Bonding apparatus and method for a display device

Abstract

To provide a bonding device for a display device and a bonding method of the display device capable of preventing damage of a substrate and improving an alignment state of the substrate.SOLUTION: A bonding apparatus for a display device and a bonding method for a display device according to an exemplary embodiment of the present invention include a transfer unit, a carrier movable along the transfer unit and receiving a substrate tray, a rotatable bonding stage disposed on the transfer unit, a supporter disposed on the bonding stage and movable along an upstream direction of the transfer unit, a downstream direction of the transfer unit, a downward direction toward the bonding stage, an upward direction opposite to the downward direction, a first rotational direction toward the upstream direction, and a second rotational direction toward the downstream direction, and a gripper connected to the supporter and disposed between the supporter and the bonding stage.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] An embodiment relates to a display device manufacturing apparatus, and more particularly to a display device bonding apparatus and a display device bonding method that can prevent damage to substrates and improve alignment of the substrates. [Background technology]

[0002] Organic light emitting diode displays (OLEDs) have self-luminous properties and, unlike liquid crystal displays (LCDs), do not require a separate light source, which allows for reduced thickness and weight. Furthermore, OLEDs offer high-quality features such as low power consumption, high brightness, and fast response speed, making them a promising next-generation display for portable electronic devices. Summary of the Invention [Problem to be solved by the invention]

[0003] SUMMARY OF THE INVENTION An object of one embodiment is to provide a bonding apparatus for a display device and a bonding method for a display device that can prevent damage to the substrates and improve the alignment of the substrates.

[0004] The problems to be solved by the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0005] According to one embodiment of the present invention, a bonding device for a display device includes a conveying means, a carrier movable along the conveying means and housing a substrate tray, a rotatable bonding stage disposed on the conveying means, a support disposed on the bonding stage and movable on the bonding stage along an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction toward the bonding stage, an upward direction opposite to the downward direction, a first rotation direction toward the upstream direction, and a second rotation direction toward the downstream direction, and a gripper connected to the support so as to be disposed between the support and the bonding stage.

[0006] According to one embodiment of the present invention, a bonding method for a display device includes a conveying means, a carrier movable along the conveying means and housing a substrate tray, a rotatable bonding stage disposed on the conveying means, a support disposed on the bonding stage and movable on the bonding stage along an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction toward the bonding stage, an upward direction opposite to the downward direction, a first rotation direction toward the upstream direction, and a second rotation direction toward the downstream direction, and a gripper connected to the support so as to be disposed between the support and the bonding stage. placing a carrier on the transport means; placing the bonding stage parallel to the transport means; placing a substrate on an upper surface of the bonding stage; supporting a first edge of the substrate in the downstream direction using a gripper; rotating the bonding stage so that the upper surface of the bonding stage faces the downstream direction; moving the support and the carrier in the downstream direction while the substrate is supported by the gripper; moving the support so that the gripper approaches a first hole of the substrate tray; and rotating the support in the second rotation direction while the gripper approaches the first hole.

[0007] Specific details of other embodiments are included in the detailed description and drawings. [Effects of the Invention]

[0008] According to an embodiment of the display device bonding apparatus and display device bonding method, damage to the substrates can be prevented and the alignment of the substrates can be improved.

[0009] The effects obtained from the present invention are not limited to those described above, and other effects not mentioned will be clearly understood by those having ordinary skill in the technical field to which the present invention pertains from the following description. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram of a vapor deposition apparatus according to an embodiment. [Figure 2] FIG. 2 is a perspective view of the substrate tray of FIG. [Figure 3] FIG. 2 is a perspective view of a carrier disposed on a transport track. [Figure 4] 4 is a diagram for explaining the substrate tray of FIG. 2 coupled to the carrier of FIG. 3. FIG. [Figure 5] 1 is a perspective view of a bonding device for a display device according to an embodiment; [Figure 6] 1 is a cross-sectional view of a support and a gripper of a bonding apparatus for a display device according to an embodiment; [Figure 7] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 8] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 9] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 10] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 11] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 12] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 13]10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 14] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 15] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 16] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 17] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 18] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 19] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 20] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 21] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 22] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 23] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 24] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 25] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 26] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 27] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 28] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 29] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. [Figure 30] 10A to 10C are diagrams illustrating a bonding method of a bonding device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] The advantages and features of the present invention, as well as methods for achieving them, will become clearer with reference to the following detailed embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various different forms. The present embodiments are provided solely for the purpose of complete disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art to which the present invention pertains. The present invention is defined solely by the scope of the claims.

[0012] When elements or layers are referred to as being "on" other elements or layers, this includes all cases where other layers or elements are directly on or between the other elements. The same reference numerals refer to the same components throughout the specification. The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments are merely examples, and the present invention is not limited to the details shown.

[0013] Although terms such as "first" and "second" are used to describe various components, it is understood that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it is understood that a "first" component referred to below may be a "second" component within the technical concept of the present invention.

[0014] The features of the various embodiments of the present invention may be partially or wholly combined or combined with one another, and may be technically interlocked and driven in various ways, and each embodiment may be implemented independently of the others or in conjunction with one another.

[0015] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0016] A manufacturing apparatus for a display device according to one embodiment may include a deposition apparatus (1000; e.g., a deposition apparatus for a substrate for a display device) of FIG. 1, a bonding apparatus (2000; e.g., a bonding apparatus between a substrate for a display device and a substrate tray) of FIG. 5, and a posture conversion apparatus (e.g., a posture conversion apparatus for a carrier for manufacturing a display device).

[0017] 1 is a schematic diagram of a deposition apparatus according to an embodiment, in which the direction opposite to the third direction DR3 (hereinafter referred to as the third opposite direction) may be the direction of gravity.

[0018] As shown in FIG. 1, a deposition apparatus 1000 for a display device according to one embodiment may include a chamber 100, a deposition source 200, a deposition stage 250, a mask structure 340, a substrate tray 700, a magnet plate 800, a transfer track 500, a carrier 600, and a driving mechanism 900.

[0019] The chamber 100 defines a deposition space within which a deposition process is performed. A film deposition process for manufacturing an organic light-emitting display device is performed within the chamber 100. The chamber 100 may be a vacuum chamber 100. The deposition source 200, deposition stage 250, driving mechanism 900, and part of the transfer track 500 are disposed within the chamber 100. Note that, when the deposition process is in progress, the deposition source 200, deposition stage 250, mask structure 340, substrate 50, substrate tray 700, magnet plate 800, part of the transfer track 500, and driving mechanism 900 are disposed within the chamber 100.

[0020] The deposition source 200 is disposed within the chamber 100. For example, the deposition source 200 is disposed between the first inner wall 101 of the chamber 100 and the deposition stage 250. The deposition source 200 provides a deposition material. The deposition material from the deposition source 200 passes through the opening 29 of the deposition stage 250 and moves toward the mask structure 340. Specifically, the deposition source 200 heats and vaporizes a deposition material, such as an organic material or an electrode material, at a high temperature. The vaporized deposition material can then be deposited on the substrate 50 through the pattern holes of the mask structure 340. The organic material can be, for example, a material for fabricating a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer disposed between an anode electrode and a cathode electrode of an organic light-emitting diode (OLED). The substrate 50 can be, for example, a substrate used in a display device including an organic light-emitting diode (OLED).

[0021] The deposition stage 250 is disposed on the deposition source 200. For example, the deposition stage 250 is disposed between the deposition source 200 and the mask structure 340. The deposition stage 250 is fixedly disposed inside the chamber 100. The deposition stage 250 may be inclined toward the deposition source 200. For example, the deposition stage 250 may be disposed so as to be inclined in a direction opposite to the second direction DR2 (hereinafter, referred to as the second opposite direction) with respect to the third direction DR3. Therefore, an acute angle may be formed between a surface of the deposition stage 250 facing the deposition source 200 and the ground on which the deposition stage 250 is disposed (e.g., the bottom surface of the chamber 100). In this case, a support protruding from a surface of the deposition stage 250 in the second direction is disposed below the deposition stage 250. The deposition stage 250 has a rectangular frame shape with a hole in the center. For example, the deposition stage 250 may have an opening in the center.

[0022] The mask structure 340 is disposed on the deposition stage 250. For example, the mask structure 340 is disposed between the deposition stage 250 and the substrate tray 700. The mask structure 340 may be placed on a support stand of the deposition stage 250. In this case, since the deposition stage 250 is tilted, the mask structure 340 is disposed in an inclined state on the deposition stage 250. The mask structure 340 may include a frame 300 and a mask 400.

[0023] The frame 300 is disposed on the deposition stage 250. For example, the frame 300 is disposed between the deposition stage 250 and the mask 400. The frame 300 has a square frame shape with a hole in the center. For example, the frame 300 may have an opening 39 in the center. Grooves 30 are disposed on both side edges of the frame 300. The frame 300 may include a magnetic material. For example, the frame 300 may include a material (e.g., iron (Fe)) that can be attached to a magnet.

[0024] The mask 400 is placed on the frame 300. For example, the mask 400 is placed between the frame 300 and the substrate tray 700. The mask 400 is placed on the frame 300 so as to cover the opening of the frame 300. The edge of the mask 400 is attached to the frame 300. For example, the mask 400 is attached to the frame 300 by welding. The mask 400 may be a fine metal mask (FMM).

[0025] The mask 400 may include multiple sub-masks (410; or mask sticks). Each of the sub-masks 410 may have a rectangular shape extending in the third direction DR3. The sub-masks 410 may be arranged along the first direction DR1. Adjacent sub-masks 410 may contact each other. The portions of each sub-mask 410, excluding both edges, are disposed over the opening 39 of the frame 300. Although not shown in the drawings, each sub-mask 410 may have multiple pattern holes penetrating the respective sub-mask 410 in the second direction DR2. The deposition material from the deposition source 200 may be deposited onto the substrate 50 through the pattern holes of each sub-mask 410. Each sub-mask 410 may be made of a material containing a magnetic material (e.g., iron (Fe)). For example, each sub-mask 410 may contain a material that is attracted to a magnet.

[0026] The substrate tray 700 is disposed on the mask structure 340. For example, the substrate tray 700 is disposed between the mask 400 of the mask structure 340 and the magnet plate 800. The substrate tray 700 can carry the substrate 50. In this case, the substrate tray 700 can attract the substrate 50 by electrostatic force. For example, the substrate tray 700 can provide a surface on which the substrate 50 is placed and also function as an electrostatic chuck that attracts and fixes the substrate 50 to one surface of the substrate tray 700. The substrate tray 700 is made of a material including ceramic or titanium.

[0027] The magnet plate 800 is disposed on the substrate tray 700. For example, the magnet plate 800 is disposed between the substrate tray 700 and the driving mechanism 900. The magnet plate 800 is disposed on the substrate tray 700 so as to face the substrate tray 700. The magnet plate 800 provides a magnetic force. For example, the magnet plate 800 can provide a magnetic force such that the metal mask 400 is tightly attached to the substrate 50.

[0028] The magnet plate 800 may include a base member 810 and a plurality of magnets 820 arranged on the base member 810. For example, the magnets 820 are arranged on the base member 810. As a specific example, if one side of the base member 810 facing the substrate tray 700 is defined as a first surface, the magnets 820 may be arranged on the first surface of the base member 810. Each magnet 820 may include, for example, a permanent magnet.

[0029] The magnets 820 have a north pole and a south pole. The magnets 820 arranged along the first direction DR1 are arranged so that the opposite poles face each other in the first direction DR1. The magnets 820 arranged along the second direction DR2 are arranged so that the opposite poles face each other.

[0030] When the surface opposite to the first surface of the base member 810 is defined as the second surface of the base member 810, a plurality of magnetic bodies 830 are disposed on the second surface of the base member 810. For example, the plurality of magnetic bodies 830 are disposed in the coupling grooves of the base member 810 on the second surface. For example, the magnetic bodies 830 may include a material (e.g., iron (Fe)) that can be attached to a magnet.

[0031] The drive mechanism 900 may include a first drive mechanism 910 and a second drive mechanism 920 .

[0032] The first drive mechanism 910 is disposed between the magnet plate 800 and the second drive mechanism 920. For example, the first drive mechanism 910 is disposed between the base member 810 of the magnet plate 800 and the second drive mechanism 920. The first drive mechanism 910 may include a magnet 89. For example, the magnet 89 is disposed on the surface of the first drive mechanism 910 opposite to the surface connected to the first drive shaft 911. The magnet 89 of the first drive mechanism 910 is disposed to correspond to (or overlap) the magnetic body 830 of the magnet plate 800. The magnet 89 may include a permanent magnet.

[0033] The magnet plate 800 is detachably attached to a first driving mechanism 910. For example, the base member 810 of the magnet plate 800 is detachably attached to the magnet 89 of the first driving mechanism 910. In other words, the magnetic material 830 of the base member 810 can be attached to the magnet 89 of the first driving mechanism 910 by magnetic force from the magnet 89 of the first driving mechanism 910. The first driving mechanism 910 moves toward or away from the deposition source 200 inside the chamber 100. For example, the first driving mechanism 910 can move along a second reverse direction or a second direction DR2. To this end, according to one embodiment, the first driving mechanism 910 may be connected to a first driving shaft 911 that extends along the second reverse direction or retracts along the second direction DR2. The first driving shaft 911 may be connected to an external driving unit via a hole 90 of the second driving mechanism 920 and a hole 21 of the chamber 100. In addition, the first driving mechanism 910 can further move in the first direction DR1, the direction opposite to the first direction DR1 (hereinafter referred to as the first opposite direction), the third direction DR3, or the third opposite direction. In this case, the first driving shaft 911 can further move in the first direction DR1, the first opposite direction, the third direction DR3, or the third opposite direction. The movement of the first driving mechanism 910 can control the movement of the magnet plate 800 attached to the first driving mechanism 910.

[0034] The second driving mechanism 920 is disposed between the first driving mechanism 910 and the second inner wall 102 of the chamber 100. The second driving mechanism 920 may include a permanent electromagnet 93. The substrate tray 700 is attached to the second driving mechanism 920. For example, the magnetic material 77 of the substrate tray 700 is attached to the second driving mechanism 920 by attaching the magnetic material 77 of the substrate tray 700 to the permanent electromagnet 93 of the second driving mechanism 920. The permanent electromagnet 93 is disposed on both side edges of the second driving mechanism 920. The magnetic material 77 is disposed on both side edges of the substrate tray 700 to correspond to the permanent electromagnet 93. The magnetic material 77 may include a magnetic material that is attached to a magnet, such as iron (Fe).

[0035] The second driving mechanism 920 may include an electromagnet instead of the permanent electromagnet 93. The second driving mechanism 920 may move toward or away from the deposition source 200 within the chamber 100. For example, the second driving mechanism 920 may move along a second reverse direction or a second direction DR2. To this end, according to one embodiment, the second driving mechanism 920 may be connected to a second driving shaft 921 that extends along the second reverse direction or retracts along the second direction DR2. The second driving mechanism 920 may also move in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. In such a case, the second driving shaft 921 may also move in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. The movement of the second driving mechanism 920 may control the movement of the substrate tray 700 attached to the second driving mechanism 920. The second drive mechanism 920 can perform an alignment operation between the substrate 50 on the substrate tray 700 and the mask structure 340 by controlling the position of the substrate tray 700 attached thereto.

[0036] The transport track 500 is arranged inside and outside the chamber 100 so as to pass through, for example, a first gate G1 and a second gate G2 of the chamber 100. The transport track 500 may extend along a first direction DR1. The first gate G1 and the second gate G2 are arranged to face each other.

[0037] The carrier 600 moves along the transport track 500. For example, the carrier 600 can move along the transport track 500 by a magnetic levitation system. The carrier 600 can transport the substrate tray 700.

[0038] As described above, the deposition stage 250 may have an upper side tilted toward the deposition source 200 (for example, tilted at the same angle as the carrier 600 shown in FIG. 11 , which will be described later). Therefore, the mask structure 340, substrate tray 700, substrate 50, magnet plate 800, first driving mechanism 910, second driving mechanism 920, transfer track 500, and carrier 600 may also be tilted at the same angle as the deposition stage 250. This allows particles generated during the deposition process on the substrate 50 to fall in the direction of gravity without adhering to the substrate 50. This prevents contamination of the substrate 50 by particles.

[0039] FIG. 2 is a perspective view of the substrate tray 700 of FIG.

[0040] As shown in FIG. 2, the substrate tray 700 may include a support plate 710 and an electrostatic chuck 720 .

[0041] The support plate 710 has the shape of a square frame with a hole in the center. For example, the support plate 710 can have an opening 79 in the center.

[0042] The electrostatic chuck 720 is disposed on the support plate 710. For example, the electrostatic chuck 720 is disposed between the support plate 710 and the substrate 50. In this case, the electrostatic chuck 720 may cover the opening 79 of the support plate 710. The substrate 50 is disposed on the electrostatic chuck 720. The electrostatic chuck 720 may attract the substrate 50 by electrostatic force.

[0043] At least one detachable member 7 is disposed on an edge of the substrate tray 700. For example, a detachable member 7 is disposed near each corner of a rectangular support plate 710. Specifically, the support plate 710 may have six detachable members 7, with three of the six detachable members 7 disposed on the upper, central, and lower sides of a first side 71 of the substrate tray 700, respectively, and the remaining three detachable members 7 disposed on the upper, central, and lower sides of a second side 72 of the substrate tray 700, respectively. The first side 71 and the second side 72 of the substrate tray 700 are disposed to face each other along the first direction DR1.

[0044] The detachable member 7 may include a coupling tip 7a and a separation groove 7b arranged adjacent to each other in the third direction DR3. The coupling tip 7a is arranged above the separation groove 7b. For example, in one detachable member 7, the coupling tip 7a is arranged above the separation groove 7b in the third direction DR3. The coupling tip 7a may have a smaller thickness (e.g., size in the second direction DR2) than other portions of the substrate tray 700. For example, the coupling tip 7a may have a smaller thickness (e.g., size in the second direction DR2) than other portions of the support plate 710. The separation groove 7b may have a recessed shape from the first side 71 toward the second side 72 of the substrate tray (700; e.g., the support plate 710) or a recessed shape from the second side 72 toward the first side 71. For example, separation grooves 7b arranged on different sides and facing each other may have recessed shapes toward each other.

[0045] 3 is a perspective view of a carrier disposed on a transport track, which may be a perspective view of a carrier 600 disposed on the transport track 500 of FIG.

[0046] The carrier 600 moves along the transport track 500. The transport track 500 may include a lower track 501 and an upper track 502 arranged to face each other in the third direction DR3, so that the carrier 600 is disposed between the lower track 501 and the upper track 502. The carrier 600 can move along the transport track 500 between the lower track 501 and the upper track 502.

[0047] The carrier 600 may have a square frame shape as shown in Fig. 3. However, the shape of the carrier 600 is not limited thereto and may be changed to various shapes.

[0048] 3, the carrier 600 may include a plurality of bars 601, 602, 603, 604 and a plurality of support members 610, 620, 630. For example, the carrier 600 may include a first bar 601, a second bar 602, a third bar 603, and a fourth bar 604 that are connected to one another. A substrate tray 700 is placed in an area (e.g., opening 88b) that is defined and surrounded by the first bar 601, the second bar 602, the third bar 603, and the fourth bar 604.

[0049] The first bar 601 and the second bar 602 face each other in the first direction DR1. The third bar 603 and the fourth bar 604 face each other in the third direction DR3. The first bar 601 is disposed between one end of the third bar 603 and one end of the fourth bar 604. The second bar 602 is disposed between the other end of the third bar 603 and the other end of the fourth bar 604.

[0050] The plurality of support members 610, 620, 630 may include at least one first support member 610 extending from the first bar 601, at least one second support member 620 extending from the second bar 602, and at least one third support member 630 extending from the third bar 603.

[0051] The first support member 610 may include an extension 611 and a plurality of protrusions 612. One side of the extension 611 may be connected to the first bar 601. The extension 611 may extend from the first bar 601 toward the second bar 602. A plurality of protrusions 612 (e.g., two protrusions 612) are disposed on the other side of the extension 611. The plurality of protrusions 612 may be rotatably connected to the other side of the extension 611. For example, each of the plurality of protrusions 612 rotates around an axis parallel to the first direction DR1. The plurality of protrusions 612 are disposed to face each other in the second direction DR2. Each of the plurality of protrusions 612 may have a cylindrical shape. However, the shape of the protrusions 612 is not limited thereto and may be changed to various shapes.

[0052] The second support member 620 may have the same configuration as the first support member 610 described above, except that the extension of the second support member 620 may extend from the second bar 602 towards the first bar 601.

[0053] The third support member 630 may include an extension 631, a protrusion 632, and a projection 633. One side of the extension 631 may be connected to the third bar 603. The extension 631 may extend from the third bar 603 toward the fourth bar 604. The projection 632 is disposed on the other side of the extension 631. The projection 633 is disposed on one side of the projection 632. The projection 633 may be rotatably connected to one side of the projection 632. For example, the projection 633 rotates around an axis parallel to the second direction DR2. The projection 633 may have a cylindrical shape. However, the shape of the projection 633 is not limited thereto and may be changed to various shapes.

[0054] FIG. 4 is a diagram illustrating the substrate tray 700 of FIG. 2 coupled to the carrier 600 of FIG.

[0055] As shown in FIG. 4, the first support member 610, the second support member 620, and the third support member 630 support a substrate tray 700.

[0056] The first support members 610 each support a first side 71 of the substrate tray 700. For example, the first side 71 of the substrate tray 700 is supported by being disposed between the protrusions 612 of the first support members 610. Specifically, the first side 71 can be supported by being disposed between the protrusions 612 of the first support members 610, whereby the coupled chip 7a of the first side 71 is supported.

[0057] The second support members 620 support the second sides 72 of the respective substrate trays 700. For example, the second sides 72 of the substrate trays 700 are supported by being disposed between the protrusions of the second support members 620. Specifically, the second sides 72 may be supported by being disposed between the protrusions of the second support members 620, whereby the coupling chips 7a of the second sides 72 are supported.

[0058] The third support members 630 support the third sides 73 of the respective substrate trays 700. For example, the third sides 73 of the substrate trays 700 are supported by being placed on the protrusions 633 of the third support members 630. In this case, the protrusions 633 of the third support members 630 may come into contact with the third sides 73.

[0059] The deposition apparatus of one embodiment may further include a pusher (55). The pusher 55 is disposed on the carrier 600. For example, the pusher 55 is disposed on a fourth bar 604 of the carrier 600. Specifically, the pusher 55 faces the fourth bar 604 through an opening 60 in the upper track 502. The pusher 55 and the opening 60 in the upper track 502 may be disposed within the chamber 100.

[0060] The pusher 55 moves toward the fourth bar 604 or in the opposite direction. For example, the pusher 55 can move along the third reverse direction or the third direction DR3. The pusher 55 can move a first step distance and a second step distance along the third reverse direction. Here, the second step distance may be greater than the first step distance. Here, when the pusher 55 descends the second step distance along the third reverse direction, the lower track 501 can also descend along the third reverse direction. For example, when the pusher 55 descends the second step distance, the pusher 55 and the lower track 501 can both descend in the same direction.

[0061] When the pusher 55 descends in the third reverse direction by a first step, the pusher 55 may come into contact with the carrier 600. The carrier 600 may descend in the third reverse direction due to pressure applied by the pusher 55. In this case, the lower track 501 does not descend but remains unchanged, thereby reducing the gap between the carrier 600 and the lower track 501. As a result, the carrier 600 may be stably positioned on the lower track 501 within the chamber 100. When the pusher 55 descends by the first step, the descending distance is short, so that the substrate tray 700 accommodated in the carrier 600 may remain supported by the support members 610, 620, and 630 of the carrier 600 even when the carrier 600 descends due to pressure applied by the pusher 55.

[0062] When the pusher 55 descends the second-stage distance, the lower track 501 may simultaneously descend along the third reverse direction along with the pusher 55. In other words, the pusher 55 and the lower track 501 may simultaneously descend along the third reverse direction. Therefore, the carrier 600 and the lower track 501 may descend along the third reverse direction. In this case, the gap between the carrier 600 and the lower track 501 may be substantially the same as the gap between the carrier 600 and the lower track 501 when the pusher 55 descends the first-stage distance described above. Therefore, the first support member 610, the second support member 620, and the third support member 630 are each moved in the third reverse direction, thereby positioning the protrusions 612 of each first support member 610 and the protrusions of each second support member 620 to face each other across the separation grooves 7b of the substrate tray 700. In other words, the protrusions 612 of each first support member 610 and the coupling chips 7a on the first side 71 of the substrate tray 700 do not contact each other, and the protrusions 612 of each second support member 620 and the coupling chips on the second side 72 of the substrate tray 700 do not contact each other. Furthermore, as described above, as the pusher 55 moves the carrier 600 downward in the third reverse direction, the third support member 630 and the substrate tray 700 may move apart from each other. For example, as the protrusions 612 of the second support member 620 and the third side 73 of the substrate tray 700 move apart from each other, the protrusions 633 of the third support member 630 do not come into contact with the third side 73. Therefore, the substrate tray 700 is no longer supported by the carrier 600. Therefore, the substrate tray 700 can be easily moved in the second direction DR2 and the second reverse direction without interference with the carrier 600.

[0063] The substrate tray 700 and the substrate 50 are provided from the bonding apparatus 2000. For example, the substrate tray 700 and the substrate 50 from the bonding apparatus 2000 are provided to the deposition apparatus 1000 via a posture changing device.

[0064] Hereinafter, the bonding apparatus 2000 for a display device according to an embodiment will be described in detail as follows.

[0065] 5 is a perspective view of a bonding apparatus 2000 for a display device according to an embodiment, and FIG. 6 is a cross-sectional view of a support 83 and a gripper 84 of the bonding apparatus 2000 for a display device according to an embodiment. For example, the support 83 and the gripper 84 in FIG. 6 correspond to the support 83 and the gripper 84 in FIG. 5, respectively.

[0066] As shown in Figures 5 and 6, the bonding device 2000 for a display device according to one embodiment may include a conveying means 31, a bonding stage 40, a moving body 80, a first drive arm (95), a first guide bar (61), a second guide bar 62, and a plurality of support bars (70).

[0067] As shown in FIG. 5 , the substrate tray 700 may further include a plurality of first clamps 11 and a plurality of first holes 41 arranged on one edge of the base plate 710, and a plurality of second clamps 12 and a plurality of second holes 42 arranged on the other edge of the base plate 710. The first clamps 11 and the plurality of first holes 41 are arranged adjacent to the first bar 601 of the carrier 600. The second clamps 12 and the plurality of second holes 42 are arranged adjacent to the second bar 602 of the carrier 600. The first clamps 11 and the first holes 41 are arranged alternately along the second direction DR2. The second clamps 12 and the second holes 42 are arranged alternately along the second direction DR2. The first clamps 11, the first holes 41, the second clamps 12, and the second holes 42 are exposed to the outside through through holes that penetrate the electrostatic chuck 720. The first holes 41 and the second holes 42 are arranged to correspond to the gripper 84, which will be described later.

[0068] The conveying means 31 is arranged along a first direction DR1. The conveying means 31 can convey the carrier 600 along the first direction DR1. The conveying means 31 may include rollers 32 and a connecting shaft 33 connecting the rollers 32. The connecting shaft 33 may extend along a second direction DR2. The rollers 32 may be connected to one side and the other side of the connecting shaft 33. The rollers 32 may be rotatably connected to the connecting shaft 33.

[0069] The first guide bar 61 and the second guide bar 62 are arranged to face each other. For example, the first guide bar 61 and the second guide bar 62 are arranged to face each other in the second direction DR2.

[0070] The first guide bar 61 may include a first rail 61a and a first opening 61b. The first rail 61a is disposed on the first guide bar 61 along the extension direction (or longitudinal direction; for example, the first direction DR1) of the first guide bar 61. The first opening 61b penetrates the first guide bar 61. The first opening 61b may extend along the first rail 61a. The substrate 50 may be loaded into the bonding apparatus 2000 from the outside via the first opening 61b, or the substrate 50 may be unloaded from the bonding apparatus 2000 to the outside via the first opening 61b.

[0071] The second guide bar 62 may include a second rail 62a and a second opening 62b. The second rail 62a is disposed on the second guide bar 62 along the extension direction (or longitudinal direction; e.g., the first direction DR1) of the second guide bar 62. The second opening 62b penetrates the second guide bar 62. The second opening 62b may extend along the second rail 62a. The substrate 50 may be loaded into the bonding apparatus 2000 from the outside via the second opening 62b, or the substrate 50 may be unloaded from the bonding apparatus 2000 to the outside via the second opening 62b.

[0072] The support bar 70 is disposed between the first guide bar 61 and the second guide bar 62. FIG. 2 shows an example in which two support bars 70 are disposed spaced apart in the first direction. The support bars 70 are each disposed parallel to the connecting shaft 33 of the conveying means 31. The support bars 70 may each extend in the second direction DR2. The support bar 70 may connect the first guide bar 61 and the second guide bar 62 to each other. For example, one end of each support bar 70 may be connected to the inner surface of the first guide bar 61, and the other end of each support bar 70 may be connected to the inner surface of the second guide bar 62.

[0073] The bonding stage 40 is disposed on a plurality of support bars 70. For example, the bonding stage 40 is disposed on the plurality of support bars 70 between the first guide bar 61 and the second guide bar 62. The bonding stage 40 may be connected to the plurality of support bars 70. The bonding stage 40 may include a base plate 411 and a plurality of support pins 422.

[0074] The base plate 411 of the bonding stage 40 is disposed on the support bar 70. The base plate 411 may be connected to the support bar 70. The support pins 422 of the bonding stage 40 are disposed on the base plate 411. The support pins 422 may have a columnar shape protruding upward from the base plate 411. The support pins 422 are connected to the base plate 411. For example, one side of the support pin 422 may be connected to the base plate 411. A spherical ball is disposed on the other end of the support pin 422 and is rotatably connected to the support pin 422. A plurality of support pins 422 may be arranged in a matrix on the base plate 411.

[0075] The moving body 80 is disposed on the bonding stage 40. For example, the moving body 80 is disposed on the bonding stage 40 so as to overlap the bonding stage 40. The moving body 80 may be movably coupled to the first guide bar 61 and the second guide bar 62. The moving body 80 moves between the first guide bar 61 and the second guide bar 62 along the first rail 61a of the first guide bar 61 and the second rail 62a of the second guide bar 62. For example, the moving body 80 is guided by the first rail 61a and the second rail 62a and can move on the bonding stage 40 along the first direction DR1 or the first reverse direction DR1. The moving body 80 may include a support 83, a first driving unit 85, a second driving unit 86, a first coupling unit 81, a second coupling unit 82, and a gripper 84.

[0076] The support 83 of the moving body 80 is disposed between the first guide bar 61 and the second guide bar 62. The support 83 may extend along the second direction DR2. The support 83 is disposed on the bonding stage 40 so as to overlap the bonding stage 40. The support 83 may have an "R" shaped cross section.

[0077] According to one embodiment, the support 83 may include a horizontal portion 83a and a vertical portion 83b, as shown in Figure 6. The vertical portion 83b may extend downward from one side of the horizontal portion 83a. For example, the vertical portion 83b may extend from one side of the horizontal portion 83a along a third opposite direction.

[0078] The gripper 84 of the moving body 80 is disposed on the support 83. The gripper 84 is disposed below the support 83. The gripper 84 may be arranged in a line along the support 83 in the second direction DR2 between the first guide bar 61 and the second guide bar 62. In other words, the gripper 84 is disposed below the support 83 along the extension direction of the support 83 (e.g., the second direction DR2). The gripper 84 is coupled to and supported by the support 83. The gripper 84 may have an "L"-shaped cross section.

[0079] According to one embodiment, the gripper 84 may include a connecting portion 84a, a first extension portion 84c, a second extension portion 84b, and a pressure means 84d.

[0080] The coupling portion 84 a of the gripper 84 can be connected to the vertical portion 83 b of the support 83 .

[0081] The first extension portion 84c of the gripper 84 may extend in a first opposite direction from one edge of the connecting portion 84a.

[0082] The second extension 84b of the gripper 84 is disposed on the first extension 84c. For example, the second extension 84b is disposed between the first extension 84c and the support 83. The second extension 84b may extend along the first opposite direction from the center of the coupling portion 84a.

[0083] The pressure applying means 84d of the gripper 84 is disposed between the first extension 84c and the second extension 84b. The pressure applying means 84d may be movably connected to the second extension 84b. For example, the pressure applying means 84d may move between the first extension 84c and the second extension 84b toward the first extension 84c or toward the second extension 84b. The pressure applying means 84d may be connected to an actuator disposed within the second extension 84b, for example.

[0084] The gripper 84 grips the substrate 50 via the pressure means 84d and the first extension 84c. For example, when the pressure means 84d moves toward the first extension 84c, the substrate 50 may come into contact with the first extension 84c and the pressure means 84d. In this case, the substrate 50 can be supported between the first extension 84c and the pressure means 84d due to the pressure applied by the pressure means 84d.

[0085] The gripper 84 may include the aforementioned connecting portion 84a and first extension portion 84c. In other words, the second extension portion 84b and the pressure means 84d may be omitted from the gripper 84 of FIG.

[0086] The first coupling part 81 of the moving body 80 is movably coupled to the first rail 61a of the first guide bar 61. The first coupling part 81 may include a first wheel movably coupled to the first rail 61a, so that the first coupling part 81 can move along the first rail 61a by being driven by the first wheel.

[0087] The second coupling part 82 of the moving body 80 is movably coupled to the second rail 62a of the second guide bar 62. The second coupling part 82 may include a second wheel movably coupled to the second rail 62a, so that the second coupling part 82 can move along the second rail 62a by driving the second wheel. The centers of the rotational axes of the first wheel and the second wheel are parallel to and coincide with each other. The rotational directions of the first wheel and the second wheel may be the same.

[0088] The first driving unit 85 of the moving body 80 is disposed on one side of the support 83. The first driving unit 85 may be connected to one side of the support 83 and one side of the first connecting unit 81. For example, the first driving unit 85 may include a first actuator 971 connected to one side of the support 83. The first actuator 971 may extend (or expand) and contract under control of the first driving unit 85. The first driving unit 85 may include a first rotating shaft 981 rotatably connected to one side of the first connecting unit 81. The first driving unit 85 rotates clockwise or counterclockwise around the first rotating shaft 981. The first driving unit 85 may control the rotation direction of the first wheel of the first connecting unit 81.

[0089] The second drive unit 86 of the moving body 80 is disposed on the other side of the support 83. The second drive unit 86 may be connected to the other side of the support 83 and one side of the second coupling unit 82. For example, the second drive unit 86 may include a second actuator 972 connected to the other side of the support 83. The second actuator 972 may extend and retract under control of the second drive unit 86. The second drive unit 86 may include a second rotation shaft 982 rotatably connected to one side of the second coupling unit 82. The second drive unit 86 rotates clockwise or counterclockwise around the second rotation shaft 982. The center of the second rotation shaft 982 and the center of the first rotation shaft 981 are parallel to and coincide with each other. The second drive unit 86 may control the rotation direction of the second wheel of the second coupling unit 82.

[0090] By the operation of the first actuator 971 of the first driving unit 85 and the second actuator 972 of the second driving unit 86, the support 83 moves in a direction away from the first driving unit 85 and the second driving unit 86, or moves in a direction toward the first driving unit 85 and the second driving unit 86. For example, when the first actuator 971 and the second actuator 972 operate in an extension direction, the support 83 moves in a direction away from the first driving unit 85 and the second driving unit 86. In addition, when the first actuator 971 and the second actuator 972 operate in a contraction direction, the support 83 moves in a direction toward the first driving unit 85 and the second driving unit 86. As a result, the distance between the support 83 and the bonding stage 40 can be adjusted.

[0091] The support 83 rotates clockwise or counterclockwise around the first rotation axis (or the second rotation axis) due to the operation of the first rotation axis 981 of the first driving unit 85 and the second rotation axis 982 of the second driving unit 86. As a result, the support 83 rotates clockwise or counterclockwise around the first rotation axis (981) of the first driving unit 85 or the second rotation axis 982 of the second driving unit 86.

[0092] The first drive arm 95 controls the tilt angle of the first guide bar 61. The first drive arm 95 may be rotatably connected to the other side of the first coupling part 81. The first drive arm 95 may include a first link 91 and a second link 92. One side of the first link 91 may be rotatably connected to the first coupling part 81. For example, one side of the first link 91 may be connected to a first rotation shaft 981 of the first drive part 85. The other side of the first link 91 may be rotatably connected to a second link 92. The other side of the second link 92 may be connected to a first drive motor.

[0093] Although not shown in the drawings, a second drive arm that controls the tilt angle of the second guide bar 62 may be further connected to the other side of the second coupling part 82. The second drive arm is disposed opposite the above-described first drive arm 95 and may have substantially the same configuration as the first drive arm 95. For example, the second drive arm may be rotatably connected to the second coupling part 82. The second drive arm may include a third link corresponding to the first link 91 and a fourth link corresponding to the second link 92. One side of the third link may be rotatably connected to the second coupling part 82. For example, one side of the third link may be connected to the second rotation shaft 982 of the second drive part 86. The other side of the third link may be rotatably connected to the fourth link. The other side of the fourth link may be connected to the second drive motor.

[0094] The tilt angle of the first guide bar 61 and the second guide bar 62 is controlled by driving the links of the first drive arm 95 (e.g., the first link 91 and the second link 92) and the links of the second drive arm (e.g., the third link and the fourth link), and therefore the tilt angle of the support bar 70 connected to the guide bars 61 and 62 can be controlled. Furthermore, by controlling the tilt angle of the support bar 70, the tilt angle of the joining stage 40 connected to the support bar 70 can be controlled. Therefore, the tilt angle of the joining stage 40 can be controlled by driving the links of the first drive arm 95 (e.g., the first link 91 and the second link 92) and the links of the second drive arm (e.g., the third link and the fourth link).

[0095] The operation of the bonding device 2000 according to an embodiment will be described in detail below.

[0096] Figures 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 and 30 are figures for explaining the bonding method of a bonding device according to one embodiment. Here, Figure 13 is an enlarged view of the first clamp and the first hole area in Figure 12, Figure 14 is a cross-sectional view along line I-I' in Figure 13, Figure 16 is a cross-sectional view along line II-II' in Figure 15, Figure 18 is a cross-sectional view along line III-III' in Figure 17, Figure 20 is an enlarged view of the first clamp and the first hole area in Figure 19, Figure 23 is an enlarged view of the first clamp and the first hole area in Figure 22, Figure 28 is an enlarged view of the second clamp and the second hole area in Figure 27, and Figure 30 is an enlarged view of the second clamp and the second hole area in Figure 29.

[0097] 7, a carrier (600; e.g., carrier 600 housing substrate trays 700) is disposed on conveying means 31 of bonding apparatus 2000, and bonding stage 40 is disposed on carrier 600 so as to overlap carrier 600. In this case, moving body 80 is disposed at one end of first guide bar 61 and second guide bar 62 so as not to cover first opening 61b of first guide bar 61 and second opening 62b of second guide bar 62. For example, if the conveying direction (e.g., first direction DR1) of conveying means 31 relative to bonding stage 40 is defined as the downstream direction and the opposite direction (or reverse direction) of the conveying direction of conveying means 31 is defined as the upstream direction, moving body 80 is disposed at one end of first guide bar 61 and second guide bar 62 in the upstream direction. In this case, moving body 80 may not overlap bonding stage 40 or may overlap the edge of bonding stage 40.

[0098] 7 and 8, the substrate 50 is loaded into the bonding apparatus 2000 from outside. For example, the substrate 50 supported by a robot arm may be loaded into the bonding apparatus 2000. As a specific example, the robot arm may include a plurality of fingers spaced apart from one another, and the substrate 50 placed on the fingers may be loaded into the bonding apparatus 2000 together with the fingers. For example, the fingers on which the substrate 50 is placed pass through the first opening 61b of the first guide bar 61 and are positioned between the first guide bar 61 and the second guide bar 62. Therefore, the bonding stage 40 is positioned below the fingers so as to overlap the fingers, and a carrier (600; for example, the carrier 600 carrying the substrate tray 700) is positioned below the bonding stage 40 so as to overlap the bonding stage 40. In other words, the fingers are disposed between the bonding stage 40 and the substrate 50 between the first guide bar 61 and the second guide bar 62, the bonding stage 40 is disposed between the fingers and the carrier 600, and the carrier 600 is disposed between the bonding stage 40 and the conveying means 31. In this case, the bonding stage 40 can maintain a horizontal position. For example, the bonding stage 40 and the carrier (600; or the substrate tray 700 housed in the carrier 600) are disposed parallel to each other. In addition, the fingers can be disposed on the bonding stage 40 so as not to overlap with the support pins 422 of the bonding stage 40.

[0099] The fingers then descend toward the bonding stage 40. The descended fingers are positioned between the support pins 422 of the bonding stage 40. As the fingers descend, the substrate 50 placed on the fingers is supported by the support pins 422. In other words, as the fingers descend, the substrate 50 can be supported only by the support pins 422 instead of the fingers. In this case, the lower surface of the substrate 50 can come into contact with the balls of the support pins 422, as shown in FIG. 9 .

[0100] Next, the finger that has transferred the substrate 50 is ejected to the outside through the first opening 61b.

[0101] Then, as shown in Figure 9, the movable body 80 moves downstream (e.g., in the first direction DR1) along the first guide bar 61 and the second guide bar 62 and is positioned so as to be close to the first side (or edge; 51) of the substrate 50 on the bonding stage 40.

[0102] Next, the movable body 80 moves so that the gripper 84 of the movable body 80 is positioned between the bonding stage 40 and the substrate 50. In this case, the gripper 84 supports the lower surface of the substrate 50 (e.g., the lower surface of the first side 51 of the substrate 50) between the support pins 422. For example, the gripper 84 may support the lower surface of the substrate 50 (e.g., the lower surface of the first side 51 of the substrate 50) at one edge of the bonding stage 40. In this state, the gripper 84 grips the first side 51 of the substrate 50. Alternatively, the gripper 84 may only support the first side 51 of the substrate 50, without gripping it.

[0103] 10, the bonding stage 40 rotates while the first edge 51 of the substrate 50 is supported by the gripper 84. For example, the bonding stage 40 tilts while the first edge 51 of the substrate 50 is supported by the gripper 84. For example, the bonding stage 40 may tilt downstream as the first guide bar 61 and the second guide bar 62 tilt under the control of the first drive arm 95 and the second drive arm. Specifically, the bonding stage 40 may tilt at a predetermined angle so that the upper surface of the bonding stage 40 (e.g., the surface on which the support pins 422 are disposed) faces the downstream side of the conveying means 31 and the lower surface of the bonding stage 40 (e.g., the surface opposite the upper surface of the bonding stage 40) faces the upstream side of the conveying means 31. Here, the angle formed between the upper surface of the tilted bonding stage 40 and the downstream conveying means 31 may be an obtuse angle. Also, the angle formed between the lower surface of the inclined bonding stage 40 and the upstream conveying means 31 may be an acute angle.

[0104] 11 to 14, the moving body 80 moves downstream along the first and second guide bars 61 and 62, which are inclined toward the downstream direction, and the carrier 600 also moves downstream on the conveying means 31. In this case, the substrate 50 on the support pins 422 can also move downstream along the inclined surface of the bonding stage 40 together with the moving body 80. For example, the substrate 50 can be moved downstream together with the moving body 80 while being supported (and / or gripped) by the gripper 84 of the moving body 80. Here, the moving body 80 moves downstream along the inclined first and second guide bars 61 and 62, while the carrier 600 moves downstream along the conveying means 31, which is not inclined but is horizontal. As the moving body 80 and the carrier 600 move downstream, the gripper 84 of the moving body 80 can gradually approach the first hole 41 arranged in the substrate tray 700 of the carrier 600.

[0105] As shown in FIGS. 12 to 14 , when the gripper 84 of the movable body 80 approaches the first hole 41 of the substrate tray, the movable body 80 and the carrier 600 stop moving. In this case, as shown in FIGS. 13 to 14 , the substrate 50 is supported by the gripper 84 and the bonding stage 40 and placed on the electrostatic chuck 720. For example, as shown in FIGS. 13 and 14 , the substrate 50 and the electrostatic chuck 720 are spaced apart by a predetermined distance in the third direction DR3 so as not to contact each other, and a portion of the substrate 50 (e.g., a portion of the substrate 50 including the first edge 51) overlaps with a portion of the electrostatic chuck 720 on the electrostatic chuck 720. Here, as shown in FIGS. 13 and 14 , the angle (θ) formed between the substrate 50 and the electrostatic chuck 720 near the first edge 51 of the substrate 50 may be an acute angle. For example, the angle (θ) formed between the opposing surfaces of the substrate 50 and the electrostatic chuck 720 near the first edge 51 of the substrate 50 may be an acute angle. Specifically, if one surface of the substrate 50 facing the electrostatic chuck is defined as a first surface S1 and one surface of the electrostatic chuck 720 facing the first surface S1 is defined as a second surface S2, the angle (θ) formed between the first surface S1 of the substrate 50 and the second surface S2 of the electrostatic chuck 720 near the first side 51 of the substrate 50 may be an acute angle. In other words, the angle (θ) formed between an imaginary first extended surface SS1 extending along the first surface S1 of the substrate 50 and an imaginary second extended surface S22 extending along the second surface S2 of the electrostatic chuck 720 near the first side 51 of the substrate 50 may be an acute angle.

[0106] Then, as shown in FIGS. 15 and 16 , the first driver 85 and the second driver 86 rotate downstream by a predetermined angle. Therefore, the support 83 and the gripper 84 attached to the support 83 can rotate downstream by a predetermined angle. For example, the support 83 and the gripper 84 attached to the support 83 can rotate downstream by a predetermined angle so that the horizontal portion 83a of the support 83 and the upper surface (e.g., the inclined surface) of the bonding stage 40 are not parallel. As a result, the gripper 84 can overlap with each of the first holes 41 on the first holes 41. Furthermore, as the substrate 50 moves a predetermined distance downstream due to the rotation of the gripper 84, the first edge 51 of the substrate 50 can overlap with the first holes 41. In this case, as shown in FIG. 16 , the substrate 50 is supported by the gripper 84 and the bonding stage 40 and placed on the electrostatic chuck 720. 16 , the substrate 50 and the electrostatic chuck 720 are spaced apart by a predetermined distance in the third direction DR3 so as not to contact each other, and a portion of the substrate 50 (e.g., a portion of the substrate 50 including the first edge 51) may overlap a portion of the electrostatic chuck 720 on the electrostatic chuck 720. Here, the rotation of the gripper 84 causes the first edge 51 of the substrate 50 and a portion of the substrate 50 adjacent to the first edge 51 to be positioned parallel to the electrostatic chuck 720. For example, if the first edge 51 and the portion of the substrate 50 adjacent to the first edge 51 are defined as the outer portion A of the substrate 50, the opposing surfaces S1 and S2 of the substrate 50 and the electrostatic chuck 720 may be parallel to each other in the outer portion A of the substrate 50. Specifically, the first surface S1 of the substrate 50 and the second surface S2 of the electrostatic chuck 720 may be parallel to each other in the outer portion A of the substrate 50. In other words, the imaginary first extension plane SS1 extending along the first surface S1 of the substrate 50 and the imaginary second extension plane S22 extending along the second surface S2 of the electrostatic chuck 720 at the outer portion A of the substrate 50 may be parallel to each other. Note that, depending on the rotation angle of the gripper 84 in FIGS. 15 and 16 , the substrate 50 may have a curved shape that is not a straight line at the outer portion A of the substrate 50. For example, the substrate 50 may have a parabolic shape that is convex toward the electrostatic chuck 720 at the outer portion A of the substrate 50.

[0107] Next, as shown in FIGS. 17 and 18 , the first actuator 971 and the second actuator 972 may extend the substrate 50 a predetermined distance toward the substrate tray 700. As a result, the support 83 connected to the first actuator 971 and the second actuator 972 and the gripper 84 connected to the support 83 may descend toward the electrostatic chuck 720 of the substrate tray 700. In this case, the grippers 84 may be inserted into the first holes 41, respectively. For example, the grippers 84 may be inserted into the first holes 41 while being biased toward the upstream side in each space of the first holes 41. Here, because the size of the first holes 41 in the first direction DR1 is larger than the size of the grippers 84 in the first direction DR1, when the grippers 84 are inserted into the first holes 41, an extra space (or gap) may exist between each gripper 84 and each first hole 41. For example, when the gripper 84 is inserted into the first hole 41, there may be clearance within the first hole 41 to allow the gripper 84 to move further downstream. In this case, as the gripper 84 is inserted into the first hole 41, a portion of the substrate 50 (e.g., an outer portion A of the substrate 50) may first come into contact with the electrostatic chuck 720 of the substrate tray 700. According to one embodiment, at the time of initial contact between the substrate 50 and the electrostatic chuck 720, the outer portion A of the substrate 50 and the electrostatic chuck 720 may come into face-to-face contact. This is because, for example, as shown in FIGS. 15 and 16 , the rotation of the gripper 84 causes the opposing surfaces S1 and S2 of the substrate 50 and the electrostatic chuck 720 to be parallel to each other at the outer portion A of the substrate 50. This prevents the first edge 51 of the substrate 50 from initially coming into line-to-line contact with the electrostatic chuck 720 when the substrate 50 forms a predetermined angle (e.g., θ) with the electrostatic chuck 720. Therefore, according to one embodiment, damage to the substrate 50 when the substrate 50 first comes into contact with the electrostatic chuck 720 (e.g., in a line-to-line contact) is prevented, and the contact area between the substrate 50 and the electrostatic chuck 720 is increased at the time of initial contact between the substrate 50 and the electrostatic chuck, thereby improving the adhesion (or cohesion) between the substrate 50 and the electrostatic chuck 720. In addition, the alignment of the substrate 50 on the substrate tray 700 is improved.

[0108] It should be noted that, when the gripper 84 is gripping the substrate 50, before the gripper 84 of the moving body 80 is inserted into the first hole 41, the grip of the gripper 84 on the substrate 50 is released first.

[0109] 19 and 20, the first clamp 11 rotates toward the upper surface of the substrate 50 to clamp the substrate 50. As a result, the first side 51 of the substrate 50 and its periphery can be supported and fixed by the first clamp 11.

[0110] 21, with the gripper 84 inserted into the first hole 41, the moving body 80 moves a predetermined distance downstream and then stops. The gripper 84 can then move downstream into the free space of each first hole 41. As a result, the gripper 84 moves away from the first edge 51 of the substrate 50, and contact between the first edge 51 of the substrate 50 and the gripper 84 is released. In other words, the first edge 51 (or outer portion A) of the substrate 50 may be supported by the first clamp 11 rather than by the gripper 84. In this case, the first clamp 11 may function as a stopper that prevents the substrate 50 from moving downstream. According to one embodiment, the gripper 84 and the first clamp 11 may support the substrate 50 together for a certain period of time. For example, as shown in FIG. 18, the first clamp 11 may clamp the substrate 50 while the gripper 84 supports the substrate 50. In other words, the first side 51 of the substrate 50 and the outer portion A of the substrate 50 may be supported simultaneously by the gripper 84 and the first clamp 11 for a certain period of time. However, after the certain period of time, the gripper 84 may release its support of the substrate 50, while the first clamp 11 may maintain its support of the substrate 50. In this manner, the time during which the gripper 84 supports the first side 51 of the substrate 50 and the outer portion A of the substrate 50 and the first clamp 11 support the first side 51 of the substrate 50 and the outer portion A of the substrate 50 overlap for a certain period of time, so that the position of the substrate 50 can be maintained constant without shifting during the clamping operation by the first clamp 11.

[0111] Therefore, when the means for supporting the substrate 50 is switched from the gripper 84 to the first clamp 11, the alignment of the substrate 50 on the electrostatic chuck 720 is improved.

[0112] In order to minimize damage to the substrate 50 due to friction between the substrate 50 and the gripper 84 as the gripper 84 supporting the substrate 50 moves horizontally, the movable body 80 may further descend toward the hole 41 before moving a predetermined distance in the downstream direction. For example, in FIG. 18, the gripper 84 may further descend in the third reverse direction and then move in the downstream direction (e.g., in the first direction DR1) as shown in FIG.

[0113] 22 and 23, with the first edge 51 of the substrate 50 supported and fixed by the first clamp 11, the movable body 80 moves up in the third direction DR3 away from the first hole 41. As a result, the gripper 84 can move up after being exposed to the outside within the first hole 41. Therefore, the gripper 84 can be positioned on the substrate 50 so as not to come into contact with the substrate 50.

[0114] 24, the first driving unit 85 and the second driving unit 86 rotate by a predetermined angle toward the upstream side. As a result, the support 83 and the gripper 84 attached to the support 83 can rotate by a predetermined angle toward the upstream side. For example, the support 83 and the gripper 84 attached to the support 83 can rotate by a predetermined angle toward the upstream side so that the horizontal portion 83a of the support 83 and the upper surface (e.g., the inclined surface) of the bonding stage 40 become parallel.

[0115] 25 and 26, the carrier 600 can move downstream while the first edge 51 of the substrate 50 is supported and fixed by the first clamp 11. In other words, the carrier 600 can move further downstream while the bonding stage 40 remains stationary. As a result, the electrostatic chuck 720 of the substrate tray 700, which was covered by the bonding stage 40, is gradually exposed, and the substrate 50 clamped by the first clamp 11 of the substrate tray 700 is gradually moved downstream together with the substrate tray 700. As a result, the remaining portion of the substrate 50 on the bonding stage 40 can gradually come into contact with the electrostatic chuck 720. In other words, the movement of the carrier 600 moves the substrate tray 700 in the downstream direction, and in response to such movement of the substrate tray 700, the substrate tray 700 can pull the substrate 50 down from the bonding stage 40 (e.g., the bonding stage 40 tilted toward the downstream side) while gripping the first edge 51 of the substrate 50 on the bonding stage 40. Therefore, as the carrier (600; or the substrate tray 700 on the carrier 600) moves downstream, the contact area between the bonding stage 40 (e.g., the support pins 422 of the bonding stage 40) and the substrate 50 gradually decreases, while the contact area between the electrostatic chuck 720 of the substrate tray 700 housed in the carrier 600 and the substrate 50 gradually increases. Therefore, the substrate 50 on the bonding stage 40 can be transferred from the bonding stage 40 onto the electrostatic chuck 720 of the substrate tray 700 while being moved downstream.

[0116] 27 and 28 , the carrier 600 may be further moved in the downstream direction until the carrier 600 and the bonding stage 40 no longer overlap. The substrate 50 may then be completely moved from the bonding stage 40 onto the electrostatic chuck 720 of the substrate tray 700. As the carrier 600 moves in the downstream direction, the first edge 51 of the substrate 50, which is closer to the downstream side, may begin to contact the electrostatic chuck 720, and then the second edge 52 of the substrate 50 may finally contact the electrostatic chuck 720. In this case, the second edge 52 of the substrate 50 on the electrostatic chuck 720 may be positioned adjacent to the second clamp 12 and the second hole 42 of the substrate tray 700.

[0117] 29 and 30 , the second clamp 12 rotates toward the upper surface of the substrate 50 to clamp the substrate 50. Therefore, the second side 52 of the substrate 50 and its periphery can be supported and fixed by the second clamp 12. Therefore, the substrate 50 can be supported and fixed on the electrostatic chuck 720 by the first clamp 11 and the second clamp 12.

[0118] Next, the carrier 600 containing the substrate tray (700; e.g., the substrate tray 700 on which the substrate 50 is placed) can move further in the downstream direction (e.g., the first direction) along the transport means 31 and be loaded into the posture conversion device.

[0119] The attitude changing device can change the attitude of the carrier 600. For example, after the aforementioned bonding process between the substrate 50 and the substrate tray 700, the attitude changing device can change the attitude of the carrier 600 transported along the transport means 31 from a horizontal attitude to a vertical attitude as shown in Fig. 4. In addition, in the attitude changing device, an electrostatic force is applied from the electrostatic chuck 720, so that the substrate 50 can adhere to the electrostatic chuck 720.

[0120] Thereafter, the vertically oriented carrier (600; for example, the vertically oriented carrier 600 including the substrate tray 700 and the substrate 50) can be loaded into the bonding apparatus 1000 along the conveying means 31. For example, the vertically oriented carrier 600 can be conveyed along the conveying means 31 and loaded into the chamber 100 through the first gate G1 of the chamber 100 of FIG. 1. In the chamber 100, a deposition process can be performed on the substrate 50 accommodated in the vertically oriented carrier 600. In this case, the substrate 50 can receive the deposition material while maintaining the vertical orientation inside the chamber 100.

[0121] Those skilled in the art will understand that the present specification can be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. The scope of the present specification is defined by the claims below, rather than the above detailed description, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present specification.

[0122] In addition, the present specification and drawings disclose preferred embodiments of the present specification, and specific terms are used, but these are used in a general sense merely to easily explain the technical content of the present specification and to aid in understanding the invention, and are not intended to limit the scope of the present specification. In addition to the embodiments disclosed herein, it is obvious to those skilled in the art to which the present specification pertains that other modifications based on the technical ideas of the present specification can be implemented. [Explanation of symbols]

[0123] 2000 Fusing device 31 Means of transport 32 Rail 33 Connecting shaft 11 First clamp 41 Hole 1 12 Second clamp 42 2nd Hole 50 boards 51 Side 1 52 Side 2 80 Mobile 81 1st joint 82 Second joint 83 Support 84 Gripper 85 First drive unit 86 Second drive unit 600 Carriers 601 Bar 1 602 2nd Bar 603 3rd Bar 604 4th Bar 610 First support member 620 Second support member 630 Third support member 61 First guide bar 61a 1st rail 61b 1st opening 62 Second guide bar 62a 2nd rail 62b 2nd opening 40 Combined Stage 411 Base Plate 422 Support pin 95 First drive arm 91 Link 1 92 Second Link 971 First Actuator 972 Second Actuator 981 First rotation axis 982 Second rotation axis 700 PCB Tray 710 Support Plate 720 Electrostatic Chuck

Claims

1. A conveying means; a carrier movable along the transport means and housing a substrate tray; a rotatable bonding stage disposed on the conveying means; a support disposed on the bonding stage, and movable on the bonding stage in an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction toward the bonding stage, an upward direction opposite to the downward direction, a first rotation direction toward the upstream direction, and a second rotation direction toward the downstream direction; a gripper connected to the support so as to be disposed between the support and the bonding stage.

2. The bonding device for a display device according to claim 1 , wherein the support has an R-shaped cross section.

3. The bonding device for a display device according to claim 1 , wherein the gripper has an L-shaped cross section.

4. The coalescence stage is a base plate on the conveying means; The display device of claim 1 , further comprising: a support pin on the base plate.

5. a first driving unit connected to one side of the support; The bonding device for a display device according to claim 1 , further comprising: a second driving unit connected to the other side of the support.

6. the first driving unit includes a first actuator connected to one side of the support; The bonding device for a display device according to claim 5 , wherein the second driving unit includes a second actuator connected to the other side of the support.

7. a first guide bar disposed on one side of the support; The bonding device for a display device according to claim 5 , further comprising: a second guide bar disposed on the other side of the support.

8. a first coupling portion connected to the first guide bar so as to be movable along the first guide bar; The bonding device for a display device according to claim 7 , further comprising: a second coupling part connected to the second guide bar so as to be movable along the second guide bar.

9. the first driving portion is rotatably coupled to the first coupling portion, The bonding device for a display device of claim 8 , wherein the second driving part is rotatably coupled to the second coupling part.

10. a first drive arm rotatably connected to the first coupling portion; The bonding device for a display device of claim 9 , further comprising: a second driving arm rotatably connected to the second coupling portion.

11. The first guide bar is a first rail connected to the first coupling portion; The bonding device for a display device according to claim 8 , further comprising: a first opening extending along the first rail.

12. The second guide bar is a second rail connected to the second coupling portion; The bonding device for a display device according to claim 11 , further comprising: a second opening extending along the second rail.

13. 8. The bonding device for a display device according to claim 7, further comprising a support bar disposed between the conveying means and the bonding stage between the first guide bar and the second guide bar.

14. The bonding device for a display device according to claim 13 , wherein the support bar is connected to the first guide bar, the second guide bar, and the bonding stage.

15. The substrate tray comprises: an electrostatic chuck; a first clamp disposed on one edge of the electrostatic chuck; a first hole disposed adjacent to the first clamp; a second clamp disposed on the other edge of the electrostatic chuck; a second hole disposed adjacent to the second clamp; The bonding apparatus for a display device according to claim 1 , wherein the gripper is disposed to correspond to the first hole of the substrate tray.

16. 2. The bonding device for a display device according to claim 1, wherein the bonding stage is rotatable by a predetermined angle so that an upper surface of the bonding stage faces a downstream side of the conveying means and a lower surface of the bonding stage faces an upstream side of the conveying means.

17. preparing a bonding device for a display device, the device including: a conveying means; a carrier movable along the conveying means and accommodating a substrate tray; a rotatable bonding stage disposed on the conveying means; a support disposed on the bonding stage and movable on the bonding stage along an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction toward the bonding stage, an upward direction opposite to the downward direction, a first rotation direction toward the upstream direction, and a second rotation direction toward the downstream direction; and a gripper connected to the support so as to be disposed between the support and the bonding stage; placing a carrier on said transport means; disposing the bonding stage parallel to the conveying means; placing a substrate on an upper surface of the bonding stage; supporting a first edge of the substrate in the downstream direction using a gripper; rotating the coalescence stage so that an upper surface of the coalescence stage faces the downstream direction; moving the support and the carrier in the downstream direction while the substrate is supported by the gripper; moving the support so that the gripper is adjacent to a first hole in the substrate tray; and rotating the support in the second rotation direction while the gripper is in proximity to the first hole.

18. The step of rotating the support in the second rotational direction comprises:

18. The method of claim 17, further comprising: rotating the support in the second rotation direction so that an outer portion of the substrate supported by the gripper and an electrostatic chuck of the substrate tray are parallel to each other.

19. 18. The method of claim 17, further comprising: moving the support member downward so that a gripper supporting the substrate is inserted into the first hole.

20. 20. The method of claim 19, further comprising supporting a first edge of the substrate using a first clamp of the substrate tray.

21. The method of claim 20 , further comprising releasing the gripper from supporting the first edge of the substrate after the first edge of the substrate is supported by the first clamp.

22. The method of claim 21 , wherein a time during which the first edge of the substrate is supported by the first clamp and a time during which the first edge of the substrate is supported by the gripper overlap with each other for a predetermined period of time.

23. The method of claim 17 , further comprising supporting a second edge of the substrate using a second clamp of the substrate tray.

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