Mounting apparatus

Abstract

To provide a mounting apparatus which cools an elastic film without reducing productivity to prevent a sticking failure of a sticking object.SOLUTION: A mounting device 100 includes a chamber 10 in which a lid body 11 and a housing can be separated and an adhesive film F is stuck to a workpiece W under a reduced pressure condition, and a stage 20 which is housed in the chamber and has a holding part (electrostatic chuck) 22 for holding the workpiece and a heating part 23 for heating the workpiece. The housing has an exhaust port 15 for depressurizing the inside of the chamber, and the lid is disposed at a position facing the holding part of the stage, is formed of an elastic member capable of holding the adhesive film F, and includes an elastic film 30 having a first face 31 capable of sticking the adhesive film to the sticking face of the workpiece and a second face 32 opposite to the first face, a base side 11a having an A-face facing the second face of the elastic film and a vent hole 14 communicating at least the A-face with the outside of the chamber, and a cooler 40 directly contacting the elastic film to cool the elastic film.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus. [Background technology]

[0002] In the semiconductor manufacturing process, the TCB (Thermal Compression Bonding) method is used to stack chips on a wafer, and an insulating adhesive film is attached to the chips used in this process to protect the chip surface and simplify the process.

[0003] Patent Document 1 below discloses a bonding device that bonds an adhesive film to a workpiece such as a wafer by vacuum lamination using an elastic bonding film such as a diaphragm. This device bonds the adhesive film using an elastic film under reduced pressure, allowing it to bond without generating voids while following minute irregularities such as bumps formed on the bonding surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-32078 Summary of the Invention [Problem to be solved by the invention]

[0005] In conventional bonding devices, the workpiece may be heated, for example, via a stage, to increase the adhesive strength of the adhesive film. The adhesive film exhibits excellent adhesion when the workpiece is heated. However, the elastic membrane also heats up when it comes into contact with the heated workpiece or stage. Because the elastic membrane is made of a stretchable elastic material such as natural or synthetic rubber, it can deteriorate and change shape when heated. A deformed elastic membrane can reduce the adhesive strength of the adhesive film, making it difficult to accurately adhere to the workpiece or accurately position it relative to the workpiece.

[0006] Furthermore, if the adhesive film comes into contact with an elastic film that has not been sufficiently cooled after heating, the adhesive formed on the adhesion surface may unintentionally initiate a reaction, resulting in poor bonding during bonding.

[0007] To solve this problem, some application devices cool the elastic film by blowing air onto it after the film is pressed and before the next adhesive film is attached. However, cooling with air takes a long time, which reduces productivity.

[0008] The present invention has been made in consideration of the above-mentioned problems, and specifically, an object of the present invention is to provide a mounting device that can cool an elastic film without reducing productivity and prevent poor application of an adhesive material. [Means for solving the problem]

[0009] The above object can be achieved by any one of the following means (1) to (13).

[0010] (1) A mounting device that applies an adhesive film to an attachment surface of a workpiece, the mounting device having a lid and a housing that are separable, the mounting device including: a chamber for applying the adhesive film to the workpiece under reduced pressure; a stage housed in the chamber and having a holding unit that holds the workpiece and a heating unit that heats the workpiece; the housing having an exhaust port for reducing the pressure inside the chamber; the lid including an elastic membrane, a base, and a cooling unit; the elastic membrane being formed of an elastic material that can hold the adhesive film and being positioned opposite the holding unit of the stage; the elastic membrane having a first surface that can apply the adhesive film to the attachment surface of the workpiece and a second surface opposite the first surface; the base having an A-side that faces the second surface of the elastic membrane and an air vent that connects at least the surface of A-side to the outside of the chamber; and the cooling unit being in direct contact with the elastic membrane to cool the elastic membrane.

[0011] (2) The mounting device according to (1) above, wherein the cooling unit is at least one thermoelectric element disposed between the second surface and the A surface.

[0012] (3) The mounting device according to (1) above, wherein the cooling unit is a cooling plate disposed on the surface A and through which a refrigerant can flow.

[0013] (4) The mounting device according to (1) above, wherein the cooling section is a refrigerant flow path disposed inside the elastic film.

[0014] (5) The mounting device according to any one of (1) to (4) above, wherein the elastic film has an auxiliary heating section that auxiliary heats the adhesive film.

[0015] (6) The mounting device according to (5) above, wherein the auxiliary heating unit is a heater that patterns wiring made of conductive resin formed on the first surface of the elastic film and heats by applying a voltage to the wiring resistance.

[0016] (7) The mounting device according to (6) above, wherein the heaters are patterned in a plurality of heating regions that partition the first surface of the elastic film.

[0017] (8) The mounting device according to any one of (1) to (6) above, wherein the adhesive film is an insulating resin film.

[0018] (9) The mounting device according to any one of (1) to (7) above, wherein the elastic film is a diaphragm made of silicone rubber.

[0019] (10) The mounting device according to any one of (1) to (9) above, wherein the first surface of the elastic film has an adsorption surface having a plurality of regions with different adsorption forces.

[0020] (11) The mounting device according to (10), wherein the suction surface has regions with different suction forces formed by varying the surface roughness of the first surface.

[0021] (12) The mounting device according to (10) above, wherein the attraction surface has regions with different attraction forces formed by differences in the friction coefficient of the material forming the first surface.

[0022] (13) The mounting device according to any one of (1) to (12) above, comprising a control unit that executes the following steps: an adsorption step of adsorbing the adhesive film onto the first surface of the elastic membrane; a processing space forming step of combining the lid body and the housing to form a processing space as the chamber; an attachment step of expanding the elastic membrane by at least one of a process of reducing the pressure inside the chamber or a process of sending gas into the chamber through the air vent, and attaching the adhesive film to the workpiece placed on the stage; and a cooling step of cooling the elastic membrane using the cooling unit. [Effects of the Invention]

[0023] According to the present invention, it is possible to prevent improper application of a patch by cooling the elastic film without reducing productivity. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a cross-sectional view schematically illustrating a mounting device according to a first embodiment of the present invention. [Figure 2A] 3 is a cross-sectional view schematically illustrating the configuration of a cooling unit of the mounting device according to the first embodiment. FIG. [Figure 2B] 5A and 5B are cross-sectional views showing other configurations of the cooling unit of the mounting device according to the first embodiment. [Figure 2C] 5A and 5B are cross-sectional views showing other configurations of the cooling unit of the mounting device according to the first embodiment. [Figure 3] 4 is a flowchart showing the operation of the mounting device according to the first embodiment. [Figure 4A] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 4B] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 4C] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 4D] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 4E] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 4F] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 4G] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 4H] 5A to 5C are cross-sectional views illustrating the operation of the mounting device according to the first embodiment. [Figure 5] FIG. 6 is a cross-sectional view illustrating a mounting device according to a second embodiment of the present invention. [Figure 6] FIG. 10 is a schematic plan view of a cooling plate that functions as a cooling unit of the mounting device according to the second embodiment. [Figure 7A] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 7B] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 7C] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 7D] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 7E] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 7F] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 7G] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 7H] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the second embodiment. [Figure 8] FIG. 10 is a cross-sectional view illustrating a mounting device according to a third embodiment of the present invention. [Figure 9A] 10 is a schematic configuration diagram of an elastic film formed with a refrigerant flow path that functions as a cooling section of a mounting device according to a third embodiment, viewed from the second surface side. FIG. [Figure 9B]FIG. 4 is a partial cross-sectional view of an elastic membrane in which a refrigerant flow path is formed. [Figure 10A] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 10B] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 10C] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 10D] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 10E] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 10F] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 10G] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 10H] 10A to 10C are cross-sectional views illustrating the operation of the mounting device according to the third embodiment. [Figure 11] FIG. 10 is a schematic diagram illustrating the configuration of an auxiliary heating unit provided as a configuration of a first modified example of a mounting device according to the present invention. [Figure 12] FIG. 10 is a conceptual diagram showing an example of the arrangement of heating regions of the auxiliary heating unit in Modified Example 1. [Figure 13] 10 is a conceptual diagram showing an example of the formation of an adsorption surface provided as a configuration of a second modified example of the mounting device according to the present invention. FIG. [Figure 14] 10 is a conceptual diagram showing another example of the formation of the adsorption surface of Modified Example 2. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following drawings, the same reference numerals refer to the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience. Meanwhile, the embodiments described below are merely examples, and various modifications are possible from such embodiments.

[0026] Hereinafter, the terms "upper" and "above" may include not only what is directly above in contact with something, but also what is above without contact. Similarly, the terms "lower" and "below" may include not only what is directly below in contact with something, but also what is below without contact.

[0027] The singular expression includes the plural expression unless the context clearly dictates otherwise. Furthermore, when a part "includes," "comprises," or "has" a certain element, it does not mean that it excludes other elements, but that it may further include other elements, unless otherwise specified to the contrary.

[0028] Unless explicitly stated or stated to the contrary, steps constituting a method may be performed in any suitable order, and are not necessarily limited to the order of the steps described. The use of any examples or exemplary terms is merely for the purpose of illustrating the technical idea, and the scope of the invention is not limited by the examples or exemplary terms, except as limited by the scope of the claims.

[0029] In the following description, when ordinal numbers such as "first" and "second" are used, unless otherwise specified, they are used for convenience and do not stipulate any particular order.

[0030] A mounting apparatus 100 according to a first embodiment of the present invention will be described.

[0031] The mounting apparatus 100 of the first embodiment is an apparatus for applying an insulating adhesive film F to a workpiece W, which may be any of a variety of wafers, such as a glass substrate, a resin substrate, or a ceramic substrate, to be processed into semiconductor chips or substrates. As an example, the workpiece W may be a wafer attached to dicing tape and fixed with a dicing frame. The adhesive film F may be an insulating resin film having adhesive properties that allow it to be attached to the workpiece W. The adhesiveness of the adhesive film F can be increased by heating.

[0032] 1, the mounting device 100 includes a chamber 10 that forms a processing space S in which an adhesive film F is attached to a workpiece W under reduced pressure, and a stage 20 that is housed in the chamber 10 and is movable relative to a lid 11. The mounting device 100 includes a control unit 110 shown in FIG. 1, which controls the driving of each unit according to a predetermined driving program.

[0033] The chamber 10 is configured so that the lid 11 and the housing 12 can move toward or away from each other. The chamber 10 forms a processing space S when the lid 11 and the housing 12 are in close contact with each other. The pressure within the processing space S of the chamber 10 can be adjusted using a vacuum pump (not shown) or the like through an exhaust port 15 of the housing 12. The adhesive film F is attached to the workpiece W under reduced pressure conditions where the pressure within the processing space S is reduced to a predetermined level.

[0034] The lid 11 has a base 11a and an elastic membrane 30 that is provided on the base 11a and holds the adhesive film F. The base 11a has a surface A 13 that faces a second surface 32 of the elastic membrane 30. The base 11a has a vent 14 that connects at least the surface of the surface A 13 to the outside of the chamber 10. The lid 11 is disposed in a position facing the electrostatic chuck 22 (holding portion) of the stage 20.

[0035] The lid body 11 is connected to a moving mechanism (not shown) and is configured to be movable in a first direction in which it approaches or moves away from the housing 12 (the up-and-down direction in FIG. 1), and a second direction in which it intersects the first direction (such as the left-right direction in FIG. 1).

[0036] The elastic film 30 is formed of an elastic material, such as natural rubber or synthetic rubber such as silicone rubber, that has stretchability and is capable of holding the adhesive film F. Taking into consideration heat resistance, durability, insulating properties, adhesion to the adhesive film F, etc., the elastic film 30 is preferably formed of silicone rubber.

[0037] The elastic film 30 has a first surface 31 that can adhere the adhesive film F to the attachment surface Wa of the workpiece W, and a second surface 32 opposite the first surface 31. The elastic film 30 is formed from a stretchable elastic body, and can therefore deform to follow the surface shape of the attachment surface Wa of the workpiece W. Because the adhesive film F can deform while following the shape of the elastic film 30, it is adhered to the attachment surface Wa of the workpiece W without forming voids.

[0038] The elastic membrane 30 expands when air flows into the space between the lid 11 and the elastic membrane 30 through the vent 14 of the lid 11. As a result, the first surface 31 of the elastic membrane 30 protrudes toward the stage 20. The elastic membrane 30 contracts when the air in the space is exhausted through the vent 14. As a result, the second surface 32 of the elastic membrane 30 moves toward the surface A 13 of the base 11a. The elastic membrane 30 expands to allow the adhesive film F to be attached to the workpiece W. The elastic membrane 30 contracts to accommodate the workpiece W so as not to interfere with the transition to the next process. The elastic membrane 30 can expand by at least one of a process of reducing the pressure inside the chamber 10 or a process of sending gas into the chamber 10 through the vent 14.

[0039] The stage 20 includes a stage main body 21, an electrostatic chuck 22 that functions as a holding unit for holding the workpiece W, and a heating unit 23 that heats the workpiece W. The stage 20 is configured so that the stage main body 21 can move toward or away from the lid body 11 relatively.

[0040] The heating unit 23 heats the workpiece W. The heating unit 23 may be configured to heat the workpiece W to a predetermined temperature (for example, about 100°C) directly or indirectly via the electrostatic chuck 22 or the like. In FIG. 1, the heating unit 23 is built into the stage 20, and heats the electrostatic chuck 22 to indirectly heat the workpiece W.

[0041] The mounting apparatus 100 has a cooling unit 40 that cools the elastic film 30 .

[0042] The cooling unit 40 is disposed between the second surface 32 of the elastic membrane 30 and the surface A 13 of the base 11a, and cools the elastic membrane 30. The cooling unit 40 can be composed of a plurality of thermoelectric elements 41, such as Peltier elements. After the adhesive film F has been attached to the workpiece W by the elastic membrane 30, the cooling unit 40 is driven for a predetermined time before the next adhesive film F is retrieved, to cool the elastic membrane 30. Because the cooling unit 40 cools the elastic membrane 30 by contacting it, the cooling time required by air blowing is not as long, and the elastic membrane 30 can be cooled efficiently in a short time.

[0043] 2A to 2C show arrangements of the cooling unit 40. As shown in FIG. 2A, the cooling unit 40 may have a configuration in which a plurality of thermoelectric elements 41 are arranged on the second surface 32 of the elastic membrane 30. As shown in FIG. 2B, the cooling unit 40 may have a configuration in which a plurality of thermoelectric elements 41 are arranged between the second surface 32 of the elastic membrane 30 and the surface A 13 of the base 11a. The cooling unit 40 shown in FIG. 2B may be configured, for example, by arranging a plurality of thermoelectric elements 41 on a conductive film 41a. As shown in FIG. 2C, the cooling unit 40 may have a configuration in which a plurality of thermoelectric elements 41 are arranged on the surface A 13 of the base 11a.

[0044] 2A to 2C, the cooling unit 40 is preferably arranged so as to uniformly cool the entire elastic membrane 30, from the viewpoint of suppressing unevenness in temperature during cooling and preventing partial deterioration. Also, the cooling unit 40 is preferably arranged so as not to affect the expansion and contraction deformation of the elastic membrane 30.

[0045] Next, the operation of the mounting device 100 according to the first embodiment will be described. Note that the series of operations shown below is an example, and other operations may be incorporated between each operation as necessary. Furthermore, the order of the operations shown below may be changed without departing from the scope of the present invention.

[0046] 3, the mounting apparatus 100 according to the first embodiment performs a film attachment process including a first movement process S1, a suction process S2, a second movement process S3, a processing space forming process S4, an attachment process S5, and a cooling process S6. The mounting apparatus 100 performs each process under the control of the control unit 110.

[0047] As shown in FIG. 4A, the mounting device 100 performs a first movement step S1, places the workpiece W on the electrostatic chuck 22, and moves the lid body 11 to retrieve the adhesive film F placed on the mounting table 200. The mounting device 100 contracts the elastic film 30 by suction through the ventilation hole 14. As shown in FIG. 4B, the mounting device 100 performs a suction step S2, presses the first surface 31 of the elastic film 30 against the adhesive film F, and adsorbs the adhesive film F to the first surface 31. As shown in FIG. 4C, the mounting device 100 performs a second movement step S3, raises the lid body 11 that has received the adhesive film F from the mounting table 200, and returns it to above the housing 12 as shown in FIG. 4D. The mounting table 200 moves up and down when delivering and receiving the adhesive film F, as shown in FIGS. 4A to 4C.

[0048] 4E, the mounting apparatus 100 performs a processing space forming step S4, and moves the lid body 11 relative to the housing 12 to come into close contact with the housing 12 to form the processing space S. Once the processing space S is formed, the mounting apparatus 100 exhausts the internal air within the processing space S through the exhaust port 15 to reduce the pressure to a predetermined level.

[0049] As shown in FIG. 4F , the mounting device 100 performs the bonding step S5, and inflates the elastic film 30 by letting air in through the ventilation holes 14. The mounting device 100 also raises the stage 20 toward the lid 11 in accordance with the expansion of the elastic film 30. At this time, the adhesive film F comes into contact with the heated workpiece W and becomes more adhesive, so that the adhesive film F is bonded from the first surface 31 of the elastic film 30 to the bonding surface Wa of the workpiece W. The adhesive film F is bonded to the bonding surface Wa of the workpiece W while following the deformation of the elastic film 30, so that no voids are formed when the adhesive film F is bonded.

[0050] As shown in Fig. 4G, the mounting device 100 performs the cooling step S6, and when the attachment of the adhesive film F is completed, the chamber 10 is opened to the atmosphere and the air inside the lid 11 is discharged through the ventilation hole 14, causing the elastic film 30 to contract. At the same time as opening the chamber to the atmosphere, the mounting device 100 also drives the cooling unit 40 to cool the elastic film 30. The cooling unit 40 drives the thermoelectric element 41 to cool the entire film from the second surface 32 side of the elastic film 30.

[0051] 4H, the mounting device 100 moves the lid body 11 to the mounting table 200 to retrieve the next adhesive film F. Because the elastic film 30 is cooled by the cooling unit 40, when the adhesive film F adheres to the first surface 31, unintentional increase in adhesion is prevented.

[0052] Thereafter, the mounting device 100 repeats the operations shown in Figures 4A to 4H to apply the adhesive film F to the workpiece W. That is, the mounting device 100 determines whether or not it is OK to proceed to the next film application process (S7). If the mounting device 100 proceeds to the next film application process (S7-Yes), it returns to S1 again and performs the next film application process. On the other hand, if the mounting device 100 does not proceed to the next film application process (the process is not performed) (S7-No), it ends the process.

[0053] Next, a mounting device 100A according to a second embodiment of the present invention will be described. In the mounting device 100A according to the second embodiment described below, the same components as those in the above-described embodiment will be assigned the same reference numerals, and the description thereof will be omitted. Furthermore, the components not specifically mentioned can be configured in the same manner as those in the above-described embodiment.

[0054] A mounting apparatus 100A according to the second embodiment of the present invention has a cooling section 40 having a different configuration from the above-described configuration.

[0055] In the mounting apparatus 100A of the second embodiment, the cooling section 40 is configured by a cooling plate 42, as shown in FIG.

[0056] 6, the cooling plate 42 has a flow path 43 through which the refrigerant flows, a first flow section 43a disposed at one end of the flow path 43 and into which the refrigerant flows, a second flow section 43b disposed at the other end of the flow path 43 and from which the refrigerant flows out, and a plate 44 in which the flow path 43 is formed. The plate 44 is formed with a plurality of air holes 42a which communicate with the ventilation hole 14 and allow air to flow in order to expand and contract the elastic membrane 30.

[0057] The flow path 43 is formed over the entire plate 44. The shape of the flow path 43 is not limited to the serpentine shape shown in Fig. 6, as long as it has a path that can cool the entire plate 44. The plate 44 has an area that can contact at least the entire second surface 32 of the elastic membrane 30. This allows the cooling plate 42 to uniformly cool the entire elastic membrane 30 that is in contact with the plate 44.

[0058] The cooling plate 42 is disposed on the surface A 13 of the base 11a. When the elastic membrane 30 contracts after the adhesive film F is attached, it comes into contact with the cooling plate 42 and is cooled.

[0059] From the viewpoint of ease of handling, water adjusted to a predetermined temperature is preferably used as the coolant flowing through the flow paths 43 of the cooling plate 42. However, a heat medium other than water may also be used as the coolant.

[0060] Next, the operation of the mounting device 100A according to the second embodiment will be described. Note that the series of operations shown below is an example, and other operations may be incorporated between each operation as necessary. Furthermore, the order of the operations shown below may be changed without departing from the scope of the present invention.

[0061] When performing the film bonding process, the mounting apparatus 100A according to the second embodiment performs the same process as the mounting apparatus 100 according to the first embodiment shown in Fig. 3. However, the cooling method in the cooling step S6 is different from that of the mounting apparatus 100.

[0062] 7A, the mounting device 100A performs a first movement step S1, places the workpiece W on the electrostatic chuck 22, and moves the lid body 11 to retrieve the adhesive film F placed on the mounting table 200. The mounting device 100A also starts driving the cooling unit 40. The mounting device 100 applies suction through the ventilation opening 14 to contract the elastic film 30, and brings the elastic film 30 into contact with the cooling plate 42 to cool the elastic film 30.

[0063] As shown in Fig. 7B, the mounting device 100A performs a suction step S2, pressing the first surface 31 of the elastic film 30 against the adhesive film F to adhere the adhesive film F to the first surface 31. As shown in Fig. 7C, the mounting device 100A performs a second movement step S3, raising the lid body 11 that has received the adhesive film F from the mounting table 200, and returning it to above the housing 12 as shown in Fig. 7D. The mounting table 200 moves up and down when delivering and receiving the adhesive film F, as shown in Figs. 7A to 7C.

[0064] 7E, the mounting apparatus 100A performs a processing space forming step S4, and moves the lid body 1 relative to the housing 12 to form the processing space S by being in close contact with the housing 12. Once the processing space S is formed, the mounting apparatus 100A exhausts the internal air in the processing space S through the exhaust port 15 to reduce the pressure to a predetermined level.

[0065] As shown in FIG. 7F, the mounting apparatus 100A performs the bonding step S5, and inflates the elastic film 30 by letting air in through the ventilation holes 14. The mounting apparatus 100A also raises the stage 20 toward the lid 11 in accordance with the expansion of the elastic film 30. At this time, the adhesive film F comes into contact with the heated workpiece W and becomes more adhesive, so that the adhesive film F is bonded from the first surface 31 of the elastic film 30 to the bonding surface Wa of the workpiece W. The adhesive film F is bonded to the bonding surface Wa of the workpiece W while following the deformation of the elastic film 30, so that no voids are formed when the adhesive film F is bonded.

[0066] As shown in FIG. 7G, the mounting device 100A performs a cooling step S6. When the attachment of the adhesive film F is complete, the mounting device 100A opens the chamber 10 to the atmosphere and exhausts the air inside the lid 11 through the vent 14, causing the elastic film 30 to contract. At the same time as opening the chamber 10 to the atmosphere, the mounting device 100A also drives the cooling unit 40 to cool the elastic film 30. The cooling unit 40 passes a refrigerant through a flow path 43. The elastic film 30 comes into contact with a cooling plate 42 having flow paths 43 through which the refrigerant flows, thereby cooling the entire film from the second surface 32 side of the elastic film 30.

[0067] 7H, the mounting device 100A moves the lid 11 to retrieve the next adhesive film F. Because the elastic film 30 is cooled by the cooling unit 40, when the adhesive film F adheres to the first surface 31, the adhesive film F is prevented from unintentionally becoming more tacky.

[0068] Thereafter, the mounting apparatus 100A repeats the operations shown in Figures 7A to 7H to apply the adhesive film F to the workpiece W. That is, the mounting apparatus 100A determines whether or not it is OK to proceed to the next film application process (S7). If the mounting apparatus 100A proceeds to the next film application process (S7-Yes), it returns to S1 again and performs the next film application process. On the other hand, if the mounting apparatus 100A does not proceed to the next film application process (the process is not performed) (S7-No), it ends the process.

[0069] Next, a mounting device 100B according to a third embodiment of the present invention will be described. In the mounting device 100B according to the third embodiment described below, the same components as those in the above-described embodiment will be assigned the same reference numerals, and the description thereof will be omitted. Furthermore, the components not specifically mentioned can be configured in the same manner as those in the above-described embodiment.

[0070] A mounting apparatus 100B according to the third embodiment of the present invention has a cooling section 40 having a different configuration from the above-described configurations.

[0071] 8, the mounting device 100B has a cooling unit 40 configured by a refrigerant flow path 45 formed in the elastic film 30. The refrigerant flow path 45 is formed in the second surface 32 of the elastic film 30.

[0072] The refrigerant flow path 45 has a flow path 46 through which the refrigerant flows, a first flow section 46a located at one end of the flow path 46 and through which the refrigerant flows, and a second flow section 46b located at the other end of the flow path 46 and through which the refrigerant flows out.

[0073] The refrigerant flow path 45 cools the entire second surface 32 of the elastic membrane 30. Therefore, as shown in Figures 9A and 9B, the flow path 46 has a first flow section 46a and a second flow section 46b communicating with each other, and can be formed in a single stroke across the entire second surface 32 of the elastic membrane 30. As an example, the refrigerant flow path 45 can be disposed by fitting it into a groove 32a formed in advance in the second surface 32 of the elastic membrane 30. Alternatively, the refrigerant flow path 45 may be disposed by being fixed to the second surface 32 of the elastic membrane 30 with an adhesive or the like to prevent peeling, without forming a groove 32a or the like.

[0074] 9A and 9B, the refrigerant flow path 45 may be a single flow path that extends around at least the entire second surface 32 of the elastic film 30. The refrigerant flow path 45 may be in a form that is not exposed on the first surface 31 side of the elastic film 30 so as not to interfere with the process of attaching the adhesive film F.

[0075] The coolant flow path 45 may be formed inside the elastic membrane 30. In this case, the coolant flow path 45 can be formed, for example, by configuring the elastic membrane 30 with a pair of membrane members and interposing the flow path 46 between the membrane members. Alternatively, the coolant flow path 45 may be formed by forming a recess that becomes the flow path 46 inside the elastic membrane 30.

[0076] Next, the operation of the mounting device 100B according to the third embodiment will be described. Note that the series of operations shown below is an example, and other operations may be incorporated between each operation as necessary. Furthermore, the order of the operations shown below may be changed without departing from the scope of the present invention.

[0077] When performing the film bonding process, the mounting apparatus 100B according to the third embodiment performs the same process as the mounting apparatus 100 according to the first embodiment shown in Fig. 3. However, the cooling method in the cooling step S6 is different from that of the mounting apparatus 100.

[0078] 10A, the mounting device 100B performs a first movement step S1, places the workpiece W on the electrostatic chuck 22, and moves the lid body 11 to retrieve the adhesive film F placed on the mounting table 200. The mounting device 100 applies suction through the ventilation hole 14 to contract the elastic film 30. The mounting device 100B also starts driving the cooling unit 40 to cool the elastic film 30.

[0079] As shown in Fig. 10B, the mounting device 100B performs a suction step S2, pressing the first surface 31 of the elastic film 30 against the adhesive film F to adhere the adhesive film F to the first surface 31. As shown in Fig. 10C, the mounting device 100B performs a second movement step S3, receiving the adhesive film F from the mounting table 200, and returning to above the housing 12 as shown in Fig. 10D. As shown in Figs. 10A to 10C, the mounting table 200 moves up and down when delivering and receiving the adhesive film F.

[0080] 10E, the mounting device 100B performs a processing space forming step S4, and moves the lid body 11 relative to the housing 12 to come into close contact with the housing 12 to form the processing space S. Once the processing space S is formed, the mounting device 100 exhausts the internal air in the processing space S through the exhaust port 15 to reduce the pressure to a predetermined level.

[0081] As shown in FIG. 10F, the mounting device 100B performs the bonding step S5, and inflates the elastic film 30 by letting air in through the ventilation holes 14. The mounting device 100B also raises the stage 20 toward the lid 11 in accordance with the expansion of the elastic film 30. At this time, the adhesive film F comes into contact with the heated workpiece W and becomes more adhesive, so that the adhesive film F is bonded from the first surface 31 of the elastic film 30 to the bonding surface Wa of the workpiece W. The adhesive film F is bonded to the bonding surface Wa of the workpiece W while following the deformation of the elastic film 30, so that no voids are formed when the adhesive film F is bonded.

[0082] As shown in FIG. 10G, the mounting device 100B performs the cooling step S6, and when the attachment of the adhesive film F is completed, the chamber 10 is opened to the atmosphere and the air inside the lid 11 is discharged through the vent 14, causing the elastic film 30 to contract. At the same time as opening to the atmosphere, the mounting device 100B also drives the cooling unit 40 to cool the elastic film 30. The cooling unit 40 passes the refrigerant through the flow path 46 of the refrigerant flow path 45. The entire elastic film 30 is cooled by the refrigerant flowing through the flow path 46.

[0083] Thereafter, the mounting device 100B moves the lid body 11 to retrieve the next adhesive film F. Because the elastic film 30 is cooled by the cooling unit 40, when the adhesive film F adheres to the first surface 31, unintentional increase in adhesion is prevented.

[0084] Thereafter, the mounting device 100B repeats the operations shown in Figures 10A to 10H to apply the adhesive film F to the workpiece W. That is, the mounting device 100B determines whether or not it is OK to proceed to the next film application process (S7). If the mounting device 100A proceeds to the next film application process (S7-Yes), it returns to S1 again and performs the next film application process. On the other hand, if the mounting device 100A does not proceed to the next film application process (the process is not performed) (S7-No), it ends the process.

[0085] Next, modified examples of the mounting apparatus according to this embodiment will be described. The following modified examples can be appropriately incorporated into the above-described mounting apparatuses 100, 100A, and 100B.

[0086] Modification 1 of this embodiment will be described. As Modification 1, the mounting apparatuses 100, 100A, and 100B can be configured such that an auxiliary heating unit 50 is disposed on the first surface 31 of the elastic film 30, as shown in FIGS.

[0087] 11, the auxiliary heating unit 50 can be configured as a heater in which wiring 51 is formed in a predetermined pattern shape on the first surface 31 of the elastic membrane 30 using a conductive resin whose base material is the same as that of the elastic membrane 30. When a predetermined voltage is applied to the wiring 51, the auxiliary heating unit 50 heats the elastic membrane 30 by the wiring resistance of the wiring 51 generating heat.

[0088] The auxiliary heating section 50 can be formed over the entire elastic film 30, as shown in Fig. 11. However, it is sufficient that the auxiliary heating section 50 can at least provide auxiliary heating to the adhesive film F. Therefore, depending on the size and shape of the adhesive film F used, the auxiliary heating section 50 can also be formed only in the central portion and its periphery of the elastic film 30. If the heating temperature of the heating section 23 is set to 100°C, the auxiliary heating section 50 can be set to a temperature lower than this temperature (approximately 80°C).

[0089] 12, the auxiliary heating unit 50 divides the first surface 31 of the elastic film 30 into a plurality of sections to form a plurality of heating regions HA, and can independently form patterns of wiring 51 in each of the heating regions HA (HA1 to HA4). This allows the first surface 31 of the elastic film 30 to heat by appropriately selecting the shape of the adhesive film F and the region that requires auxiliary heating.

[0090] The heating region HA is not limited to the shape and number of sections shown in Fig. 12. Furthermore, although the wiring 51 is patterned for each region in the heating region HA, the wiring 51 may be patterned across multiple regions.

[0091] As described above, the mounting devices 100, 100A, and 100B can be configured to provide the auxiliary heating unit 50 on the elastic film 30. This allows the mounting devices 100, 100A, and 100B to supplementarily heat the adhesive film F from the elastic film 30 side in addition to heating it from the stage 20 side when bonding the adhesive film F to the workpiece W. Therefore, the mounting devices 100, 100A, and 100B can reliably increase the adhesiveness of the adhesive film F, thereby preventing poor bonding to the workpiece W.

[0092] A second modified example according to this embodiment will be described. As the second modified example, the mounting devices 100, 100A, and 100B can be configured such that an adsorption surface 60 having a plurality of regions with different adsorption forces is arranged on the first surface 31 of the elastic film 30, as shown in FIGS.

[0093] As shown in Fig. 13, the suction surface 60 can be configured in such a way that multiple triangular regions expanding from the center of the elastic membrane 30 toward the outer periphery are arranged at equal intervals along the periphery (in Fig. 13, a total of four regions are arranged, one at every 90°). The suction surface 60 can also be configured in such a way that regions with different surface roughness are arranged concentrically, alternating from the center toward the outer periphery, as shown in Fig. 14. In addition to the configurations shown in Figs. 13 and 14, the suction surface 60 can be configured in such a way that multiple regions with different suction strengths are arranged in any shape depending on the shape, size, etc. of the adhesive film F used.

[0094] The suction surface 60 can be formed with a plurality of regions with different suction strengths depending on the surface roughness of the first surface 31. The suction strength of each surface of the suction surface 60 can be changed by adjusting the number of recesses or protrusions formed on the first surface 31 so that the suction strength varies depending on the size of the contact area with the adhesive film F. As an example, the suction surface 60 can have low suction regions 60A with high surface roughness (regions with large dot sizes in Figures 13 and 14) with Ra<10 μm, and high suction regions 60B with low surface roughness (regions with small dot sizes in Figures 13 and 14) with Ra<1 μm.

[0095] The attraction surface 60 can have multiple regions with different attraction strengths depending on the friction coefficient of the material forming the first surface 31. The elastic film 30 can be molded by arranging materials with different attraction strengths in a predetermined shape so that the attraction strength changes within the first surface 31 during molding. The attraction surface 60 can also be changed by applying a material with a different friction coefficient to the first surface 31. As an example, the attraction strength of each surface of the attraction surface 60 can be changed by applying a fluorine-based resin or the like with a low friction coefficient to the first surface 31 of the elastic film 30 to form low attraction regions 60A that are coated regions and high attraction regions 60B that are not coated regions.

[0096] The attraction force of the attraction surface 60 varies depending on the surface roughness and the coefficient of friction of the material used to form the surface, but the attraction force can also be adjusted by combining these factors. The attraction surface 60 may also have multiple regions with different attraction forces depending on factors other than the surface roughness and the coefficient of friction of the material used to form the surface. The attraction surface 60 is not limited to two types, the low attraction region 60A and the high attraction region 60B, but may also have multiple attraction regions with varying levels of attraction force.

[0097] As described above, the mounting devices 100, 100A, and 100B can be configured to have a plurality of suction surfaces 60 with different suction forces on the first surface 31 of the elastic film 30. This allows the mounting devices 100, 100A, and 100B to control the suction force of the elastic film 30 when attaching the adhesive film F to the workpiece W, making it possible to easily peel the adhesive film F from the elastic film 30. Therefore, the mounting devices 100, 100A, and 100B can reliably attach the adhesive film F to the workpiece W without the adhesive film F remaining adhered to the elastic film 30.

[0098] Furthermore, the above-described mounting devices 100, 100A, and 100B can also be equipped with a blowing device that blows air onto the first surface 31 of the elastic film 30. This allows the mounting devices 100, 100A, and 100B to cool the elastic film 30 more efficiently and in a shorter time because the cooling effect of the blowing device is added to the cooling effect of the cooling unit 40.

[0099] As described above, the mounting device 100 according to this embodiment is an apparatus for bonding an adhesive film F to a bonding surface Wa of a workpiece W, and includes a chamber 10 in which the lid 11 and the housing 12 are separable, for bonding the adhesive film F to the workpiece W under reduced pressure, and a stage 20 housed in the chamber 10 and having a holding unit (electrostatic chuck 22) for holding the workpiece W and a heating unit 23 for heating the workpiece W. The housing 12 has an exhaust port 15 for reducing the pressure inside the chamber 10, and the lid 11 is configured to include an elastic film 30, a base 11a, and a cooling unit 40. The elastic film 30 is disposed at a position opposite the holding unit of the stage 20, is formed of an elastic member capable of holding the adhesive film F, and has a first surface 31 capable of bonding the adhesive film F to the bonding surface Wa of the workpiece W, and a second surface 32 opposite the first surface 31. The base 11a has an A-side 13 that faces the second side 32 of the elastic membrane 30, and a vent 14 that connects at least the surface of the A-side 13 to the outside of the chamber 10. The cooling unit 40 is in direct contact with the elastic membrane 30 to cool the elastic membrane 30.

[0100] With this configuration, the mounting apparatus 100 can appropriately cool the elastic film 30 using the cooling unit 40 when performing the bonding process while the stage 20 is heated to increase the adhesive strength of the adhesive film F. As a result, the mounting apparatus 100 can reliably adsorb the elastic film 30 without reducing its adhesiveness and accurately position it relative to the workpiece W. Furthermore, because the cooling unit 40 appropriately cools the elastic film 30, unintended adhesive reactions do not occur when the adhesive film F contacts the first surface 31 of the elastic film 30. Therefore, the mounting apparatus 100 does not experience poor bonding of the adhesive film F during bonding. Furthermore, because the cooling unit 40 appropriately cools the mounting apparatus 100 before the next adhesive film F is retrieved, the cooling time required is shorter than with conventional air blowing, and productivity is not reduced. [Explanation of symbols]

[0101] 10 chambers, 11 lid body, 11a base, 12 enclosures, 13 Side A of the base, 14 vents, 15 exhaust vents, 20 stages, 21 Stage body, 22 electrostatic chuck (holding part), 23 heating section, 30 elastic membrane, 31 First surface of elastic membrane, 32 second surface of the elastic membrane, 40 Cooling section, 41 Thermoelectric elements, 41a conductive film, 42 cooling plate, 42a air vent, 43 flow paths, 43a first flow section of the flow channel; 43b a second flow section of the flow channel; 44 plates, 45 refrigerant flow path, 46 flow paths, 46a first flow section of the flow channel; 46b second flow section of the flow channel; 50 Auxiliary heating section, 51 wiring, 60 Adsorption surface, 60A low adsorption area, 60B high adsorption area, 100, 100A, 100B mounting equipment, 110 control section, 200 mounting table, F adhesive film, HA (HA1~HA4) heating area, Double work, Wa: The attachment surface of the workpiece.

Claims

1. A mounting device that attaches an adhesive film to an attachment surface of a workpiece, a chamber having a detachable lid and a casing for applying the adhesive film to the workpiece under reduced pressure; a stage that is housed in the chamber and has a holding part that holds the workpiece and a heating part that heats the workpiece; the housing has an exhaust port for reducing the pressure inside the chamber, The lid body is The device includes an elastic membrane, a base, and a cooling portion, the elastic membrane is formed of an elastic member capable of holding the adhesive film, is disposed at a position facing the holding portion of the stage, and has a first surface capable of attaching the adhesive film to the attachment surface of the workpiece, and a second surface opposite to the first surface; the base portion has a surface A facing the second surface of the elastic membrane, and a vent hole communicating at least the surface of the surface A with the outside of the chamber; The cooling unit is in direct contact with the elastic film to cool the elastic film.

2. The mounting device according to claim 1 , wherein the cooling unit is at least one thermoelectric element disposed between the second surface and the A surface.

3. The mounting device according to claim 1 , wherein the cooling unit is a cooling plate disposed on the surface A and through which a coolant can flow.

4. The mounting device according to claim 1 , wherein the cooling section is a coolant flow path disposed inside the elastic film.

5. 5. The mounting device according to claim 1, wherein the elastic film has an auxiliary heating portion that auxiliary heats the adhesive film.

6. 6. The mounting device according to claim 5, wherein the auxiliary heating section is a heater formed on the first surface of the elastic film and having wiring made of conductive resin formed in a predetermined pattern shape.

7. The mounting device according to claim 6 , wherein the heaters are arranged in a plurality of heating regions that partition the first surface of the elastic film.

8. 5. The mounting device according to claim 1, wherein the adhesive film is an insulating resin film.

9. 5. The mounting device according to claim 1, wherein the elastic film is a diaphragm made of silicone rubber.

10. 5. The mounting device according to claim 1, wherein the first surface of the elastic film has an adsorption surface having a plurality of regions with different adsorption forces.

11. The mounting device according to claim 10 , wherein the attraction surface has regions with different attraction forces formed by varying the surface roughness of the first surface.

12. The mounting device according to claim 10 , wherein the attraction surface has regions with different attraction forces formed by differences in friction coefficients of materials forming the first surface.

13. a suction step of suctioning the adhesive film onto the first surface of the elastic membrane; a processing space forming step of combining the lid and the housing to form a processing space as the chamber; an attachment step of expanding the elastic membrane by at least one of a process of reducing the pressure inside the chamber and a process of feeding gas into the chamber through the vent hole, and attaching the adhesive film to the workpiece placed on the stage; The mounting device according to claim 1 , further comprising: a control unit that executes a cooling step of cooling the elastic film with the cooling unit.

Images