Pressure device

Abstract

A pressure device capable of ensuring traceability for each workpiece is provided. [Solution] The pressure device 1 according to the present invention comprises an upper pressure unit UP capable of applying pressure to each workpiece W, a plurality of individual heating units 3 arranged below each workpiece and capable of heating the corresponding workpiece, a holding mold 2 for holding the individual heating units, and a plurality of load sensors 4 housed in the holding mold. Each load sensor detects the load applied to the corresponding individual heating unit from the upper pressure unit. Each individual heating unit is movable vertically relative to the holding mold and includes a heater 37, an individual heating mold 30 containing the heater, a temperature sensor 38 housed in the individual heating mold for detecting the temperature of the heater or the individual heating mold, and an individual shaft mold 35 arranged below the individual heating mold for guiding the vertical movement of the individual heating mold relative to the holding mold.

Description

[Technical Field]

[0001] The present invention relates to a pressure device. [Background technology]

[0002] Pressure devices are used, for example, in the manufacturing process of electronic components to pressurize (bond, sinter) multiple stacked workpieces (substrates, elements, sheet bodies, etc.) (see, for example, Patent Document 1). The pressure device disclosed in Patent Document 1 pressurizes multiple workpieces at once using a pressure pad formed of a special elastic body that deforms to follow the shape of each workpiece. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-296746 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, in the electronic component manufacturing industry, there has been a demand for ensuring traceability, which allows the production history of each product to be traced back, due to demands for product quality assurance. However, with the pressure device disclosed in Patent Document 1, due to its configuration, it is difficult to track the pressure conditions (load and temperature applied to the workpiece) for each workpiece, i.e., to ensure traceability.

[0005] An object of the present invention is to provide a pressure device that can ensure traceability for each workpiece. [Means for solving the problem]

[0006] In one embodiment of the present invention, a pressure application device is a pressure application device for applying pressure to a plurality of workpieces, and comprises: an upper pressure application unit arranged above each of the workpieces and capable of applying pressure to each of the workpieces; a plurality of individual heating units arranged below each of the workpieces and capable of heating the corresponding workpieces; a holding mold that holds the individual heating units; and a plurality of load sensors housed in the holding mold, each of the load sensors detecting the load applied from the upper pressure application unit to the corresponding individual heating unit, and each of the individual heating units being movable relative to the holding mold in the vertical direction and comprising a heater that heats the corresponding workpiece, an individual heating mold in which the heater is housed, a temperature sensor housed in the individual heating mold that detects the temperature of the heater or the individual heating mold, and an individual shaft mold arranged below the individual heating mold and guiding the vertical movement of the individual heating mold relative to the holding mold. [Effects of the Invention]

[0007] The present invention provides a pressure device that can ensure traceability for each workpiece. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic cross-sectional view of a pressurizing device according to an embodiment of the present invention; [Figure 2] FIG. 3 is a schematic plan view of a lower pressure unit of the pressure device. [Figure 3] FIG. 2 is an exploded schematic perspective view of a holding mold of the pressure device. [Figure 4] FIG. 2 is a partially enlarged schematic cross-sectional view of the pressure device at a portion A in FIG. 1. [Figure 5] 5 is a partially enlarged schematic cross-sectional view of the holding mold taken along line BB in FIG. 4. [Figure 6] FIG. 2 is an exploded schematic perspective view of the lower pressure unit. [Figure 7] FIG. 3 is a schematic cross-sectional view of the pressurizing device, showing a state in which an upper pressurizing unit of the pressurizing device is lowered. [Figure 8]FIG. 3 is a schematic cross-sectional view of the pressure device, showing a state in which a pressure treatment is being performed. [Figure 9] 9 is a partially enlarged schematic cross-sectional view of the pressure device at a portion C in FIG. 8. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] An embodiment of a pressure device according to the present invention will be described below. In the following description, reference will be made to the drawings as appropriate. In the drawings, the same members and elements are designated by the same reference numerals, and duplicated descriptions will be omitted. Furthermore, the dimensional proportions of the elements may be exaggerated for the sake of convenience, and are not limited to the proportions shown in the drawings.

[0010] In the following explanations and drawings, when the three mutually orthogonal axes in space are the X-axis, Y-axis, and Z-axis, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the up-down direction. The "X-axis direction" is the direction along the X-axis, the "+X-direction" is one direction along the X-axis, and the "-X-direction" is the other direction along the X-axis. The "Y-axis direction" is the direction along the Y-axis, the "+Y-direction" is one direction along the Y-axis, and the "-Y-direction" is the other direction along the Y-axis. The "Z-axis direction" is the direction along the Z-axis and is the up-down direction. The "+Z-direction" is the upward direction, and the "-Z-direction" is the downward direction. The "XY-direction" is the direction along the X-axis and Y-axis directions, and the "XY-plane" is an imaginary plane parallel to the XY-direction (horizontal direction). The "XZ-direction" is the direction along the X-axis and Z-axis directions, and the "XZ-plane" is an imaginary plane parallel to the XZ-direction (vertical direction). The "YZ direction" is a direction along the Y-axis direction and the Z-axis direction, and the "YZ plane" is an imaginary plane parallel to the YZ direction (vertical direction).

[0011] In the following description, the lower surface is a surface that faces downward and is parallel to the X and Y directions, and the upper surface is a surface that faces upward and is parallel to the X and Y directions. In other words, the lower and upper surfaces are flat.

[0012] ●Pressure device● ●Configuration of pressure device FIG. 1 is a schematic cross-sectional view of a pressurizing device according to an embodiment of the present invention (hereinafter referred to as "the device"). This figure shows the state in which the device 1 placed on the XY plane is cut along the XZ plane (the same applies to Figures 5, 7 to 9 described later). For convenience of explanation, this figure also shows a functional block diagram of the control device 13 (described later).

[0013] This device 1 applies pressure to multiple workpieces W at once. This device 1 includes a holding mold 2, multiple (four) individual heating units 3, multiple (four) load sensors 4, multiple connecting cooling paths 5, a base 6, a mold 7, a side unit 8, a support unit 9, a frame member 10, a pressure pad 11, a lifting device 12, a control device 13, and a pump P. The holding mold 2, individual heating units 3, load sensors 4, and connecting cooling paths 5 are arranged vertically below the workpieces W and constitute a lower pressure unit DP. The base 6, mold 7, side unit 8, support unit 9, frame member 10, and pressure pad 11 are arranged vertically above the workpieces W and constitute an upper pressure unit UP.

[0014] The "workpiece W" is an object to be pressurized in the present apparatus 1 (that is, an object to be pressurized), and is, for example, a substrate on which electronic components, circuits, etc. are mounted.

[0015] FIG. 2 is a schematic plan view of the lower pressure unit DP. FIG. 3 is an exploded schematic perspective view of the holding mold 2. As shown in FIG. For convenience of explanation, the second accommodating hole 24b, the bearing member 25, and the individual shaft mold 35 (all of which will be described later) are indicated by two-dot chain lines in Figure 2. In the following explanation, Figure 1 will be referred to as appropriate along with Figures 2 and 3.

[0016] The holding mold 2 holds the individual heating units 3 so that they can move vertically relative to the holding mold 2. The holding mold 2 has, for example, a rectangular parallelepiped shape aligned along the XY direction when viewed from above. The holding mold 2 is disposed below the upper pressure unit UP. The holding mold 2 includes a main body 20, a plurality (four) of accommodation holes 24, a plurality (four) of bearing members 25, and a lower cover member 26.

[0017] FIG. 4 is a partially enlarged schematic cross-sectional view of part A in FIG. In the following description, FIGS. 2 and 3 will be referred to together with FIG. 4 as appropriate.

[0018] The main body 20 defines the receiving hole 24. The main body 20 has a rectangular parallelepiped shape aligned along the XY axis direction when viewed from above and below. The main body 20 includes an upper surface 20a, a lower surface 20b, a first main body 21, a second main body 22, and a main body insulating member 23.

[0019] The first main body portion 21 defines first through holes 21c (described later). The first main body portion 21 has, for example, a rectangular parallelepiped shape aligned along the XY direction when viewed from above. The first main body portion 21 is made of, for example, a metal having high rigidity (for example, carbon steel). The first main body portion 21 has an upper surface 21a, a lower surface 21b, and a plurality (four) of first through holes 21c.

[0020] The first through holes 21c are through holes that penetrate the first main body portion 21 in the up-down direction. The first through holes 21c have a rectangular cylindrical shape that is aligned with the XY directions when viewed from above. When viewed from above, the first through holes 21c are evenly arranged (2 rows x 2 columns) in the first main body portion 21 along the XY directions. In the following description, when the first through holes 21c are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0021] The second main body portion 22 defines a second through-hole 22c (described later). The second main body portion 22 has, for example, a rectangular parallelepiped shape aligned along the XY direction when viewed from above. The second main body portion 22 is made of, for example, a metal having high rigidity (for example, carbon steel). The second main body portion 22 includes an upper surface 22a, a lower surface 22b, a second through-hole 22c, a cooling path 22d, a plurality (four) of piping paths 22e, and a plurality (four) of wiring paths 22f.

[0022] The second through holes 22c are through holes that penetrate the second main body portion 22 in the up-down direction. The second through holes 22c are cylindrical in shape when viewed from above. In the X and Y directions, the length (inner diameter D1) of the second through holes 22c is smaller than the length (width) L1 of the first through holes 21c. When viewed from above, the second through holes 22c are evenly arranged (2 rows x 2 columns) along the X and Y directions in the second main body portion 22. In the following description, when the second through holes 22c are to be particularly distinguished from one another, the suffixes "1" to "4" are added to their names.

[0023] The cooling path 22d is, for example, a tubular flow path through which a refrigerant (not shown; the same applies below) flows. The refrigerant is cooled by a cooling device (not shown; the same applies below) and circulates between the cooling path 22d and the cooling device. The cooling path 22d is contained within the second main body portion 22. When viewed from above, the cooling path 22d is arranged in a serpentine manner so as to pass through the +X-axis direction and the -X-axis direction of each of the second through-holes 22c. In the horizontal direction, the cooling path 22d is arranged to the side of the upper half of the second through-hole 22c. The cooling path 22d is an example of a retention cooling path according to the present invention. The refrigerant flowing through the cooling path 22d is an example of a first refrigerant according to the present invention.

[0024] The piping passages 22e are grooves in which the connection cooling passages 5 are piped. The piping passages 22e are rectangular grooves. The piping passages 22e are arranged on the lower surface 22b so as to extend along the X-axis direction. Each of the piping passages 22e opens into a corresponding second through-hole 22c and into a side surface of the second main body portion 22 in the X-axis direction.

[0025] The wiring paths 22f are through holes in which signal lines and power supply lines (both of which will be described later) are arranged. The wiring paths 22f are arranged inside the second main body portion 22 along the X-axis direction. Each of the wiring paths 22f opens into a corresponding second through hole 22c and into a side surface of the second main body portion 22 in the X-axis direction.

[0026] The main heat insulating member 23 suppresses heat conduction between the first main body portion 21 and the second main body portion 22. The main heat insulating member 23 has, for example, a rectangular plate shape aligned along the XY direction when viewed from above. The main heat insulating member 23 is made of, for example, a known hard heat insulating material (for example, a heat insulating material having a compressive strength of several tens of MPa to 100 MPa or more). The main heat insulating member 23 has an upper surface 23a, a lower surface 23b, and a plurality of third through holes 23c.

[0027] The third through holes 23c are through holes that penetrate the main heat insulating member 23 in the vertical direction. The shape of the third through holes 23c is a rectangular cylinder that is aligned with the XY direction when viewed from above. When viewed from above, the shape of the third through holes 23c is the same as that of the first through holes 21c. When viewed from above, the third through holes 23c are evenly arranged (2 rows x 2 columns) in the main heat insulating member 23 along the XY direction. In the following description, when the third through holes 23c are to be particularly distinguished from one another, the suffixes "1" to "4" are added to their names.

[0028] The main body insulating member 23 is disposed adjacent to the first main body portion 21, below the first main body portion 21. The second main body portion 22 is disposed adjacent to the main body insulating member 23, below the main body insulating member 23. That is, in the vertical direction, the main body insulating member 23 is disposed between the first main body portion 21 and the second main body portion 22, adjacent to them. The first main body portion 21, the second main body portion 22, and the main body insulating member 23 are fixed together, for example, by bolts (not shown), to form a single main body portion 20. The lower surface 21b abuts against the upper surface 23a, and the upper surface 22a abuts against the lower surface 23b.

[0029] When viewed from above, the center of each first through hole 21c coincides with the center of each second through hole 22c and the center of each third through hole 23c. Each third through hole 23c is disposed below the corresponding first through hole 21c and communicates with the first through hole 21c. Each second through hole 22c is disposed below the corresponding third through hole 23c and communicates with the third through hole 23c. As a result, the corresponding first through hole 21c, second through hole 22c, and third through hole 23c form a single receiving hole 24. The correspondence between these will be described later.

[0030] The accommodating holes 24 accommodate the corresponding individual heating units 3. The accommodating holes 24 are through-holes that penetrate the main body 20 in the up-down direction. When viewed from above, the accommodating holes 24 are arranged evenly (2 rows x 2 columns) in the main body 20 along the XY directions. The accommodating holes 24 include a first accommodating hole 24a and a second accommodating hole 24b. In the following description, when the accommodating holes 24 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0031] The first accommodating hole 24a accommodates a corresponding individual heating mold 30 (described later). The first accommodating hole 24a is formed by the first through hole 21c and the third through hole 23c. That is, the first accommodating hole 24a opens to the upper surface 20a (upper surface 21a) and the lower surface 23b. The shape of the first accommodating hole 24a is a rectangular cylinder extending along the XY direction when viewed from above.

[0032] The second accommodating hole 24b accommodates a corresponding individual shaft die 35 (described later). The second accommodating hole 24b is formed by the second through hole 22c. That is, the second accommodating hole 24b is open to the upper surface 22a and the lower surface 22b. The second accommodating hole 24b has a cylindrical shape when viewed from above. The second accommodating hole 24b is disposed adjacent to the first accommodating hole 24a below the first accommodating hole 24a and communicates with the first accommodating hole 24a. The inner diameter of the upper half of the second accommodating hole 24b is larger than the inner diameter of the lower half of the second accommodating hole 24b (i.e., the inner diameter D1 of the second through hole 22c). In the XY directions, the inner diameter (inner diameter D1) of the lower half of the second accommodating hole 24b is smaller than the length of the first accommodating hole 24a (i.e., the length L1 of the first through hole 21c).

[0033] FIG. 5 is a partially enlarged schematic cross-sectional view of the holding mold 2 taken along line BB in FIG. For the sake of convenience, the second receiving hole 24b is indicated by a two-dot chain line in this figure. In the following description, Figures 1 to 4 will be referred to together with Figure 5 as appropriate.

[0034] The bearing member 25 guides the vertical movement of the individual shaft mold 35. The bearing member 25 is made of, for example, metal. When viewed from above, the bearing member 25 is cylindrical. The bearing member 25 is attached (placed) in the upper half of the second accommodating hole 24b (second through hole 22c). Therefore, in the horizontal direction, the cooling path 22d is placed on the side of the bearing member 25 so as to sandwich the bearing member 25. The inner diameter D2 of the bearing member 25 is smaller than the inner diameter (inner diameter D1) of the second accommodating hole 24b. The bearing member 25 is an example of a bearing portion in the present invention.

[0035] The drawings to which reference will be made primarily in the following description are FIGS. 2 and 4. The lower cover member 26 covers the accommodation hole 24 from below. The lower cover member 26 is made of, for example, a metal (e.g., carbon steel) having high rigidity. The lower cover member 26 has a rectangular plate shape extending along the XY direction when viewed from above. The lower cover member 26 is disposed adjacent to the main body portion 20 below the main body portion 20. The lower cover member 26 is detachably attached to the main body portion 20. The lower cover member 26 has an upper surface 26a and a lower surface 26b. A sealing member (e.g., an O-ring; not shown) is disposed between the main body portion 20 and the lower cover member 26.

[0036] FIG. 6 is an exploded schematic perspective view of the lower pressure unit DP. In the following description, FIGS. 1 to 4 will be referred to together with FIG. 6 as appropriate.

[0037] The individual heating units 3 heat the corresponding workpieces W when pressure is applied to the workpieces W. The individual heating units 3 are housed in the corresponding housing holes 24 and are movable vertically relative to the holding mold 2 inside the housing holes 24. The individual heating units 3 include an individual heating mold 30, an individual shaft mold 35, an individual heat insulating member 36, a heater 37, and a temperature sensor 38. In the following description, when the individual heating units 3 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0038] The individual heating molds 30 include corresponding heaters 37 and temperature sensors 38. The individual heating molds 30 are made of, for example, a metal having high rigidity (e.g., carbon steel). The shape of the individual heating molds 30 is a rectangular parallelepiped along the XY axis direction when viewed from above and below. The individual heating molds 30 have an upper surface 30a, a lower surface 30b, a first insertion hole 30c, and a second insertion hole 30d. In the XY direction, the length L2 of the individual heating mold 30 is shorter than the length L1 of the first receiving hole 24a. In the following description, when the individual heating molds 30 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0039] The first insertion hole 30c is a blind hole into which the heater 37 is inserted. The first insertion hole 30c has a cylindrical shape extending in the vertical direction. The first insertion hole 30c is disposed inside the individual heating mold 30 and opens to the center of the lower surface 30b.

[0040] The second insertion hole 30d is a blind hole into which the temperature sensor 38 is inserted. The second insertion hole 30d has a thin cylindrical shape extending in the vertical direction. The second insertion hole 30d is disposed inside the individual heating mold 30 and opens to the lower surface 30b.

[0041] The individual axial mold 35 guides the vertical movement of the corresponding individual heating mold 30 relative to the holding mold 2. The individual axial mold 35 is made of, for example, a metal (e.g., carbon steel) having high rigidity. The individual axial mold 35 is cylindrical with a rectangular plate-shaped flange portion 35d at its upper end. In the XY directions, the length (outer diameter D3) of the individual axial mold 35 is smaller than the length L2 of the individual heating mold 30 and slightly smaller than the length (inner diameter D2) of the bearing member 25. The individual axial mold 35 has an upper surface 35a, a lower surface 35b, an outer peripheral surface 35c, a flange portion 35d, a wiring path 35e, and an individual cooling path 35f. In the following description, when the individual axial molds 35 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0042] The outer peripheral surface 35c has a cylindrical shape, and the upper end of the outer peripheral surface 35c projects radially outward in a ring shape to form a flange portion 35d.

[0043] The wiring path 35e is a through hole through which a signal line and a power supply line (both of which will be described later) are arranged. The wiring path 35e is open to the upper surface 35a and the outer peripheral surface 35c.

[0044] The individual cooling passage 35f is, for example, a tubular passage through which a refrigerant flows. The refrigerant is cooled by a cooling device and circulated between the individual cooling passage 35f and the cooling device via the connecting cooling passage 5. The individual cooling passage 35f is contained within the individual shaft mold 35. The individual cooling passage 35f is arranged so that the entire individual shaft mold 35 is cooled approximately evenly by the refrigerant. The individual cooling passage 35f includes an inlet 35g through which the refrigerant flows and an outlet 35h through which the refrigerant flows. The inlet 35g and the outlet 35h are arranged side by side on the outer circumferential surface 35c. The refrigerant flowing through the individual cooling passage 35f is an example of the second refrigerant of the present invention. This refrigerant is, for example, the same as the refrigerant flowing through the cooling passage 22d.

[0045] The individual heat insulating members 36 suppress heat conduction between the individual heating molds 30 and the individual shaft molds 35. The shape of the individual heat insulating members 36 is, for example, a rectangular plate along the XY direction when viewed from above. The individual heat insulating members 36 are made of, for example, a known hard heat insulating material. In the XY direction, the length of the individual heat insulating members 36 is the same as the length L2 of the individual heating mold 30. In the up-down direction, the sum of the lengths of the individual heating mold 30 and the individual heat insulating members 36 is shorter than the length of the first accommodating holes 24a. The individual heat insulating members 36 have an upper surface 36a, a lower surface 36b, and through holes 36c. In the following description, when the individual heat insulating members 36 are to be particularly distinguished from one another, the suffixes "1" to "4" are added to their names.

[0046] The through-hole 36c is a through-hole that passes through the individual heat insulating member 36 in the vertical direction. When viewed from above, the through-hole 36c is disposed in the center of the individual heat insulating member 36.

[0047] The heaters 37 heat the corresponding workpieces W through the individual heating molds 30. The heaters 37 are, for example, known straight tube heaters. The heaters 37 are removably inserted into the first insertion holes 30c. The power supply wires (not shown) of the heaters 37 are routed through the through holes 36c, the wiring paths 35e, and the wiring paths 22f. In the following description, when the heaters 37 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0048] The temperature sensors 38 detect the temperatures of the corresponding individual heating molds 30. The temperature sensors 38 are, for example, known thermocouples. The temperature sensors 38 are removably inserted into the second insertion holes 30d. The signal wires (not shown) of the temperature sensors 38 are wired through the through holes 36c, the wiring paths 35e, and the wiring paths 22f. In the following description, when the temperature sensors 38 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0049] The individual heat insulating member 36 is disposed below and adjacent to the individual heating mold 30. The individual axial mold 35 is disposed below and adjacent to the individual heat insulating member 36. That is, the individual heat insulating member 36 is disposed between the individual heating mold 30 and the individual axial mold 35. The individual heating mold 30, the individual axial mold 35, and the individual heat insulating member 36 are fixed together by, for example, bolts (not shown) inserted into the flange portions 35d, forming a single individual heating unit 3. That is, the individual heating mold 30, the individual axial mold 35, and the individual heat insulating member 36 can be separated by removing the bolts. As a result, the heater 37 and the temperature sensor 38 can be replaced.

[0050] As described above, the individual heating units 3 are accommodated in the corresponding accommodation holes 24. In the accommodation holes 24, the individual heating molds 30 and the individual heat insulating members 36 are accommodated in the first accommodation holes 24a. In the vertical direction, the position of the upper surface 30a is the same as the positions of the upper surfaces 20a and 21a. The upper end portion (flange portion 35d) of the individual shaft mold 35 is accommodated in the first accommodation hole 24a. The remaining portion of the individual shaft mold 35 is accommodated in the second accommodation hole 24b. In the vertical direction, the lower surface 36b is spaced from the upper surface 22a. In the horizontal direction, the bearing member 25 is arranged to the side of the outer circumferential surface 35c. In the horizontal direction, the cooling path 22d is arranged to the side of the bearing member 25. In the XY directions (horizontal directions), the distance D11 between the bearing member 25 and the individual shaft mold 35 is smaller than the distance D12 between the first accommodating hole 24a and the individual heating mold 30 and the distance D13 between the second accommodating hole 24b and the individual shaft mold 35. In other words, of the gaps formed between the holding mold 2 and the individual heating unit 3 in the horizontal direction, the gap formed between the bearing member 25 and the individual shaft mold 35 is the narrowest.

[0051] The load sensors 4 detect the load applied to the corresponding individual heating units 3 from the upper pressure units UP. The load sensors 4 are, for example, known compression-type load cells. The load sensors 4 are housed in the corresponding housing holes 24 and attached to the upper surface 26a of the lower cover member 26. The load sensors 4 support the corresponding individual heating units 3 from below. The signal lines (not shown) of the load sensors 4 are routed, for example, to the piping 22e. In the following description, when the load sensors 4 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of their names.

[0052] The connection cooling path 5 is a flow path through which the refrigerant flows into the individual cooling path 35f and flows out of the individual cooling path 35f. The connection cooling path 5 is connected between the individual cooling path 35f and the cooling device. The connection cooling path 5 includes an inflow path 5a and an outflow path 5b. In the following description, when the connection cooling paths 5 are to be particularly distinguished from one another, the numbers "1" to "4" are added to the end of these.

[0053] The inlet passage 5a is connected to the inlet 35g of the corresponding individual cooling passage 35f. The outlet passage 5b is connected to the outlet 35h of the corresponding individual cooling passage 35f. The inlet passage 5a and the outlet passage 5b are piped to the piping passage 22e. The inlet passage 5a and the outlet passage 5b do not abut the piping passage 22e. An end 50c of the inlet 35g side of the inlet passage 5a and an end 51d of the outlet passage 5b on the outlet 35h side are not held by the holding mold 2, and can move (swing) up and down in response to the up and down movement of the individual heating unit 3.

[0054] Here, among the first through hole 21c, the second through hole 22c, the third through hole 23c, the accommodating hole 24, the individual heating unit 3, the individual heating mold 30, the individual shaft mold 35, the individual heat insulating member 36, the heater 37, the temperature sensor 38, the load sensor 4, and the connecting cooling path 5, components with the same reference numerals for distinction correspond to each other. That is, for example, the first through hole 21c1, the second through hole 22c1, the third through hole 23c1, the accommodating hole 241, the individual heating unit 31, the load sensor 41, and the connecting cooling path 51 correspond to each other. The first through hole 21c1, the second through hole 22c1, and the third through hole 23c1 form the accommodating hole 241. The individual heating unit 31 is accommodated in the accommodating hole 241. The individual heating unit 31 includes an individual heating mold 301, an individual shaft mold 351, an individual heat insulating member 361, a heater 371, and a temperature sensor 381. The temperature sensor 381 measures the temperature of the individual heating mold 301. The load sensor 41 is disposed below the individual heating unit 31 and supports the individual heating unit 31 from below. The connection cooling path 51 is connected to the individual cooling path 35f of the individual heating unit 31. When pressure is applied to the workpiece W, the individual heating unit 31 presses the corresponding load sensor 41 (strain element) and moves slightly downward relative to the holding mold 2. When pressure is applied to the workpiece W, the individual heating unit 31 releases the pressure on the corresponding load sensor 41. At this time, the individual heating unit 31 moves slightly upward relative to the holding mold 2 (returning to its original position) due to the restoring force of the load sensor 41 (e.g., the restoring force of the support structure of the strain element).

[0055] The base 6 supports the mold 7, the side unit 8, and the support unit 9. The base 6 has a rectangular parallelepiped shape aligned along the XY direction when viewed from above and below.

[0056] The mold 7 applies pressure to the workpiece W via the pressure pad 11 by applying pressure downward with the pressure pad 11. The mold 7 is made of, for example, a metal having high rigidity (for example, carbon steel). The mold 7 has a rectangular parallelepiped shape aligned with the XY direction when viewed from above and below. The mold 7 is attached to the underside of the base 6.

[0057] In the present invention, the mold 7 may be molded integrally with the base 6.

[0058] The side unit 8, together with the holding die 2 and the base 6, forms a space (hereinafter referred to as the "accommodation chamber R"; see Figure 7; the same applies below) in which the workpiece W is accommodated when pressure is applied to the workpiece W. The side unit 8 is arranged below the base 6. The side unit 8 has an exhaust hole 8a. The shape of the side unit 8 is a double rectangular cylinder aligned along the XY direction when viewed from the top and bottom. The side unit 8 is attached to the underside of the base 6. In the horizontal direction, the side unit 8 is arranged so as to surround the die 7 and the support unit 9. The exhaust hole 8a is a through hole that passes through the side unit 8.

[0059] The support unit 9 is disposed below the base 6. The support unit 9 includes a support member 90 and a plurality of spring members 91.

[0060] The support member 90 supports the frame member 10. The support member 90 has a rectangular frame shape along the XY direction when viewed from the top and bottom. In the horizontal direction, the support member 90 is disposed on the side of the mold 7 so as to surround the mold 7.

[0061] The spring member 91 is attached to the base 6 and the support member 90, and supports the support member 90 so that the support member 90 can move vertically relative to the mold 7. The spring member 91 is, for example, a known coil spring.

[0062] The frame member 10 holds the pressure pad 11. The frame member 10 is made of, for example, a metal having high rigidity (for example, stainless steel). When viewed from the top-bottom direction, the frame member 10 has a rectangular frame shape that is aligned with the XY axis direction. In the top-bottom direction, the frame member 10 is located below the mold 7. The frame member 10 is supported by the base 6 via a support unit 9 so as to be movable relative to the mold 7 in the top-bottom direction.

[0063] When pressure is applied to the workpiece W, the pressure pad 11 deforms to follow the shape of the surface of the workpiece W, thereby applying uniform pressure to the workpiece W. The pressure pad 11 is held by a frame member 10 and is disposed below the mold 7. The pressure pad 11 includes an elastic body 11a and two film members 11b and 11c.

[0064] When the workpiece W is pressurized, the elastic body 11a uniformly transmits the pressure from the mold 7 to the workpiece W. The elastic body 11a is made of, for example, a known elastic material having high fluidity and low impact elasticity. The outer edges of the membrane members 11b and 11c are held so as to be sandwiched between the frame member 10 along their entire periphery. The elastic body 11a is filled between the membrane members 11b and 11c, which are arranged above and below the elastic body 11a. As a result, the elastic body 11a is surrounded by the frame member 10 in the horizontal direction.

[0065] The lifting device 12 lifts and lowers the base 6. The lifting device 12 is, for example, a known hydraulic cylinder.

[0066] The control device 13 controls the overall operation of the device 1. The control device 13 is realized by, for example, a PC (Personal Computer) or a PLC (Programmable Logic Controller). The control device 13 includes a control unit 13a and a storage unit 13b. The control unit 13a includes, for example, a processor such as a CPU (Central Processing Unit) 13c, a volatile memory such as a RAM (Random Access Memory) 13d that functions as a work area for the CPU 13c, and a non-volatile memory such as a ROM (Read Only Memory) 13e that stores various information such as control programs. The control unit 13a includes a correction unit 13f.

[0067] The storage unit 13b stores information necessary for the operation of the device 1, the temperature detection result of the temperature sensor 38, and the load detection result of the load sensor 4.

[0068] The correction unit 13f corrects the load detection result of the load sensor 4 based on the temperature detection result of the temperature sensor 38. The specific operation of the correction unit 13f will be described later.

[0069] The pump P reduces the pressure inside the accommodation chamber R. The pump P is a known vacuum pump. The pump P is connected to the exhaust hole 8a via a pipe.

[0070] ●Operation of pressure device Next, the following describes the operation of the device 1. In the following description, FIGS. 1 to 6 will be referred to as appropriate.

[0071] First, the workpiece W is placed on the corresponding individual heating unit 3 (upper surface 30a).

[0072] Next, the lifting device 12 lowers the upper pressurizing unit UP (pressurizing the workpiece W is started). Specifically, the lifting device 12 lowers the upper pressurizing unit UP until the side unit 8 comes into close contact with the holding mold 2. At this time, a storage chamber R for storing the workpiece W is formed between the upper pressurizing unit UP and the holding mold 2. The storage chamber R is a space surrounded by the holding mold 2, the base 6, and the side unit 8.

[0073] FIG. 7 is a schematic cross-sectional view of the device 1 showing a state after the upper pressurizing unit UP has been lowered.

[0074] Here, when the pressure application process is started, each temperature sensor 38 starts detecting (measuring) the temperature of the corresponding individual heating mold 30 (workpiece W). Each load sensor 4 starts detecting (measuring) the load applied from the corresponding individual heating unit 3. The temperature detection results and the load detection results are sent to the control device 13, associated with information indicating their respective positions (i.e., information indicating the corresponding workpiece W), and stored in the memory unit 13b.

[0075] Next, the pump P makes the atmosphere in the accommodation chamber R into a reduced pressure atmosphere.

[0076] Next, the control device 13 controls the operation of the heater 37 to heat the individual heating unit 3. As a result, the workpiece W is heated to a predetermined heating temperature (for example, 230°C).

[0077] When the workpiece W is heated, the temperature of the heater 37 is controlled based on the temperature measurement results of the corresponding temperature sensor 38. In the present apparatus 1, a heater 37 and a temperature sensor 38 are provided for each corresponding workpiece W. That is, the temperature of the heater 37 can be adjusted for each workpiece W. Therefore, in the present apparatus 1, the variation in temperature applied to each workpiece W is extremely small. That is, the variation in temperature between the workpieces W in the present apparatus 1 is suppressed compared to a conventional pressure device (hereinafter referred to as the "conventional device") that heats multiple workpieces W using a single mold.

[0078] Furthermore, when the workpiece W is heated, the individual heating mold 30 is heated to a predetermined heating temperature. The heat from the individual heating mold 30 is conducted to the individual axial mold 35 via the individual insulating member 36. The heat conduction is suppressed by the individual insulating member 36. However, when the temperature of the individual heating mold 30 is high, the heat conduction suppression effect of the individual insulating member 36 is overcome, and a relatively large amount of heat may be conducted to the individual axial mold 35. As described above, the individual axial mold 35 is provided with the individual cooling path 35f. Therefore, the individual axial mold 35 is cooled by heat exchange between the individual axial mold 35 and the refrigerant flowing through the individual cooling path 35f. As a result, the individual axial mold 35 is cooled to the guaranteed operating temperature of the load sensor 4. Therefore, the load sensor 4 can accurately detect the load applied to the individual heating unit 3 without being affected by heat from the individual heating mold 30. Furthermore, thermal expansion of the individual axial mold 35 is suppressed.

[0079] Heat from the individual heating mold 30 is radiated horizontally and is also transmitted to the first body portion 21. The heat from the first body portion 21 is conducted to the second body portion 22 via the body insulating member 23. This heat conduction is suppressed by the body insulating member 23. However, when the temperature of the individual heating mold 30 is high, a relatively large amount of heat may be conducted to the second body portion 22, as with the individual shaft mold 35. As described above, the second body portion 22 is provided with the cooling path 22d. Therefore, heat is exchanged between the second body portion 22 and the refrigerant flowing through the cooling path 22d, and the second body portion 22 is cooled. In the horizontal direction, the cooling path 22d is disposed to the side of the bearing member 25. Therefore, the bearing member 25 is preferentially cooled within the holding mold 2. As a result, the thermal expansion of the bearing member 25 is particularly suppressed within the holding mold 2.

[0080] Next, the lifting device 12 lowers the base 6 until a specified pressure (for example, 10 MPa to 20 MPa, hereinafter referred to as "specified pressure") is applied to the workpiece W. At this time, the mold 7 descends relative to the frame member 10. As a result, the mold 7 presses the pressure pad 11 downward, and the pressure pad 11 deforms to follow the shape of the surface of the workpiece W, applying uniform pressure to the workpiece W. As a result, the workpiece W is uniformly pressurized from all directions (multi-directions). Pressurization of the workpiece W can be performed during or after the temperature of the workpiece W has been raised.

[0081] FIG. 8 is a schematic cross-sectional view of the present device 1, showing a state in which a pressure treatment is being performed. FIG. 9 is a partially enlarged schematic cross-sectional view of the part C of the device 1 in FIG.

[0082] When pressure is applied to the workpiece W, the workpiece W and the individual heating unit 3 move slightly downward relative to the holding die 2 in response to elastic deformation of a portion of the load sensor 4 (the support structure for the strain body). At this time, the movement of the individual heating unit 3 is guided by the bearing member 25 and the individual shaft die 35. As described above, of the gaps formed between the holding die 2 and the individual heating unit 3 in the horizontal direction, the gap formed between the bearing member 25 and the individual shaft die 35 is the narrowest. Furthermore, because the bearing member 25 and the individual shaft die 35 are cooled, their thermal expansion is suppressed. Therefore, the individual shaft die 35 can move vertically so as to slide relative to the bearing member 25. As a result, the individual shaft die 35 moves approximately parallel to the vertical direction. In other words, the individual heating unit 3 moves accurately in the vertical direction. Therefore, a vertical load is applied from the individual heating unit 3 to the load sensor 4. The load sensor 4 can accurately detect the load applied to the individual heating unit 3. Furthermore, when the individual heating unit 3 descends, the ends 5c and 5d of the connecting cooling path 5 also descend accordingly. As described above, the ends 5c and 5d are not fixed to the holding mold 2. Therefore, the mechanical load applied to the connection portions between the ends 5c and 5d and the inlet 35g and outlet 35h is reduced.

[0083] Next, after a predetermined time has elapsed, the lifting device 12 raises the base 6 to finish applying pressure to the workpiece W. Next, the workpiece W is cooled in the storage chamber R to a temperature (for example, about 100°C or lower) at which it can be removed.

[0084] Next, the control device 13 stops the pump P and purges the storage chamber R with inert gas. Next, the lifting device 12 raises the upper pressurizing unit UP. At this time, the workpiece W is removed from the storage chamber R. When the upper pressurizing unit UP has finished raising, the pressurizing process for the workpiece W ends. The temperature detection results and load detection results sent to the control device 13 from the start to the end of the pressurizing process are associated with information indicating the corresponding workpiece W and stored in the memory unit 13b. As a result, the user of the device 1 can track the temperature and load applied to each workpiece W from the start to the end of the pressurizing process based on the information stored in the memory unit 13b. In other words, the device 1 can ensure the traceability of the temperature and load for each workpiece W.

[0085] When the heat applied to the workpiece W during the pressure treatment is high enough to exceed the cooling capacity of the individual cooling path 35f, the correction unit 13f corrects the load detection result based on the temperature detection result and the correction information. As a result, the device 1 can obtain accurate load detection results even when performing pressure treatment on the workpiece W at high temperatures.

[0086] The "correction information" is information that the correction unit 13f uses to correct the load detection result together with the temperature detection result. The correction information is, for example, information that indicates the correlation between the temperature of the individual heating mold 30 and the temperature of the lower surface 35b of the individual shaft mold 35. The correction information is measured in advance and is stored in the ROM 13e together with, for example, a temperature correction program.

[0087] In the present invention, the correction information is not limited to information indicating a correlation. For example, the correction information may be a function that obtains a corrected load detection result by inputting a temperature detection result.

[0088] Summary According to the embodiment described above, the apparatus 1 includes an upper pressure applying unit UP, a holding mold 2, multiple individual heating units 3, and multiple load sensors 4. Each load sensor 4 detects the load applied to the corresponding individual heating unit 3 from the upper pressure applying unit UP. Each individual heating unit 3 is vertically movable relative to the holding mold 2. Each individual heating unit 3 includes an individual heating mold 30, an individual shaft mold 35, a heater 37, and a temperature sensor 38. The temperature sensor 38 is housed within the individual heating mold 30 and detects the temperature of the individual heating mold 30. The individual shaft mold 35 is disposed below the individual heating mold 30 and guides the vertical movement of the individual heating mold 30 relative to the holding mold 2. With this configuration, the temperature sensor 38 can detect the temperature applied to the corresponding workpiece W. Furthermore, because the vertical movement of the individual heating mold 30 is guided, the load sensor 4 can accurately detect the load applied to the individual heating unit 3, i.e., the load applied to the corresponding workpiece W. Therefore, the present device 1 can ensure the traceability of the temperature and load for each workpiece W.

[0089] Furthermore, according to the embodiment described above, the holding mold 2 includes a plurality of accommodating holes 24 and bearing members 25. The accommodating holes 24 include a first accommodating hole 24a and a second accommodating hole 24b, which accommodate the individual heating units 3, respectively. The bearing members 25 are disposed in the second accommodating hole 24b and guide the vertical movement of the individual shaft mold 35. The first accommodating hole 24a accommodates the individual heating mold 30, and the second accommodating hole 24b accommodates the individual shaft mold 35. In the horizontal direction, the distance D13 between the bearing members 25 and the individual shaft mold 35 is narrower than the distance D11 between the first accommodating hole 24a and the individual heating mold 30 and the distance D12 between the second accommodating hole 24b and the individual shaft mold 35. With this configuration, the individual heating units 3 move vertically accurately. Therefore, the load sensor 4 can accurately detect the load applied to the individual heating units 3.

[0090] Furthermore, according to the embodiment described above, the holding mold 2 includes a main body 20 and a cooling passage 22d. The main body 20 defines the accommodation hole 24 in the horizontal direction. The cooling passage 22d is contained within the main body 20, and a refrigerant for cooling the main body 20 flows through the cooling passage 22d. In the horizontal direction, the cooling passage 22d is disposed to the side of the bearing member 25. With this configuration, the bearing member 25 is cooled preferentially, even within the holding mold 2. As a result, the thermal expansion of the bearing member 25 is particularly suppressed, even within the holding mold 2. Therefore, the bearing member 25 does not hinder the vertical movement of the individual heating unit 3. Therefore, the load sensor 4 can more accurately detect the load applied to the individual heating unit 3.

[0091] Furthermore, according to the embodiment described above, the cooling passages 22d are arranged so as to sandwich the second accommodating hole 24b in the horizontal direction. With this configuration, the cooling performance of the bearing member 25 by the cooling passages 22d is improved.

[0092] Furthermore, according to the embodiment described above, each individual heating unit 3 includes an individual heat insulating member 36 disposed between the individual heating mold 30 and the individual axial mold 35. The individual heating mold 30, the individual axial mold 35, and the individual heat insulating member 36 are separable from one another. According to this configuration, the individual heat insulating member 36 suppresses heat conduction to the individual axial mold 35. Therefore, heat conduction from the individual axial mold 35 to the load sensor 4 is also suppressed. As a result, the load sensor 4 can more accurately detect the load applied to the individual heating unit 3.

[0093] Furthermore, according to the embodiment described above, each individual heating unit 3 is provided with an individual cooling path 35f. The individual cooling path 35f is contained within the individual shaft mold 35, and a refrigerant for cooling the individual shaft mold 35 flows through the individual cooling path 35f. With this configuration, the individual shaft mold 35 is cooled by heat exchange between the individual shaft mold 35 and the refrigerant flowing through the individual cooling path 35f. As a result, the individual shaft mold 35 is cooled to within the guaranteed temperature of the load sensor 4. Therefore, the load sensor 4 is not affected by heat from the individual heating mold 30. Furthermore, thermal expansion of the individual shaft mold 35 is suppressed, and the individual shaft mold 35 does not hinder the vertical movement of the individual heating unit 3. Therefore, the load sensor 4 can more accurately detect the load applied to the individual heating unit 3.

[0094] Furthermore, according to the embodiment described above, the apparatus 1 includes a plurality of connecting cooling paths 5 through which a refrigerant flows. The connecting cooling paths 5 are connected to corresponding individual cooling paths 35f. The individual cooling paths 35f include an inlet 35g through which the refrigerant flows and an outlet 35h through which the refrigerant flows. Each connecting cooling path 5 includes an inlet 5a connected to the corresponding inlet 35g and an outlet 5b connected to the corresponding outlet 35h. The ends 5c and 5d of the inlet path 5a are arranged inside the holding mold 2 so as to be movable in the vertical direction. With this configuration, the ends 5c and 5d move up and down in accordance with the vertical movement of the individual heating unit 3 due to the presence or absence of a load. Therefore, the mechanical load applied to the connections between the ends 5c and 5d and the inlet 35g and outlet 35h is reduced.

[0095] Furthermore, according to the embodiment described above, the holding mold 2 includes the first body portion 21, the second body portion 22, and the body insulating member 23. The body insulating member 23 is disposed between the first body portion 21 and the second body portion 22. With this configuration, even if the first body portion 21 is heated by heat radiated from the individually heated mold 30, the conduction of heat from the first body portion 21 to the second body portion 22 is suppressed by the body insulating member 23. As a result, the second body portion 22 in which the bearing member 25 is disposed is less likely to be heated, and thermal expansion of the bearing member 25 is suppressed.

[0096] Furthermore, according to the embodiment described above, the holding mold 2 includes a main body 20 and a lower cover member 26. The lower cover member 26 is detachably attached to the main body 20. According to this configuration, the load sensor 4 can be easily replaced by removing the lower cover member 26 from the main body 20.

[0097] Furthermore, according to the embodiment described above, the device 1 includes a memory unit 13b. The memory unit 13b stores the load detection results of the load sensor 4 and the temperature detection results of the temperature sensor 38 in association with each piece of information indicating the corresponding workpiece W. With this configuration, the user of the device 1 can track the temperature and load applied to the workpiece W by referring to the information stored in the memory unit 13b. In other words, the device 1 can ensure the traceability of the temperature and load for each workpiece W by itself.

[0098] Furthermore, according to the embodiment described above, the apparatus 1 includes a correction unit 13f. The correction unit 13f corrects the load detection result of the load sensor 4 based on the temperature detection result of the temperature sensor 38. With this configuration, the apparatus 1 can obtain accurate load detection results even when performing pressure treatment on the workpiece W at high temperatures.

[0099] ●Other embodiments● In the present invention, when the temperature of the pressure treatment is low, the main body 20 does not need to include the main body heat insulating member 23.

[0100] In the present invention, when the temperature of the pressure treatment is low, the second main body portion 22 does not need to be provided with the cooling path 22d.

[0101] Furthermore, in the present invention, the cooling path 22d does not have to be disposed on the side of the bearing member 25 in the horizontal direction, as long as the bearing member 25 is appropriately cooled.

[0102] Furthermore, in the present invention, cooling path 22d does not have to be arranged so as to sandwich second accommodating hole 24b therebetween. That is, for example, cooling path 22d may be arranged only to the side of second accommodating hole 24b in the +X-axis direction or the −X-axis direction.

[0103] Furthermore, in the present invention, it is only necessary that the end portions 5c and 5d are movable in the vertical direction, and the piping path 22e does not have to open to the side surface of the second main body portion 22. In this case, the portion of the connection cooling path 5 that is closer to the side surface of the second main body portion 22 than the end portions 5c and 5d may be supported by the holding mold 2.

[0104] Furthermore, in the present invention, the second main body portion 22 does not necessarily have to include the wiring path 22f. In this case, the signal line and the power supply line may be routed in, for example, the piping path 22e.

[0105] Furthermore, in the present invention, the shape of the accommodating hole 24 may be determined according to the shape of the individual heating unit 3, and is not limited to the shapes in the above-described embodiment. That is, for example, the shape of the first accommodating hole 24a may be cylindrical when viewed from above.

[0106] Furthermore, in the present invention, the holding mold 2 does not necessarily have to include the bearing member 25. In this case, the upper half of the second accommodating hole 24b may function as the bearing member 25. That is, for example, the inner diameter of the upper half is smaller than the inner diameter of the lower half. In the horizontal direction, the distance between the upper half and the individual shaft mold 35 is smaller than the distances D12 and D13.

[0107] Furthermore, in the present invention, the number of the receiving holes 24 and the individual heating units 3 is not limited to "four".

[0108] Furthermore, in the present invention, the holding mold 2 does not necessarily have to include the lower cover member 26. That is, for example, the main body 20 and the lower cover member 26 may have a seamless, integrated structure.

[0109] Furthermore, in the present invention, when the temperature of the pressure treatment is low, the individual heating unit 3 does not need to be provided with the individual heat insulating member 36 .

[0110] Furthermore, in the present invention, the shape of the individual heating unit 3 is not limited to the shapes of the embodiments described above. That is, for example, the shape of the individual heating mold 30 may be cylindrical when viewed from above.

[0111] Furthermore, in the present invention, when the temperature of the pressure treatment is low, the individual shaft mold 35 does not need to be provided with the individual cooling passage 35f. In this case, the present apparatus 1 does not need to be provided with the connecting cooling passage 5 either.

[0112] Furthermore, in the present invention, the heater 37 may be configured integrally with the temperature sensor 38. In this case, the temperature sensor 38 detects the temperature of the heater 37.

[0113] Furthermore, in the present invention, the heater 37 is not limited to a known straight tube heater as long as it can heat the corresponding workpiece W to a predetermined heating temperature. That is, for example, the heater 37 may be a tube through which heated oil flows.

[0114] Furthermore, in the present invention, the temperature sensor 38 is not limited to a thermocouple as long as it can detect the temperature of the individual heating mold 30 or the heater 37 .

[0115] Furthermore, in the present invention, the load sensor 4 is not limited to a load cell as long as it can detect the load applied to the individual heating unit 3.

[0116] Furthermore, in the present invention, a portion of the connection cooling passage 5 may be supported by the holding mold 2. That is, for example, the piping passage 22e may not open to the side surface of the main body portion 20, and a portion of the connection cooling passage 5 may be inserted into the main body portion 20.

[0117] Furthermore, in the present invention, the configuration of the upper pressurizing unit UP is not limited to the configuration of the embodiment described above. That is, for example, the upper pressurizing unit UP may not be provided with the pressurizing pad 11, and may be configured to pressurize the workpieces W collectively using the molds 7. Also, for example, the upper pressurizing unit UP may be configured to pressurize the workpieces W individually and collectively using multiple molds 7 corresponding to the workpieces W.

[0118] Furthermore, in the present invention, the device 1 does not necessarily have to include the correction unit 13f.

[0119] Furthermore, in the present invention, the device 1 does not necessarily have to include the storage unit 13b. In this case, the temperature detection results and the load detection results are stored in a storage device connected to the device 1, for example.

[0120] Furthermore, in the present invention, each workpiece W may be individually heated at a different temperature.

[0121] Furthermore, in the present invention, the atmosphere in the pressure treatment of the present apparatus 1 is not limited to a reduced pressure atmosphere. That is, for example, the atmosphere in the pressure treatment of the present apparatus 1 may be air or an inert gas atmosphere.

[0122] ●Embodiments of the present invention● Next, embodiments of the present invention that can be understood from the above-described embodiments will be described below, using the terms and symbols described in the embodiments.

[0123] A first embodiment of the present invention is a pressure device (for example, pressure device 1) that pressurizes a plurality of workpieces (for example, workpieces W), and includes an upper pressure unit (for example, upper pressure unit UP) that is arranged above each of the workpieces and can pressurize each of the workpieces, a plurality of individual heating units (for example, individual heating units 3) that are arranged below each of the workpieces and can heat the corresponding workpieces, a holding mold (for example, holding mold 2) that holds the individual heating units, and a plurality of load sensors (for example, load sensor 4) that are housed in the holding mold, and each of the load sensors is connected to the corresponding individual heating unit. The pressure device detects the load applied to the workpiece from the upper pressure unit, and each of the individual heating units is movable vertically relative to the holding mold, and is equipped with a heater (e.g., heater 37) that heats the corresponding workpiece, an individual heating mold (e.g., individual heating mold 30) that contains the heater, a temperature sensor (e.g., temperature sensor 38) that is contained in the individual heating mold and detects the temperature of the heater or the individual heating mold, and an individual axial mold (e.g., individual axial mold 35) that is arranged below the individual heating mold and guides the vertical movement of the individual heating mold relative to the holding mold. With this configuration, the device can ensure the traceability of the temperature and load for each workpiece.

[0124] A second embodiment of the present invention is a pressure device in which, in the first embodiment, the holding mold has a plurality of accommodating holes (e.g., accommodating holes 24) that accommodate each of the individual heating units, and a bearing portion (e.g., bearing member 25) that guides the vertical movement of the individual shaft mold, and the accommodating holes have a first accommodating hole (e.g., first accommodating hole 24a) in which the individual heating mold is accommodated, and a second accommodating hole (e.g., second accommodating hole 24b) in which the individual shaft mold is accommodated, and the bearing portion is arranged in the second accommodating hole, and in the horizontal direction, the distance between the individual shaft mold and the bearing portion (e.g., distance D11) is narrower than the distance between the individual heating mold and the first accommodating hole (e.g., distance D12) and the distance between the individual shaft mold and the second accommodating hole (e.g., distance D13). With this configuration, the load sensor can accurately detect the load applied to the individual heating unit.

[0125] A third embodiment of the present invention is a pressurizing device in which, in the second embodiment, the holding mold comprises a main body portion (e.g., main body portion 20) that defines the accommodating hole, and a holding cooling path (e.g., cooling path 22d) that is contained in the main body portion and through which a first refrigerant flows to cool the main body portion, and in the horizontal direction, the holding cooling path is arranged to the side of the bearing portion. With this configuration, the load sensor can more accurately detect the load applied to the individual heating unit.

[0126] A fourth embodiment of the present invention is the pressurizing device of the third embodiment, wherein the holding and cooling paths are arranged so as to sandwich the second accommodating hole in the horizontal direction. According to this configuration, the cooling performance of the cooling passage for the bearing member is improved.

[0127] A fifth embodiment of the present invention is a pressure applying device in which, in the first embodiment, the individual shaft mold and the individual heated mold are separable, and each of the individual heating units is provided with an individual insulating member (e.g., individual insulating member 36) arranged between the individual heated mold and the individual shaft mold. With this configuration, the load sensor can more accurately detect the load applied to the individual heating unit.

[0128] A sixth embodiment of the present invention is a pressurizing device in the fifth embodiment, wherein each of the individual heating units is included in the individual shaft mold and is provided with an individual cooling path (e.g., individual cooling path 35f) through which a second refrigerant flows to cool the individual shaft mold. With this configuration, the load sensor can more accurately detect the load applied to the individual heating unit.

[0129] A seventh embodiment of the present invention is a pressurizing device according to the sixth embodiment, comprising a plurality of connecting cooling paths (e.g., connecting cooling paths 5) through which the second refrigerant flows and which are connected to the corresponding individual cooling paths, wherein the individual cooling paths have an inlet (e.g., inlet 35g) through which the second refrigerant flows and an outlet (e.g., outlet 35h) through which the second refrigerant flows, and each connecting cooling path has an inlet path (e.g., inlet path 5a) connected to the corresponding inlet and an outlet path (e.g., outlet path 5b) connected to the corresponding outlet, and an end portion (e.g., end 5c) of the inlet path on the inlet side and an end portion (e.g., end 5d) of the outlet path on the outlet side are arranged inside the holding mold so as to be movable in the vertical direction. This configuration reduces the mechanical load applied to the connection between the end and the inlet and outlet.

[0130] An eighth embodiment of the present invention is a pressure applying device in which, in the second embodiment, the holding mold comprises a first main body portion (e.g., first main body portion 21) that defines the first accommodating hole, a second main body portion (e.g., second main body portion 22) that defines the second accommodating hole, and a main body insulating member (e.g., main body insulating member 23) that is arranged between the first main body portion and the second main body portion. According to this configuration, the thermal expansion of the bearing member is suppressed.

[0131] A ninth embodiment of the present invention is a pressure applying device in the second embodiment, wherein the holding mold comprises a main body portion (e.g., main body portion 20) that defines the accommodating hole and a lower cover member (e.g., lower cover member 26) that covers the accommodating hole from below, and the lower cover member is removably attached to the main body portion. According to this configuration, the load sensor can be easily replaced.

[0132] A tenth embodiment of the present invention is a pressure device comprising, in the first embodiment, a memory unit (e.g., memory unit 13b) that stores the load detection results of the load sensor and the temperature detection results of the temperature sensor in association with information indicating the corresponding work. According to this configuration, the device can ensure the traceability of the temperature and load for each workpiece W by itself.

[0133] A second embodiment of the present invention is a pressure device according to the first embodiment, which includes a correction unit (e.g., correction unit 13f) that corrects the load detection result of the load sensor based on the temperature detection result of the temperature sensor. With this configuration, the device can obtain accurate load detection results even when a workpiece is subjected to high-temperature pressure treatment. [Explanation of symbols]

[0134] 1. Pressure device 2. Holding mold 13b Storage section 13f correction section 20 Main body 21 First main body part 22 Second main body part 22d Cooling path (holding cooling path) 23 Main body insulation material 24 Receiving hole 24a First storage hole 24b Second storage hole 25 Bearing member (bearing part) 26 Lower cover member (lower cover portion) 3 Individual heating units 30 Individually heated molds 35 Individual axis mold 35f Individual cooling path 35g inlet 35h Outlet 36 Retaining insulation member 37 Heater 38 Temperature Sensor 4 Load Sensor 5 Connecting cooling channels 5a Inlet channel 5b Outflow channel 5c end 5d end P pump UW upper pressure unit double work

Claims

1. A pressure device that applies pressure to multiple workpieces, an upper pressure unit disposed above each of the workpieces and capable of applying pressure to each of the workpieces; a plurality of individual heating units arranged below the respective workpieces and capable of heating the corresponding workpieces; a holding mold for holding the individual heating unit; a plurality of load sensors accommodated in the holding mold; and Each of the load sensors detects a load applied to the corresponding individual heating unit from the upper pressure unit, Each of the individual heating units is movable relative to the holding mold in the up and down direction, a heater for heating the corresponding workpiece; an individual heating mold containing the heater; a temperature sensor included in the individual heating mold for detecting a temperature of the heater or the individual heating mold; an individual shaft mold disposed below the individual heating mold and guiding vertical movement of the individual heating mold relative to the holding mold; Equipped with Pressure device.

2. The holding mold is a plurality of receiving holes for receiving the individual heating units; a bearing portion that guides the vertical movement of the individual shaft mold; With The receiving hole is a first receiving hole in which the individual heated mold is received; a second receiving hole in which the individual shaft mold is received; With The bearing portion is disposed in the second accommodating hole, In the horizontal direction, a distance between the individual shaft mold and the bearing portion is narrower than a distance between the individual heating mold and the first accommodating hole and a distance between the individual shaft mold and the second accommodating hole. The pressure device according to claim 1 .

3. The holding mold is a main body portion defining the receiving hole; a retention cooling path that is contained within the main body portion and through which a first refrigerant that cools the main body portion flows; With In the horizontal direction, the holding and cooling passage is disposed to the side of the bearing portion. The pressure device according to claim 2 .

4. The holding and cooling passages are arranged to sandwich the second accommodating hole in the horizontal direction. The pressure device according to claim 3 .

5. The individual shaft mold and the individual heated mold are separable, Each of the individual heating units comprises: an individual heat insulating member disposed between the individual heated mold and the individual shaft mold; Equipped with The pressure device according to claim 1 .

6. Each of the individual heating units comprises: an individual cooling path contained in the individual shaft mold and through which a second refrigerant for cooling the individual shaft mold flows; Equipped with The pressure device according to claim 5.

7. a plurality of connecting cooling passages through which the second refrigerant flows and which are connected to the corresponding individual cooling passages; and The individual cooling paths are an inlet through which the second refrigerant flows; an outlet through which the second refrigerant flows out; With Each of the connecting cooling channels comprises: an inlet channel connected to the corresponding inlet; an outlet channel connected to the corresponding outlet; With An end portion of the inlet side of the inflow path and an end portion of the outlet side of the outflow path are arranged inside the holding mold so as to be movable in the vertical direction. The pressure device according to claim 6.

8. The holding mold is a first main body portion defining the first receiving hole; a second main body portion defining the second receiving hole; a main body insulating member disposed between the first main body portion and the second main body portion; Equipped with The pressure device according to claim 2 .

9. The holding mold is a main body portion defining the receiving hole; a lower cover member that covers the receiving hole from below; With The lower cover member is detachably attached to the main body. The pressure device according to claim 2 .

10. a storage unit that stores the load detection result of the load sensor and the temperature detection result of the temperature sensor in association with each other for information indicating the corresponding workpiece; consisting of The pressure device according to claim 1 .

11. a correction unit that corrects the load detection result of the load sensor based on the temperature detection result of the temperature sensor; consisting of The pressure device according to claim 1 .

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