System and method for monitoring a processing device
The integration of temperature measuring devices in reactor systems addresses temperature variations in semiconductor processing, ensuring high-quality deposition by real-time monitoring and correction.
JP2026085889APending Publication Date: 2026-05-25ASM IP HLDG BV
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Patent Information
- Application Number
- JP2025189129
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-13
- Filing Date
- 2025-11-10
- Publication Date
- 2026-05-25
AI Technical Summary
Technical Problem
Temperature variations during semiconductor processing lead to non-ideal deposition characteristics, necessitating accurate monitoring and control to prevent system malfunctions and production of defective substrates.
Method used
A reactor system with temperature measuring devices, such as pyrometers and infrared cameras, is integrated into substrate carriers and translation arms to measure substrate temperatures during rotation and transport, allowing for real-time comparison with reference temperatures and detection of deviations.
Benefits of technology
Enables precise temperature monitoring and control, preventing defects by identifying and correcting temperature discrepancies in real-time, thereby improving the quality of deposition processes.
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Smart Images
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Abstract
We provide reactor systems. [Solution] The reactor system may comprise a substrate carrier and / or a translation arm, which may be configured to move a substrate within the reactor system; a temperature measuring device; a processor; and / or a tangible non-temporary memory configured to communicate with the processor and storing instructions that cause the processor to perform actions in response to execution by the processor. The temperature measuring device may be coupled to the substrate carrier and / or the translation arm, and / or the temperature measuring device may be coupled to another component of the reactor system. The temperature measuring device may be configured to measure the temperature of a processed substrate within the reaction system. The processor may perform actions including measuring the temperature of the substrate and / or comparing the measured temperature with a reference temperature.
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