Peeling apparatus for display device and peeling method for display device

Abstract

To provide a peeling device for a display device capable of easily separating a substrate from an electrostatic chuck, and a peeling method of the display device.SOLUTION: One embodiment relates to a peeling apparatus for a display device and a peeling method of a display device capable of easily separating a substrate from an electrostatic chuck, including a conveying unit, a carrier movable along the conveying unit and receiving a substrate tray, a rotatable peeling stage disposed on the conveying unit, a support disposed on the peeling stage and movable on the peeling stage along an upstream direction of the conveying unit, a downstream direction of the conveying unit, a downward direction facing the peeling stage, an upward direction opposite to the downward direction, a first rotational direction facing the upstream direction, and a second rotational direction facing the downstream direction, a gripper connected to the support so as to be disposed between the support and the peeling stage, and a discharging unit disposed on one side of the peeling stage.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] One embodiment relates to a manufacturing apparatus for a display device, and more particularly to a peeling apparatus for a display device and a peeling method for a display device that can easily separate a substrate from an electrostatic chuck. [Background technology]

[0002] Organic light emitting diode (OLED) displays have self-luminous properties and, unlike liquid crystal displays (LCDs), do not require a separate light source, which allows for reduced thickness and weight. Furthermore, OLED displays are attracting attention as next-generation display devices for portable electronic devices due to their high-quality characteristics, such as low power consumption, high brightness, and fast response speed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent Publication No. 10-2019-0098114 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of one embodiment is to provide a peeling apparatus for a display device and a peeling method for a display device that can easily separate a substrate from an electrostatic chuck.

[0005] The problems to be solved by the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0006] To achieve the above object, one embodiment of a peeling device for a display device includes a conveying means, a carrier movable along the conveying means and housing a substrate tray, a rotatable peeling stage disposed on the conveying means, a support disposed on the peeling stage and movable on the peeling stage along an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction facing the peeling stage, an upward direction opposite to the downward direction, a first rotation direction facing the upstream direction, and a second rotation direction facing the downstream direction, a gripper connected to the support so as to be disposed between the support and the peeling stage, and a discharge means disposed on one side of the peeling stage.

[0007] According to one embodiment of the present invention, a method for peeling a display device includes the steps of: preparing a peeling device for a display device, the peeling device including a conveying means; a carrier movable along the conveying means and housing a substrate tray; a rotatable peeling stage disposed on the conveying means; a support disposed on the peeling stage and movable on the peeling stage along an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction facing the peeling stage, an upward direction opposite to the downward direction, a first rotation direction facing the upstream direction, and a second rotation direction facing the downstream direction; a gripper connected to the support so as to be disposed between the support and the peeling stage; and a charge removing means disposed on one side of the peeling stage; disposing, on the conveying means, the carrier housing the substrate tray and the substrate on the electrostatic chuck of the substrate tray; and removing the carrier when an upper surface of the peeling stage is in contact with the upstream direction. rotating the separation stage to face the carrier in a lateral direction; inserting a gripper into the second hole of the first hole of the substrate tray in the upstream direction and the second hole of the substrate tray in the downstream direction; moving the gripper inserted into the second hole in the upstream direction within the second hole to overlap the gripper with a lower surface of the substrate; releasing the first clamp and the second clamp of the substrate tray to release the restraining forces of the first clamp and the second clamp on the first edge of the substrate and the second edge of the substrate from the electrostatic chuck by raising the support and moving the gripper out of the second hole; and providing ions between the electrostatic chuck and the substrate through a nozzle of the charge removal means disposed at one edge of the separation stage in the upstream direction.

[0008] Specific details of other embodiments are included in the detailed description and drawings. [Effects of the Invention]

[0009] According to the peeling device for a display device and the peeling method for a display device of one embodiment, the substrate can be easily separated from the electrostatic chuck via the charge removing means.

[0010] The effects obtained from the present invention are not limited to those described above, and other effects not mentioned will be clearly understood by those having ordinary skill in the technical field to which the present invention pertains from the following description. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram of a vapor deposition apparatus according to an embodiment. [Figure 2] FIG. 2 is a perspective view of the substrate tray of FIG. [Figure 3] FIG. 2 is a perspective view of a carrier disposed on a transport track. [Figure 4] 4 is a diagram for explaining the substrate tray of FIG. 2 coupled to the carrier of FIG. 3. FIG. [Figure 5] 1 is a perspective view of a peeling device for a display device according to an embodiment; [Figure 6] FIG. 10 is a cross-sectional view of a support and gripper according to one embodiment. [Figure 7] FIG. 2 is a schematic diagram of a peeling stage and a static elimination unit according to an embodiment. [Figure 8] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 9] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 10] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 11] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 12] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 13] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 14] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 15] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 16] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 17] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 18] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 19] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 20] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. [Figure 21] 1A to 1C are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] The advantages and features of the present invention, as well as methods for achieving them, will become clearer with reference to the following detailed embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be realized in various different forms. The present embodiments are provided solely for the purpose of complete disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art to which the present invention pertains. The present invention is defined solely by the scope of the claims.

[0013] When elements or layers are referred to as being "on" other elements or layers, this includes all cases where other layers or elements are directly on or between the other elements. The same reference numerals refer to the same components throughout the specification. The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments are merely examples, and the present invention is not limited to the details shown in the drawings.

[0014] Although terms such as "first" and "second" are used to describe various components, it is understood that these components are not limited by these terms. These terms are used merely to distinguish one component from another. Therefore, it is understood that a "first" component referred to below may be a "second" component within the technical concept of the present invention.

[0015] The features of the various embodiments of the present invention may be partially or wholly combined or combined with one another, and may be technically interlocked and driven in various ways, and each embodiment may be implemented independently of the others or in conjunction with one another.

[0016] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0017] A manufacturing apparatus for a display device according to one embodiment may include a deposition apparatus (1000; e.g., a deposition apparatus for a substrate for a display device) of FIG. 1, a peeling apparatus (2000; e.g., a peeling apparatus between a substrate for a display device and a substrate tray) of FIG. 5, and a posture conversion apparatus (e.g., a posture conversion apparatus for a carrier for manufacturing a display device).

[0018] 1 is a schematic diagram of a vapor deposition apparatus according to one embodiment, in which the direction opposite to the third direction DR3 (hereinafter referred to as the third opposite direction) is the direction of gravity.

[0019] As shown in FIG. 1, a deposition apparatus 1000 for a display device according to one embodiment may include a chamber 100, a deposition source 200, a deposition stage 250, a mask structure 340, a substrate tray 700, a magnet plate 800, a transfer track 500, a carrier 600, and a driving mechanism 900.

[0020] The chamber 100 may define a deposition space in which a deposition process is performed. A film deposition process for manufacturing an organic light-emitting display device is performed inside the chamber 100. The chamber 100 may be a vacuum chamber 100. The deposition source 200, deposition stage 250, driving mechanism 900, and part of the transfer track 500 are disposed within the chamber 100. Note that when the deposition process is in progress, the deposition source 200, deposition stage 250, mask structure 340, substrate 50, substrate tray 700, magnet plate 800, part of the transfer track 500, and driving mechanism 900 are disposed within the chamber 100.

[0021] The deposition source 200 is disposed within the chamber 100. For example, the deposition source 200 is disposed between the first inner wall 101 of the chamber 100 and the deposition stage 250. The deposition source 200 provides a deposition material. The deposition material from the deposition source 200 passes through the opening 29 of the deposition stage 250 and moves toward the mask structure 340. Specifically, the deposition source 200 heats and vaporizes a deposition material, such as an organic material or an electrode material, at a high temperature. The vaporized deposition material can then be deposited on the substrate 50 through the pattern holes of the mask structure 340. The organic material can be, for example, a material for fabricating a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer disposed between an anode electrode and a cathode electrode of an organic light-emitting diode (OLED). The substrate 50 can be, for example, a substrate used in a display device including an organic light-emitting diode (OLED).

[0022] The deposition stage 250 is disposed on the deposition source 200. For example, the deposition stage 250 is disposed between the deposition source 200 and the mask structure 340. The deposition stage 250 is fixedly disposed inside the chamber 100. The deposition stage 250 may be tilted toward the deposition source 200. For example, the deposition stage 250 is tilted in a direction opposite to the second direction DR2 (hereinafter, referred to as the second opposite direction) with respect to the third direction DR3. Therefore, an acute angle may be formed between one side of the deposition stage 250 facing the deposition source 200 and the ground on which the deposition stage 250 is disposed (e.g., the bottom surface of the chamber 100). In this case, a support protruding from one side of the deposition stage 250 in the second direction may be disposed below the deposition stage 250. The deposition stage 250 may have a rectangular frame shape with a hole in the center. For example, the deposition stage 250 may have an opening in the center.

[0023] The mask structure 340 is disposed on the deposition stage 250. For example, the mask structure 340 is disposed between the deposition stage 250 and the substrate tray 700. The mask structure 340 may be placed on a support of the deposition stage 250. At this time, since the deposition stage 250 is tilted, the mask structure 340 is disposed in an inclined state on the deposition stage 250. The mask structure 340 may include a frame 300 and a mask 400.

[0024] The frame 300 is disposed on the deposition stage 250. For example, the frame 300 is disposed between the deposition stage 250 and the mask 400. The frame 300 may have a square frame shape with a hole in the center. For example, the frame 300 may have an opening 39 in the center. Grooves 30 are disposed on both side edges of the frame 300. The frame 300 may include a magnetic material. For example, the frame 300 may include a material (e.g., iron (Fe)) that can be attached to a magnet.

[0025] The mask 400 is placed on the frame 300. For example, the mask 400 is placed between the frame 300 and the substrate tray 700. The mask 400 is placed on the frame 300 so as to cover the opening of the frame 300. The edge of the mask 400 is attached to the frame 300. For example, the mask 400 can be attached to the frame 300 by welding. The mask 400 can be a fine metal mask (FMM).

[0026] The mask 400 may include multiple submasks (410; or mask sticks). Each of the submasks 410 may have a rectangular shape extending in the third direction DR3. The submasks 410 may be arranged along the first direction DR1. Adjacent submasks 410 may contact each other. The portions of each submask 410, excluding both edges, are positioned over the opening 39 of the frame 300. Although not shown in the drawings, each submask 410 may have multiple pattern holes penetrating the respective submask 410 in the second direction DR2. The deposition material from the deposition source 200 may be deposited onto the substrate 50 through the pattern holes of each submask 410. Each submask 410 may be made of a material containing a magnetic material (e.g., iron (Fe)). For example, each submask 410 may contain a material that is attracted to a magnet.

[0027] The substrate tray 700 is disposed on the mask structure 340. For example, the substrate tray 700 is disposed between the mask 400 of the mask structure 340 and the magnet plate 800. The substrate tray 700 carries the substrate 50. At this time, the substrate tray 700 can attract the substrate 50 by electrostatic force. For example, the substrate tray 700 can provide a surface on which the substrate 50 is placed and also function as an electrostatic chuck that attracts and fixes the substrate 50 to one surface of the substrate tray 700. The substrate tray 700 is made of a material including ceramic or titanium.

[0028] The magnet plate 800 is disposed on the substrate tray 700. For example, the magnet plate 800 is disposed between the substrate tray 700 and the driving mechanism 900. The magnet plate 800 is disposed on the substrate tray 700 so as to face the substrate tray 700. The magnet plate 800 provides a magnetic force. For example, the magnet plate 800 can provide a magnetic force such that the metal mask 400 is tightly attached to the substrate 50.

[0029] The magnet plate 800 may include a base member 810 and a plurality of magnets 820 arranged on the base member 810. For example, the magnets 820 are arranged on the base member 810. As a specific example, when one side of the base member 810 facing the substrate tray 700 is defined as a first surface, the magnets 820 are arranged on the first surface of the base member 810. Each magnet 820 may include, for example, a permanent magnet.

[0030] The magnets 820 have a north pole and a south pole. The magnets 820 arranged along the first direction DR1 may be arranged with opposite polarities facing each other in the first direction DR1. The magnets 820 arranged along the second direction DR2 may be arranged with opposite polarities facing each other.

[0031] When the surface opposite to the first surface of the base member 810 is defined as the second surface of the base member 810, a plurality of magnetic bodies 830 are disposed on the second surface of the base member 810. For example, the plurality of magnetic bodies 830 may be disposed in the coupling grooves of the base member 810 on the second surface. For example, the magnetic bodies 830 may include a material (e.g., iron (Fe)) that can be attached to a magnet.

[0032] The drive mechanism 900 may include a first drive mechanism 910 and a second drive mechanism 920 .

[0033] The first drive mechanism 910 is disposed between the magnet plate 800 and the second drive mechanism 920. For example, the first drive mechanism 910 is disposed between the base member 810 of the magnet plate 800 and the second drive mechanism 920. The first drive mechanism 910 may include a magnet 89. For example, the magnet 89 is disposed on the surface of the first drive mechanism 910 opposite to the surface connected to the first drive shaft 911. The magnet 89 of the first drive mechanism 910 may be disposed to correspond to (or overlap) the magnetic body 830 of the magnet plate 800. The magnet 89 may include a permanent magnet.

[0034] The magnet plate 800 is detachably attached to a first driving mechanism 910. For example, the base member 810 of the magnet plate 800 can be detachably attached to the magnet 89 of the first driving mechanism 910. In other words, the magnetic material 830 of the base member 810 can be attached to the magnet 89 of the first driving mechanism 910 by magnetic force from the magnet 89 of the first driving mechanism 910. The first driving mechanism 910 moves toward the deposition source 200 or in the opposite direction within the chamber 100. For example, the first driving mechanism 910 can move along a second reverse direction or a second direction DR2. To this end, according to one embodiment, the first driving mechanism 910 can be connected to a first driving shaft 911 that extends along the second reverse direction or retracts along the second direction DR2. The first driving shaft 911 is connected to an external driving unit via a hole 90 of the second driving mechanism 920 and a hole 21 of the chamber 100. In addition, the first driving mechanism 910 can further move in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. In this case, the first driving shaft 911 can further move in the first direction DR1, the direction reverse to the first direction DR1 (hereinafter referred to as the first reverse direction), the third direction DR3, or the third reverse direction. The movement of the first driving mechanism 910 can control the movement of the magnet plate 800 attached to the first driving mechanism 910.

[0035] The second driving mechanism 920 is disposed between the first driving mechanism 910 and the second inner wall 102 of the chamber 100. The second driving mechanism 920 may include a permanent electromagnet 93. The substrate tray 700 is attached to the second driving mechanism 920. For example, the magnetic material 77 of the substrate tray 700 may be attached to the second driving mechanism 920 by attaching it to the permanent electromagnet 93 of the second driving mechanism 920. The permanent electromagnet 93 is disposed on both side edges of the second driving mechanism 920. The magnetic material 77 is disposed on both side edges of the substrate tray 700 to correspond to the permanent electromagnet 93. The magnetic material 77 may include a magnetic material that is attached to a magnet, such as iron (Fe).

[0036] The second driving mechanism 920 may include an electromagnet instead of the permanent electromagnet 93. The second driving mechanism 920 moves toward or away from the deposition source 200 within the chamber 100. For example, the second driving mechanism 920 may move along a second reverse direction or a second direction DR2. To this end, according to one embodiment, the second driving mechanism 920 may be connected to a second driving shaft 921 that extends along the second reverse direction or retracts along the second direction DR2. The second driving mechanism 920 may also move further in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. In such a case, the second driving shaft 921 may also move further in the first direction DR1, the first reverse direction, the third direction DR3, or the third reverse direction. The movement of the second driving mechanism 920 may control the movement of the substrate tray 700 attached to the second driving mechanism 920. The second drive mechanism 920 can perform an alignment operation between the substrate 50 on the substrate tray 700 and the mask structure 340 by controlling the position of the substrate tray 700 attached thereto.

[0037] The transport track 500 is arranged inside and outside the chamber 100 so as to pass through, for example, a first gate G1 and a second gate G2 of the chamber 100. The transport track 500 may extend along a first direction DR1. The first gate G1 and the second gate G2 are arranged to face each other.

[0038] The carrier 600 moves along the transport track 500. For example, the carrier 600 can move along the transport track 500 by magnetic levitation. The carrier 600 transports the substrate tray 700.

[0039] As described above, the deposition stage 250 may have its upper side tilted toward the deposition source 200 (for example, tilted at the same angle as the carrier 600 in FIG. 11 , which will be described later). Therefore, the mask structure 340, substrate tray 700, substrate 50, magnet plate 800, first driving mechanism 910, second driving mechanism 920, transfer track 500, and carrier 600 may also be tilted at the same angle as the deposition stage 250. This allows particles generated during the deposition process on the substrate 50 to fall in the direction of gravity without adhering to the substrate 50. This prevents contamination of the substrate 50 by particles.

[0040] FIG. 2 is a perspective view of the substrate tray 700 of FIG.

[0041] As shown in FIG. 2, the substrate tray 700 may include a support plate 710 and an electrostatic chuck 720 .

[0042] The support plate 710 may have the shape of a square frame with a hole in the center, for example, the support plate 710 may have an opening 79 in the center.

[0043] The electrostatic chuck 720 is disposed on the support plate 710. For example, the electrostatic chuck 720 is disposed between the support plate 710 and the substrate 50. At this time, the electrostatic chuck 720 may cover the opening 79 of the support plate 710. The substrate 50 is disposed on the electrostatic chuck 720. The electrostatic chuck 720 attracts the substrate 50 by electrostatic force.

[0044] At least one detachable member 7 is disposed on an edge of the substrate tray 700. For example, a detachable member 7 may be disposed near each corner of a rectangular support plate 710. Specifically, the support plate 710 may have six detachable members 7, with three of the six detachable members 7 disposed on the upper, central, and lower sides of a first side 71 of the substrate tray 700, respectively, and the remaining three detachable members 7 disposed on the upper, central, and lower sides of a second side 72 of the substrate tray 700, respectively. The first side 71 and the second side 72 of the substrate tray 700 are disposed to face each other along the first direction DR1.

[0045] The detachable member 7 may include a coupling tip 7a and a separation groove 7b arranged adjacent to each other in the third direction DR3. The coupling tip 7a is arranged above the separation groove 7b. For example, in one detachable member 7, the coupling tip 7a is arranged above the separation groove 7b in the third direction DR3. The coupling tip 7a may have a smaller thickness (e.g., size in the second direction DR2) than other portions of the substrate tray 700. For example, the coupling tip 7a may have a smaller thickness (e.g., size in the second direction DR2) than other portions of the support plate 710. The separation groove 7b may have a recessed shape from the first side 71 toward the second side 72 of the substrate tray (700; e.g., the support plate 710) or a recessed shape from the second side 72 toward the first side 71. For example, the separation grooves 7b arranged on different sides and facing each other may have recessed shapes toward each other.

[0046] 3 is a perspective view of a carrier disposed on a transport track, which may be a perspective view of a carrier 600 disposed on the transport track 500 of FIG.

[0047] The carrier 600 moves along the transport track 500. The transport track 500 includes a lower track 501 and an upper track 502 arranged to face each other in the third direction DR3, so that the carrier 600 can be positioned between the lower track 501 and the upper track 502. The carrier 600 moves along the transport track 500 between the lower track 501 and the upper track 502.

[0048] The carrier 600 may have a square frame shape as shown in Fig. 3. However, the shape of the carrier 600 is not limited thereto and may be modified into various shapes.

[0049] 3, the carrier 600 may include a plurality of bars 601, 602, 603, 604 and a plurality of support members 610, 620, 630. For example, the carrier 600 may include a first bar 601, a second bar 602, a third bar 603, and a fourth bar 604 that are connected to one another. A substrate tray 700 is placed in an area (e.g., opening 88b) defined by the first bar 601, the second bar 602, the third bar 603, and the fourth bar 604.

[0050] The first bar 601 and the second bar 602 face each other in the first direction DR1. The third bar 603 and the fourth bar 604 face each other in the third direction DR3. The first bar 601 is disposed between one end of the third bar 603 and one end of the fourth bar 604. The second bar 602 is disposed between the other end of the third bar 603 and the other end of the fourth bar 604.

[0051] The plurality of support members 610, 620, 630 may include at least one first support member 610 extending from the first bar 601, at least one second support member 620 extending from the second bar 602, and at least one third support member 630 extending from the third bar 603.

[0052] The first support member 610 may include an extension 611 and a plurality of protrusions 612. One side of the extension 611 may be connected to the first bar 601. The extension 611 may extend from the first bar 601 toward the second bar 602. A plurality of protrusions 612 (e.g., two protrusions 612) are disposed on the other side of the extension 611. The plurality of protrusions 612 may be rotatably connected to the other side of the extension 611. For example, each of the plurality of protrusions 612 may rotate around an axis parallel to the first direction DR1. The plurality of protrusions 612 are disposed to face each other in the second direction DR2. Each of the plurality of protrusions 612 may have a cylindrical shape. However, the shape of the protrusions 612 is not limited thereto and may be changed to various shapes.

[0053] The second support member 620 may have the same configuration as the first support member 610 described above, except that the extension of the second support member 620 may extend from the second bar 602 towards the first bar 601.

[0054] The third support member 630 may include an extension 631, a protrusion 632, and a projection 633. One side of the extension 631 may be connected to the third bar 603. The extension 631 may extend from the third bar 603 toward the fourth bar 604. The projection 632 is disposed on the other side of the extension 631. The projection 633 is disposed on one side of the projection 632. The projection 633 may be rotatably connected to one side of the projection 632. For example, the projection 633 may rotate around an axis parallel to the second direction DR2. The projection 633 may have a cylindrical shape. However, the shape of the projection 633 is not limited thereto and may be changed to various shapes.

[0055] FIG. 4 is a diagram illustrating the substrate tray 700 of FIG. 2 coupled to the carrier 600 of FIG.

[0056] As shown in FIG. 4, the first support member 610, the second support member 620, and the third support member 630 support a substrate tray 700.

[0057] The first support members 610 each support a first side 71 of the substrate tray 700. For example, the first side 71 of the substrate tray 700 may be supported by being disposed between the protrusions 612 of the first support members 610. Specifically, the first side 71 may be supported by being disposed between the protrusions 612 of the first support members 610, whereby the coupled chip 7a of the first side 71 may be supported.

[0058] The second support members 620 each support the second side 72 of the substrate tray 700. For example, the second side 72 of the substrate tray 700 may be supported by being disposed between the protrusions of the second support members 620. Specifically, the coupling chip 7a of the second side 72 may be disposed between the protrusions of the second support members 620, thereby supporting the second side 72.

[0059] The third support members 630 each support a third edge 73 of the substrate tray 700. For example, the third edge 73 of the substrate tray 700 can be supported by being placed on the protrusions 633 of the third support members 630. At this time, the protrusions 633 of the third support members 630 can come into contact with the third edge 73.

[0060] The deposition apparatus of one embodiment may further include a pusher (55). The pusher 55 is disposed on the carrier 600. For example, the pusher 55 is disposed on a fourth bar 604 of the carrier 600. Specifically, the pusher 55 faces the fourth bar 604 via an opening 60 in the upper track 502. The pusher 55 and the opening 60 in the upper track 502 are disposed within the chamber 100.

[0061] The pusher 55 moves toward the fourth bar 604 or in the opposite direction. For example, the pusher 55 moves along the third reverse direction or the third direction DR3. The pusher 55 can move a first step distance and a second step distance along the third reverse direction. Here, the second step distance is greater than the first step distance. Here, when the pusher 55 descends the second step distance along the third reverse direction, the lower track 501 also descends along the third reverse direction. For example, when the pusher 55 descends the second step distance, the pusher 55 and the lower track 501 descend together in the same direction.

[0062] When the pusher 55 descends in the third reverse direction by a first step, the pusher 55 may come into contact with the carrier 600. The carrier 600 may descend in the third reverse direction due to the pressure of the pusher 55. At this time, the lower track 501 does not descend but remains unchanged, thereby reducing the gap between the carrier 600 and the lower track 501. Therefore, the carrier 600 may be stably disposed on the lower track 501 in the chamber 100. Here, when the pusher 55 descends by the first step, the descending distance is short, so even if the carrier 600 descends due to the pressure of the pusher 55, the substrate tray 700 accommodated in the carrier 600 may remain supported by the support members 610, 620, and 630 of the carrier 600.

[0063] When the pusher 55 descends the second-stage distance, the lower track 501 simultaneously descends along the third reverse direction along with the pusher 55. In other words, the pusher 55 and the lower track 501 can simultaneously descend along the third reverse direction. This allows the carrier 600 and the lower track 501 to descend along the third reverse direction. At this time, the gap between the carrier 600 and the lower track 501 may be substantially the same as the gap between the carrier 600 and the lower track 501 when the pusher 55 descends the first-stage distance described above. Therefore, the first support member 610, the second support member 620, and the third support member 630 each move in the third reverse direction, thereby allowing the protrusions 612 of each first support member 610 and the protrusions of each second support member 620 to be positioned opposite each other across the separation grooves 7b of the substrate tray 700. In other words, the protrusions 612 of each first support member 610 and the coupling chips 7a on the first side 71 of the substrate tray 700 do not contact each other, and the protrusions 612 of each second support member 620 and the coupling chips on the second side 72 of the substrate tray 700 do not contact each other. Furthermore, as described above, as the pusher 55 moves the carrier 600 downward in the third reverse direction, the third support member 630 and the substrate tray 700 move apart from each other. For example, as the protrusions 612 of the second support member 620 and the third side 73 of the substrate tray 700 move apart from each other, the protrusions 633 of the third support member 630 do not come into contact with the third side 73. Therefore, the substrate tray 700 is no longer supported by the carrier 600. Therefore, the substrate tray 700 can be easily moved in the second direction DR2 and the second reverse direction without interference with the carrier 600.

[0064] The substrates 50 that have undergone a deposition process in the deposition apparatus 1000 are stored in the carrier 600 while attached to the substrate trays 700. The carrier 600 storing the substrate trays 700 is unloaded to the outside of the chamber 100 along the transfer track 500. The carrier 600 unloaded to the outside of the chamber 100 is loaded into the separation device 2000. For example, the carrier 600 unloaded to the outside of the chamber 100 is converted from a vertical position to a horizontal position by a position conversion device, and then loaded into the separation device 2000. The separation device 2000 separates (e.g., peels) the substrates 50 from the substrate trays 700 stored in the carrier 600 and transfers the peeled substrates 50 to other process instrumentation for a subsequent process.

[0065] Hereinafter, the peeling apparatus 2000 for a display device according to an embodiment will be described in detail with reference to the drawings.

[0066] Fig. 5 is a perspective view of a peeling device 2000 for a display device according to one embodiment, Fig. 6 is a cross-sectional view of a support and a gripper according to one embodiment, and Fig. 7 is a schematic diagram of a peeling stage and a discharging means according to one embodiment. Here, the support and the gripper in Fig. 6 correspond to the support and the gripper in Fig. 5, respectively, and the peeling stage and the nozzle in Fig. 7 correspond to the peeling stage and the nozzle in Fig. 5, respectively.

[0067] As shown in Figures 5, 6 and 7, a peeling device 2000 for a display device according to one embodiment may include a conveying means 31, a peeling stage 40, a moving body 80, a first drive arm (95; arm), a first guide bar (61; bar), a second guide bar 62, a plurality of support bars (70; bar), and a discharge means 450.

[0068] The carrier 600 transported in a horizontal position via the transport means 31 is loaded into the peeling device 2000. Here, the substrate tray 700 housed in the carrier 600 in a horizontal position may further include a plurality of first clamps 11 and a plurality of first holes 41 arranged on one edge of a base plate 710, and a plurality of second clamps 12 and a plurality of second holes 42 arranged on the other edge of the base plate 710, as shown in FIG. 5 . The first clamps 11 and the plurality of first holes 41 are arranged adjacent to a first bar 601 of the carrier 600. The second clamps 12 and the plurality of second holes 42 are arranged adjacent to a second bar 602 of the carrier 600. The first clamps 11 and the first holes 41 are arranged alternately along the second direction DR2. The second clamps 12 and the second holes 42 are arranged alternately along the second direction DR2. The first clamp 11, the first hole 41, the second clamp 12, and the second hole 42 are exposed to the outside via through holes that penetrate the electrostatic chuck 720. The first clamp 11 and the second clamp 12 are arranged to face each other, and the first hole 41 and the second hole 42 are arranged to face each other. The first hole 41 and the second hole 42 are arranged to correspond to a gripper 84, which will be described later.

[0069] The conveying means 31 is arranged along the first direction DR1. The conveying means 31 conveys the carrier 600 along the first direction DR1. The conveying means 31 may include rollers 32 and a connecting shaft 33 connecting the rollers 32. The connecting shaft 33 may extend along the second direction DR2. The rollers 32 are connected to one side and the other side of the connecting shaft 33. The rollers 32 are rotatably connected to the connecting shaft 33.

[0070] The first guide bar 61 and the second guide bar 62 are arranged to face each other. For example, the first guide bar 61 and the second guide bar 62 are arranged to face each other in the second direction DR2.

[0071] The first guide bar 61 may include a first rail 61a and a first opening 61b. The first rail 61a is disposed on the first guide bar 61 along the extension direction (or longitudinal direction; for example, the first direction DR1) of the first guide bar 61. The first opening 61b penetrates the first guide bar 61. The first opening 61b may extend along the first rail 61a. The substrate 50 is loaded into the peeling apparatus 2000 from the outside through the first opening 61b, or the substrate 50 is unloaded from the peeling apparatus 2000 to the outside through the first opening 61b.

[0072] The second guide bar 62 may include a second rail 62a and a second opening 62b. The second rail 62a is disposed on the second guide bar 62 along the extension direction (or longitudinal direction; for example, the first direction DR1) of the second guide bar 62. The second opening 62b penetrates the second guide bar 62. The second opening 62b may extend along the second rail 62a. The substrate 50 is loaded into the peeling apparatus 2000 from the outside through the second opening 62b, or the substrate 50 is unloaded from the peeling apparatus 2000 to the outside through the second opening 62b.

[0073] The support bar 70 is disposed between the first guide bar 61 and the second guide bar 62. FIG. 2 shows an example in which two support bars 70 are disposed spaced apart in the first direction. The support bars 70 are each disposed parallel to the connection axis 33 of the conveying means 31. The support bars 70 may each extend in the second direction DR2. The support bar 70 may connect the first guide bar 61 and the second guide bar 62 to each other. For example, one end of each support bar 70 may be connected to the inner surface of the first guide bar 61, and the other end of each support bar 70 may be connected to the inner surface of the second guide bar 62.

[0074] The peeling stage 40 is disposed on a plurality of support bars 70. For example, the peeling stage 40 is disposed on the plurality of support bars 70 between the first guide bar 61 and the second guide bar 62. The peeling stage 40 is connected to the plurality of support bars 70. The peeling stage 40 may include a base plate 411 and a plurality of support pins 422.

[0075] The base plate 411 of the peeling stage 40 is disposed on the support bar 70. The base plate 411 may be connected to the support bar 70. The support pins 422 of the peeling stage 40 are disposed on the base plate 411. The support pins 422 may have a columnar shape protruding upward from the base plate 411. The support pins 422 may be coupled to the base plate 411. For example, one side of the support pin 422 may be coupled to the base plate 411. A spherical ball is disposed on the other end of the support pin 422 and is rotatably connected to the support pin 422. The plurality of support pins 422 are arranged in a matrix on the base plate 411.

[0076] The moving body 80 is disposed on the peeling stage 40. For example, the moving body 80 may be disposed on the peeling stage 40 so as to overlap the peeling stage 40. The moving body 80 may be movably coupled to the first guide bar 61 and the second guide bar 62. The moving body 80 moves between the first guide bar 61 and the second guide bar 62 along the first rail 61a of the first guide bar 61 and the second rail 62a of the second guide bar 62. For example, the moving body 80 is guided by the first rail 61a and the second rail 62a and can move on the peeling stage 40 along the first direction DR1 or the first reverse direction DR1. The moving body 80 may include a support 83, a first driving unit 85, a second driving unit 86, a first coupling unit 81, a second coupling unit 82, and a gripper 84.

[0077] The support 83 of the moving body 80 is disposed between the first guide bar 61 and the second guide bar 62. The support 83 may extend along the second direction DR2. The support 83 is disposed on the peeling stage 40 so as to overlap with the peeling stage 40. The support 83 may have an "r" shaped cross section.

[0078] 6, the support 83 may include a horizontal portion 83a and a vertical portion 83b. The vertical portion 83b may extend downward from one side of the horizontal portion 83a. For example, the vertical portion 83b may extend from one side of the horizontal portion 83a in a third opposite direction.

[0079] The gripper 84 of the moving body 80 is disposed on the support 83. The gripper 84 is disposed below the support 83. The gripper 84 is arranged in a line along the support 83 in the second direction DR2 between the first guide bar 61 and the second guide bar 62. In other words, the gripper 84 may be disposed below the support 83 along the extension direction of the support 83 (e.g., the second direction DR2). The gripper 84 is coupled to and supported by the support 83. The gripper 84 may have an "L"-shaped cross section.

[0080] According to one embodiment, as shown in FIG. 6, the gripper 84 may include a connecting portion 84a, a first extension portion 84c, a second extension portion 84b, and a pressure means 84d.

[0081] The coupling portion 84 a of the gripper 84 is connected to the vertical portion 83 b of the support 83 .

[0082] The first extension portion 84c of the gripper 84 may extend in a first opposite direction from one edge of the connecting portion 84a.

[0083] The second extension portion 84b of the gripper 84 is disposed on the first extension portion 84c. For example, the second extension portion 84b is disposed between the first extension portion 84c and the support body 83. The second extension portion 84b may extend along the first opposite direction from the center of the coupling portion 84a.

[0084] The pressure applying means 84d of the gripper 84 is disposed between the first extension 84c and the second extension 84b. The pressure applying means 84d may be movably connected to the second extension 84b. For example, the pressure applying means 84d may move between the first extension 84c and the second extension 84b toward the first extension 84c or toward the second extension 84b. The pressure applying means 84d may be connected to an actuator disposed within the second extension 84b, for example.

[0085] The gripper 84 grips the substrate 50 via the pressure means 84d and the first extension 84c. For example, when the pressure means 84d moves toward the first extension 84c, the substrate 50 may come into contact with the first extension 84c and the pressure means 84d. At this time, the substrate 50 may be supported between the first extension 84c and the pressure means 84d due to the pressure applied by the pressure means 84d.

[0086] The gripper 84 may include the aforementioned connecting portion 84a and first extension portion 84c. In other words, the second extension portion 84b and the pressure means 84d may be omitted from the gripper 84 of FIG.

[0087] The first coupling part 81 of the moving body 80 may be movably coupled to the first rail 61a of the first guide bar 61. The first coupling part 81 includes a first wheel movably coupled to the first rail 61a, and therefore the first coupling part 81 may move along the first rail 61a by being driven by the first wheel.

[0088] The second coupling part 82 of the moving body 80 may be movably coupled to the second rail 62a of the second guide bar 62. The second coupling part 82 includes a second wheel movably coupled to the second rail 62a, so that the second coupling part 82 can move along the second rail 62a by driving the second wheel. The centers of the rotational axes of the first wheel and the second wheel may be parallel to and coincide with each other. The rotational directions of the first wheel and the second wheel may be the same.

[0089] The first driving unit 85 of the moving body 80 is disposed on one side of the support 83. The first driving unit 85 may be connected to one side of the support 83 and one side of the first coupling unit 81. For example, the first driving unit 85 may include a first actuator 971 connected to one side of the support 83. The first actuator 971 extends (or expands) and contracts under the control of the first driving unit 85. The first driving unit 85 may include a first rotating shaft 981 rotatably connected to one side of the first coupling unit 81. The first driving unit 85 rotates clockwise or counterclockwise around the first rotating shaft 981. The first driving unit 85 may control the rotation direction of the first wheel of the first coupling unit 81.

[0090] The second drive unit 86 of the moving body 80 is disposed on the other side of the support 83. The second drive unit 86 may be connected to the other side of the support 83 and one side of the second coupling unit 82. For example, the second drive unit 86 may include a second actuator 972 connected to the other side of the support 83. The second actuator 972 extends and contracts under the control of the second drive unit 86. The second drive unit 86 may include a second rotation shaft 982 rotatably connected to one side of the second coupling unit 82. The second drive unit 86 rotates clockwise or counterclockwise around the second rotation shaft 982. The center of the second rotation shaft 982 and the center of the first rotation shaft 981 may be parallel to each other and may coincide with each other. The second drive unit 86 may control the rotation direction of the second wheel of the second coupling unit 82.

[0091] By the operation of the first actuator 971 of the first driving unit 85 and the second actuator 972 of the second driving unit 86, the support 83 moves in a direction away from the first driving unit 85 and the second driving unit 86, or moves in a direction toward the first driving unit 85 and the second driving unit 86. For example, when the first actuator 971 and the second actuator 972 operate in an extension direction, the support 83 can move in a direction away from the first driving unit 85 and the second driving unit 86. Meanwhile, when the first actuator 971 and the second actuator 972 operate in a contraction direction, the support 83 can move in a direction toward the first driving unit 85 and the second driving unit 86. Therefore, the distance between the support 83 and the peeling stage 40 can be adjusted.

[0092] The support 83 rotates clockwise or counterclockwise around the first rotation axis (or the second rotation axis) due to the operation of the first rotation axis 981 of the first drive unit 85 and the second rotation axis 982 of the second drive unit 86. Therefore, the support 83 can rotate clockwise or counterclockwise around the first rotation axis (981) of the first drive unit 85 or the second rotation axis 982 of the second drive unit 86.

[0093] The first drive arm 95 controls the tilt angle of the first guide bar 61. The first drive arm 95 may be rotatably connected to the other side of the first coupling part 81. The first drive arm 95 may include a first link 91 and a second link 92. One side of the first link 91 may be rotatably connected to the first coupling part 81. For example, one side of the first link 91 may be connected to a first rotation shaft 981 of the first drive part 85. The other side of the first link 91 may be rotatably connected to a second link 92. The other side of the second link 92 may be connected to a first drive motor.

[0094] Although not shown in the drawings, a second drive arm that controls the tilt angle of the second guide bar 62 may be further connected to the other side of the second coupling part 82. The second drive arm is disposed opposite the first drive arm 95 and may have substantially the same configuration as the first drive arm 95. For example, the second drive arm may be rotatably connected to the second coupling part 82. The second drive arm may include a third link corresponding to the first link 91 and a fourth link corresponding to the second link 92. One side of the third link may be rotatably connected to the second coupling part 82. For example, one side of the third link may be connected to the second rotation shaft 982 of the second drive part 86. The other side of the third link may be rotatably connected to the fourth link. The other side of the fourth link may be connected to the second drive motor.

[0095] The tilt angle of the first guide bar 61 and the second guide bar 62 is controlled by driving the links of the first drive arm 95 (e.g., the first link 91 and the second link 92) and the links of the second drive arm (e.g., the third link and the fourth link), and thereby the tilt angle of the support bar 70 connected to the guide bars 61 and 62 can be controlled. Furthermore, by controlling the tilt angle of the support bar 70, the tilt angle of the peeling stage 40 connected to the support bar 70 can be controlled. Therefore, the tilt angle of the peeling stage 40 can be controlled by driving the links of the first drive arm 95 (e.g., the first link 91 and the second link 92) and the links of the second drive arm (e.g., the third link and the fourth link).

[0096] The charge removal means (450; for example, an ionizer) provides ions for removing static electricity. As shown in FIG. 7 , the charge removal means 450 may include an ion generator 451 and a plurality of nozzles 452. Since the substrate 50 may be attached to the electrostatic chuck 720 of the substrate tray 700 by electrostatic force, the charge removal means 450 provides ions to the interface between the substrate 50 and the electrostatic chuck 720. As a result, the substrate 50 can be easily separated (or peeled) from the electrostatic chuck 720.

[0097] The ion generating unit 451 generates ions. For example, the ion generating unit 451 ionizes the air inside the unit 451 by a corona discharge method, a radiation irradiation method, or an ultraviolet irradiation method to generate ions.

[0098] The plurality of nozzles 452 are connected to the ion generator 451. The plurality of nozzles 452 may emit ions generated from the ion generator 451 to the outside. For example, the ions from the ion generator 451 may be ejected to the outside through the plurality of nozzles 452 together with air accelerated by a strong pressure.

[0099] According to one embodiment, the ion generating unit 451 of the static eliminator 450 is disposed, for example, inside the peeling stage 40. However, without being limited thereto, the ion generating unit 451 may also be disposed outside the peeling stage 40.

[0100] According to one embodiment, the plurality of nozzles 452 of the charge removal unit 450 are disposed, for example, on one side of the separation stage 40. For example, if the transport direction (e.g., the first direction DR1) of the transport unit 31 relative to the separation stage 40 is defined as the downstream direction and the opposite direction (or reverse direction) of the transport direction of the transport unit 31 is defined as the upstream direction, the plurality of nozzles 452 are disposed at one end of the separation stage 40 facing the upstream direction. In other words, the nozzles 452 may be disposed on one edge (or one side) of the separation stage 40 in the upstream direction. The plurality of nozzles 452 are disposed at one end of the separation stage 40 along the longitudinal direction of the end. For example, the plurality of nozzles 452 may be disposed at regular intervals along the second direction DR2 at one end of the separation stage 40. The plurality of nozzles 452 inject ions toward the upstream direction. For example, the plurality of nozzles 452 may inject ions in the first reverse direction at one end of the separation stage 40.

[0101] The operation of the peeling apparatus 2000 for a display device according to an embodiment will be described in detail below.

[0102] Figures 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, and 21 are diagrams illustrating a peeling method using a peeling device for a display device according to an embodiment. Here, Figure 9 is an enlarged view of the periphery of second clamp 12 and second hole 42 in Figure 8, Figure 12 is an enlarged view of the periphery of second clamp 12 and second hole 42 in Figure 11, and Figure 14 is an enlarged view of the periphery of second clamp 12 and second hole 42 in Figure 13.

[0103] First, as shown in FIGS. 8 and 9 , a carrier (600; for example, the carrier 600 housing a substrate tray 700) is disposed on the transport means 31 of the separation apparatus 2000. A substrate 50 is disposed on an electrostatic chuck 720 of the substrate tray 700 housed in the carrier 600. At this time, a first edge 51 of the substrate 50 is supported by a first clamp 11. For example, the first edge 51 of the substrate 50 in the upstream direction may be clamped (or held) by the first clamp 11. In addition, a second edge 52 of the substrate 50 in the downstream direction may be supported by a second clamp 12. For example, the second edge 52 of the substrate 50 in the downstream direction may be clamped (or held) by the second clamp 12. Here, a portion of the first edge 51 of the substrate 50 may overlap the first hole 41. The portion of the first edge 51 overlapping the first hole 41 may not contact the electrostatic chuck 720. A portion of the second side 52 of the substrate 50 may overlap the second hole 42. The portion of the second side 52 that overlaps the second hole 42 may not be in contact with the electrostatic chuck 720.

[0104] 8 and 9, the peeling stage 40 is disposed adjacent to the carrier 600 in the downstream direction of the carrier 600. At this time, the peeling stage 40 may be tilted toward the carrier 600. As an example, the peeling stage 40 may be tilted toward the upstream direction as the first guide bar 61 and the second guide bar 62 are tilted by the control of the first drive arm 95 and the second drive arm. Specifically, the peeling stage 40 may be tilted at a predetermined angle so that the upper surface of the peeling stage 40 (e.g., the surface on which the support pins 422 are arranged) faces the upstream direction of the conveying means 31, and the lower surface of the peeling stage 40 (e.g., the surface opposite the upper surface of the peeling stage 40) faces the downstream direction of the conveying means 31. Here, the angle formed between the upper surface of the tilted peeling stage 40 and the conveying means 31 in the upstream direction may be an obtuse angle. The angle formed between the lower surface of the tilted peeling stage 40 and the conveying means 31 in the downstream direction may be an acute angle. Here, one edge of the tilted peeling stage 40 may be disposed on one edge of the substrate tray 700 so that the edge of the tilted peeling stage 40 and the edge of the substrate tray 700 overlap.

[0105] 8 and 9, the moving body 80 is disposed between the carrier 600 and the peeling stage 40 so as to overlap the edges of the carrier 600 and the peeling stage 40 that are adjacent to each other.

[0106] 8 and 9, the grippers 84 are inserted into the second holes 42. For example, the grippers 84 may be inserted into the second holes 42 while being biased toward the downstream side in each space of the second holes 42. Here, the size of the second holes 42 in the first direction DR1 is larger than the size of the grippers 84 in the first direction DR1. Therefore, when the grippers 84 are inserted into the second holes 42, there may be a surplus space (or a gap) between each gripper 84 and each second hole 42. For example, when the grippers 84 are inserted into the second holes 42, there may be a surplus space within the second holes 42 so that the grippers 84 can move further upstream. In this case, the grippers 84 inserted into the second holes 42 do not come into contact with the substrate 50.

[0107] 10, the support 83 moves a predetermined distance upstream along the first guide bar 61 and the second guide bar 62. This allows the gripper 84 connected to the support 83 to move upstream. Then, the gripper 84 moves within the second hole 42 into each available space of the second hole 42, and the gripper 84 and the substrate 50 overlap. For example, the gripper 84 and the second edge 52 of the substrate 50 may overlap in the third direction DR3.

[0108] Next, as shown in FIG. 11 , first clamp 11 is released. For example, first clamp 11 may be rotated to the opposite side of substrate 50, thereby releasing the restraining force of first clamp 11 on first edge 51 of substrate 50. Furthermore, as shown in FIGS. 11 and 12 , second clamp 12 may be released. For example, second clamp 12 may be rotated to the opposite side of substrate 50, thereby releasing the restraining force of second clamp 12 on second edge 52 of substrate 50. As a result, substrate 50 is no longer supported by first clamp 11 and second clamp 12.

[0109] 13 and 14, the first and second driving units 85 and 86 raise the support 83 away from the substrate 50. As a result, the grippers 84 connected to the support 83 rise while protruding from the second holes 42 and contacting the lower surface of the substrate 50. Therefore, the first edge 51 of the substrate 50 is supported and lifted by the grippers 84. The support 83 then moves a predetermined distance upstream and rotates a predetermined angle downstream. This allows the grippers 84 to move a predetermined distance upstream and rotate a predetermined angle downstream. The first edge 51 and its surrounding area of ​​the substrate 50 are then lifted and separated from the electrostatic chuck 720. The interface between the substrate 50 and the electrostatic chuck 720 is exposed, and the nozzle 452 of the charge removal unit 450 faces the interface. Note that the electrostatic force of the electrostatic chuck 720 may be released before the first edge 51 of the substrate 50 is lifted. For example, before the first side 51 of the substrate 50 is lifted, the supply of power to the electrostatic chuck 720 is first cut off, thereby removing the electrostatic force applied to the substrate 50 from the electrostatic chuck 720. Even if the supply of electrostatic force from the electrostatic chuck 720 is cut off, the substrate 50 can remain attached to the electrostatic chuck 720 due to residual static electricity that remains undischarged.

[0110] Thereafter, the charge removal means 450 injects ions onto the interface between the substrate 50 and the electrostatic chuck 720. The ions from the charge removal means 450 remove (or neutralize) the static electricity between the substrate 50 and the electrostatic chuck 720. Therefore, the bonding force between the substrate 50 and the electrostatic chuck 720 is weakened, and the substrate 50 can be easily separated from the electrostatic chuck 720.

[0111] 15 to 18, the carrier 600 and the support 83 move downstream. For example, the carrier 600 moves downstream along the conveying means 31, and the support 83 can move downstream on the peeling stage (40; for example, an inclined peeling stage 40) along the first guide bar 61 and the second guide bar 62. Therefore, the substrate 50 is lifted from the electrostatic chuck 720 onto the peeling stage 40 while being supported by the gripper 84 connected to the support 83.

[0112] In this manner, the support 83 moves downstream on the peeling stage 40 along the inclined first guide bar 61 and second guide bar 62, while the carrier 600 moves downstream along the uninclined, horizontal conveying means 31. As a result, when the support 83 and the carrier 600 move downstream together, the substrate 50 is transformed from a horizontal position to an inclined position, and can be moved from the electrostatic chuck 720 to the peeling stage 40. For example, as shown in FIG. 18 , when the peeling stage 40 and the carrier 600 completely (or almost completely) overlap each other, the substrate 50 is positioned on the support pins 422 of the peeling stage 40. In other words, when the peeling stage 40 and the carrier 600 completely (or almost completely) overlap each other, as shown in FIG. 18 , the substrate 50 can be transferred from the electrostatic chuck 720 to the peeling stage 40.

[0113] As shown in Figures 15 to 17, as the carrier (600; or the substrate tray 700 on the carrier 600) and the support 83 move together in the downstream direction, the contact area between the peeling stage (40; for example, the support pin 422 of the peeling stage 40) and the substrate 50 gradually increases, while the contact area between the electrostatic chuck 720 of the substrate tray 700 stored in the carrier 600 and the substrate 50 gradually decreases.

[0114] 14 to 18, the charge removal unit 450 continues to provide ions between the substrate 50 and the electrostatic chuck 720 (or the interface therebetween), so that the substrate 50 can be easily separated (or peeled) from the electrostatic chuck 720. In other words, from the time the first edge 51 of the substrate 50 is lifted until the substrate 50 moves from the electrostatic chuck 720 to the peeling stage 40, the charge removal unit 450 can continuously provide ions between the substrate 50 and the electrostatic chuck 720 (or the interface therebetween).

[0115] Furthermore, according to one embodiment, the nozzle 452 of the charge removal means 450 is disposed on one edge of the separation stage 40 and can face between the substrate 50 and the electrostatic chuck 720, so that ions from the nozzle 452 can be directly and quickly provided to the interface between the substrate 50 and the electrostatic chuck 720 during the separation process. This allows the substrate 50 to be more easily separated from the electrostatic chuck 720 during the separation process. Therefore, the tact time of the separation process is shortened, and productivity is improved.

[0116] 19 , with the second edge 52 of the substrate 50 supported by the gripper 84, the peeling stage 40 rotates to assume a horizontal position. For example, with the second edge 52 of the substrate 50 supported by the gripper 84, the peeling stage 40 may tilt downstream. As an example, the peeling stage 40 can be positioned parallel to the conveying means 31 as the first guide bar 61 and the second guide bar 62 tilt under the control of the first drive arm 95 and the second drive arm. This allows the substrate 50 on the peeling stage 40 to assume a horizontal position parallel to the conveying means 31.

[0117] 20 , as the support 83 descends a predetermined distance toward the peeling stage 40 in the third reverse direction, contact between the second edge 52 of the substrate 50 and the gripper 84 is released. Next, the substrate 50 on the peeling stage 40 is lifted from the support pins of the peeling stage 40 by the robot arm. As a specific example, the robot arm includes a plurality of fingers spaced apart from one another, and the fingers of the robot arm can be positioned between the substrate 50 and the peeling stage 40 through the first opening 61b of the first guide bar 61 in a horizontal position. At this time, the fingers are positioned between the support pins 422. When the fingers positioned between the substrate 50 and the peeling stage 40 rise toward the substrate 50 in the third direction DR3, the substrate 50 can be supported by the fingers and rise in the third direction DR3. This allows the substrate 50 to move from the support pins 422 to the fingers.

[0118] Thereafter, as shown in FIG. 21, the fingers on which the substrate 50 is placed are ejected to the outside through the first opening 61b of the first guide bar 61, whereby the substrate 50 can be unloaded from the peeling device 2000.

[0119] Those skilled in the art will understand that the present specification can be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. The scope of the present specification is defined by the claims below, rather than the above detailed description, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present specification.

[0120] In addition, the present specification and drawings disclose preferred embodiments of the present specification, and specific terms are used, but these are used in a general sense merely to easily explain the technical content of the present specification and to aid in understanding the invention, and are not intended to limit the scope of the present specification. It is obvious to a person skilled in the art to which the present specification pertains that, in addition to the embodiments disclosed herein, other modifications based on the technical idea of ​​the present specification can be implemented. [Explanation of symbols]

[0121] 2000 Peeling Device 31 Means of transport 32 Rail 33 Connecting shaft 11 First clamp 41 Hole 1 12 Second clamp 42 2nd Hole 50 boards 51 Side 1 52 Side 2 80 Mobile 81 1st joint 82 Second joint 83 Support 84 Gripper 85 First drive unit 86 Second drive unit 600 Carriers 601 Bar 1 602 2nd Bar 603 3rd Bar 604 4th Bar 610 First support member 620 Second support member 630 Third support member 61 First guide bar 61a 1st rail 61b 1st opening 62 Second guide bar 62a 2nd rail 62b 2nd opening 40 Peeling Stage 411 Base Plate 422 Support pin 95 First drive arm 91 Link 1 92 Second Link 971 First Actuator 972 Second Actuator 981 First rotation axis 982 Second rotation axis 700 PCB Tray 710 Support Plate 720 Electrostatic Chuck 452 nozzle

Claims

1. A conveying means; a carrier movable along the transport means and housing a substrate tray; a rotatable peeling stage disposed on the conveying means; a support disposed on the peeling stage, the support being movable on the peeling stage in an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction facing the peeling stage, an upward direction opposite to the downward direction, a first rotation direction facing the upstream direction, and a second rotation direction facing the downstream direction; a gripper connected to the support so as to be disposed between the support and the peeling stage; and a charge removal means disposed on one side of the peeling stage.

2. The static elimination means is an ion generation unit disposed inside the peeling stage; The peeling apparatus for a display device according to claim 1 , further comprising: a nozzle disposed on an edge of one side of the peeling stage and connected to the ion generating unit.

3. The peeling device for a display device according to claim 2 , wherein the nozzle is disposed on one edge of the peeling stage in an upstream direction.

4. the nozzle includes a plurality of nozzles connected to the ion generation unit, The peeling device for a display device according to claim 2 , wherein the plurality of nozzles are arranged along an edge of one side of the peeling stage.

5. The peeling stage is a base plate on the conveying means; The peeling device for a display device according to claim 1 , further comprising: a support pin on the base plate.

6. a first driving unit connected to one side of the support; The peeling device for a display device according to claim 1 , further comprising: a second driving unit connected to the other side of the support.

7. the first driving unit includes a first actuator connected to one side of the support; The peeling device for a display device according to claim 6 , wherein the second driving unit includes a second actuator connected to the other side of the support.

8. a first guide bar disposed on one side of the support; The peeling device for a display device according to claim 6 , further comprising: a second guide bar disposed on the other side of the support.

9. a first coupling portion connected to the first guide bar so as to be movable along the first guide bar; The peeling device for a display device according to claim 8 , further comprising: a second coupling part connected to the second guide bar so as to be movable along the second guide bar.

10. the first driving portion is rotatably coupled to the first coupling portion, The peeling device for a display device of claim 9 , wherein the second driving unit is rotatably coupled to the second coupling unit.

11. a first drive arm rotatably connected to the first coupling portion; The peeling device for a display device according to claim 10 , further comprising: a second drive arm rotatably connected to the second coupling portion.

12. The first guide bar is a first rail connected to the first coupling portion; The peeling device for a display device according to claim 9 , further comprising: a first opening extending along the first rail.

13. The second guide bar is a second rail connected to the second coupling portion; The peeling device for a display device according to claim 12 , further comprising: a second opening extending along the second rail.

14. 9. The peeling device for a display device according to claim 8, further comprising a bar disposed between the conveying means and the peeling stage between the first guide bar and the second guide bar.

15. The peeling device for a display device according to claim 14 , wherein the support bar is connected to the first guide bar, the second guide bar, and the peeling stage.

16. The substrate tray comprises: an electrostatic chuck; a first clamp disposed on one edge of the electrostatic chuck; a first hole disposed adjacent to the first clamp; a second clamp disposed on the other edge of the electrostatic chuck; a second hole disposed adjacent to the second clamp; 2. The peeling device for a display device according to claim 1, wherein the gripper is disposed to correspond to the first hole of the substrate tray.

17. 2. The peeling device for a display device according to claim 1, wherein the peeling stage is rotatable at a predetermined angle so that an upper surface of the peeling stage faces a downstream side of the conveying means or so that a lower surface of the peeling stage faces an upstream side of the conveying means.

18. a carrier movable along the conveying means and accommodating a substrate tray; a rotatable peeling stage disposed on the conveying means; a support disposed on the peeling stage and movable on the peeling stage along an upstream direction of the conveying means, a downstream direction of the conveying means, a downward direction facing the peeling stage, an upward direction opposite to the downward direction, a first rotation direction facing the upstream direction, and a second rotation direction facing the downstream direction; a gripper connected to the support so as to be disposed between the support and the peeling stage; and a static elimination means disposed on one side of the peeling stage; placing a carrier on the transport means, the carrier containing the substrate tray and the substrate on the electrostatic chuck of the substrate tray; rotating the peeling stage so that an upper surface of the peeling stage faces the carrier in the upstream direction; inserting a gripper into the second hole of the first hole of the upstream substrate tray and the second hole of the downstream substrate tray; moving the gripper inserted into the second hole in the upstream direction within the second hole to overlap the gripper with a lower surface of the substrate; releasing a first clamp and a second clamp of the substrate tray to release the restraining force of the first clamp and the second clamp on the first edge of the substrate and the second edge of the substrate; raising the support and moving the gripper outwardly through the second hole, thereby lifting the first edge of the substrate from the electrostatic chuck with the gripper; and providing ions between the electrostatic chuck and the substrate through a nozzle of the charge removal means, the nozzle being disposed at an edge of one side of the separation stage in an upstream direction.

19. 20. The method of claim 18, further comprising the step of moving the substrate on the electrostatic chuck to the peeling stage by moving the carrier and the support along the downstream direction.

20. The step of providing ions comprises:

20. The method of claim 19, further comprising the step of continuously providing ions between the substrate and the electrostatic chuck through a nozzle of the charge removal means while the substrate moves from the electrostatic chuck to the peeling stage after the first edge of the substrate is lifted.

Images