Die bonding method for adapting the die fixing device to the angle of the substrate

Abstract

This invention provides a die bonding method that adapts the die fixing device to the angle of the substrate. [Solution] The die bonding method includes the steps of: installing a die fixing device in the chamber of a mobile mounting device; bringing the side of the top of the die fixing device into contact with the bottom of the mobile mounting device; adsorbing the die by the negative pressure passing through the opening at the bottom of the mobile mounting device; and applying positive pressure to the top of the die fixing device by the mobile mounting device; A step of moving the mobile mounting device above the substrate and aligning the die with the die mounting area, A step of moving the mobile mounting device downwards, bringing the die into contact with the die mounting area, and applying a reaction force provided from the substrate to the die fixing device via the die, In a positive pressure environment, the process includes floating the die fixing device within the chamber and opening by a reaction force, and adapting it to the angle of the substrate until the die is completely attached to the die mounting area.

Description

Technical Field

[0001] The present invention relates to a die bonding method, and particularly to a die bonding method for adapting a die fixing device to the angle of a substrate.

Background Art

[0002] Integrated circuits are manufactured on semiconductor wafers through multiple processes by batch production, and the wafers are further cut into a plurality of dies. In other words, a die is a body of a small integrated circuit made of semiconductor material and not encapsulated. The plurality of cut dies are neatly attached to a carrier device, and the die fixing device sequentially transfers the plurality of dies onto a substrate to perform subsequent processing steps.

[0003] However, in the conventional die bonding method, a connecting rod is used to move the die fixing device, and the quality of die bonding is easily affected by the orbital accuracy (rigidity) of the connecting rod. When the die fixing device applies pressure, a lateral component force is generated and applied to the die, so the angle and position at which the die is fixed to the die placement area on the substrate may deviate.

[0004] Furthermore, some substrates are inclined with respect to the die, and the angle of the die fixing device is limited by the moving placement device, so the die fixing device cannot apply force evenly to the die and the die placement area.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The main object of the present invention is to provide a die bonding method for adapting a die fixing device to the angle of a substrate, in which the angle and position at which the die is fixed to the die placement area are very accurate.

[0006] Another object of the present invention is to provide a die bonding method for adapting a die fixing device to the angle of a substrate, which applies force more evenly to the die and the die placement area. [Means for solving the problem]

[0007] To achieve the aforementioned objectives, the present invention provides: (a) a step of capturing an image of at least one first positioning tag in the die mounting area of ​​a substrate using a first image capture unit; (b) a step of installing a die fixing device in the chamber of a mobile mounting device, wherein the side of the top of the die fixing device abuts against the bottom of the mobile mounting device, the height of the chamber is greater than the thickness of the top of the die fixing device, the width of the chamber is greater than the width of the top of the die fixing device, the bottom of the die fixing device attracts the die by negative pressure through an opening in the bottom of the mobile mounting device, the diameter of the opening is greater than the width of the bottom of the mobile mounting device, and the mobile mounting device provides positive pressure to the top of the die fixing device; and (c) a step of capturing an image of at least one second positioning tag of the die using a second image capture unit; d) A die bonding method for adapting a die fixing device to the angle of a substrate, comprising the steps of (e) moving the mobile mounting device above the substrate and aligning the die with the die mounting area based on an image of at least one first positioning tag in the die mounting area and an image of at least one second positioning tag on the die using a control unit; (f) moving the mobile mounting device downward so that the die is in contact with the die mounting area, such that there is an angle between the die and the substrate that is greater than or equal to 0 degrees and less than 90 degrees, and a reaction force provided by the substrate is applied to the die fixing device via the die; and (g) in the positive pressure environment, the reaction force causes the die fixing device to float within the chamber and the opening, adapting it to the angle of the substrate until the die is completely attached to the die mounting area.

[0008] Furthermore, in step (b), the through-hole of the mobile mounting device communicates with the chamber and the external space.

[0009] Furthermore, the through-hole may be provided on the top of the mobile mounting device, or on both the top and side of the mobile mounting device.

[0010] Furthermore, in step (b), the negative pressure is provided by the exhaust pipe of the mobile mounting device, which penetrates the top of the mobile mounting device and the top and bottom of the die fixing device.

[0011] Furthermore, in step (b), the through-hole at the top of the mobile mounting device communicates with the chamber and the external space, the exhaust pipe penetrates the through-hole, and the diameter of the through-hole is larger than the outer diameter of the exhaust pipe.

[0012] Furthermore, in step (b), the positive pressure is provided by having the multiple intake pipes of the mobile mounting device pass through the top of the mobile mounting device and communicate with the chamber, and align with the top of the die fixing device.

[0013] Furthermore, step (b) generates the positive pressure by supplying gas to the chamber through the plurality of intake pipes using a gas supply device.

[0014] Furthermore, in step (b), the plurality of intake pipes are installed surrounding the top of the mobile mounting device.

[0015] Furthermore, in step (b), the film is fixed to the moving mounting device and in contact with the top surface of the top of the die fixing device.

[0016] Furthermore, in step (b), the exhaust pipe of the mobile mounting device penetrates the top of the mobile mounting device, the film, and the top and bottom of the die fixing device, and the negative pressure is supplied from the exhaust pipe. [Effects of the Invention]

[0017] The advantages of the present invention are that a positive pressure can be provided to the die fixing device by the movable mounting device, and sufficient space is provided for the die fixing device by the chamber and opening. In a positive pressure environment, the reaction force provided by the substrate causes the die fixing device to float within the chamber and opening, allowing it to rotate or be attached flat to adapt to the angle of the substrate. As a result, the angle and position in which the die is fixed to the die mounting area are highly accurate and no displacement occurs.

[0018] Furthermore, even if the substrate is inclined with respect to the crystal grains (i.e., the angle is greater than 0 degrees and less than 90 degrees), since the angle of the die fixing device is not limited by the moving placement device, the die fixing device can apply force more evenly to the die and the die placement area.

Brief Description of the Drawings

[0019] [Figure 1] It is a flowchart of the method according to the present invention. [Figure 2] It is a schematic diagram of step S10 of the first embodiment of the method according to the present invention. [Figure 3] It is a schematic diagram of steps S20 and S30 of the first embodiment of the method according to the present invention. [Figure 4] It is a cross-sectional view taken along line IV-IV of FIG. 3. [Figure 5] It is a schematic diagram of the connection relationship between the moving placement device, the vacuum device and the gas supply device of the present invention. [Figure 6] It is a schematic diagram of the connection relationship between the first image capture unit, the second image capture unit and the control unit of the present invention. [Figure 7] It is a schematic diagram of step S40 of the first embodiment of the method according to the present invention. [Figure 8] It is a schematic diagram of step S40 of the first embodiment of the method according to the present invention. [Figure 9] It is a schematic diagram of steps S50 and S60 of the first embodiment of the method according to the present invention. [Figure 10] It is a schematic diagram of steps S50 and S60 of the first embodiment of the method according to the present invention. [Figure 11] It is a schematic diagram of step S10 of the second embodiment of the method according to the present invention. [Figure 12] It is a schematic diagram of steps S20 and S30 of the second embodiment of the method according to the present invention. [Figure 13] It is a schematic diagram of step S40 of the second embodiment of the method according to the present invention. [Figure 14] It is a schematic diagram of step S40 of the second embodiment of the method according to the present invention. [Figure 15] This is a schematic diagram of steps S50 and S60 of a second embodiment of the method according to the present invention. [Figure 16] This is a schematic diagram of steps S50 and S60 of a second embodiment of the method according to the present invention. [Figure 17] This is a schematic diagram of steps S20 and S30 of a third embodiment of the method according to the present invention. [Modes for carrying out the invention]

[0020] Embodiments of the present invention will be described in more detail below with reference to the drawings and reference numerals, so that those skilled in the art can implement them after studying this specification.

[0021] Figure 1 is a flowchart of the method according to the present invention. Figure 2 is a schematic diagram of step S10 of the first embodiment of the method according to the present invention. Figure 3 is a schematic diagram of steps S20 and S30 of the first embodiment of the method according to the present invention. Figure 4 is a cross-sectional view taken along line IV-IV in Figure 3. Figure 5 is a schematic diagram of the connection relationship between the mobile mounting device 40, the vacuum device and the gas supply device of the present invention. Figure 6 is a schematic diagram of the connection relationship between the first image capture unit 10, the second image capture unit 60 and the control unit 70 of the present invention.

[0022] Figures 7 and 8 are schematic diagrams of step S40 of the first embodiment of the method according to the present invention. Figures 9 and 10 are schematic diagrams of steps S50 and S60 of the first embodiment of the method according to the present invention. The present invention provides a die bonding method for adapting a die fixing device to the angle of a substrate, and includes the steps described below.

[0023] Step S10: As shown in Figures 1 and 2, the first image capture unit 10 captures images of the two first positioning tags 211 on the die mounting area 21 of the substrate 20.

[0024] Step S20: As shown in Figures 1, 3, 4, and 5, the die fixing device 30 is installed inside the chamber 43 of the mobile mounting device 40, the side of the top 31 of the die fixing device 30 abuts against the bottom 42 of the mobile mounting device 40, the height of the chamber 43 is greater than the thickness of the top 31 of the die fixing device 30, the width of the chamber 43 is greater than the width of the top 31 of the die fixing device 30, the bottom 32 of the die fixing device 30 passes through the opening 421 of the bottom 42 of the mobile mounting device 40 and attracts the die 50 with negative pressure 441, the diameter of the opening 421 is greater than the width of the bottom 42 of the mobile mounting device 40 and positive pressure 451 is provided by the mobile mounting device 40 and applied to the top surface of the top 31 of the die fixing device 30.

[0025] Step S30: As shown in Figures 1 and 3, the second image capture unit 60 captures images of the two second positioning tags 51 on the die 50.

[0026] Step S40: As shown in Figures 1, 6, 7, and 8, the control unit 70 moves the mobile mounting device 40 above the substrate 20 and aligns the die 50 with the die mounting area 21 based on the images of the multiple first positioning tags 211 on the die mounting area 21 and the images of the multiple second positioning tags 51 on the die 50.

[0027] Step S50: As shown in Figures 1 and 9, the movable mounting device 40 is moved downward, bringing one side of the die 50 into contact with one side of the die mounting section 21, so that there is an angle θ between the die 50 and the substrate 20 that is greater than 0 degrees and less than 90 degrees, and a reaction force F provided by the substrate 20 is applied to the die fixing device 30 via the die 50.

[0028] Step S60: As shown in Figures 1, 9, and 10, in a positive pressure environment 451, the reaction force F causes the die fixing device 30 to float and rotate within the chamber 43 and opening 421, adapting to the angle of the substrate 20 until the die is completely attached to the die mounting area.

[0029] In this process, during step S40, the angle θ is equal to 0 degrees; during step S50, the bottom surface of the die 50 contacts the surface of the die placement area 21; and during step S60, in a positive pressure environment 451, the reaction force F causes the die fixing device 30 to float within the chamber 43 and opening 421, flattening it and adapting it to the angle of the substrate.

[0030] As a result, the present invention can provide positive pressure 451 to the die fixing device 30 via the movable mounting device 40, and the chamber 43 and opening 421 provide sufficient space for the die fixing device 30. In the positive pressure environment 451, the reaction force F provided from the substrate 20 causes the die fixing device 30 to float within the chamber 43 and opening 421, allowing it to rotate or flatten and adapt to the angle of the substrate 20. This ensures that the angle and position at which the die 50 is fixed to the die mounting section 21 are highly accurate and no misalignment occurs.

[0031] Furthermore, even if the substrate 20 is tilted relative to the die 50 (i.e., the angle is greater than 0 degrees and less than 90 degrees), the movable mounting device 40 does not restrict the angle of the die fixing device 30, so the die fixing device 30 can apply force more evenly to the die 50 and the die mounting section 21.

[0032] Furthermore, during the movement of the mobile mounting device 40, the present invention provides positive pressure 451 through the mobile mounting device 40 and applies it to the top 31 of the die fixing device 30, thereby preventing the die fixing device 30 from shaking. In addition, the present invention prevents the die 50 from detaching from the die fixing device 30 by attracting the die 50 with negative pressure 441.

[0033] In the first embodiment, in step S20, as shown in Figures 3 and 4, a through-hole 411 in the top 41 of the mobile mounting device 40 communicates with the chamber 43 and the outside space. Specifically, the chamber 43 is not sealed. Furthermore, the positive pressure 451 of the mobile mounting device 40 is constantly formed from the gas entering the chamber 43. If the chamber 43 were sealed, it could explode due to excessive pressure. If the chamber 43 is not sealed, the gas inside the chamber 43 can escape to the outside space through the through-hole 411, maintaining a constant pressure in the chamber 43 and preventing it from exploding due to excessive pressure.

[0034] In the first embodiment, in step S20, as shown in Figures 3 and 4, a negative pressure 441 is provided by the exhaust pipe 44 of the mobile mounting device 40, which penetrates the top 41 of the mobile mounting device 40 and the top 31 and bottom 32 of the die fixing device 30. Specifically, as shown in Figure 5, the vacuum device 80 generates a vacuum by extracting air through the exhaust pipe 44, thereby providing a negative pressure 441. As shown in Figure 10, the exhaust pipe 44 is a deformable hose. However, the exhaust pipe 44 may be a rigid, non-deformable tube.

[0035] Preferably, in step S20, as shown in Figures 3 and 4, the exhaust pipe 44 passes through the through-hole 411 and the diameter of the through-hole 411 is larger than the outer diameter of the exhaust pipe 44. This allows the present invention to reduce the cost of drilling other holes for the mobile mounting device 40 to pass the exhaust pipe 44 through. Furthermore, the exhaust pipe 44 does not affect the outflow of gas from the chamber 43 to the outside space through the through-hole 411.

[0036] In the first embodiment, in step S20, as shown in Figures 3 and 4, a plurality of intake pipes 45 of the mobile mounting device 40 pass through the top 41 of the mobile mounting device 40 and communicate with the chamber 43, and are aligned with the top of the die fixing device 30, thereby providing a positive pressure 451. Specifically, as shown in Figure 5, the gas supply device 90 supplies gas to the chamber 43 via the plurality of intake pipes 45 to generate a positive pressure 451. The plurality of intake pipes 45 are deformable hoses. However, the plurality of intake pipes 45 may also be rigid, non-deformable pipes. This allows the positive pressure 451 provided from the plurality of intake pipes 45 to be applied evenly to the top 31 of the die fixing device 30, and to apply force more evenly to the die 50 and the die mounting section 21.

[0037] Preferably, in step S20, as shown in Figures 3 and 4, the plurality of intake pipes 45 are installed surrounding the top 41 of the movable mounting device 40. This allows the positive pressure 451 provided by the plurality of intake pipes 45 to be applied more evenly to the top 31 of the die fixing device 30, and to apply force more evenly to the die 50 and the die mounting section 21.

[0038] Figure 11 is a schematic diagram of step S10 of the second embodiment of the method according to the present invention. Figure 12 is a schematic diagram of steps S20 and S30 of the second embodiment of the method according to the present invention. Figures 13 and 14 are schematic diagrams of step S40 of the second embodiment of the method according to the present invention. Figures 15 and 16 are schematic diagrams of steps S50 and S60 of the second embodiment of the method according to the present invention.

[0039] As shown in Figures 11 to 16, the difference between the second embodiment and the first embodiment is that in step S20, the film 100 is fixed to the movable mounting device 40 and in contact with the top surface of the top 31 of the die fixing device 30, and the exhaust pipe 44 penetrates the film 100. Compared to the first embodiment, because the film 100 is in contact with the top surface of the top 31 of the die fixing device 30, the positive pressure 451 can be applied more evenly by the top 31 of the die fixing device 30 through the film 100, and the force can be applied more evenly to the die 50 and the die mounting section 21.

[0040] Figure 17 is a schematic diagram of steps S20 and S30 of a third embodiment of the method according to the present invention. As shown in Figure 17, the difference between the third embodiment and the first embodiment is that a plurality of through-holes 411 are provided on the top 41 and sides of the movable mounting device 40, and the through-holes 411 on the sides of the movable mounting device 40 can similarly make the chamber 43 unsealed, thereby achieving the same effect.

[0041] The above are preferred embodiments of the present invention and do not limit the scope of the embodiments of the present invention. That is, all equivalent variations and modifications according to the claims of the present invention are included within the scope of the claims of the present invention. [Explanation of Symbols]

[0042] 10. First Image Capture Unit 20 circuit boards 21 Die mounting section 211 First positioning tag 30 Die fixing device 31 Top 32 Bottom 40 Mobile mounting device 41 Top 411 Through-hole 42 Bottom 421 Aperture 43 Chambers 44 Exhaust pipe 441 Negative pressure 45 Intake pipe 451 Positive pressure 50 Dies 51 Second positioning tag 60 Second Image Capture Unit 70 Control Unit 80 Vacuum equipment 90 Gas supply equipment 100 film F reaction force S10~S60 process θ angle

Claims

1. (a) A step of capturing an image of at least one first positioning tag in the die mounting area of ​​the substrate using a first image capture unit, (b) A step of installing a die fixing device in the chamber of a mobile mounting device, wherein the side of the top of the die fixing device abuts against the bottom of the mobile mounting device, the height of the chamber is greater than the thickness of the top of the die fixing device, the width of the chamber is greater than the width of the top of the die fixing device, the bottom of the die fixing device holds the die by negative pressure through an opening in the bottom of the mobile mounting device, the diameter of the opening is greater than the width of the bottom of the mobile mounting device, and the mobile mounting device provides positive pressure to the top of the die fixing device, (c) A step of capturing an image of at least one second positioning tag of the die using a second image capture unit, (d) A step of moving the mobile mounting device above the substrate and aligning the die with the die mounting area based on an image of at least one first positioning tag in the die mounting area and an image of at least one second positioning tag on the die, (e) A step of moving the movable mounting device downward, bringing the die into contact with the die mounting area, such that there is an angle between the die and the substrate that is greater than or equal to 0 degrees and less than 90 degrees, and a reaction force provided by the substrate is applied to the die fixing device via the die, (f) In the positive pressure environment, the process of floating the die fixing device within the chamber and the opening by the reaction force and adapting it to the angle of the substrate until the die is completely attached to the die mounting area, including, A die bonding method that adapts the die fixing device to the angle of the substrate.

2. In process (b), The through-hole of the mobile mounting device communicates with the chamber and the external space. A die bonding method for adapting the die fixing device described in claim 1 to the angle of a substrate.

3. The through-hole is provided on the top of the mobile mounting device, or the through-hole is provided on the top and side of the mobile mounting device. A die bonding method for adapting the die fixing device described in claim 2 to the angle of the substrate.

4. In process (b), The negative pressure is provided by the top of the mobile mounting device and the exhaust pipe of the mobile mounting device, which penetrates the top and bottom of the die fixing device. A die bonding method for adapting the die fixing device described in claim 1 to the angle of a substrate.

5. In process (b), The through-hole at the top of the mobile mounting device communicates with the chamber and the external space, the exhaust pipe passes through the through-hole and the diameter of the through-hole is larger than the outer diameter of the exhaust pipe, A die bonding method for adapting the die fixing device described in claim 4 to the angle of the substrate.

6. In process (b), The multiple intake pipes of the mobile mounting device pass through the top of the mobile mounting device and communicate with the chamber, and are aligned with the top of the die fixing device, thereby providing the positive pressure. A die bonding method for adapting the die fixing device described in claim 1 to the angle of a substrate.

7. In process (b), The gas supply device provides gas to the chamber through the plurality of intake pipes to generate the positive pressure. A die bonding method for adapting the die fixing device described in claim 6 to the angle of the substrate.

8. In process (b), The plurality of intake pipes are installed surrounding the top of the mobile mounting device. A die bonding method for adapting the die fixing device described in claim 6 to the angle of the substrate.

9. In process (b), The film is fixed to the moving mounting device and is in contact with the top surface of the top of the die fixing device. A die bonding method for adapting the die fixing device described in claim 1 to the angle of a substrate.

10. In process (b), The exhaust pipe of the mobile mounting device penetrates the top of the mobile mounting device, the film, and the top and bottom of the die fixing device, and the negative pressure is provided from the exhaust pipe. A die bonding method for adapting the die fixing device described in claim 9 to the angle of a substrate.

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