Method for adjusting the substrate transport position, substrate transport method, and substrate processing system

Abstract

The present invention provides a method for adjusting the substrate transport position, a transport method, and a processing system that reduce misalignment of substrates transported from a batch processing unit to a single-wafer processing unit. [Solution] A method for adjusting the substrate transport position of a substrate processing system 1 comprising a batch processing unit 4 for processing multiple substrates at once, a single-wafer processing unit 6, and a second interface unit 5 where substrates W to be transported from the batch processing unit to the single-wafer processing unit wait, wherein the second interface unit has a transfer table and a third transport device 53 for placing substrates processed by the batch processing unit onto the transfer table, the single-wafer processing unit has a fourth transport device 61 for acquiring substrates from the transfer table, the third transport device has a third transport arm 53a, and the fourth transport device has a fourth transport arm 61b. The substrate transport position adjustment method involves the fourth transport arm acquiring a substrate from the transfer table, detecting the amount of displacement of the substrate relative to a reference position while the fourth transport arm is holding the acquired substrate, and correcting the horizontal position when the substrate is placed based on this amount of displacement.

Description

Technical Field

[0001] The present disclosure relates to a method for adjusting a substrate transfer position, a substrate transfer method, and a substrate processing system.

Background Art

[0002] Patent Document 1 discloses a technique in which when a fork is retracting while holding a substrate, a sensor detects the position of the peripheral edge of the substrate held by the fork, and based on the detection value of the sensor, corrects the delivery position of the substrate of the next processing unit when transferring to the next processing unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure provides a technique capable of reducing the misalignment of a substrate transferred from a batch processing unit to a single-sheet processing unit.

Means for Solving the Problems

[0005] A method for adjusting the substrate transport position according to one aspect of the present disclosure is a method for adjusting the substrate transport position in a substrate processing system comprising: a batch processing unit for processing multiple substrates at once; a single-wafer processing unit for processing the substrates one at a time; and a substrate waiting unit where substrates to be transported from the batch processing unit to the single-wafer processing unit wait, wherein the substrate waiting unit comprises a transfer table on which the substrates are placed, and a first transport robot for placing the substrates processed by the batch processing unit onto the transfer table, and the single-wafer processing unit comprises a second transport robot for acquiring the substrates from the transfer table. The transport robot has a first transport robot which has a first holding part for holding the substrate, and a second transport robot which has a second holding part for holding the substrate, and the method for adjusting the substrate transport position is to have the second holding part acquire the substrate from the transfer table, to detect the amount of displacement of the substrate with respect to a reference position while the second holding part is holding the substrate acquired from the transfer table, and to correct the horizontal position when the first holding part places the substrate on the transfer table based on the detected amount of displacement. [Effects of the Invention]

[0006] According to this disclosure, misalignment of substrates transported from batch processing to single-wafer processing can be reduced. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view showing an example of a substrate processing system. [Figure 2] Figure 2 shows an example of the second transfer section. [Figure 3] Figure 3 is a flowchart showing an example of a substrate processing method. [Figure 4] Figure 4 shows an example of a method for adjusting the substrate transport position. [Figure 5] Figure 5 shows an example of a method for adjusting the substrate transport position. [Figure 6] Figure 6 shows an example of a method for adjusting the substrate transport position. [Figure 7] Figure 7 shows an example of a method for adjusting the substrate transport position. [Figure 8] FIG. 8 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 9] FIG. 9 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 10] FIG. 10 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 11] FIG. 11 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 12] FIG. 12 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 13] FIG. 13 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 14] FIG. 14 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 15] FIG. 15 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 16] FIG. 16 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 17] FIG. 17 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 18] FIG. 18 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 19] FIG. 19 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 20] FIG. 20 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 21] FIG. 21 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 22] FIG. 22 is a diagram showing an example of a method for adjusting a substrate transfer position.) [Figure 23] FIG. 23 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 24] FIG. 24 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 25] FIG. 25 is a diagram showing an example of a method for adjusting a substrate transfer position. [Figure 26] FIG. 26 is a diagram showing another example of a method for adjusting a substrate transfer position. [Figure 27] FIG. 27 is a diagram showing another example of a method for adjusting the substrate transfer position. [Figure 28] FIG. 28 is a diagram showing another example of a method for adjusting the substrate transfer position. [Figure 29] FIG. 29 is a diagram showing another example of a method for adjusting the substrate transfer position. [Figure 30] FIG. 30 is a diagram showing another example of a method for adjusting the substrate transfer position. [Figure 31] FIG. 31 is a diagram showing another example of a method for adjusting the substrate transfer position. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] In the following description, an XYZ orthogonal coordinate system is used. However, this coordinate system is defined for the purpose of explanation and does not limit the posture of the substrate processing system 1. A view in the XY plane is referred to as a plan view, and depending on the viewing point, the positive side of the Z axis may be referred to as the upper side, and the negative side of the Z axis may be referred to as the lower side.

[0010] 〔Substrate Processing System〕 Referring to FIG. 1, the substrate processing system 1 according to the embodiment will be described. FIG. 1 is a schematic plan view showing an example of the substrate processing system 1.

[0011] As shown in FIG. 1, the substrate processing system 1 includes a loading / unloading unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single wafer processing unit 6, and a control circuit 9.

[0012] The loading / unloading section 2 serves as both the loading and unloading section. This allows the substrate processing system 1 to be miniaturized. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.

[0013] The load port 21 is located on the negative X-axis side of the loading / unloading section 2. Multiple load ports 21 (e.g., four) are arranged along the Y-axis. The number of load ports 21 is not particularly limited. Cassettes C are placed on the load ports 21. Cassette C contains multiple (e.g., 25) substrates W. Cassette C is loaded into and out of the load port 21. Inside the cassette C, the substrates W are held horizontally and along the Z-axis at a second pitch P2 (P2 = N × P1) which is N times the first pitch P1. N is a natural number greater than or equal to 2, and in this embodiment it is 2, but it may be 3 or greater.

[0014] Multiple (e.g., four) stockers 22 are arranged along the Y-axis at the center of the X-axis of the loading / unloading section 2. Multiple (e.g., two) stockers 22 are arranged along the Y-axis adjacent to the first interface section 3 on the positive X-axis side of the loading / unloading section 2. Stockers 22 may be arranged in multiple stages along the Z-axis. Stockers 22 temporarily store cassettes C containing substrates W before cleaning, and cassettes C that have become empty after the substrates W have been removed. The number of stockers 22 is not particularly limited.

[0015] The loader 23 is adjacent to the first interface section 3. The loader 23 is positioned on the positive X-axis side of the loading / unloading section 2. The cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. Multiple loaders 23 may be provided. The loaders 23 may be arranged in multiple stages along the Z-axis.

[0016] The cassette transport device 24 transports the cassette C between the load port 21, the stocker 22, and the loader 23. The cassette transport device 24 is, for example, an articulated transport robot.

[0017] The first interface unit 3 is positioned on the positive X-axis side of the loading / unloading unit 2. The first interface unit 3 transports the substrate W between the loading / unloading unit 2, the batch processing unit 4, and the single-wafer processing unit 6. The first interface unit 3 includes a substrate transfer device 31, a lot formation unit 32, and a first transfer unit 33.

[0018] The substrate transfer device 31 transports the substrate W between the cassette C placed on the loader 23, the lot forming unit 32, and the first transfer unit 33. The substrate transfer device 31 consists of a multi-axis (e.g., 6-axis) vertical articulated robot and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has multiple holding claws (not shown) capable of holding multiple substrates W (e.g., 25). The substrate holding arm 31a can assume any position and orientation in three-dimensional space while holding the substrate W with its holding claws.

[0019] The lot formation unit 32 is positioned on the positive X-axis side of the first interface unit 3. The lot formation unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L.

[0020] The first transfer unit 33 is adjacent to the single-wafer processing unit 6. The first transfer unit 33 is located on the positive Y-axis side of the first interface unit 3. The first transfer unit 33 receives the substrate W from the fourth transport device 61 and temporarily stores it until it is handed over to the loading / unloading unit 2.

[0021] The batch processing unit 4 is located on the positive X-axis side of the first interface unit 3. The loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 are arranged in this order, from the negative X-axis side to the positive X-axis side. The batch processing unit 4 processes a lot L containing multiple substrates W (for example, 50 or 100) at a first pitch P1 all at once. One lot L consists of, for example, M cassettes C containing substrates W. M is a natural number greater than or equal to 2. M may be the same natural number as N, or a natural number different from N. The batch processing unit 4 includes a chemical tank 41, a rinse tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0022] The chemical solution tank 41 and the rinse solution tank 42 are arranged along the X-axis. For example, the chemical solution tank 41 and the rinse solution tank 42 are arranged in this order from the positive side of the X-axis to the negative side of the X-axis. The chemical solution tank 41 and the rinse solution tank 42 are collectively referred to as the treatment tank. The number of chemical solution tanks 41 and rinse solution tanks 42 is not limited to that shown in Figure 1. For example, although there is one set of chemical solution tank 41 and rinse solution tank 42 in Figure 1, there may be multiple sets.

[0023] The chemical tank 41 stores the chemical solution into which lot L is immersed. The chemical solution is, for example, an aqueous phosphoric acid solution (H3PO4). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film from the silicon oxide film. The chemical solution is not limited to an aqueous phosphoric acid solution. The chemical solution may also be DHF (dilute hydrofluoric acid), BHF (mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (mixture of ammonia, hydrogen peroxide, and water), SC2 (mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (mixture of tetramethylammonium hydroxide and water), a plating solution, etc. The chemical solution may be for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited and may be multiple.

[0024] The rinsing solution tank 42 stores the first rinsing solution into which the lot L is immersed. The first rinsing solution is pure water that removes the chemical solution from the substrate W, for example, DIW (deionized water).

[0025] The first conveying device 43 includes a guide rail 43a and a first conveying arm 43b. The guide rail 43a is positioned on the negative Y-axis side of the processing tank. The guide rail 43a extends along the X-axis from the first interface unit 3 to the batch processing unit 4. The first conveying arm 43b moves along the guide rail 43a. The first conveying arm 43b may move along the Z-axis or rotate around the Z-axis. The first conveying arm 43b conveys a lot L in one piece between the first interface unit 3 and the batch processing unit 4.

[0026] The processing device 44 receives and holds the lot L from the first transport arm 43b. The processing device 44 holds multiple substrates W along the Y axis at a first pitch P1, and holds each of the multiple substrates W vertically.

[0027] The drive unit 45 moves the processing tool 44 along the X and Z axes. The processing tool 44 immerses the lot L in the chemical solution stored in the chemical solution tank 41, then immerses the lot L in the first rinse solution stored in the rinse solution tank 42, and then passes the lot L to the first conveying device 43.

[0028] In this embodiment, there is one unit for the processing tool 44 and the drive unit 45, but there may be multiple units. In the latter case, one unit immerses the rod L in the chemical solution stored in the chemical solution tank 41, and another unit immerses the rod L in the first rinse solution stored in the rinse solution tank 42. In this case, the drive unit 45 only needs to move the processing tool 44 along the Z-axis, and does not need to move the processing tool 44 along the X-axis.

[0029] The second interface unit 5 is positioned on the positive Y-axis side of the batch processing unit 4. The second interface unit 5 transports the substrate W between the batch processing unit 4 and the single-wafer processing unit 6. The second interface unit 5 includes an immersion tank 51, a second transport device 52, a third transport device 53, and a second transfer unit 54.

[0030] The immersion tank 51 is positioned outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is positioned offset to the positive Y-axis relative to the processing tank. The immersion tank 51 stores the second rinse liquid into which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted out of the second rinse liquid by the third transport device 53. Since the substrate W is below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the collapse of the uneven pattern on the substrate W.

[0031] The second transport device 52 includes a Y-axis drive device 52a, a Z-axis drive device 52b, and a second transport arm 52c.

[0032] The Y-axis drive unit 52a is positioned on the positive X-axis side of the second interface unit 5. The Y-axis drive unit 52a extends along the Y-axis from the second interface unit 5 to the batch processing unit 4. The Y-axis drive unit 52a moves the Z-axis drive unit 52b and the second transport arm 52c along the Y-axis. The Y-axis drive unit 52a may include a ball screw.

[0033] The Z-axis drive unit 52b is movably mounted to the Y-axis drive unit 52a. The Z-axis drive unit 52b moves the second transport arm 52c along the Z-axis. The Z-axis drive unit 52b may include a ball screw.

[0034] The second transport arm 52c is movably mounted to the Z-axis drive unit 52b. The second transport arm 52c receives and holds the lot L from the first transport arm 43b. The second transport arm 52c holds multiple substrates W along the Y-axis at a first pitch P1, and holds each of the multiple substrates W vertically. The second transport arm 52c moves along the Y-axis and Z-axis by the Y-axis drive unit 52a and the Z-axis drive unit 52b. The second transport arm 52c is configured to move between multiple positions, including a receiving position, an immersion position, and a standby position.

[0035] The transfer position is the location where the lot L is transferred between the first transport arm 43b and the second transport arm 52c. The transfer position is located on the negative side of the Y axis and the positive side of the Z axis.

[0036] The immersion position is the position where the rod L is immersed in the immersion tank 51. The immersion position is located on the positive side of the Y axis and the negative side of the Z axis compared to the handover position.

[0037] The standby position is the position where the second transport arm 52c waits when neither the transfer of lot L nor the immersion of lot L into the immersion tank 51 is performed. The standby position is directly below the transfer position (negative Z-axis side) and does not obstruct the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position by moving only upward (positive Z-axis side), thus improving throughput. The standby position may also be the same position as the immersion position. In this case, it is possible to prevent particles that may be generated as a result of the operation of the first transport device 43 from adhering to the second transport arm 52c. The standby position may also be directly above the immersion position (positive Z-axis side). In this way, by setting the standby position to a position different from the transfer position, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0038] The second conveying device 52 moves the second conveying arm 52c to an immersion position or standby position while the first conveying device 43 is operating. This prevents contact between the first conveying arm 43b and the second conveying arm 52c.

[0039] The third transport device 53 consists of a multi-axis (e.g., 6-axis) vertical articulated robot and has a third transport arm 53a at its tip. The third transport arm 53a has a holding claw 53b (see Figure 2) capable of holding one substrate W and a clamping member 53c (see Figure 2). The clamping member 53c is configured to be movable between a closed position that clamps the peripheral edge of the substrate W and an open position that releases the clamp on the substrate W. The third transport arm 53a can take any position and orientation in three-dimensional space while holding the substrate W with the holding claw 53b and the clamping member 53c. The third transport device 53 transports the substrate W between the second transport arm 52c, which is in the immersion position, and the second transfer unit 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a do not interfere with each other. This allows one of the first transport device 43 and the third transport device 53 to operate independently, regardless of the operating state of the other. Therefore, the first transport device 43 and the third transport device 53 can be operated at any desired timing, thus reducing the time required to transport the substrate W. As a result, the productivity of the substrate processing system 1 is improved.

[0040] The second transfer unit 54 is adjacent to the single-wafer processing unit 6. The second transfer unit 54 is located on the negative X-axis side of the second interface unit 5. The second transfer unit 54 receives the substrate W from the third transport device 53 and temporarily stores it until it is handed over to the single-wafer processing unit 6. The substrate W removed from the immersion tank 51 is placed on the second transfer unit 54. It is preferable that the substrate W placed on the second transfer unit 54 has its surface wet with the second rinsing liquid. In this case, the surface tension of the second rinsing liquid does not act on the substrate W, and the collapse of the uneven pattern on the substrate W can be suppressed. There may be one or more second transfer units 54. The second transfer units 54 may be arranged in multiple stages (for example, three stages) along the Z-axis. Details of the second transfer unit 54 will be described later.

[0041] The single-wafer processing unit 6 is located on the negative X-axis side of the second interface unit 5. The single-wafer processing unit 6 is located on the positive Y-axis side of the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4. The single-wafer processing unit 6 processes the substrates W one by one. The single-wafer processing unit 6 includes a fourth transport device 61, a liquid processing device 62, and a drying device 63.

[0042] The fourth transport device 61 includes a guide rail 61a and a fourth transport arm 61b.

[0043] The guide rail 61a is positioned on the negative Y-axis side of the sheet-wafer processing unit 6. The guide rail 61a extends along the X-axis within the sheet-wafer processing unit 6.

[0044] The fourth transport arm 61b moves along the guide rail 61a. The fourth transport arm 61b rotates around the Z axis. The fourth transport arm 61b transports the substrate W between the second transfer unit 54, the liquid processing device 62, the drying device 63, and the first transfer unit 33. There may be one or more fourth transport arms 61b; in the latter case, the fourth transport device 61 transports multiple substrates (for example, five) W at once.

[0045] The liquid processing apparatus 62 is positioned on the positive X-axis and positive Y-axis side of the single-wafer processing apparatus 6. The liquid processing apparatus 62 is single-wafer type and processes one substrate W at a time with the processing liquid. The liquid processing apparatus 62 is arranged in multiple stages (for example, 3 stages) along the Z-axis. This allows multiple substrates W to be processed with the processing liquid simultaneously. The processing liquid may consist of multiple components, for example, pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA (isopropyl alcohol).

[0046] The drying apparatus 63 is positioned adjacent to the liquid processing apparatus 62 on the negative X-axis side. In this case, the end face of the single-wafer processing unit 6 on the positive Y-axis side can be positioned flush or nearly flush with the end face of the second interface unit 5 on the positive Y-axis side. As a result, there is almost no dead space, and the footprint of the substrate processing system 1 can be reduced. In contrast, if the drying apparatus 63 is positioned adjacent to the liquid processing apparatus 62 on the positive Y-axis side, the end face of the single-wafer processing unit 6 on the positive Y-axis side will protrude beyond the end face of the second interface unit 5 on the positive Y-axis side, potentially creating dead space. The drying apparatus 63 is a single-wafer type and dries one substrate W at a time with supercritical fluid. The drying apparatus 63 is arranged in multiple stages (for example, 3 stages) along the Z-axis. This allows multiple substrates W to be dried simultaneously.

[0047] The liquid processing apparatus 62 and the drying apparatus 63 do not necessarily have to be single-wafer type; the liquid processing apparatus 62 may be single-wafer type and the drying apparatus 63 may be batch type. The drying apparatus 63 may dry multiple substrates W at once using a supercritical fluid. The number of substrates W processed at once in the drying apparatus 63 may be greater than or less than the number of substrates W processed at once in the liquid processing apparatus 62. Other apparatus besides the liquid processing apparatus 62 and the drying apparatus 63 may be arranged in the single-wafer processing apparatus 6.

[0048] The control circuit 9 is, for example, a computer. The control circuit 9 comprises an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as memory. The storage unit 92 stores programs that control various processes performed in the board processing system 1. The control circuit 9 controls the operation of the board processing system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92.

[0049] The control circuit 9 includes electronic circuits such as a CPU, FPGA (Field Programmable Gate Array), or ASIC (Application Specific Integrated Circuit), and performs the various control operations described in this specification by executing instruction codes stored in memory or by designing the circuit for special applications.

[0050] In the substrate processing system 1, the substrate W is transported from the loading / unloading section 2 to the first interface section 3, batch processing section 4, second interface section 5, and single-wafer processing section 6 in that order, and then returns to the loading / unloading section 2.

[0051] [Second delivery department] An example of the second transfer unit 54 will be described with reference to Figure 2. Figure 2 is a diagram showing an example of the second transfer unit 54. As shown in Figure 2, the second transfer unit 54 includes a transfer table 55, an alignment table 56, a substrate position changing unit 57, and a detection unit 58.

[0052] The transfer platform 55 has a base plate 55a, a plurality of pins 55b, and a nozzle 55c. The plurality of pins 55b are provided on the base plate 55a. The number of pins 55b is, for example, three. The number of pins 55b may be four or more. The surface including the upper end of each pin 55b is horizontal. The plurality of pins 55b horizontally support the substrate W from below above the base plate 55a. The nozzle 55c discharges pure water supplied through a pure water supply line (not shown). This supplies pure water to the upper surface of the substrate W supported by the plurality of pins 55b.

[0053] The alignment table 56 is provided above the transfer table 55. The alignment table 56 has a base plate 56a and a plurality of support parts 56b. The plurality of support parts 56b are provided on the base plate 56a. The number of support parts 56b is, for example, four. The number of support parts 56b may be three, or five or more. Each support part 56b has a frustoconical protrusion whose outer diameter decreases from the lower end to the upper end. The surface including the upper end of each support part 56b is horizontal. The plurality of support parts 56b support the substrate W from below above the base plate 56a. The plurality of support parts 56b support the substrate W with the tapered portion of the protrusion. This centers the substrate W. The center position of the substrate W supported by the plurality of support parts 56b on the alignment table 56 coincides with the center position of the substrate W supported by the plurality of pins 55b on the transfer table 55.

[0054] The substrate position changing unit 57 has a contact surface 57a that can contact the substrate W held by the third transport arm 53a. The contact surface 57a is provided on the positive X-axis side of the substrate position changing unit 57. The contact surface 57a is, for example, a flat surface. The contact surface 57a may also be a curved surface that is convex on the positive X-axis side. While holding the substrate W, the third transport arm 53a moves to the same height as the contact surface 57a on the positive X-axis side of the substrate position changing unit 57a, and then moves horizontally toward the negative X-axis side toward the contact surface 57a, thereby bringing the edge of the substrate W into contact with the contact surface 57a and aligning the substrate W. The substrate position changing unit 57 is positioned on the positive X-axis side of the transfer table 55. In this case, the time required for the third transport arm 53a to align the substrate W can be shortened. The substrate position changing unit 57 is positioned above the transfer table 55 and below the alignment table 56. In this case, the distance traveled by the third transport arm 53a from the time it aligns the substrate W until it hands the substrate W to the transfer table 55 is shortened, thus reducing the time required for the third transport arm 53a to move. The position where the substrate position changing unit 57 is located is not limited to the position shown in Figure 2, and it may be located in any other position accessible to the third transport arm 53a. The substrate position changing unit 57 may be located on the negative X-axis side of the transfer table 55. The substrate position changing unit 57 may be located below the transfer table 55, or above the alignment table 56.

[0055] The detection unit 58 may include a light-emitting unit 58a and a light-receiving unit 58b. The light-emitting unit 58a and the light-receiving unit 58b face each other across the path through which the substrate W passes when the fourth transport arm 61b moves toward the negative X-axis after receiving the substrate W from the transfer table 55. For example, the light-emitting unit 58a is provided below the light-receiving unit 58b. The light-emitting unit 58a may also be provided above the light-receiving unit 58b. The detection unit 58 detects the position of the peripheral edge of the substrate W when the fourth transport arm 61b is moving along the negative X-axis while holding the substrate W. The light-emitting unit 58a is a light source such as a light-emitting diode (LED). The light-receiving unit 58b is an image sensor such as a linear image sensor. Multiple detection units 58 may be provided. In this case, the detection accuracy is improved.

[0056] [Substrate processing method] Referring to Figures 1 and 3, an example of a substrate processing method performed in the substrate processing system 1 will be described. Figure 3 is a flowchart of an example of a substrate processing method. The processing shown in Figure 3 is performed under the control of the control circuit 9.

[0057] First, cassette C, containing multiple circuit boards W, is loaded into the loading / unloading section 2 and placed on the load port 21. Inside cassette C, the circuit boards W are held horizontally and along the Z-axis at a second pitch P2 (P2 = N × P1). N is a natural number greater than or equal to 2, and in this embodiment it is 2, but it may be 3 or greater.

[0058] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23. Once the cassette C is transported to the loader 23, the lid is opened by the lid opening / closing mechanism.

[0059] Next, the substrate transfer device 31 receives the substrate W contained in the cassette C (S1 in Figure 3) and transports it to the lot formation unit 32.

[0060] Next, the lot formation unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L (S2 in Figure 3). One lot L consists of, for example, M substrates W for cassette C. Since the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W that can be processed at once can be increased.

[0061] Next, the first conveying device 43 receives the lot L from the lot forming unit 32 and conveys it to the processing device 44.

[0062] Next, the processing tool 44 descends from above the chemical tank 41, immersing the rod L in the chemical solution and performing treatment with the chemical solution (S3 in Figure 3). After that, the processing tool 44 rises to lift the rod L out of the chemical solution, and then moves toward the negative side of the X axis toward above the rinse solution tank 42.

[0063] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs treatment with the rinse liquid (S3 in Figure 3). After that, the processing tool 44 rises to lift the lot L out of the first rinse liquid. Then, the first conveying device 43 receives the lot L from the processing tool 44 and hands it over to the second conveying device 52.

[0064] Next, the second transport arm 52c of the second transport device 52 moves to the positive side of the Y-axis and descends from above the immersion tank 51, immersing the lot L in the second rinsing liquid (S4 in Figure 3). The multiple substrates W of lot L are held in the second rinsing liquid until they are pulled out of the second rinsing liquid by the third transport device 53. Since the substrates W are below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, preventing the collapse of the uneven pattern on the substrates W.

[0065] Next, the third transport device 53 transports the substrates W of lot L, held by the second transport arm 52c in the second rinsing liquid, to the second transfer section 54. The third transport device 53 transports the substrates W one by one to the second transfer section 54. In the second transfer section 54, pure water is discharged onto the upper surface of the substrates W to prevent the surface from drying out and the uneven pattern from collapsing, and a liquid film of pure water is formed.

[0066] Next, the fourth transport device 61 receives the substrate W from the second transfer unit 54 and transports it to the liquid processing device 62.

[0067] Next, the liquid processing apparatus 62 processes each substrate W with liquid (S5 in Figure 3). The liquid may consist of multiple liquids, for example, pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA. The liquid processing apparatus 62 supplies pure water and the drying liquid in this order to the upper surface of the substrate W, forming a liquid film of the drying liquid.

[0068] Next, the fourth transport device 61 receives the substrate W from the liquid processing device 62 and holds the substrate W horizontally with the drying liquid film facing upwards. The fourth transport device 61 then transports the substrate W from the liquid processing device 62 to the drying device 63.

[0069] Next, the drying apparatus 63 dries the substrates W one by one with supercritical fluid (S5 in Figure 3). The drying liquid can be replaced with supercritical fluid, and the collapse of the uneven pattern on the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure vessel, the process is carried out one sheet at a time rather than in batches in order to miniaturize the pressure vessel.

[0070] In this embodiment, the drying apparatus 63 is a single-wafer type, but as mentioned above, it may also be a batch type. The batch type drying apparatus 63 dries multiple substrates W, each with a liquid film formed on it, all at once using a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm to hold the substrates W, the batch type drying apparatus 63 has multiple transport arms.

[0071] In this embodiment, the drying apparatus 63 dries the substrate W by supercritical drying, but the drying method is not particularly limited. Any drying method that can suppress the collapse of the uneven pattern of the substrate W is acceptable, and may be, for example, spin drying, scan drying, or water-repellent drying. In spin drying, the liquid processing apparatus 62 rotates the substrate W and removes the drying liquid from the substrate W by centrifugal force. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the outer circumference of the substrate W, and the liquid film is removed from the substrate W by centrifugal force. In scan drying, the supply position of the drying gas, such as nitrogen gas, may also be moved from the center of the substrate W toward the outer circumference of the substrate W in accordance with the supply position of the drying liquid.

[0072] Next, the fourth transport device 61 receives the substrate W from the drying device 63 and transports it to the first transfer unit 33.

[0073] Next, the substrate transfer device 31 receives the substrate W from the first transfer unit 33 and stores it in the cassette C (S6 in Figure 3). The cassette C, containing multiple substrates W, is then discharged from the loading / unloading unit 2. This completes the process shown in Figure 3.

[0074] [Method for adjusting the substrate transport position] Referring to Figures 4 to 25, an example of a method for adjusting the substrate transport position will be described. Figures 4 to 25 are diagrams illustrating an example of a method for adjusting the substrate transport position. The substrate transport position adjustment method shown in Figures 4 to 25 is performed, for example, using a dummy substrate W before processing is carried out on the actual product substrate. A product substrate may be used instead of a dummy substrate. The substrate transport position adjustment method shown in Figures 4 to 25 is performed, for example, during periodic maintenance of the substrate processing system 1.

[0075] First, as shown in Figure 4, an adjustment jig 59 is mounted on the alignment table 56. For example, the adjustment jig 59 is mounted on the alignment table 56 by an operator. The adjustment jig 59 is detachable from the alignment table 56. In this case, one adjustment jig 59 can be used in multiple substrate processing systems 1, so it is not necessary to prepare an adjustment jig 59 for each substrate processing system 1. The adjustment jig 59 has legs 59a, a base plate 59b, a top plate 59c, a connecting part 59d, a reference block 59e, a laser displacement meter 59f, and a camera 59g. For example, four legs 59a are provided. Each leg 59a extends downward from the lower surface of the base plate 59b at the periphery of the base plate 59b. Each leg 59a is placed on the upper surface of the alignment table 56. The base plate 59b is provided parallel to the base plate 56a of the alignment stand 56 by the legs 59a. The top plate 59c is provided parallel to the base plate 59b. For example, four connecting parts 59d are provided. Each connecting part 59d connects the base plate 59b and the top plate 59c at their peripheral edges. A reference block 59e is provided on the base plate 59b. The reference block 59e holds the target disk TD (see Figure 5) in a reference position. The target disk TD is a plate-shaped member with positioning marks on its upper surface. A laser displacement meter 59f is attached to the top plate 59c. For example, three laser displacement meters 59f are provided. The laser displacement meter 59f detects the vertical position and the inclination of the target disk TD with respect to the horizontal plane. A camera 59g is attached to the top plate 59c. Camera 59g detects the horizontal position and rotation around the vertical axis of the target disk TD by capturing positioning marks on the target disk TD.

[0076] Next, as shown in Figure 5, the target disk TD is placed on the reference block 59e. For example, the target disk TD is placed on the reference block 59e by an operator. Then, the laser displacement meter 59f and camera 59g detect the position of the target disk TD and transmit the detected position information to the control circuit 9. The control circuit 9 stores the received position information of the target disk TD as the reference position.

[0077] Next, as shown in Figure 6, the target disk TD installed on the reference block 59e is removed. For example, the target disk TD is removed from the reference block 59e by an operator.

[0078] Next, as shown in Figure 7, the third transport arm 53a moves to a position directly above the position where the substrate W is placed on the alignment table 56 (hereinafter referred to as the "first insertion position") while holding the target disk TD. Next, the laser displacement meter 59f and camera 59g detect the position of the target disk TD and transmit the detected position information to the control circuit 9. Based on the received position information of the target disk TD and the reference position, the control circuit 9 corrects the first insertion position so that the received position of the target disk TD matches the reference position.

[0079] Next, as shown in Figure 8, the third transport arm 53a retracts to the positive X-axis side of the alignment table 56 while holding the target disk TD.

[0080] Next, as shown in Figure 9, the target disk TD is removed from the third transport arm 53a, and the adjustment jig 59 is removed from the alignment table 56. For example, the target disk TD is removed from the third transport arm 53a by the operator. For example, the adjustment jig 59 is removed from the alignment table 56 by the operator.

[0081] Next, as shown in Figure 10, the fourth transport arm 61b moves to a position directly above the position where the substrate W will be transferred to the alignment table 56 (hereinafter referred to as the "second insertion position") while holding the substrate W. The substrate W is, for example, a dummy substrate acquired by the fourth transport arm 61b from the first transfer unit 33. The substrate W may also be a dummy substrate placed on the fourth transport arm 61b by an operator.

[0082] Next, as shown in Figure 11, the fourth transport arm 61b descends while holding the substrate W, and passes the substrate W to the multiple support parts 56b. The multiple support parts 56b support the substrate W with the tapered portion of the convex part. This centers the substrate W. After passing the substrate W to the multiple support parts 56b, the fourth transport arm 61b retracts to the negative X-axis side of the alignment table 56.

[0083] Next, as shown in Figure 12, the third transport arm 53a receives the substrate W supported by the multiple support parts 56b. At this time, the third transport arm 53a does not hold the substrate W with the retaining claws 53b and clamping members 53c.

[0084] Next, as shown in Figure 13, the third transport arm 53a, while holding the substrate W, presses the substrate W against the contact surface 57a of the substrate position changing unit 57, thereby moving the substrate W to the positive X-axis side relative to the third transport arm 53a.

[0085] Next, as shown in Figure 14, the third transport arm 53a moves to a position directly above the position where the substrate W is to be transferred to the transfer table 55 (hereinafter referred to as the "third insertion position"), while holding the substrate W.

[0086] Next, as shown in Figure 15, the third transport arm 53a descends while holding the substrate W, and passes the substrate W to a plurality of pins 55b. The plurality of pins 55b horizontally support the substrate W from below above the base plate 55a. After passing the substrate W to the plurality of pins 55b, the third transport arm 53a retracts to the positive X-axis side of the transfer table 55.

[0087] Next, as shown in Figure 16, the fourth transport arm 61b receives the substrate W, which is supported by a plurality of pins 55b.

[0088] Next, as shown in Figure 17, the fourth transport arm 61b retracts to the negative X-axis side of the transfer table 55 while holding the substrate W. At this time, the detection unit 58 detects the amount of horizontal displacement of the substrate W held by the fourth transport arm 61b as it moves toward the negative X-axis side, and transmits the detected displacement amount to the control circuit 9. The control circuit 9 corrects the third insertion position (horizontal position) of the third transport arm 53a so that the received displacement amount becomes 0 (zero).

[0089] Next, as shown in Figure 18, the fourth transport arm 61b moves to the second insertion position while holding the substrate W.

[0090] Next, as shown in Figure 19, the fourth transport arm 61b descends while holding the substrate W, and passes the substrate W to the multiple support parts 56b. The multiple support parts 56b support the substrate W with the tapered portion of the convex part. This centers the substrate W. After passing the substrate W to the multiple support parts 56b, the fourth transport arm 61b retracts to the negative X-axis side of the alignment table 56.

[0091] Next, as shown in Figure 20, the third transport arm 53a receives the substrate W supported by the multiple support parts 56b. At this time, the third transport arm 53a does not hold the substrate W with the retaining claws 53b and clamping members 53c.

[0092] Next, as shown in Figure 21, the third transport arm 53a, while holding the substrate W, presses the substrate W against the contact surface 57a of the substrate position changing unit 57, thereby moving the substrate W to the positive X-axis side relative to the third transport arm 53a.

[0093] Next, as shown in Figure 22, the third transport arm 53a moves to the third insertion position while holding the substrate W.

[0094] Next, as shown in Figure 23, the third transport arm 53a descends while holding the substrate W, and passes the substrate W to a plurality of pins 55b. The plurality of pins 55b horizontally support the substrate W from below above the base plate 55a. After passing the substrate W to the plurality of pins 55b, the third transport arm 53a retracts to the positive X-axis side of the transfer table 55.

[0095] Next, as shown in Figure 24, the fourth transport arm 61b receives the substrate W, which is supported by a plurality of pins 55b.

[0096] Next, as shown in Figure 25, the fourth transport arm 61b retracts to the negative X-axis side of the transfer table 55 while holding the substrate W. At this time, the detection unit 58 detects the amount of horizontal displacement of the substrate W held by the fourth transport arm 61b as it moves toward the negative X-axis side, and transmits the detected displacement amount to the control circuit 9. The control circuit 9 determines whether the received displacement amount is within the acceptable range. If the received displacement amount is within the acceptable range, the substrate transport position adjustment method is terminated. If the received displacement amount is not within the acceptable range, the control circuit 9 controls the third transport arm 53a and the fourth transport arm 61b to repeat the operations from Figure 18 to Figure 25.

[0097] According to the example of the substrate transport position adjustment method described above, first, while the substrate W acquired from the transfer table 55 is held by the fourth transport arm 61b, the amount of displacement of the substrate W relative to the reference position is detected. Next, based on the detected amount of displacement, the horizontal position when the third transport arm 53a places the substrate W on the transfer table 55 is corrected. In this case, the positional displacement of the substrate W transported from the batch processing unit 4 to the single-wafer processing unit 6 can be reduced.

[0098] Referring to Figures 26 to 31, another example of a method for adjusting the substrate transport position will be described. Figures 26 to 31 are diagrams illustrating another example of a method for adjusting the substrate transport position. The substrate transport position adjustment method shown in Figures 26 to 31 is performed using the product substrate as the substrate W when processing is carried out on the product substrate. The substrate transport position adjustment method shown in Figures 26 to 31 is performed, for example, on all substrates W of lot L. The substrate transport position adjustment method shown in Figures 26 to 31 may also be performed on some of the substrates W of lot L, such as the first substrate W of lot L.

[0099] First, as shown in Figure 26, the third transport arm 53a acquires the substrate W, which is held in a vertical position in the immersion tank 51. The substrate W is, for example, a product substrate. When the third transport arm 53a acquires the substrate W from the immersion tank 51, it holds the substrate W with the holding claws 53b and clamping member 53c. Next, the third transport arm 53a changes the substrate W from a vertical position to a horizontal position.

[0100] Next, as shown in Figure 27, the third transport arm 53a moves the substrate W relative to the third transport arm 53a toward the positive X-axis by pressing the substrate W against the contact surface 57a of the substrate position changing unit 57 while the substrate W is held in a horizontal position. Before pressing the substrate W against the contact surface 57a, the third transport arm 53a moves the clamp member 53c from the closed position to the open position.

[0101] Next, as shown in Figure 28, the third transport arm 53a moves to the third insertion position while holding the substrate W.

[0102] Next, as shown in Figure 29, the third transport arm 53a descends while holding the substrate W, and passes the substrate W to a plurality of pins 55b. The plurality of pins 55b horizontally support the substrate W from below above the base plate 55a. After passing the substrate W to the plurality of pins 55b, the third transport arm 53a retracts to the positive X-axis side of the transfer table 55.

[0103] Next, as shown in Figure 30, the fourth transport arm 61b receives the substrate W, which is supported by a plurality of pins 55b.

[0104] Next, as shown in Figure 31, the fourth transport arm 61b retracts to the negative X-axis side of the transfer table 55 while holding the substrate W. At this time, the detection unit 58 detects the amount of horizontal displacement of the substrate W held by the fourth transport arm 61b as it moves toward the negative X-axis side, and transmits the detected displacement amount to the control circuit 9. The control circuit 9 corrects the third insertion position (horizontal position) of the third transport arm 53a so that the received displacement amount becomes 0 (zero). This improves the positional accuracy when the third transport arm 53a places the next substrate W onto the transfer table 55.

[0105] In another example of the substrate transport position adjustment method described above, first, while the substrate W acquired from the transfer table 55 is held by the fourth transport arm 61b, the amount of displacement of the substrate W relative to the reference position is detected. Next, based on the detected amount of displacement, the horizontal position when the third transport arm 53a places the substrate W on the transfer table 55 is corrected. In this case, the positional displacement of the substrate W transported from the batch processing unit 4 to the single-wafer processing unit 6 can be reduced.

[0106] In the example above, we described a case where the third insertion position of the third transport arm 53a is corrected based on the displacement of a single substrate W, but this is not limited to this. For example, the third insertion position of the third transport arm 53a may be corrected based on the average value of the displacement amounts of multiple substrates W.

[0107] In the above embodiment, the second interface unit 5 is an example of a substrate waiting unit. The third transport device 53 is an example of a first transport robot, and the third transport arm 53a is an example of a first holding unit. The fourth transport device 61 is an example of a second transport robot, and the fourth transport arm 61b is an example of a second holding unit.

[0108] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of Symbols]

[0109] 1. Substrate Processing System 4. Batch Processing Unit 5. Second Interface Section 53 Third Conveyor Device 53a Third transport arm 55 Transfer platform 6-leaf processing 61. Fourth Conveyor Device 61b Fourth transport arm W board

Claims

1. A method for adjusting the substrate transport position in a substrate processing system comprising: a batch processing unit for processing multiple substrates at once; a single-wafer processing unit for processing the substrates one by one; and a substrate waiting unit where substrates to be transported from the batch processing unit to the single-wafer processing unit wait; The substrate waiting unit includes a transfer table on which the substrates are placed, and a first transport robot that places the substrates processed in the batch processing unit onto the transfer table. The single-wafer processing unit has a second transport robot for acquiring the substrate from the transfer table, The first transport robot has a first holding part that holds the substrate, The second transport robot has a second holding part that holds the substrate, The method for adjusting the substrate transport position is: The second holding unit acquires the substrate from the transfer table, With the substrate acquired from the transfer table being held by the second holding unit, the amount of displacement of the substrate relative to the reference position is detected. Based on the detected displacement, the first holding unit corrects the horizontal position when it places the substrate on the transfer table, Having, Method for adjusting the substrate transport position.

2. The circuit board shown is a dummy circuit board. The method for adjusting the substrate transport position is performed using the dummy substrate before processing is carried out on the product substrate. A method for adjusting the substrate transport position according to claim 1.

3. The aforementioned substrate is a product substrate, The method for adjusting the substrate transport position is performed using the product substrate when processing is carried out on the product substrate. A method for adjusting the substrate transport position according to claim 1.

4. The first transport robot is a 6-axis vertical articulated robot. A method for adjusting the substrate transport position according to any one of claims 1 to 3.

5. The aforementioned displacement is the displacement in the horizontal direction. A method for adjusting the substrate transport position according to any one of claims 1 to 3.

6. The amount of displacement is detected when the second holding part is moving. A method for adjusting the substrate transport position according to any one of claims 1 to 3.

7. The amount of displacement is detected by a detection unit including a light-emitting unit and a light-receiving unit that are opposite each other across the path through which the substrate passes when the second holding unit transports the substrate acquired from the transfer table. A method for adjusting the substrate transport position according to any one of claims 1 to 3.

8. A substrate transport method in a substrate processing system comprising: a batch processing unit for processing multiple substrates at once; a single-wafer processing unit for processing the substrates one by one; and a substrate waiting unit where substrates to be transported from the batch processing unit to the single-wafer processing unit wait; The substrate waiting unit includes a transfer table on which the substrates are placed, and a first transport robot that places the substrates processed in the batch processing unit onto the transfer table. The single-wafer processing unit has a second transport robot for acquiring the substrate from the transfer table, The first transport robot has a first holding part that holds the substrate, The second transport robot has a second holding part that holds the substrate, The substrate transport method is The second holding unit acquires the substrate from the transfer table, With the substrate acquired from the transfer table being held by the second holding unit, the amount of displacement of the substrate relative to the reference position is detected. Based on the detected displacement, the first holding unit corrects the horizontal position when it places the substrate on the transfer table, Having, A method for transporting circuit boards.

9. A batch processing unit that processes multiple circuit boards at once, A single-wafer processing unit that processes the aforementioned substrates one by one, A substrate waiting section where substrates to be transported from the batch processing section to the single-wafer processing section are waiting, Control circuit and Equipped with, The substrate waiting unit includes a transfer table on which the substrates are placed, and a first transport robot that places the substrates processed in the batch processing unit onto the transfer table. The single-wafer processing unit has a second transport robot for acquiring the substrate from the transfer table, The first transport robot has a first holding part that holds the substrate, The second transport robot has a second holding part that holds the substrate, The aforementioned control circuit is The second holding unit acquires the substrate from the transfer table, With the substrate acquired from the transfer table being held by the second holding unit, the amount of displacement of the substrate relative to the reference position is detected. Based on the detected displacement, the first holding unit corrects the horizontal position when it places the substrate on the transfer table, Configured to perform, PCB processing system.

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