Method for manufacturing a meta-optical element and method for manufacturing a laminate for forming a meta-optical element

Abstract

To provide a method for manufacturing meta-optical elements with excellent productivity. [Solution] The method for manufacturing a meta-optical element comprises, in this order: obtaining a processing laminate using the exposed surface of the resin layer of a support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, where the exposed surface of the resin layer exhibits easy peelability, and the third main surface of a processing substrate having a third main surface and a fourth main surface and a thickness of 0.1 to 1.0 mm as the lamination surface; grinding the fourth main surface of the processing substrate until its thickness is 0.05 to 0.4 mm; polishing the fourth main surface of the ground processing substrate until the thickness variation of the entire processing laminate is 10 μm or less to obtain a substrate for forming a meta-optical element; forming a plurality of nanostructures on the polished surface of the substrate for forming a meta-optical element; and separating the substrate for forming a meta-optical element having a plurality of nanostructures from the support substrate with a resin layer.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a meta-optical element and a method for manufacturing a laminate for forming a meta-optical element.

Background Art

[0002] A general meta-optical element is configured to form a three-dimensional structure on the order of sub-μm shorter than the visible light wavelength, called a meta-atom, in an arbitrary pattern on the surface of a transparent substrate that transmits visible light, and to exhibit functions such as diffraction for a specific wavelength. Examples of the transparent substrate that transmits visible light used here include a quartz substrate and an alkali-free glass. Since the transparent substrate is a member that does not perform functions such as light diffraction, phase, and amplitude adjustment, thinning the transparent substrate can thin the meta-optical element itself. Although a transparent substrate thinned in advance can be used, there are problems such as cracking during wafer transfer, warping after film formation, and pattern defects caused by focus errors in the lithography process due to the deflection of the substrate.

[0003] As a method of preparing a glass substrate laminate by bonding a pre-thinned transparent substrate to a support substrate that functions as a reinforcing material for the transparent substrate and then using it in the manufacturing process of a display device panel, for example, the method described in Patent Document 1 is known. In addition, a method for manufacturing an electronic device is disclosed in Patent Document 2, in which a transparent substrate is bonded to a support substrate that functions as a reinforcing material for the transparent substrate to form a laminate, then the transparent substrate is thinned, and then a member for an electronic device is formed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

[0005] Although the laminates described in Patent Document 1 or 2 exhibit sufficient flatness for the manufacture of display panel and electronic device components, further flatness may be required when these laminates are applied to the manufacture of meta-optical elements. Furthermore, when forming meta-optical elements, high-temperature processes exceeding 300°C, such as film deposition and annealing, may be performed, and the laminated layer, which consists of resin components constituting the laminate, may require even greater high-temperature durability. On the other hand, to thin the meta-optical element by making the transparent substrate thinner than a certain thickness, one possible method is to perform a backgrinding treatment on the transparent substrate as a post-processing step after all processes for forming the meta-optical element are completed. However, applying the backgrinding treatment commonly used for silicon substrates to transparent substrates such as quartz or alkali-free glass can cause defects such as cracking and chipping of the transparent substrate, leading to a decrease in yield. This disclosure is made in view of the above-mentioned prior circumstances, and one aspect of this disclosure aims to provide a method for manufacturing a meta-optical element with excellent productivity. Another aspect of this disclosure aims to provide a method for manufacturing a meta-optical element forming laminate used in the manufacture of a meta-optical element. [Means for solving the problem]

[0006] The specific means for achieving the aforementioned objectives are as follows: <1> A support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the support substrate with a resin layer exhibits easy peelability, and the first main surface of a substrate for forming a meta-optical element having a first main surface and a second main surface, with a thickness of 0.05 to 0.4 mm and a thickness variation of 10 μm or less, are used as the lamination surfaces to obtain a laminate for forming a meta-optical element by closely laminating the support substrate with a resin layer and the substrate for forming a meta-optical element. Forming a plurality of nanostructures on the second main surface of the substrate for forming the meta-optical element, which constitutes the laminate for forming the meta-optical element, To obtain a meta-optical element comprising the plurality of nanostructures by separating the substrate for forming the meta-optical element having the plurality of nanostructures from the support substrate with the resin layer, A method for manufacturing a meta-optical element having the elements in this order. <2> The overall thickness variation of the laminate for forming the meta-optical element is 10 μm or less. <1> A method for manufacturing a meta-optical element as described above. <3> A support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the resin-layered support substrate exhibits easy peelability, and the third main surface of a processing substrate having a third main surface and a fourth main surface with a thickness of 0.1 to 1.0 mm, are used as the lamination surfaces to obtain a processing laminate by closely laminating the resin-layered support substrate and the processing substrate. The fourth main surface of the processing substrate constituting the processing laminate is ground until the thickness of the processing substrate is 0.05 to 0.4 mm. The fourth main surface of the ground processing substrate is polished until the thickness variation of the entire processing laminate is 10 μm or less to obtain a substrate for forming a meta-optical element having a polished surface. Forming a plurality of nanostructures on the polished surface of the substrate for forming the meta-optical element, To obtain a meta-optical element comprising the plurality of nanostructures by separating the substrate for forming the meta-optical element having the plurality of nanostructures from the support substrate with the resin layer, A method for manufacturing a meta-optical element having the elements in this order. <4> The support substrate with the resin layer is obtained by forming a resin layer-forming composition layer on one surface of the support substrate, leaving the support substrate with the resin layer-forming composition layer to stand for a predetermined time, and then curing the resin layer-forming composition layer to fix the resin layer on one surface of the support substrate. <1> ~ <3> A method for manufacturing a meta-optical element as described in any one of the items. <5> The thickness of the resin layer is 2 to 15 μm. <1> ~ <4> A method for manufacturing a meta-optical element as described in any one of the items. <6> The resin in the aforementioned resin layer is a silicone resin. <1> ~ <5> A method for manufacturing a meta-optical element as described in any one of the items. <7> The support substrate is a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate. <1> ~ <6> A method for manufacturing a meta-optical element as described in any one of the items. <8> A method for manufacturing a laminate for forming a meta-optical element, comprising: a support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the support substrate has an easily peelable surface, and the first main surface of a substrate for forming a meta-optical element having a first main surface and a second main surface, a thickness of 0.05 to 0.4 mm, and a thickness variation of 10 μm or less, and the support substrate with a resin layer having a thickness variation of 10 μm or less, and the substrate for forming a meta-optical element being closely laminated, with the exposed surface of the resin layer of the support substrate having a thickness variation of 10 μm or less and the exposed surface of the resin layer having an easily peelable surface, and the first main surface of a substrate for forming a meta-optical element having a thickness of 0.05 to 0.4 mm and a thickness variation of 10 μm or less, as the lamination surface. <9> The overall thickness variation of the laminate for forming the meta-optical element is 10 μm or less. <8> A method for manufacturing a laminate for forming a meta-optical element as described above. <10> A support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the resin-layered support substrate exhibits easy peelability, and the third main surface of a processing substrate having a third main surface and a fourth main surface with a thickness of 0.1 to 1.0 mm, are used as the lamination surfaces to obtain a processing laminate by closely laminating the resin-layered support substrate and the processing substrate. The fourth main surface of the processing substrate constituting the processing laminate is ground until the thickness of the processing substrate is 0.05 to 0.4 mm. The fourth main surface of the ground substrate for processing is polished until the thickness variation of the entire laminate for processing is 10 μm or less, A method for manufacturing a laminate for forming a meta-optical element, having the elements in this order. <11> The support substrate with the resin layer is obtained by forming a resin layer-forming composition layer on one surface of the support substrate, leaving the support substrate with the resin layer-forming composition layer to stand for a predetermined time, and then curing the resin layer-forming composition layer to fix the resin layer on one surface of the support substrate. <8> ~ <10> A method for manufacturing a laminate for forming a meta-optical element, as described in any one of the items. <12> The thickness of the resin layer is 2 to 15 μm. <8> ~ <11> A method for manufacturing a laminate for forming a meta-optical element, as described in any one of the items. <13> The resin in the aforementioned resin layer is a silicone resin. <8> ~ <12> A method for manufacturing a laminate for forming a meta-optical element, as described in any one of the items. <14> The support substrate is a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate. <8> ~ <13> A method for manufacturing a laminate for forming a meta-optical element, as described in any one of the items. [Effects of the Invention]

[0007] According to one embodiment of this disclosure, a method for manufacturing a meta-optical element with excellent productivity can be provided. Furthermore, according to another embodiment of this disclosure, a method for manufacturing a laminate for forming a meta-optical element used in the manufacture of a meta-optical element can be provided. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic cross-sectional view showing an example of a laminate 10. [Figure 2] This is a schematic cross-sectional view showing an example of a processed laminate 30. [Modes for carrying out the invention]

[0009] In this disclosure, a numerical range indicated using "~" means a range that includes the numbers before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described step by step in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the upper limit value or the lower limit value of the numerical range described in other step-by-step descriptions. Also, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value described in a certain numerical range may be replaced with the value shown in the examples. In the present disclosure, a combination of two or more preferred embodiments is a more preferred embodiment. In the present disclosure, the amount of each component means the total amount of a plurality of substances when there are a plurality of substances corresponding to each component, unless otherwise specified. In the present disclosure, the peel strength at the interface between the support substrate and the resin layer being higher than the peel strength at the interface between the resin layer and the substrate for forming the meta-optical element is hereinafter referred to as the resin layer and the substrate for forming the meta-optical element being detachably adhered, and the support substrate and the resin layer being fixed. In the present disclosure, the thickness variation (TTV) conforms to the definition and calculation of the SEMI standard (MF533-1109). For a substrate in a state where the back surface of the substrate (or laminate) is adsorbed and fixed to a flat chuck surface, it is the value obtained by subtracting the distance from the lowest point to the distance from the highest point from the back surface of the substrate. Note that the sizes of the members in each figure are conceptual, and the relative size relationships between the members are not limited thereto. Also, members having substantially the same function may be given the same reference numerals throughout the drawings, and duplicate explanations may be omitted.

[0010] <Method for manufacturing a meta-optical element> The manufacturing method of the first meta-optical element of the present disclosure includes a support substrate with a plate thickness variation of 10 μm or less and a resin layer fixed to one surface of the support substrate, wherein the exposed surface of the resin layer exhibits easy peelability. Using the exposed surface of the resin layer of the support substrate with the resin layer and the first main surface of a meta-optical element forming substrate having a first main surface and a second main surface, a thickness of 0.05 to 0.4 mm, and a plate thickness variation of 10 μm or less as a lamination surface, laminating the support substrate with the resin layer and the meta-optical element forming substrate in close contact to obtain a laminated body for forming a meta-optical element (hereinafter, may be referred to as a lamination step), forming a plurality of nanostructures on the second main surface of the meta-optical element forming substrate constituting the laminated body for forming a meta-optical element (hereinafter, may be referred to as a forming step), and separating the meta-optical element forming substrate having the plurality of nanostructures from the support substrate with the resin layer to obtain a meta-optical element having the plurality of nanostructures (hereinafter, may be referred to as a separation step), which are carried out in this order. In the manufacturing method of the first meta-optical element of the present disclosure, nanostructures constituting the meta-optical element are formed using a laminated body composed of a support substrate with a plate thickness variation of 10 μm or less and a meta-optical element forming substrate with a plate thickness variation of 10 μm or less. Therefore, for example, the occurrence of pattern defects caused by focus errors in the lithography process due to the deflection of the substrate is likely to be suppressed, and it is presumed that the productivity of the meta-optical element is excellent.

[0011] Hereinafter, the details of the manufacturing method of the first meta-optical element of the present disclosure will be described with reference to the drawings. At the same time, the manufacturing method of the laminated body for forming the first meta-optical element of the present disclosure, which includes laminating in close contact the support substrate with the resin layer and the meta-optical element forming substrate, using the exposed surface of the resin layer of the support substrate with the resin layer, which has a support substrate with a plate thickness variation of 10 μm or less and a resin layer fixed to one surface of the support substrate, and the exposed surface of the resin layer exhibits easy peelability, and the first main surface of the meta-optical element forming substrate having a first main surface and a second main surface, a thickness of 0.05 to 0.4 mm, and a plate thickness variation of 10 μm or less as the lamination surface, will also be described. The first method for manufacturing a laminate for forming a meta-optical element according to this disclosure comprises a lamination step, a formation step, and a separation step in that order, and may optionally include other steps such as a cleaning step and an annealing step.

[0012] In the lamination process, the resin-coated support substrate, which includes a support substrate with a resin layer exhibiting a predetermined thickness variation, and the first main surface of the substrate for forming a meta-optical element, which has a first main surface and a second main surface and has a predetermined thickness and thickness variation, are used as the lamination surfaces, and the resin-coated support substrate and the substrate for forming a meta-optical element are closely laminated to obtain a meta-optical element forming laminate. Hereinafter, the "meta-optical element forming laminate" will also be simply referred to as the laminate. By carrying out the lamination process, a laminate is obtained that will be used in the formation and separation processes described later.

[0013] Figure 1 is a schematic cross-sectional view showing an example of a laminate 10. As shown in Figure 1, the laminate 10 is composed of a support substrate 12, a substrate 14 for forming meta-optical elements, and a resin layer 16 provided between the support substrate 12 and the substrate 14. The support substrate 12 and the resin layer 16 constitute a support substrate 18 with a resin layer. One side of the resin layer 16 is fixed to the support substrate 12, and the other side is an exposed surface. The other side (exposed surface) is in contact with the first main surface 14a of the meta-optical element forming substrate 14, and the interface between the resin layer 16 and the meta-optical element forming substrate 14 is tightly adhered and peelable. In other words, the resin layer 16 is easily peelable from the first main surface 14a of the meta-optical element forming substrate 14. The resin-coated support substrate 18 reinforces the metal-optical element formation substrate 14 during the formation process for manufacturing metal-optical elements such as metallenses.

[0014] The laminate 10 is used until the formation process. That is, the laminate 10 is used until multiple nanostructures are formed on the second main surface 14b of the meta-optical element formation substrate 14. Therefore, the thickness variation of the laminate 10 as a whole is preferably 10 μm or less, and more preferably 5 μm or less. Furthermore, from the viewpoint of productivity, the thickness variation of the laminate 10 as a whole is preferably 0.5 μm or more. After multiple nanostructures are formed, the resin-layered support substrate 18 is peeled off at the interface between the resin layer 16 and the meta-optical element forming substrate 14, and the resin-layered support substrate 18 does not become part of the meta-optical element. The separated resin-layered support substrate 18 may be laminated with a new meta-optical element forming substrate 14 and reused as a laminate 10.

[0015] The support substrate 12 works in cooperation with the resin layer 16 to support and reinforce the meta-optical element formation substrate 14, preventing deformation, scratching, and damage to the meta-optical element formation substrate 14 during the manufacturing of nanostructures in the formation process described later. Another purpose of using the support substrate 12 is that when using a meta-optical element formation substrate that is thinner than conventional substrates, the laminate 10 can be made to have the same thickness as a conventional meta-optical element formation substrate, allowing the use of manufacturing technologies and equipment suitable for conventional thickness meta-optical element formation substrates in the formation process.

[0016] The support substrate 12 is not particularly limited as long as its thickness variation is 10 μm or less. Examples of support substrates 12 include glass plates, silicon wafers, synthetic resin plates, and metal plates. From a productivity standpoint, the thickness variation of the support substrate 12 may be 0.5 μm or more. When a glass plate is used as the support substrate 12, various types of glass can be used, such as glass containing alkali metal oxides (e.g., soda-lime glass) or alkali-free glass. Among these, alkali-free glass is preferred because it has a low thermal shrinkage rate. Furthermore, if the support substrate 12 is a glass plate, it can be obtained by polishing a glass plate formed by the float method, fusion method, slot-down draw method, full-coal method, rubber method, etc., using a standard method until the plate thickness variation is 10 μm or less, as needed. When the support substrate 12 is a silicon wafer, it can be obtained by lapping or grinding one or both sides of an azu slice wafer cut from a silicon single crystal ingot, and then polishing it by a standard method until the thickness variation is 10 μm or less. When a synthetic resin plate is used as the support substrate 12, there are no particular limitations on its type. Examples include polyethylene terephthalate resin, polycarbonate resin, polyimide resin, fluororesin, polyamide resin, polyaramid resin, polyethersulfone resin, polyetherketone resin, polyetheretherketone resin, polyethylene naphthalate resin, polyacrylic resin, various liquid crystal polymer resins, and silicone resins. When a metal plate is used as the support substrate 12, there are no particular restrictions on its type; for example, stainless steel, copper, etc., are examples. When the formation process of the support substrate 12 involves heat treatment, it is preferable that the support substrate 12 be made of a material with a small difference in coefficient of linear expansion from the substrate 14 for forming the meta-optical element, and more preferably that it be made of the same material as the substrate 14 for forming the meta-optical element.

[0017] The thickness of the support substrate 12 may be thicker, thinner, or the same as the substrate 14 for forming the meta-optical element. The thickness of the support substrate 12 is selected based on the thickness of the laminate 10, the thickness of the resin layer 16, and the thickness of the substrate 14 for forming the meta-optical element. From the viewpoint of having the support substrate 12 function as a reinforcing material for the substrate 14 for forming the meta-optical element, it is preferable that the thickness of the support substrate 12 is thicker than that of the substrate 14 for forming the meta-optical element. For example, if the formation process is designed to process a substrate with a thickness of 1 mm, and the sum of the thickness of the meta-optical element formation substrate 14 and the thickness of the resin layer 16 is 0.5 mm, then the thickness of the support substrate 12 is set to 0.5 mm. The thickness of the support substrate 12 is usually between 0.2 and 5.0 mm.

[0018] When the support substrate 12 is a glass plate, the thickness of the support substrate 12 is preferably 0.08 mm or more for reasons such as ease of handling and resistance to breakage. Furthermore, the thickness of the support substrate 12 is preferably 1.0 mm or less because it is desirable to have sufficient rigidity to allow for moderate bending without breaking when peeling after the formation of the nanostructure.

[0019] The resin layer 16 is fixed to one side of the support substrate 12 and adheres to the meta-optical element forming substrate 14 in a peelable manner. The resin layer 16 prevents the meta-optical element forming substrate 14 from shifting position until the separation operation is performed. Furthermore, the resin layer 16 can be easily peeled off from the meta-optical element forming substrate 14 during the separation operation, preventing damage to the meta-optical element forming substrate 14 and other components during the separation operation. In addition, since the resin layer 16 is fixed to the support substrate 12, the resin layer 16 and the support substrate 12 do not separate during the separation operation, and a support substrate 18 with the resin layer is obtained through the separation operation. It is preferable to establish a peeling starting point at the interface between the resin layer 16 and the meta-optical element forming substrate 14 when starting the separation operation, so that the interface can be easily peeled off during the separation operation. The surface 16a of the resin layer 16 that is in contact with the substrate 14 for forming the meta-optical element adheres to the first main surface 14a of the substrate 14 in a peelable manner. This property of the surface 16a of the resin layer 16 adhering to the substrate 14 in a peelable manner is called peelability (peelability).

[0020] In this disclosure, the above-mentioned fixation and (peelable) adhesion differ in peel strength (i.e., the stress required for peeling), meaning that fixation has greater peel strength than adhesion. Furthermore, peelable adhesion means that it is peelable and at the same time peelable without causing peeling of the fixed surface. Specifically, in the laminate 10, when the operation to separate the meta-optical element forming substrate 14 and the support substrate 12 is performed, it means that peeling occurs at the adhered surface, but not at the fixed surface. Therefore, when the operation to separate the laminate 10 into the meta-optical element forming substrate 14 and the support substrate 12 is performed, the laminate 10 is separated into the meta-optical element forming substrate 14 and the resin layered support substrate 18.

[0021] Preferably, the resin layer 16 is fixed to the surface of the support substrate 12 by a strong bonding force such as adhesive strength or tackiness. For example, by reaction-curing a reaction-curable resin on the surface of the support substrate 12, the cured resin adheres to the surface of the support substrate 12. Alternatively, the bonding force between the surface of the support substrate 12 and the resin layer 16 can be increased by applying a treatment that generates a strong bonding force between the surface of the support substrate 12 and the resin layer 16 (for example, a treatment using a coupling agent). On the other hand, the resin layer 16 is preferably bonded to the first main surface 14a of the substrate 14 for forming the meta-optical element with a weak bonding force, for example, by a bonding force resulting from van der Waals forces between solid molecules. The surface 16a of the resin layer 16 before contact with the substrate 14 for forming the meta-optical element is preferably an easily peelable surface, and by bringing this easily peelable surface 16a of the resin layer 16 into contact with the first main surface 14a of the substrate 14 for forming the meta-optical element, the two surfaces can be bonded with a weak bonding force. In other words, if the surface 16a of the resin layer 16 is easily peelable, the peelability at the interface with the first main surface 14a of the substrate 14 for forming the meta-optical element will be better. The two surfaces are in contact without any gaps, and this state is referred to as close contact in this disclosure.

[0022] As described above, the bonding force of the resin layer 16 to the surface of the support substrate 12 is relatively higher than the bonding force of the resin layer 16 to the first main surface 14a of the meta-optical element forming substrate 14. Therefore, the peel strength between the resin layer 16 and the support substrate 12 is higher than the peel strength between the resin layer 16 and the meta-optical element forming substrate 14. It is preferable that the resin layer 16 and the support substrate 12 are bonded by adhesive or bonding. However, it is not limited to this, and the resin layer 16 and the support substrate 12 may be bonded by forces resulting from other bonding forces, as long as the bonding force is relatively higher than the bonding force of the resin layer 16 to the meta-optical element forming substrate 14.

[0023] The surface 16a of the resin layer 16 may be treated by methods such as: setting the support substrate 12 equipped with the resin layer forming composition layer (hereinafter also referred to as the resin layer forming composition layer) on the support substrate 12 after forming the resin layer 16 using the resin layer forming composition used when forming the resin layer 16, before curing; pressing a flattening member having a flat surface onto the surface of the resin layer 16 (preferably under a heated environment) to transfer the flatness; or etching the surface of the resin layer 16, from the viewpoint of reducing variations in the plate thickness of the entire laminate 10.

[0024] The thickness of the resin layer 16 is not particularly limited. The thickness of the resin layer 16 may be thicker than, thinner than, or the same as the substrate 14 for forming the meta-optical element or the support substrate 12.

[0025] The thickness of the resin layer 16 is not particularly limited, but from the viewpoint of reducing variations in the overall thickness of the laminate 10, it is preferably 15 μm or less, more preferably 2 to 15 μm, and even more preferably 2 to 10 μm. When the thickness of the resin layer 16 is within this range, there is a tendency for sufficient adhesion between the resin layer 16 and the substrate 14 for forming the meta-optical element. Furthermore, even if air bubbles or foreign matter are interposed between the resin layer 16 and the substrate 14 for forming the meta-optical element, there is a tendency for variations in the overall thickness of the laminate 10 to be suppressed.

[0026] The resin layer 16 may consist of two or more layers. In this case, "thickness of resin layer 16" refers to the total thickness of all resin layers. Furthermore, if the resin layer 16 consists of two or more layers, the types of resins forming each resin layer may be different.

[0027] The resin layer 16 is preferably made of a material whose glass transition temperature is lower than room temperature (around 25°C) or which does not have a glass transition temperature. This is because it can be more easily peeled off from the substrate 14 for forming the meta-optical element, and at the same time, sufficient adhesion to the substrate 14 for forming the meta-optical element is achieved.

[0028] Furthermore, since the resin layer 16 is often heat-treated during the formation process, it is preferable that it has heat resistance. The thermal decomposition start temperature of the resin layer 16 can be 400°C or higher in the state of the laminate 10. A heat resistance temperature of 420°C or higher is more preferable, and 430°C to 450°C is particularly preferable. Within the above range, even if the laminate 10 is exposed to high-temperature conditions during the nanostructure manufacturing process, the decomposition of the resin layer 16 is suppressed, and the occurrence of foaming in the laminate 10 is further suppressed.

[0029] The type of resin used to form the resin layer 16 is not particularly limited. Examples include acrylic resin, polyolefin resin, polyurethane resin, or silicone resin. Several types of resin can also be mixed and used. Among these, silicone resin is preferred. This is because silicone resin has excellent heat resistance and release properties. Also, when the support substrate 12 is a glass plate, it is easy to fix to the glass plate by a condensation reaction with the silanol groups on the surface of the glass plate. Another advantage of the silicone resin layer is that, when placed between the support substrate 12 and the substrate 14 for forming the meta-optical element, its release properties do not deteriorate significantly even when treated in air at approximately 200°C for about an hour.

[0030] The resin layer 16 is preferably made of a silicone resin (cured product) used for release paper, among other silicone resins. The silicone resin in the release layer of the release paper is formed by curing a layer of curable silicone resin composition coated on the release paper. A resin layer made of cured silicone resin formed by using this curable silicone resin composition and curing it on the surface of the support substrate 12 is preferable because it adheres to the surface of the support substrate 12 and its free surface has excellent peelability. Furthermore, because it is highly flexible, even if foreign matter such as air bubbles or dust particles are mixed between the resin layer 16 and the substrate 14 for forming the meta-optical element, the occurrence of distortion defects in the substrate 14 for forming the meta-optical element can be suppressed.

[0031] The curable silicone resin compositions used to form the resin layer 16 are classified according to their curing mechanism into condensation reaction type silicone resin compositions, addition reaction type silicone resin compositions, ultraviolet curable type silicone resin compositions, and electron beam curable type silicone resin compositions, and any of these can be used. Among these, the addition reaction type silicone resin composition is preferred. This is because it is easy to cure, the degree of peelability of the surface 16a of the cured resin layer 16 is good, and it also has high heat resistance.

[0032] The silicone resin forming the resin layer 16 (cured product of the above-mentioned curable silicone resin composition) preferably has the property that components such as low molecular weight silicone in the silicone resin layer do not easily migrate to the substrate 14 for forming the meta-optical element, i.e., it has low silicone migration properties.

[0033] The method for fixing the resin layer 16 onto the support substrate 12 is not particularly limited. For example, a resin layer forming step may be performed before the lamination step to form and fix an easily peelable resin layer 16 on the support substrate 12. For example, a resin layer forming step may be performed to form a resin layer 16 by applying a resin layer forming composition (curable resin composition) to the support substrate 12. More specifically, a method is preferred in which a resin layer forming composition layer that will become the resin layer 16 is formed on one surface of the support substrate 12, and then the resin layer forming composition is cured to form a resin layer 16 fixed on the support substrate 12. Furthermore, the resin layer 16 can also be formed by, for example, fixing a film-like resin to the surface of the support substrate 12. Specifically, in order to impart high fixing force (high peel strength) to the surface of the support substrate 12, a surface modification treatment (priming treatment) is performed on the surface of the support substrate 12, and the film is then fixed onto the support substrate 12. Examples include chemical methods that chemically improve fixing force, such as silane coupling agents (primer treatment), physical methods that increase surface active groups, such as flame treatment, and mechanical treatment methods that increase grip by increasing surface roughness, such as sandblasting.

[0034] In a method for forming a resin layer 16 by forming a resin layer composition layer on the surface of a support substrate 12, and then curing the resin layer composition layer, one method for forming the resin layer composition layer on the surface of the support substrate 12 is to coat the support substrate 12 with the resin layer composition. Examples of coating methods include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. One of these methods can be appropriately selected depending on the type of resin composition.

[0035] Furthermore, when coating the resin layer-forming composition that will become the resin layer 16 onto the support substrate 12, the amount to be applied is 1 to 100 g / m². 2 Preferably, 5-20 g / m 2 This is preferable.

[0036] When a resin layer forming composition contains a solvent and a resin, from the viewpoint of reducing variations in the overall thickness of the laminate 10, it is preferable to reduce the solvent content in the resin layer forming composition to 70% by mass or less, more preferably 60% by mass or less, and even more preferably 50% by mass or less, based on the total amount of the composition when manufacturing the resin layer 16. By adjusting the amount of solvent within the above range, the amount of solvent that evaporates from the formed layer of composition is suppressed, and variations in the overall thickness of the laminate 10 can be reduced. As for the lower limit of the amount of solvent, there is no particular limit as long as the resin layer forming composition can be applied, but from the viewpoint of handling, etc., 30% by mass or more is preferable.

[0037] The type of solvent used in the resin layer forming composition is not particularly limited, but from the viewpoint of reducing variations in the overall thickness of the laminate 10, it is preferable to use a solvent with a boiling point of 100°C or lower. Furthermore, the viscosity of the resin layer-forming composition is preferably 40 mPas or less, and more preferably 20 mPas or less, from the viewpoint of reducing variations in the overall thickness of the laminate 10. There is no particular lower limit, but from the viewpoint of the film-forming properties of the composition, 3 mPas or more is preferred.

[0038] The resin included in the resin layer forming composition is a resin capable of forming the aforementioned resin layer, and among these, curable silicone is preferred.

[0039] For example, when forming a resin layer 16 from an addition-reaction type silicone resin composition, a resin layer-forming composition X consisting of a mixture of organoalkenylpolysiloxane, organohydrogenpolysiloxane, and a catalyst is applied onto a support substrate 12 by a known method such as the spray coating method described above, and then heat-cured. The heat curing conditions vary depending on the amount of catalyst used, but the reaction is carried out in air at 50-250°C, preferably 100-200°C. The reaction time in this case is 5-60 minutes, preferably 10-30 minutes.

[0040] By heating and curing the resin layer-forming composition X, the silicone resin chemically bonds with the support substrate 12 during the curing reaction, and the silicone resin layer also bonds with the support substrate 12 through an anchoring effect, resulting in adhesion. Through these actions, the silicone resin layer is firmly fixed to the support substrate 12. Even when forming a resin layer made of a resin other than silicone resin from the resin layer-forming composition, the resin layer 16 fixed to the support substrate 12 can be formed in the same manner as described above.

[0041] In a method for forming a resin layer 16 on the surface of a support substrate 12, and then curing the resin layer 16 to fix it on the support substrate 12, it is preferable to leave the support substrate 12 with the resin layer 16 undisturbed after the resin layer 16 is formed but before it hardens, in order to obtain a more flat resin layer 16. In other words, it is preferable that the support substrate 18 with the resin layer is obtained by forming a resin layer 16 on one surface of the support substrate 12, leaving the support substrate 12 with this resin layer 16 undisturbed for a predetermined time, and then curing the resin layer 16 to fix it on one surface of the support substrate 12. By allowing the material to stand for a predetermined time, the flatness of the surface of the resin layer forming composition layer is improved, and volatile components contained in the resin layer forming composition layer are removed, which further suppresses surface roughness of the resin layer 16 during curing. The temperature at which the material is left to stand is not particularly limited; it should be left at a temperature lower than the heating temperature used during curing. A temperature of 0 to 100°C is preferred, and 0 to room temperature (around 25°C) is more preferred. The standing time is not particularly limited, but 30 seconds to 1 hour is preferred, and 1 to 10 minutes is more preferred, as it provides a better balance between the flatness of the resin layer 16 and productivity. Furthermore, if necessary, the material may be left to stand under reduced pressure. The conditions for reduced pressure are not particularly limited, but 1 to 1000 Pa is preferred, and 10 to 1000 Pa is more preferred, as it provides a better balance between the flatness of the resin layer 16 and the efficiency of the operation.

[0042] The substrate 14 for forming the meta-optical element has a first main surface 14a and a second main surface 14b, and is fine as long as it has a thickness of 0.05 to 0.4 mm and a plate thickness variation of 10 μm or less. The first main surface 14a of the substrate 14 for forming the meta-optical element is in close contact with the resin layer 16, and a plurality of nanostructures are provided on the second main surface 14b, which is opposite to the resin layer 16. For this reason, it is preferable that the second main surface 14b of the substrate 14 for forming the meta-optical element is polished. The method of polishing the second main surface 14b is not particularly limited, and the physical polishing method, chemical polishing method, or chemical mechanical polishing method described later can be applied. The first main surface 14a of the substrate 14 for forming the meta-optical element may also be polished to adjust for plate thickness variations of the substrate 14. The type of substrate 14 for forming the meta-optical element can be a general type, such as a glass substrate.

[0043] The substrate 14 for forming the meta-optical element is obtained by melting a glass raw material and forming the molten glass into a plate shape. Such forming methods can be general, such as the float method, fusion method, slot-down draw method, full col method, and rubber method. In particular, a thin substrate 14 for forming the meta-optical element can be obtained by a method (redraw method) in which the glass, which has been formed into a plate shape, is heated to a formable temperature and then stretched to make it thin by means of stretching or other means.

[0044] The glass of the substrate 14 for forming the meta-optical element is not particularly limited, but alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses mainly composed of silicon dioxide are preferred. As for the oxide-based glass, glass with a silicon dioxide content of 40 to 90% by mass in terms of oxide is preferred.

[0045] The thickness of the substrate 14 for forming the meta-optical element is 0.4 mm or less, and more preferably 0.15 mm or less, from the viewpoint of making the substrate 14 thinner and lighter. When the thickness is 0.4 mm or less, it is possible to give the substrate 14 good flexibility. When the thickness is 0.15 mm or less, it is possible to wind the substrate 14 into a roll. Furthermore, the thickness of the substrate 14 for forming the meta-optical element is preferably 0.05 mm or more, for reasons such as ease of manufacturing and handling. The thickness of the substrate 14 for forming the meta-optical element is preferably 0.05 to 0.4 mm.

[0046] The substrate 14 for forming the meta-optical element may consist of two or more layers, in which case the materials forming each layer may be the same material or different materials. In this case, "thickness of the substrate 14 for forming the meta-optical element" refers to the total thickness of all layers.

[0047] If the substrate 14 for forming the meta-optical element consists of two or more layers, a thin film of a nitride such as silicon nitride or gallium nitride, or an oxide such as titanium oxide, tantalum oxide, zirconium oxide, hafnium oxide, or niobium oxide may be formed on the second main surface 14b side of the substrate 14 for forming the meta-optical element. These thin films can be formed by conventional methods.

[0048] In the lamination process, a support substrate 18 with a resin layer and a substrate 14 for forming a meta-optical element are prepared, and the two are laminated in close contact, with the surface 16a of the resin layer 16 of the support substrate 18 and the first main surface 14a of the substrate 14 for forming a meta-optical element being used as the lamination surface. The surface 16a of the resin layer 16 has easy peelability, and it can be easily peeled off and adhered to the substrate by normal overlapping and pressure. Specifically, one example is a method in which a substrate 14 for forming a meta-optical element is placed on the surface 16a of an easily peelable resin layer 16 under normal pressure, and then the resin layer 16 and the substrate 14 for forming the meta-optical element are pressed together using a pressure roll or press plate. Pressing with a pressure roll or press plate is preferable because it makes the resin layer 16 and the substrate 14 for forming the meta-optical element more closely bonded. It is also preferable because pressing with a roll or press makes it relatively easy to remove air bubbles that have entered between the resin layer 16 and the substrate 14 for forming the meta-optical element.

[0049] Pressing by vacuum lamination or vacuum pressing is preferable because it suppresses the inclusion of air bubbles and ensures good adhesion. Pressing under vacuum also has the advantage that even if minute air bubbles remain, they will not grow due to heating, which is less likely to lead to distortion defects in the substrate 14 for forming the meta-optical element.

[0050] When peelably adhering the resin layer 16 to the first main surface 14a of the meta-optical element forming substrate 14, it is preferable to thoroughly clean the surfaces of the resin layer 16 and the meta-optical element forming substrate 14 that come into contact with each other, and to laminate them in a highly clean environment. Even if foreign matter is mixed between the resin layer 16 and the meta-optical element forming substrate 14, the resin layer 16 will deform, so it will not affect the flatness of the surface of the meta-optical element forming substrate 14. However, the higher the cleanliness, the better the flatness will be, so it is preferable.

[0051] The laminate 10 formed by the lamination process is used to form multiple nanostructures on the second main surface 14b of the meta-optical element formation substrate 14 in a formation process described later.

[0052] In the formation process, multiple nanostructures are formed on the second main surface 14b of the meta-optical element formation substrate 14. The method for forming the nanostructures is not particularly limited and may include methods using deep ultraviolet (DUV) lithography, electron beam lithography, or nanoimprint lithography combined with reactive ion etching (RIE). In the first method for manufacturing a meta-optical element described herein, a meta-optical element formation substrate having a thickness of 0.05 to 0.4 mm is supported on a support substrate and subjected to the formation process in a laminated state. Therefore, cracking during the formation process and the occurrence of focus errors during lithography processing due to warping and bending after the formation of the nanostructure are suppressed.

[0053] After a formation process, multiple nanostructures are formed on the second main surface 14b of the meta-optical element formation substrate 14. In the separation process, the meta-optical element formation substrate 14 is separated from the resin-layered support substrate 18 to obtain a meta-optical element comprising multiple nanostructures. Examples of meta-optical elements include metalens, filters, mirrors, and splitters.

[0054] The method for separating the first main surface 14a of the meta-optical element forming substrate 14 and the surface 16a of the resin layer 16 that constitute the laminate 10 in the separation process is not particularly limited. Specifically, for example, a sharp blade-like object can be inserted into the interface between the meta-optical element forming substrate 14 and the resin layer 16 to serve as the starting point for separation, and then a mixed fluid of water and compressed air can be sprayed to separate them. Preferably, the laminate 10 is placed on a surface plate with the support substrate 12 on the upper side and the meta-optical element forming substrate 14 on the lower side, and the meta-optical element forming substrate 14 side is vacuum-suctioned onto the surface plate. In this state, the blade is first inserted into the meta-optical element forming substrate 14-resin layer 16 interface. Then, the support substrate 12 side is suctioned with a plurality of vacuum suction pads, and the vacuum suction pads are raised sequentially from the vicinity of where the blade was inserted. This creates an air layer at the interface between the resin layer 16 and the meta-optical element forming substrate 14, and this air layer spreads across the entire interface, allowing the support substrate 12 to be easily separated.

[0055] The second method for manufacturing a meta-optical element of this disclosure involves: using the exposed surface of the resin layer of the resin-layered support substrate, which has a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, as the lamination surface, and the third main surface of the processing substrate, which has a third main surface and a fourth main surface and a thickness of 0.1 to 1.0 mm, as the lamination surfaces to obtain a processing laminate by closely laminating the resin-layered support substrate and the processing substrate (hereinafter sometimes referred to as the processing lamination process); and grinding the fourth main surface of the processing substrate constituting the processing laminate until the thickness of the processing substrate is 0.05 to 0.4 mm (hereinafter The process comprises the following steps in this order: (sometimes referred to as the grinding process); polishing the fourth main surface of the ground processing substrate until the thickness variation of the entire processing laminate is 10 μm or less to obtain a substrate for forming a meta-optical element having a polished surface (hereinafter sometimes referred to as the polishing process); forming a plurality of nanostructures on the polished surface of the substrate for forming a meta-optical element (hereinafter sometimes referred to as the formation process); and separating the substrate for forming a meta-optical element having the plurality of nanostructures from the resin-layered support substrate to obtain a meta-optical element comprising the plurality of nanostructures (hereinafter sometimes referred to as the separation process). In the second method for manufacturing a meta-optical element described herein, a processing laminate is used, consisting of a support substrate with a thickness variation of 10 μm or less and a processing substrate with a thickness of 0.1 to 1.0 mm. The processing substrate is ground down to a thickness of 0.05 to 0.4 mm, and then polished until the overall thickness variation of the processing laminate is 10 μm or less to obtain a substrate for forming a meta-optical element, after which nanostructures constituting the meta-optical element are formed. Therefore, for example, when obtaining a substrate for forming a meta-optical element, the occurrence of cracks in the substrate during grinding and polishing is easily suppressed. For this reason, it is presumed that the productivity of the meta-optical element is excellent.

[0056] The details of the second method for manufacturing a meta-optical element according to this disclosure will be described below with reference to the drawings. In addition, the method for manufacturing a second meta-optical element forming laminate according to this disclosure will also be described, which involves, in this order, obtaining a processing laminate by closely laminating the resin-layered support substrate and the processing substrate, with the exposed surface of the resin layer of the resin-layered support substrate having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, and the third main surface of the processing substrate having a thickness of 0.1 to 1.0 mm, using the exposed surface of the resin layer of the resin-layered support substrate and the third main surface of the processing substrate having a third main surface and a fourth main surface, respectively; grinding the fourth main surface of the processing substrate constituting the processing laminate until the thickness of the processing substrate is 0.05 to 0.4 mm; and polishing the fourth main surface of the ground processing substrate until the thickness variation of the entire processing laminate is 10 μm or less. The second method for manufacturing a laminate for forming a meta-optical element according to this disclosure comprises a processing lamination step, a grinding step, a polishing step, a forming step, and a separation step in that order, and may optionally include other steps such as a cleaning step and an annealing step.

[0057] In the lamination process for processing, the resin-coated support substrate, which includes a support substrate with a predetermined thickness variation, and the third main surface of the processing substrate, which has a third main surface and a fourth main surface and a thickness of 0.1 to 1.0 mm, are used as the lamination surfaces, and the resin-coated support substrate and the processing substrate are closely laminated to form a processing laminate. By performing a processing lamination process, a processing laminate used in the grinding and polishing processes described later is obtained.

[0058] Figure 2 is a schematic cross-sectional view showing an example of a processed laminate 30. As shown in Figure 2, the processing laminate 30 is a laminate composed of a support substrate 12, a processing substrate 20 with a thickness of 0.1 to 1.0 mm, and a resin layer 16 provided between the support substrate 12 and the processing substrate 20. The support substrate 12 and the resin layer 16 constitute the resin-layered support substrate 18. The resin-layered support substrate 18 reinforces the processing substrate 20 when grinding and polishing the processing substrate 20 to obtain the meta-optical element forming substrate 14. It also supports and reinforces the meta-optical element forming substrate 14 obtained after grinding and polishing, preventing deformation, scratches, and damage to the meta-optical element forming substrate 14 during the manufacturing of nanostructures in the formation process described later. Details of the support substrate 12, resin layer 16, support substrate 18 with resin layer, and lamination method are the same as in the case of the first method for manufacturing a meta-optical element.

[0059] The processing substrate 20 has a third main surface 20a and a fourth main surface 20b and a thickness of 0.1 to 1.0 mm. The third main surface 20a of the processing substrate 20 is in close contact with the resin layer 16, and the fourth main surface 20b, which is on the opposite side from the resin layer 16, is subjected to the grinding and polishing processes described later. The type of processing substrate 20 can be a general type, such as a glass substrate. The details of the glass substrate used as the processing substrate 20 are the same as those of the glass substrate used as the substrate 14 for forming the meta-optical element, except for the thickness and variations in plate thickness.

[0060] Furthermore, in order to reduce variations in the overall thickness of the laminate 30 for processing, a substrate that has undergone a grinding process and, if necessary, a polishing process on the third main surface 20a of the substrate 20 for processing may be used as the substrate 20 for processing.

[0061] In the grinding process, the fourth main surface 20b of the processing substrate 20 that constitutes the processing laminate 30 is ground until the thickness of the processing substrate 20 is 0.05 to 0.4 mm (i.e., up to the dashed line in Figure 2). Grinding is a process of reducing the thickness of the substrate 20 for processing. The grinding method is not particularly limited, and known grinding methods such as lapping, wet etching, through-feed, and in-feed methods can be used. Grinding is preferably performed while cooling the laminate 30 for processing and the grinding wheel (diamond, etc.) by supplying pure water.

[0062] In the polishing process, the fourth main surface 20b of the ground processing substrate 20 obtained in the grinding process is polished until the overall thickness variation of the processing laminate 30 is 10 μm or less to obtain a substrate 14 for forming a meta-optical element having a polished surface. The overall thickness variation of the processing laminate 30 is preferably 5 μm or less. However, from the viewpoint of productivity, the overall thickness variation of the processing laminate 30 is preferably 0.5 μm or more. By incorporating a polishing process, minute irregularities and scratches on the fourth main surface 20b of the processing substrate 20 can be removed, improving the flatness of the surface on which multiple nanostructures are formed. Therefore, the reliability of the resulting meta-optical element can be enhanced. This effect is particularly pronounced for processing substrates 20 with a thickness of 0.4 mm or less. Processing substrates 20 with a thickness of 0.4 mm or less tend to be difficult to polish on their own, making it difficult to polish the processing substrate 20 before forming the processing laminate 30. The polished surface corresponds to the second main surface 14b of the substrate 14 for forming the meta-optical element in the first method of manufacturing the meta-optical element. Furthermore, the substrate 14 for forming the meta-optical element and the support substrate 18 with a resin layer constitute a laminate (laminated body for forming the meta-optical element) 10.

[0063] The polishing method is not particularly limited, and known methods can be employed, including mechanical polishing (physical polishing) or chemical polishing (chemical polishing). Mechanical polishing methods include sandblasting, which involves blasting ceramic abrasive particles; polishing using lapping sheets or grinding wheels; and chemical mechanical polishing (CMP), which uses abrasive particles and chemical solvents in combination. Additionally, chemical polishing (sometimes called wet etching) can be used, which involves polishing the surface of a glass substrate using a chemical solution. In particular, chemical mechanical polishing is preferred because it provides higher flatness and cleanliness of the polished surface of the substrate for forming meta-optical elements after polishing. Known abrasive grains such as cerium oxide can be used in chemical mechanical polishing.

[0064] By going through a processing lamination process, a grinding process, and a polishing process, a laminate containing a polished substrate for forming meta-optical elements (a laminate for forming meta-optical elements) can be manufactured. The laminate formed after the polishing process is used to form multiple nanostructures on the polished surface of the substrate for forming meta-optical elements in the formation process described later.

[0065] By performing the formation and separation steps on the substrate for forming the meta-optical element obtained as described above, in the same manner as the method for manufacturing the first meta-optical element, a meta-optical element comprising multiple nanostructures can be obtained. The details of the formation and separation steps are the same as in the case of the method for manufacturing the first meta-optical element. [Explanation of Symbols]

[0066] 10 Laminate 12 Support substrate 14. Substrate for forming meta-optical elements 14a First main surface 14b Second main surface 16 resin layer 18 Support substrate 20 Processing substrate 20a Third main surface 20b 4th principal surface 30 Laminate for processing

Claims

1. A support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the support substrate with a resin layer exhibits easy peelability, and the first main surface of a substrate for forming a meta-optical element having a first main surface and a second main surface, with a thickness of 0.05 to 0.4 mm and a thickness variation of 10 μm or less, are used as the lamination surfaces to obtain a laminate for forming a meta-optical element by closely laminating the support substrate with a resin layer and the substrate for forming a meta-optical element. Forming a plurality of nanostructures on the second main surface of the substrate for forming the meta-optical element, which constitutes the laminate for forming the meta-optical element, To obtain a meta-optical element comprising the plurality of nanostructures by separating the substrate for forming the meta-optical element having the plurality of nanostructures from the support substrate with the resin layer, A method for manufacturing a meta-optical element having the elements in this order.

2. The method for manufacturing a meta-optical element according to claim 1, wherein the variation in plate thickness of the entire laminate for forming the meta-optical element is 10 μm or less.

3. A support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the resin-layered support substrate exhibits easy peelability, and the third main surface of a processing substrate having a third main surface and a fourth main surface and a thickness of 0.1 to 1.0 mm, are used as the lamination surfaces to obtain a processing laminate by closely laminating the resin-layered support substrate and the processing substrate. The fourth main surface of the processing substrate constituting the processing laminate is ground until the thickness of the processing substrate is 0.05 to 0.4 mm. The fourth main surface of the ground processing substrate is polished until the thickness variation of the entire processing laminate is 10 μm or less to obtain a substrate for forming a meta-optical element having a polished surface. Forming a plurality of nanostructures on the polished surface of the substrate for forming the meta-optical element, To obtain a meta-optical element comprising the plurality of nanostructures by separating the substrate for forming the meta-optical element having the plurality of nanostructures from the support substrate with the resin layer, A method for manufacturing a meta-optical element having the elements in this order.

4. A method for manufacturing a meta-optical element according to claim 1 or 3, wherein the support substrate with the resin layer is obtained by forming a resin layer-forming composition layer on one surface of the support substrate, leaving the support substrate with the resin layer-forming composition layer to stand for a predetermined time, and then curing the resin layer-forming composition layer to fix the resin layer on one surface of the support substrate.

5. The method for manufacturing a meta-optical element according to claim 1 or 3, wherein the thickness of the resin layer is 2 to 15 μm.

6. The method for manufacturing a meta-optical element according to claim 1 or 3, wherein the resin of the resin layer is a silicone resin.

7. The method for manufacturing a meta-optical element according to claim 1 or 3, wherein the support substrate is a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate.

8. A method for manufacturing a meta-optical element forming laminate, comprising: a support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the resin-coated support substrate exhibits easy peelability; and the first main surface of a meta-optical element forming substrate having a first main surface and a second main surface, with a thickness of 0.05 to 0.4 mm and a thickness variation of 10 μm or less, wherein the resin-coated support substrate and the meta-optical element forming substrate are closely laminated together, with the exposed surface of the resin layer of the resin-coated support substrate having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, and the first main surface of the meta-optical element forming substrate having a thickness variation of 0.05 to 0.4 mm and a thickness variation of 10 μm or less as the lamination surface.

9. The method for manufacturing a laminate for forming a meta-optical element according to claim 8, wherein the thickness variation of the entire laminate for forming the meta-optical element is 10 μm or less.

10. A support substrate with a resin layer having a thickness variation of 10 μm or less and a resin layer fixed to one side of the support substrate, wherein the exposed surface of the resin layer of the resin-layered support substrate exhibits easy peelability, and the third main surface of a processing substrate having a third main surface and a fourth main surface and a thickness of 0.1 to 1.0 mm, are used as the lamination surfaces to obtain a processing laminate by closely laminating the resin-layered support substrate and the processing substrate. The fourth main surface of the processing substrate constituting the processing laminate is ground until the thickness of the processing substrate is 0.05 to 0.4 mm. The fourth main surface of the ground substrate for processing is polished until the thickness variation of the entire laminate for processing is 10 μm or less. A method for manufacturing a laminate for forming a meta-optical element, having the elements in this order.

11. The method for manufacturing a laminate for forming a meta-optical element according to claim 8 or 10, wherein the support substrate with the resin layer is obtained by forming a resin layer-forming composition layer on one surface of the support substrate, leaving the support substrate with the resin layer-forming composition layer to stand for a predetermined time, and then curing the resin layer-forming composition layer to fix the resin layer on one surface of the support substrate.

12. The method for manufacturing a laminate for forming a meta-optical element according to claim 8 or 10, wherein the thickness of the resin layer is 2 to 15 μm.

13. The method for manufacturing a laminate for forming a meta-optical element according to claim 8 or 10, wherein the resin of the resin layer is a silicone resin.

14. The method for manufacturing a laminate for forming a meta-optical element according to claim 8 or 10, wherein the support substrate is a glass plate, a silicon wafer, a synthetic resin plate, or a metal plate.

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