Mounted circuit board and method for manufacturing a mounted circuit board

Abstract

The present invention provides a mounting substrate that can accommodate the displacement of elements covered by a resin material on a carrier due to thermal expansion of the resin material. [Solution] The mounting substrate 1 includes a housing substrate 10 having an organic material and a first surface 11 and a second surface 12 located opposite the first surface, with a recess 13 provided on the first surface side; an element 50 located in the recess of the housing substrate and having terminals 51; an insulating layer 20 that at least partially covers the housing substrate and the element 50 on the first surface 11 side and is at least partially located in the gap between the wall surface 132 of the recess of the housing substrate 10 and the element 50; and a through electrode substrate 40 having a substrate 41 located on the first surface 11 side of the housing substrate 10 and a through electrode 45 that penetrates the substrate 41 and the insulating layer 20 and is electrically connected to the terminals 51 of the element 50.

Description

Technical Field

[0004] , , , , , , , , , , , , , , ,

[0003]

[0001] Embodiments of the present disclosure relate to a mounting substrate and a method for manufacturing the mounting substrate.

Background Art

[0002] As a technology for packaging elements such as elements, wafer-level packaging (WLP) is known. Wafer-level packaging is a technology for performing the process of packaging elements in a wafer state. For example, Patent Document 1 discloses a technology for improving fan-out wafer-level packaging (FOWLP). Fan-out wafer-level packaging is a technology for forming a rewiring layer over an area exceeding the area of an element in the process of packaging an element in a wafer state. In this specification, the rewiring layer is also simply referred to as a wiring layer.

[0003] In conventional fan-out wafer-level packaging, first, a plurality of elements are prepared, and then the plurality of elements are placed on a carrier. Thereafter, a resin material is supplied so as to cover the carrier and the elements, and the resin material is cured to seal each element with resin. Subsequently, a resin-sealed member including the plurality of resin-sealed elements is removed from the carrier. Next, the resin-sealed member is turned over, and a wiring layer is formed on the resin-sealed member. Thereafter, the resin-sealed member and the wiring layer are cut for each section including one element to obtain an electronic device in which the element is packaged.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Resin materials expand and contract in response to temperature changes. Furthermore, curing shrinkage occurs during the hardening process. Therefore, it is possible that the position of elements covered by the resin material may shift on the carrier due to the expansion and contraction of the resin material.

[0006] The embodiments of this disclosure aim to provide a mounting substrate that can effectively solve the aforementioned problems. [Means for solving the problem]

[0007] One embodiment of the present disclosure is a mounting substrate comprising: a housing substrate having an organic material and including a first surface and a second surface located opposite the first surface, with a recess provided on the first surface side; an element having terminals and located in the recess of the housing substrate; an insulating layer that at least partially covers the housing substrate and the element on the first surface side and is at least partially located in the gap between the wall surface of the recess of the housing substrate and the element; a conductive layer having a first portion located on the insulating layer and a second portion that penetrates the insulating layer and electrically connects the first portion and the terminals of the element.

[0008] An implementation substrate according to one embodiment of the present disclosure may further include a support substrate having an inorganic material and located on the second surface side of the housing substrate.

[0009] In a mounting substrate according to one embodiment of the present disclosure, the conductive layer may further have a third portion connected to the first portion and penetrating the insulating layer and the housing substrate.

[0010] In a mounting substrate according to one embodiment of the present disclosure, the recess of the housing substrate may have a stepped portion that supports the surface of the element located on the second surface side of the housing substrate, and a through portion that penetrates the housing substrate between the surface of the element and the second surface of the housing substrate.

[0011] In a mounting substrate according to one embodiment of the present disclosure, the sensor portion may be formed on the surface of the element that is located on the second surface side of the housing substrate.

[0012] One embodiment of the present disclosure is a mounting substrate comprising: a housing substrate having an organic material and including a first surface and a second surface located opposite the first surface, with a recess provided on the first surface side; an element having terminals and located in the recess of the housing substrate; an insulating layer that at least partially covers the housing substrate and the element on the first surface side and is at least partially located in the gap between the wall surface of the recess of the housing substrate and the element; a substrate located on the first surface side of the housing substrate; and a through electrode that penetrates the substrate and the insulating layer and is electrically connected to the terminal of the element.

[0013] In a mounting substrate according to one embodiment of the present disclosure, a recess may be formed on the surface of the insulating layer in a portion that overlaps with the gap between the wall surface of the recess and the element when viewed along the direction normal to the first surface of the housing substrate.

[0014] In a mounting substrate according to one embodiment of the present disclosure, the organic material of the housing substrate may include a polyimide resin, an epoxy resin, a polyphenylene ether resin, or a fluororesin.

[0015] In a mounting substrate according to one embodiment of the present disclosure, the material constituting the insulating layer may include a polyimide resin, an epoxy resin, or an acrylic resin.

[0016] One embodiment of the present disclosure is a method for manufacturing a mounting substrate, comprising the steps of: preparing a support substrate having an inorganic material; forming a housing substrate having an organic material on the support substrate, the housing substrate having a first surface located on the side far from the support substrate and a second surface located on the side of the support substrate, with a recess provided on the first surface side; arranging an element having terminals in the recess of the housing substrate; forming an insulating layer that at least partially covers the housing substrate and the element on the first surface side and is at least partially located in the gap between the wall surface of the recess of the housing substrate and the element; and forming a conductive layer that has a first portion located on the insulating layer and a second portion that penetrates the insulating layer and electrically connects the first portion and the terminal of the element.

[0017] A method for manufacturing a mounting substrate according to one embodiment of the present disclosure may further include a step of separating the support substrate from the housing substrate.

[0018] In a method for manufacturing a mounting substrate according to one embodiment of the present disclosure, the support substrate is provided with electrodes that penetrate the support substrate, and the conductive layer formation step may include a step of forming a third portion that penetrates the insulating layer and the housing substrate and electrically connects the first portion and the electrodes of the support substrate.

[0019] In a method for manufacturing a mounting substrate according to one embodiment of the present disclosure, the support substrate may have glass.

[0020] One embodiment of the present disclosure includes a step of preparing a support substrate having an inorganic material, a first surface located on the side far from the support substrate and a second surface located on the support substrate side, the first surface side being provided with a recess, and forming a housing substrate having an organic material on the support substrate, a step of disposing an element having a terminal in the recess of the housing substrate, an insulating layer forming step of forming an insulating layer that at least partially covers the housing substrate and the element on the first surface side and is at least partially located in a gap between a wall surface of the recess of the housing substrate and the element, preparing a through-electrode substrate having a substrate located on the first surface side of the housing substrate and a through-electrode penetrating the substrate, and disposing the through-electrode substrate on the insulating layer such that the through-electrode of the through-electrode substrate contacts the terminal of the element.

[0021] In the method for manufacturing a mounting substrate according to an embodiment of the present disclosure, the insulating layer forming step may include a step of sucking the insulating layer into a gap between a wall surface of the recess of the housing substrate and the element.

Advantages of the Invention

[0022] According to an embodiment of the present disclosure, it is possible to suppress the occurrence of displacement of the element.

Brief Description of the Drawings

[0023] [Figure 1] It is a cross-sectional view showing a mounting substrate according to an embodiment. [Figure 2] It is a cross-sectional view showing an enlarged recess of the housing substrate of the mounting substrate shown in FIG. 1. [Figure 3] It is a view showing a step of preparing a housing substrate provided with a recess. [Figure 4] It is a view showing a step of disposing an element in a recess of a housing substrate. [Figure 5] It is a view showing a step of forming an insulating layer on a housing substrate. [Figure 6] It is a cross-sectional view showing a modified example of a mounting substrate. [Figure 7]This is a cross-sectional view showing a modified example of a mounted circuit board. [Figure 8] This is a cross-sectional view showing a modified example of a mounted circuit board. [Figure 9] This is a cross-sectional view showing a modified example of a mounted circuit board. [Figure 10] This figure shows the manufacturing process of the mounted circuit board shown in Figure 9. [Modes for carrying out the invention]

[0024] The configuration of a mounting substrate and its manufacturing method according to one embodiment will be described in detail below with reference to the drawings. The embodiments shown below are examples of embodiments of this disclosure, and this disclosure is not limited to these embodiments. Furthermore, in this specification, terms such as "substrate," "base material," "sheet," and "film" are not distinguished from each other solely on the basis of name. For example, "substrate" and "base material" are concepts that include components that may be called sheets or films. Moreover, terms used in this specification to specify shape, geometric conditions, and their degree, such as "parallel" and "orthogonal," as well as values ​​of length and angle, are not strictly defined but are interpreted to include a range that allows for the expectation of similar functionality. In addition, in the drawings referenced in this embodiment, the same or similar reference numerals are used for identical parts or parts with similar functions, and repeated explanations may be omitted. Furthermore, the dimensional ratios in the drawings may differ from the actual ratios for explanatory purposes, and some components may be omitted from the drawings.

[0025] [Mounted circuit board] First, the configuration of the mounting substrate 1 according to one embodiment will be described with reference to Figure 1. Figure 1 is a cross-sectional view showing the mounting substrate 1 according to this embodiment.

[0026] As shown in Figure 1, the mounting substrate 1 comprises a housing substrate 10, elements 50, an insulating layer 20, a conductive layer 25, and a support substrate 30. The individual components of the mounting substrate 1 will be described below.

[0027] (Full board) The housing substrate 10 includes a first surface 11 located on the side furthest from the support substrate 30, and a second surface 12 located on the opposite side of the first surface 11, i.e., on the side facing the support substrate 30. A recess 13 is provided on the side of the housing substrate 10 facing the first surface 11. The recess 13 includes a bottom surface 131 and a wall surface 132 extending from the bottom surface 131 to the first surface 11. The thickness t1 of the housing substrate 10 is, for example, 50 μm or more, and for example, 700 μm or less.

[0028] The recess 13 defines a space for housing the element 50. The depth d of the recess 13 is, for example, 30 μm or more, and for example, 400 μm or less. The width w of the recess 13 is, for example, 300 μm or more, and for example, 20,000 μm or less.

[0029] The housing substrate 10, which is provided with the recess 13, is manufactured by molding an organic material. Examples of organic materials that can be used to constitute the housing substrate 10 include polyimide resin, epoxy resin, polyphenylene ether resin, polytetrafluoroethylene resin, and other fluororesins. Furthermore, in order to improve the insulating properties and mechanical strength of the housing substrate 10, the housing substrate 10 may further contain fibers such as glass fibers or inorganic material fillers.

[0030] (element) Element 50 includes, for example, device chips such as LSIs (Large-Scale Integrations), MEMS (Micro Electro Mechanical Systems), and discrete components. MEMS are electronic devices in which mechanical components, sensors, actuators, electronic circuits, etc., are integrated on a single substrate. Element 50 may also include power amplifiers, surface acoustic wave filters, switches, image sensors, etc.

[0031] As shown in Figure 1, the element 50 is located inside the recess 13 of the housing substrate 10. The element 50 also has terminals 51. In the example shown in Figure 1, the element 50 is positioned in the recess 13 such that terminals 51 are located on the first surface 11 side. Although not shown, the element 50 may also be positioned so that terminals 51 are located on the second surface 12 side. The element 50 may be bonded to the bottom surface 131 of the recess 13 with an adhesive material, such as a die attachment material (not shown).

[0032] In the example shown in Figure 1, the surface of element 50 facing the first surface 11 is located on the same plane as the first surface 11. However, it is not limited to this, and the surface of element 50 facing the first surface 11 may be located on the second surface 12 side, i.e., inward from the first surface 11, or conversely, it may be located outward from the first surface 11.

[0033] (Insulating layer) The insulating layer 20 is an insulating layer that at least partially covers the housing substrate 10 and the element 50 on the first surface 11 side of the housing substrate 10. In the example shown in Figure 1, the insulating layer 20 is located on the first surface 11 and on the element 50 so as to cover the entire element 50 from the first surface 11 side. The thickness t2 of the insulating layer 20 is, for example, 5 μm or more, and for example, 50 μm or less.

[0034] Figure 2 is a cross-sectional view showing an enlarged view of the recess 13 of the housing substrate 10 of the mounting substrate 1 shown in Figure 1. As shown in Figure 2, the insulating layer 20 is located not only on the element 50 but also at least partially in the gap between the wall surface 132 of the recess 13 and the element 50. This prevents the element 50 from shifting position inside the recess 13. It also prevents liquids, foreign matter, etc. from entering the gap of the recess 13. The dimension s of the gap in the recess 13 is, for example, 5 μm or more, and for example, 100 μm or less.

[0035] The material used to constitute the insulating layer 20 is one that has sufficient fluidity, flexibility, etc., to fill the gap between the wall surface 132 of the recess 13 and the element 50. Examples of materials that can be used to constitute the insulating layer 20 include polyimide resin, epoxy resin, polyphenylene ether resin, polytetrafluoroethylene resin, and other fluororesins.

[0036] (Conductive layer) The conductive layer 25 is a conductive layer that is electrically connected to the terminal 51 of the element 50. The conductive layer 25 has at least a first portion 26 located on the insulating layer 20 and a second portion 27 that penetrates the insulating layer 20 and electrically connects the first portion 26 to the terminal 51 of the element 50. In the example shown in Figures 1 and 2, the second portion 27 of the conductive layer 25 is physically connected to the terminal 51 of the element 50.

[0037] The composition of the conductive layer 25 is not particularly limited, as long as the conductive layer 25 is conductive. For example, the conductive layer 25 may consist of a single conductive layer or multiple conductive layers. For example, the conductive layer 25 may have a conductive first layer and a second layer formed on the first layer by electroplating. In this case, the first layer functions as a seed layer that serves as a base for growing the second layer, which is a plated layer.

[0038] When the conductive layer 25 includes the first and second layers described above, the material of the first layer may be the same as or different from the material of the second layer. For example, the first layer may be a laminated film in which titanium and copper are stacked in order, or chromium, etc. The first layer can be formed by, for example, sputtering, vapor deposition, electroless plating, sol-gel method, etc. The second layer may contain, for example, copper. The second layer may contain, for example, copper as a main component, and more specifically, 80% by mass or more of copper. The second layer may also contain metals such as gold, silver, platinum, rhodium, tin, aluminum, nickel, chromium, or alloys using these metals.

[0039] (Support base) The support substrate 30 is a substrate located on the second surface 12 side of the housing substrate 10. In the example shown in Figures 1 and 2, the support substrate 30 is in contact with the second surface 12 of the housing substrate 10. By including the support substrate 30 in the mounting substrate 1, the overall rigidity of the mounting substrate 1 can be increased. The thickness of the support substrate 30 is, for example, 0.05 mm or more, and for example, 0.7 mm or less.

[0040] The support substrate 30 contains an inorganic material having a certain degree of insulating properties. For example, the support substrate 30 may be a glass substrate, a quartz substrate, a sapphire substrate, a resin substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al2O3) substrate, an aluminum nitride (AlN) substrate, a zirconia oxide (ZrO2) substrate, a lithium niobate substrate, a tantalum niobate substrate, or a laminate of these substrates. The support substrate 30 may also partially contain a substrate made of a conductive material, such as an aluminum substrate or a stainless steel substrate.

[0041] Examples of glass used in the support substrate 30 include alkali-free glass. Alkali-free glass is glass that does not contain alkaline components such as sodium or potassium. Alkali-free glass may contain boric acid instead of alkaline components, for example. It may also contain alkaline earth metal oxides such as calcium oxide or barium oxide. Examples of alkali-free glass include EN-A1 from Asahi Glass and Eagle XG from Corning.

[0042] [Manufacturing method for mounted circuit boards] An example of a manufacturing method for the mounting substrate 1 will be described below with reference to Figures 3 to 5.

[0043] (Formation process of housing substrate) First, a support substrate 30 is prepared. Next, a resin layer containing an organic material is provided on the support substrate 30. Methods for providing the resin layer include dry lamination and printing. Subsequently, the resin layer is molded to form a recess on the surface of the resin layer. This allows for the formation of a housing substrate 10 on the support substrate 30, with a recess 13 on the first surface 11 side, as shown in Figure 3. As a method for producing the housing substrate 10 by molding the resin layer, for example, a method of pressing a mold onto the resin layer can be used. Furthermore, if the organic material is photosensitive, the resin layer may be molded by exposure and development treatments.

[0044] Alternatively, a housing substrate 10 with a recess 13 on the first surface 11 side may be formed on the support substrate 30 by using a 3D printer or the like to provide a resin layer in the parts other than the parts that would become recesses 13.

[0045] (Element placement process) Next, as shown in Figure 4, the element 50 is placed in the recess 13 of the housing substrate 10. For example, the element 50 is placed so that its terminals 51 are on the first surface 11 side. The element 50 may be bonded to the bottom surface 131 of the recess 13 with an adhesive material (not shown), such as a die attachment material.

[0046] (Insulating layer formation process) Next, an insulating layer 20 is formed on the first surface 11 of the housing substrate 10 and on the element 50. For example, a resin film (not shown) including a support substrate and the insulating layer 20 is attached to the first surface 11 of the housing substrate 10 and the element 50. The insulating layer 20 is then sucked into the gap between the wall surface 132 of the recess 13 of the housing substrate 10 and the element 50. For example, by using a vacuum laminator to provide the insulating layer 20 on the first surface 11 of the housing substrate 10 and the element 50, attachment and suction into the gap of the recess 13 can be achieved. In this way, as shown in Figure 5, an insulating layer 20 can be formed that is located in the gap of the recess 13 and covers the first surface 11 and the element 50.

[0047] Alternatively, an insulating layer 20 may be formed using a curable resin. For example, when using a thermosetting resin, a resin film (not shown) including a support substrate and a layer of thermosetting resin is attached to the first surface 11 of the housing substrate 10 and the element 50. For example, by using a vacuum laminator to place the layer of thermosetting resin on the first surface 11 of the housing substrate 10 and the element 50, attachment and suction into the gap of the recess 13 can be achieved. After that, the layer of thermosetting resin is heated to form the insulating layer 20. When using a photocurable resin, the procedure is the same as when using a thermosetting resin, except that the photocurable resin is irradiated with light such as ultraviolet light or an electron beam to form the insulating layer 20.

[0048] Furthermore, a processing step may be performed to form through holes in the insulating layer 20 through which the second portion 27 of the conductive layer 25 described above is provided. For example, if the insulating layer 20 is photosensitive, through holes can be formed by subjecting the insulating layer 20 to exposure and development treatments.

[0049] Furthermore, as described above, when the insulating layer 20 is drawn into the gap between the wall surface 132 of the recess 13 of the housing substrate 10 and the element 50 by suction, the thickness of the insulating layer 20 may be smaller in the vicinity of the gap in the recess 13 compared to other parts. For example, as shown in Figure 2, a depression 21 may be formed on the surface of the insulating layer 20 in the portion that overlaps with the gap between the wall surface 132 of the recess 13 and the element 50 when viewed along the direction normal to the first surface 11 of the housing substrate 10. The depth of the depression 21 is, for example, 5 μm or more, and for example, 10 μm or less. By forming a depression, stress concentration can be avoided.

[0050] (Conductive layer formation process) Next, a conductive layer 25 is formed, having a first portion 26 located on the insulating layer 20 and a second portion 27 that penetrates the insulating layer 20 and electrically connects the first portion 26 with the terminal 51 of the element 50. This makes it possible to obtain the mounting substrate 1 shown in Figure 1.

[0051] In this embodiment, as described above, the element 50 is placed in the recess 13 of the housing substrate 10. Therefore, even if the insulating layer 20 covering the element 50 expands or contracts, the range of displacement of the element 50 can be limited to the inside of the recess 13. This prevents the element 50 from being displaced beyond the allowable range during the manufacturing process of the mounting substrate 1.

[0052] It is possible to make various modifications to the embodiments described above. Hereinafter, modifications will be described with reference to the drawings as necessary. In the following description and the drawings used therein, parts that can be configured similarly to the embodiments described above will be given the same reference numerals as those used for the corresponding parts in the embodiments described above, and redundant explanations will be omitted. Furthermore, if it is clear that the effects and advantages obtained in the embodiments described above can also be obtained in the modifications, the explanation may be omitted.

[0053] (First variation) In the above-described embodiment, an example was shown in which the mounting substrate 1 includes a support substrate 30 that supports the insulating layer 20 from the second surface 12 side. However, the example is not limited to this, and as shown in Figure 6, the mounting substrate 1 does not have to include a support substrate 30. Such a mounting substrate 1 can be obtained, for example, by manufacturing the mounting substrate 1 shown in Figure 1 above, and then further performing a step of separating the support substrate 30 from the second surface 12 of the housing substrate 10.

[0054] (Second variation) As shown in Figure 7, the support substrate 30 that supports the insulating layer 20 from the second surface 12 side may be provided with electrodes 35 that penetrate the support substrate 30. In this case, as shown in Figure 7, the conductive layer 25 may further have a third portion 28 in addition to the first portion 26 and the second portion 27, which penetrates the insulating layer 20 and the housing substrate 10 and electrically connects the first portion 26 and the electrodes 35 of the support substrate 30. This allows the terminals 51 of the element 50 and the electrodes 35 of the support substrate 30 to be electrically connected. Other electronic components that transmit and receive electrical signals to and from the element 50 are electrically connected to the electrodes 35 of the support substrate 30.

[0055] The through-hole in the housing substrate 10, where the third portion 28 of the conductive layer 25 is provided, may be formed in the process of forming the recess 13 in the housing substrate 10. Alternatively, the through-hole in the housing substrate 10 may be formed after the recess 13 has been formed in the housing substrate 10.

[0056] (Third variation) As shown in Figure 8, the recess 13 of the housing substrate 10 may have a stepped portion 133 that supports the surface 52 of the element 50 located on the second surface 12 side of the housing substrate 10, and a through portion 134 that penetrates the insulating layer 20 between the surface 52 of the element 50 and the support substrate 30. In the example shown in Figure 8, the stepped portion 133 is formed by forming a through portion 134 that penetrates to the support substrate 30 side in a part of the bottom surface 131 of the recess 13. In this modified example, the element 50 has a sensor portion 53 formed on the surface 52 located on the second surface 12 side. For example, the element 50 includes an image sensor, and the sensor portion 53 is a light detection unit that detects light.

[0057] In this modified example, at least a portion of the surface 52 of the element 50 does not come into contact with the housing substrate 10. In this case, it is preferable to provide the sensor portion 53 on the portion of the surface 52 of the element 50 that does not come into contact with the housing substrate 10. This makes it possible to suppress a decrease in the accuracy of the sensor portion 53 due to contact with the housing substrate 10.

[0058] (Fourth variation) In the embodiments and modifications described above, an example was shown in which a conductive layer 25 provided on the insulating layer 20 is electrically connected to the terminal 51 of the element 50. In this modification, an example will be described in which a through electrode 45 of a through electrode substrate 40 located on the first surface 11 side of the housing substrate 10 is electrically connected to the terminal 51 of the element 50.

[0059] Figure 9 is a cross-sectional view showing the mounting substrate 1 according to this modified example. As shown in Figure 9, the mounting substrate 1 comprises a housing substrate 10, an element 50, an insulating layer 20, and a through-electrode substrate 40.

[0060] The through-electrode substrate 40 has a substrate 41 located on the first surface 11 side of the housing substrate 10, and a through-electrode 45 that penetrates the substrate 41 and protrudes from the surface of the substrate 41 toward the housing substrate 10. As shown in Figure 9, the through-electrode 45 penetrates the insulating layer 20 so as to be electrically connected to the terminal 51 of the element 50. In the example shown in Figure 9, the tip of the conductive layer 25 is in contact with the terminal 51 of the element 50.

[0061] The substrate 41 contains an inorganic material having a certain degree of insulating properties. For example, the substrate 41, like the support substrate 30, may be a glass substrate, quartz substrate, sapphire substrate, resin substrate, silicon substrate, silicon carbide substrate, alumina (Al2O3) substrate, aluminum nitride (AlN) substrate, zirconia oxide (ZrO2) substrate, lithium niobate substrate, tantalum niobate substrate, or a laminate of these substrates. The support substrate 30 may partially contain a substrate made of a conductive material, such as an aluminum substrate or a stainless steel substrate. Examples of glass used in the substrate 41 include alkali-free glass, similar to the case of the support substrate 30. The thickness of the substrate 41 is, for example, 0.05 mm or more, and for example, 0.5 mm or less.

[0062] The configuration of the through electrode 45 is not particularly limited, as long as the through electrode 45 is conductive. For example, the through electrode 45 may be composed of a single conductive layer, similar to the conductive layer 25 described above, or it may be composed of multiple conductive layers. As the material of the through electrode 45, the same metallic material as the conductive layer 25 can be used.

[0063] Below, an example of a manufacturing method for the mounting substrate 1 shown in Figure 9 will be explained with reference to Figure 10.

[0064] First, a housing substrate 10 with a recess 13 is formed on a support substrate 30 in the same manner as in the embodiment described above, an element 50 is placed in the recess 13, and the element 50 is covered with an insulating layer 20. For the insulating layer 20, for example, an adhesive can be used, and specifically, polyimide resin, epoxy resin, acrylic resin, etc. are used. Also, as shown in Figure 10, a through-electrode substrate 40 having through-electrodes 45 protruding toward the housing substrate 10 is prepared. Next, the through-electrode substrate 40 is placed on the insulating layer 20 so that the through-electrode 45 of the through-electrode substrate 40 contacts the terminals 51 of the element 50. For example, the through-electrode substrate 40 is pressed toward the insulating layer 20 so that the through-electrode 45 of the through-electrode substrate 40 penetrates the insulating layer 20 and contacts the terminals 51 of the element 50. In this way, the mounting substrate 1 shown in Figure 9 can be obtained.

[0065] While we have described several variations of the above-mentioned embodiment, it is naturally possible to combine and apply multiple variations as appropriate. [Explanation of symbols]

[0066] 1. Implemented circuit board 10 Housing board 11 Page 1 12 Side 2 13 recess 131 Base 132 Wall surface 133 Stepped section 134 Penetration section 20 Insulating layer 21 Indentation 25 Conductive layer 26 Part 1 27 Part 2 28 Part 3 30 Support substrate 35 electrodes 40 Through-electrode substrate 41 circuit boards 45 Through electrode 50 elements 51 terminals 53 Sensor section

Claims

1. A housing substrate having an organic material and including a first surface and a second surface located opposite the first surface, with a recess provided on the first surface side, An element located in the recess of the housing substrate and having terminals, An insulating layer that at least partially covers the housing substrate and the element on the first surface side, and is at least partially located in the gap between the wall surface of the recess of the housing substrate and the element, A mounting substrate comprising a substrate located on the first surface side of the housing substrate, and a through-electrode substrate having a through-electrode that penetrates the substrate and the insulating layer and is electrically connected to the terminal of the element.

2. The mounting substrate according to claim 1, wherein a recess is formed on the surface of the insulating layer in a portion that overlaps with the gap between the wall surface of the recess and the element when viewed along the direction normal to the first surface of the housing substrate.

3. The mounting substrate according to any one of claims 1 to 2, wherein the organic material of the housing substrate includes a polyimide resin, an epoxy resin, a polyphenylene ether resin, or a fluororesin.

4. The mounting substrate according to any one of claims 1 to 3, wherein the material constituting the insulating layer includes a polyimide resin, an epoxy resin, or an acrylic resin.

5. A step of preparing a support substrate having an inorganic material, A step of forming a housing substrate on the support substrate, which includes a first surface located on the side furthest from the support substrate and a second surface located on the side of the support substrate, wherein a recess is provided on the side of the first surface and the housing substrate is made of an organic material, The steps include: placing an element having terminals in the recess of the housing substrate; An insulating layer forming step, which forms an insulating layer that at least partially covers the housing substrate and the element on the first surface side and is at least partially located in the gap between the wall surface of the recess of the housing substrate and the element, A method for manufacturing a mounting substrate, comprising the steps of: preparing a through-electrode substrate having a substrate located on the first surface side of the housing substrate and a through-electrode penetrating the substrate; and arranging the through-electrode substrate on the insulating layer such that the through-electrode of the through-electrode substrate contacts the terminal of the element.

6. The method for manufacturing a mounting substrate according to claim 5, wherein the insulating layer formation step includes a step of drawing the insulating layer into the gap between the wall surface of the recess of the housing substrate and the element.

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