Substrate processing apparatus and substrate processing method

Abstract

Providing a technology that can reduce the impact of pins used to position the circuit board on processing. [Solution] In the substrate processing apparatus 100, the base plate 11 has a plurality of position regulating pins 13, which include a stationary pin 13a and a sliding pin 13b. The stationary pin 13a, when positioned at the regulating position P2, contacts the peripheral edge 93 of the substrate 9, regulating the position of the substrate 9 to a normal position Q defined above the base plate 11, and also regulating its rotation so that it does not rotate relative to the base plate 11. The sliding pin 13b, when positioned at the regulating position P2, is positioned opposite the peripheral edge 93 of the substrate 9, which is positioned at the normal position Q, while providing a gap G, and allows the substrate 9 to rotate relative to the base plate 11, while regulating its position so that it does not displace radially from the normal position Q beyond an allowable range.

Description

Technical Field

[0001] This application relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] In manufacturing semiconductor devices and the like, various processes are performed on a substrate. For example, there is known a substrate processing apparatus that holds a substrate in a posture (horizontal posture) such that its thickness direction is along the vertical direction, rotates the substrate around an axis extending vertically through the center of its main surface, supplies a processing liquid to the substrate, and processes the substrate with the processing liquid (for example, Patent Documents 1 to 3).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] A spin chuck is used, for example, to hold and rotate a substrate in a horizontal position. As an example, a spin chuck has a configuration in which multiple pins (chuck pins) for holding the substrate are provided on the upper surface of a flat base plate. The multiple chuck pins contact the peripheral edge of the substrate, which is positioned horizontally above the base plate, thereby restricting the position of the substrate so as not to be displaced in the radial and vertical directions, and restricting its rotation so as not to be rotated relative to the base plate. When the base plate is rotated in this state, the base plate and the substrate held by the chuck pins provided on it rotate together as a single unit. When a processing liquid is supplied to the main surface of the rotating substrate, the processing liquid spreads over the entire main surface, and the entire main surface is treated by the processing liquid.

[0005] Incidentally, depending on the processing recipe, it is required that the processing solution supplied to the main surface of the substrate also be used to process the peripheral edges of the substrate. However, the processing solution is less likely to be supplied to the areas of the substrate's peripheral edges where the chuck pins are in contact, compared to other areas. As a result, these areas are less likely to be processed than other areas, and uniformity of processing across the entire circumferential direction of the peripheral edges may not be guaranteed.

[0006] Furthermore, depending on the processing recipe, it is required to keep the amount of processing liquid supplied to one main surface of the substrate that flows over to the other main surface (flow width) to a sufficiently small extent. However, in the areas where the chuck pins contact the peripheral edges of the substrate, the processing liquid supplied to one main surface tends to flow over to the other main surface by running along the chuck pins. As a result, the flow of processing liquid may concentrate in these areas, causing a peak in the flow width to appear (and consequently, the maximum value of the flow width to increase).

[0007] This application was made in view of these problems, and its purpose is to provide a technology that can reduce the influence of pins that restrict the position of the substrate on processing. [Means for solving the problem]

[0008] The first embodiment is a substrate processing apparatus comprising: a base plate; a plurality of position regulating pins provided on the base plate for regulating the position of a substrate placed horizontally above the base plate; a pin drive mechanism for moving each of the plurality of position regulating pins between a regulating position in which the position regulating pins regulate the position of the substrate and a release position in which the position regulating pins do not regulate the position of the substrate; a rotation mechanism for rotating the base plate around a rotation axis extending vertically; a processing liquid supply unit for supplying processing liquid to the substrate; and a control unit for controlling the pin drive mechanism, the rotation mechanism, and the processing liquid supply unit, wherein the plurality of position regulating pins are statically connected. The device includes a stopper pin and a slide pin. The stopper pin, when positioned in the regulating position, abuts against the peripheral edge of the substrate, thereby regulating the substrate to a designated position above the base plate and restricting its rotation so that it does not rotate relative to the base plate. The slide pin, when positioned in the regulating position, is positioned opposite the peripheral edge of the substrate in the designated position, leaving a gap between them, thereby allowing the substrate to rotate relative to the base plate while restricting its position so that it does not displace radially from the designated position beyond a permissible range.

[0009] A second embodiment is a substrate processing apparatus according to the first embodiment, wherein the control unit controls the pin drive mechanism to switch between a stationary restricting state in which the stationary pins restrict the position of the substrate and a sliding restricting state in which the sliding pins restrict the position of the substrate, and in the sliding restricting state, controls the processing liquid supply unit to supply the processing liquid to the substrate.

[0010] A third embodiment is a substrate processing apparatus according to the second embodiment, wherein the control unit controls the rotation mechanism in the slip-restricted state to change the rotation speed of the base plate.

[0011] A fourth embodiment is a substrate processing apparatus according to the second or third embodiment, wherein the control unit controls the processing liquid supply unit in the slip-restricting state to change the rotational speed of the substrate by the external force exerted on the substrate by the processing liquid supplied to the substrate.

[0012] A fifth embodiment is a substrate processing apparatus according to any of the second to fourth embodiments, comprising a gas supply unit for supplying gas to the substrate, wherein the control unit controls the gas supply unit in the slip-restricting state to change the rotational speed of the substrate by the external force exerted on the substrate by the gas supplied to the substrate.

[0013] The sixth aspect is a substrate processing apparatus according to any of the first to fifth aspects, wherein the sliding pin has a restricting surface that, when it is positioned in the restricting position, faces the peripheral edge of the substrate positioned in the normal position while providing the gap, and the restricting surface has a side surface that faces the peripheral edge from the side.

[0014] The seventh aspect is a substrate processing apparatus according to the sixth aspect, wherein the regulating surface has an upper surface that faces the peripheral edge from diagonally above.

[0015] The eighth aspect is a substrate processing apparatus according to the sixth or seventh aspect, wherein the regulating surface has a lower surface that faces the peripheral edge from an oblique angle below.

[0016] A ninth aspect is a substrate processing method comprising: a static restriction state formation step in which stationary pins provided on a base plate abut against the peripheral edge of a substrate arranged horizontally above the base plate, thereby restricting the position of the substrate to a predetermined normal position above the base plate and restricting its rotation so as not to rotate relative to the base plate; an acceleration step in which, in the static restriction state, the rotation speed of the base plate is increased to a predetermined liquid processing rotation speed; a sliding restriction state formation step after the acceleration step in which sliding pins provided on the base plate are positioned opposite the peripheral edge of the substrate arranged in the normal position, leaving a gap between them, thereby restricting the position of the substrate so as not to displace radially from the normal position beyond an allowable range, while allowing relative rotation to the base plate; and a processing liquid supply step in which, in the sliding restriction state, processing liquid is supplied to the substrate. [Effects of the Invention]

[0017] According to the substrate processing apparatus of the first embodiment, the substrate can rotate relative to the base plate in a state in which its position is restricted by the sliding pins, at or near the normal position (a position in which the amount of displacement from the normal position does not exceed an allowable range). When the substrate rotates relative to the base plate, the sliding pins provided on the base plate move relative to the peripheral edge of the substrate in the circumferential direction, and the positions in which the sliding pins face each other at the peripheral edge of the substrate (pin opposing positions) change moment by moment in the circumferential direction. Therefore, the influence of the sliding pins on the processing is reduced.

[0018] In the substrate processing apparatus according to the second embodiment, processing liquid is supplied to the substrate in a slip-restricted state. In the slip-restricted state, the substrate can rotate relative to the base plate, and when the substrate rotates relative to the base plate, the pin opposing positions change moment by moment in the circumferential direction. When the pin opposing positions change moment by moment in the circumferential direction, it becomes less likely that the amount of processing liquid supplied will be uneven across the entire circumferential edge of the substrate, and the circumferential edge will be processed uniformly over the entire circumferential direction. In addition, when the pin opposing positions change moment by moment in the circumferential direction, the leakage of processing liquid does not concentrate at a specific position in the circumferential direction on the circumferential edge of the substrate, so a peak in the leakage width is less likely to appear. That is, the maximum value of the leakage width can be kept small.

[0019] In the substrate processing apparatus according to the third embodiment, the rotation mechanism changes the rotational speed of the base plate when the slip restriction state is in place. When the slip restriction state is in place, even if the rotational speed of the base plate changes, the rotational speed of the substrate does not change in response. Therefore, by changing the rotational speed of the base plate, a difference in rotational speed is created between the substrate and the base plate, and the substrate can be rotated relative to the base plate.

[0020] In the substrate processing apparatus according to the fourth embodiment, the rotational speed of the substrate changes due to the external force applied from the processing liquid when the sliding is restricted. This creates a difference in rotational speed between the substrate and the base plate, and consequently, the substrate can be rotated relative to the base plate.

[0021] In the substrate processing apparatus according to the fifth embodiment, the rotational speed of the substrate changes due to an external force applied from the gas when the sliding is restricted. This creates a difference in rotational speed between the substrate and the base plate, and consequently, allows the substrate to rotate relative to the base plate.

[0022] According to the sliding pin for the substrate processing apparatus of the sixth embodiment, when it is positioned in the restricted position, the position can be restricted so that the substrate does not displace radially beyond an allowable range corresponding to the gap from the normal position.

[0023] According to the sliding pin of the substrate processing apparatus according to the seventh aspect, in a state where this is arranged at the regulation position, it is possible to regulate the position so that the substrate does not displace upward beyond the allowable range corresponding to the gap from the normal position.

[0024] According to the sliding pin of the substrate processing apparatus according to the eighth aspect, in a state where this is arranged at the regulation position, it is possible to regulate the position so that the substrate does not displace downward beyond the allowable range corresponding to the gap from the normal position.

Brief Description of the Drawings

[0025] [Figure 1] It is a side sectional view schematically showing the configuration of the substrate processing apparatus according to the embodiment. [Figure 2] It is a plan view schematically showing the upper surface of the base plate. [Figure 3] It is a plan view of the stationary pin. [Figure 4] It is a side view schematically showing the state where the stationary pin is moved between the release position and the regulation position. [Figure 5] It is a plan view of the sliding pin. [Figure 6] It is a side view schematically showing the state where the sliding pin is moved between the release position and the regulation position. [Figure 7] It is a plan view schematically showing the stationary regulation state. [Figure 8] It is a plan view schematically showing the sliding regulation state. [Figure 9] It is a view showing the lower surface of the base plate, showing a state where the first release magnet and the second release magnet are arranged at the separated positions. [Figure 10] It is a view showing the lower surface of the base plate, showing a state where the first release magnet and the second release magnet are arranged at the proximity positions. [Figure 11] It is a view showing the lower surface of the base plate, showing a state where the first release magnet is arranged at the proximity position and the second release magnet is arranged at the separated position. [Figure 12] This is a block diagram showing the configuration of the control unit. [Figure 13] This diagram shows the processing flow performed in a substrate processing apparatus. [Figure 14] This diagram illustrates the processing flow performed in a substrate processing apparatus. [Figure 15] This is a schematic side view showing how the sliding pin according to the first modified example moves between the release position and the restricted position. [Figure 16] This is a schematic side view showing how the sliding pin according to the second modified example moves between the release position and the restricted position. [Figure 17] This is a schematic plan view showing the upper surface of the base plate on which the position-regulating pins relating to the third modification are provided. [Figure 18] This is a schematic side view showing how the position-regulating pin according to the third modified example moves between the release position, the stationary regulating position, and the sliding regulating position. [Figure 19] This is a schematic plan view illustrating the static traffic control conditions. [Figure 20] This is a plan view schematically illustrating the slip restriction state. [Modes for carrying out the invention]

[0026] The embodiments will be described below with reference to the attached drawings. Note that the components described in these embodiments are merely examples and are not intended to limit the scope of this disclosure to them alone. Furthermore, in the drawings, the dimensions or number of parts may be exaggerated or simplified as needed for ease of understanding.

[0027] Expressions indicating relative or absolute positional relationships (e.g., "in one direction," "along one direction," "parallel," "orthogonal," "center," "concentric," "coaxial," etc.) shall, unless otherwise specified, not only strictly represent the positional relationship but also represent a state in which the object is relatively displaced in terms of angle or distance within a tolerance or range in which equivalent functionality is obtained. Similarly, expressions indicating equality (e.g., "identical," "equal," "homogeneous," etc.) shall, unless otherwise specified, not only represent a state in which the object is quantitatively exactly equal but also represent a state in which there is a difference in which tolerance or equivalent functionality is obtained. Furthermore, expressions indicating shape (e.g., "circular," "square," "cylindrical," etc.) shall, unless otherwise specified, not only strictly represent the shape geometrically but also represent a shape within a range in which equivalent effects are obtained, and may include features such as concavity or chamfers. Finally, expressions such as "equipped," "possessed," "contains," and "have" a component are not exclusive expressions that exclude the existence of other components. Furthermore, the expression "at least one of A, B, and C" includes "A only," "B only," "C only," "any two of A, B, and C," and "all of A, B, and C."

[0028] <1. Configuration of substrate processing equipment> The configuration of the substrate processing apparatus 100 according to this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a schematic side cross-sectional view showing the configuration of the substrate processing apparatus 100. Figure 2 is a schematic plan view showing the upper surface 111 of the base plate 11.

[0029] The substrate processing apparatus 100 is a so-called single-wafer processing apparatus that processes substrates 9 one at a time. The substrates 9 to be processed are, for example, disc-shaped. The substrate processing apparatus 100 includes, for example, a spin chuck 1, a processing liquid supply unit 2, a gas supply unit 3, and a control unit 4. The spin chuck 1, the processing liquid nozzle 21 (described later) of the processing liquid supply unit 2, etc., are housed in a chamber (not shown) that forms an approximately sealed space inside.

[0030] (Spin Chuck 1) The spin chuck 1 rotates the substrate 9 while positioning it in a horizontal orientation. Here, "horizontal orientation" refers to an orientation in which the thickness direction of the substrate 9 is aligned with the vertical direction, one main surface of the substrate 9 faces downward, and the other main surface faces upward. The spin chuck 1 comprises, for example, a base plate 11, a plurality of support pins 12, a plurality of position regulating pins 13, and a rotation mechanism 14.

[0031] The base plate 11 is a disc-shaped member and is positioned so that its thickness direction is aligned with the vertical direction. The base plate 11 is provided with a plurality of support pins 12 and a plurality of position regulating pins 13.

[0032] Multiple support pins 12 contact the substrate 9 from below, supporting the substrate 9 in a horizontal position above the base plate 11. A lifting mechanism (not shown) is connected to the multiple support pins 12 to raise and lower them (move them vertically) between an upper and lower position. As the lifting mechanism raises and lowers each support pin 12, the substrate 9 supported by the support pins 12 moves up and down. In other words, here, the multiple support pins 12 not only function as support pins that support the substrate 9, but also as lift pins that raise and lower the substrate 9.

[0033] Multiple position-regulating pins 13 contact or approach the substrate 9, which is positioned horizontally above the base plate 11, from the side, thereby regulating the position of the substrate 9. The specific configuration of the position-regulating pins 13 will be described later.

[0034] The rotation mechanism 14 rotates the base plate 11 around an axis (rotation axis) J1 that extends vertically. For example, the axis extending vertically through the center of the upper surface 111 of the base plate 11 is defined as the rotation axis J1. As will become clear later, the substrate 9, whose position is restricted by the position restriction pins 13, has its center (or a position sufficiently close to the center) coincide with the rotation axis J1 when viewed from above. In other words, the rotation axis J1 passes through the center (or a position sufficiently close to the center) of the substrate 9 whose position is restricted by the position restriction pins 13. Specifically, the rotation mechanism 14 includes, for example, a shaft 141 that is arranged coaxially with the rotation axis J1 and connected to the lower surface 112 of the base plate 11 at its upper end, and a motor 142 that rotates the shaft 141 around its axis. The rotation of the shaft 141 by the drive of the motor 142 causes the base plate 11 to rotate around the rotation axis J1. The motor 142 operates in response to instructions from the control unit 4, and the rotational speed of the base plate 11, the position (angle) of the rotational direction when the base plate 11 stops rotating, etc., are controlled by the control unit 4.

[0035] (Processing liquid supply unit 2) The processing liquid supply unit 2 supplies processing liquid to the substrate 9 (specifically, the substrate 9 which is positioned horizontally above the base plate 11 and whose position is restricted by the position regulating pins 13). The processing liquid supply unit 2 includes, for example, a processing liquid nozzle 21 and a processing liquid supply source 22.

[0036] The processing liquid nozzle 21 is a nozzle that discharges processing liquid and is supported by a nozzle arm 211. A nozzle moving mechanism (not shown) is connected to the nozzle arm 211, and the processing liquid nozzle 21 is moved between a discharge position and a standby position when the nozzle arm 211 is driven by the nozzle moving mechanism. Here, the "discharge position" is the position where the processing liquid nozzle 21 overlaps with the substrate 9 when viewed from above (for example, a position facing the center of the upper surface 92 of the substrate 9). The "standby position" is the position where the processing liquid nozzle 21 does not overlap with the substrate 9 when viewed from above, but is spaced away from it.

[0037] The processing liquid supply source 22 is a supply source that supplies processing liquid to the processing liquid nozzle 21. Specifically, the processing liquid supply source 22 comprises, for example, a chemical supply source 22a that supplies a chemical solution as the first processing liquid to the processing liquid nozzle 21, and a rinse liquid supply source 22b that supplies a rinse liquid as the second processing liquid to the processing liquid nozzle 21. The chemical solution is, for example, hydrofluoric acid (HF), ozone-containing hydrofluoric acid solution, dilute hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF), or SC1 (a liquid containing NH4OH and H2O2), but is not limited to these. The rinse liquid is, for example, deionized water (DIW) or isopropyl alcohol (IPA), but is not limited to these.

[0038] The chemical supply source 22a is connected to the processing liquid nozzle 21 via a pipe 223a in which a chemical valve 221a and a flow rate adjustment unit 222a are inserted. Therefore, when the chemical valve 221a is opened while the processing liquid nozzle 21 is in the discharge position, the chemical is discharged from the processing liquid nozzle 21 toward the substrate 9 (in this case, the upper surface 92 of the substrate 9). Similarly, the rinse liquid supply source 22b is connected to the processing liquid nozzle 21 via a pipe 223b in which a rinse liquid valve 221b and a flow rate adjustment unit 222b are inserted. Therefore, when the rinse liquid valve 221b is opened while the processing liquid nozzle 21 is in the discharge position, the rinse liquid is discharged from the processing liquid nozzle 21 toward the substrate 9 (in this case, the upper surface 92 of the substrate 9). Each valve 221a, 221b and each flow rate adjustment unit 222a, 222b operates in accordance with instructions from the control unit 4, and the timing and amount of discharge of the processed liquid are controlled by the control unit 4.

[0039] (Gas supply section 3) The gas supply unit 3 supplies gas to the substrate 9 (specifically, the substrate 9 which is positioned horizontally above the base plate 11 and whose position is restricted by the position regulating pins 13). Specifically, the gas supply unit 3 supplies gas to the space (lower space) U between the lower surface 91 of the substrate 9 and the upper surface 111 of the base plate 11. The gas supply unit 3 includes, for example, a gas supply pipe 31 and a gas supply source 32.

[0040] The gas supply pipe 31 is a pipe for circulating gas and is inserted inside the shaft 141. Here, for example, a through-hole 113 is provided in the center of the base plate 11, penetrating the base plate 11 in the thickness direction, and the gas supply pipe 31 is provided so as to extend from the upper end of the shaft 141 to the through-hole 113, with its upper end positioned inside the through-hole 113. Here, a disc 115 is provided so as to face the opening of the upper end of the gas supply pipe 31 which is positioned inside the through-hole 113. Specifically, for example, a circular recess 114 is provided on the upper surface 111 of the base plate 11, surrounding the through-hole 113 in a plan view, and the disc 115 is provided inside the recess 114. The disc 115 is supported in a horizontal position at a distance from the bottom surface of the recess 114 by a plurality of legs (not shown) erected on the bottom surface of the recess 114.

[0041] The gas supply source 32 is a source that supplies a predetermined gas to the gas supply pipe 31. The gas supplied from the gas supply source 32 may be, for example, an inert gas (nitrogen gas, argon gas, helium gas), low-humidity clean air, etc., but is not limited to these. The gas supplied from the gas supply source 32 may also be a high-pressure gas, compressed gas, etc.

[0042] The gas supply source 32 is connected to the gas supply pipe 31 via a pipe 323 in which a gas valve 321 and a flow rate adjustment unit 322 are interposed. Therefore, when the gas valve 321 is opened, gas is discharged from the opening at the upper end of the gas supply pipe 31. The discharged gas collides with the disc 115 and spreads radially, and is discharged into the lower space U through the gap between the disc 115 and the recess 114. As a result, a gas flow is formed in the lower space U that, when viewed from above, spreads radially (radially outward) from the side of the rotation axis J1. The gas valve 321 and the flow rate adjustment unit 322 operate in accordance with instructions from the control unit 4, and the gas discharge timing, discharge amount, etc., are controlled by the control unit 4.

[0043] (Control Unit 4) The control unit 4 controls each part of the substrate processing apparatus 100 (spin chuck (substrate holding part) 1, processing liquid supply unit 2, and gas supply unit 3). The control unit 4 is composed of, for example, a general computer having an electrical circuit. As an example, as shown in Figure 12, the control unit 4 is composed of a CPU (Central Processor Unit) 41 as a central processing unit responsible for data processing, a ROM (Read Only Memory) 42 in which basic programs are stored, a RAM (Random Access Memory) 43 used as a work area when the CPU 41 performs predetermined processing (data processing), a storage device 44 composed of non-volatile storage devices such as flash memory and hard disk drives, and a bus line 45 connecting these to each other. The storage device 44 stores a program P that defines the processing to be executed by the control unit 4, and by executing this program P on the CPU 41, the control unit 4 can execute the processing defined by the program P. However, some or all of the processing to be executed by the control unit 4 may be executed by dedicated hardware such as logic circuits. Also, the program P may be stored on a recording medium, and the program P may be installed on the control unit 4 using this recording medium.

[0044] <2. Positioning pin> <2-1. Configuration of position control pins> The position regulating pins 13 provided on the base plate 11 will now be described. In the following description, the annular portion in plan view surrounding the main surface of the substrate 9, which is non-parallel to each main surface that extends flat, will be referred to as the "peripheral edge 93" of the substrate 9. Furthermore, the surface of the peripheral edge 93 of the substrate 9 that faces radially outward (typically, a surface perpendicular to the main surface) will be referred to as the "peripheral edge end face 930". In addition, the portion of the peripheral edge 93 of the substrate 9 that is connected to the lower side of the peripheral edge end face 930 will be referred to as the "peripheral edge lower surface 931", and the portion that is connected to the upper side of the peripheral edge end face 930 will be referred to as the "peripheral edge upper surface 932". In other words, the lower peripheral surface 931 is the portion located between the peripheral end face 930 and the lower surface (downward-facing main surface) 91 of the substrate 9, and the upper peripheral surface 932 is the portion located between the peripheral end face 930 and the upper surface (upward-facing main surface) 92 of the substrate 9. For example, if the diameter of the substrate 9 is 300 mm, the peripheral 93 is an annular region extending approximately 0.5 mm from the peripheral end face 930. Note that the peripheral 93 is, for example, curved in an arc shape, but is not limited to this shape.

[0045] As shown in Figure 2, multiple position regulating pins 13 (six in the example shown) are provided on the upper surface 111 of the base plate 11. The multiple position regulating pins 13 are arranged at equal intervals along the circumference of a reference circle C defined on the upper surface 111. However, the "reference circle C" is a hypothetical circle with the rotation axis J1 as its center and a radius that is approximately the same as the radius of the substrate 9. In other words, the circumference of the reference circle C is defined as overlapping the peripheral edge surface 930 of the substrate 9 at a position (hereinafter referred to as "normal position Q") where the center coincides with the rotation axis J1 when viewed from above. Multiple support pins 12 are also provided on the circumference of the reference circle C. That is, the multiple support pins 12 are arranged at equal intervals along the circumference of the reference circle C. Here, the same number of position regulating pins 13 and support pins 12 are provided, and the position regulating pins 13 and support pins 12 are arranged alternately at equal intervals along the circumference of the reference circle C.

[0046] Among the multiple position regulating pins 13 provided on the base plate 11 are stationary pins 13a and sliding pins 13b. For example, here, every other position regulating pin 13 along the circumferential direction of the reference circle C (that is, three position regulating pins 13 that are 120 degrees apart from each other when viewed from the rotation axis J1) are stationary pins 13a, and the remaining three position regulating pins 13 are sliding pins 13b.

[0047] (i) Stationary pin 13a The stationary pin 13a will be explained with reference to Figures 3 and 4. Figure 3 is a plan view of the stationary pin 13a. Figure 4 is a schematic side view showing how the stationary pin 13a moves between the release position P1 and the restricting position P2.

[0048] The stationary pin 13a comprises a substantially cylindrical base portion 61a and a projection portion 62a that protrudes upward from the upper end surface of the base portion 61a.

[0049] The base portion 61a is positioned within a cylindrical hole 116 provided on the upper surface 111 of the base plate 11. In other words, the upper surface 111 of the base plate 11 is provided with a plurality of holes 116 arranged at equal intervals along the circumference of a reference circle C, and the base portion 61a of each stationary pin 13a is positioned within each hole 116. A bearing 1161 (Figure 1) is provided in the hole 116, and the base portion 61a is supported so as to be rotatable around an axis (pin rotation axis) J2 that extends vertically through its center. A locking member (not shown) may also be provided in the hole 116 to limit the rotation range of the base portion 61a to a predetermined angular range. Furthermore, it is preferable that the upper surface of the base portion 61a is positioned at the same height as the upper surface 111 of the base plate 11, or slightly above the upper surface 111. With this configuration, when processing is performed using the processing liquid, the processing liquid does not accumulate on the upper surface of the base portion 61a.

[0050] The protruding portion 62a is positioned at an eccentric location (offset position) away from the pin rotation axis J2. A regulating surface (static regulating surface) 620a is provided on the side surface of the protruding portion 62a, in the portion facing the rotation axis J1 on that side surface. Specifically, the static regulating surface 620a comprises, for example, an upper surface 621a, a curved surface 622a extending below the upper surface 621a, and a lower surface 623a extending below the curved surface 622a. The upper surface 621a is a flat surface region that slopes upward in a direction approaching the rotation axis J1 (i.e., its normal direction is obliquely downward). The curved surface 622a is, for example, a curved surface with a curvature similar to that of the peripheral edge 93 of the substrate 9. The lower surface 623a is a flat surface region that slopes downward in a direction approaching the rotation axis J1 (i.e., its normal direction is obliquely upward). The inclination angle of the lower surface 623a is, for example, about the same as the inclination angle of the upper surface 621a.

[0051] The stationary pin 13a is driven by the pin drive mechanism 600 (described later) and rotated around the pin rotation axis J2. As a result, the stationary restricting surface 620a moves in a direction toward or toward the circumference of the reference circle C (and thus toward the peripheral edge 93 of the substrate 9 in the normal position Q). In other words, by rotating the stationary pin 13a around the pin rotation axis J2, the stationary restricting surface 620a moves between a position P1 that is relatively far from the peripheral edge 93 of the substrate 9 (release position) and a position P2 that is relatively close to the peripheral edge 93 of the substrate 9 (restricting position).

[0052] When the stationary pin 13a is in the release position P1, the stationary restricting surface 620a is sufficiently spaced apart from the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above and from the side (dotted line in Figure 3 and upper panel of Figure 4).

[0053] With the stationary pin 13a positioned at the regulated position P2, the stationary regulating surface 620a extends parallel to the tangent to the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above, and abuts against the peripheral edge 93 when viewed from the side (solid line in Figure 3 and lower panel in Figure 4). Specifically, the upper surface 621a abuts against the upper surface 932 of the peripheral edge, the curved surface 622a abuts against the end surface 930 of the peripheral edge, and the lower surface 623a abuts against the lower surface 931 of the peripheral edge. With the stationary pin 13a positioned at the regulated position P2, the stationary regulating surface 620a may be biased against the peripheral edge 93 of the substrate 9.

[0054] (ii) Sliding pin 13b The sliding pin 13b will be explained with reference to Figures 5 and 6. Figure 5 is a plan view of the sliding pin 13b. Figure 6 is a schematic side view showing how the sliding pin 13b moves between the release position P1 and the restricting position P2.

[0055] The sliding pin 13b, like the stationary pin 13a, comprises a substantially cylindrical base portion 61b and a projection portion 62b that protrudes upward from the upper end surface of the base portion 61b.

[0056] The base portion 61b, like the base portion 61a of the stationary pin 13a, is positioned within a cylindrical hole 116 provided on the upper surface 111 of the base plate 11. As described above, a bearing 1161 (Figure 1) is provided in the hole 116, and the base portion 61b is supported so as to be rotatable around the pin pivot axis J2 which extends vertically through its center.

[0057] The projection 62b is positioned offset from the pin rotation axis J2, similar to the projection 62a of the stationary pin 13a. A regulating surface (sliding regulating surface) 620b is provided on the side surface of the projection 62b, in the portion facing the rotation axis J1 on that side surface. Specifically, the sliding regulating surface 620b comprises, for example, an upper surface 621b and a side surface 622b that extends below the upper surface 621b. The upper surface 621b is a flat surface region that slopes upward in a direction that approaches the rotation axis J1 (i.e., its normal direction is obliquely downward). The inclination angle of the upper surface 621b is, for example, about the same as the inclination angle of the upper surface 621a of the stationary regulating surface 620a. The side surface 622b is a flat surface region that extends vertically (i.e., its normal direction extends in the horizontal plane). The upper surface 621b and the side surface 622b may be connected via, for example, a curved surface 623b. In this case, the curved surface 623b is, for example, a curved surface with a curvature similar to that of the peripheral edge 93 of the substrate 9.

[0058] The sliding pin 13b, like the stationary pin 13a, is driven by the pin drive mechanism 600 (described later) and rotates around the pin rotation axis J2. As a result, the sliding restricting surface 620b moves in a direction toward or toward the circumference of the reference circle C (and thus toward the peripheral edge 93 of the substrate 9 in the normal position Q). In other words, by rotating the sliding pin 13b around the pin rotation axis J2, the sliding restricting surface 620b moves between a position P1 where it is relatively far from the peripheral edge 93 of the substrate 9 (release position) and a position P2 where it is relatively close to the peripheral edge 93 of the substrate 9 (restricted position).

[0059] When the sliding pin 13b is in the release position P1, the sliding restricting surface 620b is sufficiently spaced apart from the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above and from the side (dotted line in Figure 5 and upper panel in Figure 6).

[0060] When the sliding pin 13b is positioned at the regulated position P2, the sliding regulating surface 620b extends parallel to the tangent to the peripheral edge 93 of the substrate 9 at the normal position Q when viewed from above, and faces the peripheral edge 93 in close proximity with a gap G between them when viewed from the side (i.e., faces each other without contact) (solid line in Figure 5 and lower panel in Figure 6). Specifically, the side surface 622b faces the peripheral edge end face 930 from the side with a gap G between them, and the top surface 621b faces the peripheral edge top surface 932 from diagonally above with a gap G between it and the peripheral edge top surface 932. The dimension of the gap G (the distance between the sliding regulating surface 620b and the peripheral edge 93 in the direction of opposition) is preferably a value that is sufficiently small compared to the diameter of the substrate 9. As an example, the dimension of the gap G is preferably about 0.1 mm.

[0061] <2-2. Location Restriction Status> The position-regulating pin 13 does not regulate the position of the substrate 9 when positioned in the release position P1, but regulates the position of the substrate 9 when positioned in the regulation position P2. The manner in which the position-regulating pin 13 regulates the position of the substrate 9 will be explained with reference to Figures 7 and 8. Figure 7 is a schematic plan view showing state M1 in which the stationary pin 13a regulates the position of the substrate 9. Figure 8 is a schematic plan view showing state M2 in which the sliding pin 13b regulates the position of the substrate 9. For the sake of explanation, in Figures 7 and 8, the protrusions 62a and 62b of the position-regulating pin 13 are shown in cross-section.

[0062] (i) Static restricted state M1 When each stationary pin 13a provided on the base plate 11 is positioned at the regulating position P2, a state M1 is formed in which each stationary pin 13a regulates the position of the substrate 9 (hereinafter referred to as the "stationary regulating state") (Figure 7). However, since the position regulation by the stationary pins 13a is tighter than the position regulation by the sliding pins 13b, the position regulation by the stationary pins 13a is not hindered by the position regulation by the sliding pins 13b. Therefore, in the stationary regulating state M1, the sliding pins 13b may be positioned at either the release position P1 or the regulating position P2. In this embodiment, in the stationary regulating state M1, the sliding pins 13b are positioned at the regulating position P2. The stationary regulating state M1 is released when both the stationary pins 13a and the sliding pins 13b are positioned at the release position P1.

[0063] In the static restricted state M1, the substrate 9 is restricted to a predetermined position (normal position) Q defined above the base plate 11, and its rotation is restricted so as not to rotate relative to the base plate 11.

[0064] In other words, in the statically restricted state M1, the statically restricted surfaces 620a of each statically restricted pin 13a abut against each other at different positions along the circumferential direction on the peripheral edge 93 of the substrate 9. Specifically, the upper surface 621a abuts against the upper surface 932 of the peripheral edge, the curved surface 622a abuts against the end surface 930 of the peripheral edge, and the lower surface 623a abuts against the lower surface 931 of the peripheral edge. As a result, the substrate 9 is restricted in position so as not to be displaced from a predetermined position in the radial and vertical directions. Here, since the multiple statically restricted pins 13a are provided on the circumference of a reference circle C centered on the rotation axis J1, the predetermined position where the substrate 9, whose position is restricted by the multiple statically restricted pins 13a, is placed is the position where the center of the substrate 9 coincides with the rotation axis J1 (i.e., the normal position Q). Furthermore, the substrate 9 is restricted from rotation by the frictional force it receives from the stationary restricting surface 620a that contacts (and is biased as necessary) its peripheral edge 93, so as not to be displaced in the rotational direction around the rotation axis J1 with respect to each stationary pin 13a (and consequently the base plate 11) (i.e., not to rotate relative to the base plate 11).

[0065] (ii) Slip restriction condition M2 When each sliding pin 13b provided on the base plate 11 is positioned at the restricting position P2, a state M2 is formed in which each sliding pin 13b restricts the position of the substrate 9 (hereinafter referred to as the "slip restricting state") (Figure 8). However, since the position restriction by the sliding pins 13b is weaker than the position restriction by the stationary pins 13a, the position restriction by the sliding pins 13b is hindered by the position restriction by the stationary pins 13a. Therefore, in the slip restricting state M2, the stationary pins 13a are positioned at the release position P1. The slip restricting state M2 is released when both the stationary pins 13a and the sliding pins 13b are positioned at the release position P1.

[0066] In the slip-restricted state M2, the substrate 9 is allowed to rotate relative to the base plate 11 (without being restricted from rotation), while its position is restricted so that it does not displace beyond an acceptable range from its normal position Q in the radial and upward directions.

[0067] In other words, in the sliding restriction state M2, the sliding restriction surfaces 620b of each sliding pin 13b face each other in close proximity (i.e., face each other without contact) at different positions along the circumferential direction on the peripheral edge 93 of the substrate 9, which is positioned at the normal position Q. Therefore, for example, when the substrate 9 is displaced radially from the normal position Q, when the amount of displacement reaches the dimension of the gap G, the sliding restriction surface 620b of at least one sliding pin 13b in the direction of displacement comes into contact with the peripheral edge 93 (typically, the side surface 622b comes into contact with the peripheral edge end surface 930), and the substrate 9 cannot be displaced any further. In other words, the substrate 9 is positioned so as not to be displaced radially beyond an allowable range (an allowable range corresponding to the gap G) from the normal position Q. For example, when the substrate 9 is displaced upward from its normal position Q, once the amount of displacement reaches the dimension of the gap G, the sliding restricting surface 620b of at least one sliding pin 13b comes into contact with the peripheral edge 93 (typically, the upper surface 621b comes into contact with the upper surface 932 of the peripheral edge), and the substrate 9 cannot be displaced any further. In other words, the substrate 9 is positioned so as not only in the radial direction but also in the upward direction that it does not displace beyond the allowable range (the allowable range corresponding to the gap G) from its normal position Q. Furthermore, in the sliding restricted state M2, even if the substrate 9 is displaced in the rotational direction around the rotation axis J1 at its normal position Q, the gap G between the sliding restricting surface 620b of each sliding pin 13b and the peripheral edge 93 of the substrate 9 is maintained. Therefore, the substrate 9 at its normal position Q can be displaced in the rotational direction around the rotation axis J1 without being hindered by each sliding pin 13b. In other words, the substrate 9 is allowed to rotate relative to the base plate 11 at its normal position Q. As described above, when the substrate 9 is displaced from its normal position Q, the sliding restricting surfaces 620b of some of the sliding pins 13b may come into contact with the peripheral edge 93 of the substrate 9. In this state, when the substrate 9 is displaced in the rotational direction around the rotation axis J1, the substrate 9 receives some frictional force from the sliding restricting surfaces 620b that are in contact with the peripheral edge 93. However, even in this case, a frictional force large enough to restrict the rotational displacement of the substrate 9 (i.e., a frictional force large enough to restrict the rotation so that the substrate 9 does not rotate relative to the base plate 11) does not act on the substrate 9.In other words, even when the substrate 9 is displaced to a position near the normal position Q (a position where the amount of displacement from the normal position Q does not exceed the allowable range corresponding to the gap G), it is permitted to rotate relative to the base plate 11.

[0068] <2-3. Pin drive mechanism> A pin drive mechanism 600 is connected to the position regulating pin 13, which rotates it around the pin rotation axis J2. The pin drive mechanism 600 rotates the position regulating pin 13, causing the position regulating pin 13 to move between the release position P1 and the regulating position P2. An example of the configuration of the pin drive mechanism 600 will be specifically explained with reference to Figures 1, 9, 10, and 11. Figures 9, 10, and 11 are schematic diagrams showing the lower surface 112 of the base plate 11. In Figures 9, 10, and 11, hatching is applied to the north pole side of the magnet. In addition, each rotating magnet 601a, 601b, each closing magnet 602a, 602b, and each opening magnet 603a, 603b are actually housed in dedicated holding members, but the holding members are not shown in the diagram.

[0069] (Rotating magnets 601a, 601b) The pin drive mechanism 600 comprises a plurality of first rotating magnets 601a and a plurality of second rotating magnets 601b. Each of the plurality of first rotating magnets 601a is attached to a stationary pin 13a on the lower surface 112 side of the base plate 11. Each of the plurality of second rotating magnets 601b is attached to a sliding pin 13b on the lower surface 112 side of the base plate 11. Both the first rotating magnets 601a and the second rotating magnets 601b are, for example, permanent magnets, and the direction of their magnetic poles (magnetization direction) is, for example, perpendicular to the rotation axis J1 and the pin rotation axis J2.

[0070] (Closure magnets 602a, 602b) The pin drive mechanism 600 further comprises a plurality of first blocking magnets 602a and a plurality of second blocking magnets 602b. Each of the plurality of first blocking magnets 602a is fixed to the lower surface 112 of the base plate 11 in the vicinity of the first rotational magnet 601a. ​​Each of the plurality of second blocking magnets 602b is fixed to the lower surface 112 of the base plate 11 in the vicinity of the second rotational magnet 601b. Both the first blocking magnets 602a and the second blocking magnets 602b are, for example, permanent magnets, and the orientation of their magnetic poles is, for example, perpendicular to the rotation axis J1 and the pin rotation axis J2, and inclined with respect to the radial direction of a circle centered on the rotation axis J1. However, the orientation of the magnetic poles of the first blocking magnets 602a and the orientation of the magnetic poles of the second blocking magnets 602b are opposite to each other with respect to the radial direction of a circle centered on the rotation axis J1. For example, if the first blocking magnet 602a has a magnetic pole orientation such that its south pole is located on the side of the rotation axis J1, then the second blocking magnet 602b is oriented so that its north pole is located on the side of the rotation axis J1.

[0071] (Open magnets 603a, 603b) The pin drive mechanism 600 further comprises a plurality of first open magnets 603a and a plurality of second open magnets 603b. Both the first open magnets 603a and the second open magnets 603b are provided below the base plate 11, independently of the base plate 11 (Figure 1). Both the first open magnets 603a and the second open magnets 603b are arc-shaped in plan view and are arranged below the base plate 11 on the circumference of a circle (a circle with a smaller diameter than the reference circle C) centered on the rotation axis J1. However, the first open magnets 603a and the second open magnets 603b are arranged alternately along the circumferential direction with a certain gap between them. When the base plate 11 has stopped rotating at a predetermined rotation stop position, each first open magnet 603a is positioned in the vicinity of the first rotating magnet 601a in a plan view, and each second open magnet 603b is positioned in the vicinity of the second rotating magnet 601b in a plan view. Both the first open magnet 603a and the second open magnet 603b are, for example, permanent magnets, and the direction of their magnetic poles is aligned with the radial direction of a circle centered on the rotation axis J1. However, the direction of the magnetic poles of the first open magnet 603a and the direction of the magnetic poles of the second open magnet 603b are opposite to each other. Furthermore, with respect to the radial direction of the circle centered on the rotation axis J1, the orientation of the magnetic poles of the first open magnet 603a is opposite to that of the magnetic poles of the first closed magnet 602a, and the orientation of the magnetic poles of the second open magnet 603b is opposite to that of the magnetic poles of the second closed magnet 602b. For example, if the south pole of the first closed magnet 602a is positioned on the side of the rotation axis J1 and the north pole of the second closed magnet 602b is positioned on the side of the rotation axis J1, the first open magnet 603a is oriented so that its north pole is positioned on the side of the rotation axis J1, and the second open magnet 603b is oriented so that its south pole is positioned on the side of the rotation axis J1.

[0072] (Magnetic lifting mechanism 604a, 604b) The pin drive mechanism 600 further comprises a first magnet lifting mechanism 604a for raising and lowering (moving vertically) a plurality of first open magnets 603a, and a second magnet lifting mechanism 604b for raising and lowering a plurality of second open magnets 603b (Figure 1). Both the first magnet lifting mechanism 604a and the second magnet lifting mechanism 604b are located below the base plate 11.

[0073] The first magnet lifting mechanism 604a specifically comprises, for example, a piston rod 6041a and an air cylinder 6042a that moves it forward and backward. One of the first open magnets 603a is attached to the tip of the piston rod 6041a. However, the multiple first open magnets 603a are connected to each other by an annular member (not shown). When the piston rod 6041a is lowered by the drive of the air cylinder 6042a, the multiple first open magnets 603a are positioned at a sufficiently far distance (spaced position) from the lower surface 112 of the base plate 11 (solid line in Figure 1). At this time, the first open magnets 603a do not have a magnetic effect on the first rotating magnet 601a. ​​On the other hand, when the piston rod 6041a is raised by the drive of the air cylinder 6042a, the multiple first open magnets 603a are positioned at a close distance (close position) from the lower surface 112 of the base plate 11 (dotted line in Figure 1). At this time, the first open magnet 603a exerts a magnetic influence on the first rotating magnet 601a.

[0074] The second magnet lifting mechanism 604b specifically comprises, for example, a piston rod 6041b and an air cylinder 6042b that moves it forward and backward. One of the second open magnets 603b is attached to the tip of the piston rod 6041b. However, the multiple second open magnets 603b are connected to each other by an annular member (not shown). When the piston rod 6041b is driven by the air cylinder 6042b and moves downward, the multiple second open magnets 603b are positioned at a sufficiently far distance (spaced position) from the lower surface 112 of the base plate 11 (dotted line in Figure 1). At this time, the second open magnets 603b do not have a magnetic effect on the second rotating magnet 601b. On the other hand, when the piston rod 6041b is driven by the air cylinder 6042b and moves upward, the multiple second open magnets 603b are positioned at a close distance (close position) from the lower surface 112 of the base plate 11 (solid line in Figure 1). At this time, the second open magnet 603b exerts a magnetic influence on the second rotating magnet 601b.

[0075] (Method of driving the stationary pin 13a) When multiple first open magnets 603a are arranged in close proximity, each first open magnet 603a is positioned near the first rotating magnet 601a, and the first open magnets 603a exert a magnetic influence on the first rotating magnet 601a (Figures 10 and 11). At this time, the magnetic attractive force between the first rotating magnet 601a and the first open magnet 603a becomes greater than the magnetic attractive force between the first rotating magnet 601a and the first closed magnet 602a. As a result, the first rotating magnet 601a assumes a first orientation (for example, an orientation where the south pole is positioned on the opposite side of the rotation axis J1 and the north pole is positioned on the side of the rotation axis J1) due to the magnetic attractive force between it and the first open magnet 603a (in the example shown in the figure, the orientation of the magnetic poles of the first rotating magnet 601a at this time is inclined with respect to the radial direction of a circle centered on the rotation axis J1). When the first rotating magnet 601a is in the first position, the position of the stationary pin 13a (i.e., the stationary pin 13a attached to the first rotating magnet 601a) (angle position around the pin rotation axis J2) becomes the release position P1. In other words, when multiple first open magnets 603a are arranged in close proximity, each of the multiple stationary pins 13a is positioned at the release position P1.

[0076] On the other hand, when multiple first open magnets 603a are positioned at spaced-out positions, each first open magnet 603a is positioned sufficiently far from the first rotating magnet 601a (Figure 9). At this time, the magnetic attractive force between the first rotating magnet 601a and the first closed magnet 602a becomes greater than the magnetic attractive force between the first rotating magnet 601a and the first open magnet 603a. As a result, the first rotating magnet 601a is forced into a second position different from the first position by the magnetic attractive force between it and the first closed magnet 602a (for example, a position where the N pole is positioned on the opposite side of the rotation axis J1 and the S pole is positioned on the side of the rotation axis J1) (in the example shown in the figure, the orientation of the magnetic poles of the first rotating magnet 601a at this time is inclined with respect to the radial direction of a circle centered on the rotation axis J1). When the first rotating magnet 601a is in the second position, the position of the stationary pin 13a (i.e., the stationary pin 13a attached to the first rotating magnet 601a) (angle position around the pin rotation axis J2) becomes the restricted position P2. In other words, when multiple first open magnets 603a are positioned at spaced-out positions, each of the multiple stationary pins 13a is positioned at the restricted position P2.

[0077] Thus, when multiple first open magnets 603a are moved from a separated position to a close position by the drive of the first magnet lifting mechanism 604a, multiple stationary pins 13a move synchronously from the restricted position P2 to the released position P1. On the other hand, when multiple first open magnets 603a are moved from a close position to a separated position by the drive of the first magnet lifting mechanism 604a, multiple stationary pins 13a move synchronously from the released position P1 to the restricted position P2. Note that when the base plate 11 rotates around the rotation axis J1, the first rotating magnet 601a and the first closing magnet 602a rotate together with the base plate 11, while the first open magnet 603a does not rotate. In a situation where multiple first open magnets 603a are positioned in close proximity and the base plate 11 is rotated at a certain speed or higher (for example, above the liquid processing rotation speed f1 described later), each first open magnet 603a positioned in close proximity substantially exerts a magnetic attractive force on each first rotating magnet 601a, regardless of the position (angular position) of each first rotating magnet 601a. ​​Therefore, each stationary pin 13a is maintained in the released position P1.

[0078] (Method of driving the sliding pin 13b) When multiple second open magnets 603b are arranged in close proximity, each second open magnet 603b is positioned near the second rotating magnet 601b, and the second open magnets 603b exert a magnetic influence on the second rotating magnet 601b (Figure 10). At this time, the magnetic attractive force between the second rotating magnet 601b and the second open magnet 603b becomes greater than the magnetic attractive force between the second rotating magnet 601b and the second closed magnet 602b. As a result, the second rotating magnet 601b assumes a first orientation (for example, an orientation where the N pole is positioned on the opposite side of the rotation axis J1 and the S pole is positioned on the side of the rotation axis J1) due to the magnetic attractive force between it and the second open magnet 603b (in the example shown in the figure, the orientation of the magnetic poles of the second rotating magnet 601b at this time is inclined with respect to the radial direction of a circle centered on the rotation axis J1). When the second rotating magnet 601b is in the first position, the position of the sliding pin 13b (i.e., the sliding pin 13b attached to the second rotating magnet 601b) (angle position around the pin rotation axis J2) becomes the release position P1. In other words, when multiple second open magnets 603b are arranged in close proximity, each of the multiple sliding pins 13b is positioned at the release position P1.

[0079] On the other hand, when multiple second open magnets 603b are positioned at spaced distances from each other, each second open magnet 603b is positioned sufficiently far from the second rotating magnet 601b (Figures 9 and 11). At this time, the magnetic attractive force between the second rotating magnet 601b and the second closed magnet 602b becomes greater than the magnetic attractive force between the second rotating magnet 601b and the second open magnet 603b. As a result, the second rotating magnet 601b is forced into a second orientation different from the first orientation by the magnetic attractive force between it and the second closed magnet 602b (for example, an orientation where the south pole is positioned on the opposite side of the rotation axis J1 and the north pole is positioned on the side of the rotation axis J1) (in the example shown in the figure, the orientation of the magnetic poles of the second rotating magnet 601b at this time is inclined with respect to the radial direction of a circle centered on the rotation axis J1). When the second rotating magnet 601b is in its second position, the position of the sliding pin 13b (i.e., the sliding pin 13b attached to the second rotating magnet 601b) (angle position around the pin rotation axis J2) becomes the restricted position P2. In other words, when multiple second open magnets 603b are positioned at spaced-out positions, each of the multiple sliding pins 13b is positioned at the restricted position P2.

[0080] Thus, when multiple second open magnets 603b are moved from a separated position to a close position by the drive of the second magnet lifting mechanism 604b, multiple sliding pins 13b move synchronously from the restricted position P2 to the released position P1. On the other hand, when multiple second open magnets 603b are moved from a close position to a separated position by the drive of the second magnet lifting mechanism 604b, multiple sliding pins 13b move synchronously from the released position P1 to the restricted position P2. Furthermore, as described above, when multiple second open magnets 603b are positioned in close proximity and the base plate 11 is rotated at a certain speed or higher, each sliding pin 13b is maintained in the released position P1.

[0081] <3. Processing Flow> The processing flow performed by the substrate processing apparatus 100 will be explained with reference to Figures 12, 13, and 14. Figure 12 is a block diagram showing the configuration of the control unit 4. Figure 13 is a diagram showing the processing flow performed by the substrate processing apparatus 100. Figure 14 is a diagram illustrating the processing flow performed by the substrate processing apparatus 100.

[0082] The processing performed by the substrate processing apparatus 100 is carried out by the control unit 4 controlling each part of the substrate processing apparatus 100 (rotating mechanism 14, chemical valve 221a, flow rate adjustment unit 222a, rinse liquid valve 221b, flow rate adjustment unit 222b, gas valve 321, flow rate adjustment unit 322, pin drive mechanism 600, etc.). Furthermore, the series of processes described below are usually performed repeatedly. That is, once the series of processes on one substrate 9 is completed, the same series of processes is then performed on another new substrate 9.

[0083] Step S1 First, the substrate 9 to be processed is brought into the substrate processing apparatus 100. Specifically, an external transport mechanism first inserts a hand holding the substrate 9 into the chamber of the substrate processing apparatus 100 and positions it above the base plate 11. Here, for example, a pattern for a device (a device in the process of being manufactured) is formed on one main surface of the substrate 9 to be processed, and the substrate processing apparatus 100 processes the other main surface on which the pattern is not formed. In this case, the substrate 9 held by the hand is oriented such that the main surface on which the pattern is formed faces downward (becoming the bottom surface 91), and the main surface on which the pattern is not formed faces upward (becoming the top surface 92).

[0084] Step S2 Next, the hand is lowered. When the hand holding the substrate 9 is positioned above the base plate 11, each support pin 12 is in the upper position, and each stationary pin 13a and each sliding pin 13b are all in the release position P1. Therefore, when the hand is lowered, the peripheral edge 93 of the substrate 9 is supported from below by each support pin 12. This transfers the substrate 9 from the hand onto each support pin 12. After that, the transport mechanism retracts the hand from above the base plate 11 and exits the chamber of the substrate processing device 100. When the hand is retracted from above the base plate 11, each support pin 12 is lowered and positioned in the lower position.

[0085] Step S3 Next, the pin drive mechanism 600 moves each stationary pin 13a and each sliding pin 13b from the release position P1 to the restricting position P2. When each stationary pin 13a begins to move (rotate) toward the restricting position P2, first the lower surface 623a of the stationary restricting surface 620a comes into contact with the lower surface 931 of the peripheral edge of the substrate 9 supported by each support pin 12. Subsequently, as each stationary pin 13a continues to move, the substrate 9 is guided by the lower surface 623a and moves upward (lifted) while maintaining a horizontal position, separating from each support pin 12. Then, with each stationary pin 13a in the restricted position P2, a stationary restricting state M1 is formed in which each stationary pin 13a restricts the position of the substrate 9 (Figure 7). As described above, in the stationary restricting state M1, each sliding pin 13b may be positioned in either the release position P1 or the restricting position P2, but here it is positioned in the restricting position P2.

[0086] Step S4 Next, the gas supply unit 3 begins supplying gas to the lower space U. Specifically, the gas valve 321 is opened. As a result, the gas supplied from the gas supply source 32 is discharged from the gas supply pipe 31 at a predetermined flow rate adjusted by the flow rate adjustment unit 322. The gas supply rate is, for example, 200 L / min (liters per minute) or more. The gas supply unit 3 continues to supply gas while processing is being performed on the substrate 9.

[0087] Step S5 Next, the base plate 11 starts rotating. That is, the rotation mechanism 14 rotates the base plate 11 around the rotation axis J1, increasing its rotational speed to a predetermined liquid processing rotational speed f1. In the static restriction state M1, the substrate 9 is restricted from rotating relative to the base plate 11. That is, in the static restriction state M1, the substrate 9 rotates together with the base plate 11 (at the same rotational speed). Therefore, when the base plate 11 starts rotating and its rotational speed increases to the liquid processing rotational speed f1, the substrate 9 also starts rotating together with the base plate 11 and its rotational speed increases to the liquid processing rotational speed f1. The liquid processing rotational speed f1 is, for example, 150 to 1800 rpm.

[0088] Step S6 When the rotational speed of the base plate 11 reaches the liquid processing rotational speed f1, the rotation mechanism 14 maintains the rotational speed of the base plate 11 at the liquid processing rotational speed f1. In this state, the pin drive mechanism 600 moves each stationary pin 13a from the restricted position P2 to the release position P1 while keeping each sliding pin 13b in the restricted position P2. This creates a sliding restricted state M2 in which each sliding pin 13b restricts the position of the substrate 9 (Figure 8). In other words, the system switches from the stationary restricted state M1 to the sliding restricted state M2.

[0089] In the slip-restricted state M2, the substrate 9 is permitted to rotate relative to the base plate 11. That is, when switching from the static restriction state M1 to the slip-restricted state M2, the substrate 9 becomes capable of rotating relative to the base plate 11. However, the rotational speed of the base plate 11 is kept constant before and after the switch. Also, due to inertia, the substrate 9 continues to rotate at almost the same speed before and after the switch (the rotational speed hardly changes). Therefore, even after switching to the slip-restricted state M2, the substrate 9 and the base plate 11 continue to rotate at almost the same speed relative to each other (that is, the substrate 9 hardly rotates relative to the base plate 11). Furthermore, in the slip-restricted state M2, the substrate 9 may be displaced from the normal position Q within an allowable range (an allowable range corresponding to the gap G). However, if the substrate 9 is rotating at a sufficient speed, the centrifugal force acting on the substrate 9 makes it highly likely that the substrate 9 will hardly be displaced radially (remain in the normal position Q). Furthermore, because the substrate 9 is subjected to the pressure of the gas supplied to the space below U, it is highly likely that the substrate 9 will hardly displace in the vertical direction (remain in its normal position Q).

[0090] Step S7 Next, the processing liquid supply unit 2 begins supplying the chemical solution as the first processing liquid. Specifically, the processing liquid nozzle 21 is positioned at the discharge position, and the chemical solution valve 221a is opened. Then, the chemical solution supplied from the chemical solution supply source 22a begins to be discharged from the processing liquid nozzle 21, and the chemical solution begins to be supplied to the upper surface 92 of the substrate 9. The chemical solution supplied to the upper surface 92 of the substrate 9 spreads toward the periphery due to the centrifugal force caused by the rotation of the substrate 9, and the entire upper surface 92 is treated with the chemical solution. In other words, chemical treatment is performed on the substrate 9.

[0091] Step S8 Next, the rotation mechanism 14 changes the rotational speed of the base plate 11 from the liquid processing rotational speed f1 to a larger sliding rotational speed f2. As described above, in the sliding restricted state M2, the substrate 9 can rotate relative to the base plate 11. Therefore, even if the rotational speed of the base plate 11 changes, the rotational speed of the substrate 9 does not change in response. In other words, here, the rotational speed of the substrate 9 is maintained at the liquid processing rotational speed f1, while only the rotational speed of the base plate 11 changes to the sliding rotational speed f2. This creates a rotational speed difference Δf between the substrate 9 and the base plate 11, causing the substrate 9 to rotate relative to the base plate 11. The difference between the sliding rotational speed f2 and the liquid processing rotational speed f1 (change in rotational speed) Δf is preferably 50 rpm or more. It is also preferable that the change in rotational speed Δf is about 5% of the liquid processing rotational speed f1. For example, if the liquid processing rotational speed f1 is 1000 rpm, the change Δf is preferably about 50 rpm.

[0092] At this stage, the substrate 9 to which the chemical solution is supplied (the substrate 9 undergoing chemical treatment) is rotated relative to the base plate 11. As the substrate 9 rotates relative to the base plate 11, the sliding pins 13b provided on the base plate 11 move relative to the peripheral edge 93 of the substrate 9 in the circumferential direction. In other words, the positions where the sliding pins 13b face each other on the peripheral edge 93 of the substrate 9 (pin opposing positions) change constantly in the circumferential direction. Chemical solution is less likely to be supplied to the pin opposing positions compared to other positions. Therefore, if a specific position in the circumferential direction on the peripheral edge 93 of the substrate 9 is always a pin opposing position, a difference in the amount of chemical solution supplied (and consequently, the rate of chemical treatment) may occur between that position and other positions. Here, since the pin opposing positions change constantly in the circumferential direction while the chemical treatment is being performed, it becomes less likely that there will be an uneven distribution of the amount of chemical solution supplied across the entire circumferential direction of the peripheral edge 93 of the substrate 9, and the peripheral edge 93 will be treated uniformly across the entire circumferential direction. Furthermore, at the pin-opposing positions, the chemical solution supplied to one main surface of the substrate 9 (in this case, the upper surface 92) can easily flow along the sliding pins 13b and wrap around to the other main surface (in this case, the lower surface 91). Therefore, if a specific circumferential position on the peripheral edge 93 of the substrate 9 is always a pin-opposing position, the leakage of the chemical solution will concentrate at that position, and a peak in the leakage width will appear at that position. Here, since the pin-opposing positions change circumferentially moment by moment while the chemical solution treatment is being performed, the leakage of the chemical solution does not concentrate at a specific circumferential position on the peripheral edge 93 of the substrate 9. Therefore, a peak in the leakage width is less likely to appear. In other words, the maximum value of the leakage width can be kept small. Moreover, here, each sliding pin 13b is positioned opposite the peripheral edge 93 of the substrate 9, which is positioned at the normal position Q, while providing a gap G. Therefore, when the substrate 9 rotates relative to the base plate 11 at or near the normal position Q, and each sliding pin 13b moves relative to the peripheral edge 93 of the substrate 9 in the circumferential direction, the peripheral edge 93 is less likely to be damaged by friction with the sliding pins 13b.

[0093] Step S9 After a predetermined time has elapsed since the supply of the first treatment solution (chemical solution) began, the treatment solution supply unit 2 stops supplying the chemical solution and starts supplying the second treatment solution (rinsing solution). Specifically, with the treatment solution nozzle 21 positioned at the discharge location, the chemical solution valve 221a is closed and the rinsing solution valve 221b is opened. Then, instead of the chemical solution supplied from the chemical solution supply source 22a, the rinsing solution supplied from the rinsing solution supply source 22b is discharged from the treatment solution nozzle 21, and the rinsing solution is supplied to the upper surface 92 of the substrate 9. The rinsing solution supplied to the upper surface 92 of the substrate 9 spreads toward the periphery due to the centrifugal force caused by the rotation of the substrate 9. As a result, the chemical solution on the upper surface 92 of the substrate 9 is replaced by the rinsing solution and washed away (rinsed). In other words, the substrate 9 is rinsed.

[0094] Step S10 After a predetermined time has elapsed since the start of supplying the rinse solution as the second processing solution, and for example, when the concentration of the chemical solution on the upper surface 92 of the substrate 9 has decreased sufficiently, the rotating mechanism 14 changes the rotation speed of the base plate 11 so that the rotation speed of the base plate 11 matches (or is very close to) the rotation speed of the substrate 9 at that time. For example, if the rotation speed of the substrate 9 at that time is the liquid processing rotation speed f1, the rotating mechanism 14 changes the rotation speed of the base plate 11 from the sliding rotation speed f2 to the liquid processing rotation speed f1.

[0095] Step S11 Next, the pin drive mechanism 600 moves each stationary pin 13a from the release position P1 to the restricted position P2, while keeping each sliding pin 13b in the restricted position P2. This creates a stationary restricted state M1 in which each stationary pin 13a restricts the position of the substrate 9 (Figure 7). In other words, it switches from the sliding restricted state M2 to the stationary restricted state M1. When it switches from the sliding restricted state M2 to the stationary restricted state M1, the substrate 9 begins to rotate together with the base plate 11 at the normal position Q.

[0096] Step S12 Subsequently, the processing liquid supply unit 2 stops supplying the rinsing liquid. Specifically, the rinsing liquid valve 221b is closed. As a result, the discharge of rinsing liquid from the processing liquid nozzle 21 stops.

[0097] Step S13 Next, the rotating mechanism 14 increases the rotational speed of the base plate 11 to a drying rotational speed f3 that is sufficiently greater than the liquid treatment rotational speed f1. In the static restricted state M1, the substrate 9 rotates together with the base plate 11, so when the rotational speed of the base plate 11 is increased to the drying rotational speed f3, the rotational speed of the substrate 9 also increases to the drying rotational speed f3 along with the base plate 11. The drying rotational speed f3 is, for example, 1000 to 2500 rpm.

[0098] Step S14 When the rotational speed of the base plate 11 reaches the drying rotational speed f3, the rotation mechanism 14 maintains the rotational speed of the base plate 11 at the drying rotational speed f3. In the static restricted state M1, the substrate 9 rotates together with the base plate 11, so while the rotational speed of the base plate 11 is maintained at the drying rotational speed f3, the rotational speed of the substrate 9 is also maintained at the drying rotational speed f3. In this state, a large centrifugal force acts on the liquid adhering to the substrate 9, causing the liquid to be spun around the substrate 9, and the substrate 9 is dried (spin-drying process).

[0099] Step S15 When the liquid adhering to the substrate 9 is sufficiently shaken off, the rotation of the base plate 11 stops. That is, the rotation mechanism 14 reduces the rotation speed of the base plate 11 from the drying rotation speed f3 to zero. In the static restricted state M1, the substrate 9 rotates together with the base plate 11, so when the rotation speed of the base plate 11 is reduced from the drying rotation speed f3 to zero, the rotation speed of the substrate 9 also decreases from the drying rotation speed f3 to zero along with the base plate 11.

[0100] Step S16 Next, the gas supply unit 3 stops supplying gas to the lower space U. Specifically, the gas valve 321 is closed.

[0101] Step S17 Next, the pin drive mechanism 600 moves each stationary pin 13a and each sliding pin 13b from the restricted position P2 to the released position P1. As each stationary pin 13a moves, the substrate 9 moves downward while maintaining a horizontal position, guided by the lower surface 623a of the stationary restricting surface 620a. With each stationary pin 13a in the released position P1, the substrate 9 is supported from below by each support pin 12. Subsequently, each support pin 12 is raised and positioned in the upper position.

[0102] Step S18 Subsequently, the substrate 9 is discharged from the substrate processing device 100. Specifically, an external transport mechanism inserts a hand into the chamber of the substrate processing device 100, moves it between the lower surface 91 of the substrate 9, which is supported by each support pin 12, and the base plate 11, and then raises it. This transfers the substrate 9 from each support pin 12 onto the hand. After that, the transport mechanism removes the hand holding the substrate 9 from the chamber of the substrate processing device 100.

[0103] <4. Effects> The substrate processing apparatus 100 according to the above embodiment comprises a base plate 11, a plurality of position regulating pins 13, a pin drive mechanism 600, a rotation mechanism 14, a processing liquid supply unit 2, and a control unit 4. The position regulating pins 13 are provided on the base plate 11 and regulate the position of the substrate 9, which is positioned horizontally above the base plate 11. The pin drive mechanism 600 moves each of the plurality of position regulating pins 13 between a regulating position P2 in which the position regulating pin 13 regulates the position of the substrate 9 and a release position P1 in which the position regulating pin 13 does not regulate the position of the substrate 9. The rotation mechanism 14 rotates the base plate 11 around a rotation axis J1 that extends vertically. The processing liquid supply unit 2 supplies processing liquid to the substrate 9. The control unit 4 controls the pin drive mechanism 600, the rotation mechanism 14, and the processing liquid supply unit 2. The plurality of position regulating pins 13 also include stationary pins 13a and sliding pins 13b. The stationary pin 13a, when positioned at the regulated position P2, contacts the peripheral edge 93 of the substrate 9, thereby restricting the position of the substrate 9 to the normal position Q defined above the base plate 11, and restricting its rotation so that it does not rotate relative to the base plate 11. The sliding pin 13b, when positioned at the regulated position P2, is positioned opposite the peripheral edge 93 of the substrate 9, which is positioned at the normal position Q, while providing a gap G, thereby restricting the position of the substrate 9 so that it does not displace radially from the normal position Q beyond a permissible range, while allowing it to rotate relative to the base plate 11.

[0104] In this configuration, the substrate 9 can rotate relative to the base plate 11 at or near the normal position Q (a position where the displacement from the normal position Q does not exceed an allowable range) while being restricted in position by the sliding pins 13b. When the substrate 9 rotates relative to the base plate 11, the sliding pins 13b provided on the base plate 11 move relative to the peripheral edge 93 of the substrate 9 in the circumferential direction, and the position where the sliding pins 13b face each other on the peripheral edge 93 of the substrate 9 (pin opposing position) changes moment by moment in the circumferential direction. Therefore, the influence of the sliding pins 13b on the processing is reduced.

[0105] Furthermore, in the above embodiment, the control unit 4 controls the pin drive mechanism 600 to switch between a stationary restriction state M1 in which the stationary pin 13a restricts the position of the substrate 9 and a sliding restriction state M2 in which the sliding pin 13b restricts the position of the substrate 9. In the sliding restriction state M2, the control unit 4 controls the processing liquid supply unit 2 to supply processing liquid to the substrate 9. In the sliding restriction state M2, the substrate 9 can rotate relative to the base plate 11, and as the substrate 9 rotates relative to the base plate 11, the pin opposing positions change circumferentially. As the pin opposing positions change circumferentially, it becomes less likely that the amount of processing liquid supplied will be uneven across the entire circumferential edge 93 of the substrate 9, and the circumferential edge 93 will be processed uniformly across the entire circumferential edge. In addition, as the pin opposing positions change circumferentially, the leakage of processing liquid does not concentrate at a specific position in the circumferential direction on the circumferential edge 93 of the substrate 9, so that a peak in the leakage width is less likely to appear. That is, the maximum value of the leakage width can be kept small.

[0106] Furthermore, in the above embodiment, the control unit 4 controls the rotation mechanism 14 in the slip-restricted state M2 to change the rotation speed of the base plate 11. In the slip-restricted state M2, even if the rotation speed of the base plate 11 changes, the rotation speed of the substrate 9 does not change in response. Therefore, by changing the rotation speed of the base plate 11, a difference in rotation speed is created between the substrate 9 and the base plate 11, allowing the substrate 9 to rotate relative to the base plate 11.

[0107] Furthermore, in the above embodiment, the sliding pin 13b has a sliding restricting surface 620b that, when positioned at the restricting position P2, faces the peripheral edge 93 of the substrate 9 positioned at the normal position Q while providing a gap G. The sliding restricting surface 620b has a side surface 622b that faces the peripheral edge 93 from the side and an upper surface 621b that faces the peripheral edge 93 from diagonally above. Therefore, when the sliding pin 13b is positioned at the restricting position P2, the substrate 9 can be restricted in the radial and upward directions so as not to displace beyond an allowable range corresponding to the gap G from the normal position Q. Note that the sliding pin 13b does not have a surface on the sliding restricting surface 620b that faces the peripheral edge 93 from diagonally below. Therefore, when the sliding pin 13b is positioned at the restricting position P2, the substrate 9 is allowed to displace from the normal position Q in the downward direction (no position restriction). However, as in the embodiment described above, when gas is supplied to the lower space U, the pressure of this gas acts on the substrate 9, sufficiently suppressing displacement of the substrate 9 from its normal position Q in the downward direction. By not having a surface that faces the peripheral edge 93 from diagonally below the sliding restricting surface 620b, the peripheral edge 93 is less susceptible to damage due to friction when the sliding pin 13b moves relative to the peripheral edge 93 of the substrate 9 in the circumferential direction.

[0108] Furthermore, in the above embodiment, when the sliding pin 13b is positioned at the regulated position P2, the distance between the sliding regulating surface 620b and the peripheral edge 93 of the substrate 9 at the normal position Q in the opposing direction (dimension of the gap G) is set to approximately 0.1 mm. The larger the dimension of the gap G, the less likely the substrate 9 is to be damaged by friction with the sliding pin 13b. On the other hand, the larger the dimension of the gap G, the larger the amount of displacement (swing) that the substrate 9 can be allowed to have from the normal position Q. When the amount of allowed displacement is large, the impact that occurs when the substrate 9 is displaced from the normal position Q and comes into contact with the sliding pin 13b tends to be large (as a result, for example, collision noise is likely to occur). Also, if the substrate 9 is processed at a position that is significantly displaced from the normal position, there is a risk that the uniformity of the processing across the entire main surface of the substrate 9 cannot be guaranteed. By setting the dimension of the gap G to a value that is sufficiently small relative to the diameter of the substrate 9 (preferably, approximately 0.1 mm), these problems can be sufficiently avoided.

[0109] Furthermore, the substrate processing method according to the above embodiment includes a step of forming a static restriction state M1 in which a stationary pin 13a provided on the base plate 11 contacts the peripheral edge 93 of the substrate 9 which is positioned horizontally above the base plate 11, thereby restricting the position of the substrate 9 to a predetermined normal position Q above the base plate 11 and restricting its rotation so that it does not rotate relative to the base plate 11 (static restriction state formation step: step S3), and a step of increasing the rotation speed of the base plate 11 to a predetermined liquid processing rotation speed f1 in the static restriction state M1 ( The process includes a fast-start step (step S5), a step after the acceleration step in which the sliding pins 13b provided on the base plate 11 are positioned opposite the peripheral edge 93 of the substrate 9, which is positioned at the normal position Q, while providing a gap G, thereby forming a sliding restriction state M2 that restricts the position of the substrate 9 so as not to be displaced beyond a permissible range from the normal position Q, while allowing relative rotation with respect to the base plate 11 (sliding restriction state formation step: step S6), and a step in which processing liquid is supplied to the substrate 9 in the sliding restriction state M2 (processing liquid supply step: step S7). With this configuration, the influence of the sliding pins 13b on the process is reduced.

[0110] <5. Variation> The configuration and operation of the substrate processing apparatus 100 according to the above embodiment can be modified as appropriate. In the following description, elements similar to those described in the above embodiment will be denoted by the same reference numerals, and their descriptions will be omitted.

[0111] <5-1. First variation> The sliding pin 13c in the first modified example will be explained with reference to Figure 15. Figure 15 is a schematic side view showing how the sliding pin 13c moves between the release position P1 and the restricting position P2.

[0112] (Construction of the 13c sliding pin) The basic configuration of the sliding pin 13c is the same as that of the stationary pin 13a according to the above embodiment. That is, the sliding pin 13c comprises a substantially cylindrical base portion 61c and a projection portion 62c that protrudes upward from the upper end surface of the base portion 61c. The sliding restricting surface 620c provided on the projection portion 62c comprises an upper surface 621c, a curved surface 622c that is connected below the upper surface 621c, and a lower surface 623c that is connected below the curved surface 622c. The upper surface 621c is a flat surface region that is inclined in a direction that approaches the rotation axis J1 as it goes upward. The curved surface 622c is, for example, a curved surface that is curved with a curvature similar to that of the peripheral edge 93 of the substrate 9. The lower surface 623c is a flat surface region that is inclined in a direction that approaches the rotation axis J1 as it goes downward.

[0113] The sliding pin 13c is driven by the pin drive mechanism 600 and rotated around the pin rotation axis J2, thereby moving between the release position P1 and the restricting position P2. When the sliding pin 13c is in the release position P1, the sliding restricting surface 620c is sufficiently spaced away from the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above and from the side (upper part of Figure 15). When the sliding pin 13c is in the restricting position P2, the sliding restricting surface 620c extends parallel to the tangent of the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above, and faces the peripheral edge 93 in close proximity with a gap G when viewed from the side (lower part of Figure 15). Specifically, the upper surface 621c faces the upper surface 932 of the peripheral edge from diagonally above, while providing a gap G between it and the upper surface 932 of the peripheral edge; the curved surface 622c faces the end surface 930 of the peripheral edge from the side, while providing a gap G between it and the end surface 930 of the peripheral edge; and the lower surface 623c faces the lower surface 931 of the peripheral edge from diagonally below, while providing a gap G between it and the lower surface 931 of the peripheral edge.

[0114] (Slip restriction condition M2) Each sliding pin 13c provided on the base plate 11 is positioned at the restricting position P2, thereby forming a sliding restriction state M2 in which each sliding pin 13c restricts the position of the substrate 9. In this modified example, as in the above embodiment, in the sliding restriction state M2, the substrate 9 is allowed to rotate relative to the base plate 11, while its position is restricted so that it does not displace beyond a permissible range from the normal position Q in the radial and upward directions. Furthermore, in this modified example, in the sliding restriction state M2, the substrate 9 is also restricted so that it does not displace beyond a permissible range from the normal position Q in the downward direction. That is, when the substrate 9 displaces downward from the normal position Q, once the amount of displacement reaches the dimension of the gap G, the sliding restriction surface 620c of at least one sliding pin 13c comes into contact with the peripheral edge 93 (typically, the lower surface 623c comes into contact with the lower surface 931 of the peripheral edge), and the substrate 9 cannot displace any further.

[0115] (effect) In this modified example, the sliding pin 13c has a sliding restricting surface 620c which includes a curved surface (side surface) 622c facing the peripheral edge 93 from the side, an upper surface 621c facing the peripheral edge 93 from diagonally above, and a lower surface 623c facing the peripheral edge 93 from diagonally below. Therefore, when the sliding pin 13c is positioned at the restricting position P2, the substrate 9 can be restricted in the radial and vertical directions so as not to be displaced beyond an allowable range corresponding to the gap G from the normal position Q. Furthermore, in this modified example, the stationary pin 13a and the sliding pin 13b can be formed from a common component. For example, by forming all of the position regulating pins 13 provided on the base plate 11 from a common part, and by specifying that the rotation angle of some of the position regulating pins 13 (the rotation angle when the position regulating pin 13 moves from the release position P1 to the regulating position P2) is smaller than the rotation angle of the remaining position regulating pins 13, some of the position regulating pins 13 can be made to function as sliding pins 13c, and the remaining position regulating pins 13 can be made to function as stationary pins 13a. This configuration reduces the number of parts.

[0116] <5-2. Second variation> The sliding pin 13d in the second modified example will be explained with reference to Figure 16. Figure 16 is a schematic side view showing how the sliding pin 13d moves between the release position P1 and the restricting position P2.

[0117] (Configuration of the 13d sliding pin) The basic configuration of the sliding pin 13d is the same as that of the sliding pin 13b according to the above embodiment. That is, the sliding pin 13d comprises a substantially cylindrical base portion 61d and a projection portion 62d that protrudes upward from the upper end surface of the base portion 61d. However, the sliding pin 13d differs from the sliding pin 13b according to the above embodiment in the shape of the projection portion 62d. That is, the sliding restricting surface 620d provided thereon has a side surface 621d which is a surface region that extends vertically (i.e., the normal direction extends in the horizontal plane), and does not have a surface region that inclins in a direction that approaches the axis of rotation J1 as it goes upward or downward. As an example, the projection portion 62d is polygonal prism-shaped, in which case the sliding restricting surface 620d has a side surface 621d which is straight or bent when viewed from above. As another example, the projection 62d is cylindrical, in which case the sliding restricting surface 620d has an arc-shaped side surface 621d when viewed from above.

[0118] The sliding pin 13d is driven by the pin drive mechanism 600 and rotated around the pin rotation axis J2, thereby moving between the release position P1 and the restricting position P2. When the sliding pin 13d is in the release position P1, the sliding restricting surface 620d is sufficiently spaced away from the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above and from the side (upper part of Figure 16). When the sliding pin 13d is in the restricting position P2, the sliding restricting surface 620d is close to the peripheral edge 93 of the substrate 9 in the normal position Q, while maintaining a gap G when viewed from above and from the side (lower part of Figure 16). Specifically, the side surface 621d faces the peripheral edge end surface 930 from the side, while maintaining a gap G between it and the peripheral edge end surface 930.

[0119] (Slip restriction condition M2) Each sliding pin 13d provided on the base plate 11 is positioned at the restricting position P2, thereby forming a sliding restriction state M2 in which each sliding pin 13d restricts the position of the substrate 9. In this modified example, as in the above embodiment, the substrate 9 is allowed to rotate relative to the base plate 11 in the sliding restriction state M2. Furthermore, the substrate 9 is restricted in position so as not to displace beyond a tolerance range from the normal position Q in the radial direction. That is, when the substrate 9 is displaced radially from the normal position Q, once the amount of displacement reaches the dimension of the gap G, the sliding restriction surface 620d of at least one sliding pin 13d comes into contact with the peripheral edge 93 (typically, the side surface 621d comes into contact with the peripheral edge end face 930), and the substrate 9 cannot be displaced any further.

[0120] (effect) In this modified example, the sliding pin 13d has a sliding restricting surface 620d that has a side surface 621d facing the peripheral edge 93 from the side. Therefore, when the sliding pin 13d is positioned at the restricting position P2, the position of the substrate 9 can be restricted so that it does not displace radially beyond a tolerance range corresponding to the gap G from the normal position Q. The sliding pin 13d does not have a sliding restricting surface 620d that faces the peripheral edge 93 diagonally downward or diagonally upward. Therefore, when the sliding pin 13d is positioned at the restricting position P2, the substrate 9 is allowed to displace vertically from the normal position Q. However, as in the above embodiment, when gas is supplied to the lower space U, the pressure of this gas acts on the substrate 9, sufficiently suppressing the downward displacement of the substrate 9 from the normal position Q, and by appropriately adjusting the gas flow rate (and thus the pressure the gas exerts on the substrate 9), the upward displacement of the substrate 9 from the normal position Q is also sufficiently suppressed. By not having a surface that faces the peripheral edge 93 diagonally downward or diagonally upward on the sliding restricting surface 620d, an advantage is obtained in that the peripheral edge 93 is less likely to be damaged by friction when the sliding pin 13d moves relative to the peripheral edge 93 of the substrate 9 in the circumferential direction.

[0121] <5-3. Third Variation> (Configuration of position control pin 15) The configuration of the position regulating pin 15 according to the third modified example will be explained with reference to Figures 17 and 18. Figure 17 is a schematic plan view showing the upper surface 111 of the base plate 11 on which the position regulating pin 15 is provided. Figure 18 is a schematic side view showing how the position regulating pin 15 moves between the release position P1, the stationary regulating position P21, and the sliding regulating position P22.

[0122] Multiple position regulating pins 15 (three in the example shown) are provided on the upper surface 111 of the base plate 11. The multiple position regulating pins 15 are arranged at equal intervals along the circumference of a reference circle C defined on the upper surface 111.

[0123] The basic configuration of the position regulating pin 15 is the same as that of the stationary pin 13a according to the above embodiment. That is, the position regulating pin 15 comprises a substantially cylindrical base portion 71 and a projection portion 72 that protrudes upward from the upper end surface of the base portion 71. The regulating surface 720 provided on the projection portion 72 comprises an upper surface 721, a curved surface 722 that is connected below the upper surface 721, and a lower surface 723 that is connected below the curved surface 722. The upper surface 721 is a flat surface region that is inclined in a direction that approaches the rotation axis J1 as it goes upward. The curved surface 722 is a curved surface that is curved with a curvature of about the same degree as the curvature of the peripheral edge 93 of the substrate 9. The lower surface 723 is a flat surface region that is inclined in a direction that approaches the rotation axis J1 as it goes downward.

[0124] At least one of the multiple position regulating pins 15 provided on the base plate 11 is driven by a pin drive mechanism 600 and rotated around the pin rotation axis J2, thereby moving between a release position P1, a first regulating position (static regulating position) P21, and a second regulating position (sliding regulating position) P22.

[0125] When the position regulating pin 15 is in the release position P1, the regulating surface 720 is sufficiently spaced apart from the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above and from the side (upper panel of Figure 18).

[0126] When the position regulating pin 15 is positioned at the stationary regulating position P21, the regulating surface 720 extends parallel to the tangent to the peripheral edge 93 of the substrate 9 in the normal position Q when viewed from above, and abuts against the peripheral edge 93 when viewed from the side (middle section of Figure 18). Specifically, the upper surface 721 abuts against the upper surface 932 of the peripheral edge, the curved surface 722 abuts against the end surface 930 of the peripheral edge, and the lower surface 723 abuts against the lower surface 931 of the peripheral edge. When the position regulating pin 15 is positioned at the stationary regulating position P21, the regulating surface 720 may be biased against the peripheral edge 93 of the substrate 9.

[0127] When the position regulating pin 15 is positioned at the sliding regulating position P22, the regulating surface 720 extends parallel to the tangent to the peripheral edge 93 of the substrate 9 at the normal position Q when viewed from above, and faces the peripheral edge 93 in close proximity with a gap G when viewed from the side (lower part of Figure 18). Specifically, the upper surface 721 faces the peripheral edge upper surface 932 from diagonally above with a gap G between it and the peripheral edge upper surface 932, the curved surface 722 faces the peripheral edge end surface 930 from the side with a gap G between it and the peripheral edge end surface 930, and the lower surface 723 faces the peripheral edge lower surface 931 from diagonally below with a gap G between it and the peripheral edge lower surface 931.

[0128] (Location restricted state) The position regulating pin 15 does not regulate the position of the substrate 9 when positioned in the release position P1, but regulates the position of the substrate 9 when positioned in the static regulating position P21 or the sliding regulating position P22. The manner in which the position regulating pin 15 regulates the position of the substrate 9 will be explained with reference to Figures 19 and 20. Figure 19 is a schematic plan view showing the static regulating state M1. Figure 20 is a schematic plan view showing the sliding regulating state M2. For the sake of explanation, the protrusion 72 of the position regulating pin 15 is shown in cross-section in Figures 19 and 20.

[0129] (i) Static restricted state M1 The position regulating pin 15 functions as a stationary pin by being positioned at the stationary regulating position P21. In other words, when each position regulating pin 15 is positioned at the stationary regulating position P21, a stationary regulating state M1 is formed in which the stationary pins regulate the position of the substrate 9 (Figure 19).

[0130] In this modified example, as in the embodiment described above, in the static restricted state M1, the substrate 9 is restricted to the normal position Q and its rotation is restricted so as not to rotate relative to the base plate 11.

[0131] In other words, in the static regulated state M1, the regulating surfaces 720 of each position regulating pin 15 abut against each other at different positions along the circumferential direction on the peripheral edge 93 of the substrate 9. This regulated the position of the substrate 9 so that it would not be displaced from its normal position Q in the radial and vertical directions. Furthermore, the substrate 9 was restricted from rotation by the frictional force it received from the regulating surfaces 720 that abutted (and were biased as necessary) its peripheral edge 93, so that it would not be displaced in the rotational direction around the rotation axis J1 relative to each position regulating pin 15 (and consequently the base plate 11) (i.e., it would not rotate relative to the base plate 11).

[0132] (ii) Slip restriction condition M2 The position regulating pin 15 functions as a sliding pin by being positioned at the sliding regulating position P22. In other words, the position regulating pin 15 being positioned at the sliding regulating position P22 creates a sliding regulating state M2 in which the sliding pin regulates the position of the substrate 9 (Figure 20). However, in order to form the sliding regulating state M2, it is not necessary for all position regulating pins 15 provided on the base plate 11 to be positioned at the sliding regulating position P22. For example, if multiple position regulating pins 15 are arranged at equal intervals along the circumference of the reference circle C, the sliding regulating state M2 may be formed by having at least one-third of adjacent position regulating pins 15 (one in the example shown in the figure) positioned at the sliding regulating position P22 and the remaining position regulating pins 15 positioned at the stationary regulating position P21. Needless to say, the sliding regulating state M2 may also be formed by having all position regulating pins 15 provided on the base plate 11 positioned at the sliding regulating position P22.

[0133] In this modified example, similar to the first modified example, in the slip-restricted state M2, the substrate 9 is allowed to rotate relative to the base plate 11, while its position is restricted so that it does not displace beyond an acceptable range from its normal position Q in the radial and vertical directions.

[0134] For the sake of explanation, let us assume that the substrate 9 is slightly displaced radially from its normal position Q (for example, by a displacement of about half the gap G), and that the restricting surfaces 720 of all position restricting pins 15 are separated from the peripheral edge 93 of the substrate 9. The position of the substrate 9 in this state is called the "eccentric normal position Qt," and the gap between the peripheral edge 93 of the substrate 9 and each restricting surface 720 in this state is called the "eccentric gap Gt." In other words, in the sliding restriction state M2, the restricting surfaces 720 of each position restricting pin 15 are in close proximity to each other at different positions along the circumferential direction of the peripheral edge 93 of the substrate 9, which is located at the eccentric normal position Qt, while maintaining an eccentric gap Gt. Therefore, for example, if the substrate 9 is displaced radially or vertically from the eccentric normal position Qt, when the amount of displacement reaches the dimension of the eccentric gap Gt, the restricting surface 720 of at least one position restricting pin 15 in the direction of displacement will come into contact with the peripheral edge 93, and the substrate 9 will not be able to displace any further. In other words, the substrate 9 is restricted in position so as not to displace beyond an allowable range (an allowable range corresponding to the eccentric gap Gt) from the eccentric normal position Qt in the radial and vertical directions. That is, it is restricted in position so as not to displace beyond an allowable range from the normal position Q. Furthermore, in the sliding restriction state M2, the substrate 9 in the eccentric normal position Qt can be displaced in the rotational direction around the rotation axis J1 without being hindered by each position restricting pin 15. In other words, the substrate 9 is allowed to rotate relative to the base plate 11 at the eccentric normal position Qt (i.e., in the vicinity of the normal position Q). Furthermore, when the substrate 9 is displaced from its eccentric normal position Qt, the restricting surfaces 720 of some of the position restricting pins 15 may come into contact with the peripheral edge 93 of the substrate 9, and the substrate 9, which is displaced in the rotational direction around the rotation axis J1, may experience some frictional force. However, even in this case, a frictional force large enough to restrict the displacement of the substrate 9 in the rotational direction will not act on the substrate 9. In other words, the substrate 9 is permitted to rotate relative to the base plate 11 in the vicinity of the eccentric normal position Qt (that is, in and around the normal position Q).

[0135] (effect) In this modified example, at least some of the position regulating pins 15 are configured to be positioned at the sliding regulating position P22 in addition to the release position P1 and the stationary regulating position P21, thereby giving at least some of the position regulating pins 15 the function of a sliding pin in addition to the function of a stationary pin. With this configuration, the total number of position regulating pins 15 provided on the base plate 11 can be reduced compared to the case where position regulating pins that function as stationary pins and position regulating pins that function as sliding pins are provided separately.

[0136] <5-4. Fourth variation> In the above embodiment, the control unit 4 controlled the rotation mechanism 14 in the slip-restricted state M2 to change the rotation speed of the base plate 11, thereby rotating the substrate 9 relative to the base plate 11. However, the manner in which the substrate 9 is rotated relative to the base plate 11 is not limited to this.

[0137] For example, in the slip-restricted state M2, the control unit 4 may control the processing liquid supply unit 2 to change the rotational speed of the substrate 9 by the external force exerted on the substrate 9 by the processing liquid supplied to the substrate 9. The magnitude and direction of the external force exerted on the substrate 9 by the processing liquid are determined by the discharge position, discharge direction, discharge flow rate, viscosity, etc. of the processing liquid. In other words, by adjusting at least one of the discharge position, discharge direction, discharge flow rate, viscosity, etc. of the processing liquid, the magnitude and direction of the external force exerted on the substrate 9 by the processing liquid supplied to the substrate 9 by the processing liquid supply unit 2 (and consequently, the direction and amount of change in the rotational speed of the substrate 9) can be set to the desired value. For example, by adjusting the discharge position of the processing liquid, etc., so that the processing liquid exerts an external force in the direction opposite to the rotational direction of the substrate 9 (resistance that hinders the rotation of the substrate 9), the rotational speed of the substrate 9 can be reduced. Alternatively, for example, by adjusting the discharge position of the processing liquid, etc., so that the processing liquid exerts an external force in the direction along the rotational direction of the substrate 9 (a thrust that promotes the rotation of the substrate 9), the rotational speed of the substrate 9 can be increased.

[0138] For example, the control unit 4 may, in the slip-restricted state M2, control the gas supply unit 3 to change the rotational speed of the substrate 9 by the external force exerted on the substrate 9 by the gas supplied to the substrate 9. The magnitude and direction of the external force exerted on the substrate 9 by the gas are determined by the gas discharge position, discharge direction, discharge flow rate, temperature, etc. In other words, by adjusting at least one of the gas discharge position, discharge direction, discharge flow rate, temperature, etc., the magnitude and direction of the external force exerted on the substrate 9 by the gas supplied to the substrate 9 by the gas supply unit 3 (and consequently, the direction and amount of change in the rotational speed of the substrate 9) can be set to the desired value. For example, by adjusting the gas discharge position, etc., so that the gas exerts an external force in the opposite direction to the rotational direction of the substrate 9 (resistance that hinders the rotation of the substrate 9), the rotational speed of the substrate 9 can be reduced. Alternatively, for example, by adjusting the gas discharge position, etc., so that the gas exerts an external force in the direction along the rotational direction of the substrate 9 (a thrust that promotes the rotation of the substrate 9), the rotational speed of the substrate 9 can be increased.

[0139] According to these modifications, in the slip-restricted state M2, the rotational speed of the substrate 9 changes due to the external force applied from the processing liquid or gas. This creates a difference in rotational speed between the substrate 9 and the base plate 11, and consequently, allows the substrate 9 to rotate relative to the base plate 11.

[0140] <5-5. Other variations> In the above embodiment, the control unit 4 controlled the rotation mechanism 14 in the slip-restricted state M2 to increase the rotation speed of the base plate 11 (i.e., change it from the liquid processing rotation speed f1 to a larger slip rotation speed f2), thereby rotating the substrate 9 relative to the base plate 11. However, the control unit 4 may also control the rotation mechanism 14 in the slip-restricted state M2 to decrease the rotation speed of the base plate 11 (i.e., change it from the liquid processing rotation speed f1 to a smaller slip rotation speed), thereby rotating the substrate 9 relative to the base plate 11. For example, if the rotation speed of the substrate 9 is reduced by an external force exerted on the substrate 9 by the processing liquid and / or gas supplied to the substrate 9, it is preferable to increase the rotation speed of the base plate 11. Conversely, if the rotation speed of the substrate 9 is increased by the external force, it is preferable to decrease the rotation speed of the base plate 11. Furthermore, if the rotation speed of the substrate 9 is sufficiently changed by the external force, the rotation speed of the base plate 11 does not need to be changed.

[0141] In the above embodiment, the timing of the process to start supplying the chemical solution (step S7) (i.e., the timing when the chemical solution treatment begins) was after the switch from the static restriction state M1 to the sliding restriction state M2 (step S6), but it may also be simultaneous with the switch or before the switch. In other words, at least a part of the chemical solution treatment may proceed in the static restriction state M1.

[0142] In the above embodiment, the timing of the process to start supplying the chemical solution (step S7) was before the process to change the rotational speed of the base plate 11 to the sliding rotational speed f2 (step S8), but it may be at the same time as or after the process. In other words, the chemical solution treatment may be started after the substrate 9 has started to rotate relative to the base plate 11.

[0143] In the above embodiment, the timing of the process (steps S10 to S11) in which the rotation speed of the base plate 11 is changed to match the rotation speed of the substrate 9 and the process of switching from a sliding restricted state M2 to a stationary restricted state M1 is performed (i.e., the timing at which the state in which the substrate 9 rotates relative to the base plate 11 ends) was before the process of stopping the supply of rinse liquid (step S12) was performed, but it may be at the same time as or after the process. However, as in the above embodiment, it is preferable that the state in which the substrate 9 rotates relative to the base plate 11 is maintained until the concentration of the chemical solution on the upper surface 92 of the substrate 9 has sufficiently decreased (i.e., until the rinsing process has progressed to a certain extent). Until the rinsing process has progressed to a certain extent, the pin opposing positions change moment by moment in the circumferential direction, so that the chemical solution is rinsed evenly and thoroughly over the entire circumferential edge 93 of the substrate 9. In addition, since the rinse liquid containing the chemical solution does not concentrate and wrap around to a specific position in the circumferential direction on the circumferential edge 93 of the substrate 9, the maximum value of the wrap-around width can be kept small.

[0144] In the above embodiment, the number of position-regulating pins 13 is not limited to 6, but may be any number. Similarly, the number of stationary pins 13a and sliding pins 13b is not limited to 3, but may be any number. Furthermore, when the stationary regulating surface 620a is biased against the peripheral edge 93 with the stationary pin 13a positioned at the regulating position P2, the biasing force (chuck force) can be appropriately defined. However, when the stationary regulating surface 620a is biased against the peripheral edge 93 with the stationary pin 13a positioned at the regulating position P2, the stationary regulating surface 620a does not have to be biased against the peripheral edge 93. In other words, the biasing force may be zero.

[0145] The configuration of the pin drive mechanism 600 according to the above embodiment may be modified as appropriate. For example, the pin drive mechanism 600 may position the position regulating pin 13 at the regulated position P2 by the magnetic repulsive force between the rotating magnets 601a, 601b and the blocking magnets 602a, 602b. Alternatively, for example, the position regulating pin 13 may be positioned at the released position P1 by the magnetic repulsive force between the rotating magnets 601a, 601b and the opening magnets 603a, 603b. Furthermore, while the first magnet lifting mechanism 604a and the second magnet lifting mechanism 604b used air cylinders, they may use, for example, motors. Also, the pin drive mechanism 600 does not necessarily have to switch the position of the position regulating pin 13 by changing the relative positions of the magnets. For example, the pin drive mechanism 600 may switch the position of each position regulating pin 13 by transmitting the driving force of a motor directly to each position regulating pin 13, or through a ball screw mechanism, rack and pinion mechanism, link mechanism, etc.

[0146] In the above embodiment, the chemical solution as the first processing liquid and the rinsing liquid as the second processing liquid do not necessarily have to be discharged from the same processing liquid nozzle 21, and a chemical solution nozzle for discharging the chemical solution and a rinsing liquid nozzle for discharging the rinsing liquid may be provided separately.

[0147] The processing performed by the substrate processing apparatus 100 according to the above embodiment may be, for example, a cleaning process to remove contaminants, particles, oxide films, etc., adhering to the main surface of the substrate 9, or it may be an etching process. The substrate 9 to be processed by the substrate processing apparatus 100 may be a semiconductor substrate, a photomask glass substrate, a liquid crystal display glass substrate, a plasma display glass substrate, a FED (Field Emission Display) substrate, an optical disc substrate, a magnetic disc substrate, a magneto-optical disc substrate, etc. The shape of the substrate 9 to be processed may be a disc or other shape (for example, a rectangular plate).

[0148] As described above, the substrate processing apparatus and substrate processing method have been described in detail, but the above description is illustrative in all respects and does not limit the substrate processing apparatus and substrate processing method. It is understood that countless variations not illustrated can be envisioned without falling outside the scope of this disclosure. The components described in each of the above embodiments and each of the above variations can be combined or omitted as appropriate, as long as they do not contradict each other. [Explanation of Symbols]

[0149] 100 Substrate Processing Equipment 1. Spin Chuck 11 Base Plate 12 support pins 13 Position regulating pins 13a Stationary pin 620a Static control surface 621a top surface 622a Curved surface 623a Bottom side 13b, 13c, 13d Slipping pins 620b, 620c, 620d Slip-resistant surface 621b,621c,621d Side 622b,622c top surface 623c bottom surface 15 Position regulating pins 720 Regulatory aspects 721 Top surface 722 Curved surface 723 Bottom surface 600-pin drive mechanism 2. Processing liquid supply unit 3. Gas Supply Department 4. Control Unit 9 circuit boards P1 release position P2 regulation position P21 Stationary regulation position P22 Slip-restricted position M1 Static Restriction M2 skid restriction conditions

Claims

1. base plate and A plurality of position-regulating pins are provided on the base plate and are used to regulate the position of a substrate that is positioned horizontally above the base plate, A pin drive mechanism moves each of the plurality of position regulating pins between a regulating position in which the position regulating pin regulates the position of the substrate and a release position in which the position regulating pin does not regulate the position of the substrate. A rotation mechanism that rotates the base plate around a rotation axis extending vertically, A processing liquid supply unit that supplies processing liquid to the substrate, The pin drive mechanism, the rotation mechanism, and the control unit that controls the processing liquid supply unit, Equipped with, The aforementioned plurality of position regulating pins include stationary pins and sliding pins. The stationary pin, when positioned in the regulated position, contacts the peripheral edge of the substrate, thereby regulating the substrate to a designated position above the base plate, and restricting its rotation so that it does not rotate relative to the base plate. The sliding pin, when positioned in the regulated position, is positioned opposite the peripheral edge of the substrate in the normal position, leaving a gap between them, thereby restricting the position of the substrate so that it does not displace beyond a permissible range in the radial direction from the normal position, while allowing the substrate to rotate relative to the base plate. Circuit board processing equipment.

2. A substrate processing apparatus according to claim 1, The control unit, The pin drive mechanism is controlled to switch between a stationary positioning state in which the stationary pins restrict the position of the substrate and a sliding positioning state in which the sliding pins restrict the position of the substrate. In the aforementioned slip-restricted state, the processing liquid supply unit is controlled to supply the processing liquid to the substrate. Circuit board processing equipment.

3. A substrate processing apparatus according to claim 2, The control unit, In the aforementioned slip-restricted state, the rotation mechanism is controlled to change the rotation speed of the base plate. Circuit board processing equipment.

4. A substrate processing apparatus according to claim 2 or 3, The control unit, In the aforementioned slip-restricted state, the processing liquid supply unit is controlled to change the rotation speed of the substrate by the external force exerted on the substrate by the processing liquid supplied to the substrate. Circuit board processing equipment.

5. A substrate processing apparatus according to claim 2 or 3, A gas supply unit that supplies gas to the substrate, Equipped with, The control unit, In the aforementioned slip-restricting state, the gas supply unit is controlled to change the rotational speed of the substrate by the external force exerted on the substrate by the gas supplied to the substrate. Circuit board processing equipment.

6. A substrate processing apparatus according to any one of claims 1 to 3, The aforementioned sliding pin, When this is positioned in the aforementioned restricted position, the restricting surface faces the peripheral edge of the substrate positioned in the regular position while providing the aforementioned gap, Equipped with, The regulating surface has a side surface that faces the peripheral edge from the side, Circuit board processing equipment.

7. A substrate processing apparatus according to claim 6, The regulating surface has an upper surface that faces the peripheral edge from diagonally above. Circuit board processing equipment.

8. A substrate processing apparatus according to claim 7, The regulating surface has a lower surface that faces the peripheral edge from diagonally below, Circuit board processing equipment.

9. A static restriction state formation step is performed in which a stationary pin provided on the base plate contacts the peripheral edge of a substrate that is positioned horizontally above the base plate, thereby restricting the position of the substrate to a predetermined regular position above the base plate and forming a static restriction state that restricts rotation so as not to rotate relative to the base plate. In the aforementioned static restricted state, an acceleration step is performed to increase the rotation speed of the base plate to a predetermined liquid processing rotation speed, A sliding restriction state formation step is performed after the acceleration step, in which sliding pins provided on the base plate are positioned opposite the peripheral edge of the substrate which is positioned in the normal position, while leaving a gap between them, thereby forming a sliding restriction state that restricts the position of the substrate so as not to be displaced beyond a permissible range from the normal position in the radial direction of the substrate, while allowing relative rotation of the substrate with respect to the base plate. In the aforementioned slip-restricted state, a processing liquid supply step is performed, which involves supplying a processing liquid to the substrate. A substrate processing method comprising:

Images