Double-sided polishing device
The double-sided polishing apparatus addresses the tilting issue of guide rods by using a self-aligning mechanism in the support system, ensuring the upper platen remains horizontal, thus stabilizing the processing and improving wafer flatness.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SPEEDFAM CO LTD
- Filing Date
- 2024-12-20
- Publication Date
- 2026-07-02
AI Technical Summary
Conventional double-sided polishing apparatuses face issues with guide rods tilting due to manufacturing distortions, leading to upper platens tilting during processing, which affects the processed shape of wafers, and require laborious and time-consuming adjustments to maintain horizontal positioning.
A double-sided polishing apparatus with a support mechanism that includes a lifting actuator, joint plate, guide rods, and a linear bush with a self-aligning mechanism, allowing vertical movement of the upper platen without tilting, by absorbing guide rod tilts through a self-aligning mechanism.
Enables easy and precise vertical lowering of the upper platen, maintaining its horizontal position during processing, thereby stabilizing the wafer shape and reducing variations in load, improving the flatness of the processed workpieces.
Smart Images

Figure 2026110174000001_ABST