Gas absorption unit

Abstract

To provide a gas absorption unit with improved separation and recovery efficiency for specific components. [Solution] The gas absorption unit disclosed herein comprises a gas absorber 20, an induction heating device, and a heating element 30. The gas absorber 20 comprises a porous resin matrix 22 and gas absorbing particles 26, the resin matrix 22 having a three-dimensional mesh structure including pores 24, the gas absorbing particles 26 being arranged within the pores 24 of the resin matrix 22, and the heating element 30 being arranged in contact with at least a portion of the gas absorber 20.

Description

[Technical Field]

[0001] This disclosure relates to a gas absorption unit. [Background technology]

[0002] Exhaust gases emitted from thermal power plants, factories, automobiles, etc., contain various harmful components, and there is a need for the development of materials and technologies to selectively separate and recover them. For example, carbon dioxide (CO2), one of the harmful components, is a greenhouse gas, and there is a pressing need to drastically reduce its emissions. In order to efficiently separate and recover such components, materials comprising active substances such as gas absorbents and catalysts, and carriers that support these active substances, are used. Patent documents 1 and 2 are examples of technologies related to this. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Special Publication No. 2014-506836 [Patent Document 2] Special Publication No. 2018-187574 [Overview of the project] [Problems that the invention aims to solve]

[0004] To efficiently separate and recover specific components from gases, it is conceivable to increase the amount of active material supported per carrier. Examples of such carriers include those based on honeycomb structures or nonwoven fabrics. However, these carriers have the drawback of having a low amount of active material supported per unit volume because the carrier is only placed on the surface of the substrate.

[0005] Furthermore, the above-described technology employs a method in which a specific component is adsorbed onto an active substance, and then heated gas (air) is circulated through the carrier to raise the temperature of the active substance and recover the specific component adsorbed onto the active substance. Further investigation by the inventors revealed that in order to improve the separation and recovery efficiency of the specific component, it is necessary not only to increase the amount of active substance supported, but also to use a technology to rapidly raise the carrier temperature.

[0006] The technology disclosed herein has been developed in view of the circumstances described above, and its main objective is to provide a gas absorption unit with improved separation and recovery efficiency for specific components. [Means for solving the problem]

[0007] The gas absorption unit disclosed herein comprises a gas absorbent, an induction heating device, and a heating element that generates heat by the induction heating device. The gas absorbent comprises a porous resin matrix and gas-absorbing particles, the resin matrix having a three-dimensional network structure including pores, the gas-absorbing particles being arranged within the pores of the resin matrix, and the heating element being arranged in contact with at least a portion of the gas absorbent.

[0008] The gas absorber in the gas absorption unit with the above configuration comprises a porous resin matrix, and gas-absorbing particles are arranged within the pores of the resin matrix. This configuration allows for an increase in the amount of gas-absorbing particles that can be supported. Furthermore, the gas absorption unit with the above configuration includes a heating element that generates heat using an induction heating device, and the heating element is positioned to be in contact with at least a portion of the gas absorber. This allows for a rapid increase in the temperature of the gas absorber. Therefore, a gas absorption unit with improved separation and recovery efficiency of specific components can be provided.

[0009] In one preferred embodiment of the gas absorption unit disclosed herein, the heating element is arranged such that at least a portion of it is embedded in the resin matrix.

[0010] In a preferred embodiment of the gas absorption unit disclosed herein, the heating element includes at least one of metal or carbon.

[0011] In a preferred embodiment of the gas absorption unit disclosed herein, when the area of the resin matrix in a plan view is 100%, the heating element is disposed in an area of 20% or more.

[0012] In a preferred embodiment of the gas absorption unit disclosed herein, the gas absorption particles include carrier particles having a plurality of mesopores and a gas absorbent, and the gas absorbent is disposed in the plurality of mesopores of the carrier particles.

[0013] In a preferred embodiment of the gas absorption unit disclosed herein, the carrier particles are composed of an inorganic material or an organometallic structure, and the inorganic material includes at least one of silica, alumina, ceria, zirconia, titania, activated carbon, and zeolite.

[0014] In a preferred embodiment of the gas absorption unit disclosed herein, the porosity of the gas absorber based on the Archimedes method is 60% or more and 90% or less.

[0015] In a preferred embodiment of the gas absorption unit disclosed herein, the thermal conductivity of the gas absorber is 0.02 W / m·K or more and 1 W / m·K or less.

[0016] In a preferred embodiment of the gas absorption unit disclosed herein, the gas absorber is in a sheet shape, and a plurality of the gas absorbers are laminated along a predetermined arrangement direction.

[0017] In a preferred embodiment of the gas absorption unit disclosed herein, the gas absorber includes a base portion and a convex portion extending from the surface of the base portion.

[0018] In a preferred embodiment of the gas absorption unit disclosed herein, in a plan view, the arrangement positions of the convex portions of the plurality of gas absorbers are substantially the same.

[0019] In one preferred embodiment of the gas absorption unit disclosed herein, the induction heating device is positioned at at least one end of the gas absorber in the direction of arrangement.

[0020] In one preferred embodiment of the gas absorption unit disclosed herein, the induction heating device is positioned at at least one end of the gas absorber in a direction perpendicular to the arrangement direction of the gas absorber. [Brief explanation of the drawing]

[0021] [Figure 1] Figure 1 is a schematic perspective view of the gas absorption unit disclosed herein. [Figure 2] Figure 2 is a schematic perspective view showing the internal structure of the gas absorption unit disclosed herein. [Figure 3] Figure 3 is a schematic plan view showing the structure of the gas absorber according to this embodiment. [Figure 4] Figure 4 is a schematic enlarged view showing the structure of the gas absorber according to this embodiment. [Figure 5] Figure 5 is a diagram corresponding to Figure 1 relating to the first modified example. [Figure 6] Figure 6 is a schematic front view showing the gas absorber and heating element according to the first modified example. [Figure 7] Figure 7 is a schematic top view showing a gas absorber according to the first modified example. [Figure 8] Figure 8 is a corresponding diagram to Figure 4 relating to the first modified example. [Figure 9] Figure 9 is a corresponding diagram to Figure 2 relating to the first modified example. [Figure 10] Figure 10 is a diagram corresponding to Figure 1, relating to a second modified example. [Figure 11] Figure 11 is a schematic front view showing the gas absorber and heating element according to the second modified example. [Figure 12] Figure 12 is a schematic top view showing a gas absorber according to a second modified example. [Modes for carrying out the invention]

[0022] Hereinafter, preferred embodiments of the technology disclosed herein will be described with reference to the drawings. Matters other than those specifically mentioned herein but necessary for implementation can be understood based on the technical content taught herein and the common technical knowledge of those skilled in the art. The technology disclosed herein can be implemented based on the content disclosed herein and the common technical knowledge of the art. In this specification, the notation "A to B" indicating a range means A or greater and B or less.

[0023] In the following drawings, components and parts that perform the same function are denoted by the same reference numerals. Also, the dimensional relationships (length, width, thickness, etc.) in each drawing do not reflect the actual dimensional relationships. The arrows X, Y, and Z in the drawings indicate three mutually orthogonal directions, with X indicating the width direction, Y indicating the longitudinal direction, and Z indicating the thickness direction (vertical direction). The directions of up, down, left, right, front, and back are represented by the arrows U, D, L, R, F, and Rr in the drawings, respectively. Here, the directions of up, down, left, right, front, and back are defined only for the sake of explanation and do not limit the content of the technology disclosed herein unless otherwise specified.

[0024] <Gas Absorption Unit> Figure 1 is a schematic perspective view of the gas absorption unit 100 disclosed herein. Figure 2 is a schematic perspective view of the internal structure of the gas absorption unit 100 disclosed herein. In Figure 1, the direction of gas flow is indicated by a white arrow. In Figure 2, the frame 10 is not shown. In Figures 1 and 2, the heating element 30 is shown by a dashed line. The gas absorption unit 100 according to this embodiment is characterized by comprising a gas absorber 20, a heating element 30, and an induction heating device 40. In this embodiment, the gas absorption unit 100 further comprises a frame 10.

[0025] The gas absorption unit disclosed herein is configured to absorb, for example, a gas (component) to be recovered from a mixed gas containing multiple types of gases. Examples of mixed gases include air, exhaust gas, flue gas, biogas, gases generated in the cement manufacturing process, gases generated in the iron and steel manufacturing process and / or the manufacturing process of steel products. The gases to be absorbed by the gas absorption unit disclosed herein may include, for example, various acidic gases, various basic gases, carbon monoxide, oxygen, nitrogen, hydrogen, etc.

[0026] Examples of acidic gases include carbon dioxide (CO2), hydrogen sulfide (H2S), carbon disulfide (CS2), carbonyl sulfide (COS), mercaptan (R-SH, where "R" is an alkyl group having 1 to 20 carbon atoms), and sulfur dioxide (SO2). Examples of basic gases include monomethylamine, monoethylamine, dimethylamine, methylethylamine, diethylamine, and ammonia. The type of gas to be absorbed is not particularly limited, as long as there are gas-absorbing particles or gas absorbents for that gas.

[0027] As shown in Figure 1, in this embodiment, a plurality of sheet-like gas absorbers 20 and heating elements 30 are stacked in a predetermined arrangement direction (the Z-axis direction in this embodiment) and held by a frame 10. As shown in Figure 1, a pair of openings 10h are formed at both ends of the frame 10. The pair of openings 10h serve as gas vents. In other words, when the gas absorption unit is in use, gas flows in from one opening 10h and is discharged from the other opening 10h. In this embodiment, the frame 10 has a flattened, bottomed rectangular parallelepiped shape. However, the external shape of the frame 10 is not particularly limited and can be appropriately changed depending on the shape of the gas absorber 20 and the device to which it is applied, for example, it can be cylindrical, cubic, polygonal columnar, etc.

[0028] The arrangement direction of the gas absorbers 20 is not particularly limited, but it is preferable that the gas absorbers 20 be stacked in a direction substantially perpendicular to the gas flow direction (white arrow in Figure 1). This reduces pressure loss when gas flows in. Also, although not limited to this, it is preferable that the gas absorbers 20 be stacked so that gaps are formed between them. As shown in Figures 1 and 2, in this embodiment, multiple gas absorbers 20 are stacked so that gaps are formed between them. This creates a space S between adjacent gas absorbers 20. This space S serves as a gas flow path when gas is introduced into the gas absorption unit 100. However, it is not limited to this, and the multiple gas absorbers 20 may be stacked so that they are in contact with each other. Also, the method of holding the gas absorbers 20 is not limited to the frame 10, and for example, the multiple gas absorbers 20 may be fixed with an adhesive. Examples of adhesives that can be used include water-based adhesives, urea resin-based adhesives, melamine resin-based adhesives, phenol resin-based adhesives, resorcinol resin-based adhesives, water-based polymer-isocyanate-based adhesives, vinyl acetate resin-based adhesives, emulsion-type adhesives, solvent-based adhesives, chloroprene rubber-based adhesives, chemical reaction-based adhesives, epoxy resin-based adhesives, urethane resin-based adhesives, modified silicone-based adhesives, and hot-melt adhesives.

[0029] The material used to construct the frame 10 is not particularly limited, but for example, iron, stainless steel, etc., can be used. When the induction heating device 40 is placed on the outside of the frame 10, it is preferable to use a material that generates heat when heated by the induction heating device 40.

[0030] <Gas absorber> Figure 3 is a schematic plan view showing the structure of the gas absorber 20 according to this embodiment. Figure 4 is a schematic enlarged view showing the structure of the gas absorber 20 according to this embodiment. In Figures 3 and 4, the heating element 30 is shown by a dashed line. In Figure 3, the gas absorbing particles 26 are not shown. As shown in Figure 4, the gas absorber 20 according to this embodiment includes a resin matrix 22 and gas absorbing particles 26.

[0031] The gas absorber 20 can be molded into a sheet, a rectangular parallelepiped, a cube, a prismatic shape, a cylindrical shape, a spherical shape, or the like. Although not particularly limited, the gas absorber 20 is preferably a carrier sheet molded into a sheet shape. If the gas absorber 20 is in the form of a sheet, for example, it is preferable that its thickness is 0.02 mm or more and 15 mm or less.

[0032] The resin matrix 22 contained in the gas absorber 20 disclosed herein has a porous structure having pores 24, as shown in Figure 4. The resin matrix 22 may function as a framework in the gas absorber 20. The resin matrix 22 may be composed, for example, by bonding resin crystalline particles together. The pores 24 may be interconnected pores that communicate with each other. A plurality of gas-absorbing particles 26 are arranged within the pores 24. It is preferable that the gas-absorbing particles 26 are mainly separated from the resin matrix 22 and present in the pores 24, and more preferably that the majority of them are separated from the resin matrix 22 and present in the pores 24. The gas-absorbing particles 26 are particles that absorb a specific gas to be recovered, as will be described later. The presence of the resin matrix 22 and gas-absorbing particles 26 in the gas absorber 20 can be confirmed, for example, by observing the surface or cross-section of the gas absorber 20 with a scanning electron microscope (SEM).

[0033] The gas absorber 20 disclosed herein has gas-absorbing particles 26 arranged in the pores 24 of the resin matrix 22. This allows for the support of more gas-absorbing particles and gas absorbent than conventional materials. Therefore, the amount of gas-absorbing particles (gas absorbent) per unit volume is increased, improving the recovery and separation performance of the target gas. Furthermore, the gas absorber 20 has a three-dimensional mesh structure, which provides excellent gas diffusion. This facilitates the flow of gas (air). With a gas absorber 20 having such a configuration, when gas (air) is flowed in the thickness direction of the gas absorber 20, the gas (air) reaches the gas-absorbing particles 26 arranged inside the gas absorber 20, improving the separation and recovery efficiency of the target gas.

[0034] Although not particularly limited, the porosity of the gas absorber 20 disclosed herein based on the Archimedes method is preferably 60% or more, more preferably 65% or more, and particularly preferably 70% or more. Thereby, the gas and the gas absorption particles or the gas absorbent can be suitably brought into contact. On the other hand, since air has a low thermal conductivity, the lower the porosity of the gas absorber 20, the higher the thermal conductivity of the gas absorber 20. From this, the porosity of the gas absorber 20 based on the Archimedes method is preferably, for example, 90% or less, and may be 86% or less. Note that the "porosity of the gas absorber" can be calculated based on the Archimedes method. More specifically, the dry weight W of the gas absorber Air , the weight in water W Aq , and the water-containing weight W a+w are measured, and the porosity (P) can be calculated based on the following formula (1). P (%) = (W a+w - W Air ) / (W a+w - W Aq ) × 100 ··· (1)

[0035] Although not particularly limited, the water absorption rate of the gas absorber 20 disclosed herein based on the Archimedes method is preferably 140% or more, more preferably 160% or more, still more preferably 170% or more, and may be 190% or more, or may be 200% or more. Typically, the higher the water absorption rate of the gas absorber 20, the greater the amount of gas absorption particles or gas absorbent supported per unit volume, and the separation and recovery performance of the gas to be recovered can be improved. From this perspective, a higher water absorption rate is preferable, and the upper limit is not particularly limited. For example, the water absorption rate of the gas absorber 20 based on the Archimedes method may be 400% or less, may be 370% or less, or may be 350% or less. Note that the "water absorption rate of the gas absorber" can be calculated based on the Archimedes method. More specifically, the dry weight W of the gas absorber Air , the weight in water W Aq , and the water-containing weight W a+w are measured, and the water absorption rate (Aw) can be calculated based on the following formula (2). Aw(%)=(W a+w -W Air ) / W Air ×10···(2)

[0036] While not particularly limited, the gas absorber 20 preferably has high resistance to hot water. The heat resistance of the gas absorber 20 is preferably 120°C or higher, more preferably 140°C or higher, and may be 150°C or higher, or even 160°C or higher. This allows the gas absorber 20 disclosed herein to be suitably used even in environments exceeding 100°C or in relatively humid environments. The heat resistance of the gas absorber 20 is preferably, for example, 250°C or lower, and may be 200°C or lower. The "heat resistance of the gas absorber" can be evaluated by drying the gas absorber immersed in hot water in an autoclave and measuring its strength by a conventionally known tensile test.

[0037] While not particularly limited, the thermal conductivity of the gas absorber 20 is preferably 0.02 W / m·K or higher, more preferably 0.04 W / m·K or higher, and even more preferably 0.06 W / m·K or higher, from the viewpoint of rapidly desorbing the gas to be recovered. On the other hand, while not particularly limited, the upper limit of the thermal conductivity of the gas absorber 20 is preferably 1 W / m·K or lower, more preferably 0.8 W / m·K or lower, and even more preferably 0.6 W / m·K or lower, from the viewpoint of increasing the porosity of the gas absorber. The "thermal conductivity of the gas absorber" can be obtained by measuring the thermal conductivity in the thickness direction of the gas absorber using the protective hot plate method (GHP method) in accordance with JIS A 1412-1:2016.

[0038] The resin matrix 22 is a porous body containing a plurality of pores 24. The average pore diameter A of the resin matrix 22 is preferably 0.4 μm or more, more preferably 0.5 μm or more, even more preferably 0.6 μm or more, and may be 1 μm or more. This allows the gas-absorbing particles 26 to be suitably supported on the gas absorber 20. If the average pore diameter A of the resin matrix 22 is too large, the gas-absorbing particles 26 may detach from the resin matrix 22. From this viewpoint, the average pore diameter A of the resin matrix 22 is preferably, for example, 10 μm or less, more preferably 7 μm or less, and even more preferably 5 μm or less. The "average pore diameter of the resin matrix" can be determined by a mercury intrusion method using a commercially available mercury porosimeter.

[0039] The resin matrix 22 contains a resin, and may be composed of crystalline particles of the resin bonded together. While not particularly limited, the resin matrix 22 preferably contains a resin with a glass transition temperature (Tg) of 70°C or higher. This improves the heat resistance of the gas absorber 20. The glass transition temperature of the resin contained in the resin matrix 22 is preferably 70°C or higher, but may also be 100°C or higher, or 120°C or higher. The glass transition temperature of the resin contained in the resin matrix 22 may also be, for example, 260°C or lower, or 250°C or lower. The "glass transition temperature of the resin" can be measured according to conventionally known methods such as differential scanning calorimetry (DSC) measurement or dynamic viscoelasticity measurement (DMA method).

[0040] Furthermore, although not particularly limited, the resin matrix 22 preferably contains a resin with high heat water resistance. This can improve the heat water resistance of the gas absorber 20. The heat water resistance of the resin contained in the resin matrix 22 is preferably 120°C or higher, more preferably 140°C or higher, and may be 150°C or higher, or 160°C or higher. The heat water resistance of the resin contained in the resin matrix 22 is preferably, for example, 300°C or lower, may be 250°C or lower, or 200°C or lower. In this specification, "heat water resistance of the resin" can be taken from the temperature measured by load deflection in accordance with JIS K 7191-2:2015.

[0041] The resin content is not particularly limited, but is preferably 5% to 50% by mass, more preferably 10% to 45% by mass, and even more preferably 20% to 40% by mass, when the total mass of the gas absorber 20 is taken as 100% by mass. This allows for a favorable improvement in the water absorption of the gas absorber 20.

[0042] While not particularly limited, the resin components included in the resin matrix 22 include acrylic resins, cellulose resins, and resins classified as super engineering plastics. The resin matrix 22 may contain any one of the above-mentioned resins alone, or it may contain a combination of two or more.

[0043] Acrylic resins include, for example, polymers containing alkyl (meth)acrylate as a constituent monomer component and derivatives thereof. In this specification, "(meth)acrylate" is used as a term that comprehensively means acrylate and / or methacrylate. Examples of acrylic resins include polymers containing alkyl (meth)acrylate as a main monomer (a component accounting for 50% or more by mass of the total monomer) and copolymers containing this main monomer and a secondary monomer copolymerizable with the main monomer. Examples of acrylic resins include poly(meth)acrylic acid, poly(meth)acrylamide, polymethyl methacrylate (PMMA), etc. Among these, the acrylic resin used in the resin matrix 22 preferably contains methacrylic acid and / or PMMA.

[0044] Cellulose resins include, for example, all compounds derived from cellulose (cellulose derivatives). Examples of cellulose resins include ethylcellulose (EC), hydroxyethylcellulose (HEC), ethylmethylcellulose (EMC), hydroxyethylmethylcellulose (HEMC), nitrocellulose, and diacetylcellulose. Among these, the cellulose resin used in the resin matrix 22 preferably contains ethylcellulose.

[0045] Super engineering plastics are resins characterized by, for example, excellent heat resistance and excellent mechanical strength. Examples of super engineering plastics include fluorine-based resins such as polytetrafluoroethylene (PTFE), tetrafluoroethylene perfluorovinyl ether copolymer (PFA), tetrafluoroethylene hexafluoropropylene copolymer (FEP), chlorotrifluoroethylene homopolymer (PCTFE), ethylene tetrafluoroethylene copolymer (ETFE), ethylene chlorotrifluoroethylene copolymer (ECTFE), and vinylidene fluoride homopolymer (PVDF); thermoplastic polyimides such as polybenzimidazole (PBI), polyimide (PI), polyetherimide (PEI), and polyamideimide (PAI); and polyethersulfone (PES), polyetheretherketone (PEEK), polyphenylene sulfide (PPS), PSU (polysulfone), and polyphenylsulfone (PPSU). The super engineering plastic used in the resin matrix 22 preferably contains PEI, PES, PVDF, PSU, PPSU, etc.

[0046] The gas-absorbing particles 26 are particles that absorb a specific gas to be recovered. The gas-absorbing particles 26 may absorb the specific gas to be recovered by themselves. Alternatively, the gas-absorbing particles 26 may be in a form that carries a gas absorbent, and the specific gas may be absorbed by the gas absorbent. In other words, the gas-absorbing particles 26 disclosed herein encompass both forms that include a gas absorbent and forms that do not include a gas absorbent (in other words, the gas-absorbing particles themselves have a gas-absorbing function).

[0047] The shape of the gas-absorbing particles 26 is not particularly limited and may be spherical or non-spherical. Examples of non-spherical gas-absorbing particles 26 include plate-like, flaky, or irregularly shaped particles.

[0048] When spherical gas-absorbing particles 26 are used, the aspect ratio of the gas-absorbing particles 26 is preferably 1.2 or less, more preferably 1.15 or less, and particularly preferably 1.1 or less. This allows for more stable absorption of the specific gas to be recovered. On the other hand, when non-spherical gas-absorbing particles 26 are used, the aspect ratio of the gas-absorbing particles 26 is preferably 1.3 or more, more preferably 1.5 or more, even more preferably 1.7 or more, and particularly preferably 2 or more. Using gas-absorbing particles 26 with such high aspect ratios allows for a suitable increase in the specific surface area of ​​the gas-absorbing particles 26, and thus a suitable improvement in the adsorption efficiency of the gas components to be recovered. On the other hand, from the viewpoint of absorption stability of the specific gas to be absorbed and productivity of the gas-absorbing particles, the upper limit of the aspect ratio of non-spherical gas-absorbing particles 26 is preferably 5 or less, more preferably 4 or less, and particularly preferably 3 or less. Furthermore, the gas-absorbing particles 26 may be in the form of a so-called mixed powder, which is a mixture of spherical and non-spherical particles.

[0049] The type of particles used for the gas-absorbing particles 26 is not particularly limited and can be appropriately selected depending on the type of gas to be recovered. The gas-absorbing particles 26 may be composed of, for example, an inorganic material or a metal-organic framework (MOF). When the gas-absorbing particles 26 are composed of an inorganic material, examples of inorganic materials that can be used include zeolite, carbon, activated carbon, glass, clay minerals, diatomaceous earth, etc. The inorganic material may be any one of the above-mentioned inorganic materials alone, or it may be a combination of two or more types.

[0050] The average particle size of the gas-absorbing particles 26 is not particularly limited, but may be, for example, about 0.1 μm to 20 μm. If the average particle size of the gas-absorbing particles 26 is too small, the gas-absorbing particles 26 tend to be difficult to disperse in the gas absorber 20. From this viewpoint, the average particle size of the gas-absorbing particles 26 may be, for example, 0.1 μm or more, 1 μm or more, 3 μm or more, or 5 μm or more. On the other hand, if the average particle size is too large, the time it takes for the gas to reach the inside of the gas-absorbing particles 26 increases. From this viewpoint, the average particle size of the gas-absorbing particles 26 may be, for example, 10 μm or less, 7 μm or less, or 5 μm or less. In this specification, "average particle size of gas-absorbing particles" refers to the arithmetic mean of the equivalent circle diameter measured based on optical microscope observation. Here, the equivalent circle diameter refers to the diameter of a circle having the same area as the ellipse formed by the longest diameter of the gas-absorbing particles observed in a microscope image (the major axis) and the longest diameter of the line intersecting the major axis at a right angle (the minor axis). In this specification, the average particle size of porous particles refers to the arithmetic mean of the equivalent circle diameters of 200 randomly selected gas-absorbing particles.

[0051] From the viewpoint of increasing the contact area between the gas-absorbing particles 26 and the gas to be recovered, it is preferable that the specific surface area of ​​the gas-absorbing particles 26 be large. Although not particularly limited, the specific surface area of ​​the gas-absorbing particles 26 measured by the BET method (BET specific surface area) is, for example, 70 m². 2 / g or more 500m 2 It is preferable that it be less than or equal to / g, and 150m 2 / g or more 400m 2 It is more preferable that the value be less than or equal to / g. In this specification, the "BET specific surface area of ​​the gas-absorbing particles" can be measured by the nitrogen adsorption method using a commercially available specific surface area measuring device.

[0052] The content of gas-absorbing particles 26 is not particularly limited, but is preferably 5% to 35% by mass, more preferably 8% to 30% by mass, even more preferably 10% to 25% by mass, and may be 13% to 20% by mass, when the total mass of the gas absorber 20 is taken as 100% by mass. This allows for a favorable improvement in the adsorption efficiency of the gas to be recovered.

[0053] As shown in Figure 4, the gas-absorbing particles 26 according to this embodiment have a plurality of pores 26p. Although not limited to this, the gas-absorbing particles 26 are preferably porous particles having a plurality of mesopores. In other words, the gas-absorbing particles 26 may be, for example, a mesoporous material having mesopores. With such a configuration, the contact area between the gas-absorbing particles 26 and the gas to be recovered can be increased. This makes it possible to suitably improve the adsorption efficiency of the gas to be recovered. Furthermore, the gas-absorbing particles 26 in this embodiment are arranged in the pores 24 of the resin matrix 22. This allows the gas-absorbing particles 26 to exist in a state where the pores 26p of the gas-absorbing particles 26 are not crushed or filled with resin.

[0054] "Mesopore" refers to a pore with a diameter in the range of 2 nm to less than 50 nm, based on the IUPAC classification. Pore 26p is an example of a "mesopore." The presence of pore 26p in the gas-absorbing particle 26 can be confirmed, for example, by observing the surface or cross-section of the gas-absorbing particle 26 with a scanning electron microscope (SEM).

[0055] When the gas-absorbing particles 26 have multiple mesopores, the average pore diameter B of the gas-absorbing particles 26 is preferably, for example, 2 nm or more, more preferably 10 nm or more, and even more preferably 12 nm or more. This allows for suitable introduction of the gas absorbent into the pores 26p when it is supported. The average pore diameter B of the gas-absorbing particles 26 is preferably, for example, 100 nm or less, more preferably 70 nm or less, even more preferably 50 nm or less, and particularly preferably 40 nm or less. This allows for a suitable increase in the specific surface area of ​​the gas-absorbing particles 26, and thus a suitable improvement in the adsorption efficiency of the gas components to be recovered. The "average pore diameter of the gas-absorbing particles" can be measured for the gas absorber using a commercially available pore diameter distribution measuring device and the pore diameter distribution by the gas adsorption method based on the BJH method.

[0056] While not particularly limited, in the gas absorber 20, the ratio (A / B) of the average pore diameter A of the resin matrix 22 to the average pore diameter B of the gas absorbing particles 26 is preferably 20 or more and 200 or less, more preferably 24 or more and 165 or less, and may also be 50 or more and 120 or less. That is, it is preferable that the gas absorber 20 has a structure that includes both relatively small pores (e.g., mesopores less than 50 nm) derived from the gas absorbing particles 26 and relatively large pores (e.g., pores of 0.5 μm or more) derived from the pores 24 of the resin matrix 22. This allows for a favorable improvement in the adsorption efficiency of the gas to be recovered by the gas absorber 20.

[0057] While not particularly limited, in the gas absorber 20, the mass ratio of gas-absorbing particles 26 to the resin constituting the resin matrix 22 is preferably, for example, 20:80 to 80:20, more preferably 30:70 to 75:25, and even more preferably 60:40 to 70:30. This allows for a suitable balance between the average pore size A derived from the resin matrix 22 and the average pore size B derived from the gas-absorbing particles 26, thereby improving the adsorption efficiency of the gas to be recovered by the gas absorber 20.

[0058] The gas absorber 20 may further include thermally conductive fibers, although this is not particularly limited. This allows for a more favorable improvement in the thermal conductivity performance of the gas absorber 20. The thermally conductive fibers are not particularly limited, but carbon fibers, metal fibers, etc., can be used. The distribution of thermally conductive fibers in the gas absorber 20 is not particularly limited, but from the viewpoint of transferring heat throughout the gas absorber 20, it is preferable that the thermally conductive fibers are uniformly dispersed in the resin matrix 22. The length of the thermally conductive fibers is not particularly limited, but for example, it may be 100 μm or more and 10 mm or less. When the gas absorber 20 is equipped with thermally conductive fibers, the proportion of thermally conductive fibers to the total gas absorber 20 is not particularly limited, as it can be adjusted depending on the thermally conductive fibers used and the temperature at which the gas absorber 20 is used, but for example, when the total mass of the gas absorber 20 is 100% by mass, the proportion may be 5% by mass or more and 30% by mass or less.

[0059] <Heating element> The heating element 30 is a component that generates heat using an induction heating device 40, which will be described later. The heating element 30 is positioned so as to be in contact with at least a portion of the gas absorber 20.

[0060] When separating and recovering a specific gas to be recovered using a gas absorption unit, the following method is employed. First, a mixed gas (e.g., air) is passed through the gas absorbent, and the specific gas contained in the mixed gas is separated by adsorption onto the gas absorbent. Then, by heating the gas absorbent to a predetermined temperature, the gas to be recovered that has been adsorbed onto the gas absorbent is desorbed from the gas absorbent and recovered. To efficiently separate and recover the gas to be recovered, it is necessary to heat the gas absorbent to a predetermined temperature quickly.

[0061] As described above, the gas absorption unit disclosed herein includes a heating element 30. The heating element 30 is characterized by being positioned in contact with the gas absorber 20. With this configuration, when the heating element 30 is heated by the induction heating device 40, the generated heat is transferred to the gas absorber 20, causing the temperature of the gas absorber 20 to rise. This allows the gas absorber 20 to be quickly heated to a predetermined temperature.

[0062] As shown in Figure 1, in this embodiment, the heating element 30 is positioned approximately in the center when viewed in the thickness direction of the gas absorber 20. However, it is not limited to this, and the heating element 30 may be positioned off-center to the upper or lower side when viewed in the thickness direction of the gas absorber 20. Also, a portion of the heating element 30 may be exposed from the surface of the resin matrix 22 (upper or lower side when viewed in the thickness direction). Preferably, at least a portion of the heating element 30 is embedded in the gas absorber 20 (more specifically, the resin matrix 22). In other words, in some embodiments, the heating element 30 can be supported on the resin matrix 22. This ensures more reliable contact between the heating element 30 and the gas absorber 20, allowing the heating element 30 to rapidly heat the gas absorber 20.

[0063] The heating element 30 is not particularly limited as long as it generates heat through the induction heating device 40, but from the viewpoint of dielectric heating efficiency, it is preferable to have at least one of metal or carbon. Examples of the above metals include SUS, iron-chromium-aluminum alloy (kanthal wire), nickel-chromium alloy (nichrome wire), molybdenum, tungsten, platinum, tantalum, tungsten, silicon carbide, molybdenum silicide, lanthanum chromite, carbon, molybdenum disilicide, etc.

[0064] As shown in Figure 3, the heating element 30 here is a sheet-like material. The shape of the heating element 30 is not particularly limited, and a plate-like material, a mesh-structured material, or a material with multiple through holes (for example, perforated metal) can be used. Among these, from the viewpoint of reducing pressure loss, it is preferable to use a mesh-structured material or a material with multiple through holes as the heating element 30.

[0065] When a mesh structure is used as the heating element 30, the weaving method is not particularly limited, and known weaving methods such as plain weave, twill weave, tatami weave, and twill tatami weave can be used. The thickness of the heating element 30 is not particularly limited and may be, for example, 0.02 mm or more and 15 mm or less.

[0066] While not limited to this, when a mesh structure is used as the heating element 30, the wire diameter of the heating element 30 is preferably 0.016 mm or more, more preferably 0.02 mm or more, and even more preferably 0.03 mm or more. This allows the temperature of the gas absorber 20 to be raised appropriately. On the other hand, from the viewpoint of ensuring a sufficient flow path for gas (air) and from the viewpoint of more efficiently bringing the gas-absorbing particles 26 placed inside the gas absorber 20 into contact with the gas to be recovered, the wire diameter of the heating element 30 is preferably 2 mm or less, more preferably 1.5 mm or less, and even more preferably 1 mm or less. The "wire diameter of the heating element" can be measured using a caliper or the like.

[0067] While not limited to this, when a mesh structure is used as the heating element 30, the mesh opening of the heating element 30 is preferably 0.01 mm or more, more preferably 0.015 mm or more, and even more preferably 0.02 mm or more. This suppresses obstruction of the gas (air) flow path through the gas absorber 20 and allows the gas-absorbing particles 26 placed inside the gas absorber 20 to come into contact with the gas to be recovered more efficiently. On the other hand, from the viewpoint of suitably raising the temperature of the gas absorber 20, the mesh opening of the heating element 30 is preferably 20 mm or less, more preferably 15 mm or less, and even more preferably 10 mm or less. The "mesh opening of the heating element" can be determined by first counting the number of holes in one side of the heating element over 1 inch (25.4 mm). Then, based on the obtained mesh number and wire diameter (mm), the "mesh opening of the heating element (mm) = (25.4 / mesh number) - wire diameter (mm)".

[0068] The void ratio of the heating element 30 is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. This suppresses obstruction of the gas (air) flow path through the gas absorber 20, and allows for more efficient contact between the gas-absorbing particles 26 placed inside the gas absorber 20 and the gas to be recovered. On the other hand, from the viewpoint of suitably raising the temperature of the gas absorber 20, the void ratio of the heating element 30 is preferably 90% or less, more preferably 85% or less, and even more preferably 80% or less. Note that when a mesh structure is used as the heating element, the "void ratio of the heating element (%) = (mesh opening (mm))" 2 (Mesh opening (mm) + wire diameter (mm)) 2 It can be calculated by multiplying by 100. Furthermore, when perforated metal is used as the heating element, the porosity (%) can be calculated using a formula corresponding to the shape, diameter, pitch, and arrangement of the holes, and the resulting porosity (%) can be adopted as the "void ratio of the heating element." Since such formulas are well known to those skilled in the art, they are omitted here.

[0069] As shown in Figure 2, the gas absorption unit 100 according to this embodiment is equipped with one heating element 30 for each gas absorber 20. However, the number of heating elements equipped for each gas absorber is not limited to this. In some embodiments, the gas absorption unit may be equipped with multiple (two or more) heating elements for each gas absorber, depending on the shape (thickness) of the gas absorber and the desired thermal conductivity of the gas absorber.

[0070] As shown in Figure 3, in this embodiment, the heating element 30 is arranged over the entire area of ​​the resin matrix 22 in a plan view. However, it is not limited to this, and the heating element 30 may be arranged in a part of the area of ​​the resin matrix 22 in a plan view. In other words, the heating element 30 may be arranged so as to be in contact with at least a part of the gas absorber 20 (resin matrix 22). Also, the heating element 30 may be arranged so as to protrude (be exposed) from the edges of the resin matrix 22 in the width direction and / or longitudinal direction. Although not limited to this, from the viewpoint of suitably raising the temperature of the gas absorber 20, it is preferable to arrange the heating element 30 in an area of ​​20% or more, and more preferable to arrange the heating element 30 in an area of ​​30% or more, when the area of ​​the resin matrix 22 in a plan view is taken as 100%.

[0071] <Induction heating device> The induction heating device 40 is a device that induces heat generation in the heating element 30. The induction heating device 40 is connected to a power supply (not shown). When current flows through the induction heating device 40 by the power supply, the heating element 30 generates heat. This allows the gas absorber 20 to be heated up rapidly. The induction heating device 40 can be any conventionally known device without limitation.

[0072] The number of induction heating devices 40 arranged in the gas absorption unit 100 is not particularly limited; there may be one or more (two or more). The location where the induction heating devices 40 are arranged is not particularly limited, but it is preferable to arrange them at one end in the direction of arrangement of the gas absorber 20 and the heating element 30. As shown in Figure 1, in this embodiment, a total of two induction heating devices 40 are arranged, one at each end in the direction of arrangement of the gas absorber 20 and the heating element 30, and are held by the frame 10.

[0073] As shown in Figure 2, in this embodiment, the induction heating device 40 is positioned to cover the entire area of ​​the gas absorber 20 in a plan view. However, it is not limited to this, and the induction heating device 40 may be positioned in a part of the area of ​​the gas absorber 20 in a plan view. Also, the induction heating device 40 may be positioned so as to protrude (be exposed) from the ends of the gas absorber 20 in the width direction and / or the longitudinal direction.

[0074] The above describes one embodiment of the technology disclosed herein. However, the above-described embodiment is not intended to limit the technology disclosed herein. Other embodiments of the technology disclosed herein will be described below.

[0075] <First variation> Figure 5 is a diagram corresponding to Figure 1 relating to the first modified example. Figure 6 is a schematic front view showing the gas absorber 220 and heating element 30 relating to the first modified example. Figure 7 is a schematic top view showing the gas absorber 220 relating to the first modified example. Figure 8 is a diagram corresponding to Figure 4 relating to the first modified example. Figure 9 is a diagram corresponding to Figure 2 relating to the first modified example. In Figure 7, the heating element 30 is not shown.

[0076] As shown in Figure 5, in the first modified example, the gas absorption unit 200 includes a gas absorber 220 instead of a gas absorber 20. Also, as shown in Figure 8, in the first modified example, the gas absorption unit 200 includes gas absorbent particles 226 instead of gas absorbent particles 26. Aside from these points, the invention may be the same as the embodiment described above, and since this has already been explained, redundant descriptions are omitted.

[0077] For example, in the embodiment described above, the gas absorber 20 was in the form of a flat sheet. However, it is not limited to this. As shown in Figures 6 and 7, the gas absorber 220 comprises a base portion 220b and a protrusion 220p. In some preferred embodiments, it may further comprise a plurality of protrusions 220p, although this is not particularly limited. Here, the protrusions 220p extend upward from the surface of the base portion 220b. Here, the base portion 220b and the protrusions 220p are integrally formed as a resin matrix 222. That is, the base portion 220b and the protrusions 220p each have pores 224, and gas absorbing particles 226 (see Figure 8) are arranged in each pore 224. In other words, the configuration of the gas absorber 220 is the same as that of the gas absorber 20 according to the embodiment described above, except that it comprises a base portion 220b and a protrusion 220p.

[0078] As shown in Figure 5, in the gas absorption unit 200 according to the first modified example, a plurality of gas absorbers 220 are stacked along a predetermined arrangement direction (the Z-axis direction in this embodiment). At this time, a space S is formed between adjacent gas absorbers 220 by the protrusions 220p. Furthermore, by providing protrusions 220p on the gas absorbers 220, turbulence can be generated in the gas flow. This makes it possible to further improve the contact efficiency between the gas absorbing particles 226 and the gas while reducing pressure loss.

[0079] In the first modified example, the gas absorbers 220 are stacked so that the protrusions 220p of the gas absorbers 220 are in contact with the base portions 220b of adjacent gas absorbers 220. However, the invention is not limited to this, and the gas absorbers 220 may be stacked so that the protrusions 220p of the gas absorbers 220 are in contact with the protrusions 220p of adjacent gas absorbers 220. Alternatively, the gas absorbers 220 may be stacked so that the base portions 220b of the gas absorbers 220 are in contact with the base portions 220b of adjacent gas absorbers 220. Furthermore, as shown in Figure 5, in the first modified example, the gas absorbers 220 are stacked so that the positions of the protrusions 220p of the multiple gas absorbers 220 are substantially the same in a plan view. However, the invention is not limited to this, and the gas absorbers may be stacked with the protrusions 220p of the multiple gas absorbers 220 offset in a plan view.

[0080] As shown in Figure 5, in the first modified example, the multiple protrusions 220p are spaced apart from each other and extend along a direction perpendicular to the thickness direction of the gas absorber 20 (here, the Y-axis direction) (in other words, arranged in a stripe pattern). The spacing between the multiple protrusions 220p may be equal or unequal. Also, in the first modified example, the multiple protrusions 220p are arranged on only one surface of the base portion 220b. However, the invention is not limited to this, and the multiple protrusions 220p may be further provided on the other surface of the base portion 220b. In other words, in some embodiments, the gas absorber 220 may have protrusions 220p on both sides.

[0081] As shown in Figure 6, the protrusion 220p is columnar in this case. As shown in Figure 6, the protrusion 220p has a flat surface 220A at its tip in the protruding direction. The area of ​​the flat surface 220A is preferably set to 60% to 100% of the cross-sectional area of ​​the base end 220C of the protrusion 220p. For this reason, the protrusion 220p may be tapered, with its diameter gradually decreasing in the protruding direction. In this embodiment, the base end 220C of the protrusion 220p refers to the boundary between the protrusion 220p and the base portion 220b.

[0082] In this embodiment, the total area of ​​the flat surface 220A of the protrusions 220p is, for example, 30% or more of the total area of ​​the surface on which the protrusions 220p are provided in the gas absorber 220. From the viewpoint of improving the thermal conductivity efficiency of the gas absorber 220, it is preferably 40% or more, more preferably 50% or more, and even more preferably 60% or more. On the other hand, from the viewpoint of improving the gas absorption performance of the gas absorber 220, the total area of ​​the flat surface 220A of the protrusions 220p is, preferably 90% or less, more preferably 80% or less, and even more preferably 70% or less of the total area of ​​the surface on which the protrusions 220p are provided in the gas absorber 220.

[0083] The height of the protrusion 220p can be adjusted as appropriate according to the size of the gas absorption unit 200 and the number of gas absorbers 220 constituting the gas absorption unit 200, and is not particularly limited. From the viewpoint of securing space S, the height H of the protrusion 220p may be, for example, 0.5 mm or more, and preferably 1 mm or more. On the other hand, from the viewpoint of gas absorption amount, the height H of the protrusion 220p may be, for example, 50 mm or less, and preferably 10 mm or less. In this specification, "height H of the protrusion 220p" means the length of the perpendicular line drawn from the apex of the protrusion 220p to the point on the base portion 220b closest to the protrusion 220p, when viewed in the thickness direction of the gas absorber 220.

[0084] Although not limited to this, the average height of the convex portion 220p of the gas absorber 220 is H ave In this case, at least 80% of the provided protrusion 220p is 0.5H ave ~1.5H ave It is preferable that it has a height of 0.7H ave ~1.3H ave It is more preferable to include it in 0.8H ave ~1.2H ave It is even more preferable that it be included in 0.9H ave ~1.1H ave It is particularly preferable that it be included in the above. The average height H of the convex portion 220p of the gas absorber 220. ave The smaller the variation (i.e., closer to 1), the more likely the protrusions 220p are to come into contact with adjacent gas absorbers 220 when the gas absorbers 220 are stacked. This makes the heat conduction of the gas absorbers 220 more efficient.

[0085] As shown in Figure 8, in the first modified example, the gas-absorbing particle 226 comprises a carrier particle 227 and a gas absorbent 228. The fact that the gas-absorbing particle 226 comprises a carrier particle 227 and a gas absorbent 228 can be inferred, for example, by thermogravimetric analysis (TG).

[0086] The carrier particles 227 are particles that support the gas absorbent 228. As shown in Figure 8, the carrier particles 227 have a plurality of pores 227p. Here, the carrier particles 227 are porous particles having a plurality of mesopores, and the gas absorbent 228 is disposed in the pores 227p of the carrier particles 227. The carrier particles 227 can be, for example, a mesoporous material having mesopores.

[0087] The carrier particles 227 may be any inorganic porous material capable of supporting the gas absorbent 228. For example, the carrier particles 227 are preferably porous materials with a relatively large specific surface area. The carrier particles 227 may be composed of, for example, an inorganic material or an organometallic frame (MOF). When the carrier particles 227 are composed of an inorganic material, preferably used inorganic materials include activated carbon, oxides of metalloid elements, oxides of metal elements, and their solid solutions. Examples of inorganic materials include activated carbon, silica, alumina, ceria, zirconia, titania, zeolite, etc. The inorganic material may be any one of the above-mentioned inorganic materials alone, or a combination of two or more. In particular, the carrier particles 227 preferably contain silica particles.

[0088] From the viewpoint of increasing the amount of gas absorbent 228 carried, it is preferable that the oil absorption capacity of the carrier particles 227 is high. Although not particularly limited, the oil absorption capacity of the carrier particles 227 is preferably, for example, 100 ml / 100 g or more and 400 ml / 100 g or less, and more preferably 130 ml / 100 g or more and 380 ml / 100 g or less. The "oil absorption capacity of the carrier particles" can be measured in accordance with JIS K6217-4:2008 using a general absorption capacity measuring device and DBP (dibutyl phthalate) as the reagent liquid.

[0089] Furthermore, the composition of the carrier particles 227 (aspect ratio, average particle size, specific surface area, average pore diameter, etc.) is the same as that of the gas-absorbing particles 26 described above, except for the points mentioned above. Also, the composition of the pores 227p of the carrier particles 227 is the same as that of the pores 26p of the gas-absorbing particles 26 described above, except for the points mentioned above. For this reason, explanations of these overlapping elements will be omitted.

[0090] The gas absorbent 228 is placed (supported) on the carrier particles 227. As shown in Figure 8, here the gas absorbent 228 is placed in multiple pores 227p of the carrier particles 227. Preferably, the gas absorbent 228 is placed, for example, in the mesopores of the carrier particles 227.

[0091] The type of gas absorbent is not particularly limited and can be appropriately determined depending on the type of gas to be absorbed. For example, when the gas to be absorbed is an acidic gas (e.g., CO2, H2S, etc.), amine compounds can be preferably used as the gas absorbent. Alternatively, when the gas to be absorbed is a basic gas, iron sulfate (FeSO4) or metaphosphoric acid (HPO3) can be used as the gas absorbent.

[0092] Amine compounds include, for example, at least one primary amino group (NH2 - These are various compounds having a primary amino group. In addition to a primary amino group, the amine compound may also contain a secondary amino group and / or a tertiary amino group. The amine compound may be solid or liquid at room temperature. Some amine compounds become solid when adsorbing gas (e.g., CO2 adsorption) and become liquid when desorbing gas (e.g., CO2 desorption) (e.g., isoholodiamine). Such amine compounds may be used as gas absorbents.

[0093] Examples of amine compounds include amines, polyamines, and compounds having primary to tertiary amino groups such as aminoorganosilanes. Examples of amines include monoethanolamine, diethanolamine, triethanolamine, and isoholodiamine. Examples of polyamines include polyethyleneimine, polypropyleneimine, ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and pentaethylenehexamine. Examples of aminoorganosilanes include (3-aminopropyl)trimethoxysilane (APTMS), N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3-amino-propyltriethoxysilane, N-(2-aminoethyl)-3-amino-propylmethyldimethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, and N-(n-butyl)-3-aminopropyltrimethoxysilane. Furthermore, compounds with partially modified functional groups may be used as amine compounds. The amine compound may be used alone or in combination of two or more. In particular, the amine compound preferably contains polyalkylene imines such as polyethyleneimine and polypropyleneimine.

[0094] While not limited thereto, the amount of gas absorbent 228 loaded onto the gas absorber 120 is preferably 15% by mass or more and 60% by mass or less, more preferably 20% by mass or more and 56% by mass or less, even more preferably 25% by mass or more and 54% by mass or less, and particularly preferably 30% by mass or more and 52% by mass or less. The gas absorber 220 disclosed herein is not limited to a specific amount of gas absorbent 228 loaded onto it. As described above, the gas absorber 220 disclosed herein has a structure with excellent gas diffusion properties. Therefore, according to the technology disclosed herein, even when the amount of gas absorbent 228 loaded onto it is small, the adsorption performance of the gas to be recovered can be improved.

[0095] In the first modified example, the gas absorbent 228 is arranged in multiple pores 227p of the carrier particles 227. However, this configuration does not limit the gas absorbent 228 to being arranged only in the pores 227p of the carrier particles 227. For example, the gas absorbent 228 may be arranged on the surface of the carrier particles 227 in addition to the pores 227p of the carrier particles 227. Alternatively, the gas absorbent 228 may be arranged on the surface and pores 224 of the resin matrix 222.

[0096] As shown in Figures 5 and 9, in the first modified example, two induction heating devices 40 are placed at each end of the gas absorber 220, one at each end, in a direction perpendicular to the arrangement direction of the gas absorber 220 and the heating element 230 (Z-axis direction) and perpendicular to the direction in which the opening 10h of the frame 10 is positioned (Y-axis direction) (X-axis direction), and are held by the frame 10. Although not limited to this, it is preferable that an induction heating device 40 be placed at at least one end in the direction perpendicular to the arrangement direction of the gas absorber 220, and more preferably that induction heating devices 40 be placed at both ends. With this configuration, the gas absorber 220 can be heated more rapidly. The reason for this effect is not clear, but it is presumed that by placing the induction heating devices 40 in a direction perpendicular to the arrangement direction of the gas absorber 220, the heating element 230 can be heated uniformly. The configuration of the induction heating device 40 is the same as that of the induction heating device 40 according to the above embodiment, except for the difference in arrangement.

[0097] The first modified example has been described above. However, the shape of the protrusion 220p is not limited thereto. For example, the protrusion 220p may extend in the X-axis direction, or in a direction intersecting the X-axis and Y-axis directions (diagonal direction). Furthermore, the shape of the protrusion 220p is not limited thereto, and may be, for example, dot-shaped, island-shaped, dashed-line-shaped, etc.

[0098] <Second variation> Figure 10 is a diagram corresponding to Figure 1 relating to the second modified example. Figure 11 is a schematic front view showing the gas absorber 320 and heating element 330 relating to the second modified example. Figure 12 is a schematic top view showing the gas absorber 320 relating to the second modified example. In Figure 12, the heating element 330 is not shown. In the second modified example, the gas absorber 20 is replaced with the gas absorber 320, and the induction heating device 40 is replaced with the induction heating device 340. In addition, in the second modified example, the gas absorption unit 300 further includes a metal plate 350. Note that other than these points, it may be the same as the above embodiment and has already been explained, so redundant descriptions are omitted.

[0099] As shown in Figure 12, in the second modified example, the multiple protrusions 320p of the gas absorber 320 are dot-shaped when viewed from above, and the multiple protrusions 320p are arranged in a staggered pattern. Even in this configuration, a space S can be formed, and turbulence can be generated in the gas flow. Also, as shown in Figures 11 and 12, the protrusions 320p are cylindrical. However, the shape of the protrusions 320p is not limited to this, and may be triangular prisms, square prisms, polygonal prisms, etc. Furthermore, the configuration of the gas absorber 320 is the same as that of the above embodiment and the gas absorbers 20 and 220 according to the first modified example, except that the arrangement of the protrusions 320p is different. In this embodiment, "the multiple protrusions 320p are arranged in a staggered pattern" means that adjacent protrusions 320p in the first direction P are offset from each other in the second direction Q, but adjacent protrusions 220p that are one position apart in the first direction P are arranged so that they are at the same position in the second direction Q. The first direction P is defined, for example, by a straight line connecting any adjacent protrusions 320p, and in Figure 12, it represents the direction from the rear to the front. The second direction Q is perpendicular to the first direction P, and in Figure 12, it represents the direction from left to right.

[0100] As shown in Figure 11, in the second modified example, the heating element 330 is positioned such that a portion of the heating element 30 is exposed from the side of the base portion 320b of the gas absorber 320 where the protrusion 320p is not located. In this configuration as well, the gas absorber 320 can be heated rapidly by the heating element 330. The configuration of the heating element 330 is the same as that of the heating element 30 in the above embodiment, except for the difference in arrangement.

[0101] As shown in Figure 10, in the second modified example, one induction heating device 340 is placed at one end of the arrangement direction of the gas absorber 320 and the heating element 330. More specifically, in this case, the heating element 330 and the induction heating device 340 are placed in contact at the lower end of the arrangement direction of the gas absorber 320 and the heating element 330.

[0102] As shown in Figure 10, in the second modified example, a metal plate 350, which is a plate-shaped metal member, is arranged at the upper end in the direction of arrangement of the gas absorber 320 and the heating element 330 so as to be in contact with the gas absorber 320 (here, the protrusion 320p). In some preferred embodiments, the gas absorption unit 300 may further include the metal plate 350. This allows the gas absorber 320 to be suitably heated.

[0103] The metal that can be used for the metal plate 350 is not particularly limited, but it is preferable to use a metal with good thermal conductivity. Suitable metals include, for example, stainless steel (SUS), iron-based, copper-based, nickel-based, titanium-based, aluminum-based, molybdenum-based, tungsten-based alloys, and pure metal materials.

[0104] The number of metal plates 350 may be one or multiple (two or more). Furthermore, the placement of the metal plates 350 is not limited to this; for example, the metal plates 350 may be arranged so as to be interposed between the gas absorber 320. Although not limited to this, it is preferable that the metal plates 350 be arranged so as to cover the entire area of ​​the gas absorber 320 in a plan view.

[0105] <Other Embodiments> It is possible to replace some of the embodiments described above with other modifications, and to add other modifications to the embodiments described above. Furthermore, if a technical feature is not described as essential, it may be deleted as appropriate. For example, in some embodiments, the gas absorption unit may be further equipped with a heat exchange member. For example, the heat exchange member may be further interposed between the gas absorber 20 and the heating element 30. Next, the heat exchange member is connected to an externally provided heat exchange means. Then, the heat exchange member is cooled or heated via the heat exchange means. This allows the temperature of the gas absorber 20 to reach a predetermined temperature more quickly. As the heat exchange member, for example, a multi-tube heat exchanger, a plate heat exchanger, a fin-tube heat exchanger, a coil heat exchanger, a spiral heat exchanger, a jacket heat exchanger, a non-metallic heat exchanger, a spiral heat exchanger, a direct-contact heat exchanger, an air-cooled heat exchanger, a water-cooled heat exchanger, an immersion heat exchanger, etc. can be used.

[0106] <Method for manufacturing gas absorbers> Next, an example of a method for manufacturing the gas absorber 20 disclosed herein will be described. The gas absorber 20 disclosed herein may include a preparation step, a molding step, an immersion step, and a first drying step. However, the gas absorber 20 disclosed herein is not limited to those manufactured by the following manufacturing method.

[0107] In the preparation step, a slurry-like composition (slurry for forming a gas absorber) containing at least gas-absorbing particles 26, a resin, and an organic solvent is prepared. In this specification, the term "slurry" is used to include forms also called "paste" and "ink."

[0108] As an example, in the preparation step, gas-absorbing particles 26 are added to an organic solvent and stirred. This disperses the gas-absorbing particles 26 in the organic solvent. Next, the resin is added to the organic solvent in which the gas-absorbing particles 26 are dispersed and stirred. This dissolves the resin in the organic solvent. Although not particularly limited, in the preparation step, it is preferable to add the gas-absorbing particles 26 and the resin to the organic solvent and stir while heating it to 40°C to 60°C. Details of the gas-absorbing particles 26 and resin prepared in the preparation step have already been explained, so redundant explanations will be omitted.

[0109] When the gas-absorbing particles 26 comprise carrier particles and a gas absorbent, gas-absorbing particles may be prepared by pre-loading (arranging) the gas absorbent on the carrier particles. Alternatively, the gas absorbent may be arranged on the carrier particles after the carrier particles have been arranged in the resin matrix. A manufacturing example in which the gas absorbent is arranged on the carrier particles after the carrier particles have been arranged in the resin matrix will be described later as a second manufacturing method.

[0110] The organic solvent is not particularly limited as long as it can dissolve the resin. Examples of organic solvents include amides such as diethylformamide, dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and dimethylimidazolidinone; alkyl ketones such as dimethyl sulfoxide, acetone, and methyl ethyl ketone; ethers such as tetrahydrofuran, dioxane, and diglyme; and glycol ethers such as ethylene glycol and diethylene glycol. These may be used individually or in combination of two or more. The mass ratio of the organic solvent contained in the slurry for forming the gas absorber is not particularly limited. The content of the organic solvent in the slurry for forming the gas absorber is preferably, for example, 30% to 80% by mass. This allows for the suitable production of molded articles in the molding process.

[0111] Furthermore, the slurry for forming the gas absorber may contain conventionally known additives, provided that these additives do not significantly impair the effects of the technology disclosed herein. Examples of such additives include dispersants, plasticizers, defoamers, and thickeners. For example, glycerin and nonionic surfactants can be preferably used as additives. The additive content in the slurry for forming the gas absorber is, for example, 30% by mass or less, preferably 20% by mass or less, and more preferably 10% by mass or less.

[0112] In the molding process, the molded body is formed using the gas absorber forming slurry and the heating element 30 prepared above. The heating element 30 described above can be suitably used as the heating element 30. For example, a sheet-like molded body can be produced by supplying the gas absorber forming slurry onto a metal substrate to a predetermined thickness using a squeegee. Alternatively, a molded body of a desired shape can be produced by using the doctor blade method, extruding the gas absorber forming slurry into a predetermined shape, printing on a metal plate or metal mesh, or dip coating a core material.

[0113] The position of the heating element 30 placed on the gas absorber 20 after manufacturing can be adjusted by the supply conditions of the slurry for forming the gas absorber and the timing of the placement of the heating element 30. For example, the molded body may be manufactured by supplying the slurry for forming the gas absorber onto the heating element 30. Alternatively, the molded body may be manufactured by supplying the slurry for forming the gas absorber and then placing the heating element 30 on top of the slurry.

[0114] For example, when performing the molding process using a squeegee, the following method can be used. First, the heating element 30 is placed on a metal substrate. At this time, it is placed so that there is a gap between the metal substrate and the heating element 30. This gap can be adjusted as appropriate according to the thickness of the gas absorber 20 to be manufactured. Next, the slurry for forming the gas absorber is supplied onto the heating element 30. Then, by squeezing the supplied slurry using a squeegee, a portion of the slurry passes through the mesh of the heating element 30 and moves between the heating element 30 and the glass substrate. As a result, at least a portion of the heating element 30 is embedded in the slurry for forming the gas absorber. At this time, the position of the heating element 30 that will be placed on the gas absorber 20 after manufacturing can be adjusted by adjusting the squeezing conditions of the squeegee (for example, the distance between the squeegee and the surface of the heating element 30, the force applied to the squeegee, etc.).

[0115] Furthermore, a gas absorber having a base portion and a protrusion as described above can be manufactured, for example, by using a metal substrate having multiple recesses or a metal substrate having multiple through holes (for example, perforated metal) as the metal substrate. By supplying a slurry for forming a gas absorber to such a metal substrate in a predetermined thickness, a gas absorber having a base portion and a protrusion can be manufactured. The number of recesses, the shape of the recesses, the number of through holes, the shape of the through holes, etc., in the metal plate used in this process can be appropriately set according to the desired number and shape of the protrusions in the gas absorber 20. In addition, conventionally known metal substrates can be used without particular limitation, for example, aluminum can be used.

[0116] In the immersion step, the molded body prepared in the molding step is immersed in an aqueous solvent (for example, water). As a result, the organic solvent contained in the molded body is replaced by the aqueous solvent, and the resin precipitates. The areas where the organic solvent contained in the molded body is replaced by the aqueous solvent become pores 24, and when the resin precipitates, the resin matrix 22 described above is suitably formed. Since the gas-absorbing particles 26 are dispersed in the organic solvent, the resin matrix 22 is formed to enclose the gas-absorbing particles 26, and the gas-absorbing particles 26 are positioned in the pores 24 of the resin matrix 22.

[0117] The aqueous solvent used in the immersion process is not particularly limited. The aqueous solvent may be, for example, water, a mixed solution of water and alcohol, or water with a surfactant added. Deionized water, pure water, ultrapure water, distilled water, etc., can be preferably used as the aqueous solvent. The immersion time of the molded body in the immersion process is, for example, 2 hours or more. The temperature conditions for the immersion process are, for example, cold (around 10°C).

[0118] In the first drying step, the molded body after the immersion step is dried to remove the aqueous solvent from the molded body. This makes it possible to produce a gas absorber 20 comprising a resin matrix 22 and gas-absorbing particles 26. The drying means in the first drying step is not particularly limited, and for example, a hot air dryer, a low-humidity air dryer, a vacuum dryer, various infrared dryers, electromagnetic induction dryers, microwave dryers, dry air, etc., or drying acceleration means such as blowing air, reducing pressure, and heating can be used alone or in combination. The drying temperature in the first drying step (setting temperature of the drying device, etc.) can be appropriately selected depending on the type and amount of solvent in the mixture, but can be set to, for example, 40°C to 120°C, preferably 60°C to 100°C. The drying time can also be appropriately selected depending on the type and amount of aqueous solvent, and is not particularly limited. The drying time can be appropriately set depending on the type and amount of solvent in the mixture, but is generally 30 minutes to 24 hours, and preferably 1 hour to 10 hours.

[0119] <Second manufacturing method> Next, a second method for manufacturing the gas absorber disclosed herein will be described. The second method may include a preparation step, a molding step, an immersion step, a first drying step, a second drying step, an introduction step, and a third drying step. Each step will be described below.

[0120] In the preparation step, a slurry-like composition (slurry for gas absorber formation) containing at least carrier particles, a resin, and an organic solvent is prepared. The preparation step for the second manufacturing method may be the same as the preparation step for the manufacturing method described above, except that carrier particles are used.

[0121] In the second manufacturing method, a precursor for a gas absorber comprising a resin matrix, carrier particles, and a heating element can be obtained by going through a molding step, an immersion step, and a first drying step. In this specification, "precursor for gas absorber" refers to a gas absorber before the gas absorbent is placed on it. The molding step, immersion step, and first drying step in the second manufacturing method can be carried out by the same operations as in the manufacturing method described above. Therefore, redundant explanations are omitted here.

[0122] In the second drying step, the gas absorber precursor obtained in the first drying step is dried to remove moisture from the gas absorber precursor. This allows more gas absorbent to be supported on the carrier particles in the subsequent introduction step. There is no intention to limit the technology disclosed herein, but the reason for this effect is presumed to be as follows: Because the carrier particles of the gas absorber precursor have pores, they easily absorb moisture from the air. Carrier particles that have absorbed moisture from the air have moisture trapped inside their pores. Therefore, by performing the second drying step, the moisture inside the pores of the carrier particles is removed. This is thought to make it easier for the gas absorbent to be placed inside the pores of the carrier particles.

[0123] The drying method in the second drying step is not particularly limited, and the same method as in the first drying step can be used. Among these, drying by vacuum drying is preferred from the viewpoint of suitably removing moisture. The drying temperature in the second drying step (setting temperature of the drying apparatus, etc.) can be set to, for example, 60°C to 120°C, preferably 70°C to 100°C. The drying time is also not particularly limited, but is generally 1 to 6 hours, and preferably 2 to 3 hours.

[0124] As mentioned above, the carrier particles are porous and therefore have a tendency to absorb moisture from the air. For this reason, although not limited to this, it is preferable to perform the second drying step immediately before carrying out the introduction step described later.

[0125] The introduction step involves introducing the gas absorbent into the pores of the carrier particles after the second drying step. By performing the introduction step, the gas absorbent is introduced into the pores of the carrier particles. The gas absorbent can also be introduced into the pores of the carrier particles and the resin matrix. The method of introducing the gas absorbent is not particularly limited, and a method appropriate to the type of gas absorbent can be adopted. For example, if the gas absorbent is an amine compound, a solution can be prepared by dissolving the amine compound in an organic solvent (e.g., a lower alcohol such as ethanol), and the amine compound can be introduced by immersing the gas absorbent precursor in this solution. Alternatively, the amine compound can be introduced into the gas absorbent precursor by placing it in an atmosphere in which the amine compound is in the gas phase.

[0126] While not particularly limited, the amount of gas absorbent (e.g., an amine compound) introduced into the molded body during the introduction process is preferably approximately 20 to 60 parts by mass per 100 parts by mass of the gas absorbent precursor after the second drying process.

[0127] The third drying step is, for example, a step of drying the gas absorber precursor after the introduction step. By performing the third drying step, for example, the organic solvent used in the introduction step can be removed from the gas absorber precursor after the immersion step. This makes it possible to obtain a gas absorber having the above-described configuration. As the drying means used in the third drying step, for example, the means used in the first drying step and the second drying step may be used. The drying temperature (setting temperature of the drying apparatus, etc.) in the third drying step can be appropriately set depending on the type and amount of solvent in the mixture, but is generally 60°C to 150°C, with 80°C to 120°C being preferred. The drying time can be appropriately set depending on the type and amount of solvent in the mixture, but is generally 30 minutes to 24 hours, with 1 hour to 10 hours being preferred.

[0128] In this way, a gas absorber 20 with a heating element 30 having the configuration according to the above embodiment can be manufactured. Next, the gas absorber 20 and the heating element 30 obtained can be stacked in a frame 10, and an induction heating device can be placed inside to manufacture a gas absorption unit 100.

[0129] As described above, a gas absorption unit 100 with improved separation and recovery efficiency of the gas to be recovered can be manufactured. Such a gas absorption unit 100 can be suitably used in direct air recovery (DAC) devices, hydrogen recovery devices, volatile organic compound (VOC) recovery devices, incineration exhaust gas recovery devices, automobile exhaust gas recovery devices, wastewater oil recovery devices, fluorine recovery devices, boron recovery devices, arsenic recovery devices, selenium recovery devices, phosphorus recovery devices, organofluorine compound (PFAS) recovery devices, colloid recovery devices, metal recovery devices, organometallic recovery devices, metal ion recovery devices, sludge recovery devices, chemical activator recovery devices, radioactive material recovery devices, and the like.

[0130] <Example Test> The following describes test examples relating to the technology disclosed herein, but it is not intended that the technology disclosed herein is limited to these test examples.

[0131] <Preparation of gas absorbers> (Example 1) First, 135 g of porous silica particles (SiO2, average particle size 9 μm) as carrier particles, 80 g of polysulfone (PSU) as resin, 330 g of dimethyl sulfoxide (DMSO) as an organic solvent, and 35 g of glycerin as an additive were prepared. This prepared the slurry for forming the gas absorber of Example 1. Next, a heating element was placed on a flat aluminum metal substrate so that it was in full contact with the substrate. The slurry for forming the gas absorber of Example 1 was then applied to the heating element so that the total thickness was 2 mm (base thickness 1 mm, height of convex part 1 mm). After that, the slurry for forming the gas absorber was squeezed using a squeegee at a speed of 200 mm / min on the metal substrate and the heating element. This obtained a sheet-like molded body. The sheet-like molded body was immersed in water for 24 hours. Then, by drying the molded body after immersion in water at 80°C for 5 hours, a precursor for a gas absorber was obtained, which comprises a molded body formed into a flat sheet and a heating element embedded approximately at the center of the thickness direction of the molded body, as in Example 1. As the heating element in Example 1, a plain weave metal mesh with the following configuration was used. Material: SUS304 Mesh count: 60 Wire diameter: 0.14mm Mesh opening: 0.283mm Space ratio: 44.4%

[0132] (Example 2) In Example 2, a slurry for forming a gas absorber was directly applied to a metal substrate similar to that in Example 1, and then the slurry was squeezed. After that, a heating element was placed on the squeezed slurry to obtain a molded body. Except for this, the procedure was the same as in Example 1. In this way, a molded body formed in the shape of a flat sheet and a precursor of a gas absorber equipped with a heating element according to Example 2, in which the heating element is placed on one surface of the molded body, were obtained.

[0133] (Example 3) In Example 3, the procedure was the same as in Example 1, except that a metal substrate with slits was used instead of the metal substrate in Example 1. This resulted in a precursor for a gas absorber comprising a molded body having a base portion, a protrusion extending from one surface of the base portion and arranged to extend in a direction perpendicular to the thickness direction of the base portion (hereinafter referred to as "strip-shaped"), and a heating element embedded approximately at the center of the thickness direction of the molded body, as in Example 3.

[0134] (Example 4) In Example 4, the process was the same as in Example 2, except that the metal substrate according to Example 3 was used instead of the metal plate according to Example 2. This resulted in obtaining a precursor for a gas absorber comprising a molded body having a base portion and protrusions extending from one surface of the base portion and arranged in a stripe pattern, and a heating element according to Example 4, in which the heating element is placed on the other surface of the base portion (the surface without the protrusions).

[0135] (Example 5) In Example 5, the procedure was the same as in Example 1, except that a perforated aluminum metal with staggered through-holes was used instead of the metal substrate in Example 2. This resulted in a precursor for a gas absorber comprising a base portion, a molded body having protrusions extending from one surface of the base portion and arranged in a staggered pattern, and a heating element embedded approximately at the center of the thickness direction of the molded body, as in Example 5.

[0136] (Example 6) In Example 6, the process was the same as in Example 2, except that the perforated metal according to Example 5 was used instead of the metal plate according to Example 2. This resulted in obtaining a precursor for a gas absorber comprising a base portion, a molded body having convex portions extending from one surface of the base portion and arranged in a staggered pattern, and a heating element according to Example 6, in which the heating element is placed on the other surface of the base portion (the surface without the convex portions).

[0137] (Examples 7-12) Here, one more precursor of a gas absorber equipped with a heating element, as described in Examples 1 to 6, was prepared. These precursors of gas absorbers equipped with heating elements, as described in Examples 1 to 6, were then designated as Examples 7 to 12, respectively.

[0138] (Reference example) Here, gas absorber samples were prepared to evaluate the porosity and thermal conductivity of gas absorbers fabricated using the gas absorber formation slurries of the test examples (Examples 1-12). Specifically, a gas absorber formation slurry similar to that in Example 1 was prepared, and the slurry was applied to a glass substrate to a thickness of 2 mm on a flat aluminum metal substrate. No heating element was placed on the substrate. This resulted in obtaining a reference example gas absorber formed in a sheet shape.

[0139] <Measurement of thermal conductivity> The thermal conductivity (W / m·K) in the thickness direction of the gas absorber in the reference example was measured using the protective hot plate method (GHP method). The measurement apparatus and conditions were as shown below. As a result, the thermal conductivity in the thickness direction of the gas absorber in the reference example was 0.051 W / m·K. Measurement device: NETZSCH GHP456s (main heating plate size 8cm square) Sample size: 200 x 150 mm Measurement temperature: 20℃ (heating plate 35℃, cooling plate 15℃) Measurement atmosphere: Nitrogen gas flow Atmospheric pressure: atmospheric pressure

[0140] <Measurement of porosity> The porosity of the reference gas absorber was measured using the Archimedes method. Specifically, first, the dry weight W of the reference gas absorber was measured. Air The following was measured. Next, the gas absorber used as a reference example was immersed in distilled water and then placed in a desiccator with a vacuum pump, and vacuuming was performed for 45 minutes, and the weight in water W was measured. Aq and water content W a+w The following measurements were taken. Then, the porosity (P) was calculated based on the following formula (1). As a result, the porosity of the gas absorber in the reference example was 70%. P(%)=(W a+w -W Air ) / (W a+w -W Aq ) × 100···(1)

[0141] <Introduction of gas absorbent> (Examples 1-12) Here, a gas absorbent was introduced into the precursor of a gas absorber equipped with a heating element, as described in Examples 1 to 12 above. Specifically, first, the precursor of the gas absorber was placed in a vacuum oven and vacuum-dried at 80°C for 3 hours. Next, a 30 wt% solution of polyethyleneimine (PEI) was prepared as the gas absorbent by dissolving PEI in ethanol. Then, the vacuum-dried precursor of the gas absorber was impregnated into the PEI solution in the thickness direction, and left to stand for 1 minute with the precursor completely submerged in the PEI solution. After that, the precursor was removed from the PEI solution, and the excess PEI solution adhering to the surface of the precursor was removed by placing the precursor perpendicular to the thickness direction. After that, the precursor was air-dried at room temperature overnight. After that, the precursor was placed in a vacuum oven and vacuum-dried at 80°C for 5 hours. After vacuum drying, each precursor was quickly wrapped in plastic wrap and allowed to cool at room temperature. This resulted in a gas absorber with a heating element, which contained gas absorbent particles in which the gas absorbent was arranged within the pores of the carrier particles.

[0142] <Creating a gas absorption unit> (Examples 1-6) First, a frame measuring 300 mm in width, 400 mm in depth, and 300 mm in height was prepared. 150 gas absorbers with heating elements were stacked on the frame for each example. Next, one induction heater was placed at each end of the stacked gas absorbers in the arrangement direction as an induction heating device. This created the gas absorption units according to Examples 1 to 6.

[0143] (Examples 7-12) In Examples 7 to 12, an induction heater was used instead of an induction heating device. Other than this, the process was the same as in Examples 1 to 6. This resulted in the fabrication of the gas absorption units described in Examples 7 to 12.

[0144] <Evaluation of gas absorption cycles> The gas absorption cycles of the gas absorption units prepared in Examples 1 to 12 above were evaluated using a gas evaluation device. The gas evaluation device comprises a reactor, a gas supply line, a vacuum pump, a low-concentration (detection range: 0-1000 ppm) CO2 concentration meter, a high-concentration (detection range: 0-100%) CO2 concentration meter, a wet gas meter, and a vacuum valve. The vacuum valves are provided as an inlet vacuum valve and an outlet vacuum valve, respectively, on the inlet and outlet sides of the reactor. The gas supply line, in this case, is a line that supplies air as a carrier gas and CO2 as a specific gas to the reactor, and is provided on the inlet side (upstream side) of the reactor. The vacuum pump is provided on the outlet side (downstream side) of the reactor. Furthermore, a low-concentration CO2 concentration meter, a high-concentration CO2 concentration meter, and a wet gas meter are provided downstream of the vacuum pump. This allows for the supply of carrier gas into the reactor and the measurement of the CO2 concentration and integrated flow rate of the gas flowing out of the reactor.

[0145] The gas absorption units according to each example were placed inside the reactor so that the openings of the gas absorption units faced the inlet and outlet of the reactor (in other words, the direction in which the pair of openings of the gas absorption units were inserted coincided with the direction in which the inlet and outlet of the reactor were inserted).

[0146] First, CO2 in the gas was adsorbed onto the gas absorption unit in the reactor by repeating the following steps (1) and (2). Then, during step (2) below, when the CO2 concentration of the gas flowing out of the reactor reached 390 ppm, it was considered that the gas absorber had reached its saturation adsorption capacity, and the CO2 adsorption was terminated. At this time, the total time spent performing the following steps (1) and (2) (including the time spent repeating them) was defined as the "CO2 adsorption time". Step (1): Open the inlet vacuum valve and close the outlet vacuum valve, then introduce a mixture of air and CO2 (CO2 concentration 400 ppm) into the reactor from the gas supply line. Step (2): Close the inlet vacuum valve and open the outlet vacuum valve to completely discharge the gas from the reactor.

[0147] Next, the following steps (3) to (5) were performed to recover the CO2 adsorbed onto the gas absorber. When the vacuum gauge reading of the vacuum pump fell below 1 Pa, it was considered that the CO2 had been completely recovered from the gas absorber, and the CO2 recovery process was terminated. At this time, the total time spent performing the following steps (3) to (5) was defined as the "CO2 recovery time". In Examples 7 to 12, in step (4) below, the gas absorber was heated to approximately 60°C using a hot plate instead of an induction heater. Step (3): Close the inlet vacuum valve, then open the vacuum valve to create a vacuum inside the reactor. Step (4): Close the inlet vacuum valve, turn on the IH heater, and raise the heating element to approximately 60°C. Step (5): Close the inlet vacuum valve, then open the vacuum valve to recover CO2 from the reactor into the recovery container.

[0148] For each example, the sum of the CO2 adsorption time and CO2 recovery time was defined as "1 cycle time (minutes)". The cumulative flow rate of CO2 measured with a wet gas meter during steps (3) to (5) was defined as "recovered CO2 amount (L)". Furthermore, the average concentration of CO2 in the recovery container was defined as "recovered CO2 concentration (%)". The results are shown in Table 1.

[0149] [Table 1]

[0150] As shown in Table 1, in Examples 1 to 6, which are equipped with induction heating devices (IH heaters), the cycle time was significantly reduced compared to Examples 7 to 12, which are equipped with hot plates.

[0151] <Measurement of pressure loss> Here, the pressure loss was measured for the gas absorption units described in Examples 1 to 6. Specifically, air was flowed through the gas absorption units of Examples 1 to 6 at a flow velocity of 3 m / s from the inlet (one of the openings) of the gas absorption unit. The pressure at the inlet and outlet sides of the gas absorption unit were then measured using pressure gauges, and the pressure loss (Pa) was calculated. The results are shown in Table 2.

[0152] [Table 2]

[0153] As shown in Table 2, in Examples 3 to 6, where the gas absorber is equipped with protrusions, the pressure loss was smaller compared to Examples 1 and 2. This result is thought to be because the protrusions caused turbulence in the gas flow when the gas flows into the gas absorber.

[0154] The specific examples of the technology disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes to the specific examples described above.

[0155] As described above, specific embodiments of the technology disclosed herein include those listed in the following items.

[0156] [Section 1] A gas absorption unit comprising a gas absorber, an induction heating device, and a heating element that generates heat by the induction heating device, The above gas absorber is A porous resin matrix, Gas-absorbing particles and, It is equipped with, The above resin matrix has a three-dimensional network structure including pores. The above gas-absorbing particles are arranged within the pores of the above resin matrix. The heating element is arranged so as to be in contact with at least a portion of the gas absorber. Gas absorption unit.

[0157] [Section 2] The gas absorption unit according to item 1, wherein the heating element is arranged in such a state that at least a portion of it is embedded in the resin matrix.

[0158] [Section 3] The gas absorption unit according to claim 1 or 2, comprising at least one of metal or carbon as the heating element.

[0159] [Section 4] A gas absorption unit according to any one of items 1 to 3, wherein, when the area of ​​the resin matrix in a plan view is taken as 100%, the heating element is arranged in an area of ​​20% or more.

[0160] [Section 5] The above gas-absorbing particles comprise a carrier particle having a plurality of mesopores and a gas absorbent. The above gas absorbent is placed in a plurality of mesopores of the above carrier particles. A gas absorption unit as described in any one of items 1 to 4.

[0161] [Section 6] The above-mentioned carrier particles are composed of inorganic materials or organometallic structures. The gas absorption unit according to item 5, wherein the inorganic material includes at least one of silica, alumina, ceria, zirconia, titania, activated carbon, and zeolite.

[0162] [Section 7] A gas absorption unit according to any one of items 1 to 6, wherein the porosity of the gas absorber based on the Archimedes process is 60% or more and 90% or less.

[0163] [Section 8] A gas absorption unit according to any one of items 1 to 7, wherein the thermal conductivity of the gas absorber is 0.02 W / m·K or more and 1 W / m·K or less.

[0164] [Section 9] The above gas absorber is in the form of a sheet. Multiple of the above gas absorbers are stacked along a predetermined arrangement direction. A gas absorption unit as described in any one of items 1 to 8.

[0165] [Section 10] The above gas absorber comprises a base portion and a protrusion extending from the surface of the base portion. The gas absorption unit described in item 9.

[0166] [Section 11] In a plan view, the positions of the convex portions of the multiple gas absorbers are approximately the same. A gas absorption unit as described in item 9 or 10.

[0167] [Section 12] The induction heating devices are arranged at the ends of the gas absorbers in the direction of arrangement. A gas absorption unit as described in any one of items 9 to 11.

[0168] [Section 13] The gas absorption unit according to any one of claims 9 to 12, wherein the induction heating device is arranged at at least one end in a direction perpendicular to the arrangement direction of the gas absorbers. [Explanation of symbols]

[0169] 10 Frame 10h opening 20, 220, 320 gas absorbers 22,222 resin matrix 24,224 pores 26,226 gas-absorbing particles 26p Pores 30, 330 heating element 40, 340 induction heating device 100, 200, 300 Gas Absorption Units 220b, 320b Base section 220p, 320p convex part 227 Carrier particles 227p Pores 228 Gas absorbent 350 metal plate

Claims

1. A gas absorption unit comprising a gas absorber, an induction heating device, and a heating element that generates heat by the induction heating device, The gas absorber is A porous resin matrix, Gas-absorbing particles and, It is equipped with, The resin matrix has a three-dimensional network structure including pores, The gas-absorbing particles are arranged within the pores of the resin matrix. The heating element is arranged so as to be in contact with at least a portion of the gas absorber. Gas absorption unit.

2. The gas absorption unit according to claim 1, wherein the heating element is arranged in such a state that at least a portion of it is embedded in the resin matrix.

3. The gas absorption unit according to claim 1 or 2, wherein the heating element comprises at least one of metal or carbon.

4. In a plan view, when the area of ​​the resin matrix is ​​set to 100%, the heating element is arranged in an area of ​​20% or more. The gas absorption unit according to claim 1 or 2.

5. The gas-absorbing particles comprise a carrier particle having a plurality of mesopores and a gas absorbent. The gas absorbent is arranged in a plurality of mesopores of the carrier particles. The gas absorption unit according to claim 1 or 2.

6. The carrier particles are composed of an inorganic material or an organometallic structure. The inorganic material includes at least one of silica, alumina, ceria, zirconia, titania, activated carbon, and zeolite. The gas absorption unit according to claim 5.

7. The porosity of the gas absorber, based on the Archimedes process, is 60% or more and 90% or less. The gas absorption unit according to claim 1 or 2.

8. The thermal conductivity of the gas absorber is 0.02 W / m·K or more and 1 W / m·K or less. The gas absorption unit according to claim 1 or 2.

9. The gas absorbent is in the form of a sheet, Multiple gas absorbers are stacked along a predetermined arrangement direction. The gas absorption unit according to claim 1 or 2.

10. The gas absorber comprises a base portion and a protrusion extending from the surface of the base portion. The gas absorption unit according to claim 9.

11. In a plan view, the positions of the convex portions of the plurality of gas absorbers are substantially the same. The gas absorption unit according to claim 9.

12. The induction heating device is positioned at at least one end of the gas absorber in the direction of arrangement. The gas absorption unit according to claim 9.

13. In a direction perpendicular to the arrangement direction of the gas absorber, the induction heating device is arranged at at least one end. The gas absorption unit according to claim 9.

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