Measuring device, film deposition system, and manufacturing method

Abstract

This provides a new technology that is advantageous for measuring the thickness of films deposited on substrates. [Solution] A measuring device for measuring the thickness of a film deposited on a first surface of a substrate in a vacuum atmosphere, comprising: a substrate support portion that supports the peripheral edge of the first surface of the substrate; a pressing member that presses the peripheral edge of a second surface of the substrate opposite to the first surface supported by the substrate support portion; and a measuring unit that optically measures the thickness of the film, wherein the measuring unit measures the thickness of the film deposited in a region of the first surface located closer to the center of the substrate than the clamping region of the substrate held between the substrate support portion and the pressing member, and in a measurement region where the amount of deformation of the substrate due to being clamped by the substrate support portion and the pressing member is within an acceptable range.

Description

Technical Field

[0001] The present invention relates to a measuring device, a film forming system, and a manufacturing method.

Background Art

[0002] Organic EL display devices (organic EL displays) have been applied to smartphones, TVs, automotive displays, and also to VR HMDs (Virtual Reality Head Mount Displays), etc. In the process of manufacturing an organic EL display device, when forming an organic light emitting element (organic EL element: OLED) on a substrate, generally, a film forming apparatus is used. The film forming apparatus adheres a vapor deposition substance (film forming material) emitted from a vapor deposition source to a substrate through a mask on which a pattern corresponding to a pixel pattern is formed, to form (film form) a film such as an organic film or a metal film.

[0003] One of the indexes for evaluating a film formed on a substrate using a film forming apparatus is the uniformity of the thickness (film thickness), and a technique for measuring the film thickness with high precision is required (see Patent Document 1). Patent Document 1 discloses a technique for measuring the film thickness in a state where a substrate on which a film is formed is adsorbed (held) by an electrostatic chuck and deformation (bending) due to the weight of the substrate is suppressed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, conventional technologies using electrostatic chucks may present unique challenges. For example, in recent years, substrates have become larger in order to increase the size of displays and improve the productivity of display production, and the deformation (bending) of the substrate due to its own weight tends to increase. Such greatly deformed substrates are difficult to hold with an electrostatic chuck, leading to an increase in cycle time. In addition, there is a possibility that the substrate may detach from the electrostatic chuck and fall after being held by the electrostatic chuck or when peeling the substrate from the electrostatic chuck. Therefore, there is a need for a new technology to replace electrostatic chucks that can suppress deformation due to the substrate's own weight and achieve high-precision measurement of film thickness.

[0006] This invention has been made in view of the problems of the prior art, and its exemplary objective is to provide a new technology that is advantageous for measuring the thickness of a film deposited on a substrate. [Means for solving the problem]

[0007] To achieve the above objective, a measuring device as one aspect of the present invention is a measuring device for measuring the thickness of a film deposited on a first surface of a substrate in a vacuum atmosphere, comprising: a substrate support portion that supports the peripheral edge of the first surface of the substrate; a pressing member that presses the peripheral edge of a second surface of the substrate opposite to the first surface supported by the substrate support portion; and a measuring unit that optically measures the thickness of the film, wherein the measuring unit measures the thickness of the film deposited in a region of the first surface located closer to the center of the substrate than the clamping region of the substrate held between the substrate support portion and the pressing member, and in a measuring region where the amount of deformation of the substrate due to being clamped by the substrate support portion and the pressing member is within an acceptable range.

[0008] Further objects or other aspects of the present invention will be revealed by embodiments described below with reference to the accompanying drawings. [Effects of the Invention]

[0009] According to the present invention, for example, it is possible to provide a novel technique that is advantageous for measuring the thickness of a film deposited on a substrate. [Brief explanation of the drawing]

[0010] [Figure 1] This figure schematically shows the configuration of a film deposition system as one aspect of the present invention. [Figure 2] This diagram schematically shows the configuration of the handover room. [Figure 3] This diagram shows the configuration of the substrate support section and the pressing section. [Figure 4] This is a schematic perspective view showing the configuration of the first support member. [Figure 5] This is a schematic perspective view showing the configuration of the second support member. [Figure 6] This is a schematic perspective view showing the state in which the first support member and the second support member are combined. [Figure 7] This is a schematic perspective view showing the structure of the pressing member. [Figure 8] This diagram illustrates the measurement process for measuring the film thickness of a film deposited on a substrate in the transfer room. [Figure 9] This diagram illustrates the measurement process for measuring the film thickness of a film deposited on a substrate in the transfer room. [Figure 10] This diagram illustrates the measurement process for measuring the film thickness of a film deposited on a substrate in the transfer room. [Figure 11] This diagram illustrates the measurement process for measuring the film thickness of a film deposited on a substrate in the transfer room. [Figure 12] This diagram illustrates the measurement process for measuring the film thickness of a film deposited on a substrate in the transfer room. [Figure 13] This diagram illustrates the measurement process for measuring the film thickness of a film deposited on a substrate in the transfer room. [Figure 14] This is a schematic perspective view showing the configuration of a transport robot. [Figure 15] This is a perspective view showing the overall positional relationship between the first support member, the second support member, the pressing section, and the transport robot. [Figure 16] In the first state, it is a top view showing the overall positional relationship of each of the first support member, the second support member, and the transfer robot. [Figure 17] It is a diagram for explaining a measurement region for measuring the film thickness of a film formed on a substrate. [Figure 18] It is a diagram for explaining an organic EL display device as an electronic device.

Embodiments for Carrying Out the Invention

[0011] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims, and not all combinations of the features described in the embodiments are essential for the invention. Two or more of the features described in the embodiments may be arbitrarily combined. Also, the same or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0012] FIG. 1 is a diagram schematically showing the configuration (layout) of a film forming system 1 as one aspect of the present invention. The film forming system 1 is, for example, a production line applied to the production of electronic devices such as display panels typified by organic EL display devices. In the film forming system 1, the substrate 100 is sequentially transferred to the film forming block 301, and film formation (film forming process) of organic EL is performed on the substrate 100.

[0013] In the film-forming block 301, around the transfer chamber 302 having an octagonal shape in plan view, there are arranged a plurality of film-forming chambers 303a to 303d for performing film-forming treatment on the substrate 100, and a mask storage chamber 305 for storing masks used in the film-forming treatment. In the transfer chamber 302, a transfer robot 302a (transfer unit) for transferring the substrate 100 is provided. The transfer robot 302a includes a hand for holding the substrate 100 and an articulated arm for horizontally moving the hand. In other words, the film-forming block 301 is a cluster-type film-forming unit in which a plurality of film-forming chambers 303a to 303d are arranged so as to surround the periphery of the transfer robot 302a. When the film-forming chambers 303a to 303d are collectively referred to, or when the film-forming chambers 303a to 303d are not particularly distinguished, they are denoted as the film-forming chamber 303.

[0014] In the conveyance direction (arrow direction) of the substrate 100, buffer chambers 306, a turning chamber 307, and a delivery chamber 308 are arranged on the upstream side and the downstream side of the film-forming block 301, respectively. In the manufacturing process, each of the film-forming chamber 303, the mask storage chamber 305, the buffer chamber 306, the turning chamber 307, and the delivery chamber 308 is maintained in a vacuum atmosphere (vacuum state). In FIG. 1, only one film-forming block 301 is illustrated, but it is not limited thereto. For example, the film-forming system 1 may have a plurality of film-forming blocks 301, and the plurality of film-forming blocks 301 may have a configuration in which they are connected by a connecting device composed of buffer chambers 306, a turning chamber 307, and a delivery chamber 308. However, the connecting device may be composed of, for example, only the buffer chamber 306 or the delivery chamber 308.

[0015] The transfer robot 302a transfers the substrate 100 from the upstream delivery chamber 308 into the transfer chamber 302 and transfers the substrate 100 between the plurality of film-forming chambers 303a to 303d. Further, the transfer robot 302a also transfers the mask between the mask storage chamber 305 and the film-forming chamber 303 and discharges the substrate 100 from the transfer chamber 302 to the downstream buffer chamber 306.

[0016] The buffer chamber 306 is a chamber for temporarily storing substrates 100 depending on the operating status of the film deposition system 1. The buffer chamber 306 is equipped with a substrate storage shelf, also called a cassette, and a lifting mechanism. The substrate storage shelf has a multi-tiered structure that can store multiple substrates 100 while maintaining a state (horizontal state) in which the film deposition surface of the substrates 100 faces downward in the direction of gravity (vertical direction). The lifting mechanism raises and lowers the substrate storage shelf to align the stage for loading or unloading the substrates 100 with the transport position. In this way, the buffer chamber 306 has the function of temporarily storing and holding multiple substrates 100.

[0017] The rotating chamber 307 is equipped with a transport robot 307a (transport unit) as a mechanism for changing the orientation of the substrate 100. In this embodiment, the transport robot 307a rotates the orientation of the substrate 100 by 180 degrees in the rotating chamber 307. The transport robot 307a, located in the rotating chamber 307, rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and passes it to the transfer chamber 308, thereby swapping the front and rear ends of the substrate 100 between the buffer chamber 306 and the transfer chamber 308. Consequently, the orientation of the substrate 100 when it is brought into the deposition chamber 303 is the same in each deposition block 301, allowing the scanning direction and mask orientation during the deposition process on the substrate 100 to be consistent in each deposition block 301. This allows the orientation of the masks stored in the mask storage chamber 305 to be consistent in each deposition block 301, simplifying mask management and improving usability.

[0018] The transfer chamber 308 is a chamber for transferring the substrate 100, which has been brought in by the transfer robot 307a located in the turning chamber 307, to the transfer robot 302a located in the downstream film deposition block 301. In this embodiment, as will be described later, the thickness (film thickness) of the film deposited (formed) on the substrate 100 is measured (inspected) in the transfer chamber 308. In other words, the transfer chamber 308 is also a chamber for measuring the film deposited on the substrate 100.

[0019] The film deposition system 1 includes a control system (control unit) consisting of a host computer (higher-level device 300) that controls the entire line, and control devices 309, 310, 311, 313a-313d that control each component. The higher-level device 300 and control devices 309, 310, 311, 313a-313d can communicate via a wired or wireless communication line 300a. Control devices 313a-313d are provided corresponding to each of the multiple film deposition chambers 303a-303d and control the film deposition equipment provided in each film deposition chamber. Control device 309 controls the transport robot 302a provided in the transport chamber 302. Control device 310 controls the transport robot 307a provided in the swivel chamber 307. Control device 311 controls the components (units) and processing related to the measurement of the film deposited on the substrate 100 in the transfer chamber 308. The higher-level device 300 controls information related to the substrate 100 and transport timing via control devices 309, 310, 311, and 313a to 313d.

[0020] Figure 2 is a schematic diagram showing the configuration (components) of the transfer chamber 308. Note that Figure 2 mainly emphasizes the components related to the measurement of the film deposited on the substrate 100, so their arrangement and size may not match those in other drawings. Also, in each figure, arrow Z indicates the vertical direction (direction of gravity), and arrows X and Y indicate the mutually orthogonal horizontal directions. As shown in Figure 2, the transfer chamber 308 includes a chamber 10, a moving part 12, a pressing part 13, a substrate support part 15, and a measuring part 29.

[0021] Chamber 10 has a box-like shape and defines an internal space 101. The internal space 101 of chamber 10 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, chamber 10 is connected to a vacuum pump (not shown) to maintain the internal space 101 in a vacuum atmosphere. Note that "vacuum" means a state in which a space is filled with a gas at a pressure lower than atmospheric pressure, that is, a reduced pressure state.

[0022] The substrate 100 is loaded into the chamber 10 via a transport robot 307a located in the rotating chamber 307, through an entrance ENT (see Figure 3A) in the chamber 10. The substrate 100 is then unloaded from the chamber 10 via a transport robot 302a located in the transport chamber 302 downstream of the transfer chamber 308, through an exit EXP (see Figure 3A) in the chamber 10.

[0023] The substrate support section 15 is positioned above the measurement section 29 in the internal space 101 of the chamber 10 and supports the substrate 100 that has been brought into the chamber 10 by the transport robot 307a. In this embodiment, the substrate support section 15 supports the substrate 100, on which a film has been deposited on the film-deposited surface 100A (first surface), from below. Specifically, the substrate support section 15 supports the peripheral edge of the film-deposited surface A of the substrate 100 with the film-deposited surface 100A facing downwards. As shown in Figures 3A and 3B, the substrate support section 15 includes a first support member 151 and a second support member 152. Figures 3A and 3B show the configuration of the substrate support section 15 and the pressing section 13 arranged in the internal space 101 (transfer chamber 308) of the chamber 10, where Figure 3A is a perspective view of the internal space 101 of the chamber 10 and Figure 3B is a cross-sectional view of the internal space 101 of the chamber 10.

[0024] As shown in Figure 4, the first support member 151 includes a first frame 1511 and a first support 1512. The first support member 151 is configured to be movable relative to the second support member 152 in the Z direction (normal direction to the film-forming surface 100A of the substrate 100 supported by the substrate support 15) by a movable part 12. Figure 4 is a schematic perspective view showing the configuration of the first support member 151.

[0025] The first frame 1511 forms the outer shape of the first support member 151. The first frame 1511 has a rectangular frame shape. The substrate 100 is supported inside the frame formed by the first frame 1511. The first frame 1511 is composed of multiple members, for example, two members 1511A and 1511B. A gap is provided between member 1511A and member 1511B. This makes it possible to avoid contact (physical interference) between the first frame 1511 (first support member 151) and the transport robot 302a or 307a when the substrate 100 is loaded or unloaded by the transport robot 302a or 307a.

[0026] The first support member 1512 is composed of, for example, an elastic member (leaf spring) or a metal member (metal claw), and directly supports the first portion of the peripheral edge of the film-forming surface 100A of the substrate 100 at the first support member 151. In this embodiment, a plurality of first support members 1512 are provided on the first frame 1511 so as to extend inside the frame formed by the first frame 1511. Furthermore, the plurality of first support members 1512 are provided spaced apart from each other. This makes it possible to avoid contact (physical interference) between the first support members 1512 (first support member 151) and the transport robot 302a or 307a when the substrate 100 is loaded or unloaded by the transport robot 302a or 307a.

[0027] As shown in Figure 5, the second support member 152 includes a second frame 1521 and a second support body 1522. As shown in Figure 3B, the second support member 152 is supported on the bottom plate (inner surface) of the chamber 10 and fixed in the internal space 101 of the chamber 10. Figure 5 is a schematic perspective view showing the configuration of the second support member 152.

[0028] The second frame 1521 forms the outer shape of the second support member 152. The second frame 1521 has a rectangular frame shape. The substrate 100 is supported inside the frame formed by the second frame 1521. In this embodiment, the second frame 1521 is composed of one member, but it may be composed of multiple members.

[0029] The second support member 1522 is composed of, for example, an elastic member (leaf spring) or a metal member (metal claw), and directly supports a second portion of the peripheral edge of the film-forming surface 100A of the substrate 100, which is different from the first portion. In this embodiment, a plurality of second support members 1522 are provided on the second frame 1521 so as to extend inside the frame formed by the second frame 1511. Furthermore, the plurality of second support members 1522 are spaced apart from each other, and the first support member 1512 of the first support member 151 can be positioned between them.

[0030] In this embodiment, the first support member 151 and the second support member 152 are combined as shown in Figure 6 to jointly support the substrate 100 as a substrate support 15 when measuring the thickness of the film deposited on the film deposition surface 100A of the substrate 100. Figure 6 is a schematic perspective view showing the state in which the first support member 151 and the second support member 152 are combined. When the first support member 151 and the second support member 152 are combined, the first support 1512 and the second support 1522 are positioned along the peripheral edge of the film deposition surface 100A of the substrate 100, surrounding the periphery of the substrate 100. Therefore, in this embodiment, compared to the case where the substrate 100 is supported by the first support member 151 (first support 1512) or the second support member 152 (second support 1522) alone, the peripheral edge of the film deposition surface 100A of the substrate 100 can be supported over a wider area. This helps to suppress deformation of the substrate 100, which is supported by the substrate support portion 15, due to its own weight, and to reduce the amount of deformation.

[0031] Furthermore, in this embodiment, the first support 1512 and the second support 1522 are arranged alternately so as to be located between them, as shown in Figure 6. In other words, the first portion of the peripheral edge of the film-forming surface 100A of the substrate 100 supported by the first support 1512 and the second portion of the peripheral edge of the film-forming surface 100A of the substrate 100 supported by the second support 1522 are alternately provided at their respective peripheral edges. This makes it possible to uniformly support the peripheral edge of the film-forming surface 100A of the substrate 100, which is advantageous in reducing the amount of deformation of the substrate 100 supported by the substrate support portion 15, particularly the amount of deformation of the peripheral edge of the substrate 100.

[0032] From the viewpoint of reducing the amount of deformation of the periphery of the substrate 100 supported by the substrate support portion 15, it is preferable to arrange the first support 1512 and the second support 1522 so as to surround the entire periphery of the substrate 100 without any gaps, as shown in Figure 6. As a result, at the periphery of the film-forming surface 100A of the substrate 100, a first portion supported by the first support 1512 and a second portion supported by the second support 1522 are provided over the entire periphery of the film-forming surface 100A of the substrate 100. Therefore, the amount of deformation of the periphery of the substrate 100 supported by the substrate support portion 15 can be further reduced.

[0033] As shown in Figure 2, the movable part 12 includes a movable part 121, a fixed part 122, and a drive part 123, and moves the first support member 151 of the substrate support part 15. Specifically, the movable part 12 raises and lowers the first support member 151 of the substrate support part 15 in the Z direction. In Figure 2, the movable part 12 is provided on the side (above) of the upper plate 102 of the chamber 10, but it may also be provided on the side (below) of the bottom plate of the chamber 10. In other words, any technology well known in the industry that realizes the function of moving the first support member 151 of the substrate support part 15 can be applied to the movable part 12, and its arrangement is not limited.

[0034] The movable part 121 supports the first support member 151 of the substrate support part 15 and is provided to be movable together with the first support member 151. The movable part 121 includes a fixed part side member 1211, a support part side member 1212, and a connecting part 1213. The fixed part side member 1211 is movably supported with respect to the fixed part 122. The support part side member 1212 is connected to the first frame 1511 of the first support member 151 and supports the first support member 151. The connecting part 1213 includes, for example, a spherical bearing and swingably connects the fixed part side member 1211 and the support part side member 1212. An elastic member may be interposed between the first support member 151 and the support part side member 1212.

[0035] The fixed part 122 is fixed to the upper plate 102 of the chamber 10. The drive unit 123 includes a drive source that generates a driving force to move the movable part 121, and a conversion mechanism that converts the driving force of the drive source into translational motion. For example, the rotational driving force of an electric motor as the drive source is converted into translational motion via a ball screw mechanism as the conversion mechanism and transmitted to the movable part 121, causing the movable part 121 to move, and the first support member 151 moves in conjunction with the movement of the movable part 121.

[0036] The pressing section 13 includes a pressing member 131, a shaft member 132, and a lifting section 133, and has the function of assisting the support of the substrate 100 by the substrate support section 15. The pressing member 131 is a member that presses the substrate 100 supported by the substrate support section 15, and more specifically, presses the surface 100B of the substrate 100 opposite to the film-forming surface 100A (hereinafter referred to as the "back surface 100B"). One end of the shaft member 132 is connected to the pressing member 131, and the other end is connected to the lifting section 133. In other words, the shaft member 132 connects the pressing member 131 and the lifting section 133. The lifting section 133 includes an electric motor and a ball screw mechanism, and raises and lowers the shaft member 132, that is, moves the shaft member 132 in the Z direction. The lifting mechanism 133 moves the shaft member 132, causing the pressing member 131 to move (rise and fall) in conjunction with the movement of the shaft member 132. In Figure 2, the lifting mechanism 133 is located on the side (above) of the upper plate 102 of the chamber 10, but it may also be located on the side (below) of the bottom plate of the chamber 10. In other words, any technology well known in the industry that realizes the function of moving the pressing member 131 via the shaft member 132 can be applied to the lifting mechanism 133, and its placement is not limited.

[0037] The configuration of the pressing member 131 will be described in detail with reference to Figure 7. Figure 7 is a schematic perspective view showing the configuration of the pressing member 131. Note that Figure 7 shows the configuration of the pressing member 131 when a lifting part 133 that moves up and down via a shaft member 132 is provided on the bottom plate side of the chamber 10. As shown in Figure 7, the pressing member 131 includes a frame 1311 and a pressing body 1312.

[0038] The frame 1311 forms the outer shape of the pressing member 131. The frame 1311 has a rectangular frame shape. The peripheral edge of the back surface 100B of the substrate 100 is pressed inside the frame formed by the frame 1311. In this embodiment, the frame 1311 is composed of two members 1311A and 1311B, but it may be composed of one member or three or more members. Also, in this embodiment, the frame 1311 is provided on the short side and corners of the substrate 100, but it may be provided so as to surround the entire peripheral edge of the substrate 100.

[0039] The pressing body 1312 is composed of, for example, an elastic member (leaf spring) or a metal member (metal frame), and directly presses the peripheral edge of the back surface 100B of the substrate 100 at the pressing portion 13. In this embodiment, the pressing body 1312 is provided on the frame 1311 so as to extend inside the frame formed by the frame 1311. By pressing the peripheral edge of the back surface 100B of the substrate 100 with the pressing body 1312, the substrate 100 supported by the substrate support portion 15 is clamped between the substrate support portion 15 and the pressing body 1312 (pressing member 131). Therefore, deformation due to the weight of the substrate 100 supported by the substrate support portion 15 is suppressed, and the amount of deformation, especially the amount of deformation at the periphery of the substrate 100, can be reduced.

[0040] As shown in Figure 2, the measurement unit 29 is positioned below the substrate support unit 15 in the internal space 101 of the chamber 10, and optically measures the thickness of the film deposited on the film deposition surface 100A of the substrate 100. The measurement unit 29 includes a measurement head 2903 and a head movement unit 2910.

[0041] The measurement head 2903 includes, for example, a light-emitting unit that emits light from a light source vertically upward and causes it to incident on the film-forming surface 100A (the film formed on it) of the substrate 100, and a detection unit for detecting the light reflected from the film-forming surface 100A of the substrate 100 (reflected light). The measurement head 2903 also includes a processing unit that determines the thickness of the film formed on the film-forming surface 100A of the substrate 100 based on the intensity of the reflected light detected by the detection unit.

[0042] The head moving section 2910 includes a base section 2907, a guide rail 2908, and a drive unit (not shown) to realize the function of moving the measuring head 2903. The base section 2907 is a member that supports the measuring head 2903. The guide rail 2908 is a member that guides the base section 2907. The drive unit includes an electric motor and a ball screw mechanism and generates a driving force to move the base section 2907. As the base section 2907 moves along the guide rail 2908, the measuring head 2903 supported by the base section 2907 moves.

[0043] Thus, the measuring head 2903 is configured to move relative to the film-forming surface 100 of the substrate 100, which is supported by the substrate support 15, via the head moving part 2910. In this embodiment, the measuring head 2903 is configured to move in the short-side direction of the substrate 100, which is supported by the substrate support 15. Therefore, the measuring unit 29 can measure the film thickness of the film formed on the film-forming surface 100A of the substrate 100 in a measuring area provided along the short-side direction of the substrate 100.

[0044] In the film deposition system 1, in order to evaluate the film deposited on the deposition surface 100A of the substrate 100 after passing through the film deposition block 301, it is necessary to measure the thickness of the film. In this embodiment, for the substrate 100 that has been transported from the turning chamber 307 to the transfer chamber 308, as described above, the thickness of the film deposited on the substrate 100, which is held between the substrate support part 15 and the pressing part 13, is measured in the transfer chamber 308 using the measurement unit 29.

[0045] The following describes the measurement process for measuring the film thickness of the film deposited on the substrate 100 in the transfer chamber 308, with reference to Figures 8(A) to 13(B). This measurement process is carried out by the control device 311 comprehensively controlling each component provided in the transfer chamber 308. In order to facilitate understanding of the measurement process in this embodiment, only the components related to the measurement process are shown in Figures 8(A) to 13(B).

[0046] In the measurement process of this embodiment, first, as shown in Figures 8(A) and 8(B), the substrate 100 is transported from the rotating chamber 307 to the transfer chamber 308 via a transport robot 307a provided in the rotating chamber 307. Figures 8(A) and 8(B) show the first state in which the substrate 100 has been transported to the transfer chamber 308. Figures 8(A) and 8(B) show a perspective view and a side view, respectively, showing the first state in which the transport robot 307a holding the substrate 100 has entered the transfer chamber 308 via the entrance ENT.

[0047] As shown in Figures 8(A) and 8(B), when the substrate 100 is transported from the turning chamber 307 to the transfer chamber 308, the first support member 151, the second support member 152, and the pressing part 13 are in their initial positions in the internal space 101 (Z direction) of the chamber 10. Specifically, the first support body 1512 of the first support member 151 is located at the first position PS1 where the substrate 100 is received from the transport robot 307a, and the second support body 1522 of the second support member 152 is located at the second position PS2, which is fixed to the bottom plate of the chamber 10. The pressing member 131 of the pressing part 13 is located at the third position PS3 above the first position PS1. The transport robot 307a enters and stops at the fourth position PS4, which is between the first position PS1 where the first support body 1512 is located and the third position PS3 where the pressing member 131 is located.

[0048] Here, an example of the configuration of the transport robot 307a provided in the rotating chamber 307 will be described. Figure 14 is a schematic perspective view showing the configuration of the transport robot 307a. The transport robot 307a includes a base member 3071a and a substrate holder 3072a. The base member 3071a is an axial member that forms the axis of the hand that holds the substrate 100. The substrate holder 3072a is provided at multiple locations on the base member 3071a so as to extend from the base member 3071a and holds the substrate 100 from below, that is, with the film-deposited surface 100A facing downwards. Note that the substrate holder 3072a is provided on the base member 3071a so as not to come into contact with the first support 1512 when the substrate 100 is passed to the first support member 151, as shown in Figures 8(B), 15 and 16. Figure 15 is a perspective view showing the overall positional relationship of the first support member 151, the second support member 152, the pressing unit 13, and the transport robot 307a in the first state. Figure 16 is a top view showing the overall positional relationship of the first support member 151, the second support member 152, and the transport robot 307a in the first state.

[0049] In the measurement process in this embodiment, the transport robot 307a is then lowered, as shown in Figures 9(A) and 9(B), to transfer the substrate 100, which is held by the transport robot 307a, to the first support member 151, i.e., the first support body 1512. Figures 9(A) and 9(B) are perspective and side views, respectively, showing the second state in which the substrate 100 has been transferred from the transport robot 307a to the first support body 1512 of the first support member 151.

[0050] Referring to Figures 9(A) and 9(B), the transport robot 307a is moved from the fourth position PS4 to a fifth position PS5, which is below the first position PS1 where the first support 1512 is located, specifically between the first position PS1 and the second position PS2. Therefore, at the time when the transport robot 307a is located at the first position PS1, the substrate 100 is transferred from the transport robot 307a to the first support 1512. In this way, the first support 1512 receives the substrate 100 from the transport robot 307a at the first position PS1.

[0051] In the measurement process of this embodiment, the transport robot 307a is then moved from the fifth position PS5 between the first position PS1 and the second position PS2 to a retracted position (not shown) to avoid contact with the first support member 151, as shown in Figures 10(A) and 10(B). Figures 10(A) and 10(B) are perspective and side views, respectively, showing the third state in which the transport robot 307a has been retracted (moved) to the retracted position.

[0052] In the measurement process of this embodiment, the first support member 151 is then lowered, as shown in Figures 11(A) and 11(B), to jointly support the substrate 100, which is supported by the first support 1512, with the second support 1522 of the second support member 152. Figures 11(A) and 11(B) are a perspective view and a side view, respectively, showing the fourth state in which the substrate 100 is supported by the first support 1512 and the second support 1522.

[0053] Referring to Figures 11(A) and 11(B), the first support 1512 is moved from the first position PS1 to the second position PS2 where the second support 1512 is located (first operation). As a result, at the timing when the first support 1512 is in the second position PS2, the second support 1522 supports the substrate 100, which is supported by the first support 1512, together with the first support 1512. In this way, the substrate 100 is supported by the first support 1512 and the second support 1522 at the second position PS2. In the fourth state, the peripheral edge of the film-forming surface 100A of the substrate 100 is supported over a wider area by the first support 1512 and the second support 1522. Therefore, although deformation due to the weight of the substrate 100 is suppressed, it cannot be said that the amount of deformation is sufficiently reduced.

[0054] In the measurement process in this embodiment, the pressing portion 13 is then lowered, as shown in Figures 12(A) and 12(B), to press the back surface 100B of the substrate 100, which is supported by the first support 1512 and the second support 1522, with the pressing member 131. Figures 12(A) and 12(B) are perspective and side views, respectively, showing the fifth state in which the pressing member 131 presses the back surface 100B of the substrate 100.

[0055] Referring to Figures 12(A) and 12(B), the pressing member 131 is moved from the third position PS3 to the second position PS2 (second operation). As a result, when the pressing member 131 is in the second position PS2, it presses against the back surface 100B of the substrate 100, which is supported by the first support 1512 and the second support 1522. In other words, the substrate 100 is clamped between the first support 1512, the second support 1522 and the pressing member 131. Therefore, in the fifth state, deformation due to the weight of the substrate 100 is suppressed, and the amount of deformation, especially the deformation at the periphery of the substrate 100, is sufficiently reduced (within the allowable range).

[0056] In the measurement process of this embodiment, as shown in Figures 13(A) and 13(B), the measurement unit 29 measures the thickness of the film deposited on the film-forming surface 100A of the substrate 100, which is sandwiched between the first support 1512, the second support 1522, and the pressing member 131. Figures 13(A) and 13(B) are perspective and side views, respectively, showing the sixth state in which the measurement unit 29 is measuring the thickness of the film deposited on the film-forming surface 100A of the substrate 100.

[0057] Referring to Figures 13(A) and 13(B), the measurement unit 29 optically measures the film thickness of a film deposited in a measurement area MSR adjacent to the clamping area CLR of the substrate 100, which is clamped between the first support 1512, the second support 1522, and the pressing member 131. Here, the clamping area CLR is the area outside the peripheral edge of the substrate 100, which is in contact with the first support 1512, the second support 1522, and the pressing member 131. The measurement area MSR is the area inside the peripheral edge of the substrate 100 (closer to the center of the substrate 100 than the clamping area CLR), which is adjacent to the clamping area CLR. Furthermore, it is preferable that the measurement area MSR corresponds to a pressing area on the film deposition surface 100A that is not supported by the first support 1512 and the second support 1522, but is pressed by the pressing member 131. Since the measurement region MSR is a part of the peripheral edge of the substrate 100, as described above, it is a region where the amount of deformation of the substrate 100 is sufficiently reduced. Therefore, by measuring the film thickness of the film deposited in the measurement region MSR adjacent to the clamping region CLR of the substrate 100, the film thickness of the film deposited on the film-deposited surface 100A of the substrate 100 can be measured with high accuracy without being affected by the deformation due to the substrate 100's own weight.

[0058] Here, with reference to Figures 17(A), 17(B), and 17(C), the measurement region MSR on which the measurement unit 29 should measure the film thickness will be specifically described. As described above, the measurement region MSR is preferably the peripheral edge of the substrate 100, in particular, a region where deformation due to the substrate 100's own weight is minimal, and is preferably as close to the clamping region CLR as possible. Therefore, as shown in Figure 17(A), the measurement region MSR is a region adjacent to the clamping region CLR, where the amount of deformation of the substrate 100 clamped by the substrate support 15 and the pressing member 131 is within an acceptable range. Figure 17(A) is a top view showing the positional relationship between the first support 1512, the second support 1522, the pressing member 131 (clamping region CLR), and the measurement region MSR. Figure 17(B) is a diagram showing the angular change due to deformation of the substrate 100 clamped by the substrate support 15 and the pressing member 131, with the region where the angular change is within an acceptable range being shown as region MSR1. Figure 17(C) shows the displacement due to deformation of the substrate 100, which is held between the substrate support portion 15 and the pressing member 131, and the region in which the displacement is within the acceptable range is shown as region MSR2. In this embodiment, the measurement region MSR is used, but a region that satisfies both region MSR1, in which the angular change is within the acceptable range, and region MSR2, in which the displacement is within the acceptable range, may also be used as the measurement region.

[0059] Thus, according to this embodiment, the substrate 100 is sandwiched between the substrate support portion 15 and the pressing member 131, suppressing deformation due to the substrate 100's own weight, and the film thickness of the film deposited on the substrate 100 can be measured when the amount of deformation is sufficiently reduced. Therefore, it is advantageous for measuring the film thickness of the film deposited on the substrate 100 with high accuracy. Furthermore, since an electrostatic chuck is not used in this embodiment, the unique problems caused by electrostatic chucks (such as increased cycle time and detachment of the substrate from the electrostatic chuck) do not occur.

[0060] Next, a manufacturing method for producing an electronic device using the film deposition system 1 in this embodiment will be described. Here, an organic EL display device will be used as an example of the electronic device.

[0061] First, let's explain the organic EL display device. Figure 18(A) shows the overall configuration of the organic EL display device 50. Figure 18(B) shows the cross-sectional structure of one pixel of the organic EL display device 50.

[0062] As shown in Figure 18(A), the organic EL display device 50 has a display area 51 in which pixels 52, each containing a plurality of light-emitting elements, are arranged in a matrix. As will be described later, each of the plurality of light-emitting elements has a structure comprising an organic layer (organic film) sandwiched between a pair of electrodes. In this embodiment, a pixel means the smallest unit that enables the display of a predetermined color in the display area 51. For example, in the organic EL display device 50, the pixels 52 are composed of a combination of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, each enabling the display of different colors. Generally, the pixels 52 are composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but are not limited to this. For example, they may be composed of a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and only need to be composed of at least one color of light-emitting element.

[0063] Figure 18(B) is a partial cross-sectional view along the A-B line shown in Figure 18(A). The pixel 52 consists of an organic EL element on a substrate 53, comprising an anode 54, a hole transport layer 55, one of the light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a cathode 58. Of these, the hole transport layer 55, the light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In this embodiment, the light-emitting layer 56R is an organic EL layer that emits red light, the light-emitting layer 56G is an organic EL layer that emits green light, and the light-emitting layer 56B is an organic EL layer that emits blue light. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The anode 54 is formed separately for each light-emitting element. The hole transport layer 55, electron transport layer 57, and cathode 58 may be formed in common with multiple light-emitting layers 56R, 56G, and 56B, or they may be formed for each light-emitting element. In addition, an insulating layer 59 is provided between the electrodes to prevent the anode 54 and cathode 58 from short-circuiting due to foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer PL is provided to protect the organic EL element from moisture and oxygen.

[0064] In Figure 18(B), the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but depending on the structure of the organic EL device, they may be formed from multiple layers including a hole blocking layer and an electron blocking layer. Furthermore, a hole injection layer having an energy band structure may be formed between the anode 54 and the hole transport layer 55 to facilitate the smooth injection of holes from the anode 54 to the hole transport layer 55. Similarly, an electron injection layer may be formed between the cathode 58 and the electron transport layer 57.

[0065] The following describes the manufacturing method for organic EL display devices.

[0066] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and an anode 54 are formed.

[0067] Next, an acrylic resin is formed on the substrate 53 on which the anode 54 is formed by spin coating, and an insulating layer 59 is formed by patterning the acrylic resin in the area where the anode 54 is formed using lithography. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0068] A substrate 53 with an insulating layer 59 patterned on it is brought into the deposition block 301 (first deposition chamber) of the deposition system 1, and a hole transport layer 55 is deposited as a common layer on the anode 54 of the display area 51. The hole transport layer 55 is deposited, for example, by vacuum deposition. Since the hole transport layer 55 is actually formed to be larger than the display area 51, a high-resolution mask is not required.

[0069] Next, the substrate 53, on which the hole transport layer 55 has been formed, is brought into the deposition block 301 (second deposition chamber) of the deposition system 1. Alignment is performed between the substrate 53 and the mask, and a red light-emitting layer 56R is deposited on the portion of the substrate 53 that will form the red light-emitting element, via the mask.

[0070] Similar to the deposition of the light-emitting layer 56R, a light-emitting layer 56G that emits green light is deposited in the deposition block 301 (third deposition chamber) of the deposition system 1, and then a light-emitting layer 56B that emits blue light is deposited in the deposition block 301 (fourth deposition chamber) of the deposition system 1. After the light-emitting layers 56R, 56G, and 56B have been deposited, an electron transport layer 57 is deposited over the entire display area 51 in the deposition block 301 (fifth deposition chamber) of the deposition system 1. The electron transport layer 57 is formed as a layer common to the three light-emitting layers 56R, 56G, and 56B.

[0071] Next, the substrate 53, on which the electron transport layer 57 has been formed, is brought into the deposition block 301 (sixth deposition chamber) of the deposition system 1, and the cathode 58 is deposited.

[0072] Then, the substrate 53 with the cathode 58 formed is brought into a sealing device, and a protective layer PL is deposited by plasma CVD (sealing process) to complete the organic EL display device 50. Here, the protective layer PL is formed by the CVD method, but it is not limited to this. For example, the protective layer PL may be deposited by the ALD method or the inkjet method.

[0073] Furthermore, if the substrate 53, which has the insulating layer 59 patterned on it, is exposed to an atmosphere containing moisture or oxygen between the time it is brought into the film deposition system 1 and the time the protective layer PL is deposited, the light-emitting layer made of organic EL material may deteriorate. Therefore, it is preferable that the loading and unloading of the substrate 53 between film deposition apparatuses be carried out under a vacuum atmosphere or an inert gas atmosphere.

[0074] The invention is not limited to the embodiments described above, and various modifications and changes are possible within the scope of the gist of the invention. [Explanation of Symbols]

[0075] 1: Film deposition system 13: Pressing section 131: Pressing member 15: Substrate support section 151: First support member 152: Second support member 29: Measurement section 100: Substrate 100A: Film deposition surface 100B: Back surface

Claims

1. A measuring device for measuring the thickness of a film deposited on the first surface of a substrate in a vacuum atmosphere, A substrate support portion that supports the peripheral edge of the first surface of the substrate, A pressing member that presses the peripheral edge of the second surface of the substrate, which is supported by the substrate support portion and is opposite to the first surface, A measuring unit for optically measuring the thickness of the aforementioned film, It has, The measuring unit measures the thickness of the film deposited in a region of the first surface of the substrate that is located closer to the center of the substrate than the clamping region of the substrate held between the substrate support and the pressing member, and in a measurement region where the amount of deformation of the substrate due to being clamped by the substrate support and the pressing member is within an acceptable range. A measuring device characterized by the following features.

2. The measuring device according to claim 1, characterized in that the measurement area includes an area of ​​the first surface corresponding to the pressing area of ​​the second surface that is pressed by the pressing member.

3. The substrate support portion is, A first support member that supports the first portion of the peripheral edge of the first surface of the substrate, A second support member that supports a second portion of the peripheral edge of the first surface of the substrate, which is different from the first portion, The measuring device according to claim 1, characterized by including the following:

4. The measuring device according to claim 3, characterized in that the first portion and the second portion are alternately provided on the peripheral edge of the first surface of the substrate.

5. The measuring device according to claim 4, characterized in that the first portion and the second portion are provided over the entire peripheral edge of the first surface of the substrate.

6. The measuring device according to claim 3, characterized in that the first support member is configured to be movable relative to the second support member in the direction normal to the first surface of the substrate supported by the substrate support portion.

7. The measuring device according to claim 6, characterized in that the first support member is configured to be movable between a first position where it receives the substrate from a transport unit that transports the substrate and a second position where the second support member is located.

8. The measuring device according to claim 7, characterized in that the pressing member is configured to be movable between a third position above the first position and the second position in the normal direction.

9. The measuring device according to claim 8, further comprising a control unit for controlling the movement of the first support member, the second support member, and the pressing member.

10. The control unit, A first operation involves moving the first support member, which has received the substrate from the transport unit, from a first position to a second position, After the first operation, a second operation is performed to move the pressing member from the third position to the second position, The measuring device according to claim 9, characterized in that it performs the following:

11. The measuring device according to claim 1, characterized in that the measuring device is located in a transfer chamber for transferring the substrate to a downstream film deposition block, unlike the film deposition chamber for depositing the film.

12. The measuring device according to claim 11, characterized in that the transfer chamber is maintained in a vacuum atmosphere at least when measuring the thickness of the film.

13. The measuring device according to claim 1, characterized in that the measuring unit is configured to be movable relative to the first surface of the substrate.

14. A film deposition chamber for depositing a film on the first surface of the substrate, A transfer chamber for receiving the substrate on which the film has been deposited, It has, The transfer chamber is equipped with the measuring device described in claim 1. A film deposition system characterized by the following features.

15. A manufacturing method characterized by manufacturing an electronic device using the film deposition system described in claim 14.

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