Edge coating of framed glass core substrates

Abstract

The present invention provides a glass core substrate that possesses the necessary mechanical robustness and compatibility with semiconductor package manufacturing and assembly processes. [Solution] The device includes a package substrate 200 comprising a glass core substrate 205 and build-up layers 220 above and below the glass core substrate, the build-up layers comprising an organic dielectric material layer. The edge surface 206 of the glass core substrate 205 is offset from the edge 221 of the build-up layer. The package substrate 200 further includes a buffer layer 210 comprising a dielectric material surrounding the glass core substrate 205 and the build-up layer 220, the outer edge 211 of the buffer layer 210 being substantially straight, and a frame 215 surrounding and in contact with the outer edge 211.

Description

[Technical Field]

[0001] This application relates to edge coating for framed glass core substrates. [Background technology]

[0002] As the complexity of electronic packaging continues to increase, sophisticated packaging solutions are required. For example, interconnecting multiple dies, systems, and / or other components within a single electronic package is needed to enable device miniaturization and / or improved alignment accuracy. Existing packaging substrates that rely on organic core materials suffer from problems such as significant warping, poor flatness, and limited scaling ability to smaller via sizes. One proposed solution is to replace the organic core material with a glass core.

[0003] Glass cores offer significant advantages, such as reduced substrate warping and the ability to minimize the through-via pitch. However, the singulation and handling of glass core substrates are not without challenges. Due to the brittle nature of glass core materials, new defects and / or failure modes may occur during the manufacturing, handling, and / or deployment of the package substrate in operating conditions. For example, cracking and / or seware of the glass can lead to complete failure of the package substrate. [Brief explanation of the drawing]

[0004] [Figure 1A] This is a cross-sectional view of a package substrate according to one embodiment, having a glass core that extends beyond the edges of the build-up layers stacked on top and below it. [Figure 1B] This is a cross-sectional view of a package substrate having a glass core protected by a buffer layer having a curved outer edge, according to one embodiment. [Figure 2A] This is a cross-sectional view of a package substrate having a glass core protected by a buffer layer enclosed by a frame, according to one embodiment. [Figure 2B] This is a cross-sectional view of a package substrate having a glass core protected by a buffer layer confined by a frame, according to an additional embodiment. [Figure 3A] This is a plan view showing a process of applying a buffer layer and a frame around a package substrate having a glass core, according to one embodiment. [Figure 3B] This is a plan view showing a process of applying a buffer layer and a frame around a package substrate having a glass core, according to one embodiment. [Figure 3C] This is a plan view showing a process of applying a buffer layer and a frame around a package substrate having a glass core, according to one embodiment. [Figure 3D] This is a plan view showing a process of applying a buffer layer and a frame around a package substrate having a glass core, according to one embodiment. [Figure 3E] This is a flowchart illustrating a process for applying a buffer layer and a frame around a package substrate having a glass core, according to one embodiment. [Figure 4A] This is a plan view showing a portion of a package substrate in which the buffer layer has a curved surface along the edge of the package substrate, according to one embodiment. [Figure 4B] This is a plan view showing a part of the package substrate in Figure 4A when the buffer layer is subjected to gas pressurization and hardening treatment according to one embodiment. [Figure 4C] Figure 4B is a cross-sectional view of a package substrate including a buffer layer having a substantially vertical profile, according to one embodiment. [Figure 4D] Figure 4B is a cross-sectional view of a package substrate including a buffer layer having a bowl-shaped profile, according to one embodiment. [Figure 4E] This is a flowchart of a process for applying a buffer layer having vertical edges to a package substrate using gas flow and curing treatment, according to one embodiment. [Figure 5A]A plan view of a package substrate in a state including one or more edges having a curved profile of a glass core according to an embodiment. [Figure 5B] A plan view of the package substrate of FIG. 5A after applying a buffer layer according to an embodiment, wherein the curved profile of one or more edges biases the edge profile of the buffer layer, whereby the edges are substantially planar. [Figure 5C] A plan view of a package substrate in a state including one or more corner portions having circular protrusions of a glass core according to an embodiment. [Figure 5D] A plan view of the package substrate of FIG. 5C after applying a buffer layer according to an embodiment, wherein the circular protrusions of the corner portions bias the edge profile of the buffer layer, whereby the edges are substantially planar. [Figure 5E] A plan view of a package substrate in a state including an edge having a bias-induced pattern of a glass core to provide a planar edge to a buffer layer according to an embodiment. [Figure 5F] A plan view of a package substrate in a state including an edge having a bias-induced pattern of a glass core to provide a planar edge to a buffer layer according to an embodiment. [Figure 5G] A plan view of a package substrate in a state including an edge having a bias-induced pattern of a glass core to provide a planar edge to a buffer layer according to an embodiment. [Figure 5H] A plan view of a package substrate in a state including an edge having a bias-induced pattern of a glass core to provide a planar edge to a buffer layer according to an embodiment. [Figure 5I] A flowchart of a process for forming a package substrate in a state including a bias edge for controlling the edge profile of a buffer layer deposited on an edge of a glass core according to an embodiment. [Figure 6A]A corresponding plan view and cross-sectional view showing a process of applying a buffer layer around a package substrate having a glass core using a roller coating process and a scraper, according to one embodiment. [Figure 6B] A corresponding plan view and cross-sectional view showing a process of applying a buffer layer around a package substrate having a glass core using a roller coating process and a scraper, according to one embodiment. [Figure 6C] A corresponding plan view and cross-sectional view showing a process of applying a buffer layer around a package substrate having a glass core using a roller coating process and a scraper, according to one embodiment. [Figure 6D] A corresponding plan view and cross-sectional view showing a process of applying a buffer layer around a package substrate having a glass core using a roller coating process and a scraper, according to one embodiment. [Figure 7A] A schematic plan view of a system for implementing a process of applying a buffer layer along an edge of a package substrate including a glass layer, according to one embodiment. [Figure 7B] A flowchart of a process of applying a buffer layer along an edge of a package substrate including a glass layer, according to one embodiment. [Figure 8A] A cross-sectional view showing a part of a package substrate having a vacuum-assisted scraper for defining an edge profile of a buffer layer applied on an edge of the package substrate and a glass core, according to one embodiment. [Figure 8B] A plan view of a package substrate having a glass core when a vacuum-assisted scraper defines an edge profile of a buffer layer applied to the package substrate, according to one embodiment. [Figure 8C] A cross-sectional view showing a part of a package substrate showing cross-sectional profiles of different buffer layers, according to one embodiment. [Figure 8D] A cross-sectional view showing a part of a package substrate showing cross-sectional profiles of different buffer layers, according to one embodiment. [Figure 8E]This is a cross-sectional view showing a portion of a package substrate that exhibits the cross-sectional profiles of different buffer layers according to one embodiment. [Figure 8F] This is a flowchart of a process for defining the edge profile of a buffer layer on a package substrate having a glass core, according to one embodiment. [Figure 9] This is a cross-sectional view of an electronic system according to one embodiment, in which the package substrate includes a buffer layer having a defined cross-sectional profile. [Figure 10] This is a schematic diagram of a computing device configured according to one embodiment. [Modes for carrying out the invention]

[0005] This specification describes package substrate architectures having a protective layer on the edge of a glass core, according to various embodiments. In the following description, various aspects of the exemplary embodiments are described using terminology commonly used by those skilled in the art to communicate the content of their research to others skilled in the art. However, it will be apparent to those skilled in the art that this disclosure can be implemented using only some of the embodiments described. For the sake of clarity, specific figures, materials, and configurations are shown to allow for a full understanding of the exemplary embodiments. However, it will be apparent to those skilled in the art that this disclosure can be implemented without specific details. Also, well-known features may be omitted or simplified in order not to obscure the exemplary embodiments.

[0006] Various operations are described sequentially as separate operations in order to best aid in understanding this disclosure; however, the order of the descriptions should not be interpreted as meaning that these operations are necessarily dependent on their order. In particular, these operations do not need to be performed in the order presented.

[0007] Various embodiments or aspects of the present disclosure are described herein. In some embodiments, different embodiments are implemented separately. However, embodiments are not limited to being implemented in isolation. For example, two or more different embodiments can be combined to be implemented as a single device, process, or structure, etc. In some cases, entire sets of various embodiments can be combined. Also, a part of the first embodiment can be combined with a part of one or more different embodiments. For example, a part of the first embodiment can be combined with a part of the second embodiment, or a part of the first embodiment can be combined with a part of the second embodiment and a part of the third embodiment.

[0008] As mentioned above, using a glass core in the package substrate improves performance and allows for further scaling to finer feature sizes and pitches. For example, using a glass core substrate can improve warpage performance, dimensional stability, and flatness. However, glass is brittle, which presents challenges in the singulation and handling of glass core substrates. For instance, glass can be prone to cracking and / or back fracture damage during processing, assembly, and / or operation.

[0009] Potential damage to the glass core substrate is more pronounced depending on the structure of the package substrate. In some cases, the glass core substrate may extend beyond the edges of the overlying and underlying build-up layers. As a result, exposed portions of the glass core substrate are exposed and can easily be impacted during assembly. Some designs incorporate a buffer layer over the exposed portions of the glass core substrate to provide additional protection. An example of such a solution is shown in Figures 1A and 1B. However, depending on the architecture, the edges of the glass core and the edges of the build-up layers may be substantially coplanar. Even in such embodiments, the exposed edge surfaces of the glass core can benefit from the additional protection provided by the embodiments described herein.

[0010] Referring now to Figure 1A, a cross-sectional view of the package substrate 100 is shown. As shown, the package substrate 100 may include a glass core substrate 105 having an upper build-up layer 120 and a lower build-up layer 120. The glass core substrate 105 may include portions 104 that extend beyond the edges 121 of the build-up layers 120. That is, a portion of the upper surface 107, a portion of the lower surface 108, and a side wall surface 106 of the glass core substrate 105 may be exposed. The exposed portions 104 are unprotected and therefore may be susceptible to damage.

[0011] Referring now to Figure 1B, a cross-sectional view of the package substrate 100 of Figure 1A is shown after the buffer layer 110 has been applied to the exposed portion 104 of the glass core substrate 105. As shown, the buffer layer 110 conforms to the exposed surface of the glass core substrate 105. The buffer layer 110 may also be a dielectric material capable of absorbing impacts that could damage the glass core substrate 105. The buffer layer 110 can also provide protection against internal thermomechanical stresses (e.g., stresses caused by mismatches in thermal expansion coefficients (CTEs)).

[0012] However, the buffer layer 110 may not have a clearly defined edge 111. For example, the edge 111 in Figure 1B is curved. In addition to the curvature of the edge 111 shown in Figure 1B, the edge 111 may also be curved in a plane perpendicular to the figure in Figure 1B (i.e., a plan view looking down on the package substrate 100). The curvature of the buffer layer 110 may be due to the effect of surface tension during the deposition of the liquid material. Before curing to form a solid buffer layer 110, the liquid material flows freely and forms a shape that minimizes surface energy. Furthermore, in some cases, the buffer layer 110 may have a transparent (or relatively transparent) color, which is difficult to identify with optical imaging. The synergistic effect of the undefined straight edge and the transparent nature of the buffer layer 110 makes handling the package substrate 100 with automated toolsets difficult.

[0013] Accordingly, embodiments disclosed herein may include a set of processes and / or architectures that enable a more clearly defined edge profile of the buffer layer. In one embodiment, the edge profile is set substantially vertically by the presence of a rigid frame. In another embodiment, a gas pressurization treatment is used to maintain a straight edge during the curing process. In yet another embodiment, the shape of the glass core substrate is biased to account for the effect of the surface tension of the liquid adhesive in order to provide a straight edge. In yet another embodiment, a roller coating treatment using a scraping tool may be used to define the edge profile of the buffer layer. Embodiments may include a vacuum-assisted scraper to improve the profile of the buffer layer.

[0014] Referring now to Figures 2A and 2B, a pair of cross-sectional views of a package substrate 200 having a buffer layer 210 held by a frame 215 according to one embodiment are shown.

[0015] Referring now to Figure 2A, a cross-sectional view of a package substrate 200 according to one embodiment is shown. In one embodiment, the package substrate 200 may have a panel form factor, a quarter panel form factor, or a unit form factor. In one embodiment, the package substrate 200 may include a glass core substrate 205 provided between organic build-up layers 220.

[0016] In one embodiment, the glass core substrate 205 may be substantially entirely glass. The glass core substrate 205 may be a solid mass made of a glass material having an amorphous crystalline structure, and this solid glass core may also include various structures filled with one or more other materials (e.g., metals, metal alloys, dielectric materials, etc.), such as vias, cavities, channels, and other features. For this reason, the glass core substrate 205 may be distinguished from, for example, the “prepreg” or “FR4” core of a printed circuit board (PCB) substrate, which typically contains glass fibers embedded in a resin-organic material such as epoxy.

[0017] The glass core substrate 205 may have any suitable dimensions. In certain embodiments, the thickness of the glass core substrate 205 may be about 50 μm or more. For example, the thickness of the glass core substrate 205 may be between about 50 μm and about 1.4 mm. However, thinner or thicker thicknesses may also be used. The glass core substrate 205 may have edge dimensions (e.g., length, width, etc.) of about 10 mm or more. For example, the edge dimensions may be between about 10 mm and about 250 mm. However, larger or smaller edge dimensions may also be used. More generally, the area dimensions (from the top view) of the glass core substrate 205 may be between about 10 mm × 10 mm and about 250 mm × 250 mm. In one embodiment, the first edge of the glass core substrate 205 may be perpendicular or orthogonal to the second edge. In a more general embodiment, the glass core substrate 205 may include a rectangular volume in which some parts (e.g., vias) are removed and filled with other material (e.g., metal, etc.).

[0018] The glass core substrate 205 may include a single monolithic glass layer. In other embodiments, the glass core substrate 205 may include two or more individual glass layers stacked on top of each other. The individual glass layers may be in direct contact with each other, or they may be mechanically bonded together by an adhesive or the like. Each individual glass layer in the glass core substrate 205 may have a thickness of less than about 50 μm. For example, the individual glass layers in the glass core substrate 205 may have a thickness of about 25 μm to about 50 μm. However, depending on the embodiment, the thickness of the individual glass layers may be thicker or thinner than this. When used herein, "about" may refer to a range of values ​​within 10% of the stated value. For example, about 50 μm may refer to a range of 45 μm to 55 μm.

[0019] The glass core substrate 205 may be any suitable glass compound having the required mechanical robustness and compatibility with the semiconductor package manufacturing and assembly processes. For example, the glass core substrate 205 may include aluminosilicate glass, borosilicate glass, aluminoborosilicate glass, silica, or fused silica. In some embodiments, the glass core substrate 205 may contain one or more additives, such as, but not limited to, Al2O3, B2O3, MgO, CaO, SrO, BaO, SnO2, Na2O, K2O, SrO, P2O3, ZrO2, Li2O, Ti, or Zn. More generally, in addition to silicon and oxygen, the glass core substrate 205 may contain one or more of aluminum, boron, magnesium, calcium, barium, tin, sodium, potassium, strontium, phosphorus, zirconium, lithium, titanium, or zinc. In one embodiment, the glass core substrate 205 may contain at least 23 wt% silicon and at least 26 wt% oxygen. In some embodiments, the glass core substrate 205 may further contain at least 5 wt% aluminum.

[0020] In the embodiment shown in Figure 2A, electrical wiring (e.g., pads, traces, vias, etc.) is omitted for simplification. However, it will be understood that conductive vias may be formed in the thickness direction of the glass core substrate 205, and other electrical wiring may be provided within the build-up layer 220. The build-up layer 220 may include multiple laminated organic dielectric material layers, such as an organic build-up film.

[0021] In one embodiment, the glass core substrate 205 may include a portion 204 that extends beyond the edge 221 of the build-up layer 220. For example, the glass core substrate 205 may have a width wider than one or both of the build-up layer 220. In one embodiment, the portion 204 extending beyond the build-up layer 220 may include an upper surface 207, a lower surface 208, and an edge surface 206. In the illustrated embodiment, the edge surface 206 is substantially perpendicular to the upper surface 207 and / or the lower surface 208 (i.e., the edge surface 206 may be said to be "substantially perpendicular"). However, in other embodiments, the edge surface 206 may be inclined, curved, or non-perpendicular to the upper surface 207 and / or the lower surface 208. As shown, the edge surface 206 may be offset from one or both edges 221 of the build-up layer 220.

[0022] In one embodiment, the portion 204 extending beyond the edge 221 of the build-up layer 220 may be embedded in the buffer layer 210. The buffer layer 210 may be a dielectric material applied by any suitable process. For example, the buffer layer 210 may include one or more such materials as epoxy, acrylic, urethane, or polyimide. In some embodiments, the buffer layer 210 is a material that can be cured by an ultraviolet (UV) exposure process. The buffer layer 210 may be applied in a liquid state by a roller coating process and then cured.

[0023] In the embodiment shown in Figure 2A, the height of the buffer layer 210 is substantially equal to the combined height of the glass core substrate 205 and the two build-up layers 220. However, in other embodiments, the buffer layer 210 may be lower than the combined height of the glass core substrate 205 and the two build-up layers 220. That is, the buffer layer 210 may cover the entire edge 221 of one or both of the build-up layers 220, or it may cover a portion of the edge 221 of one or both of the build-up layers 220.

[0024] In one embodiment, the outer edge 211 of the buffer layer 210 is surrounded by a frame 215 wrapped around the periphery of the package substrate 200. The frame 215 may include a metal (e.g., copper, aluminum, etc.) or a thermosetting plastic frame (e.g., epoxy, polyimide, etc.). In one embodiment, the height of the frame 215 may be equal to the combined height of the package substrate 200, or the height of the frame 215 may be lower than the combined height of the package substrate 200. The rigid frame 215 provides a barrier that prevents the buffer layer 210 from flowing into a curved shape and minimizes surface tension when in a liquid state. Thus, the package substrate 200 is provided with a clearly defined edge that can be easily identified and handled by automated material handling equipment and / or tools.

[0025] The frame 215 provides containment along the outer edge 211 of the buffer layer 210, but the top and bottom surfaces 212 of the buffer layer 210 may not be contained. Therefore, the top and bottom surfaces 212 may have curved profiles. For example, in Figure 2A, the top and bottom surfaces 212 show concave curvature. Alternatively, Figure 2B shows a cross-sectional view of the package substrate 200 where the top and bottom surfaces 212 of the buffer layer 210 show convex curvature.

[0026] Referring here to Figures 3A to 3D, a series of plan views are shown illustrating a process for forming a package substrate 300 having a buffer layer 310 including a clearly defined outer edge 311, according to one embodiment.

[0027] Referring now to Figure 3A, a plan view of a package substrate 300 according to one embodiment is shown. As shown, the build-up layer 320 is provided on the glass core substrate 305. A portion 304 of the glass core substrate 305 may extend beyond the edge of the build-up layer 320. In one embodiment, the build-up layer 320 and the glass core substrate 305 may be the same as the build-up layer 220 and the glass core substrate 205 described in more detail above.

[0028] Referring to Figure 3B, a plan view of the package substrate 300 is shown after a buffer layer 310 (liquid) has been applied to a portion 304 (shown by a dashed line) of the glass core substrate 305, according to one embodiment. In one embodiment, the buffer layer 310 can be applied using a roller coating process or the like. As shown, due to the surface tension caused by the liquid nature of the buffer layer 310, the edge 311 may curve outward from the edge of the glass core substrate 305.

[0029] Referring now to Figure 3C, a plan view of the package substrate 300 is shown when the frame 315 is applied around the package substrate 300 according to one embodiment. In the illustrated embodiment, the frame 315 is a continuous structure wrapped around the buffer layer 310. However, in other embodiments, the frame 315 may include a plurality of separate segments attached to one another around the buffer layer 310. For example, each of the four edges 311 of the buffer layer 310 may be pressed by a separate segment of the frame 315.

[0030] Referring now to Figure 3D, a plan view of the package substrate 300 after the frame 315 has been pressed against all edges 311 of the buffer layer 310 according to one embodiment is shown. As shown, the frame 315 restricts the flow of the liquid buffer layer 310, making the edges 311 substantially straight. At this point, the liquid buffer layer 310 may be cured to transform it into a solid material (for example, by using one or more of UV curing or heat curing treatments). In one embodiment, the buffer layer 310 may be made of a material similar to any of the buffer layer materials described in more detail herein.

[0031] Referring now to Figure 3E, a flowchart is shown illustrating a process 380 for forming a package substrate having clearly defined edges using a frame, according to one embodiment. In one embodiment, process 380 may be the same as the process described above with respect to Figures 3A to 3D. In one embodiment, process 380 may begin with step 381, which includes applying a liquid adhesive around a substrate comprising a glass core, a first build-up layer on the glass core, and a second build-up layer below the glass core. In one embodiment, the liquid adhesive may be a curable material applied by a roller coating process or the like.

[0032] In one embodiment, process 380 may proceed to step 382, ​​in which the frame is pressed into the liquid adhesive. In one embodiment, the frame surrounds the perimeter of the substrate. The frame may be pressed into the liquid adhesive to set a straight edge for the liquid adhesive. The frame may be similar to any of the frames described in more detail herein.

[0033] In one embodiment, process 380 may proceed to step 383, in which the liquid adhesive is cured to fix the frame to the substrate. In one embodiment, the curing treatment may include one or more of the following: UV curing, or heat curing. The cured liquid adhesive may be a solid material that functions as a buffer layer to protect any portion of the glass core that may protrude beyond the edges of the first build-up layer and / or the second build-up layer.

[0034] While a physical frame may be used to provide clearly defined edges for the buffer layer, other embodiments may include a package substrate having clearly defined edges without adding any retaining mechanisms that remain in the final structure of the package substrate. For example, pressure may be applied to the liquid buffer layer to set a desired edge profile. In one such embodiment, a gas pressurization process may be used. Examples of such embodiments are shown in Figures 4A and 4B.

[0035] Referring now to Figure 4A, a partial plan view of a package substrate 400 according to one embodiment is shown. In one embodiment, the package substrate 400 may be similar to other package substrates described herein. For example, the glass core substrate 405 (shown by a dashed line) may protrude beyond the edge 421 of the build-up layer 420 that is superimposed on and / or below it. The glass core substrate 405 and the build-up layer 420 may be similar to any of the glass core substrates and / or build-up layers described in more detail herein.

[0036] In one embodiment, a liquid-based buffer layer 410 may be applied to a protruding portion of the glass core substrate 405. In the illustrated embodiment, a single edge 411 of the buffer layer 410 is shown for simplification. However, as with other embodiments described herein, it should be understood that the buffer layer 410 can surround the periphery of the package substrate 400. As illustrated, due to the surface tension effect of the liquid properties of the buffer layer 410, the edge 411 may be non-linear (i.e., curved).

[0037] Referring here to Figure 4B, a partial plan view of the package substrate 400 during a gas pressurization and curing process according to one embodiment is shown. In one embodiment, the gas pressurization process may include flowing gas 412 along the edge 411 of the buffer layer 410. The force of the gas 412 can set a new profile of the edge 411, for example, a substantially linear profile parallel to the edge 421 of the build-up layer 420. After setting the desired profile of the edge 411 of the buffer layer 410, a curing process 413 (e.g., UV curing or thermal curing) may be performed, during which the gas 412 continues to flow to maintain the desired profile through curing. After converting the buffer layer 410 into a solid layer, the gas pressurization may be stopped.

[0038] In some embodiments, gas pressurization can be performed simultaneously along all edges 411 of the buffer layer 410 (for example, along the entire circumference of the package substrate 400). In other embodiments, each edge 411 of the buffer layer 410 may be set and cured sequentially. In yet another embodiment, portions of the edges 411 of the buffer layer 410 may be set and cured sequentially.

[0039] Referring here to Figures 4C and 4D, the pair of cross-sectional views show various profiles of the edges 411 of the buffer layer 410 along a plane perpendicular to the plane of Figure 4B. As shown in Figure 4C, the height of the buffer layer 410 may be substantially equal to the composite height of the package substrate 400 (i.e., the combined height of the two build-up layers 420 and the glass core substrate 405). However, in other embodiments, the height of the buffer layer 410 may be lower than the composite height of the package substrate 400, or higher than the composite height of the package substrate. As shown, the inner surface of the buffer layer 410 may be aligned with the edges 421 of the build-up layer 420 and the surfaces of the glass core substrate 405 (e.g., the top surface 407, the bottom surface 408, and the edges 406 of the portion 404 extending beyond the build-up layer 420). In some embodiments, at least a portion of the edges 411 of the buffer layer 410 is substantially parallel to the edge surface 406 of the glass core substrate 405.

[0040] In one embodiment, the exposed surfaces of the buffer layer 410 may have substantially the same surface roughness. For example, the upper surface 414, lower surface 416, and edge 411 of the buffer layer 410 may all have substantially the same surface roughness. The similarity in surface roughness among all exposed surfaces is a result of the treatment used to define the vertical edge 411. Since a non-contact process (i.e., no physical contact with the solid material) is used to set the profile of the buffer layer 410, there is no physical damage to any of the surfaces 414, 416, or edge 411. That is, cutting or singulation processes to roughen the surface are not required to form the vertical edge 411. Similarly, in the molding process, artifacts remain due to the surface roughness of the mold or damage to the edge 411 during mold removal.

[0041] Figure 4C shows a perfectly perpendicular edge 411, but depending on the embodiment, a partially perpendicular edge 411 may be included. An example of such an embodiment is shown in Figure 4D. As shown in Figure 4D, the buffer layer 410 may include a pair of protrusions 418 provided on the upper and lower parts of the buffer layer 410. That is, the protrusions 418 may be on the opposite side of the glass core substrate 405. In one embodiment, the protrusions 418 may be the result of a gas pressurization process. The force applied by the gas may push some of the liquid away from the straight portion of the edge 411. Such a profile is sometimes said to have a bowl shape or bowl-like shape. That is, the perpendicular straight portion of the edge 411 may be the bottom of a bowl, and the protrusions 418 may define the side walls of the bowl.

[0042] Referring now to Figure 4E, a flow chart of step 480 for forming a package substrate having a buffer layer using a gas pressurization process according to one embodiment is shown. In one embodiment, step 480 may be the same as the steps described with respect to Figures 4A and 4B described herein.

[0043] In one embodiment, step 480 may begin with step 481, which includes applying a liquid adhesive to the edge of a substrate comprising a glass core and a first build-up layer above the glass core and a second build-up layer below the glass core. In one embodiment, the liquid adhesive may be applied by a roller coating process or the like. In one embodiment, the substrate may be similar to any of the package substrates described in more detail herein.

[0044] In one embodiment, step 480 may proceed to step 482, which includes flowing a gas over the liquid adhesive. In one embodiment, the force of the gas alters the profile of the liquid adhesive. In one embodiment, the gas may be directed perpendicular to the edge of the liquid adhesive. However, the gas may be flowed at other angles to the edge of the liquid adhesive. In one embodiment, the gas may include air, an inert gas, or other suitable gas. In one embodiment, the profile may provide an edge with a vertical portion. In some embodiments, the profile may have a bowl-shaped form.

[0045] In one embodiment, step 480 may proceed to step 483, which includes curing the liquid adhesive to maintain the profile formed by the gas pressure. In one embodiment, the curing process may be carried out while the gas pressurization process is still being performed. The curing process may include UV curing or thermal curing, etc.

[0046] In yet another embodiment, the edge profile of the buffer layer may be controlled by modifying the surface of the glass core substrate and / or the build-up layer. For example, the edge profile of the glass core substrate may be curved or otherwise biased to account for the effect of its surface tension when the buffer layer is in a liquid state. Thus, the liquid buffer layer can have relatively straight edges without the application of external forces such as a physical frame or mold and / or gas pressurization. Examples of such embodiments are shown in Figures 5A to 5H.

[0047] Referring now to Figure 5A, a plan view of a package substrate 500 according to one embodiment is shown. In one embodiment, the package substrate 500 may include a glass core substrate 505 and a build-up layer 520 above and / or below the glass core substrate 505. The glass core substrate 505 and the build-up layer 520 may be similar to either the glass core substrate or the build-up layer described in more detail herein. As shown, a portion of the glass core substrate 505 may extend beyond the edge of the build-up layer 520. That is, in some embodiments, the width of the glass core substrate 505 may be greater than the width of the build-up layer 520.

[0048] In contrast to some other embodiments described herein, the edge 506 of the glass core substrate 505 may include a nonlinear profile. For example, the right edge 506 in Figure 5A is edge 506 B It may include a recess 527 having a curved portion. In some cases, an edge 506 B The curved portion is sometimes said to have a concave shape. In some embodiments, edge 506 A and 506 C The straight portion may also be provided along the right edge 506 of the glass core substrate 505. That is, one or more edges 506 of the glass core substrate 505 may include both straight and non-straight portions. In the embodiment shown in Figure 5A, each edge 506 around the glass core substrate 505 includes a recess 527. However, embodiments may include recesses 527 along any number of edges 506 around the glass core substrate 505. In some embodiments, the glass core substrate 505 may have recesses 527 that are oriented such that the glass core substrate 505 is symmetrical with respect to a line passing through the center of the glass core substrate 505.

[0049] In one embodiment, the edges of the build-up layer 520 may include a curved surface that substantially matches the profile of the edge 506 of the glass core substrate 505. However, in other embodiments, the build-up layer 520 may have edges that do not substantially match the profile of the edge 506 of the glass core substrate 505.

[0050] Referring now to Figure 5B, a plan view of the package substrate 500 of Figure 5A after the application of the buffer layer 510 according to one embodiment is shown. In one embodiment, the buffer layer 510 may include any suitable buffer layer material, such as those described in more detail herein. For example, the buffer layer 510 may include one or more epoxy, acrylic, urethane, or polyimide. The buffer layer 510 can be applied as a liquid (e.g., a liquid adhesive) and cured to form a solid buffer layer 510. As shown, the depression 527 can be designed such that a straight edge 511 is formed in the buffer layer 510 due to the surface tension of the liquid buffer layer 510. That is, the natural state of the liquid buffer layer 510 forms a straight edge 511 without the application of any external force. A curing treatment (e.g., UV curing or thermal curing) may be used to set the profile of the edge 511 of the buffer layer 510.

[0051] Referring now to Figure 5C, a plan view of the package substrate 500 according to an additional embodiment is shown. In one embodiment, the package substrate 500 of Figure 5C may be the same as the package substrate 500 of Figure 5A, except that projections 526 are used instead of recesses. For example, circular projections 526 may be provided on the corners of the glass core substrate 505. Although shown as a partially circular structure, it should be understood that in other embodiments, projections of any shape may be provided on the corners of the glass core substrate 505.

[0052] Referring to Figure 5D, a plan view of the package substrate 500 after the application of the buffer layer 510 according to one embodiment is shown. As shown, the buffer layer 510 can have substantially straight edges 511. The straight edges 511 are formed by the projections 526 biasing the liquid material of the buffer layer 510 and counteracting the effect of surface tension. Therefore, the liquid of the buffer layer 510 immediately after deposition can form straight edges 511 without the application of external force. The shape of the buffer layer 510 can be set by a curing treatment (e.g., UV curing or thermal curing).

[0053] Referring now to Figures 5E to 5H, a series of plan views of various package substrates 500 according to additional embodiments are shown. In one embodiment, the package substrate 500 of Figures 5E to 5H may be the same as the package substrate 500 of Figures 5E to 5D, except for the profile of the edge 506 of the glass core substrate 505. However, it should be understood that the profiles shown in Figures 5E to 5H may be designed to bias a buffer layer (not shown) in order to generate a straight edge without applying external force.

[0054] Referring now to Figure 5E, a plan view of a package substrate 500 according to one embodiment is shown. As shown, the package substrate 500 may include a glass core substrate 505 having rounded corners 522 and a first edge 506. The rounded corners 522 may contribute to the formation of a straight edge of a buffer layer (not shown).

[0055] Referring now to Figure 5F, a plan view of the package substrate 500 according to an additional embodiment is shown. As shown, the glass core substrate 505 has a substantially linear first edge 506 A (i.e., the left edge 506 and the right edge 506) and the curved second edge 506 B(i.e., the upper edge 506 and the lower edge 506) may be included. In some embodiments, the package substrate 500 may be considered to be mirror-symmetric or symmetric. That is, the left half of the package substrate 500 may be a mirror image of the right half of the package substrate 500.

[0056] Referring now to Figure 5G, a plan view of the package substrate 500 according to an additional embodiment is shown. As shown, the package substrate 500 of Figure 5G may be the same as the package substrate 500 of Figure 5A, except for the corners 522. Instead of the corners being approximately 90 degrees, the corners 522 of Figure 5G are rounded. The rounded shape of the corners 522 may further improve the ability to form straight edges of buffer layers (not shown). In one embodiment, the rounded corners may include recesses 527 or be joined to each other by curved edges 506.

[0057] Referring now to Figure 5H, a plan view of the package substrate 500 according to an additional embodiment is shown. In one embodiment, the package substrate 500 may include a plurality of recesses 527 along a single edge of the glass core substrate 505. For example, Figure 5H shows four recesses 527 A ~527 D This illustrates the concept. In some embodiments, a profile having multiple such depressions may also be called a scalloped profile.

[0058] Referring here to Figure 5I, a flow chart of a process 580 for forming a package substrate having a buffer layer including a straight edge according to one embodiment is shown. In one embodiment, process 580 may begin with step 581, which includes singulation of the substrate from a panel. In one embodiment, the substrate may have nonlinear edge surfaces. The substrate may include a package substrate similar to any of the package substrates 500 described herein. For example, the substrate may include a glass core substrate extending over the edges of an overlaid and / or underlaid build-up layer. In one embodiment, the singulation process may include laser ablation or etching, etc. Nonlinear edge surfaces may include one or more curves and / or rounded corners, etc.

[0059] In one embodiment, process 580 may proceed to step 582, which includes applying the liquid adhesive to the straight edge surface. In one embodiment, the outer edge of the liquid adhesive is substantially flat. For example, due to the effect of the surface tension of the liquid adhesive, the liquid adhesive may have a straight edge profile depending on the designed shape of the non-straight edges of the substrate. Therefore, it may not be necessary to apply external force to provide a straight edge to the substrate. In one embodiment, the liquid adhesive may be applied using a roller coating process or the like.

[0060] In one embodiment, process 580 may proceed to step 583, which includes curing the liquid adhesive. The curing treatment may include one or more of the following: UV curing, or heat curing. After curing, the liquid adhesive is converted into a solid buffer layer on the edges of the substrate.

[0061] Embodiments disclosed herein may include applying a buffer layer (or coating) around a package substrate to protect exposed portions of a glass core substrate. Typically, the buffer layer may be applied by a liquid-based process. After applying the liquid, a curing process is used to convert the material into a solid buffer layer. In some embodiments, roller coating is described as one process for applying the buffer layer.

[0062] Embodiments disclosed herein may further include roller coating processes and / or systems that enable more efficient and precise application of a buffer layer onto the exposed edges of a glass core substrate. For example, by using a system capable of processing trays of unit-level package substrates, the thickness and profile of the sidewall coating can be precisely controlled. This can significantly improve yield due to improved control of the protective buffer layer. Such systems using automated processes can also significantly improve the throughput of the buffer layer coating process.

[0063] Referring to Figures 6A to 6D, a series of plan views (left) and corresponding cross-sectional views (right) are shown illustrating a process of roller coating a buffer layer onto a package substrate having an exposed glass core substrate according to one embodiment.

[0064] Referring here to Figure 6A, the plan view shows the package substrate 600. The package substrate 600 may be similar to other package substrates described in more detail herein. For example, the package substrate 600 may include a glass core substrate 605 and a build-up layer 620 that overlaps and / or overlaps it. The glass core substrate 605 may have a width wider than the width of the build-up layer 620, and the edge portions 604 of the glass core substrate 605 may be exposed. In one embodiment, a cross-sectional view shows the package substrate 600 having one or more dies 695 and a second level interconnect 692. The package substrate 600 may be housed in an inspection tool 650. The inspection tool 650 may include a mount 654 for holding the package substrate 600. In one embodiment, an optical sensor 651 (e.g., a camera) can be used to inspect the contour, orientation, and check for defects, etc., before further processing. In other embodiments, additional optical sensors (located outside the plane of Figure 6A and not visible) can be used to inspect the sidewalls and check for existing cracks and / or other defects in the glass edge.

[0065] Referring now to Figure 6B, a diagram showing a roller coating process according to one embodiment is shown. As shown, a liquid buffer layer 610 is applied along the edge of the package substrate 600. For example, the liquid buffer layer 610 can cover the exposed portion 604 of the glass core substrate 605.

[0066] As illustrated, the roller coating tool 660 may include a roller 665 configured to pick up liquid from the buffer layer 610 from the reservoir 669 and apply the liquid to the edge of the glass core substrate 605. In one embodiment, a mount 661 (e.g., a vacuum mount) holds the package substrate 600, thereby aligning its edge with the roller 665. In some embodiments, the mount 661 may rotate.

[0067] Referring now to Figure 6C, a diagram is shown illustrating a process for defining the edge profile of the buffer layer 610 according to one embodiment. After applying the buffer layer 610 along all edge surfaces of the package substrate 600, the profile of the edge 611 of the buffer layer 610 can be set using a scraper 667. For example, the buffer layer 610 may have a tapered cross-sectional shape in which the inner surface in contact with the package substrate 600 is higher than the edge 611 away from the package substrate 600. The surface 613 connected to the edge 611 may be straight or curved.

[0068] In one embodiment, the scraper 667 can improve the accuracy of the thickness of the buffer layer 610 on the edge surface of the glass core substrate 605. For example, the thickness of the buffer layer 610 between the edge of the glass core substrate 605 and the edge 611 of the buffer layer 610 can be up to approximately 20 μm, up to approximately 50 μm, or up to approximately 100 μm. However, in some embodiments, a larger thickness may be used.

[0069] As shown in the plan view of Figure 6C, the buffer layer 610 can form a frame or ring-shaped structure around the package substrate 600. This can improve the protection of the fragile glass core substrate 605. Furthermore, in some embodiments, the edges 611 of the buffer layer 610 may be curved due to the influence of surface tension in the liquid material used for the buffer layer 610. However, other embodiments described herein may be used in combination with a roller coating process to provide straight edges 611.

[0070] Referring now to Figure 6D, a diagram of the package substrate 600 after curing according to one embodiment is shown. As shown, the curing process may include UV curing. For example, UV radiation may be propagated from a UV light source 668. The curing process can convert the liquid adhesive into a solid buffer layer 610, protecting the glass core substrate 605 within the package substrate 600.

[0071] Referring now to FIG. 7A, a schematic plan view of a tool 770 that can be used to perform a roller coating process (such as that described with respect to FIGS. 6A-6D) according to one embodiment is shown. In one embodiment, the tool 770 can include a plurality of tray stackers 771. For example, in FIG. 7A, a set of four tray stackers 771 A ~771 D is shown. The first tray stacker 771 A can include a tray 772 filled with uncoated package substrates 700. The package substrate 700 can be similar to any of the package substrates including the glass core substrate described herein. The second tray stacker 771 A can accommodate an empty tray 772 B For example, all the trays 772 C are conveyed along a conveyor 773 A and individual package substrates 700 are removed (e.g., as shown in tray 772 A ) by a robot arm 772 and roller coated. In some embodiments, an inspection system 751 (e.g., an optical sensor, etc.) can be provided along the conveyor 773 B to inspect for unit orientation and / or large defects, etc. A In one embodiment, the robot arm 772 can remove a package substrate 700 unit and convey the package substrate to a roller coating tool 760. In the illustrated embodiment, a plurality of roller coating tools 760 are provided to improve throughput. The roller coating tool 760 can operate in a similar manner to the roller coating tool 660 described above. For example, the roller coating tool 760 can include components for performing a liquid adhesive dispensing process, a scraping process, and a curing process. After applying the coating to the edge of the package substrate 700, the robot arm places the coated substrate 700 in a third tray stacker 771

[0072] In one embodiment, the robot arm 772 can remove a package substrate 700 unit and convey the package substrate to a roller coating tool 760. In the illustrated embodiment, a plurality of roller coating tools 760 are provided to improve throughput. The roller coating tool 760 can operate in a similar manner to the roller coating tool 660 described above. For example, the roller coating tool 760 can include components for performing a liquid adhesive dispensing process, a scraping process, and a curing process. After applying the coating to the edge of the package substrate 700, the robot arm places the coated substrate 700 in a third tray stacker 771 Cand the 4th tray stacker 771 D Conveyor 773 between B Top tray 772 E Before loading, inspection 752 (e.g., by optical sensor, etc.) can be performed. Third tray stacker 771 C Empty tray 772 D Offering the 4th tray stacker 771 D This is a full tray 772 containing coated package substrates 700. F You can receive it.

[0073] Referring now to Figure 7B, a flow chart of a process 780 for forming a buffer layer coating along the edge of a glass core substrate in a package substrate according to one embodiment. In one embodiment, process 780 may begin with step 781, which includes applying a liquid adhesive to the edge of a substrate including a glass core and a first build-up layer above the glass core and a second build-up layer below the glass core. In one embodiment, the substrate may be similar to any package substrate described herein. In one embodiment, the edge portion of the glass core may extend beyond the edge of the build-up layer. In one embodiment, the liquid adhesive may be applied by a roller coating process, such as any roller coating process described herein.

[0074] In one embodiment, process 780 may be followed by step 782 of scraping (removing) a portion of the liquid adhesive from the edge of the substrate. In one embodiment, this scraping step provides a clearly defined edge profile of the liquid adhesive having a uniform thickness on the outer edge of the glass core.

[0075] In one embodiment, process 780 may be followed by step 783, which involves curing the liquid adhesive to form a solid layer. In one embodiment, the curing treatment may include one or more of the following: UV curing, or heat curing. The solid layer may be considered a buffer layer and / or coating, which is a frame or ring surrounding the outer periphery of the substrate. The buffer layer may protect the glass core to prevent damage such as cracking and / or back fracture defects. In one embodiment, the buffer layer may include one or more of any suitable materials that can be deposited as a liquid and cured into a solid, such as epoxy, acrylic, urethane, or polyimide.

[0076] In the roller coating process described herein, the desired edge profile of the buffer layer can be set using the design of the scraping tool. Furthermore, because the scraping tool passes through a liquid material, the profile may deform from the desired shape after the scraping tool has passed through a portion of the buffer layer due to the liquid properties of the buffer layer. Therefore, embodiments disclosed herein may include a scraping tool that uses a vacuum-assisted scraping head to better control the edge profile. In addition, an integrated UV light source can be connected to the scraping tool to cure the buffer layer during the scraping process. Thus, the desired profile of the buffer layer can be formed by the scraping head and cured without causing significant deformation.

[0077] Referring here to Figure 8A, a partial cross-sectional view of a package substrate 800 having a scraping tool 840 that defines the edge profile of a buffer layer 810 according to one embodiment is shown. In one embodiment, the package substrate 800 may include a glass core substrate 805 having a build-up layer 820 that overlaps on top and / or below. The glass core substrate 805 and the build-up layer 820 may be similar to any of the glass core substrate and build-up layers described in more detail herein.

[0078] In one embodiment, the scraping tool 840 may include a scraping head comprising an inner wall 841 and an outer wall 843. A gap 844 between the inner wall 841 and the outer wall 843 may be fluidly coupled to a vacuum line 846. A pump (not shown) coupled to the vacuum line 846 can create a vacuum in the gap 844 (e.g., reduce the pressure). In one embodiment, one or more ports 845 may be provided penetrating the inner wall 841 (as indicated by the arrows) to draw the liquid adhesive of the buffer layer 810 into the gap 844. The outward pulling force on the liquid buffer layer 810 allows the buffer layer 810 to completely fill the cavity 842 defined by the scraping head, thereby providing a desired profile. In the illustrated embodiment, port 845 A It may be provided along the edge of the inner wall 841, and port 845 B The ports may be provided along the approximate center of the upper part of the inner wall 841. However, it should be understood that, depending on the various embodiments, any number of ports 845 and / or any position of ports 845 may be used. In one embodiment, the cavity 842 may have any suitable depth, such as 25 μm or more, 50 μm or more, 100 μm or more, or 500 μm or more. However, in some embodiments, the depth of the cavity 842 may be smaller.

[0079] In one embodiment, the scraping head may have an open bottom at the entrance to the cavity 842. Furthermore, the scraping head may have an open side (outside the plane in Figure 8A) that allows the scraping head to move along the edge of the package substrate 800. In some embodiments, the scraping head can be described as a C-shaped, half-pipe, or partially tubular structure having any desired cross-sectional shape.

[0080] Referring here to Figure 8B, a plan view of the package substrate 800 is shown when defining the edge surface 811 of the buffer layer 810 using a scraping tool 840 according to one embodiment. As shown, the scraping tool 840 may include an outer wall 843 that passes laterally along the edge of the package substrate 800. The scraping tool 840 sets the profile of the edge surface 811. In some embodiments, an integrated UV light source 868 can be coupled to the scraping tool 840. Thus, the edge surface 811 set by the scraping tool 840 can be set (e.g., immediately after molding) to prevent deformation while the edge surface 811 is still in a liquid state. Thus, in some embodiments, a substantially linear edge surface 811 can be provided. In one embodiment, the UV light source 868 may also include a shield 869. The shield 869 may be provided between the UV light source 868 and the scraping head. The shield 869 can prevent UV radiation from propagating forward of the scraping tool 840. In other words, the UV light source 868 can be configured to cure the buffer layer 810 after setting the edge surface 811 of the buffer layer.

[0081] It should be understood that such a vacuum-assisted scraping tool 840 has the flexibility to provide various buffer layer 810 profiles. Several examples are shown in Figures 8C to 8E.

[0082] Referring now to Figure 8C, a cross-sectional view is shown of a portion of a package substrate 800 including a glass core substrate 805 and a build-up layer 820 according to one embodiment. As shown, the glass core substrate 805 may extend beyond the edge surface 821 of the build-up layer 820. To protect the glass core substrate 805, a buffer layer 810 may be provided on the edge surface 806 of the glass core substrate 805. In one embodiment, the buffer layer 810 may have a vertical surface 813, an inclined surface 814, and an edge surface 811 that are substantially perpendicular to the edge surface 821 of the build-up layer 820. The edge surface 811 may be substantially parallel to the edge surface 806 of the glass core substrate 805. Furthermore, the height of the buffer layer 810 (measured between the vertical surfaces 813) may be less than the total height of the package substrate 800 (i.e., the combined height of the glass core substrate 805 and the build-up layer 820). In such embodiments, a portion of the edge surface 821 of the build-up layer 820 may be exposed.

[0083] Referring now to Figure 8D, a partial cross-sectional view of the package substrate 800 according to an additional embodiment is shown. The package substrate 800 in Figure 8D may be the same as the package substrate 800 in Figure 8C, except for the buffer layer 810. Instead of a straight edge surface 811, the edge surface 811 may be curved. In some embodiments, the curved edge surface 811 may be directly connected to the vertical surface 813.

[0084] Referring now to Figure 8E, a partial cross-sectional view of the package substrate 800 according to an additional embodiment is shown. The package substrate 800 in Figure 8E may be the same as the package substrate 800 in Figure 8C, except for the shape of the buffer layer 810. In Figure 8E, the height of the buffer layer 810 may be substantially equal to the total height of the package substrate 800. That is, the buffer layer 810 may cover the entire length of the edge surface 821 of the build-up layer 820. Furthermore, the edge surface 811 may intersect the vertical surface 813 at a substantially 90-degree angle. In some embodiments, the buffer layer 810 may be rectangular in shape with recesses for accommodating the protruding portion of the glass core substrate 805.

[0085] Referring now to Figure 8F, a flow chart of process 880 for forming a substrate including a buffer layer having a defined edge profile according to one embodiment is shown. In one embodiment, process 880 may begin with step 881, which includes applying a liquid adhesive to the edges of a substrate including a glass core, a first build-up layer on the glass core, and a second build-up layer below the glass core. In one embodiment, the substrate may be similar to any of the package substrates described herein. In one embodiment, the edge portion of the glass core may extend beyond the edges of the build-up layers. In one embodiment, the liquid adhesive may be applied by a roller coating process, such as any of the roller coating processes described herein.

[0086] In one embodiment, process 880 may proceed to step 882, which includes defining a profile of the liquid adhesive using a scraper that includes an internal vacuum line. In one embodiment, the scraper may be similar to the scraping tool 840 described herein. In one embodiment, the profile may include a profile similar to any of the profiles described herein, such as those shown in Figures 8C to 8E.

[0087] In one embodiment, process 880 may proceed to step 883, which includes curing the liquid adhesive to maintain the profile. In one embodiment, the curing process may include UV curing or thermal curing. In one embodiment, the curing process may be performed approximately immediately after the scraping process. For example, a UV light source may be coupled to the backend of the scraping tool to cure the liquid adhesive approximately at the same time that the liquid adhesive is set to the desired profile. This prevents the profile from being significantly deformed after the scraping process.

[0088] Referring now to Figure 9, a cross-sectional view of an electronic system 990 according to one embodiment is shown. In one embodiment, the electronic system 990 may include a board 991 such as a printed circuit board (PCB) or motherboard. In one embodiment, the board 991 may be electrically coupled to a package substrate 900 by an interconnect 992. The interconnect 992 may include solder balls, sockets, pins, or any other suitable second-level interconnect (SLI) architecture.

[0089] In one embodiment, the package substrate 900 may be similar to any of the package substrates described in more detail herein. For example, the package substrate 900 may include a glass core substrate 905 between the build-up layers 920. In one embodiment, a portion 904 of the glass core substrate 905 may extend beyond the edges of the build-up layers 920. To further protect the exposed portion 904, a buffer layer 910 may be provided on the glass core substrate 905. The buffer layer 910 may be similar to any of the buffer layers described herein. For example, the buffer layer 910 may have a controlled profile to facilitate handling and / or identification by optical systems. The buffer layer 910 can be applied using a roller coating process or the like. For example, the buffer layer 910 can be formed using any of the roller coating processes, roller coating tools, and / or scraping tools described herein.

[0090] In one embodiment, one or more dies 995 may be electrically coupled to the package substrate 900 via an interconnect 993. In one embodiment, the interconnect may include solder balls, copper bumps, a hybrid bonding interface, or any other suitable FLI architecture. In one embodiment, one or more dies 995 may include any type of die, such as a processor (e.g., a central processing unit (CPU), graphics processing unit (GPU), XPU, etc.), a memory die, and / or a communication die. In some embodiments, a bridge (not shown) may be embedded in or on top of the build-up layer 920. The bridge may electrically couple two dies 995 together; that is, a conductive path may be provided from the first die 995 to the second die 995, and the conductive path may pass through and / or on the bridge.

[0091] Figure 10 shows a computing device 1000 according to one embodiment of the present disclosure. The computing device 1000 houses a board 1002. The board 1002 may include, but is not limited to, a processor 1004 and at least one communication chip 1006. The processor 1004 is physically and electrically coupled to the board 1002. In some embodiments, at least one communication chip 1006 is also physically and electrically coupled to the board 1002. In further embodiments, the communication chip 1006 is part of the processor 1004.

[0092] These other components include, but are not limited to, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, graphics processors, digital signal processors, cryptographic processors, chipsets, antennas, displays, touchscreen displays, touchscreen controllers, batteries, audio codecs, video codecs, power amplifiers, Global Positioning System (GPS) devices, compasses, accelerometers, gyroscopes, speakers, cameras, and mass storage devices (hard disk drives, compact discs (CDs), digital multipurpose discs (DVDs), etc.).

[0093] The communication chip 1006 enables wireless communication for transferring data to and from the computing device 1000. The term "wireless" and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communication channels, etc., that can communicate data using modulated electromagnetic radiation over a non-solid medium. This term does not mean that the associated device does not contain any wires, although in some embodiments it may be wire-free. The communication chip 1006 can implement any of a number of wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, LTE (Long Term Evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, their derivative standards, and other wireless protocols designated as 3G, 4G, 5G, and later standards. The computing device 1000 may contain multiple communication chips 1006. For example, the first communication chip 1006 may be dedicated to short-range wireless communication such as Wi-Fi and Bluetooth, and the second communication chip 1006 may be dedicated to long-range wireless communication such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, and Ev-DO.

[0094] The processor 1004 of the computing device 1000 includes an integrated circuit die packaged within the processor 1004. In some embodiments of this disclosure, the integrated circuit die of the processor may be part of an electronic package including a glass core and a buffer layer protecting the edges of the glass core, as described in one embodiment herein. The term “processor” may refer to any device or part of a device that processes electronic data from registers and / or memory and converts that electronic data into other electronic data that can be stored in registers and / or memory.

[0095] The communication chip 1006 also includes an integrated circuit die packaged within the communication chip 1006. In another embodiment of the present disclosure, the integrated circuit die of the communication chip may be part of an electronic package including a glass core and a buffer layer protecting the edges of the glass core, as described in one embodiment of the present specification.

[0096] In one embodiment, the computing device 1000 may be part of any device. For example, the computing device may be part of a personal computer, server, mobile device, tablet, or automobile. In other words, the computing device 1000 is not limited to use in a specific type of system, and may be included in any device that can benefit from computing capabilities.

[0097] The above description of the illustrated embodiments of this disclosure, including the contents described in the abstract, is not exhaustive and is not intended to limit the disclosure to the form in which it is disclosed. Specific embodiments and examples of this disclosure are described herein for illustrative purposes only, but various equivalent modifications are possible within the scope of this disclosure, as can be understood by those familiar with the relevant art.

[0098] In light of the detailed description above, these modifications may be made to this disclosure. The terms used in the following claims should not be construed as limiting this disclosure to the specific embodiments disclosed herein and in the claims. Rather, the scope of this disclosure is entirely determined by the following claims, which should be construed in accordance with established principles of claim interpretation.

[0099] Example 1: A device comprising: a first substrate comprising a glass layer; a second substrate located on the first substrate; a third substrate located below the first substrate, wherein the second and third substrates comprise an organic dielectric material, and the first edge of the first substrate is offset from the second edge of the second substrate and the third edge of the third substrate; a layer surrounding the first, second, and third substrates, wherein the layer comprises a dielectric material, and the fourth edge of the layer is substantially straight; and a frame surrounding and in contact with the fourth edge of the layer.

[0100] Example 2: The apparatus described in Example 1, wherein the upper and lower surfaces of the layers are non-linear.

[0101] Example 3: The apparatus described in Example 2, wherein the top and bottom surfaces are concave.

[0102] Example 4: The apparatus described in Example 2, wherein the top and bottom surfaces are convex.

[0103] Example 5: The apparatus described in Examples 1-4, wherein the frame is a metal frame.

[0104] Example 6: The apparatus described in Examples 1-4, wherein the frame is made of thermosetting plastic.

[0105] Example 7: The apparatus according to Examples 1 to 6, wherein the height of the layers is substantially equal to the combined height of the first substrate, the second substrate, and the third substrate.

[0106] Example 8: The apparatus according to Examples 1 to 7, wherein the second and third substrates include a build-up layer having conductive wiring embedded in one or both of the second or third substrates.

[0107] Example 9: The apparatus according to Examples 1 to 8, wherein the layer is in contact with the upper surface of the first substrate, the lower surface of the first substrate, and the first edge of the first substrate.

[0108] Example 10: The apparatus according to Examples 1 to 9, wherein the layer comprises epoxy, acrylic, urethane, polyimide, or a combination thereof.

[0109] Example 11: A device comprising: a package substrate having a glass core between build-up layers, wherein the width of the glass core is greater than the width of the build-up layers; a buffer layer surrounding the periphery of the package substrate, wherein the inner surface of the buffer layer matches the profile of the package substrate and the outer surface of the buffer layer is substantially perpendicular; and a frame in direct contact with the outer surface of the buffer layer.

[0110] Example 12: The apparatus as in Example 11, wherein the buffer layer is in direct contact with the glass core and the build-up layer.

[0111] Example 13: The apparatus according to Example 11 or Example 12, wherein the upper and lower surfaces of the buffer layer are curved.

[0112] Example 14: The apparatus according to Examples 11-13, wherein the buffer layer comprises epoxy, acrylic, urethane, polyimide, or a combination thereof.

[0113] Example 15: The apparatus described in Examples 11-14, wherein the frame comprises copper or aluminum.

[0114] Example 16: The apparatus described in Examples 11-15, wherein the frame comprises polyimide or epoxy.

[0115] Example 17: The apparatus according to Examples 11-16, wherein the frame includes multiple individual segments.

[0116] Example 18: A device comprising: a package substrate having a core containing a glass layer, wherein the edge profile of the package substrate is nonlinear, and a portion of the core protrudes from the edges of organic build-up layers above and below the core; a layer surrounding the package substrate that is in contact with the top surface of the core, the bottom surface of the core, and the edge surfaces of the core; and a frame around the layer.

[0117] Example 19: The apparatus as described in Example 18, wherein the frame comprises a metal material or a thermosetting plastic material.

[0118] Example 20: The apparatus according to Example 18 or Example 19, wherein the outer edges of the layers are substantially perpendicular.

Claims

1. A device, and said device is A first substrate comprising a glass layer, A second substrate is located on the first substrate, A third substrate located beneath the first substrate, wherein the second and third substrates include an organic dielectric material, and the first edge of the first substrate is offset from the second edge of the second substrate and the third edge of the third substrate. A layer surrounding the first substrate, the second substrate, and the third substrate, wherein the layer comprises a dielectric material and the fourth edge of the layer is substantially straight, The layer includes a frame that surrounds and contacts the fourth edge of the layer, device.

2. The apparatus according to claim 1, wherein the upper and lower surfaces of the layer are non-linear.

3. The apparatus according to claim 2, wherein the upper surface and the lower surface are concave.

4. The apparatus according to claim 2, wherein the upper surface and the lower surface are convex.

5. The apparatus according to claim 1, wherein the frame is a metal frame.

6. The apparatus according to claim 1, wherein the frame is made of thermosetting plastic.

7. The apparatus according to claim 1, wherein the height of the layer is substantially equal to the combined height of the first substrate, the second substrate, and the third substrate.

8. The apparatus according to claim 1, wherein the second substrate and the third substrate include a build-up layer having conductive wiring embedded in one or both of the second substrate or the third substrate.

9. The apparatus according to claim 1, wherein the layer is in contact with the upper surface of the first substrate, the lower surface of the first substrate, and the first edge of the first substrate.

10. The apparatus according to claim 1, wherein the layer comprises epoxy, acrylic, urethane, polyimide, or a combination thereof.

11. A device, and said device is A package substrate having a glass core between build-up layers, wherein the width of the glass core is greater than the width of the build-up layers, A buffer layer surrounding the periphery of the package substrate, wherein the inner surface of the buffer layer matches the profile of the package substrate and the outer surface of the buffer layer is substantially perpendicular, The buffer layer includes a frame that is in direct contact with the outer surface of the buffer layer, device.

12. The apparatus according to claim 11, wherein the buffer layer is in direct contact with the glass core and the build-up layer.

13. The apparatus according to claim 11, wherein the upper and lower surfaces of the buffer layer are curved.

14. The apparatus according to claim 11, wherein the buffer layer comprises epoxy, acrylic, urethane, polyimide, or a combination thereof.

15. The apparatus according to claim 11, wherein the frame comprises copper or aluminum.

16. The apparatus according to claim 11, wherein the frame comprises polyimide or epoxy.

17. The apparatus according to claim 11, wherein the frame includes a plurality of individual segments.

18. A device, and said device is A package substrate having a core containing a glass layer, wherein the edge profile of the package substrate is nonlinear, and a portion of the core protrudes from the edges of the organic build-up layers above and below the core, A layer surrounding the package substrate, which is in contact with the upper surface of the core, the lower surface of the core, and the edge surface of the core, Including a frame around the aforementioned layer, device.

19. The apparatus according to claim 18, wherein the frame comprises a metal material or a thermosetting plastic material.

20. The apparatus according to claim 18, wherein the outer edge of the layer is substantially vertical.

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