Probe and method for manufacturing a probe

Abstract

The present invention provides a probe and a method for manufacturing a probe that do not impede axial extension and retraction movements even when the probe diameter is reduced. [Solution] The probe 10 comprises a spring unit 110 in which a beam-shaped first spring component 111, a second spring component 112, a third spring component 113, a fourth spring component 114, and a connecting spring component 115 are connected in order. The first spring component 111 extends in a first direction. The second spring component 112 extends in a second direction. The third spring component 113 extends in a first direction. The fourth spring component 114 extends in a second direction. The connecting spring component 115 is connected to the fourth spring component 114, and the first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114 are stacked in this order and extend in a third direction. Multiple spring units 110 are arranged sequentially along the axial direction, and a connecting spring component 115 of one adjacent spring unit 110 connects to the first spring component 111 of the other spring unit 110.

Description

Technical Field

[0001] The present invention relates to a probe used for inspecting electrical characteristics of an inspection object and a method for manufacturing the probe.

Background Art

[0002] An electrical connection device including a probe is used to inspect the electrical characteristics of an inspection object such as a semiconductor integrated circuit in a wafer state. In an inspection using a probe, one end of the probe contacts an electrode of the inspection object, and the other end of the probe contacts a terminal (hereinafter also referred to as a "land") disposed on a substrate of the electrical connection device. The land is electrically connected to an inspection device such as a tester.

[0003] In order to accurately inspect the electrical characteristics of the inspection object, it is necessary to stably electrically connect the inspection object and the land via the probe. For this purpose, a probe having elasticity in the axial direction is used. By pressing the probe connected to the land against the inspection object to contract the probe in the axial direction, an overdrive is generated that further pushes the probe toward the inspection object by the elastic force of the probe. By the overdrive, the inspection object and the probe can be stably brought into contact. As a probe having elasticity in the axial direction, a probe including a spring portion in which beams are connected in a spiral shape is used.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When narrowing the spacing between multiple probes arranged in a grid (hereinafter also referred to as the "arrangement pitch"), it is necessary to reduce the size of the probe as viewed from the axial direction (hereinafter referred to as the "probe diameter"). To reduce the probe diameter of a probe in which beams arranged on each side of a rectangle and connected in a spiral manner as viewed from the axial direction, it is preferable to reduce not only the length of the beams but also the area of ​​the part where each beam connects to the beam on the adjacent side (hereinafter also referred to as the "holding area"). However, reducing the holding area results in insufficient connection strength, so it is necessary to shorten the beams without reducing the holding area. This causes problems with the axial extension and retraction movement of the probe.

[0006] In view of the above problems, the present invention aims to provide a probe and a method for manufacturing a probe that does not impede axial extension and retraction even when the probe diameter is reduced. [Means for solving the problem]

[0007] A probe according to one aspect of the present invention comprises a spring unit in which a beam-shaped first spring component, a second spring component, a third spring component, a fourth spring component, and a connecting spring component are connected in order. The first spring component extends in a first direction. The second spring component is connected to the first spring component and extends in a second direction. The third spring component is connected to the second spring component and extends in a first direction. The fourth spring component is connected to the third spring component and extends in a second direction. The connecting spring component is connected to the fourth spring component and extends in a third direction in which the first spring component, second spring component, third spring component, and fourth spring component are stacked in this order. A plurality of spring units are arranged sequentially along the axial direction, and the connecting spring component of one adjacent spring unit is connected to the first spring component of the other spring unit. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a probe and a method for manufacturing a probe that do not impede axial extension and retraction movements even when the probe diameter is reduced. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic side view showing the configuration of a probe according to an embodiment. [Figure 2] Figure 2 is a schematic perspective view showing the configuration of the spring unit of the probe according to the embodiment. [Figure 3] Figure 3 is a schematic top view showing the configuration of the spring unit of the probe according to this embodiment. [Figure 4] Figure 4 is a schematic perspective view from direction IV in Figure 1. [Figure 5] Figure 5 is a schematic perspective view from the direction V in Figure 4. [Figure 6] Figure 6 is a schematic perspective view from the direction VI in Figure 4. [Figure 7] Figure 7 is a schematic perspective view from direction VII in Figure 4. [Figure 8] Figure 8 is a schematic perspective view showing the configuration of a comparative example probe. [Figure 9] Figure 9 is a schematic diagram showing an enlarged view of region M in Figure 8. [Figure 10] Figure 10 is a schematic diagram showing the substrate constituting the probe according to the embodiment. [Figure 11] Figure 11 is a schematic diagram illustrating the method for manufacturing a probe according to an embodiment (Part 1). [Figure 12] Figure 12 is a schematic diagram illustrating the method for manufacturing a probe according to the embodiment (part 2). [Figure 13] Figure 13 is a schematic diagram illustrating the method for manufacturing a probe according to the embodiment (part 3). [Figure 14] Figure 14 is a schematic diagram illustrating the method for manufacturing a probe according to the embodiment (part 4). [Figure 15] Figure 15 is a schematic diagram showing the configuration of an electrical connection device including a probe according to an embodiment. [Modes for carrying out the invention]

[0010] Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the ratios of the thicknesses of each part are different from the actual ones. Also, it is a matter of course that there are parts where the dimensional relationships and ratios are different between the drawings. The embodiments shown below illustrate devices and methods for embodying the technical idea of this invention, and the embodiments of this invention do not specify the materials, shapes, structures, arrangements, etc. of the components as follows.

[0011] The probe 10 according to the embodiment shown in FIG. 1 has conductivity and is used for inspecting the electrical characteristics of an inspection object. In the inspection of the inspection object, one end in the axial direction of the probe 10 is connected to the inspection object, and the other end is connected to the land of the electrical connection device. In FIG. 1, one end of the probe 10 connected to the inspection object is denoted as the "tip end 11", and the other end of the probe 10 connected to the land is denoted as the "base end 12". The probe 10 includes a spring portion 100 between the tip end 11 and the base end 12. The probe 10 has a columnar shape with the tip end 11 and the base end 12 at both ends. The spring portion 100 has elasticity in the axial direction.

[0012] As shown in FIG. 1, the axial direction of the probe 10 is defined as the Z direction, the left - right direction in FIG. 1 is defined as the X direction, and the depth direction in FIG. 1 is defined as the Y direction. Also, the direction in which the tip end 11 is located when viewed from the base end 12 along the Z direction is defined as upward, and the direction in which the base end 12 is located when viewed from the tip end 11 is defined as downward.

[0013] As shown in Figure 2, the probe 10 includes a spring unit 110 comprising a first spring component 111, a second spring component 112, a third spring component 113, a fourth spring component 114, and a connecting spring component 115. The spring unit 110 is configured by sequentially connecting the beam-shaped first spring component 111, second spring component 112, third spring component 113, fourth spring component 114, and connecting spring component 115. In the following, unless otherwise specified, the first spring component 111, second spring component 112, third spring component 113, fourth spring component 114, and connecting spring component 115 will be referred to as "spring component". The spring component is electrically conductive. Metal materials may be used for the spring component. For example, nickel (Ni), nickel alloys, palladium (Pd), palladium alloys, rhodium (Rh), rhodium alloys, tungsten (W), etc., may be used for spring components.

[0014] The configuration of the spring unit 110 is described below in detail. In the following description, the first direction and the second direction are directions that intersect the X direction obliquely in the XZ plane and extend obliquely with respect to the axial direction from top to bottom. More specifically, the first direction is the direction from the upper right to the lower left when projected onto the XZ plane. The second direction is the direction from the upper left to the lower right when projected onto the XZ plane. The third direction is the direction parallel to the Y direction. In each of the first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114, the first end is the upper end of the beam and the end closest to the tip 11. The second end is the lower end of the beam and the end closest to the base 12.

[0015] The first spring component 111 extends in a first direction that intersects obliquely with respect to the axial direction. The second spring component 112 has a first end connected to the second end of the first spring component 111 and extends in a second direction that intersects obliquely with respect to both the axial direction and the first direction. The third spring component 113 has a first end connected to the second end of the second spring component and extends in the first direction. The fourth spring component has a first end connected to the second end of the third spring component and extends in the second direction. The first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114 are laminated in a third direction. Thus, the first spring component 111, the second spring component 112, the third spring component 113, and the fourth spring component 114 are connected in a zigzag along the axial direction.

[0016] The connecting spring component 115 has a first end connected to the second end of the fourth spring component 114 and extends in the third direction. A plurality of spring units 110 are arranged in order along the axial direction, and the connecting spring component 115 connects between two adjacent spring units 110. That is, the second end of the connecting spring component 115 of one adjacent spring unit 110 is connected to the first end of the first spring component 111 of the other spring unit 110.

[0017] The second end of the connecting spring component 115 and the first end of the first spring component 111 are connected by a first joining member 131. The first end of the connecting spring component 115 and the second end of the fourth spring component 114 are connected by a second joining member 132. The first joining member 131 and the second joining member 132 are films for diffusion bonding by vapor deposition of, for example, gold (Au).

[0018] In the spring unit 110, the path from the first end of the first spring component 111 to the second end of the connecting spring component 115 functions as a continuous current path. By connecting the second end of the connecting spring component 115 of one adjacent spring unit 110 to the first end of the first spring component 111 of the other spring unit 110, the current paths of the multiple spring units 110 constituting the spring section 100 become continuous. The spring unit 110 closest to the tip 11 is electrically connected to the tip 11. The spring unit 110 closest to the base 12 is electrically connected to the base 12. This constitutes a current path from the tip 11 to the base 12.

[0019] In the probe 10, the ends of each beam-shaped spring component are connected in sequence, so the spring unit 110 has elasticity in the axial direction. Because the spring section 100 is constructed by connecting multiple spring units 110 in the axial direction, the probe 10 has elasticity in the axial direction.

[0020] As shown in Figure 3, the probe 10 is rectangular in shape and has four sides when viewed from the axial direction. Any method can be used for connecting the first spring component 111 to the second spring component 112, the second spring component 112 to the third spring component 113, and the third spring component 113 to the fourth spring component 114.

[0021] For example, the probe 10 may include a first connecting component 121 that connects the first spring component 111 and the second spring component 112, a second connecting component 122 that connects the second spring component 112 and the third spring component 113, and a third connecting component 123 that connects the third spring component 113 and the fourth spring component 114. The first connecting component 121 connects the second end of the first spring component 111 to the first end of the second spring component 112. The second connecting component 122 connects the second end of the second spring component 112 to the first end of the third spring component 113. The third connecting component 123 connects the second end of the third spring component 113 to the first end of the fourth spring component 114. In the following, unless limited, the first connecting component 121, the second connecting component 122, and the third connecting component 123 will be referred to as "connecting component". The connecting components are electrically conductive.

[0022] As will be described later, the probe 10 may be constructed by stacking multiple substrates, each containing a spring component and a connecting component. In this case, each of the spring component and the connecting component may have a flat, axially extending portion that constitutes the tip portion 11 and the base portion 12. In other words, the flat portions at both ends of the spring component and the connecting component may be stacked to form the tip portion 11 and the base portion 12.

[0023] Figure 4 shows a partial perspective view of the probe 10 as seen from direction IV in Figure 1. Figure 5 shows a partial perspective view of the probe 10 as seen from direction V in Figure 4. Figure 6 shows a partial perspective view of the probe 10 as seen from direction VI in Figure 4. Figure 7 shows a partial perspective view of the probe 10 as seen from direction VII in Figure 4. The spring component and connecting component shown in Figures 4 to 7 include a flat plate-shaped portion that constitutes the tip 11.

[0024] In the probe 10 according to this embodiment, the second spring component 112 and the third spring component 113 are housed in the region sandwiched between the first spring component 111 and the fourth spring component 114. The first spring component 111 and the fourth spring component 114 are connected to the connecting spring component 115 in the portions that extend outward from the second spring component 112 and the third spring component 113. For this reason, in the XZ plane, the lengths of the first spring component 111 and the fourth spring component 114 are set to be longer than the lengths of the second spring component 112 and the third spring component 113.

[0025] To show a comparison with probe 10, Figure 8 shows a comparative probe (hereinafter referred to as "comparative probe 10M"). Figure 9 is an enlarged view of region M in Figure 8. Comparative probe 10M has an expandable section 100M between the first end 11M and the second end 12M. The expandable section 100M has a configuration in which a non-elastic connecting section 101M is placed between two spring sections that form a helical spring. Comparative probe 10M is rectangular when viewed from the axial direction, and the ends of the beams that make up each side of the spring section are connected to the ends of the beams on the adjacent sides. In comparative probe 10M, when a load is applied in the axial direction, the distance D between the beams that make up the spring section narrows, generating an axial elastic force.

[0026] In comparative probe 10M, the balance between the beam length and the holding area is important. As shown in Figure 9, the holding area S is the area where each beam connects to the beam of an adjacent side. If the holding area S is large or the beam length is short, the amount of deformation in response to stress becomes small, and there is a risk that the beam may break because it cannot release the external force acting on it.

[0027] When the spacing of the comparison probes 10M is narrowed, the probe diameter of the comparison probes 10M must be reduced. In other words, the length of the beams on each side must be shortened. In this case, it is preferable to also reduce the holding area S. However, there is a limit to how much the holding area S can be reduced in order to ensure mechanical strength. Therefore, it is necessary to shorten the beams while maintaining the size of the holding area S. As a result, the area of ​​the beam that can deform becomes narrower, and the axial expansion and contraction movement of the comparison probes 10M is hindered. This reduces the amount of overdrive when the comparison probes 10M expand and contract, making the comparison probes 10M more prone to buckling.

[0028] Regarding the comparative probe 10M, one method to ensure sufficient overdrive is to increase the overall length of the probe (hereinafter also referred to as "probe length"). However, increasing the probe length reduces the rigidity of the comparative probe 10M, making it more susceptible to buckling.

[0029] On the other hand, the probe 10 according to the embodiment has a structure in which the second spring component 112 and the third spring component 113 are sandwiched between the first spring component 111 and the fourth spring component 114. In other words, the probe 10 has a configuration in which the spring components are also arranged in the central space as viewed from the axial direction of the comparative probe 10M. By connecting the first spring component 111, the second spring component 112, the third spring component 113, the fourth spring component 114 and the connecting spring component 115, the beam per unit length in the axial direction of the spring section 100 can be increased without increasing the probe length of the probe 10. As a result of increasing the beam per unit length in the axial direction of the spring section 100, the sum of the deformable portions of each beam increases, and the buckling durability during the axial extension and retraction movement of the probe 10 is improved. Therefore, even if the probe diameter of the probe 10 is reduced in order to narrow the arrangement pitch of the probes 10, it is possible to suppress interference with the axial extension and retraction movement and prevent the probe 10 from buckling.

[0030] As described above, in the probe 10 according to this embodiment, a predetermined overdrive amount can be secured without increasing the probe length, even if the probe diameter is reduced. Therefore, the probe 10 allows for a narrower arrangement pitch of the probes. Furthermore, since there is no need to increase the probe length, the probe 10 can be suitably used for high-current and high-frequency inspections of the object to be inspected.

[0031] The probe 10 may be constructed by laminating multiple substrates, each containing, for example, a first spring component 111, a second spring component 112, a third spring component 113, and a fourth spring component 114. The thickness of the connecting component may be, for example, about 1 μm. The connecting component may be a thin film for diffusion bonding or a conductive adhesive. Alternatively, the connecting component may be made of the same metal material as the spring component. That is, the spring component and the connecting component may be made of plate-shaped components and laminated alternately.

[0032] The following describes an example of a manufacturing method for constructing the probe 10 by stacking multiple substrates, each containing a spring component and a connecting component.

[0033] First, prepare the multiple plate-shaped substrates shown in Figure 10. Specifically, prepare the first spring substrate 1110, the connecting substrate 1150, the first connecting substrate 1210, the second spring substrate 1120, the second connecting substrate 1220, the third spring substrate 1130, the third connecting substrate 1230, and the fourth spring substrate 1140.

[0034] The first spring substrate 1110 includes a configuration in which a plurality of first spring components 111 are arranged along the axial direction. The connecting substrate 1150 includes a configuration in which a plurality of connecting spring components 115 are arranged along the axial direction. The first connecting substrate 1210 includes a configuration in which a plurality of first connecting components 121 are arranged along the axial direction. The second spring substrate 1120 includes a configuration in which a plurality of second spring components 112 are arranged along the axial direction. The second connecting substrate 1220 includes a configuration in which a plurality of second connecting components 122 are arranged along the axial direction. The third spring substrate 1130 includes a configuration in which a plurality of third spring components 113 are arranged along the axial direction. The third connecting substrate 1230 includes a configuration in which a plurality of third connecting components 123 are arranged along the axial direction. The fourth spring substrate 1140 includes a configuration in which a plurality of fourth spring components 114 are arranged along the axial direction. The first spring substrate 1110, the first connecting substrate 1210, the second spring substrate 1120, the second connecting substrate 1220, the third spring substrate 1130, the third connecting substrate 1230, and the fourth spring substrate 1140 include flat plate-shaped portions that constitute the tip portion 11 and the base portion 12.

[0035] First, as shown in Figure 11, the connecting substrate 1150 is stacked on the first spring substrate 1110, and the second end of the connecting spring component 115 and the first end of the first spring component 111 are connected by the first joining member 131.

[0036] Next, as shown in Figure 12, the first connecting board 1210 and the second spring board 1120 are stacked sequentially on the first spring board 1110, and the second end of the first spring component 111 and the first end of the second spring component 112 are connected by the first connecting component 121. Furthermore, as shown in Figure 13, the second connecting board 1220 and the third spring board 1130 are stacked sequentially on the second spring board 1120, and the second end of the second spring component 112 and the first end of the third spring component 113 are connected by the second connecting component 122.

[0037] Subsequently, as shown in Figure 14, the third connecting substrate 1230 and the fourth spring substrate 1140 are stacked sequentially on the third spring substrate 1130, and the second end of the third spring component 113 and the first end of the fourth spring component 114 are connected by the third connecting component 123. In addition, the first end of the connecting spring component 115 and the second end of the fourth spring component 114 are connected by the second joining member 132.

[0038] With the above steps completed, the probe 10 is finished. The completed probe 10 has a configuration in which the first spring component 111, the first connecting component 121, the second spring component 112, the second connecting component 122, the third spring component 113, the third connecting component 123, and the fourth spring component 114 are stacked in the third direction when viewed from the axial direction.

[0039] On the other hand, when using a thin film or conductive adhesive for diffusion bonding as a connecting component, the probe 10 may be manufactured as follows.

[0040] A connecting board 1150 is laminated onto the first spring board 1110, and the second end of the connecting spring component 115 and the first end of the first spring component 111 are connected by the first joining member 131. Next, a second spring board 1120 is laminated onto the first spring board 1110, and the second end of the first spring component 111 and the first end of the second spring component 112 are connected by the first connecting component 121. Furthermore, a third spring board 1130 is laminated onto the second spring board 1120, and the second end of the second spring component 112 and the first end of the third spring component 113 are connected by the second connecting component 122. Then, a fourth spring board 1140 is laminated onto the third spring board 1130, and the second end of the third spring component 113 and the first end of the fourth spring component 114 are connected by the third connecting component 123. In addition, the second end of the fourth spring component 114 and the first end of the connecting spring component 115 are connected by the second joining member 132.

[0041] The probe 10 is used, for example, in the electrical connection device 1 shown in Figure 15. The probe 10 is held in a holding part 20 which has an insertion hole into which the probe 10 is inserted. The probe 10 is inserted into the insertion hole of the holding part 20 from the base end 12 side. A land 21, which is a conductive terminal, is located at the bottom of the insertion hole of the holding part 20, and the end face of the base end 12 of the probe 10 is electrically connected to the land 21. The holding part 20 includes an external terminal 22 which is electrically connected to the land 21 via an internal circuit (not shown). The external terminal 22 is electrically connected to an inspection device such as an IC tester (not shown).

[0042] The base end 12 of the probe 10 may be joined to the land 21 to constitute the electrical connection device 1. The method and material for joining the probe 10 to the land 21 can be arbitrarily selected. For example, the end face of the base end 12 of the probe 10 may be joined to the land 21 by soldering.

[0043] The holding portion 20 may be, for example, an integrally molded space transformer. Because the holding portion 20 is a space transformer, the spacing between the external terminals 22 can be increased beyond the arrangement pitch of the probes 10. This facilitates the connection between the electrical connection device 1 and the inspection device.

[0044] In the inspection of the object to be inspected 2 using the electrical connection device 1, the tip 11 of the probe 10 comes into contact with the electrode pad (not shown) of the object to be inspected 2. The inspection of the object to be inspected 2 is performed by the propagation of electrical signals between the object to be inspected 2 and the inspection device via the probe 10 and the holding part 20.

[0045] Because the spring portion 100 of the probe 10 is elastic, when the tip portion 11 of the probe 10, with its base portion 12 connected to the land 21, is brought into contact with the object to be inspected 2, the probe 10 can undergo elastic deformation along its axial direction. Therefore, after the probe 10 is brought into contact with the object to be inspected 2, overdrive can be generated to press the probe 10 against the object to be inspected 2. Overdrive ensures an electrical connection between the probe 10 and the object to be inspected 2.

[0046] After the inspection of object 2 is complete, the probe 10 is removed from object 2. The probe 10, which has a spring portion 100, returns to its original shape after being removed from object 2.

[0047] In Figure 15, the probes 10 are shown being held in a single row in the holding section 20, but the arrangement of the probes 10 in the holding section 20 is arbitrary. For example, the probes 10 may be arranged in a matrix when viewed from the axial direction. Since the probes 10 are held linearly along the axial direction, the arrangement density of the probes 10 can be increased.

[0048] Furthermore, the depth of the insertion hole in the holding part 20 into which the probe 10 is inserted can be set arbitrarily. For example, by making the insertion hole deeper, it is possible to prevent the probe 10 from being held at an angle in the holding part 20. This prevents misalignment of the tip 11 relative to the electrode pad of the object to be inspected 2.

[0049] As described above, the probe 10 is extendable and retractable in the axial direction due to the presence of a spring portion 100. Furthermore, with the probe 10, a predetermined amount of overdrive can be secured without increasing the probe length, even if the probe diameter is reduced. For this reason, with the electrical connection device 1 including the probe 10, even if the spacing between the electrode pads of the object to be inspected 2 is narrow, it can be accommodated by narrowing the arrangement pitch of the probes 10.

[0050] (Other embodiments) Although the present invention has been described above by embodiments, the descriptions and drawings that constitute part of this disclosure should not be understood as limiting the invention. Various alternative embodiments, examples, and operational techniques will become apparent to those skilled in the art from this disclosure.

[0051] For example, when viewed from a direction perpendicular to the axial direction, the beam of the spring section 100 may not be straight but may include curved portions. For example, the direction of travel of the beam of the spring component may change along the way. By including curved portions rather than being a simple straight line in the beam of the spring section 100, the load applied to the probe 10 is more easily transmitted in the axial direction, and it is possible to suppress the probe 10 from bending and buckling from its central axis when an axial compressive force is applied to the probe 10.

[0052] Furthermore, the electrical connection device 1 may be configured such that the base end 12 of the probe 10 and the land 21 can be freely separated or brought into contact. Because the base end 12 is not joined to the land 21, the probe 10 can be easily replaced, for example, if a malfunction occurs in the probe 10.

[0053] Thus, the present invention naturally includes various embodiments not described above. [Explanation of Symbols]

[0054] 10 probes 11 Tip 12 Proximal end 100 spring section 110 Spring Unit 111 First spring component 112 Second spring part 113 Third spring component 114. Fourth spring component 115 Connecting spring parts 121 First connecting part 122 Second connecting part 123 Third connecting part 131 First Joining Member 132 Second Joining Member 1110 First spring substrate 1120 Second spring substrate 1130 Third spring substrate 1140 Fourth spring substrate 1150 Linked substrate 1210 First connection board 1220 Second connection board 1230 Third connection board

Claims

1. A columnar probe extending in the axial direction, used for testing the electrical properties of an object under inspection, A beam-shaped first spring component extending in a first direction that intersects the axial direction at an angle, A beam-shaped second spring component, the first end of which is connected to the second end of the first spring component, and the beam-shaped second spring component extending in a second direction that intersects obliquely with both the axial direction and the first direction, A beam-shaped third spring component, the first end of which is connected to the second end of the second spring component and extending in the first direction, A beam-shaped fourth spring component, the first end of which is connected to the second end of the third spring component and extending in the second direction, A beam-shaped connecting spring component extending in a third direction, in which the first end is connected to the second end of the fourth spring component, and the first spring component, the second spring component, the third spring component, and the fourth spring component are stacked in this order, A spring unit including Multiple spring units are arranged sequentially along the axial direction. The connecting spring component connects two adjacent spring units, such that the second end of the connecting spring component of one adjacent spring unit connects to the first end of the first spring component of the other spring unit. probe.

2. A first connecting component that connects the second end of the first spring component and the first end of the second spring component, A second connecting component that connects the second end of the second spring component and the first end of the third spring component, A third connecting component that connects the second end of the third spring component and the first end of the fourth spring component, Furthermore, The probe according to claim 1, wherein, when viewed from the axial direction, the first spring component, the first connecting component, the second spring component, the second connecting component, the third spring component, the third connecting component, and the fourth spring component are stacked in the third direction.

3. The probe according to claim 2, wherein each of the first connecting component, the second connecting component, and the third connecting component is a plate-shaped substrate.

4. The probe according to claim 2, wherein each of the first connecting component, the second connecting component, and the third connecting component is a thin film for diffusion bonding.

5. The probe according to any one of claims 1 to 4, wherein it is rectangular in shape and has four sides when viewed from the axial direction.

6. The probe according to any one of claims 1 to 4, wherein the lengths of the first spring component and the fourth spring component are longer than the lengths of the second spring component and the third spring component.

7. A method for manufacturing a probe according to claim 1, Prepare a first spring substrate on which a plurality of the first spring components are arranged along the axial direction, a second spring substrate on which a plurality of the second spring components are arranged along the axial direction, a third spring substrate on which a plurality of the third spring components are arranged along the axial direction, a fourth spring substrate on which a plurality of the fourth spring components are arranged along the axial direction, and a connecting substrate on which a plurality of the connecting spring components are arranged along the axial direction. The connecting substrate is laminated onto the first spring substrate to connect the second end of the connecting spring component to the first end of the first spring component. The second spring substrate is laminated onto the first spring substrate, and the second end of the first spring component is connected to the first end of the second spring component. The third spring substrate is laminated onto the second spring substrate, and the second end of the second spring component and the first end of the third spring component are connected. The fourth spring substrate is laminated onto the third spring substrate, the second end of the third spring component is connected to the first end of the fourth spring component, and the second end of the fourth spring component is connected to the first end of the connecting spring component. A method for manufacturing a probe containing a probe.

8. A first connecting substrate, on which a plurality of first connecting components connecting the second end of the first spring component and the first end of the second spring component are arranged along the axial direction, is placed between the first spring substrate and the second spring substrate. A second connecting substrate, on which a plurality of second connecting components connecting the second end of the second spring component and the first end of the third spring component are arranged along the axial direction, is placed between the second spring substrate and the third spring substrate. A third connecting substrate, on which a plurality of third connecting components connecting the second end of the third spring component and the first end of the fourth spring component are arranged along the axial direction, is placed between the third spring substrate and the fourth spring substrate. A method for manufacturing a probe according to claim 7, further comprising:

9. A method for manufacturing a probe according to claim 7, wherein the connection between the second end of the first spring component and the first end of the second spring component, the connection between the second end of the second spring component and the first end of the third spring component, and the connection between the second end of the third spring component and the first end of the fourth spring component are performed by diffusion bonding.

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