Stripping agent composition

The O/W emulsion release agent composition addresses the challenge of resin mask removal in miniaturized electronic components by enhancing penetration and peeling efficiency, improving manufacturing yield and component quality.

JP2026056539APending Publication Date: 2026-04-01KAO CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-06-09
Publication Date
2026-04-01

AI Technical Summary

Technical Problem

Conventional release agent compositions struggle to efficiently remove resin masks from fine gaps and interfaces between resin masks and metal layers on substrates, particularly in miniaturized electronic components, leading to residue and reduced manufacturing yield.

Method used

A release agent composition in the form of an O/W emulsion containing an alkaline agent, organic solvent, and water, which enhances penetration and peeling efficiency by concentrating the organic solvent at the interface of the resin mask.

Benefits of technology

The O/W emulsion composition effectively removes resin masks, reducing residue and improving the yield and reliability of electronic components by promoting dissociation and electrostatic repulsion, thus facilitating high-quality manufacturing.

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Abstract

In one embodiment, a release agent composition with excellent resin mask removal (peelability) is provided. [Solution] In one aspect, this disclosure relates to a stripping agent composition that contains an alkaline agent, an organic solvent other than an alkaline agent, and water, and is an O / W type emulsion.
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Citation Information

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