Deposition apparatus for display device and deposition method for display device

Abstract

To provide a vapor deposition apparatus for a display device and a vapor deposition method for the display device, capable of minimizing manufacturing cost, tact time and alignment failure.SOLUTION: The vapor deposition device includes a chamber 100, a deposition source 200 in the chamber, a stage 250 on the deposition source, mask structures 340 on the stage, substrate trays 700 on the mask structures, magnet plates 800 on the substrate trays, a transfer track 500 passing through a first gate G1 of the chamber and a second gate G2 of the chamber and disposed inside and outside the chamber, first carriers 1600 for transferring the mask structures along the transfer track, and second carriers 2600 for transferring the substrate trays along the transfer track.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One embodiment relates to a deposition apparatus for a display device, and more particularly to a deposition apparatus for a display device and a deposition method for a display device that can minimize manufacturing costs, takt time, and alignment defects. [Background technology]

[0002] Organic light emitting diode displays (OLEDs) have self-luminous properties and, unlike liquid crystal displays (LCDs), do not require a separate light source, which allows for reduced thickness and weight. Furthermore, OLEDs offer high-quality features such as low power consumption, high brightness, and fast response speed, making them a promising next-generation display for portable electronic devices. Summary of the Invention [Problem to be solved by the invention]

[0003] An object of one embodiment is to provide a deposition apparatus and a deposition method for a display device that can minimize manufacturing costs, takt time, and alignment defects.

[0004] The problems to be solved by the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0005] According to one embodiment of the present invention, a deposition apparatus for a display device includes a chamber, a deposition source in the chamber, a stage above the deposition source, a mask structure on the stage, a substrate tray on the mask structure, a magnetic plate on the substrate tray, a transport track that passes through a first gate of the chamber and a second gate of the chamber and is disposed inside and outside the chamber, a first carrier that transports the mask structure along the transport track, and a second carrier that transports the substrate tray along the transport track.

[0006] According to one embodiment of the present invention, there is provided a vapor deposition method for a display device, comprising the steps of: arranging a vapor deposition source, a stage, a first driving mechanism, a magnet plate attached to the first driving mechanism, a second driving mechanism, a pusher, and a transport track between a first inner wall and a second inner wall of the chamber; moving a first carrier carrying a mask structure including a mask along the transport track to load it into the chamber; attaching the second driving mechanism to the mask structure in the first carrier; pressing the first carrier with the pusher to lower the first carrier and a support member of the first carrier, thereby releasing a binding force of the support member of the first carrier on the mask structure; moving the second driving mechanism to separate the mask structure from the first carrier; moving the second driving mechanism toward the stage to place the mask structure on the stage; moving the pusher to its original position; moving the first carrier along the transport track to unload it outside the chamber; moving a second carrier, on which a substrate tray containing substrates is loaded, along the transport track to load it into the chamber; attaching the second driving mechanism to the substrate tray in the second carrier; pressing the second carrier with the pusher to lower the second carrier and the support member of the second carrier, thereby releasing the restraining force of the support member of the second carrier on the substrate tray; moving the second driving mechanism to which the substrate tray is attached, to separate the substrate tray from the second carrier; moving the second driving mechanism toward a mask structure on the stage to position the substrate tray on the mask structure; moving the first driving mechanism toward the substrate tray to position a magnet plate on the substrate tray; and depositing a deposition material from the deposition source onto the substrate through the mask of the mask structure.

[0007] Specific details of other embodiments are included in the detailed description and drawings. [Effects of the Invention]

[0008] According to an embodiment of the deposition apparatus for a display device and the deposition method for a display device, the manufacturing cost of the deposition apparatus, the takt time, and alignment defects can be minimized.

[0009] It should be noted that the effects obtained from the present invention are not limited to those described above, and other effects not mentioned will be clearly understood by those having ordinary skill in the technical field to which the present invention pertains from the following description. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram of a vapor deposition apparatus according to an embodiment. [Figure 2] FIG. 2 is a perspective view of the mask structure of FIG. [Figure 3] FIG. 2 is a perspective view of the stage and frame of FIG. 1. [Figure 4] FIG. 2 is a perspective view of a first carrier disposed on a transport track. [Figure 5] FIG. 5 is an enlarged view of region A1 in FIG. [Figure 6] 5 is a view for explaining the state in which a mask structure is coupled to the first carrier of FIG. 4. FIG. [Figure 7] FIG. 7 is an enlarged view of region A2 in FIG. 6. [Figure 8] FIG. 10 is a diagram illustrating separation between the first carrier and the mask structure. [Figure 9] FIG. 10 is a diagram illustrating separation between the first carrier and the mask structure. [Figure 10] FIG. 2 is a perspective view of the substrate tray of FIG. [Figure 11] 11 is a view for explaining the state in which the substrate tray of FIG. 10 is coupled to the second carrier. FIG. [Figure 12] 1A to 1C are diagrams illustrating a deposition method of a deposition apparatus according to an embodiment. [Figure 13] 1A to 1C are diagrams illustrating a deposition method of a deposition apparatus according to an embodiment. [Figure 14]1A to 1C are diagrams illustrating a deposition method of a deposition apparatus according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] The advantages and features of the present invention, as well as methods for achieving them, will become clearer with reference to the following detailed embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various different forms. The present embodiments are provided solely for the purpose of complete disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art to which the present invention pertains. The present invention is defined solely by the scope of the claims.

[0012] When elements or layers are referred to as being "on" another element or layer, this includes all cases where other layers or elements are directly on or between the other elements. The same reference numerals refer to the same components throughout the specification. The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments are for illustrative purposes only, and the present invention is not limited to the details shown.

[0013] Although terms such as "first" and "second" are used to describe various components, it is understood that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it is understood that a "first" component referred to below may be a "second" component within the technical concept of the present invention.

[0014] The features of the various embodiments of the present invention may be partially or wholly combined or combined with one another, and may be technically interlocked and driven in various ways, and each embodiment may be implemented independently of the others or in conjunction with one another.

[0015] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0016] Fig. 1 is a schematic diagram of a vapor deposition apparatus according to one embodiment, Fig. 2 is a perspective view of the mask structure of Fig. 1, and Fig. 3 is a perspective view of the stage and frame of Fig. 1. Note that in Figs. 1 to 3, the opposite direction of the third direction DR3 (hereinafter referred to as the third opposite direction) may be the direction of gravity.

[0017] As shown in FIG. 1 , a vapor deposition apparatus for a display device according to one embodiment may include a chamber 100, a vapor deposition source 200, a stage 250, a mask structure 340, a substrate tray 700, a magnet plate 800, a transfer track 500, a first carrier 1600, and a driving mechanism 900.

[0018] The chamber 100 may define a deposition space in which a deposition process is performed. A film deposition process for manufacturing an organic light-emitting display device is performed inside the chamber 100. The chamber 100 may be a vacuum chamber. The deposition source 200, the stage 250, the driving mechanism 900, and a portion of the transport track 500 are disposed within the chamber 100. Note that, when the deposition process is in progress, the deposition source 200, the stage 250, the mask structure 340, the substrate 50, the substrate tray 700, the magnet plate 800, a portion of the transport track 500, and the driving mechanism 900 are disposed within the chamber 100.

[0019] The deposition source 200 is disposed within the chamber 100. For example, the deposition source 200 is disposed between the first inner wall 101 of the chamber 100 and the stage 250. The deposition source 200 provides a deposition material. The deposition material travels from the deposition source 200 through the opening 29 of the stage 250 toward the mask structure 340. Specifically, the deposition source 200 heats and vaporizes a deposition material, such as an organic material or an electrode material, at a high temperature. The vaporized deposition material may then be deposited on the substrate 50 through the pattern holes of the mask structure 340. The organic material may be, for example, a material for fabricating a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer disposed between an anode electrode and a cathode electrode of an organic light-emitting diode (OLED). The substrate 50 may be, for example, a substrate used in a display device including an organic light-emitting diode (OLED).

[0020] The stage 250 is disposed above the deposition source 200. For example, the stage 250 is disposed between the deposition source 200 and the mask structure 340. The stage 250 is fixedly disposed inside the chamber 100. The stage 250 may be tilted toward the deposition source 200. For example, the stage 250 may be tilted in a second direction opposite to the second direction DR2 with respect to the third direction DR3. Therefore, an acute angle may be formed between a surface of the stage 250 facing the deposition source 200 and the ground on which the stage 250 is disposed (e.g., the bottom surface of the chamber 100). In this case, as shown in FIG. 3 , a support 28 is disposed below the stage 250, protruding from a surface of the lower surface along the second direction. The stage 250 may have a rectangular frame shape with a hole in the center. For example, the stage 250 may have an opening 29 in the center. The stage 250 may further include a permanent electromagnet. For example, a permanent electromagnet is disposed on one surface of the stage 250 facing the mask structure 340 .

[0021] The mask structure 340 is disposed on the stage 250. For example, the mask structure 340 is disposed between the stage 250 and the substrate tray 700. The mask structure 340 may be placed on the support 28 of the stage 250. In this case, since the stage 250 is tilted, the mask structure 340 may be disposed in an inclined state on the stage 250. The mask structure 340 may include a frame 300 and a mask 400.

[0022] The frame 300 is disposed on the stage 250. For example, the frame 300 is disposed between the stage 250 and the mask 400. The frame 300 may have a rectangular frame shape with a hole in the center. For example, the frame 300 may have an opening 39 in the center. Grooves 30 are disposed on both side edges of the frame 300. The frame 300 may include a magnetic material. For example, the frame 300 may include a material (e.g., iron (Fe)) that can be attached to a magnet.

[0023] 3, at least one detachable member 3 is disposed on an edge of the frame 300. For example, a detachable member 3 is disposed near each corner of the rectangular frame 300. Specifically, the frame 300 may have six detachable members 3, where three of the six detachable members 3 are disposed on the upper, central, and lower sides of a first side 11 of the frame 300, respectively, and the remaining three detachable members 3 are disposed on the upper, central, and lower sides of a second side 22 of the frame 300, respectively. The first side 11 and the second side 22 of the frame 300 are disposed opposite each other in the first direction.

[0024] The detachable member 3 may include a coupling tip 3a and a separation groove 3b arranged adjacent to each other in the third direction DR3. The coupling tip 3a is arranged above the separation groove 3b. For example, in one detachable member 3, the coupling tip 3a may be arranged above the separation groove 3b in the third direction DR3. The coupling tip 3a may have a thickness (e.g., size in the second direction DR2) smaller than that of other parts of the frame 300. The separation groove 3b may have a shape recessed from the first side 11 toward the second side 22 of the frame 300, or a shape recessed from the second side 22 toward the first side 11. For example, separation grooves 3b arranged on different sides and facing each other may have shapes recessed toward each other.

[0025] The mask 400 is placed on the frame 300. For example, the mask 400 is placed between the frame 300 and the substrate tray 700. The mask 400 is placed on the frame 300 so as to cover the opening 39 of the frame 300. The edge of the mask 400 is attached to the frame 300. For example, the mask 400 is attached to the frame 300 by welding. The mask 400 may be a fine metal mask (FMM).

[0026] The mask 400 may include multiple sub-masks (410, or mask sticks). Each of the sub-masks 410 may have a rectangular shape extending in the third direction DR3. The sub-masks 410 may be arranged along the first direction DR1. Adjacent sub-masks 410 may contact each other. A portion of each sub-mask 410, excluding both edges, is disposed over the opening 39 of the frame 300. Although not shown in the drawings, each sub-mask 410 may have multiple pattern holes penetrating the respective sub-mask 410 in the second direction DR2. A deposition material may be deposited from the deposition source 200 onto the substrate 50 through the pattern holes of each sub-mask 410. Each sub-mask 410 may be made of a material containing a magnetic material (e.g., iron (Fe)). For example, each sub-mask 410 may contain a material that is attracted to a magnet.

[0027] The substrate tray 700 is disposed on the mask structure 340. For example, the substrate tray 700 is disposed between the mask 400 and the magnet plate 800 of the mask structure 340. The substrate tray 700 carries the substrate 50. At this time, the substrate tray 700 can attract the substrate 50 by electrostatic force. For example, the substrate tray 700 can provide a surface on which the substrate 50 is placed and also function as an electrostatic chuck that attracts and fixes the substrate 50 to one surface of the substrate tray 700. The substrate tray 700 is made of a material including ceramic or titanium.

[0028] The magnet plate 800 is disposed on the substrate tray 700. For example, the magnet plate 800 is disposed between the substrate tray 700 and the driving mechanism 900. The magnet plate 800 is disposed on the substrate tray 700 so as to face the substrate tray 700. The magnet plate 800 provides a magnetic force. For example, the magnet plate 800 can provide a magnetic force such that the metal mask 400 is tightly attached to the substrate 50.

[0029] The magnet plate 800 may include a base member 810 and a plurality of magnets 820 arranged on the base member 810. For example, the magnets 820 are arranged on the base member 810. As a specific example, when one side of the base member 810 facing the substrate tray 700 is defined as a first surface, the magnets 820 are arranged on the first surface of the base member 810. Each magnet 820 may include, for example, a permanent magnet.

[0030] The magnets 820 may have a north pole and a south pole. The magnets 820 arranged along the first direction DR1 are arranged with opposite polarities facing each other in the first direction DR1. The magnets 820 arranged along the second direction DR2 are arranged with opposite polarities facing each other.

[0031] When the surface opposite to the first surface of the base member 810 is defined as the second surface of the base member 810, a plurality of magnetic bodies 830 are disposed on the second surface of the base member 810. For example, the plurality of magnetic bodies 830 are disposed in the coupling grooves of the base member 810 on the second surface. For example, the magnetic bodies 830 may include a material that can be attached to a magnet (e.g., iron (Fe)).

[0032] The drive mechanism 900 may include a first drive mechanism 910 and a second drive mechanism 920 .

[0033] The first drive mechanism 910 is disposed between the magnet plate 800 and the second drive mechanism 920. For example, the first drive mechanism 910 is disposed between the base member 810 of the magnet plate 800 and the second drive mechanism 920. The first drive mechanism 910 may include a magnet 89. For example, the magnet 89 is disposed on the surface of the first drive mechanism 910 opposite to the surface connected to the first drive shaft 911. The magnet 89 of the first drive mechanism 910 is disposed to correspond to (or overlap) the magnetic body 830 of the magnet plate 800. The magnet 89 may include a permanent magnet.

[0034] The magnet plate 800 is detachably attached to a first driving mechanism 910. For example, the base member 810 of the magnet plate 800 is detachably attached to the magnet 89 of the first driving mechanism 910. In other words, the magnetic body 830 of the base member 810 can be attached to the magnet 89 of the first driving mechanism 910 by magnetic force generated by the magnet 89 of the first driving mechanism 910. The first driving mechanism 910 can move toward or away from the deposition source 200 within the chamber 100. For example, the first driving mechanism 910 can move along a second reverse direction or a second direction DR2. To this end, according to one embodiment, the first driving mechanism 910 may be connected to a first driving shaft 911 that extends along the second reverse direction or retracts along the second direction DR2. The first driving shaft 911 may be connected to an external driving unit via a hole 90 of the second driving mechanism 920 and a hole 21 of the chamber 100. The first driving mechanism 910 can also move further in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. In such a case, the first driving shaft 911 can also move further in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. The movement of the first driving mechanism 910 can control the movement of the magnet plate 800 attached to the first driving mechanism 910.

[0035] The second driving mechanism 920 is disposed between the first driving mechanism 910 and the second inner wall 102 of the chamber 100. The second driving mechanism 920 may include a permanent electromagnet 92. The substrate tray 700 is attached to the second driving mechanism 920. For example, the magnetic material 70 of the substrate tray 700 is attached to the second driving mechanism 920 by attaching the magnetic material 70 of the substrate tray 700 to the permanent electromagnet 92 of the second driving mechanism 920. The permanent electromagnet 92 is disposed on both side edges of the second driving mechanism 920. The magnetic material 70 is disposed on both side edges of the substrate tray 700 to correspond to the permanent electromagnet 92. The magnetic material 70 may include a magnetic material that is attached to a magnet, such as iron (Fe).

[0036] The second driving mechanism 920 may include an electromagnet instead of the permanent electromagnet 92. The second driving mechanism 920 moves from the interior of the chamber 100 toward the deposition source 200 or in the opposite direction. For example, the second driving mechanism 920 may move along a second reverse direction or a second direction DR2. To this end, according to one embodiment, the second driving mechanism 920 may be connected to a second driving shaft 921 that extends along the second reverse direction or retracts along the second direction DR2. The second driving mechanism 920 may also move in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. In such a case, the second driving shaft 921 may also move in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. The movement of the second driving mechanism 920 may control the movement of the substrate tray 700 attached to the second driving mechanism 920. The second drive mechanism 920 can perform an alignment operation between the substrate 50 on the substrate tray 700 and the mask structure 340 by controlling the position of the substrate tray 700 attached thereto.

[0037] The transfer track 500 is arranged inside and outside the chamber 100 so as to pass through, for example, a first gate G1 and a second gate G2 of the chamber 100. The transfer track 500 may extend along a first direction DR1. The first gate G1 and the second gate G2 are arranged opposite each other.

[0038] The first carrier 1600 moves along the transport track 500. For example, the first carrier 1600 can move along the transport track 500 by a magnetic levitation system. The first carrier 1600 can transport the mask structure 340.

[0039] As described above, the stage 250 may have its upper side tilted toward the deposition source 200. As a result, the mask structure 340, substrate tray 700, substrate 50, magnet plate 800, first driving mechanism 910, second driving mechanism 920, transfer track 500, and carrier (1600 or 2600) may also be tilted at the same angle as the stage 250. As a result, particles generated during the deposition process on the substrate 50 can fall in the direction of gravity without adhering to the substrate 50. This prevents contamination of the substrate 50 by particles.

[0040] Fig. 4 is a perspective view of the first carrier 1600 arranged on the transport track 500, Fig. 5 is an enlarged view of the A1 area of ​​Fig. 4, Fig. 6 is a diagram for explaining that the mask structure 340 is coupled to the first carrier 1600 of Fig. 4, and Fig. 7 is an enlarged view of the A2 area of ​​Fig. 6. Here, Fig. 4 may be a perspective view of the first carrier 1600 arranged on the transport track 500 of Fig. 1.

[0041] The first carrier 1600 moves along the transport track 500. The transport track 500 may include a lower track 501 and an upper track 502 arranged opposite each other in the third direction DR3. The lower track 501 may have a U-shaped cross section, and the upper track 502 may have a bar shape. The first carrier 1600 is disposed between the lower track 501 and the upper track 502. The first carrier 1600 may move along the transport track 500 between the lower track 501 and the upper track 502.

[0042] The first carrier 1600 may have a square frame shape as shown in the example of Fig. 4. However, the shape of the first carrier 1600 is not limited thereto and may be modified into various shapes.

[0043] The first carrier 1600 may include a plurality of bars 1601, 1602, 1603, 1604 and a plurality of support members 1610, 1620, 1630. For example, the first carrier 1600 may include a first bar 1601, a second bar 1602, a third bar 1603, and a fourth bar 1604 that are connected to one another. The mask structure 340 is disposed in a region (e.g., opening 88a) defined by the first bar 1601, the second bar 1602, the third bar 1603, and the fourth bar 1604. Here, the third bar 1603 may have a U-shaped cross section.

[0044] The first bar 1601 and the second bar 1602 face each other in the first direction DR1. The third bar 1603 and the fourth bar 1604 face each other in the third direction DR3. The first bar 1601 is disposed between one end of the third bar 1603 and one end of the fourth bar 1604. The second bar 1602 is disposed between the other end of the third bar 1603 and the other end of the fourth bar 1604.

[0045] The plurality of support members 1610, 1620, 1630 may include at least one first support member 1610 extending from the first bar 1601, at least one second support member 1620 extending from the second bar 1602, and at least one third support member 1630 extending from the third bar 1603. For example, two first support members 1610 may extend from one side and the other of the first bar 1601 toward the second bar 1602, respectively. For example, two first support members 1610 may extend from one side and the other of the first bar 1601 along the first direction DR1. Two second support members 1620 may extend from one side and the other of the second bar 1602 toward the first bar 1601, respectively. For example, two second support members 1620 may extend from one side and the other of the second bar 1602 along the second opposite direction, respectively. The two third support members 1630 may extend from one side and the other side of the third bar 1603 toward the fourth bar 1604. For example, the two third support members 1630 may extend from one side and the other side of the third bar 1603 along the third direction DR3. The two first support members 1610 and the two second support members 1620 are disposed opposite each other.

[0046] As shown in FIG. 5 , the first support member 1610 may include an extension 1611 and a plurality of protrusions 1612. One side of the extension 1611 may be connected to the first bar 1601. The extension 1611 may extend from the first bar 1601 toward the second bar 1602. A plurality of protrusions 1612 (e.g., two protrusions 1612) are disposed on the other side of the extension 1611. The plurality of protrusions 1612 may be rotatably connected to the other side of the extension 1611. For example, each of the plurality of protrusions 1612 rotates about an axis parallel to the first direction DR1. The plurality of protrusions 1612 are disposed opposite each other in the second direction DR2. Each of the plurality of protrusions 1612 may have a cylindrical shape. However, the shape of the protrusions 1612 is not limited thereto and may be changed to various shapes.

[0047] The second support member 1620 may have the same configuration as the previously described first support member 1610. However, the extension of the second support member 1620 may extend from the second bar 1602 toward the first bar 1601.

[0048] The third support member 1630 may include an extension 1631, a protrusion 1632, and a projection 1633. One side of the extension 1631 may be connected to the third bar 1603. The extension 1631 may extend from the third bar 1603 toward the fourth bar 1604. The projection 1632 is disposed on the other side of the extension 1631. The projection 1633 is disposed on one side of the projection 1632. The projection 1633 may be rotatably connected to one side of the projection 1632. For example, the projection 1633 rotates about an axis parallel to the second direction DR2. The projection 1633 may have a cylindrical shape. However, the shape of the projection 1633 is not limited thereto and may be changed to various shapes.

[0049] As shown in FIGS. 6 and 7, a first support member 1610, a second support member 1620, and a third support member 1630 support the mask structure 340. As shown in FIG.

[0050] The first support members 1610 each support a first side 11 of the mask structure 340. For example, the first side 11 of the mask structure 340 may be supported by being disposed between the protrusions 1612 of the first support members 1610. Specifically, the first side 11 may be supported by being disposed between the protrusions 1612 of the first support members 1610, whereby the coupling chip 3a of the first side 11 may be supported.

[0051] The second support members 1620 each support the second side 22 of the mask structure 340. For example, the second side 22 of the mask structure 340 may be supported by being disposed between the protrusions of the second support members 1620. Specifically, the coupling tip 3a of the second side 22 may be disposed between the protrusions of the second support members 1620, thereby supporting the second side 22.

[0052] The third support members 1630 each support the third side 33 of the mask structure 340. For example, the third side 33 of the mask structure 340 may be supported by being placed on the protrusions 1633 of the third support members 1630. In this case, the protrusions 1633 of the third support members 1630 may come into contact with the third side 33.

[0053] 8 and 9 are diagrams for explaining the separation between the first carrier 1600 and the mask structure 340. FIG.

[0054] The deposition apparatus of one embodiment may further include a pusher (55). The pusher 55 is disposed on the first carrier 1600. For example, as shown in FIG. 8 , the pusher 55 is disposed on the fourth bar 1604 of the first carrier 1600. Specifically, the pusher 55 faces the fourth bar 1604 via the opening 60 of the upper track 502. The pusher 55 and the opening 60 of the upper track 502 are disposed within the chamber 100.

[0055] The pusher 55 moves toward the fourth bar 1604 or in the opposite direction. For example, the pusher 55 can move along the third reverse direction or the third direction DR3. The pusher 55 can move a first step distance and a second step distance along the third reverse direction, where the second step distance is greater than the first step distance. Here, when the pusher 55 descends the second step distance along the third reverse direction, the lower track 501 also descends along the third reverse direction. For example, when the pusher 55 descends the second step distance, the pusher 55 and the lower track 501 can both descend in the same direction.

[0056] When the pusher 55 moves the second distance along the third reverse direction, as shown in FIG. 9 , the pusher 55 may contact the fourth bar 1604 through the opening 60 of the upper track 502. At this time, the fourth bar 1604 is lowered by the pressure of the pusher 55. In other words, the pusher 55 presses the fourth bar 1604 in the third reverse direction, causing the first carrier 1600 to move in the third reverse direction. Therefore, the first support member 1610, the second support member 1620, and the third support member 1630 each move in the third reverse direction, thereby allowing the protrusions 1612 of each first support member 1610 and the protrusions of each second support member 1620 to be positioned opposite each other across the separation grooves 3 b of the mask structure 340. In other words, the protrusions 1612 of each first support member 1610 and the coupling tips 3a of the first side 11 of the mask structure 340 do not contact each other, and the protrusions 1612 of each second support member 1620 and the coupling tips 3a of the second side 22 of the mask structure 340 do not contact each other. Furthermore, as described above, as the pusher 55 moves the first carrier 1600 downward in the third reverse direction, the third support member 1630 and the mask structure 340 become separated from each other. For example, as the protrusions 1612 of the second support member 1620 and the third side 33 of the mask structure 340 become separated from each other, the protrusions 1633 of the third support member 1630 do not come into contact with the third side 33. Therefore, the mask structure 340 is no longer supported by the first carrier 1600. Therefore, the mask structure 340 can be easily moved in the second direction DR2 and the second reverse direction without interference with the first carrier 1600.

[0057] A mover 550 is disposed inside the lower track 501. The mover 550 may have a screw shape. A plurality of permanent magnets are disposed on the outer circumferential surface of the mover 550. A permanent magnet is also disposed inside the lower track 501, and a permanent magnet is also disposed on each of the opposing surfaces of the upper track 502 and the fourth bar 1604 of the first carrier 1600. Rotation of the permanent magnets and the mover 550 allows the first carrier 1600 to move along the transport track 500 by magnetic levitation. For example, the movement direction of the first carrier 1600 disposed on the transport track 500 can be controlled depending on the rotation direction of the mover 550. Specifically, when the mover 550 rotates clockwise, the first carrier 1600 can move along the transport track 500 in a first direction DR1. When the mover 550 rotates counterclockwise, the first carrier 1600 can move along the transport track 500 in a first reverse direction DR1.

[0058] FIG. 10 is a perspective view of the substrate tray 700 of FIG.

[0059] As shown in FIG. 10, a substrate tray 700 may include a support plate 710 and an electrostatic chuck 720 .

[0060] The support plate 710 may have the shape of a square frame with a hole in the center, for example, the support plate 710 may have an opening 79 in the center.

[0061] The electrostatic chuck 720 is disposed on the support plate 710. For example, the electrostatic chuck 720 is disposed between the support plate 710 and the substrate 50. At this time, the electrostatic chuck 720 may cover the opening 79 of the support plate 710. The substrate 50 is disposed on the electrostatic chuck 720. The electrostatic chuck 720 can attract the substrate 50 by electrostatic force.

[0062] At least one detachable member 7 is arranged on the edge of the substrate tray 700. For example, a detachable member 7 is arranged near each corner of a rectangular support plate 710. Specifically, the support plate 710 may have six detachable members 7, and three of the six detachable members 7 are arranged on the upper, central, and lower sides of a first side 71 of the substrate tray 700, respectively, and the remaining three detachable members 7 are arranged on the upper, central, and lower sides of a second side 72 of the substrate tray 700, respectively. The first side 71 and the second side 72 of the substrate tray 700 are arranged opposite each other along the first direction DR1.

[0063] The detachable member 7 may include a coupling tip 7a and a separation groove 7b arranged adjacent to each other in the third direction DR3. The coupling tip 7a is arranged above the separation groove 7b. For example, in one detachable member 7, the coupling tip 7a is arranged above the separation groove 7b in the third direction DR3. The coupling tip 7a may have a smaller thickness (e.g., size in the second direction DR2) than other portions of the substrate tray 700. For example, the coupling tip 7a may have a smaller thickness (e.g., size in the second direction DR2) than other portions of the support plate 710. The separation groove 7b may have a shape recessed from the first side 71 toward the second side 72 of the substrate tray (700, e.g., the support plate 710) or a shape recessed from the second side 72 toward the first side 71. For example, separation grooves 7b arranged on different sides and facing each other may have shapes recessed toward each other.

[0064] According to one embodiment, the detachable member 7 of the substrate tray 700 may have substantially the same structure as the detachable member 3 of the frame 300 provided in the mask structure 340 described above.

[0065] The second carrier 2600 moves along the transfer track 500. For example, the second carrier 2600 may move along the transfer track 500 using a magnetic levitation system. The second carrier 2600 may transfer the substrate tray 700. Thus, according to an embodiment, the first carrier 1600 and the second carrier 2600 may be transferred along the same transfer track 500. Therefore, according to an embodiment, the equipment for the deposition apparatus may be simplified, and the manufacturing costs of the deposition apparatus may be reduced.

[0066] The second carrier 2600 will be described in detail below.

[0067] FIG. 11 is a diagram illustrating the state in which the substrate tray 700 of FIG. 10 is coupled to the second carrier 2600. As shown in FIG.

[0068] The second carrier 2600 may include a plurality of bars 2601, 2602, 2603, 2604 and a plurality of support members 2610, 2620, 2630. For example, the second carrier 2600 may include a first bar 2601, a second bar 2602, a third bar 2603, and a fourth bar 2604 that are connected to one another. The substrate tray 700 is placed in an area (e.g., opening 88b) defined by the first bar 2601, the second bar 2602, the third bar 2603, and the fourth bar 2604.

[0069] The first bar 2601 and the second bar 2602 face each other in the first direction DR1. The third bar 2603 and the fourth bar 2604 face each other in the third direction DR3. The first bar 2601 is disposed between one end of the third bar 2603 and one end of the fourth bar 2604. The second bar 2602 is disposed between the other end of the third bar 2603 and the other end of the fourth bar 2604.

[0070] The plurality of support members 2610, 2620, 2630 may include at least one first support member 2610 extending from the first bar 2601, at least one second support member 2620 extending from the second bar 2602, and at least one third support member 2630 extending from the third bar 2603.

[0071] The first bar 2601, the second bar 2602, the third bar 2603, the fourth bar 2604, the first support member 2610, the second support member 2620, and the third support member 2630 of the second carrier 2600 are substantially identical to the first bar 1601, the second bar 1602, the third bar 1603, the fourth bar 1604, the first support member 1610, the second support member 1620, and the third support member 1630 of the first carrier 1600 described above, respectively. For the description of the first bar 2601, the second bar 2602, the third bar 2603, the fourth bar 2604, the first support member 2610, the second support member 2620 and the third support member 2630 of the second carrier 2600, please refer to the description of the first bar 1601, the second bar 1602, the third bar 1603, the fourth bar 1604, the first support member 1610, the second support member 1620 and the third support member 1630 of the first carrier 1600 described above.

[0072] According to one embodiment, the coupling scheme between the substrate tray 700 and the second carrier 2600 may be substantially the same as the coupling scheme between the mask structure 340 and the first carrier 1600 described above.

[0073] For example, the first support members 2610 of the second carrier 2600 support the first sides 71 of the respective substrate trays 700. For example, the first sides 71 of the substrate trays 700 are supported by being disposed between the protrusions of the first support members 2610. Specifically, the first sides 71 can be supported by being disposed between the protrusions of the first support members 2610, whereby the coupling chips of the first sides 71 are supported.

[0074] The second support members 2620 each support the second side 72 of the substrate tray 700. For example, the second side 72 of the substrate tray 700 is supported by being disposed between the protrusions of the second support members 2620. Specifically, the coupling tip of the second side 72 may be disposed between the protrusions of the second support members 2620, thereby supporting the second side 72.

[0075] The third support members 2630 each support the third side 73 of the substrate tray 700. For example, the third side 73 of the substrate tray 700 can be supported by being placed on a protrusion of the third support members 2630. In this case, the protrusion of the third support members 2630 may come into contact with the third side 73.

[0076] According to one embodiment, the separation mechanism between the substrate tray 700 and the second carrier 2600 may be substantially the same as the separation mechanism between the mask structure 340 and the first carrier 1600 described above.

[0077] For example, when the pusher 55 moves along the third reverse direction, the pusher 55 comes into contact with the fourth bar 2604 of the second carrier 2600 through the opening 60 of the upper track 502. At this time, the fourth bar 2604 is lowered by the pressure of the pusher 55. In other words, when the pusher 55 presses the fourth bar 2604 in the third reverse direction, the second carrier 2600 can move in the third reverse direction. Therefore, the first support member 2610, the second support member 2620, and the third support member 2630 each move in the third reverse direction, whereby the protrusions of the first support members 2610 and the protrusions of the second support members 2620 can be arranged opposite each other across the separation groove 7b of the substrate tray 700. In other words, the protrusions of each first support member 2610 and the coupling chips 7a on the first side 71 of the substrate tray 700 do not contact each other, and the protrusions of each second support member 2620 and the coupling chips on the second side 72 of the substrate tray 700 do not contact each other. Furthermore, as described above, as the pusher 55 moves the second carrier 2600 downward in the third reverse direction, the third support member 2630 and the substrate tray 700 can move apart from each other. For example, as the protrusions of the second support member 2620 and the third side 73 of the substrate tray 700 move apart from each other, the protrusions of the third support member 2630 and the third side 73 do not come into contact with each other. Therefore, the substrate tray 700 is no longer supported by the second carrier 2600. Therefore, the substrate tray 700 can be easily moved in the second direction DR2 and the second reverse direction without interference with the second carrier 2600.

[0078] A deposition method using the deposition apparatus according to an embodiment having the above configuration will now be described in detail.

[0079] 12, 13, and 14 are diagrams illustrating a vapor deposition method of a vapor deposition apparatus according to one embodiment.

[0080] First, the deposition source 200, the stage 250, the first driving mechanism 910, and the second driving mechanism 920 are arranged inside the chamber 100. At this time, the magnet plate 800 is attached to the first driving mechanism 910. Furthermore, the first driving mechanism 910 and the second driving mechanism 920 are arranged between the transfer track 500 and the second inner wall 102 of the chamber 100 so as not to overlap with the transfer track 500.

[0081] 12, the first carrier 1600 carrying the mask structure 340 is loaded into the chamber 100 along the transfer track 500. For example, the first carrier 1600 carrying the mask structure 340 passes through the first gate G1 of the chamber 100 along the transfer track 500 and is loaded (or placed) into the chamber 100. For example, the first carrier 1600 may be placed in the chamber 100 such that the mask structure 340 is aligned with the stage 250 between the stage 250 and the drive mechanism 900.

[0082] Next, the pusher 55 descends in the third reverse direction by a first step size and contacts the first carrier 1600. The first carrier 1600 descends in the third reverse direction due to the pressure of the pusher 55. At this time, the lower track 501 remains unchanged without descending, thereby reducing the gap between the first carrier 1600 and the lower track 501. As a result, the first carrier 1600 can be stably disposed on the lower track 501 in the chamber 100. Here, when the pusher 55 descends by the first step distance, the descending distance is short. Therefore, even if the first carrier 1600 descends due to the pressure of the pusher 55, the mask structure 340 accommodated in the first carrier 1600 can remain supported by the support members 1610, 1620, and 1630 of the first carrier 1600.

[0083] Thereafter, the second driving mechanism 920 recognizes the position of the mask structure 340 and adjusts the suction position between the second driving mechanism 920 and the mask structure 340. For example, the position of the driving mechanism 900 including the second driving mechanism 920 can be adjusted to align the electro-permanent magnet 92 of the second driving mechanism 920 and the groove 30 of the mask structure 340.

[0084] Next, the driving mechanism 900 moves toward the first carrier 1600. At this time, the electro-permanent magnet 92 of the second driving mechanism 920 and the frame 300 of the mask structure 340 come into contact with each other, thereby attaching the mask structure 340 to the second driving mechanism 920. For example, the electro-permanent magnet 92 of the second driving mechanism 920 is inserted into the groove 30 of the frame 300, and the frame 300 is attached to the second driving mechanism 920 by the magnetic force of the electro-permanent magnet 92. In other words, the frame 300 of the mask structure 340 and the mask structure 340 in the first carrier 1600 are attached to the second driving mechanism 920.

[0085] Next, with the mask structure 340 attached to the second drive mechanism 920, the pusher 55 further descends a second distance, and simultaneously the lower track 501 descends in the third reverse direction. In other words, the pusher 55 and the lower track 501 can simultaneously descend in the third reverse direction. This allows the first carrier 1600 and the lower track 501 to descend in the third reverse direction. At this time, the gap between the first carrier 1600 and the lower track 501 may be substantially the same as the gap between the first carrier 1600 and the lower track 501 when the pusher 55 descends by the aforementioned first-stage magnitude. Therefore, the restraining force of the support members 1610, 1620, and 1630 of the first carrier 1600 on the mask structure 340 is released, allowing the mask structure 340 to remain movable in the second direction DR2 and the second reverse direction from the first carrier 1600.

[0086] Next, the driving mechanism 900 moves further in the second reverse direction. In other words, the driving mechanism 900 can move toward the stage 250. As a result, the mask structure 340 attached to the second driving mechanism 920 is separated from the first carrier 1600 in the second reverse direction and can move along the second reverse direction along the second driving mechanism 920 to be removed from the transport track 500. Thereafter, the driving mechanism 900 to which the mask structure 340 is attached moves further in the second reverse direction toward the stage 250 to place the mask structure 340 on the stage 250. For example, the mask structure 340 is placed on the support 28 of the stage 250. At this time, the electro-permanent magnet of the stage 250 and the frame 300 of the mask structure 340 are attached to each other. Once the mask structure 340 is placed on the stage 250, the second driving mechanism 920 and the mask structure 340 are separated from each other. For example, the magnetic force of the electro-permanent magnet 92 of the second driving mechanism 920 is released, so that the mask structure 340 can be separated from the second driving mechanism 920 .

[0087] According to one embodiment, the movement distance of the drive mechanism (900, e.g., the second drive mechanism 920) during the process of placing the mask structure 340 on the stage 250 is smaller than the width W of the transport track 500. For example, if the position of the second drive mechanism 920 at the time when the mask structure (340, e.g., the mask structure 340 placed on the first carrier 1600) is attached to the second drive mechanism 920 is defined as the first position, and the position of the second drive mechanism 920 at the time when the second drive mechanism 920 moves from the first position toward the stage 250 and the mask structure 340 and the stage 250 come into contact with each other (or the contact between the mask structure 340 and the second drive mechanism 920 is released after the mask structure 340 is placed and aligned on the stage 250) is defined as the second position, the movement distance of the second drive mechanism 920 from the first position to the second position may be smaller than the width W of the transport track 500. In other words, the travel distance of a driving mechanism (e.g., the second driving mechanism 920) that moves to transfer the mask structure 340 from the first carrier 1600 to the stage 250 may be smaller than the width W of the transport track 500. Here, the width W of the transport track can be defined as the width W of the lower track 501 in the second direction DR2, as in the example shown in FIG. 4. In such a case, the travel distance of the second driving mechanism 920 from the first position to the second position may be smaller than the aforementioned width W. Note that the width W of the transport track 500 can also be defined as, for example, the width of the upper track 502 (e.g., the width of the upper track 502 in the second direction DR2). In such a case, the travel distance of the second driving mechanism 920 from the first position to the second position may be smaller than the aforementioned width of the upper track 502. Therefore, the travel distance of a driving mechanism (e.g., the second driving mechanism 920) that transfers the mask structure 340 from the first carrier 1600 to the stage 250 becomes very short. Therefore, the time required for the mask structure 340 of the first carrier 1600 to be transferred to the stage 250 is shortened, and misalignment (eg, misalignment) of the mask structure 340 during the process of moving the mask structure 340 can be minimized.

[0088] The driving mechanism 900 then moves in the second direction DR2. For example, the driving mechanism 900 can pass through the opening 88a of the first carrier 1600 along the second direction DR2. The driving mechanism 900 is then positioned between the transfer track 500 and the second inner wall 102 of the chamber 100.

[0089] Next, the pusher 55 rises and moves to its original position. Therefore, the first carrier (1600, for example, the first carrier in an empty state) that transferred the mask structure 340 can rise and move to its original position. Thereafter, the first carrier (1600, for example, the first carrier in an empty state) passes through the second gate G2 of the chamber 100 along the transfer track 500 and is unloaded to the outside of the chamber 100. Thereafter, as shown in FIG. 13 , a second carrier 2600 carrying a substrate tray (700, for example, a substrate tray 700 on which a substrate 50 is placed) is loaded into the chamber 100 along the transfer track 500. For example, the second carrier 2600 carrying the substrate tray 700 passes through the first gate G1 of the chamber 100 along the transfer track 500 and is loaded (or placed) into the chamber 100. As a specific example, the second carrier 2600 can be positioned within the chamber 100 such that the substrate tray 700 is aligned with the mask structure 340 between the mask structure 340 and the drive mechanism 900 .

[0090] 14, the pusher 55 descends in the third reverse direction at a first step size and contacts the second carrier 2600. The second carrier 2600 descends in the third reverse direction due to the pressure of the pusher 55. At this time, the lower track 501 remains unchanged without descending, thereby reducing the gap between the second carrier 2600 and the lower track 501. This allows the second carrier 2600 to be stably positioned on the lower track 501 within the chamber 100. Because the distance of the downward movement of the pusher 55 is short when the pusher 55 descends at the first step size, even when the second carrier 2600 descends due to the pressure of the pusher 55, the substrate tray 700 accommodated in the second carrier 2600 can remain supported by the support members 2610, 2620, and 2630 of the second carrier 2600.

[0091] Thereafter, the second driving mechanism 920 recognizes the position of the substrate tray 700 and adjusts the suction position between the second driving mechanism 920 and the substrate tray 700. For example, the position of the driving mechanism 900 including the second driving mechanism 920 can be adjusted to align the electro-permanent magnet 92 of the second driving mechanism 920 and the magnetic body 70 of the substrate tray 700.

[0092] Next, the driving mechanism 900 moves toward the second carrier 2600. At this time, the permanent electromagnet 92 of the second driving mechanism 920 and the magnetic body 70 of the substrate tray 700 come into contact with each other, thereby attaching the substrate tray 700 to the second driving mechanism 920. For example, the substrate tray 700 is attached to the second driving mechanism 920 by the magnetic force of the permanent electromagnet 92.

[0093] Next, with the substrate tray 700 attached to the second drive mechanism 920, the pusher 55 further descends at the second stage magnitude, and simultaneously, the lower track 501 descends along the third reverse direction. In other words, the pusher 55 and the lower track 501 can simultaneously descend along the third reverse direction. This allows the second carrier 2600 and the lower track 501 to descend along the third reverse direction. At this time, the gap between the second carrier 2600 and the lower track 501 may be substantially the same as the gap between the second carrier 2600 and the lower track 501 when the pusher 55 descends at the first stage magnitude described above. This removes the restraining force of the support members 2610, 2620, and 2630 of the second carrier 2600 on the substrate tray 700, thereby allowing the substrate tray 700 to remain movable from the second carrier 2600 in the second direction DR2 and the second reverse direction.

[0094] Next, the drive mechanism 900 moves further along the second reverse direction. In other words, the drive mechanism 900 can move toward the mask structure 340 on the stage 250. As a result, the substrate tray 700 attached to the second drive mechanism 920 is separated from the second carrier 2600 in the second reverse direction, and can move away from the transport track 500 by moving in the second reverse direction along the second drive mechanism 920. Thereafter, the drive mechanism 900 to which the substrate tray 700 is attached can move further in the second reverse direction toward the mask structure 340 on the stage 250 to place the substrate tray 700 on the mask structure 340.

[0095] Next, the first driving mechanism 910 moves further in the second reverse direction toward the substrate tray 700. This allows the magnet plate 800 attached to the first driving mechanism 910 to approach or contact the substrate tray 700. Then, the mask structure 340 is attracted toward the magnets 820 of the magnet plate 800 by the magnetic force of the magnet plate 800. This can improve the adhesion between the substrate 50 on the substrate tray 700 and the mask structure 340.

[0096] Thereafter, the deposition material is deposited onto the substrate 50 from the deposition source 200 through the pattern holes of the mask structure 340. For example, a deposition process on the substrate 50 may be performed.

[0097] After the deposition process on the substrate 50 is completed, the first driving mechanism 910 to which the magnet plate 800 is attached moves in the second direction DR2, thereby weakening the adhesive force between the mask structure 340 and the substrate 50.

[0098] The driving mechanism 900 then moves in the second direction DR2. At this time, the substrate tray (700, for example, the substrate tray 700 on which the substrate 50 for which the deposition process has been completed is placed) attached to the second driving mechanism 920 also moves in the second direction DR2. The substrate tray 700 attached to the second driving mechanism 920 may be recoupled to the second carrier (2600, for example, the vacant second carrier 2600). For example, the movement of the driving mechanism 900 places the substrate tray 700 in the opening 88b of the second carrier 2600. At this time, the pusher 55 that had been pressing the second carrier 2600 rises along the third direction DR3 and returns to its original position, causing the support members 2610, 2620, and 2630 of the second carrier 2600 to contact the substrate tray 700 again. As a result, a substrate tray (700, for example, a substrate tray 700 on which a substrate 50 for which a deposition process has been completed is placed) may be recoupled (or loaded) to the second carrier 2600. After the substrate tray 700 is recoupled to the second carrier 2600, the second driving mechanism 920 and the substrate tray 700 are separated from each other. For example, the magnetic force of the permanent electromagnet 92 of the second driving mechanism 920 is released, thereby separating the second driving mechanism 920 and the substrate tray 700 from each other.

[0099] Next, the driving mechanism 900 moves further in the second direction DR2, so that the driving mechanism 900 is disposed between the transfer track 500 and the second inner wall 102 of the first chamber 100.

[0100] Next, the second carrier 2600 loaded with a substrate tray (700, for example, a substrate tray 700 on which a substrate 50 on which the deposition process has been completed is placed) passes through the second gate G2 of the chamber 100 along the transport track 500 and is unloaded outside the chamber 100.

[0101] Note that when the first driving mechanism 910 moves during the deposition process described above, the first driving mechanism 910 can also move together with the second driving mechanism 920. Similarly, when the second driving mechanism 920 moves during the deposition process, the second driving mechanism 920 can also move together with the first driving mechanism 910. For example, when the first driving mechanism 910 is located on the movement path along which the second driving mechanism 920 moves, the second driving mechanism 920 and the first driving mechanism 910 move together. At this time, the first driving mechanism 910 can move together while being disposed within the second driving mechanism 920. For example, as shown in FIG. 1 , the second driving mechanism 920 can have a cross section (e.g., a U-shaped cross section) that surrounds the first driving mechanism 910, and the first driving mechanism 910 can move together with the second driving mechanism 920 while being disposed within the second driving mechanism 920 so as to be surrounded by the second driving mechanism 920.

[0102] According to one embodiment, the region in the chamber 100 where the mask structure 340 in the first carrier 1600 is attached to the second drive mechanism 920 (hereinafter referred to as the first region) is the same as or partially overlaps with the region in the chamber 100 where the substrate tray 700 in the second carrier 2600 is attached to the second drive mechanism 920 (hereinafter referred to as the second region). In other words, the first region and the second region may completely overlap each other, or at least a portion of the first region and the second region may overlap each other.

[0103] According to one embodiment, the first region corresponds to the opening 88a of a first carrier (1600, e.g., the first carrier 1600 loaded with the mask structure 340) loaded into the chamber 100, and the second region corresponds to the opening 88b of a second carrier (2600, e.g., the second carrier 2600 loaded with the substrate tray 700) loaded into the chamber 100. In other words, when the second drive mechanism 920 grasps (or grips) the mask structure 340 of the first carrier 1600 or the substrate tray 700 of the second carrier 2600 in the chamber 100, the second drive mechanism 920 can grasp the mask structure 340 or the substrate tray 700 in the same region of the chamber 100. Therefore, unnecessary movement of the second driving mechanism 920 is reduced during the process of sequentially gripping a plurality of different structures (for example, the mask structure 340 and the substrate tray 700), thereby minimizing the tact time of the deposition apparatus.

[0104] Those skilled in the art will understand that the present specification can be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. The scope of the present specification is defined not by the above detailed description but by the claims that follow, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present specification.

[0105] In addition, the present specification and drawings disclose preferred embodiments of the present specification, and specific terms are used, but these are used in a general sense merely to easily explain the technical content of the present specification and to aid in understanding the invention, and are not intended to limit the scope of the present specification. It is obvious to a person skilled in the art to which the present specification pertains that, in addition to the embodiments disclosed in the present specification, other modifications based on the technical idea of ​​the present specification can be implemented. [Explanation of symbols]

[0106] 100 Chambers 200 Deposition source 101 First Inner Wall 102 Second Inner Wall 250 stages 340 Mask Structure 300 frames 400 masks 410 Submask 700 PCB Tray 50 boards 900 Drive Mechanism 910 First drive mechanism 920 Second drive mechanism 1600 First Carrier 500 transport trucks 800 magnetic plate 810 Base material 820 Magnet 70 Magnetic material 92 Permanent electromagnet 88 Magnet 30 grooves G1 Gate 1 G2 2nd Gate 830 Magnetic material 90 holes 24 holes 21 holes DR1 1st direction DR2 2nd direction DR3 3rd direction 2600 Second Carrier

Claims

1. Chamber, a deposition source within the chamber; a stage above the deposition source; a mask structure on the stage; a substrate tray on the mask structure; a magnet plate on the substrate tray; a transport track passing through a first gate of the chamber and a second gate of the chamber and disposed inside and outside the chamber; a first carrier for transporting the mask structure along the transport track; and a second carrier for transporting the substrate tray along the transport track;

2. The deposition apparatus for a display device according to claim 1 , further comprising a first driving mechanism that moves the magnet plate.

3. The deposition apparatus for a display device according to claim 1 , further comprising a second driving mechanism that moves the mask structure and the substrate tray.

4. 4. The vapor deposition apparatus for a display device according to claim 3, wherein an area in the chamber where the mask structure in the first carrier is attached to the second driving mechanism is the same as an area in the chamber where the substrate tray in the second carrier is attached to the second driving mechanism.

5. 4. The vapor deposition apparatus for a display device according to claim 3, wherein a moving distance of a second driving mechanism that moves to transfer the mask structure from the first carrier to the stage is smaller than a width W of the transport track.

6. The deposition apparatus for a display device according to claim 5 , wherein the width of the transport track is the width of a lower track of the transport track.

7. The deposition apparatus for a display device according to claim 6 , wherein the width of the transport track is the width of an upper track of the transport track.

8. The transport truck is the lower track, and The deposition apparatus for a display device according to claim 1 , further comprising an upper track on the lower track.

9. The deposition apparatus for a display device according to claim 8 , wherein the first carrier and the second carrier are disposed between the lower track and the upper track.

10. The first carrier is First bar, a second bar disposed opposite the first bar; a third bar disposed on the lower track; a fourth bar disposed below the upper track and facing the third bar; an opening surrounded by the first bar, the second bar, the third bar, and the fourth bar; a first support member extending from the first bar toward the second bar; a second support member extending from the second bar toward the first bar; and The deposition apparatus for a display device according to claim 9 , further comprising a third support member extending from the third bar toward the fourth bar.

11. The first support member is an extension extending from the first bar; and The deposition apparatus for a display device according to claim 10 , further comprising a protrusion rotatably connected to one side of the extension.

12. The third support member is an extension extending from the third bar; a protrusion disposed on one side of the extension; and The deposition apparatus for a display device according to claim 11 , further comprising a protrusion rotatably disposed on one side of the protruding portion.

13. The deposition apparatus for a display device according to claim 10 , further comprising a pusher disposed opposite the fourth bar through the opening of the upper track and movable toward the fourth bar.

14. The deposition apparatus for a display device according to claim 10 , wherein the mask structure includes a detachable member disposed adjacent to the first support member and the second support member.

15. The deposition apparatus for a display device according to claim 14 , wherein the detachable member includes a coupling tip and a separation groove disposed adjacent to each other.

16. The deposition apparatus for a display device according to claim 15 , wherein the coupled chip is disposed above the separation groove in the first carrier.

17. The deposition apparatus for a display device according to claim 15 , wherein the combined chip has a thickness smaller than that of the other portion of the second carrier.

18. The deposition apparatus for a display device of claim 15 , wherein the separation groove has a recessed shape from one side edge of the first carrier to the other side edge thereof.

19. The deposition apparatus for a display device according to claim 3 , wherein the mask structure is attached to a permanent electromagnet of the second driving mechanism.

20. 20. The deposition apparatus for a display device according to claim 19, wherein the mask structure includes a magnetic body attached to a permanent electromagnet of the second driving mechanism.

21. The deposition apparatus for a display device according to claim 3 , wherein the substrate tray is attached to a permanent electromagnet of the second driving mechanism.

22. The deposition apparatus for a display device according to claim 21 , wherein the substrate tray includes a magnetic material attached to a permanent electromagnet of the second driving mechanism.

23. a deposition source, a stage, a first driving mechanism, a magnet plate attached to the first driving mechanism, a second driving mechanism, a pusher, and a transport track are disposed between a first inner wall of a chamber and a second inner wall of the chamber; a first carrier carrying a mask structure including a mask is moved along the transport track and loaded into the chamber; attaching the second drive mechanism and the mask structure in the first carrier to each other; Pressurizing the first carrier with the pusher to lower the first carrier and the support member of the first carrier, and also lowering a lower track of the transport track, thereby releasing the restraining force of the support member of the first carrier against the mask structure; moving a second drive mechanism to which the mask structure is attached to separate the mask structure from the first carrier; moving the second drive mechanism toward the stage to place the mask structure on the stage; disconnecting the connection between the second drive mechanism and the mask structure; the second drive mechanism is disposed between the transfer track and a second inner wall of the chamber; Moving the pusher to its original position; moving the first carrier along the transfer track to unload it outside the chamber; a second carrier carrying a substrate tray containing a substrate is moved along the transport track and loaded into the chamber; attaching the second drive mechanism and the substrate tray in the second carrier to each other; Pressurizing the second carrier with the pusher to lower the second carrier and the support member of the second carrier, and also lowering a lower track of the transport track, thereby releasing the restraining force of the support member of the second carrier against the substrate tray; moving a second drive mechanism to which the substrate tray is attached to separate the substrate tray from the second carrier; moving the second drive mechanism toward a mask structure on the stage to place the substrate tray on the mask structure; moving the first drive mechanism toward the substrate tray to position a magnet plate on the substrate tray; and A vapor deposition method for a display device, comprising: depositing a vapor deposition material from the vapor deposition source onto the substrate through a mask of the mask structure.

24. 24. The vapor deposition method for a display device according to claim 23, wherein the area in the chamber where the mask structure in the first carrier is attached to the second driving mechanism is the same as the area in the chamber where the substrate tray in the second carrier is attached to the second driving mechanism.

25. 24. The vapor deposition method for a display device according to claim 23, wherein a movement distance of the second driving mechanism that moves to transfer the mask structure from the first carrier to the stage is smaller than a width of the transport track.

26. 26. The vapor deposition method for a display device according to claim 25, wherein the width of the transport track is the width of a lower track of the transport track.

27. 27. The method of claim 26, wherein the width of the transport track is the width of an upper track of the transport track.

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