Ceramic substrate housing and holding member

Abstract

External impact and overlapping in the storage container containing the circuit board set It suppresses impact between the ceramic substrates while preventing impurities from adhering from the storage container. [Solution] The ceramic substrate storage and holding member is designed so that multiple ceramic substrates are stacked together. It holds a set of ceramic substrates. The ceramic substrate storage and holding member has a first surface and A first silicon nitride plate-like portion comprising a second surface provided on the opposite side of the first surface. A second nitrogen comprising a material, a third surface, and a fourth surface provided on the opposite side of the third surface. It comprises a plate-shaped member made of silicon nitride, and the second of the first plate-shaped member made of silicon nitride. The surface and the third surface of the second silicon nitride plate-like member are integrated by an adhesive member. Yes, they are.

Description

Technical Field

[0001] Embodiments of the present invention generally relate to a ceramic substrate storage and holding member.

Background Art

[0002] In recent years, with the development of semiconductors that require high currents, such as power electronics and next-generation power semiconductors, the demand for ceramic substrates has been increasing year by year. In particular, as the elements become smaller and more highly performant, and the heat generation from the elements increases, the thickness of the ceramic substrate tends to become thinner in order to efficiently dissipate heat. With the miniaturization and high performance of electrical products, electronic components are becoming smaller, and the amount of heat generated from semiconductors tends to increase due to higher output. Ceramic substrates are used for the electrical insulation of electronic components, but thinner substrates are required to improve the heat dissipation characteristics as the electronic components become smaller. Many ceramic substrates have high electrical insulation and high heat dissipation characteristics, but they also have the characteristics of being hard and brittle, and care must be taken to avoid cracking and chipping when working in a stacked state during and between manufacturing processes. On the other hand, in order to reduce the manufacturing cost of ceramic substrates, manufacturing is being carried out in a larger shape. Among ceramic substrates, a silicon nitride substrate having high strength, high toughness, and high heat dissipation has a substrate with a size of 220 mm × 220 mm × 0.32 mm disclosed. According to Patent Document 1, high heat dissipation can also be obtained by thinning the silicon nitride substrate. As such, a large number of ceramic substrates manufactured in this large size are taken.

[0003] As electrical products become smaller and more highly performant, electronic components are becoming smaller and the amount of heat generated from semiconductors tends to increase due to higher output.

[0004]

[0005]

[0006] According to Patent Document 2, a silicon nitride substrate is laser-processed and divided to obtain a large number of circuit boards. It is possible.

[0006] In tasks such as inspecting ceramic substrates that have been divided after laser processing, resin and metal substrates are used. Which storage container should it be placed in? At this time, the corners and edges of the ceramic substrate may be damaged during handling. This can cause a portion of the storage container to be scraped off and adhere to the ceramic substrate. Some resins in kimonos may melt when heated, such as when joining semiconductor elements. The molten resin may detach during the process or after the product is completed, potentially causing adverse effects. Metals adhering to the surface of ceramic substrates, etc., can short-circuit the insulation, reducing the insulating properties of the product. There is a possibility that it will happen. [Prior art documents] [Patent Documents]

[0007] [Patent Document 1] Patent No. 6399252 [Patent Document 2] Japanese Patent Publication No. 6587205 [Overview of the project] [Problems that the invention aims to solve]

[0008] In recent years, the increased heat generation of semiconductor devices has led to the thinning of ceramic substrate components and increased manufacturing costs. A ceramic substrate set formed by stacking multiple ceramic substrates after molding. The circuit board set (hereinafter simply referred to as the "circuit board set") is stored in a storage container. The circuit board set is handled by During storage, it is necessary to suppress contamination from the storage container.

[0009] The embodiment solves these problems, and includes a storage container that houses the circuit board set. During handling of [[ID=]], while suppressing contamination from the storage container, simple storage of the substrate set is to provide a ceramic substrate storage and holding member that enables this.

Means for Solving the Problems

[0010] The ceramic substrate storage and holding member according to the embodiment holds a ceramic substrate set formed by stacking a plurality of ceramic substrates. The ceramic substrate storage and holding member includes a first plate-shaped member made of silicon nitride having a first surface and a second surface provided on the side opposite to the first surface, and a third surface and a fourth surface provided on the side opposite to the third surface, and a second plate-shaped member made of silicon nitride. Further, the second surface of the first plate-shaped member made of silicon nitride and the third surface of the second plate-shaped member made of silicon nitride are integrated by an adhesive member. of the first plate-shaped member made of silicon nitride and the third surface of the second plate-shaped member made of silicon nitride are integrated by an adhesive member. and a second plate-shaped member made of silicon nitride having a third surface and a fourth surface provided on the side opposite to the third surface. Further, the second surface of the first plate-shaped member made of silicon nitride and the third surface of the second plate-shaped member made of silicon nitride are integrated by an adhesive member. A second plate-shaped member made of silicon nitride having a third surface and a fourth surface provided on the side opposite to the third surface. and a second plate-shaped member made of silicon nitride having a third surface and a fourth surface provided on the side opposite to the third surface. and the third surface of the second plate-shaped member made of silicon nitride are integrated by an adhesive member. are integrated by an adhesive member.

Brief Description of the Drawings

[0011] [Figure 1] Perspective view showing the appearance of the ceramic substrate storage and holding member according to the embodiment. [Figure 2] Perspective view showing the state in which the substrate set is stored in the storage member and the storage and holding member according to the conventional example. [Figure 3] Perspective view showing the state in which the substrate set is stored using the ceramic substrate storage and holding member according to the embodiment. [Figure 4] View showing the appearance of the ceramic substrate storage and holding member according to the embodiment. [Figure 5] Front view of the sample for measuring the overlap shear strength. [Figure 6] Front view showing the form for evaluating the durability of the storage and holding member. [Figure 7] Front view showing the form of the vibration evaluation of the storage and holding member.

Mode for Carrying Out the Invention

[0012] Figure 1 is an oblique view of a ceramic substrate storage and holding member according to an embodiment. In Figure 1, 1 is a ceramic This is a mixed substrate storage and holding member. 11 is a first silicon nitride plate-shaped member, and 12 is the 2 are plate-shaped members made of silicon nitride. The first is a plate-shaped member made of silicon nitride 11 and the second is made of silicon nitride The plate-shaped member 12 is connected to an adhesive member (not shown) located between the plate-shaped member 11 and the plate-shaped member 12. It is more integrated. In Figure 1, the first silicon nitride plate-shaped member 11 and the second silicon nitride The plate-like member 12 is rectangular, but it may also be of other shapes such as polygons, circles, and ellipses. Also, even if the shape is rectangular or polygonal, it is acceptable to have rounded or rounded corners. These chamfers are designed to prevent chipping of the ceramic substrate housing and holding member. It is preferable to do so.

[0013] Figure 2 shows a conventional ceramic substrate set consisting of multiple ceramic substrates stacked on top of each other. This is a storage container that holds the ceramic substrate at one end of the substrate set 3. The circuit board set is stored so that the outer surface of the board faces the bottom surface of the storage container 4. In other words, the storage container is a set of substrates made by overlapping the planes of multiple ceramic substrates. This is the case when the unit is placed in a flat position with the plane facing downwards. In Figure 2(b), multiple bases are shown. A storage retaining member 8 is used to divide the board set 3. The material of the support member 8 is resin or metal. An example of resin is polyethylene terephthalate (P ET), polyvinyl chloride (PVC), acrylic (PMMA), polycarbonate (PC) Examples include stainless steel (SUS) and aluminum (Al). Resin and metal have the advantage of being durable, easy to process into container shapes, and inexpensive. However, if resin or metal is used for storage container 4 or the storage and holding container described later... This occurs when the corners and edges of the ceramic substrate rub against the storage container or storage and holding container, causing the ceramic to... Resin or metal may adhere to the surface of the ceramic substrate. This is due to the process of joining metal circuits or joining semiconductor elements to metal circuits, where the material melts due to heat treatment. This can lead to poor bonding. Also, metal adhering to the ceramic substrate can cause electrical problems. Because it conducts electricity directly, it may cause problems such as poor pressure resistance. On the other hand, the storage container 4 contains ceramic When using acrylic, even if ceramics adhere due to friction, they will melt and inhibit bonding. It does not suffer from pressure resistance failure. However, ceramics are susceptible to impact. It is easily damaged, difficult to process, and expensive, making it unsuitable for storage containers.

[0014] In Figure 2(c), the outer surfaces of the two ceramic substrates at both ends of the substrate set are on four sides. The circuit board set is housed so that it faces each of the two opposing sides. Furthermore, the packaging container is designed to hold the circuit board set with the edges of each ceramic substrate facing downwards. This allows for the storage of circuit board sets in a vertical position. Figure 2(d) shows multiple circuit board sets. Storage and holding member 8 is used to partition T3. If resin or metal is used for the storage container 4 and the storage holding member 8, there may be poor bonding or pressure resistance. This could potentially cause problems.

[0015] In the case of the storage and holding member according to the embodiment, the surface that comes into contact with the substrate set is made of silicon nitride. No oily or metallic components adhere to it. Also, as will be described later, due to the deflection of the silicon nitride plate... Furthermore, it can absorb impacts to the storage and holding member. In addition, it is partially integrated with an adhesive member. In this case, the unbonded portion can flex and absorb the impact.

[0016] Figure 3 shows a ceramic substrate storage and holding member according to the embodiment, used to store a substrate set. This is a perspective view showing the state. For example, the circuit board set 3 is arranged in two rows in a storage container 4 made of resin. It is stored in a ceramic substrate storage and holding member between the substrate set 3 and the storage container 4. It is placed there. That is, between the long side of the ceramic substrate and the storage container 4 there is a ceramic The substrate storage and holding member 1a has a ceramic substrate storage and holding section between its short side and the storage container 4. Material 1b is used to create a ceramic substrate storage and holding member 1 between the bottom surface of the substrate set 3 and the storage container 4. c is installed. Also, a ceramic substrate storage and holding member is placed between the two substrate sets 3. 1d is installed. The ceramic substrate housing and holding members 1a, 1b and 1c are made of resin. This prevents the storage container and the ceramic substrate from coming into contact. (Ceramic substrate storage and holding section) Material 1d includes, for example, a resin storage and holding section to separate and hold the two circuit board sets 3. This prevents the ceramic substrates from coming into contact with each other without using any additional materials.

[0017] The ceramic substrate storage and holding member according to the embodiment has an arithmetic mean height Sa2 of the second surface. The ratio of the arithmetic mean height Sa3 of the third surface to (Sa3 / Sa2) is 0.7 or greater. It is 0.3 or less.

[0018] Figure 4 shows the external appearance of the ceramic substrate storage and holding member according to the embodiment. Figure 4(a) is a top view, Figure 4(b) is a front view seen from the direction of the long side, and Figure 4(c) is a side view seen from the direction of the short side. This is a view drawing. The first silicon nitride plate-shaped member 11 has a first surface 111 and the first surface is It also has a second surface 112 provided on the opposite side. 2 comprises a third surface 121 and a fourth surface 122 provided on the opposite side from the third surface. The second surface 112 of the first silicon nitride plate-shaped member 11 and the second silicon nitride plate The third surface 121 of the shaped member is bonded to the adhesive member 2 in Figure 4. The arithmetic mean height Sa of the third surface 121 relative to the arithmetic mean height Sa2 of the second surface 112. The value of the ratio of 3 (Sa3 / Sa2) is between 0.7 and 1.3.

[0019] Since silicon nitride plate-shaped members are ceramics, the surface roughness of the surface after sintering is It's large. Silicon nitride is a high-strength, difficult-to-process material, so polishing its surface is costly. Therefore, silicon nitride plate-shaped parts are preferred to be used without any processing such as polishing. For example, when bonding silicon nitride with double-sided tape, the surface roughness of the bonding surfaces should be made similar. This is preferable. When bonding ceramic members and double-sided tape, a larger surface roughness is preferable for the interface. The mechanical fit is strengthened, resulting in increased adhesive strength. However, the surface roughness is too great. This could result in the double-sided tape not being able to make contact with the entire interface, potentially reducing the adhesive strength. Therefore, it is preferable that the adhesive strength between the two silicon nitride plate-like members and the double-sided tape be equivalent. The difference in adhesive strength varies depending on the difference in surface roughness, therefore the surface roughness of the silicon nitride plate-like member It is preferable that it be close. For this reason, the arithmetic mean height Sa2 of the second surface 112 is The ratio of the arithmetic mean height Sa3 of the third face 121 (Sa3 / Sa2, hereafter referred to as "Sa3 / Sa2") The value of (omitted) is preferably 0.7 or more and 1.3 or less. The value of Sa3 / Sa2 is 0.7 If the value is below or above 1.3, it represents the difference in adhesive strength between two silicon nitride plate-like members. This is because one of the silicon nitride plate-shaped members may peel off from the double-sided tape. Therefore, it is more preferable that the Sa3 / Sa2 value be between 0.8 and 1.2.

[0020] The ceramic substrate storage and holding member according to the embodiment is the first silicon nitride plate-shaped member The adhesion between the second surface and the third surface of the second silicon nitride plate-like member is made by double-sided tape. It is being carried out.

[0021] Double-sided tape can be easily applied without the need for any equipment. As mentioned above... By adjusting the surface roughness of the surfaces to be bonded, consistent bonding is possible. Yes. Also, as will be described later, the silicon nitride substrate will bend and deform due to the thickness of the double-sided tape. This is preferable because it can absorb the impact applied to the ceramic substrate housing and holding member.

[0022] The ceramic substrate storage and holding member according to the embodiment has the first and fourth surfaces arithmetic The average height is 5.0 μm or less.

[0023] In Figure 4(a), the first face is 111 and the fourth face is 122. Both faces are storage The surface of the holding member is in contact with the ceramic substrate. Therefore, the first surface 111 and the fourth surface 1 The lower the surface roughness of 22, the less friction there is on the ceramic substrate and the less damage occurs. Therefore, the surface roughness of the first surface 111 and the fourth surface 122 is 5.0 μm or less in arithmetic mean height. It is preferable that it be lower. The lower limit of the arithmetic mean height should not be set, but polishing... Because mirror polishing increases costs, surface roughness is achieved by honing or blasting. It is preferable that the arithmetic mean height is 0.5 μm or more. Therefore, it is more preferable The arithmetic mean height of the surface roughness is between 1.0 μm and 3.0 μm.

[0024] The ceramic substrate housing and holding member according to the embodiment is made of the first and second silicon nitride The maximum deflection of the plate member is 0.1 mm or more.

[0025] In Figure 4(b), a front view, the adhesive member 2 is located near the ends of the first and second silicon nitride plate members. It is bonded. The thickness of the double-sided tape is 0.1mm to 1.0mm, and it is bonded near the edges. In this case, a space with a thickness of 0.1 mm to 1.0 mm is formed in the center. If the deflection of the mixed substrate storage and holding member is 0.1 mm or more, the ceramic substrate storage The holding member flexes inward in the center, absorbing the impact generated when handling the circuit board set. To store. When using adhesive, the thickness of the adhesive is approximately 0.05 mm to 0.3 mm. Although it is often thinner than the adhesive thickness of double-sided tape, the central part similarly flexes inward to absorb shock. It can be stored. As will be described later, if a thin silicon nitride plate is used, the silicon nitride plate The deflection increases, and the entire ceramic substrate housing and holding member deflects, increasing its ability to absorb shock. It will become difficult. In this case, if it is the deflection of the entire ceramic substrate storage and holding member, the adhesive will Applying it to the entire surface of a silicon nitride plate before bonding enhances the adhesive effect.

[0026] Here, the maximum deflection is observed when a silicon nitride plate member is horizontally supported with a support span of 50 mm. A load is applied to the central part from a vertical upward direction, and the distance until fracture is taken as the maximum deflection height. Measure.

[0027] The ceramic substrate storage and holding member according to this embodiment has a silicon nitride plate member with a thickness of 0.2 It is 1 mm or more.

[0028] The three-point bending strength of silicon nitride substrates is 600-700 MPa, and the fracture toughness is 6-7 MPa·m. 1 / 2 Because of its large size, it is possible to make the silicon nitride plate material thinner. By making the material thinner, the amount of deflection increases, which absorbs the impact received from the circuit board set. This is possible. Furthermore, making it thinner reduces its weight and improves handling. Furthermore, it is possible to reduce the amount of expensive silicon nitride raw material used. The thickness of the silicon nitride plate member used in the Lamix substrate storage and holding member is 0.2 mm or more. It is preferable that the thickness of the silicon nitride plate member is less than 0.2 mm, While it can be used as a substrate storage and holding member, when it bends or is subjected to impact... It is sometimes easily damaged. Also, when manufacturing silicon nitride plate components, silicon nitride is used as a ceramic. Because it is a sintered body, it is prone to warping and undulation when thin. For this reason, silicon nitride is used. The thickness of the plate member is preferably 0.3 mm or more. There is no specific upper limit, but as mentioned above, good handling and flexibility To obtain this, it is preferable that the thickness is 1.0 mm or less, and more preferably 0.7 mm or less.

[0029] The ceramics housed in a container using the ceramic substrate storage and holding member according to the embodiment. The substrate is one of silicon nitride, aluminum nitride, or aluminum oxide.

[0030] Each of the components of the substrate set to be stored in the packaging container for transporting ceramic substrates according to the embodiment Types of ceramic substrates include silicon nitride (Si3N4) substrates and aluminum nitride (A Examples include N substrates and alumina (aluminum oxide: Al2O3) substrates. The substrates include silicon nitride substrates, aluminum nitride substrates, and aluminum oxide substrates. It is preferable that there be only one of the following. Also, the argyl substrate is one of the aluminum oxide substrates. For example, Argyl is composed of 20-80% by mass of aluminum oxide with the remainder being aluminum oxide. It is a sintered body made of aluminum oxide. It consists of three substrates: aluminum nitride substrate and aluminum oxide substrate. The point bending strength is approximately 300-450 MPa. The strength of the Argil substrate is also 550 MPa. It is around this range. The three-point bending strength of the silicon nitride substrate is 600 MPa or more, and even 700 MPa. It can be increased to the above. These ceramic substrates have the aforementioned properties. It is suitable for mixed circuit boards. Furthermore, the thermal conductivity of the silicon nitride substrate is 50 W / (m·K). Furthermore, it can be increased to 80W / (m·K) or more. In particular, in recent years, high strength and There are also silicon nitride substrates that possess both high thermal conductivity and high strength. This makes it possible to further improve heat dissipation. For this reason, the thickness of the silicon nitride substrate The thickness is preferably 0.635 mm or less, and more preferably 0.3 mm or less. It is not set to 0.1 mm or more, but it is preferable that it be 0.1 mm or more. This is because of the silicon nitride group This is to ensure the electrical insulation of the plate. The thickness referred to here is the thickness of the top and bottom surfaces of the ceramic substrate. This refers to the dimensions in the direction connecting the surfaces. These ceramic substrates may be single sheets. Furthermore, it may have a three-dimensional structure such as a multilayer structure. The thickness of the ceramic substrate is not particularly limited. No. Heat dissipation is achieved by making the ceramic circuit board thinner and the metal circuit thicker. Sexual performance improves.

[0031] The hardness (HV) of these ceramic substrates is 13-14 GPa for silicon nitride and aluminum nitride. The radiation levels are high, at 10-11 GPa for nium and 11-13 GPa for aluminum oxide. Also, as mentioned above... As the ceramic substrate has become thinner, the corners and edges of the ceramic substrate As a result, the packaging container rubs against the material, making it prone to adhesion of a portion of the packaging container. In contrast to this, according to the embodiment Since the ceramic substrate housing and holding member is made of silicon nitride, any silicon nitride substrate will be equivalent. It has hardness. Furthermore, other ceramic substrates have even higher hardness. Therefore, even if it comes into contact with something and rubs against a corner, the possibility of any part of the packaging container sticking to it is low.

[0032] The ceramic substrate is housed in a container using the ceramic substrate storage and holding member according to the embodiment. The Kus substrate is formed by processing the outer periphery of the ceramic substrate with a laser.

[0033] As mentioned above, in order to reduce manufacturing costs, large ceramic substrates are manufactured, and individually There is a method of dividing it into product sizes. Because ceramic substrates are high strength, they are divided. One method is to form scribe lines using laser processing and then divide the material. By forming and dividing live lines, the ceramic substrate is cut using laser processing. It can be processed faster than traditional methods, resulting in superior cost performance. To improve the efficiency of laser processing, the scribe line is made not as a line, but as the thickness of the ceramic substrate. By processing with dots that do not penetrate in one direction, like perforations, the processing can be made even faster. It is possible. However, when you divide a scribe line processed with dots, On the side where the dots were formed, the dots were cut, resulting in an uneven shape, while on the opposite side where the dots were formed... These often have sharp, angular edges. These uneven surfaces and sharp edges come into contact with the storage container. This increases the likelihood that part of the packaging container will adhere to it. If the storage container uses a ceramic substrate storage and holding member, it can be obtained by laser processing. Even in the surrounding areas, the possibility of resin or metal adhering to the surface is low, making it suitable.

[0034] The ceramic substrate is housed in a container using the ceramic substrate storage and holding member according to the embodiment. The substrate has a metal plate bonded to the surface of the ceramic substrate.

[0035] A ceramic substrate is a ceramic-metal bonded substrate in which a metal plate is bonded to both sides or one side (e.g.) For example, silicon nitride metal junction substrates, or ceramic circuit boards formed by processing metal plates. This also includes plates (for example, silicon nitride circuit boards). In other words, ceramics that house ceramic substrates. The storage and holding member for the ceramic substrate can accommodate not only the ceramic substrate alone, but also metal plates on both sides or one side. Ceramic metal bonded substrates with joined metal plates, and ceramic circuits formed by metal plates. It is also possible to store the circuit boards as a set.

[0036] Ceramic metal bonded substrates and ceramic circuit boards are different from ceramic substrates in terms of their substrate properties. The weight per set increases. Therefore, ceramic metal bonded substrates and ceramics Circuit boards, when assembled using circuit boards, may experience greater stress when rubbing against the storage container. When force is applied, the amount of material adhering from the storage container increases. Therefore, friction The ceramic substrate storage and holding member according to the embodiment, which is less likely to adhere, is preferable. be.

[0037] Next, a method for manufacturing a ceramic substrate storage and holding member will be described. As long as the Lamix substrate storage and holding member has the above configuration, its manufacturing method is not particularly limited. However, the following manufacturing methods can be used to obtain it efficiently.

[0038] First, regarding the manufacturing method of silicon nitride plate members used in ceramic substrate storage and holding members... Let me explain. The manufacturing method for the plate member involves adding silicon nitride powder and sintering aid powder to the raw material solution. The process involves manufacturing the raw material, degassing the raw material solution to prepare the raw material slurry, and then processing the raw material slurry. The process involves molding to form a sheet, and heating the sheet at a temperature of 1000°C or less to prepare the degreased material. The process comprises a manufacturing step and a step of sintering the degreased body at a temperature of 1600°C to 2000°C. do.

[0039] The silicon nitride powder has an α-gelatinization rate of 80% by mass or more and an average particle size of 0.4 μm to 2.5 μm. It is preferable that the m value is 1 or less and the impurity oxygen content is 2% by mass or less.

[0040] The sintering aid powder is a metal oxide powder with an average particle size of 0.5 μm or more and 3.0 μm or less. This is preferable. As for metal oxide powders, rare earth elements, magnesium (Mg), titanium ( Examples include oxides such as Ti (Ti) and hafnium (Hf). Sintering aids are added as metal oxides. By adding this, it becomes easier to form liquid phase components during the sintering process. As a sintering aid, rare earth One or more elements selected from the following: symmetric elements, magnesium, titanium, and hafnium, in oxide form. The total amount added should be between 1% and 14% by mass. In particular, it is preferable to add two or more types. It's nice.

[0041] Next, the raw material solution is degassed to prepare the raw material slurry. The degassing process is carried out in a vacuum using the raw material solution. This is a process of removing air bubbles from a raw material solution by stirring the liquid. By reducing air bubbles, the amount of air bubbles in the sintered body can also be reduced. By performing a degassing treatment, It is possible to create a slurry with high viscosity.

[0042] Next, the raw material slurry is molded to prepare a sheet. The sheet molding is performed using the doctor blade method. This is preferable. The doctor blade method improves mass production efficiency. Other than the doctor blade method... The sheet forming methods include die pressing and cold isostatic pressing. Examples include the tic pressing (CIP) method and the roll forming method. This makes it easier to adjust the thickness of the sintered body, and the required thickness of the plate-like member can be adjusted to match the sheet thickness. Adjust. Before the degreasing process for the sheet, cut the sheet to the desired size. .

[0043] Next, the sheet is heated to a temperature of 1000°C or lower to prepare a degreased body. The atmosphere should preferably be an inert atmosphere such as nitrogen gas or argon gas. An oxygen-containing atmosphere may also be used.

[0044] The degreasing temperature should be 1000°C or lower, and more specifically, within the range of 500°C to 800°C. Preferred. By performing the degreasing process within this range, the thermal decomposition rate of the polymer binder can be controlled. Therefore, it is possible to prevent the molded body from being damaged by the release of thermal decomposition gases associated with degreasing. ru.

[0045] Next, the degreased body is sintered at a temperature between 1600°C and 2000°C. The pressure inside the sintering furnace is increased. A suitable atmosphere is preferable. If the sintering temperature is below 1600°C, the densification of the sintered body will be insufficient. Yes. When the temperature exceeds 2000°C, if the furnace atmosphere pressure is low, silicon (Si) and nitrogen (N) are produced. There is a risk of decomposition. The sintering temperature is preferably in the range of 1700°C to 1900°C. Within this range, multiple glass compounds with different compositions are generated due to the sintering aid and impurity oxygen. This facilitates the liquid-phase sintering of silicon nitride.

[0046] A sintered body can be manufactured through the above process. Next, a plate-shaped member is manufactured from the sintered body. The method will be explained. In order to efficiently manufacture plate-shaped members, the aforementioned sheet molding process It is preferable to increase the size of the sintered body so that multiple plate-like members can be obtained. A break line the size of a plate-shaped member is formed on the sintered body of Iz by laser processing. The surface roughness of the sintered body, which has formed an ecline, is improved by honing or blasting. Adjust the settings. Honing and breasting can also be done before laser processing, but When a break line is formed by laser processing, residue from the laser processing is formed. Therefore, it is preferable to perform the process after laser processing to remove any remaining residue.

[0047] When adjusting the surface roughness of a sintered body by honing, the first surface (front surface) of the sintered body To make the surface roughness of the first surface and the second surface (back surface) the same or close to the same, use the same honing process. The first and second surfaces of the sintered body are processed according to the procedure. The surface roughness of the first and second surfaces of the sintered body is different. This can be achieved by changing the honing conditions. The term "item" refers to, for example, in the case of dry honing using abrasive grains, the type of abrasive grain (material, size) These include hardness and dry honing conditions (pressure, time), etc.

[0048] After honing, the sintered body is divided by the break line to obtain plate-shaped parts. When joining with double-sided tape, apply the double-sided tape to the designated location on the joining surface and then attach the plate-shaped part. Attach them together. Any type of double-sided tape can be used as long as it can bond silicon nitride components together. However, there are general-purpose double-sided tapes, super-strong adhesive double-sided tapes, rough surface adhesive double-sided tapes, and thin double-sided tapes. These are some examples. The curing conditions for each double-sided tape are treated, and the ceramic substrate is housed and held in place. Obtain the components.

[0049] Double-sided tape allows for easier bonding compared to adhesives, thus reducing working time. It is possible to do so. Also, as mentioned above, it is available in thicknesses up to about 1.0 mm, and double-sided tape Its cushioning properties can be utilized. Furthermore, because it is in tape form, it is easy to use. It can be attached only to a portion. Therefore, as a ceramic substrate storage and holding member It is preferable to use it between circuit board sets or between circuit board sets and jigs. Double-sided tape When applied to the center of a plate-like component, the surrounding plate-like component flexes and absorbs the impact, The corners become weaker and more prone to chipping from impact. In contrast, when applied to both ends, the corners are more susceptible to impact. It is highly resistant to impact, and its central section flexes inward, acting as a cushion.

[0050] Because double-sided tape has lower fluidity compared to adhesives, if the surface roughness is rough, it will stick to the surface of the plate-like material and both sides. A gap may form between the tape surface and the surface. Therefore, with thin double-sided tape, the surface roughness may be Smaller is preferable. Thicker double-sided tape can adhere even to surfaces with a rough surface. Furthermore, if the surface roughness of the surfaces to be bonded is different, the bond may start from the surface with the lower roughness or the surface with the higher roughness. This is undesirable because it can cause delamination. Therefore, an adhesive suited to the surface condition of the plate-like member should be used. do.

[0051] When joining plate-shaped parts with adhesive, apply it to the designated area on the joining surface, and when controlling the thickness, use a screw. For lean printing or using a dispenser, adhesive can be applied simply with a spatula or trowel. The type of adhesive is not limited as long as it can join silicon nitride components together, but epoxy adhesives, etc. Acrylic adhesives, silicone adhesives, urethane adhesives, cyanoacrylate adhesives, etc. These are some examples. The curing conditions of each adhesive are treated, and the ceramic substrate is housed and held. Obtain the components.

[0052] Adhesives are preferable to double-sided tape when adhesive strength is required. For cyanoacrylate adhesives, the tensile shear strength is 30-40 MPa and the adhesive strength is 6-7 kN / m. Strong adhesive strength can be obtained. The ceramic substrate housing and holding member has strong adhesive strength. Preferably, it is used on the bottom surface of the circuit board set described later or on heavy metal bonded circuit boards. This is the case when using them. Because these circuit board sets are heavy, they can be large when they come into contact with the jig. This is because a heavy load is applied. For this reason, the ceramic substrate housing and holding member has no hollow space and is joined together. In order to withstand a strong load in this shape, more than half, preferably the entire surface of the plate-shaped member is in contact with the surface. Apply the adhesive to bond the pieces together.

[0053] As mentioned earlier, with adhesives, the bonding strength increases when the surfaces being joined are rough. This is because the surface area that can make contact is expanded, and the mechanical fit of the interface is strengthened. However, if the surface roughness of the silicon nitride sheet is too high, it can cause cracks and shedding of grains, which is undesirable. That's not good. Also, if the surface roughness of the surfaces to be bonded is different, peeling will occur from the surface with the lower roughness or the surface with the higher roughness. This is undesirable because it can cause separation. Therefore, use an adhesive that is suitable for the surface condition of the plate-like member. ru.

[0054] (Examples 1-6, Comparative Examples 1-6) Silicon nitride powder with an average particle size of 0.7 μm and an α-gelatinization rate of 95%, containing yttrium oxide (Y2O3), Hafnium oxide (HfO2), titanium oxide (TiO2), magnesium oxide (MgO2) ) was added at a concentration of 10% by mass as a sintering aid, and the total amount was adjusted to 100% by mass. The obtained raw material powder was mixed with a binder and solvent to obtain a slurry. The slurry was then formed into a sheet. Two different thicknesses of green sheets were produced using a molding machine. The green sheets were then cut into sheets. A degreased product was obtained by heating in a nitrogen atmosphere at 700°C. The degreased product was then heated in a nitrogen atmosphere for 18 minutes. By heating at 0°C, the size becomes 100mm x 50mm, and the thickness becomes 0.3mm and 0.5mm. A plate-shaped component made of silicon nitride sintered material with a thickness of mm was obtained. The corners of the plate-shaped component were chamfered with a radius of 1 mm. .

[0055] The surface of the plate-shaped part is coated with #220 (particle size: 75~45μm) and #120 (particle size: 125~9 White alundum (WA) abrasive grains (0 μm) were sprayed at a pressure of 0.1 to 0.3 MPa. This results in the examples 1-6, comparative examples 1-2, and comparative examples 4-5 shown in Tables 1 and 2. A plate-shaped component with an arithmetic mean height (Sa) was obtained. In the table, the first silicon nitride plate-shaped component The arithmetic mean height of the first surface is Sa1, and the arithmetic mean of the second surface, which is located on the opposite side of the first surface, is Sa1. Let Sa2 be the height, Sa3 be the arithmetic mean height of the third surface of the second silicon nitride plate-like member, and the above The arithmetic mean height of the fourth face, which is located on the opposite side of face 3, is defined as Sa4. The height (Sa) was measured using a Keyence VK-X3000 at approximately the center of the plate-shaped component, measuring 1mm x 1m. m was measured.

[0056] [Table 1]

[0057] The arithmetic mean height Sa3 of the third face relative to the arithmetic mean height Sa2 of the second face in Examples 1 to 6 The value of the ratio (Sa3 / Sa2) was within a favorable range. This corresponds to the arithmetic mean height S of the second surface. This is because the values ​​of a2 and the arithmetic mean height Sa3 of the third face were adjusted to be close together. The Sa3 / Sa2 values ​​in Comparative Examples 1-4 fell outside the preferred range.

[0058] Next, Examples 1-6 and Comparative Examples 1-4 in Table 1 use double-sided tape (Kure Kogyo GORILLA CRYSTAL). A) was attached parallel to the shorter side at a position approximately 10 mm from both ends in the length direction. The double-sided tape has pullback (non-adhesive portion) of approximately 5 mm on both sides and is made of first silicon nitride It was attached to two locations on the second surface of the plate-like member. The size of the double-sided tape used at this time was 25.4 m. It is m x 40 mm. Next, the third surface of the second silicon nitride plate-like member is placed on top of the double-sided tape. Then, after leaving it at room temperature for 24 hours to bond, a ceramic substrate housing and holding member was obtained. Comparative Examples 5-6, which do not use silicon plate-shaped members, are resin (A) measuring 100mm x 50mm. A storage and holding member made of acrylic was obtained. The corners of the resin storage and holding member also have a 1 mm radius. The removal was carried out.

[0059] Next, the overlapping shear strength (hereinafter referred to as "shear strength") of Examples 1-6 and Comparative Examples 1-4. (abbreviated as follows). As shown in Figure 5, the silicon nitride plate-shaped substrates of Examples 1-6 and Comparative Examples 1-4 The ends of the second surface 112 and the third surface 121 are bonded together with 5mm wide double-sided tape and left at room temperature. The test specimens were prepared by leaving them for 24 hours. Next, the test specimens were subjected to a tensile testing using an Instron tensile testing machine. The breaking force (F(MPa)) was determined by tensile force in the direction of the arrow. The obtained breaking force was applied to the shear area ( S(mm 2 The shear strength (F / S(MPa)) was obtained by dividing by ). The shear strength is shown in Table 2.

[0060] Next, a vibration test was conducted to evaluate the durability of the storage and holding member. As shown in Figure 6, 50 50mm x 5mm urethane foam was used for storage in Examples 1-6 and Comparative Examples 1-4. 100 test specimens were prepared, each inserted into the central part of the support member. Ten of the prepared test specimens were taken to Ikeda. The storage and holding member is positioned so that one of its longer sides is facing downwards when placed in the Automatic Machinery Co., Ltd. vibrating transfer machine (TI-18). They were aligned and fixed from both sides with spring-loaded plates. Next, the vibration frequency was set to 950 rpm and the vibration angle was 1 The device was subjected to 10 vibrations, with a 5-degree angle and a 10-second descent and rise time. Storage after testing. Products with the retaining members still attached will be considered acceptable, while those with even one point of detachment will be considered unacceptable. The failure rate of the vibration test was then determined.

[0061] Next, in order to confirm the effectiveness of the ceramic substrate housing and holding member, vibration evaluation was performed to assess the surrounding environment. The contamination status from the holding member was checked. Figure 7 shows the vibration evaluation of the ceramic substrate housing and holding member. This is a front view showing the dimensions for Examples 1-3 and Comparative Examples 1-2 and 5, 60mm x 50mm x 1.72mm silicon nitride copper circuit board (silicon nitride substrate thickness 0.32mm, copper circuit thickness on both sides) 25 boards (0.7 mm on each side) were used as a substrate set. Examples 4-6 and Comparative Examples 3-4 and 6 Based on 100 silicon nitride substrates (plain substrates) measuring 30mm x 20mm x 0.32mm, The board set was assembled. Two sets of substrates and a ceramic substrate storage and holding member were stored as shown in Figure 3. The container was set inside, and the sides and top were fixed with a jig. Comparative Examples 5 and 6 are as follows: An acrylic plate of approximately the same size as the ceramic substrate storage and holding member is used as the storage and holding member. Next, the storage container with the circuit board set and silicon nitride storage member fixed to it was subjected to vibration by Ikeda Automatic Machinery Co., Ltd. The storage and holding members are aligned so that one of their longer sides is facing downwards in the type transfer machine (TI-18) and from both sides It was fixed with a spring-loaded plate. Next, the vibration frequency was 950 rpm, the vibration angle was 15 degrees, and the descent time was... The oscillation was performed 10 times with a rise time of 10 seconds. After the test, the silicon nitride substrate and nitrogen A silicon dioxide copper circuit board was heated in air at 300°C for 1 minute, and the surface (periphery) of the board was examined using a tool microscope. After inspection, samples with organic components attached were classified as having poor adhesion, and the poor adhesion rate was calculated.

[0062] [Table 2]

[0063] The ceramic substrate housing and holding members of Examples 1-6 exhibited high shear strength. This is because, This is because the Sa3 / Sa2 values ​​are within a favorable range. In contrast, the values ​​of Comparative Examples 1-4 The strength was low. This is because the Sa3 / Sa2 value is outside the desirable range. Therefore, The difference between the arithmetic mean height Sa2 of the second face and the arithmetic mean height Sa3 of the third face is large. This is because a difference in adhesive strength occurred, resulting in shearing with less strength.

[0064] Furthermore, in the ceramic substrate housing and holding members of Examples 1 to 6, the housing and holding members did not come into contact during the vibration test. It remained attached. As mentioned above, in Examples 1-6, the vibration test was performed because the shear strength was high. However, delamination did not occur. In contrast, in Comparative Examples 1-4, delamination occurred in the test specimens. This occurred because the shear strength was not high enough, causing delamination during vibration testing.

[0065] Furthermore, the ceramic substrate storage and holding members according to Examples 1 to 6 have a low adhesion defect rate, which is desirable. It was within the acceptable range. This is because the ceramic substrate housing and holding member was used, This is because adhesion from the storage container and storage holding member made of rill plate was prevented. In comparative examples 5 and 6, the adhesion rate was high. This is because the ceramic substrate was in contact with the acrylic plate. This is because, upon contact, it scraped off the surface of the acrylic plate and adhered to the surface of the ceramic substrate.

[0066] According to at least one embodiment described above, the storage container in which the circuit board set is stored In this case, while suppressing external impacts and impacts between stacked ceramic substrates, storage It is possible to prevent impurities from adhering from the container.

[0067] Although several embodiments of the present invention have been illustrated above, these embodiments are presented as examples only. These are novel embodiments and are not intended to limit the scope of the invention. It can be implemented in various other forms, without departing from the spirit of the invention, Various omissions, substitutions, and modifications are possible. These embodiments and their variations are: The scope and gist of the invention, as well as the scope of the invention and its equivalents described in the claims, are included. It is included in the enclosure. Furthermore, each of the embodiments described above can be implemented in combination with one another. [Explanation of Symbols]

[0068] 1…Ceramic substrate storage and holding member 11…First silicon nitride plate-shaped member 12…Second silicon nitride plate-shaped member 111...First surface of the first silicon nitride plate-like member 112...Second surface of the first silicon nitride plate-like member 121...Third surface of the second silicon nitride plate-like member 122...Fourth surface of the second silicon nitride plate-like member 2…Adhesive material 3…Ceramic substrate set 4…Storage containers 5… Storage circuit board set 6… Urethane foam 7…Vibration testing equipment 8...Storage and holding member

Claims

1. A ceramic holding a ceramic substrate set consisting of multiple stacked ceramic substrates. A substrate storage and holding member, A first silicon nitride comprising a first surface and a second surface provided on the opposite side of the first surface. A plate-shaped member made of, A second silicon nitride comprising a third surface and a fourth surface provided on the opposite side of the third surface. A plate-shaped member made of, The second surface of the first silicon nitride plate-shaped member and the front of the second silicon nitride plate-shaped member A ceramic substrate housing characterized in that the third surface is integrated with an adhesive member. Retaining member.

2. The ratio of the arithmetic mean height Sa3 of the third surface to the arithmetic mean height Sa2 of the second surface (S The following is a feature of the product according to claim 1, characterized in that the value of a3 / Sa2 is 0.7 or more and 1.3 or less. Lamix substrate storage and holding member.

3. The second surface of the first silicon nitride plate-shaped member and the front of the second silicon nitride plate-shaped member The adhesive member between the third surface is double-sided tape, as is the case with 1 or the case. A ceramic substrate storage and holding member as described in item 2.

4. The invention is characterized in that the arithmetic mean height of the first and fourth surfaces is 5.0 μm or less. A ceramic substrate storage and holding member according to claim 1 or claim 2.

5. The deflection amount of the first silicon nitride plate member and the second silicon nitride plate member is 0. The ceramic substrate according to claim 1 or 2, characterized in that it is 1 mm or more in thickness. Storage and retention member.

6. The thickness of the first silicon nitride plate member and the second silicon nitride plate member is 0.2 m. The ceramic substrate housing according to claim 1 or 2, characterized in that it is m or more. Support member.

7. The ceramic substrate is made of silicon nitride, aluminum nitride, and aluminum oxide. The ceramic substrate housing according to claim 1 or 2, characterized in that it is a offset. Support member.

8. The outer periphery of the ceramic substrate is processed by a laser, characterized in that The ceramic substrate storage and holding member described in 6.

9. The ceramic substrate is characterized in that a metal plate is bonded to its surface, as described in 6. A ceramic substrate storage and holding member.

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