Sensor module

Abstract

To provide a sensor module that can be made lower in profile. [Solution] The sensor module comprises a sensor board having a circuit board and an inertial sensor mounted on the circuit board; a package having a main body that houses the sensor board, having a first surface and a second surface that are in a front-back relationship and a side surface connecting the first surface and the second surface; and a flexible wiring portion that is electrically connected to the sensor board and extends out of the package from the side surface. The package has a first screw insertion hole that penetrates the first surface and the second surface, and is fixed to an object by a screw inserted through the first screw insertion hole.

Description

Technical Field

[0001] The present invention relates to a sensor module.

Background Art

[0002] The inertial measurement device described in Patent Document 1 includes an inner case, a circuit board mounted on the lower surface of the inner case, and an outer case that covers the inner case and houses the circuit board between the inner case and itself. Further, a Z-axis angular velocity sensor, a three-axis acceleration sensor, and a plug-type connector are mounted on the upper surface of the circuit board, a microcontroller is mounted on the lower surface of the circuit board, and an X-axis angular velocity sensor and a Y-axis angular velocity sensor are mounted on the side surface of the circuit board.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the inertial measurement device of Patent Document 1, since the plug-type connector is arranged in a posture standing upright with respect to the circuit board, it is difficult to reduce the height of the entire device.

Means for Solving the Problems

[0005] The sensor module of the present invention includes a sensor substrate having a circuit board and an inertial sensor mounted on the circuit board, a package having a first surface and a second surface that are in a front-back relationship, and a side surface that connects the first surface and the second surface, and having a main body portion that houses the sensor substrate inside, and a flexible wiring portion that is electrically connected to the sensor substrate and extends outside the package from the side surface. The package has a first screw insertion hole that penetrates the first surface and the second surface, The object is fixed by a screw inserted through the first screw insertion hole. [Brief explanation of the drawing]

[0006] [Figure 1] This is a perspective view showing a sensor module according to the first embodiment. [Figure 2] This is a disassembled perspective view of the sensor module. [Figure 3] This is a bottom view of the sensor module. [Figure 4] This is a top view of the sensor board. [Figure 5] This is a cross-sectional view of an accelerometer. [Figure 6] This is a plan view showing an angular velocity sensor. [Figure 7] This is a schematic diagram showing the operating state of the angular velocity sensor. [Figure 8] This is a schematic diagram showing the operating state of the angular velocity sensor. [Figure 9] This is a cross-sectional view showing the mounting state of the sensor module. [Figure 10] This is a top view showing a modified example of a flexible wiring section. [Figure 11] This is a top view showing a modified example of a flexible wiring section. [Figure 12] This is a perspective view of the sensor module according to the second embodiment. [Figure 13] This is a cross-sectional view of the sensor module. [Figure 14] This is a cross-sectional view of a sensor module according to the third embodiment. [Figure 15] This is a perspective view of the sensor module according to the fourth embodiment. [Figure 16] This is a bottom view of the sensor module. [Figure 17] This is a bottom view showing a modified version of the sensor module. [Figure 18] This is a bottom view showing a modified version of the sensor module. [Figure 19] It is a top view of the sensor module according to the fifth embodiment. [Figure 20] It is a cross-sectional view of the sensor module. [Figure 21] It is a top view showing a modified example of the sensor module. [Figure 22] It is a top view of the sensor module according to the sixth embodiment. [Figure 23] It is a top view showing a modified example of the sensor module. [Figure 24] It is a cross-sectional view showing a modified example of the sensor module.

Mode for Carrying Out the Invention

[0007] Hereinafter, the sensor module of the present invention will be described in detail based on the embodiments shown in the accompanying drawings. For the sake of convenience of explanation, in each figure, three axes orthogonal to each other are illustrated as the X-axis, Y-axis, and Z-axis. Also, hereinafter, for the sake of convenience of explanation, the direction parallel to the X-axis is also referred to as the "X-axis direction", the direction parallel to the Y-axis is also referred to as the "Y-axis direction", and the direction parallel to the Z-axis is also referred to as the "Z-axis direction". Further, the arrow side of each axis is also referred to as the "plus side", and the opposite side is also referred to as the "minus side". Also, the arrow side in the Z-axis direction is also referred to as "up", and the opposite side is also referred to as "down".

[0008] <First Embodiment> FIG. 1 is a perspective view showing a sensor module according to the first embodiment. FIG. 2 is an exploded perspective view of the sensor module. FIG. 3 is a bottom view of the sensor module. FIG. 4 is a top view of the sensor substrate. FIG. 5 is a cross-sectional view of the acceleration sensor. FIG. 6 is a plan view showing the angular velocity sensor. FIGS. 7 and 8 are schematic views showing the driving states of the angular velocity sensor, respectively. FIG. 9 is a cross-sectional view showing the mounted state of the sensor module. FIGS. 10 and 11 are top views showing modified examples of the flexible wiring portion, respectively.

[0009] The sensor module 1 shown in Figure 1 is an inertial measurement unit (IMU) that independently measures angular velocity around the X, Y, and Z axes, and acceleration in the axial directions of the X, Y, and Z axes. Such a sensor module 1 includes a package 2, a sensor substrate 3 housed in the package 2, and a flexible wiring section 4 that is electrically connected to the sensor substrate 3 and extends from the package 2.

[0010] Package 2 As shown in Figure 1, the package 2 has a main body 20 which has a housing space for housing the sensor substrate 3. The main body 20 is cubic in shape and has a bottom surface 2a as the first surface and an top surface 2b as the second surface, which are in a front-back relationship, and a frame-shaped side surface 2c that connects the bottom surface 2a and the top surface 2b. Since the bottom surface 2a is composed of the XY plane, the "plan view from the Z-axis direction" used frequently below is synonymous with "plan view of the bottom surface 2a".

[0011] As shown in Figure 2, package 2 has an inner case 22 and an outer case 23. The outer case 23 is placed over the inner case 22 from above. In such package 2, the inner case 22 forms the bottom surface 2a, and the outer case 23 forms the top surface 2b.

[0012] The inner case 22 and outer case 23 are each made of aluminum (Al). This results in a highly rigid package 2. In particular, in this embodiment, the inner case 22 and outer case 23 are anodized to provide insulation to the package 2. However, the constituent materials of the inner case 22 and outer case 23 are not particularly limited and may be made of metal materials such as titanium, magnesium, or stainless steel, or ceramics such as alumina or titania.

[0013] The inner case 22 has a mounting base 221 on which the sensor substrate 3 is placed, which is erected along its edge. The inner case 22 also has a plurality of positioning protrusions 222 that protrude above the mounting base 221 and are used to position the sensor substrate 3 relative to the mounting base 221.

[0014] The outer case 23 is a rectangular box-shaped body having a recess opening on its bottom surface. The outer case 23 is placed over the inner case 22 from above by inserting the inner case 22 into the recess. The inner case 22 and the outer case 23 are then bonded and fixed together with an adhesive (not shown). However, the method of fixing the inner case 22 and the outer case 23 is not particularly limited, and for example, they may be fixed by screwing.

[0015] As shown in Figure 3, such a package 2 has a first screw insertion hole 24 that penetrates the lower surface 2a and the upper surface 2b. A screw N1 for fixing the sensor module 1 to the mounting substrate 91 is inserted through this first screw insertion hole 24. The first screw insertion hole 24 is located on the positive side of the Y-axis direction from the center O of the lower surface 2a. In other words, the first screw insertion hole 24 is located on the opposite side of the flexible wiring section 4 from the center O.

[0016] The above describes Package 2, but the configuration of Package 2 is not particularly limited.

[0017] ≪Sensor board 3≫ As shown in Figure 4, the sensor board 3 includes a circuit board 5, an acceleration sensor 6 as an inertial sensor, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z, and a circuit element 8.

[0018] The circuit board 5 is made of a rigid substrate, such as a multilayer glass epoxy substrate. The circuit board 5 is fixed to the upper surface of the mounting base 221 via an adhesive (not shown) on its underside. However, the method of fixing the circuit board 5 to the upper surface of the mounting base 221 is not particularly limited, and it may be fixed by screwing, for example. In addition, a hole is formed in the portion of the circuit board 5 that overlaps with the first screw insertion hole 24 to allow the insertion of a screw N1 into the first screw insertion hole 24.

[0019] As shown in Figure 4, the acceleration sensor 6 is mounted on the top surface of the circuit board 5, facing the positive side of the Z-axis direction. The acceleration sensor 6 is a 3-axis acceleration sensor that can independently detect acceleration in the X-axis direction (Ax), the Y-axis direction (Ay), and the Z-axis direction (Az).

[0020] As shown in Figure 5, the acceleration sensor 6 has a package 61 and sensor elements 62x, 62y, and 62z housed in the package 61. It is electrically connected to the circuit board 5 via connection terminals (not shown) located on the package 61.

[0021] Sensor element 62x is an element that detects acceleration Ax in the X-axis direction, sensor element 62y is an element that detects acceleration Ay in the Y-axis direction, and sensor element 62z is an element that detects acceleration Az in the Z-axis direction. Although not shown in the figures, these sensor elements 62x, 62y, and 62z are silicon MEMS vibration elements having a fixed electrode fixed to the package 61 and a movable electrode that is variable relative to the package 61. In such sensor elements 62x, 62y, and 62z, when acceleration in the detection axis direction is received, the movable electrode is displaced relative to the fixed electrode, and the capacitance formed between the fixed electrode and the movable electrode changes accordingly. Therefore, the change in capacitance of sensor elements 62x, 62y, and 62z can be extracted as a detection signal, and the acceleration in each axis direction can be determined based on the extracted detection signal.

[0022] The acceleration sensor 6 has been described above, but the configuration of the acceleration sensor 6 is not particularly limited. For example, a configuration using quartz oscillators as the sensor elements 62x, 62y, and 62z is also possible.

[0023] As shown in Figure 4, the X-axis angular velocity sensor 7X is mounted on the side of the circuit board 5, facing the positive side in the X-axis direction. The X-axis angular velocity sensor 7X detects the angular velocity ωx around the X-axis. The Y-axis angular velocity sensor 7Y is mounted on the side of the circuit board 5, facing the positive side in the Y-axis direction. The Y-axis angular velocity sensor 7Y detects the angular velocity ωy around the Y-axis. The Z-axis angular velocity sensor 7Z is mounted on the top surface of the circuit board 5, facing the positive side in the Z-axis direction. The Z-axis angular velocity sensor 7Z detects the angular velocity ωz around the Z-axis.

[0024] As shown in Figure 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z each have a package 71 and a sensor element 72 housed in the package 71. They are electrically connected to the circuit board 5 via connection terminals (not shown) located on the package 71.

[0025] The sensor element 72 is, for example, a quartz crystal oscillator and has a base 720, four drive vibration arms 722, and two detection vibration arms 721. In such a sensor element 72, as shown in Figure 7, when a drive signal is applied to drive the drive vibration arms 722 and an angular velocity ω around the detection axis J is applied, the detection vibrations are excited by the Coriolis force, as shown in Figure 8. The charge generated in the detection vibration arms 721 by the detection vibrations is then extracted as a detection signal, and the angular velocity ω can be determined based on the extracted detection signal.

[0026] The configurations of the X-axis angular velocity sensor 7X, Y-axis angular velocity sensor 7Y, and Z-axis angular velocity sensor 7Z have been summarized above. The X-axis angular velocity sensor 7X is positioned so that its detection axis J is aligned with the X-axis, the Y-axis angular velocity sensor 7Y is positioned so that its detection axis J is aligned with the Y-axis, and the Z-axis angular velocity sensor 7Z is positioned so that its detection axis J is aligned with the Z-axis. As a result, the X-axis angular velocity sensor 7X can detect angular velocity ωx, the Y-axis angular velocity sensor 7Y can detect angular velocity ωy, and the Z-axis angular velocity sensor 7Z can detect angular velocity ωz.

[0027] However, the configuration of the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z is not particularly limited. For example, the sensor element 72 may be a silicon MEMS vibration element.

[0028] As shown in Figure 4, the circuit element 8 is mounted on the underside of the circuit board 5. The circuit element 8 is electrically connected to the acceleration sensor 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z via the circuit board 5. Such a circuit element 8 is, for example, an MCU (Micro Controller Unit) that comprehensively controls each part of the sensor module 1. Specifically, the circuit element 8 has a control circuit that controls the driving of the acceleration sensor 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z via the circuit board 5, and an interface circuit that communicates with the outside.

[0029] The control circuit controls the driving of the accelerometer 6, the X-axis angular velocity sensor 7X, the Y-axis angular velocity sensor 7Y, and the Z-axis angular velocity sensor 7Z. Based on the detection signal output from the accelerometer 6, it detects acceleration Ax, Ay, and Az, and based on the detection signals output from the X-axis, Y-axis, and Z-axis angular velocity sensors 7X, 7Y, and 7Z, it detects angular velocity ωx, ωy, and ωz. The interface circuit transmits and receives signals, accepts commands from the outside, and outputs the detected acceleration Ax, Ay, Az and angular velocity ωx, ωy, and ωz to the outside.

[0030] The sensor board 3 has been described above, but its configuration is not particularly limited. For example, in this embodiment, the inertial sensors include an acceleration sensor 6, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z, but it is not limited to this, and it is sufficient to have at least one inertial sensor.

[0031] ≪Flexible wiring section 4≫ As shown in Figures 2 and 4, the flexible wiring section 4 is electrically connected to the circuit board 5 and has the function of electrically connecting the circuit board 5 to the mounting board 91. Such a flexible wiring section 4 is a flexible wiring and is made of, for example, a flexible substrate. In particular, in this embodiment, the circuit board 5 and the flexible wiring section 4 are integrally formed by a rigid-flexible substrate, which is formed by connecting a rigid substrate that will become the circuit board 5 and a flexible substrate that will become the flexible wiring section 4. This simplifies the device configuration of the sensor module 1. Furthermore, since the circuit board 5 and the flexible wiring section 4 can be connected without using parts such as connectors, the number of parts can be reduced, and the sensor module 1 can be made smaller and lighter.

[0032] This flexible wiring section 4 is connected to the negative Y-axis end of the circuit board 5 and extends outside the package 2 from the side surface 2c of the main body 20 facing the negative Y-axis. A connector 41 is attached to the free end of the flexible wiring section 4, and it is connected to an external device via this connector 41.

[0033] The configuration of the sensor module 1 has been described above. Such a sensor module 1 is mounted on a mounting board 91 as shown in Figure 9. The mounting board 91 has a circuit board 92 and a connector 93 mounted on the upper surface of the circuit board 92. The circuit board 92 also has screw holes 921 for fastening screws N1.

[0034] First, the connector 41 provided on the flexible wiring section 4 is connected to the connector 93 on the mounting board 91. This electrically connects the sensor module 1 and the mounting board 91. Next, the sensor module 1 is placed on the upper surface of the circuit board 92 with its lower surface 2a facing the mounting board 91. Then, the sensor module 1 is fixed to the circuit board 92 by fastening the screw N1, which is inserted through the first screw insertion hole 24 formed in the package 2, into the screw hole 921.

[0035] With the above steps completed, the mounting of the sensor module 1 onto the mounting board 91 is finished. As mentioned above, the sensor module 1 is electrically connected to the mounting board 91 via the flexible wiring section 4. Therefore, it is not necessary to mount a connector on the circuit board 5 as in the conventional method. Furthermore, in the sensor module 1, the flexible wiring section 4 extends outward from the side 2c of the package 2. With this configuration, a connector is not required inside, and the flexible wiring section 4 does not protrude above or below the package 2, so the height of the sensor module 1 can be reduced.

[0036] In particular, in this embodiment, the first screw insertion hole 24 is located on the opposite side of the flexible wiring section 4 from the center O of the lower surface 2a. That is, while the flexible wiring section 4 is located on the negative side of the Y-axis direction of the center O, the first screw insertion hole 24 is located on the positive side of the Y-axis direction of the center O. With this configuration, the two fixing points (connector 41 and screw N1) fixed to the mounting substrate 91 can be spaced as far apart as possible, thereby increasing the mounting stability of the sensor module 1.

[0037] In this embodiment, the connector 41 attached to the tip of the flexible wiring section 4 is electrically connected to the connector 93 on the mounting board 91. However, the embodiment is not limited to this. For example, as shown in Figure 10, the connector 41 may be omitted from the tip of the flexible wiring section 4, and the tip of the flexible wiring section 4 may be directly connected to the connector 93. Alternatively, as shown in Figure 11, a rigid board 42 may be placed at the tip of the flexible wiring section 4 instead of the connector 41, and the rigid board 42 may be connected to the connector 93.

[0038] The sensor module 1 has been described above. As previously mentioned, the sensor module 1 includes a circuit board 5, a sensor board 3 having an acceleration sensor 6, an X-axis angular velocity sensor 7X, a Y-axis angular velocity sensor 7Y, and a Z-axis angular velocity sensor 7Z as inertial sensors mounted on the circuit board 5, a package 2 having a main body 20 that houses the sensor board 3, and having a first surface, which is a bottom surface 2a, and a second surface, which is an top surface 2b, which are in a front-back relationship, and a side surface 2c that connects the bottom surface 2a and the top surface 2b, and a flexible wiring section 4 that is electrically connected to the sensor board 3 and extends outside the package 2 from the side surface 2c. The package 2 also has a first screw insertion hole 24 that penetrates the bottom surface 2a and the top surface 2b, and is fixed to the mounting board 91, which is the target object, by a screw N1 inserted through the first screw insertion hole 24. With this configuration, the sensor module 1 can be electrically connected to the mounting board 91 via the flexible wiring section 4. Therefore, it is not necessary to mount a connector on the circuit board 5 as in the conventional method. In this way, the mounting of a connector on the circuit board 5 is eliminated, and furthermore, by extending the flexible wiring section 4 to the outside from the side 2c of the package 2, the height of the sensor module 1 can be reduced.

[0039] Furthermore, as mentioned above, the circuit board 5 and the flexible wiring section 4 are composed of a rigid-flexible circuit board, which has a rigid circuit board 5 and a flexible circuit board 4. This configuration simplifies the device configuration of the sensor module 1. In addition, since the circuit board 5 and the flexible wiring section 4 can be electrically connected without using components such as connectors, the number of components can be reduced, and the sensor module 1 can be made lower profile and lighter.

[0040] Furthermore, as mentioned above, in a plan view of the lower surface 2a, the first screw insertion hole 24 is positioned on the opposite side of the flexible wiring section 4 from the center O of the lower surface 2a. With this configuration, the two fixing points that are fixed to the mounting substrate 91 can be spaced as far apart as possible, thereby improving the mounting stability of the sensor module 1.

[0041] <Second Embodiment> Figure 12 is a perspective view of the sensor module according to the second embodiment. Figure 13 is a cross-sectional view of the sensor module.

[0042] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the flexible wiring section 4 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0043] As shown in Figures 12 and 13, in the sensor module 1 of this embodiment, a second screw insertion hole 43 is formed in the flexible wiring section 4 through which a screw N2 is inserted. In addition, in the mounting substrate 91, a screw hole 922 is formed in the circuit board 92 into which the screw N2 is screwed.

[0044] As shown in Figure 13, in this configuration, the sensor module 1 is mounted on the mounting substrate 91 in the same manner as in the first embodiment described above, and then the sensor module 1 is fixed to the circuit board 92 by fastening a screw N2 inserted through the second screw insertion hole 43 into the screw hole 922. With this configuration, the sensor module 1 is fixed to the mounting substrate 91 by two screws N1 and N2, thus increasing the mounting stability of the sensor module 1. In addition, since the flexible wiring section 4 is fixed to the mounting substrate 91 by screw N2, unwanted vibrations of the flexible wiring section 4 can be effectively suppressed.

[0045] As described above, in the sensor module 1 of this embodiment, the flexible wiring section 4 has a second screw insertion hole 43 and is fixed to the mounting substrate 91, which is the object, by a screw N2 inserted through the second screw insertion hole 43. With this configuration, the mounting stability of the sensor module 1 is increased. In addition, since the flexible wiring section 4 is fixed to the mounting substrate 91 by the screw N2, unwanted vibrations of the flexible wiring section 4 can be effectively suppressed.

[0046] This second embodiment can also achieve the same effects as the first embodiment described above.

[0047] <Third Embodiment> Figure 14 is a cross-sectional view of the sensor module according to the third embodiment.

[0048] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the package 2 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0049] As shown in Figure 14, the package 2 has a columnar protrusion 25 that projects from the lower surface 2a. The protrusion 25 is located on the negative side in the Y-axis direction from the center O of the lower surface 2a. In other words, the protrusion 25 is located on the opposite side of the first screw insertion hole 24 from the center O. In contrast, the circuit board 92 of the mounting substrate 91 has a bottomed recess 923 into which the protrusion 25 is fitted.

[0050] In this configuration, the sensor module 1 is fixed to the circuit board 92 by engaging the protrusion 25 of the package 2 with the recess 923 and fastening the screw N1 inserted through the first screw insertion hole 24 to the screw hole 921. By engaging the protrusion 25 with the recess 923 in this way, the orientation of the sensor module 1 becomes more stable. Also, since the number of screws N1 used for fixing can be limited to one, as in the first embodiment described above, mounting the sensor module 1 to the mounting board 91 becomes easier. In particular, as in this embodiment, by positioning the protrusion 25 on the negative side of the Y-axis direction with respect to the center O, the first screw insertion hole 24 and the protrusion 25 can be separated as much as possible. As a result, the orientation of the sensor module 1 becomes even more stable.

[0051] As described above, in the sensor module 1 of this embodiment, the package 2 has a protrusion 25 that protrudes from the lower surface 2a, and the protrusion 25 engages with a recess 923 formed in the mounting substrate 91. With this configuration, the orientation of the sensor module 1 is more stable. In addition, since the number of screws N1 used for fixing can be reduced, mounting the sensor module 1 onto the mounting substrate 91 becomes easier.

[0052] This third embodiment can also achieve the same effects as the first embodiment described above. However, for example, the position and number of the protrusions 25 are not particularly limited.

[0053] <Fourth Embodiment> Figure 15 is a perspective view of the sensor module according to the fourth embodiment. Figure 16 is a bottom view of the sensor module. Figures 17 and 18 are bottom views showing modified examples of the sensor module, respectively.

[0054] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the package 2 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0055] As shown in Figure 15, in the sensor module 1 of this embodiment, the package 2 has a plurality of first screw insertion holes 24. On the other hand, although not shown, the circuit board 92 of the mounting substrate 91 has a plurality of screw holes 921 formed therein for fastening screws N1 that are inserted through each of the first screw insertion holes 24. In this way, because the package 2 has a plurality of first screw insertion holes 24, the sensor module 1 can be mounted on the mounting substrate 91 using a plurality of screws N1, thereby increasing the mounting stability of the sensor module 1.

[0056] In particular, in this embodiment, as shown in Figure 16, the package 2 has two first screw insertion holes 24 that are positioned opposite each other with respect to the center O of the lower surface 2a. In other words, the package 2 has two first screw insertion holes 24 that are located on opposite sides of each other with respect to the center O of the lower surface 2a. By arranging the two first screw insertion holes 24 in this positional relationship, the two first screw insertion holes 24 can be spaced as far apart as possible, thereby further increasing the mounting stability of the sensor module 1.

[0057] In this embodiment, two first screw insertion holes 24 are arranged diagonally across the lower surface 2a, but the arrangement of the first screw insertion holes 24 is not limited to this. For example, they may be arranged along the X-axis direction as shown in Figure 17, or along the Y-axis direction as shown in Figure 18. Also, the number of first screw insertion holes 24 is not limited to two, but may be three or more.

[0058] As described above, in the sensor module 1 of this embodiment, the package 2 has a plurality of first screw insertion holes 24. With this configuration, the mounting stability of the sensor module 1 is further enhanced.

[0059] Furthermore, as mentioned above, the package 2 has a pair of first screw insertion holes 24 that are positioned opposite each other with respect to the center O of the lower surface 2a.

[0060] This fourth embodiment can also achieve the same effects as the first embodiment described above.

[0061] <Fifth Embodiment> Figure 19 is a top view of the sensor module according to the fifth embodiment. Figure 20 is a cross-sectional view of the sensor module. Figure 21 is a top view showing a modified example of the sensor module.

[0062] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the package 2 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0063] As shown in Figures 19 and 20, in the sensor module 1 of this embodiment, the first screw insertion hole 24 is located on the negative side of the Y-axis with respect to the center O. The package 2 also has a fixing portion 26 that extends from the main body portion 20 along the lower surface 2a toward the positive side of the Y-axis. In other words, the fixing portion 26 is located on the opposite side of the flexible wiring portion 4 from the main body portion 20. The fixing portion 26 also has a third screw insertion hole 261 through which a screw N3 is inserted. As will be described later, the fixing portion 26 is fixed to the mounting substrate 91 by the screw N3 inserted through the third screw insertion hole 261. On the other hand, the circuit board 92 of the mounting substrate 91 has a screw hole 924 that is inserted through the third screw insertion hole 261 and fastens the screw N3.

[0064] The sensor module 1 with this configuration is fixed to the circuit board 92 by fastening a screw N1 inserted through the first screw insertion hole 24 to the screw hole 921, and a screw N3 inserted through the third screw insertion hole 261 to the screw hole 924. By mounting the sensor module 1 to the mounting board 91 using two screws N1 and N3 in this way, the mounting stability of the sensor module 1 is increased. In particular, since the fixing part 26 is located on the opposite side of the flexible wiring part 4 from the main body part 20, the two points located at both ends of the three fixing points (connector 41, screw N1, and screw N3), namely the connector 41 and screw N3, can be spaced as far apart as possible. Therefore, the mounting stability of the sensor module 1 is increased.

[0065] As described above, in the sensor module 1 of this embodiment, the package 2 has a fixing portion 26 that extends from the main body portion 20 along the lower surface 2a and is fixed to the mounting substrate 91. With this configuration, the mounting stability of the sensor module 1 is increased.

[0066] Furthermore, as mentioned above, in a plan view of the lower surface 2a, the fixing portion 26 is positioned on the opposite side of the flexible wiring portion 4 from the main body portion 20. This configuration enhances the mounting stability of the sensor module 1.

[0067] This fifth embodiment can also achieve the same effects as the first embodiment described above. However, the configuration of the sensor module 1 is not particularly limited, and for example, as shown in Figure 21, a pair of fixed parts 26 may be arranged along the X-axis direction.

[0068] <Sixth Embodiment> Figure 22 is a top view of the sensor module according to the sixth embodiment. Figure 23 is a top view showing a modified example of the sensor module.

[0069] The sensor module 1 of this embodiment is the same as that of the first embodiment described above, except that the configuration of the package 2 is different. In the following description, this embodiment will be described mainly in terms of the differences from the first embodiment described above, and similar matters will not be described. Also, in the figures of this embodiment, the same reference numerals are used for components that are the same as those in the previously described embodiment.

[0070] As shown in Figure 22, in the sensor module 1 of this embodiment, the package 2 has a pair of fixing parts 26 that extend from the main body 20 along the lower surface 2a toward the negative side in the Y-axis direction. That is, the pair of fixing parts 26 are located on the same side as the flexible wiring part 4 relative to the main body 20. Also, the pair of fixing parts 26 are arranged side by side in the X-axis direction. Furthermore, in a plan view from the Z-axis direction, the pair of fixing parts 26 are positioned on both sides of the flexible wiring part 4 and do not overlap with the flexible wiring part 4. Therefore, it is easier to insert screws N3 through the third screw insertion holes 261 formed in each fixing part 26. With this configuration, the sensor module 1 is fixed to the mounting substrate 91 by two screws N3 in addition to one screw N1, thus increasing the mounting stability of the sensor module 1.

[0071] As described above, in the sensor module 1 of this embodiment, in a plan view of the lower surface 2a, the fixing portion 26 is located on the same side as the flexible wiring portion 4 relative to the main body portion 20, and a pair of fixing portions are arranged so as to be located on both sides of the flexible wiring portion 4. With this configuration, the mounting stability of the sensor module 1 is increased.

[0072] This sixth embodiment can also achieve the same effects as the first embodiment described above. However, the configuration of the sensor module 1 is not particularly limited, and for example, as shown in Figure 23, one fixed part 26 may be arranged so as to overlap with the flexible wiring part 4.

[0073] Although the sensor module of the present invention has been described above based on the illustrated embodiment, the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having a similar function. Furthermore, other arbitrary configurations may be added to the present invention. Also, each embodiment may be combined as appropriate.

[0074] For example, as shown in Figure 24, the package 2 may be composed of a resin mold M. [Explanation of symbols]

[0075] 1...Sensor module, 2...Package, 2a...Bottom, 2b...Top, 2c...Side, 20...Main body, 22...Inner case, 221...Mounting base, 222...Positioning projection, 23...Outer case, 24...First screw insertion hole, 25...Protrusion, 26...Fixing part, 261...Third screw insertion hole, 3...Sensor board, 4...Flexible wiring section, 41...Connector, 42...Rigid board, 43...Second screw insertion hole, 5...Circuit board, 6...Accelerometer, 61...Package, 62x...Sensor element, 62y...Sensor element, 62z...Sensor element, 7X ...axis angular velocity sensor, 7Y...Y-axis angular velocity sensor, 7Z...Z-axis angular velocity sensor, 71...package, 72...sensor element, 720...base, 721...detection vibration arm, 722...drive vibration arm, 8...circuit element, 91...mounting board, 92...circuit board, 921...screw hole, 922...screw hole, 923...recess, 924...screw hole, 93...connector, Ax...acceleration, Ay...acceleration, Az...acceleration, J...detection axis, M...resin mold, N1...screw, N2...screw, N3...screw, O...center, ω...angular velocity, ωx...angular velocity, ωy...angular velocity, ωz...angular velocity

Claims

1. A sensor board having a circuit board and an inertial sensor mounted on the circuit board, A package having a main body that houses the sensor substrate, having a first surface and a second surface that are in a front-back relationship, and a side surface connecting the first surface and the second surface, It has a flexible wiring portion that is electrically connected to the sensor substrate and extends from the side to the outside of the package, The package has a first screw insertion hole that penetrates the first surface and the second surface, A sensor module characterized by being fixed to an object by a screw inserted through the first screw insertion hole.

2. The sensor module according to claim 1, wherein the circuit board and the flexible wiring section are composed of a rigid-flexible substrate having a rigid substrate which is the circuit board and a flexible substrate which is the flexible wiring section.

3. In a plan view of the first surface, The sensor module according to claim 1, wherein the first screw insertion hole is located on the opposite side of the flexible wiring portion from the center of the first surface.

4. The package is a sensor module according to claim 1, having a plurality of first screw insertion holes.

5. The sensor module according to claim 4, wherein the package has a pair of first screw insertion holes that are arranged opposite each other through the center of the first surface.

6. The aforementioned flexible wiring section has a second screw insertion hole, The sensor module according to claim 1, which is fixed to the object by a screw inserted through the second screw insertion hole.

7. The sensor module according to claim 1, wherein the package has a fixing portion that extends from the main body portion along the first surface and is fixed to the object.

8. In a plan view of the first surface, The sensor module according to claim 7, wherein the fixing portion is arranged on the opposite side of the main body from the flexible wiring portion.

9. In a plan view of the first surface, The sensor module according to claim 7, wherein the fixed portion is located on the same side as the flexible wiring portion with respect to the main body portion and is arranged in pairs on both sides of the flexible wiring portion.

10. The sensor module according to claim 1, wherein the package has a protrusion projecting from the first surface, and the protrusion engages with the object.

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