Printed circuit board

Abstract

One of the various objectives of the present invention is to provide a printed circuit board that can improve the adhesion between the glass layer and the insulating layer, and can improve issues such as voids and delamination. [Solution] The present invention relates to a printed circuit board comprising: a glass layer; metal vias penetrating at least a portion between the upper and lower surfaces of the glass layer; a first insulating layer disposed on the upper surface of the glass layer; a second insulating layer disposed on the upper surface of the first insulating layer and containing an insulating material different from that of the first insulating layer; a first wiring layer disposed on the upper surface of the second insulating layer; and a first connecting via that penetrates the first and second insulating layers together and connects at least a portion of the first wiring layer to the upper surface of the metal vias.

Claims

[Claim 1] A glass layer, A metal via that penetrates at least a portion of the space between the upper and lower surfaces of the glass layer, A first insulating layer disposed on the upper surface of the glass layer, A second insulating layer is disposed on the upper surface of the first insulating layer and includes an insulating material different from that of the first insulating layer, A first wiring layer disposed on the upper surface of the second insulating layer, A printed circuit board comprising: a first connecting via that penetrates the first insulating layer and the second insulating layer together and connects at least a portion of the first wiring layer to the upper surface of the metal via. [Claim 2] The printed circuit board according to claim 1, wherein the second insulating layer is thicker than the first insulating layer on the upper surface of the glass layer. [Claim 3] The side surface of the first connecting via has a protrusion, The printed circuit board according to claim 1, wherein the protruding portion is arranged adjacent to the boundary between the first insulating layer and the second insulating layer. [Claim 4] The printed circuit board according to claim 3, wherein the thickness of the protrusion becomes substantially thinner as it moves away from the side surface of the first connection via. [Claim 5] The side surface of the first connecting via has a stepped portion, The printed circuit board according to claim 1, wherein the stepped portion is arranged adjacent to the boundary between the first insulating layer and the second insulating layer. [Claim 6] The first connecting via includes a first region penetrating the first insulating layer and a second region penetrating the second insulating layer. The printed circuit board according to claim 5, wherein the side surface of the first connection via in the first region and the side surface of the first connection via in the second region are connected via the stepped portion. [Claim 7] The printed circuit board according to claim 6, wherein the width of the first connection via on the cross-section at the uppermost side of the first region is wider than the width of the first connection via on the cross-section at the lowermost side of the second region. [Claim 8] The printed circuit board according to claim 6, wherein the width of the first connection via on the cross-section at the uppermost side of the first region is narrower than the width of the first connection via on the cross-section at the lowermost side of the second region. [Claim 9] A third insulating layer is disposed on the lower surface of the glass layer, A fourth insulating layer is disposed on the lower surface of the third insulating layer and includes an insulating material different from that of the third insulating layer, A second wiring layer is disposed on the lower surface of the fourth insulating layer, The printed circuit board according to claim 1, further comprising a second connecting via that penetrates the third insulating layer and the fourth insulating layer together and connects at least a portion of the second wiring layer to the lower surface of the metal via. [Claim 10] The printed circuit board according to claim 9, wherein the first connecting via and the second connecting via are each directly connected to the metal via. [Claim 11] The printed circuit board according to claim 9, wherein the fourth insulating layer is thicker than the third insulating layer on the lower surface of the glass layer. [Claim 12] The side surface of the second connecting via has a protrusion or a stepped portion. The printed circuit board according to claim 9, wherein the protruding portion or the stepped portion is arranged adjacent to the boundary between the third insulating layer and the fourth insulating layer. [Claim 13] A frame having a through portion in which at least a part of the glass layer is arranged, The printed circuit board according to claim 9, further comprising a filler disposed between the first insulating layer and the third insulating layer, which fills at least a portion of the space between the frame and the glass layer within the through-hole. [Claim 14] A plurality of first build-up insulating layers are disposed on the upper surface of the second insulating layer, A plurality of first build-up wiring layers, each disposed on or within the plurality of first build-up insulating layers, A plurality of first build-up via layers, each disposed within the plurality of first build-up insulating layers and each connected to one or more of the plurality of first build-up wiring layers, A plurality of second build-up insulating layers are disposed on the lower surface of the fourth insulating layer, A plurality of second build-up wiring layers, each disposed on or within the plurality of second build-up insulating layers, The printed circuit board according to claim 13, further comprising a plurality of second build-up via layers, each disposed within the plurality of second build-up insulating layers and each connected to one or more of the plurality of second build-up wiring layers. [Claim 15] A glass layer, A metal via penetrating at least a portion of the glass layer, An insulating layer disposed on the glass layer, A wiring layer disposed on the aforementioned insulating layer, Includes a connecting via that penetrates the insulating layer and connects at least a portion of the wiring layer to the metal via, The side surface of the aforementioned connecting via has a protruding portion or a stepped portion. The protruding portion or the stepped portion is a printed circuit board located inside the insulating layer. [Claim 16] The insulating layer includes a first insulating layer and a second insulating layer that are separated by a boundary between them. The printed circuit board according to claim 15, wherein the protruding portion or the stepped portion is arranged adjacent to the boundary between the first insulating layer and the second insulating layer.

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