Method for pre-adjusting the processing surface of a glass substrate for semiconductor packaging.

Abstract

This invention provides a method for pre-adjusting the processing surface of a glass substrate for semiconductor packaging, thereby improving manufacturing efficiency. [Solution] A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package includes the steps of: selecting one material group from among material groups; collecting processing information; confirming whether the transfer equipment attached to the processing equipment that performs the processing is equipped with a flipper; and pre-adjusting the glass substrate by rotating it using other processing equipment equipped with a flipper.

Description

Technical Field

[0001] The present invention relates to a method for pre-adjusting a processing surface of a glass substrate for a glass substrate semiconductor package, which can pre-adjust the current surface of the glass substrate to correspond to the processing surface when processing the glass substrate in the manufacturing process of the glass substrate semiconductor package and deliver it to process equipment.

Background Art

[0002] Recently, for the replacement of plastic substrates used in the semiconductor packaging field, glass substrates made of glass have been developed and used. Such glass substrates have attracted attention as innovative substrate materials that change the trend in the semiconductor package field.

[0003] That is, since the glass substrate has a smooth surface and excellent processability into large square panels, it is not only suitable for realizing semiconductor packaging with ultra-fine line widths, but also does not require an intermediate substrate, so the thickness of the substrate can be reduced, and there is an advantage that power consumption can also be reduced.

[0004] On the other hand, different from a plastic substrate that must process the upper and lower surfaces simultaneously, the glass substrate has a characteristic that the upper and lower surfaces can be processed individually according to material properties.

[0005] Due to such characteristics, prior to processing the glass substrate to manufacture a glass substrate semiconductor package, depending on whether the processing surface of the process is the upper surface of the glass substrate or the processing surface of the process is the lower surface of the glass substrate, an upper and lower surface adjustment operation for rotating the glass substrate so that the upper surface faces upward or the lower surface faces upward must be performed first.

[0006] Here, the manufacturing equipment for glass substrate semiconductor packages includes process equipment that performs the main process of processing the glass substrate, and auxiliary equipment that assists the process equipment by allowing the glass substrate to rotate 180° to perform upper and lower surface adjustment.

[0007] As mentioned above, auxiliary equipment for adjusting the upper and lower surfaces of the glass substrate includes a sorter and an optional EFEM (Field-Elevated Electron Element) attached to the process equipment. Specifically, the upper and lower surfaces of the glass substrate are adjusted through the flip stage of the sorter and the flipper of the EFEM.

[0008] However, distribution equipment is deployed in only a limited number of units, typically only two or three, across the entire semiconductor package manufacturing line, and flippers are not fitted to all transfer equipment; they are fitted selectively.

[0009] In other words, if the transfer equipment attached to the process equipment used in the current process does not have a flipper, and it is necessary to rotate the glass substrate, the processing step will be delayed, resulting in a decrease in manufacturing efficiency.

[0010] Therefore, in order to shorten process time and improve manufacturing efficiency, process improvement technology is needed that allows the current surface of the glass substrate to be pre-adjusted to correspond to the processing process using available distribution equipment and other transfer equipment equipped with flippers, and then handed over to the processing equipment. [Prior art documents] [Patent Documents]

[0011] [Patent Document 1] Republic of Korea Registered Patent No. 10-2548820 (Publication Date: 2023.06.28) [Patent Document 2] Republic of Korea Registered Patent No. 10-0984279 (Publication Date: 2010.09.30) [Patent Document 3] Republic of Korea Published Patent No. 10-2021-0141698 (Publication Date: 2021.11.23) [Overview of the project] [Problems that the invention aims to solve]

[0012] The present invention was invented to solve the above-mentioned problems, and aims to provide a method for pre-adjusting the processing surface of a glass substrate for a semiconductor package, which allows the current surface of the glass substrate to be pre-adjusted to correspond to the processing process and handed over to the processing equipment using available dispensing equipment or other transfer equipment equipped with a flipper, thereby shortening the process time and improving the manufacturing efficiency of semiconductor packages.

[0013] The objectives of the present invention are not limited to those mentioned above, and other objectives not mentioned can be clearly understood from the following description and may be fully included in the objectives of the present invention. [Means for solving the problem]

[0014] To achieve the above objective, the present invention provides a pre-adjustment method for the processed surface of a glass substrate for a glass substrate semiconductor package, which is for pre-adjusting the processed surface of a glass substrate for manufacturing a glass substrate semiconductor package to correspond to the processed surface of a processing step, and comprises the steps of: selecting one material group from among material groups in which a plurality of glass substrates, each holding an identification code, are handled in a form in which they form a single group and are placed in a single transport container; using the identification codes, collecting processing information from process equipment for performing a processing step on the glass substrate belonging to the one material group; and using the processing information, selecting the transport equipment associated with the process equipment performing the current processing step, and the next step of the current process. The process may consist of: a step of checking whether the transfer equipment associated with the process equipment for the preceding next processing step is equipped with a flipper; if the process equipment for the current processing step and the next processing step is equipped with a flipper, the glass substrate is rotated and pre-adjusted using the process equipment for the current processing step, depending on whether the current surface of the glass substrate coincides with the processing surface and whether the processing surface of the glass substrate coincides with the discharge surface; and if the process equipment for the current processing step and the next processing step is not equipped with a flipper and the current surface of the glass substrate does not coincide with the processing surface, the glass substrate is rotated and pre-adjusted using a dispensing device that is in a usable state or other process equipment that is in a usable state and equipped with a flipper. [Effects of the Invention]

[0015] The pre-adjustment method for the processed surface of a glass substrate for a glass substrate semiconductor package according to the present invention, with the above configuration, enables rapid pre-adjustment of the glass substrate even when the current processing equipment and the process equipment for the next processing process are not equipped with flippers, and the current surface of the glass substrate does not coincide with the processed surface. This is achieved by searching for currently available dispensing equipment or other process equipment and using them to pre-adjust the current surface of the glass substrate to coincide with the processed surface, thereby shortening the time required for manufacturing glass substrate semiconductor packages and improving manufacturing efficiency. [Brief explanation of the drawing]

[0016] [Figure 1] This flowchart shows a method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to a preferred embodiment of the present invention. [Figure 2] This is a diagram showing a process control server for performing a pre-adjustment method for the processed surface of a glass substrate for a semiconductor package according to a preferred embodiment of the present invention. [Best Mode for Carrying Out the Invention]

[0017] The present invention relates to a method for pre-adjusting the processing surface of a glass substrate for a glass substrate semiconductor package, for pre-adjusting the current surface of the glass substrate used in the glass substrate semiconductor package to correspond to the processing process.

[0018] In particular, a key feature of the pre-adjustment method for the processed surface of a glass substrate for a glass substrate semiconductor package according to the present invention is that, when the process equipment for the current processing step and the next processing step is not equipped with a flipper, the pre-adjustment of the processed surface of the glass substrate to correspond to the manufacturing process is performed using a distribution equipment capable of rotating the glass substrate and other transfer equipment equipped with a flipper. This allows for rapid pre-adjustment of the glass substrate, thereby significantly improving the manufacturing efficiency of glass substrate semiconductor packages.

[0019] A preferred embodiment of the present invention, a method for pre-adjusting the processed surface of a glass substrate for a semiconductor package, will be described in detail below with reference to the attached drawings.

[0020] The pre-adjustment method for the processing surface of a glass substrate for a glass substrate semiconductor package according to a preferred embodiment of the present invention pre-adjusts the current surface of the glass substrate for manufacturing the glass substrate semiconductor package to correspond to the working surface by the current processing step, so as to save the time required for preparing to process the glass substrate. As shown in FIG. 1, it may be composed of a material group selection step (S100), a processing step information collection step (S200), a flipper confirmation step (S300), and a pre-adjustment step (S400).

[0021] Here, the material group selection step (S100), the processing step information collection step (S200), the flipper confirmation step (S300), and the pre-adjustment step (S400) can be performed by the process management server 100 that manages information on all processing steps in the glass substrate semiconductor package factory and controls all process equipment in the glass substrate semiconductor package factory.

[0022] However, as shown in FIG. 2, the process management server 100 can be composed of a communication interface 110, a memory 120, and a processor 130. The communication interface 110 can communicate with an external electronic device, receive user input from the external electronic device, or provide the data processing result to the administrator via an external terminal. The memory 120 includes a computer-readable recording medium and can store an operating system and preset instructions. The processor 130 can perform processing operations such as parsing instruction words and calculating and comparing materials.

[0023] First, in the material group selection step (S100), any one material group (Lot) to be input into the processing step can be selected from a plurality of material groups.

[0024] In this case, the material group may consist of a transport container (cassette) equipped with multiple mounting slots, and multiple glass substrates each housed in one of the mounting slots of the transport container.

[0025] Furthermore, each glass substrate can have a unique identification code to distinguish it from other glass substrates, and processing information for each glass substrate can be obtained via a process control server through this identification code.

[0026] Next, in the processing process information collection step (S200), processing process information for performing processing steps on multiple glass substrates belonging to the material group selected in the material group selection step (S100) can be collected via the identification code held by each glass substrate.

[0027] In other words, in the processing process information collection step (S200), processing process information for each glass substrate can be collected via the process management server, using the identification code held by each glass substrate as a medium.

[0028] In this case, the processing information may include process sequence information for the glass substrate, process equipment catalog information for processing the glass substrate according to the process sequence information, and process equipment specification information for confirming the specifications of the process equipment included in the process equipment catalog information.

[0029] Next, in the flipper confirmation step (S300), based on the processing process information regarding the glass substrate collected in the processing process information collection step (S200), it is possible to confirm whether the transfer equipment (EFEM) attached to the process equipment that performs the current processing process on the glass substrate, and the transfer equipment (EFEM) attached to the process equipment that performs the next processing process, which is the next step in the sequence following the current processing process, are equipped with flippers.

[0030] In other words, in the flipper confirmation step (S300), it is possible to confirm, through the process equipment specification information included in the processing process information, whether both the first process equipment for performing the current processing process on the glass substrate and the second process equipment for performing the next processing process are equipped with flippers for changing the current surface of the glass substrate to correspond to the processing surface.

[0031] Finally, in the pre-adjustment step (S400), depending on whether or not a flipper is provided as confirmed in the flipper confirmation step (S300), the current surface of the glass substrate can be pre-adjusted to correspond to the processing surface using the process equipment for the current processing step, or the current surface of the glass substrate can be pre-adjusted to correspond to the processing surface using the currently available distribution equipment or other process equipment in the vicinity.

[0032] In other words, in the pre-adjustment step (S400), if the transfer equipment associated with the first-step equipment for the current processing process and the second-step equipment for the next processing process are equipped with flippers, the glass substrate can be pre-adjusted using these flippers.

[0033] Then, in the pre-adjustment step (S400), if the transfer equipment attached to the first process equipment and the second process equipment does not have flippers, the pre-adjustment work on the glass substrate can be performed through the third process equipment, which is attached to a transfer equipment that is currently available and equipped with flippers, excluding the first and second process equipment, using the currently available distribution equipment in the vicinity.

[0034] Here, the Current Surface refers to the side of the glass substrate facing upwards with the transport container placed on the port of the transport equipment before the glass substrate in the transport container is transported to the processing equipment via the transport equipment; the Working Surface refers to the side of the glass substrate that is processed by the processing equipment after the glass substrate has been transported to the processing equipment via the transport equipment; and the Unloading Surface refers to the side of the glass substrate facing upwards with the transport container lowered from the port of the transport equipment after the glass substrate processed by the processing equipment has been placed in the transport container.

[0035] In other words, the top surface and bottom surface of the glass substrate can become the current surface, the processing surface, and the output surface through a pre-adjustment process involving a 180° rotation. This is because, unlike other conventional substrates, the glass substrate allows for the individual processing of at least one of the top and bottom surfaces.

[0036] To this end, the pre-adjustment step (S400) may consist of a step to confirm the processed surface of the current surface of the glass substrate (S410), an equipment search step (S420), an equipment state change step (S430), a glass substrate transport step (S440), a glass substrate rotation step (S450), an equipment state change step (S460), and a glass substrate transport step (S470), as shown in Figure 1.

[0037] In the step of confirming the processed surface of the current surface of the glass substrate (S410), it is possible to confirm whether the current surface of the glass substrate coincides with the processed surface where processing work is performed in the first step equipment of the current processing process.

[0038] In this case, during the step of confirming the processing surface of the current surface of the glass substrate (S410), if the current surface of the glass substrate matches the processing surface, no prior adjustment work is required for the glass substrate. Therefore, the glass substrate can be loaded into the first process equipment, and the prior adjustment step (S400) can be completed without performing the subsequent detailed steps.

[0039] In the aforementioned equipment search step (S420), if the current surface of the glass substrate does not match the processing surface in the processing surface confirmation step (S410), equipment that is currently available for use in the glass substrate semiconductor package factory and capable of rotating the glass substrate can be searched for in order to perform pre-adjustment work on the glass substrate.

[0040] In other words, the equipment search step (S420) can search for distribution equipment that is currently available for use within the glass substrate semiconductor packaging factory, or third-process equipment that is currently available for use and equipped with a flipper.

[0041] In the equipment state change step (S430), if a currently usable distribution equipment or a third-step equipment that is currently usable and equipped with a flipper is found in the equipment search step (S420), the equipment's state can be changed from usable to in use in order to use it.

[0042] In the glass substrate transport step (S440), the transport container containing the glass substrate can be transported via transport equipment provided within the glass substrate semiconductor package factory to a location where the distribution equipment or third process equipment whose state has been changed to the in-use state in the equipment state change step (S430) is located.

[0043] In the glass substrate rotation step (S450), after the glass substrate is pulled out from the transport container, which was transported in the glass substrate transport step (S440) to a position where the dispensing equipment or third process equipment is located, using the dispensing equipment or third process equipment, the glass substrate can be rotated 180° so that its current surface aligns with the processing surface, and then placed back into the transport container.

[0044] In the aforementioned equipment state re-change step (S460), after completing the pre-adjustment work on the glass substrate, the equipment's state can be changed again from "in use" to "ready to use" so that it can be used for other purposes.

[0045] In the glass substrate transport step (S470), the glass substrate, which has been rotated in the glass substrate rotation step (S450) so that its current surface coincides with the processing surface, can be transported to the location of the first process equipment via transport equipment provided within the glass substrate semiconductor package factory.

[0046] The above embodiments are merely illustrative, and any person with ordinary skill in the art could devise many other variations therefrom.

[0047] Therefore, the true scope of technical protection of the present invention must include not only the embodiments described above, but also other diversely modified embodiments, based on the technical concept of the invention as described in the appended claims. [Explanation of symbols]

[0048] S100 Material Group Selection Step S200 Machining Process Information Collection Step S300 Flipper Check Steps S400 Pre-adjustment Steps S410 Step to confirm the processed surface of the current surface of the glass substrate S420 Equipment Search Step S430 Equipment Status Change Step S440 Glass Substrate Transport Step S450 Glass Substrate Rotating Step S460 Equipment Status Reconfiguration Steps S470 Glass Substrate Transfer Step 100 Process Management Server 110 Communication Interface 120 memory 130 processors

Claims

1. This is for pre-adjusting the processed surface of a glass substrate for manufacturing a glass substrate semiconductor package so that it corresponds to the processed surface during the manufacturing process. A step of selecting one material group from among material groups in which multiple glass substrates, each possessing an identification code, are placed together in a transport container as a single group, The steps include: using the identification code to collect processing information from process equipment for performing a processing step on a glass substrate belonging to one material group; Using the aforementioned processing information, a step is to confirm whether the transfer equipment attached to the process equipment performing the current processing step, and the transfer equipment attached to the process equipment performing the next processing step, which is the next step in the sequence following the current process, are each equipped with flippers. A method for pre-adjusting the processed surface of a glass substrate for a glass substrate semiconductor package, comprising the steps of: if the process equipment for the current processing step and the next processing step is equipped with a flipper, pre-adjusting the glass substrate by rotating it using the process equipment for the current processing step, depending on whether the current surface of the glass substrate coincides with the processing surface and whether the processing surface of the glass substrate coincides with the discharge surface; and if the process equipment for the current processing step and the next processing step is not equipped with a flipper, pre-adjusting the glass substrate by rotating it using a dispensing device that is in a usable state or other process equipment that is in a usable state and equipped with a flipper.

2. The aforementioned pre-adjustment step is: The process equipment for the current processing step and the next processing step is equipped with a flipper, and the current surface of the glass substrate does not coincide with the processing surface, Based on the processing information, a step is to determine whether the current surface of the glass substrate and the processed surface coincide. A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package, according to claim 1, characterized in that, if the current surface of the glass substrate does not coincide with the processed surface based on the result of the determination of whether or not they coincide, the glass substrate is rotated using the process equipment of the current processing step so that the current surface of the glass substrate coincides with the processed surface.

3. The aforementioned pre-adjustment step is: If the process equipment for the current and subsequent processing steps does not include a flipper, and the current surface of the glass substrate does not coincide with the processing surface, Based on the processing information, a step is to determine whether the current surface of the glass substrate and the processed surface coincide. If the result of the determination of whether or not they match does not show that the current surface of the glass substrate and the processed surface do not match, the step is to search for a dispensing device that is in a usable state, or other process device that is in a usable state and is equipped with a flipper. A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 1, comprising the steps of: rotating the glass substrate using the searched distribution equipment or other process equipment so that the current surface of the glass substrate coincides with the processed surface.

4. The step of rotating the glass substrate is: The steps include transporting the glass substrate to the searched distribution equipment, The steps include rotating the glass substrate using the aforementioned distribution equipment to align the current surface of the glass substrate with the processing surface, A method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 3, characterized by comprising the step of transporting the glass substrate, whose current surface coincides with the processed surface, to the process equipment for the current processing step.

5. The step of rotating the glass substrate is: Before the step of transporting the glass substrate, If the distribution equipment is found as a result of the search, the step of changing the state of the distribution equipment from ready-to-use to in use is included. Between the matching step and the step of transporting to the process equipment, The method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 4, characterized in that it includes a step of changing the state of the distribution equipment from a state of use to a state of readiness.

6. The step of rotating the glass substrate is: A step of transporting the glass substrate to the other process equipment that was searched, The steps include rotating the glass substrate using the aforementioned other process equipment to align the current surface of the glass substrate with the processing surface, A method for pre-adjusting the processing surface of a glass substrate for a semiconductor package according to claim 3, characterized by comprising the step of transporting a glass substrate that has been pre-adjusted so that its current surface coincides with the processing surface to the processing equipment for the current processing step.

7. The aforementioned step of performing the rotation operation is, Before the step of transporting the glass substrate, If the search results indicate that other process equipment has been found, the step of changing the state of the other process equipment from ready-to-use to in use is included. Between the matching step and the step of transporting to the process equipment, The method for pre-adjusting the processed surface of a glass substrate for a semiconductor package according to claim 6, characterized in that it includes a step of changing the state of the other process equipment from a state of use to a state of readiness.

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