Electronic control device

Abstract

To provide an electronic control device capable of improving heat dissipation of a heat generating component.SOLUTION: The electronic control device includes a cooling plate 330 forming a part of the housing space, and an electronic device inserted into the housing space and engaged with the rack. The electronic device includes a wiring board 111, a heating component 112 mounted on one surface of the wiring board, a case 120,130 for housing the wiring board and the heating component, and a heat radiation member 150,160,170 provided in the case. The heat radiating member is disposed to face the heat generating component in a direction orthogonal to the one surface. In a non-inserted state where the electronic device is not inserted in the housing space, a thickness from the engagement position in the orthogonal direction to a surface of the heat dissipation member facing the cold plate is larger than an interval Z10 between the engagement position and the cold plate in the orthogonal direction. In the attached state in which the electronic device is attached to the rack, the thickness Z21 is equal to the interval Z10, and the heat dissipation member is disposed to face the cooling plate in the orthogonal direction.SELECTED DRAWING: Figure 33

Description

[Technical Field]

[0001] The present disclosure relates to electronic control devices. [Background technology]

[0002] Patent Document 1 discloses a configuration including an electronic device in which electronic components are mounted on a printed circuit board, a rack for accommodating the electronic device in an exchangeable manner, and a cooler for cooling the electronic device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] German Patent Application Publication No. 102021203622 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the cooler in Patent Document 1 is disposed on the side wall of the printed circuit board. In other words, the cooler is not disposed facing the electronic components. Therefore, the configuration disclosed in Patent Document 1 may not be able to sufficiently dissipate heat from the electronic components.

[0005] One disclosed object is to provide an electronic control device that can improve the heat dissipation performance of heat-generating components. [Means for solving the problem]

[0006] The electronic control device disclosed herein comprises: a rack (200) having an accommodation space (IN1); a cooling plate (330) forming a part of the receiving space; the electronic device (100) is inserted into the storage space and engaged with the rack, and includes a wiring board (111), a heat-generating component (112) mounted on one surface (SF2) of the wiring board, a case (120, 130, 130b) for accommodating the wiring board and the heat-generating component, and a heat-dissipating member (150, 160, 170) provided in the case; The heat dissipation member is disposed opposite the heat-generating component in the orthogonal direction of one surface, When the electronic device is not inserted into the storage space, the thickness from the engagement position in the orthogonal direction to the surface of the heat dissipation member facing the cooling plate is greater than the distance between the engagement position in the orthogonal direction and the cooling plate, and when the electronic device is inserted into the storage space and attached to the rack, the thickness is equal to the distance, and the heat dissipation member is positioned opposite the cooling plate in the orthogonal direction.

[0007] In this way, the electronic control device has the above-mentioned relationship between the thickness of the electronic device and the distance between the engagement position and the cooling plate. Therefore, the electronic control device can reliably bring the heat dissipation member into contact with the cooling plate when mounted. Furthermore, in the mounted state of the electronic control device, the heat dissipation member is disposed opposite the cooling plate in the orthogonal direction. Furthermore, the heat dissipation member is disposed opposite the heat-generating component in the orthogonal direction. Therefore, the electronic control device can position the heat-generating component opposite the cooling plate via the heat dissipation member in the orthogonal direction. Therefore, the electronic control device can improve the heat dissipation performance of the heat-generating component.

[0008] The electronic control device disclosed herein also includes: a rack (200) having an accommodation space (IN1); a cooling plate (330) forming a part of the receiving space; an electronic device (100) that is inserted into a storage space and engaged with a rack, the electronic device having a wiring board (111), a heat-generating component (112) mounted on one surface (SF2) of the wiring board, a case (120, 130a) that stores the wiring board and the heat-generating component, and an elastic member (190b) that is provided in the case and that constantly applies stress to the wiring board in a direction perpendicular to the one surface; When the electronic device is inserted into the storage space and attached to the rack, stress is applied to the wiring board from the elastic member, and the part of the case that faces the heat-generating component in the perpendicular direction presses against the cooling plate via the heat-generating component.

[0009] In this way, when the electronic control device is installed, the portion of the case that faces the heat-generating component in the orthogonal direction presses against the cooling plate, thereby ensuring that the portion of the case that faces the heat-generating component in the orthogonal direction comes into contact with the cooling plate, thereby improving the heat dissipation performance of the heat-generating component.

[0010] The various aspects disclosed in this specification employ different technical means to achieve their respective objectives. The reference numerals in parentheses in the claims and in this section are intended to exemplify correspondences with the following embodiments and are not intended to limit the technical scope. The objectives, features, and advantages disclosed in this specification will become more apparent by reference to the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is a perspective view showing a schematic configuration of an electronic control device. [Figure 2] FIG. 2 is a perspective view showing a state in which the electronic device of the electronic control device is removed. [Figure 3] FIG. 2 is an exploded perspective view showing a schematic configuration of the electronic control device. [Figure 4] FIG. 1 is an exploded perspective view showing a schematic configuration of an electronic device. [Figure 5] FIG. 2 is a plan view showing a schematic configuration of a circuit board. [Figure 6] FIG. 2 is a perspective view showing a schematic configuration of a case. [Figure 7] FIG. 2 is a perspective view showing a schematic configuration of the rear part of the case. [Figure 8] FIG. 2 is a perspective view showing a schematic configuration of an electronic device and a cooling plate. [Figure 9]FIG. 1 is a plan view showing a schematic configuration of an electronic device. [Figure 10] FIG. 10 is a cross-sectional view taken along line XX in FIG. 9. [Figure 11] FIG. 2 is a perspective view showing a schematic configuration of a slide member. [Figure 12] FIG. 2 is a perspective view showing a schematic configuration of a slider. [Figure 13] FIG. 2 is a perspective view showing a schematic configuration of a slider. [Figure 14] FIG. 2 is a cross-sectional view showing a schematic configuration of a slide member. [Figure 15] FIG. 2 is a perspective view showing a holding structure of a cooling plate. [Figure 16] FIG. 2 is a perspective view showing a schematic configuration of a holding member and a movable member. [Figure 17] FIG. 2 is a plan view showing a schematic configuration of a holding member and a movable member. [Figure 18] FIG. 2 is a perspective view showing a schematic configuration of a movable member. [Figure 19] FIG. 2 is a perspective view showing a schematic configuration of a positioning member and a base substrate. [Figure 20] FIG. 2 is a perspective view showing a schematic configuration of a positioning member. [Figure 21] FIG. 21 is an enlarged view of part XXI in FIG. 20. [Figure 22] FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 21. [Figure 23] FIG. 2 is a perspective view showing a schematic configuration of a positioning member, a base substrate, and an electronic device. [Figure 24] FIG. 2 is an enlarged perspective view showing a schematic configuration of a positioning member. [Figure 25] FIG. 2 is a perspective view showing a schematic configuration of a positioning member, a base substrate, and a wiring substrate. [Figure 26] FIG. 26 is a cross-sectional view taken along line XXVI-XXVI in FIG. 25. [Figure 27] FIG. 10 is an image diagram illustrating positioning by a second positioning unit. [Figure 28] FIG. 10 is an image diagram illustrating positioning by a first positioning unit. [Figure 29] FIG. 10 is an image diagram illustrating the installation of an electronic device. [Figure 30] FIG. 10 is an image diagram illustrating the installation of an electronic device. [Figure 31] FIG. 10 is an image diagram illustrating removal of the electronic device. [Figure 32] FIG. 2 is a cross-sectional view of the electronic device before insertion. [Figure 33] FIG. 10 is a cross-sectional view of the electronic device during insertion. [Figure 34] FIG. 10 is a cross-sectional view of the electronic device after insertion. [Figure 35] FIG. 10 is a cross-sectional view of an electronic device according to a second embodiment before insertion. [Figure 36] FIG. 10 is a cross-sectional view of the electronic device according to the second embodiment after insertion. [Figure 37] FIG. 10 is a cross-sectional view of a modified example of an electronic device before insertion. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, several embodiments for carrying out the present disclosure will be described with reference to the drawings. In each embodiment, parts corresponding to matters described in the preceding embodiment may be assigned the same reference numerals, and duplicated explanations may be omitted. In each embodiment, when only a part of the configuration is described, the other parts of the configuration may be applied by referring to the other embodiment described previously.

[0013] In the following description, the three mutually perpendicular directions are referred to as the X, Y, and Z directions. One of the X directions, X1, is referred to as the first outward direction, and the other, X2, is referred to as the second outward direction. One of the Y directions, Y1, is referred to as the mounting direction, and the other, Y2, is referred to as the removal direction. One of the Z directions, Z1, is referred to as the upward direction, and the other, Z2, is referred to as the downward direction.

[0014] The Z direction is a direction perpendicular to the mounting direction Y1 and corresponds to the thickness direction of the electronic device 100. The Y direction corresponds to the thickness direction of the base substrate 600. The X direction can also be referred to as the left-right direction. In this case, the first outward direction X1 is the rightward direction, and the second outward direction X2 is the leftward direction. The thickness direction of the base substrate 600 is the same as the insertion direction of the board-to-board connector 611 and the board-to-board connector 113.

[0015] (First embodiment) The overall configuration of electronic control device 1000 will be described using Figures 1 to 3, etc. As shown in Figures 1 and 3, electronic control device 1000 includes electronic device 100, rack 200, cooling member 300, movable members 410 and 420, positioning structure 500 (positioning member 510), and base substrate 600. Note that Figures 1 to 3 are drawings showing the overall configuration, and some components (such as heat sink 160) may be omitted.

[0016] The electronic control device 1000 is configured to be mountable on a moving body such as a vehicle. The vehicle may be, for example, a gasoline vehicle, a diesel vehicle, a hybrid vehicle, an electric vehicle, a fuel cell vehicle, etc. Furthermore, the moving body may be an air vehicle other than a vehicle.

[0017] Each electronic device 100 may have a function as a control device. In other words, the electronic control device 1000 can be referred to as a collective control device, a control device cluster, or the like.

[0018] In the electronic control device 1000, a plurality of electronic devices 100 are stacked and arranged in the Z direction. Hereinafter, of two electronic devices 100 arranged adjacent to each other in the Z direction, the upper electronic device 100 will be referred to as the upper electronic device, and the lower electronic device 100 will be referred to as the lower electronic device. In other words, of the two electronic devices 100, the electronic device 100 arranged relatively closer to the upper side in the Z1 direction is the upper electronic device, and the electronic device 100 arranged relatively closer to the lower side in the Z2 direction is the lower electronic device.

[0019] The plurality of electronic devices 100 are configured to be mountable to the rack 200. The plurality of electronic devices 100 are also configured to be removable from the rack 200. The plurality of electronic devices 100 are mounted to the rack 200 by moving them in an installation direction Y1. The plurality of electronic devices 100 can also be mounted to the rack 200 by inserting them into the rack 200. The plurality of electronic devices 100 are removed from the rack 200 by moving them in a removal direction Y2. In other words, the electronic devices 100 are configured to be replaceable.

[0020] The electronic device 100 can also be called a replaceable ECU, etc. ECU is an abbreviation for Electronic Control Unit.

[0021] The electronic devices 100 are electrically connected to the base substrate 600 while attached to the rack 200. The electronic devices 100 are mounted in a direction perpendicular to the base substrate 600 (Y direction). Note that the term "perpendicular" in this disclosure includes a relationship where the direction is not perpendicular to the base substrate 600 to an extent of error. In other words, if there is a deviation within the extent of error, the direction is considered to be perpendicular. Therefore, the electronic devices 100 can be said to be mounted in a direction approximately perpendicular to the base substrate 600.

[0022] The state in which the electronic device 100 is attached to the rack 200 is referred to as an attached state. In the attached state, the electronic device 100 is fixed to the rack 200. In addition, in the attached state, the cooling plate 330, which will be described later, has moved downward in the Z2 direction. Furthermore, in the attached state, the heat conduction member 150, which will be described later, is compressed by the electronic device 100 and the cooling plate 330.

[0023] A state in which the electronic device 100 is merely inserted into the rack 200 is referred to as an inserted state. In the inserted state, the cooling plate 330 has not moved in the downward direction Z2. A state in which the electronic device 100 is not attached to the rack 200 is also referred to as an unattached state. In the unattached state, the electronic device 100 is not inserted into the rack 200. Therefore, the unattached state can also be called a uninserted state. The electronic device 100 will be described in detail later.

[0024] 3, the rack 200 includes a rack side 210, a rack front 220, a rack top 230, a rack bottom 240, and a rack back 250. Furthermore, the rack 200 includes a holding member 260.

[0025] The rack 200 has a frame made up of rack side portions 210, a rack front portion 220, and a rack back portion 250. The rack 200 has a rack top portion 230 and a rack bottom portion 240 provided as covers on the upper and lower sides of the frame. The rack top portion 230 and the rack bottom portion 240 are fixed to the frame by screws, welding, or the like. The rack 200 defines an accommodation space IN1 in which the electronic devices 100 are placed by the frame, the rack top portion 230, and the rack bottom portion 240. The accommodation space IN1 is provided corresponding to each electronic device 100. Thus, the rack 200 has four accommodation spaces IN1. The accommodation spaces IN1 can also be referred to as insertion spaces IN1.

[0026] The rack side portion 210 has two Z-direction sides extending in the Z direction and a Y-direction side portion extending in the Y direction that connects them. The Z-direction side portion and the Y-direction side portion are fixed by screwing, welding, or the like. The rack side portions 210 are provided in pairs in the X direction so as to sandwich the electronic device 100 therebetween. Furthermore, a portion of the cooling member 300 is disposed between the two Z-direction side portions.

[0027] A holding member 260 is fixed to the rack side portion 210. The holding member 260 is a portion that holds the movable members 410, 420 in a state where they are movable in the Z direction. In other words, the movable members 410, 420 are configured to be movable in the Z direction relative to the holding member 260. The movable members 410, 420 are also fixed to the cooling plate 330 of the cooling member 300. Therefore, the holding member 260 can also be said to be a portion that holds the cooling plate 330 in a state where they are movable in the Z direction. The cooling plate 330 is configured to be movable in the Z direction together with the movable members 410, 420. The movable members 410, 420 can be considered to be part of the rack 200.

[0028] The holding member 260 is provided individually for each electronic device 100. The movable members 410 and 420 are provided individually for each electronic device 100. The holding member 260 and the movable members 410 and 420 will be described in detail later.

[0029] The rack front section 220 has two Z-direction front sections aligned in the Z direction and an X-direction front section that connects them along the X direction. The Z-direction front section and the X-direction front section are fixed together by screws, welding, or the like. An insertion opening IN2 for the electronic device 100 is formed between the two Z-direction front sections.

[0030] The rack back portion 250 has two Z-direction back portions along the Z direction and two X-direction back portions along the X direction that connect them. The Z-direction back portions and the X-direction back portions are fixed by screws, welding, or the like. In addition, a part of the positioning structure 500 is placed in an opening surrounded by the two Z-direction back portions and the two X-direction back portions.

[0031] 14, the rack back 250 is provided with a fixing portion 251 for fixing the push-back member 142. The fixing portion 251 is provided with a female thread that engages with a male thread provided at the tip of the push-back member 142. The push-back member 142 will be described in detail later.

[0032] The rack 200 has a four-tier configuration capable of accommodating four electronic devices 100. However, the rack 200 may be configured to accommodate five or more electronic devices 100. The rack 200 may also be configured to accommodate three or fewer electronic devices 100. In other words, the rack 200 may be configured to accommodate only one electronic device 100. Therefore, the electronic control device 1000 may be one that includes multiple electronic devices 100 or one that includes only one electronic device 100.

[0033] 2 and 3, the cooling member 300 includes an inlet portion 310, an outlet portion 320, a cooling plate 330, a back portion 340, and a cooling hose 350. The cooling member 300 is provided to cool the electronic device 100. The cooling member 300 is mainly used to cool the heat-generating components 112 of the electronic device 100.

[0034] The cooling plates 330 are attached to the rack 200. A cooling plate 330 is provided for each electronic device 100. The cooling member 300 includes four cooling plates 330. The four cooling plates 330 are stacked and arranged along the Z direction. One electronic device 100 is arranged between the cooling plates 330. Note that the space between the cooling plates 330 refers to the space between two cooling plates 330 adjacent to each other in the Z direction. The cooling plates 330 can also be considered as part of the rack 200.

[0035] In other words, the cooling plate 330 can be said to form a part of the storage space IN1. The storage space IN1 is formed between the two cooling plates 330. The storage space IN1 is also formed between the rack top 230 and the cooling plate 330. The storage space IN1 is also formed between the rack bottom 240 and the cooling plate 330.

[0036] The number of cooling plates 330 is not limited to four. The cooling member 300 may include the same number of cooling plates 330 as the number of electronic devices 100 that can be accommodated in the rack 200.

[0037] The cooling member 300 mainly cools the electronic device 100 with a cooling plate 330. The cooling plate 330 is mainly made of a metal with high thermal conductivity, such as aluminum. The cooling plate 330 has a refrigerant space formed therein through which a liquid refrigerant, such as cooling water, flows.

[0038] The cooling plate 330 is arranged with the electronic device 100 to be cooled facing the surface on the downward direction Z2 side. Therefore, the electronic control device 1000 is arranged in the downward direction Z2 in the following order: cooling plate 330, electronic device 100 to be cooled by cooling plate 330. In other words, the cooling plate 330 is arranged in the opposite direction to the direction of gravity than the electronic device 100 to be cooled. This allows the cooling plate 330 to prevent an air layer from being generated between the liquid refrigerant and the electronic device 100.

[0039] 2, the surface of the cooling plate 330 facing downward in the Z2 direction is the facing surface SF4. On the other hand, the surface of the electronic device 100 facing the cooling plate 330 is the facing surface SF1. The facing surface SF1 is the surface of the electronic device 100 facing upward in the Z1 direction. Therefore, when the electronic device 100 and the cooling plate 330 are attached, the facing surfaces SF1 and SF4 are arranged opposite each other. The facing surfaces SF1 and SF4 are, for example, flat surfaces.

[0040] The cooling plate 330 has an inlet portion 310 on one side in the X direction and an outlet portion 320 on the other side. The liquid refrigerant flows from the inlet portion 310 into the refrigerant space, flows through the refrigerant space, and is discharged from the outlet portion 320. The positional relationship between the inlet portion 310 and the outlet portion 320 may be reversed.

[0041] The inlet portion 310 and the outlet portion 320 have refrigerant flow paths through which a liquid refrigerant flows. The inlet portion 310 and the outlet portion 320 are attached with cooling hoses 350 having refrigerant flow paths.

[0042] The cooling hoses 350 are attached to the inlet portion 310 and the outlet portion 320 of each cooling plate 330. One end of the cooling hoses 350 is attached to the inlet portion 310 or the outlet portion 320, and the other end is attached to the back portion 340. The back portion 340 has a refrigerant flow path through which the liquid refrigerant supplied to the cooling plate 330 flows, and a refrigerant flow path through which the liquid refrigerant discharged from the cooling plate 330 flows.

[0043] 3, movable members 410, 420 are attached to the four corners of the cooling plate 330. The movable members 410, 420 are attached to the cooling plate 330 at both ends in the X direction, in the front-rear direction in the Y direction. The movable members 410, 420 are fixed to the cooling plate 330 by screws, welding, or the like.

[0044] As described above, the cooling plate 330 is configured to be movable in the Z direction. That is, the cooling plate 330 is movable in the Z direction relative to the rack 200 (holding member 260). It can also be said that the cooling plate 330 is attached to the rack 200 in a state where it is movable in the thickness direction Z, which is perpendicular to the attachment direction Y1. Therefore, the cooling hose 350 is made of a deformable material such as rubber. The attachment direction Y1 can also be said to be the insertion direction Y1.

[0045] The movable members 410 and 420 are attached to the rack 200 at positions that sandwich the electronic device 100. The movable members 410 and 420 have protrusions 417 and 427 that protrude toward the electronic device 100. The movable members 410 and 420 will be described in detail later.

[0046] 2 and 3, rear surface unit 340 is attached to the back side of rack 200 in attachment direction Y1. Rear surface unit 340 is attached to rack 200 with positioning member 510 and base substrate 600 disposed between rear surface unit 340 and rack back portion 250.

[0047] The positioning member 510 is disposed between the base substrate 600 and the plurality of electronic devices 100. The positioning member 510 is a member that positions the inter-board connector 611 of the base substrate 600 and the inter-board connector 113 of the electronic device 100. The positioning member 510 and the base substrate 600 will be described in detail later. Note that the electronic control device 1000 does not necessarily have to include the positioning member 510 and the base substrate 600. The inter-board connector 611 corresponds to the first connector. The inter-board connector 113 corresponds to the second connector.

[0048] <Electronic equipment> The electronic device 100 will be described using Figures 4 to 10, etc. Note that in Figures 4 and 6, the heat sink 160 and other components are omitted for the sake of simplicity. In Figure 4, the heat-generating component 112, spring member 190a, and other components are omitted for the sake of simplicity. Also, Figures 9 and 10 are simplified drawings for conceptually explaining the peripheral configuration of the heat-generating component 112 in the electronic device 100. Therefore, the size of the heat-conducting member 150 and other aspects of the electronic device 100 shown in Figures 9 and 10 are different from those in the other drawings.

[0049] Each electronic device 100 is inserted into the accommodation space IN1 and engaged with the rack 200. Each electronic device 100 has a similar configuration. However, each electronic device 100 has a different circuit configuration and processing content. As shown in FIGS. 4 and 5, the electronic device 100 includes a circuit board 110 and a case that accommodates the circuit board 110. Furthermore, as shown in FIG. 10, the electronic device 100 includes heat dissipation members 150, 160, and 170 provided on the case.

[0050] The circuit board 110 includes a wiring board 111, a heat-generating component 112 as an electronic component, an inter-board connector 113, an external connector 114, and the like. The wiring board 111 has conductive wiring provided on an electrically insulating base material such as resin. The wiring board 111 has one surface SF2 and an opposite surface SF3 of the surface SF2. The wiring board 111 is a so-called printed circuit board. In an attached state, the wiring board 111 is disposed along the XY plane. The XY plane is a plane defined by an X axis extending in the X direction and a Y axis extending in the Y direction.

[0051] Circuit elements including heat-generating components 112 are mounted on wiring board 111. In other words, heat-generating components 112 and circuit elements different from heat-generating components 112 are mounted on wiring board 111. Some of the different circuit elements are provided around heat-generating components 112. Circuit elements provided around heat-generating components 112 can also be called peripheral circuit elements.

[0052] The circuit elements are electrically connected to the wiring of the wiring board 111. The circuit elements are connected to the wiring and electrodes via solder or the like. The heat-generating components 112 are circuit elements that generate heat when they operate. The heat-generating components 112 are, for example, SoCs (System on a Chip) and semiconductor switching elements such as MOSFETs and IGBTs.

[0053] The heat-generating component 112 has a plurality of side walls arranged in an annular shape and two surfaces connected to the side walls. The two surfaces have a larger area than each of the side walls. One surface is a mounting surface that faces the wiring board 111. The other surface is the opposite surface to the mounting surface. A heat-conducting member 170, which will be described later, is provided in contact with the opposite surface. In other words, the heat-dissipating members 150-170 are arranged opposite the opposite surface of the heat-generating component 112.

[0054] 5 shows one surface SF2 of wiring board 111. As shown in Fig. 5, heat-generating component 112 is mounted on, for example, one surface SF2 of wiring board 111. One surface SF2 is the surface facing upper case 130, which will be described later. Furthermore, upper case 130 is the portion facing cooling plate 330.

[0055] The wiring board 111 is mounted with an inter-board connector 113 used for electrical connection with the base substrate 600. The inter-board connector 113 is electrically connected to the wiring and circuit elements of the wiring board 111. The inter-board connector 113 is electrically connected to an inter-board connector 611 of the base substrate 600. The inter-board connectors 113, 611 are sometimes referred to as board-to-board connectors (BtoB connectors). Note that the inter-board connectors 113, 611 are electrically connected by inserting one into the other.

[0056] The board-to-board connectors 113, 611 may be, for example, floating connectors. In this case, at least one of the board-to-board connectors 113, 611 has a floating mechanism that can move in two directions perpendicular to the connection direction. This allows the board-to-board connectors 113, 611 to absorb any misalignment that may occur during connection. The connection direction of the board-to-board connectors 113, 611 is the Y direction.

[0057] An external connector 114 is mounted on the wiring board 111 and is used for electrical connection with an external device provided outside the electronic control device 1000. The external connector 114 is electrically connected to the wiring and circuit elements of the wiring board 111.

[0058] Wiring board 111 is provided with positioning slits 115. Positioning slits 115 are provided for positioning inter-board connectors 113, 611 in the X direction. Positioning slits 115 correspond to second positioning holes.

[0059] At least in the attached state, the first positioning portion 530 of the positioning member 510 is disposed in the positioning slit 115. Furthermore, the positioning member 510 gradually enters the positioning slit 115 when the electronic device 100 is moved in the attachment direction Y1.

[0060] The positioning slit 115 is provided along the planar direction of the wiring board 111. The positioning slit 115 is a hole that penetrates the wiring board 111 in the thickness direction (Z direction). The positioning slit 115 has an opening in one of the side walls of the wiring board 111. The positioning slit 115 can also be considered a notch provided along the mounting direction Y1. The opening end of the positioning slit 115 is provided with a chamfered portion 115a. This makes it easier for the positioning member 510 to enter the positioning slit 115. The thickness direction of the wiring board 111 corresponds to the distance between one surface SF2 and the opposite surface SF3. The planar direction of the wiring board 111 is the same as the insertion direction of the board-to-board connector 611 and the board-to-board connector 113.

[0061] 5, the wiring board 111 is provided with a through hole 111a that extends from one surface SF2 to the opposite surface SF3. The through hole 111a is a hole in which a bolt 110a for fixing the wiring board 111 to the case is placed.

[0062] As will be explained later, wiring board 111 is fixed to case upper part 130 (FIG. 10). Furthermore, when case upper part 130 is attached, it will bend from the area facing heat-generating component 112. It is conceivable that wiring board 111 will bend together with case upper part 130. Unless otherwise specified, the area facing heat-generating component 112 is the area facing heat-generating component 112 in the upward direction Z1.

[0063] In electronic device 100, when wiring board 11 bends together with upper case 130, stress is applied to the connection between wiring board 11 and heat-generating component 112. Therefore, in electronic device 100, there is a risk of reducing the reliability of the connection between wiring board 11 and heat-generating component 112. The connection is formed by solder, a terminal of heat-generating component 112, or the like.

[0064] Therefore, the through hole 111a is provided in a position adjacent to the heat-generating component 112. That is, the wiring board 111 is fixed to the case upper part 130 in a position adjacent to the heat-generating component 112. Furthermore, it is preferable that the through hole 111a is provided in the periphery of the heat-generating component 112. Furthermore, it is preferable that the through hole 111a is provided as close to the heat-generating component 112 as possible. A clearance may be provided between the through hole 111a and the bolt 110a. Even if the case upper part 130 is bent, it is possible to suppress the application of stress to the wiring board 111.

[0065] This prevents the wiring board 111 from bending together with the case upper part 130. Furthermore, the electronic device 100 can prevent stress from being applied to the connection portion between the wiring board 111 and the heat-generating component 112. Therefore, the electronic device 100 can prevent a decrease in the reliability of the connection between the wiring board 111 and the heat-generating component 112. The through holes 111a may be provided at the four corners of the wiring board 111 in addition to the positions adjacent to the heat-generating component 112.

[0066] As shown in Figures 4, 6, 7, and 10, the case accommodates the circuit board 110. That is, the case accommodates the wiring board 111 and the heat-generating component 112. The case includes a base 120 and a cover that covers the circuit board 110. The case forms an accommodation space for the circuit board 110 by assembling the base 120 and the cover. The base 120 and the cover are fixed together with screws, adhesive, or the like.

[0067] The cover includes a case upper part 130, a guide holding part 131, a removal opening 132, a case back part 133, and screw holes 134. The cover is recessed so as to be able to cover the circuit board 110. The case upper part 130 is disposed opposite one surface SF2 of the wiring board 111.

[0068] 10, a wiring board 111 is fixed to the case upper part 130 by bolts 110a. That is, the wiring board 111 is fixed to the case upper part 130 with the heat-generating component 112 disposed between the wiring board 111 and the case upper part 130. The case upper part 130 corresponds to the upper case part. The upper case part can be said to be the part facing the surface SF2 of the case.

[0069] The base 120 is disposed opposite the case upper portion 130. The base 120 is also disposed opposite the opposite surface SF3. The base 120 corresponds to the lower case portion.

[0070] The surface of case upper part 130 is opposite surface SF1 that faces cooling plate 330. As shown in Fig. 8, in the mounted state of electronic device 100, cooling plate 330 is disposed on opposite surface SF1. In other words, case upper part 130 is a portion disposed between wiring board 111 and cooling plate 330.

[0071] The case upper part 130 is mainly made of resin. In this case, the guide holding part 131 and the case back part 133 are also mainly made of resin. In other words, the cover is mainly made of resin. On the other hand, the base 120 may be mainly made of metal or may be mainly made of resin. Note that a material mainly made of metal is also called metallic, and a material mainly made of resin is also called resinous.

[0072] The case upper part 130 is configured to bend when stress is applied in the Z direction. Furthermore, when the stress is released, the case upper part 130 returns to the shape it had when no stress was applied. In other words, the case upper part 130 is configured to be elastically deformable. The state in which stress is applied in the Z direction is also referred to as the applied state. The state in which stress is not applied in the Z direction is also referred to as the non-applied state.

[0073] 9 and 10, the case upper part 130 is provided with heat dissipation members 150-170. The heat dissipation members 150-170 are arranged to face the heat-generating component 112 in the direction perpendicular to the surface SF2 (Z direction). The heat dissipation members 150-170 are also arranged on the case upper part 130 side with respect to the heat-generating component 112. The heat dissipation members include a heat sink 160 and thermally conductive members 150, 170. Hereinafter, the direction perpendicular to the surface SF2 will also be simply referred to as the perpendicular direction.

[0074] The heat sink 160 is primarily made of a metal with good thermal conductivity, such as copper or aluminum. The heat sink 160 is a plate-shaped member and can also be called a heat sink plate. As described above, the upper case 130 is made of resin. Therefore, the heat sink 160 can be insert-molded into the upper case 130. In other words, the heat sink 160 is integrated with the upper case 130 by insert molding.

[0075] The heat sink 160 is provided so as to protrude from the case upper part 130 toward the cooling plate 330. The heat sink 160 also protrudes from the case upper part 130 toward the heat-generating components 112. In other words, the heat sink 160 is thicker than the case upper part 130. By insert-molding the heat sink 160, the electronic device 100 can be provided with the heat sink 160 only in locations corresponding to the heat-generating components 112. The plate thickness is the thickness in the Z direction.

[0076] The heat sink 160 may encompass the heat-generating component 112 in a plan view from the Z direction. In other words, the planar area of ​​the heat sink 160 may be equal to or greater than the planar area of ​​the heat-generating component 112. The planar area is the area along the XY plane.

[0077] The thermal conduction members 150, 170 are elastically deformable sheet-like members. Alternatively, gel, grease, or the like may be used as the thermal conduction members 150, 170. The thermal conduction members 150, 170 are sometimes referred to as TIM (Thermal Interface Material). The thermal conduction members 150, 170 may encompass the heat-generating component 112 in a plan view from the Z direction. In other words, the planar area of ​​the thermal conduction member 150 may be equal to or larger than the planar area of ​​the heat-generating component 112. The planar area of ​​the thermal conduction member 170 may be equal to the planar area of ​​the heat-generating component 112.

[0078] Heat conduction member 150 is provided on the cooling plate 330 side of heat dissipation plate 160. In other words, heat conduction member 150 is provided so as to be exposed to the external space of the case with respect to heat dissipation plate 160. Heat conduction member 150 corresponds to an external heat conduction member.

[0079] The heat conduction member 150 is disposed between the heat sink 160 and the cooling plate 330 in the attached state or the inserted state. The heat conduction member 150 is in contact with the heat sink 160 and the cooling plate 330 at least in the attached state. The heat conduction member 150 is pressed (compressed) by the heat sink 160 and the cooling plate 330 in the attached state. The heat conduction member 150 is disposed between the cooling plate 330 and the heat-generating component 112 of the electronic device 100 that is the cooling target of the cooling plate 330. The heat conduction member 150 may be in contact with the surface of the heat sink 160 in the non-inserted state.

[0080] The heat conducting member 150 is a member that facilitates heat transfer from the heat sink 160 to the cooling plate 330. The heat conducting member 150 can also be said to be a member that reduces the thermal resistance between the heat sink 160 and the cooling plate 330. The electronic control device 1000 is provided with the heat conducting member 150, thereby improving heat dissipation performance.

[0081] Heat conduction member 170 is provided on the heat-generating component 112 side of heat sink 160. In other words, heat conduction member 170 is provided on heat sink 160 so as to be exposed to the internal space of the case. Heat conduction member 170 corresponds to an internal heat conduction member.

[0082] In the non-inserted state, the heat conducting member 170 is disposed between the heat generating component 112 and the heat sink 160. Furthermore, the heat conducting member 170 is in contact with the heat generating component 112 and the heat sink 160 at least in the attached state. Furthermore, in the attached state, the heat conducting member 170 is pressed (compressed) by the heat generating component 112 and the heat sink 160. Note that the heat conducting member 170 may be in contact with the heat generating component 112 and the heat sink 160 in the non-inserted state.

[0083] The heat conducting member 170 is a member that facilitates heat transfer from the heat generating component 112 to the heat sink 160. The heat conducting member 170 can also be said to be a member that reduces the thermal resistance between the heat generating component 112 and the heat sink 160. The electronic control device 1000 is provided with the heat conducting member 170, thereby improving heat dissipation.

[0084] In this way, the case upper part 130 is provided with the heat dissipation members 150-170. When attached, the heat dissipation members 150-170 form a heat dissipation path from the heat-generating component 112 to the cooling plate 330. Furthermore, even if the case upper part 130 is made of resin, it can dissipate heat generated from the heat-generating component 112 to the cooling plate 330. Therefore, the electronic device 100 can have improved heat dissipation performance compared to a configuration in which the heat dissipation members 150-170 are not provided.

[0085] In this embodiment, the heat dissipation member is a heat sink 160 and thermally conductive members 150 and 170. However, the present disclosure is not limited to this. The present disclosure may include at least one of the heat sink 160 and the thermally conductive members 150 and 170 as the heat dissipation member. For example, the heat dissipation member may be only the heat sink 160.

[0086] 33, in the attached state, the case upper part 130 elastically deforms in contact with the cooling plate 330. The case upper part 130 is configured to press the cooling plate 330 by a reaction force of the elastic deformation. That is, in the attached state, the case upper part 130 presses the cooling plate 330 in the upward direction Z1.

[0087] However, as described above, the main component of the case upper part 130 is resin. Therefore, the case upper part 130 may harden due to heat. Alternatively, the bending modulus of the case upper part 130 may decrease due to heat. In this case, the force with which the case upper part 130 presses the cooling plate 330 decreases.

[0088] 10, the electronic device 100 is provided with a spring member 190a between the base 120 and the wiring board 111. The region of the heat-generating component 112 on which the spring member 190a is provided is a region on the downward direction Z2 side of the heat-generating component 112. The spring member 190a corresponds to an auxiliary elastic member.

[0089] In this embodiment, as an example, an example in which one spring member 190a is provided is adopted. However, the spring member 190a may be provided at multiple locations. For example, the spring member 190a may be provided at four corners or two diagonal locations in the opposing area of ​​the heat-generating component 112. A leaf spring may also be adopted as the spring member 190a.

[0090] In the non-inserted state, no force is applied to the spring member 190a from the wiring board 111. However, in the attached state, the spring member 190a is elastically deformed by the force applied from the wiring board 111 in the downward direction Z2. The spring member 190a then applies a reaction force (stress) to the wiring board 111 in the perpendicular direction. In other words, the spring member 190a applies a stress to the wiring board 111 in the upward direction Z1. It can also be said that the spring member 190a presses the wiring board 111 toward the cooling plate 330.

[0091] In this way, spring member 190a assists case upper portion 130 to reliably press cooling plate 330. Furthermore, even if case upper portion 130 or the like deteriorates over time, electronic control device 1000 can maintain the pressing force of case upper portion 130 on cooling plate 330. However, electronic device 100 does not need to include spring member 190a as long as the cooling plate 330 can be pressed by the reaction force of case upper portion 130.

[0092] As shown in Figures 4 and 6, the guide holding portion 131 is provided continuous with the case upper portion 130. The guide holding portion 131 is provided on both ends of the cover in the X direction. The guide holding portion 131 forms a side wall of the cover along the Y direction. The guide holding portion 131 is a groove in which the slide member 140 is disposed. The slide member 140 is provided on both ends of the electronic device 100 in the X direction. The guide holding portion 131 can also be called a slide holding portion.

[0093] The slide member 140 includes a slider 141. Therefore, it can be said that the slider 141 is disposed in the guide holding portion 131. The slide member 140 will be described in detail later.

[0094] The guide holding portion 131 has a removal opening 132 at its end in the Y direction. The removal opening 132 is an opening for exposing the push-back member 142 of the slide member 140. In other words, the removal opening 132 is provided so that one end of the push-back member 142 is exposed to the outside of the cover.

[0095] 7, the case back 133 is a side wall on the Y direction side. The case back 133 is provided to be continuous with the case upper part 130. Note that FIG. 7 shows a state in which the circuit board 110 is housed in the case.

[0096] Case back 133 is provided with first opening 133a, second opening 133b, and connection opening 133c. Each of openings 133a to 133c is a hole that penetrates case back 133 in the thickness direction. Therefore, in FIG. 7, wiring board 111 can be seen through each of openings 133a to 133c.

[0097] First opening 133a is an opening in which first positioning portion 530 of positioning member 510 is disposed, at least in the attached state. First opening 133a is an opening for disposing first positioning portion 530 of positioning member 510 disposed outside electronic device 100 on the housing space side.

[0098] Second opening 133b is an opening in which, at least in the attached state, a part of second positioning portion 540 is disposed. Second opening 133b is an opening for disposing a part of second positioning portion 540 of positioning member 510 disposed outside electronic device 100 on the housing space side.

[0099] The connection opening 133c is an opening for connecting the inter-board connectors 113, 611. In other words, the connection opening 133c is a mechanism for connecting the inter-board connector 113 of the circuit board 110 arranged in the accommodation space with the inter-board connector 611 of the base substrate 600 arranged outside the electronic device 100. In the attached state, at least one of the inter-board connectors 113, 611 is disposed in the connection opening 133c.

[0100] The screw holes 134 are holes into which fixing screws 1 are inserted to fix the electronic device 100 to the rack 200. In the mounted state, the electronic device 100 is fixed to the rack 200 by the fixing screws 1 and the push-back members 142. Note that the method of fixing the electronic device 100 to the rack 200 is not limited to the above.

[0101] 4, 6, and 10, the case upper portion 130 has a protrusion 180 at a location facing the cooling plate 330. The protrusion 180 protrudes from the opposing surface SF1. The protrusion 180 also protrudes further than the heat conduction member 150. The protrusion 180 is disposed closer to the insertion direction Y1 than the heat conduction member 150. In other words, the protrusion 180 is disposed closer to the attachment direction Y1 than the heat conduction member 150, rather than closer to the removal direction Y2.

[0102] As a result, when the electronic device 100 is inserted into the rack 200, the protrusions 180 come into contact with the cooling plate 330 before the heat conduction member 150. Therefore, the electronic control device 1000 can prevent the heat conduction member 150 from being turned over or sheared, and can prevent a decrease in heat dissipation performance.

[0103] Furthermore, the protrusion 180 is inclined so that the amount of protrusion decreases as it approaches the mounting direction Y1. In other words, the protrusion 180 has an inclined portion at the end on the mounting direction Y1 side. The inclined portion of the protrusion 180 gradually becomes thinner as it approaches the mounting direction Y1. This allows the electronic control device 1000 to insert the electronic device 100 into the rack 200 even if the protrusion 180 is provided.

[0104] As shown in FIG. 33 , the cooling plate 330 is provided with a recess 330a that is recessed from the surrounding area and where the protrusion 180 is located in the attached or inserted state. The recess 330a is inclined so that the recessed amount decreases as it approaches the removal direction Y2. That is, the recess 330a has an inclined portion at the end on the removal direction Y2 side. The distance between the inclined portion of the recess 330a and an imaginary plane along the opposing surface SF4 gradually decreases as it approaches the removal direction Y2. This allows the electronic control device 1000 to remove the electronic device 100 from the rack 200 even if the protrusion 180 is provided. However, the present disclosure does not necessarily require the protrusion 180 and the recess 330a.

[0105] <Slide component> The sliding members 140 will be described with reference to Figures 4, 6, and 11 to 14. As shown in Figures 4 and 6, the sliding members 140 are arranged in pairs at both ends of the cover in the X direction. That is, the electronic device 100 is provided with two sliding members 140. The electronic device 100 is also provided with a pair of sliding members 140, one on the first outward direction X1 side and the other on the second outward direction X2 side.

[0106] The slide member 140 includes a slider 141, a push-back member 142, a slider holder 143, and a slider cover 144. The slider 141 corresponds to a guide member. 11 to 13 show the slider 141 disposed on the first outward direction X1 side of the electronic device 100. That is, FIGS. 11 to 13 show the slider 141 disposed on the right side.

[0107] 11, slider 141 is attached to slider holder 143. Slider 141 is placed in guide holding portion 131 while attached to slider holder 143. Slider 141 is held by slider cover 144 so as not to come off guide holding portion 131.

[0108] The slider 141 is configured to be movable along the mounting direction Y1. The slider 141 is movable along the mounting direction Y1 while being placed in the guide holding portion 131. The slider 141 is also movable in the Y direction relative to the slider holder 143 and the case (such as the case upper portion 130).

[0109] As shown in FIGS. 12 and 13, the slider 141 is formed, for example, by pressing a plate-shaped member whose main component is metal. The slider 141 mainly has opposing sidewall portions 141c, 141d, and 141h, and a connecting portion 141a continuing to the sidewall portions 141c, 141d, and 141h. The sidewall portions 141c, 141d, and 141h are portions that extend along the YZ plane. On the other hand, the connecting portion 141a is a portion that extends along the XY plane. The YZ plane is a plane defined by the Y axis and the Z axis that extends in the Z direction.

[0110] The side walls 141c and 141d are provided on one end of the connecting portion 141a. The side wall 141h is provided on the other end of the connecting portion 141a. Therefore, the side walls 141c and 141d and the side wall 141h are disposed opposite each other.

[0111] The side wall portion 141c is disposed on the inner side of the side wall portion 141d when the electronic device 100 is disposed in the accommodation space IN1. Therefore, it can be said that the side wall portion 141c is disposed closer to the mounting direction Y1 than the side wall portion 141d.

[0112] The side wall portion 141d is provided via an extension portion 141b provided on a part of the connecting portion 141a. The extension portion 141b is a portion of the connecting portion 141a extended in the first outward direction X1. The extension portion 141b is provided to position the side wall portion 141d further in the first outward direction X1 than the side wall portion 141c. Therefore, the side wall portion 141d is located closer to the first outward direction X1 than the side wall portion 141c. Furthermore, the distance between the side wall portion 141h and the side wall portion 141d is wider than the distance between the side wall portion 141h and the side wall portion 141c. Note that the distance here is the distance in the X direction.

[0113] The slider 141 disposed on the left side has the same configuration as the slider 141 disposed on the right side. However, the slider 141 disposed on the left side has an extension portion 141b for positioning the side wall portion 141d further in the second outward direction X2 than the side wall portion 141c. Therefore, the side wall portion 141d is positioned closer to the second outward direction X2 than the side wall portion 141c.

[0114] Furthermore, guide grooves 141e and 141f are provided in the side wall portions 141c and 141d along the mounting direction Y1. The side wall portions 141c and 141d can also be considered as notches that penetrate the slider 141 in the plate thickness direction. The guide grooves 141e and 141f are grooves in which protrusions 417 and 427 of the movable members 410 and 420, which will be described later, are disposed. The guide grooves 141e and 141f are also grooves in which the protrusions 417 and 427 can move (slide). In other words, the slider 141 is movable in the Y direction with the protrusions 417 and 427 disposed in the guide grooves 141e and 141f.

[0115] The guide grooves 141e, 141f have open ends on the mounting direction Y1 side. That is, the guide grooves 141e, 141f are grooves with openings 141f1, 141e1 provided on the mounting direction Y1 side. In the process of mounting the electronic device 100 to the rack 200, the protrusions 417, 427 of the slider 141 enter through the open ends of the guide grooves 141e, 141f. The guide grooves 141e, 141f can also be referred to as guide slits or notches. The mounting process can also be referred to as an insertion process.

[0116] The sidewalls 141c and 141d have openings 141f1 and 141e1 that are wider in the mounting direction Y1. The slider 141 also has guide grooves 141e and 141f that have openings that are gradually wider toward the open ends. Therefore, the guide grooves 141e and 141f are easy to fit the protrusions 417 and 427 into.

[0117] The guide grooves 141e, 141f include inclined portions SL11, SL14 inclined with respect to the mounting direction Y1. The inclined portions SL11, SL14 are inclined so that the mounting direction Y1 side is tilted upward in the Z1 direction relative to the removal direction Y2 side. The inclined portions SL11, SL14 are portions for attracting the cooling plate 330 toward the electronic device 100. That is, the inclined portions SL11, SL14 are portions for attracting the cooling plate 330 toward the electronic device 100 when mounting (inserting) the electronic device 100 in the rack 200. The inclined portions SL11, SL14 are also portions for separating the cooling plate 330 from the electronic device 100 when removing (removing) the electronic device 100 from the rack 200. This point will be explained in detail later.

[0118] The guide grooves 141e and 141f also include holding portions SL12 and SL15 at the ends opposite to the Y1 side in the mounting direction. The holding portions SL12 and SL15 are portions that hold the protrusions 417 and 427. In this way, the guide grooves 141e and 141f are grooves that extend from the openings 141f1 and 141e1 to the holding portions SL12 and SL15.

[0119] The guide grooves 141e and 141f include flat portions SL10 and SL13 between the openings 141f1 and 141e1 and the inclined portions SL11 and SL14. The flat portions SL10 and SL13 are provided along the mounting direction Y1.

[0120] Here, the guide grooves 141e, 141f will be described in detail with reference to Figures 12 and 13. The slider 141 is provided with a first guide groove 141e and a second guide groove 141f as guide grooves. The first movable member 410, which will be described later, is provided with a first protrusion 417. On the other hand, the second movable member 420 is provided with a second protrusion 427. The first guide groove 141e is a groove in which the first protrusion 417 is disposed. The second guide groove 141f is a groove in which the second protrusion 427 is disposed.

[0121] A first guide groove 141e is formed in the side wall portion 141c. A flat portion SL10 is formed between the first guide surfaces SF10 and SF20. The first guide surfaces SF10 and SF20 face each other and are surfaces along the Y direction. The first guide surfaces SF10 and SF20 are, for example, flat surfaces. The opening width of the flat portion SL10 corresponds to the distance between the first guide surfaces SF10 and SF20.

[0122] The inclined portion SL11 is formed between the first inclined surfaces SF11 and SF21. The first inclined surfaces SF11 and SF21 face each other and are inclined with respect to the Y direction. The inclined portion SL11 inclines in the upward direction Z1 as it approaches the mounting direction Y1. The opening width of the inclined portion SL11 corresponds to the distance between the first inclined surfaces SF11 and SF21.

[0123] The holding portion SL12 is formed between the first holding surfaces SF12 and SF22. The first holding surfaces SF12 and SF22 face each other and are surfaces along the Y direction. The holding portion SL12 may also include a surface that is continuous with the first holding surfaces SF12 and SF22. The surface that is continuous with the first holding surfaces SF12 and SF22 is the back surface of the first guide groove 141e. The holding portion SL12 is located below the flat portion SL10 in the downward direction Z2.

[0124] The opening width of the holding portion SL12 corresponds to the distance between the first holding surfaces SF12 and SF22. The opening widths of the flat portion SL10, the inclined portion SL11, and the holding portion SL12 correspond to the opening width of the first guide groove 141e.

[0125] A second guide groove 141f is formed in the side wall portion 141d. The flat portion SL13 is formed between the second guide surfaces SF13 and SF23. The second guide surfaces SF13 and SF23 face each other and are surfaces along the Y direction. The second guide surfaces SF13 and SF23 are, for example, flat surfaces. The opening width of the flat portion SL13 corresponds to the distance between the second guide surfaces SF13 and SF23.

[0126] The inclined portion SL14 is formed between the second inclined surfaces SF14 and SF24. The second inclined surfaces SF14 and SF24 face each other and are inclined with respect to the Y direction. The inclined portion SL14 inclines upward in the Z1 direction as it approaches the mounting direction Y1. The opening width of the inclined portion SL14 corresponds to the distance between the second inclined surfaces SF14 and SF24.

[0127] The holding portion SL15 is formed between the second holding surfaces SF15 and SF25. The second holding surfaces SF15 and SF25 face each other and are surfaces along the Y direction. The holding portion SL15 may also include a surface that is continuous with the second holding surfaces SF15 and SF25. The surface that is continuous with the second holding surfaces SF15 and SF25 is the back surface of the second guide groove 141f. The holding portion SL15 is located below the flat portion SL13 in the downward direction Z2.

[0128] The opening width of the holding portion SL15 corresponds to the distance between the second holding surfaces SF15 and SF25. The opening widths of the flat portion SL13, the inclined portion SL14, and the holding portion SL15 correspond to the opening width of the second guide groove 141f.

[0129] The opening width of each guide groove 141e, 141f is set to match the diameter (thickness) of the protrusions 417, 427. In other words, the opening width of each guide groove 141e, 141f is large enough to allow the corresponding protrusions 417, 427 to move. As will be explained later, the first protrusion 417 is made thicker than the second protrusion 427. Therefore, the opening width of the first guide groove 141e is wider than the opening width of the second guide groove 141f. However, if the thicknesses of the protrusions 417, 427 are the same, the opening widths of the guide grooves 141e, 141f may be the same.

[0130] As described above, the side wall portion 141c is disposed closer to the mounting direction Y1 than the side wall portion 141d. Therefore, when the electronic device 100 is mounted on the rack 200, the first guide groove 141e is inserted into the accommodation space IN1 before the second guide groove 141f.

[0131] Furthermore, the first guide groove 141e and the second guide groove 141f are provided at different positions in the Y direction. The first guide groove 141e is disposed further back in the mounting direction Y1 than the second guide groove 141f. Therefore, the first guide groove 141e can be said to be a guide groove disposed on the back side in the mounting direction Y1. On the other hand, the second guide groove 141f can be said to be a guide groove disposed on the front side in the mounting direction Y1.

[0132] In this way, the electronic device 100 has two guide grooves 141e and 141f on one end side in the X direction and two guide grooves 141e and 141f on the other end side. This allows the electronic device 100 to move the cooling plate 330 in the Z direction in a balanced manner. In other words, the electronic device 100 can move the cooling plate 330 while maintaining a parallel positional relationship between the opposing surfaces SF1 and SF4.

[0133] The imaginary center line of flat portion SL10 coincides with the imaginary center line of flat portion SL13 in the Z direction. The imaginary center line of holding portion SL12 coincides with the imaginary center line of holding portion SL15 in the Z direction. Each imaginary center line is an imaginary straight line that passes through the center of each portion SL10, SL12, SL13, and SL15 in the Z direction and extends along the Y direction.

[0134] 11 and other figures, the push-back member 142 is disposed in a space sandwiched between the side walls 141c, 141d and the side wall 141h. The push-back member 142 is provided to push back the slider 141 when the electronic device 100 is removed. As shown in FIG. 14, the push-back member 142 includes a rod-shaped portion 142a and a flange portion 142b protruding from the rod-shaped portion 142a.

[0135] On the other hand, the slider 141 is provided with a pressed portion 141g at an end on the mounting direction Y1 side. When the push-back member 142 moves in the removal direction Y2, the pressed portion 141g is pressed in the removal direction Y2 by the flange portion 142b. When the pressed portion 141g is pressed, the slider 141 moves in the removal direction Y2.

[0136] The electronic device 100 may include an elastically deformable member such as a spring instead of the push-back member 142. In other words, the electronic device 100 only needs to include a mechanism for moving the slider 141 in the removal direction Y2.

[0137] The push-back member 142 is also used to secure the electronic device 100 to the rack 200. The rod-shaped portion 142a has a male screw at the tip on the flange portion 142b side. The male screw engages with a female screw of a fixing portion 251 provided on the rack back portion 250. In other words, the rod-shaped portion 142a is screwed to the fixing portion 251 with the case back portion 133 positioned between the flange portion 142b and the rack back portion 250.

[0138] This fixes the push-back member 142 to the rack back 250. Then, by fixing the push-back member 142 to the rack back 250, the electronic device 100 is fixed to the rack 200. The electronic device 100 is fixed to the rack 200 by the push-back member 142 and the fixing screw 1.

[0139] However, the push-back member 142 does not necessarily have to include a mechanism for fixing the electronic device 100 and the rack 200 together.

[0140] <Holding member and movable member> Next, the holding member 260 and the movable members 410, 420 will be described with reference to Fig. 3, and Figs. 15 to 18. Note that Fig. 3 shows a simplified view of the holding member 260 and the movable members 410, 420. Fig. 18 shows a state in which the holding member 260 is not attached.

[0141] There are many common parts between the first movable member 410 and the second movable member 420. Therefore, the common parts will be described using the first movable member 410 or the second movable member 420.

[0142] 17, for the sake of simplicity, only a portion of the holding member 260 and the second movable member 420 is shown. The first movable member 410 has a sliding portion similar to the sliding portion 426. The first movable member 410 also has a spring receiving surface similar to the spring receiving surface 425a.

[0143] First, a description will be given of the holding members 260. As shown in Figures 15 and 18, the holding members 260 are provided at multiple locations on the rack side portion 210. The holding members 260 are fixed to the rack side portion 210 by screws, welding, or the like.

[0144] The holding members 260 are provided individually for the multiple movable members 410, 420. Therefore, the number of holding members 260 is the same as the number of movable members 410, 420. The holding members 260 are provided at four locations for one electronic device 100. In other words, as shown in FIG. 3 , four holding members 260 are provided for each stage of the rack 200.

[0145] 16, the holding member 260 includes a holding base 261 and holding side portions 262 provided on both ends of the holding base 261. In other words, the holding side portions 262 are provided on both sides of the holding base 261 in the Y direction. The holding base 261 and the two holding side portions 262 are provided, for example, as a single unit.

[0146] 17, the holding side portion 262 is provided with a slit 263 for holding the second movable member 420 in a state where it can move in the Z direction. A sliding portion 426, which is a part of the second movable member 420, is disposed in the slit 263. The second movable member 420 is movable in the Z direction with the sliding portion 426 disposed in the slit 263. In other words, the sliding portion 426 is slidable in the Z direction within the slit 263.

[0147] 16 and 17, the recess 264 is a bottomed hole with an opening in the upward direction Z1. A spring member SP1 mainly made of metal is placed in the recess 264. However, the spring member SP1 is not limited to being made of metal. Rubber or other materials may be used instead of the spring member SP1.

[0148] 17, the spring member SP1 is disposed between the second movable member 420 provided for the upper electronic device and the holding member 260 provided for the lower electronic device. The holding member 260 provided for the lower electronic device can be said to have a recess 254 in which the spring member SP1 is disposed. The second movable member 420 provided for the upper electronic device has a spring receiving surface 425a with which the spring member SP1 comes into contact. The spring member SP1 elastically deforms between the holding member 260 and the second movable member 420. The spring member SP1 constantly applies stress to the second movable member 420 in a direction that separates the electronic device 100 and the cooling plate 330. The separation direction corresponds to the Z1 direction.

[0149] The uppermost holding member 260 in the upward direction Z1 does not necessarily have to be provided with the recess 254. Furthermore, the uppermost holding member 260 does not necessarily have to have the spring member SP1 disposed in the recess 254.

[0150] 16 and 17, the holding member 260 has recesses 254 provided in each holding side portion 262. Therefore, the spring members SP1 are disposed on both sides of the holding base 261 in the Y direction. Note that it can also be said that the holding member 260 has recesses 254 provided on both sides of the second protrusion 427 in the mounting direction Y1. Therefore, it can also be said that the spring members SP1 are provided on both sides of the protrusions 417, 427 in the mounting direction Y1.

[0151] The spring member SP1 is a member that presses the second movable member 420 in the upward direction Z1. The upward direction Z1 corresponds to the opposite direction to the pressing direction in which the cooling plate 330 presses the heat conduction member 150. Therefore, the pressing direction here is the downward direction Z2.

[0152] The spring member SP1 is provided to maintain the position of the second movable member 420 in the Z direction in the unattached state. In other words, because the electronic control device 1000 includes the spring member SP1, it is easy to maintain the second movable member 420 in a predetermined position. This makes it easy to insert the electronic device 100 into the accommodation space IN1. In other words, when attaching the electronic device 100, the electronic control device 1000 makes it easy to align the positions of the guide grooves 141e, 141f and the protrusions 417, 427 in the Z direction. Furthermore, when attaching the electronic device 100 to the rack 200, the electronic control device 1000 makes it easy to position the protrusions 417, 427 in the guide grooves 141e, 141f, thereby improving the attachability of the electronic device 100 to the rack 200.

[0153] In the attached state, the spring member SP1 is pressed in the downward direction Z2 by the spring receiving surface 425a. This is because, in the attached state, the second movable member 420 moves in the downward direction Z2. This point will be described in detail later.

[0154] Next, a description will be given of the movable members 410 and 420. Figure 16 shows a state in which the cooling plate 330 is not attached.

[0155] 3, the movable members 410, 420 are attached to the four corners of the cooling plate 330. Therefore, four movable members 410, 420 are arranged on each shelf of the rack 200. In addition, two first movable members 410 and two second movable members 420 are attached to the cooling plate 330. As shown in FIG. 16, the first movable members 410 are arranged further back in the attachment direction Y1 than the second movable members 420.

[0156] 16, 17, and 18, the first movable member 410 includes a movable base 411 and movable side portions 412 provided on both ends of the movable base 411. In other words, the movable side portions 412 are provided on both sides of the movable base 411 in the Y direction. The movable base 411 and the two movable side portions 412 are provided, for example, as a single unit.

[0157] The movable base 411 includes a cooling fixing portion 413 and a first protrusion 417. The cooling fixing portion 413 is a portion that is fixed to the cooling plate 330. The cooling fixing portion 413 and the cooling plate 330 are fixed together by screwing, welding, or the like.

[0158] The first protrusions 417 are portions that protrude in the X direction relative to the movable base 411. The first protrusion 417 disposed on the right protrudes in the second outward direction X2. The first protrusion 417 disposed on the left protrudes in the first outward direction X1. The first protrusions 417 have a cylindrical shape.

[0159] The first protrusions 417 are provided corresponding to the first guide grooves 141e. The movable members 410, 420 fixed to one cooling plate 330 have the same number of protrusions 417, 427 as the number of guide grooves 141e, 141f, which correspond to the guide grooves 141e, 141f provided in one electronic device 100.

[0160] The first protrusion 417 is configured as a separate body from the movable base 411. The first protrusion 417 is attached to the movable base 411. However, the first protrusion 417 may be configured as an integral body with the movable base 411.

[0161] As shown in FIGS. 16 and 18 , the movable side portion 412 includes a cooling pressure portion 414 and a spring seat 415. The cooling pressure portion 414 is provided at the end of the movable side portion 412 on the upward Z1 side. The cooling pressure portion 414 is in contact with the auxiliary pressure portion 331 of the cooling plate 330. As described above, the first movable member 410 moves the cooling plate 330 in the downward Z2 direction while being fixed to the cooling plate 330. In other words, the first movable member 410 presses the cooling plate 330 downward Z2. The cooling pressure portion 414 is a portion that assists the pressing. By including the cooling pressure portion 414, the first movable member 410 can increase the pressing force on the cooling plate 330 in the downward Z2 direction. However, the first movable member 410 does not necessarily have to include the cooling pressure portion 414.

[0162] The second movable member 420 includes a movable base 421 and movable side portions 422 provided on both ends of the movable base 421. The movable base 421 includes a cooling fixing portion 423 and a second protrusion 427. The second protrusion 427 is provided in correspondence with the second guide groove 141f.

[0163] The movable side portion 422 includes a cooling pressing portion 424, a spring receiving portion 425, and a sliding portion 426. The spring receiving portion 425 has the spring receiving surface 425a as described above. The sliding portion 426 is a portion that is disposed in the slit 263 as described above. The sliding portion 426 is a portion that slides in the Z direction within the slit 263. The sliding portion 426 can also be said to be a flat portion that is disposed within the slit 263 and is movable within the slit 263.

[0164] 16, the first protrusion 417 is longer than the second protrusion 427. In other words, the second protrusion 427 arranged on the front side in the mounting direction Y1 is shorter than the first protrusion 417 arranged on the back side in the mounting direction Y1. This allows the electronic control device 1000 to insert the electronic device 100 while preventing the slide member 140 and the like from coming into contact with the second protrusion 427. In other words, the electronic control device 1000 can improve the guiding ability when inserting the electronic device 100 into the accommodation space IN1. Note that guiding ability can also be referred to as insertability or attachability.

[0165] Incidentally, a force is applied to the first protrusion 417 and the second protrusion 427 from the slider 141 when the cooling plate 330 is pressed down in the downward direction Z2. This force is also applied to the boundary between the first protrusion 417 and the movable base 411 and the boundary between the second protrusion 427 and the movable base 421. As described above, the first protrusion 417 is longer than the second protrusion 427. Therefore, a larger force is applied to the boundary between the first protrusion 417 and the movable base 411 than to the boundary between the second protrusion 427 and the movable base 421.

[0166] 16, first protrusion 417 has a larger diameter than second protrusion 427. This improves the strength of the boundary between first protrusion 417 and movable base 411. However, first protrusion 417 may have a diameter similar to that of second protrusion 427 as long as sufficient strength is ensured.

[0167] <Positioning member and base board> 19 to 28, positioning member 510 and base substrate 600 will be described. In order to make the relationship between positioning member 510 and wiring board 111 easier to understand, only one positioning member 510 and one wiring board 111 are shown in FIG. 25. For the same reason, the case of electronic device 100 is omitted. In FIGS. 27 and 28, inter-board connectors 113 and 611 are shown in a simplified form.

[0168] First, the base substrate 600 will be described with reference to Figures 19, 23, 25, etc. The base substrate 600 includes a wiring board 610, an inter-board connector 611, etc. The wiring board 610 has conductive wiring provided on an electrically insulating base material such as resin. The wiring board 610 is a so-called printed circuit board. When electrically connected to the electronic device 100, the wiring board 610 is disposed along the XZ plane. The XZ plane is a plane defined by the X axis and the Z axis. The state in which the wiring board 610 and the electronic device 100 are electrically connected is referred to as an inter-board connection state. Note that the wiring board 610 and the electronic device 100 are in an inter-board connection state, for example, when they are inserted into each other.

[0169] Wiring substrate 610 has a mounting surface SF5 on which inter-board connector 611 is mounted, and a surface SF6 opposite to mounting surface SF5. Inter-board connector 611 is electrically connected to wiring on wiring substrate 610. As shown in FIG. 25 , inter-board connector 611 is electrically connected to inter-board connector 113. That is, electronic device 100 is mounted on mounting surface SF5. Circuit elements such as semiconductor switching elements, resistor elements, and capacitor elements may also be mounted on wiring substrate 610.

[0170] The number of mountable electronic devices 100 is preset on the base substrate 600. In the present embodiment, as an example, the base substrate 600 is used which can mount four electronic devices 100. Therefore, the base substrate 600 is provided with the same number of inter-board connectors 611 as the number of mountable electronic devices 100.

[0171] The wiring board 610 is provided with a positioning hole 612. In the positioning hole 612, the first protrusion 520 of the positioning member 510 is placed in the connected state between the boards. The positioning hole 612 corresponds to the first positioning hole.

[0172] The positioning holes 612 are individually provided for each electronic device 100 mounted on the base substrate 600. Furthermore, in this embodiment, a positioning member 510 is provided for each electronic device 100. Therefore, the positioning holes 612 are individually provided corresponding to each positioning member 510.

[0173] Two positioning holes 612 are provided for one positioning member 510. One of the positioning holes 612 is provided for positioning the inter-board connectors 113, 611 in the X and Z directions. The other positioning hole 612 is provided for suppressing rotational misalignment. The rotational misalignment indicates that the base substrate 600 and the positioning member 510 rotate around the Y axis.

[0174] The positioning holes 612 are holes that penetrate the wiring substrate 610 in the thickness direction (Y direction). The positioning holes 612 are through holes provided along the Y direction. The thickness direction of the wiring substrate 610 corresponds to the distance between the mounting surface SF5 and the opposite surface SF6. The thickness direction of the wiring substrate 610 can also be said to be the thickness direction of the base substrate 600. The positioning holes 612 may be bottomed holes that open to the mounting surface SF5. In other words, the positioning holes 612 may be recessed portions.

[0175] Two positioning holes 612 corresponding to one positioning member 510 are provided at positions offset in the X direction. For example, two positioning holes 612 are provided on both sides in the X direction of inter-board connector 611. Furthermore, the positions of the two positioning holes 612 in the Z direction are the same.

[0176] Next, the positioning members 510 will be described with reference to Figs. 19 to 28. The positioning members 510 are individually provided for each electronic device 100 mounted on the base substrate 600. As shown in Fig. 19, the multiple positioning members 510 are stacked in the Z direction to form the positioning structure 500. The multiple positioning members 510 are provided as separate bodies.

[0177] 23, a plurality of positioning members 510 are arranged between a base substrate 600 and a plurality of electronic devices 100. The positioning members 510 are members that position inter-board connectors 611 of the base substrate 600 and inter-board connectors 113 of the electronic devices 100. The plurality of positioning members 510 have the same configuration. The following description will be given using a representative example of positioning member 510.

[0178] 19, 20, 23, 24, etc., positioning member 510 includes positioning base 511 provided with connector opening 512 and component arrangement hole 513. Connector opening 512 is a through-hole in which inter-board connector 611 is arranged. Component arrangement hole 513 is a through-hole in which push-back member 142 is arranged.

[0179] The positioning base 511 has a first protrusion 520 on the surface facing the base substrate 600. The first protrusion 520 protrudes in the mounting direction Y1 from the periphery. The first protrusion 520 is a protrusion for positioning with the base substrate 600. The first protrusion 520 is inserted into the positioning hole 612.

[0180] 20, 25, etc., positioning member 510 includes a first positioning portion 530 and a second positioning portion 540 on the surface facing electronic device 100. Second positioning portion 540 corresponds to a clamping portion.

[0181] The first positioning portion 530 includes a second protrusion 531 and a reinforcing portion 532 that protrudes in a direction intersecting the second protrusion 531. The second protrusion 531 is a protrusion for positioning the positioning member 510 and the wiring board 111. The second protrusion 531 is a portion that protrudes in the removal direction Y2 from the surrounding area. The second protrusion 531 can also be said to be a protrusion for positioning the board-to-board connector 611 and the board-to-board connector 113 in the X direction.

[0182] 26 , the case (case back 133) of the electronic device 100 is disposed between the positioning member 510 and the wiring board 1111. A portion of the second protrusion 531 is inserted into the first opening 133a and disposed on the wiring board 111 side. The second protrusion 531 is then inserted into the positioning slit 115. The second protrusion 531 has, for example, a flat plate shape extending in the Y direction from the positioning base 511. However, the second protrusion 531 may have any shape as long as it can be inserted into the positioning slit 115.

[0183] 28, the second protrusion 531 is provided coaxially with the central axis RL1 of the first protrusion 520. That is, the center line of the second protrusion 531 and the center line of the first protrusion 520 are arranged on the same straight line. The center line of the second protrusion 531 is an imaginary line that passes through the center of the second protrusion 531 in the X and Z directions and extends in the Y direction. The center line of the first protrusion 520 is an imaginary line that passes through the center of the first protrusion 520 in the X and Z directions and extends in the Y direction. Therefore, this imaginary line coincides with the central axis RL1.

[0184] The second protrusion 531 is inserted into the positioning slit 115 of the wiring board 111. Therefore, the center line of the second protrusion 531 can be considered to coincide with the center line of the positioning slit 115. The center line of the positioning slit 115 is an imaginary straight line that passes through the center of the positioning slit 115 in the X and Z directions and extends in the Y direction.

[0185] It can also be said that the axis extending in the Y direction of the first protrusion 520 is coaxial with the center line in the X and Z directions of the second protrusion 531. Furthermore, it can be said that the center line of the second protrusion 531 and the center line of the first protrusion 520 are aligned in the X and Z directions.

[0186] In this way, in the X direction, positioning slit 115 serves as the position reference for wiring board 111. On the other hand, for positioning member 510, second protrusion 531 serves as the position reference for wiring board 111. Also, for positioning member 510, first protrusion 520 serves as the position reference for base substrate 600. The position reference for wiring board 111 and the position reference for base substrate 600 are the same. The position reference for wiring board 111 can be considered to be the center line of positioning slit 115. The position reference for positioning member 510 can be considered to be central axis RL1.

[0187] 26 and other figures, positioning member 510 has only one second protrusion 531. Positioning member 510 has second protrusion 531 provided at only one location, which is inserted into positioning slit 115 provided in one wiring board 111. The positioning of inter-board connectors 113, 611 in the X direction is determined by only one second protrusion 531.

[0188] The reinforcing portion 532 is provided to reinforce the second protrusion 531. The reinforcing portion 532 is configured as an integral part with the second protrusion 531. The reinforcing portion 532 is provided, for example, at the end of the second protrusion 531. In this case, the first positioning portion 530 has a T-shape in cross section along the XZ plane. However, the reinforcing portion 532 is not limited to the above. The first positioning portion 530 does not necessarily have to include the reinforcing portion 532.

[0189] The second positioning section 540 is a section that sandwiches the electronic device 100 in the Z direction. The second positioning section 540 is a section for positioning the positioning member 510 and the wiring board 111. The second positioning section 540 can also be said to be a section for positioning the inter-board connectors 611 and 113 in the Z direction. The positioning member 510 is provided with a plurality of second positioning sections 540 for one electronic device 100.

[0190] The second positioning portion 540 includes a contact portion 541 and a reinforcing portion 542 that protrudes in a direction intersecting the contact portion 541. As shown in FIGS. 25 and 26, the contact portion 541 is a portion that protrudes in the removal direction Y2 relative to the surrounding area. The reinforcing portion 542 has the same configuration as the reinforcing portion 532. The reinforcing portion 542 does not necessarily have to be provided.

[0191] The contact portion 541 is a portion that comes into contact with the wiring board 111. More specifically, the contact portion 541 has a contact surface 541a that comes into contact with the wiring board 111 (SF2). The contact portion 541 has, for example, a flat plate shape extending in the Y direction from the positioning base 511. However, the contact portion 541 may have any shape as long as it can come into contact with one surface SF2 of the wiring board 111.

[0192] 20, 21, 22, etc., second positioning section 540 includes pressing member 543 provided at a position facing contact section 541. Pressing member 543 presses electronic device 100 (wiring board 111) between contact section 541 and pressing member 543. Pressing member 543 is a cantilevered leaf spring. Second positioning section 540 includes mounting section 544 to which pressing member 543 is attached. Mounting section 544 is provided, for example, as an integral part with positioning base 511. Note that pressing member 543 may also be a cantilevered leaf spring.

[0193] As shown in FIG. 26, a portion of contact portion 541 is inserted into second opening 133b and disposed on the wiring board 111 side. Contact surface 541a is in contact with one surface SF2 of wiring board 111. Meanwhile, pressing member 543 is disposed outside the case. Pressing member 543 is in contact with base 120 and presses base 120. Wiring board 111 is fixed to base 120. Therefore, pressing member 543 presses wiring board 111 via base 120. Furthermore, pressing member 543 presses wiring board 111 toward contact surface 541a.

[0194] In this way, second positioning portion 540 sandwiches wiring board 111 in the Z direction. Note that pressing member 543 may be inserted into the case and press the opposite surface SF3 of wiring board 111 directly.

[0195] 27, contact surface 541a is provided along central axis RL1 of first protrusion 520. Contact surface 541a coincides with central axis RL1 in the Z direction. That is, in the Z direction, one surface SF2 serves as a positioning reference (reference plane). The positioning reference of positioning member 510 is the central axis RL1 of first protrusion 520, as in the X direction. Furthermore, pressing member 543 presses wiring board 111 so that one surface SF2 coincides with central axis RL1.

[0196] The pressing member 543 may be provided as a separate member from the second positioning unit 540. It is only necessary for the pressing member 543 to be able to press the wiring board 111 so that the one surface SF2 and the central axis RL1 coincide with each other.

[0197] <Installation and removal> Next, the installation and removal of the electronic device 100 will be described with reference to Figures 29 to 34. Figures 29 to 31 mainly describe the positional relationship between the slider 141 and the protrusions 417 and 427 in each state, and the positions of the movable members 410 and 420. Therefore, in Figures 29 to 31, the description of the convex portion 180 and the concave portion 330a will be omitted. Figures 32 and 33 describe the states of the electronic device 100 in the non-inserted state and the installed state. Also, Figure 34 describes the state of the electronic device 100 in the middle of insertion. Note that the installation and removal of the electronic device 100 can be performed by a dealer, a worker at a factory, or the like.

[0198] First, the attachment of the electronic device 100 to the rack 200 will be described with reference to Figures 29 and 30. As shown in Figure 29, when the electronic device 100 is attached to the rack 200, the electronic device 100 is inserted into the accommodation space IN1 through the insertion opening IN2. The electronic device 100 is inserted with the heat conduction member 150 provided on the opposing surface SF1. Figure 29 shows the inserted state.

[0199] The electronic device 100 moves in the installation direction Y1 with the first protrusion 417 positioned on the flat portion SL10 and the second protrusion 427 positioned on the flat portion SL13. Then, the electronic device 100 is inserted deep into the accommodation space IN1. That is, the electronic device 100 moves to an installation position where the heat conduction member 150 faces the cooling plate 330 without contacting the cooling plate 330.

[0200] In this state, the male screw provided at the tip of the push-back member 142 is screwed into the fixing portion 251 provided on the rack back portion 250. Also, the electronic device 100 is fixed to the rack 200 with the fixing screw 1. In this way, the electronic device 100 is fixed to the rack 200.

[0201] In the inserted state, a part of the slider 141 is located outside the insertion slot IN2. Furthermore, the first protrusion 417 is located on the flat portion SL10, and the second protrusion 427 is located on the flat portion SL13. Therefore, the movable members 410, 420 do not move in the downward direction Z2. Therefore, the heat conduction member 150 is not in contact with the cooling plate 330 (opposing surface SF4). In other words, a clearance is formed between the heat conduction member 150 and the cooling plate 330 in the Z direction. Furthermore, the heat conduction member 150 is not compressed.

[0202] Next, as shown in Fig. 30, the cooling plate 330 is moved downward in the Z2 direction. After the electronic device 100 has moved to the mounting position, the positions of the protrusions 417, 427 are displaced from the inclined portions SL11, SL14 to the holding portions SL12, SL15, thereby moving the movable members 410, 420 so as to attract them. Fig. 30 shows the mounted state.

[0203] More specifically, with the electronic device 100 moved to the mounting position, the slider 141 is pushed in the mounting direction Y1. That is, after the electronic device 100 has moved to the mounting position, the slider 141 moves in the mounting direction Y1, thereby displacing the position of the first protrusion 417 from the inclined portion SL11 to the holding portion SL12. Similarly, the position of the second protrusion 427 is displaced from the inclined portion SL14 to the holding portion SL15. The slider 141 can be moved by an operator.

[0204] In this way, the positions of the protrusions 417, 427 are displaced from the inclined portions SL11, SL14 to the holding portions SL12, SL15. As a result, the movable members 410, 420 are pushed down in the downward direction Z2 by the slider 141. Therefore, the movable members 410, 420 move in the downward direction Z2.

[0205] Furthermore, the electronic device 100 is engaged with the rack 200 by arranging the protrusions 417, 427 on the holding portions SL12, SL15. Therefore, the position where the protrusion 417 contacts the first holding surface SF22 and the position where the protrusion 427 contacts the second holding surface SF25 correspond to the engagement position. The engagement position can also be said to be a position where the electronic device 100 contacts the rack 200, thereby restricting movement of the electronic device 100 in the Z direction. Therefore, the engagement position can be considered to be a position where the base 120 and the rack 200 contact in the Z direction. The position where the base 120 contacts the rack 200 is the rack bottom 240, for example.

[0206] The cooling plate 330 is fixed to the movable members 410 and 420. Therefore, the cooling plate 330 moves in the downward direction Z2 in accordance with the movement of the movable members 410 and 420. The cooling plate 330 comes into contact with the heat conduction member 150 by moving in the downward direction Z2. Furthermore, the cooling plate 330 compresses the heat conduction member 150 between itself and the electronic device 100.

[0207] Therefore, the heat conduction member 150 is in contact with the cooling plate 330 (opposing surface SF4). Furthermore, the heat conduction member 150 is pressed (compressed) in the Z direction by the electronic device 100 and the cooling plate 330. In this way, the electronic device 100 is attached to the rack 200 with the heat conduction member 150 in contact with both the electronic device 100 and the cooling plate 330.

[0208] As described above, in the attached state, the first protrusion 417 is located in the holding portion SL12, and the second protrusion 427 is located in the holding portion SL15. The protrusions 417, 427 are engaged with the holding portions SL12, SL15. Note that the movement of the slider 141 in the attachment direction Y1 is limited by the protrusions 417, 427 being disposed in the holding portions SL12, SL15.

[0209] The movement amount of the first protrusion 417 in the Z direction corresponds to the perpendicular distance between the flat portion SL10 and the holding portion SL12. Similarly, the movement amount of the second protrusion 427 in the Z direction corresponds to the perpendicular distance between the flat portion SL13 and the holding portion SL15. Note that both movement distances are the same. The perpendicular distance can also be said to be the distance between the flat portion SL10 and the holding portion SL12 in the Z direction.

[0210] Then, movement of the slider 141 in the mounting direction Y1 moves the cooling plate 330 by the orthogonal distance. The orthogonal distance is set according to the desired amount of compression (compression amount, compressive force) of the heat conduction member 150. The orthogonal distance for achieving the optimal compressive force can be set by experiment, simulation, or the like.

[0211] The orthogonal distance can also be set in consideration of the clearance to be secured when the electronic device 100 is attached to the rack 200. The inclination angles of the inclined portions SL11 and SL14 are set to angles that do not impede the movement of the slider 141.

[0212] Next, removal of the electronic device 100 from the rack 200 will be described with reference to Figure 31. First, the push-back member 142 is removed from the fixing portion 251. Then, the push-back member 142 is moved in the removal direction Y2. At this time, the push-back member 142 is moved in the removal direction Y2 with the flange portion 142b in contact with the pressed portion 141g. This causes the slider 141 to move in the removal direction Y2. That is, the slider 141 is pushed back in the removal direction Y2.

[0213] Then, as the slider 141 moves in the removal direction Y2, the position of the first protrusion 417 is displaced from the holding portion SL12 to the inclined portion SL11 and the flat portion SL10. Similarly, the position of the second protrusion 427 is displaced from the holding portion SL15 to the inclined portion SL14 and the flat portion SL13.

[0214] In this way, the positions of the protrusions 417, 427 are displaced from the holding portions SL12, SL15 to the flat portions SL10, SL13. As a result, the movable members 410, 420 are pushed upward in the Z1 direction from the slider 141. Furthermore, the cooling plate 330 moves upward in the Z1 direction in conjunction with the movement of the movable members 410, 420.

[0215] At this time, the first protrusion 417 is located on the flat portion SL10, and the second protrusion 427 is located on the flat portion SL13. The movable members 410 and 420 are moved in the upward direction Z1. Therefore, the heat conduction member 150 is separated from the cooling plate 330. In this state, the electronic device 100 can be removed from the rack 200 by moving the electronic device 100 in the removal direction Y2.

[0216] 32 and 33, the states of the electronic device 100 in the uninserted state and the attached state will be described. Here, as an example, an example is used in which the electronic device 100 is placed between the rack bottom 240 and the cooling plate 330. Also, as an example, the position where the surface SF0 of the base 120 contacts the surface SF41 of the rack bottom 240 is taken as the engagement position. Therefore, the engagement positions are the surfaces SF0 and SF41.

[0217] 32 denotes the distance Z10 between the engagement position and the cooling plate 330 (SF4) in the orthogonal direction. Therefore, the distance Z10 is the distance between SF41 and SF4 in the Z direction. Note that the distance Z10 can also be said to be the distance between the accommodation spaces IN1 in the Z direction.

[0218] In this embodiment, the cooling plate 330 moves in the upward direction Z1 and the downward direction Z2. That is, the distance Z10 differs between the non-inserted state and the attached state. Therefore, the distance Z10 in this embodiment is the distance between the engagement position SF41 and the opposing surface SF4 when the protrusions 417, 427 are arranged in the holding portions SL12, SL15 (attached state).

[0219] 32, the case upper part 130 has a flat shape when no voltage is applied. In other words, the facing surface SF1 is a flat surface. The shape of the case upper part 130 when no voltage is applied can also be referred to as the original shape, initial shape, or normal shape. Note that the case upper part 130 may have a shape in which the area facing the heat-generating component 112 is convex when no voltage is applied.

[0220] As described above, the case upper part 130 is configured to elastically deform when stress is applied. Therefore, as shown in FIG. 33, when stress is applied in the downward direction Z2, the case upper part 130 bends so that the facing surface SF1 becomes concave. In other words, when stress is applied in the downward direction Z2, the case upper part 130 deforms into a curved shape so that the area facing the heat-generating component 112 becomes concave. Note that when the stress is released in the downward direction Z2, the case upper part 130 returns to its original shape. In other words, when stress is released in the downward direction Z2, the curve of the case upper part 130 is released.

[0221] In the unattached state, no voltage is applied. On the other hand, in the attached state, voltage is applied in the downward direction Z2. Therefore, the thicknesses Z20 and Z21 of the electronic device 100 change between the uninserted state and the attached state. The electronic device 100 has different thicknesses in the Z direction in parts. In other words, the thicknesses Z20 and Z21 are the thicknesses in the Z direction of parts of the electronic device 100. The thicknesses Z20 and Z21 are the thicknesses from the engagement position SF0 in the Z direction to the surfaces of the heat dissipation members 150-170 that face the cooling plate 330.

[0222] In this embodiment, an example is adopted in which the heat conduction member 150 faces the cooling plate 330. Therefore, the thicknesses Z20 and Z21 are the thicknesses from the engagement position SF0 in the Z direction to the surface of the heat conduction member 150 facing the cooling plate 330.

[0223] The electronic device 100 does not necessarily have to be provided with the heat conduction member 150. Therefore, the thicknesses Z20 and Z21 can also be considered to be the thickness in the Z direction from the engagement position SF0 to the portion that comes into contact with the cooling plate 330 in the attached state. Furthermore, the thicknesses Z20 and Z21 can also be considered to be the thickness of the portion that undergoes the greatest displacement between the non-inserted state and the attached state.

[0224] 32, the symbol Z20 denotes the thickness of the electronic device 100 in the non-inserted state. The relationship between the thickness Z20 and the distance Z10 is Z20>Z10. That is, the electronic device 100 is configured so that the thickness Z20 is greater than the distance Z10 in the non-inserted state. Note that the portion of the electronic device 100 that first passes through the insertion opening IN2 may have a thickness smaller than the distance Z10 in the non-inserted state.

[0225] 33 indicates the thickness of the electronic device 100 in the attached state. The relationship between the thickness Z21 and the distance Z10 is Z21=Z10. That is, the electronic device 100 is configured so that the thickness Z21 is equal to the distance Z10 in the attached state. Note that the thickness of the electronic device 100, such as the periphery of the heat conduction member 150, may be smaller than the distance Z10 in the attached state.

[0226] In the mounted state of the electronic device 100, the heat dissipation members 150-170 are arranged to face the cooling plate 330. That is, the heat dissipation members 150-170 are arranged to face the cooling plate 330 in the perpendicular direction. Therefore, in the electronic device 100, the heat conduction member 150 is arranged to face the cooling plate 330. In addition, the heat conduction member 150 is in contact with the cooling plate 330.

[0227] 34, when the electronic device 100 is being inserted into the rack 200, the convex portion 180 prevents the heat dissipation member 150 from coming into contact with the cooling plate 330. The upper case portion 130 is bent in the same direction as in the attached state and is bent more than in the attached state.

[0228] Therefore, the electronic control device 1000 can prevent the heat conduction member 150 from being turned over or sheared by the cooling plate 330 when the electronic device 100 is inserted into or removed from the rack 200. Furthermore, the electronic control device 1000 improves the ease of insertion when inserting the electronic device 100 into the rack 200. Furthermore, the electronic control device 1000 makes it easier to clean the cooling plate 330 when inserting the electronic device 100 into the rack 200 again.

[0229] <Effects> As described above, the electronic control device 1000 has the above-described relationship between the thicknesses Z20 and Z21 of the electronic device 100 and the distance Z10 between the engagement position and the cooling plate. Therefore, in the attached state, the electronic control device 1000 can reliably bring the heat conduction member 150 into contact with the cooling plate.

[0230] Furthermore, in the mounted state of the electronic control device 1000, the heat dissipation members 150-170 are disposed to face the cooling plate in the orthogonal direction. The heat dissipation members 150-170 are disposed to face the heat-generating component 112 in the orthogonal direction. Therefore, in the electronic control device 1000, the heat-generating component 112 can be disposed to face the cooling plate via the heat dissipation members 150-170 in the orthogonal direction. In other words, the wide surface of the heat-generating component 112 is disposed to face the cooling plate via the heat dissipation members 150-170. Therefore, the electronic control device 1000 can improve the heat dissipation performance of the heat-generating component 112.

[0231] Furthermore, the electronic control device 1000 can prevent the temperature around the heat-generating component 112 in the electronic device 100 from becoming too high. Therefore, the electronic control device 1000 can prevent malfunctions caused by heat in the heat-generating component 112 and peripheral circuit elements.

[0232] Furthermore, in the attached state, the heat dissipation members 150-170 form a heat dissipation path from the heat-generating component 112 to the cooling plate 330. The electronic control device 1000 can transfer heat from the heat-generating component 112 to the cooling plate 330 via the heat dissipation members 150-170. Therefore, the electronic control device 1000 can efficiently cool the heat-generating component 112 with the cooling plate 330.

[0233] Furthermore, the electronic device 100 is configured such that, in the attached state, the case upper portion 130 presses the cooling plate 330 in the upward direction Z1. Therefore, in the attached state, the electronic control device 1000 can maintain the heat conduction member 150 and the cooling plate 330 in a state of constant contact. Furthermore, in the attached state, the electronic control device 1000 can shorten the distance between the case upper portion 130 and the cooling plate 330 by squeezing the heat dissipation member 150. Therefore, the electronic control device 1000 can improve the heat dissipation performance of the electronic device 100.

[0234] The electronic control device 1000 has a resin upper case 130. A resin upper case 130 is more flexible than a metal upper case 130 of the same thickness. Therefore, the electronic control device 1000 makes it easier to insert the electronic device 100 into the accommodation space IN1. Furthermore, by using a resin upper case 130 for the electronic control device 1000, costs can be reduced and weight can be reduced compared to when a metal upper case 130 is used.

[0235] Furthermore, the electronic control device 1000 is configured so that the electronic device 100 can be mounted on the rack 200. When mounted on the rack 200, the electronic device 100 is placed at a mounting position facing the cooling plate 330 with the heat conduction member 150 in contact with the electronic device 100. After being placed at the mounting position, the electronic device 100 displaces the positions of the protrusions 417, 427 from the inclined portions SL11, SL14 to the holding portions SL12, SL15.

[0236] As a result, the electronic device 100 is attached to the rack 200 with the heat conduction member 150 in contact with the cooling plate 330. Therefore, the electronic control device 1000 can prevent the heat conduction member 150 from being turned over or sheared when the electronic device 100 is attached to the rack 200. Furthermore, the electronic control device 1000 can also prevent other loads from being applied to the heat conduction member 150 from the electronic device 100 or the cooling plate 330 during attachment. In particular, since the electronic device 100 has the protrusion 180 on the case upper portion 130, the electronic device 100 can further prevent the heat conduction member 150 from being turned over or sheared, and other loads from being applied to the heat conduction member 150. Note that the electronic control device 1000 can achieve the same effect even if it does not include the positioning member 510 and the base substrate 600.

[0237] Electronic control device 1000 includes first protrusion 520 that positions base substrate 600 and positioning member 510, and second protrusion 531 that is provided coaxially with center axis RL1 of first protrusion 520 and that positions electronic device 100 and positioning member 510. Therefore, electronic control device 1000 does not need to consider the tolerance that arises when first protrusion 520 and second protrusion 531 are not coaxial. As a result, electronic control device 1000 can improve the relative positional accuracy of board-to-board connectors 113, 611.

[0238] Electronic control device 1000 includes contact portion 541 (contact surface 541a) provided along center axis RL1 of first protrusion 520. Therefore, electronic control device 1000 can further improve the relative positional accuracy of board-to-board connectors 113, 611.

[0239] Furthermore, the central axis RL1 of the first protrusion 520 of the positioning member 510 coincides with the reference position of the wiring board 111 in the X direction and with the reference plane of the wiring board 111 in the Z direction. This allows the electronic control device 1000 to connect the board-to-board connectors 113, 611 within the tolerance range. It can also be said that the positioning member 510 can connect the board-to-board connectors 113, 611 within the range of the floating amount of the floating connector. The electronic control device 1000 can achieve effects related to positioning even without including the slide member 140 or the movable members 410, 420.

[0240] Furthermore, by providing a separate positioning member 510 (four in this embodiment) for each electronic device 100, the distance from the point positioned by the positioning hole 612 and the first protrusion 520 for each electronic device 100 is shortened, which allows the dimensional tolerance to be set small, making it easier to fit within the tolerance range of the board-to-board connectors 113, 611.

[0241] Furthermore, in the electronic control device 1000, when the heat conduction member 150 is pressed, the protrusions 417, 427 of the movable members 410, 420 that hold the cooling plate 330 are held by the holding portions SL12, SL15 of the slider 141 of the electronic device 100. Therefore, the electronic control device 1000 can prevent the cooling plate 330 and the electronic device 100 from being separated due to the reaction force of the heat conduction member 150. Therefore, the electronic control device 1000 can be configured so that the heat conduction member 150 is in contact with the cooling plate 330 and the electronic device 100. Note that the electronic control device 1000 can achieve the same effect even if it does not include the positioning member 510 and the base substrate 600.

[0242] Furthermore, electronic device 100 is provided at its four corners with holding portions SL12 and SL15 that engage with protrusions 417 and 427. Therefore, electronic control device 1000 can compress heat conduction member 150 while maintaining a parallel positional relationship between opposing surfaces SF1 and SF4.

[0243] Note that this embodiment employs an example in which the heat conduction member 150 is provided as a preferred embodiment. However, the present disclosure does not necessarily require the heat conduction member 150. Even with this configuration, when mounting the electronic device 100 to the rack 200, the protrusions 417, 427 are displaced from the inclined portions SL11, SL14 to the holding portions SL12, SL15 after the electronic device 100 is positioned in a mounting position facing the cooling plate 330. By displacing the protrusions 417, 427 in this manner, the electronic device 100 is mounted to the rack 200 by moving the movable members 410, 420 in such a manner as to attract the movable members 410, 420. In other words, when mounting the electronic device 100 to the rack, the electronic device 100 can attract the cooling plate 330 to which the movable members 410, 420 are attached. Therefore, the electronic control device 1000 can bring the electronic device 100 and the cooling plate 330 closer to each other. As a result, the electronic control device 1000 can improve the cooling efficiency of the electronic device 100.

[0244] Furthermore, in this embodiment, second protrusion 531 is preferably provided coaxially with central axis RL1 of first protrusion 520. However, the present disclosure can also employ second protrusion 531 that is not coaxial with central axis RL1 of first protrusion 520. Even with this configuration, positioning member 510 includes first protrusion 520 that positions base substrate 600 and positioning member 510, and second protrusion 531 that positions electronic device 100 and positioning member 510. In other words, positioning member 510 includes both first protrusion 520 used for positioning with base substrate 600 and second protrusion 531 used for positioning with electronic device 100. Therefore, electronic control device 1000 can improve the relative positional accuracy of inter-board connectors 113, 611.

[0245] The configuration of the rack 200 is not limited to the above. The rack 200 only needs to have an accommodation space IN1 that accommodates the electronic device 100 and to be able to mount the cooling plate 330 that forms part of the accommodation space IN1. Therefore, the rack 200 does not need to be provided with the holding member 260, the movable members 410, 420, etc.

[0246] The configuration of electronic device 100 is not limited to the above. Electronic device 100 is inserted into accommodation space IN1 and engaged with rack 200, and may include wiring board 111, heat-generating component 112, a case, and heat dissipation members 150-170.

[0247] Therefore, the electronic device 100 does not need to be provided with the guide holding portion 131, the slide member 140, or the like. Furthermore, the case is not limited to a configuration having a cover including the base 120 and the case upper portion 130. The case need only be capable of accommodating the circuit board 10. The wiring board 111 need only be fixed to a portion of the case facing the one surface SF2. Furthermore, the wiring board 111 does not need to be fixed to the case upper portion 130. In other words, the wiring board 111 may be fixed to the base 120.

[0248] Therefore, the heat dissipation members 150 to 170 do not have to be provided on the case upper portion 130. The heat dissipation members 150 to 170 only need to be disposed opposite the heat generating component 112 in the orthogonal direction.

[0249] The electronic control device 1000 only needs to satisfy the above-described relationship between the thicknesses Z20, Z21 of the electronic device 100 and the distance Z10 between the engagement position and the cooling plate. This relationship can be satisfied by shaping the case upper part 130 so that the area facing the heat-generating component 112 is convex when no voltage is applied. Therefore, the heat sink 160 does not need to protrude from the case upper part 130. In other words, the heat sink 160 may have a thickness similar to that of the case upper part 130. The shape that causes the area facing the heat-generating component 112 to be convex is a shape as shown in FIG. 35.

[0250] Furthermore, the case upper part 130 (cover) may be made primarily of metal. That is, the case may include a metal case upper part 130. The metal case upper part 130 is preferably manufactured by forging.

[0251] The metal case upper part 130 is mainly composed of a metal with high thermal conductivity, such as aluminum or copper. The metal case upper part 130 does not necessarily have to include the heat sink 160. In addition, the portion of the metal case upper part 130 that faces the heat-generating component 112 or the portion that is in contact with the heat conduction member 170 can also be considered as the heat sink. Furthermore, in the metal case upper part 130, the plate thickness of the portion that faces the heat-generating component 112 may be thicker than the surrounding area.

[0252] The metal case upper part 130 can prevent a decrease in the flexural modulus due to the heat generated by the heat-generating component 112 and the temperature of the surrounding environment. In other words, the metal case upper part 130 is more likely to maintain the flexural modulus than the resin case upper part 130.

[0253] Therefore, even if the ambient temperature of case upper part 130 becomes high, case upper part 130 can easily maintain the reaction force pressing against cooling plate 330. In other words, case upper part 130 can easily maintain contact between heat conduction member 150 and cooling plate 330. Furthermore, even in a configuration that does not include spring member 190a, case upper part 130 can easily maintain contact between heat conduction member 150 and cooling plate 330.

[0254] (Second embodiment) Here, an electronic control device 1000 of a second embodiment will be described using Fig. 35 and Fig. 36. In the second embodiment, differences from the first embodiment will be mainly described. The second embodiment differs mainly in the configuration of the electronic device 100. Fig. 35 is a cross-sectional view corresponding to Fig. 32. Fig. 36 is a cross-sectional view corresponding to Fig. 33.

[0255] In this embodiment, as an example, a case including a case upper portion 130a corresponding to the upper case portion and a base 120 corresponding to the lower case portion is used. However, the case may be any case as long as it can accommodate the circuit board 10. A heat-generating component 112 is mounted on one surface SF2 of the wiring board 111. The wiring board 111 is fixed to the case upper portion 130a with the heat-generating component 112 disposed between the wiring board 111 and the case upper portion 130a.

[0256] 35, the electronic device 100 includes a spring member 190b. The spring member 190b is provided between the base 120 and the wiring board 111. The spring member 190b is provided in an area facing the heat-generating component 112 on the downward Z2 side.

[0257] In this embodiment, an example in which one spring member 190b is provided is adopted. However, the spring member 190b may be provided in multiple locations. For example, the spring member 190b may be provided at four corners or two diagonal locations in the area facing the heat-generating component 112 on the downward Z2 side. A leaf spring may also be used as the spring member 190b. The spring member 190b corresponds to an elastic member.

[0258] Unlike spring member 190a, spring member 190b always applies stress to wiring board 111 in the orthogonal direction. That is, in the attached state and the non-inserted state, spring member 190b is elastically deformed when force is applied from wiring board 111, and applies the reaction force to wiring board 111. Spring member 190b presses wiring board 111 in the upward direction Z1.

[0259] Case upper portion 130a is mainly composed of a metal with high thermal conductivity, such as aluminum or copper, and is therefore not provided with heat sink 160. Case upper portion 130a is designed to be elastically deformable.

[0260] Similar to the above embodiment, case upper portion 130a is provided with heat conduction members 150, 170 in the area facing heat-generating component 112. Heat conduction member 150 is in contact with facing surface SF1 of case upper portion 130a, at least in the attached state.

[0261] Heat conducting member 170 is provided between case upper portion 130a and heat generating component 112. As described above, wiring board 111 is pressed by spring member 190b. Therefore, heat conducting member 170 is in contact with heat generating component 112 and case upper portion 130a in both the uninserted state and the attached state.

[0262] Meanwhile, the reaction force of spring member 190b is applied to case upper portion 130a via wiring board 111, heat-generating component 112, and heat-conducting member 170. That is, case upper portion 130a is pressed in upward direction Z1. Therefore, as shown in FIG. 35, case upper portion 130a has a curved shape in which the area facing heat-generating component 112 is convex when no force is applied.

[0263] The case upper part 130a is configured to elastically deform when a voltage is applied. As shown in Fig. 36, when a voltage is applied in the downward direction Z2, the case upper part 130a deforms so that the facing surface SF1 becomes flat. When a voltage is applied in the downward direction Z2, the case upper part 130a may deform so that the area facing the heat-generating component 112 becomes concave or convex, which is smaller than when a voltage is not applied.

[0264] As in the above embodiment, the case upper portion 130a is in a non-voltage-applied state when the electronic device 100 is not attached, and is in a voltage-applied state in the downward direction Z2 when the electronic device 100 is attached. Therefore, the thicknesses Z20 and Z21 of the electronic device 100 change between the attached state and the uninserted state. The relationship between the thicknesses Z20 and Z21 of the electronic device 100 and the distance Z10 is the same as in the above embodiment.

[0265] Furthermore, electronic device 100 is configured such that, in the attached state, stress from spring member 190b is applied to wiring board 111. Therefore, in the attached state, electronic device 100 is configured such that a portion of case upper portion 130a facing heat-generating component 112 presses cooling plate 330 via heat-generating component 112. The portion facing heat-generating component 112 is a portion that faces heat-generating component 112 in a direction perpendicular to the heat-generating component 112.

[0266] The portion of case upper portion 130a facing heat-generating component 112 is provided with heat conduction member 150. Therefore, electronic device 100 is configured such that heat conduction member 150 presses cooling plate 330 when attached.

[0267] In this manner, in the mounted state of electronic control device 1000, stress from spring member 190b is applied to wiring board 111, causing the portion of case upper portion 130a that faces heat-generating component 112 in the orthogonal direction to press cooling plate 330. Therefore, in the mounted state of electronic control device 1000, the portion of case upper portion 130a that faces heat-generating component 112 in the orthogonal direction can be reliably brought into contact with cooling plate 330. Therefore, electronic control device 1000 can improve the heat dissipation performance of heat-generating component 112.

[0268] Furthermore, the electronic control device 1000 includes the spring member 190b, which makes it possible to prevent the pressing force of the case upper portion 130 on the cooling plate 330 from decreasing.

[0269] (Variation) Here, a modified electronic control device 1000 will be described with reference to Figure 37. The modified example will be described mainly with respect to the differences from the first embodiment. The modified example differs from the case upper part 130 mainly in the configurations of the case upper part 130b and the heat sink 160. In Figure 37, the heat conduction members 150, 170 are indicated by two-dot chain lines to make the recesses 130b1, 130b2 easier to understand.

[0270] 37, case upper portion 130b is provided with recesses 130b1 and 130b2. That is, case upper portion 130b is provided with heat sink 160 at a position recessed with respect to opposing surface SF1 and the surface opposite opposing surface SF1. Heat sink 160 is thinner than case upper portion 130b. Therefore, heat sink 160 does not protrude from case upper portion 130b in the Z direction.

[0271] The recesses 130b1 and 130b2 are bottomed holes with the surface of the heat sink 160 as their bottoms. The recesses 130b1 and 130b2 are surrounded by an annular wall surface of the case upper portion 130b. The recesses 130b1 and 130b2 are provided in at least a portion of the opposing area of ​​the heat-generating component 112. The heat conduction member 150 is disposed in the recess 130b1. The heat conduction member 170 is disposed in the recess 130b2. The heat conduction member 150 is disposed in the recess 130b1 and is in contact with the heat sink 160. The heat conduction member 170 is disposed in the recess 130b2 and is in contact with the heat sink 160.

[0272] In the electronic control device 1000 of this modification, the thicknesses Z20, Z21 of the electronic device 100 and the distance Z10 between the engagement position and the cooling plate have the same relationship as in the first embodiment. For example, in the non-inserted state, the electronic device 100 can also have the above relationship by curving the case upper portion 130b as in the second embodiment.

[0273] The electronic control device 1000 of the modified example can prevent the heat conduction members 150, 170 from shifting along the XY plane. Therefore, the electronic control device 1000 of the modified example can reliably form a heat dissipation path by the heat dissipation members 150-170 in the attached state. Therefore, the electronic control device 1000 can prevent a decrease in the heat dissipation performance of the heat-generating component 112 due to the heat conduction members 150, 170 being shifted.

[0274] Case upper portion 130b may be mainly composed of a metal with high thermal conductivity, such as aluminum or copper. In this case, case upper portion 130b may not be provided with heat sink 160. Recesses 130b1 and 130b2 are bottomed holes whose bottoms are at thin portions of case upper portion 130b. Case upper portion 130b may be provided with at least one of recesses 130b1 and 130b2.

[0275] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0276] (Technical thought 1) a rack (200) having an accommodation space (IN1); a cooling plate (330) forming a part of the receiving space; an electronic device (100) that is inserted into the housing space and engaged with the rack, the electronic device (100) having a wiring board (111), a heat-generating component (112) mounted on one surface (SF2) of the wiring board, a case (120, 130, 130b) that houses the wiring board and the heat-generating component, and a heat-dissipating member (150, 160, 170) provided in the case; the heat dissipation member is disposed opposite the heat-generating component in a direction perpendicular to the one surface, When the electronic device is not inserted into the storage space, the thickness from the engagement position in the orthogonal direction to the surface of the heat dissipation member facing the cooling plate is greater than the distance between the engagement position in the orthogonal direction and the cooling plate, and when the electronic device is inserted into the storage space and attached to the rack, the thickness is equal to the distance, and the heat dissipation member is positioned opposite the cooling plate in the orthogonal direction.

[0277] (Technical thought 2) The electronic control device according to Technical Idea 1, wherein the heat dissipation member includes a heat dissipation plate that protrudes from the case toward the cooling plate.

[0278] (Technical Thought 3) the case includes an upper case portion disposed between the wiring board and the cooling plate, and a lower case portion disposed opposite the upper case portion; The electronic control device according to Technical Idea 2, wherein the wiring board is fixed to the upper case portion with the heat-generating component disposed between the wiring board and the upper case portion.

[0279] (Technical Thought 4) the upper case portion is made primarily of resin, The electronic control device according to Technical Idea 3, wherein the heat sink is mainly composed of metal.

[0280] (Technical Thought 5) the heat dissipation member includes an external heat conduction member provided on the cooling plate side of the heat dissipation plate, and an internal heat conduction member provided on the heat-generating component side of the heat dissipation plate, An electronic control device as described in Technical Idea 4, wherein in the mounted state, the external heat conduction member is in contact with the heat sink and the cooling plate, and the internal heat conduction member is in contact with the heat sink and the heat-generating component.

[0281] (Technical Thought 6) The device further includes an auxiliary elastic member (190a) provided in the case and applying stress to the wiring board in the orthogonal direction, The electronic control device according to any one of Technical Ideas 1 to 5, wherein the auxiliary elastic member presses the wiring board toward the cooling plate.

[0282] (Technical Thought 7) a rack (200) having an accommodation space (IN1); a cooling plate (330) forming a part of the receiving space; an electronic device (100) that is inserted into the housing space and engaged with the rack, the electronic device having a wiring board (111), a heat-generating component (112) mounted on one surface (SF2) of the wiring board, a case (120, 130a) that houses the wiring board and the heat-generating component, and an elastic member (190b) that is provided in the case and constantly applies stress to the wiring board in a direction perpendicular to the one surface; When the electronic device is inserted into the storage space and attached to the rack, stress from the elastic member is applied to the wiring board, and the part of the case that faces the heat-generating component in the perpendicular direction presses against the cooling plate via the heat-generating component.

[0283] (Technical Thought 8) the case includes an upper case portion disposed between the wiring board and the cooling plate, and a lower case portion disposed opposite the upper case portion; The electronic control device according to Technical Idea 7, wherein the wiring board is fixed to the upper case portion with the heat-generating component disposed between the wiring board and the upper case portion.

[0284] (Technical Thought 9) The electronic control device according to Technical Idea 8, wherein the upper case portion is made primarily of metal.

[0285] (Technical Thought 10) An electronic control device described in any one of technical ideas 7 to 9, wherein when the electronic device is not inserted into the storage space, the thickness from the engagement position in the orthogonal direction to the surface of the case facing the cooling plate is greater than the distance between the engagement position in the orthogonal direction and the cooling plate, and when the electronic device is installed, the thickness is equal to the distance.

[0286] (Technical Thought 11) an external heat conduction member provided on the cooling plate side of the case, and an internal heat conduction member provided on the heat generating component side of the case, An electronic control device described in any one of technical ideas 7 to 10, wherein in the installed state, the external heat conduction member is in contact with the case and the cooling plate, and the internal heat conduction member is in contact with the case and the heat-generating component.

[0287] (Technical Thought 12) The electronic control device according to any one of Technical Ideas 3, 4, 8 and 9, wherein the wiring board is fixed to the upper case portion at a position adjacent to the heat-generating component.

[0288] (Technical Thought 13) the case is provided with a protrusion that protrudes beyond the external heat conduction member at a portion facing the cooling plate, the cooling plate is provided with a recessed portion recessed from the surrounding area, where the protruding portion is disposed when the electronic device is in the attached state; The electronic control device according to Technical Idea 5 or 11, wherein the protrusion is arranged on the insertion direction side of the external heat conduction member.

[0289] (Technical Thought 14) The protrusion is inclined so that the protrusion amount decreases in the insertion direction, The electronic control device according to Technical Idea 13, wherein the recess is inclined so that the recess depth decreases in the direction opposite to the insertion direction.

[0290] Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more, or less than one element are also within the scope and spirit of the present disclosure. [Explanation of symbols]

[0291] 100...electronic device, 111...wiring board, 112...heat-generating component, 150, 170...thermal conductive member, 160...heat sink, 120...base, 130, 130a, 130b...upper case, 200...rack, 330...cooling plate, 1000...electronic control device

Claims

1. a rack (200) having an accommodation space (IN1); a cooling plate (330) forming a part of the receiving space; an electronic device (100) that is inserted into the housing space and engaged with the rack, the electronic device having a wiring board (111), a heat-generating component (112) mounted on one surface (SF2) of the wiring board, a case (120, 130, 130b) that houses the wiring board and the heat-generating component, and a heat dissipation member (150, 160, 170) provided in the case; the heat dissipation member is disposed opposite the heat-generating component in a direction perpendicular to the one surface, When the electronic device is not inserted into the storage space, the thickness from the engagement position in the orthogonal direction to the surface of the heat dissipation member facing the cooling plate is greater than the distance between the engagement position in the orthogonal direction and the cooling plate, and when the electronic device is inserted into the storage space and attached to the rack, the thickness is equal to the distance, and the heat dissipation member is positioned opposite the cooling plate in the orthogonal direction.

2. 2. The electronic control device according to claim 1, wherein the heat dissipation member includes a heat dissipation plate provided on the case so as to protrude toward the cooling plate.

3. the case includes an upper case portion disposed between the wiring board and the cooling plate, and a lower case portion disposed opposite the upper case portion; The electronic control device according to claim 2 , wherein the wiring board is fixed to the upper case portion with the heat-generating component disposed between the wiring board and the upper case portion.

4. the upper case portion is made primarily of resin, 4. The electronic control device according to claim 3, wherein the heat sink is made primarily of metal.

5. the heat dissipation member includes an external heat conduction member provided on the cooling plate side of the heat dissipation plate, and an internal heat conduction member provided on the heat-generating component side of the heat dissipation plate, 5. The electronic control device according to claim 4, wherein, in the attached state, the external heat conducting member is in contact with the heat sink and the cooling plate, and the internal heat conducting member is in contact with the heat sink and the heat generating component.

6. The device further includes an auxiliary elastic member (190a) provided in the case and applying stress to the wiring board in the orthogonal direction, 6. The electronic control device according to claim 1, wherein the auxiliary elastic member presses the wiring board toward the cooling plate.

7. a rack (200) having an accommodation space (IN1); a cooling plate (330) forming a part of the receiving space; an electronic device (100) that is inserted into the housing space and engaged with the rack, the electronic device having a wiring board (111), a heat-generating component (112) mounted on one surface (SF2) of the wiring board, a case (120, 130a) that houses the wiring board and the heat-generating component, and an elastic member (190b) that is provided in the case and that constantly applies stress to the wiring board in a direction perpendicular to the one surface; When the electronic device is inserted into the storage space and attached to the rack, stress from the elastic member is applied to the wiring board, and the part of the case that faces the heat-generating component in the perpendicular direction presses against the cooling plate via the heat-generating component.

8. the case includes an upper case portion disposed between the wiring board and the cooling plate, and a lower case portion disposed opposite the upper case portion; The electronic control device according to claim 7 , wherein the wiring board is fixed to the upper case portion with the heat-generating component disposed between the wiring board and the upper case portion.

9. 9. The electronic control device according to claim 8, wherein the upper case portion is made primarily of metal.

10. An electronic control device as described in any one of claims 7 to 9, wherein when the electronic device is not inserted into the storage space, the thickness from the engagement position in the orthogonal direction to the surface of the case facing the cooling plate is greater than the distance between the engagement position in the orthogonal direction and the cooling plate, and when the electronic device is installed, the thickness is equal to the distance.

11. an external heat conduction member provided on the cooling plate side of the case, and an internal heat conduction member provided on the heat generating component side of the case, 8. The electronic control device according to claim 7, wherein, in the attached state, the external heat conducting member is in contact with the case and the cooling plate, and the internal heat conducting member is in contact with the case and the heat generating component.

12. 10. The electronic control device according to claim 3, wherein the wiring board is fixed to the upper case portion at a position adjacent to the heat-generating component.

13. the case is provided with a protrusion that protrudes beyond the external heat conduction member at a portion facing the cooling plate, the cooling plate is provided with a recessed portion recessed from the surrounding area, where the protruding portion is disposed when the electronic device is in the attached state; The electronic control device according to claim 5 or 11, wherein the protrusion is disposed on the insertion direction side of the external heat conduction member.

14. The protrusion is inclined so that the protrusion amount decreases in the insertion direction, The electronic control device according to claim 13, wherein the recess is inclined so that the recessed portion has a smaller depth in the direction opposite to the insertion direction.

Images