Wafer detection unit

Abstract

The objective is to provide a technology that can detect the presence or absence of a semiconductor wafer regardless of the film deposition state of the semiconductor wafer. [Solution] The wafer detection unit 9 comprises a base 1, a plurality of support pins 3 erected on the base 1 and capable of supporting a semiconductor wafer 100, a resin part 8 positioned at the tip of each support pin 3 so as to be able to contact the semiconductor wafer 100 and having a through hole 8a in the center, an emitting optical fiber 51 provided on the outer periphery of each support pin 3 and within the resin part 8, with one end exposed from the side where the through hole 8a in the resin part 8 faces the semiconductor wafer 100, a light source 5 connected to the other end of the emitting optical fiber 51, a receiving optical fiber 61 provided in the center of each support pin 3 with one end facing the through hole 8a in the resin part 8, a light receiving sensor 6 connected to the other end of the light receiving optical fiber 61, and a control unit 10 that determines whether or not a semiconductor wafer 100 is present based on a detection signal obtained from the light receiving sensor 6.

Description

Technical Field

[0001] This disclosure relates to a wafer detection unit.

Background Art

[0002] In conventional wafer detection, the incident light of a reflection-type or transmission-type optical sensor installed on a wafer stage base is reflected or blocked by placing a semiconductor wafer, thereby detecting the semiconductor wafer (see

[0003] In the technique described in Patent Document 1, incident light is irradiated from a reflection-type optical sensor installed on a wafer stage base onto a semiconductor wafer, and the presence or absence of the semiconductor wafer is determined by obtaining the reflected light.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the technique described in Patent Document 1, the reflection-type optical sensor is installed above the semiconductor wafer. When an oxide film or an organic film is formed on the semiconductor wafer, the reflected light from the semiconductor wafer is attenuated or scattered, so that the detection accuracy of the presence or absence of the semiconductor wafer depends on the film formation state of the semiconductor wafer.

[0006] Therefore, an object of the present disclosure is to provide a technique capable of detecting the presence or absence of a semiconductor wafer without depending on the film formation state of the semiconductor wafer.

Means for Solving the Problems

[0007] Note: There seems to be a formatting issue in the original text where some line numbers are missing their tags in the middle of the text. I've translated it as accurately as possible while keeping the original structure. Also, some of the "??" tags in the translation are placeholders for the original text where the tag numbers seem to be incorrect or incomplete in the provided source.The wafer detection unit according to this disclosure comprises a base, a plurality of support pins erected on the base and capable of supporting a semiconductor wafer, a resin part positioned at the tip of each support pin so as to be able to contact the semiconductor wafer and having a through hole in its center, an emitting optical fiber provided on the outer periphery of each support pin and within the resin part, one end of which is exposed from the side of the resin part facing the semiconductor wafer through hole, a light source connected to the other end of the emitting optical fiber, a light receiving optical fiber provided in the center of each support pin, one end of which faces the through hole in the resin part, a light receiving sensor connected to the other end of the light receiving optical fiber, and the light receiving The system includes a control unit that determines whether or not a semiconductor wafer is loaded based on a detection signal obtained from a sensor, wherein when the semiconductor wafer is placed on a plurality of support pins via the resin part, the emitted light from the light source is emitted from the light-emitting optical fiber toward the semiconductor wafer and reflected by the semiconductor wafer, and the reflected light from the semiconductor wafer is transmitted from the through hole in the resin part through the light-receiving optical fiber to the light-receiving sensor, and the control unit determines that the semiconductor wafer is loaded if the detection signal is obtained from the light-receiving sensor, and determines that the semiconductor wafer is not loaded if the detection signal is not obtained. [Effects of the Invention]

[0008] According to this disclosure, the presence or absence of a semiconductor wafer can be detected regardless of the film deposition state of the semiconductor wafer. [Brief explanation of the drawing]

[0009] [Figure 1] This is a top view of the wafer detection unit according to Embodiment 1. [Figure 2] This is a cross-sectional view of the wafer detection unit according to Embodiment 1. [Figure 3] This is a top view of the support pins provided in the wafer detection unit according to Embodiment 1. [Figure 4] This is a top view of the support pins provided in the wafer detection unit according to a modified example 1 of Embodiment 1. [Figure 5]This is a top view of the support pins provided in the wafer detection unit according to a modified example 2 of Embodiment 1. [Figure 6] This is a cross-sectional view of the support pin in Embodiment 1 when there is no semiconductor wafer load. [Figure 7] This is a cross-sectional view of the support pin in the case where a semiconductor wafer is loaded in Embodiment 1. [Figure 8] This is a cross-sectional view of the wafer detection unit when the semiconductor wafer is placed at an angle in Embodiment 1. [Figure 9] This is a cross-sectional view of the wafer detection unit when a warped semiconductor wafer is placed on it in Embodiment 1. [Figure 10] This is a cross-sectional view of the support pin in Embodiment 2 when there is no semiconductor wafer load. [Figure 11] This is a cross-sectional view of the support pin in the case where a semiconductor wafer is loaded in Embodiment 2. [Figure 12] This is a top view of the support pins provided in the wafer detection unit according to Embodiment 2. [Figure 13] This is a top view of the wafer detection unit according to Embodiment 3. [Figure 14] This is a cross-sectional view showing a semiconductor wafer with a diameter of φ=6 placed on the wafer detection unit according to Embodiment 3. [Figure 15] This is a cross-sectional view showing a semiconductor wafer with a diameter of φ=12 placed on the wafer detection unit according to Embodiment 3. [Figure 16] This is a top view showing semiconductor wafers having different diameters placed on a wafer detection unit according to Embodiment 3. [Figure 17] This is a cross-sectional view of the wafer detection unit when a semiconductor wafer with a flatness defect is placed on it in Embodiment 3. [Modes for carrying out the invention]

[0010] <Embodiment 1> Embodiment 1 will be described below with reference to the drawings. FIG. 1 is a top view of the wafer detection unit 9 according to Embodiment 1. FIG. 2 is a cross-sectional view of the wafer detection unit 9 according to Embodiment 1, specifically, a cross-sectional view taken along line A-A in FIG. 1.

[0011] In FIG. 1, the X direction, Y direction, and Z direction are orthogonal to each other. The X direction, Y direction, and Z direction shown in the following figures are also orthogonal to each other. Hereinafter, the direction including the X direction and the -X direction opposite to the X direction is also referred to as the "X-axis direction". Also, hereinafter, the direction including the Y direction and the -Y direction opposite to the Y direction is also referred to as the "Y-axis direction". Also, hereinafter, the direction including the Z direction and the -Z direction opposite to the Z direction is also referred to as the "Z-axis direction".

[0012] As shown in FIGS. 1 and 2, the wafer detection unit 9 includes a base 1, a pair of trays 2, a plurality of support pins 3, a resin part 8, a light-emitting side optical fiber 51, a light source 5, a light-receiving side optical fiber 61, a light-receiving sensor 6, and a control unit 10.

[0013] The base 1 is formed in a rectangular shape in a top view (viewed from the Z direction). The pair of trays 2 are erected on both ends in the Y-axis direction of the base 1 (in the Z direction) so as to face each other. A taper is formed on the inner peripheral side of the pair of trays 2, and alignment of the semiconductor wafer 100 is performed by dropping the semiconductor wafer 100.

[0014] The support pins 3 are formed in a columnar shape using a material containing, for example, metal, and are erected in a region between the pair of trays 2 on the base 1. Therefore, the semiconductor wafer 100 can be supported. More specifically, the support pins 3 can support the lower surface (-Z direction surface) of the semiconductor wafer 100. The support pins 3 are arranged at positions where the semiconductor wafer 100 automatically transported by a robot arm (not shown) can be held. In FIG. 1, three support pins 3 are arranged at positions facing the outer peripheral portion of the semiconductor wafer 100, but it is also possible to arrange three or more support pins 3 within a range that does not interfere with the operation of the robot arm.

[0015] The resin portion 8 is formed in a cylindrical shape and is positioned at the tip of each support pin 3 so as to be able to contact the lower surface of the semiconductor wafer 100.

[0016] The light-emitting optical fiber 51 extends from the light source 5 through the support pin 3 to the upper end (Z-direction end) of the resin part 8. The light-receiving optical fiber 61 extends from the light-receiving sensor 6 through the support pin 3 to the upper end of the support pin 3.

[0017] The control unit 10 includes a processor (not shown), such as a CPU (Central Processing Unit). The control unit 10 is connected to the light receiving sensor 6 and determines whether or not a semiconductor wafer 100 is present based on the detection signal obtained from the light receiving sensor 6. Here, the control unit 10 may store in its own memory a table containing reflected light intensity data that differs for each substrate material constituting the semiconductor wafer 100. In this case, the control unit 10 determines the type of semiconductor wafer 100 based on the table. Note that in Figure 1, the control unit 10 is not connected to the light receiving sensor 6, but in reality, the two are connected.

[0018] Next, the structure of the support pin 3 and the resin part 8 will be described. Figure 3 is a top view of the support pin 3 provided in the wafer detection unit 9 according to Embodiment 1. Figure 4 is a top view of the support pin 3 provided in the wafer detection unit 9 according to Modification 1 of Embodiment 1. Figure 5 is a top view of the support pin 3 provided in the wafer detection unit 9 according to Modification 2 of Embodiment 1.

[0019] As shown in Figures 2 and 3, the light-emitting optical fiber 51 is provided in the outer periphery and resin portion 8 of the support pin 3. One end of the light-emitting optical fiber 51 is exposed from the side (Z direction) facing the semiconductor wafer 100 through the through hole 8a (see Figure 6) in the resin portion 8. The other end of the light-emitting optical fiber 51 is connected to the light source 5. The light-emitting optical fiber 51 is provided along the entire outer periphery of the support pin 3. In this case, the amount of light emitted from the light-emitting optical fiber 51 can be increased.

[0020] Here, as shown in Figure 4, two holes (not shown) may be provided at opposing positions on the outer circumference of the support pin 3, and two light-emitting optical fibers 51 may be placed in each of the two holes. In this case, even if one of the light-emitting optical fibers 51 malfunctions, light can still be emitted using only the other light-emitting optical fiber 51.

[0021] As shown in Figures 3 and 4, a light-receiving optical fiber 61 is provided in the center of the support pin 3. One end of the light-receiving optical fiber 61 faces the through-hole 8a (see Figure 6) of the resin part 8. The other end of the light-receiving optical fiber 61 is connected to the light-receiving sensor 6 (see Figure 2).

[0022] Here, when arranging the light-emitting optical fiber 51 in the resin part 8, a hole is provided in the resin part 8 at an angle, for example, within a range of 40 to 60° with respect to the Y direction, preferably 45°, so that the light emitted from the light-emitting optical fiber 51 reaches the semiconductor wafer 100 and the light reflected by the semiconductor wafer 100 is incident on the light-receiving optical fiber 61, and one end of the light-emitting optical fiber 51 is positioned at the tip of the resin part 8.

[0023] Furthermore, the light-receiving optical fiber 61 is not placed in the resin part 8, but a through-hole 8a (see Figure 6) is provided that penetrates the upper surface (Z-direction surface) and lower surface (-Z-direction surface) of the resin part 8. The through-hole 8a is formed in the area where light emitted from the light-emitting optical fiber 51 is reflected by the semiconductor wafer 100 and incident on the light-receiving optical fiber 61, for example, in the center of the resin part 8. With this configuration, light emitted from the light-emitting optical fiber 51 is reflected by the semiconductor wafer 100 and passes through the through-hole 8a, allowing it to be directly incident on the light-receiving optical fiber 61 without going through the main body of the resin part 8. If the light is incident on the light-emitting optical fiber 51 via the main body of the resin part 8, the light intensity decreases and the detection sensitivity decreases, so it is preferable to have the light incident directly on the light-receiving optical fiber 61. The main body of the resin part 8 refers to the part of the resin part 8 other than the through-hole 8a.

[0024] Furthermore, as shown in Figure 5, the light-emitting optical fiber 51 and the light-receiving optical fiber 61 may be positioned opposite each other within the outer periphery of the support pin 3 and within the resin part 8 (see Figure 6). Specifically, one end of the light-emitting optical fiber 51 is exposed from the side where the through-hole 8a (see Figure 6) in the resin part 8 faces the semiconductor wafer 100. Also, one end of the light-receiving optical fiber 61 is exposed from the part of the resin part 8 where the through-hole 8a faces the semiconductor wafer 100 and faces the light-emitting optical fiber 51. To explain in more detail, the configuration in Figure 5 is the same as in Figure 6, which will be described later, but with the light-receiving optical fiber 61 located in the center of the support pin 3 replaced by one of the left or right light-emitting optical fibers 51.

[0025] Next, the operation of the wafer detection unit 9 will be described. Here, the case where the structure of the support pin 3 and the resin part 8 is as shown in Figure 3 or Figure 4 will be described. Figure 6 is a cross-sectional view of the support pin 3 when there is no semiconductor wafer 100 loaded in Embodiment 1. Figure 7 is a cross-sectional view of the support pin 3 when there is a semiconductor wafer 100 loaded in Embodiment 1. Figure 8 is a cross-sectional view of the wafer detection unit 9 when the semiconductor wafer 100 is placed at an angle in Embodiment 1. Figure 9 is a cross-sectional view of the wafer detection unit 9 when a warped semiconductor wafer 100 is placed in Embodiment 1.

[0026] As shown in Figure 6, light incident from the light source 5 is irradiated through the light-emitting optical fiber 51 from the tip of the resin part 8 located at the tip of the support pin 3. Since no semiconductor wafer 100 is placed on it, no reflection of incident light occurs, and light does not enter the light-receiving optical fiber 61 connected to the light-receiving sensor 6. Therefore, light does not reach the light-receiving sensor 6. If light does not reach the light-receiving sensor 6 from any of the light-receiving optical fibers 61 built into all of the support pins 3, the light-receiving sensor 6 does not output a detection signal. In other words, if light does not reach the light-receiving sensor 6 from all of the light-receiving optical fibers 61 built into all of the support pins 3, the light-receiving sensor 6 does not output a detection signal. If the control unit 10 (see Figure 1) does not receive a detection signal from the light-receiving sensor 6, it determines that there is no semiconductor wafer 100 loaded.

[0027] As shown in Figure 7, light incident from the light source 5 is irradiated through the light-emitting optical fiber 51 from the tip of the resin part 8 located at the tip of the support pin 3. Because a semiconductor wafer 100 is placed on it, the light reflected by the semiconductor wafer 100 reaches the light-receiving sensor 6 through the light-receiving optical fiber 61 inside the support pin 3. When light reaches the light-receiving sensor 6 from all of the light-receiving optical fibers 61 built into all of the support pins 3, the light-receiving sensor 6 outputs a detection signal. When the control unit 10 (see Figure 1) receives a detection signal from the light-receiving sensor 6, it determines that a semiconductor wafer 100 is present.

[0028] Furthermore, as shown in Figure 8, if the semiconductor wafer 100 is placed at an angle due to a transport error, reflected light will not reach the support pins 3 that do not have a semiconductor wafer 100 directly above them. By determining that a transport error occurs when the reflected light from all support pins 3 is not aligned, damage to the automatic transport arm (not shown) and the semiconductor wafer 100 can be suppressed. Similarly, if the semiconductor wafer 100 is placed in a misaligned position, this can also be determined as a transport error.

[0029] Furthermore, as shown in Figure 9, if an additional support pin 3 is positioned at a location corresponding to the center of the semiconductor wafer 100, it is possible to detect semiconductor wafers 100 with significant warping. For example, if a semiconductor wafer 100 that is significantly warped in a concave shape is placed on the wafer, the center of the semiconductor wafer 100 will be in contact with the support pin 3, while the outer periphery of the semiconductor wafer 100 will not be in contact with the support pin 3. Therefore, reflected light will reach from the support pin 3 positioned at the location corresponding to the center of the semiconductor wafer 100, but not from the support pin 3 positioned at the location corresponding to the outer periphery of the semiconductor wafer 100. Similar to transport errors, if reflected light does not reach from any of the support pins 3, it is determined that the semiconductor wafer 100 is warped, making it possible to remove semiconductor wafers 100 with significant warping before processing.

[0030] As described above, in Embodiment 1, the wafer detection unit 9 comprises a base 1, a plurality of support pins 3 erected on the base 1 and capable of supporting a semiconductor wafer 100, a resin part 8 positioned at the tip of each support pin 3 so as to be able to contact the semiconductor wafer 100 and having a through hole 8a in its center, an emitting optical fiber 51 provided on the outer periphery of each support pin 3 and within the resin part 8, with one end exposed from the side where the through hole 8a in the resin part 8 faces the semiconductor wafer 100, a light source 5 connected to the other end of the emitting optical fiber 51, a receiving optical fiber 61 provided in the center of each support pin 3 with one end facing the through hole 8a in the resin part 8, a light receiving sensor 6 connected to the other end of the light receiving optical fiber 61, and a control unit 10 that determines whether or not a semiconductor wafer 100 is present based on a detection signal obtained from the light receiving sensor 6. When the semiconductor wafer 100 is placed on a plurality of support pins 3 via the resin part 8, the emitted light from the light source 5 is emitted from the light-emitting optical fiber 51 toward the semiconductor wafer 100 and reflected by the semiconductor wafer 100. The reflected light from the semiconductor wafer 100 is transmitted to the light-receiving sensor 6 via the light-receiving optical fiber 61 through the through hole 8a of the resin part 8. The control unit 10 determines that the semiconductor wafer 100 is present if a detection signal is obtained from the light-receiving sensor 6, and determines that the semiconductor wafer 100 is not present if no detection signal is obtained.

[0031] In this configuration, in Embodiment 1, the distance between the light-emitting optical fiber 51 and the semiconductor wafer 100, and the distance between the semiconductor wafer 100 and the light-receiving optical fiber 61 are made very short, so that light is incident on and received by the semiconductor wafer 100 over very short distances. By shortening the distances related to the incident and received light, attenuation and scattering of incident light can be suppressed.

[0032] Therefore, the presence or absence of a semiconductor wafer 100 can be detected without depending on the film deposition state of the semiconductor wafer 100.

[0033] Furthermore, by reducing the distance between the semiconductor wafer 100 and the light-receiving optical fiber 61, even slight reflected light can be received, and detection accuracy does not decrease even if the reflected light is attenuated or scattered on the semiconductor wafer 100 after film deposition. Therefore, even in the case of polycrystalline wafers where significant attenuation and scattering of reflected light are expected, it is possible to suppress a decrease in detection accuracy.

[0034] Furthermore, the multiple support pins 3 include at least three support pins 3 positioned at locations corresponding to the outer periphery of the semiconductor wafer 100. Therefore, if the reflected light from all the support pins 3 is not aligned, it can be determined that the semiconductor wafer 100 is placed in a tilted or misaligned state, and these can be judged as transport errors.

[0035] Furthermore, the multiple support pins 3 each include one support pin 3 positioned at a location corresponding to the center of the semiconductor wafer 100. When a semiconductor wafer 100 that is significantly warped in a concave shape is placed on the wafer, reflected light reaches from the support pin 3 positioned at the center of the semiconductor wafer 100, but not from the support pin 3 positioned at the outer edge of the semiconductor wafer 100. Similar to transport errors, if reflected light does not reach from any of the support pins 3, it is determined that the semiconductor wafer 100 is warped, making it possible to remove the warped semiconductor wafer 100 before processing.

[0036] Furthermore, the control unit 10 includes a table containing reflected light intensity data that differs for each substrate material constituting the semiconductor wafer 100. For example, in the case of a SiC wafer, the attenuation and scattering of reflected light are large, while in the case of a Si wafer, the reflected light is prominent. By including a table containing reflected light intensity data for both types of wafers, the control unit 10 can determine the type of semiconductor wafer 100 based on the table.

[0037] Furthermore, by integrating the support pin 3 with the light-emitting optical fiber 51 and the light-receiving optical fiber 61, space can be secured above and below (in the Z direction) the mounting position of the semiconductor wafer 100 for the arm to move up and down, without hindering the transport of the semiconductor wafer 100 by the automatic transport arm.

[0038] Furthermore, since the light-emitting optical fiber 51 and the light-receiving optical fiber 61 are provided on the support pins 3 that hold the semiconductor wafer 100, there is no need to provide new members for attaching the light-emitting optical fiber 51 and the light-receiving optical fiber 61. Therefore, it is possible to suppress an increase in the number of parts of the wafer detection unit 9.

[0039] Furthermore, by placing the resin part 8 at the tip of the support pin 3, the resin part 8 can be replaced if it is damaged.

[0040] Furthermore, in the modified example 2 of Embodiment 1, since not only the light-emitting optical fiber 51 but also the light-receiving optical fiber 61 is provided on the outer circumference of the support pin 3, the structure of the support pin 3 is simplified. As a result, maintenance work, including replacement of the resin part 8, the light-emitting optical fiber 51, or the light-receiving optical fiber 61, is made easier.

[0041] <Embodiment 2> Next, Embodiment 2 will be described. Figure 10 is a cross-sectional view of the support pin 3 in Embodiment 2 when the semiconductor wafer 100 is not loaded. Figure 11 is a cross-sectional view of the support pin 3 in Embodiment 2 when the semiconductor wafer 100 is loaded. Figure 12 is a top view of the support pin 3 provided in the wafer detection unit 9 according to Embodiment 2. In Embodiment 2, the same reference numerals are used for components that are the same as those described in Embodiment 1, and their descriptions are omitted.

[0042] As shown in Figures 10 to 12, in Embodiment 2, the shape of the through-hole 8a in the resin part 8 is different from that of Embodiment 1. Also, the arrangement of the light-emitting optical fiber 51 and the light-receiving optical fiber 61 is different.

[0043] The resin portion 8 is positioned at the tip of each support pin 3 so as to be able to contact the semiconductor wafer 100, and an inverted conical through hole 8a is provided in the center, with the diameter increasing from the support pin 3 side to the semiconductor wafer 100 side.

[0044] The light-emitting optical fiber 51 is provided on the outer circumference of each support pin 3 and within the resin portion 8. One end of the light-emitting optical fiber 51 is exposed from the slope that forms the inverted cone-shaped through hole 8a in the resin portion 8.

[0045] The light-receiving optical fiber 61 is provided in the outer periphery of each support pin 3 and within the resin part 8. Furthermore, one end of the light-receiving optical fiber 61 is exposed from the portion of the inclined surface forming the inverted cone-shaped through hole 8a in the resin part 8 that faces the light-emitting optical fiber 51. In other words, one end of the light-receiving optical fiber 61 faces one end of the light-emitting optical fiber 51.

[0046] Next, the operation of the wafer detection unit 9 will be described. As shown in Figure 10, light incident from the light source 5 (see Figure 2) is irradiated through the light-emitting optical fiber 51 from the tip of the resin part 8 located at the tip of the support pin 3. Since no semiconductor wafer 100 is placed on it, no reflection of the incident light occurs, and light does not enter the light-receiving optical fiber 61 connected to the light-receiving sensor 6 (see Figure 2). Therefore, light does not reach the light-receiving sensor 6. If light does not reach the light-receiving sensor 6 from any of the light-receiving optical fibers 61 built into all of the support pins 3, the light-receiving sensor 6 does not output a detection signal. If the control unit 10 (see Figure 1) does not receive a detection signal from the light-receiving sensor 6, it determines that there is no semiconductor wafer 100 loaded.

[0047] As shown in Figure 11, light incident from the light source 5 (see Figure 2) is irradiated through the light-emitting optical fiber 51 from the tip of the resin part 8 located at the tip of the support pin 3. Because a semiconductor wafer 100 is placed on it, the light reflected by the semiconductor wafer 100 reaches the light-receiving sensor 6 (see Figure 2) through the light-receiving optical fiber 61 inside the resin part 8. When light reaches the light-receiving sensor 6 from all of the light-receiving optical fibers 61 embedded in all of the support pins 3, the light-receiving sensor 6 outputs a detection signal. When the control unit 10 (see Figure 1) receives a detection signal from the light-receiving sensor 6, it determines that a semiconductor wafer 100 is present.

[0048] As described above, in Embodiment 2, in addition to the effects of Embodiment 1, the structure of the support pin 3 is simplified because not only the light-emitting optical fiber 51 but also the light-receiving optical fiber 61 is provided on the outer circumference of the support pin 3. Therefore, maintenance work, including replacement of the resin part 8, the light-emitting optical fiber 51, or the light-receiving optical fiber 61, is made easier.

[0049] <Embodiment 3> Next, Embodiment 3 will be described. Figure 13 is a top view of the wafer detection unit 9 according to Embodiment 3. Figure 14 is a cross-sectional view showing a semiconductor wafer 101 with φ=6 placed on the wafer detection unit 9 according to Embodiment 3. Figure 15 is a cross-sectional view showing a semiconductor wafer 103 with φ=12 placed on the wafer detection unit 9 according to Embodiment 3. Here, Figures 14 and 15 are cross-sectional views taken along the BB line in Figure 13. In Embodiment 3, the same reference numerals are used for components that are the same as those described in Embodiments 1 and 2, and their descriptions are omitted.

[0050] As shown in Figures 13 to 15, in Embodiment 3, in order to support multiple semiconductor wafers 101, 103 of different diameters, the multiple support pins 3 are arranged in positions corresponding to the outer periphery of each of the multiple semiconductor wafers 101, 102, 103 of different diameters, compared to Embodiments 1 and 2. Note that the drawings show the structure of the support pins 3 and the resin part 8 as in Figure 3 or Figure 4.

[0051] Next, the operation of the wafer detection unit 9 will be described. Figure 16 is a top view showing semiconductor wafers 101, 102, and 103, each having a different diameter, placed on the wafer detection unit 9 according to Embodiment 3. Figure 17 is a cross-sectional view of the wafer detection unit 9 when semiconductor wafer 103, which has a flatness defect, is placed on it in Embodiment 3.

[0052] As shown in Figure 16, if the smallest diameter of the semiconductor wafer 100 is 6 inches, the middle diameter is 8 inches, and the largest diameter is 12 inches, then at least three support pins 3 are positioned to correspond to the outer periphery of the 6-inch semiconductor wafer 101. Similarly, at least three support pins 3 are positioned to correspond to the outer periphery of the 8-inch semiconductor wafer 102, and at least three support pins 3 are positioned to correspond to the outer periphery of the 12-inch semiconductor wafer 103. In Embodiment 3, a total of nine support pins 3 are arranged, and these nine support pins 3 can support multiple semiconductor wafers 101, 102, and 103 of different diameters.

[0053] Furthermore, as shown in Figure 17, the multiple support pins 3 are positioned at locations corresponding to the outer periphery of each of the multiple semiconductor wafers 101, 102, and 103 of different diameters. This allows the control unit 10 to detect semiconductor wafers 103 with poor flatness from the detection distribution or light intensity distribution of the detection signal detected by the light receiving sensor 6 based on the light received from the light receiving optical fiber 61 embedded in the multiple support pins 3.

[0054] As described above, in Embodiment 3, the multiple support pins 3 are positioned to correspond to the outer periphery of each of the multiple semiconductor wafers 101, 102, and 103 of different diameters. Therefore, it is possible to support multiple semiconductor wafers 101, 102, and 103 of different diameters with the nine support pins 3. As a result, the dedicated mounting jigs that were required for each semiconductor wafer 101, 102, and 103 in the conventional configuration are no longer necessary.

[0055] Furthermore, it is possible to freely combine each embodiment, or to modify or omit each embodiment as appropriate.

[0056] The various aspects of this disclosure are summarized below as an appendix.

[0057] (Note 1) The base and Multiple support pins erected on the aforementioned base and capable of supporting a semiconductor wafer, A resin portion is positioned at the tip of each support pin so as to be able to contact the semiconductor wafer, and has a through hole in its center. An optical fiber is provided in the outer periphery of each support pin and within the resin portion, with one end of the optical fiber being exposed from the side where the through hole in the resin portion faces the semiconductor wafer. A light source connected to the other end of the light-emitting optical fiber, A light-receiving optical fiber is provided in the center of each of the support pins, with one end facing the through-hole in the resin part, A light-receiving sensor connected to the other end of the light-receiving optical fiber, The system includes a control unit that determines whether or not the semiconductor wafer is loaded based on a detection signal obtained from the light receiving sensor, When the semiconductor wafer is placed on the plurality of support pins via the resin portion, the emitted light from the light source is emitted from the light-emitting optical fiber toward the semiconductor wafer and reflected by the semiconductor wafer, and the reflected light reflected by the semiconductor wafer is transmitted from the through hole in the resin portion through the light-receiving optical fiber to the light-receiving sensor. The control unit determines that the semiconductor wafer is present when the detection signal is obtained from the light receiving sensor, and determines that the semiconductor wafer is not present when the detection signal is not obtained.

[0058] (Note 2) The wafer detection unit according to Appendix 1, wherein the plurality of support pins include at least three support pins positioned at locations corresponding to the outer periphery of the semiconductor wafer.

[0059] (Note 3) The wafer detection unit according to Appendix 2, wherein the plurality of support pins further include one support pin positioned at a location corresponding to the center of the semiconductor wafer.

[0060] (Note 4) The control unit includes a table containing different reflected light intensity data for each material of the substrate constituting the semiconductor wafer, The control unit determines the type of semiconductor wafer based on the table, as described in any one of the appendices 1 to 3.

[0061] (Note 5) The base and Multiple support pins erected on the aforementioned base and capable of supporting a semiconductor wafer, A resin portion is provided at the tip of each support pin so as to be able to contact the semiconductor wafer, and has an inverted conical through hole in its center whose diameter increases from the support pin side to the semiconductor wafer side, A light-emitting optical fiber is provided in the outer periphery of each support pin and within the resin portion, with one end exposed from the inclined surface that forms the inverted conical through-hole in the resin portion, A light source connected to the other end of the light-emitting optical fiber, A light-receiving optical fiber is provided within the outer periphery and resin portion of each support pin, with one end exposed from the portion of the inclined surface in the resin portion that forms the inverted cone-shaped through hole, facing the light-emitting optical fiber. A light-receiving sensor connected to the other end of the light-receiving optical fiber, The system includes a control unit that determines whether or not the semiconductor wafer is loaded based on a detection signal obtained from the light receiving sensor, When the semiconductor wafer is placed on the plurality of support pins via the resin portion, the emitted light from the light source is emitted from the light-emitting optical fiber toward the semiconductor wafer and reflected by the semiconductor wafer, and the reflected light reflected by the semiconductor wafer is transmitted from the through hole in the resin portion through the light-receiving optical fiber to the light-receiving sensor. The control unit determines that the semiconductor wafer is present when the detection signal is obtained from the light receiving sensor, and determines that the semiconductor wafer is not present when the detection signal is not obtained.

[0062] (Note 6) The base and Multiple support pins erected on the aforementioned base and capable of supporting a semiconductor wafer, A resin portion is positioned at the tip of each support pin so as to be able to contact the semiconductor wafer, and has a through hole in its center. An optical fiber is provided in the outer periphery of each support pin and within the resin portion, with one end of the optical fiber being exposed from the side where the through hole in the resin portion faces the semiconductor wafer. A light source connected to the other end of the light-emitting optical fiber, A light-receiving optical fiber is provided within the outer periphery and resin portion of each support pin, with one end exposed from the portion of the resin portion facing the light-emitting optical fiber on the side where the through-hole faces the semiconductor wafer, A light-receiving sensor connected to the other end of the light-receiving optical fiber, The system includes a control unit that determines whether or not the semiconductor wafer is loaded based on a detection signal obtained from the light receiving sensor, When the semiconductor wafer is placed on the plurality of support pins via the resin portion, the emitted light from the light source is emitted from the light-emitting optical fiber toward the semiconductor wafer and reflected by the semiconductor wafer, and the reflected light reflected by the semiconductor wafer is transmitted from the through hole in the resin portion through the light-receiving optical fiber to the light-receiving sensor. The control unit determines that the semiconductor wafer is present when the detection signal is obtained from the light receiving sensor, and determines that the semiconductor wafer is not present when the detection signal is not obtained.

[0063] (Note 7) The wafer detection unit according to any one of the appendices 1 to 6, wherein the plurality of support pins are arranged at positions corresponding to the outer periphery of each of the plurality of semiconductor wafers of different diameters. [Explanation of Symbols]

[0064] 1 Base, 3 Support pins, 5 Light source, 6 Light receiving sensor, 8 Resin part, 8a Through hole, 9 Wafer detection unit, 10 Control unit, 51 Light-emitting optical fiber, 61 Light-receiving optical fiber, 100, 101, 102, 103 Semiconductor wafer.

Claims

1. The base and Multiple support pins erected on the aforementioned base and capable of supporting a semiconductor wafer, A resin portion is positioned at the tip of each support pin so as to be able to contact the semiconductor wafer, and has a through hole in its center. An optical fiber is provided in the outer periphery of each support pin and within the resin portion, with one end of the optical fiber being exposed from the side where the through hole in the resin portion faces the semiconductor wafer. A light source connected to the other end of the light-emitting optical fiber, A light-receiving optical fiber is provided in the center of each of the support pins, with one end facing the through-hole in the resin part, A light-receiving sensor connected to the other end of the light-receiving optical fiber, The system includes a control unit that determines whether or not the semiconductor wafer is loaded based on a detection signal obtained from the light receiving sensor, When the semiconductor wafer is placed on the plurality of support pins via the resin portion, the emitted light from the light source is emitted from the light-emitting optical fiber toward the semiconductor wafer and reflected by the semiconductor wafer, and the reflected light reflected by the semiconductor wafer is transmitted from the through hole in the resin portion through the light-receiving optical fiber to the light-receiving sensor. The control unit determines that the semiconductor wafer is present when the detection signal is obtained from the light receiving sensor, and determines that the semiconductor wafer is not present when the detection signal is not obtained.

2. The wafer detection unit according to claim 1, wherein the plurality of support pins include at least three support pins positioned at locations corresponding to the outer periphery of the semiconductor wafer.

3. The wafer detection unit according to claim 2, wherein the plurality of support pins further include one support pin positioned at a location corresponding to the center of the semiconductor wafer.

4. The control unit includes a table containing different reflected light intensity data for each material of the substrate constituting the semiconductor wafer, The wafer detection unit according to claim 1, wherein the control unit determines the type of semiconductor wafer based on the table.

5. The base and Multiple support pins erected on the aforementioned base and capable of supporting a semiconductor wafer, A resin portion is provided at the tip of each support pin so as to be able to contact the semiconductor wafer, and has an inverted conical through hole in its center whose diameter increases from the support pin side to the semiconductor wafer side, A light-emitting optical fiber is provided in the outer periphery of each support pin and within the resin portion, with one end exposed from the inclined surface that forms the inverted conical through-hole in the resin portion, A light source connected to the other end of the light-emitting optical fiber, A light-receiving optical fiber is provided within the outer periphery and resin portion of each support pin, with one end exposed from the portion of the inclined surface in the resin portion that forms the inverted cone-shaped through hole, facing the light-emitting optical fiber. A light-receiving sensor connected to the other end of the light-receiving optical fiber, The system includes a control unit that determines whether or not the semiconductor wafer is loaded based on a detection signal obtained from the light receiving sensor, When the semiconductor wafer is placed on the plurality of support pins via the resin portion, the emitted light from the light source is emitted from the light-emitting optical fiber toward the semiconductor wafer and reflected by the semiconductor wafer, and the reflected light reflected by the semiconductor wafer is transmitted from the through hole in the resin portion through the light-receiving optical fiber to the light-receiving sensor. The control unit determines that the semiconductor wafer is present when the detection signal is obtained from the light receiving sensor, and determines that the semiconductor wafer is not present when the detection signal is not obtained.

6. The base and Multiple support pins erected on the aforementioned base and capable of supporting a semiconductor wafer, A resin portion is positioned at the tip of each support pin so as to be able to contact the semiconductor wafer, and has a through hole in its center. An optical fiber is provided in the outer periphery of each support pin and within the resin portion, with one end of the optical fiber being exposed from the side where the through hole in the resin portion faces the semiconductor wafer. A light source connected to the other end of the light-emitting optical fiber, A light-receiving optical fiber is provided within the outer periphery and resin portion of each support pin, with one end exposed from the portion of the resin portion facing the light-emitting optical fiber on the side where the through-hole faces the semiconductor wafer, A light-receiving sensor connected to the other end of the light-receiving optical fiber, The system includes a control unit that determines whether or not the semiconductor wafer is loaded based on a detection signal obtained from the light receiving sensor, When the semiconductor wafer is placed on the plurality of support pins via the resin portion, the emitted light from the light source is emitted from the light-emitting optical fiber toward the semiconductor wafer and reflected by the semiconductor wafer, and the reflected light reflected by the semiconductor wafer is transmitted from the through hole in the resin portion through the light-receiving optical fiber to the light-receiving sensor. The control unit determines that the semiconductor wafer is present when the detection signal is obtained from the light receiving sensor, and determines that the semiconductor wafer is not present when the detection signal is not obtained.

7. The wafer detection unit according to any one of claims 1, 5, or 6, wherein the plurality of support pins are arranged at positions corresponding to the outer periphery of each of the plurality of semiconductor wafers of different diameters.

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