Method of manufacturing substrate device and substrate device

Abstract

To improve heat dissipation of a conductive layer having the same area when heat generated by an electronic component is dissipated by the conductive layer.SOLUTION: A method for manufacturing a circuit board device according to the present disclosure includes, for a circuit board including a conductive layer in which a plurality of through-holes are formed at preset intervals and an electrode layer to which a terminal of an electronic component is soldered: The method comprises a step of applying solder onto the electrode layer and the region of the conductive layer by using a printing plate having an opening formed corresponding to the position of the electrode layer and a plurality of opening holes formed corresponding to the region of the conductive layer at intervals narrower than the intervals of the through holes, and a step of soldering the electronic component to the substrate by heating the substrate after the electronic component is arranged on the solder applied onto the electrode layer.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a substrate device and a substrate device. [Background technology]

[0002] Patent Document 1 discloses a printed wiring board that includes an insulating layer and a solid pattern formed of a conductor on the insulating layer, and that has at least one of a plurality of recesses and a plurality of protrusions that do not penetrate the solid pattern in the thickness direction on the side of the solid pattern opposite to the side that contacts the insulating layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-108321 Summary of the Invention [Problem to be solved by the invention]

[0004] In a substrate device in which heat-generating electronic components are mounted on a substrate, the heat generated by the electronic components must be dissipated. To ensure the required amount of heat dissipation, a heat sink, a heat-dissipating component, is typically attached to the electronic components. However, using a heat sink to dissipate heat from electronic components increases the cost of the heat sink and the labor required to attach the heat sink to the electronic components. Furthermore, to attach (mount) the heat sink to the electronic components, a space must be provided around the electronic components for the heat sink to be placed. To avoid this problem, a large-area solid pattern made of metal foil, such as copper foil, is sometimes formed in the available space on the substrate, and this solid pattern is used to dissipate the heat generated by the electronic components.

[0005] However, since the metal foil solid pattern is formed simultaneously with the planar metal foil wiring pattern for electrically connecting electronic components during the manufacturing of the circuit board, it is a planar pattern. The larger the area of ​​the solid pattern, the better the heat dissipation, but there is a limit to the area that can be provided with the solid pattern.

[0006] The object of the technology disclosed herein is to provide a method for manufacturing a substrate device and a substrate device that can improve the heat dissipation properties of a conductive layer of the same area when heat generated by an electronic component is dissipated by the conductive layer. [Means for solving the problem]

[0007] A method for manufacturing a substrate device according to a first aspect of the present disclosure includes the steps of: applying solder to a substrate having a conductive layer in which a plurality of through holes are formed at predetermined intervals and an electrode layer to which terminals of electronic components are soldered, using a printing plate having openings formed corresponding to the positions of the electrode layer and a plurality of opening holes formed corresponding to areas of the conductive layer at intervals narrower than the intervals between the through holes; and a step of placing the electronic component on the solder applied to the electrode layer, and then heating the substrate to solder the electronic component to the substrate.

[0008] A method for manufacturing a substrate device according to a second aspect of the present disclosure is the method for manufacturing a substrate device according to the first aspect, wherein an inner diameter of the opening hole is larger than an inner diameter of the through hole.

[0009] A manufacturing method for a substrate device according to a third aspect of the present disclosure is the manufacturing method for a substrate device according to the first aspect, wherein the conductive layer is electrically connected to a part of the electrode layer.

[0010] A fourth aspect of the present disclosure relates to a method for manufacturing a substrate device according to the third aspect, wherein the conductive layer is electrically connected to an electrode layer connected to a heat dissipation terminal of the electronic component.

[0011] A fifth aspect of the present disclosure relates to a method for manufacturing a substrate device according to the first aspect, wherein the substrate is a multi-layer substrate, and the conductive layer is electrically connected to a ground layer or a power supply layer.

[0012] A sixth aspect of the method for manufacturing a substrate device of the present disclosure is a method for manufacturing a substrate device of the first aspect, wherein the printing plate is configured such that the outermost opening hole in the conductive layer area among the plurality of opening holes is located more inward than the through hole formed in the outermost periphery of the conductive layer.

[0013] A manufacturing method of a substrate device according to a seventh aspect of the present disclosure is the manufacturing method of the substrate device according to the first aspect, wherein the electrode layer and the conductive layer are formed on different surfaces of the substrate, respectively; The printing plate comprises a first printing plate having an opening formed corresponding to the position of the electrode layer, and a second printing plate having a plurality of opening holes formed corresponding to the area of ​​the conductive layer.

[0014] The substrate device of the eighth aspect of the present disclosure is manufactured by applying solder to a substrate having a conductive layer in which a plurality of through holes are formed at predetermined intervals and an electrode layer to which terminals of electronic components are soldered, using a printing plate having openings formed corresponding to the position of the electrode layer and a plurality of opening holes formed at intervals narrower than the spacing of the through holes corresponding to areas of the conductive layer, placing the electronic components on the solder applied to the electrode layer, and then heating the substrate to solder the electronic components to the substrate. [Effects of the Invention]

[0015] According to the method for manufacturing a substrate device of the first aspect of the present disclosure, when heat generated by electronic components is dissipated by a conductive layer, it is possible to improve the heat dissipation performance of a conductive layer with the same area.

[0016] According to the method for manufacturing a substrate device of the second aspect of the present disclosure, the unevenness of the solder formed on the conductive layer can be made larger compared to when the inner diameter of the opening hole is the same as the inner diameter of the through hole.

[0017] According to the method for manufacturing a substrate device of the third aspect of the present disclosure, the heat dissipation properties of the conductive layer can be improved compared to when the conductive layer is not electrically connected to a portion of the electrode layer.

[0018] According to the method for manufacturing a substrate device according to the fourth aspect of the present disclosure, the heat generated by the electronic components can be dissipated more efficiently.

[0019] According to the manufacturing method of the substrate device of the fifth aspect of the present disclosure, heat generated by electronic components can be dissipated more efficiently compared to when the conductive layer is not electrically connected to either the ground layer or the power layer.

[0020] According to the manufacturing method of the substrate device of the sixth aspect of the present disclosure, it is possible to prevent short circuits caused by solder protruding from the conductive layer at the peripheral portion of the conductive layer between components outside the conductive layer and the conductive layer.

[0021] According to the manufacturing method of the substrate device of the seventh aspect of the present disclosure, even if the surface on which the electronic components are placed and the surface on which the conductive layer is formed are different, it is possible to improve the heat dissipation properties of the conductive layer of the same area.

[0022] According to the substrate device of the eighth aspect of the present disclosure, when heat generated by electronic components is dissipated by the conductive layer, it is possible to improve the heat dissipation performance of the conductive layer with the same area. [Brief explanation of the drawings]

[0023] [Figure 1] 1A and 1B are diagrams illustrating an example of a substrate used in a manufacturing method of a substrate device according to an embodiment of the present disclosure. [Figure 2] 1A and 1B are diagrams illustrating an example of a metal mask used in a method for manufacturing a substrate device according to an embodiment of the present disclosure. [Figure 3] 1 is a flowchart illustrating steps of a manufacturing method for a substrate device according to an embodiment of the present disclosure. [Figure 4]FIG. 10 is a diagram showing the state of the substrate 10 after the paste solder has been applied. [Figure 5] FIG. 1 is a diagram showing a state in which electronic components are arranged on a substrate 10 after paste solder has been applied. [Figure 6] 2 is an enlarged plan view showing the positional relationship between the through-hole 22 and the solder paste 42. FIG. [Figure 7] 2 is an enlarged cross-sectional view showing the positional relationship between a through-hole 22 and a solder paste 42. FIG. [Figure 8] FIG. 1 is a perspective view of a substrate 10 after heating, in which an electronic component is placed on the substrate 10 after the paste solder has been applied thereto. [Figure 9] FIG. 10 is a diagram showing an example of a photographic image showing the state of solder on an actual solid pattern. [Figure 10] FIG. 10 is a diagram showing a state in which the opening holes 32 of the metal mask 30 are positioned inside the outermost through holes 22. DETAILED DESCRIPTION OF THE INVENTION

[0024] Next, embodiments of the present disclosure will be described in detail with reference to the drawings.

[0025] First, an example of a substrate used in a method for manufacturing a substrate device according to an embodiment of the present disclosure is shown in Fig. 1. Fig. 1 is a diagram (plan view) of the surface of a substrate 10 as seen from above.

[0026] Here, the substrate refers to a printed wiring board on which a land pattern (hereinafter abbreviated as land), a solid pattern, a wiring pattern, etc. made of metal foil such as copper foil are formed on at least one of the front and back surfaces of an insulating material such as glass epoxy.

[0027] 1, the substrate 10 in this embodiment has lands 23 and a solid pattern 21 formed by a metal foil such as copper foil formed on the surface of an insulating material in a pre-designed pattern (arrangement shape), and a solder resist (hereinafter abbreviated as resist) formed on the surface of the insulating material and on the metal foil such as copper foil except for a portion thereof in a pre-designed pattern. In other words, the substrate 10 has the lands 23 and the solid pattern 21 formed by forming the resist in the area excluding the hatched area in FIG. 1 and through-holes 22 described later.

[0028] In this embodiment, only the configuration of the semiconductor element (an example of an electronic component) with the component number IC101 will be mainly described. Therefore, wiring patterns, lands, etc. related to electronic components other than the semiconductor element with the component number IC101 are partially omitted in FIG.

[0029] Here, the land 23 refers to a metal foil portion to which a terminal of an electronic component is soldered, and is an example of an electrode layer. The solid pattern 21 refers to a pattern in which all metal foil, such as copper foil, remains within a set area. In other words, the solid pattern refers to a metal foil portion formed in a planar area of ​​the substrate where the lands 23 and wiring patterns for transmitting signals are not formed, and is an example of a conductive layer. The lands 23 and the solid pattern 21 do not have resist formed thereon, and the metal foil is exposed to the outside. In this embodiment, the solid pattern 21 refers to a metal foil formed within a certain area for heat dissipation of the electronic component. In this embodiment, the solid pattern 21 has a plurality of through holes 22 formed at predetermined intervals. The through holes 22 are through holes for electrically connecting a pattern on the front surface of the substrate 10 (at least one of the lands 23, the solid pattern 23, and the wiring pattern) to a pattern on the back surface. A metal foil, such as copper foil, is formed on the inner surface of the through holes 22, electrically connecting the front surface and the back surface. In addition, when the substrate 10 is a multilayer substrate, the through holes 22 can electrically connect not only between the patterns on the front surface and the patterns on the back surface, but also between patterns formed on the internal conductor layers.

[0030] Then, electronic components such as semiconductor elements, resistor elements, capacitors, coil elements, and connectors are mounted (soldered and attached) on the substrate 10 shown in FIG. 1, thereby manufacturing a substrate device.

[0031] In this embodiment, electronic components are soldered and attached to the substrate 10 using a method called reflow soldering. In this reflow soldering method, a printing plate called a metal mask and a spatula called a squeegee are used to first apply paste solder placed on the metal mask to the desired soldering locations on the substrate 10 by moving the squeegee (screen printing). The paste solder is also called cream solder and is in a paste form at room temperature. Next, electronic components are placed on the paste solder applied to the substrate 10. The substrate 10 with the electronic components placed thereon is then placed in a heating furnace such as a reflow furnace and heated, and then cooled to room temperature. Note that this paste solder is a material that melts once heated to a certain temperature and then solidifies even when cooled back to room temperature, allowing electronic components to be soldered to the substrate.

[0032] An example of a metal mask used in such a reflow process is shown in FIG. 2. FIG. 2 is a view (plan view) of the surface of the metal mask seen from above. The metal mask 30 shown in FIG. 2 is created for applying paste solder to the substrate 10 by screen printing. Therefore, as shown in FIG. 2, the metal mask 30 has openings 33 formed corresponding to the positions of the lands 23 and a plurality of opening holes 32 formed at intervals narrower than the intervals between the through holes 22, corresponding to the region 31 of the solid pattern 21. Here, the approximately C-shaped region 31 surrounded by a dotted line in FIG. 2 is the same (equivalent, similar, or identical) region as the shaded portion of the approximately C-shape representing the solid pattern 21 in FIG. 1.

[0033] Then, with the metal mask 30 placed on the substrate 10, paste solder can be poured into the opening holes 32 and the openings 33 using a spatula-shaped part called a squeegee, thereby applying paste solder to the areas where the openings 33 and opening holes 32 of the metal mask 30 are provided.

[0034] Next, the steps of the manufacturing method of the substrate device according to one embodiment of the present disclosure are shown in the flowchart of FIG.

[0035] First, in the manufacturing method of the substrate device of this embodiment, in step S101, paste solder is applied to the substrate 10 on the lands 23 and the solid pattern 21 using the metal mask 30.

[0036] The state (appearance) of the substrate 10 after the paste solder has been applied in this manner is shown in Figure 4. Figure 4 is a view (plan view) of the surface of the substrate 10 as seen from above. In Figure 4, the paste solder is shown in black. Referring to Figure 4, it can be seen that circular paste solder 42 corresponding to the positions of the opening holes 32 in the metal mask 30 have been applied in a staggered pattern at equal intervals on the solid pattern 21. It can also be seen that paste solder 41 corresponding to the positions of the openings 33 in the metal mask 30 and corresponding to the shape of each land 23 has been applied on the lands 23.

[0037] Next, in step S102, electronic components to be mounted on the board 10 are placed at predetermined positions on the board 10. Specifically, the electronic components are placed on the paste solder 41 applied to the board 10.

[0038] FIG. 5 shows the state in which electronic components are placed on the solder paste 41 on the substrate 10 after the solder pastes 41 and 42 have been applied in this manner. FIG. 5 is a view (plan view) of the surface of the substrate 10 seen from above. Referring to FIG. 5, electronic components 61 to 64 are shown placed on the lands 23 to which the solder paste 41 has been applied. The electronic component 61 shown in FIG. 5 is an electronic component that is a heat dissipation target, and some of its terminals serve as heat dissipation terminals 71.

[0039] Finally, in step S103, the substrate 10 is heated by passing it through a reflow furnace to melt the paste solder 41, and then the substrate 10 is cooled to room temperature, thereby soldering the electronic components to the substrate 10. At this time, the paste solder 42 also melts and cools and solidifies.

[0040] Here, the positional relationship between through-hole 22 and solder paste 42 before solder paste 41 and 42 are heated will be described with reference to FIGS.

[0041] Fig. 6 is an enlarged plan view showing the positional relationship between through-hole 22 and solder paste 42. Fig. 7 is an enlarged cross-sectional view showing the positional relationship between through-hole 22 and solder paste 42.

[0042] Here, as an example, the description will be given assuming that the inner diameter (hole diameter) of the through holes 22 is 0.3 mm. Note that, because a metal foil such as copper foil is formed on the inner peripheral surface of the through holes 22, the actual inner diameter of the through holes 22 is narrower than 0.3 mm. The pitch between adjacent through holes 22 is 1.2 mm. The description will be given assuming that the plurality of through holes 22 are formed in a lattice pattern within the area of ​​the solid pattern 21. Note that, although FIG. 6 shows the through holes arranged in a lattice pattern in a plan view, it is also possible to arrange the through holes 22 in a staggered pattern (alternately).

[0043] As an example, the description will be given assuming that the inner diameter of the openings 32 in the metal mask 30 is 0.6 mm. The pitch between adjacent openings 32 is 0.8 mm. The description will be given assuming that the plurality of openings 32 are arranged in a staggered pattern (alternately) corresponding to the area of ​​the solid pattern 21. It is also possible to arrange the openings 32 in a lattice pattern. The inner diameter of the openings 32 in the metal mask 30 may be 0.8 mm or 1.0 mm.

[0044] In this manner, in this embodiment, the inner diameter of the opening 32 of the metal mask 30, 0.6 mm, is larger than the inner diameter of the through-hole 22, 0.3 mm.

[0045] In FIG. 6, the circular paste solder 42 is shown in white and in a see-through state, and the through-holes 22 are shown with diagonal lines. As can be seen from FIGS. 6 and 7, the circular paste solder 42 and the through-holes 22 are arranged at different pitches and in different configurations. Therefore, the overlap between the circular paste solder 42 and the through-holes 22 is random. Specifically, in some cases, the circular paste solder 42 overlaps with the through-hole 22, and in other cases, the circular paste solder 42 does not overlap with the through-hole 22 at all. Furthermore, even when the circular paste solder 42 overlaps with the through-hole 22, it can be seen that various states occur, such as partial overlap and complete overlap.

[0046] Next, FIG. 8 shows a perspective view of the substrate 10 after heating and cooling, in which the substrate 10 has electronic components arranged on it after the paste solders 41 and 42 have been applied, and the substrate 10 is heated and then cooled.

[0047] Referring to FIG. 8, it can be seen that uneven solder is formed on the solid pattern 21 of the substrate 10. When the paste solder 42 applied to the substrate 10 melts, some of the molten solder flows into the through-holes 22. Therefore, if the amount of molten solder around the through-holes 42 is small, when the molten solder cools and solidifies, the amount of solder at the locations of the through-holes 22 will be less than that of the surrounding area, resulting in a concave portion relative to the surface of the substrate 10. Conversely, if the amount of molten solder around the through-holes 42 is large, even if some of the molten solder flows into the through-holes 42, molten solder is supplied from the surrounding area. Therefore, when the molten solder cools and solidifies, the amount of solder at the locations of the through-holes 22 will be greater than that of the surrounding area, resulting in a convex portion relative to the surface of the substrate 10. Furthermore, since it is difficult for the molten solder to flow into the through-holes 22 in areas where there are no through-holes 22, the amount of solder will be greater than that of the surrounding area, resulting in a convex portion relative to the surface of the substrate 10. In particular, in areas where there is a large amount of solder, when the molten solder gathers together, cools, and solidifies, a bridge is formed, resulting in a higher protrusion, regardless of whether or not a through-hole 22 is present.

[0048] In this way, by arranging the through-holes 22 and the paste solder 42 on the solid pattern 21 at different pitches and in different arrangement shapes (sizes), unevenness of the solder is formed on the solid pattern 21.

[0049] The state of the solder on the actual solid pattern 21 thus formed is shown in Fig. 9. Fig. 9 is an example of a photographic image showing the state of the solder on the actual solid pattern 21.

[0050] 9, the solder unevenness is formed irregularly on the solid pattern 21. The irregular formation of the solder unevenness in this way increases the surface area of ​​the solid pattern 21 compared to when the solder is formed uniformly on the solid pattern 21. As the surface area increases, the area in contact with the air naturally also increases, resulting in improved heat dissipation even when the solid pattern 21 has the same area.

[0051] The solid pattern 21 may not be electrically separated from other wiring patterns or the lands 23, but may be electrically connected to a part of the lands 23 that are soldered to the terminals of the electronic component that is the heat dissipation target. For example, in this embodiment, the solid pattern 21 is electrically connected to the lands 23 that are connected to the heat dissipation terminals 71 of the electronic component that is the heat dissipation target.

[0052] Furthermore, if the substrate 10 is a multi-layer substrate, the solid pattern 21 may be electrically connected to the ground layer, which is the ground layer of the substrate 10, or to the power supply layer of the substrate 10.

[0053] Furthermore, the metal mask 30 may be configured such that, among the plurality of opening holes 32, the outermost opening holes 32 in the region of the solid pattern 21 are positioned more inward than the through holes 22 formed on the outermost periphery of the solid pattern 21. More specifically, the outermost opening hole 32 among the plurality of opening holes 32 formed in the metal mask 30 may be positioned on the outermost periphery of the plurality of through holes 22 formed in the solid pattern 21, and may be positioned inside the line segment connecting the centers of adjacent through holes 22.

[0054] With this configuration, as shown in FIG. 10 , the circular paste solder 42 is applied to the solid pattern 21 so as to be positioned inside the through-holes 22 formed at the outermost periphery. Therefore, when the circular paste solder 42 located near the outermost through-holes 22 is heated and melted, the molten solder easily flows into the outermost through-holes 22, reducing the likelihood of the solder spreading beyond the outermost through-holes 22. As a result, the solder is prevented from spilling outside the solid pattern 21. Therefore, even in a configuration in which lands 91 of other electronic components are arranged close to the solid pattern 21 as shown in FIG. 10 , the occurrence of solder bridges between the solid pattern 21 and other electronic components is prevented. Here, a solder bridge refers to a short circuit caused by solder spilling outside the solid pattern 21 between the electronic components and other components arranged outside the solid pattern 21.

[0055] In the above description, the case has been described where the lands 23 of the electronic components to be heat dissipated and the solid pattern 21 are formed on the same surface (front surface) of the substrate 10. However, the present disclosure is not limited to such a case, and is equally applicable to a case where the lands 23 of the electronic components to be heat dissipated and the solid pattern 21 are formed on different surfaces of the substrate 10. Specifically, this is the case where the lands 23 are formed on one surface (front surface or back surface) of the substrate 10, and the solid pattern 21 is formed on the other surface (back surface or front surface) of the substrate 10.

[0056] In this case, the metal mask will be composed of a first metal mask having openings formed corresponding to the positions of the lands 23, and a second metal mask having a plurality of opening holes formed corresponding to the areas of the solid pattern 21.

[0057] Although the present disclosure has been described in detail with respect to specific embodiments, it will be apparent to those skilled in the art that the present disclosure is not limited to such embodiments, and that various other embodiments are possible within the scope of the present disclosure.

[0058] In the above embodiment, it has been described that the solder unevenness (uneven shape) formed on the solid pattern 21 is irregular. This irregularity in the solder unevenness exists even among multiple substrates 10 of the same type (model). In other words, the solder unevenness formed on the solid pattern 21 of a substrate 10 is original to that substrate 10, and no other substrate has the same solder unevenness formed thereon. This is because the behavior of molten solder on the solid pattern 21 of a substrate 10 is different for each substrate 10, even when the same metal mask 30 and the same reflow oven are used. For this reason, the technology disclosed herein can also be used to recognize the substrate 10 (recognizing the model name, serial number, etc.) and to determine whether the substrate 10 is genuine. This technology will be described below.

[0059] The peta pattern 21 of the substrate 10 of a substrate device manufactured using the substrate device manufacturing method shown in the flowchart of FIG. 3 has solder bumps that are original to that substrate 10 (see FIG. 9). In other words, there is no other substrate with the same solder bumps as that substrate 10. Therefore, after manufacturing a substrate device using the substrate device manufacturing method shown in the flowchart of FIG. 3, the serial number attached to the substrate 10 of the substrate device is input, and the solder bumps formed on the peta pattern 21 of the substrate 10 are imaged (photographed) using an imaging device such as a camera. Image data (original image data), such as a photograph, obtained by the image capture is stored in a storage device such as a memory in pair with the serial number (as a set). The substrate device is then transported to a subsequent process, and products such as image forming devices equipped with the substrate device are distributed to the market. Even in such cases, if the solder bumps formed on the petapattern 21 of the board 10 can be captured in a downstream process or in the market using another imaging device, such as a built-in camera in a mobile device like a smartphone, to obtain other image data, the serial number of the board 10 can be recognized by comparing the other image data with the original image data stored in the storage device. This comparison is performed by using a mobile device via a communication line, such as the Internet, to access the original image data stored in the storage device and using known pattern matching techniques to quantify the similarity (difference) with the other image data. If this numerical value is equal to or greater than a predetermined value, the data is determined to be similar, the serial number of the board 10 can be recognized, and the board 10 can be determined to be genuine. Conversely, if this numerical value is smaller than the predetermined value, the data is determined to be dissimilar, and the board 10 can be determined to be non-genuine. Since the pattern matching software is pre-installed on the mobile device, this determination can be made in the presence of the actual board 10.

[0060] [Note] (((1))) a step of applying solder to a substrate having a conductive layer in which a plurality of through holes are formed at predetermined intervals and an electrode layer to which terminals of an electronic component are soldered, using a printing plate having openings formed corresponding to the positions of the electrode layer and a plurality of opening holes formed corresponding to areas of the conductive layer at intervals narrower than the intervals between the through holes; a step of placing the electronic component on the solder applied to the electrode layer, and then heating the substrate to solder the electronic component to the substrate; A method for manufacturing a substrate device having the above structure. (((2))) The inner diameter of the opening hole is larger than the inner diameter of the through hole. A method for manufacturing a substrate device according to (((1))). (((3))) the conductive layer is electrically connected to a part of the electrode layer; A method for manufacturing a substrate device according to (((1))) or (((2))). (((4))) The method for manufacturing a substrate device according to (((3))), wherein the conductive layer is electrically connected to an electrode layer that is connected to a heat dissipation terminal of the electronic component. (((5))) The method for manufacturing a substrate device according to any one of ((1))) to ((4))), wherein the substrate is a multi-layer substrate and the conductive layer is electrically connected to a ground layer or a power supply layer. (((6))) the printing plate is configured such that the outermost openings in the conductive layer region among the plurality of openings are positioned more inward than the through holes formed in the outermost periphery of the conductive layer; A method for manufacturing a substrate device according to any one of ((1))) to (((5))). (((7))) the electrode layer and the conductive layer are formed on different surfaces of the substrate, The printing plate comprises a first printing plate having an opening formed corresponding to the position of the electrode layer, and a second printing plate having a plurality of opening holes formed corresponding to the region of the conductive layer. A method for manufacturing a substrate device according to (((1))). (((8))) A substrate device manufactured by applying solder to a substrate having a conductive layer in which a plurality of through holes are formed at predetermined intervals and an electrode layer to which terminals of electronic components are soldered, using a printing plate having openings formed corresponding to the position of the electrode layer and a plurality of opening holes formed at intervals narrower than the intervals between the through holes and corresponding to areas of the conductive layer, placing the electronic components on the solder applied to the electrode layer, and then heating the substrate to solder the electronic components to the substrate.

[0061] According to the method for manufacturing a substrate device (((1))), when heat generated by electronic components is dissipated by a conductive layer, it is possible to improve the heat dissipation performance of a conductive layer of the same area. According to the method for manufacturing a substrate device (((2))), the unevenness of the solder formed on the conductive layer can be made larger compared to when the inner diameter of the opening hole is the same as the inner diameter of the through hole. (((3))) According to the manufacturing method of the substrate device of the third aspect of the present disclosure, the heat dissipation properties of the conductive layer can be improved compared to when the conductive layer is not electrically connected to a portion of the electrode layer. According to the method for manufacturing a substrate device (((4))), the heat generated by the electronic components can be dissipated more efficiently. According to the manufacturing method of the substrate device (((5))), the heat generated by the electronic components can be dissipated more efficiently than when the conductive layer is not electrically connected to either the ground layer or the power layer. According to the manufacturing method of the substrate device (((6))), it is possible to prevent short circuits from occurring at the peripheral portion of the conductive layer due to solder protruding from the conductive layer between the conductive layer and components outside the conductive layer. According to the manufacturing method of the substrate device (((7))), even if the surface on which the electronic components are placed and the surface on which the conductive layer is formed are different, it is possible to improve the heat dissipation properties of the conductive layer of the same area. According to the substrate device of (((8))), when heat generated by electronic components is dissipated by a conductive layer, it is possible to improve the heat dissipation performance of the conductive layer of the same area. [Explanation of symbols]

[0062] 10. Circuit board (printed wiring board) 21 Solid pattern (an example of a conductive layer) 22 Through hole (an example of a through hole) 23 Land (an example of an electrode layer) 30 Metal mask (example of printing plate) 31 areas 32 Opening hole 41, 42 Paste solder 61~64 Electronic Components 71 Heat dissipation terminal 91 rand

Claims

1. a step of applying solder to a substrate having a conductive layer in which a plurality of through holes are formed at predetermined intervals and an electrode layer to which terminals of an electronic component are soldered, using a printing plate having openings formed corresponding to the positions of the electrode layer and a plurality of opening holes formed corresponding to areas of the conductive layer at intervals narrower than the intervals between the through holes; a step of placing the electronic component on the solder applied to the electrode layer, and then heating the substrate to solder the electronic component to the substrate; A method for manufacturing a substrate device having the above structure.

2. The inner diameter of the opening hole is larger than the inner diameter of the through hole. The method for manufacturing the substrate device according to claim 1 .

3. the conductive layer is electrically connected to a part of the electrode layer; The method for manufacturing the substrate device according to claim 1 .

4. The method for manufacturing a substrate device according to claim 3 , wherein the conductive layer is electrically connected to an electrode layer that is connected to a heat dissipation terminal of the electronic component.

5. 2. The method for manufacturing a substrate device according to claim 1, wherein the substrate is a multi-layer substrate, and the conductive layer is electrically connected to a ground layer or a power supply layer.

6. the printing plate is configured such that the outermost openings in the conductive layer region among the plurality of openings are positioned more inward than the through holes formed in the outermost periphery of the conductive layer; The method for manufacturing the substrate device according to claim 1 .

7. the electrode layer and the conductive layer are formed on different surfaces of the substrate, the printing plates include a first printing plate having openings formed corresponding to the positions of the electrode layers, and a second printing plate having a plurality of opening holes formed corresponding to the regions of the conductive layer; The method for manufacturing the substrate device according to claim 1 .

8. A substrate device manufactured by applying solder to a substrate having a conductive layer in which a plurality of through holes are formed at predetermined intervals and an electrode layer to which terminals of electronic components are soldered, using a printing plate having openings formed corresponding to the position of the electrode layer and a plurality of opening holes formed at intervals narrower than the intervals between the through holes and corresponding to areas of the conductive layer, placing the electronic components on the solder applied to the electrode layer, and then heating the substrate to solder the electronic components to the substrate.

Images