Liquid ejection head substrate, liquid ejection head, and method of manufacturing liquid ejection head substrate

The configuration of a liquid ejection head substrate with electrochemically dissolvable second protective layers ensures reliable kogation removal by electrically isolating heater and counter electrodes, addressing conductive residue issues and maintaining stable ink ejection.

JP2026028428APending Publication Date: 2026-02-20CANON KK
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
JP2024130833
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-07
Publication Date
2026-02-20

AI Technical Summary

Technical Problem

Conductive residue left on the sidewalls of etching steps in the protective layer of a liquid ejection head substrate hinders effective removal of kogation, leading to unstable ink ejection due to electrical connections between the heat-generating element and counter electrode.

Method used

A configuration with a first and second protective layer, where the second protective layer is formed using a material that dissolves electrochemically, ensuring the heater-side electrode portion and counter electrode portion are electrically independent, allowing kogation removal through an electrochemical reaction.

Benefits of technology

Effectively removes kogation by applying a voltage between the heater-side and counter electrode portions, preventing electrical connections via conductive residue and maintaining stable ink ejection.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026028428000001_ABST
    Figure 2026028428000001_ABST
Patent Text Reader

Abstract

To surely remove kogation generated on a substrate for a liquid ejection head.SOLUTION: A liquid ejection head substrate includes a first wiring layer 103 for supplying power, an insulating layer 104 covering the first wiring layer 103, and a resistance heating element 105 formed on a surface of the insulating layer 104 opposite to the first wiring layer 103, and is formed at a portion different from the resistance heating element 105 on the surface of the insulating layer 104 opposite to the first wiring layer 103. The heater includes the second wiring layer 107 electrically connected to the first wiring layer 103, the insulating first protection layer 108 covering the resistance heating element 105 and the second wiring layer 107, and the second protection layer 109 formed to overlap the first protection layer 108, and the second protection layer 109 includes the heating-element-side electrodes 109a overlapping the portions of the first protection layer 108 covering the resistance heating element 105 and the opposing-electrode portions 109a spaced apart from the heating-element-side electrodes 109b and overlapping the portions of the first protection layer 108 covering the second wiring layer 107.SELECTED DRAWING: Figure 6
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Substrate for inkjet head, inkjet head with substrate, cleaning method for inkjet head, and inkjet recorder using inkjet head

    JP2008105364A