How to laminate film

Abstract

This invention provides a lamination method that effectively reduces air bubbles between the sealing film and the substrate, thereby increasing the yield rate of good packages. [Solution] The method includes using a vacuum laminating film apparatus that includes an upper laminating film unit and a lower laminating film unit to provide a sealing film and a substrate so that they do not come into contact with each other between the units; bringing the upper laminating film unit and the lower laminating film unit closer together, and creating a vacuum in the chamber so that the sealing film and the substrate are received in the chamber and not in contact with each other; moving and overlapping at least one of the sealing film and the substrate; heating the sealing film and the substrate; releasing the vacuum in the chamber; and separating the upper laminating film unit and the lower laminating film unit.

Description

Technical Field

[0001] The present invention relates to packaging a substrate, and more particularly to a method of laminating a film by packaging a thin film.

Background Art

[0002] Known methods of laminating a film generally involve covering the surface of a substrate with a sealing film and then evacuating the gas remaining between the sealing film and the substrate in a vacuuming manner to attach the sealing film to the substrate, and adhering the sealing film to the substrate by heating and laminating.

[0003] However, when the substrate has a large-height structure on its surface or when the sealing film and the surface of the substrate are too tightly bonded, the gas remaining between the sealing film and the substrate cannot be evacuated even in a vacuuming manner. At that time, bubbles are likely to exist between the sealing film and the substrate, and there is a problem that the yield rate of the package is not good. Therefore, the commonly used method of laminating a film still needs to be improved.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In view of this, an object of the present invention is to provide a method of laminating a film that can effectively reduce bubbles between a sealing film and a substrate and improve the yield rate of the package.

Means for Solving the Problems

[0005] To achieve the above object, the method of laminating a film provided by the present invention is Step A provides a vacuum laminating film apparatus comprising an upper laminating film unit and a lower laminating film unit, wherein the upper laminating film unit and the lower laminating film unit are relatively movable. The invention provides a sealing film and a substrate, wherein the substrate and the sealing film are installed between the upper laminate film unit and the lower laminate film unit, and there is a predetermined distance between the sealing film and the substrate so that they are not in contact with each other (step B), Step C, in which the upper laminate film unit and the lower laminate film unit are moved so that they move closer to each other and join together, enclosing the chamber, and the sealing film and the substrate are received in the chamber, the sealing film and the substrate are not in contact with each other, Step D involves creating a vacuum in the chamber, Step E involves moving at least one of the sealing film and the substrate so that the sealing film and the substrate move closer together and the sealing film overlaps the substrate. Step F involves heating the sealing film and the substrate, Step G is to release the vacuum state of the chamber, The process includes step H, which involves moving at least one of the upper laminating film unit and the lower laminating film unit so that the upper laminating film unit and the lower laminating film unit are separated from each other. [Effects of the Invention]

[0006] The effect of the present invention is that, by performing the step of drawing a vacuum into the chamber before the sealing film and the substrate come into contact with each other, when the sealing film is superimposed on the substrate, the two are tightly bonded together, and air bubbles between the sealing film and the substrate are effectively reduced, thereby achieving the objective of increasing the yield rate of the packages. [Brief explanation of the drawing]

[0007] [Figure 1] This is a flowchart of a method for laminating a film according to a preferred embodiment of the present invention. [Figure 2] This is a flowchart of a method for laminating the film according to the above preferred embodiment. [Figure 3] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 4] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 5] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 6] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 7] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 8] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 9] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 10] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 11] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 12]This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 13] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 14] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 15] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Figure 16] This is a schematic diagram showing a vacuum laminating film apparatus according to the above preferred embodiment. [Modes for carrying out the invention]

[0008] To further clarify the present invention, preferred embodiments will be described in detail below with reference to the drawings. As shown, Figures 1 and 2 are flowcharts of a method for laminating a film according to a preferred embodiment of the present invention, and Figures 3 to 16 are schematic diagrams showing the flow of operations related to the laminated film. The method for laminating the film includes the following steps.

[0009] Step S02 provides a vacuum laminating film apparatus 1. The vacuum laminating film apparatus 1 includes an upper laminating film unit 10 and a lower laminating film unit 20. The upper laminating film unit 10 and the lower laminating film unit 20 are relatively movable. As shown in Figure 3, the upper laminating film unit 10 includes an upper heating plate 12, a flexible material pad 14 and an upper cover 16 that opens downward, and the upper heating plate 12 and the flexible material pad 14 are installed on the upper cover 16 so as to overlap. The lower laminating film unit 20 includes a lower heating plate 22, a push-up rod 24 and an upper cover 26 that opens upward, and the lower heating plate 22 and the push-up rod 24 are installed on the lower cover 26, and the push-up rod 24 is embedded in the lower heating plate 22. The push-up rod 24 has a support portion 241 and, when controlled, is movable up and down relative to the lower heating plate 22.

[0010] As shown in FIGS. 4 to 6, step S04 provides a sealing film 32 and a substrate 40. The substrate 40 and the sealing film 32 are installed between the upper laminate film unit 10 and the lower laminate film unit 20. The substrate 40 is installed on the lower laminate film unit 20, and the sealing film 32 is installed between the upper laminate film unit 10 and the substrate 40 and has a predetermined distance between the sealing film 32 and the substrate 40 and they do not contact each other. Note that the sealing film 32 may be a photosensitive sealing film or a drying film, but is not limited thereto. The substrate 40 is installed on the support portion 241 in the lower laminate film unit 20. The step S04 includes controlling the push-up rod 24 to adsorb the substrate 40 and controlling the push-up rod 24 to move downward so that the substrate 40 can contact the lower heating plate 22. Thereby, the substrate 40 can be firmly installed on the push-up rod 24, and the lower heating plate 22 can heat the substrate 40. In this embodiment, the substrate 40 is placed on the support portion 241 in the lower laminate film unit 20 by a mechanical arm, but is not limited thereto in other embodiments. In this embodiment, the adsorption hole is set at the top end of the push-up rod 24 and the air is exhausted by an air exhaust device to adsorb the substrate 40 as an example. In practice, a plurality of adsorption holes can also be installed on the lower heating plate 22 and the air can be exhausted by an air exhaust device, and similarly, the effect of adsorbing the substrate 40 can be achieved.

[0011] It should be explained again that in this embodiment, the example of installing the substrate 40 on the lower laminate film unit 20 and installing the sealing film 32 between the upper laminate film unit 10 and the substrate 40 has been described. However, in other embodiments, the substrate may be installed on the upper laminate film unit 10, and the sealing film 32 may be installed between the lower laminate film unit 20 and the substrate 40.

[0012] Step S06 involves moving at least one of the upper laminate film unit 10 and the lower laminate film unit 20 so that the upper laminate film unit 10 and the lower laminate film unit 20 approach and join each other, surrounding and forming the chamber R. When the sealing film 32 and the substrate 40 are received in the chamber, the sealing film 32 and the substrate 40 are not in contact with each other. As shown in FIG. 7, in this embodiment, the movement of the upper laminate film unit 10 closer to the lower laminate film unit 20 is taken as an example for explanation. However, in other embodiments, the upper laminate film unit and the lower laminate film unit may move closer to each other and join, or the lower laminate film unit may move closer to the upper laminate film unit and join. Similarly, the upper laminate film unit and the lower laminate film unit can together achieve the effect of surrounding and forming the chamber.

[0013] Further explanation is that the lower cover 26 includes an outer cover 261 and an inner cover 262. The outer cover 261 is movable up and down with respect to the inner cover 262 while being described and controlled around the outer periphery of the inner cover 262. As shown in FIG. 7, in the initial state, the outer cover 261 is installed such that the upper opening is positioned higher than the upper opening of the inner cover 262. Step S06 includes moving the upper cover 16 closer to the lower cover 26 so that the upper cover 16 and the outer cover 261 join each other to form the chamber R.

[0014] Step S08 involves creating a vacuum in the chamber R. During this process, a predetermined distance is maintained between the sealing film 32 and the substrate 40; that is, the sealing film 32 and the substrate 40 are not in contact when the vacuum is created. This removes the gas between the sealing film 32 and the substrate 40, ensuring that when the sealing film 32 is superimposed on the substrate 40, they adhere tightly together, effectively reducing air bubbles between the sealing film 32 and the substrate 40, and ultimately increasing the yield rate of the packages.

[0015] Step S10 involves moving at least one of the sealing film 32 and the substrate 40 so that the sealing film 32 moves closer to each other and the sealing film 32 is superimposed on the substrate 40. In this embodiment, as shown in Figure 8, the upper laminating film unit 10 moves closer to the lower laminating film unit 20, and the sealing film 32 and the substrate 40 are laminated by being sandwiched between the upper laminating film unit 10 and the lower laminating film unit 20, thereby bonding the sealing film 32 to the substrate. In other embodiments, the upper laminating film unit and the lower laminating film unit may move closer to each other, or the lower laminating film unit may move closer to the upper laminating film unit. Similarly, this achieves the effect of clamping and bonding the sealing film and the substrate between the upper laminate film unit and the lower laminate film unit. In this embodiment, pressure is applied to the sealing film 32 and the substrate 40 by the flexible material pad 14 in the upper laminate film unit 10 and the lower laminate film unit 20, but in practice, pressure may be applied to the sealing film 32 and the substrate 40 in other forms. For example, the flexible material pad 14 in the upper laminate film unit 10 may be replaced with a pressure roller. The pressure roller rolls over the surface of the sealing film 32, applying pressure to the sealing film 32 and the substrate 40, and tightly bonding the sealing film 32 and the substrate 40 together.

[0016] Furthermore, in this embodiment, by installing the flexible material pad 14 in the upper laminate film unit 10, when the upper laminate film unit 10 and the lower laminate film unit 20 are laminating the sealing film 32 and the substrate 40, the sealing film 32 can properly conform to the uneven surface of the substrate and be bonded flat to the substrate 40. The flexible material pad 14 may be, for example, a flexible material pad made of silica gel or rubber. In other embodiments, the user may choose not to install the flexible material pad 14 depending on the usage conditions.

[0017] Step S12 involves heating the sealing film 32 and the substrate 40. In this embodiment, the upper heating plate 12 and the lower heating plate 22 in the upper laminating film unit 10 and the lower laminating film unit 20 are controlled to heat the sealing film 32 and the substrate 40 and raise their temperature. In other embodiments, the sealing film 32 and the substrate 40 may be heated and raised by at least one of the upper heating plate 12 and / or the lower heating plate 22.

[0018] Step S14 releases the vacuum state of the chamber R.

[0019] Step S16 includes moving at least one of the upper laminating film unit 10 and the lower laminating film unit 20 so that they move away from each other. As shown in Figure 9, in this embodiment, the upper laminating film unit 10 moves away from the lower laminating film unit 20 so that the upper laminating film unit moves away from the position where it joins the lower laminating film unit. In other embodiments, the upper laminating film unit and the lower laminating film unit may move away from each other, or the lower laminating film unit may move away from the upper laminating film unit. This can similarly have the effect of moving the upper laminating film unit away from the position where it joins the lower laminating film unit.

[0020] To reiterate, this embodiment further includes the step of providing a carrier roll film 50, a sealing film roll 30, and a cutting device 60. As shown in Figures 14 to 16, the carrier roll film 50 is output as a carrier film 52 by a carrier transport device 70. The carrier transport device 70 includes a plurality of rollers. The sealing film roll 30 is output as a sealing film 32 via a sealing film transport device 80. The carrier transport device 70 includes a plurality of rollers. The transport by the carrier transport device 70 and the sealing film transport device 80 causes a portion of the sealing film 32 unwound from the sealing film roll 30 and a portion of the carrier film 52 unwound from the carrier roll film 50 to be positioned facing each other and adjacent to each other, and a portion of the sealing film unwound from the sealing film roll 30 is adsorbed and fixed by a vacuum device 90. Next, the cutting device 60 cuts the portion output from the sealing film roll 30 to form the sealing film 32. Furthermore, since a portion of the sealing film 32 unwound from the sealing film roll 30 and a portion of the carrier film 52 unwound from the carrier roll film 50 are installed facing each other and adjacent to one another, the cut sealing film 32 is attached to a portion of the carrier film 52 unwound from the carrier roll film 50. Next, the carrier transport device 70 is controlled to transport the sealing film 32 attached to the carrier roll film 50 between the upper laminate film unit 10 shown in Figure 6 and the substrate 40. The rollers in the carrier transport device 70 rotate clockwise and counterclockwise to adjust and move the sealing film 32 so that it is positioned above the substrate 40, and the carrier roll film 50 comes into contact with the top surface of the outer cover 261.Furthermore, when the step of creating a vacuum in the chamber R is performed, the sealing film 32 is attached to the carrier film 52, and the carrier film 52 is tightened by the rollers in the carrier transport device 70. As a result, the sealing film 32 is held at the predetermined distance from the substrate by the constraint from the carrier film 52, preventing them from coming into contact with each other.

[0021] To reiterate, step S04 includes the steps of transporting the sealing film 32 attached to the carrier roll film 50 to a position between the upper laminate film unit 10 and the substrate 40 shown in Figure 6 using rollers in the carrier transport device 70, and controlling the push-up rod 24 to move downward. The order in which these two steps are performed may be reversed depending on the user's usage conditions.

[0022] As shown in Figure 7, the sealing film 32 is attached to the first surface 521 of the carrier film 52 output by the carrier roll film 50. One side of the flexible material pad 14 is in contact with the upper heating plate 12. Step S06 includes moving the upper laminate film unit 10 to a position where the other side facing the flexible material pad 14 is in contact with the second surface 522 of the carrier film 52 output by the carrier roll film 50, and the first surface 521 and the second surface 522 are in opposite directions.

[0023] As shown in Figure 8, step S10 includes controlling the upper laminating film unit 10 and the outer cover 261 to move downward, and controlling the carrier transport device 70 so that a portion of the carrier film 52 unwound from the carrier roll film 50 moves downward in synchronous with the upper laminating film unit 10 and the outer cover 261, thereby causing the sealing film 32 and the substrate 40 to adhere to each other and be sandwiched between the upper laminating film unit 10 and the lower laminating film unit 20.

[0024] As shown in Figures 9 to 13, when the upper laminating film unit 10 moves away from the position where it is joined to the lower laminating film unit 20, step S16 includes controlling the carrier transport device 70 so that a portion of the carrier film 52 unwound from the carrier roll film 50 moves upward, and after a portion of the carrier film 52 unwound from the carrier roll film 50 moves away from the sealing film 32 attached to the substrate 40, the push-up rod 24 moves upward to stop the suction of the substrate 40, thereby preparing to remove the substrate 40 with the sealing film completed. Next, the outer cover 261 is controlled to return to a position where the upper opening in the outer cover 261 is higher than the upper opening in the inner cover 262, thereby preparing to perform the next lamination.

[0025] In short, the effect of the present invention is to perform a vacuuming step before the sealing film 32 and the substrate 40 come into contact with each other, thereby ensuring that when the sealing film 32 is superimposed on the substrate 40, the two are tightly bonded together, and effectively reducing air bubbles between the sealing film 32 and the substrate 40, ultimately increasing the yield rate of good products.

[0026] The above description is merely a preferred embodiment of the present invention, and any equivalent substitutions made by applying the claims together with the specification of the present invention should be included within the scope of the claims of the present invention. [Explanation of Symbols]

[0027] 1. Vacuum laminating film apparatus 10 Upper laminating film unit 12 Upper heating plate 14. Flexible material pads 16 Upper cover 20 Downward laminating film unit 22 Lower heating plate 24 Push-up rod 241 Support part 26 Lower cover 261 Outer cover 262 Inner cover 30 Sealing Film Rolls 32 Sealing film 40 circuit boards 50 Carrier Roll Film 52 Carrier film 521 Front page 522 Second side 60 Cutting device 70 Carrier transport device 80 Sealing film transport device 90 Vacuum equipment R Chamber S02 Step S04 Step S06 Step S08 Step S10 Step S12 Step S14 Step S16 Step

Claims

1. Step A provides a vacuum laminating film apparatus comprising an upper laminating film unit and a lower laminating film unit, wherein the upper laminating film unit and the lower laminating film unit are relatively movable. The invention provides a sealing film and a substrate, wherein the substrate and the sealing film are installed between the upper laminate film unit and the lower laminate film unit, and there is a predetermined distance between the sealing film and the substrate so that they are not in contact with each other (step B), Step C, in which the sealing film and the substrate are received in the chamber, is performed by moving at least one of the upper and lower laminate film units so that they move closer to each other and are joined, and together enclose the chamber, and the sealing film and the substrate are received in the chamber, and the sealing film and the substrate are not in contact with each other, Step D involves creating a vacuum in the chamber, Step E involves moving at least one of the sealing film and the substrate so that the sealing film layer is superimposed on the substrate, Step F involves heating the sealing film and the substrate, Step G involves releasing the vacuum state of the chamber, A method for laminating a film, comprising step H of moving at least one of the upper laminating film unit and the lower laminating film unit so that the upper laminating film unit and the lower laminating film unit are separated from each other.

2. This includes providing carrier roll film, However, the substrate is installed in the lower laminate film unit, the sealing film is installed between the upper laminate film unit and the substrate, the carrier roll film is output by a carrier transport device, and the sealing film is attached to the carrier film output by the carrier roll film. The method for laminating a film according to claim 1, wherein the carrier transport device transports the sealing film attached to the carrier roll film between the upper laminating film unit and the substrate so that the sealing film is positioned above the substrate.

3. The method for laminating a film according to claim 2, wherein step E includes moving at least one of the upper laminating film unit and the lower laminating film unit so that the upper laminating film unit and the lower laminating film unit move closer to each other and the sealing film and the substrate are sandwiched between the upper laminating film unit and the lower laminating film unit.

4. The sealing film is attached to the first surface of the carrier film output by the carrier roll film, and the upper laminating film unit is in contact with the second surface of the carrier film output by the carrier roll film. A method for laminating a film according to claim 3, wherein the first surface and the second surface are in opposite directions.

5. The upper laminate film unit includes an overlapping upper heating plate and a flexible material pad, with one side of the flexible material pad in contact with the upper heating plate. The method for laminating a film according to claim 4, further comprising moving the upper laminating film unit to a position where the other opposing side of the flexible material pad contacts the second surface of the carrier film output by the carrier roll film in step C.

6. The upper laminating film unit includes an upper cover that opens downward, and the lower laminating film unit includes a lower cover that opens upward. Step C includes moving the upper cover to meet the lower cover and join them together to form the chamber, The method for laminating a film according to claim 5, wherein the upper heating plate and the flexible material pad are installed in the upper cover.

7. The lower cover includes an outer cover and an inner cover, the outer cover being installed around the outer circumference of the inner cover and, when controlled, being movable vertically relative to the inner cover. Step C includes moving the upper cover toward the outer cover, so that the upper cover and the outer cover join together to form the chamber, The method for laminating a film according to claim 6, further comprising moving the upper laminating film unit and the outer cover downward in step E such that the sealing film and the substrate are sandwiched between the upper laminating film unit and the lower laminating film unit.

8. The lower laminate film unit includes a lower heating plate and an adsorption device installed in the lower cover, the adsorption device being embedded in the lower heating plate and having a support portion for supporting the substrate, and being able to move up and down relative to the lower heating plate when controlled. Step B includes placing the substrate on the support portion, controlling the adsorption device to adsorb the substrate, and controlling the adsorption device to move downward so that the substrate can come into contact with the lower heating plate, the method for laminating a film according to claim 6.

9. The carrier transport device transports the sealing film attached to the carrier roll film between the upper laminate film unit and the substrate, so that when the sealing film is positioned above the substrate, the carrier roll film and the top surface of the outer cover come into contact. The method for laminating a film according to claim 7, further comprising, in step E, controlling the carrier transport device so that the carrier roll film moves in conjunction with the upper laminating film unit and the outer cover to move downward in synchronous manner.

10. The invention includes providing a sealing film roll and a cutting device. The method for laminating a film according to claim 2, wherein the sealing film roll outputs a sealing film using a sealing film transport device, and the cutting device cuts the sealing film output from the sealing film roll to form the sealing film.

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