Heat supply device, heat supply system, and heat supply method

Abstract

A heat supply device, a heat supply system, and a heat supply method are provided that enable time restrictions on heat supply to be relaxed. [Solution] A heat dissipation section (21) of a heat supply device (11) has a heat dissipation flow path (22) through which a first gas (G1), a heat storage material (C1), and a reactant (R) can flow. The heat dissipation section (21) generates a reaction product (C2) within the heat dissipation flow path (22). A regeneration section (31) of the heat supply device (11) has a regeneration flow path (32) through which a second gas (G2) and the reaction product (C2) can flow. The regeneration section (31) desorbs the reactant (R) from the reaction product (C2) within the regeneration flow path (32). The heat dissipation section (21) includes a first separation mechanism (23) that separates the reaction product (C2) from the first gas (G1) and a first supply flow path (24) that supplies the reaction product (C2) to the regeneration flow path (32). The regeneration section (31) includes a second separation mechanism (33) that separates the heat storage material (C1) from the second gas (G2) and the reactant (R), and a second supply flow path (34) that supplies the heat storage material (C1) to the heat dissipation flow path (22).

Description

[Technical Field]

[0001] The present invention relates to a heat supply device, a heat supply system, and a heat supply method. [Background technology]

[0002] As described in Patent Document 1, a chemical heat storage device equipped with a reactor containing a chemical heat storage material can supply heat to the outside during a heat dissipation operation that utilizes an exothermic reaction between the chemical heat storage material and a reactant. After the heat dissipation operation is completed, a heat storage operation is performed that uses exhaust heat to desorb the reactant from the reaction product between the chemical heat storage material and the reactant. Such a chemical heat storage device can be used as a heat supply device that supplies heat at a temperature higher than that of the exhaust heat. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-141362 Summary of the Invention [Problem to be solved by the invention]

[0004] In a heat supply device that uses the reaction of a heat storage material such as a chemical heat storage material as described above, heat dissipation cannot be performed during the regeneration operation (heat storage operation) in which the reaction product is regenerated into a heat storage material, so there is a time limit on the supply of heat. [Means for solving the problem]

[0005] A heat supply device that solves the above problem is a heat supply device that supplies heat using a reaction between a heat storage material and a reactant, and includes a heat dissipation section that has a heat dissipation flow path through which a first gas that transports heat to be supplied to the outside, the heat storage material, and the reactant can flow, and that generates a reaction product from the heat storage material and the reactant within the heat dissipation flow path, and a regeneration section that has a regeneration flow path through which a second gas containing external exhaust heat and the reaction product can flow, and that desorbs the reactant from the reaction product within the regeneration flow path, wherein the heat dissipation section includes a first separation mechanism that separates the reaction product generated within the heat dissipation flow path from the first gas, and a first supply flow path that supplies the reaction product separated by the first separation mechanism to the regeneration flow path, and the regeneration section includes a second separation mechanism that separates the heat storage material generated within the regeneration flow path from the second gas and the reactant, and a second supply flow path that supplies the heat storage material separated by the second separation mechanism to the heat dissipation flow path.

[0006] According to this configuration, the heat dissipation unit can perform a heat dissipation operation in which a reaction product is generated from the heat storage material and the reactant in the heat dissipation flow path. The regeneration unit can perform a regeneration operation in which the reactant is desorbed from the reaction product in the regeneration flow path. The heat dissipation unit can supply the reaction product generated in the heat dissipation flow path to the regeneration flow path by the first separation mechanism and the first supply flow path. Furthermore, the regeneration unit can supply the heat storage material generated in the regeneration flow path to the heat dissipation flow path by the second separation mechanism and the second supply flow path. Therefore, the regeneration operation can be performed during the heat dissipation operation. [Effects of the Invention]

[0007] The present invention makes it possible to alleviate the time restriction on the supply of heat. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram showing a heat supply system according to an embodiment. [Figure 2] FIG. 2 is a front view showing the heat supply device. [Figure 3] FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. [Figure 5] FIG. 5 is a cross-sectional perspective view partially showing the heat supply device. [Figure 6] FIG. 6 is a schematic diagram showing a heat supply system. [Figure 7] FIG. 7 is a cross-sectional view showing a part of the heat supply system. [Figure 8] FIG. 8 is a cross-sectional view showing a heat supply device according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of a heat supply device, a heat supply system, and a heat supply method will be described. <Overall configuration of heat supply device 11> As shown in Fig. 1, the heat supply device 11 includes a heat dissipation section 21 and a regeneration section 31. The heat dissipation section 21 includes a heat dissipation flow path 22, a first separation mechanism 23, and a first supply flow path 24. The regeneration section 31 includes a regeneration flow path 32, a second separation mechanism 33, and a second supply flow path 34. The heat supply device 11 supplies heat by using a reaction between a heat storage material C1 and a reactant R. The heat supply device 11 can utilize waste heat generated in a factory or the like, for example, to supply heat at a temperature higher than that of the waste heat.

[0010] <Heat radiation part 21: Heat radiation flow path 22> The heat dissipation flow path 22 is configured to allow the flow of a first gas G1 that transports heat to the outside, the heat storage material C1, and the reactant R. The heat dissipation section 21 generates a reaction product C2 from the heat storage material C1 and the reactant R within the heat dissipation flow path 22. The heat dissipation flow path 22 is configured to allow the generated reaction product C2 to also flow.

[0011] The heat dissipation flow path 22 is supplied with a first gas G1 and a reactant R from a heat dissipation gas supply source 12 disposed outside the heat supply device 11. The heat dissipation flow path 22 is connected to a second supply flow path 34 of the regeneration unit 31.

[0012] <Heat dissipation part 21: first separation mechanism 23> The first separation mechanism 23 separates the reaction product C2 generated in the heat dissipation flow path 22 from the first gas G1. The first separation mechanism 23 has a reaction product outlet part 23a that discharges the reaction product C2 to the first supply flow path 24. The first separation mechanism 23 has a heated gas outlet part 23b that discharges the heated first gas G1. The first gas G1 discharged by the heated gas outlet part 23b can be supplied to the heating target 13 outside the heat supply device 11.

[0013] An example of the first separation mechanism 23 is a swirling flow imparting mechanism that imparts a swirling flow to the mixed fluid of the reaction product C2 and the first gas G1. The swirling flow imparting mechanism can apply centrifugal force to the reaction product C2 in the mixed fluid. That is, the swirling flow imparting mechanism can centrifuge the reaction product C2 in the mixed fluid. Examples of the swirling flow imparting mechanism include a swirler fixed to the flow path of the mixed fluid, and an injection nozzle arranged to inject the mixed fluid in a tangential direction against the inner wall of a flow path member having a cylindrical flow path.

[0014] The first separation mechanism 23 may be, for example, a filter unit that allows the first gas G1 in the mixed fluid of the reaction product C2 and the first gas G1 to pass through preferentially over the reaction product C2. Examples of the filter material that constitutes the filter unit include mesh material and nonwoven fabric. Examples of the material for the filter material include metal, glass, ceramics, and resin.

[0015] <Heat Dissipation Section 21: First Supply Flow Path 24> The first supply flow path 24 supplies the reaction product C2 separated by the first separation mechanism 23 to the regeneration flow path 32 of the regeneration section 31. The first supply flow path 24 has an inlet portion into which the reaction product C2 flows from the first separation mechanism 23, and an outlet portion connected to the regeneration flow path 32.

[0016] <Regeneration section 31: Regeneration channel 32> The regeneration flow path 32 is configured to allow the second gas G2 containing external waste heat and the reaction product C2 to flow through it. The regeneration unit 31 desorbs the reactant R from the reaction product C2 within the regeneration flow path 32. The regeneration flow path 32 is also configured to allow the reactant R and the heat storage material C1 to flow through it.

[0017] A second gas G2 containing external exhaust heat is supplied to the regeneration flow path 32 from an exhaust heat generation source 14 disposed outside the heat supply device 11. The regeneration flow path 32 is connected to the first supply flow path 24 of the heat dissipation unit 21.

[0018] <Regeneration unit 31: second separation mechanism 33> The second separation mechanism 33 separates the heat storage material C1 produced in the regeneration flow path 32 from the second gas G2. The second separation mechanism 33 has a heat storage material outlet section 33a that discharges the heat storage material C1 into the second supply flow path 34. The second separation mechanism 33 has a second gas outlet section 33b that discharges the second gas G2 and the reactant R to the outside. The second gas G2 and the reactant R discharged by the second gas outlet section 33b are discharged at an outlet section 15 outside the heat supply device 11.

[0019] The second separation mechanism 33 may be, for example, a swirl flow imparting mechanism, a filter unit, etc. The swirl flow imparting mechanism and the filter unit may be the same as those described for the first separation mechanism 23.

[0020] <Regeneration section 31: second supply flow path 34> The second supply flow path 34 supplies the heat storage material C1 separated by the second separation mechanism 33 to the heat dissipation flow path 22 of the heat dissipation section 21. The second supply flow path 34 has an inlet portion into which the heat storage material C1 flows from the second separation mechanism 33, and an outlet portion connected to the heat dissipation flow path 22.

[0021] <Heat storage material C1, reactant R, reaction product C2, first gas G1, and second gas G2> The heat storage material C1 generates a reaction product C2 through an exothermic reaction with the reactant R. The reaction product C2 desorbs the reactant R through an endothermic reaction. Examples of reversible reactions between the heat storage material C1 and the reaction product C2 include hydration reactions and dehydration reactions, and adsorption reactions and desorption reactions.

[0022] The heat storage material C1 and the reaction product C2 are configured to be able to flow so as to circulate between the heat release flow path 22 and the regeneration flow path 32. The heat storage material C1 and the reaction product C2 are, for example, in powder form. The heat storage material C1 may be composed only of a heat storage substance that reacts with the reactant R, or may be a material in which the heat storage substance is bound with a binder. The binder is preferably a material that is permeable to the reactant R. For example, the heat storage material may be one in which the reactant R is water.

[0023] Examples of heat storage materials include heat storage materials that utilize chemical reactions such as hydration reactions (chemical heat storage materials), and heat storage materials that utilize adsorption reactions (adsorption heat storage materials). Examples of chemical heat storage materials include alkaline earth metal halides, alkaline earth metal hydroxides, alkaline earth metal carbonates, alkaline earth metal sulfates, lithium hydroxide, magnesium sulfate, and strontium bromide. Examples of adsorption heat storage materials include zeolites, silica gel, activated carbon, and metal-organic frameworks (MOFs).

[0024] The reactant R that reacts with the heat storage material C1 may also be called a reaction medium, a working medium, etc. Examples of the reactant R that reacts with the heat storage substance include water vapor, ammonia, etc. One type of heat storage material C1 may be used, or multiple types may be used in combination.

[0025] The hydration and dehydration reactions of calcium chloride, which is a type of chemical heat storage material, are represented by, for example, the following formula (A). CaCl2·H2O+H2O⇔CaCl2·2H2O···(A) The first gas G1 and the second gas G2 may be, for example, air, carbon dioxide, an inert gas, etc. The inert gas may be, for example, nitrogen, helium, argon, etc.

[0026] <Operation of the heat supply device 11> In the heat dissipation operation of the heat supply device 11, a reaction product C2 is generated from the heat storage material C1 and the reactant R in the heat dissipation flow path 22 of the heat dissipation section 21. At this time, the first gas G1 is heated by the heat generated in association with the generation of the reaction product C2 in the heat dissipation flow path 22. The pressure in the heat dissipation flow path 22 during the heat dissipation operation is maintained at, for example, atmospheric pressure or higher.

[0027] The heated first gas G1 can be used to heat an external heating target 13. The reaction product C2 generated in the heat dissipation flow path 22 is separated from the first gas G1 by the first separation mechanism 23 and then supplied to the regeneration flow path 32 through the first supply flow path 24.

[0028] In the regeneration operation of the heat supply device 11, the reactant R is desorbed from the reaction product C2 in the regeneration flow path 32 of the regeneration section 31. A second gas G2 containing exhaust heat can be used to desorb the reactant R from the reaction product C2. The pressure in the regeneration flow path 32 during the regeneration operation is maintained at, for example, atmospheric pressure or higher. The heat storage material C1 produced in the regeneration flow path 32 is separated from the second gas G2 by the second separation mechanism 33, and then supplied to the heat release flow path 22 via the second supply flow path 34.

[0029] The heat supply device 11 can perform a regeneration operation during a heat dissipation operation. More specifically, in the heat supply device 11, the heat storage material C1 regenerated in the regeneration flow path 32 is continuously supplied to the heat dissipation flow path 22 during the heat dissipation operation. Furthermore, the reaction product C2 is continuously supplied from the heat dissipation flow path 22 to the regeneration flow path 32 during the regeneration operation.

[0030] <Specific example of heat supply device 11> Next, a specific example of the heat supply device 11 will be described. 2 to 5, the heat supply device 11 includes a flow path pipe 51. The flow path pipe 51 includes an outer flow path pipe 51a and an inner flow path pipe 51b disposed inside the outer flow path pipe 51a. The heat dissipation flow path 22 of the heat dissipation unit 21 is provided in the inner flow path pipe 51b.

[0031] The heat supply device 11 includes a first gas supply pipe 52 that supplies a first gas G1 to the inner flow path pipe 51b, and a heat outflow pipe 53 that outputs the heated first gas G1 from the inner flow path pipe 51b. The first gas supply pipe 52 has an opening that faces the opening at the lower end of the inner flow path pipe 51b. The first gas supply pipe 52 supplies the first gas G1 and the reactant R toward the inside of the inner flow path pipe 51b. The heat supply device 11 includes a first filter member F1 that prevents the heat storage material C1 from flowing out through the first gas supply pipe 52.

[0032] The heat outflow pipe 53 has an opening facing the opening at the upper end of the inner flow path pipe 51b. The heat outflow pipe 53 constitutes the heated gas outflow section 23b. The heat supply device 11 is provided with a second filter member F2 that prevents the reaction product C2 from flowing out to the outside through the heat outflow pipe 53.

[0033] The first separation mechanism 23 is composed of a swirl flow imparting mechanism that imparts a swirl flow to the mixed fluid of the reaction product C2 and the first gas G1. The swirl flow imparting mechanism includes a swirler SW having blades that swirl the airflow, and a swirl flow path SP through which the mixed fluid that has passed through the swirler SW flows as a swirl flow. The swirl flow path SP is cylindrical. The swirl flow path SP is composed of a part of the inner flow path pipe 51b. The swirler SW is fixed inside the inner flow path pipe 51b.

[0034] The reaction product C2 between the heat storage material C1 and the reactant R is generated upstream of the swirler SW, i.e., on the first gas supply pipe 52 side of the swirler SW. The reaction product C2 between the heat storage material C1 and the reactant R may be generated downstream of the swirler SW in addition to the upstream side of the swirler SW.

[0035] The first supply flow path 24 supplies the reaction product C2 centrifuged from the mixed fluid by the swirl flow imparting mechanism to the regeneration flow path 32. The first supply flow path 24 supplies the reaction product C2 centrifuged in the swirl flow path SP in the inner flow path pipe 51b between the outer flow path pipe 51a and the inner flow path pipe 51b. The first supply flow path 24 is provided so as to extend from the opening at the downstream end of the inner flow path pipe 51b to between the outer flow path pipe 51a and the inner flow path pipe 51b.

[0036] The regeneration flow path 32 of the regeneration unit 31 is provided between the outer flow path pipe 51a and the inner flow path pipe 51b. The second separation mechanism 33 of the regeneration unit 31 includes a guide member 54 that guides the flow of the heat storage material C1 produced in the regeneration flow path 32. The guide member 54 has an inclined surface 54a that guides the downward flow of the heat storage material C1. The inclined surface 54a constitutes the above-mentioned heat storage material outflow section 33a. The guide member 54 includes a third filter member F3 that allows the second gas G2 and the reactant R to pass preferentially over the heat storage material C1. The third filter member F3 constitutes the above-mentioned second gas outflow section 33b.

[0037] The second supply flow path 34 is provided to allow the heat storage material C1, which has flowed downward along the inclined surface 54a of the guide member 54, to flow into the regeneration flow path 32. The second supply flow path 34 is provided to extend from the lower end of the guide member 54 to the opening at the lower end of the inner flow path pipe 51b. More specifically, the heat supply device 11 includes a peripheral wall member 55 provided to surround the outer periphery of the guide member 54. The lower part of the peripheral wall member 55 has an inclined shape in which the inner circumferential surface is inclined downward so that the diameter thereof decreases. The inclined shape of the peripheral wall member 55 guides the heat storage material C1 to flow into the inner flow path pipe 51b. The heat storage material C1 flows downward along the inner circumferential surface of the peripheral wall member 55, and thereby flows into the heat release flow path 22.

[0038] The heat supply device 11 includes a second gas supply pipe 56 that supplies the second gas G2 between the outer flow path pipe 51a and the inner flow path pipe 51b. The heat supply device 11 also includes a second gas outlet pipe 57 that constitutes the second gas outlet portion 33b.

[0039] <Heat Supply System 10> 1, the heat supply system 10 includes the heat supply device 11, a heat dissipation gas supply source 12, a heating target 13, an exhaust heat generation source 14, and an exhaust unit 15. The heat dissipation gas supply source 12 supplies a first gas G1 and a reactant R to the heat dissipation flow path 22 of the heat supply device 11.

[0040] The heating target 13 is heated by the first gas G1 supplied from the heating gas outlet 23b of the first separation mechanism 23 in the heat supply device 11. Examples of the heating target 13 include a drying device, a heat treatment device, a steam generator, and a thermoelectric converter.

[0041] The exhaust heat generation source 14 supplies the second gas G2 containing exhaust heat to the regeneration passage 32 of the heat supply device 11. The exhaust heat generation source 14 may be, for example, factory equipment. The discharge section 15 discharges the second gas G2 after being used in the heat supply device 11. The second gas G2 flows out from the second gas outlet section 33b of the second separation mechanism 33 in the heat supply device 11 together with the reactant R.

[0042] 6 and 7 show specific examples of the heat supply system 10. The heat supply system 10 has, for example, a heat dissipation gas supply source 12, a heat supply device 11, and a heating target 13, and a first gas circulation path 16 that circulates a first gas G1 through the heat dissipation gas supply source 12, the heat supply device 11, and the heating target 13. As shown in FIG. 7, the heat dissipation gas supply source 12 has, for example, an evaporator 61 that generates a gaseous reactant R by evaporating a liquid reactant R. The evaporator 61 has a storage container 61a that stores the liquid reactant R, and a heater 61b that heats the reactant R stored in the storage container 61a. The heater 61b can be, for example, an electric heater.

[0043] The first gas circulation path 16 is provided so as to inject the first gas G1 into the liquid reactant R in the storage container 61a of the evaporator 61. That is, the evaporator 61 is provided with an ejection part 61c that ejects the first gas G1 into the liquid reactant R in the storage container 61a.

[0044] The heat dissipation gas supply source 12 includes a supply unit 62 that can supply reactant R to a storage container 61a of the evaporator 61. The supply unit 62 includes a supply container 62a and a heat exchanger 62b. The supply container 62a stores the reactant R in a liquid state. The supply container 62a is configured to allow the reactant R to be injected. The heat exchanger 62b exchanges heat between the reactant R in a liquid state in the supply container 62a and the second gas G2 used in the heat supply device 11. The heat exchange in the heat exchanger 62b heats the reactant R in a liquid state in the reinforcing container by the second gas G2. The second gas G2 that has passed through the heat exchanger 62b is discharged from the discharge unit 15. The supply unit 62 includes an adjustment valve 62c that adjusts the amount of reactant R supplied from the supply container 62a to the storage container 61a.

[0045] <Heat supply method> The heat supply method supplies heat by using a reaction between the heat storage material C1 and the reactant R. The heat supply method includes a heat release step, a regeneration step, a first separation step, a first supply step, a second separation step, and a second supply step.

[0046] In the heat dissipation process, the first gas G1 that transports heat to be supplied to the outside, the heat storage material C1, and the reactant R are caused to flow within the heat dissipation flow path 22. In the heat dissipation process, a reaction product C2 is generated from the heat storage material C1 and the reactant R. In the heat dissipation process, the first gas G1 can be heated as the reaction product C2 is generated.

[0047] In the regeneration process, the second gas G2 and the reaction product C2 are caused to flow into the regeneration flow path 32, and the reactant R is desorbed from the reaction product C2 in the regeneration flow path 32. In the regeneration process, the heat storage material C1 is produced from the reaction product C2.

[0048] In the first separation step, the reaction product C2 produced in the heat dissipation flow path 22 is separated from the first gas G1. In the first supply step, the reaction product C2 separated in the first separation step is supplied to the regeneration flow path 32. In the second separation step, the heat storage material C1 produced in the regeneration flow path 32 is separated from the second gas G2 and the reactant R. In the second supply step, the heat storage material C1 separated in the second separation step is supplied to the heat dissipation flow path 22.

[0049] In the heat supply method, the first separation step, the first supply step, the second separation step, and the second supply step are carried out in parallel while the heat release step and the regeneration step are being carried out. <Actions and Effects of the Embodiment> Next, the operation and effects of the embodiment will be described.

[0050] (1) The heat supply device 11 supplies heat using a reaction between a heat storage material C1 and a reactant R. The heat supply device 11 includes a heat dissipation section 21 having a heat dissipation flow path 22 and a regeneration section 31 having a regeneration flow path 32. The heat dissipation flow path 22 is configured to allow a first gas G1, which transports heat to be supplied to the outside, the heat storage material C1, and the reactant R to flow through it. The heat dissipation section 21 generates a reaction product C2 from the heat storage material C1 and the reactant R within the heat dissipation flow path 22. The regeneration flow path 32 is configured to allow a second gas G2 containing external waste heat and the reaction product C2 to flow through it. The regeneration section 31 desorbs the reactant R from the reaction product C2 within the regeneration flow path 32.

[0051] The heat dissipation section 21 includes a first separation mechanism 23 that separates the reaction product C2 generated in the heat dissipation flow path 22 from the first gas G1, and a first supply flow path 24 that supplies the reaction product C2 separated by the first separation mechanism 23 to the regeneration flow path 32.

[0052] The regeneration section 31 includes a second separation mechanism 33 that separates the heat storage material C1 produced in the regeneration flow path 32 from the second gas G2 and the reactant R, and a second supply flow path 34 that supplies the heat storage material C1 separated by the second separation mechanism 33 to the heat dissipation flow path 22.

[0053] According to this configuration, the heat dissipation unit 21 can perform a heat dissipation operation to generate a reaction product C2 from the heat storage material C1 and the reactant R in the heat dissipation flow path 22. The regeneration unit 31 can perform a regeneration operation to desorb the reactant R from the reaction product C2 in the regeneration flow path 32. The heat dissipation unit 21 can supply the reaction product C2 generated in the heat dissipation flow path 22 to the regeneration flow path 32 by the first separation mechanism 23 and the first supply flow path 24. Furthermore, the regeneration unit 31 can supply the heat storage material C1 generated in the regeneration flow path 32 to the heat dissipation flow path 22 by the second separation mechanism 33 and the second supply flow path 34. This allows the regeneration operation to be performed during the heat dissipation operation. Therefore, it is possible to alleviate the time restriction on the supply of heat.

[0054] Moreover, since it is possible to avoid switching between the heat dissipation operation and the regeneration operation, it becomes easier to operate the heat supply device 11. Furthermore, since it is not necessary to perform a regeneration operation in the heat dissipation flow path 22, it is possible to easily suppress a decrease in the temperature of the heat dissipation flow path 22.

[0055] (2) The second separation mechanism 33 includes a guide member 54 that guides the flow of the heat storage material C1 produced in the regeneration flow path 32. The guide member 54 has an inclined surface 54a that guides the downward flow of the heat storage material C1. The guide member 54 includes a third filter member F3 that allows the second gas G2 and the reactant R to pass preferentially over the heat storage material C1. The second supply flow path 34 causes the heat storage material C1 that has flowed downward along the inclined surface 54a of the guide member 54 to flow into the regeneration flow path 32. In this case, the guide member 54 can easily separate the heat storage material C1 from the second gas G2.

[0056] (3) The first separation mechanism 23 includes a swirl flow imparting mechanism that imparts a swirl flow to the mixed fluid of the reaction product C2 and the first gas G1. The first supply flow path 24 supplies the reaction product C2, which has been centrifuged from the mixed fluid by the swirl flow imparting mechanism, to the regeneration flow path 32. In this case, the swirl flow imparting mechanism makes it possible to easily separate the reaction product C2 from the first gas G1.

[0057] (4) The heat supply device 11 includes, for example, an outer flow path pipe 51a and an inner flow path pipe 51b disposed inside the outer flow path pipe 51a. The heat dissipation flow path 22 is provided in the inner flow path pipe 51b. The swirl flow imparting mechanism of the first separation mechanism 23 is provided to impart a swirl flow to the mixed fluid in the inner flow path pipe 51b. The regeneration flow path 32 is provided between the inner flow path pipe 51b and the outer flow path pipe 51a. The first supply flow path 24 supplies the reaction product C2 centrifuged in the inner flow path pipe 51b to the outer flow path pipe 51a. In this case, the heat supply device 11 can be easily downsized.

[0058] (5) The heat supply system 10 includes a heat supply device 11, a heat dissipation gas supply source 12, a heating target 13, an exhaust heat generation source 14, and an exhaust section 15. The heat dissipation gas supply source 12 supplies a first gas G1 and a reactant R to the heat supply device 11. The heating target 13 is heated by the first gas G1 supplied from the heat supply device 11. The exhaust heat generation source 14 supplies a second gas G2 containing exhaust heat to the heat supply device 11. The exhaust section 15 exhausts the second gas G2 after use in the heat supply device 11. This configuration can achieve the same effects as those described in section (1) above.

[0059] (6) The heat supply system 10 has a first gas circulation path 16 that circulates the first gas G1 among the heat dissipation gas supply source 12, the heat supply device 11, and the heating target 13. In this case, for example, the path of the first gas G1 can be simplified. Also, for example, it is possible to easily ensure the purity of the first gas G1.

[0060] (7) The heat dissipation gas supply source 12 of the heat supply system 10 includes an evaporator 61 that evaporates the liquid reactant R. The evaporator 61 includes a storage container 61a that stores the liquid reactant R. The first gas circulation path 16 is configured to eject the first gas G1 into the liquid reactant R in the storage container 61a. In this case, the content of the reactant R in the mixed fluid of the first gas G1 and the reactant R can be easily increased. Therefore, for example, it is possible to easily prevent a shortage of the reactant R in the heat dissipation flow path 22.

[0061] (8) The heat dissipation gas supply source 12 of the heat supply system 10 includes a supply unit 62 that can supply the reactant R to the storage container 61a of the evaporator 61. The supply unit 62 includes a supply container 62a that stores the liquid reactant R, and a heat exchanger 62b. The heat exchanger 62b exchanges heat between the liquid reactant R in the supply container 62a and the second gas G2 used in the heat supply device 11. The second gas G2 that has passed through the heat exchanger 62b is discharged from the discharge unit 15. In this case, the reactant R supplied from the supply unit 62 to the evaporator 61 can be heated using the second gas G2. This makes it possible to further increase the utilization rate of the heat of the second gas G2, i.e., the exhaust heat.

[0062] (9) The heat supply method supplies heat using a reaction between the heat storage material C1 and the reactant R. In the heat supply method, the first separation step, the first supply step, the second separation step, and the second supply step are carried out in parallel during the heat release step and the regeneration step. According to this method, it is possible to obtain the same effect as that described in the above section (1).

[0063] <Example of change> The above embodiment may be modified as follows: The above embodiment and the following modifications may be implemented in combination with each other within the scope of technical compatibility.

[0064] In the heat supply system 10, the heat exchanger 62b in the supply unit 62 of the heat dissipation gas supply source 12 may be omitted. In the heat supply system 10, the first gas circulation path 16 is configured to inject the first gas G1 into the liquid reactant R in the storage container 61a, but it can also be configured to inject the first gas G1 above the liquid surface of the reactant R. Even in this case, a mixed fluid of the first gas G1 and the reactant R can be obtained.

[0065] A heat exchanger through which a heating medium flows may be used instead of the heater 61b of the evaporator 61. Also, the heater 61b and the heat exchanger may be used together. The first gas circulation path 16 may be omitted from the heat supply system 10. That is, the heat dissipation gas supply source 12 may be configured to newly supply the first gas G1 to the heat supply device 11 without using the first gas G1 that has passed through the heating target 13.

[0066] The first gas circulation path 16 may be provided with a blower that forcibly circulates the first gas G1. The first separation mechanism 23 may be a separation mechanism other than the first separation mechanism 23 of the above embodiment. For example, the inner flow path pipe 51b in the heat supply device 11 of the modified example shown in Fig. 8 has a nozzle portion N that narrows the flow path at the downstream end. The tip of the nozzle portion N is disposed inside the heat outflow pipe 53. The outer peripheral surface of the nozzle portion N is an inclined surface that slopes downward so that the diameter increases.

[0067] The reaction product outlet 23a of the first separation mechanism 23 is provided in the gap between the outer peripheral surface of the tip of the nozzle part N and the inner peripheral surface of the heat outflow pipe 53. The first supply flow path 24 of the first separation mechanism 23 is connected from the gap between the outer peripheral surface of the tip of the nozzle part N and the inner peripheral surface of the heat outflow pipe 53 to the regeneration flow path 32.

[0068] The first separation mechanism 23 includes a second filter member F2 that allows the first gas G1 to pass through the heat outflow pipe 53 preferentially over the reaction product C2. The second filter member F2 has a shape that is convex toward the upstream side (downward). The second filter member F2 is provided inside the heat outflow pipe 53.

[0069] In the heat supply device 11 of the modified example, the mixed fluid flowing out from the nozzle portion N flows along the second filter member F2, thereby generating a vortex inside the heat outflow pipe 53. The shear stress of the mixed fluid flowing as a vortex increases near the inner wall of the heat outflow pipe 53. Therefore, the flow rate of the mixed fluid flowing as a vortex decreases near the inner wall of the heat outflow pipe 53. As a result, the reaction product C2 falls near the wall surface of the heat outflow pipe 53. The reaction product C2 that falls in this way flows into the regeneration flow path 32 through the reaction product outlet portion 23a and the first supply flow path 24.

[0070] 3, the heat dissipation flow path 22 of the heat dissipation unit 21 is provided inside the inner flow path pipe 51b, and the regeneration flow path 32 of the regeneration unit 31 is provided between the outer flow path pipe 51a and the inner flow path pipe 51b, but this is not limited to this. The heat dissipation flow path 22 of the heat dissipation unit 21 may be provided between the outer flow path pipe 51a and the inner flow path pipe 51b, and the regeneration flow path 32 of the regeneration unit 31 may be provided inside the inner flow path pipe 51b. In this modification, the first separation mechanism 23 and the first supply flow path 24 of the above embodiment can be used as the second separation mechanism 33 and the second supply flow path 34, respectively. Furthermore, the second separation mechanism 33 and the second supply flow path 34 of the above embodiment can be used as the first separation mechanism 23 and the first supply flow path 24, respectively.

[0071] 3, the heat release flow path 22 and the regeneration flow path 32 are configured by an outer flow path pipe 51a and an inner flow path pipe 51b, but the arrangement of the flow paths is not limited to this. For example, the heat release flow path 22 and the regeneration flow path 32 can also be configured by using a pair of adjacent flow path pipes. Also, the heat release flow path 22 and the regeneration flow path 32 can also be configured by using three or more flow path pipes.

[0072] The heat storage material C1 may be temporarily deposited on the first filter member F1. In this case, by adjusting the flow rate of the first gas G1, the heat storage material C1 deposited on the first filter member F1 can be gradually moved by the airflow of the first gas G1. Furthermore, the reaction product C2 can be generated in a state where the heat storage material C1 is temporarily deposited on the first filter member F1. In this case, the heat dissipation flow path 22 also includes the area above the first filter member F1.

[0073] The heat storage material C1 may be temporarily deposited on the third filter member F3. In this case, by adjusting the flow rate of the second gas G2, the heat storage material C1 deposited on the third filter member F3 can be gradually mobilized by the airflow of the second gas G2. Furthermore, the reaction product C2 can be regenerated while it is temporarily deposited on the third filter member F3. In this case, the regeneration flow path 32 also includes the area above the third filter member F3.

[0074] <Additional Notes> The technical ideas that can be understood from the above-described embodiment and modified examples will be described. (Supplementary Note 1) A heat supply device in which the first separation mechanism includes a guide member that guides the flow of the reaction products generated in the heat dissipation flow path, the guide member including an inclined surface that guides the downward flow of the reaction products and a filter member that allows the first gas to pass preferentially over the reaction products, and the first supply flow path causes the reaction products that have flowed downward along the inclined surface of the guide member to flow into the heat dissipation flow path.

[0075] (Supplementary Note 2) A heat supply device, wherein the second separation mechanism includes a swirling flow imparting mechanism that imparts a swirling flow to a mixed fluid of the heat storage material, the second gas, and the reactant, and the second supply flow path supplies the heat storage material that has been centrifuged from the mixed fluid by the swirling flow imparting mechanism to the heat dissipation flow path.

[0076] (Appendix 3) A heat supply device according to appendix 2, comprising an outer flow path pipe and an inner flow path pipe arranged inside the outer flow path pipe, the regeneration flow path being provided in the inner flow path pipe, the swirl flow imparting mechanism being configured to impart a swirl flow to the mixed fluid in the inner flow path pipe, the heat dissipation flow path being provided between the inner flow path pipe and the outer flow path pipe, and the second supply flow path supplying the heat storage material centrifuged in the inner flow path pipe to between the inner flow path pipe and the outer flow path pipe.

[0077] (Appendix 4) A heat supply device comprising a lower flow path pipe and an upper flow path pipe, the lower flow path pipe having a nozzle portion whose flow path narrows toward an upper end of the lower flow path pipe, a tip portion of the nozzle portion being disposed inside the upper flow path pipe, at least one of the first separation mechanism and the second separation mechanism being provided in the upper flow path pipe and comprising a filter member shaped to generate a vortex flow of the mixed fluid flowing out of the nozzle portion, and separating at least one of the heat storage material and the reaction product by utilizing the vortex flow. [Explanation of symbols]

[0078] 10...Heat supply system 11...Heat supply device 12... Heat dissipation gas supply source 13...Heated object 14...Exhaust heat source 15...Discharge section 16...First gas circulation route 21...Heat radiation part 22...Heat radiation flow path 23...First separation mechanism 24...First supply flow path 31…Playback section 32...Regeneration channel 33…Second separation mechanism 34...Second supply flow path 51a...Outer channel pipe 51b...inner flow path pipe 54...Guide member 54a…Slanted surface 61...Evaporator 61a...Storage container 62…Supply Department 62a…Supply container 62b…Heat exchanger C1…heat storage material C2: Reaction products F3: Third filter element G1...First gas G2: Second gas R...reactant

Claims

1. A heat supply device that supplies heat using a reaction between a heat storage material and a reactant, a heat dissipation section having a heat dissipation flow path through which a first gas that transports heat to be supplied to the outside, the heat storage material, and the reactant can flow, and which generates a reaction product from the heat storage material and the reactant within the heat dissipation flow path; a regeneration unit having a regeneration flow path through which a second gas containing external waste heat and the reaction product can flow, and which desorbs the reactant from the reaction product in the regeneration flow path; The heat dissipation unit is a first separation mechanism that separates the reaction product generated in the heat dissipation flow path from the first gas; a first supply flow path that supplies the reaction product separated by the first separation mechanism to the regeneration flow path; The playback unit a second separation mechanism that separates the heat storage material generated in the regeneration flow path from the second gas and the reactant; a second supply flow path that supplies the heat storage material separated by the second separation mechanism to the heat dissipation flow path.

2. the second separation mechanism includes a guide member that guides a flow of the heat storage material generated in the regeneration flow path, the guide member includes an inclined surface that guides the downward flow of the heat storage material, and a filter member that allows the second gas and the reactant to pass preferentially over the heat storage material, The heat supply device according to claim 1 , wherein the second supply flow path causes the heat storage material that has flowed downward along the inclined surface of the guide member to flow into the regeneration flow path.

3. the first separation mechanism includes a swirl flow imparting mechanism that imparts a swirl flow to a mixed fluid of the reaction product and the first gas, The heat supply device according to claim 1 , wherein the first supply flow path supplies the reaction product, which has been centrifuged from the mixed fluid by the swirl flow imparting mechanism, to the regeneration flow path.

4. an outer flow path pipe; and an inner flow path pipe disposed inside the outer flow path pipe; the heat dissipation flow path is provided in the inner flow path pipe, the swirl flow imparting mechanism is provided to impart a swirl flow to the mixed fluid in the inner flow path pipe, the regeneration flow path is provided between the inner flow path pipe and the outer flow path pipe, The heat supply device according to claim 3 , wherein the first supply flow path supplies the reaction product centrifuged in the inner flow path pipe to a space between the inner flow path pipe and the outer flow path pipe.

5. The heat supply device according to claim 1; a heat dissipation gas supply source that supplies the first gas and the reactant to the heat supply device; a heating target to be heated by the first gas supplied from the heat supply device; a waste heat generating source that supplies the second gas containing waste heat to the heat supply device; a discharge section that discharges the second gas after it has been used in the heat supply device.

6. The heat supply system according to claim 5 , further comprising a first gas circulation path for circulating the first gas among the heat dissipation gas supply source, the heat supply device, and the object to be heated.

7. the heat dissipation gas supply source includes an evaporator that evaporates the reactant in a liquid state; the evaporator includes a storage container for storing the reactant in a liquid state; The heat supply system according to claim 6 , wherein the first gas circulation path is provided so as to inject the first gas into the reactant in a liquid state in the storage container.

8. the heat dissipation gas supply source includes a replenishing unit capable of replenishing the reactant into the storage container of the evaporator, The replenishing unit includes a replenishing container for storing the reactant in a liquid state; a heat exchanger that exchanges heat between the reactant in a liquid state in the replenishment container and the second gas used in the heat supply device, The heat supply system according to claim 7 , wherein the second gas that has passed through the heat exchanger is discharged from the discharge section.

9. A heat supply method for supplying heat using a reaction between a heat storage material and a reactant, comprising: a heat dissipation step of generating a reaction product from the heat storage material and the reactant by causing a first gas that transports heat to be supplied to the outside, the heat storage material, and the reactant to flow in a heat dissipation flow path; a regeneration step of flowing a second gas containing external waste heat and the reaction product in a regeneration flow path to desorb the reactants from the reaction product; a first separation step of separating the reaction product generated in the heat dissipation flow path from the first gas; a first supply step of supplying the reaction product separated in the first separation step to the regeneration flow path; a second separation step of separating the heat storage material produced in the regeneration flow path from the second gas and the reactants; a second supply step of supplying the heat storage material separated in the second separation step to the heat dissipation flow path, A heat supply method, wherein the first separation step, the first supply step, the second separation step, and the second supply step are carried out in parallel while the heat release step and the regeneration step are being carried out.

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