Sensor module

Abstract

To provide a sensor module that can be made lower in profile. [Solution] The sensor module comprises a sensor board having a circuit board and an inertial sensor mounted on the circuit board; a package having a main body having a first surface and a second surface that are in a front-back relationship and a side surface connecting the first surface and the second surface, and housing the sensor board inside; a fixing part extending from the main body along the first surface and fixed to an object; and a flexible wiring part electrically connected to the sensor board and extending out of the package from the side surface.

Description

Technical Field

[0001] The present invention relates to a sensor module.

Background Art

[0002] The inertial measurement device described in Patent Document 1 includes an inner case, a circuit board mounted on the lower surface of the inner case, and an outer case that covers the inner case and houses the circuit board between the inner case and the outer case. On the upper surface of the circuit board, a Z-axis angular velocity sensor, a three-axis acceleration sensor, and a plug-type connector are mounted. On the lower surface of the circuit board, a microcontroller is mounted. On the side surface of the circuit board, an X-axis angular velocity sensor and a Y-axis angular velocity sensor are mounted.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the inertial measurement device of Patent Document 1, since the plug-type connector is arranged in a posture standing against the circuit board, it is difficult to reduce the height of the entire device.

Means for Solving the Problems

[0005] The sensor module of the present invention includes a sensor substrate having a circuit board and an inertial sensor mounted on the circuit board, a main body having a first surface and a second surface in a front-back relationship and a side surface connecting the first surface and the second surface, and housing the sensor substrate therein, and a fixing portion extending from the main body portion along the first surface and fixed to an object. The package includes a flexible wiring portion that is electrically connected to the sensor substrate and extends from the side to the outside of the package. [Brief explanation of the drawing]

[0006] [Figure 1] This is a perspective view showing a sensor module according to the first embodiment. [Figure 2] This is a disassembled perspective view of the sensor module. [Figure 3] This is a top view of the sensor board. [Figure 4] This is a cross-sectional view of an accelerometer. [Figure 5] This is a plan view showing an angular velocity sensor. [Figure 6] This is a schematic diagram showing the operating state of the angular velocity sensor. [Figure 7] This is a schematic diagram showing the operating state of the angular velocity sensor. [Figure 8] This is a top view showing a modified example of a flexible wiring section. [Figure 9] This is a top view showing a modified example of a flexible wiring section. [Figure 10] This is a perspective view of the sensor module according to the second embodiment. [Figure 11] This is a cross-sectional view of the sensor module. [Figure 12] This is a top view of the sensor module according to the third embodiment. [Figure 13] This is a cross-sectional view of the sensor module according to the fourth embodiment. [Figure 14] This is a top view showing a modified version of the sensor module. [Figure 15] This is a top view showing a modified version of the sensor module. [Figure 16] This is a top view showing a modified version of the sensor module. [Figure 17] This is a top view showing a modified version of the sensor module. [Figure 18] This is a top view showing a modified version of the sensor module. [Figure 19]It is a top view showing a modified example of the sensor module. [Figure 20] It is a top view showing a modified example of the sensor module. [Figure 21] It is a top view showing a modified example of the sensor module. [Figure 22] It is a top view showing a modified example of the sensor module. [Figure 23] It is a cross-sectional view showing a modified example of the sensor module.

Embodiments for Carrying Out the Invention

[0007] Hereinafter, the sensor module of the present invention will be described in detail based on the embodiments shown in the accompanying drawings. For the sake of convenience of explanation, in each figure except FIGS. 5 to 7, three axes orthogonal to each other are illustrated as the X-axis, Y-axis, and Z-axis. Also, hereinafter, for the sake of convenience of explanation, the direction parallel to the X-axis is also referred to as the "X-axis direction", the direction parallel to the Y-axis is also referred to as the "Y-axis direction", and the direction parallel to the Z-axis is also referred to as the "Z-axis direction". Also, the arrow side of each axis is also referred to as the "plus side", and the opposite side is also referred to as the "minus side". Also, the arrow side in the Z-axis direction is also referred to as "up", and the opposite side is also referred to as "down".

[0008] <First Embodiment>[ FIG. 1 is a perspective view showing a sensor module according to the first embodiment. FIG. 2 is an exploded perspective view of the sensor module. FIG. 3 is a top view of the sensor substrate. FIG. 4 is a cross-sectional view of the acceleration sensor. FIG. 5 is a plan view showing the angular velocity sensor. FIGS. 6 and 7 are schematic views showing the driving states of the angular velocity sensor, respectively. FIGS. 8 and 9 are top views showing modified examples of the flexible wiring portion, respectively.

[0009] The sensor module 1 shown in FIG. 1 is an inertial measurement unit (IMU) that independently measures the angular velocity around each of the X-axis, Y-axis, and Z-axis and the acceleration in the direction of each of the X-axis, Y-axis, and Z-axis. Such a sensor module 1 includes a package 2, a sensor substrate 3 housed in the package 2, and a flexible wiring portion 4 that is electrically connected to the sensor substrate 3 and extends from the package 2.

[0010] ≪Package 2≫ As shown in FIG. 1, the package 2 has a main body portion 20 having an accommodation space inside, and a fixing portion 21 protruding from the main body portion 20 toward the positive side in the Y-axis direction. The main body portion 20 is cubic and has a lower surface 2a as a first surface in a front-back relationship and an upper surface 2b as a second surface, and a frame-shaped side surface 2c connecting the lower surface 2a and the upper surface 2b. Since the lower surface 2a is constituted by the X-Y plane, the "plan view from the Z-axis direction" frequently used below is synonymous with the "plan view of the lower surface 2a".

[0011] As shown in FIG. 2, the package 2 has an inner case 22 that constitutes a part of the main body portion 20 and the fixing portion 21, and an outer case 23 that constitutes a part of the main body portion 20. The outer case 23 is covered with the inner case 22 from above. In such a package 2, the lower surface 2a is constituted by the inner case 22, and the upper surface 2b is constituted by the outer case 23.

[0012] The inner case 22 and the outer case 23 are each made of aluminum (Al). As a result, the package 2 has high rigidity. In particular, in the present embodiment, the surfaces of the inner case 22 and the outer case 23 are each anodized, so that the package 2 is provided with insulation. However, the constituent materials of the inner case 22 and the outer case 23 are not particularly limited, and for example, they may be made of metal materials such as titanium, magnesium, and stainless steel, or ceramics such as alumina and titania.

[0013] The inner case 22 is plate-shaped and has a base portion 221 that constitutes part of the main body portion 20, and a fixing portion 21 that protrudes from the base portion 221 in the positive direction in the Y-axis direction. The base portion 221 is square in shape when viewed from the Z-axis direction. The base portion 221 also has a mounting base 221a on which the sensor substrate 3 is placed, which is erected along its edge. The base portion 221 also has a plurality of positioning protrusions 221b that protrude above the mounting base 221a and position the sensor substrate 3 relative to the mounting base 221a.

[0014] Furthermore, the fixing portion 21 extends from the main body portion 20 along the lower surface 2a. In particular, in this embodiment, the lower surface of the fixing portion 21 is a continuous surface with the lower surface 2a. The fixing portion 21 is also rectangular in shape. The width (length in the X-axis direction) of the fixing portion 21 is equal to the width (length in the X-axis direction) of the base portion 221. The fixing portion 21 also has a screw insertion hole 211 through which a screw N is inserted. The screw insertion hole 211 is made up of a notch that opens on the tip surface of the fixing portion 21. As will be described later, the sensor module 1 is fixed to the mounting substrate 91 by fastening the screw N inserted through the screw insertion hole 211 to the mounting substrate 91, which is the target object.

[0015] The outer case 23 is a rectangular box-shaped body having a recess opening on its bottom surface. The outer case 23 is placed over the inner case 22 from above by inserting the base 221 of the inner case 22 into the recess. The inner case 22 and the outer case 23 are then bonded and fixed together by an adhesive (not shown). However, the method of fixing the inner case 22 and the outer case 23 is not particularly limited, and for example, they may be fixed by screwing.

[0016] Although package 2 has been described above, the configuration of package 2 is not particularly limited. For example, in this embodiment, the inner case 22 has a fixing part 21, but it is not limited to this, and the outer case 23 may also have a fixing part 21. Also, in this embodiment, package 2 is configured by assembling two members, the inner case 22 and the outer case 23, but it is not limited to this, and for example, at least one of the inner case 22 and the outer case 23 may be divided into multiple parts, and the configuration may be one in which three or more members are assembled.

[0017] ≪Sensor board 3≫ As shown in Figure 3, the sensor board 3 includes a circuit board 5, an acceleration sensor 6 as an inertial sensor, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z, and a circuit element 8.

[0018] The circuit board 5 is made of a rigid substrate, such as a multilayer glass epoxy substrate. The circuit board 5 is fixed to the upper surface of the mounting base 221a via an adhesive (not shown) on its underside. However, the method of fixing the circuit board 5 to the upper surface of the mounting base 221a is not particularly limited, and it may be fixed by screwing, for example.

[0019] As shown in Figure 3, the acceleration sensor 6 is mounted on the top surface of the circuit board 5, facing the positive side of the Z-axis direction. The acceleration sensor 6 is a 3-axis acceleration sensor that can independently detect acceleration in the X-axis direction (Ax), the Y-axis direction (Ay), and the Z-axis direction (Az).

[0020] As shown in Figure 4, the acceleration sensor 6 has a package 61 and sensor elements 62x, 62y, and 62z housed in the package 61. It is electrically connected to the circuit board 5 via connection terminals (not shown) located on the package 61.

[0021] Sensor element 62x is an element that detects acceleration Ax in the X-axis direction, sensor element 62y is an element that detects acceleration Ay in the Y-axis direction, and sensor element 62z is an element that detects acceleration Az in the Z-axis direction. Although not shown in the figures, these sensor elements 62x, 62y, and 62z are silicon MEMS vibration elements having a fixed electrode fixed to the package 61 and a movable electrode that is variable relative to the package 61. In such sensor elements 62x, 62y, and 62z, when acceleration in the detection axis direction is received, the movable electrode is displaced relative to the fixed electrode, and the capacitance formed between the fixed electrode and the movable electrode changes accordingly. Therefore, the change in capacitance of sensor elements 62x, 62y, and 62z can be extracted as a detection signal, and the acceleration in each axis direction can be determined based on the extracted detection signal.

[0022] The acceleration sensor 6 has been described above, but the configuration of the acceleration sensor 6 is not particularly limited. For example, a configuration using quartz oscillators as the sensor elements 62x, 62y, and 62z is also possible.

[0023] As shown in Figure 3, the X-axis angular velocity sensor 7X is mounted on the side of the circuit board 5, facing the positive side in the X-axis direction. The X-axis angular velocity sensor 7X detects the angular velocity ωx around the X-axis. The Y-axis angular velocity sensor 7Y is mounted on the side of the circuit board 5, facing the positive side in the Y-axis direction. The Y-axis angular velocity sensor 7Y detects the angular velocity ωy around the Y-axis. The Z-axis angular velocity sensor 7Z is mounted on the top surface of the circuit board 5, facing the positive side in the Z-axis direction. The Z-axis angular velocity sensor 7Z detects the angular velocity ωz around the Z-axis.

[0024] As shown in Figure 5, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z each have a package 71 and a sensor element 72 housed in the package 71. They are electrically connected to the circuit board 5 via connection terminals (not shown) located on the package 71.

[0025] The sensor element 72 is, for example, a quartz crystal oscillator and has a base 720, four drive vibration arms 722, and two detection vibration arms 721. In such a sensor element 72, as shown in Figure 6, when a drive signal is applied to drive the drive vibration arms 722 and an angular velocity ω around the detection axis J is applied, the detection vibration arms 721 are excited by the Coriolis force to produce detection vibrations, as shown in Figure 7. The charge generated in the detection vibration arms 721 by the detection vibrations is then extracted as a detection signal, and the angular velocity ω can be determined based on the extracted detection signal.

[0026] The configurations of the X-axis angular velocity sensor 7X, Y-axis angular velocity sensor 7Y, and Z-axis angular velocity sensor 7Z have been summarized above. The X-axis angular velocity sensor 7X is positioned so that its detection axis J is aligned with the X-axis, the Y-axis angular velocity sensor 7Y is positioned so that its detection axis J is aligned with the Y-axis, and the Z-axis angular velocity sensor 7Z is positioned so that its detection axis J is aligned with the Z-axis. As a result, the X-axis angular velocity sensor 7X can detect angular velocity ωx, the Y-axis angular velocity sensor 7Y can detect angular velocity ωy, and the Z-axis angular velocity sensor 7Z can detect angular velocity ωz.

[0027] However, the configuration of the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z is not particularly limited. For example, the sensor element 72 may be a silicon MEMS vibration element.

[0028] As shown in Figure 3, the circuit element 8 is mounted on the underside of the circuit board 5. The circuit element 8 is electrically connected to the acceleration sensor 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z via the circuit board 5. Such a circuit element 8 is, for example, an MCU (Micro Controller Unit) that comprehensively controls each part of the sensor module 1. Specifically, the circuit element 8 has a control circuit that controls the driving of the acceleration sensor 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z via the circuit board 5, and an interface circuit that communicates with the outside.

[0029] The control circuit controls the driving of the accelerometer 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z. Based on the detection signal output from the accelerometer 6, it detects acceleration Ax, Ay, and Az, and based on the detection signals output from the X-axis, Y-axis, and Z-axis angular velocity sensors 7X, 7Y, and 7Z, it detects angular velocity ωx, ωy, and ωz. The interface circuit transmits and receives signals, accepts commands from the outside, and outputs the detected acceleration Ax, Ay, Az and angular velocity ωx, ωy, and ωz to the outside.

[0030] The sensor board 3 has been described above, but its configuration is not particularly limited. For example, in this embodiment, the inertial sensors include an acceleration sensor 6, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z, but it is not limited to this, and it is sufficient to have at least one inertial sensor.

[0031] ≪Flexible wiring section 4≫ As shown in Figures 2 and 3, the flexible wiring section 4 is electrically connected to the circuit board 5 and has the function of electrically connecting the circuit board 5 to the mounting board 91. Such a flexible wiring section 4 is a flexible wiring and is made of, for example, a flexible substrate. In particular, in this embodiment, the circuit board 5 and the flexible wiring section 4 are integrally formed by a rigid-flexible substrate, which is formed by connecting a rigid substrate that will become the circuit board 5 and a flexible substrate that will become the flexible wiring section 4. This simplifies the device configuration of the sensor module 1. Furthermore, since the circuit board 5 and the flexible wiring section 4 can be connected without using parts such as connectors, the number of parts can be reduced, and the sensor module 1 can be made smaller, lower profile, and lighter.

[0032] This flexible wiring section 4 is connected to the negative Y-axis end of the circuit board 5 and extends outside the package 2 from the side surface 2c of the main body 20 facing the negative Y-axis. A connector 41 is attached to the free end of the flexible wiring section 4, and it is connected to an external device via this connector 41.

[0033] The configuration of the sensor module 1 has been described above. The sensor module 1 is mounted on the mounting board 91 as shown in Figures 1 and 2. As shown in Figure 2, the mounting board 91 has a circuit board 92 and a connector 93 mounted on the upper surface of the circuit board 92. The circuit board 92 also has screw holes 921 for fastening screws N. First, the connector 41 provided on the flexible wiring section 4 is connected to the connector 93 on the mounting board 91. This electrically connects the sensor module 1 and the mounting board 91. Next, the sensor module 1 is placed on the upper surface of the circuit board 92 with its lower surface 2a facing the mounting board 91. Then, the sensor module 1 is fixed to the circuit board 92 by fastening screws N, which are inserted through screw insertion holes 211 formed in the fixing section 21 of the package 2, into the screw holes 921. This completes the mounting of the sensor module 1 to the mounting board 91. With this configuration, the sensor module 1 is fixed to the mounting board 91 at two points: the connector 41 and the screws N. Therefore, the sensor module 1 can be fixed to the mounting board 91 in a stable position. In particular, by using a screw to fasten one of these points, the position of the sensor module 1 becomes even more stable.

[0034] Furthermore, in this embodiment, the fixing portion 21 is positioned on the opposite side of the flexible wiring portion 4 from the main body portion 20 of the package 2. In other words, while the flexible wiring portion 4 is positioned on the negative side of the Y-axis direction of the main body portion 20, the fixing portion 21 is positioned on the positive side of the Y-axis direction of the main body portion 20. With this configuration, the two fixing points fixed to the mounting substrate 91 can be spaced as far apart as possible, increasing the mounting stability of the sensor module 1.

[0035] In this embodiment, the connector 41 attached to the tip of the flexible wiring section 4 is electrically connected to the connector 93 on the mounting board 91. However, the embodiment is not limited to this. For example, as shown in Figure 8, the connector 41 may be omitted from the tip of the flexible wiring section 4, and the tip of the flexible wiring section 4 may be directly connected to the connector 93. Alternatively, as shown in Figure 9, a rigid board 42 may be placed at the tip of the flexible wiring section 4 instead of the connector 41, and the rigid board 42 may be connected to the connector 93.

[0036] The sensor module 1 has been described above. As mentioned above, the sensor module 1 includes a circuit board 5, a sensor board 3 having an acceleration sensor 6, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z as inertial sensors mounted on the circuit board 5, a main body 20 having a first surface, which is a bottom surface 2a, and a second surface, which is an top surface 2b, and a side surface 2c connecting the bottom surface 2a and the top surface 2b, and housing the sensor board 3 inside, a fixing part 21 extending from the main body 20 along the bottom surface 2a and fixed to the mounting board 91 which is the target object, and a flexible wiring part 4 that is electrically connected to the sensor board 3 and extends outside the package 2 from the side surface 2c. With this configuration, the sensor module 1 can be electrically connected to the mounting board 91 via the flexible wiring part 4. Therefore, it is not necessary to mount a connector on the circuit board 5 as in the conventional method. In this way, the mounting of a connector on the circuit board 5 is eliminated, and furthermore, by extending the flexible wiring section 4 to the outside from the side 2c of the package 2, the height of the sensor module 1 can be reduced.

[0037] Furthermore, as mentioned above, the circuit board 5 and the flexible wiring section 4 are composed of a rigid-flexible circuit board, which has a rigid circuit board 5 and a flexible circuit board 4. This configuration simplifies the device configuration of the sensor module 1. In addition, since the circuit board 5 and the flexible wiring section 4 can be electrically connected without using components such as connectors, the number of components can be reduced, and the sensor module 1 can be made lower profile and lighter.

[0038] Furthermore, as mentioned above, the fixing portion 21 has a screw insertion hole 211 through which a screw N is inserted, and the fixing portion 21 is fixed to the mounting substrate 91 by the screw N. With this configuration, the sensor module 1 can be fixed to the mounting substrate 91 in a more stable position.

[0039] Furthermore, as mentioned above, the fixing portion 21 is positioned on the opposite side of the flexible wiring portion 4 from the main body portion 20 in a plan view of the lower surface 2a. With this configuration, the two fixing points fixed to the mounting substrate 91 can be spaced as far apart as possible, increasing the mounting stability of the sensor module 1.

[0040] <Second Embodiment> Figure 10 is a perspective view of the sensor module according to the second embodiment. Figure 11 is a cross-sectional view of the sensor module.

[0041] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the package 2 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0042] As shown in Figures 10 and 11, the fixing portion 21 has a first fixing portion 21A and a second fixing portion 21B that are positioned opposite each other to the main body portion 20 in a plan view from the Z-axis direction. The first fixing portion 21A is positioned on the opposite side of the flexible wiring portion 4, that is, on the positive Y-axis side relative to the main body portion 20, and the second fixing portion 21B is positioned on the flexible wiring portion 4 side, that is, on the negative Y-axis side relative to the main body portion 20. Therefore, in a plan view from the Z-axis direction, the second fixing portion 21B overlaps with the flexible wiring portion 4. Also, as shown in Figure 11, the first and second fixing portions 21A and 21B each have screw insertion holes 211 through which screws N are inserted. The screw insertion hole 211 of the first fixing portion 21A is made up of a notch that opens to the tip surface of the first fixing portion 21A, and the screw insertion hole 211 of the second fixing portion 21B is made up of a closed hole.

[0043] Furthermore, as shown in Figure 11, a screw insertion hole 43 is also formed in the portion that overlaps with the screw insertion hole 211 formed in the second fixing portion 21B of the flexible wiring portion 4, through which a screw N is inserted.

[0044] Furthermore, the mounting board 91 has two screw holes 921 and 922 formed in the circuit board 92 for screwing in screws N.

[0045] As shown in Figure 11, in this configuration, the sensor module 1 is fixed to the circuit board 92 by fastening a screw N inserted through a screw insertion hole 211 formed in the first fixing part 21A into a screw hole 921, and by fastening screws N inserted through a screw insertion hole 43 formed in the flexible wiring part 4 and a screw insertion hole 211 formed in the second fixing part 21B into screw holes 922. By screwing the sensor module 1 to the mounting board 91 in two places in this way, the sensor module 1 can be fixed to the mounting board 91 in a more stable position. In particular, as in this embodiment, by fixing the flexible wiring part 4 to the mounting board 91 together with the package 2, unwanted vibrations of the flexible wiring part 4 can be effectively suppressed.

[0046] As described above, in the sensor module 1 of this embodiment, the fixing portion 21 has a first fixing portion 21A and a second fixing portion 21B which are arranged on opposite sides to the main body portion 20 in a plan view of the lower surface 2a. With this configuration, the package 2 is fixed to the mounting substrate 91 at two locations, the first fixing portion 21A and the second fixing portion 21B, so that the sensor module 1 can be fixed to the mounting substrate 91 in a more stable position.

[0047] Furthermore, as mentioned above, in a plan view of the lower surface 2a, the first fixing part 21A is positioned on the opposite side from the flexible wiring part 4, and the second fixing part 21B is positioned on the side of the flexible wiring part 4. The flexible wiring part 4 overlaps with the second fixing part 21B and is fixed to the mounting substrate 91 together with the second fixing part 21B. With this configuration, unwanted vibrations of the flexible wiring part 4 can be effectively suppressed.

[0048] This second embodiment can also achieve the same effects as the first embodiment described above.

[0049] <Third Embodiment> Figure 12 is a top view of the sensor module according to the third embodiment.

[0050] The sensor module 1 of this embodiment is the same as that of the second embodiment described above, except that the arrangement of the first and second fixing parts 21A and 21B is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0051] As shown in Figure 12, in the sensor module 1 of this embodiment, the first fixing part 21A is positioned on the positive X-axis side relative to the main body 20, and the second fixing part 21B is positioned on the negative X-axis side relative to the main body. In other words, in a plan view from the Z-axis direction, the direction in which the first fixing part 21A and the second fixing part 21B are aligned (X-axis direction) intersects with the direction in which the flexible wiring part 4 extends (Y-axis direction). With this configuration, in a plan view from the Z-axis direction, the first and second fixing parts 21A and 21B do not overlap with the flexible wiring part 4, making it easy to fix the package 2 to the mounting substrate 91.

[0052] As described above, in the sensor module 1 of this embodiment, in a plan view of the lower surface 2a, the direction in which the first fixing portion 21A and the second fixing portion 21B are aligned intersects with the direction in which the flexible wiring portion 4 extends. With this configuration, in a plan view from the Z-axis direction, the first and second fixing portions 21A and 21B do not overlap with the flexible wiring portion 4, making it easy to fix the package 2 to the mounting substrate 91.

[0053] This third embodiment can also achieve the same effects as the first embodiment described above.

[0054] <Fourth Embodiment> Figure 13 is a cross-sectional view of the sensor module according to the fourth embodiment.

[0055] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the package 2 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0056] As shown in Figure 13, the inner case 22 has a columnar protrusion 229 that projects from the lower surface 2a. The protrusion 229 is located on the negative side in the Y-axis direction from the center O of the lower surface 2a, that is, on the side of the flexible wiring section 4. In contrast, the circuit board 92 of the mounting substrate 91 has a bottomed recess 929 into which the protrusion 229 is fitted.

[0057] In this configuration, the sensor module 1 is fixed to the circuit board 92 by engaging the protrusion 229 of the package 2 with the recess 929 and fastening a screw N inserted through the screw insertion hole 211 to the screw hole 921. By engaging the protrusion 229 with the recess 929 in this way, the orientation of the sensor module 1 becomes more stable. Also, since the number of screws N used for fixing can be limited to one, as in the first embodiment described above, mounting the sensor module 1 to the mounting board 91 becomes easier. In particular, as in this embodiment, by positioning the protrusion 229 on the negative side of the Y-axis direction with respect to the center O, the screw insertion hole 211 and the protrusion 229 can be separated as much as possible. As a result, the orientation of the sensor module 1 becomes even more stable.

[0058] As described above, in the sensor module 1 of this embodiment, the package 2 has a protrusion 229 that protrudes from the lower surface 2a, and the protrusion 229 engages with a recess 929 formed in the mounting substrate 91. With this configuration, the orientation of the sensor module 1 is more stable. In addition, since the number of screws N used for fixing can be reduced, mounting the sensor module 1 onto the mounting substrate 91 becomes easier.

[0059] Furthermore, as mentioned above, in a plan view of the lower surface 2a, the fixing portion 21 is positioned on the opposite side from the flexible wiring portion 4, and the protrusion 229 is located on the side of the flexible wiring portion 4 from the center O of the lower surface 2a. With this configuration, the screw insertion hole 211 and the protrusion 229 can be spaced as far apart as possible. As a result, the orientation of the sensor module 1 becomes even more stable.

[0060] This fourth embodiment can also achieve the same effects as the first embodiment described above.

[0061] Although the sensor module of the present invention has been described above based on the illustrated embodiment, the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having a similar function. Furthermore, other arbitrary configurations may be added to the present invention. Also, each embodiment may be combined as appropriate.

[0062] For example, the configurations shown in Figures 14 to 18 are modified versions of the second embodiment described above. In the modified versions shown in Figures 14 to 18, the screw insertion holes 211 are closed holes that do not open to the tip surfaces of the first and second fixing parts 21A and 21B, but the invention is not limited to this, and may be configured as notches that open to the tip surfaces of the first and second fixing parts 21A and 21B.

[0063] In Figure 14, the first fixing part 21A is divided into two parts spaced apart in the X-axis direction, and screw insertion holes 211 are formed in each part. Similarly, the second fixing part 21B is also divided into two parts spaced apart in the X-axis direction, and screw insertion holes 211 are formed in each part. Furthermore, in a plan view from the Z-axis direction, the screw insertion holes 211 of the second fixing part 21B do not overlap with the flexible wiring part 4. With this configuration, the sensor module 1 is fixed to the mounting substrate 91 by four screws N, thereby increasing the mounting stability of the sensor module 1.

[0064] In Figure 15, the first fixing part 21A is positioned biased towards the negative side in the X-axis direction, and the second fixing part 21B is positioned biased towards the positive side in the X-axis direction. Also, in a plan view from the Z-axis direction, the screw insertion hole 211 of the second fixing part 21B does not overlap with the flexible wiring part 4. With this configuration, the screw insertion holes 211 of the first and second fixing parts 21A and 21B can be spaced as far apart as possible. As a result, the mounting stability of the sensor module 1 is improved.

[0065] In Figure 16, the widths (lengths in the X-axis direction) of the first and second fixing parts 21A and 21B are smaller than the width (lengths in the X-axis direction) of the main body part 20. With this configuration, the footprint of the sensor module 1 can be reduced.

[0066] In Figure 17, the first fixing part 21A is divided into two parts spaced apart in the X-axis direction, and screw insertion holes 211 are formed in each part. The second fixing part 21B is located in the center in the X-axis direction, and its width (length in the X-axis direction) is smaller than the width (length in the X-axis direction) of the main body part 20. With this configuration, the sensor module 1 is fixed to the mounting substrate 91 by three screws N, thereby increasing the mounting stability of the sensor module 1.

[0067] In Figure 18, the second fixing portion 21B is divided into two parts spaced apart in the X-axis direction, with screw insertion holes 211 formed in each part. The first fixing portion 21A is located in the center in the X-axis direction, and its width (length in the X-axis direction) is smaller than the width (length in the X-axis direction) of the main body portion 20. With this configuration, the sensor module 1 is fixed to the mounting substrate 91 by three screws N, thereby increasing the mounting stability of the sensor module 1.

[0068] Furthermore, for example, the configuration shown in Figures 19 to 22 is a modified version of the third embodiment described above. In the modified version shown in Figures 19 to 22, the screw insertion hole 211 is a closed hole that does not open to the tip surfaces of the first and second fixing parts 21A and 21B, but it is not limited to this and may be a notch that opens to the tip surfaces of the first and second fixing parts 21A and 21B.

[0069] In Figure 19, the first fixing part 21A is divided into two parts spaced apart in the Y-axis direction, and screw insertion holes 211 are formed in each part. Similarly, the second fixing part 21B is also divided into two parts spaced apart in the Y-axis direction, and screw insertion holes 211 are formed in each part. With this configuration, the sensor module 1 is fixed to the mounting substrate 91 by four screws N, thereby increasing the mounting stability of the sensor module 1.

[0070] In Figure 20, the first fixing part 21A is positioned biased towards the positive side of the Y-axis, and the second fixing part 21B is positioned biased towards the negative side of the Y-axis. With this configuration, the screw insertion holes 211 of the first and second fixing parts 21A and 21B can be spaced as far apart as possible. Therefore, the mounting stability of the sensor module 1 is improved.

[0071] In Figure 21, the widths of the first and second fixing parts 21A and 21B are located in the center in the Y-axis direction, and the width (length in the Y-axis direction) of the first and second fixing parts 21A and 21B is smaller than the width (length in the Y-axis direction) of the main body 20. With this configuration, the footprint of the sensor module 1 can be reduced.

[0072] In Figure 22, the first fixing portion 21A is divided into two parts spaced apart in the Y-axis direction, with screw insertion holes 211 formed in each. The second fixing portion 21B is located in the center in the Y-axis direction, and its width (length in the Y-axis direction) is smaller than the width (length in the Y-axis direction) of the main body portion 20. With this configuration, the sensor module 1 is fixed to the mounting substrate 91 by three screws N, thereby increasing the mounting stability of the sensor module 1.

[0073] Furthermore, as shown in Figure 23, for example, the package 2 may be composed of a resin mold M. [Explanation of Symbols]

[0074] 1...Sensor module, 2...Package, 2a...Bottom, 2b...Top, 2c...Side, 20...Main body, 21...Fixing part, 21A...First fixing part, 21B...Second fixing part, 211...Screw insertion hole, 22...Inner case, 221...Base, 221a...Mounting base, 221b...Positioning projection, 229...Protrusion, 23...Outer case, 3...Sensor board, 4...Flexible wiring part, 41...Connector, 42...Rigid board, 43...Screw insertion hole, 5...Circuit board, 6...Accelerometer, 61...Package, 62x...Sensor element, 62y...Sensor Sensor element, 62z…Sensor element, 7X…X-axis angular velocity sensor, 7Y…Y-axis angular velocity sensor, 7Z…Z-axis angular velocity sensor, 71…Package, 72…Sensor element, 720…Base, 721…Detection vibration arm, 722…Drive vibration arm, 8…Circuit element, 91…Mounting board, 92…Circuit board, 921…Screw hole, 922…Screw hole, 929…Recess, 93…Connector, Ax…Accelerometer, Ay…Accelerometer, Az…Accelerometer, J…Detection axis, N…Screw, M…Resin mold, O…Center, ω…Angular velocity, ωx…Angular velocity, ωy…Angular velocity, ωz…Angular velocity

Claims

1. A sensor board having a circuit board and an inertial sensor mounted on the circuit board, A package having a main body having a first surface and a second surface that are in a front-back relationship, and a side surface connecting the first surface and the second surface, and housing the sensor substrate inside, and a fixing part that extends from the main body along the first surface and is fixed to an object, A sensor module characterized by having a flexible wiring portion that is electrically connected to the sensor substrate and extends from the side surface to the outside of the package.

2. The sensor module according to claim 1, wherein the circuit board and the flexible wiring section are composed of a rigid-flexible substrate having a rigid substrate which is the circuit board and a flexible substrate which is the flexible wiring section.

3. The aforementioned fixing portion has a screw insertion hole through which a screw is inserted. The sensor module according to claim 1, wherein the fixing part is fixed to the object by the screw.

4. The sensor module according to claim 1, wherein the fixing portion is arranged on the side opposite to the flexible wiring portion relative to the main body portion in a plan view of the first surface.

5. The sensor module according to claim 1, wherein the fixing portion has a first fixing portion and a second fixing portion that are arranged on opposite sides to the main body portion in a plan view of the first surface.

6. In a plan view of the first surface, The first fixing portion is positioned on the opposite side from the flexible wiring portion. The second fixing part is positioned on the side of the flexible wiring part, The sensor module according to claim 5, wherein the flexible wiring portion overlaps with the second fixing portion and is fixed to the object together with the second fixing portion.

7. In a plan view of the first surface, The sensor module according to claim 5, wherein the direction in which the first fixed portion and the second fixed portion are aligned intersects with the direction in which the flexible wiring portion extends.

8. The package has a protrusion that extends from the first surface, The sensor module according to claim 1, wherein the protrusion engages with a recess formed in the object.

9. In a plan view of the first surface, The fixing portion is positioned on the opposite side from the flexible wiring portion. The sensor module according to claim 8, wherein the protrusion is located on the side of the flexible wiring portion that is closer to the center of the first surface.

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