in a substrate processing apparatus 100 of Modification 6. Specifically, Fig. 43 shows a first liquid supply unit 12, an upper substrate holding unit 2A, a movable unit 200A, a rinse processing unit PUL, and first to fifth rail members 8a to 8e corresponding to the first processing cup row L1 of the first processing block PB1. Fig. 43 also shows a cross-section of the movable unit 200A and rinse cup unit 62b as viewed from the left side.

[0417] As shown in Fig. 43, the rinse processing unit PUL has a rinse cup 62b, a second liquid supply unit 13d, a first drainage unit 14d, and a second drainage unit 15d. In Modification 6, the rinse cup 62b has a bottom wall 611, a side wall 612, an inner wall 613, a plurality of support members 614, and a lower nozzle 5B. The rinse cup 62b shown in Fig. 43 has a structure similar to that of the immersion tank 61b, and therefore a detailed description thereof will be omitted.

[0418] The second liquid supply unit 13d supplies a rinse liquid (here, DIW) to the lower nozzle unit 5B of the rinse cup unit 62b. Specifically, the second liquid supply unit 13d has a rinse liquid piping unit 131d and an open / close valve 135d. The configuration of the second liquid supply unit 13d is similar to the configuration of the second liquid supply unit 13c shown in FIG. 29, and therefore a detailed description thereof will be omitted.

[0419] The first drainage section 14d drains the rinse liquid stored inside the inner wall section 613 from the rinse cup section 62b. Specifically, the first drainage section 14d has a drainage pipe section 141d and an on-off valve 145d. The second drainage section 15d drains the rinse liquid collected between the inner wall section 613 and the side wall section 612 from the rinse cup section 62b. Specifically, the second drainage section 15d has a drainage pipe section 151d and an on-off valve 152d. The configurations of the first drainage section 14d and the second drainage section 15d are similar to the configuration of the drainage section 14c shown in FIG. 29 , and therefore detailed description thereof will be omitted.

[0420] In the sixth modification, the rinse process is performed on the substrate W after the first chemical liquid process inside the rinse cup portion 62b. The rinse process performed inside the rinse cup portion 62b will be described below.

[0421] The control unit 102 controls the moving unit 200A to move the upper substrate holding unit 2A, which holds the substrate W after the first chemical liquid processing, to a position P1 facing the rinse cup unit 62b. Then, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A from the position P1 facing the rinse cup unit 62b to a first processing position P2.

[0422] In Modification 6, at the start of a rinse process on the substrate W after the first chemical liquid process, no rinse liquid is stored in the rinse cup portion 62b. The control portion 102 lowers the upper substrate holding portion 2A from the opposing position P1 of the rinse cup portion 62b to the first process position P2, and then controls the upper rotation portion 4 (upper motor main body 42) to rotate the substrate W. Thereafter, as described with reference to FIG. 17 , the control portion 102 switches the second opening / closing valve 126 of the first liquid supply portion 12 and the opening / closing valve 135d of the second liquid supply portion 13d from the closed state to the open state, causing the upper nozzle portion 5A and the lower nozzle portion 5B to eject the rinse liquid toward the upper surface Wa and lower surface Wb of the rotating substrate W (first step of the rinse process).

[0423] When a predetermined time has elapsed since the start of discharge of the rinsing liquid, the control unit 102 closes the on-off valve 145d of the first drainage unit 14d. As a result, as described with reference to Fig. 18, the rinsing liquid is stored inside the inner wall 613, and the substrate W is immersed in the rinsing liquid (second step of the rinsing process). The control unit 102 continues to rotate the substrate W from the first step to the second step of the rinsing process.

[0424] In Modification 6, after the substrate W is immersed in the rinse liquid, the substrate W is left in the rinse cup portion 62b. Specifically, the control unit 102 stops the rotation of the substrate W after the substrate W is immersed in the rinse liquid. The control unit 102 also switches the second opening / closing valve 126 of the first liquid supply unit 12 and the opening / closing valve 135d of the second liquid supply unit 13d from the open state to the closed state to stop the discharge of the rinse liquid. The control unit 102 then controls the lifting mechanism 210A to move the upper substrate holding unit 2A from the first processing position P2 to the second processing position P3, and then controls the upper chuck driving mechanism 50 to release the grip of the substrate W by the upper chuck member 31. As a result, the substrate W is supported by the multiple supports 614 of the rinse cup portion 62b.

[0425] The control unit 102 may stop the discharge of the rinse liquid after a predetermined time has elapsed since the substrate W was immersed in the rinse liquid. Specifically, the control unit 102 may continue the discharge of the rinse liquid until a predetermined time has elapsed since the space inside the inner wall portion 613 was filled with the rinse liquid, thereby causing the rinse liquid to overflow from the inner wall portion 613 (overflow process).

[0426] When the substrate W is moved from the rinse cup 62b to another processing cup 6, the control unit 102 causes the upper chuck member 31 to grip the substrate W and raises the upper substrate holding unit 2A from the second processing position P3 to the first processing position P2. Then, the control unit 102 switches the opening / closing valve 145d of the first drainage unit 14d from a closed state to an open state to discharge the rinse liquid from the rinse cup 62b. After the rinse liquid is discharged from the rinse cup 62b, the control unit 102 controls the first liquid supply unit 12, the second liquid supply unit 13d, and the upper substrate holding unit 2A to perform the third step of the rinse process described with reference to FIG. 19 inside the rinse cup 62b.

[0427] Note that, while the control unit 102 is discharging the rinse liquid, it may rotate the substrate W and cause the upper nozzle unit 5A and the lower nozzle unit 5B to discharge the rinse liquid. This process prevents the substrate W from drying, and can prevent the pattern from collapsing and the generation of particles.

[0428] Furthermore, the control unit 102 may execute a process of causing the rinse liquid to overflow from the inner wall portion 613 before discharging the rinse liquid. In this case, the control unit 102 causes the upper chuck member 31 to grip the substrate W and raises the upper substrate holding unit 2A from the second processing position P3 to the first processing position P2, and then causes the upper nozzle unit 5A and the lower nozzle unit 5B to discharge the rinse liquid so that the rinse liquid overflows from the inner wall portion 613. When a predetermined time has elapsed since the start of discharge of the rinse liquid, the control unit 102 stops the discharge of the rinse liquid and then discharges the rinse liquid from the rinse cup portion 62b. The control unit 102 may rotate the substrate W while causing the rinse liquid to overflow from the inner wall portion 613.

[0429] Next, with reference to Figures 42, 43, and 44(a) to 44(f), an example of the operation of the substrate processing apparatus 100 of Modification 6 will be described using the first processing cup row L1 of the first processing block PB1 as an example. Figures 44(a) to 44(f) are diagrams schematically showing an example of the operation of the substrate processing apparatus 100 of Modification 6. In detail, Figures 44(a) to 44(f) show an example of the operation of the first processing block PB1 when two substrates W (a first substrate W1 and a second substrate W2) are processed in the first processing cup row L1 of the first processing block PB1.

[0430] 44(a), the control unit 102 causes the upper substrate holding unit 2A to hold the first substrate W1 that has been carried into the first processing block PB1 by the transport robot TR. Then, the control unit 102 causes the first substrate W1 to be immersed in the first chemical liquid in the first immersion tank 61b1.

[0431] 44(b), when a predetermined time (predetermined first chemical solution processing time) has elapsed since the first substrate W1 was immersed in the first chemical solution, the control unit 102 moves the first substrate W1 from the first immersion tank 61b1 to the rinse cup unit 62b. Then, as described with reference to FIG. 43, after immersing the first substrate W1 in the rinse solution, the control unit 102 leaves the first substrate W1 in the rinse cup unit 62b.

[0432] 44(c), the control unit 102 causes the first substrate W1 to remain in the rinse cup unit 62b, and then causes the upper substrate holding unit 2A to hold the second substrate W2 that has been carried into the first processing block PB1 by the transport robot TR. Then, the control unit 102 causes the second substrate W2 to remain in the first chemical liquid in the first immersion tank 61b1.

[0433] 44(d), after the control unit 102 leaves the second substrate W2 in the first chemical liquid in the first immersion tank 61b1, it controls the moving unit 200A and the upper chuck driving mechanism 50 to cause the upper substrate holding unit 2A to hold the first substrate W1, which is left in the rinse liquid in the rinse cup unit 62b. Then, as described with reference to FIG. 43, the control unit 102 discharges the rinse liquid from the rinse cup unit 62b, and then performs the third step of the rinse process.

[0434] 44(e), after the third step of the rinsing process is completed, the control unit 102 moves the first substrate W1 from the rinse cup unit 62b to the second immersion tank 61b2. Then, the control unit 102 leaves the first substrate W1 in the second chemical liquid in the second immersion tank 61b2.

[0435] 44(f), when a predetermined time (predetermined first chemical solution treatment time) has elapsed since the second substrate W2 was immersed in the first chemical solution, the control unit 102 moves the second substrate W2 from the first immersion tank 61b1 to the rinse cup unit 62b. Then, the control unit 102 leaves the second substrate W2 in the rinse solution in the rinse cup unit 62b, just like the first substrate W1.

[0436] After the second substrate W2 is left in the rinse cup section 62b, when the time that has elapsed since the first substrate W1 was immersed in the second chemical liquid reaches or exceeds a predetermined time (predetermined second chemical liquid treatment time), the control section 102 moves the first substrate W1 from the second immersion bath 61b2 to the rinse and dry cup section 62a, where the first substrate W1 is subjected to rinsing and drying treatments. After drying the first substrate W1, the control section 102 unloads the first substrate W1 from the first treatment block PB1. Thereafter, the control section 102 processes the second substrate W2 in the same manner as the first substrate W1, and unloads the second substrate W2 from the first treatment block PB1.

[0437] 44(a) to 44(f), the operation for processing two substrates W has been described, but the third and subsequent substrates W are processed in the same manner. Specifically, the control unit 102 causes the second substrate W2 to remain in the rinse cup unit 62b, and then causes the upper substrate holding unit 2A to hold the third substrate W3 (the third substrate W) that has been carried into the first processing block PB1 by the transport robot TR. Then, the control unit 102 causes the third substrate W3 to remain in the first chemical liquid in the first immersion tank 61b1.

[0438] Modification 6 has been described above with reference to Figures 42, 43, and 44(a) to 44(f). According to Modification 6, processing of the next substrate W can be started before processing of one substrate W is completed. This reduces the waiting time for the timing to start chemical liquid processing. Furthermore, in Modification 6, multiple processing cups 6 are lined up according to the processing procedure. This prevents the movement sequence of the upper substrate holding part 2A from becoming complicated.

[0439] The rinse-dry cup section 62a may have the same structure as the immersion tank 61b. By having the rinse-dry cup section 62a have the same structure as the immersion tank 61b, the rinse liquid can be stored in the rinse-dry cup section 62a, and the substrates W can be left in the rinse-dry cup section 62a. This makes it possible to increase the number of substrates W that can be processed continuously.

[0440] Furthermore, in Modification 6, the multiple processing cup portions 6 of each processing cup row L include two second processing cup portions 62, but the number of second processing cup portions 62 is not limited to two. For example, the multiple processing cup portions 6 of each processing cup row L may include three or more second processing cup portions 62. Specifically, the multiple processing cup portions 6 of each processing cup row L may include three or more immersion tanks 61b, two or more rinse cup portions 62b, and one rinse-drying cup portion 62a.

[0441] Furthermore, although no mounting table 7 is provided in the sixth modified example, a mounting table 7 may be provided for each processing cup row L, similar to the embodiment described with reference to FIGS.

[0442] [Variation 7] Next, the substrate processing apparatus 100 of Modified Example 7 will be described with reference to Figure 45. However, only the points different from the embodiment described with reference to Figures 1 to 43 and 44(a) to 44(f) will be described, and the points the same as those in the embodiment described with reference to Figures 1 to 43 and 44(a) to 44(f) will not be described.

[0443] Fig. 45 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of Modification 7. In detail, Fig. 45 shows the configuration of the first processing block PB1 included in the substrate processing apparatus 100 of Modification 7. Although not shown, the configuration of the second processing block PB2 is similar to the configuration of the first processing block PB1.

[0444] 45, in Modification 7, similarly to Modification 6, a plurality of first processing cup parts 61 and a plurality of second processing cup parts 62 are arranged in a first direction D1 (left-right direction) in accordance with the processing procedure for the substrate W. Specifically, the plurality of processing cup parts 6 in each processing cup row L include two immersion tanks 61b (a first immersion tank 61b1 and a second immersion tank 61b2), one rinse-dry cup part 62a, and one rinse cup part 62b. The first immersion tank 61b1, the second immersion tank 61b2, the rinse-dry cup part 62a, and the rinse cup part 62b are arranged in this order from left to right: first immersion tank 61b1, rinse cup part 62b, second immersion tank 61b2, and rinse-dry cup part 62a. The first immersion tank 61b1 and the second immersion tank 61b2 store a first chemical liquid and a second chemical liquid, respectively.

[0445] In Modification 7, the substrate W is subjected to a first chemical liquid treatment, a rinse treatment, a second chemical liquid treatment, a rinse treatment, and a drying treatment in this order. In the second immersion tank 61b2, the treatment immediately before the final rinse treatment (the second chemical liquid treatment) is performed. In the rinse-dry cup section 62a, the final rinse treatment and a drying treatment are performed. The second immersion tank 61b2 is an example of a "third treatment cup section." The rinse-dry cup section 62a is an example of a "fourth treatment cup section."

[0446] Furthermore, in Modification 7, similarly to Modification 1 (FIG. 21), two upper substrate holding parts 2A are provided for each processing cup row L. Specifically, a first upper substrate holding part 2A1 and a second upper substrate holding part 2A2 are provided for each processing cup row L. The second upper substrate holding part 2A2 holds the substrate W when performing the final rinsing process and drying process included in the processing procedure for the substrate W.

[0447] In detail, the first processing block PB1 and the second processing block PB2 each have, for each processing cup row L, a first upper substrate holding portion 2A1, a rail member 81 corresponding to the first upper substrate holding portion 2A1, a first moving portion 200A1 corresponding to the first upper substrate holding portion 2A1, a second upper substrate holding portion 2A2, a rail member 82 corresponding to the second upper substrate holding portion 2A2, and a second moving portion 200A2 corresponding to the second upper substrate holding portion 2A2.

[0448] Like the moving section 200A, the first moving section 200A1 includes a support arm 201A, a lifting mechanism 210A, and a moving mechanism 220A. The support arm 201A and the lifting mechanism 210A of the first moving section 200A1 are guided in a first direction D1 (left-right direction) by a rail member 81. The configuration of the first moving section 200A1 is similar to the configuration of the moving section 200A described with reference to FIGS. 1, 2, 4, and 5, and therefore a detailed description thereof will be omitted. Similarly, the configuration of the rail member 81 is similar to the configuration of the rail member 8 described with reference to FIGS. 1, 2, 4, and 5, and therefore a detailed description thereof will be omitted. The moving mechanism 220A of the first moving section 200A1 is an example of a "first moving mechanism."

[0449] Similar to the moving section 200A, the second moving section 200A2 includes a support arm 201A, a lifting mechanism 210A, and a moving mechanism 220A. The support arm 201A and the lifting mechanism 210A of the second moving section 200A2 are guided in the first direction D1 (left-right direction) by a rail member 82. The configuration of the second moving section 200A2 is similar to the configuration of the moving section 200A described with reference to FIGS. 1, 2, 4, and 5, and therefore a detailed description thereof will be omitted. Similarly, the configuration of the rail member 82 is similar to the configuration of the rail member 8 described with reference to FIGS. 1, 2, 4, and 5, and therefore a detailed description thereof will be omitted. The moving mechanism 220A of the second moving section 200A2 is an example of a "second moving mechanism."

[0450] When the first upper substrate holding unit 2A1 is moved in the first direction D1, the support arms 201A of the first upper substrate holding unit 2A1 and the first moving unit 200A1 are positioned differently in the vertical direction from the support arms 201A of the second upper substrate holding unit 2A2 and the second moving unit 200A2. Similarly, when the second upper substrate holding unit 2A2 is moved in the first direction D1, the support arms 201A of the first upper substrate holding unit 2A1 and the first moving unit 200A1 are positioned differently in the vertical direction from the support arms 201A of the second upper substrate holding unit 2A2 and the second moving unit 200A2. This prevents the first upper substrate holding unit 2A1 and the second upper substrate holding unit 2A2 from interfering with each other. Furthermore, it also prevents the support arms 201A from interfering with each other.

[0451] Next, with reference to FIG. 45, an example of the operation of the first processing block PB1 when processing one substrate W will be described, taking the first processing cup row L1 as an example.

[0452] The control unit 102 controls the first mover 200A1 and the first upper substrate holding unit 2A1 to hold the substrate W that the transport robot TR has carried into the first processing block PB1. The control unit 102 then controls the first mover 200A1, the first upper substrate holding unit 2A1, and the first chemical liquid processing unit PU1 to immerse the substrate W in the first chemical liquid in the first immersion tank 61b1 (first chemical liquid processing).

[0453] When the time that has elapsed since the substrate W was immersed in the first chemical liquid reaches or exceeds a predetermined time (predetermined first chemical liquid processing time), the control unit 102 controls the first mover 200A1, the first upper substrate holding unit 2A1, and the first chemical liquid processing unit PU1 to raise the first upper substrate holding unit 2A1 to a position P1 facing the first immersion bath 61b1, thereby lifting the substrate W out of the first chemical liquid. The control unit 102 then controls the first mover 200A1 to move the first upper substrate holding unit 2A1 to a position P1 facing the rinse cup unit 62b, and then lowers the first upper substrate holding unit 2A1 from the position P1 facing the rinse cup unit 62b to a first processing position P2. As a result, the substrate W that has been processed with the first chemical liquid moves inside the rinse cup unit 62b. When the substrate W processed with the first chemical liquid moves to the inside of the rinse cup portion 62b, the control portion 102 performs a rinse process on the substrate W processed with the first chemical liquid.

[0454] After the rinsing process is completed, the control unit 102 controls the first mover 200A1 to move the first upper substrate holding unit 2A1 to a position P1 facing the rinse cup unit 62b, and then moves the first upper substrate holding unit 2A1 from the position P1 facing the rinse cup unit 62b to a position P1 facing the second immersion bath 61b2. The control unit 102 then controls the first mover 200A1, the first upper substrate holding unit 2A1, and the second chemical liquid processing unit PU2 to leave the substrate W in the second chemical liquid in the second immersion bath 61b2 (second chemical liquid processing).

[0455] When the time that has elapsed since the substrate W was immersed in the second chemical liquid reaches or exceeds a predetermined time (predetermined second chemical liquid processing time), the control unit 102 controls the second mover 200A2 and the second upper substrate holding unit 2A2 to hold the substrate W immersed in the second chemical liquid on the second upper substrate holding unit 2A2. Then, the control unit 102 controls the second mover 200A2, the second chemical liquid processing unit PU2, and the second upper substrate holding unit 2A2 to raise the second upper substrate holding unit 2A2 to the opposing position P1 in the second immersion tank 61b2, thereby lifting the substrate W out of the second chemical liquid.

[0456] After lifting the substrate W from the second chemical liquid, the control unit 102 controls the second moving unit 200A2 to move the second upper substrate holding unit 2A2 to a position P1 facing the rinse-dry cup unit 62a, and then lowers the second upper substrate holding unit 2A2 from the position P1 facing the rinse-dry cup unit 62a to the first processing position P2. As a result, the substrate W after the second chemical liquid processing moves inside the rinse-dry cup unit 62a. When the substrate W after the second chemical liquid processing moves inside the rinse-dry cup unit 62a, the control unit 102 performs a rinse process and a drying process on the substrate W after the second chemical liquid processing.

[0457] After the drying process is completed, the control unit 102 controls the second mover 200A2 to move the second upper substrate holding unit 2A2, which holds the dried substrate W, to the opposing position P1 of the first immersion bath 61b1. Then, the control unit 102 controls the transport robot TR and the second upper substrate holding unit 2A2 to unload the substrate W from the first processing block PB1.

[0458] According to Modification 7, the plurality of upper chuck members 31 of the second upper substrate holding part 2A2 do not come into contact with the first chemical liquid, but only with the second chemical liquid. This reduces the possibility that another chemical liquid (first chemical liquid) will adhere to the substrate W after the second chemical liquid processing, causing the second chemical liquid and the other chemical liquid to mix on the substrate W. This reduces the possibility that the substrate W will be contaminated.

[0459] Although no mounting table 7 is provided in the seventh modified example, a mounting table 7 may be provided for each processing cup row L, similar to the embodiment described with reference to FIGS.

[0460] [Variation 8] Next, the substrate processing apparatus 100 of Modified Example 8 will be described with reference to Figures 46 and 47. However, only the points different from the embodiment described with reference to Figures 1 to 45 will be described, and a description of the points that are the same as those in the embodiment described with reference to Figures 1 to 45 will be omitted.

[0461] In the embodiment described with reference to FIGS. 25 to 45, the substrate W is not moved between the plurality of processing cup rows L, but the substrate W may be moved between the plurality of processing cup rows L.

[0462] Fig. 46 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of Modification 8. Fig. 47 is a block diagram of the substrate processing apparatus 100 of Modification 8. In detail, Fig. 46 shows the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of Modification 8. Although not shown, the configuration of a second processing block PB2 is similar to the configuration of the first processing block PB1.

[0463] 46, the first processing block PB1 may include a processing chamber 9, multiple processing cup rows L (first processing cup row L1 to fourth processing cup row L4), multiple mounting tables 7, multiple upper substrate holding units 2A, multiple moving units 200A, multiple rail members 8, and an inter-row transport device 400A. The mounting tables 7, upper substrate holding units 2A, moving units 200A, and rail members 8 are provided for each processing cup row L.

[0464] In the eighth modification, each processing cup row L includes one immersion tank 61b and one rinse-drying cup section 62a. The immersion tank 61b (first immersion tank 61b1) of the first processing cup row L1 stores a first chemical liquid. The immersion tanks 61b (second immersion tank 61b2) of the second processing cup row L2 to the fourth processing cup row L4 store a second chemical liquid. That is, the immersion tanks 61b of the second processing cup row L2 to the fourth processing cup row L4 store a different type of chemical liquid from the immersion tank 61b of the first processing cup row L1. The immersion tanks 61b of the second processing cup row L2 to the fourth processing cup row L4 store the same type of chemical liquid.

[0465] In each processing cup row L, one immersion tank 61b and one rinse-dry cup section 62a are arranged in the order of rinse-dry cup section 62a and immersion tank 61b from the left. Each mounting table 7 is arranged on the right side of the corresponding processing cup row L. In other words, each mounting table 7 is arranged at a position farther from the transport block TB (side wall 91) than the corresponding processing cup row L.

[0466] The inter-row transport device 400A transports the substrates W between the plurality of processing cup rows L. More specifically, the inter-row transport device 400A transports the substrates W between the plurality of mounting tables 7. Specifically, the inter-row transport device 400A has a substrate holder 402, a moving part 400, and a rail member 408.

[0467] The substrate holding unit 402 has a plurality of chuck members 31a, a base member 32a, and a chuck driving mechanism 403 (FIG. 47).

[0468] The multiple chuck members 31a are provided on a base member 32a. The base member 32a is substantially disk-shaped and supports the multiple chuck members 31a in a horizontal position. The multiple chuck members 31a are arranged on the periphery of the base member 32a and protrude downward from the base member 32a. The multiple chuck members 31a grip the substrate W below the base member 32a. The substrate W is held horizontally by the multiple chuck members 31a gripping the substrate W.

[0469] The chuck driving mechanism 403 (FIG. 47), like the upper chuck driving mechanism 50, is controlled by the control unit 102 to rotate the plurality of chuck members 31a between a non-holding position and a holding position. When each of the plurality of chuck members 31a rotates from the non-holding position to the holding position, the substrate W is gripped by the plurality of chuck members 31a. When each of the plurality of chuck members 31a rotates from the holding position to the non-holding position, the grip of the substrate W by the plurality of chuck members 31a is released.

[0470] The moving section 400 has a support arm 401. As shown in Figure 47, the moving section 400 further has an elevating mechanism 410 and a moving mechanism 420, similar to the moving section 200A.

[0471] The support arm 401 supports the substrate holding part 402. The rail member 408 guides the substrate holding part 402 in the second direction D2 (front-rear direction). Specifically, like the rail member 8, the rail member 408 guides the lifting mechanism 410 coupled to the support arm 401 in the second direction D2 (front-rear direction). The configuration of the rail member 408 is the same as that of the rail member 8, and therefore a detailed description thereof will be omitted.

[0472] The lifting mechanism 410 lifts and lowers the support arm 401, thereby lifting and lowering the substrate holding part 402. The moving mechanism 420 moves the lifting mechanism 410 in the second direction D2 (front-back direction) along the rail member 408. As a result, the substrate holding part 402 moves in the second direction D2 (front-back direction). The configurations of the lifting mechanism 410 and the moving mechanism 420 are similar to the configurations of the lifting mechanism 210A and the moving mechanism 220A, and therefore detailed description thereof will be omitted.

[0473] Next, an example of the operation of the first processing block PB1 when processing one substrate W will be described with reference to FIGS.

[0474] The controller 102 controls the transport robot TR to load the substrate W into the first processing block PB1 through the load / unload port corresponding to the first processing cup row L1. Then, the controller 102 performs a first chemical liquid processing and a rinse processing on the substrate W using the first immersion bath 61b1 and the rinse-drying cup unit 62a of the first processing cup row L1. After the rinse processing is completed, the controller 102 controls the mover 200A and upper substrate holder 2A corresponding to the first processing cup row L1 to place the rinsed substrate W on the mounting table 7 corresponding to the first processing cup row L1.

[0475] After the control unit 102 places the substrate W on the mounting table 7 corresponding to the first processing cup row L1, it controls the moving mechanism 420 to move the substrate holding unit 402 to a position facing the mounting table 7 corresponding to the first processing cup row L1. Then, the control unit 102 controls the lifting mechanism 410 and the chuck driving mechanism 403 to cause the substrate W placed on the mounting table 7 corresponding to the first processing cup row L1 to be held by the substrate holding unit 402, and then raises the substrate holding unit 402 holding the substrate W to a position facing the mounting table 7.

[0476] The control unit 102 controls the moving mechanism 420 to move the substrate holding unit 402 holding the substrate W to a position facing one of the mounting tables 7 corresponding to the second processing cup row L2 to the fourth processing cup row L4. For example, the control unit 102 moves the substrate holding unit 402 to a position facing the mounting table 7 corresponding to the fourth processing cup row L4. Then, the control unit 102 controls the lifting mechanism 410 and the chuck driving mechanism 403 to place the substrate W on the mounting table 7 corresponding to the fourth processing cup row L4.

[0477] The controller 102 places the substrate W on the mounting table 7 corresponding to the fourth processing cup row L4, and then controls the mover 200A and upper substrate holder 2A corresponding to the fourth processing cup row L4 to hold the substrate W on the upper substrate holder 2A corresponding to the fourth processing cup row L4. The controller 102 then performs the second chemical liquid processing, rinsing processing, and drying processing on the substrate W using the second immersion bath 61b2 and the rinse-dry cup section 62a of the fourth processing cup row L4. After drying the substrate W, the controller 102 unloads the substrate W from the first processing block PB1.

[0478] Modification 8 has been described above with reference to Figures 46 and 47. According to Modification 8, the second chemical liquid processing can be performed in parallel in multiple processing cup rows L (second processing cup row L2 to fourth processing cup row L4).

[0479] In Modification 8, the same type of chemical liquid is stored in the immersion tanks 61b of the second processing cup row L2 to the fourth processing cup row L4, but different chemical liquids may be stored in the immersion tanks 61b of the second processing cup row L2 to the fourth processing cup row L4. Alternatively, the same type of chemical liquid may be stored in two of the immersion tanks 61b of the second processing cup row L2 to the fourth processing cup row L4, and a different type of chemical liquid may be stored in the remaining immersion tank 61b.

[0480] In addition, in variant example 8, the immersion tanks 61b of the second processing cup row L2 to the fourth processing cup row L4 store a chemical liquid different from that stored in the immersion tank 61b of the first processing cup row L1, but one of the immersion tanks 61b of the second processing cup row L2 to the fourth processing cup row L4 may store the same type of chemical liquid as that stored in the immersion tank 61b of the first processing cup row L1.

[0481] In addition, in the eighth modification, the mounting table 7 is not provided on the side wall 91 side, but the mounting table 7 may be provided on the side wall 91 side.

[0482] [Variation 9] Next, a substrate processing apparatus 100 according to Modification 9 will be described with reference to Figure 48. However, only differences from the embodiment described with reference to Figures 1 to 47 will be described, and a description of the same aspects as the embodiment described with reference to Figures 1 to 47 will be omitted. Modification 9 differs from the embodiment described with reference to Figures 25 to 47 in that a lower brush 616 is provided in the immersion tank 61b.

[0483] Figure 48 is a cross-sectional view schematically showing a portion of the configuration of first processing block PB1 included in substrate processing apparatus 100 of Modification 9. In detail, Figure 48 shows first liquid supply unit 12, upper substrate holding unit 2A, movable unit 200A, first chemical liquid processing unit PU1, and first to fifth rail members 8a to 8e corresponding to first processing cup row L1 of first processing block PB1. Figure 48 also shows a cross section of movable unit 200A and first immersion tank 61b1 as viewed from the left side.

[0484] 48, the first immersion tank 61b1 may have a lower brush 616. The lower brush 616 comes into contact with the lower surface Wb of the substrate W to clean the lower surface Wb of the substrate W. The lower brush 616 is an example of a "lower brush member."

[0485] Specifically, the lower brush 616 is fixed to the upper surface of the bottom wall 611 of the first immersion tank 61b1. The lower brush 616 comes into contact with the lower surface Wb of the substrate W to clean the lower surface Wb of the substrate W while the substrate W is immersed in the processing liquid stored in the first immersion tank 61b1.

[0486] The lower brush 616 may include, for example, a porous material such as a sponge. Alternatively, the lower brush 616 may include, for example, a resin such as polyvinyl alcohol (PVA). Alternatively, the lower brush 616 may be configured by combining a plurality of members. Alternatively, the lower brush 616 may include a plurality of bristles.

[0487] The shape of the lower brush 616 is not particularly limited. For example, the lower brush 616 may be strip-shaped or linear in plan view. In this case, the lower brush 616 may extend from the center of the bottom wall portion 611 toward the outside in the radial direction of the bottom wall portion 611. Alternatively, the lower brush 616 may be approximately fan-shaped in plan view. In this case, the pivot point of the fan may be located at the center of the bottom wall portion 611. Alternatively, the lower brush 616 may be circular in plan view.

[0488] When the lower surface Wb of the substrate W is cleaned by the lower brush 616, the control unit 102 controls the lifting mechanism 210A to lower the upper substrate holding unit 2A to a position where the lower surface Wb of the substrate W comes into contact with the lower brush 616. Then, the control unit 102 controls the upper rotation unit 4 (upper motor main body 42) to rotate the upper spin base 32, thereby rotating the substrate W. As a result, the substrate W in contact with the lower brush 616 rotates, and the lower surface Wb of the substrate W is cleaned by the lower brush 616.

[0489] The processing liquid stored in the first immersion tank 61b1 when the substrate W is cleaned by the lower brush 616 may be the first chemical liquid or a rinse liquid.

[0490] Modification 9 has been described above with reference to Fig. 48. According to Modification 9, the lower surface Wb of the substrate W can be cleaned by the lower brush 616. Note that, with reference to Fig. 48, a configuration in which the lower surface Wb of the substrate W is cleaned by the lower brush 616 has been described using the first immersion tank 61b1 as an example, but the lower brush 616 may be provided in each immersion tank 61b, or the lower brush 616 may be provided in at least one of the multiple immersion tanks 61b included in each processing cup row L.

[0491] [Variation 10] Next, the substrate processing apparatus 100 of Modification 10 will be described with reference to Figures 49 to 51. However, only the differences from the embodiment described with reference to Figures 1 to 48 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 48 will be omitted. Modification 10 differs from the embodiment described with reference to Figures 25 to 48 in that an exhaust shutoff unit 71 is provided for each processing cup row L.

[0492] Fig. 49 is a schematic plan view showing an enlarged portion of the substrate processing apparatus 100 of Modification 10. Fig. 50 is a block diagram of the substrate processing apparatus 100 of Modification 10. In detail, Fig. 49 shows the configuration of a first processing block PB1 included in the substrate processing apparatus 100 of Modification 10. Although not shown, the configuration of a second processing block PB2 is similar to the configuration of the first processing block PB1.

[0493] 49, the first processing block PB1 has a processing chamber 9, a plurality of processing cup rows L (first processing cup row L1 to fourth processing cup row L4), a plurality of upper substrate holding units 2A, a plurality of exhaust cutoff units 71, a plurality of moving units 200A, a plurality of moving units 200B, a plurality of rail members 81, and a plurality of rail members 83. The upper substrate holding unit 2A, the exhaust cutoff unit 71, the moving units 200A, the moving units 200B, the rail members 81, and the rail members 83 are provided for each processing cup row L.

[0494] 49, each processing cup row L includes a rinse-dry cup section 62a, a first immersion tank 61b1, a second immersion tank 61b2, and a cleaning tank 63. The rinse-dry cup section 62a, the first immersion tank 61b1, the second immersion tank 61b2, and the cleaning tank 63 are arranged in this order from the left.

[0495] The moving section 200B has a support arm 201B. The support arm 201B supports the exhaust cutoff section 71. As shown in Fig. 50, the moving section 200B has a lifting mechanism 210B and a moving mechanism 220B, similar to the moving section 200A. The configurations of the lifting mechanism 210B and the moving mechanism 220B are the same as those of the lifting mechanism 210A and the moving mechanism 220A, and therefore detailed description thereof will be omitted.

[0496] The rail member 83 guides the lifting mechanism 210B coupled to the support arm 201B in the first direction D1 (left-right direction). The configuration of the rail member 83 is similar to the configuration of the rail member 8 described with reference to Figures 1, 2, 4, and 5, and therefore a detailed description thereof will be omitted.

[0497] When the upper substrate holding unit 2A is moved in the first direction D1, the vertical positions of the upper substrate holding unit 2A and the support arm 201A differ from the vertical positions of the exhaust cutoff unit 71 and the support arm 201B. Similarly, when the exhaust cutoff unit 71 is moved in the first direction D1, the vertical positions of the upper substrate holding unit 2A and the support arm 201A differ from the vertical positions of the exhaust cutoff unit 71 and the support arm 201B. Therefore, it is possible to prevent the upper substrate holding unit 2A and the exhaust cutoff unit 71 from interfering with each other. Similarly, it is possible to prevent the support arm 201A and the support arm 201B from interfering with each other.

[0498] FIG. 51 is a cross-sectional view schematically illustrating a portion of the configuration of a first processing block PB1 included in a substrate processing apparatus 100 of Modification 10. Specifically, FIG. 51 illustrates a first liquid supply unit 12 corresponding to the first processing cup row L1 of the first processing block PB1, an upper substrate holding unit 2A, an exhaust cutoff unit 71, a moving unit 200A, a portion of a moving unit 200B, a first chemical liquid processing unit PU1, and first to fifth rail members 8a to 8e. FIG. 51 also illustrates a cross section of moving unit 200A, a portion of moving unit 200B, an exhaust cutoff unit 71, and a first immersion tank 61b1 as viewed from the left side. The exhaust cutoff unit 71 will be described below using the first immersion tank 61b1 as an example.

[0499] 51, in Modification 10, the first chemical liquid processing unit PU1 further includes a heater 615 for heating the processing liquid. The heater 615 heats the first chemical liquid in the first immersion bath 61b1.

[0500] Specifically, the heater 615 may heat the first immersion tank 61b1, thereby heating the first chemical liquid stored in the first immersion tank 61b1. For example, the heater 615 may be disposed inside the bottom wall portion 611 of the first immersion tank 61b1. The heater 615 may be disposed so as to surround the lower nozzle portion 5B.

[0501] The control unit 102 controls the heater 615 to heat the first chemical liquid in the first immersion tank 61b1 to a predetermined temperature. Specifically, the control unit 102 controls the on / off of the heater 615 to maintain the first chemical liquid in the first immersion tank 61b1 at a predetermined temperature.

[0502] By providing the heater 615, it is possible to prevent the temperature of the first chemical liquid in the first immersion tank 61b1 from decreasing. Therefore, even when performing immersion treatment for a long period of time, it is possible to prevent the temperature of the first chemical liquid from decreasing. Furthermore, by heating the first chemical liquid in the first immersion tank 61b1 to a predetermined temperature, it is possible to treat the substrates W with the first chemical liquid at a constant temperature, for example.

[0503] The exhaust cutoff part 71 is cylindrical. The exhaust cutoff part 71 is an example of a "cylindrical member." The exhaust cutoff part 71 extends in the vertical direction. For example, the exhaust cutoff part 71 is cylindrical. When the substrate W is immersed in the first chemical liquid in the first immersion tank 61b1, the exhaust cutoff part 71 is located in the gap between the inner peripheral edge 612c of the first immersion tank 61b1 and the upper spin base 32. The inner peripheral edge 612c of the first immersion tank 61b1 forms an upper opening of the first immersion tank 61b1. The inner peripheral edge 612c of the first immersion tank 61b1 is formed by the upper end of the side wall part 612.

[0504] Before immersing the substrate W in the first chemical liquid in the first immersion tank 61b1, the control unit 102 controls the moving unit 200B to move the exhaust blocker 71 into the first immersion tank 61b1. Thereafter, the control unit 102 controls the moving unit 200A to move the upper substrate holder 2A to the first processing position P2 (see FIG. 26), thereby immersing the substrate W in the first chemical liquid in the first immersion tank 61b1. As a result, when the substrate W is immersed in the first chemical liquid in the first immersion tank 61b1, the exhaust blocker 71 is positioned in the gap between the inner periphery 612c of the first immersion tank 61b1 and the upper spin base 32.

[0505] Specifically, the diameter of the exhaust gas blocking portion 71 is larger than the diameter of the upper spin base 32 and smaller than the diameter of the upper end (inner peripheral edge portion 612c) of the side wall portion 612. In the tenth modification, the diameter of the exhaust gas blocking portion 71 is smaller than the diameter of the upper end of the inner wall portion 613.

[0506] The vertical dimension of the exhaust gas blocking portion 71 is larger than the vertical dimension of the gap SP formed between the upper end (inner peripheral edge portion 612c) of the side wall portion 612 and the upper end of the inner wall portion 613. The control portion 102 controls the moving portion 200B to move the exhaust gas blocking portion 71 to a position that covers the gap SP.

[0507] Modification 10 has been described above with reference to FIGS. 49 to 51 . According to Modification 10, gap SP is covered by exhaust gas blocking unit 71 during chemical treatment, thereby preventing a decrease in the temperature of the chemical solution stored inside inner wall portion 613. Specifically, when gap SP is open, gas in the space above the surface of the chemical solution stored inside inner wall portion 613 is drawn into gap SP by exhaust unit 17. As a result, the airflow drawn into gap SP may cause a decrease in the temperature of the chemical solution stored inside inner wall portion 613. In contrast, according to Modification 10, exhaust gas blocking unit 71 covers gap SP, making it difficult for airflow to be drawn into gap SP. Alternatively, the flow rate of the airflow drawn into gap SP can be reduced. Therefore, according to Modification 10, a decrease in the temperature of the chemical solution stored inside inner wall portion 613 can be prevented.

[0508] With reference to Figure 51, a configuration for heating the processing liquid in the immersion tank 61b has been described using the example of a configuration for heating the first chemical liquid in the first immersion tank 61b1, but a heater 615 may be provided for each immersion tank 61b, or a heater 615 may be provided for at least one of the multiple immersion tanks 61b included in each processing cup row L.

[0509] Furthermore, although no mounting table 7 is provided in Modification 10, a mounting table 7 may be provided for each processing cup row L, similar to the embodiment described with reference to FIGS.

[0510] In addition, in variant example 10, each processing cup row L includes two immersion tanks 61b, one rinse-drying cup section 62a, and one cleaning tank 63, but the configuration of the processing cup row L is not particularly limited as long as it includes at least one first processing cup section 61 and at least one second processing cup section 62.

[0511] [Variation 11] Next, the substrate processing apparatus 100 of Modification 11 will be described with reference to Figure 52. However, only differences from the embodiment described with reference to Figures 1 to 51 will be described, and a description of the same points as in the embodiment described with reference to Figures 1 to 51 will be omitted. Modification 11 differs from the embodiment described with reference to Figures 25 to 51 in that a support arm 201A supports an exhaust shutoff unit 71.

[0512] Fig. 52 is a cross-sectional view schematically showing a portion of the configuration of first processing block PB1 included in substrate processing apparatus 100 of Modification 11. Specifically, Fig. 52 shows first liquid supply unit 12, upper substrate holder 2A, movable unit 200A, chemical liquid processing unit PUC, exhaust cutoff unit 71, and first to fifth rail members 8a to 8e, which correspond to first processing cup row L1 of first processing block PB1. Fig. 52 also shows a cross-section of movable unit 200A, exhaust cutoff unit 71, and immersion tank 61b as viewed from the left side.

[0513] As shown in FIG. 52, in Modification 11, the exhaust cutoff part 71 is coupled to the support arm 201A. That is, the support arm 201A supports the exhaust cutoff part 71. The exhaust cutoff part 71 discharges downward from the support arm 201A. The exhaust cutoff part 71 is provided in a position surrounding the upper substrate holding part 2A. The exhaust cutoff part 71 covers the gap SP when the upper substrate holding part 2A is located at the first processing position P2 (see FIG. 26). Therefore, when the substrate W is immersed in the chemical solution in the immersion tank 61b, the gap SP is covered by the exhaust cutoff part 71.

[0514] Modification 11 has been described above with reference to Fig. 52. According to Modification 11, similarly to Modification 10, gap SP is covered by exhaust blocking portion 71 during chemical treatment, and therefore, a decrease in the temperature of the chemical stored inside inner wall portion 613 can be suppressed.

[0515] [Variation 12] Next, the substrate processing apparatus 100 of Modification 12 will be described with reference to Fig. 53. However, only the differences from the embodiment described with reference to Figs. 1 to 52 will be described, and a description of the same points as in the embodiment described with reference to Figs. 1 to 52 will be omitted. Modification 12 differs from the embodiment described with reference to Figs. 25 to 48 in the diameter of the upper spin base 32.

[0516] Fig. 53 is a cross-sectional view schematically showing a portion of the configuration of first processing block PB1 included in substrate processing apparatus 100 of Modification 12. Specifically, Fig. 53 shows first liquid supply unit 12, upper substrate holder 2A, movable unit 200A, chemical liquid processing unit PUC, and first to fifth rail members 8a to 8e corresponding to first processing cup row L1 of first processing block PB1. Fig. 53 also shows a cross section of movable unit 200A and immersion tank 61b as viewed from the left side.

[0517] As shown in FIG. 53, in Modification 12, the diameter of the upper spin base 32 is slightly smaller than the diameter of the upper end (inner peripheral edge 612c) of the side wall 612. The diameter of the upper spin base 32 is also slightly smaller than the diameter of the upper end of the inner wall 613. The vertical dimension of the side surface of the upper spin base 32 is larger than the vertical dimension of the gap SP. The side surface of the upper spin base 32 covers the gap SP when the upper substrate holder 2A is located at the first processing position P2 (see FIG. 26). Therefore, when the substrate W is immersed in the chemical solution in the immersion tank 61b, the gap SP is covered by the side surface of the upper spin base 32.

[0518] Modification 12 has been described above with reference to Fig. 53. According to Modification 12, the gap SP is covered by the side surface of the upper spin base 32 during chemical treatment, and therefore, a decrease in the temperature of the chemical stored inside the inner wall portion 613 can be suppressed.

[0519] [Variation 13] Next, a substrate processing apparatus 100 according to Modification 13 will be described with reference to Figure 54. However, only differences from the embodiment described with reference to Figures 1 to 53 will be described, and a description of the same aspects as the embodiment described with reference to Figures 1 to 53 will be omitted. Modification 13 differs from the embodiment described with reference to Figures 25 to 53 in that the concentration of the processing liquid stored in the immersion tank 61b is adjusted.

[0520] Fig. 54 is a cross-sectional view schematically showing a portion of the configuration of first processing block PB1 included in substrate processing apparatus 100 of Modification 13. Specifically, Fig. 54 shows first liquid supply section 12, upper substrate holding section 2A, movable section 200A, first chemical liquid processing unit PU1, and first to fifth rail members 8a to 8e corresponding to first processing cup row L1 of first processing block PB1. Fig. 54 also shows a cross section of movable section 200A and first immersion tank 61b1 as viewed from the left side.

[0521] As shown in FIG. 54, in variant 13, second liquid supply section 13b1 further includes concentrate piping section 138 and fourth on-off valve 139. Concentrate piping section 138 is a tubular member through which a fluid flows. A concentrate of the first chemical liquid is supplied to the upstream end of concentrate piping section 138. The downstream end of concentrate piping section 138 is connected to common piping section 133. Fourth on-off valve 139 is provided in concentrate piping section 138. The configuration of fourth on-off valve 139 is similar to that of first on-off valve 135, and therefore description thereof will be omitted.

[0522] When adjusting the concentration of the first chemical liquid in the first immersion tank 61b1, the control unit 102 switches the fourth on-off valve 139 from a closed state to an open state. As a result, an undiluted solution of the first chemical liquid is supplied from the lower nozzle unit 5B into the first immersion tank 61b1, and the concentration of the first chemical liquid in the first immersion tank 61b1 is adjusted. In the thirteenth modification, the second liquid supply unit 13b1 constitutes an "undiluted solution supply unit."

[0523] In addition, in Modification 13, the first chemical liquid processing unit PU1 further includes a concentration detection unit 19. The concentration detection unit 19 detects the concentration of the first chemical liquid in the first immersion tank 61b1. The control unit 102 controls the second liquid supply unit 13b1 based on the concentration of the first chemical liquid detected by the concentration detection unit 19, thereby adjusting the concentration of the first chemical liquid in the first immersion tank 61b1.

[0524] Specifically, the concentration detection unit 19 has a common pipe 191, a drainage pipe 192, a recovery pipe 193, a first on-off valve 195, a second on-off valve 196, and a concentration sensor 197. Note that the configurations of the common pipe 191, the drainage pipe 192, the recovery pipe 193, the first on-off valve 195, and the second on-off valve 196 are similar to the configurations of the common pipe 141, the drainage pipe 142, the recovery pipe 143, the first on-off valve 145, and the second on-off valve 146 included in the first drainage unit 14b1, and therefore a description thereof will be omitted.

[0525] The concentration sensor 197 detects the concentration of the first chemical liquid in the first immersion tank 61b1. More specifically, the concentration sensor 197 is provided in the common piping section 191 and detects the concentration of the first chemical liquid flowing through the common piping section 191. The concentration sensor 197 transmits a signal indicating the detected concentration of the first chemical liquid to the control section 102. As a result, the control section 102 acquires the concentration of the first chemical liquid.

[0526] The control unit 102 executes a concentration detection process. The concentration detection process refers to a process of causing the concentration detection unit 19 to detect the concentration of the first chemical liquid. Specifically, the control unit 102 switches the first opening / closing valve 195 or the second opening / closing valve 196 from a closed state to an open state. As a result, the concentration of the first chemical liquid is detected by the concentration sensor 197. For example, the control unit 102 may execute the concentration detection process periodically. Alternatively, the control unit 102 may execute the concentration detection process based on an instruction from an operator. Note that the length of time during which the first opening / closing valve 195 or the second opening / closing valve 196 is kept open is set to a length of time that allows the concentration sensor 197 to detect the concentration. For example, the length of time during which the first opening / closing valve 195 or the second opening / closing valve 196 is kept open may be set in advance.

[0527] When the control unit 102 acquires the concentration of the first chemical liquid in the first immersion tank 61b1, the control unit 102 determines whether or not to execute a concentration adjustment process based on the acquired concentration of the first chemical liquid. When the control unit 102 determines to execute the concentration adjustment process, the control unit 102 controls the second liquid supply unit 13b1.

[0528] For example, when the concentration of the first chemical liquid is lower than a predetermined range, the control unit 102 determines to execute a concentration adjustment process and switches the fourth on-off valve 139 of the second liquid supply unit 13b1 from a closed state to an open state. As a result, the undiluted first chemical liquid is supplied to the first immersion tank 61b1, and the concentration of the first chemical liquid in the first immersion tank 61b1 increases. The control unit 102 may determine the length of time for which the fourth on-off valve 139 of the second liquid supply unit 13b1 is kept open, based on the concentration of the first chemical liquid obtained from the concentration sensor 197 (concentration detection unit 19).

[0529] Furthermore, if the concentration of the first chemical liquid is higher than the predetermined range, the control unit 102 determines to execute a concentration adjustment process, switches the second opening / closing valve 136 of the second liquid supply unit 13b1 from a closed state to an open state, and discharges DIW from the lower nozzle unit 5B. As a result, the concentration of the first chemical liquid in the first immersion tank 61b1 decreases. The control unit 102 may determine the length of time for which the second opening / closing valve 136 of the second liquid supply unit 13b1 is kept open, based on the concentration of the first chemical liquid obtained from the concentration sensor 197 (concentration detection unit 19).

[0530] In addition, when the control unit 102 performs the concentration adjustment process during a period when the upper substrate holding unit 2A is not holding a substrate W, it may control the moving unit 200A to immerse the multiple upper chuck members 31 in the first chemical liquid, and control the upper rotating unit 4 to rotate the multiple upper chuck members 31 in the first chemical liquid, thereby agitating the first chemical liquid in the first immersion tank 61b1.

[0531] Modification 13 has been described above with reference to Fig. 54. According to Modification 13, the concentration of the chemical liquid in the immersion tank 61b can be maintained within a predetermined range, thereby enabling the substrates W to be processed with high precision.

[0532] Although a configuration for adjusting the concentration of the first chemical liquid in the first immersion tank 61b1 has been described with reference to Figure 54, a configuration for adjusting the concentration of the chemical liquid may be provided for each immersion tank 61b, or a configuration for adjusting the concentration of the chemical liquid may be provided for at least one immersion tank 61b out of the multiple immersion tanks 61b included in each processing cup row L.

[0533] [Variation 14] Next, the substrate processing apparatus 100 of Modified Example 14 will be described with reference to Fig. 55. However, only the points different from the embodiment described with reference to Figs. 1 to 54 will be described, and a description of the points that are the same as those in the embodiment described with reference to Figs. 1 to 54 will be omitted.

[0534] In the embodiment described with reference to Figures 25 to 54, one substrate W is immersed in the chemical solution in the immersion tank 61b, but multiple substrates W may also be immersed in the chemical solution in the immersion tank 61b.

[0535] Fig. 55 is a cross-sectional view schematically showing the configuration of an immersion tank 61b included in a substrate processing apparatus 100 of Modification 14. Fig. 55 shows the cross section of the immersion tank 61b as seen from the rear side.

[0536] As shown in FIG. 55, the immersion tank 61b may have a bottom wall portion 611, a side wall portion 612, a first support portion group 614A, and a second support portion group 614B.

[0537] The first support group 614A includes a plurality of first support portions 614a. The plurality of first support portions 614a protrude from the bottom wall portion 611. The first support portions 614a may be, for example, cylindrical. The plurality of first support portions 614a horizontally support the substrate W. Specifically, the plurality of first support portions 614a are arranged on the same circumference and support the peripheral edge portion of the substrate W.

[0538] The upper end of each first support portion 614a is positioned lower than the upper end of the side wall portion 612. In other words, the height of each first support portion 614a from the bottom wall portion 611 is lower than the height of the side wall portion 612 from the bottom wall portion 611. The substrate W supported by the multiple first support portions 614a is immersed in the chemical solution stored in the immersion tank 61b.

[0539] The second support group 614B includes a plurality of second support members 614b. The plurality of second support members 614b horizontally support the substrate W. The configuration of the second support group 614B is similar to that of the first support group 614A, and therefore a detailed description thereof will be omitted.

[0540] The second support portion group 614B is arranged in a different area from the first support portion group 614A. More specifically, the first support portion group 614A and the second support portion group 614B are aligned in the left-right direction. The first support portion group 614A and the second support portion group 614B are also arranged in positions where the substrate W supported by the first support portion group 614A and the substrate W supported by the second support portion group 614B do not overlap. Therefore, the substrate W supported by the first support portion group 614A and the substrate W supported by the second support portion group 614B are aligned in the left-right direction.

[0541] 55, two support group groups are provided in the immersion tank 61b, but three or more support group groups may be provided in the immersion tank 61b. In other words, three or more substrates W may be simultaneously immersed in the chemical solution in one immersion tank 61b.

[0542] Modification 14 has been described above with reference to Figure 55. According to Modification 14, multiple substrates W can be simultaneously immersed in the chemical solution in one immersion tank 61b. All of the immersion tanks 61b included in each processing cup row L may be structured to simultaneously immerse multiple substrates W, or only some of the multiple immersion tanks 61b included in each processing cup row L may be structured to simultaneously immerse multiple substrates W.

[0543] [Embodiment 4] Next, a fourth embodiment of the present invention will be described with reference to Figures 56 to 62. However, differences from the embodiment described with reference to Figures 1 to 55 will be described, and a description of the same matters as in the embodiment described with reference to Figures 1 to 55 will be omitted. The fourth embodiment differs from the embodiment described with reference to Figures 25 to 55 in the configuration of the rinse dry processing unit PUD.

[0544] Figure 56 is a cross-sectional view schematically showing a portion of the configuration of first processing block PB1 included in substrate processing apparatus 100 of embodiment 4. Figures 56 to 59 also show first liquid supply unit 12, first gas supply unit 16, upper substrate holder 2A, part of movable unit 200A, rinse-dry processing unit PUD, and first to fifth rail members 8a to 8e, which correspond to first processing cup row L1 of first processing block PB1. Figures 56 to 59 also show cross sections of movable unit 200A and cup unit 621 as viewed from the left side.

[0545] 56, in the fourth embodiment, the first processing block PB1 further includes a first gas supply unit 16. The first gas supply unit 16 is provided for each processing cup row L. The first gas supply unit 16 supplies gas to the corresponding upper nozzle unit 5A. The first gas supply unit 16 is controlled by the control unit 102.

[0546] The gas is, for example, an inert gas. The inert gas is, for example, nitrogen gas or argon gas. When the gas is supplied from the first gas supply unit 16 to the upper nozzle unit 5A, the gas is ejected from the upper nozzle unit 5A. Specifically, when drying the substrate W, the control unit 102 causes the gas to be ejected from the upper nozzle unit 5A toward the upper surface Wa of the substrate W.

[0547] The first gas supply unit 16 has a gas supply pipe 161 and an on-off valve 162. The gas supply pipe 161 is a tubular member through which a fluid flows. The on-off valve 162 is provided in the gas supply pipe 161. The on-off valve 162 can be opened and closed freely. The opening and closing operation of the on-off valve 162 is controlled by the control unit 102.

[0548] Gas is supplied to the upstream end of the gas supply pipe 161. The downstream end of the gas supply pipe 161 is connected to the upper nozzle section 5A. The on-off valve 162 opens and closes the flow path in the gas supply pipe 161. When the on-off valve 162 is opened, gas is supplied to the upper nozzle section 5A. As a result, gas is ejected from the upper nozzle section 5A. When the on-off valve 162 is closed, the flow of gas through the gas supply pipe 161 stops. As a result, the ejection of gas from the upper nozzle section 5A stops.

[0549] In the fourth embodiment, the rinse-dry processing unit PUD includes a rinse-dry cup part 62c, a third liquid supply part 500, a second gas supply part 510, and a third drain part 520. The rinse-dry cup part 62c includes a lower substrate holding part 2B and a cup part 621.

[0550] The lower substrate holding part 2B horizontally holds the substrate W. Furthermore, the lower substrate holding part 2B rotates while holding the substrate W. The lower substrate holding part 2B is controlled by the control part 102.

[0551] In the fourth embodiment, the lower substrate holding part 2B has a clamping-type chuck mechanism. The lower substrate holding part 2B holds the substrate W by clamping an edge of the substrate W. Specifically, the lower substrate holding part 2B has a lower holding part 3B, a lower rotating part 4B, and a lower nozzle part 5B.

[0552] The lower holding unit 3B horizontally holds the substrate W. Specifically, the lower holding unit 3B has a plurality of lower chuck members 21 and a lower spin base 22. The lower spin base 22 is an example of a "lower base member."

[0553] The multiple lower chuck members 21 are provided on the lower spin base 22. Specifically, the lower spin base 22 is substantially disk-shaped and supports the multiple lower chuck members 21 in a horizontal position. The multiple lower chuck members 21 are arranged on the periphery of the lower spin base 22 and protrude upward from the lower spin base 22. The multiple lower chuck members 21 grip the substrate W above the lower spin base 22. Therefore, the substrate W is held horizontally above the lower spin base 22.

[0554] More specifically, the plurality of lower chuck members 21 grip the peripheral edge of the substrate W. The plurality of lower chuck members 21 grip the substrate W, thereby holding the substrate W horizontally. The operation of the plurality of lower chuck members 21 is controlled by the control unit 102. The lower chuck members 21 are an example of a "lower gripping member."

[0555] The lower rotation part 4B rotates the substrate W integrally with the lower holding part 3B. The operation of the lower rotation part 4B is controlled by the control part 102. The lower rotation part 4B has, for example, a lower shaft 23 and a lower motor main body 24.

[0556] The lower shaft 23 is a hollow shaft. The lower shaft 23 extends in the vertical direction along the third rotation axis AX3. The upper end of the lower shaft 23 is coupled to the lower spin base 22.

[0557] The lower motor body 24 rotates the lower shaft 23. As a result, the lower spin base 22 rotates. The operation of the lower motor body 24 is controlled by the control unit 102. The lower motor body 24 is, for example, an electric motor.

[0558] The lower nozzle portion 5B is housed in the inner space of the lower shaft 23. The tip of the lower nozzle portion 5B protrudes from the upper surface of the lower spin base 22.

[0559] The cup portion 621 is annular in plan view. The outer shape of the cup portion 621 may be circular in plan view. The cup portion 621 is disposed around the lower substrate holding portion 2B and surrounds the lower substrate holding portion 2B. The cup portion 621 receives the processing liquid discharged from the substrate W.

[0560] Specifically, cup portion 621 includes guard portion 621a that can be raised and lowered, and a cup lifting mechanism (not shown).

[0561] The guard part 621a has an annular shape in a plan view. The outer shape of the guard part 621a may be circular in a plan view. The cup lifting mechanism is controlled by the control unit 102 to raise and lower the guard part 621a between a liquid receiving position and a retracted position. The liquid receiving position is a position above the retracted position. When the guard part 621a is positioned at the liquid receiving position, the guard part 621a surrounds the substrate W and receives the processing liquid discharged from the substrate W. When the guard part 621a is positioned at the retracted position, the guard part 621a is positioned below the upper surface of the lower spin base 22.

[0562] The third liquid supply unit 500 supplies the processing liquid to the lower nozzle unit 5B. The third liquid supply unit 500 is controlled by the control unit 102. In the fourth embodiment, the third liquid supply unit 500 selectively supplies one of a fourth chemical liquid and a rinse liquid (DIW in this embodiment) to the lower nozzle unit 5B. Specifically, the third liquid supply unit 500 has a chemical liquid piping unit 501, a rinse liquid piping unit 502, a common piping unit 503, a first opening / closing valve 504, and a second opening / closing valve 505. The configuration of the third liquid supply unit 500 is similar to that of the second liquid supply unit 13 shown in FIG. 4, and therefore a detailed description thereof will be omitted.

[0563] The second gas supply unit 510 supplies gas to the lower nozzle unit 5B. The second gas supply unit 510 is controlled by the control unit 102. The gas is, for example, an inert gas. The inert gas is, for example, nitrogen gas or argon gas.

[0564] When gas is supplied from the second gas supply unit 510 to the lower nozzle unit 5B, the gas is ejected from the lower nozzle unit 5B. Specifically, when drying the substrate W, the control unit 102 causes the lower nozzle unit 5B to eject gas toward the lower surface Wb of the substrate W. Similar to the first gas supply unit 16, the second gas supply unit 510 has a gas supply piping unit 511 and an opening / closing valve 512. The configuration of the second gas supply unit 510 is similar to the configuration of the first gas supply unit 16, and therefore description thereof will be omitted.

[0565] The third drainage section 520 discharges the processing liquid collected by the cup section 621 to the outside of the cup section 621 (rinse-dry cup section 62c). More specifically, the third drainage section 520 discharges the processing liquid collected by the cup section 621 to the outside of the first processing block PB1. Similar to the drainage section 14c shown in FIG. 29, the third drainage section 520 has a drainage piping section 521 and an open / close valve 522. The upstream end of the drainage piping section 521 is connected to the bottom wall (not shown) of the cup section 621 and communicates with the inner space of the cup section 621. The configuration of the third drainage section 520 is similar to the configuration of the drainage section 14c shown in FIG. 29, and therefore a detailed description thereof will be omitted.

[0566] In the fourth embodiment, the upper substrate holding part 2A transfers the substrate W to and from the lower substrate holding part 2B. More specifically, the control part 102 controls the moving part 200A to move the upper substrate holding part 2A to a transfer position P7. The transfer position P7 indicates a position where the substrate W held by the upper substrate holding part 2A can be ...

Claims

1. a processing block for processing a substrate; a transport block disposed adjacent to the processing block; Equipped with the transport block has a transport device that transports the substrate between the transport block and the processing block; The processing block comprises: an upper substrate holding portion that holds the substrate horizontally; a moving mechanism that moves the upper substrate holding part in a first direction that is a direction parallel to a direction in which the substrate moves between the transport block and the processing block; a processing cup row including a plurality of processing cup portions aligned in the first direction; a lifting mechanism that lifts and lowers at least one of the upper substrate holding portion and the corresponding processing cup portion so that the position of the substrate held by the upper substrate holding portion changes from one upper position of the upper positions of the processing cup portions to an inner position of the corresponding processing cup portion; and the plurality of processing cups includes a first processing cup; The first processing cup holds a processing liquid that is in contact with the substrate located inside the first processing cup, and processes the substrate.

2. the plurality of processing cups includes a plurality of first processing cups, each of the first processing cups having a support portion for supporting the substrate; The substrate processing apparatus of claim 1 , wherein the upper substrate holding part transfers the different substrates between the upper substrate holding part and the respective support parts of the first processing cup part.

3. the treatment liquid includes a chemical solution, the substrate is processed with the chemical solution in the first processing cup; the substrate processing apparatus further includes a drainage unit that drains the chemical solution from the first processing cup unit, the upper substrate holding part has an upper nozzle part that ejects a rinse liquid toward the substrate, The substrate processing apparatus according to claim 2 , wherein the upper nozzle ejects the rinse liquid toward the substrate positioned inside the first processing cup from which the chemical liquid has been discharged by the drainage part.

4. The upper substrate holding portion is an upper holding portion that holds the substrate horizontally; an upper rotating part that rotates the substrate integrally with the upper holding part; and The substrate processing apparatus according to claim 3 , wherein the upper rotation unit rotates the substrate positioned inside the first processing cup unit to dry the substrate after the discharge of the rinse liquid has stopped.

5. The substrate processing apparatus according to claim 4 , wherein the upper nozzle portion ejects gas toward the substrate when drying the substrate.

6. The processing cup further includes a second processing cup; the second processing cup receives the rinse liquid discharged from the substrate; the lifting mechanism changes the position of the processed substrate, which is the substrate processed in the first processing cup, from a position inside the first processing cup to a position above the first processing cup; the moving mechanism moves the upper substrate holding part that holds the processed substrate to an opposing position facing the second processing cup part; The substrate processing apparatus of claim 1 , wherein the lifting mechanism changes the position of the processed substrate from a position above the second processing cup to a position inside the second processing cup.

7. the upper substrate holding part has an upper nozzle part that discharges the rinse liquid, The substrate processing apparatus of claim 6 , wherein the upper nozzle ejects the rinse liquid toward the processed substrate located inside the second processing cup.

8. The upper substrate holding portion is an upper holding portion that holds the substrate horizontally; an upper rotating part that rotates the substrate integrally with the upper holding part; and The substrate processing apparatus according to claim 7 , wherein the upper rotation unit rotates the processed substrate positioned inside the second processing cup unit to dry the processed substrate after the discharge of the rinse liquid has stopped.

9. The substrate processing apparatus according to claim 8 , wherein the upper nozzle unit ejects gas toward the processed substrate when drying the processed substrate.

10. the plurality of processing cup portions include a plurality of the first processing cup portions and one of the second processing cup portions; the treatment liquid includes a chemical solution, the substrate is processed in each of the first processing cup parts with different types of chemical solutions; The substrate processing apparatus according to claim 6 , wherein the movement mechanism moves the upper substrate holding part in accordance with a processing procedure that indicates a procedure for processing the substrate.

11. The substrate processing apparatus of claim 10 , wherein each of the first processing cup portions includes a support portion for supporting the substrate.

12. the plurality of processing cup portions include a plurality of first processing cup portions and a plurality of second processing cup portions; the treatment liquid includes a chemical solution, the substrate is processed in each of the first processing cup parts with different types of chemical solutions; The substrate processing apparatus of claim 6 , wherein the plurality of first processing cup parts and the plurality of second processing cup parts are arranged in accordance with a processing sequence that indicates a procedure for processing the substrate.

13. each of the first processing cups having a support portion for supporting the substrate; The substrate processing apparatus of claim 12 , wherein the second processing cup sandwiched between the first processing cups includes a support portion that supports the substrate.

14. The process sequence includes a final rinse step and a drying step for drying the substrate; the rinsing process refers to a process of washing the chemical solution off the substrate that has been processed in the first processing cup part, the plurality of first processing cup portions include a third processing cup portion in which a process immediately before the final rinsing process is performed; the plurality of second processing cups include a fourth processing cup in which the final rinsing process and the drying process are performed; the upper substrate holding portion includes a first upper substrate holding portion and a second upper substrate holding portion; The moving mechanism includes: a first moving mechanism that moves the first upper substrate holding part so that the substrate moves between the plurality of processing cup parts other than the fourth processing cup part; a second moving mechanism that moves the second upper substrate holding part so that the substrate moves between the third processing cup part and the fourth processing cup part; The substrate processing apparatus of claim 12 , comprising:

15. The upper substrate holding portion is an upper holding part that holds the substrate; an upper rotating part that rotates the substrate integrally with the upper holding part; and the substrate processing apparatus further includes a control unit that controls the rotation of the substrate by the upper rotation unit, the moving mechanism moves the upper substrate holding part that holds the processed substrate in the first direction; 10. A substrate processing apparatus as described in any one of claims 6 to 9, wherein the control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the processing liquid is supported on the upper surface of the processed substrate when the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup portion to a position above the first processing cup portion and the moving mechanism moves the upper substrate holding portion holding the processed substrate in the first direction.

16. The upper substrate holding portion is an upper holding part that holds the substrate; an upper rotating part that rotates the substrate integrally with the upper holding part; An upper nozzle that discharges a rinse liquid; and the substrate processing apparatus further includes a control unit that controls the rotation of the substrate by the upper rotation unit, the upper nozzle portion ejects the rinse liquid toward the processed substrate positioned inside the first processing cup portion to form a liquid film of the rinse liquid on an upper surface of the processed substrate; the moving mechanism moves the upper substrate holding part that holds the processed substrate in the first direction; 10. The substrate processing apparatus according to claim 6, wherein the control unit controls the rotation speed of the processed substrate or stops the rotation of the processed substrate to maintain a puddle state in which a liquid film of the rinse liquid is supported on an upper surface of the processed substrate when the lifting mechanism changes the position of the processed substrate from a position inside the first processing cup portion to a position above the first processing cup portion and the moving mechanism moves the upper substrate holding portion that holds the processed substrate in the first direction.

17. The second processing cup portion is a lower holding portion that holds the substrate horizontally; a lower rotation unit that rotates the substrate integrally with the lower holding unit; a guard portion that surrounds the substrate held by the lower holding portion and receives chemical liquid discharged from the substrate; and the upper substrate holding part transfers the substrate after being processed in the first processing cup part to the lower holding part; The substrate processing apparatus includes: a moving nozzle that ejects the chemical solution toward the substrate held by the lower holding unit; a nozzle moving unit that moves the moving nozzle in a horizontal direction; Further provided with The substrate processing apparatus according to claim 6 , wherein the moving nozzle discharges the chemical solution while moving in the horizontal direction.

18. the first processing cup has a support portion that horizontally supports the plurality of substrates, 10. The substrate processing apparatus according to claim 6, wherein the first processing cup holds a processing liquid in contact with the plurality of substrates positioned inside the first processing cup to process the plurality of substrates.

19. The processing block comprises: A plurality of the upper substrate holding portions; A plurality of the movement mechanisms; A plurality of the lifting mechanisms; and the plurality of moving mechanisms correspond to the plurality of upper substrate holding units; The substrate processing apparatus according to claim 1 , wherein the plurality of lifting mechanisms correspond to at least one of the plurality of upper substrate holding units and the plurality of processing cup units.

20. The processing block comprises: a row of the processing cups arranged in a direction perpendicular to the first direction; the upper substrate holding portion provided for each of the processing cup rows; the moving mechanism provided for each of the processing cup rows; the lifting mechanism provided for each processing cup row; The substrate processing apparatus according to claim 1 , further comprising:

21. The substrate processing apparatus according to claim 20 , wherein the processing block further comprises an inter-row transfer device that transfers the substrate between the plurality of processing cup rows.

22. the first processing cup has an upper opening through which the substrate passes; The substrate processing apparatus according to claim 1 , further comprising a lid member that covers the upper opening.

23. The upper substrate holding portion is an upper base member; an upper gripping member provided on the upper base member and configured to horizontally grip the substrate; and the first processing cup has an inner periphery that defines an upper opening through which the substrate passes; When the substrate is positioned inside the first processing cup, a side surface of the upper base member is positioned opposite the inner peripheral edge portion, The substrate processing apparatus according to any one of claims 1 to 9, further comprising a cylindrical member positioned in the gap between the inner peripheral edge and the upper base member when the substrate is positioned inside the first processing cup portion.

24. The upper substrate holding portion is an upper base member; an upper gripping member provided on the upper base member and configured to horizontally grip the substrate; and The first processing cup portion is an inner peripheral edge portion that forms an upper opening through which the substrate passes; an annular inner wall portion located below the inner peripheral edge portion; and 10. The substrate processing apparatus according to claim 1, wherein the side surface of the upper base member covers the gap between the inner peripheral edge and the inner wall when the substrate is positioned inside the first processing cup portion.

25. the first processing cup includes an immersion tank that stores the processing liquid, The substrate processing apparatus according to claim 1 , wherein the substrate is immersed in the processing liquid in the immersion tank.

26. The upper substrate holding portion is an upper holding portion that holds the substrate horizontally; an upper rotating part that rotates the substrate integrally with the upper holding part; and the immersion tank has a lower brush member that contacts the lower surface of the substrate; 26. The substrate processing apparatus according to claim 25, wherein the upper rotating part rotates the substrate immersed in the processing liquid and in contact with the lower brush member.

27. a brush processing unit that brushes the upper surface of the substrate immersed in the processing liquid; the first processing cup has a lower substrate holding portion that holds the substrate horizontally inside the immersion tank; the upper substrate holding part transfers the substrate to the lower substrate holding part, The brush processing unit includes: an upper brush member that contacts an upper surface of the substrate held by the lower substrate holding portion; a brush rotation unit that rotates the upper brush member; and 26. The substrate processing apparatus according to claim 25, wherein the brush rotation unit rotates the upper brush member when the upper brush member is in contact with the upper surface of the substrate immersed in the processing liquid.

28. the first processing cup has a lower substrate holding portion that holds the substrate horizontally inside the immersion tank; The upper substrate holding portion is an upper base member; an upper gripping member provided on the upper base member and configured to grip the substrate; an upper brush member provided on the upper base member and in contact with an upper surface of the substrate held by the lower substrate holding portion; an upper rotating portion that rotates the upper brush member and the upper gripping member integrally with the upper base member; and the upper substrate holding portion transfers the substrate from the upper gripping member to the lower substrate holding portion; 26. The substrate processing apparatus of claim 25, wherein the upper rotating part rotates the upper brush member when the upper brush member is in contact with the upper surface of the substrate immersed in the processing liquid.

29. the treatment liquid includes a chemical solution, The immersion tank stores the chemical solution, The substrate processing apparatus according to claim 25 , further comprising an undiluted liquid supply unit that supplies an undiluted chemical solution to the immersion tank.

30. The first processing cup portion is a support portion that supports the substrate; a ring-shaped member for holding a liquid film of the processing liquid in contact with the upper surface of the substrate supported by the support; The substrate processing apparatus according to claim 1 , further comprising:

31. The first processing cup portion is a support portion that supports the substrate; a lower base member facing a lower surface of the substrate supported by the support portion; a lower nozzle portion provided on the lower base member; and the lower nozzle portion ejects the treatment liquid, 10. The substrate processing apparatus according to claim 1, wherein the processing liquid discharged from the lower nozzle portion is held in a gap between the lower surface of the substrate and the lower base member, and contacts the lower surface of the substrate.

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