Electrical contactor and electrical connecting apparatus

Abstract

To provide an electric contactor and an electric connection device having high hardness, wear resistance, and excellent conductivity.SOLUTION: An electrical contactor according to the present invention is an electrical contactor including a body portion, a first contact portion that is one tip portion of the body portion and comes into contact with a first contact target, and a second contact portion that is the other tip portion of the body portion and comes into contact with a second contact target, the electrical contactor being formed of a conductive ceramic material containing titanium. An electrical connecting apparatus according to the present invention includes a plurality of contacts each having a first contact portion to be brought into contact with an electrode portion of a device under test housed in a housing and a second contact portion to be brought into contact with a wiring formed on a substrate, and each of the contacts is the electrical contact of the present invention.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrical contact and can be applied to, for example, an electrical contact and an electrical connecting device that electrically contacts electrode terminals of a semiconductor device (also called a "semiconductor device" or "semiconductor integrated circuit"). [Background technology]

[0002] In testing the electrical characteristics of devices such as semiconductor integrated circuits mounted in packages, a probe device is used to electrically connect the device to a testing device. The probe device electrically connects the electrode terminals of the device to electrode pads arranged on a substrate such as a printed circuit board (PCB). The electrode pads are electrically connected to the testing device via wiring patterns formed on the substrate.

[0003] Conventionally, electrical contacts such as probes and pogo pins are made by processing metal materials such as wire drawing, bending, and cutting, and require high hardness to be repeatedly brought into contact with contact objects such as electrode terminals. For this reason, electrical contacts are made of metal materials such as palladium alloys (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-35866 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the electrode terminals of a semiconductor device are repeatedly brought into contact with the electrical contacts, the electrical contacts wear out and metals such as tin and palladium alloys adhere to the electrode terminals, resulting in a problem of poor contact.

[0006] In order to improve contact, metal is mechanically removed using, for example, a brush or cleaning sheet, but this cleaning can cause wear and deformation of the electrical contacts, resulting in poor contact and a shortened lifespan of the electrical contacts.

[0007] Therefore, in view of the above-mentioned problems, the present invention aims to provide an electrical contact and an electrical connecting device that are highly hard, wear-resistant, and have excellent conductivity. [Means for solving the problem]

[0008] In order to solve such problems, the first electrical contactor according to the present invention is an electrical contactor having a main body, a first contact portion at one tip of the main body that contacts a first contact object, and a second contact portion at the other tip of the main body that contacts a second contact object, and is characterized in that it is formed from a conductive ceramic material containing titanium.

[0009] The electrical connection device according to the second aspect of the present invention comprises a housing provided on a substrate on which wiring is formed, and is an electrical connection device that connects an electrode portion of a test object housed in the housing to the wiring, and is characterized in that it comprises a plurality of contactors each having a first contact portion that contacts the electrode portion of the test object housed in the housing and a second contact portion that contacts the wiring formed on the substrate, and each contactor is an electrical contactor according to the first aspect of the present invention. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide an electrical contact that is highly hard, wear-resistant, and has excellent conductivity, and it is also possible to provide an electrical connecting device that uses the electrical contact and has high contactability. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a diagram illustrating a configuration of an electrical connecting device according to an embodiment. [Figure 2]1 is a configuration diagram showing a state of a probe at the time of contact in the electrical connecting device according to the embodiment; [Figure 3] FIG. 2 is a diagram showing the characteristics of the conductive ceramic according to the embodiment. [Figure 4] FIG. 10 is a diagram showing the configuration of a probe according to a modified embodiment. [Figure 5] FIG. 10 is a diagram showing the configuration of a connector according to a modified embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] (A) Main embodiment DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of an electrical contact and an electrical connecting device according to the present invention will be described in detail with reference to the drawings.

[0013] Here, the "electrical contactor" refers to a contactor having conductivity that can come into contact with a first contact object and a second contact object. For example, a probe (including a vertical probe and a cantilever probe) that contacts an electrode terminal of a device under test, or a connector such as a pogo pin that connects wiring terminals of two boards, can be used as the "electrical contactor." In this embodiment, a probe used in a test socket is exemplified as an example of the electrical contactor according to the present invention.

[0014] The "first contact object" is an object that one end of the electrical contactor contacts, and the "second contact object" is an object that the other end of the electrical contactor contacts. Therefore, it is sufficient that the objects that the electrical contactors contact are different from each other. For example, in the case of a probe, the first contact object can be a wiring pattern (connection terminal) on a substrate, and the second contact object can be an electrode terminal of the device under test. Also, in the case of a pogo pin, the first contact object can be a connection terminal (first connection terminal) of the first substrate, and the second contact object can be a connection terminal (second connection terminal) on the second surface (e.g., the bottom surface) of the second substrate.

[0015] The "electrical connection device" is an electrical connection device that is interposed between the semiconductor inspection device and the device under test, and can be, for example, an inspection jig such as a probe card or a socket. In this embodiment, the electrical connection device is a test socket.

[0016] (A-1) Configuration of the electrical connection device Fig. 1 is a diagram showing the configuration of an electrical connecting device according to an embodiment, Fig. 2 is a diagram showing the state of probes at the time of contact in the electrical connecting device according to an embodiment.

[0017] Although each figure illustrates the main components, the present invention is not limited to the illustrated components and may actually include components not shown. In each figure, identical or corresponding components are denoted by the same or corresponding reference numerals. It should be noted that each figure is a schematic diagram, and the dimensions, thickness, etc. of each component may differ from the actual components. Furthermore, the dimensions and proportions of corresponding components may differ between drawings. The following embodiments are intended to exemplify devices and methods for embodying the technical ideas of the present disclosure, and are not intended to limit the materials, shapes, structures, arrangements, etc. of the components of the present disclosure.

[0018] In FIG. 1, a probe apparatus 1 according to the embodiment is a test socket used to inspect the electrical characteristics of a device under test 100 that is an inspection target.

[0019] The object under test 100 can be a semiconductor device mounted in a package such as a semiconductor integrated circuit. The probe apparatus 1 electrically connects electrode terminals 101 of the object under test 100 to electrode pads 201 of a substrate 200. FIG. 1 exemplarily shows a case where the electrode terminals 101 are lead electrodes of a package. The electrode pads 201 are electrically connected to the test apparatus via a wiring pattern (not shown) formed on the substrate 200.

[0020] The probe device 1 comprises a housing 10 having a first surface 11 and a second surface 12 opposite the first surface 11, a probe 20 having a first contact portion 21 and a second contact portion 22 and supported by the housing 10, and an elastic portion 30 arranged inside the housing 10.

[0021] The probe 20 functions as a contact that electrically connects the electrode terminal 101 and the electrode pad 201. Hereinafter, the first contact portion 21 and the second contact portion 22 will also be referred to as "contact portion" unless otherwise specified.

[0022] In the probe 20, at least the first contact portion 21 that contacts the electrode terminal 101 and the second contact portion 22 that contacts the electrode pad 201 are made of a highly hard conductive ceramic material. The portions of the probe 20 that are not made of conductive ceramic material use a conductive material such as a metal material.

[0023] For example, the probe 20 may have a structure in which a metal material such as beryllium copper (Be—Cu) or palladium (Pd) alloy is used for the material of the portion between the first contact portion 21 and the second contact portion 22 of the conductive ceramic material. Alternatively, not only the contact portion but the entire probe 20 may be made of a high-hardness conductive ceramic material. In this embodiment, a case in which the entire probe 20 is made of a high-hardness conductive ceramic material will be described as an example.

[0024] The elastic portion 30 is disposed inside the housing 10 in contact with the housing 10 and the probe 20 .

[0025] To make it easier to understand the explanation of the operation of the probe apparatus 1, the X direction, Y direction, and Z direction are defined as shown in Fig. 1. In Fig. 1, the X direction is the left-right direction on the paper, the Y direction is the depth direction on the paper, and the Z direction is the up-down direction on the paper. In addition, in the Z direction, the direction in which the device under test 100 is located as viewed from the probe apparatus 1 is defined as the upward direction, and the direction in which the probe apparatus 1 is located as viewed from the device under test 100 is defined as the downward direction.

[0026] 1 shows only one probe 20 of the probe device 1, the probe device 1 may have multiple probes 20. For example, the electrical connecting device 1 may have a configuration in which multiple probes 20 are arranged along the Y direction.

[0027] The thickness of the probe 20 in the Y direction (hereinafter simply referred to as "thickness") is, for example, about 0.1 to 0.2 mm. Note that the thickness of the probe is not limited to 0.1 to 0.2 mm, and can be set arbitrarily depending on the size and spacing of the electrode terminals 101, the magnitude of the current flowing through the probe 20 when the device under test 100 is being inspected, and the like.

[0028] The probe 20 may be formed by punching a plate of conductive ceramic material into a predetermined shape using wire electric discharge machining, laser machining, or the like. This allows for improved processing accuracy in the thickness of the probe 20 compared to forming the probe 20 by processing a metal material. In other words, when the probe 20 is made of a conductive ceramic material, processing variations in the thickness of the probe 20 are less likely to occur. On the other hand, because metal materials are softer than conductive ceramic materials, processing variations in the thickness of the probe 20 made of a metal material are more likely to occur.

[0029] In FIG. 1, the probe device 1 is disposed below the object under test 100 when viewed in the Z direction.

[0030] A first contact portion 21 of the probe 20 is exposed on a first surface 11 of the housing 10, and a second contact portion 22 of the probe 20 is exposed on a second surface 12 of the housing 10. The probe 20 is arranged in the housing 10 so that the first contact portion 21 comes into contact with the electrode terminal 101 of the device under test 100 when the distance between the probe device 1 and the device under test 100 narrows in the Z direction. Furthermore, the probe 20 is arranged in the housing 10 so that the contact area 220 of the second contact portion 22 comes into contact with the electrode pad 201 of the substrate 200.

[0031] During testing of the device under test 100, the position of the contact area 220 of the second contact portion 22 that comes into contact with the electrode pad 201 changes due to a change in the position of the first contact portion 21 in the Z direction. A detailed description of the change in state of the probe 20 during testing will be given later with reference to FIG.

[0032] When viewed from the Y direction, the probe 20 has a curved shape with an upwardly facing recess formed therein. One end of the probe 20 located away from the outer part of the probe 20 facing the recess (hereinafter referred to as the "curved part") is the first contact part 21. The other end of the probe 20 closer to the recess is the second contact part 22. A part of the arc-shaped region on the outer edge of the curved part is the contact area 220. When the XY plane defined by the X and Y directions is taken as a projection plane, the projection line in the direction connecting the first contact part 21 and the second contact part 22 (hereinafter referred to as the "extension direction" of the probe 20) extends in the X direction. In other words, when viewed from the Z direction, the probe 20 extends in the X direction.

[0033] The elastic portion 30 has a cylindrical shape with an axial direction extending in the Y direction. That is, the axial direction of the elastic portion 30 is perpendicular to the direction in which the first contact portion 21 of the probe 20 is displaced and perpendicular to the direction in which the probe 20 extends. The elastic portion 30 abuts against the inside of the recess of the probe 20. In other words, the elastic portion 30 is sandwiched between the surface of the recess of the probe 20 and the inner wall of the housing 10.

[0034] When inspecting the device under test 100, the electrode terminals 101 of the device under test 100 and the electrode pads 201 of the substrate 200 are electrically connected by the conductive probes 20, as shown in FIG.

[0035] That is, when inspecting the device under test 100, the device under test 100 is moved relative to the probe device 1 along the Z direction, and the first contact portion 21 of the probe 20 is pressed against the electrode terminal 101 of the device under test 100. At this time, due to a pressing force applied to the first contact portion 21 between the first contact portion 21 and the electrode terminal 101, the probe 20 changes its posture inside the housing 10 with the second contact portion 22 in contact with the surface of the electrode pad 201.

[0036] Specifically, in response to the displacement of the first contact portion 21 in the Z direction caused by the pressure applied to the first contact portion 21, the posture of the probe 20 changes inside the housing 10 while the second contact portion 22 maintains a state of contact with the electrode pad 201. As the posture of the probe 20 changes, the position of the contact area 220 of the second contact portion 22 that contacts the electrode pad 201 changes.

[0037] 2, the posture of the probe 20 and the shape of the elastic part 30 in a state where the first contact part 21 and the electrode terminal 101 are in contact (hereinafter also referred to as the "contact state") are shown by solid lines. Also, the posture of the probe 20 and the shape of the elastic part 30 in a state where the first contact part 21 and the electrode terminal 101 are not in contact (hereinafter also referred to as the "non-contact state") are shown by dashed lines.

[0038] When the probe 20 is in contact with the test object 100 during testing, the attitude of the probe 20 changes so that the position of the contact area 220 is closer to the first contact portion 21 than when the probe 20 is in a non-contact state.

[0039] Probe 20 requires conductivity to electrically connect electrode terminal 101 and electrode pad 201, and mechanical strength to prevent the shape from changing between the contact state and the non-contact state. Probe 20, made of a conductive ceramic material, has both conductivity and mechanical strength.

[0040] In the contact state, the elastic portion 30 is sandwiched and compressed between the probe 20 and the housing 10 in response to changes in the posture of the probe 20 inside the housing 10. That is, in the contact state, the elastic portion 30 is elastically deformed. The elastically deformed elastic portion 30 urges the probe 20 in a direction that returns the posture of the probe 20 to the posture in the non-contact state. In other words, the elastic portion 30 urges the probe 20 so as to press the first contact portion 21 against the electrode terminal 101.

[0041] While the device under test 100 is being inspected, the elastic force of the elastic portion 30 maintains the first contact portion 21 in contact with the electrode terminal 101 and the second contact portion 22 in contact with the electrode pad 201. This ensures electrical connection between the electrode terminal 101 of the device under test 100 and the electrode pad 201 of the substrate 200 via the probe 20 during inspection of the device under test 100.

[0042] In the probe device 1, a part of the arc-shaped region on the outer edge of the curved portion of the probe 20 contacts the electrode pad 201 along a line extending in the Y direction as the contact region 220. As shown in FIG. 2, the position of the contact region 220 in the contact state is closer to the first contact portion 21 than the position of the contact region 220 in the non-contact state. The reason why the position of the contact region 220 changes between the contact state and the non-contact state is because the position of the contact region 220 changes along the outer edge of the curved portion in response to changes in the attitude of the probe 20. Because the contact region 220 is included in the arc-shaped region of the curved portion, the position of the contact region 220 that contacts the electrode pad 201 changes smoothly in response to changes in the attitude of the probe 20. Therefore, even if the attitude of the probe 20 changes, damage to the second contact portion 22 and the electrode pad 201 can be suppressed.

[0043] As described above, when the device under test 100 is tested, the posture of the probe 20 changes, causing the elastic portion 30 sandwiched between the probe 20 and the housing 10 to elastically deform. Then, the elastic portion 30 biases the probe 20 so that the first contact portion 21 contacts the electrode terminal 101 of the device under test 100 with a predetermined pressing force.

[0044] That is, the elastic portion 30 biases the probe 20 in a direction that cancels out the displacement of the first contact portion 21 caused by the pressing force applied to the first contact portion 21 when the first contact portion 21 is pressed against the electrode terminal 101. While the device under test 100 is being inspected, that is, while the first contact portion 21 is in contact with the electrode terminal 101, the elastic portion 30 is in a compressed and deformed state.

[0045] After the inspection of the device under test 100 is completed, the relative position of the device under test 100 in the Z direction with respect to the probe device 1 is changed so as to widen the gap between the device under test 100 and the probe device 1. By separating the electrode terminal 101 of the device under test 100 and the first contact portion 21 of the probe 20, the pressing force applied to the first contact portion 21 is eliminated. As a result, the shape of the elastic portion 30 returns to the non-contact state, and the posture of the probe 20 returns to the non-contact state due to the elastic force of the elastic portion 30.

[0046] The probe 20 is supported by the housing 10 so that the attitude of the probe 20 can change in response to the displacement of the position of the first contact portion 21 in the Z direction. The attitude of the probe 20 changes inside the housing 10 so that the position of the contact area 220 of the second contact portion 22 that contacts the electrode pad 201 changes in response to the displacement of the first contact portion 21 in the Z direction. For example, although not shown, a portion of the probe 20 may be protruded and the protruding portion of the probe 20 may be fitted into a support hole provided in the housing 10. Alternatively, a portion of the probe 20 may be placed on a support portion of the housing 10 provided below the probe 20.

[0047] As described above, the probe device 1 includes a probe 20 made of a conductive ceramic material that simultaneously contacts the electrode terminal 101 and the electrode pad 201, and an elastic part 30 that biases the probe 20 with an elastic force when the probe 20 is in contact with the electrode terminal 101.

[0048] The elastic force of the elastic portion 30 controls the contact load applied to the probe 20 when the probe 20 comes into contact with the electrode terminal 101. By increasing the elastic force of the elastic portion 30, the contact load increases, and by decreasing the elastic force of the elastic portion 30, the contact load decreases.

[0049] Furthermore, in the probe device 1, the amount of displacement (hereinafter also referred to as "stroke") of the first contact portion 21 due to contact with the electrode terminal 101 is controlled by the elastic force of the elastic portion 30. That is, by increasing the elastic force of the elastic portion 30, the stroke decreases, and by decreasing the elastic force of the elastic portion 30, the stroke increases.

[0050] The elastic portion 30 may be made of a material such as an elastomer. Alternatively, the elastic portion 30 may be cylindrical and hollow. By making the elastic portion 30 cylindrical, it is easier to control the contact load and stroke. In other words, by increasing the thickness of the cylindrical elastic portion 30, the contact load can be increased and the stroke can be decreased. On the other hand, by decreasing the thickness of the cylindrical elastic portion 30, the contact load can be decreased and the stroke can be increased.

[0051] The elastic portion 30 may be made of a conductive material or an insulating material, but the materials of the housing 10 and the elastic portion 30 and the arrangement of the elastic portion 30 inside the housing 10 are set so that the probes 20 are electrically insulated from each other.

[0052] (A-2) Detailed Description of Probe 20 Conventionally, metal materials have been used for the contacts that electrically connect the electrode terminals 101 and the electrode pads 201. The contacts correspond to the probes 20 in the probe device 1. Repeated inspection of the device under test 100 causes the metal material (such as tin or nickel palladium (Ni-Pd)) of the electrode terminals 101 and the electrode pads 201 to adhere to the surfaces of the contacts. In order to prevent a decrease in the contact between the electrode terminals 101 and the electrode pads 201, it is necessary to remove the metal adhering to the surfaces of the contacts by a cleaning operation.

[0053] However, physical cleaning can wear or damage the contact surface, deforming the probe and reducing the contact performance, which can affect inspection accuracy.

[0054] Therefore, in the probe device 1, the probe 20 is made of a conductive ceramic material that is harder and more wear-resistant than metal materials, so that the deterioration of the contact performance of the probe 20 can be suppressed.

[0055] For example, the probe device 1 can suppress wear of the probe 20 due to a cleaning operation for removing metal attached to the surface of the probe 20. Furthermore, the probe device 1 enables stable contact between the probe 20 and the electrode terminal 101 and the electrode pad 201.

[0056] (A-3) Detailed explanation of conductive ceramics FIG. 3 is a diagram showing the characteristics of the conductive ceramic according to the embodiment.

[0057] Figure 3 shows the properties of beryllium copper (Be-Cu), a typical metal material used in conventional probes (labeled "Comparative Example 1"), and the properties of titanium carbonitride or materials containing titanium carbonitride (labeled "Examples 1 to 4") exemplified in this embodiment, showing, for example, hardness (Vickers hardness) and volume resistivity.

[0058] As examples of high-hardness conductive ceramics, conductive ceramics containing titanium carbonitride as a main component, as in Examples 1 to 4, are exemplified.

[0059] Examples 1 and 2 are conductive ceramics containing titanium carbonitride, nickel, and chromium as the main components, and Examples 3 and 4 are conductive ceramics containing titanium carbonitride as the main component.

[0060] From the viewpoint of good electrical conductivity, the volume resistivity of the probe 20 is, for example, about 100 [×10 -6 Ω·cm] or less is good, and 60[×10 -6 It is preferable that the volume resistivity of the probe 20 is about 100 [×10 -6 By setting the electrical conductivity to [Ω·cm] or less, good electrical conductivity can be ensured.

[0061] From the viewpoint of wear resistance, the hardness of the probe 20 is preferably, for example, 800 HV or more, preferably 1000 HV or more, and more preferably 1380 HV or more. In this way, by making the hardness of the probe 20 or the like higher than the hardness of the metal material, such as 800 HV or more, metal debris is less likely to be generated during contact and it is less likely to be scraped off during cleaning, thereby suppressing deformation and improving contactability.

[0062] As described above, titanium-based ceramics are suitable as conductive ceramics having high hardness and good electrical conductivity, and ceramics containing titanium carbonitride as the main component and composite ceramics containing titanium carbonitride (hereinafter referred to as "titanium carbonitride-based ceramics") are also preferred.

[0063] Furthermore, using titanium carbonitride ceramics as the material for the probe 20 facilitates processing of the tip (for example, peaked tip processing) of the probe 20. For example, peaked tip processing makes it easier to process the contact surface of the probe 20 with a metal terminal such as an electrode terminal of the test object, thereby improving contact.

[0064] Furthermore, by using conductive ceramics for the probe 20, the maximum operating temperature is increased, deformation of the probe 20 can be suppressed, and the life of the probe 20 can be extended.

[0065] (A-4) Effects of the embodiment As described above, according to this embodiment, by forming the electrical contacts from titanium carbonitride ceramics, it is possible to increase the hardness, thereby suppressing wear during cleaning and improving contact. It also extends the lifespan. Furthermore, since the volume resistivity is low, it is possible to maintain conductivity.

[0066] Furthermore, by using electrical contacts made of titanium carbonitride ceramics to conduct electrical testing of an object to be tested, the contact of probes and the like is improved, enabling highly accurate testing.

[0067] (B) Other embodiments Although the above-described embodiments are directed to electrical contacts and electrical connection devices according to the present invention, the following modified embodiments are also applicable to the present invention.

[0068] (B-1) In the above-described embodiment, an electrical contact formed of titanium carbonitride ceramics was exemplified as a highly hard conductive ceramic, but the electrical contact may be partially plated with metal or the like.

[0069] (B-2) A modified example of the probe will be illustrated using Fig. 4. In this modified embodiment, a vertical probe will be illustrated, but the structure of the vertical probe is not limited to that shown in Fig. 4.

[0070] As shown in FIG. 4, the probe 20A has one first plunger 31, two second plungers 32 (32a, 32b), and one coil spring 33.

[0071] The first plunger 31 and the second plunger 32 (32a, 32b) are each a plate-like member, and the two second plungers 32 (32a, 32b) are provided on either side of the first plunger 31. In addition, the coil spring 33 is provided so as to cover the outer periphery of the overlapping portion of the second plunger 32 (32a and 32b) and the first plunger 31.

[0072] The first plunger 31 has a coil receiving portion 311 that is wider than the end portion that is inserted into the coil spring 33. Similarly, the second plunger 32 (32a, 32b) also has a coil receiving portion 321 that is wider than the end portion that is inserted into the coil spring 33. Both ends of the coil spring 33 are supported by the coil receiving portion 311 and the coil receiving portion 321. Therefore, when a contact load acts on the first plunger 31 and the second plunger 32 (32a, 32b) during testing, the coil spring 33 becomes elastic in the Z-axis direction, allowing the probe 20A to move up and down (in the Z-axis direction).

[0073] The method for assembling the probe 20A using the first plunger 31, the second plunger 32 (32a, 32b), and the coil spring 33 is, for example, to insert the two second plungers 32 (32a, 32b) from one end of the coil spring 33. Next, the first plunger 31 is inserted from the other end of the coil spring 33 so that the first plunger 31 is fitted between the two second plungers 32. The method for assembling the probe 20A is not limited to the above-mentioned method.

[0074] The probe 20A shown in FIG. 4 is also made of a highly hard conductive ceramic material, particularly a conductive ceramic containing titanium carbonitride as its main component.

[0075] For example, all of the components (members) of the first plunger 31, the second plunger 32 (32a, 32b), and the coil spring 33 may be made of conductive ceramics. Alternatively, some of the components of the first plunger 31, the second plunger 32 (32a, 32b), and the coil spring 33 may be made of conductive ceramics. For example, the first plunger 31 and the second plunger 32 may be made of conductive ceramics, and the coil spring 33 may be made of metal.

[0076] Further, for example, the first plunger 31, the second plunger 32 (32a, 32b), and the coil spring 33 may each be formed entirely from conductive ceramics, or only a portion of each component may be formed from conductive ceramics.

[0077] When using conductive ceramics to fabricate the probe 20A, a method can be used in which a plate made of conductive ceramics is cut by wire electric discharge machining or laser machining to form the outer shape. This reduces the need for conventional processes such as drawing and bending metal materials. When cutting metal plate materials using wire electric discharge machining or the like, burrs are generated on the cut surface, but when using conductive ceramic plate materials, burrs are less likely to be generated on the cut surface, improving machining accuracy.

[0078] The probe 20A comes into contact with the electrode terminal 101 of the device under test 100 and the connection terminal 85 of the substrate, but since the number of contacts is large, it is required to have high mechanical strength. In other words, the conductive ceramic material must have high hardness. Furthermore, it must also have conductivity.

[0079] (B-3) Next, an example will be given in which connectors such as pogo pins are also formed from high-hardness conductive ceramics containing titanium carbonitride as the main component.

[0080] In FIG. 5, the connector 16 can be an existing pogo pin, and includes, for example, a third plunger 161, a fourth plunger 162, a barrel 163, and a coil spring 164.

[0081] Although the connector 16 is shown as a pogo pin in FIG. 5, the structure of the connector 16 is not limited to that shown in FIG. 5, and the connector 16 is not limited to a pogo pin and may be a rod or the like.

[0082] The third plunger 161 and the fourth plunger 162 are each a roughly cylindrical or columnar member with a pointed tip, and are members that protrude from the end of a cylindrical barrel 163. Inside the barrel 163, a coil spring 164 is provided that is fixed to the end of the third plunger 161 and the fourth plunger 162. This provides elasticity to the connector 16 in the Z-axis direction.

[0083] Here, connector 16 is connected to terminal 53 of the wiring board (first board) and connection terminal 54 of the connection wiring board (second board), and is required to have mechanical strength and, of course, conductivity.

[0084] Therefore, the connector 16 can be made of a highly hard conductive ceramic material, similar to the probe 20A.

[0085] For example, of the four components (members), the third plunger 161 and the fourth plunger 162 are made of conductive ceramics. Of course, all of the components, namely the third plunger 161, the fourth plunger 162, the barrel 163, and the coil spring 164, may be made of conductive ceramics. Also, for example, the entire third plunger 161 and the fourth plunger 162 may be made of conductive ceramics, or only a portion of them may be made of conductive ceramics.

[0086] (B-4) The structure of the vertical probe exemplified in the above-described embodiment is not limited to that shown in Fig. 4. Although the vertical probe in Fig. 4 is exemplified as being formed of four components, the number of components is not limited, and it may be formed of, for example, one component. Furthermore, the shape of the vertical probe is not limited.

[0087] (B-5) In the above-described embodiment, the probe is a vertical probe, but the probe may also be a cantilever probe.

[0088] The cantilever probe may be entirely or partially made of titanium carbonitride ceramics. Furthermore, since the cantilever probe can be formed by electrical discharge machining or the like on a titanium carbonitride ceramic plate, it is easier to process than conventional metal materials.

[0089] (B-6) In the above-described embodiments, the electrical contacts according to the present invention are exemplified as probes and pogo pins, but only the probes may be made of conductive ceramic material, or only the pogo pins may be made of conductive ceramic material.

[0090] Furthermore, in an electrical connection device such as a probe card, a conductive member may be made of conductive ceramics. [Explanation of symbols]

[0091] 1: probe device, 10: housing, 11: first surface, 12: second surface, 20: Probe, 20A: Probe, 21: First contact portion, 22: Second contact portion, 30: Elastic portion, 100: Test object, 101: Electrode terminal, 31: first plunger, 32: second plunger, 33: coil spring, 53: terminal, 54: connection terminal, 62: second plunger, 85: connection terminal, 16: connector, 161: third plunger, 162: fourth plunger, 163: barrel, 164: coil spring, 200: substrate, 201: electrode pad, 220: contact area, 311: coil receiving portion, 321: coil receiving portion.

Claims

1. An electrical contactor having a main body, a first contact portion at one end of the main body that contacts a first contact object, and a second contact portion at the other end of the main body that contacts a second contact object, characterized in that the electrical contactor is made of a conductive ceramic material containing titanium.

2. 2. The electrical contact according to claim 1, wherein the entire electrical contact is formed from a conductive ceramic material containing titanium carbonitride as a main component or a conductive ceramic material containing titanium carbonitride.

3. The electrical contact has a Vickers hardness of about 800 HV or more and a volume resistivity of about 60×10 －６ 3. The electrical contact according to claim 2, wherein the electrical resistance is Ω·cm or less.

4. The electrical contact has a Vickers hardness of about 1000 HV or more and a volume resistivity of about 100×10 －６ 3. The electrical contact according to claim 2, wherein the electrical resistance is Ω·cm or less.

5. An electrical connecting device comprising a housing provided on a substrate on which wiring is formed, the electrical connecting device connecting an electrode portion of a device under test housed in the housing to the wiring, a plurality of contacts each having a first contact portion that contacts an electrode portion of the device under test housed in the housing and a second contact portion that contacts the wiring formed on the substrate; Each of the contacts is an electrical contact according to any one of claims 1 to 4. An electrical connecting device characterized by:

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