Circuit board and image forming apparatus

Abstract

To provide a circuit board which can be miniaturized.SOLUTION: The circuit board includes a plurality of pads (201, 206) that are arranged on the first surface and to which terminals of the component (A) are connected, and a plurality of pads (211, 216) that are arranged on the first surface and to which terminals of the component (B) are connected. The pad 211 is disposed between the pad 201 and the pad 206 in the first direction along the first surface. The pad 206 is disposed between the pad 211 and the pad 216 in the first direction.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a circuit board on which electronic components are mounted and an image forming apparatus equipped with such a circuit board. [Background technology]

[0002] There are cases where multiple electronic components with compatible electrical standards are exclusively mounted on the same circuit board. Patent Document 1 discloses a circuit board (printed circuit board) in which pads for electronic components with smaller package sizes are arranged inside pads for electronic components with larger package sizes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-320156 Summary of the Invention [Problem to be solved by the invention]

[0004] The conventional method cannot be applied unless there is a certain degree of variation in package size. Therefore, it is sometimes difficult to arrange pads to narrow the mounting area. In other words, there is a problem that the circuit board becomes larger.

[0005] In view of the above-mentioned problems, a main object of the present invention is to provide a circuit board that can be miniaturized. [Means for solving the problem]

[0006] The circuit board of the present invention comprises a first pad and a second pad arranged on a first surface for connecting terminals of a first electronic component, and a third pad and a fourth pad arranged on the first surface for connecting terminals of a second electronic component, wherein the third pad is arranged between the first pad and the second pad in a first direction along the first surface, and the second pad is arranged between the third pad and the fourth pad in the first direction. [Effects of the Invention]

[0007] According to the present invention, the circuit board can be made smaller. [Brief explanation of the drawings]

[0008] [Figure 1] (a) and (b) are explanatory diagrams of the shape of electronic components. [Figure 2] FIG. [Figure 3] (a) and (b) are explanatory diagrams of the pad arrangement. [Figure 4] FIG. 10 is an explanatory diagram of another example of a mounting area for electronic components. [Figure 5] FIG. 10 is an explanatory diagram of another example of a mounting area for electronic components. [Figure 6] FIG. 1 is an explanatory diagram of an image forming apparatus. [Figure 7] Schematic diagram of the controller power supply unit. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0010] (Electronic component configuration) 1A and 1B are explanatory diagrams illustrating the shape of an electronic component mounted on a circuit board according to this embodiment. As illustrated in FIG. 1A, the electronic component 100 has, for example, six terminals (six pins). The electronic component 100 is, for example, an SOP (Small Outline Package). The electronic component 100 includes a semiconductor device or the like for performing predetermined processing therein. Each terminal has a function of supplying power to an internal semiconductor element, inputting a signal, outputting a signal, grounding, and the like.

[0011] The first terminal 101 of the electronic component 100 has a function assigned to terminal number 1. The second terminal 102 of the electronic component 100 has a function assigned to terminal number 2. The third terminal 103 of the electronic component 100 has a function assigned to terminal number 3. The fourth terminal 104 of the electronic component 100 has a function assigned to terminal number 4. The fifth terminal 105 of the electronic component 100 has a function assigned to terminal number 5. The sixth terminal 106 of the electronic component 100 has a function assigned to terminal number 6.

[0012] First terminal 101, second terminal 102, and third terminal 103 are provided on the same side of the package of electronic component 100. Fourth terminal 104, fifth terminal 105, and sixth terminal 106 are provided on the same side of the package of electronic component 100. First terminal 101, second terminal 102, and third terminal 103, and fourth terminal 104, fifth terminal 105, and sixth terminal 106 are provided on opposing sides of the package of electronic component 100.

[0013] FIG. 1(b) is an exemplary diagram showing the functions assigned to each terminal when the electronic component 100 is component A and component B. Here, two types of electronic components 100 (component A and component B) are described, but three or more types of electronic components 100 may be used. Here, an example is described in which component A and component B are both configured to output a voltage corresponding to an input power supply voltage. Components A and B may be configured to output the input power supply voltage as is, or may convert the voltage value before outputting.

[0014] When the electronic component 100 is component A, the following functions are assigned to each terminal. The first terminal 101 functions as a power supply input terminal VIN. The second terminal 102 functions as a ground GND. The third terminal 103 functions as an input terminal EN for a control signal. The fourth terminal 104 functions as a second setting terminal Cont2 that sets the function of component A. The fifth terminal 105 functions as a first setting terminal Cont1 that sets the function of component A. The sixth terminal 106 functions as a power supply output terminal VOUT.

[0015] The second setting terminal Cont2 assigned to the fourth terminal 104 and the first setting terminal Cont1 assigned to the fifth terminal 105 are terminals for setting different functions to the component A. The fifth terminal 105 (first setting terminal Cont1) is a terminal that can be connected to the sixth terminal 106 (power output terminal VOUT).

[0016] In the case of component A, electronic component 100 operates, for example, as follows. For example, when a control signal of a predetermined logical value (e.g., "High") is input from third terminal 103, electronic component 100 outputs the voltage input to power supply input terminal VIN from sixth terminal 106. When a control signal of an opposite logical value (e.g., "Low") is input from third terminal 103, electronic component 100 does not output the voltage input to power supply input terminal VIN from sixth terminal 106.

[0017] When electronic component 100 is component B, the following functions are assigned to each terminal. The first terminal 101 functions as a first power supply output terminal VOUT. The second terminal 102 functions as a second power supply output terminal VOUT. For convenience, they are distinguished as "first" and "second," but the first power supply output terminal VOUT and the second power supply output terminal VOUT output the same output voltage VOUT. The third terminal 103 functions as an input terminal EN for a control signal. The fourth terminal 104 functions as a ground GND. The fifth terminal 105 functions as a first power supply input terminal VIN. The sixth terminal 106 functions as a second power supply input terminal VIN. For convenience, they are distinguished as "first" and "second," but the same input voltage VIN is input to the first power supply input terminal VIN and the second power supply input terminal VIN.

[0018] In the case of component B, electronic component 100 operates, for example, as follows. For example, when a control signal of a predetermined logical value (e.g., "High") is input from third terminal 103, electronic component 100 outputs the voltages input to first power supply input terminal VIN and second power supply input terminal VIN from first terminal 101 and second terminal 102. When a control signal of a predetermined logical value (e.g., "Low") is input from third terminal 103, electronic component 100 does not output the voltages input to first power supply input terminal VIN and second power supply input terminal VIN from first terminal 101 and second terminal 102.

[0019] In this way, the functions assigned to some of the terminals of parts A and B are the same, but the functions assigned to the remaining terminals are different. Note that parts A and B may have different numbers of terminals and different arrangements of terminals. For example, part B may further include a seventh terminal arranged on the same side as first terminal 101, second terminal 102, and third terminal 103, and an eighth terminal arranged on the same side as fourth terminal 104, fifth terminal 105, and sixth terminal 106. In this case, the size of part B is larger than that of part A by the amount of the seventh and eighth terminals.

[0020] (Circuit board configuration) 2 is an explanatory diagram of the mounting area of ​​the circuit board on which the electronic component 100 is mounted. In the mounting area of ​​the electronic component 100, pads to which the terminals of the electronic component 100 are connected are arranged so that the electronic component 100 can be mounted as either component A or B. An example of such a pad arrangement is shown in FIG.

[0021] The circuit board of this embodiment is a printed circuit board configured such that a predetermined wiring pattern of a conductor such as copper foil is formed on a mounting surface (first surface) on which the electronic component 100 is mounted, and the wiring pattern is covered with a dielectric. The conductor wiring pattern transmits and receives signals and supplies power voltage between multiple electronic components, including the mounted electronic component 100. The pads are resist openings formed by exposing the wiring pattern (conductor) for soldering each terminal of the electronic component 100 to the circuit board from the dielectric. That is, in this embodiment, openings are formed in the resist, which is a dielectric, and the openings define areas that function as pads. Note that this embodiment will be described using a case in which the circuit board is a printed circuit board, but the circuit board is not limited to a printed circuit board and may be any board on which the electronic component 100 can be mounted. Furthermore, the areas that function as pads may also be defined by the outer edges of the conductor wiring pattern rather than by openings in the resist.

[0022] In FIG. 2, pads 201, 202, 203, 204, 205, and 206 for component A and pads 211, 212, 213, 214, 215, and 216 for component B are arranged. Pad 201 is connected to the first terminal 101 of component A. Pad 202 is connected to the second terminal 102 of component A. Pad 203 is connected to the third terminal 103 of component A. Pad 204 is connected to the fourth terminal 104 of component A. Pad 205 is connected to the fifth terminal 105 of component A. Pad 206 is connected to the sixth terminal 106 of component A. Pad 211 is connected to the first terminal 101 of component B. Pad 212 is connected to the second terminal 102 of component B. Pad 213 is connected to the third terminal 103 of component B. The pad 214 is connected to the fourth terminal 104 of the component B. The pad 215 is connected to the fifth terminal 105 of the component B. The pad 216 is connected to the sixth terminal 106 of the component B.

[0023] In this embodiment, a portion of the mounting area of ​​component A overlaps a portion of the mounting area of ​​component B. The other portion of component A (also referred to as the remaining portion) does not overlap the mounting area of ​​component B. In other words, the remaining portion of component A is located outside the mounting area of ​​component B. Furthermore, the remaining portion of component B does not overlap the mounting area of ​​component A. Therefore, in a first direction (the left-right direction in FIG. 2 ) along the mounting surface of the circuit board, the pads 211-213 to which the terminals of component B are connected are arranged between some of the pads 201-203 to which the terminals of component A are connected and the remaining pads 204-206. Furthermore, in the first direction, the pads 204-206 to which the terminals of component A are connected are arranged between some of the pads 211-213 to which the terminals of component B are connected and the remaining pads 214-216.

[0024] In the example of FIG. 2, pads 201, 211, 206, and 216 are aligned on a line along the first direction. In this arrangement, pads 201, 211, 206, and 216 are sometimes expressed as being aligned at the same position in a second direction (the up-and-down direction in FIG. 2) that intersects with the first direction. On the other hand, for example, pad 201 and pad 212 are not aligned on a line along the first direction. In this arrangement, pad 201 and pad 212 are sometimes expressed as being aligned at different positions in the second direction.

[0025] With this pad arrangement, components A and B are mounted exclusively on the circuit board. Therefore, for example, when component A is mounted, pads 211-213 to which the terminals of component B are connected are covered by component A. Similarly, when component B is mounted, pads 204-206 to which the terminals of component A are connected are covered by component B.

[0026] Pads 201, 215, and 216, which are connected to terminals functioning as power supply input terminals VIN, are connected to an input power supply pattern, which is a wiring pattern. A power supply voltage is supplied to each pad via the input power supply pattern. Pads 206, 211, and 212, which are connected to terminals functioning as power supply output terminals VOUT, are connected to an output power supply pattern, which is a wiring pattern. The output power supply pattern is a continuous wiring pattern including pads 206, 211, and 212. The output power supply pattern outputs a power supply voltage from each pad. In addition, since the fifth terminal 105 (first setting terminal Cont1) of component A is a terminal connectable to the sixth terminal 106 (power supply output terminal VOUT), pad 205 is also connected to the output power supply pattern, which is a wiring pattern. By connecting the fifth terminal 105 of component A to the output voltage VOUT, the fall time of the output voltage VOUT can be shortened when a "low" control signal is input to the third terminal 103. In this way, pads connected to terminals with the same function and pads connected to terminals with different functions but which can be connected are connected to the same wiring pattern.

[0027] When component A is mounted, the fifth terminal 105 (first setting terminal Cont1) is directly connected to the output power supply pattern by the pad 205. That is, the fifth terminal 105 (first setting terminal Cont1) is treated as the same node as the pads 211, 212, and 206 to which the output power supply pattern is connected. In this way, the pads for component A and component B connected to the same wiring pattern are each arranged between the pads for the other components.

[0028] With this configuration, it is possible to reduce the area occupied by components A and B on the circuit board while ensuring the size of the output power supply pattern. In the example of FIG. 2, pad 206, to which the terminal of component A is connected, and pad 211, to which the terminal of component B is connected, are arranged in the same position in the second direction. Even if pad 206 and pad 211 are arranged in different positions in the second direction, it is possible to obtain the above-mentioned space-saving effect. Furthermore, since it is preferable to reduce the resistance value, especially in the wiring pattern of the power supply system, the effect of reducing resistance by sharing the output power supply pattern is significant.

[0029] Figure 3 is an explanatory diagram of the arrangement of pads connected to the output power supply pattern. Figure 3(a) shows the arrangement of pads 205, 206, 211, and 212. Figure 3(b) is an explanatory diagram of pads including adjacent pads.

[0030] In FIG. 3(a), pad 211 to which first terminal 101 of component B is connected is connected to the output power supply pattern via gap 301. In this embodiment, gaps 301 are provided at four locations, one on each of the top, bottom, left, and right of pad 211. Gaps 301 allow pad 211 to form a thermal land. Pad 212 to which second terminal 102 of component B is connected is connected to the output power supply pattern via gap 302. In this embodiment, gaps 302 are provided at four locations, one on each of the top, bottom, left, and right of pad 212. Gaps 302 allow pad 212 to form a thermal land.

[0031] The pad 206 to which the sixth terminal 106 of component A is connected is connected to the output power supply pattern via gaps 303. In this embodiment, gaps 303 are provided at four locations, one on each of the top, bottom, left, and right of the pad 206. The gaps 303 allow the pad 206 to form a thermal land. The pad 205 to which the fifth terminal 105 of component A is connected is connected to the output power supply pattern via gaps 304. In this embodiment, gaps 304 are provided at four locations, one on each of the top, bottom, left, and right of the pad 205. The gaps 304 allow the pad 205 to form a thermal land. In this way, in the example shown in FIG. 3(a), the output power supply pattern is formed as a wiring pattern that connects multiple pads.

[0032] In FIG. 3(b), pads 211 and 206 are contained within a single pad 310. That is, pads 211 and 206 do not have individual resist openings, and pad 310 serves as the resist opening. Here, the resist is an example of a dielectric layer that covers a wiring pattern. The openings in the resist define the area that functions as a pad. That is, the openings in the resist define a portion of the wiring pattern, which is a conductor, as an area for connecting a terminal. Pad 310 is connected to the output power pattern through gaps 305. In this embodiment, gaps 305 are provided in a total of six locations: two above and below and one on each side. The gaps 305 allow pad 310 to form a thermal land. Pads 212 and 205 are formed inside pad 311. That is, pads 212 and 205 do not have individual resist openings, and pad 311 serves as the resist opening. Pad 311 is connected to the output power pattern through gaps 306. In this embodiment, gaps 306 are provided in a total of six locations: two at the top and bottom and one at the left and one at the right. The gaps 306 allow the pads 311 to form thermal lands. If a dielectric layer such as a resist is not used, the outer edge of the pad is defined by patterning the conductor layer.

[0033] Fig. 4 is an explanatory diagram of another example of the mounting area of ​​electronic component 100. Fig. 4 illustrates an example of pad arrangement similar to Fig. 2. In Fig. 4, pads 401, 402, 403, 404, 405, and 406 for component A and pads 411, 412, 413, 414, 415, and 416 for component B are arranged.

[0034] Pad 401 is connected to the first terminal 101 of component A. Pad 402 is connected to the second terminal 102 of component A. Pad 403 is connected to the third terminal 103 of component A. Pad 404 is connected to the fourth terminal 104 of component A. Pad 405 is connected to the fifth terminal 105 of component A. Pad 406 is connected to the sixth terminal 106 of component A. Pad 411 is connected to the first terminal 101 of component B. Pad 412 is connected to the second terminal 102 of component B. Pad 413 is connected to the third terminal 103 of component B. Pad 414 is connected to the fourth terminal 104 of component B. Pad 415 is connected to the fifth terminal 105 of component B. Pad 416 is connected to the sixth terminal 106 of component B.

[0035] The mounting area of ​​component A and the mounting area of ​​component B are not the same, but are arranged so that some of them overlap while the remaining portions do not. For this reason, pads 414-416 to which the terminals of component B are connected are arranged between pads 401-403 and pads 404-406 to which the terminals of component A are connected. Furthermore, pads 401-403 to which the terminals of component A are connected are arranged between pads 411-413 and pads 414-416 to which the terminals of component B are connected. Pads 401-406 to which the terminals of component A are connected and pads 411-416 to which the terminals of component B are connected are arranged with a shift in the direction parallel to the side on which each terminal is provided (the direction in which the terminals are arranged). In FIG. 4, pads 411-416 to which component B is connected are arranged with a shift by one pad above pads 401-406 to which component A is connected. This pad arrangement is possible because component A and site B are mounted exclusively on the circuit board.

[0036] Pads 401, 415, and 416, to which terminals functioning as power supply input terminals VIN are connected, are connected to an input power supply pattern. A power supply voltage is supplied to each pad by the input power supply pattern. Pads 406, 411, and 412, to which terminals functioning as power supply output terminals VOUT are connected, are connected to an output power supply pattern. A power supply voltage is output from each pad by the output power supply pattern.

[0037] In FIG. 4, pad 405 to which fifth terminal 105 (first setting terminal Cont1) is connected is arranged in an individually adjustable position. In FIG. 4, if pads 401-406 to which the terminals of component A are connected and pads 411-416 to which the terminals of component B are connected are not shifted in the direction of arrangement of the terminals of the electronic components, the size of the ground pattern for pads 402 and 414 to be grounded cannot be ensured. By shifting pads 411-416 to which the terminals of component B are connected relative to pads 401-406 to which the terminals of component A are connected in the direction of arrangement of the terminals of the electronic components, ground pads 402 and 414 become adjacent to each other. This ensures the size of the ground pattern commonly connected to pads 402 and 414. Because pads 401, 415, and pad 416 are formed on the input power supply pattern, the area occupied by components A and B on the circuit board can be reduced while ensuring the size of the input power supply pattern.

[0038] Fig. 5 is an explanatory diagram of another example of the mounting area of ​​electronic component 100. Fig. 5 illustrates an example of pad arrangement similar to Fig. 2. In Fig. 5, pads 501, 502, 503, 504, 505, and 506 for component A and pads 511, 512, 513, 514, 515, and 516 for component B are arranged.

[0039] Pad 501 is connected to the first terminal 101 of component A. Pad 502 is connected to the second terminal 102 of component A. Pad 503 is connected to the third terminal 103 of component A. Pad 504 is connected to the fourth terminal 104 of component A. Pad 505 is connected to the fifth terminal 105 of component A. Pad 506 is connected to the sixth terminal 106 of component A. Pad 511 is connected to the first terminal 101 of component B. Pad 512 is connected to the second terminal 102 of component B. Pad 513 is connected to the third terminal 103 of component B. Pad 514 is connected to the fourth terminal 104 of component B. Pad 515 is connected to the fifth terminal 105 of component B. Pad 516 is connected to the sixth terminal 106 of component B.

[0040] The mounting areas of component A and component B are not the same, but are provided so that some of them overlap while the remaining portions do not. The terminals of components A and B are oriented in opposite directions when mounted. For this reason, pads 514-516 to which the terminals of component B are connected are arranged between pads 501-503 and pads 504-506 to which the terminals of component A are connected. Furthermore, pads 504-506 to which the terminals of component A are connected are arranged between pads 511-513 and pads 514-516 to which the terminals of component B are connected. Pads 501-506 to which the terminals of component A are connected and pads 511-516 to which the terminals of component B are connected are offset in a direction parallel to the side on which each terminal is provided (the direction in which the terminals are arranged). In FIG. 5, pads 511-516 to which component B is connected are offset two pads above pads 501-506 to which component A is connected. This pad arrangement is possible because component A and site B are mounted exclusively on the circuit board.

[0041] Pads 501, 515, and 516, to which a terminal functioning as a power supply input terminal VIN is connected, are connected to an input power supply pattern. A power supply voltage is supplied to each pad via the input power supply pattern. Pads 506, 511, and 512, to which a terminal functioning as a power supply output terminal VOUT is connected, are connected to an output power supply pattern. A power supply voltage is output from each pad via the output power supply pattern. This pad arrangement ensures that the sizes of the input power supply pattern and the output power supply pattern are sufficient on the same surface of the circuit board, while reducing the area occupied by components A and B on the circuit board.

[0042] As shown in Figures 2, 4, and 5, the pads on the circuit board are arranged according to the functions of the terminals of components A and B to be connected. For example, in Figure 2, the pads connected to component A are arranged across the pads connected to component B, so that the pads are arranged adjacent to each other for each function of the terminals to be connected. In Figure 4, the pads connected to component A and the pads connected to component B are arranged offset in the terminal arrangement direction, so that the pads are arranged adjacent to each other for each function of the terminals to be connected. In Figure 5, the pads connected to component A and the pads connected to component B are arranged in the opposite direction and offset in the terminal arrangement direction, so that the pads are arranged adjacent to each other for each function of the terminals to be connected. Because pads connected to terminals with the same function are arranged adjacent to each other, it is easy to include multiple pads in a single pad, as shown in Figure 3(b).

[0043] In this way, by arranging the pads for component A and component B adjacent to each other according to the function of the terminal to be connected, the layout of the wiring patterns (input power supply pattern, output power supply pattern, ground pattern) is simplified. It also makes it easier to ensure the size of the wiring patterns. By ensuring the size of the wiring patterns, the supply of power supply voltage to the electronic components mounted on the circuit board is stabilized, and the ground potential is also stabilized, resulting in stable operation of the electronic components.

[0044] (Image forming device) 6 is an explanatory diagram of an image forming apparatus equipped with a circuit board having the above-described configuration. This image forming apparatus 600 includes a controller unit 610, an operation unit 620, a scanner unit 621, a printer unit 622, and a storage unit 623. The above-described circuit board is mounted on the controller unit 610, for example.

[0045] The controller unit 610 is an information processing device including a control unit 611, a ROM (Read Only Memory) 612, and a RAM (Random Access Memory) 613. The controller unit 610 includes a controller power supply unit 650, an image processing unit 616, a storage interface (IF) control unit 614, and a network IF unit 615. The control unit 611, the ROM 612, the RAM 613, the image processing unit 616, the storage IF control unit 614, and the network IF unit 615 are communicably connected via a bus 618. The controller unit 610 controls the overall operation of the image forming apparatus 600.

[0046] The control unit 611 is a processing device such as a CPU (Central Processing Unit), an MPU (Micro Processing Unit), or a GPU (Graphics Processing Unit). The control unit 611 executes computer programs stored in a ROM 612 to control the operations of each part of the controller unit 610, the operation unit 620, the scanner unit 621, the printer unit 622, and the storage 623. The RAM 613 functions as a main memory when the control unit 611 executes processing.

[0047] The network IF unit 615 is a communication interface that enables the image forming apparatus 600 to communicate with an external device such as a personal computer. The image processing unit 616 performs predetermined image processing on image data. The image data is, for example, image data representing an image read from an original by the scanner unit 621, image data obtained from an external device by the network IF unit 615, or image data obtained from a storage 623 by the storage IF control unit 614. The scanner unit 621 is an image reading device that reads an original.

[0048] The storage IF control unit 614 is a communication interface for communicating with the storage 623. The storage IF control unit 614 is a bridge circuit for converting data on the bus 618 into data on the bus 617 connected to the storage 623. The storage 623 is a non-volatile storage device such as an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a USB (Universal Serial Bus) memory.

[0049] The print unit 622 is an image forming unit that prints an image based on image data that has been image-processed by the image processing unit 616 onto a recording material such as a sheet. The operation unit 620 is a user interface that has an input interface and an output interface. The input interface includes various key buttons, a touch panel, etc. The output interface includes a display, a speaker, etc. A user can input various instructions and settings to the image forming apparatus 600 using the operation unit 620.

[0050] The controller power supply unit 650 supplies a power supply voltage to each electronic component that constitutes the controller unit 610. The controller power supply unit 650 is controlled by the control unit 611. The control unit 611 and the controller power supply unit 650 are directly connected by a group of control signal lines 660, without going through the bus 618.

[0051] 7 is a configuration diagram of the controller power supply unit 650. The controller power supply unit 650 is supplied with an input power supply voltage of 12 V, and generates and outputs output power supply voltages of 5 V and 3.3 V from the input power supply voltage. To this end, the controller power supply unit 650 includes a first power supply generation unit 710, a second power supply generation unit 711, and a power supply switch unit 712. A group of control signal lines 660 connecting the controller power supply unit 650 and the control unit 611 is used to transmit control signals 661, 662, and 663.

[0052] The first power supply generating unit 710 is a power supply circuit that generates an output power supply voltage of 5 V from an input power supply voltage of 12 V. The output power supply voltage of 5 V is output as 5V_OUT 720. The first power supply generating unit 710 is, for example, a general electronic device such as a DC-DC converter. The first power supply generating unit 710 outputs an output power supply voltage (5V_OUT 720) by receiving a control signal 661 of a predetermined logical value (for example, "High") from the control unit 611. The first power supply generating unit 710 cuts off the output of the output power supply voltage (5V_OUT 720) by receiving a control signal 661 of an opposite logical value (for example, "Low") from the control unit 611.

[0053] 5V_OUT 720 is supplied to electronic components driven by the 5V power supply of the controller unit 610. When the power consumption of the controller unit 610 is reduced, the output of 5V_OUT 720 is not cut off.

[0054] The second power supply generating unit 711 is a power supply circuit that generates an output power supply voltage of 3.3 [V] from the output power supply voltage (5V_OUT720) of 5 [V] generated by the first power supply generating unit 710. The output power supply voltage of 3.3 [V] is output as 3.3V_OUT721. The second power supply generating unit 711 is, for example, a general electronic device such as a DC-DC converter. The second power supply generating unit 711 outputs the output power supply voltage (3.3V_OUT721) by receiving a control signal 662 of a predetermined logical value (for example, "High") from the control unit 611. The second power supply generating unit 711 cuts off the output of the output power supply voltage (3.3V_OUT721) by receiving a control signal 662 of an opposite logical value (for example, "Low") from the control unit 611.

[0055] 3.3V_OUT 721 is supplied to electronic components driven by the 3.3V power supply of the controller unit 610. When the power consumption of the controller unit 610 is reduced, the output of 3.3V_OUT 721 is not cut off.

[0056] The power supply SW unit 712 is a power supply circuit that generates an output power supply voltage of 5 [V] from the output power supply voltage (5V_OUT720) of 5 [V] generated by the first power supply generating unit 710. The output power supply voltage of 5 [V] is output as W_5V_OUT722. The power supply SW unit 712 is, for example, a general electronic device such as a load switch. The power supply SW unit 712 outputs the output power supply voltage (SW_5V_OUT722) by receiving a control signal 663 of a predetermined logical value (for example, "High") from the control unit 611. The power supply SW unit 712 cuts off the output of the output power supply voltage (SW_5V_OUT722) by receiving a control signal 663 of an opposite logical value (for example, "Low") from the control unit 611.

[0057] SW_5V_OUT 722 is supplied to electronic components driven by the 5V power supply of the controller unit 610. When the power consumption of the controller unit 610 is to be reduced, the output of SW_5V_OUT 722 is cut off.

[0058] The electronic component in FIG. 1 is, for example, a controller power supply unit 650 of a controller unit 610. The controller power supply unit 650 can utilize, for example, the components A and B described above. For this reason, the circuit board of the controller unit 610 on which the controller power supply unit 650 is mounted has a pad arrangement as described with reference to FIGS. 2 to 5. The components A and B are, for example, a genuine product and a substitute, and when the genuine product is out of stock, the substitute is used to manufacture the controller unit 610. Alternatively, the components A and B are an initial product mounted at the time of production and an improved product that is replaced after distribution. Alternatively, the components A and B are components with different characteristics that are prepared to change the specifications of the image forming apparatus.

[0059] 1 may be, for example, at least one of the first power supply generating unit 710, the second power supply generating unit 711, and the power supply switching unit 712 of the controller power supply unit 650. Each of the first power supply generating unit 710, the second power supply generating unit 711, and the power supply switching unit 712 is, for example, either the above-mentioned component A or component B. The circuit board of the controller power supply unit 650 on which the first power supply generating unit 710, the second power supply generating unit 711, and the power supply switching unit 712 are mounted has pad arrangements as described with reference to FIGS.

[0060] 1 may be any electronic component mounted on the controller unit 610, other than the controller power supply section 650. That is, the electronic components in Fig. 1 may be a control section 611, a ROM 612, a RAM 613, an image processing section 616, a storage IF control section 614, and a network IF section 615. The circuit board of the controller unit 610 has pad arrangements as described in Figs. 2 to 5 as appropriate.

Claims

1. a first pad and a second pad disposed on the first surface to which terminals of a first electronic component are connected; a third pad and a fourth pad disposed on the first surface and to which terminals of a second electronic component are connected; the third pad is disposed between the first pad and the second pad in a first direction along the first surface, the second pad is disposed between the third pad and the fourth pad in the first direction; A circuit board comprising:

2. Further, a wiring pattern is provided to electrically connect the second pad and the third pad.

2. The circuit board according to claim 1.

3. a power supply voltage output from the first electronic component or the second electronic component is supplied to the wiring pattern; 3. The circuit board according to claim 2.

4. a power supply voltage to be input to the first electronic component or the second electronic component is supplied to the wiring pattern; 3. The circuit board according to claim 2.

5. a continuous wiring pattern including the second pad and the third pad; a dielectric layer covering the wiring pattern, a first opening in the dielectric layer defining the second pad; a second opening in the dielectric layer defining the third pad; 2. The circuit board according to claim 1.

6. a power supply voltage output from the first electronic component or the second electronic component is supplied to the wiring pattern; 6. The circuit board according to claim 5.

7. a power supply voltage to be input to the first electronic component or the second electronic component is supplied to the wiring pattern; 6. The circuit board according to claim 5.

8. fifth and sixth pads disposed on the first surface and to which terminals of the first electronic component are connected; seventh and eighth pads disposed on the first surface and to which terminals of the second electronic component are connected; the seventh pad is disposed between the fifth pad and the sixth pad in the first direction; the sixth pad is disposed between the seventh pad and the eighth pad in the first direction; 2. The circuit board according to claim 1.

9. In a second direction intersecting the first direction, the first pad, the second pad, the third pad, and the fourth pad are arranged at the same position; the fifth pad, the sixth pad, the seventh pad, and the eighth pad are arranged at the same position in the second direction; 9. The circuit board according to claim 8.

10. In a second direction intersecting the first direction, the first pad, the second pad, the third pad, and the fourth pad are arranged at the same position; In the second direction, the fifth pad and the sixth pad are disposed at the same position as each other, In the second direction, the seventh pad and the eighth pad are arranged at the same position as each other and at a different position from the fifth pad and the sixth pad.

9. The circuit board according to claim 8.

11. In a second direction intersecting the first direction, the first pad, the second pad, the third pad, and the fourth pad are arranged at the same position.

2. The circuit board according to claim 1.

12. an image forming section for forming an image on a recording material; a control unit that controls the image forming unit, The control unit includes the circuit board according to claim 1 on which the first electronic component or the second electronic unit is mounted. An image forming apparatus characterized by:

Images