Multilayer electronic components
The stacked electronic component design with varied crystal grain sizes and dielectric compositions in side margin portions addresses moisture and structural issues, enhancing reliability and durability.
JP2026087480APending Publication Date: 2026-05-27SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-09-02
- Publication Date
- 2026-05-27
AI Technical Summary
Technical Problem
Multilayer ceramic capacitors face issues with moisture resistance, porosity, toughness, and warping/cracking due to external exposure and interface joints with side margin areas.
Method used
A stacked electronic component design featuring dielectric layers and internal electrodes with extended side margin portions comprising different crystal grain sizes and dielectric compositions to enhance moisture resistance and structural integrity.
Benefits of technology
Improves moisture resistance, reduces pores, and enhances toughness and resistance to warping and cracking in multilayer electronic components.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026087480000001_ABST
Abstract
This invention provides a multilayer electronic component with excellent moisture resistance reliability, reduced pores, and superior toughness and resistance to warping and cracking. [Solution] The stacked electronic component 1 includes a body comprising a dielectric layer 111 and internal electrodes 121 and 122 arranged alternately with the dielectric layer in the thickness direction, a first external electrode 131 and a second external electrode 132 arranged on the third surface 3 and the fourth surface, respectively, a first side margin portion 114 arranged on the fifth surface 5 and extending to a part of the first surface 1 and the second surface 2, and a second side margin portion 115 arranged on the sixth surface 6 and extending to a part of the first surface and the second surface. The first and second side margin portions include a first margin layer 114a and 115a arranged in contact with the body and a second margin layer 114b and 115b arranged on the first margin layer, and the first and second margin layers differ in at least one of the average size of the crystal grains and the dielectric composition.
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