Positioning jig, grinding apparatus, and positioning method

Abstract

To provide a technique for improving positioning accuracy when aligning the center of an object with the center of a holding surface for holding a substrate.SOLUTION: The positioning jig includes a first placement portion, a second placement portion, and four or three contact portions. The first placement portion has a first straight line portion extending along a first perpendicular bisector of a line segment connecting a first set of two contact points, and positions a center of the object on the first perpendicular bisector by coming into contact with the object at the first straight line portion. The second placement portion includes a second straight line portion extending along a second perpendicular bisector of a line segment connecting a second set of two contact points, and positions a center of the object on the second perpendicular bisector by coming into contact with the object at the second straight line portion. The first perpendicular bisector and the second perpendicular bisector intersect each other as viewed from a direction perpendicular to the holding surface.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a positioning jig, a grinding device, and a positioning method. [Background technology]

[0002] The thickness measurement unit described in Patent Document 1 measures the thickness of the substrate after grinding. The thickness measurement unit is, for example, a non-contact laser displacement sensor. The thickness measurement unit is moved between a measurement position and a standby position by a movement mechanism. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Utility Model Registration No. 3240007 Summary of the Invention [Problem to be solved by the invention]

[0004] One embodiment of the present disclosure provides a technique for improving positioning accuracy when aligning the center of an object with the center of a holding surface that holds a substrate. [Means for solving the problem]

[0005] A positioning jig according to one embodiment of the present disclosure aligns the center of an object with the center of a holding surface of a holder having a circular holding surface for holding a substrate and a circumferential surface concentric with the holding surface. The positioning jig includes a first mounting portion placed on the holding surface of the holder, a second mounting portion placed separately from the first mounting portion on the holding surface of the holder, and four or three contact portions spaced apart along the circumferential surface of the holder and contacting the circumferential surface of the holder at different contact points. The first mounting portion holds two contact portions that contact a first set of two contact points and has a first straight line portion extending along a first perpendicular bisector of a line segment connecting the first set of two contact points. The first mounting portion contacts the object at the first straight line portion to position the center of the object on the first perpendicular bisector. The second mounting portion holds two contact portions that come into contact at a second set of two contact points, has a second straight line portion that extends along a second perpendicular bisector of a line segment connecting the second set of two contact points, and contacts the object at the second straight line portion to position the center of the object on the second perpendicular bisector. When viewed from a direction perpendicular to the holding surface, the first perpendicular bisector and the second perpendicular bisector intersect. [Effects of the Invention]

[0006] According to an embodiment of the present disclosure, it is possible to improve the positioning accuracy when aligning the center of an object with the center of a holding surface that holds a substrate. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing a grinding system according to one embodiment. [Figure 2] FIG. 2 is a side view of the grinding system shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view showing an example of a driving unit. [Figure 4] FIG. 4 is a plan view showing an example of the second measuring unit. [Figure 5] FIG. 5 is a cross-sectional view showing an example of the second measuring unit. [Figure 6] FIG. 6 is a plan view showing an example of a positioning jig. [Figure 7] FIG. 7 is a plan view showing the positioning jig in a state where the first placement section shown in FIG. 6 is turned upside down. [Figure 8] FIG. 8 is a plan view showing an example of a connecting portion. [Figure 9] FIG. 9 is a plan view showing an example of the third placement section. [Figure 10] FIG. 10 is a cross-sectional view showing an example of a recess in an object. [Figure 11] FIG. 11 is a plan view showing another example of the positioning jig. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that in each drawing, the same or similar components are denoted by the same reference numerals, and descriptions thereof may be omitted. In each drawing, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other, the X-axis direction and the Y-axis direction are horizontal, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction that is opposite to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction that is opposite to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction that is opposite to the positive Z-axis direction.

[0009] A grinding system 1 according to one embodiment will be described mainly with reference to Figs. 1 and 2. As shown in Fig. 1, the grinding system 1 includes a grinding apparatus 10 and a transport apparatus 40. As shown in Fig. 2, the grinding apparatus 10 grinds the substrate W by pressing a grinding tool T against the substrate W. In this specification, grinding includes polishing. The transport apparatus 40 transports the substrate W.

[0010] The grinding apparatus 10 includes, for example, four holders 11A to 11D, two drivers 12A to 12B, and a housing 13. The holders 11A to 11D hold the substrates W. Holding includes suction. The drivers 12A and 12B drive the grinding tool T. The housing 13 houses the holders 11A to 11D and the drivers 12A to 12B. The housing 13 prevents particles and mist generated during grinding from escaping to the outside. The housing 13 has a loading / unloading opening 13a. The substrates W are loaded from the outside of the housing 13 into the inside thereof or unloaded from the inside of the housing 13 to the outside thereof through the loading / unloading opening 13a.

[0011] The grinding apparatus 10 may include a nozzle 14 as shown in FIG. 2. The nozzle 14 is provided inside the housing 13. The nozzle 14 sprays gas from the nozzle 14 toward the opposite side of the loading / unloading port 13a of the housing 13, forming an airflow along the underside of the substrate W. The airflow removes the cleaning liquid or grinding liquid adhering to the underside of the substrate W. This can prevent the cleaning liquid or grinding liquid from being carried out of the housing 13 together with the substrate W.

[0012] The grinding device 10 may include a rotary table 15 as shown in FIG. 1. The rotary table 15 is provided inside the housing 13. The rotary table 15 is rotated around a rotation center line R1. Four holders 11A to 11D are provided at intervals around the rotation center line R1 of the rotary table 15 and rotate together with the rotary table 15. Furthermore, the four holders 11A to 11D are rotated independently around their respective rotation center lines R2 (see FIG. 2).

[0013] The two holders 11A, 11C are disposed symmetrically about the rotation center line R1 of the turntable 15. Each holder 11A, 11C moves between a first load / unload position A3, where the transport device 40 loads / unloads the substrate W, and a first grinding position A1, where the drive unit 12A grinds the substrate W with the grinding tool T. The two holders 11A, 11C move between the first load / unload position A3 and the first grinding position A1 every time the turntable 15 rotates 180°. At the first grinding position A1, a nozzle 16 (see FIG. 2) supplies a grinding fluid such as water to the upper surface of the substrate W when the substrate W is ground. The nozzle 16 is provided inside the housing 13.

[0014] The other two holders 11B, 11D are arranged symmetrically about the rotation center line R1 of the turntable 15. Each of the holders 11B, 11D moves between a second load / unload position A0, where the transport device 40 loads and unloads the substrate W, and a second grinding position A2, where the drive unit 12B grinds the substrate W with the grinding tool T. The other two holders 11B, 11D move between the second load / unload position A0 and the second grinding position A2 every time the turntable 15 rotates 180°. At the second grinding position A2, as with the first grinding position A1, a nozzle (not shown) supplies a grinding fluid such as water to the upper surface of the substrate W when the substrate W is ground.

[0015] When viewed from above, the first loading / unloading position A3, the second loading / unloading position A0, the first grinding position A1, and the second grinding position A2 are arranged in this order in a counterclockwise direction. In this case, when viewed from above, the holding portions 11A, 11B, 11C, and 11D are arranged in this order at 90° intervals in a counterclockwise direction.

[0016] The positions of the first loading / unloading position A3 and the second loading / unloading position A0 may be reversed, and the positions of the first grinding position A1 and the second grinding position A2 may also be reversed. That is, when viewed from above, the first loading / unloading position A3, the second loading / unloading position A0, the first grinding position A1, and the second grinding position A2 may be arranged in this order clockwise. In this case, when viewed from above, the holding units 11A, 11B, 11C, and 11D are arranged in this order clockwise at 90° intervals.

[0017] However, the number of holding parts is not limited to four, and the number of driving parts is not limited to two. Also, the rotary table 15 may be omitted. Instead of the rotary table 15, a slide table may be provided.

[0018] The transfer device 40 includes a transfer arm 41 that transfers the substrate W. The transfer arm 41 includes a suction pad 42 that adsorbs the substrate W. The suction pad 42 is capable of moving horizontally (in both the X-axis and Y-axis directions) and vertically, and of rotating about a vertical axis. The grinding system 1 may also include an inverting unit (not shown) that inverts the substrate W. The grinding system 1 may also include a cassette mounting unit (not shown) or a substrate mounting unit (not shown). The cassette mounting unit mounts a cassette that stores the substrate W. The substrate mounting unit mounts a substrate removed from the cassette. The transfer device 40 may unload the substrate W from a cassette mounted on the cassette mounting unit or from the substrate mounting unit. The transfer device 40 may also load the substrate W into a cassette mounted on the cassette mounting unit or into the substrate mounting unit.

[0019] The grinding system 1 includes a control circuit 90. The control circuit 90 is, for example, a computer. The control circuit 90 includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the grinding system 1. The control circuit 90 controls the operation of the grinding system 1 by having the arithmetic unit 91 execute the programs stored in the storage unit 92. A lower-level control circuit that controls the operation of each device that makes up the grinding system 1 may be provided, and a higher-level control circuit that controls multiple lower-level control circuits may be provided. The control circuit 90 may be configured with the lower-level control circuit and the higher-level control circuit.

[0020] The control circuit 90 includes electronic circuits such as a CPU, an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), and performs the various control operations described in this specification by executing instruction codes stored in memory or by being a circuit designed for a specific application.

[0021] An example of the operation of the grinding system 1 shown in Figures 1 and 2 will be described. The following operation is performed under the control of the control circuit 90. First, the transport device 40 unloads the substrate W from the cassette placed on the cassette loading section or from the substrate loading section, and transports the unloaded substrate W to a holder (e.g., holder 11C) located at the first load / unload position A3. The holder 11C holds the substrate W with the first main surface of the substrate W facing upward. Thereafter, the turntable 15 is rotated 180°, and the holder 11C is moved from the first load / unload position A3 to the first grinding position A1.

[0022] Next, the drive unit 12A drives the grinding tool T to grind the first main surface of the substrate W. Thereafter, the turntable 15 is rotated 180°, and the holder 11C is moved from the first grinding position A1 to the first carry-in / out position A3. Next, the transport device 40 receives the substrate W from the holder 11C located at the first carry-in / out position A3 and removes it from inside the housing 13 to the outside. Thereafter, the inversion unit inverts the substrate W upside down.

[0023] Next, the transfer device 40 transfers the substrate W to a holder (e.g., holder 11D) located at the second transfer position A0. The holder 11D holds the substrate W with the second main surface of the substrate W facing upward. The second main surface faces opposite the first main surface. Thereafter, the turntable 15 is rotated 180°, and the holder 11D is moved from the second transfer position A0 to the second grinding position A2.

[0024] Next, the drive unit 12B drives the grinding tool T to grind the second main surface of the substrate W. Thereafter, the turntable 15 is rotated 180°, and the holder 11D is moved from the second grinding position A2 to the second carry-in / out position A0. Subsequently, the transport device 40 receives the substrate W from the holder 11D located at the second carry-in / out position A0, and transports it from inside the housing 13 to the outside.

[0025] Here, the operation of the grinding system 1 has been described with a focus on one substrate W. The grinding system 1 may simultaneously perform multiple processes at multiple positions to improve throughput. For example, the grinding system 1 simultaneously grinds the substrate W at each of the first grinding position A1 and the second grinding position A2. Meanwhile, the grinding system 1 performs, in this order, spray cleaning of the substrate W, measurement of the thickness distribution of the substrate W, unloading of the substrate W, cleaning of the holding surface (upper surface) of the holder 11A, 11B, 11C, or 11D, and loading of the substrate W, for example, at each of the first load / unload position A3 and the second load / unload position A0.

[0026] Thereafter, the grinding system 1 rotates the turntable 15 by 180°. Subsequently, the grinding system 1 simultaneously grinds the substrate W again at each of the first grinding position A1 and the second grinding position A2. Meanwhile, the grinding system 1 again performs spray cleaning of the substrate W, measurement of the thickness distribution of the substrate W, unloading the substrate W, cleaning the holding surface (upper surface) of the holder 11A, 11B, 11C, or 11D, and loading the substrate W, in this order, at each of the first load / unload position A3 and the second load / unload position A0.

[0027] An example of the grinding apparatus 10 will be described again with reference to Fig. 3. The grinding apparatus 10 grinds the substrate W by pressing the grinding tool T against the substrate W. The grinding tool T includes, for example, a disk-shaped grinding wheel T1 and a plurality of grinding stones T2 arranged in a ring shape on the lower surface of the grinding wheel T1. The grinding stones T2 grind the substrate W.

[0028] The grinding apparatus 10 includes a holding unit 11A. The holding unit 11A has a holding surface 111 on its upper surface that holds the substrate W. The holding unit 11A holds the substrate W from the side opposite to the grinding tool T (i.e., from below). The holding unit 11A is, for example, a vacuum chuck, and includes a porous body 112 that forms the holding surface 111, and a pedestal 113 in which the porous body 112 is embedded. The holding surface 111 may be flat as shown in FIG. 3, or may be a conical surface to adjust the thickness distribution of the substrate W. The configurations of the holding units 11B to 11D shown in FIG. 1 are similar to the configuration of the holding unit 11A shown in FIG. 3, and therefore will not be described here.

[0029] The grinding apparatus 10 includes a second rotating unit 17. The second rotating unit 17 rotates the holding unit 11A. The second rotating unit 17 has, for example, a rotation motor 171 and a vertical rotation shaft 172 that is rotated by the rotation motor 171. The holding unit 11A is provided at the upper end of the rotation shaft 172. The rotation motor 171 rotates the holding unit 11A together with the rotation shaft 172. The rotation shaft 172 may be inclined to adjust the thickness distribution of the substrate W.

[0030] The grinding device 10 includes a drive unit 12A. The drive unit 12A drives a grinding tool T. The drive unit 12A has, for example, a rotation unit 121 and an elevation unit 125. The rotation unit 121 holds and rotates the grinding tool T. The elevation unit 125 elevates the grinding tool T together with the rotation unit 121. Note that the configuration of the drive unit 12B shown in FIG. 1 is similar to the configuration of the drive unit 12A shown in FIG. 3, and therefore description thereof will be omitted.

[0031] The rotating unit 121 has, for example, a rotary motor 122, a vertical spindle shaft 123 rotated by the rotary motor 122, and a flange 124 provided at the lower end of the spindle shaft 123. The flange 124 is disposed horizontally, and a grinding tool T is attached to its lower surface. The rotary motor 122 rotates the spindle shaft 123, thereby rotating the grinding tool T attached to the lower surface of the flange 124.

[0032] Elevating unit 125 has, for example, a vertical Z-axis guide 126, a Z-axis slider 127 that moves along Z-axis guide 126, and an elevating motor 128 that moves Z-axis slider 127. Rotary motor 122 is fixed to Z-axis slider 127 via a motor holder 129. Elevating unit 125 has a ball screw (not shown) that converts the rotational motion of elevating motor 128 into linear motion of Z-axis slider 127.

[0033] The grinding apparatus 10 includes a first measuring unit 18. The first measuring unit 18 measures the thickness of the substrate W held by the holder 11A. The first measuring unit 18 has, for example, a contact-type first gauge sensor 181 that measures the height of the upper surface of the substrate W, and a contact-type second gauge sensor 182 that measures the height of the holding surface 111 of the holder 11A. The difference in height between the upper surface of the substrate W and the holding surface 111 of the holder 11A is the thickness of the substrate W. The first measuring unit 18 transmits a signal indicating the thickness of the substrate W to the control circuit 90.

[0034] An example of the second measuring unit 19 will be described with reference to Figures 4 and 5. The grinding apparatus 10 is equipped with the second measuring unit 19. As shown in Figure 4, the second measuring unit 19 is provided at the first load / unload position A3, and irradiates light onto the substrate W held by the holder 11A or 11C. Note that the second measuring unit 19 may also be provided at the second load / unload position A0, as shown in Figure 1, and may irradiate light onto the substrate W held by the holder 11B or 11D. The second measuring unit 19 measures the height of the reflective surface of the substrate W by receiving light reflected by the reflective surface of the substrate W.

[0035] 5, the second measuring unit 19 irradiates the substrate W with light from above and receives the light reflected from the upper surface of the substrate W and the light reflected from the lower surface of the substrate W, thereby measuring the height difference between the upper and lower surfaces of the substrate W, i.e., the thickness of the substrate W. The second measuring unit 19 has, for example, a laser displacement meter. The laser displacement meter is, for example, of a spectral interference type or a confocal type. The second measuring unit 19 may be provided at the first grinding position A1 or the second grinding position A2.

[0036] The second measuring unit 19 has an irradiation head 191. The irradiation head 191 irradiates the substrate W with light for measuring the thickness of the substrate W. The irradiation head 191 has a housing 192 that houses an optical system (not shown), and a protrusion 193 provided on the bottom surface of the housing 192. The optical system includes, for example, a mirror. The protrusion 193 is used to position the irradiation head 191, which will be described later.

[0037] The grinding apparatus 10 may include a moving mechanism 20. The moving mechanism 20 moves the irradiation head 191 in the horizontal direction. The moving mechanism 20 moves the irradiation head 191 between directly above the center of the substrate W and directly above the periphery of the substrate W, so that the second measuring unit 19 can measure the thickness of the substrate W over the entire radial direction of the substrate W. The moving mechanism 20 may move the irradiation head 191 in the horizontal direction and the vertical direction.

[0038] The movement mechanism 20 has, for example, a rotating arm 201, a rotating shaft 202, and a driving source 203. The irradiation head 191 is provided on the rotating arm 201. The driving source 203 rotates the rotating arm 201 about the rotating shaft 202, thereby rotating the irradiation head 191 about the rotating shaft 202. The driving source 203 may raise and lower the rotating shaft 202, thereby raising and lowering the irradiation head 191.

[0039] As shown in Fig. 4, the rotating arm 201 is provided with an insertion hole 205 through which the shank of the bolt 204 is inserted. The diameter of the insertion hole 205 is larger than the diameter of the shank of the bolt 204. The number of insertion holes 205 is four in this embodiment, but is not limited to four. The shank of the bolt 204 passes through the insertion hole 205 of the rotating arm 201 and is screwed into a bolt hole on the top surface of the irradiation head 191. The bolt 204 fastens the irradiation head 191 to the rotating arm 201.

[0040] The insertion hole 205 is preferably an elongated hole that is long in the longitudinal direction of the rotating arm 201. The elongated hole allows movement of the irradiation head 191 in the longitudinal direction of the rotating arm 201, and restricts movement of the irradiation head 191 in the width direction of the rotating arm 201. By loosening the bolt 204 and moving the irradiation head 191 in the longitudinal direction of the rotating arm 201, the distance between the optical axis of the irradiation head 191 and the rotating shaft 202 can be adjusted.

[0041] The movement mechanism 20 may include a slider 206 on which the irradiation head 191 is provided, a guide 207 that guides the slider 206 in the longitudinal direction of the rotating arm 201, and a drive source 208 that moves the slider 206 along the guide 207. Note that the movement mechanism 20 may move the irradiation head 191 in the X-axis direction and the Y-axis direction instead of rotating the irradiation head 191.

[0042] An example of the positioning jig 30 will be described with reference to Figures 6 to 9. The positioning jig 30 aligns the center of the object 50 with the center of the holding surface 111 of the holding part 11. The holding part 11 is, for example, the holding part 11A, 11B, 11C, or 11D of the grinding apparatus 10. The holding part 11 may be mounted on an apparatus other than the grinding apparatus 10, such as an etching apparatus or a cleaning apparatus. The holding part 11 may have a circular holding surface 111 that holds the substrate W, and a circumferential surface 114 that is concentric with the holding surface 111.

[0043] The target object 50 is, for example, a protrusion 193 of the irradiation head 191 shown in Fig. 5. In this embodiment, the protrusion 193 is a part of the irradiation head 191, but it may be provided separately from the irradiation head 191. For example, the irradiation head 191 may have only a housing 192, and the protrusion 193 may be attached to the housing 192 in a manner that allows it to be separated from the housing 192.

[0044] As described above, the target object 50 may be the irradiation head 191 or an object detachably attached to the irradiation head 191. In this case, the positioning jig 30 can position the irradiation head 191 so that the optical axis of the irradiation head 191 passes through the center of the holding surface 111, and therefore so that the optical axis of the irradiation head 191 passes through the center of the substrate W.

[0045] 1 and 2, the target object 50 may be the suction pad 42 of the transport arm 41, or an object that can be detachably attached to the suction pad 42. In this case, the positioning jig 30 can position the suction pad 42 so that the center of the suction pad 42 coincides with the center of the holding surface 111, and therefore so that the center of the substrate W coincides with the center of the holding surface 111.

[0046] The target object 50 may be an object that can be detachably attached to the irradiation head 191 and also detachably attached to the suction pad 42. The positioning of the irradiation head 191 and the positioning of the suction pad 42 can be performed using one target object 50. Consequently, the positioning of the irradiation head 191 and the positioning of the suction pad 42 can be performed using one positioning jig 30.

[0047] 6, the positioning jig 30 includes a first mounting portion 31, a second mounting portion 32, and four contact portions 33. The four contact portions 33 are provided at intervals along the circumferential surface 114 of the holding portion 11 and contact the circumferential surface 114 at different contact points. Each contact portion 33 has, for example, a cylindrical pin. The outer peripheral surface of the pin contacts the circumferential surface 114 of the holding portion 11.

[0048] The first mounting portion 31 is placed on the holding surface 111 of the holder 11. The first mounting portion 31 protrudes outward from the holding surface 111 and holds two contact portions 33 that come into contact at a first set of two contact points. The first mounting portion 31 has a first straight portion 311. The first straight portion 311 extends along a first perpendicular bisector L1 of a line segment connecting the first set of two contact points. The first mounting portion 31 contacts the object 50 at the first straight portion 311, thereby positioning the center of the object 50 on the first perpendicular bisector L1.

[0049] The second mounting portion 32 is placed on the holding surface 111 of the holder 11 separately from the first mounting portion 31. The second mounting portion 32 protrudes outward from the holding surface 111 and holds two contact portions 33 that make contact at a second set of two contact points. The second mounting portion 32 has a second straight portion 321. The second straight portion 321 extends along a second perpendicular bisector L2 of a line segment connecting the two contact points in the second set. The two contact points in the second set are a different combination from the two contact points in the first set. When viewed from a direction perpendicular to the holding surface 111, the first perpendicular bisector L1 and the second perpendicular bisector L2 intersect. The second mounting portion 32 contacts the object 50 at the second straight portion 321, thereby positioning the center of the object 50 on the second perpendicular bisector L2.

[0050] The first perpendicular bisector L1 and the second perpendicular bisector L2 are each the perpendicular bisector of a chord that connects two contact points on the circumferential surface 114 of the holding portion 11. Generally, the perpendicular bisector of a chord of a circle passes through the center of the circle. Therefore, the first perpendicular bisector L1 and the second perpendicular bisector L2 each pass through the center of the circumferential surface 114. The center of the circumferential surface 114 and the center of the holding surface 111 coincide with each other. Therefore, the intersection of the first perpendicular bisector L1 and the second perpendicular bisector L2 is the center of the holding surface 111.

[0051] When the object 50 comes into contact with both the first straight line portion 311 and the second straight line portion 321, the first straight line portion 311 positions the center of the object 50 on the first perpendicular bisector L1, and the second straight line portion 321 positions the center of the object 50 on the second perpendicular bisector L2. The intersection of the first perpendicular bisector L1 and the second perpendicular bisector L2 is the center of the holding surface 111. Therefore, the center of the object 50 coincides with the center of the holding surface 111.

[0052] The object 50 has a side surface that contacts both the first straight line portion 311 and the second straight line portion 321. The object 50 is preferably cylindrical, and the side surface of the object 50 is preferably a circumferential surface. If the side surface of the object 50 is a circumferential surface, the object 50 can contact both the first straight line portion 311 and the second straight line portion 321 regardless of the angle θ between the first perpendicular bisector L1 and the second perpendicular bisector L2.

[0053] Note that if the angle θ between the first perpendicular bisector L1 and the second perpendicular bisector L2 is predetermined, the side surface of the object 50 does not have to be a circumferential surface. For example, if θ is 90°, the object 50 may be a rectangular parallelepiped. Furthermore, the first mounting portion 31 and the second mounting portion 32 may have flat surfaces 312 and 322 that contact each other so that θ becomes a desired value.

[0054] Instead of the positioning jig 30, it is possible to use a jig including a ring cover (not shown). The ring cover has an inner peripheral surface that completely surrounds the circumferential surface 114 of the holder 11. From the viewpoint of processing tolerances, the diameter of the inner peripheral surface of the ring cover is set to be larger than the diameter of the circumferential surface 114 of the holder 11. This results in play between the inner peripheral surface of the ring cover and the circumferential surface 114 of the holder 11.

[0055] According to this embodiment, the first mounting portion 31 contacts the holding surface 111 of the holder 11 at a first set of two contact points. Similarly, the second mounting portion 32 contacts the holding surface 111 of the holder 11 at a second set of two contact points. At this time, no play occurs. Furthermore, the first mounting portion 31 positions the center of the object 50 on the first perpendicular bisector L1, and the second mounting portion 32 positions the center of the object 50 on the second perpendicular bisector L2. Therefore, the positioning accuracy when aligning the center of the object 50 with the center of the holding surface 111 can be improved.

[0056] As shown in FIG. 6, the first mounting portion 31 includes a first plate 310. The first plate 310 includes a first piece 310a having a first linear portion 311, a second piece 310b extending from the first piece 310a in a direction perpendicular to the first linear portion 311, and a third piece 310c extending from the first piece 310a in the opposite direction to the second piece 310b. The first linear portion 311 is formed, for example, in a notch in the first piece 310a. The second piece 310b and the third piece 310c each hold a contact portion 33. When the first plate 310 includes the first piece 310a, the second piece 310b, and the third piece 310c, as shown in FIG. 7, even if the first plate 310 is turned upside down, the first linear portion 311 contacts the object 50, thereby allowing the center of the object 50 to be positioned on the first perpendicular bisector L1.

[0057] The second mounting portion 32 has a second plate 320. The second plate 320 has a fourth piece 320a having a second linear portion 321, a fifth piece 320b extending from the fourth piece 320a in a direction perpendicular to the second linear portion 321, and a sixth piece 320c extending from the fourth piece 320a in the opposite direction to the fifth piece 320b. The second linear portion 321 is formed, for example, in a notch in the fourth piece 320a. The fifth piece 320b and the sixth piece 320c each hold a contact portion 33. When the second plate 320 has the fourth piece 320a, the fifth piece 320b, and the sixth piece 320c, even if the second plate 320 is turned upside down (not shown), the second linear portion 321 comes into contact with the object 50, thereby allowing the center of the object 50 to be positioned on the second perpendicular bisector L2.

[0058] 8, the positioning jig 30 may include a connecting portion 34. The connecting portion 34 connects the first mounting portion 31 and the second mounting portion 32. The connecting portion 34 can prevent misalignment between the first mounting portion 31 and the second mounting portion 32. It is preferable that the connecting portion 34 connects the first mounting portion 31 and the second mounting portion 32 with the flat surface 312 of the first mounting portion 31 and the flat surface 322 of the second mounting portion 32 in contact with each other.

[0059] The connecting portion 34 has, for example, a third plate 340 and a plurality of bolts 341. The third plate 340 is placed on both the first plate 310 and the second plate 320. One bolt 341 fastens the third plate 340 to the first plate 310. Another bolt 341 fastens the third plate 340 to the second plate 320. The number of bolts 341 is not particularly limited.

[0060] As shown in FIG. 9, the positioning jig 30 may include a third mounting section 35. The third mounting section 35 is placed on the holding surface 111 of the holder 11 separately from the first mounting section 31 and the second mounting section 32. When placed on the holding surface 111 of the holder 11, the third mounting section 35 has a vertical surface 351 that is perpendicular to the holding surface 111. The third mounting section 35 may be used at the first carry-in / out position A3 as shown in FIG. 9, or may be used at the second carry-in / out position A0 (see FIG. 1), although not shown.

[0061] The first mounting portion 31 has a third straight portion 313 along the first perpendicular bisector L1. The third mounting portion 35 contacts both the third straight portion 313 and the swivel arm 201 at a vertical surface 351. This allows the side surface of the third straight portion 313 and the side surface of the swivel arm 201 to be flush with each other, and the longitudinal direction of the swivel arm 201 can be positioned parallel to the first perpendicular bisector L1.

[0062] The second mounting portion 32 has a fourth straight portion 323 along the second perpendicular bisector L2. The third mounting portion 35 may contact both the fourth straight portion 323 and the swivel arm 201 on the vertical surface 351 (not shown). This allows the side surface of the fourth straight portion 323 to be flush with the side surface of the swivel arm 201, and the longitudinal direction of the swivel arm 201 to be positioned parallel to the second perpendicular bisector L2.

[0063] 10 , the object 50 may be an object that reflects light toward the irradiation head 191. By using the light reflected by the object 50 toward the irradiation head 191, the irradiation head 191 can be positioned so that the optical axis of the irradiation head 191 passes through the center of the object 50. In this case, the object 50 is spaced apart from the irradiation head 191.

[0064] When the object 50 is away from the irradiation head 191, the worker or the work robot performs the positioning of the object 50 and then the positioning of the irradiation head 191. With the optical axis of the irradiation head 191 deviated from the center of the holding surface 111, the worker or the work robot can align the center of the object 50 with the center of the holding surface 111, and the object 50 can be easily seen during the positioning operation.

[0065] The object 50 preferably has a recess 52 indicating the center of the object 50 on the surface 51 of the object 50 facing the irradiation head 191. In this embodiment, the recess 52 is a through hole, but it may also be a hole with a bottom. The diameter of the recess 52 is preferably approximately the same as the diameter of the light. When the second measurement unit 19 measures the height of the light reflecting surface, the optical axis of the irradiation head 191 can be aligned with the center of the object 50 by utilizing the fact that the height of the light reflecting surface changes depending on the recess 52. The movement mechanism 20 can move the optical axis of the irradiation head 191 toward the center of the object 50 under the control of the control circuit 90.

[0066] The target object 50 may have a convex portion (not shown) instead of the concave portion 52. By utilizing the fact that the height of the light reflecting surface varies depending on the convex portion, the optical axis of the irradiation head 191 can be aligned with the center of the target object 50. However, unlike the convex portion, the concave portion 52 can prevent interference with surrounding components and improve workability.

[0067] The object 50 may have a mirror instead of the recessed portion 52 or the protruding portion. By utilizing the change in the reflected intensity of light, the optical axis of the irradiation head 191 can be aligned with the center of the object 50. The mirror may be used in combination with the recessed portion 52 or the protruding portion, or may be provided on the bottom surface of the recessed portion 52 or the top surface of the protruding portion.

[0068] 11 , the number of contact portions 33 may be three. Of the three contact portions 33, one contact portion 33 is held by both the first placement portion 31 and the second placement portion 32. Not only can the number of contact portions 33 be reduced, but the contact portion 33 can also connect the first placement portion 31 and the second placement portion 32.

[0069] The contact portion 33 may connect the first mounting portion 31 and the second mounting portion 32 so that the angle θ between the first perpendicular bisector L1 and the second perpendicular bisector L2 is changeable. θ changes when the first mounting portion 31 and the second mounting portion 32 rotate relatively around one contact portion 33. Alternatively, the first mounting portion 31 and the second mounting portion 32 may be fixed so that θ does not change.

[0070] Although the embodiments of the positioning jig, grinding device, and positioning method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure. [Explanation of symbols]

[0071] 10 Grinding equipment 11 Holding part 111 Holding surface 114 Circumferential Surface 30 Positioning jig 31 First placement section 311 1st straight section 32 Second placement section 321 2nd straight section 33 Contact area 50 Objects L1 1st perpendicular bisector L2 second perpendicular bisector W substrate

Claims

1. A positioning jig that aligns a center of an object with a center of a holding surface of a holding part having a circular holding surface that holds a substrate and a circumferential surface that is concentric with the holding surface, a first placement portion placed on the holding surface of the holding portion; a second mounting portion that is placed on the holding surface of the holding portion separately from the first mounting portion; four or three contact portions provided at intervals along the circumferential surface of the holding portion and contacting the circumferential surface of the holding portion at different contact points from one another; Equipped with the first mounting portion holds two contact portions that contact a first set of two contact points, has a first straight line portion that extends along a first perpendicular bisector of a line segment that connects the first set of two contact points, and contacts the object at the first straight line portion to position the center of the object on the first perpendicular bisector; the second mounting portion holds two contact portions that contact at the two contact points of the second set, has a second straight line portion that extends along a second perpendicular bisector of a line segment that connects the two contact points of the second set, and by contacting the object at the second straight line portion, positions the center of the object on the second perpendicular bisector; The positioning jig has the first perpendicular bisector and the second perpendicular bisector intersecting when viewed from a direction perpendicular to the holding surface.

2. the first mounting portion has a first plate, the first plate includes a first piece having the first linear portion, a second piece extending from the first piece in a direction perpendicular to the first linear portion, and a third piece extending from the first piece in a direction opposite to the second piece, The positioning jig according to claim 1 , wherein the second piece and the third piece each hold the contact portion.

3. The positioning jig according to claim 1 , further comprising a connecting portion that connects the first mounting portion and the second mounting portion.

4. 2. The positioning jig according to claim 1, wherein the target object is an irradiation head that irradiates the substrate with light for measuring the thickness of the substrate, or an object that is detachably attached to the irradiation head.

5. The positioning jig according to claim 1 , wherein the object is an object that reflects light to an irradiation head that irradiates the substrate with light for measuring the thickness of the substrate.

6. The positioning jig according to claim 5 , wherein the target object has a recess or a protrusion that indicates a center of the target object on a surface of the target object facing the irradiation head.

7. 2. The positioning jig according to claim 1, wherein the object is a suction pad of a transport arm that transports the substrate, or an object that is detachably attached to the suction pad.

8. a third mounting portion that is placed on the holding surface of the holding portion, separate from the first mounting portion and the second mounting portion; the first mounting portion has a third straight line portion along the first perpendicular bisector, or the second mounting portion has a fourth straight line portion along the second perpendicular bisector; the third placement portion has a vertical surface that is perpendicular to the holding surface when placed on the holding surface of the holding portion, 2. The positioning jig according to claim 1, wherein the third mounting portion contacts both the third linear portion or the fourth linear portion and a rotating arm that holds an irradiation head that irradiates the substrate with light for measuring the thickness of the substrate on the vertical plane.

9. A grinding device comprising: the positioning jig according to any one of claims 1 to 8; the holding unit; and a drive unit that drives a grinding tool that grinds the substrate.

10. A positioning method, comprising: aligning a center of the object with a center of the holding surface of the holding portion using the positioning jig according to any one of claims 1 to 8.

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