Resin composition, hologram layer, laminate, card, and passport
A resin composition with polycarbonate resin and microholograms addresses thermal deformation issues in holographic layer formation, ensuring high security and durability in cards and passports by allowing lower-temperature processing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUBISHI CHEM CORP
- Filing Date
- 2024-10-11
- Publication Date
- 2026-04-23
AI Technical Summary
Existing methods for forming holographic layers using microholograms in cards and passports result in thermal deformation and damage due to high-temperature processing, compromising security and performance.
A resin composition comprising a polycarbonate resin with specific structural units derived from dihydroxy compounds like isosorbide, combined with microholograms, which allows for lower-temperature processing to form a hologram layer without thermal deformation, enhancing security and durability.
The resin composition enables the formation of hologram layers with reduced thermal damage and improved security performance, maintaining the integrity and functionality of microholograms in cards and passports.
Smart Images

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Abstract
Description
Technical Field
[0001] The present invention relates to a resin composition, a hologram layer, a laminate, a card, and a passport.
Background Art
[0002] Conventionally, hologram images (hereinafter referred to as "holograms" as a general term including relief-type diffraction grating patterns and OVD (Optical Variable Device) patterns) have been frequently used in hologram transfer foils for the purpose of transferring and forming them by hot stamping to impart a decorative effect and an anti-counterfeiting effect to cards or passports (see, for example, Patent Document 1). A hologram transfer foil generally consists of layers including a base material, a release layer, a hologram forming layer, a reflective layer (protective layer), and an adhesive layer. It peels at the interface between the base material and the release layer, and the layers after the release layer are transferred as a transfer layer to a transfer body (for example, a core sheet) for transfer formation. The release layer often functions as a protective layer for the transfer layer. When a PET film is used for the base material, after being peeled off from the release layer, the PET film is discarded, and another transparent resin sheet may be laminated for protecting the hologram forming layer.
[0003] By the way, cards, passports, etc. are generally manufactured by laminating multiple resin films and integrating them by hot pressing. As a layer structure, for example, it has a structure in which a plurality of core sheets are laminated between a pair of over sheets, or a structure in which a laser marking sheet or the like is provided between the over sheet and the core sheet in this structure. Generally, the thickness ratio of the core sheet in the whole product is high. And concealment is required for this core sheet, and it is generally done to blend a filler such as titanium oxide. In addition, in order to impart a decorative effect and an anti-counterfeiting effect, a laminate having a hologram layer in the layer structure is preferable.
Prior Art Documents
Patent Documents
[0004] [Patent Document 1] Japanese Patent Publication No. 2019-214172 [Overview of the Initiative] [Problems that the invention aims to solve]
[0005] When manufacturing laminates having a hologram layer in the layer structure described above, the aforementioned hologram transfer foil is often used. However, when forming a hologram layer using a transfer method with hologram transfer foil, the hologram layer can be scraped off, making it insufficient for applications requiring higher security from the standpoint of preventing counterfeiting. In recent years, the use of microholograms to form holographic layers has been considered from the perspective of ensuring higher security. When forming a holographic layer using microholograms, for applications such as cards and passports, one possible method is to knead the microholograms into polycarbonate resin and mold it using an extrusion molding method. However, this method requires high-temperature processing at 280°C or higher, which causes thermal deformation of the microholograms and results in the inability to obtain the desired holographic performance.
[0006] Therefore, the object of the present invention is to provide a resin composition, a hologram layer, and a laminate that can reduce damage to the hologram layer when forming the hologram layer by extrusion molding or the like, and that can provide higher security. [Means for solving the problem]
[0007] As a result of diligent research, the inventors have found that the above problems can be solved by using a sheet-like resin layer as a hologram layer, which is made up of a resin composition containing a microhologram and a polycarbonate resin having structural units derived from a specific dihydroxy compound such as isosorbide, and have completed the present invention as follows. That is, the present invention provides the following [1] to
[0025] .
[0008] [1] A resin composition comprising a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having a part of its structure represented by the following formula (1), and a microhologram. [ka] However, this excludes cases where the part represented by formula (1) is part of -CH2-OH. [2] The microhologram is the resin composition described in [1] above, wherein the temperature at which thermal deformation begins is 250°C or higher, as determined by TG-DTA measurement. [3] The resin composition according to [1] or [2] above, comprising 0.01 to 10 parts by mass of the microhologram per 100 parts by mass of the polycarbonate resin (A). [4] The resin composition according to any one of [1] to [3] above, wherein the polycarbonate resin (A) contains 30 mol% to 80 mol% of the structural unit (A1) among the structural units derived from the dihydroxy compound. [5] The resin composition according to any one of [1] to [4] above, wherein the polycarbonate resin (A) is derived from at least one dihydroxy compound selected from the group consisting of aliphatic dihydroxy compounds and alicyclic dihydroxy compounds, and further comprises a structural unit (A2) which is a structural unit other than structural unit (A1). [6] A holographic layer comprising the resin composition described in any of [1] to [5] above. [7] Resin pellets comprising any of the resin compositions described in [1] to [5] above. [8] A holographic layer formed using the resin pellets described in [7] above. [9] The hologram layer according to [6] or [8], wherein the hologram layer contains 0.01 to 10 parts by mass of the microhologram per 100 parts by mass of the polycarbonate resin (A).
[10] A laminate comprising the hologram layer described in any of [6], [8], and [9] above.
[11] comprising a resin sheet (A) laminated on one side of the hologram layer, The laminate according to
[10] above, wherein the resin sheet (A) comprises a resin composition A containing a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having a part of its structure represented by the following formula (1). [ka] However, this excludes cases where the part represented by formula (1) is part of -CH2-OH.
[12] The laminate according to
[11] , further comprising a resin sheet (B) laminated on the other side of the hologram layer, wherein the resin sheet (B) is made of a resin composition B containing polycarbonate resin.
[13] The laminate according to
[12] , wherein the resin composition B is a resin composition comprising a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having a part of its structure represented by the following formula (1). [ka] However, this excludes cases where the part represented by formula (1) is part of -CH2-OH.
[14] The laminate according to any one of
[11] to
[13] above, wherein the resin composition A contains an inorganic filler.
[15] The laminate according to
[12] or
[13] above, wherein the resin composition B contains an inorganic filler.
[16] The laminate according to
[14] or
[15] above, wherein the inorganic filler is a metal oxide.
[17] The laminate according to
[14] or
[15] above, wherein the inorganic filler is titanium oxide.
[18] The laminate according to any one of
[14] to
[17] above, wherein the content of the inorganic filler is 5 parts by mass or more and 90 parts by mass or less per 100 parts by mass of each resin component in resin composition A or resin composition B.
[19] The laminate according to any one of
[12] to
[18] above, wherein the resin composition B constituting the resin sheet (B) contains a coloring agent.
[20] The laminate according to
[19] above, wherein the content of the color former is 0.01 part by mass or more with respect to 100 parts by mass of the resin component in the resin composition B.
[21] The laminate according to any one of
[11] to
[20] above, wherein the polycarbonate resin (A) in the resin composition A or the resin composition B contains 30 mol% or more and 80 mol% or less of the structural unit (A1) in the structural units derived from the dihydroxy compound.
[22] The laminate according to any one of
[11] to
[21] above, wherein the polycarbonate resin (A) in the resin composition A or the resin composition B is derived from at least one dihydroxy compound selected from the group consisting of an aliphatic dihydroxy compound and an alicyclic dihydroxy compound, and further contains a structural unit (A2) which is a structural unit other than the structural unit (A1).
[23] A card having the laminate according to any one of
[10] to
[22] above.
[24] A passport having the laminate according to any one of
[10] to
[22] above. [Effect of the Invention]
[0009] According to the present invention, it is possible to provide a resin composition, a hologram layer, and a laminate that can reduce damage to the hologram layer and impart high security performance. " [Brief Description of the Drawings]
[0010] [Figure 1] It is a conceptual diagram showing the laminate of the present invention. [Figure 2] It is a schematic diagram showing the layer structure in a card. [Figure 3] It is a schematic diagram showing the layer structure in a passport. [Figure 4] It is a figure showing the visual observation state by CCD (under a 35°C atmosphere) during TG-DTA measurement. [Figure 5] It is a figure showing the visual observation state in CCD (under a 250°C atmosphere) during TG-DTA measurement. [Figure 6]This figure shows the visual observation conditions on the CCD during TG-DTA measurement (under a 350°C atmosphere). [Modes for carrying out the invention]
[0011] The present invention will be described in detail below with reference to embodiments. However, the present invention is not limited to the embodiments described below. Furthermore, the terms "film" and "sheet" used in the following description are not clearly distinguished, and the term "film" includes "sheet," and the term "sheet" includes "film."
[0012] [Resin composition] The resin composition of the present invention (hereinafter sometimes referred to as "this resin composition") comprises a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having a part of its structure represented by the following formula (1), and a microhologram. [ka] However, this excludes cases where the part represented by formula (1) is part of -CH2-OH. In other words, the dihydroxy compound refers to one that contains two hydroxyl groups and at least the portion of formula (1) above.
[0013] In the present invention, by using a polycarbonate resin (A) having the above structure, the environmental impact of the resin composition, the film (hologram layer) formed from the resin composition, and final products such as cards and passports containing the resin composition can be reduced. Furthermore, by using the resin composition, it is possible to form a film even when processed at a certain processing temperature or below, thereby reducing the thermal damage to the microhologram during molding. Furthermore, by using polycarbonate resin (A), a good balance of heat resistance, scratch resistance, hydrolysis resistance, and solvent resistance can be achieved, providing properties suitable for applications such as cards and passports. In addition, when the film (hologram layer) formed from this resin composition is heat-press molded, it can be fused to other films at low temperatures, improving heat-press suitability and reducing damage to the hologram layer.
[0014] (Polycarbonate resin (A)) Dihydroxy compounds having a site represented by formula (1) as part of their structure are not particularly limited as long as they have the structure represented by formula (1) in their molecule, but specifically include 9,9-bis(4-(2-hydroxyethoxy)phenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-methylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-isopropylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-isobutylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-tert-butylphenyl)fluorene, and 9,9-bis(4-(2-hydroxyethoxy)-3-cyclo Examples include compounds having aromatic groups in the side chain and ether groups bonded to the aromatic groups in the main chain, such as hexylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-phenylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3,5-dimethylphenyl)fluorene, 9,9-bis(4-(2-hydroxyethoxy)-3-tert-butyl-6-methylphenyl)fluorene, and 9,9-bis(4-(3-hydroxy-2,2-dimethylpropoxy)phenyl)fluorene, as well as dihydroxy compounds having a cyclic ether structure, such as dihydroxy compounds represented by the following formula (2) and spiroglycols represented by the following formula (3).
[0015] Among the above, dihydroxy compounds having a cyclic ether structure are preferred, and anhydrous sugar alcohols represented by formula (2) are particularly preferred. More specifically, dihydroxy compounds represented by formula (2) include isosorbide, isomannide, and isoidette, which are stereoisomers. In addition, dihydroxy compounds represented by the following formula (3) include 3,9-bis(1,1-dimethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane (common name: spiroglycol), 3,9-bis(1,1-diethyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, and 3,9-bis(1,1-dipropyl-2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane. These can be used individually, or two or more can be used in combination.
[0016] [ka]
[0017] [ka] In formula (3), R1 to R4 are each independently alkyl groups having 1 to 3 carbon atoms.
[0018] The dihydroxy compound represented by formula (2) is an ether diol that can be produced from carbohydrates using plant-derived materials as raw materials. In particular, isosorbide can be produced inexpensively by hydrogenating and then dehydrating D-glucose obtained from starch, and it is readily available as a resource. For these reasons, isosorbide is the most preferred choice.
[0019] The polycarbonate resin (A) may further contain structural units other than structural unit (A1) as structural units derived from dihydroxy compounds, and it is preferable that it contains structural units derived from at least one dihydroxy compound selected from aliphatic dihydroxy compounds and alicyclic dihydroxy compounds (hereinafter sometimes referred to as structural unit (A2)).
[0020] Aliphatic dihydroxy compounds are not particularly limited in terms of the number of carbon atoms, but preferably have about 2 to 12 carbon atoms, more preferably 2 to 6 carbon atoms. Specifically, examples include ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 2-ethyl-1,6-hexanediol, 2,2,4-trimethyl-1,6-hexanediol, 1,10-decanediol, 1,12-dodecanediol, hydrogenated dilinoleyl glycol, hydrogenated dioleyl glycol, and the like. Preferably, at least one selected from ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,9-nonanediol, 1,10-decanediol, and 1,12-dodecanediol is used, and more preferably, at least one selected from ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, and 1,6-hexanediol is used. In addition, structural units derived from aliphatic dihydroxy compounds can be used, for example, those described in International Publication No. 2004 / 111106.
[0021] The structural units derived from the alicyclic dihydroxy compound preferably include at least one of a five-membered ring structure or a six-membered ring structure, and the six-membered ring structure may be fixed in a chair-like or boat-like shape by covalent bonds. By including structural units derived from alicyclic dihydroxy compounds of these structures, the heat resistance of the resulting polycarbonate resin (A) can be improved. The number of carbon atoms in the alicyclic dihydroxy compound is, for example, 5 to 70, preferably 6 to 50, and more preferably 8 to 30. Preferably, the alicyclic dihydroxy compound is at least one selected from cyclohexanedimethanol, tricyclodecanedimethanol, adamantanediol, and pentacyclopentadecanedimethanol. From the viewpoint of economy and heat resistance, cyclohexanedimethanol or tricyclodecanedimethanol is more preferred, and cyclohexanedimethanol is even more preferred. Of the cyclohexanedimethanol, 1,4-cyclohexanedimethanol is particularly preferred because it is readily available industrially. Furthermore, structural units derived from alicyclic dihydroxy compounds, as described in International Publication No. 2007 / 148604, can also be used.
[0022] The content of structural units (A1) in polycarbonate resin (A) is preferably 30 mol% or more, more preferably 40 mol% or more, even more preferably 45 mol% or more, and preferably 80 mol% or less, more preferably 75 mol% or less, even more preferably 70 mol% or less, and even more preferably 65 mol% or less, within the structural units derived from dihydroxy compounds. By setting the content within this range, discoloration caused by the carbonate structure and discoloration caused by trace amounts of impurities due to the use of plant resource materials can be effectively suppressed, making it easier to improve the transparency of the resin composition and prevent yellowing. Furthermore, it tends to be possible to achieve a suitable balance of physical properties such as moldability, mechanical strength, and heat resistance, which is difficult to achieve with polycarbonate resins composed only of structural units (A1). On the other hand, the content of structural units (A2) in polycarbonate resin (A) is preferably 20 mol% or more, more preferably 25 mol% or more, even more preferably 30 mol% or more, and even more preferably 35 mol% or more, and also preferably 70 mol% or less, more preferably 60 mol% or less, and even more preferably 55 mol% or less, among the structural units derived from the dihydroxy compound.
[0023] The polycarbonate resin (A) preferably consists of structural units derived from dihydroxy compounds, namely structural unit (A1) and structural unit (A2). However, other structural units derived from dihydroxy compounds may also be included, as long as they do not impair the objectives of the present invention. Specifically, this may involve copolymerizing a small amount of aromatic ring-containing dihydroxy compounds, such as bisphenols like 2,2-bis(4-hydroxyphenyl)propane (commonly known as bisphenol A). Using aromatic ring-containing dihydroxy compounds is expected to efficiently improve heat resistance and moldability, but excessive amounts tend to cause problems with weather resistance. Therefore, it is best to use them in an amount that does not impair weather resistance. Examples of aromatic ring-containing dihydroxy compounds other than bisphenol A include α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene (bisphenol M), 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, 2,2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C), 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane (bisphenol AF), and 1,1-bis(4-hydroxyphenyl)decane.
[0024] The glass transition temperature of the polycarbonate resin (A) is, for example, 70°C or higher, preferably 80°C or higher, more preferably 85°C or higher, even more preferably 90°C or higher, and also, for example, 140°C or lower, preferably 130°C or lower, more preferably 125°C or lower, and even more preferably 120°C or lower. Furthermore, it is generally preferable that the polycarbonate resin (A) has a single glass transition temperature. By setting the glass transition temperature within the above range, it becomes possible to mold the hologram layer at a relatively low temperature, further suppressing thermal damage to the hologram layer. Furthermore, it tends to facilitate low-temperature thermal fusion, and it becomes easier to impart heat resistance to the resin composition. The glass transition temperature can be adjusted by appropriately selecting the ratio of each structural unit constituting the polycarbonate resin (A). The glass transition temperature of each resin can be obtained by measurement using a differential scanning calorimeter. Detailed measurement conditions should be as described in the examples.
[0025] Polycarbonate resin (A) can be produced by commonly used polymerization methods, including the phosgene method and the transesterification method involving reaction with diester carbonate. Among these, the transesterification method is preferred, in which a dihydroxy compound having a part of its structure represented by formula (1) and other dihydroxy compounds are reacted with diester carbonate in the presence of a polymerization catalyst. The transesterification method is a polymerization method in which a dihydroxy compound, diester carbonate, a basic catalyst, and an acidic substance to neutralize the catalyst are mixed, and a transesterification reaction is carried out. Examples of diester carbonates include diphenyl carbonate, ditrile carbonate, bis(chlorophenyl) carbonate, m-cresyl carbonate, dinaphthyl carbonate, bis(biphenyl) carbonate, diethyl carbonate, dimethyl carbonate, dibutyl carbonate, and dicyclohexyl carbonate, among which diphenyl carbonate is preferably used.
[0026] The molecular weight of the polycarbonate resin (A) can be expressed in terms of reduced viscosity. From the viewpoint of imparting mechanical strength, the reduced viscosity is preferably 0.3 dL / g or more, and more preferably 0.35 dL / g or more. From the viewpoint of improving productivity and moldability by increasing fluidity during molding, the reduced viscosity is preferably 1.2 dL / g or less, more preferably 1 dL / g or less, and more preferably 0.8 dL / g or less. The reduced viscosity is measured using a Ubbelohde viscometer at a temperature of 20.0°C ± 0.1°C, after precisely preparing the polycarbonate resin concentration to 0.6 g / dL using dichloromethane as the solvent.
[0027] The present resin composition may use only polycarbonate resin (A) as the resin component, but may also contain resin components other than polycarbonate resin (A) to the extent that it does not contradict the spirit of the present invention. The resin components constituting the present resin composition preferably contain polycarbonate resin (A) as the main component, and the amount of polycarbonate resin (A) is, for example, 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, and most preferably 100% by mass, based on the total amount of resin components contained in the present resin composition.
[0028] (Microhologram) This resin composition must contain microholograms. The microholograms are often reflectors, and their reflective surfaces are preferably flat or curved. If the surface is flat, parallel light beams striking the surface are reflected back in a parallel state. If the surface is curved, parallel light beams striking the surface are reflected back in the form of divergent or converging rays. Whether the reflection is in the form of divergent or converging rays can be adjusted by the curvature of the curved plane (e.g., a convex surface). Flat surfaces have the advantage of generating sharp reflective bands in a narrow angular range. Curved surfaces have the advantage of generating reflections in a wider angular range, and the angle of reflection is also wider. The microholograms may be contained in this resin composition, i.e., dispersed in the polycarbonate resin (A).
[0029] The shape of the microhologram can be any shape you desire, such as a general shape, sphere, rod, parallelepiped, polyhedron, or platelet.
[0030] Regarding the size of the microhologram, it is preferable that the major axis is 500 μm or less, the thickness is 1 to 100 μm, and that it has a circular, elliptical, or n-sided shape (n is an integer of 3 or more). For the n-sided shape, a triangular to dodecagonal shape is preferable, but a hexagonal or octagonal shape is more preferable. The size of the microhologram is preferably such that the major axis is 1 to 500 μm, more preferably 10 to 450 μm, and even more preferably 20 to 200 μm. Reducing the size of the microhologram makes it easier to prevent damage during mixing, etc. Also, having a size above a certain level makes it easier to have appropriate functionality.
[0031] Microholograms may contain at least one type of metal. The types of metals may include aluminum, copper, nickel, silver, gold, chromium, zinc, tin, and alloys containing at least two of these metals. Furthermore, microholograms may be coated with metal or alloy, or the entire microhologram may be made of metal or an alloy. It is preferable that at least the surface (reflective surface) of the microhologram is made of metal.
[0032] Microholograms are preferably used as identification platelets, i.e., microplatelets. Identification platelets are typically metal identification platelets. Metal identification platelets may be those described in, for example, the brochure in International Publication No. 2005 / 078530. The identification platelets have a reflective surface capable of forming a reflective pattern. A large number of metal identification platelets are randomly distributed within the hologram layer formed by this resin composition, and / or distributed in a specific arrangement or orientation. When the hologram layer is illuminated at various angles, a characteristic reflective pattern is formed. This pattern can be used for identification and authentication, thereby providing security. Furthermore, the identification platelets can be marked, for example, with a magnifying glass or microscope.
[0033] The identification platelet may have a diffraction structure and / or diffraction pattern formed on its surface, such as a hologram, or through-holes of any shape. The diffraction structure and / or diffraction pattern can be formed by printing, photolithography, etc. The identification platelet can also be given a reflective pattern by its external shape (e.g., triangle, square, hexagon, circle, ellipse, letter, number, symbol, emoji, or other conceivable form). In the identification platelet, the reflective surface that can form the reflective pattern may be provided on one side of the microhologram or on both sides.
[0034] This resin composition, by using the polycarbonate resin (A) described above, enables sheet molding at low temperatures, for example, below 250°C. As a result, the microhologram can exhibit the desired randomness without thermal deformation, thus maintaining a high level of security.
[0035] In microholograms, it is preferable that the thermal deformation onset temperature, as measured by TG-DTA, is 240°C or higher. By having a thermal deformation onset temperature above a certain level, the microhologram does not undergo thermal deformation during hologram layer formation or when the hologram layer is laminated onto other films or resin layers, thus maintaining the desired performance of the microhologram. The thermal deformation initiation temperature is more preferably 250°C or higher. Furthermore, the thermal deformation initiation temperature is not particularly limited, but from the viewpoint of the material that can be selected for the microhologram, it may be, for example, 400°C or lower, 350°C or lower, 300°C or lower, or 270°C or lower. The thermal deformation initiation temperature can be determined by heating the microhologram from 30°C at a heating rate of 10°C / min using TG-DTA analysis and measuring the temperature at which the microhologram begins to deform. Detailed measurement conditions are as described in the heat resistance evaluation of the examples. The thermal deformation initiation temperature is determined by selecting multiple microholograms (for example, 8) arbitrarily and defining the temperature at which at least one of them deforms as the thermal deformation initiation temperature.
[0036] In this resin composition, the microhologram content is preferably 0.01 to 30 parts by mass, more preferably 0.02 to 20 parts by mass, and even more preferably 0.03 to 10 parts by mass, per 100 parts by mass of polycarbonate resin (A). Within this range, the microhologram can be appropriately dispersed in the resin composition while incorporating the required amount of microhologram. Furthermore, when used in the hologram layer described later, the microhologram content in this resin composition is preferably 0.01 to 10 parts by mass per 100 parts by mass of polycarbonate resin (A). A microhologram content of 0.01 parts by mass or more allows for the formation of an appropriate reflection pattern by the microhologram in the hologram layer formed by this resin composition. A content of 10 parts by mass or less allows for the appropriate dispersion of the microhologram within the resin composition in the hologram layer. From the viewpoint of forming an appropriate reflection pattern, the microhologram content is more preferably 0.02 parts by mass or more, even more preferably 0.03 parts by mass or more, and even more preferably 0.04 parts by mass or more, per 100 parts by mass of polycarbonate resin (A). Furthermore, from the viewpoint of suitability for use in the hologram layer, the microhologram content is preferably 3 parts by mass or less, even more preferably 1 part by mass or less, and even more preferably 0.5 parts by mass or less, per 100 parts by mass of polycarbonate resin (A).
[0037] (Impact-resistant additive) This resin composition may contain an impact-resistant agent. By containing an impact-resistant agent, this resin composition can mitigate the effects of external impacts such as bending and impact during actual use, thereby improving the bending durability of films and other materials formed from this resin composition. It can also prevent a decrease in softness and fluidity when heated, making it easier to maintain good processability.
[0038] Examples of impact-resistant modifiers include soft styrene resins and elastomers. The elastomer may be a core-shell type elastomer. The impact-resistant modifier may be used alone or in combination of two or more types. Among the above, core-shell type elastomers are preferred as impact-resistant modifiers. By using a core-shell type elastomer, impact resistance is further improved and bending durability is further enhanced.
[0039] Examples of flexible styrene-based resins include block copolymers containing styrene polymer blocks and conjugated diene polymer blocks, and block copolymers containing styrene polymer blocks and acrylonitrile blocks. The styrene content in the flexible styrene resin is, for example, 5% by mass or more and 80% by mass or less, preferably 10% by mass or more and 50% by mass or less, and more preferably 15% by mass or more and 30% by mass or less. Having a styrene content within this range further improves the impact resistance effect.
[0040] As conjugated diene polymer blocks used in flexible styrene resins, homopolymers such as butadiene, isoprene, and 1,3-pentadiene, copolymers thereof, or copolymers containing monomers copolymerizable with conjugated diene monomers within the block can be used. Specific examples of flexible styrene-based resins include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), silicone-acrylic composite rubber-acrylonitrile-styrene copolymer (SAS), methyl methacrylate-maleic anhydride-styrene copolymer (SMM), acrylonitrile-styrene copolymer (AS), acrylonitrile-butadiene-styrene copolymer (ABS), acrylonitrile-styrene-acrylic rubber copolymer (ASA), and acrylonitrile-ethylene propylene rubber-styrene copolymer (AES). Specific products include the "Krayton D" series from Kraton Polymers, the "AR-100" series from Aron Kasei Co., Ltd., the "Dialac" series from UMG ABS, and the "Delpet" series from Asahi Kasei Chemicals. Furthermore, as flexible styrene-based resins, the following styrene-based elastomers can also be used, including the "Dynalon" series from JSR Corporation, the "Toughtech" series from Asahi Kasei Chemicals Corporation, and the "Hybral" series from Kuraray Corporation.
[0041] The block copolymer includes pure blocks, random blocks, tapered blocks, etc., and the form of copolymerization is not particularly limited. Furthermore, the block units themselves may consist of multiple repeating units. Specifically, in the case of styrene-butadiene block copolymers, the block units may be repeated multiple times, such as styrene-butadiene copolymer, styrene-butadiene-styrene block copolymer, and styrene-butadiene-styrene-butadiene block copolymer.
[0042] Furthermore, hydrogenated styrene-butadiene-styrene block copolymers (SEBS) and hydrogenated styrene-isoprene-styrene block copolymers (SEPS), in which some or all of the double bonds of the conjugated diene polymer blocks of SBS or SIS are hydrogenated, can also be used. Specific examples of such products include Asahi Kasei Chemicals' "ToughTec H" series and Kraton Polymers' "Kraton G" series.
[0043] It is also possible to impart polar functional groups to flexible styrene resins. Specific examples of polar functional groups include acid anhydride groups, carboxylic acid groups, carboxylic acid ester groups, carboxylic acid chloride groups, carboxylic acid amide groups, carboxylic acid bases, sulfonic acid groups, sulfonic acid ester groups, sulfonate chloride groups, sulfonic acid amide groups, sulfonic acid bases, epoxy groups, amino groups, imide groups, and oxazoline groups. Among these, it is preferable to impart acid anhydride groups or epoxy groups. Modified forms of SEBS and SEPS are preferred as soft styrene resins to which polar functional groups are added. Specifically, examples include maleic anhydride-modified SEBS, maleic anhydride-modified SEPS, epoxy-modified SEBS, and epoxy-modified SEPS. Specific products include the "ToughTec M" series from Asahi Kasei Chemicals, the "Dynalon" series from JSR Corporation, and the "Epofriend" series from Daicel Chemical Industries, Ltd.
[0044] Furthermore, the flexible styrene resin may also be a styrene elastomer containing an elastomer component. Specifically, among those mentioned above, examples include a styrene component and block copolymers of butadiene, isoprene, 1,3-pentadiene, etc., and modified versions of these or hydrogenated versions may also be used. More specifically, examples include SBS, SIS, SEBS, and SEPS.
[0045] The elastomer may be anything other than a styrene-based elastomer, and known examples include polyester-based elastomers, polyolefin-based elastomers, diene-based elastomers, acrylic-based elastomers, polyamide-based elastomers, polyurethane-based elastomers, fluorine-based elastomers, and silicone-based elastomers. The elastomer is generally a thermoplastic elastomer. Preferably, the elastomer is a polyester-based elastomer or one of the styrene-based elastomers described above.
[0046] Polyester elastomers are thermoplastic polyesters that have rubber properties at room temperature, and are preferably thermoplastic elastomers mainly composed of polyester block copolymers, and are preferably block copolymers having a high melting point, high crystallinity aromatic polyester as the hard segment and amorphous polyester or amorphous polyether as the soft segment. The soft segment content of the polyester elastomer is at least 20 to 95 mol% of the total segments, and in the case of a block copolymer of polybutylene terephthalate and polytetramethylene glycol (PTMG-PBT copolymer), it is 50 to 95 mol%. The preferred soft segment content is 50 to 90 mol%, particularly 60 to 85 mol%. Among these, polyester ether block copolymers, and especially PTMG-PBT copolymers, are preferred.
[0047] A core-shell type elastomer consists of an innermost layer (i.e., a core) and one or more outer layers (i.e., a shell) covering it. Preferably, the core-shell type elastomer is a core-shell type graft copolymer in which monomer components capable of graft copolymerization with respect to the core are graft copolymerized as the shell.
[0048] Core-shell type graft copolymers typically have a polymer component called a rubber component as the core. In core-shell type graft copolymers, it is preferable that the polymer component constituting the core and monomer components copolymerizable with this polymer component are graft copolymerized as the shell. The method for producing the core-shell type graft copolymer may be any of the following methods: bulk polymerization, solution polymerization, suspension polymerization, or emulsion polymerization. The copolymerization method may be single-stage grafting or multi-stage grafting. However, commercially available core-shell type elastomers can usually be used as is. Examples of commercially available core-shell type elastomers will be given later.
[0049] Specific examples of polymer components forming the core include butadiene-based rubbers such as polybutadiene and styrene-butadiene copolymers, isoprene-based rubbers, acrylic-based rubbers such as polybutyl acrylate, poly(2-ethylhexyl acrylate), and butyl acrylate-2-ethylhexyl acrylate copolymers, silicone-based rubbers such as polyorganosiloxane rubber, silicone-acrylic composite rubbers such as butadiene-acrylic composite rubbers and IPN (Interpenetrating Polymer Network) type composite rubbers consisting of polyorganosiloxane rubber and polyalkyl acrylate rubber, ethylene-α-olefin-based rubbers such as ethylene-propylene copolymers, ethylene-butene copolymers, and ethylene-octene copolymers, ethylene-acrylic rubbers, and fluororubber. These may be used individually or in combination of two or more. Among these, at least one selected from butadiene-based rubbers, acrylic-based rubbers, silicone-based rubbers, and silicone-acrylic composite rubbers is preferred in terms of mechanical properties and surface appearance, and at least one selected from butadiene-based rubbers and silicone-acrylic composite rubbers is more preferred.
[0050] Specific examples of monomer components that can be graft copolymerized with the polymer component of the core and constitute the shell include aromatic vinyl compounds; vinyl cyanide compounds; (meth)acrylic compounds such as (meth)acrylic acid ester compounds, (meth)acrylic acid compounds, and epoxy group-containing (meth)acrylic acid ester compounds such as glycidyl (meth)acrylate; maleimide compounds such as maleimide, N-methylmaleimide, and N-phenylmaleimide; and α,β-unsaturated carboxylic acid compounds such as maleic acid, phthalic acid, and itaconic acid, and their anhydrides (e.g., maleic anhydride). These monomer components may be used individually or in combination of two or more. Among these, aromatic vinyl compounds, vinyl cyanide compounds, and (meth)acrylic compounds are preferred in terms of mechanical properties and surface appearance, and more preferably aromatic vinyl compounds, (meth)acrylic compounds, and especially (meth)acrylic acid ester compounds. Specific examples of aromatic vinyl compounds include styrene, α-methylstyrene, 1-vinylnaphthalene, 4-methylstyrene, 4-propylstyrene, 4-cyclohexylstyrene, 4-dodecylstyrene, 2-ethyl-4-benzylstyrene, 4-(phenylbutyl)styrene, or halogenated styrene, with styrene or α-methylstyrene being more preferred. Specific examples of (meth)acrylic acid ester compounds include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, cyclohexyl (meth)acrylate, and octyl (meth)acrylate. Among these, methyl (meth)acrylate and ethyl (meth)acrylate are preferred because they are relatively easy to obtain, with methyl (meth)acrylate being more preferred. Note that "(meth)acrylic" is a general term for "acrylic" and "methacrylic".
[0051] As the core-shell type elastomer, a core-shell type graft copolymer is particularly preferred, which consists of a core made of at least one polymer component selected from butadiene rubber, acrylic rubber, silicone rubber, and silicone-acrylic composite rubber, and a shell formed by graft copolymerizing a (meth)acrylic compound such as a (meth)acrylic acid ester or an aromatic vinyl compound around the core. The content of the polymer component in the core of the core-shell type graft copolymer is preferably 40% by mass or more, preferably 60% by mass or more, more preferably 70% by mass or more, and even more preferably 80% by mass or more. Furthermore, the total content of (meth)acrylic compounds (especially (meth)acrylic acid esters) and aromatic vinyl compounds in the shell of the core-shell type graft copolymer is preferably 30% by mass or more, more preferably 50% by mass or more, even more preferably 60% by mass or more, and even more preferably 70% by mass or more. In the shell, either the (meth)acrylic compound or the aromatic vinyl compound may be used alone, or they may be used in combination.
[0052] Preferred specific examples of core-shell type elastomers include methyl methacrylate-butadiene-styrene copolymer (MBS), methyl methacrylate-acrylonitrile-butadiene-styrene copolymer (MABS), methyl methacrylate-butadiene copolymer (MB), methyl methacrylate-acrylic rubber copolymer (MA), methyl methacrylate-acrylic rubber-styrene copolymer (MAS), methyl methacrylate-acrylic / butadiene rubber copolymer, methyl methacrylate-acrylic / butadiene rubber-styrene copolymer, and methyl methacrylate-(acrylic / silicone composite rubber) copolymer.
[0053] Examples of commercially available core-shell graft copolymers include "Paraloid EXL2602", "Paraloid EXL2603", "Paraloid EXL2690", "Paraloid EXL2691J", "Paraloid EXL2650J", "Paraloid EXL2655", "Paraloid EXL2311", "Paraloid EXL2313", "Paraloid EXL2315", "Paraloid KM330", "Paraloid KM336P", and "Paraloid KCZ201" from Dow Chemical Japan, and "Metab" from Mitsubishi Chemical Corporation. Examples include "Ren C-223A", "Metabren E-901", "Metabren S-2001", "Metabren W-450A", "Metabren SRK-200", "Metabren E-870A", "Metabren S-2006", "Metabren W-377", and Kaneka's "Kaneace M-210", "Kaneace M-511", "Kaneace M-600", "Kaneace M-400", "Kaneace M-580", "Kaneace M-590", "Kaneace M-711", "Kaneace MR-01", and "Kaneace M-300". These impact-resistant modifiers, such as core-shell type graft copolymers, may be used individually or in combination of two or more types.
[0054] The content of the impact-resistant modifier in this resin composition is preferably 1 part by mass or more and 30 parts by mass or less per 100 parts by mass of the resin components contained in the resin composition. A content of 1 part by mass or more of the impact-resistant modifier moderately mitigates the effects of external impacts, making it easier to improve bending durability and other properties. Furthermore, it prevents a decrease in softening and fluidity during heating of the resin composition, which can be caused by the type of resin used, making it easier to maintain good processability. On the other hand, a content of 30 parts by mass or less allows the modifier to exert an effect commensurate with its content. It also prevents a decrease in various physical properties of the resin composition, such as heat resistance, moisture resistance, and mechanical strength. Additionally, it prevents the resin composition from becoming too fluid during processing. The impact-resistant agent content in this resin composition is more preferably 3 parts by mass or more, even more preferably 5 parts by mass or more, even more preferably 8 parts by mass or more, even more preferably 25 parts by mass or less, even more preferably 20 parts by mass or less, and even more preferably 15 parts by mass or less.
[0055] (Other resin components) As described above, this resin composition may contain resin components other than polycarbonate resin (A) (also referred to as "other resin components"). Such resin components may be commonly known resins, and it is preferable to use resins that are compatible with polycarbonate resin (A). Other resin components may include any resin other than the polycarbonate resin (A) and impact modifiers mentioned above, and thermoplastic resins are preferred. Examples include polycarbonate resins other than the polycarbonate resin (A) mentioned above, polyester resins, polyolefin resins, acrylic resins, polystyrene resins, polyamide resins, polyvinyl chloride resins, polyvinylidene chloride resins, polyvinyl alcohol resins, ethylene-vinyl alcohol resins, polycycloolefin resins, ethylene vinyl acetate copolymer resins, ethylene (meth)acrylate copolymer resins, and acrylonitrile-butadiene-styrene copolymer resins. Among these, polycarbonate resins other than polycarbonate resin (A) and polyester resins are preferred. Using polycarbonate resin improves bending durability and makes it easier to achieve good heat resistance. Note that polycarbonate resins other than polycarbonate resin (A) may be referred to as polycarbonate resin (B) in the following explanation.
[0056] (Polycarbonate resin (B)) As the polycarbonate resin (B), any polycarbonate resin other than the polycarbonate resin (A) having the above-described structural unit (A1) may be used, but it is preferable to use bisphenol-based polycarbonate. By using bisphenol-based polycarbonate, various mechanical properties are improved, and the bending durability described above is also made easier to achieve. Furthermore, heat resistance and other properties are also made easier to achieve.
[0057] Bisphenol-based polycarbonate refers to a material in which 50 mol% or more, preferably 70 mol% or more, and more preferably 90 mol% or more of the structural units derived from dihydroxy compounds are derived from bisphenol. Bisphenol-based polycarbonate may be either a homopolymer or a copolymer. Furthermore, bisphenol-based polycarbonate may have a branched structure, a linear structure, or a mixture of a resin with a branched structure and a resin with only a linear structure.
[0058] Specific examples of bisphenols used in polycarbonate resin (B) include 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), 1,1-bis(4-hydroxyphenyl)-1-phenylethane (bisphenol AP), 2,2-bis(4-hydroxyphenyl)hexafluoropropane (bisphenol AF), 2,2-bis(4-hydroxyphenyl)butane (bisphenol B), bis(4-hydroxyphenyl)diphenylmethane (bisphenol BP), 2,2-bis(3-methyl-4-hydroxyphenyl)propane (bisphenol C), 1,1-bis(4-hydroxyphenyl)ethane (bisphenol E), and bis(4-hydroxyphenyl)methane (bisphenol F). Examples include 2,2-bis(4-hydroxy-3-isopropylphenyl)propane (bisphenol G), 1,3-bis(2-(4-hydroxyphenyl)-2-propyl)benzene (bisphenol M), bis(4-hydroxyphenyl)sulfone (bisphenol S), 1,4-bis(2-(4-hydroxyphenyl)-2-propyl)benzene (bisphenol P), 5,5'-(1-methylethylidene)-bis[1,1'-(bisphenyl)-2-ol]propane (bisphenol PH), 1,1-bis(4-hydroxyphenyl)3,3,5-trimethylcyclohexane (bisphenol TMC), and 1,1-bis(4-hydroxyphenyl)cyclohexane (bisphenol Z). Bisphenols may be used individually or in combination of two or more types.
[0059] As the bisphenol used in the polycarbonate resin (B), 2,2-bis(4-hydroxyphenyl)propane, i.e., bisphenol A, is preferably used, but a portion of the bisphenol A may be replaced with other bisphenols. Bisphenol A homopolycarbonate is most preferred as the polycarbonate resin (B).
[0060] (Polyester resin) Polyester resins used as resin components include polyesters obtained by polycondensation of dicarboxylic acid and dihydroxy compounds. Dicarboxylic acid derivatives such as esters and acid halides may also be used as the dicarboxylic acid in the synthesis of the polyester resin. Using a polyester resin results in good low-temperature fusion properties, making it easier to adhere films formed from this resin composition to other films by heat fusion at relatively low temperatures. It also improves moldability into sheets and other forms.
[0061] From the viewpoint of heat resistance, aromatic dicarboxylic acids are preferred as the dicarboxylic acids used to obtain polyester resins, and therefore, it is preferable that the polyester resin contains structural units derived from aromatic dicarboxylic acids. There are no particular restrictions on the aromatic dicarboxylic acid, and examples include terephthalic acid, isophthalic acid, naphthalene-1,4-dicarboxylic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid, naphthalene-1,5-dicarboxylic acid, anthracenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 4,4'-diphenyletherdicarboxylic acid, 5-sulfoisophthalic acid, sodium 3-sulfoisophthalate, 2-chloroterephthalic acid, 2,5-dichloroterephthalic acid, 2-methylterephthalic acid, etc. Among these, terephthalic acid and isophthalic acid are preferred, and terephthalic acid is more preferred. Aromatic dicarboxylic acids may be used individually or in combination of two or more.
[0062] It is even more preferable that the structural units derived from aromatic dicarboxylic acids are present in the polyester resin at a concentration of, for example, 60 mol% or more, preferably 70 mol% or more, more preferably 80 mol% or more, and even more preferably 90 mol% or more. Furthermore, there is no particular upper limit, and it is acceptable as long as it is 100 mol% or less, but most preferably 100 mol%.
[0063] Furthermore, the polyester resin may contain a small amount of structural units derived from aliphatic dicarboxylic acids (usually 40 mol% or less, for example 30 mol% or less, preferably 20 mol% or less) in addition to structural units derived from aromatic dicarboxylic acids. There are no particular restrictions on the aliphatic dicarboxylic acids, and examples include oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, sebacic acid, azelaic acid, dodecanedionic acid, dimer acid, 1,3 or 1,4-cyclohexanedicarboxylic acid, cyclopentanedicarboxylic acid, and 4,4'-dicyclohexyldicarboxylic acid. The aliphatic dicarboxylic acid may be used alone or in combination of two or more.
[0064] The polyester resin preferably contains structural units derived from chain-like dihydroxy compounds. The inclusion of these structural units in the polyester resin tends to result in good low-temperature fusion properties for the resin composition. The chain-like dihydroxy compounds used in polyester resins may be linear or have a branched structure. Specific examples of chain-like dihydroxy compounds include chain-like dihydroxy compounds with approximately 2 to 18 carbon atoms, such as ethylene glycol (EG), diethylene glycol, 1,2-propylene glycol, 1,3-propanediol, 2,2-dimethyl-1,3-propanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,10-decanediol, 1,12-dodecanediol, triethylene glycol, 1,2-hexadecanediol, and 1,18-octadecanediol, as well as polyglycols such as polytetramethylene ether glycol, polypropylene glycol, and polyethylene glycol. Among these, chain-type dihydroxy compounds having 2 to 12 carbon atoms are preferred, and more preferably one or more selected from ethylene glycol, diethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, and 1,6-hexanediol, with ethylene glycol (EG) being particularly preferred. The chain-type dihydroxy compounds may be used individually or in combination of two or more.
[0065] The polyester resin is preferably a copolymer polyester resin obtained by using two or more dihydroxy compounds as copolymer components. Specifically, it is preferable to use alicyclic dihydroxy compounds in addition to chain-type dihydroxy compounds as the dihydroxy compounds used to obtain the polyester resin. Therefore, it is preferable that the polyester resin has structural units derived from alicyclic dihydroxy compounds in addition to structural units derived from chain-type dihydroxy compounds. Using alicyclic dihydroxy compounds tends to result in good heat resistance, solvent resistance, etc. Specific examples of alicyclic dihydroxy compounds include tetramethylcyclobutanediol, cyclohexanedimethanol (CHDM), tricyclodecanedimethanol, adamantanediol, and pentacyclopentadecanedimethanol. Among these, tetramethylcyclobutanediol and cyclohexanedimethanol are preferred. Of the cyclohexanedimethanol compounds available, there are 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, and 1,4-cyclohexanedimethanol, but 1,4-cyclohexanedimethanol is preferred due to its easy industrial availability. Generally, 2,2,4,4-tetramethyl-1,3-cyclobutanediol is used as the tetramethylcyclobutanediol. The alicyclic dihydroxy compound may be used alone or in combination of two or more. At least cyclohexanedimethanol is preferred as the alicyclic dihydroxy compound, and from the viewpoint of flexibility, tetramethylcyclobutanediol and cyclohexanedimethanol are preferred in combination.
[0066] In polyester resins, the proportion of structural units derived from alicyclic dihydroxy compounds is, for example, 5 mol% or more, preferably 15 mol% or more, more preferably 20 mol% or more, and also, for example, 99 mol% or less, preferably 95 mol% or less, more preferably 90 mol% or less, and even more preferably 80 mol% or less, out of a total of 100 mol% of structural units derived from chain-type dihydroxy compounds.
[0067] Of the total 100 mol% of structural units derived from chain-type dihydroxy compounds and structural units derived from alicyclic dihydroxy compounds, the proportion of structural units derived from alicyclic dihydroxy compounds is preferably 65 mol% or less, more preferably 55 mol% or less, even more preferably 45 mol% or less, and even more preferably 40 mol% or less, from the viewpoint of low-temperature fusion properties. However, in terms of heat resistance and solvent resistance, particularly in high-temperature environments, the polyester resin preferably has a proportion of structural units derived from alicyclic dihydroxy compounds in the total 100 mol% of structural units derived from chain-like dihydroxy compounds and alicyclic dihydroxy compounds that is more than 65 mol%, more preferably 70 mol% or more, even more preferably 80 mol% or more, and even more preferably 90 mol% or more.
[0068] As the dihydroxy compound used in the polyester resin, dihydroxy compounds other than chain-type dihydroxy compounds and alicyclic dihydroxy compounds (also referred to as "other dihydroxy compounds") may be used, as long as they do not impair the effects of the present invention. In the polyester resin, the content of structural units derived from other dihydroxy compounds is, for example, 20 mol% or less, preferably 10 mol% or less, more preferably 5 mol% or less, and most preferably 0 mol% per 100 moles of structural units derived from dihydroxy compounds in the polyester resin. Other dihydroxy compounds include p-xylenediol, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), tetrabromobisphenol A, tetrabromobisphenol A-bis(2-hydroxyethyl ether), α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene (bisphenol M), 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, 2,2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C), 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane (bisphenol AF), and 1,1-bis(4-hydroxyphenyl)decane.
[0069] Among the above, the polyester resin preferably contains structural units derived from ethylene glycol and structural units derived from cyclohexanedimethanol, from the viewpoint of low-temperature fusion properties, moldability, heat resistance, and solvent resistance, and also preferably contains structural units derived from ethylene glycol, structural units derived from cyclohexanedimethanol, and structural units derived from tetramethylcyclobutanediol.
[0070] The polyester resin is preferably amorphous polyester. Using amorphous polyester tends to result in good adhesion of the film (hologram layer) formed from this resin composition to other components such as resin films. The amorphous polyester can be any polyester that is substantially non-crystalline. Examples of substantially non-crystalline polyesters (including those with low crystallinity) include polyesters that do not show a clear crystal melting peak when heated by differential scanning calorimeter (DSC), polyesters that have crystallinity but have a slow crystallization rate and do not become highly crystalline when molded by extrusion film formation, and polyesters that have crystallinity but have a low crystal melting heat (ΔHm) of 10 J / g or less when heated by differential scanning calorimeter (DSC). In other words, amorphous polyester in this invention also includes "crystalline polyester that is in a non-crystalline state."
[0071] This resin composition may contain components other than resin components and impact modifiers, for example, it may contain other additives (also called other additives). Other additives include, specifically, those commonly used in a wide range of resin materials, such as fillers, colorants, ionic acid generators, antioxidants, heat stabilizers, process stabilizers, UV absorbers, light stabilizers, matting agents, processing aids, metal deactivators, residual polymerization catalyst deactivators, antibacterial and antifungal agents, antiviral agents, antistatic agents, lubricants, flame retardants, pigments, dyes, and other colorants. For these as well, the amount added should be the amount normally used, depending on the intended purpose. These additives may be used individually or in combination of two or more.
[0072] [Hologram layer] This resin composition can be used for a hologram layer. The hologram layer of the present invention may be made of the above-described resin composition. Therefore, the hologram layer contains a polycarbonate resin (A) and a microhologram, and may also contain resin components other than the polycarbonate resin (A), impact modifiers, and other additives as needed. The details and content of each component in the hologram layer are as described above. However, the content of each component, which is based on the polycarbonate resin (A), resin components, or the total amount of the resin composition as described above, may be based on the polycarbonate resin (A), resin components, or the total amount of the hologram layer as described above. Therefore, the microhologram content in the hologram layer is preferably 0.01 to 10 parts by mass per 100 parts by mass of polycarbonate resin (A) contained in the hologram layer.
[0073] As described later, the hologram layer of the present invention is preferable because, for example, by employing an extrusion method by kneading, and dispersing microholograms within the layer to form a sheet-like hologram layer, it is difficult to scrape off the security portion, and security performance is further improved from the viewpoint of preventing counterfeiting.
[0074] The thickness of the hologram layer is preferably in the range of 5 μm to 75 μm. A thickness of 5 μm or more results in good heat resistance of the hologram layer, while a thickness of 75 μm or less makes it easier to maintain the desired randomness. The thickness of the hologram layer is more preferably 10 μm to 60 μm.
[0075] (Method for producing the resin composition and hologram layer) This resin composition may be obtained by mixing, for example, polycarbonate resin (A), microholograms, and other raw materials that constitute this resin composition, such as impact absorbers, other additives, and resin components other than polycarbonate resin (A), which may be added as needed. The raw materials may be mixed by melt-kneading while heating in an extruder, plast mill, or the like. The microholograms may also be mixed in the form of resin pellets as a masterbatch, as described later. Here, the temperature during kneading should be below the temperature at which the heat deformation of the microhologram begins, for example, 180°C to 320°C, preferably 200°C to 310°C, more preferably 220°C to 300°C, and even more preferably 220°C to 250°C.
[0076] The hologram layer can be obtained, for example, by extrusion molding of the resin composition obtained by melt-kneading as described above. The extrusion temperature should be below the temperature at which the heat deformation of the microhologram begins, for example, 180°C to 320°C, preferably 200°C to 310°C, more preferably 220°C to 300°C, and even more preferably 220°C to 250°C.
[0077] [Resin pellets] This resin composition may be used as resin pellets. The resin pellets of the present invention consist of this resin composition containing a polycarbonate resin (A) and microholograms. Typically, the resin pellets of the present invention are used as a masterbatch for incorporating microholograms into a resin composition that constitutes a hologram layer or the like. Therefore, the resin pellets of the present invention are preferably composed of this resin composition with a relatively high microhologram content. In the resin composition constituting the resin pellets of the present invention, the microhologram content is preferably 1 to 30 parts by mass, more preferably 5 to 20 parts by mass, and even more preferably 5 to 10 parts by mass, per 100 parts by mass of polycarbonate resin (A).
[0078] Furthermore, as described above, the resin composition constituting the resin pellets of the present invention may optionally contain resin components other than polycarbonate resin (A), impact modifiers, and other additives. However, since the resin pellets of the present invention are typically used as a masterbatch for microholograms, as described above, the resin components other than polycarbonate resin (A), impact modifiers, and other additives, as well as other components other than polycarbonate resin (A) and microholograms, do not need to be included, or if they are included, only in small amounts. Therefore, the total amount of polycarbonate resin (A) and microholograms in the resin composition constituting the resin pellets should be, for example, 80 to 100% by mass, preferably 90 to 100% by mass.
[0079] The shape of the resin pellet is not particularly limited, but may be spherical, ellipsoidal, cylindrical, elliptic prism, or rectangular prism. The size of the resin pellet is not particularly limited, but the maximum length should be, for example, 10 to 70 mm, preferably 25 to 50 mm. The maximum length is the longest part of the resin pellet when viewed from above.
[0080] By forming the hologram layer using resin pellets, microholograms can be easily dispersed within the hologram layer, improving production efficiency. When forming a hologram layer using resin pellets, it is preferable to first knead the resin pellets with a polycarbonate resin (A) or the like to obtain the main resin composition for hologram layer formation, and then mold the main resin composition for hologram layer formation by extrusion molding or the like to obtain a film-like hologram layer.
[0081] Furthermore, the method for producing the resin pellets of the present invention is not particularly limited, but one example is to extrude the resin composition obtained by kneading each component as described above into strands and then pelletize it by cutting or the like. In this case, it is preferable to cool and solidify the resin composition extruded into strands with water or the like before pelletizing it.
[0082] [Laminated structure] The laminate of the present invention is a laminate including the hologram layer described above. The laminate of the present invention is, for example, a laminate comprising a hologram layer and a resin sheet (A) laminated on one side of the hologram layer, wherein the resin sheet (A) is made of a resin composition A containing a polycarbonate resin (A). As described above, the polycarbonate resin (A) has structural units (A1) derived from a dihydroxy compound having a part of its structure represented by the above formula (1).
[0083] By using such a laminate, it is possible to use it in combination with laminates having a hologram layer that were conventionally manufactured using transfer foil. More specifically, it is possible to use it in combination with laminates that were conventionally manufactured using transfer foil consisting of a substrate such as PET, a release layer, a hologram forming layer, a reflective layer (protective layer), and an adhesive layer, where the layers from the release layer onward are transferred to a transfer target such as a core sheet by peeling at the interface between the substrate and the release layer, the substrate is peeled off, and another transparent resin sheet is laminated to protect the hologram forming layer. Furthermore, since it does not require a base material such as PET, no waste material is generated. In addition, by using a resin sheet (A) as described later, it is possible to press-molde at low temperatures, thereby reducing thermal damage to the hologram layer.
[0084] The laminate of the present invention (hereinafter sometimes simply referred to as "this laminate") will be described below with reference to Figure 1. In the laminate 100 of the present invention, a resin sheet (A) 101 is laminated on one side of the hologram layer 102. Preferably, a resin sheet (B) is laminated on the other side of the hologram layer 102. In the example shown in Figure 1(a), a configuration of resin sheet (A) 101 / hologram layer 102 / resin sheets (B) 103, 104, 105 is illustrated, and resin sheet (B) shows an example of a three-layer laminate. In Figure 1(a), resin sheet (A) 101 may constitute an overlay layer, resin sheets (B) 103, 104 may constitute a core layer, and resin sheet (B) 105 may constitute an overlay layer. Furthermore, as shown in Figure 1(b), the laminate 100 may have a resin sheet (A) 101 laminated on one side of the hologram layer 102, while the other side is left unlaminated, with the hologram layer 102 forming the outermost layer of the laminate 100. In Figure 1(b), there is one resin sheet (A) laminated on one side of the hologram layer 102, but there may be multiple resin sheets laminated on one side.
[0085] In this laminate, unlike conventional methods where a separate transparent resin sheet is laminated after peeling off the transfer foil base sheet, a release layer is not necessary between the resin sheet (A) 101 and the hologram layer 102. However, a release layer may be present as long as it does not hinder the effects of the present invention. Furthermore, as described later, the resin sheet (A) 101 is made of a resin composition A containing a specific polycarbonate resin (A), and has high adhesion to other resin layers, particularly hologram layers containing polycarbonate resin (A). Therefore, an adhesive layer is not necessary between the resin sheet (A) 101 and the hologram layer 102. However, an adhesive layer may be present as long as it does not hinder the effects of the present invention. Furthermore, in order to ensure adhesion between the hologram layer 102 and the resin sheet (B) 103, an adhesive layer may be provided on the other side of the hologram layer 102 opposite to the resin sheet (A) 101, but it is not necessary to have an adhesive layer. For example, as will be described later, if polycarbonate resin (A) is not the main component of the resin composition B, it is preferable to place an adhesive layer between the hologram layer 102 and the resin sheet (B) 103. On the other hand, if polycarbonate resin (A) is the main component of the resin composition B, it is preferable not to place an adhesive layer between the hologram layer 102 and the resin sheet (B) 103. The adhesive layer may be made of a known resin layer or the like.
[0086] <Resin sheet (A)> As described above, the resin sheet (A) in this laminate consists of a resin composition A containing a polycarbonate resin (A) having structural units derived from a dihydroxy compound having a portion represented by formula (1) above in part of its structure. Details of the polycarbonate resin (A) are as described above.
[0087] Resin composition A may use only polycarbonate resin (A) as the resin component, but may also contain resin components other than polycarbonate resin (A) to the extent that it does not contradict the spirit of the present invention. The resin components constituting resin composition A preferably contain polycarbonate resin (A) as the main component, and the amount of polycarbonate resin (A) is, for example, 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, and most preferably 100% by mass, based on the total amount of resin components contained in resin composition A.
[0088] <Resin sheet (B)> Preferably, a resin sheet (B) is laminated on the other side of the hologram layer, i.e., the side opposite to the side on which resin sheet (A) is laminated. Resin sheet (B) may be made of resin composition B containing a polycarbonate resin, and the polycarbonate resin is not particularly limited. That is, known polycarbonate resins can be used. Therefore, the polycarbonate resin contained in resin sheet (B) may be a polycarbonate resin (B) such as bisphenol polycarbonate. Details of the polycarbonate resin (B) are as described above.
[0089] On the other hand, in this laminate, it is also preferable to use a resin composition containing the polycarbonate resin (A) described above as the resin composition B constituting the resin sheet (B). By using polycarbonate resin (A) in the resin sheet (B), the biomass content of the final product can be improved and the environmental burden can be reduced. In addition, because the resin sheet (B) contains polycarbonate resin (A), the film can be fused at a low temperature when heat-pressed, resulting in good heat-press suitability and reduced damage to the hologram layer.
[0090] Resin composition B may use only polycarbonate resin as the resin component, but may also contain resin components other than polycarbonate resin as long as it does not contradict the spirit of the present invention. The resin components constituting resin composition B preferably contain polycarbonate resin as the main component, and the amount of polycarbonate resin is, for example, 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, and most preferably 100% by mass, based on the total amount of resin components contained in resin composition B. In one preferred embodiment, the resin components constituting the resin composition B may mainly contain polycarbonate resin (B), and the amount of polycarbonate resin (B) is, for example, 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, and most preferably 100% by mass, based on the total amount of resin components contained in the resin composition B. In another preferred embodiment, the resin components constituting resin composition A may mainly contain polycarbonate resin (A), and the amount of polycarbonate resin (A) is, for example, 50% by mass or more, preferably 70% by mass or more, more preferably 90% by mass or more, and most preferably 100% by mass, based on the total amount of resin components contained in resin composition B.
[0091] The following describes resin composition A and resin composition B. When "resin composition X" is mentioned, it refers to both resin composition A and resin composition B. In addition to being used in the resin sheets (A) and resin sheets (B) described above, resin composition X can also be used as a core sheet, overlay sheet, laser marking sheet, etc., as described later.
[0092] (Inorganic filler) The resin composition X may or may not contain an inorganic filler. Examples of inorganic fillers include titanium dioxide, talc, mica, calcium carbonate, magnesium carbonate, barium oxide, carbon black, silica, lead titanate, potassium titanate, barium titanate, zircon oxide, magnesium oxide, calcium oxide, aluminum oxide, zinc sulfide, antimony oxide, zinc oxide, boron nitride, aluminum nitride, and barium sulfate. Among these, metal oxides are preferred as inorganic fillers.
[0093] As the inorganic filler, at least one selected from the inorganic fillers listed above with a refractive index of 2 or higher is preferred, more preferably 2.2 or higher, and even more preferably 2.4 or higher. Examples of inorganic fillers with a refractive index of 2 or higher include titanium dioxide, lead titanate, potassium titanate, barium titanate, zircon oxide, magnesium oxide, calcium oxide, zinc sulfide, antimony oxide, zinc oxide, aluminum oxide, boron nitride, aluminum nitride, calcium carbonate, magnesium carbonate, and barium sulfate. Using an inorganic filler with a refractive index of 2 or higher provides even better opacity and makes it easier to color the material white. From these viewpoints, titanium dioxide is more preferred as the inorganic filler. There are no particular limitations on titanium dioxide, but examples include rutile-type titanium dioxide and anatase-type titanium dioxide. The refractive index of the inorganic filler can be measured by the Becke line method.
[0094] The average particle size of the inorganic filler is not particularly limited, but is, for example, 0.01 μm or more and 1 μm or less, preferably 0.05 μm or more and 0.8 μm or less, more preferably 0.08 μm or more and 0.6 μm or less, even more preferably 0.1 μm or more and 0.5 μm or less, and even more preferably 0.12 μm or more and 0.4 μm or less. Note that the average particle size refers to the average primary particle size observed with a scanning electron microscope.
[0095] When used, for example, on the surface side of a laminate as a resin sheet (A) or resin sheet (B), it may be configured to be transparent and to ensure the visibility of the hologram layer by not containing inorganic fillers or by having a low inorganic filler content. In particular, it is preferable that the resin composition A constituting the resin sheet (A) is configured to be non-inorganic filler-free or to have a low inorganic filler content. More specifically, the inorganic filler content is preferably less than 10 parts by mass, more preferably less than 8 parts by mass, even more preferably less than 5 parts by mass, and particularly preferably 0 parts by mass, per 100 parts by mass of the resin component in the resin composition X. Here, "surface side" refers to the surface on which the hologram layer is viewed.
[0096] Furthermore, by containing a certain amount or more of inorganic filler, resin composition X can have reduced light transmittance, for example, exhibiting opacity. Therefore, resin composition X can be suitably used in cards and passports, and is particularly suitable for use in core sheets, as described later. Accordingly, it is especially preferable that resin composition B constituting the resin sheet (B) contains an inorganic filler. Specifically, the inorganic filler content in resin composition X is preferably 5 parts by mass or more and 90 parts by mass or less per 100 parts by mass of resin components contained in resin composition X. By having an inorganic filler content of 5 parts by mass or more, the opacity of the film formed from resin composition X can be improved. Furthermore, by having an inorganic filler content of 90 parts by mass or less, it becomes easier to maintain good mechanical properties such as bending resistance. From these viewpoints, the inorganic filler content is more preferably 8 parts by mass or more, even more preferably 10 parts by mass or more, and if higher opacity is required, even more preferably 20 parts by mass or more, even more preferably 25 parts by mass or more, even more preferably 30 parts by mass or more, and even more preferably 35 parts by mass or more. Furthermore, the inorganic filler content is more preferably 80 parts by mass or less, even more preferably 70 parts by mass or less, even more preferably 60 parts by mass or less, even more preferably 50 parts by mass or less, and even more preferably 45 parts by mass or less, but if higher opacity is not required, it may be 40 parts by mass or less.
[0097] As described above, the inorganic filler is preferably titanium dioxide. Therefore, the titanium dioxide content in resin composition X is preferably 5 parts by mass or more and 90 parts by mass or less per 100 parts by mass of resin components contained in resin composition X. Furthermore, the titanium dioxide content is more preferably 8 parts by mass or more, even more preferably 10 parts by mass or more, even more preferably 20 parts by mass or more, even more preferably 25 parts by mass or more, even more preferably 30 parts by mass or more, and even more preferably 35 parts by mass or more. Furthermore, the titanium dioxide content is more preferably 80 parts by mass or less, even more preferably 70 parts by mass or less, even more preferably 60 parts by mass or less, even more preferably 50 parts by mass or less, even more preferably 45 parts by mass or less, and may also be 40 parts by mass or less.
[0098] Furthermore, in one preferred embodiment, the resin composition A constituting the resin sheet (A) may contain no inorganic filler or have a low inorganic filler content, while the resin composition B constituting the resin sheet (B) may contain a certain amount or more of inorganic filler. In this embodiment, the laminate can be made easily visible from the resin sheet (A) side, and the hologram layer can be concealed by the resin sheet (B), making it impossible to see the hologram layer from the opposite side. In this case, the inorganic filler content in resin composition B and resin composition A is as described above. In this case, it is preferable that the resin sheet (B) constitutes, for example, a core sheet (core layer), and the resin sheet (A) constitutes an oversheet (overlay layer) or a laser marking sheet (laser marking layer). Furthermore, both resin composition A constituting resin sheet (A) and resin composition B constituting resin sheet (B) may contain inorganic fillers within the above-mentioned content range.
[0099] [Colorants] The resin composition X may contain a coloring agent. By containing a coloring agent, the resin sheet (resin sheet (A) or resin sheet (B)) formed from the resin composition X can be colored and printed on. The coloring agent is preferably a laser coloring agent. By containing a laser coloring agent, the resin sheet formed from the resin composition X can be laser printed on. In particular, it is preferable that the resin composition B constituting resin sheet (B) contains a coloring agent.
[0100] The laser colorant is not particularly limited as long as it has the function of generating heat when irradiated with a laser beam. It may be a so-called self-coloring colorant that emits color itself when irradiated with laser light, or it may not emit color itself. When the laser colorant generates heat, at least the surrounding forming material carbonizes, and the desired printing appears on the resin sheet. Furthermore, if a self-coloring laser colorant is used, the coloring of the laser colorant and the coloring of the carbonized material produced by the carbonization of the forming material of the resin sheet synergistically produce printing with a deep color and excellent visibility. When the laser colorant emits color, the color is not particularly limited, but from the viewpoint of visibility, it is preferable to use a laser colorant that can emit dark colors including black, navy blue, and brown.
[0101] The laser colorant may be a metal oxide or a compound other than a metal oxide. The metal oxide is not limited as long as it has a laser coloring effect, and examples include iron oxide, copper oxide, zinc oxide, tin oxide, cobalt oxide, nickel oxide, bismuth oxide, indium oxide, antimony oxide, tungsten oxide, neodymium oxide, mica, hydrotalcite, montmorillonite, and smectite. In addition to metal oxides, other laser colorants include metals such as iron, copper, zinc, tin, gold, silver, cobalt, nickel, bismuth, antimony, and aluminum, as well as their salts such as iron chloride, iron nitrate, iron phosphate, copper chloride, copper nitrate, copper phosphate, zinc chloride, zinc nitrate, zinc phosphate, nickel chloride, nickel nitrate, bismuth subcarbonate, and bismuth nitrate. Metal hydroxides such as magnesium hydroxide, lanthanum hydroxide, nickel hydroxide, and bismuth hydroxide, as well as metal borides such as zirconium boride, titanium boride, and lanthanum boride, can also be used. Among metal borides, hexaborides are preferred because they have near-infrared absorption capabilities, and lanthanum hexaboride is particularly favored due to its excellent laser light absorption efficiency. Dyes and carbon black can also be used. The laser colorant may be used alone in the resin composition, or two or more may be used in combination.
[0102] As a laser colorant, it is preferable to use a metal oxide from the viewpoint of laser printability. In particular, from the viewpoint of laser coloring effect and cost, it is preferable to use a bismuth-based metal oxide such as bismuth oxide or a metal oxide containing bismuth and at least one metal selected from Zn, Ti, Al, Zr, Sr, Nd, and Nb, and among these, it is more preferable to use bismuth oxide. Bismuth oxide produces good color even in relatively small amounts, so it is possible to achieve excellent laser coloration without impairing the transparency of the resin sheet.
[0103] The average particle size of the laser colorant is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 3 μm or less, and particularly preferably 2 μm or less. If the particle size is 10 μm or less, there is no risk of a significant decrease in transparency. Here, particle size refers to the median diameter (d50) determined by the laser diffraction-scattering method. The lower limit of the average particle size of the laser colorant is not limited, but from the viewpoint of printing performance and productivity, it is preferably 0.05 μm or more, more preferably 0.1 μm or more, and even more preferably 0.3 μm or more.
[0104] Examples of commercially available metal oxides include "42-903A" and "42-920A" from TOMATEC Corporation, and "Iliotec 8820" and "Iliotec 8825" from Merck Performance Materials K.K. When using metal oxides as laser colorants, metal oxides alone may be used, or a combination of metal oxides and other compounds may be used.
[0105] The content of the laser colorant in the resin composition X should be set appropriately to ensure good laser printability. The content of the colorant, such as the laser colorant, is not particularly limited, but is preferably 0.01 parts by mass or more, more preferably 0.03 parts by mass or more, even more preferably 0.06 parts by mass or more, and preferably 3 parts by mass or less, more preferably 2 parts by mass or less, even more preferably 1 part by mass or less, and particularly preferably 0.8 parts by mass or less, per 100 parts by mass of the resin component contained in the resin composition X.
[0106] When a laser colorant other than carbon black is used, the content is as described above. However, when carbon black is used as the laser colorant, the content of the laser colorant is not particularly limited, but is preferably 0.0001 parts by mass or more, more preferably 0.0005 parts by mass or more, even more preferably 0.001 parts by mass or more, and preferably 0.1 parts by mass or less, more preferably 0.05 parts by mass or less, even more preferably 0.01 parts by mass or less, and particularly preferably 0.005 parts by mass or less, per 100 parts by mass of the resin component contained in resin composition X.
[0107] Furthermore, resin composition X may contain an impact-resistant agent. By containing an impact-resistant agent, resin composition X can mitigate the effects of external impacts such as bending and impact during actual use, thereby improving the bending durability of films and other materials formed from resin composition X. It also helps to prevent a decrease in softening and fluidity during heating, making it easier to maintain good processability. Details of the impact-resistant agent are as described above. A detailed explanation of the impact-resistant agent content in resin composition X is also provided in the description of this resin composition.
[0108] Resin composition A may contain resin components other than polycarbonate resin (A). Such resin components may be commonly known resins, and it is preferable to use resins that are compatible with polycarbonate resin (A). Other resin components may be any resin other than the polycarbonate resin (A) and impact-resistant modifier mentioned above, and thermoplastic resins are preferred, with specific examples being described in this resin composition. In resin composition A, other resin components such as polycarbonate resin (B) and polyester resin are preferred, in addition to polycarbonate resin (A). Using polycarbonate resin (B) improves bending durability and makes it easier to achieve good heat resistance.
[0109] Similarly, resin composition B may contain resin components other than polycarbonate resin. Such resin components may include commonly used, known resins, and it is preferable to use resins that are compatible with polycarbonate resin. Examples of such resin components include other resin components besides the polycarbonate resin mentioned above, and polyester resins are preferred. Furthermore, if polycarbonate resin (B) is the main component of resin composition B, polycarbonate resin (A) can also be used as a resin component other than polycarbonate resin (B). Similarly, if polycarbonate resin (A) is the main component, polycarbonate resin (B) can also be used as a resin component other than polycarbonate resin (A).
[0110] Resin composition X may contain components other than resin components, fillers, colorants, impact modifiers, and ionic acid generators, for example, other additives (other additives). Examples of other additives include those commonly used in a wide range of resin materials, and specifically, additives other than the fillers, colorants, and ionic acid generators listed in the above-mentioned resin composition. Other additives should be added in amounts typically used depending on the intended purpose. These additives may be used individually or in combination of two or more.
[0111] The resin sheet (A) may have a single-layer structure or a multi-layer structure. In the case of a multi-layer resin sheet (A), the number of layers is not particularly limited as long as it has two or more resin layers. In the case of a multi-layer resin sheet (A), at least the resin layer closest to the hologram layer should be made of the resin composition A containing the polycarbonate resin (A) described above, but it is preferable that each resin layer is made of the resin composition A. In the case of a multi-layer resin sheet (A), the composition of the resin composition constituting each resin layer may be the same or different from each other. Furthermore, the resin sheet (B), like the resin sheet (A), may have a single-layer structure or a multi-layer structure. The number of layers in the multi-layer resin sheet (B) is not particularly limited, as long as it has two or more resin layers. In the multi-layer resin sheet (B), each resin layer may be made of the resin composition B containing the polycarbonate resin described above, or it may be made of other resin compositions, but at least the resin layer closest to the hologram layer should be made of the resin composition B described above. Alternatively, each resin layer may be made of the resin composition B described above. In the multi-layer resin sheet (B), the composition of the resin composition constituting each resin layer may be the same or different from each other.
[0112] The thickness of resin sheet (A) and resin sheet (B) is not particularly limited and can be adjusted as appropriate depending on the intended use, but for example, they are 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, even more preferably 20 μm or more, and even more preferably 40 μm or more, and also, for example, 1000 μm or less, preferably 500 μm or less, more preferably 300 μm or less, even more preferably 250 μm or less, and even more preferably 200 μm or less. Setting the thickness of the resin sheet above a certain level makes it easier for the resin sheet to perform its appropriate function. For example, it makes it easier to ensure opacity when inorganic fillers are included. On the other hand, setting the thickness below a certain level makes it easier to make cards and passports thinner.
[0113] (Method for producing resin composition X, and resin sheets (A) and resin sheets (B)) The resin composition X may be obtained, for example, by mixing the raw materials that constitute the resin composition X, such as resin components and additives that are added as needed. The mixing of the raw materials may be carried out by melt-kneading while heating in an extruder, plast mill, or the like. Furthermore, although the resin sheet (A) and resin sheet (B) can be manufactured by known methods, it is preferable to obtain a resin composition X for forming the resin sheet (A) and resin sheet (B) as described above, and then make the resin composition X into a film. The method for making the resin composition X into a film is not particularly limited, and may include press molding or extrusion molding, but extrusion molding is preferred in terms of productivity and cost.
[0114] Furthermore, if the resin sheet has a multilayer structure, resin compositions for forming each layer may be prepared, and multiple resin layers may be laminated by a known lamination method while forming each resin layer from each resin composition. Alternatively, a composition for forming another resin layer may be melt-extruded and laminated onto a resin layer formed from any of the resin compositions. A multilayer structure may also be formed by co-extrusion. From the viewpoint of productivity and cost, it is preferable to adopt the co-extrusion method. In a laminated film, the resin composition for forming each layer is preferably obtained by mixing components for forming each layer according to the composition of each layer.
[0115] (Method of manufacturing a laminate) This laminate can be manufactured by laminating a resin sheet (A), or resin sheet (A) and resin sheet (B), onto a hologram layer. It is preferable that the hologram layer 12 be manufactured in advance by an extrusion molding method or the like, as described above. Here, the hologram layer and at least one of the resin sheets (A) and (B) are preferably bonded together by heat pressing (i.e., by press molding). Here, by using polycarbonate resin (A) for resin sheets (A) and resin sheets (B), they can be bonded to the hologram layer even when press-molded at a temperature that would not be possible if a general-purpose polycarbonate resin (bisphenol polycarbonate) were used. For example, at least one of the resin sheets (A) and resin sheets (B) can be bonded to the hologram layer even when heat-pressed at a temperature 20°C to 40°C lower than when a general-purpose polycarbonate resin is used. Depending on the pressing method, using the glass transition temperature as a reference, it is preferable to press-bond them at a temperature, for example, 25 to 65°C, preferably 30 to 60°C higher than the glass transition temperature (Tg) of the polycarbonate resin (A) contained in resin sheet (A) or resin sheet (B). Specifically, at least one of the resin sheets (A) and (B) should be pressed together by pressing at a temperature of 160°C or lower, preferably 130 to 159°C. In this case, at least one of the resin sheets (A) and (B) should be a resin composition X containing polycarbonate resin (A) as described above. Furthermore, in the present invention, it is preferable that at least the resin sheet (A) is made of a resin composition X containing polycarbonate resin (A), and that the hologram layer and the resin sheet (A) are pressed and compressed at a temperature of 160°C or lower. More preferably, both resin sheets (A) and (B) are made of a resin composition X containing polycarbonate resin (A), and that both the hologram layer and the resin sheets (A) and (B) are pressed and compressed at a temperature of 160°C or lower.
[0116] More specifically, the manufacturing method involves first bonding a hologram layer onto a resin sheet (A) using a press or similar method as described above. If a resin sheet (B) is to be provided, the laminate, in which the hologram layer is formed on resin sheet (A), should be laminated such that the side of the hologram layer not facing resin sheet (A) is in contact with resin sheet (B), and then bonded together using a press or similar method. Details of the bonding by press are as described above. However, the lamination order is not limited to the above; resin sheet (B) may be laminated first, followed by resin sheet (A), or both resin sheet (A) and resin sheet (B) may be laminated to both sides of the hologram layer in a single press.
[0117] Furthermore, if necessary, one or both of the resin sheets (A) and (B) can be formed by laminating multiple sheets and press-molding them to create a single resin sheet (A) or resin sheet (B). In this way, when forming one or both of the resin sheets (A) and (B) from multiple sheets to create a multilayer structure, it is preferable to make each sheet from a resin composition X containing polycarbonate resin (A). By making each sheet from a resin composition X containing polycarbonate resin (A), a laminate can be formed at a low temperature of 160°C or less without using adhesive layers or the like. However, in the manufacture of the laminate, adhesive layers may be provided between the layers if necessary.
[0118] <Card or passport> This resin composition, hologram layer, and laminate are preferably used in cards or passports. As for cards, they can be used in various types of cards such as IC cards, magnetic cards, driver's licenses, residence cards, qualification certificates, employee IDs, student IDs, health insurance cards, My Number cards, seal registration certificates, vehicle registration certificates, tag cards, prepaid cards, cash cards, bank cards, credit cards, SIM cards, ETC cards, identification cards, information-carrying cards, smart cards, B-CAS cards, and memory cards. Furthermore, in passports, this resin composition, hologram layer, and laminate are preferably used in the data pages.
[0119] The card or passport of the present invention (more specifically, the data page of a passport) may include the laminate described above. The card or passport is usually composed of multiple resin films, and it is preferable that at least a portion of them is the laminate described above. A card or passport may include a core sheet. In addition to the core sheet, a card or passport may also include at least one of a laser marking sheet and an oversheet. In a laminate, the core sheet, laser marking sheet, and oversheet may be referred to as the core layer, laser marking layer, and overlay layer, respectively. Passports or cards may be manufactured by die-cutting this laminate, or by overlapping this laminate with other sheets, pressing and heat-fusing them, and then die-cutting them. Alternatively, instead of heat-fusing, adhesives may be used to bond the sheets together as appropriate.
[0120] If the resin sheet (A) or resin sheet (B) does not contain inorganic fillers, or contains inorganic fillers in an amount that does not impair transparency, then in one embodiment, the resin sheet (A) or resin sheet (B) does not need to contain a coloring agent, but it is also preferable that it contains a coloring agent. In the embodiment without a coloring agent, the resin sheet (A) or resin sheet (B) can be used as an oversheet, and in the embodiment with a coloring agent, the resin sheet (A) or resin sheet (B) can be used as a laser marking sheet. As described later, when a core sheet is provided on the other side of the hologram layer, it is preferable that the oversheet or laser marking sheet be placed outside the core layer (i.e., further away from the hologram layer) on one side of the hologram layer.
[0121] On the other hand, the resin sheet (A) or resin sheet (B) may be made of a resin composition X containing an inorganic filler in an amount of 5 to 90 parts by mass per 100 parts by mass of the resin component, but in this embodiment, the resin sheet (A) or resin sheet (B) is preferably used as a core sheet. Furthermore, in the case where there are multiple resin sheets (B), in one embodiment, the resin sheet (B) closest to the hologram layer among the multiple resin sheets (B) may be made of a resin composition B containing inorganic filler in an amount of 5 parts by mass or more and 90 parts by mass or less per 100 parts by mass of resin component, as described above. In this embodiment, the more preferred range for the inorganic filler content is as described above.
[0122] Furthermore, if a resin sheet (B) or core sheet is provided on the other side of the hologram layer, the resin sheet (B) outside the core sheet may contain a coloring agent as described above to constitute the laser marking layer, or it may contain no inorganic filler, or it may contain an inorganic filler in an amount that does not impair transparency, while not containing a coloring agent to constitute an oversheet. In the case of having multiple resin sheets (B), in one embodiment, the sheet (B) closest to the hologram layer among the multiple resin sheets (B) may be made of a resin composition B containing inorganic filler in an amount of 5 parts by mass or more and 90 parts by mass or less per 100 parts by mass of resin component, as described above. In this embodiment, the more preferred range for the inorganic filler content is as described above.
[0123] Examples of embodiments of the laminate used in the construction of a card or passport in the present invention include resin sheet (A) / hologram layer / resin sheet (B) / resin sheet (B), resin sheet (A) / hologram layer / resin sheet (B) / resin sheet (B) / resin sheet (B) (as shown in Figure 1(a)), resin sheet (A) / adhesive layer / hologram layer / resin sheet (B) / resin sheet (B), resin sheet (A) / hologram layer / adhesive layer / resin sheet (B) / resin sheet (B), resin sheet (A) / adhesive layer / hologram layer / adhesive layer / resin sheet (B) / resin sheet (B), and the like. Furthermore, the resin sheet may be laminated on only one side of the hologram layer. Specifically, examples include hologram layer / resin sheet (A) (as shown in Figure 1(b)), hologram layer / resin sheet (A) / resin sheet (A), hologram layer / adhesive layer / resin sheet (A), and hologram layer / adhesive layer / resin sheet (A) / resin sheet (A). In these laminates, the hologram layer may constitute the outermost layer. Furthermore, the present invention is not limited to the above configuration, and when this laminate is used in cards, passports, etc., additional layers may be laminated. In addition, layers other than the resin sheet (A), resin sheet (B), hologram layer, and adhesive layer described above may be laminated.
[0124] Preferably, the card is a card 20A comprising a laser marking sheet 1 and a core sheet 2, with the laser marking sheet 1 on one or both sides of the core sheet 2, as shown in Figure 2(a). Furthermore, a hologram layer 102 is provided between the laser marking sheet 1 and the core sheet 2. Furthermore, as shown in Figure 2(b), a card 20B is also preferable, which further includes an oversheet 4, with the oversheet 4 further laminated as a protective layer on the outside of the laser marking sheet 1. In this case as well, for example, a hologram layer 102 may be provided between the laser marking sheet 1 and the core sheet 2. Furthermore, the laser marking sheet may be omitted, and the card may be, for example, a card 20C having a core sheet 2 and an oversheet 4 as a protective layer on one or both sides of the core sheet 2, as shown in Figure 2(c), in which case there is a hologram layer 102 between the core sheet 2 and the oversheet 4. Although Figure 2 shows an embodiment in which the laser marking sheet 1, the oversheet 4, or both of these are provided on both sides of the core sheet 2, the laser marking sheet 1, the oversheet 4, or both of these may be provided on only one side of the core sheet 2. Furthermore, in each of the cards 20A to 20C, the layer structure provided on each side of the core sheet 2 was the same, but it may be different on each surface. For example, the laser marking sheet 1 and the oversheet 4 may be provided in that order on one side of the core sheet 2, and only the oversheet 4 may be provided on the other side of the core sheet 2. Furthermore, although the hologram layer is provided on only one side of the core sheet 2 in Figure 2, it may be provided on both sides of the core sheet 2. Of course, the hologram layer 102 may be placed on the outermost layer of the card, and for example, in the configuration of Figure 2(c), the oversheet 4 may be omitted.
[0125] A passport, especially an electronic passport, is preferably equipped with a hinge sheet. For example, as shown in Figure 3(a), it is preferable to have a passport 10A comprising a hinge sheet 3 and core sheets 2 provided on each side of the hinge sheet 3, with a laser marking sheet 1 laminated on the outside of one or both of the core sheets 2. A hologram layer 102 is provided between the laser marking sheet 1 and the core sheets 2. Furthermore, as shown in Figure 3(b), a passport 10B is also preferred, which includes an oversheet 4, with the oversheet 4 further laminated as a protective layer on the outside of the laser marking sheet 1. In this case as well, for example, a hologram layer 102 may be provided between the laser marking sheet 1 and the core sheet 2. Furthermore, the laser marking sheet may be omitted, and the passport may be a passport 10C as shown in Figure 3(c), comprising a hinge sheet 3, core sheets 2 provided on each side of the hinge sheet 3, and an oversheet 4 as a protective layer (overlay layer) on the outside of one or both of the core sheets 2, in which case there is a hologram layer 102 between the core sheet 2 and the oversheet 4.
[0126] Although Figure 3 shows an embodiment in which the laser marking sheet 1, the oversheet 4, or both are provided on either side of the core sheet 2, the laser marking sheet 1, the oversheet 4, or both may be provided on only one side of the core sheet 2's exterior. Furthermore, in each passport 10A to 10C, the layered structures provided on the outside of the core sheet 2 were the same, but they may be different. For example, the laser marking sheet 1 and the oversheet 4 may be provided in that order on the outside of one of the core sheets 2, and only the oversheet 4 may be provided on the outside of the other core sheet 2. Furthermore, in Figure 3, the hologram layer 102 is provided only on one side of the laminate of the core sheet 2, hinge sheet 3, and core sheet 2, but it may also be provided on both sides. Of course, the hologram layer 102 may be placed on the outermost surface of the passport, and for example, in the configuration of Figure 3(c), the oversheet 4 may be omitted.
[0127] Furthermore, while Figures 3(a) to 3(c) show a passport in which core sheets 2, 2 are arranged to sandwich the hinge sheet 3, this is not particularly limited, and the core sheets do not need to be arranged to sandwich the hinge sheet; there may be only one core sheet. Also, the core sheet may consist of multiple core sheets stacked together without sandwiching the hinge sheet. In addition, the hinge sheet 3 does not need to be in contact with the core sheets and may be placed at any position that does not touch the core sheets. The hinge sheet may be placed, but is not limited to, between core sheets, for example, between a core sheet and an oversheet, between a core sheet and a laser-marked sheet, or between a laser-marked sheet and an oversheet.
[0128] In a card or passport, the core sheet is preferably a resin film using polycarbonate resin, polyester resin, or a mixture thereof as the resin component, and it is also preferable that it contains a filler. The core sheet may be made up of multiple laminated core sheets. The thickness of each core sheet is preferably about 50 to 700 μm. Each core sheet may be a printed sheet on which fixed information is printed, or it may be an inlet sheet with a hollow section for housing an inlet such as an IC chip or antenna. It may also be a concealing sheet for concealing the inlet. The resin sheet (A) or resin sheet (B) described above may constitute the core sheet, and it is preferable that resin sheet (B) constitutes the core sheet. Furthermore, adhesive sheets may be placed between adjacent pairs of core sheets as appropriate, and adjacent pairs of core sheets may be bonded together by the adhesive sheets. Each core sheet may be composed of a single-layer film or a laminated film having two or more resin layers. The adhesive sheets may be placed between the core sheets and the oversheet or laser marking sheet, for example.
[0129] The laser marking sheet is preferably a resin film using polycarbonate resin, polyester resin, or a mixture thereof as the resin component. The laser marking sheet is a sheet on which personal information is printed by laser printing. Personal information is information used to identify the passport or cardholder, and includes personal name, personal ID, card number, etc. Laser marking sheets are often formed from a resin film, which may be a single-layer film or a laminated film having two or more resin layers. Preferably, the laser marking sheet includes a resin layer containing a laser colorant. In the case of a single-layer film, the single resin layer may contain the laser colorant. In the case of a laminated film, the laser marking sheet may have a structure in which, for example, surface layers are provided on both sides of a middle layer, and the middle layer may contain the laser colorant. Laser marking sheets are typically transparent films. The thickness of the laser marking sheet is not particularly limited, but is preferably about 5 to 400 μm, and preferably 10 to 300 μm. The resin sheet (A) or resin sheet (B) described above may constitute a laser marking sheet, and it is preferable that resin sheet (A) constitutes the laser marking sheet.
[0130] The oversheet generally forms the outermost layer on the data page of a card or passport, protecting the card or passport. When the oversheet is placed outside the laser marking sheet, as shown in Figures 2(b) and 3(b), it can suppress, for example, the so-called "blistering" of the laser-printed area due to laser irradiation. There are no particular restrictions on the resin used for the oversheet, but examples include polycarbonate resins, polyester resins, or mixtures thereof. The thickness of the oversheet is not particularly limited, but for example, it is about 5 to 400 μm, and preferably 10 to 300 μm. The resin sheet (A) or resin sheet (B) described above may constitute an oversheet, and it is preferable that resin sheet (A) constitutes the oversheet.
[0131] The hinge sheet in a passport is a sheet that securely binds the data pages together with the passport cover and other visa sheets. The hinge sheet can be made of any known material and may be a resin sheet made of thermoplastic resins or thermoplastic elastomers such as thermoplastic polyester resin, thermoplastic polyester elastomer, thermoplastic polyamide resin, thermoplastic polyamide elastomer, thermoplastic polyurethane resin, or thermoplastic polyurethane elastomer; it may be made of woven fabric, knitted fabric, or nonwoven fabric; or it may be a composite material of woven fabric, knitted fabric, or nonwoven fabric with thermoplastic resin or thermoplastic elastomer.
[0132] The following are examples and comparative examples, but these do not limit the present invention in any way.
[0133] The method for measuring the glass transition temperature of a resin is as follows: (Glass transition temperature) Using a differential scanning calorimeter "Pyris1 DSC" (manufactured by PerkinElmer), the glass transition temperature was measured in accordance with JIS K7121:2012 when the temperature was increased from 30°C to 200°C at a rate of 20°C / min, then decreased to 30°C at a rate of 20°C / min, and then increased again to 200°C at a rate of 20°C / min. The glass transition temperature was determined using the midpoint glass transition temperature (Tmg).
[0134] The evaluation method for the films obtained in the examples and comparative examples is as follows. (Heat resistance evaluation of microholograms (Holographic property substitute evaluation)) Microholograms used in the examples and comparative examples were measured by TG-DTA analysis within the measurement temperature range of 30 to 350°C at a heating rate of 10°C / min to determine the temperature at which thermal deformation of the microholograms began. During the heating process, visual observation was performed in parallel using a CCD camera at 2x magnification. If discoloration or thermal deformation of the microhologram surface was observed at the predetermined temperature, it was judged as "×" indicating thermal deformation, and if no thermal deformation was observed, it was judged as "〇". Figures 4, 5, and 6 are photographs showing the visual observation of microholograms using a CCD camera during TG-DTA measurement at 35°C, 250°C, and 350°C, respectively. In Figure 5, the microhologram circled in the image shows a change in surface color from white to gray, indicating that the surface shape deformed due to heat, changing the direction of light scattering, and that thermal deformation began at 250°C. In Figure 6, the microhologram circled in the image shows an increase in size compared to before heat treatment, indicating that the surface has undergone thermal deformation.
[0135] The raw materials used in the examples and comparative examples are as follows: (resin) ISP: A plant-derived polycarbonate resin obtained by melt polymerization using isosorbide and 1,4-cyclohexanedimethanol as dihydroxy compounds, such that the ratio of structural units derived from isosorbide to structural units derived from 1,4-cyclohexanedimethanol is 50:50 (molar ratio). Glass transition temperature: 98℃ Polycarbonate resin (PC): Bisphenol-based polycarbonate, glass transition temperature: 151℃ (Microhologram) Manufactured by Optaglio, part number: OVDot (registered trademark).
[0136] [Example 1] Plant-derived polycarbonate resin (ISP) and microhologram (40 μm) were placed in a ratio of 100 parts by mass to 0.05 parts by mass in a twin-screw extruder and kneaded at 230°C. The resin composition was then extruded using the twin-screw extruder at 230°C to obtain a film (hologram layer) with a thickness of 50 μm. [Example 2] Except for changing the size of the microhologram to 400 μm, the same procedure as in Example 1 was used to manufacture a resin sheet (hologram layer) with a thickness of 50 μm.
[0137] [Comparative Example 1] Except for changing the plant-derived polycarbonate resin to polycarbonate resin (PC), and changing the kneading temperature and extrusion temperature to 270°C, the same procedure as in Example 1 was used to produce a 50 μm thick film (hologram layer).
[0138] [Table 1]
[0139] In Examples 1 and 2 described above, by forming a film from a resin composition containing a polycarbonate resin (A) having structural units (A1) and microholograms, thermal damage to the microholograms during film formation was suppressed. Therefore, it can be understood that using this film as a hologram layer can provide a high level of security performance. In contrast, although the film in Comparative Example 1 contained polycarbonate resin and microholograms, the polycarbonate resin lacked structural units (A1), requiring film molding at high temperatures, resulting in thermal damage to the microholograms during the molding process. Therefore, it is clear that using the film of Comparative Example 1 as the hologram layer would make it difficult to impart a high level of security performance. [Industrial applicability]
[0140] According to the present invention, since sheet molding can be performed at temperatures below 250°C, for example, thermal deformation or discoloration of the microhologram is less likely to occur, and the desired hologram performance can be achieved. Therefore, the present invention is an industrially valuable technology because it can produce cards, passports, etc., with higher security functions than conventional methods. Furthermore, in the lamination of the hologram, since a sheet-like hologram layer is used instead of a transfer method using transfer foil, it is difficult to scrape off the hologram layer, which is advantageous in terms of preventing counterfeiting. [Explanation of Symbols]
[0141] 1 Laser Marking Sheet 2 core sheets 3 Hinge Seat 4 Oversheet 20A, 20B, 20C cards 10A, 10B, 10C Passport 100-layer structure 101 Overlay layer (resin sheet (A)) 102 Hologram layer 103, 104 Core layer (resin sheet (B)) 105 Overlay layer (resin sheet (B))
Claims
1. A resin composition comprising a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having a part of its structure represented by the following formula (1), and a microhologram. 【Chemistry 1】 However, the part represented by formula (1) above is -CH 2 Except when it is part of -O-H.
2. The resin composition according to claim 1, wherein the microhologram has a thermal deformation onset temperature of 250°C or higher, as determined by TG-DTA measurement.
3. The resin composition according to claim 1, comprising 0.01 to 10 parts by mass of the microhologram per 100 parts by mass of the polycarbonate resin (A).
4. The resin composition according to claim 1, wherein the polycarbonate resin (A) contains 30 mol% to 80 mol% of the structural unit (A1) derived from the dihydroxy compound.
5. The resin composition according to claim 1, wherein the polycarbonate resin (A) is derived from at least one dihydroxy compound selected from the group consisting of aliphatic dihydroxy compounds and alicyclic dihydroxy compounds, and further comprises a structural unit (A2) which is a structural unit other than structural unit (A1).
6. A holographic layer comprising the resin composition described in claim 1.
7. A resin pellet comprising the resin composition described in claim 1.
8. A hologram layer formed using the resin pellets described in claim 7.
9. The hologram layer according to claim 6 or 8, wherein the hologram layer contains 0.01 to 10 parts by mass of the microhologram per 100 parts by mass of the polycarbonate resin (A).
10. A laminate comprising the hologram layer described in claim 6.
11. The hologram layer comprises a resin sheet (A) laminated on one side of the hologram layer, The laminate according to claim 10, wherein the resin sheet (A) comprises a resin composition A containing a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having a portion represented by the following formula (1) in part of its structure. 【Chemistry 2】 However, the part represented by formula (1) above is -CH 2 Except when it is part of -O-H.
12. The laminate according to claim 11, further comprising a resin sheet (B) laminated on the other side of the hologram layer, wherein the resin sheet (B) is made of a resin composition B containing polycarbonate resin.
13. The laminate according to claim 12, wherein the resin composition B is a resin composition comprising a polycarbonate resin (A) having a structural unit (A1) derived from a dihydroxy compound having a portion represented by the following formula (1) in part of its structure. 【Transformation 3】 However, the part represented by formula (1) above is -CH 2 Except when it is part of -O-H.
14. The laminate according to claim 11, wherein the resin composition A contains an inorganic filler.
15. The laminate according to claim 12, wherein the resin composition B contains an inorganic filler.
16. The laminate according to claim 14 or 15, wherein the inorganic filler is a metal oxide.
17. The laminate according to claim 14 or 15, wherein the inorganic filler is titanium oxide.
18. The laminate according to claim 14 or 15, wherein the amount of the inorganic filler is 5 parts by mass or more and 90 parts by mass or less per 100 parts by mass of each resin component in resin composition A or resin composition B.
19. The laminate according to claim 12, wherein the resin composition B constituting the resin sheet (B) contains a coloring agent.
20. The laminate according to claim 19, wherein the content of the coloring agent is 0.01 parts by mass or more per 100 parts by mass of the resin component in the resin composition B.
21. The laminate according to claim 11 or 13, wherein the polycarbonate resin (A) in the resin composition A or resin composition B contains 30 mol% to 80 mol% of the structural unit (A1) derived from the dihydroxy compound.
22. The laminate according to claim 11 or 13, wherein the polycarbonate resin (A) in the resin composition A or resin composition B is derived from at least one dihydroxy compound selected from the group consisting of aliphatic dihydroxy compounds and alicyclic dihydroxy compounds, and further comprises a structural unit (A2) which is a structural unit other than structural unit (A1).
23. A card having a laminate according to any one of claims 10 to 15.
24. A passport having a laminate according to any one of claims 10 to 15.
Citation Information
Patent Citations
Hologram transfer foil
JP2019214172A