Multilayer electronic components

Abstract

We provide multilayer electronic components with excellent high-frequency characteristics (Low ESL). [Solution] The stacked electronic component 100 includes a body containing a dielectric layer and an internal electrode layer, and a plurality of external electrodes 131 to 136 arranged on the body, where D1 is the distance between two external electrodes that are adjacent to each other in the Y direction, and D2 is the distance between two external electrodes that are adjacent to each other in the X direction.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs), plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to implement. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] On the other hand, MLCCs are also widely used for decoupling, which removes noise from electrical signals within a set, due to their excellent high-frequency characteristics (Low ESL: Equivalent Series Inductance).

[0005] Furthermore, to resolve noise in high-speed integrated circuits (ICs), Land Side Capacitors (LSCs), a type of MLCC, can be placed adjacent to the IC. However, LSCs are known to require low thickness, high-frequency characteristics, and appropriate equivalent series resistance (Low ESR) characteristics.

[0006] To reduce ESL, it is crucial to minimize the number of magnetic flux linkages per unit current in the high-frequency range. This is addressed through various methods, such as controlling the structure to minimize the current loop or arranging internal and external electrodes in a direction that cancels out the magnetic field. Furthermore, to maintain appropriate ESR, methods such as arranging internal and external electrodes to minimize the loop current are also applied.

[0007] As mentioned above, LSCs are generally placed at the bottom of the IC substrate, and therefore are required to have low ESL and appropriate ESR while maintaining a low thickness. However, in the case of multi-terminal products with three or more external electrodes, there is a problem in that it is difficult to manufacture a product that is thin, has excellent capacitance, has low ESL characteristics, or can achieve appropriate ESR. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Korean Published Patent Gazette No. 10-2012-0119381 [Overview of the project] [Problems that the invention aims to solve]

[0009] One of the problems that this invention aims to solve is achieving low ESL (low ESL) in multilayer electronic components.

[0010] One of the problems that this invention aims to solve is achieving appropriate equivalent series resistance (Low ESR) characteristics for multilayer electronic components.

[0011] One of the problems that this invention aims to solve is to reduce the thickness of multilayer electronic components.

[0012] One of the problems to be solved by the present invention is to improve the capacitance characteristics of the multilayer electronic component.

[0013] However, some of the problems to be solved by the present invention are not limited to the above-described content and can be more easily understood in the process of describing the specific embodiments of the present invention.

Means for Solving the Problems

[0014] The multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrode layers alternately arranged with the dielectric layer in a first direction, a first and a second surface facing each other in the first direction, a third and a fourth surface connected to the first and second surfaces and facing each other in a second direction, a fifth and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a main body, a first electrode layer disposed on the main body, and a second electrode layer disposed on the first electrode layer, and includes external electrodes connected to the internal electrode layers. The external electrodes include first to third external electrodes respectively disposed over a part of the first, second, and fifth surfaces, and fourth to sixth external electrodes respectively disposed over a part of the first, second, and sixth surfaces. When the distance between two adjacent external electrodes among the first to sixth external electrodes in the third direction is D1 and the distance between two adjacent external electrodes among the first to sixth external electrodes in the second direction is D2, 0 < D2 / D1 ≤ 1.2 can be satisfied.

[0015] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrode layers alternately arranged with the dielectric layer in a first direction, and includes first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. The multilayer electronic component also includes a first electrode layer disposed on the body and a second electrode layer disposed on the first electrode layer, and a plurality of external electrodes connected to the internal electrode layers. Among the plurality of external electrodes, when the distance between two adjacent external electrodes arranged in the third direction is D1 and the distance between two adjacent external electrodes arranged in the second direction is D2, 0 < D2 / D1 ≤ 1.2 can be satisfied.

Effects of the Invention

[0016] One of the effects of the present invention is to provide a multilayer electronic component having excellent high-frequency characteristics (Low ESL).

[0017] One of the effects of the present invention is to provide a multilayer electronic component that realizes a target equivalent series resistance (Low ESR).

[0018] One of the effects of the present invention is to provide a multilayer electronic component having a thin thickness.

[0019] One of the effects of the present invention is to provide a multilayer electronic component having excellent capacitance characteristics.

[0020] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0021] [Figure 1] Schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention. [Figure 2](a) and (b) schematically show cross-sectional views including an internal electrode layer in one embodiment of the present invention. [Figure 3] (a) and (b) schematically show cross-sectional views including an internal electrode layer in another embodiment of the present invention. [Figure 4] It schematically shows a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 5] It schematically shows Lm based on the evaluation results of the moisture resistance reliability of the comparative example and the examples.

Mode for Carrying Out the Invention

[0022] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape, size, etc. of the elements in the drawings can be exaggerated for a clearer explanation, and the elements denoted by the same reference numerals in the drawings are the same elements.

[0023] And, in order to clearly explain the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of each configuration shown in the drawings are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to what is shown in the drawings. For components having the same function within the scope of the same concept, the same reference numerals are used for explanation. Further, throughout the specification, when a certain part says that a certain component "includes", this does not exclude other components unless otherwise stated, and means that other components may be further included.

[0024] In the drawings, the Z direction can be defined as the stacking direction or the thickness T direction, the X direction as the length L direction, and the Y direction as the width W direction.

[0025] Multilayer electronic component Figure 1 schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention; Figures 2(a) and (b) schematically show a cross-sectional view including an internal electrode layer in one embodiment of the present invention; Figures 3(a) and (b) schematically show a cross-sectional view including an internal electrode layer in another embodiment of the present invention; Figure 4 schematically shows a cross-sectional view along the line I-I' in Figure 1; and Figure 5 schematically shows Lm based on the evaluation results of moisture resistance reliability for comparative examples and examples.

[0026] Hereinafter, with reference to Figures 1 to 5, a multilayer electronic component according to one embodiment of the present invention will be described in detail. However, although a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, the present invention can also be applied to various electronic products that utilize dielectric compositions, such as inductors, piezoelectric elements, varistors, or thermistors.

[0027] A stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrode layers 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, a first and a second surface 1 and 2 facing each other in the first direction, a third and a fourth surface 3 and 4 connected to the first and the second surface 1 and 2 and facing each other in a second direction, and a fifth and a sixth surface 5 and 6 connected to the first to the fourth surface 1, 2, 3, 4 and facing each other in a third direction. The stacked electronic component 100 further includes first electrode layers 131a, 132a, 133a, 134a, 135a, 136a disposed on the body 110, and second electrode layers 131b, 132b, 133b, 134b, 135b, 136b disposed on the first electrode layers 131a, 132a, 133a, 134a, 135a, 136a. The stacked electronic component 100 further includes external electrodes 131, 132, 133, 134, 135, 136 connected to the internal electrode layers 121 and 122. The external electrodes 131, 132, 133, 134, 135, 136 include first to third external electrodes 131, 132, 133 respectively disposed over a part of the first, second and fifth surfaces 1, 2, 5, and fourth to sixth external electrodes 134, 135, 136 respectively disposed over a part of the first, second and sixth surfaces 1, 2, 6. When the distance between two adjacent external electrodes among the first to sixth external electrodes 131, 132, 133, 134, 135, 136 in the third direction is D1, and the distance between two adjacent external electrodes among the first to sixth external electrodes 131, 132, 133, 134, 135, 136 in the second direction is D2, 0 < D2 / D1 ≦ 1.2 can be satisfied.

[0028] The body 110 may have the dielectric layer 111 and the internal electrodes 121 and 122 alternately laminated.

[0029] More specifically, the body 110 may include a capacitance forming portion disposed inside the body 110 and including a first internal electrode 121 and a second internal electrode layer 122 alternately arranged so as to face each other with the dielectric layer 111 interposed therebetween to form a capacitance.

[0030] The specific shape of the main body 110 is not particularly limited. As shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0031] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first to fourth surfaces 1, 2, 3, 4 and face each other in a third direction.

[0032] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0033] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3) - based substances can be used. For example, barium titanate - based substances, lead - composite perovskite - based substances, or strontium titanate - based substances can be used. The barium titanate - based substances can contain BaTiO3 - based ceramic particles. Examples of the ceramic particles include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0034] Furthermore, the raw materials for forming the dielectric layer 111 can include particles such as barium titanate (BaTiO3), to which various ceramic additives, organic solvents, binders, dispersants, etc., can be added according to the purpose of the present invention.

[0035] On the other hand, in order to distinguish it from the dielectric layers included in the cover portions 112 and 113 described later, the dielectric layer 111 included in the capacitance forming portion can be defined as the first dielectric layer, and the dielectric layers included in the cover portions 112 and 113 can be defined as the second dielectric layer. The first dielectric layer and the second dielectric layer may be the same or different, and are not particularly limited.

[0036] Furthermore, the first and second dielectric layers can be formed using a dielectric material such as barium titanate (BaTiO3), and can therefore contain a dielectric microstructure after firing. The dielectric microstructure can include multiple dielectric crystal grains, grain boundaries arranged between adjacent dielectric crystal grains, and n-weighted points located at points where three or more grain boundaries meet, and can contain multiple dielectric crystal grains, grain boundaries, and n-weighted points, respectively.

[0037] The dimensions of the dielectric layer 111 in the first direction do not need to be particularly limited.

[0038] However, in order to more easily achieve miniaturization and high capacitance of multilayer electronic components, the dimensions of the dielectric layer 111 in the first direction may be 3.0 μm or less, 2.0 μm or less, 1.0 μm or less, 0.8 μm or less, 0.6 μm or less, 0.5 μm or less, or 0.4 μm or less.

[0039] Here, the dimension of the dielectric layer 111 in the first direction can mean the dimension of the dielectric layer 111 in the first direction, which is positioned between the first and second internal electrode layers 121 and 122.

[0040] On the other hand, the dimension of the dielectric layer 111 in the first direction can mean the dimension, distance, size, or length of the dielectric layer 111 in the first direction, or it can mean the thickness of the dielectric layer 111.

[0041] In this case, the dimension of the dielectric layer 111 in the first direction may be a concept that includes the dimension of at least one of the plurality of dielectric layers 111 in the first direction, or it may be a concept that includes the dimension of each of the dielectric layers 111 in the first direction.

[0042] Furthermore, the dimension of the dielectric layer 111 in the first direction can mean the average dimension of one dielectric layer in the first direction, or the average dimension of each of multiple dielectric layers 111 in the first direction, or the average dimension of multiple dielectric layers 111 in the first direction.

[0043] The average dimension of the dielectric layer 111 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and third directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average dimension of a single dielectric layer in the first direction can be calculated as the average value obtained by measuring the dimension in the first direction at five equally spaced points in the third direction of the single dielectric layer in the scanned image. These five equally spaced points can be specified in the capacitance formation section. Furthermore, by extending this measurement of average values ​​to three dielectric layers, the average dimension of multiple dielectric layers in the first direction can be further generalized.

[0044] The internal electrode layers 121 and 122 may be stacked alternately with the dielectric layer 111.

[0045] The internal electrode layers 121 and 122 may include a first internal electrode layer 121 and a second internal electrode layer 122, and the first and second internal electrode layers 121 and 122 may be arranged alternately facing each other with a dielectric layer 111 constituting the main body 110 in between. The first and second internal electrode layers 121 and 122 can be electrically isolated from each other by the dielectric layer 111 arranged between them in a first direction.

[0046] The main body 110 may be formed by alternately laminating a first ceramic green sheet printed with a first internal electrode pattern and a second ceramic green sheet printed with a second internal electrode pattern, and then firing them. Here, the first and second internal electrode patterns can be formed by applying an internal electrode paste, and after firing, they can become the first and second internal electrode layers 121 and 122.

[0047] In the following description, a stacked electronic component 100 according to one embodiment of the present invention will be described. Unless otherwise stated or otherwise contradictory, the description of the stacked electronic component 100 according to one embodiment can also be applied to a stacked electronic component 200 (not shown) according to another embodiment, and a person of ordinary skill can understand this appropriately by referring to the distinguished reference numerals in the drawings.

[0048] The internal electrode layer may include a main portion that forms a capacitance and a lead portion or floating portion that is connected to the external electrode.

[0049] Referring to Figure 2, a stacked electronic component according to one embodiment of the present invention will be described in more detail. The first internal electrode layer 121 is arranged at a distance of Lm from at least one of the third to sixth faces 3, 4, 5, and 6 of the main body and may include a first main portion 121-0 that forms capacitance, and first lead portions 121-1, 121-2, and 121-3 that are connected to the first main portion 121-0 and do not form capacitance. The first lead portions 121-1, 121-2, and 121-3 may include a first-first lead portion 121-1 that is spaced apart from each other and connected to the first external electrode 131, a first-second lead portion 121-2 that is connected to the third external electrode 133, and a first-third lead portion 121-3 that is connected to the fifth external electrode 135. In this configuration, the 1-1 lead portion 121-1 can contact a portion of at least one of the third and fifth surfaces 3 and 5, preferably a portion of the third and fifth surfaces 3 and 5. The 1-2 lead portion 121-2 can contact a portion of at least one of the fourth and fifth surfaces 4 and 5, preferably a portion of the fourth and fifth surfaces 4 and 5. The 1-3 lead portion 121-3 can contact a portion of the sixth surface 6.

[0050] The second internal electrode layer 122 is positioned at a distance of Lm from at least one of the third to sixth surfaces 3, 4, 5, and 6 of the main body and may include a second main portion 122-0 that forms a capacitance, and second lead portions 122-1, 122-2, and 122-3 that are connected to the second main portion 122-0 and do not form a capacitance. The second lead portions 122-1, 122-2, and 122-3 are positioned at a distance from each other and may include a second-first lead portion 122-1 that is connected to the fourth external electrode 134, a second-second lead portion 122-2 that is connected to the sixth external electrode 136, and a second-third lead portion 122-3 that is connected to the second external electrode 132. In this case, the second-first lead portion 122-1 may be in contact with at least one part of the third and sixth surfaces 3 and 6, preferably with parts of the third and sixth surfaces 3 and 6. The second-second lead portion 121-2 can contact a part of at least one of the fourth and sixth surfaces 4 and 6, preferably a part of the fourth and sixth surfaces 4 and 6. The second-third lead portion 122-3 can contact a part of the fifth surface 5.

[0051] In this case, the dimension in the second direction in which the second-third lead portion 122-3 contacts the fifth surface 5 is 1.25 to 2.75 times the dimension in the second direction in which the first-first lead portion 121-1 and the first-second lead portion 121-2 contact the fifth surface 5, and the dimension in the second direction in which the first-third lead portion 121-3 contacts the sixth surface 6 is 1.25 to 2.75 times the dimension in the second direction in which the second-first lead portion 122-1 and the second-second lead portion 122-2 contact the sixth surface 6.

[0052] By ensuring that the dimension in the second direction in which the second-third lead portion 122-3 contacts the fifth surface 5 is 1.25 to 2.75 times the dimension in the second direction in which the first-first lead portion 121-1 and the first-second lead portion 121-2 contact the fifth surface 5, and that the dimension in the second direction in which the first-third lead portion 121-3 contacts the sixth surface is 1.25 to 2.75 times the dimension in the second direction in which the second-first lead portion 122-1 and the second-second lead portion 122-2 contact the sixth surface 6, high-frequency characteristics (Low ESL) and appropriate ESR can be achieved.

[0053] Referring to Figure 3, another embodiment of the stacked electronic component of the present invention will be described. The first internal electrode layer 221 is arranged at a distance Lm from at least one of the third to sixth faces 3, 4, 5, and 6 of the main body and may include a first main portion 221-0 that forms capacitance, and first lead portions 221-1, 221-2, and 221-3 that are connected to the first main portion 221-0 and do not form capacitance. The first lead portions 221-1, 221-2, and 221-3 may include a first-first lead portion 221-1 that is spaced apart from each other and connected to the first external electrode 231, a first-second lead portion 221-2 that is connected to the third external electrode 233, and a first-third lead portion 221-3 that is connected to the fifth external electrode 235. In this configuration, the 1-1 lead portion 221-1 can contact a portion of at least one of the third and fifth surfaces 3 and 5, preferably a portion of the third and fifth surfaces 3 and 5. The 1-2 lead portion 221-2 can contact a portion of at least one of the fourth and fifth surfaces 4 and 5, preferably a portion of the fourth and fifth surfaces 4 and 5. The 1-3 lead portion 221-3 can contact a portion of the sixth surface 6.

[0054] The second internal electrode layer 222 is arranged at a distance Lm from at least one of the third to sixth surfaces 3, 4, 5, and 6 of the main body and includes a second main portion 222-0 that forms a capacitance, and second floating portions 222-1, 222-2, and 222-3 that are arranged at a distance from the second main portion 221-0 and do not form a capacitance. The second floating portions 222-1, 222-2, and 222-3 are arranged at a distance from each other and include a second-first floating portion 222-1 that is connected to the fourth external electrode 234, a second-second floating portion 222-2 that is connected to the sixth external electrode 236, and a second-third lead portion 222-3 that is connected to the second external electrode 232. In this case, the second-first floating portion 222-1 can be in contact with at least one part of the third and sixth surfaces 3 and 6, preferably with a part of the third and sixth surfaces 3 and 6. The second-second floating portion 222-2 can contact a part of at least one of the fourth and sixth surfaces 4 and 6, preferably a part of the fourth and sixth surfaces 4 and 6. The second-third floating portion 222-3 can contact a part of the fifth surface 5.

[0055] In this case, the dimension in the second direction in which the second-third floating portion 222-3 contacts the fifth surface 5 is 1.25 to 2.75 times the dimension in the second direction in which the first-first lead portion 221-1 and the first-second lead portion 221-2 contact the fifth surface 5, and the dimension in the second direction in which the first-third lead portion 221-3 contacts the sixth surface 6 is 1.25 to 2.75 times the dimension in the second direction in which the second-first floating portion 222-1 and the second-second floating portion 222-2 contact the sixth surface 6.

[0056] The dimension in the second direction in which the second to third floating portions 222-3 contact the fifth surface 5 satisfies 1.25 times or more and 2.75 times or less of the respective dimensions in the second direction in which the first to first lead portions 221-1 and the first to second lead portions 221-2 contact the fifth surface 5, and the dimension in the second direction in which the first to third lead portions 221-3 contact the sixth surface 6 satisfies 1.25 times or more and 2.75 times or less of the respective dimensions in the second direction in which the second to first floating portions 222-1 and the second to second floating portions 222-2 contact the sixth surface 6, whereby high-frequency characteristics (Low ESL) and appropriate ESR can be realized.

[0057] In the present invention, Lm can satisfy 3 μm or more or 30 μm or less, preferably, Lm can satisfy 3 μm or more, and more preferably, Lm can satisfy 3 μm or more and 30 μm or less. That is, 3 μm ≤ Lm can be satisfied, preferably, 3 μm ≤ Lm ≤ 30 μm can be satisfied. Here, Lm can mean a region where no lead portion or floating portion is arranged.

[0058] When Lm is less than 3 μm (Lm < 3 μm), short-circuiting of the internal electrode may be induced due to moisture penetration from the outside, and the moisture resistance reliability may be weakened. When Lm is more than 30 μm (30 μm < Lm), it is advantageous for moisture penetration from the outside, so it may be excellent in moisture resistance reliability, but the area where the main portion forming the capacitance is arranged may be insufficient, and there is a possibility that the target capacitance may not be satisfied. However, for the purpose of realizing various capacitances, Lm may be more than 30 μm (30 μm < Lm).

[0059] In the case of not being an embodiment of the present invention, even when Lm is 3 μm or more (3 μm ≤ Lm), there may be a possibility that the moisture resistance reliability due to moisture penetration from the outside is not excellent. However, in one embodiment of the present invention, for example, when the distance between the external electrodes arranged adjacent to each other in the third direction among a plurality of external electrodes is D1 and the distance between two external electrodes arranged adjacent to each other in the second direction is D2, when 0 < D2 / D1 ≤ 1.2 is satisfied, if Lm is 3 μm or more (3 μm ≤ Lm), there may be a possibility that the moisture resistance reliability due to moisture penetration from the outside is excellent. That is, in order to improve the moisture resistance reliability, Lm may be 3 μm or more (3 μm ≤ Lm).

[0060] On the other hand, the main body 110 can be formed by alternately laminating a first ceramic green sheet printed with a first internal electrode paste that becomes the first internal electrode layer 121 and a second ceramic green sheet printed with a second internal electrode paste that becomes the second internal electrode layer 122, and then firing. As a printing method of the conductive paste for the internal electrode, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0061] The substances forming the internal electrode layers 121 and 122 are not particularly limited, and substances having excellent electrical conductivity can be used. For example, the internal electrode layers 121 and 122 can contain one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0062] On the other hand, the dimension of the internal electrode layers 121 and 122 in the first direction does not need to be particularly limited.

[0063] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the dimension of the internal electrode layers 121 and 122 in the first direction may be 2.0 μm or less, 1.0 μm or less, 0.8 μm or less, 0.6 μm or less, 0.5 μm or less, or 0.4 μm or less.

[0064] Here, the dimensions of the internal electrode layers 121 and 122 in the first direction can mean the dimensions, distance, size, or length of the internal electrode layers 121 and 122 in the first direction, or it can mean the thickness of the internal electrode layers 121 and 122.

[0065] In this case, the dimensions of the internal electrode layers 121 and 122 in the first direction may be a concept that includes the dimensions of at least one of the multiple internal electrode layers 121 and 122 in the first direction, or it may be a concept that includes the dimensions of each of the internal electrode layers 121 and 122 in the first direction.

[0066] Furthermore, the dimensions of the internal electrode layers 121 and 122 in the first direction can represent the average dimensions of one internal electrode layer in the first direction, or the average dimensions of each of the multiple internal electrode layers 121 and 122 in the first direction, or the average dimensions of the multiple internal electrode layers 121 and 122 in the first direction.

[0067] The average dimensions of the internal electrode layers 121 and 122 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and third directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average dimensions of a single internal electrode in the first direction can be calculated as the average value obtained by measuring the dimensions of the single internal electrode in the first direction at five equally spaced points in the third direction in the scanned image. These five equally spaced points can be specified in the capacitance forming section. Furthermore, by extending this measurement of average values ​​to three internal electrodes, the average dimensions of multiple internal electrodes in the first direction can be further generalized.

[0068] On the other hand, the main body 110 may include cover portions 112 and 113 that are positioned on both end surfaces (end-surfaces) of the volume-forming portion in the first direction.

[0069] Specifically, it may include a first cover portion 112 positioned on one side of the volume-forming portion in the first direction and a second cover portion 113 positioned on the other side of the volume-forming portion in the first direction. More specifically, for example, it may include an upper cover portion 112 positioned on the upper part of the volume-forming portion in the first direction and a lower cover portion 113 positioned on the lower part of the volume-forming portion in the first direction.

[0070] The first cover portion 112 and the second cover portion 113 can be formed by arranging or stacking a single second dielectric layer or two or more second dielectric layers on the upper and lower surfaces of the capacitance forming portion in a first direction, respectively, and can essentially serve to prevent damage to the internal electrode layers 121 and 122 due to physical or chemical stress.

[0071] The first cover portion 112 and the second cover portion 113 do not include the internal electrode layers 121 and 122, and may contain the same dielectric material as the first dielectric layer 111 of the capacitance forming portion. That is, the first cover portion 112 and the second cover portion 113 may contain a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0072] On the other hand, the dimensions of the cover portions 112 and 113 in the first direction do not need to be particularly limited, and in the following description of the dimensions of the cover portions 112 and 113 in the first direction, it may mean the dimensions of the first cover portion 112 and the second cover portion 113, respectively.

[0073] However, in order to more easily achieve miniaturization and high capacitance of stacked electronic components, the dimensions of the cover portions 112 and 113 in the first direction may be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less.

[0074] Here, the dimensions of the cover portions 112 and 113 in the first direction can mean the dimensions, distance, size, or length of the cover portions 112 and 113 in the first direction, or it can mean the thickness of the cover portions 112 and 113.

[0075] Furthermore, the dimensions of the cover portions 112 and 113 in the first direction can represent the average dimensions of the first and second cover portions 112 and 113 in the first direction, or the average dimensions of the first and second cover portions 112 and 113 in the first direction.

[0076] The average dimensions of the cover portions 112 and 113 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and third directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, it can mean the average value calculated by measuring the size in the first direction at five equally spaced points in the third direction in an image scanned from a single cover portion.

[0077] One embodiment of the present invention describes a structure in which a stacked electronic component 100 has six external electrodes 131, 132, 133, 134, 135, and 136. However, the number and shape of the external electrodes can be changed depending on the form of the internal electrode layers 121 and 122 and other purposes.

[0078] External electrodes 131, 132, 133, 134, 135, and 136 are arranged on the main body 110 and can be connected to internal electrode layers 121 and 122.

[0079] In this case, the external electrode may be positioned to cover the lead portion or floating portion of the internal electrode layer that is exposed so as to be in contact with at least one surface of the main body. Here, positioning the external electrode to cover the lead portion or floating portion of the internal electrode layer means that when the multilayer electronic component is observed or measured from the outside, the lead portion or floating portion of the internal electrode layer is not exposed to the outside and is not visible.

[0080] The external electrodes 131, 132, 133, 134, 135, and 136 may include the first to third external electrodes 131, 132, and 133, respectively, which are positioned across the fifth surface and parts of the first and second surfaces 1 and 2, and the fourth to sixth external electrodes 134, 135, and 136, respectively, which are positioned across the sixth surface 6 and parts of the first and second surfaces 1 and 2.

[0081] More specifically, the first external electrode 131 can be positioned over parts of the first, second, and fifth surfaces 1, 2, and 5, and further over parts of the third surface 3, and preferably continuously over parts of the first, second, third, and fifth surfaces 1, 2, 3, and 5. The second external electrode 132 can be positioned over parts of the first, second, and fifth surfaces 1, 2, and 5. The third external electrode 133 can be positioned over parts of the first, second, and fifth surfaces 1, 2, and 5, and further over parts of the fourth surface 4, and preferably continuously over parts of the first, second, fourth, and fifth surfaces 1, 2, 4, and 5.

[0082] The fourth external electrode 134 can be positioned over parts of the first, second, and sixth surfaces 1, 2, and 6, and further over parts of the third surface 3, preferably continuously over parts of the first, second, third, and sixth surfaces 1, 2, 3, and 6. The fifth external electrode 135 can be positioned over parts of the first, second, and sixth surfaces 1, 2, and 6. The sixth external electrode 136 can be positioned over parts of the first, second, and sixth surfaces 1, 2, and 6, and further over parts of the fourth surface 4, preferably continuously over parts of the first, second, fourth, and sixth surfaces 1, 2, 4, and 6.

[0083] In this case, the dimension in the second direction in which the second external electrode 132 contacts the fifth surface 5 is between 1.25 and 2.75 times the dimension in the second direction in which the first and third external electrodes 131 and 133 contact the fifth surface 5, and the dimension in the second direction in which the fifth external electrode 135 contacts the sixth surface 6 is between 1.25 and 2.75 times the dimension in the second direction in which the fourth and sixth external electrodes 134 and 136 contact the sixth surface 6.

[0084] The dimension of the second external electrode 132 in the second direction where it contacts the fifth surface 5 satisfies 1.25 times or more and 2.75 times or less of the respective dimensions of the first and third external electrodes 131 and 133 in the second direction where they contact the fifth surface 5. The dimension of the fifth external electrode 135 in the second direction where it contacts the sixth surface 6 satisfies 1.25 times or more and 2.75 times or less of the respective dimensions of the fourth and sixth external electrodes 134 and 136 in the second direction where they contact the sixth surface 6. By doing so, high-frequency characteristics (Low ESL) and appropriate ESR can be realized.

[0085] The first to sixth external electrodes 131, 132, 133, 134, 135, and 136 may be arranged separately from each other.

[0086] More specifically, with reference to the fifth surface 5, the first to third external electrodes 131, 132, and 133 are arranged separately in the second direction with the second external electrode 132 in between. With reference to the sixth surface 6, the fourth to sixth external electrodes 134, 135, and 136 can be arranged separately in the second direction with the fifth external electrode 135 in between.

[0087] And, with reference to each of the first and second surfaces 1 and 2, the first and fourth external electrodes 131 and 134 are arranged separately from each other in the third direction, the second and fifth external electrodes 132 and 135 are arranged separately from each other in the third direction, and the third and sixth external electrodes 133 and 136 can be arranged separately from each other in the third direction.

[0088] At this time, when the distance between two adjacent external electrodes among the first to sixth external electrodes 131, 132, 133, 134, 135, and 136 in the third direction is D1, and the distance between two adjacent external electrodes among the first to sixth external electrodes 131, 132, 133, 134, 135, and 136 in the second direction is D2, 0 < D2 / D1 ≤ 1.2 can be satisfied.

[0089] Here, D1 can mean the dimension in the third direction in the direction parallel to the third direction, and D2 can mean the dimension in the second direction in the direction parallel to the second direction, but it is not particularly limited to this.

[0090] More specifically, for example, the distance (e.g., the dimension in the third direction) between the first external electrode 131 and the fourth external electrode 134 arranged adjacent to the first external electrode 131 in the third direction can be referred to as D1. And the distance (e.g., the dimension in the second direction) between the fourth external electrode 134 and the fifth external electrode 135 arranged adjacent to the fourth external electrode 134 in the second direction can be referred to as D2. However, it is not particularly limited thereto.

[0091] By satisfying 0 < D2 / D1 ≦ 1.2 for D1 and D2, it is possible to have high-frequency characteristics (Low ESL) or appropriate equivalent series resistance (ESR) characteristics. That is, since the number of magnetic flux linkages per unit current in the high-frequency region can be minimized or the current loop can be minimized, it is possible to achieve Low ESL or appropriate ESR while being excellent in capacitance.

[0092] The lower limit value of D2 / D1 is not particularly limited, but due to process limitations, D2 / D1 can be 0.6 or more (0.6 ≦ D2 / D1). In this case, D1 and D2 can satisfy 0.6 ≦ D2 / D1 ≦ 1.2.

[0093] On the other hand, when 1.2 < D2 / D1, it may be difficult to achieve Low ESL or it may be difficult to achieve appropriate ESR.

[0094] And D1 may be 70 μm or more (70 μm ≦ D1), but this is due to process limitations and is not particularly limited thereto.

[0095] The external electrodes 131, 132, 133, 134, 135, 136 can be formed using any material as long as it has electrical conductivity such as metal. A specific material may be determined in consideration of electrical characteristics, structural stability, etc., and it may further have a multilayer structure.

[0096] For example, the external electrodes 131, 132, 133, 134, 135, and 136 may include a first electrode layer placed on the main body 110 and a second electrode layer placed on the first electrode layer. Furthermore, they may include a third electrode layer placed on the second electrode layer. Here, it is preferable that the first to third electrode layers correspond to layers that are distinct from each other. However, this is not particularly limited, and they may be separated according to the order of the manufacturing process, and at least some of the first to third electrode layers may be observed as a single layer without being distinguished from each other.

[0097] In this invention, "distinguished" can mean, but is not limited to, two layers being distinguishable by physical differences, chemical differences, and / or simple optical differences, however, the distinction between layers can be made by the presence or absence of an "interface." An interface can mean a surface in which two layers in contact with each other are distinguishable from one another, for example, a state in which they are distinguishable by differences in components determined by EDS analysis using equipment such as a scanning electron microscope (SEM).

[0098] In other words, although not all are shown in the drawings, for the sake of explanation, the first to sixth external electrodes 131, 132, 133, 134, 135, 136 may include first electrode layers 131a, 132a, 133a, 134a, 135a, 136a placed on the main body 110, second electrode layers 131b, 132b, 133b, 134b, 135b, 136b placed on the first electrode layers 131a, 132a, 133a, 134a, 135a, 136b, and further, third electrode layers 131c, 132c, 133c, 134c, 135c, 136c placed on the second electrode layers 131b, 132b, 133b, 134b, 135b, 136c.

[0099] In this case, the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a may be arranged on the first and second surfaces 1 and 2, or more preferably, only on the first and second surfaces 1 and 2.

[0100] By arranging the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a only on the first and second surfaces 1 and 2, the second electrode layers 131b, 132b, 133b, 134b, 135b, and 136b can be arranged more uniformly and easily, making it easier to fabricate the shape of the external electrode that the present invention aims to create. Furthermore, by not arranging the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a on the third to sixth surfaces 3, 4, 5, and 6, the size of the external electrode can be reduced, thereby reducing the size of the multilayer electronic component, which may be advantageous for mounting on or inside the substrate, and may allow for further improvement of dielectric capacitance.

[0101] In this case, the average dimension of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a in the first direction may be 1 μm or more and 9 μm or less, and may have uniform dimensions in the first direction with an error of ±10% or less based on the average dimension in the first direction.

[0102] In this case, by ensuring that the average dimension of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a in the first direction is between 1 μm and 9 μm, excellent dielectric capacitance and electrical properties can be achieved.

[0103] If the average dimension of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a in the first direction is less than 1 μm, it may become difficult to control the shape of the external electrodes 131, 132, 133, 134, 135, and 136, including the second electrode layers 131b, 132b, 133b, 134b, 135b, and 136b. If the average dimension of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a in the first direction is greater than 9 μm, the dielectric capacitance characteristics may be reduced compared to multilayer electronic components of the same size.

[0104] Here, the dimensions in the first direction or the average dimensions in the first direction of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a can mean the dimensions in the first direction or the average dimensions in the first direction of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a of the first to sixth external electrodes 131, 132, 133, 134, 135, and 136, respectively.

[0105] The average dimensions in the first direction of the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a can be measured by scanning images of the cross-sections in the first and third directions with a scanning electron microscope (SEM). More specifically, the average dimension in the first direction of a single first electrode layer can be defined as the average value calculated by measuring the dimensions in the first direction at three equally spaced points in the third direction in the scanned image, and the dimensions in the first direction measured at these three points can be within ±10% of the average dimension in the first direction.

[0106] The first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a may be formed by printing a paste for the first electrode layer containing a first conductive metal onto the main body 110, or the second electrode layers 131b, 132b, 133b, 134b, 135b, and 136b may be formed by forming a plating containing a second conductive metal. Furthermore, the third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c may be formed by forming a plating containing a third conductive metal.

[0107] However, the invention is not limited thereto, and the first to third electrode layers may be formed by transferring an external electrode paste containing a conductive metal, or by applying a conductive paste for external electrodes containing a conductive metal and then firing it.

[0108] The first conductive metal contained in the first electrode layers 131a, 132a, 133a, 134a, 135a, and 136a can be a material with excellent electrical conductivity, and can include at least one of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. Preferably, it can contain nickel (Ni), and more preferably, it can contain nickel (Ni) as the main component.

[0109] In this invention, "main component" can mean a component that accounts for a relatively large weight ratio or atomic number ratio compared to other components, and can mean a component that accounts for more than 50 wt% of the total weight of the constituent substances, a component that accounts for more than 50 at% of the atomic number, or a component that accounts for more than 50 mol% of the mole number.

[0110] The second electrode layers 131b, 132b, 133b, 134b, 135b, and 136b can play a role in improving the mounting characteristics.

[0111] The second conductive metal contained in the second electrode layers 131b, 132b, 133b, 134b, 135b, and 136b can be a material with excellent electrical conductivity, and can include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. Preferably, it can contain copper (Cu), and more preferably, it can contain copper (Cu) as the main component.

[0112] The third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c can play a role in improving mounting characteristics.

[0113] The third conductive metal contained in the third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c can be a material with excellent electrical conductivity, for example, at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof can be included. Preferably, at least one of nickel (Ni), tin (Sn), copper (Cu), and alloys thereof can be included, and more preferably, at least one of nickel (Ni), tin (Sn), copper (Cu), and alloys thereof can be included as the main component. However, it is not limited thereto, and the third electrode layers 131c, 132c, 133c, 134c, 135c, and 136c may include multiple layers containing the third conductive metal.

[0114] On the other hand, the size of the stacked electronic component 100 is not particularly limited. The dimension of the stacked electronic component 100 in the first direction (e.g., thickness) can be denoted as T, the dimension in the second direction (e.g., length) as L, and the dimension in the third direction (e.g., width) as W. Here, the dimension in the first direction means the maximum dimension of the stacked electronic component in the first direction (e.g., thickness), the dimension in the second direction means the maximum dimension of the stacked electronic component in the second direction (e.g., length), and the dimension in the third direction means the maximum dimension of the stacked electronic component in the third direction (e.g., width), but it is not particularly limited to these, and can mean any generally accepted numerical value.

[0115] In this case, T of the stacked electronic component 100 satisfies 30 μm ≤ T ≤ 3 / 5 × W, W satisfies W ≤ 750 μm, and W and L can satisfy 1.75 ≤ L / W ≤ 2.25.

[0116] By satisfying the above conditions for T, L, and W of the stacked electronic component 100, noise in the high-speed integrated circuit (IC) can be reduced, making it suitable for use as an LSC (Land Side Capacitor).

[0117] The present invention will be described in more detail below through test examples, but this is intended to aid in a concrete understanding of the present invention, and the scope of the present invention is not limited by the preferred test examples.

[0118] (Example test) Table 1 below shows the measured ESL and ESR characteristics based on the ratio (D2 / D1) of the distance D2 (length) between two adjacent external electrodes in the second direction to the distance D1 (width) between two adjacent external electrodes in the third direction.

[0119] In Table 1, the width W and length L are the measured width W and length L of the multilayer electronic component, and the unit is micrometers (μm).

[0120] The first length of the external electrode is the length at which the fourth external electrode contacts the sixth surface, measured in micrometers (μm). The second length of the external electrode is the length at which the fifth external electrode contacts the sixth surface, measured in micrometers (μm).

[0121] The length spacing D2 of the external electrodes is measured in the second direction between the fourth and fifth external electrodes, with reference to the second surface, and the unit is micrometers (μm). The width spacing D1 of the external electrodes is measured in the third direction between the first and fourth external electrodes, with reference to the second surface, and the unit is micrometers (μm).

[0122] ESL measurements were performed according to the EIA-970 standard. The measurement method involved applying a 1 GHz voltage to a sample chip (MLCC) using a network analyzer and measuring the impedance (pH), which is shown in Table 1 below.

[0123] ESR measurements were performed according to the EIA-970 standard. The measurement method involved measuring the resistance (mΩ) under SRF (Self-Resonant Frequency) conditions using a network analyzer, and the results are listed in Table 1 below.

[0124] Test Examples 1 to 6 were fabricated as stacked electronic components including a main body containing a first internal electrode layer with a first lead portion and a second internal electrode layer with a second lead portion, and first to sixth external electrodes placed on the main body.

[0125] [Table 1]

[0126] In Test Examples 1 to 5, where D2 / D1 is 1.2 or less, both ESL and ESR have values ​​of 30.0 pH and 30 mΩ or less, and in particular, ESR has a maximum value of 29.9 mΩ. In contrast, in Test Example 6, where D2 / D1 corresponds to 1.4, both ESL and ESR have values ​​of 30.0 pH and 30 mΩ or more, and in particular, ESR has a value of 30.1 mΩ.

[0127] Therefore, it can be seen that when D2 / D1 is 1.2 or less, high-frequency characteristics (low ESL) and an appropriate ESR value can be obtained.

[0128] Table 2 below shows the capacitance characteristics measured based on the average thickness of the first electrode layer.

[0129] Test Examples 7 to 13 were fabricated as stacked electronic components including a main body containing a first internal electrode layer with a first lead portion and a second internal electrode layer with a second lead portion, and first to sixth external electrodes placed on the main body.

[0130] The first to sixth external electrodes in Test Example 7 do not include a first electrode layer, but only a second electrode layer, which is mainly composed of copper (Cu) and placed on the main body.

[0131] The first to sixth external electrodes in Test Examples 8 to 13 each consist of a first electrode layer mainly composed of nickel (Ni) and placed only on the first and second surfaces of the main body, and a second electrode layer mainly composed of copper (Cu) and placed on the first electrode layer.

[0132] The average thickness of the first electrode layer is measured and recorded as the average thickness of the first electrode layer of each of the fourth external electrodes arranged on the first and second surfaces, and the unit is micrometers (μm).

[0133] The thickness T is measured and described as the thickness of the multilayer electronic component including the fourth external electrode arranged on the first and second surfaces, and the unit is micrometers (μm).

[0134] The thickness of the external electrodes is determined by measuring the thickness of the fourth external electrode, which is positioned on the first and second surfaces, and then adding these two measurements together to obtain the total thickness. The unit is micrometers (μm).

[0135] The width W and length L are recorded based on measurements of the width W and length L of the multilayer electronic component.

[0136] The average thickness of the dielectric layer is measured and described as the average thickness of the dielectric layer placed between the first internal electrode layer and the second internal electrode layer, and the unit is micrometers (μm).

[0137] The dielectric capacitance (%) is expressed as a percentage (%) of the relative capacitance measured with the dielectric capacitance of Test Example 7 as the reference (100%).

[0138] [Table 2]

[0139] In Test Example 7, which did not include the first electrode layer, the first to sixth external electrodes, including the second electrode layer, were formed. However, at least one of the first to sixth external electrodes had an error exceeding ±10% based on the average thickness of the external electrodes, and an external electrode of uniform thickness was not formed.

[0140] In Test Examples 8 to 12, where the average thickness of the first electrode layer is between 1 μm and 9 μm, and the thickness is uniform with an error of within ±10% relative to the average thickness of the external electrode, it can be seen that the dielectric capacitance improved compared to Test Example 7.

[0141] In the case of Test Example 13 where the error is within ±10% based on the average thickness of the external electrode, and the average thickness of the first electrode layer is 11 μm, it can be seen that the capacitance has decreased compared to Test Example 7.

[0142] Therefore, it can be understood that when the average thickness of the first electrode layer is 1 μm or more and 9 μm or less, an external electrode with a uniform thickness can be formed and the dielectric characteristics are improved.

[0143] Next, FIG. 5 schematically shows Lm after measuring it based on the evaluation results of the moisture resistance reliability for the samples of the comparative examples and the examples.

[0144] [[ID=IS]]Here, Lm is obtained by measuring the distance between any one of the main part of the internal electrode layer and the surface in the second direction.

[0145] For the evaluation of the moisture resistance reliability, when a voltage of 5 Vr was applied for 100 hours under the temperature condition of 85°C and the humidity condition of 85%, the case where a short occurred was evaluated as "defective", and the case where no short occurred was evaluated as "normal".

[0146] More specifically, the comparative example shows, in a graph, the measurement of Lm of a normal sample in which no defect occurred in the evaluation of the moisture resistance reliability when the ratio (D2 / D1) of the distance D2 between two externally adjacent electrodes in the second direction to the distance D1 between two externally adjacent electrodes in the third direction is greater than 1.2 (1.2 < D2 / D1).

[0147] And the example shows, in a graph, the measurement of Lm of a normal sample in which no defect occurred in the evaluation of the moisture resistance reliability when the ratio (D2 / D1) of the distance D2 between two externally adjacent electrodes in the second direction to the distance D1 between two externally adjacent electrodes in the third direction is 1.2 or less (D2 / D1 ≤ 1.2).

[0148] As can be seen in the graph, in the comparative example, samples evaluated as "normal" in the humidity resistance reliability evaluation were only present when Lm exceeded 15 μm, whereas in the example, samples evaluated as "normal" in the humidity resistance reliability evaluation were also present when Lm was between 3 μm and 15 μm.

[0149] From this, it can be seen that when D2 / D1 is 1.2 or less (D2 / D1 ≤ 1.2), the moisture resistance reliability is excellent, and when the Lm value is 3 μm or more, excellent moisture resistance reliability can be ensured.

[0150] As described above, embodiments or examples of the present invention have been explained in detail, but the present invention is not limited by the embodiments and accompanying drawings described above, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0151] Furthermore, the expression "one embodiment" as used herein does not mean that each embodiment is the same as another, but is provided to highlight and describe the unique and distinct features of each embodiment. However, the above-presented embodiments do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment unless there is a description in the other embodiment that contradicts or inconsists with that matter.

[0152] The terms used herein are used solely to describe one embodiment and are not intended to limit the invention. Where otherwise clearly the context indicates otherwise, singular expressions include plural expressions. [Explanation of symbols]

[0153] 100: Stacked Electronic Components 110: Main unit 111, 211: Dielectric layer 112, 113: Cover section 121, 122, 221, 222: Internal electrode layer 131, 132, 133, 134, 135, 136: External electrode

Claims

1. A body comprising a dielectric layer and internal electrode layers arranged alternately with the dielectric layer in a first direction, having first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, The external electrode includes a first electrode layer disposed on the main body and a second electrode layer disposed on the first electrode layer, and is connected to the internal electrode layer, The external electrode includes first to third external electrodes arranged over parts of the first, second, and fifth surfaces, respectively, and fourth to sixth external electrodes arranged over parts of the first, second, and sixth surfaces, respectively. A multilayer electronic component that satisfies 0 < D2 / D1 ≤ 1.2, where D1 is the distance between two external electrodes arranged adjacent to each other in the third direction among the first to sixth external electrodes, and D2 is the distance between two external electrodes arranged adjacent to each other in the second direction among the first to sixth external electrodes.

2. The stacked electronic component according to claim 1, wherein D1 and D2 satisfy 0.6 ≤ D2 / D1 ≤ 1.

2.

3. The first to third external electrodes are arranged spaced apart from each other in the second direction with the second external electrode in between, and the fourth to sixth external electrodes are arranged spaced apart in the second direction with the fifth external electrode in between. The internal electrode layer includes a first and a second internal electrode layer. The stacked electronic component according to claim 1, wherein the first internal electrode layer includes a first main portion and first-1 to first-3 lead portions connected to the first main portion and connected to the first external electrode, third external electrode, and fifth external electrode, respectively, and arranged at a distance from each other.

4. The stacked electronic component according to claim 3, wherein the second internal electrode layer includes a second main portion and second-first to second-third lead portions connected to the second main portion and connected to the fourth external electrode, the sixth external electrode, and the second external electrode, respectively, and arranged at a distance from each other.

5. The stacked electronic component according to claim 3, wherein the second internal electrode layer includes a second main portion and second-first to second-third floating portions, which are arranged apart from the second main portion and are connected to the fourth external electrode, the sixth external electrode, and the second external electrode, respectively, and are arranged apart from each other.

6. The stacked electronic component according to claim 4, wherein the first and second main parts are arranged at a distance Lm from at least one of the third to sixth surfaces, and Lm satisfies 3 μm ≤ Lm.

7. The stacked electronic component according to claim 6, wherein Lm satisfies 3 μm ≤ Lm ≤ 30 μm.

8. The stacked electronic component according to claim 5, wherein the first and second main parts are arranged at a distance Lm from at least one of the third to sixth surfaces, and Lm satisfies 3 μm ≤ Lm.

9. The stacked electronic component according to claim 8, wherein Lm satisfies 3 μm ≤ Lm ≤ 30 μm.

10. The dimension in the second direction in which the second external electrode contacts the fifth surface is such that it is 1.25 times or more and 2.75 times or less the dimension in the second direction in which the first and third external electrodes contact the fifth surface, respectively. The stacked electronic component according to claim 1, wherein the dimension in the second direction in which the fifth external electrode contacts the sixth surface is 1.25 times or more and 2.75 times or less the respective dimensions in the second direction in which the fourth and sixth external electrodes contact the sixth surface.

11. The stacked electronic component according to claim 1, wherein the first electrode layer is arranged on the first and second surfaces.

12. The stacked electronic component according to claim 1, wherein the average dimension of the first electrode layer in the first direction is 1 μm or more and 9 μm or less.

13. The stacked electronic component according to claim 1, wherein the external electrode further includes a third electrode layer disposed on the second electrode layer.

14. When the dimension of the stacked electronic component in the first direction is T and the dimension in the third direction is W, A multilayer electronic component according to claim 1, satisfying 30 μm ≤ T ≤ 3 / 5 × W.

15. A body comprising a dielectric layer and internal electrode layers arranged alternately with the dielectric layer in a first direction, having first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, The system includes a first electrode layer disposed on the main body, and a second electrode layer disposed on the first electrode layer, and a plurality of external electrodes connected to the internal electrode layer, A multilayer electronic component that satisfies 0 < D2 / D1 ≤ 1.2, where D1 is the distance between two external electrodes arranged adjacent to each other in the third direction, and D2 is the distance between two external electrodes arranged adjacent to each other in the second direction.

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