Multilayer electronic components

Abstract

This invention provides a multilayer electronic component having external electrodes that solves problems related to resistance to external impacts, bending strength, and plating defects at corners. [Solution] The external electrodes 131 and 132 of the stacked electronic component include conductive resin layers 131b and 132b containing metal particles and resin rs, the metal particles include spherical particles sp and plate-like particles fp, the cross-sections of the external electrodes in the first direction X and second direction Y include a lower region located at the bottom of the first direction and an upper region located at the top, and the conductive resin layer has a higher area ratio of spherical particles to metal particles in the upper region than in the lower region.

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to implement.

[0004] To ensure high reliability and high strength characteristics, a proposal has been made to change the external electrode, which is conventionally composed of an electrode layer, to a two-layer structure consisting of an electrode layer and a conductive resin layer.

[0005] The two-layer structure of an electrode layer and a conductive resin layer can improve bending strength by applying a resin composition containing a conductive substance to the electrode layer to absorb external impacts.

[0006] However, when a conductive resin layer is applied to the external electrodes, there was a risk that the equivalent series resistance (ESR) would increase.

[0007] Therefore, there has been an attempt to minimize the conductive resin layer to reduce the ESR and ensure the bending strength by increasing the thickness of the conductive resin layer in the lower region rather than the upper region of the external electrode. In this case, there is a constraint that the bending strength can only be ensured when mounted in a specific direction, and it may be difficult to sufficiently ensure the bending strength and moisture resistance reliability.

[0008] In addition, since the standards for high reliability and high strength characteristics required in the industry are becoming increasingly high, a solution for further improving high reliability and high strength characteristics is demanded.

Prior Art Documents

Patent Documents

[0009]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0010] One of several objects of the present invention is to provide a laminated electronic component with excellent reliability.

[0011] One of several objects of the present invention is to provide a laminated electronic component with improved bending strength.

[0012] One of several objects of the present invention is to suppress plating breakage defects.

[0013] However, the objects of the present invention are not limited to the above content and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0014] A stacked electronic component according to one embodiment of the present invention includes a body comprising a dielectric layer and internal electrodes, having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first, second, third, and fourth surfaces and facing in a third direction; and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include a conductive resin layer containing metal particles and resin, the metal particles include spherical particles and plate-like particles, the cross-sections of the external electrodes in the first and second directions include a lower region located below the first direction and an upper region located above the first direction, and the conductive resin layer may have a higher area ratio of spherical particles to metal particles in the upper region than in the lower region. [Effects of the Invention]

[0015] One of the various effects of the present invention is that by differentiating the area ratio of spherical particles in the conductive resin layer between the upper and lower regions, it is possible to reduce the ESR while preventing an increase in the size of the laminated electronic component, and to improve the bending strength of both the upper and lower regions.

[0016] One of the various effects of the present invention is that it is possible to prevent the external electrodes at the corner portions from being formed too thin, thereby suppressing plating defects and improving moisture resistance reliability.

[0017] However, the diverse yet beneficial advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0018] [Figure 1] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 2] This is a schematic cross-sectional view along the line I-I' in Figure 1. [Figure 3]This is a schematic cross-sectional view along the line II-II' in Figure 1. [Figure 4] This shows a simplified view of the main unit after disassembly. [Figure 5] Figure 2 is a magnified view of the first external electrode region. [Figure 6] This is a side view of a stacked electronic component with respect to the sixth surface. [Figure 7] This figure corresponds to Figure 2 of a stacked electronic component according to another embodiment of the present invention. [Modes for carrying out the invention]

[0019] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0020] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, this does not exclude other components unless otherwise stated, but rather means that it may further include other components.

[0021] In drawings, the X direction can be defined as the first direction, the lamination direction, or the thickness T direction; the Y direction as the second direction or the length L direction; and the Z direction as the third direction or the width W direction.

[0022] Multilayer electronic components Figure 1 schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention; Figure 2 schematically shows a cross-sectional view along the line I-I' in Figure 1; Figure 3 schematically shows a cross-sectional view along the line II-II' in Figure 1; Figure 4 schematically shows the main body disassembled; Figure 5 is an enlarged view of the first external electrode region in Figure 2; and Figure 6 is a side view of the stacked electronic component with respect to the sixth surface.

[0023] Hereinafter, a multilayer electronic component 100 according to one embodiment of the present invention will be described in detail with reference to Figures 1 to 6. While a multilayer ceramic capacitor (MLCC) will be described as an example of a multilayer electronic component, the present invention is not limited to this and can be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0024] A stacked electronic component 100 according to one embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121, 122, and comprises a body 110 including a first surface 1 and a second surface 2 facing in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces and facing in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first, second, third and fourth surfaces and facing in a third direction, and external electrodes 131, 132 disposed on the third and fourth surfaces, wherein the external electrodes are made of metal particles sp, The conductive resin layers 131b and 132b include fp and resin rs, wherein the metal particles include spherical particles sp and plate-like particles fp, and the cross-sections of the external electrodes 131 and 132 in the first and second directions include a lower region LR located below the first direction and an upper region UR located above the first direction, and the conductive resin layers 131b and 132b may have a higher area ratio of spherical particles sp to metal particles sp and fp in the upper region than in the lower region.

[0025] By applying a resin composition containing a conductive substance to form a conductive resin layer, it is possible to absorb external impacts and improve bending strength, but there was a risk of increasing the equivalent series resistance (ESR).

[0026] Therefore, there have been attempts to minimize the conductive resin layer and lower the ESR while ensuring bending strength by increasing the thickness of the conductive resin layer in the lower region of the external electrode compared to the upper region. However, this has resulted in the constraint that bending strength can only be ensured when the electrode is mounted in a specific direction, making it difficult to adequately ensure bending strength and moisture resistance reliability.

[0027] According to one embodiment of the present invention, by differentiating the area ratio of spherical particles in the conductive resin layer in the upper and lower regions of the external electrodes 131 and 132, it is possible to reduce the ESR while preventing an increase in the size of the laminated electronic component, and to improve the bending strength of both the upper and lower regions.

[0028] The following describes each component included in the stacked electronic component 100 according to one embodiment of the present invention.

[0029] The main body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0030] There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedron-shaped.

[0031] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in a third direction.

[0032] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third, fourth, and fifth surfaces and / or the corners connecting the second surface with the third, fourth, and fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, fourth surface 4, fifth surface 5, and sixth surface 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third, fourth, fifth, and sixth faces, and / or the corners connecting the second face with the third, fourth, fifth, and sixth faces.

[0033] On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth surface 5 and sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces, and the portions connecting the second surface with the fifth and sixth surfaces, do not need to have a contracted form.

[0034] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular limit to the number of dielectric layers stacked, and it can be determined considering the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0035] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, as the ceramic powder, a barium titanate (BaTiO3)-based powder can be used. As a more specific example, the ceramic powder can be a barium titanate (BaTiO3)-based powder, a CaZrO3-based constant dielectric powder, etc. For a more specific example, the barium titanate (BaTiO3)-based powder can be BaTiO3, (Ba y , x , y , y , x ,

[0036] , y , y , x , , 1-x , 1-y , 1-y , 1-x , 1-x , , 1-y , 1-y Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and may be one or more of them. The CaZrO3-based constant dielectric powder (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) may also be used.

[0036] Therefore, the dielectric layer 111 is BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y)It can contain one or more of O3 (0 < x < 1, 0 < y < 1). In one embodiment, the dielectric layer 111 can contain (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) as a main component.

[0037] On the other hand, when applying a magnetic material instead of the dielectric material to the main body 110, the multilayer electronic component can function as an inductor. The magnetic material may be, for example, ferrite and / or metal magnetic particles. When the multilayer electronic component functions as an inductor, the internal electrode may be a coiled conductor.

[0038] Also, when applying a piezoelectric material instead of the dielectric material to the main body 110, the multilayer electronic component can function as a piezoelectric element. The piezoelectric material may be, for example, PZT (lead zirconate titanate).

[0039] Also, when applying a ZnO-based or SiC-based material instead of the dielectric material to the main body 110, the multilayer electronic component can function as a varistor, and when applying a spinel-based material instead of the dielectric material to the main body 110, the multilayer electronic component can function as a thermistor.

[0040] That is, the multilayer electronic component 100 according to one embodiment of the present invention can function not only as a multilayer ceramic capacitor but also as an inductor, a piezoelectric element, a varistor or a thermistor by appropriately changing the material and structure of the main body 110.

[0041] The size of the main body 110 does not need to be particularly limited. For example, the length L in the second direction of the main body 110 may be 3.1 to 3.3 mm, the thickness in the first direction of the main body 110 may be 2.4 to 2.6 mm, and the width in the third direction of the main body 110 may be 2.4 to 2.6 mm. However, it is not limited thereto, and it can be appropriately deformed according to the use environment and purpose.

[0042] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged to face each other with a dielectric layer 111 in between, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in a first direction.

[0043] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between.

[0044] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume forming portion Ac in the first direction, and a lower cover portion 113 positioned below the volume forming portion Ac in the first direction.

[0045] The upper cover portion 112 and the lower cover portion 113 can be formed by stacking a single dielectric layer or two or more dielectric layers 112-1, 112-2, 113-1, 113-2 on the upper and lower surfaces of the capacitance forming portion Ac in the thickness direction, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The upper cover portion 112 and the lower cover portion 113 do not contain internal electrodes and may contain the same material as the dielectric layer 111.

[0047] In other words, the upper cover portion 112 and the lower cover portion 113 can include ceramic material, for example, barium titanate (BaTiO3) based ceramic material.

[0048] On the other hand, the thickness of the cover portions 112 and 113 is not particularly limited. For example, the thickness tc of the cover portions 112 and 113 may be 100 μm or less, 30 μm or less, or 20 μm or less. Here, the average thickness of the cover portions 112 and 113 refers to the average thickness of the first cover portion 112 and the second cover portion 113, respectively.

[0049] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the size of the cover portions 112 and 113 in the first direction measured at five equally spaced points in the second direction in the cross-sections of the first and second directions obtained by cutting the main body 110 in the center of the third direction.

[0050] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0051] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 may be located on both end surfaces in the width direction of the ceramic main body 110.

[0052] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0053] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0054] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes.

[0055] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form margin portions 114 and 115.

[0056] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. For example, the average width of the margin portions 114 and 115 may be 100 μm or less, 20 μm or less, or 15 μm or less. Here, the average width of the margin portions 114 and 115 refers to the average thickness of the first margin portion 114 and the second margin portion 115, respectively.

[0057] The average width of the margin portions 114 and 115 can represent the average size MW1 in the third direction of the region where the internal electrode is separated from the fifth surface, and the average size MW2 in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0058] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively.

[0059] The first internal electrode 121 is exposed via the third surface 3, separated from the fourth surface 4, and the second internal electrode 122 can be exposed via the fourth surface 4, separated from the third surface 3. The first external electrode 131 is positioned on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 is positioned on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0060] In other words, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Furthermore, the first internal electrode 121 and the second internal electrode 122 can be arranged at a distance from the fifth and sixth surfaces of the main body 110.

[0061] However, the configuration is not limited to this form, and may include a first internal electrode and a second internal electrode arranged alternately with a dielectric layer in between, and a first-first internal electrode connected to a first external electrode, and a first-second internal electrode connected to a second external electrode, wherein the second internal electrode may have the form of a floating electrode arranged separately from the first and second external electrodes.

[0062] Furthermore, although it has been shown that the first internal electrode 121 and the second internal electrodes 121 and 122 are alternately arranged in the first direction with the dielectric layer 111 in between, the invention is not limited to this, and in one embodiment, the first internal electrode and the second internal electrode may be alternately arranged in the third direction with the dielectric layer in between.

[0063] The conductive metals contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0064] The average thickness td of the dielectric layer 111 does not need to be particularly limited, but may be, for example, 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited, but may be, for example, 0.05 μm to 3.0 μm. Furthermore, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to the desired characteristics and application.

[0065] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 refer to the sizes of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness td of the dielectric layer 111 can be measured by taking the average value of the thickness at multiple points on one dielectric layer 111, for example, 30 points that are equally spaced in the second direction. Similarly, the average thickness te of the internal electrodes 121 and 122 can be measured by taking the average value of the thickness at multiple points on one internal electrode 121 or 122, for example, 30 points that are equally spaced in the second direction. The 30 equally spaced points can be specified in the capacitance forming section Ac. On the other hand, if such average values ​​are measured for 10 dielectric layers 111 and 10 internal electrodes 121 and 122, and then the average values ​​are measured again, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0066] External electrodes 131 and 132 can be arranged on the third and fourth surfaces of the main body 110.

[0067] The external electrodes 131 and 132 may include a first external electrode 131 and a second external electrode 132, which are arranged on the third surface 3 and the fourth surface 4 of the main body 110, respectively, as shown in the configuration in Figure 2, and are connected to the first internal electrode 121 and the second internal electrode 122, respectively.

[0068] In this embodiment, a structure in which the stacked electronic component 100 has two external electrodes 131 and 132 is described, but the number and shape of the external electrodes 131 and 132 can be changed depending on the form of the internal electrodes 121 and 122 and other purposes.

[0069] The external electrodes 131 and 132 may include conductive resin layers 131b and 132b containing metal particles sp and fp and resin rs. Furthermore, the metal particles sp and fp may include spherical particles sp and plate-shaped particles fp.

[0070] The cross-sections of the external electrodes 131 and 132 in the first and second directions include a lower region LR located below the first direction and an upper region UR located above the first direction. The conductive resin layer may have a higher area ratio of spherical particles sp to the area of ​​metal particles sp and fp in the upper region UR than in the lower region LR. Because the conductive resin layers 131b and 132b have a higher area ratio of spherical particles sp in the upper region UR than in the lower region LR, the volume of the external electrodes 131 and 132 can be minimized while lowering the ESR and ensuring sufficient bending strength.

[0071] The resin rs contained in the conductive resin layers 131b and 132b plays a role in ensuring bonding and shock absorption, while the metal particles sp and fp can play a role in electrically connecting the internal electrodes 121 and 122 with the external electrodes 131 and 132.

[0072] The resin rs contained in the conductive resin layers 131b and 132b is not particularly limited as long as it has bonding and shock-absorbing properties and can be mixed with conductive metal powder to form a paste, for example, it may include epoxy resins.

[0073] The ratio of spherical particles sp to metal particles sp and fp is an important factor in determining the static viscosity of the paste used to form the conductive resin layers 131b and 132b. Here, static viscosity can be defined as the viscosity at which, after dipping the body into the paste and then lifting it, the paste stretches for a long time under external force before breaking, and immediately after breaking, the paste gradually flows, determining the applied shape. When the ratio of spherical particles sp to metal particles sp and fp is high, the static viscosity is high, and the paste is more likely to maintain its shape. Conversely, when the ratio of spherical particles sp to metal particles sp and fp is low, the static viscosity is low, and the fluidity after paste application is high, making it more likely to flow due to gravity. In other words, the ratio of plate-like particles fp to spherical particles sp is an important factor in determining static viscosity.

[0074] According to one embodiment of the present invention, in the conductive resin layers 131b and 132b, the area ratio of spherical particles sp is higher in the upper region UR than in the lower region LR. Therefore, the upper region UR easily maintains its shape even in a paste state, and conductive resin layers 131b and 132b can be sufficiently formed at the corners connecting the third surface and the second surface, and the corners connecting the fourth surface and the second surface. Similarly, in the lower region LR, conductive resin layers 131b and 132b can be sufficiently formed at the corners connecting the third surface and the first surface, and the corners connecting the fourth surface and the first surface.

[0075] In one embodiment, the upper region UR and the lower region LR may each include a convex shape in the second direction. Since the upper region UR and the lower region LR may be vulnerable to stress transmitted from the outside, having a convex shape in the upper region UR and the lower region LR can increase resistance to external stress and improve bending strength. Generally, the lower region LR is more affected by stress due to substrate warping than the upper region UR, but if only the lower region LR is thickened, bending strength can only be improved when the lower region LR is mounted closer to the mounting surface. That is, bending strength can only be improved when the first surface of the main body, of the first, second, fifth, and sixth surfaces, is mounted facing the substrate. In contrast, according to one embodiment of the present invention, bending strength can be ensured even if any one of the first, second, fifth, and sixth surfaces is mounted facing the substrate.

[0076] Furthermore, conventionally, the main method used was to form external electrodes by dipping the main body into an external electrode paste. When forming external electrodes using the dipping method, in order to form sufficiently thick external electrodes at the corners connecting the third surface with the first, second, fifth, and sixth surfaces, and at the corners connecting the fourth surface with the first, second, fifth, and sixth surfaces, the thickness of the external electrodes in the central part of the third and fourth surfaces can become extremely thick, which can reduce the capacity per unit volume of the multilayer electronic component. Also, when only the lower region LR is thickened, it is possible to form sufficiently thick external electrodes at the corners connecting the third and first surfaces, and at the corners connecting the fourth and first surfaces, but it is difficult to form sufficiently thick external electrodes at the corners connecting the third and second surfaces, and at the corners connecting the fourth and second surfaces, which can lead to cracking of the plating layer or penetration of moisture and / or plating solution, reducing the reliability of moisture resistance.

[0077] In contrast, according to one embodiment of the present invention, external electrodes 131 and 132 can be sufficiently formed at the corners connecting the second and third surfaces and the corners connecting the second and fourth surfaces, thereby preventing the plating layers 131c and 132c from breaking and blocking the penetration paths of moisture and / or plating solution, thereby improving moisture resistance reliability.

[0078] In one embodiment, the external electrodes 131 and 132 may include a shape that is recessed in the second direction between the convex shape of the upper region UR and the convex shape of the lower region LR.

[0079] Furthermore, as shown in Figure 1, the convex shape of the upper region UR may be arranged continuously in the third direction, and the convex shape of the lower region LR may also be arranged continuously in the third direction. This allows the external electrodes 131 and 132 to have a concave shape formed continuously in the third direction at the center in the first direction.

[0080] In one embodiment, when the maximum thickness in the second direction of the external electrode in the lower region LR is tm1, the maximum thickness in the second direction of the external electrode in the upper region UR is tm2, and the minimum thickness in the second direction of the external electrode at the central portion in the first direction is tmin, tmin < tm1 and tmin < tm2 can be satisfied. Thereby, while minimizing the volume of the external electrodes 131 and 132, the ESR can be reduced and the bending strength can be sufficiently ensured. As a specific example, tmin / tm1 may be 0.1 or more and 0.9 or less, and tmin / tm2 may be 0.1 or more and 0.9 or less.

[0081] Referring to FIG. 5, the upper region UR can be a region where the external electrode is disposed from the center in the first direction of the main body 110 to the extension line E2 of the second surface, and the lower region LR can be a region where the external electrode is disposed from the center in the first direction of the main body 110 to the extension line E1 of the first surface. On the other hand, the central portion in the first direction of the external electrode can be a region located at the center when the region from the extension line E1 of the first surface to the extension line E2 of the second surface is divided into three equal parts.

[0082] Also, tm1, tm2, and tmin may be measured in the cross section in the first and second directions obtained by cutting at the center in the third direction of the main body.

[0083] The external electrodes 131 and 132 can include band portions extending to a part of the first surface and the second surface. Also, the external electrodes 131 and 132 can include side band portions 131sb and 132sb extending to a part of the fifth surface and the sixth surface.

[0084] Referring to FIG. 5, the side band portions 131sb and 132sb can have a decreasing length in the second direction from the uppermost end in the first direction of the main body toward the central portion in the first direction of the main body, and a decreasing length in the second direction from the lowermost end in the first direction of the main body toward the central portion in the first direction of the main body. Thereby, while improving the bending strength on the upper and lower surfaces where external stress concentrates, the volume of the external electrode can be minimized.

[0085] In one embodiment, the external electrodes 131b and 132b include side band portions 131sb and 132sb that extend to a part of the fifth and sixth surfaces 5 and 6. The external electrodes 131 and 132 include a first external electrode 131 disposed on the third surface and a second external electrode 132 disposed on the fourth surface. When the minimum length in the second direction from the extension line E3 of the third surface to the end of the side band portion 131sb of the first external electrode at the central portion in the first direction is Lbc, the length in the second direction from the extension line E3 of the third surface to the end of the side band portion 131sb of the first external electrode at the lowermost end in the first direction of the main body is Lb1, and the length in the second direction from the extension line E3 of the third surface to the end of the side band portion 131sb of the first external electrode at the uppermost end in the first direction of the main body is Lb2, Lbc < Lb1 and Lbc < Lb2 can be satisfied. Thereby, while improving the bending strength on the upper and lower surfaces where external stress concentrates, the volume of the external electrode can be minimized.

[0086] As a specific example, Lbc / Lb1 may be 0.1 or more and 0.9 or less, and Lbc / Lb2 may be 0.1 or more and 0.9 or less.

[0087] In one embodiment, the external electrodes 131 and 132 are disposed on the main body and further include electrode layers 131a and 132a connected to the internal electrodes, and the conductive resin layers 131b and 132b can be disposed on the electrode layers 131a and 132a.

[0088] The electrode layers 131a and 132a contain a metal and can serve to be in direct contact with the internal electrodes 121 and 122 to electrically connect the external electrodes 131 and 132 and the internal electrodes 121 and 122.

[0089] In one embodiment, the electrode layers 131a and 132a may further contain glass. By further containing glass in the electrode layers 131a and 132a, the bonding strength with the main body can be improved, and the bonding strength between the external electrodes 131 and 132 and the main body 110 can be improved. The electrode layers 131a and 132a may also be firing electrodes formed by applying and firing a paste containing glass and metal onto the main body.

[0090] While materials with excellent electrical conductivity can be used as the metals contained in the electrode layers 131a and 132a, there are no particular limitations. For example, the metals contained in the electrode layers 131a and 132a may be one or more of nickel (Ni), copper (Cu), and their alloys, and more preferably Cu.

[0091] In one embodiment, the electrode layers 131a and 132a may have a shape that is convex in the second direction at the central portion in the first direction.

[0092] In one embodiment, the electrode layers 131a and 132a can satisfy ta1>ta2 and ta1>ta3 when the thickness of the electrode layer in the second direction at the central part in the first direction is ta1, the thickness of the electrode layer in the second direction at the internal electrode located at the uppermost end in the first direction among the internal electrodes connected to the electrode layer is ta2, and the thickness of the electrode layer in the second direction at the internal electrode located at the lowermost end in the first direction among the internal electrodes connected to the electrode layer is ta3.

[0093] As a concrete example, ta1 / ta2 may be greater than 1 and less than or equal to 20, and ta1 / ta3 may be greater than 1 and less than or equal to 20. Also, ta1 / ta2 may be between 1.2 and 10, and ta1 / ta3 may be between 1.2 and 10.

[0094] On the other hand, the central part in the first direction can be the central region when the area from the extension line E1 of the first surface to the extension line E2 of the second surface is divided into three equal parts, and ta1 can represent the maximum thickness of the electrode layer in the second direction in the central part of the first direction.

[0095] Furthermore, ta1, ta2, and ta3 may be measured at the cross-sections in the first and second directions obtained by cutting the main body at the center in the third direction.

[0096] In one embodiment, the main body 110 includes margin portions 114 and 115, which are regions where the internal electrodes are separated from the fifth and sixth surfaces, and the upper region UR and lower region LR in the cross-sections of the external electrodes 131 and 132 cut by the margin portions 114 and 115 in the first and second directions may each include a shape that is convex in the second direction.

[0097] In this case, the external electrodes 131 and 132 may include a shape that is recessed in the second direction between the convex shape of the upper region UR and the convex shape of the lower region LR.

[0098] The metal particles sp and fp contained in the conductive resin layers 131b and 132b may exist in a randomly dispersed form. The metal particles sp and fp contained in the conductive resin layers 131b and 132b may be in a mixed form of spherical particles sp and plate-like particles fp. However, this is not limited to the above, and the metal particles in a part of the conductive resin layers 131b and 132b may consist only of spherical particles sp, or a part of the conductive resin layers 131b and 132b may be formed by applying a paste containing metal particles and resin consisting only of spherical particles. Furthermore, the metal particles sp and fp do not need to consist only of spherical particles sp and plate-like particles fp, and may contain other forms of particles.

[0099] The metal particles sp and fp may contain one or more of Ag, Cu, and Sn. Furthermore, the metal particles sp and fp may also contain Bi, Pb, etc.

[0100] In one embodiment, the conductive resin layers 131b and 132b include a first layer 131b-1 and 132b-1 located in the lower region LR, and a second layer 131b-2 and 132b-2 located in the upper region UR, wherein the area ratio of spherical particles sp to metal particles sp and fp in the second layer 131b-2 and 132b-2 is higher than that of the first layer 131b-1 and 132b-1.

[0101] On the other hand, the resin rs contained in the conductive resin layers 131b and 132b may be, for example, an epoxy resin, and the present invention is not limited thereto. For example, it may be a bisphenol A resin, a glycol epoxy resin, a novolac epoxy resin, or a derivative thereof that is liquid at room temperature due to its small molecular weight.

[0102] Furthermore, the resin contained in the first layer 131b-1 and 132b-1 may be the same type of resin as the resin contained in the second layer 131b-2 and 132b-2.

[0103] However, this is not limited to this, and the resins contained in the first layer 131b-1 and 132b-1 may be of a different type than the resins contained in the second layer 131b-2 and 132b-2. To give a specific example, since the molecular weight of the resin can affect the static viscosity, the molecular weight of the resins contained in the first layer 131b-1 and 132b-1 can be controlled to be smaller than the molecular weight of the resins contained in the second layer 131b-2 and 132b-2.

[0104] In one embodiment, the first layers 131b-1 and 132b-1 have an area ratio of spherical particles to metal particles of 50% to 70%, while the second layers 131b-2 and 132b-2 have an area ratio of spherical particles to metal particles of 97.5% or more. This makes it possible to reduce the ESR and improve the bending strength of both the upper and lower regions while preventing an increase in the size of the laminated electronic component. Generally, the more plate-like particles in the paste increase, the higher the fluidity of the paste and the lower the static viscosity. Therefore, the first layers 131b-1 and 132b-1 may be composed mainly of spherical particles to lower the static viscosity and induce a flowable shape during the drying process immediately after application, while the second layers 131b-2 and 132b-2 may be composed mainly of spherical particles to increase the static viscosity.

[0105] If the area ratio of spherical particles to metal particles in the first layer 131b-1 and 132b-1 is less than 50%, the static viscosity of the paste may become excessively low. If it exceeds 70%, the thickness of the central part of the external electrode in the first direction may increase as the static viscosity increases, potentially leading to an increase in the size of the multilayer electronic component.

[0106] If the area ratio of spherical particles to metal particles in the second layer 131b-2 and 132b-2 is less than 97.5%, the static viscosity will be low, which may make it difficult to form the convex shape of the upper region UP.

[0107] In one embodiment, the area ratio occupied by metal particles sp and fp in the first layers 131b-1 and 132b-1 can be 60% or more and 70% or less, and the area ratio occupied by metal particles sp and fp in the second layers 131b-2 and 132b-2 can be 70% or more and 90% or less.

[0108] If the area ratio of metal particles sp and fp in the first layer 131b-1 and 132b-1 is less than 60%, the ESR may increase, and if it exceeds 70%, the bending strength may decrease.

[0109] If the area ratio of metal particles sp and fp in the second layer 131b-2 and 132b-2 is less than 70%, the ESR may increase, and if it exceeds 90%, the bending strength may decrease.

[0110] The average size of the metal particles sp and fp does not need to be particularly limited. For example, the average size of the metal particles sp and fp may be 0.2 to 20 μm. On the other hand, the average size of the metal particles sp and fp can mean the size measured from an image obtained by scanning the cross-sections (LT cross-sections) in the first and second directions taken at the center of the third direction of the main body 110 using an SEM. In the above image, the average size can be the average value of the sizes of 10 or more metal particles sp and fp. On the other hand, the size of a single metal particle sp and fp can be defined as the diameter of a hypothetical circle with the same area as the metal particle sp and fp.

[0111] Generally, spherical particles sp and plate-like particles fp differ significantly in their ratio of minor axis length to major axis length, to the extent that they are easily distinguishable by visual inspection. Therefore, there is no need to specifically limit the ratio of minor axis length to major axis length of spherical particles sp and plate-like particles fp, but for example, spherical particles sp may have a ratio of minor axis length to major axis of 1.45 or less, while plate-like particles fp may have a ratio of minor axis length to major axis of 1.95 or more.

[0112] The area ratio of spherical particles sp to metal particles sp and fp, the area ratio of metal particles sp and fp in the first layer 131b-1 and 132b-1, the area ratio of metal particles sp and fp in the second layer 131b-2 and 132b-2, and the length ratio of the minor axis to the major axis of metal particles sp and fp may be measured in the cross-sections (LT cross-sections) in the first and second directions after polishing to the halfway point in the third direction of the main body.

[0113] Specifically, after obtaining an image of the above LT cross-section using a scanning electron microscope (SEM) at a magnification of 3000x or more, the metal particles and resin in the conductive resin layers 131b and 132b may have different colors or shading from each other. This allows for the determination of the area ratio of metal particles sp and fp within the conductive resin layers 131b and 132b. Furthermore, by performing component analysis of the above image using energy-dispersive spectroscopy (EDS), the metal particles sp and fp and the resin can be distinguished more clearly.

[0114] Furthermore, spherical particles sp and plate-like particles fp can be distinguished visually from the above image, or particles with a ratio of the length of the minor axis to the length of the major axis of 1.45 or less can be selected as spherical particles, and the area ratio of spherical particles sp to metal particles sp and fp can be measured.

[0115] The area ratio of spherical particles sp to metal particles sp and fp in the upper region UR can be the average of values ​​measured in three regions with equal spacing in the first direction within the upper region UR of the LT cross-section, and the area ratio of spherical particles sp to metal particles sp and fp in the lower region UR can be the average of values ​​measured in three regions with equal spacing in the first direction within the lower region UR of the LT cross-section.

[0116] The plating layers 131c and 132c play a role in improving mounting characteristics. The types of plating layers 131c and 132c are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and may be formed in multiple layers.

[0117] To give a more specific example for the plating layers 131c and 132c, the plating layers 131c and 132c may be Ni plating layers or Sn plating layers, or they may be in a form in which Ni plating layers and Sn plating layers are formed sequentially, or they may be in a form in which Sn plating layers, Ni plating layers and Sn plating layers are formed sequentially. Furthermore, the plating layers 131c and 132c may include multiple Ni plating layers and / or multiple Sn plating layers.

[0118] In one embodiment, the first layers 131b-1 and 132b-1 are also arranged in the upper region UL, and the second layers 131b-2 and 132b-2 can be arranged on the first layers 131b-1 and 132b-1 in the upper region UL.

[0119] First, a paste with low static viscosity is applied to the third and fourth surfaces of the main body, and then a paste with high static viscosity is applied to the upper region UR and subjected to curing heat treatment to form a conductive resin layer, thereby allowing the first layers 131b-1 and 132b-1 to be placed in the upper region UL as well.

[0120] Furthermore, the first layers 131b-1 and 132b-1 may have an average thickness in the second direction in the upper region UR that is thinner than the average thickness in the second direction in the lower region LR. On the other hand, the average thickness in the second direction can be the average of the thickness values ​​in the second direction measured at five points that are equally spaced in the first direction.

[0121] On the other hand, the first layers 131b-1 and 132b-1 do not necessarily need to be further placed in the upper region UR, and the first layers 131b-1 and 132b-1 do not need to be placed in the upper region UR.

[0122] Furthermore, referring to Figure 7, which is a diagram corresponding to Figure 2 of a stacked electronic component 100' according to another embodiment of the present invention, the first layers 131b-1', 132b-1' and the second layers 132b-1', 132b-2' can be arranged spaced apart from each other. The external electrodes 131', 132' include electrode layers 131a', 132a' and conductive resin layers 131b', 132b', and the electrode layers 131a', 132a' may include areas not covered by the conductive resin layers 131b', 132', in which plating layers 131c', 132c' can be arranged.

[0123] The following describes, in part, an exemplary method for manufacturing a stacked electronic component according to the above-described embodiment of the present invention. However, the method for manufacturing the stacked electronic component 100 is not limited thereto.

[0124] First, prepare ceramic powder for forming the dielectric layer 111. The ceramic powder can include, for example, one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). The BaTiO3 powder can be synthesized, for example, by reacting a titanium raw material such as titanium dioxide with a barium raw material such as barium carbonate. Examples of the synthesis method of the above ceramic powder include a solid-phase method, a sol-gel method, a hydrothermal synthesis method, etc., but the present invention is not limited thereto. Next, after drying and pulverizing the prepared ceramic powder, mix it with an organic solvent such as ethanol and a binder such as polyvinyl butyral to produce a ceramic slurry, and apply and dry the ceramic slurry on a carrier film to prepare a ceramic green sheet.

[0125] Next, an internal electrode pattern is formed by printing a conductive paste for an internal electrode containing metal powder, binder, organic solvent, etc. on the ceramic green sheet with a predetermined thickness using a screen printing method or a gravure printing method.

[0126] Subsequently, after peeling the ceramic green sheet with the printed internal electrode pattern from the carrier film, a predetermined number of layers of ceramic green sheets with the printed internal electrode pattern are laminated and pressed together to form a ceramic laminate. A predetermined number of ceramic green sheets without the printed internal electrode pattern can be laminated on the upper and lower parts of the ceramic laminate to form cover portions 112 and 113 after firing. After that, the ceramic laminate can be cut to have a predetermined chip size, and the cut chips can be fired at a temperature of 1000°C to 1400°C to form the main body 110.

[0127] On the other hand, the margin portions 114 and 115 may be formed by applying a conductive paste for internal electrodes to the ceramic green sheet, except for the areas where the margin portions are formed, and then firing it. Alternatively, in order to suppress the step caused by the internal electrodes 121 and 122, the ceramic laminate can be cut so that the internal electrode pattern is exposed on both sides of the cut chip in the third direction, then a margin portion forming sheet can be attached to both sides of the cut chip in the third direction, and then fired to form the margin portions 114 and 115.

[0128] Next, external electrodes 131 and 132 are formed. For example, electrode layers 131a and 132a can be formed by dipping the main body 110 into a conductive paste for external electrodes containing metal powder, glass frit, binder, and organic solvent, and then firing the conductive paste for external electrodes at a temperature of 500°C to 900°C.

[0129] Subsequently, the conductive resin layers 131b and 132b can be formed using a first layer paste containing a conductive resin composition comprising metal particles, resin, binder, and organic solvent, and a second layer paste having a higher proportion of spherical particles than the first layer paste.

[0130] First, the paste for the first layer is applied to the electrode layer and tilted to allow the paste to flow to the lower region, thereby increasing the thickness of the external electrode in the lower region. Then, the paste for the second layer, which has a high static viscosity, is applied to the upper region and the corners of the second surface, and then a curing heat treatment is performed to form conductive resin layers 131b and 132b.

[0131] Subsequently, electrolytic plating and / or electroless plating can be further performed to form plating layers 131c and 132c.

[0132] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0133] Furthermore, the expression "one embodiment" as used in this invention does not mean that each embodiment is the same as another, but is provided to emphasize and describe the unique and distinct features of each embodiment. However, the above-presented embodiments do not preclude their realization in combination with the features of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, as long as there is no description in the other embodiment that contradicts or is contrary to that matter.

[0134] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions include plural expressions unless the context clearly indicates a different meaning. [Explanation of Symbols]

[0135] 100: Stacked Electronic Components 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 132: External electrode 131a, 132a: Electrode layer 131b, 132b: Conductive resin layer 131b-1, 132b-1: 1st layer 131b-2, 132b-2: 2nd layer 131c, 132c: Plating layer

Claims

1. A body including a dielectric layer and internal electrodes, and including a first and second surface facing in a first direction, a third and fourth surface connected to the first and second surfaces and facing in a second direction, and a fifth and sixth surface connected to the first, second, third and fourth surfaces and facing in a third direction, Includes external electrodes disposed on the third and fourth surfaces, The external electrode includes a conductive resin layer containing metal particles and resin, and the metal particles include spherical particles and plate-shaped particles. The cross-sections of the external electrode in the first and second directions include a lower region located below the first direction and an upper region located above the first direction. The conductive resin layer is a laminated electronic component in which the area ratio of spherical particles to metal particles is higher in the upper region than in the lower region.

2. The stacked electronic component according to claim 1, wherein the upper region and the lower region each include a shape that is convex in the second direction.

3. The stacked electronic component according to claim 2, wherein the external electrode includes a shape recessed in the second direction between the convex shape of the upper region and the convex shape of the lower region.

4. The maximum thickness of the external electrode in the second direction in the lower region is tm1, The maximum thickness of the external electrode in the second direction in the upper region is tm2, When the minimum thickness of the external electrode in the second direction at the central portion in the first direction is denoted as tmin, A stacked electronic component according to claim 1, satisfying tmin < tm1 and tmin < tm2.

5. The external electrode includes a side band portion that extends to a part of the fifth and sixth surfaces, The stacked electronic component according to claim 1, wherein the length of the side band portion decreases in the second direction as it moves from the uppermost end in the first direction of the main body toward the center in the first direction of the main body, and decreases in the second direction as it moves from the lowermost end in the first direction of the main body toward the center in the first direction of the main body.

6. The external electrode includes a side band portion that extends to a part of the fifth and sixth surfaces, The external electrode includes a first external electrode positioned on the third surface and a second external electrode positioned on the fourth surface. In the central part of the first direction, the minimum length in the second direction from the extension line of the third surface to the end of the side band portion of the first external electrode is Lbc. At the lowest end of the main body in the first direction, the length in the second direction from the extension line of the third surface to the end of the side band portion of the first external electrode is Lb1. When Lb2 is the length in the second direction from the extension line of the third surface to the end of the side band portion of the first external electrode at the uppermost end of the main body in the first direction, A multilayer electronic component according to claim 1, satisfying Lbc < Lb2 and Lbc < Lb1.

7. The external electrode is disposed on the main body and further includes an electrode layer connected to the internal electrode, The laminated electronic component according to claim 1, wherein the conductive resin layer is disposed on the electrode layer.

8. The laminated electronic component according to claim 7, wherein the electrode layer includes a shape that is convex in the second direction at the central portion in the first direction.

9. The electrode layer has a thickness of ta1 in the second direction at the central part in the first direction. Among the internal electrodes connected to the electrode layer, the thickness of the electrode layer in the second direction of the internal electrode located at the uppermost end in the first direction is ta2. When the thickness of the electrode layer in the second direction of the internal electrode located at the lowest end in the first direction among the internal electrodes connected to the electrode layer is denoted as ta3, The stacked electronic component according to claim 7, satisfying ta1 > ta2 and ta1 > ta3.

10. The main body includes a margin portion which is a region in which the internal electrodes are separated from the fifth and sixth surfaces. The stacked electronic component according to any one of claims 1 to 9, wherein in the cross-sections of the external electrode cut at the margin portion in the first and second directions, the upper region and the lower region each include a shape that is convex in the second direction.

11. The stacked electronic component according to claim 10, wherein the external electrode includes a shape recessed in the second direction between the convex shape of the upper region and the convex shape of the lower region.

12. The conductive resin layer includes a first layer disposed in the lower region and a second layer disposed in the upper region. The stacked electronic component according to any one of claims 1 to 9, wherein the second layer has a higher area ratio of spherical particles to metal particles than the first layer.

13. The first layer has an area ratio of spherical particles to metal particles of 50% or more and 70% or less. The stacked electronic component according to claim 12, wherein the second layer has an area ratio of spherical particles to metal particles of 97.5% or more.

14. The area ratio occupied by metal particles in the first layer is 60% or more and 70% or less. The laminated electronic component according to claim 12, wherein the area ratio occupied by metal particles in the second layer is 70% or more and 90% or less.

15. The spherical particles have a ratio of the length of the minor axis to the length of the major axis of 1.45 or less. The laminated electronic component according to claim 12, wherein the plate-like particles have a ratio of the length of the minor axis to the length of the major axis of 1.95 or more.

16. The first layer is also placed in the upper region, The stacked electronic component according to claim 12, wherein the second layer is arranged on the first layer in the upper region.

17. The stacked electronic component according to claim 16, wherein the average thickness in the second direction in the upper region of the first layer is thinner than the average thickness in the second direction in the lower region.

18. The stacked electronic component according to claim 12, wherein the first layer and the second layer are arranged spaced apart from each other.

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