Power module, circuit block mountable on power module, circuit constant adjusting method, and power module manufacturing method
The power module design with exchangeable circuit blocks and connection pins addresses parasitic inductance issues, allowing for easy adjustment of circuit constants and customization for various customers, enhancing productivity.
Patent Information
- Application Number
- JP2025247399
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-12-12
- Publication Date
- 2026-02-27
AI Technical Summary
Conventional power modules face difficulties in adjusting circuit constants due to parasitic inductance caused by connection positions and distances, making it hard to change circuit blocks and determine optimal settings, especially when different circuit constants are required for different customers.
The power module design includes insulating substrates with exchangeable circuit blocks connected via first and second connection pins, allowing easy adjustment and sealing with resins, which reduces parasitic inductance and enables setting of circuit constants through trial and error with replaceable circuit elements.
This design facilitates setting of circuit constants for parasitic inductance, enabling power modules with different constants for each customer by simply changing circuit blocks, improving productivity and ease of adjustment.
Smart Images

Figure 2026034577000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a power module, a circuit block that can be mounted on a power module, a method for adjusting circuit constants, and a method for manufacturing a power module. [Background technology]
[0002] A conventional power module is composed of, for example, power semiconductors, circuit components (circuit blocks), heat sinks, insulating materials, substrates, insulating resins, etc. A specific conventional power module can configure a compact power conversion circuit with insulating functions by connecting chip-state power semiconductors and circuit components over the shortest distance.
[0003] However, in conventional power modules, the substrate is covered with insulating resin, making it difficult to change the internal circuit blocks and carry out trial and error to determine the circuit constants and ratings of the power module.
[0004] This kind of trial and error can sometimes be done using the connection terminals that the power module originally has, but even if circuit components that carry high frequencies are connected via connection terminals, parasitic inductance is added due to the connection position of the circuit components on the internal board and the distance to the connection terminal, making it difficult to determine the optimal circuit constants.
[0005] Furthermore, when a power module with different circuit constants is required for each customer, it is not easy to change the circuit block. Incidentally, a technology related to a conventional power module is described in Patent Document 1. [Prior art documents] [Patent documents]
[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-72316 Summary of the Invention [Problem to be solved by the invention]
[0007] Various aspects of the present invention aim to provide a power module that facilitates setting of circuit constants for parasitic inductance. Another object of various aspects of the present invention is to provide a power module with different circuit constants for each customer simply by changing the circuit block. [Means for solving the problem]
[0008] Various aspects of the present invention are described below.
[0009] [1] An insulating substrate; a module internal circuit disposed on the insulating substrate and having a first circuit element; a first conductive portion disposed on the insulating substrate and electrically connected to one end of the first circuit element; a second conductive portion disposed on the insulating substrate and electrically connected to the other end of the first circuit element; a first connection pin located on one end side of the first circuit element in the first conductive portion, the first connection pin having one end joined to the first conductive portion; a second connection pin located on the other end side of the first circuit element in the second conductive portion, the second connection pin having one end joined to the second conductive portion; a first resin that seals the module internal circuit, the first conductive portion, the second conductive portion, one end side of the first connection pin, and one end side of the second connection pin; a circuit block exchangeably electrically connected to the first circuit element; Including, the circuit block has a second circuit element; the other end side of the first connection pin and the other end side of the second connection pin protrude from the first resin, The power module is characterized in that the circuit blocks are connected by the first connection pins and the second connection pins.
[0010] [2] In [1] above, one end of the second circuit element is electrically connected to the other end of the first connection pin; the other end of the second circuit element is electrically connected to the other end of the second connection pin; The power module is characterized in that the circuit block is sealed with a second resin on the power module.
[0011] [3] In [1] or [2] above, the second circuit element includes a capacitor and a resistor; a power module, characterized in that one end of the resistor is configured to be electrically connectable to the other end of the first connection pin, the other end of the resistor is electrically connected to a first electrode of the capacitor, and a second electrode of the capacitor is configured to be electrically connectable to the other end of the second connection pin.
[0012] [4] In [3] above, the first circuit element includes a first switching element, a second switching element, a third conductive unit, and a fourth conductive unit; a power module, characterized in that one end of the first switching element is electrically connected to the first conductive portion, the other end of the first switching element is electrically connected to the second conductive portion, the second conductive portion is electrically connected to the third conductive portion, the third conductive portion is electrically connected to one end of the second switching element, and the other end of the second switching element is electrically connected to the fourth conductive portion.
[0013] [5] In [1] or [2] above, the second circuit element includes a gate driver; one end of the second connection pin is electrically connected to a control terminal of the first circuit element; a control input terminal of the gate driver configured to be electrically connectable to the other end of the first connection pin, and an output terminal of the gate driver configured to be electrically connectable to the other end of the second connection pin.
[0014] [6] In [1] or [2] above, the second circuit element includes a third switching element; one end of the second connection pin is electrically connected to a control terminal of the first circuit element; a first electrode of the third switching element configured to be electrically connectable to the other end of the first connection pin, and a second electrode of the third switching element configured to be electrically connectable to the other end of the second connection pin.
[0015] [7] In [1] or [2] above, the first circuit element includes a current detection circuit including a resistor, a Hall element, and a current transformer; the second circuit element includes an overcurrent detection circuit; one end of the first connection pin is electrically connected to a first terminal of the current detection circuit, and one end of the second connection pin is electrically connected to a second terminal of the current detection circuit; A power module characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the second connection pin.
[0016] [8] A circuit block electrically connected to a power module in which the other ends of the first connection pin and the second connection pin protrude, and the circuit block is replaceable; the circuit block has a second circuit element; one end of the second circuit element is configured to be electrically connectable to the other end of the first connection pin; A circuit block mountable on a power module, wherein the other end of the second circuit element is configured to be electrically connectable to the other end of the second connection pin.
[0017] [9] In paragraph [8] above, the second circuit element includes a capacitor and a resistor; a circuit block that can be mounted on a power module, wherein one end of the resistor is configured to be electrically connectable to the other end of the first connection pin, the other end of the resistor is electrically connected to a first electrode of the capacitor, and a second electrode of the capacitor is configured to be electrically connectable to the other end of the second connection pin.
[0018]
[10] In paragraph [8] above, the second circuit element includes a gate driver; A circuit block that can be mounted on a power module, wherein a control input terminal of the gate driver is configured to be electrically connectable to the other end of the first connection pin, and an output terminal of the gate driver is configured to be electrically connectable to the other end of the second connection pin.
[0019]
[11] In paragraph [8] above, the second circuit element includes a third switching element; a first electrode of the third switching element configured to be electrically connectable to the other end of the first connection pin, and a second electrode of the third switching element configured to be electrically connectable to the other end of the second connection pin.
[0020]
[12] In paragraph [8] above, the second circuit element includes an overcurrent detection circuit; A circuit block that can be mounted on a power module, characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the second connection pin.
[0021]
[13] A step (a) of electrically connecting the circuit block according to any one of claims 8 to 12 to a circuit block replaceable power module by the first connection pins and the second connection pins; a step (b) of adjusting the second circuit element of the circuit block described in the step (a); a step (c) of electrically connecting a circuit block having the second circuit element adjusted in the step (b) to the power module described in the step (a) via the first connection pin and the second connection pin; A method for adjusting a circuit constant, comprising:
[0022]
[14] A step (a) of electrically connecting the circuit block according to any one of claims 8 to 12 to a circuit block replaceable power module by the first connection pins and the second connection pins; a step (b) of sealing the circuit block on the power module with a second resin; A method for manufacturing a power module, comprising: [Effects of the Invention]
[0023] According to various aspects of the present invention, it is possible to provide a power module that facilitates setting of circuit constants for parasitic inductance. Furthermore, according to various aspects of the present invention, it is possible to provide power modules with different circuit constants for each customer simply by changing the circuit block. [Brief explanation of the drawings]
[0024] [Figure 1] FIG. 1A is a perspective view showing a schematic diagram of a power module 21 according to one embodiment of the present invention, and FIG. 1B is a cross-sectional view showing the power module 21 shown in FIG. 1A and a circuit block 19 connected to the power module 21. [Figure 2] 1A is a diagram showing the internal circuit of the module, and FIG. 1B is a schematic diagram illustrating the connection relationship between the internal circuit of the module and the circuit blocks. [Figure 3] 1A is a perspective view showing the state in which the circuit block 19 shown in FIG. 1B is attached to the power module 20 shown in FIG. 1A and then sealed with a second resin 31, and FIG. 1B is a cross-sectional view showing the state in which the circuit block 19 shown in FIG. 1A is sealed with the second resin 31. [Figure 4]FIG. 13 is a circuit diagram of a module internal circuit 13a, showing a decoupling capacitor and a damper resistor in the power supply line of a switching circuit. [Figure 5] 1A is a schematic circuit diagram illustrating a configuration in which a circuit block 19 is connected to a module internal circuit 13b, and FIG. 1B is a circuit diagram illustrating a gate driver in the module internal circuit 13b. [Figure 6] FIG. 10 is a circuit diagram of a fail-safe circuit when an overcurrent is detected. DETAILED DESCRIPTION OF THE INVENTION
[0025] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be readily understood by those skilled in the art that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.
[0026] FIG. 1(A) is a perspective view schematically illustrating a power module 21 according to one embodiment of the present invention, and FIG. 1(B) is a cross-sectional view illustrating the power module 21 illustrated in FIG. 1(A) and a circuit block 19 connected to the power module 21.
[0027] A power module 20 shown in Figures 1(A) and 1(B) has an insulating substrate 11. A module internal circuit 13 having a first circuit element 12 shown in Figures 2(A) and 2(B) is arranged on the insulating substrate 11. The first circuit element 12 is a first switching element (e.g., a MOSFET).
[0028] A first conductive portion 14 is disposed on the insulating substrate 11, and the first conductive portion 14 is electrically connected to one end 12a of the first switching element 12. As shown in FIG. 2(B), the first conductive portion 14 is formed of, for example, a copper clip.
[0029] A second conductive portion 15 is disposed on the insulating substrate 11 and is electrically connected to the other end 12b of the first switching element 12. The second conductive portion 15 is formed of, for example, a copper pattern. Note that reference numerals 12a and 12b in FIG. 2(B) indicate the positions of connection pins.
[0030] 2A and 2B, one end 16a of the first connection pin 16 is joined to the first switching element 12 or the first conductive portion 14, and the joined portion is located on the side of the first end 12a of the first switching element 12 in the first conductive portion 14. In other words, one end 16a of the first connection pin 16 is joined to the side of the first end 12a of the first switching element 12 in the first conductive portion 14.
[0031] The first end 16a of the first connection pin 16 can be joined to the first conductive portion 14 by soldering or welding. Alternatively, the first connection pin 16 may be formed integrally with the first conductive portion 14 instead of being joined.
[0032] One end 17a of the second connection pin 17 is joined to the second conductive portion 15, and this joined portion is located on the other end 12b side of the first switching element 12 in the second conductive portion 15. In other words, one end 17a of the second connection pin 17 is joined to the other end 12b side of the first switching element 12 in the second conductive portion 15.
[0033] Furthermore, soldering or welding can be used as a method for joining one end 17a of second connection pin 17 and second conductive portion 15. Alternatively, second connection pin 17 may be formed integrally with second conductive portion 15 instead of being joined.
[0034] The module internal circuit 13, the first conductive part 14, the second conductive part 15, one end 16a of the first connection pin 16, and one end 17a of the second connection pin 17 are sealed with a first resin 18 shown in Figures 1(A) and (B).
[0035] Each of the first connection pins 16 and the second connection pins 17 is preferably made of a conductive material (for example, a metal such as copper). Each of the first connection pins 16 and the second connection pins 17 may be shaped like a round rod or a square rod, and although Fig. 1 shows straight connection pins, they may also have curved portions.
[0036] Furthermore, the plurality of connection terminals 52 protrude from the first resin 18, and one end of each of the plurality of connection terminals 52 is connected to the insulating substrate 11 (see FIGS. 1(A), (B), 3(A), (B)).
[0037] 1(A) and 1(B), the circuit block 19 is electrically connected to the first switching element 12 in an exchangeable manner. In other words, the power module 20 has the circuit block 19 that is exchangeably connected.
[0038] The circuit block 19 includes a second circuit element 21 (see FIGS. 1 and 2).
[0039] As shown in FIGS. 1A and 1B, the other end 16b of the first connection pin 16 and the other end 17b of the second connection pin 17 protrude from the first resin .
[0040] The circuit blocks 19 are connected by first connection pins 16 and second connection pins 17 .
[0041] In the power module with replaceable circuit blocks according to this embodiment, the first connection pin 16 electrically connected to one end 12a of the first switching element 12, which is the first circuit element 12 of the module internal circuit 13, and the second connection pin 17 electrically connected to the other end 12b of the first switching element 12, respectively, protrude from the first resin 18. Therefore, by preparing a circuit block 19 having a second circuit element 21, the second circuit element 21 of the circuit block can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18. Preparing a plurality of circuit blocks 19 with adjusted second circuit elements 21 facilitates trial and error to determine the circuit constants of the power module. 2, one end 16a of the first connection pin 16 is joined to a portion of the first conductive section 14 located on the side of one end 12a of the first switching element 12, and one end 17a of the second connection pin 17 is joined to a portion of the second conductive section 15 located on the side of the other end 12b of the first switching element 12, thereby positioning the first connection pin 16 and the second connection pin 17 so as to be the shortest distance from the first switching element 12. This reduces parasitic inductance. Because the first circuit element 21 of the circuit block 19 and the first switching element 12 are connected by the first connection pin 16 and the second connection pin 17, it becomes possible to set circuit constants that correspond to the reduced parasitic inductance.
[0042] As shown in FIG. 2B, one end 21a of the second circuit element 21 is electrically connected to the other end 16b of the first connection pin 16.
[0043] The other end 21b of the second circuit element 21 is electrically connected to the other end 17b of the second connection pin 17. Note that reference numerals 21a and 21b shown in Fig. 2(B) indicate the positions of the connection pins.
[0044] 3(A) is a perspective view showing the state in which the circuit block 19 shown in FIG. 1(B) is attached to the power module 20 shown in FIG. 1(A) and then sealed with a second resin 31, and FIG. 3(B) is a cross-sectional view showing the state in which the circuit block 19 shown in FIG. 3(A) is sealed with the second resin 31.
[0045] When the circuit block 19 is replaceable from the power module 20, the other end 16b of the first connection pin 16 and one end 21a of the second circuit element 21 can be connected using sockets 51a and 51b. The other end 16b of the first connection pin 16 is inserted into the socket 51a, and the other end 17b of the second connection pin 17 is inserted into the socket 51b (see FIGS. 1B and 3B). Furthermore, after the setting of circuit constants and the like has been completed and there is no need to replace the circuit block 19, the other end 16b of the first connection pin 16 and one end 21a of the second circuit element 21 can be joined by soldering or welding. Alternatively, the other end 16b of the first connection pin 16 may be integrally formed with the circuit block 19 instead of being joined.
[0046] The circuit block 19 is sealed on the power module 20 with a second resin 31 (see FIG. 3).
[0047] According to the power module of this embodiment, the circuit block 19, in which a suitable circuit constant for the parasitic inductance can be set, is electrically connected to the first circuit element 12 of the power module 20, and the circuit block 19 is sealed on the power module 20 with the second resin, thereby making it possible to provide power modules with different circuit constants for each customer.
[0048] Fig. 2(A) is a circuit diagram showing a CR snubber of a three-phase inverter, which is the module internal circuit 13. Fig. 2(B) is a schematic circuit diagram for explaining a configuration in which a circuit block 19 is connected to the module internal circuit 13. As shown in Figs. 2(A) and 2(B), the second circuit element 21 has a capacitor 32 and a resistor 33.
[0049] 2(B), one end of resistor 33 is configured to be electrically connectable to the other end 16b of first connection pin 16. The other end of resistor 33 is electrically connected to a first electrode of capacitor 32. A second electrode of capacitor 32 is configured to be electrically connectable to the other end 17b of second connection pin 17.
[0050] According to this embodiment, by preparing a circuit block 19 having a capacitor 32 and a resistor 33 of a CR snubber, the capacitor 32 and the resistor 33 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in FIG. 1 . By preparing a plurality of circuit blocks 19 with adjusted capacitors 32 and resistors 33, trial and error can be easily performed to determine the circuit constants of the power module. Furthermore, since the capacitor 32 and the resistor 33 of the circuit block 19 are connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it is possible to set the circuit constants for reduced parasitic inductance.
[0051] Fig. 4 is a circuit diagram of the module internal circuit 13a, showing the decoupling capacitor and damper resistor of the power supply line of the switching circuit. The first circuit element 12d shown in Fig. 4 has a first switching element 34, a second switching element 35, and the third conductive part 36 and the fourth conductive part 37 shown in Fig. 2(B).
[0052] 2(B), one end of the first switching element 34 is electrically connected to the first conductive portion 14, and the other end of the first switching element 34 is electrically connected to the second conductive portion 15. The second conductive portion 15 is electrically connected to the third conductive portion 36. The third conductive portion 36 is electrically connected to one end of the second switching element 35, and the other end of the second switching element 35 is electrically connected to the fourth conductive portion 37. The first conductive portion 14 and the third conductive portion 36 are each formed of, for example, a copper clip. The second conductive portion 15 and the fourth conductive portion 37 are each formed of, for example, a copper pattern.
[0053] According to this embodiment, by preparing a circuit block 19 having a decoupling capacitor 32a and a damper resistor 33a, the decoupling capacitor 32a and the damper resistor 33a of the circuit block 19 can be easily electrically connected to the first switching element 34 and the second switching element 35 of the power module by the first connection pins 16 and the second connection pins 17 protruding from the first resin 18 shown in FIG. 1 . Preparing a plurality of circuit blocks 19 with adjusted decoupling capacitors 32a and damper resistors 33a facilitates trial and error to determine the circuit constants of the power module. Furthermore, because the decoupling capacitor 32a and the damper resistor 33a of the circuit block 19 are connected to the first switching element 34 and the second switching element 35 by the first connection pins 16 and the second connection pins 17, it is possible to set the circuit constants for reduced parasitic inductance.
[0054] Fig. 5(A) is a schematic circuit diagram for explaining a configuration in which the circuit block 19 is connected to the module internal circuit 13b. Fig. 5(B) is a circuit diagram showing a gate driver in the module internal circuit 13b. The second circuit element 21 has a gate driver 38.
[0055] As shown in FIG. 5(A), one end 17a of the second connection pin 17 is electrically connected to the control terminal 12c of the first switching element 12.
[0056] A control input terminal 39 of the gate driver 38 is configured to be electrically connectable to the other end 16b of the first connection pin 16. An output terminal 40 of the gate driver 38 is configured to be electrically connectable to the other end 17b of the second connection pin 17.
[0057] According to this embodiment, by preparing a circuit block 19 having a gate driver 38, the gate driver 38 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in FIG. 1 . By preparing a plurality of circuit blocks 19 with adjusted gate drivers 38, trial and error can be easily carried out to determine the circuit constants of the power module. Furthermore, since the gate driver 38 of the circuit block 19 is connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it is possible to set the circuit constants for reduced parasitic inductance.
[0058] 6 is a circuit diagram of a fail-safe circuit when an overcurrent is detected. The second circuit element 21 has a bipolar transistor 41 as a third switching element.
[0059] One end of the second connection pin 17 is electrically connected to a control terminal of a first switching element 12 serving as a first circuit element.
[0060] An emitter electrode 43 serving as a first electrode of bipolar transistor 41 serving as a third switching element is configured to be electrically connectable to the other end of first connection pin 16. A collector electrode 42 serving as a second electrode of bipolar transistor 41 serving as a third switching element is configured to be electrically connectable to the other end of second connection pin 17.
[0061] The module internal circuit shown in FIG. 6 has a current detection circuit 45 as a first circuit element that includes a resistor, a Hall element, and a current transformer.
[0062] The second circuit element 21 includes an overcurrent detection circuit 44 .
[0063] One end 16a of the first connection pin 16 shown in Figure 1 is electrically connected to a first terminal of the current detection circuit 45, and one end 17a of the second connection pin 17 is electrically connected to a second terminal of the current detection circuit 45.
[0064] A first terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 16b of the first connection pin 16 shown in Fig. 1. A second terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 17b of the second connection pin 17 shown in Fig. 1.
[0065] According to this embodiment, by preparing a circuit block 19 having an overcurrent detection circuit 44, the overcurrent detection circuit 44 of the circuit block 19 can be easily electrically connected to the current detection circuit 45 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in FIG. 1 . By preparing a plurality of circuit blocks 19 with adjusted overcurrent detection circuits 44, trial and error can be easily carried out to determine the circuit constants of the power module. Furthermore, since the overcurrent detection circuit 44 and the current detection circuit 45 of the circuit block 19 are connected by the first connection pin 16 and the second connection pin 17, it is possible to set the circuit constants for reduced parasitic inductance.
[0066] As shown in FIG. 1, the circuit block 19 is electrically connected to a power module 20 that is a replaceable circuit block, and the other ends 16b and 17b of the first connection pin 16 and the second connection pin 17 of the power module 20 protrude.
[0067] The circuit block 19 has a second circuit element 21 (see FIGS. 1 and 2).
[0068] One end 21 a of the second circuit element 21 is configured to be electrically connectable to the other end 16 b of the first connection pin 16 .
[0069] The other end 21 b of the second circuit element 21 is configured to be electrically connectable to the other end 17 b of the second connection pin 17 .
[0070] According to this embodiment, a power module 20 with replaceable circuit blocks is prepared. In this power module 20 with replaceable circuit blocks, the other ends 16b, 17b of the first connection pins 16 and the second connection pins 17 protrude. A circuit block 19 having a second circuit element 21 is prepared, and one end 21a of the second circuit element 21 is configured to be electrically connectable to the other end 16a of the first connection pin 16, and the other end 21b of the second circuit element 21 is configured to be electrically connectable to the other end 17b of the second connection pin 17. Because such a circuit block 19 can be electrically connected to the power module 20 with replaceable circuit blocks, a variety of circuit blocks can be prepared, and power modules with different circuit constants can be realized for each customer.
[0071] As shown in FIGS. 2A and 2B, the second circuit element 21 includes a capacitor 32 and a resistor 33.
[0072] 2(B), one end of resistor 33 is configured to be electrically connectable to the other end 16b of first connection pin 16. The other end of resistor 33 is electrically connected to a first electrode of capacitor 32. A second electrode of capacitor 32 is configured to be electrically connectable to the other end 17b of second connection pin 17.
[0073] According to this embodiment, by preparing a circuit block 19 having a capacitor 32 and a resistor 33 of a CR snubber, the capacitor 32 and the resistor 33 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in FIG. 1 . By preparing a plurality of circuit blocks 19 with adjusted capacitors 32 and resistors 33, trial and error can be easily performed to determine the circuit constants of the power module. Furthermore, since the capacitor 32 and the resistor 33 of the circuit block 19 are connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it is possible to set the circuit constants for reduced parasitic inductance.
[0074] The second circuit element 21 shown in FIGS. 5(A) and 5(B) has a gate driver 38.
[0075] A control input terminal 39 of the gate driver 38 is configured to be electrically connectable to the other end 16b of the first connection pin 16. An output terminal 40 of the gate driver 38 is configured to be electrically connectable to the other end 17b of the second connection pin 17.
[0076] According to this embodiment, by preparing a circuit block 19 having a gate driver 38, the gate driver 38 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in FIG. 1 . By preparing a plurality of circuit blocks 19 with adjusted gate drivers 38, trial and error can be easily carried out to determine the circuit constants of the power module. Furthermore, since the gate driver 38 of the circuit block 19 is connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it is possible to set the circuit constants for reduced parasitic inductance.
[0077] The second circuit element 21 shown in FIG. 6 has a bipolar transistor 41 as a third switching element.
[0078] An emitter electrode 43 serving as a first electrode of bipolar transistor 41 serving as a third switching element is configured to be electrically connectable to the other end of first connection pin 16. A collector electrode 42 serving as a second electrode of bipolar transistor 41 serving as a third switching element is configured to be electrically connectable to the other end of second connection pin 17.
[0079] The second circuit element 21 shown in FIG.
[0080] A first terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 16b of the first connection pin 16 shown in Fig. 1. A second terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 17b of the second connection pin 17 shown in Fig. 1.
[0081] According to this embodiment, by preparing a circuit block 19 having an overcurrent detection circuit 44, the overcurrent detection circuit 44 of the circuit block 19 can be easily electrically connected to the current detection circuit 45 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in FIG. 1 . By preparing a plurality of circuit blocks 19 with adjusted overcurrent detection circuits 44, trial and error can be easily carried out to determine the circuit constants of the power module. Furthermore, since the overcurrent detection circuit 44 and the current detection circuit 45 of the circuit block 19 are connected by the first connection pin 16 and the second connection pin 17, it is possible to set the circuit constants for reduced parasitic inductance.
[0082] The method for adjusting the circuit constants will be explained below.
[0083] First, the circuit block 19 is electrically connected to the power module 20, which is circuit block replaceable, by the first connection pins 16 and the second connection pins 17 (step (a)).
[0084] The second circuit element 21 of the circuit block 19 described in the above step (a) is adjusted (step (b)).
[0085] The circuit block 19 having the second circuit element 21 adjusted by the above step (b) is electrically connected to the power module 20 described in step (a) by the first connection pin 16 and the second connection pin 17 (step (c)).
[0086] According to the above-described method for adjusting a circuit constant, since it includes the step (b) of adjusting the second circuit element 21 of the circuit block 19, the circuit block 19 having the adjusted second circuit element 21 can be electrically connected to the power module 20 described in the step (a) by the first connection pin 16 and the second connection pin 17. Therefore, it is possible to provide power modules with different circuit constants for each customer.
[0087] The method for manufacturing the power module will be described below.
[0088] The circuit block 19 according to claim 3 is electrically connected to the power module 20, which allows replacement of the circuit block, by the first connection pins 16 and the second connection pins 17 (step (a)).
[0089] As shown in FIGS. 3(A) and 3(B), the circuit block 19 is sealed with a second resin (31) on the power module 20 (step (b)).
[0090] According to the above-described method for manufacturing a power module, the circuit block 19 according to claim 3 is electrically connected to the power module 20, which allows for exchange of circuit blocks, by the first connection pins 16 and the second connection pins 17, and the circuit block 19 is sealed with the second resin (31) on the power module 20. As a result, even when power modules with different circuit constants are required for different customers, it is only necessary to change the circuit block, which makes it easier to adjust production and improves productivity. [Explanation of symbols]
[0091] 11 Insulating substrate 12, 12d First circuit element 12a One end of the first circuit element 12b the other end of the first circuit element 12c control terminal 13 Module internal circuit 14 First conductive part 15 Second conductive part 16 First connecting pin 16a One end of the first connecting pin 16b Other end of first connecting pin 17 Second connecting pin 17a One end of the second connecting pin 17b Other end of second connecting pin 18 First Resin 19 Circuit Blocks 20 Power Module 21 Second circuit element 21a One end of the second circuit element 21b the other end of the second circuit element 31 Second Resin 32,32a capacitor 33,33a resistance 34 First switching element 35 Second switching element 36 Third conductive part 37 Fourth conductive part 38 Gate Driver 39 Control input terminal 40 Gate driver output terminal 41 Third switching element 42 Second electrode of third switching element 43 First electrode of third switching element 44 Overcurrent detection circuit 45 Current detection circuit
Claims
1. an insulating substrate; a module internal circuit disposed on the insulating substrate and having a first circuit element; a first conductive portion disposed on the insulating substrate and electrically connected to one end of the first circuit element; a second conductive portion disposed on the insulating substrate and electrically connected to the other end of the first circuit element; a first connection pin located on one end side of the first circuit element in the first conductive portion, the first connection pin having one end joined to the first conductive portion; a second connection pin located on the other end side of the first circuit element in the second conductive portion, the second connection pin having one end joined to the second conductive portion; a first resin that seals the module internal circuit, the first conductive portion, the second conductive portion, one end side of the first connection pin, and one end side of the second connection pin; a circuit block exchangeably electrically connected to the first circuit element; Including, the circuit block has a second circuit element; the other end side of the first connection pin and the other end side of the second connection pin protrude from the first resin, the circuit blocks are connected by the first connection pins and the second connection pins; the first circuit element includes a current detection circuit including a resistor, a Hall element, and a current transformer; the second circuit element includes an overcurrent detection circuit; one end of the first connection pin is electrically connected to a first terminal of the current detection circuit, and one end of the second connection pin is electrically connected to a second terminal of the current detection circuit; A power module characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the second connection pin.
2. In claim 1, one end of the second circuit element is electrically connected to the other end of the first connection pin; the other end of the second circuit element is electrically connected to the other end of the second connection pin; The power module is characterized in that the circuit block is sealed with a second resin on the power module.
3. a circuit block electrically connected to a power module in which the other ends of the first connection pin and the second connection pin protrude, and the power module is replaceable with a circuit block; the circuit block has a second circuit element; one end of the second circuit element is configured to be electrically connectable to the other end of the first connection pin; the other end of the second circuit element is configured to be electrically connectable to the other end of the second connection pin; the second circuit element includes an overcurrent detection circuit; A circuit block that can be mounted on a power module, characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the second connection pin.
4. a step (a) of electrically connecting the circuit block according to claim 3 to a power module in which the circuit block is replaceable by the first connection pins and the second connection pins; a step (b) of adjusting the second circuit element of the circuit block described in the step (a); a step (c) of electrically connecting a circuit block having the second circuit element adjusted in the step (b) to the power module described in the step (a) via the first connection pin and the second connection pin; A method for adjusting a circuit constant, comprising:
5. a step (a) of electrically connecting the circuit block according to claim 3 to a power module in which the circuit block is replaceable by the first connection pins and the second connection pins; (b) sealing the circuit block on the power module with a second resin; A method for manufacturing a power module, comprising:
Citation Information
Patent Citations
Power module and drive unit using the same
JP2014072316A