Stripping agent composition
The O/W emulsion release agent composition addresses the challenge of resin mask removal in miniaturized electronic components by enhancing penetration and peeling efficiency, improving manufacturing yield and component quality.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-06-09
- Publication Date
- 2026-04-01
AI Technical Summary
Conventional release agent compositions struggle to efficiently remove resin masks from fine gaps and interfaces between resin masks and metal layers on substrates, particularly in miniaturized electronic components, leading to residue and reduced manufacturing yield.
A release agent composition in the form of an O/W emulsion containing an alkaline agent, organic solvent, and water, which enhances penetration and peeling efficiency by concentrating the organic solvent at the interface of the resin mask.
The O/W emulsion composition effectively removes resin masks, reducing residue and improving the yield and reliability of electronic components by promoting dissociation and electrostatic repulsion, thus facilitating high-quality manufacturing.
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Abstract
Citation Information
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