Connection structure for electric wires, manufacturing method thereof, and assembly of electric wires
The wire connection structure addresses tilted wire positions by using a fixing and sealing member to align and secure electric wires with varying diameters, enabling high-density connections and precise manufacturing processes.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- HIRAKAWA HEWTECH
- Filing Date
- 2026-05-12
- Publication Date
- 2026-07-29
AI Technical Summary
Existing methods for connecting electric wires result in tilted positions due to residual bending stress, making high-density electrical connections difficult, especially with varying wire diameters and increasing integration demands in electronic components.
A wire connection structure that fixes the relative positions of multiple electric wires with different outer diameters using a fixing member and sealing member, ensuring parallel alignment and watertight sealing, and a manufacturing method involving wire-tidying jigs and resin molding to secure precise connections.
Enables high-density electrical connections between wire terminals and connectors or circuit boards, maintaining wire position stability and facilitating simultaneous cutting, stripping, and connecting processes with precision.
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Figure 2026123290000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a connection structure for electric wires, a manufacturing method thereof, and an electric wire assembly.
Background Art
[0002] In recent years, a manufacturing method of a transmission cable with a connector has been proposed to solve problems such as skew due to displacement in the longitudinal direction of the core wire and pitch displacement in the terminal processing of the transmission cable (see, for example, Patent Document 1).
[0003] The manufacturing method of the transmission cable with a connector described in Patent Document 1 cuts a round transmission cable in which a plurality of insulated wires are covered with an outer covering layer into a predetermined length. In the end region of the transmission cable, the outer covering layer is removed by a predetermined length, and the end tips of the plurality of insulated wires exposed to the outside are abutted against the abutting portion of the wire alignment jig, and the insulated wires are fitted into the concave portion of the wire alignment jig to perform wire alignment. The insulated wire is fixed with a fixing means (a tape with an adhesive, or a cured material by an adhesive or resin molding) at a position close to the wire alignment jig, the wire alignment jig is removed, the tip of the core wire is soldered to the corresponding cable connection terminal of the connector wiring board, and the fixing means is removed. Thereby, the transmission cable and the connector wiring board are conductively connected.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] According to the conventional example described above, since the insulated wires drawn from a single round cable are fixed by a fixing mechanism, each insulated wire is fixed in a tilted state (residual bending stress) within the fixing mechanism. Therefore, when the wire arranging jig is removed, the position of the tip of the core wire may shift due to the bending stress, making it difficult to achieve high-density electrical connection of the core wire terminals. Furthermore, in recent years, with the increasing integration and multi-functionality of semiconductors incorporated into electronic components and electronic devices, there has been a demand for higher density of connectors and terminals (also called pads) on circuit boards used for communication between semiconductors and the outside, as well as for communication using various types of wires with different applications and outer diameters.
[0006] The object of the present invention is to provide a connection structure for electric wires, a method for manufacturing the same, and an electric wire assembly that enables high-density electrical connection between the exposed core wire terminals in the end region of electric wires, cables, etc., and the terminals of the object to be connected. [Means for solving the problem]
[0007] [1] A wire connection structure for electrically connecting the ends of multiple core wires, each exposed by stripping the insulation from the end region of multiple parallel wires, to the corresponding connection portions of multiple terminals arranged on a circuit board, The system includes a fixing member formed to contact the outer circumferential surface of the multiple electric wires near the end region, in a state where the multiple electric wires are arranged parallel to each other in the vicinity of the end region, thereby fixing the relative positions between the electric wires. The aforementioned multiple wires include multiple wires with different outer diameters, The aforementioned fixing member is a wire connection structure that fixes the relative positions between multiple wires with different outer diameters. [2] The connection structure for electric wires according to [1], wherein the position of the center line of each of the multiple electric wires with different outer diameters in the thickness direction of the substrate differs according to the outer diameter. [3] The wire connection structure according to [2], wherein the plurality of wires with different outer diameters are in contact with the outer surface of each core wire and are arranged such that the contacts facing the substrate coincide between the wires. [4] The wire connection structure according to [1], further comprising a sealing member that covers the fixing member and the substrate together and seals the connection portion in a watertight manner. [5] A manufacturing method for producing a connection structure for electric wires described in any one of [1] to [3] above, A pair of wire-tidying jigs, each having a plurality of wire-tidying grooves formed to correspond to the outer diameter of each of the plurality of wires, are arranged at a predetermined distance from each other. The plurality of electric wires are placed in the corresponding wire-tied grooves such that the vicinity of the end region is located between the pair of wire-tied jigs, and the plurality of electric wires are tied parallel to each other in the end region. A fixing member is formed between the pair of wire jigs so as to contact the outer circumferential surface near the end regions of the plurality of electric wires, thereby fixing the relative positions of the electric wires. Remove the pair of wire shaping jigs from the plurality of wires, A method for manufacturing a wire connection structure, comprising: cutting the plurality of wires at a predetermined length from the fixing member; stripping the coating from the end regions of the cut wires to expose the core wires; and connecting the exposed ends of the core wires to the corresponding terminal connection portions arranged on the substrate, performed before or after forming the fixing member. [6] Multiple parallel power lines and A connection target having a circuit board with multiple terminals to which the ends of multiple core wires, each with their respective end regions stripped of their insulation, are electrically connected, The system includes a fixing member formed to contact the outer circumferential surface of the multiple electric wires near the end region, in a state where the multiple electric wires are arranged parallel to each other in the vicinity of the end region, thereby fixing the relative positions between the electric wires. The aforementioned multiple wires include multiple wires with different outer diameters, The aforementioned fixing member is a wire assembly that fixes the relative positions between multiple wires of different outer diameters. [Effects of the Invention]
[0008] According to the present invention, high-density electrical connection becomes possible between the exposed core wire terminals in the end region of electric wires, cables, etc., and the terminals of the object to be connected. [Brief explanation of the drawing]
[0009] [Figure 1] Figure 1 is a plan view showing a connection structure for electric wires according to the first embodiment of the present invention. [Figure 2] Figure 2 is a cross-sectional view taken along line AA in Figure 1. [Figure 3] Figure 3 is a cross-sectional view along line BB in Figure 2. [Figure 4] Figure 4 is a plan view showing multiple insulated wires arranged using a pair of wire-arranging jigs. [Figure 5] Figure 5(a) is a front view showing an example of a wire tidying jig, Figure 5(b) is a detailed view of section C in Figure 5(a), and Figure 5(c) shows the wire tidying jig shown in Figure 5(b) with insulated wires placed in the wire tidying grooves. [Figure 6] Figure 6 shows an example of a mold for a fixed member, where (a) is a cross-sectional view along the DD line in (b), (b) is a cross-sectional view along the X direction, and (c) is a cross-sectional view along the EE line in (b). [Figure 7] Figure 7 is a plan view of the fixing member formed between the wire-laying jigs. [Figure 8] Figure 8 is a plan view showing the cutting process for multiple insulated wires. [Figure 9] Figure 9 is a plan view showing the stripping process of multiple insulated wires. [Figure 10] Figure 10 is a front view of the main part of the wire-tied jig according to modified examples 1 to 4. [Figure 11] Figure 11 is a perspective view showing an example of an insulated wire used in a connection structure for electric wires according to a second embodiment of the present invention. [Figure 12] Figures 12(a) and (b) are front views of the wire tidying tool used in the second embodiment, viewed from the end of the insulated wire, and Figure 12(c) is a front view of the wire tidying tool according to the fifth modification. [Figure 13]FIG. 13 is a cross-sectional view along the Y direction of the fixing member according to the second embodiment. [Figure 14] FIG. 14 is a plan view showing a connection structure of electric wires according to the third embodiment of the present invention. [Figure 15] FIG. 15 is a cross-sectional view corresponding to FIG. 3. [Figure 16] FIG. 16 is a plan view showing a connection structure of electric wires according to the fourth embodiment of the present invention. [Figure 17] [[ID=]12]FIG. 17 is a cross-sectional view of the main part corresponding to FIG. 3. [Figure 18] FIG. 18 is a cross-sectional view of electric wires according to the fifth embodiment of the present invention.
MODE FOR CARRYING OUT THE INVENTION
[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, components having substantially the same function are denoted by the same reference numerals, and redundant description thereof is omitted.
[0011] [First Embodiment] FIG. 1 is a plan view showing a connection structure of electric wires according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1, and FIG. 3 is a cross-sectional view taken along line B-B of FIG. 2.
[0012] Figures 1 and 2 show the case where a connector to be connected is connected to one end of multiple wires. The connection target is not limited to connectors; it may also be a circuit board or other connection target. Examples of connectors to be connected include those that connect wires to a card edge circuit board, those that connect wires to a circuit board on which plug connectors or receptacle connectors are mounted, and those to which wires are directly connected to the terminals of a connector (pin header, socket terminals, cup terminals, etc.). Mounting types of plug connectors and receptacle connectors to circuit boards include SMT (surface mount), DIP (soldering by passing the lead of the component through a hole in the circuit board), and press-fit (press-fitting into a hole in the circuit board). Examples of circuit boards to be connected include PCBs (printed circuit boards), FPCs (flexible printed circuit boards), circuit boards, control boards, and relay boards to which wires are directly connected. In addition, connectors may be connected to both ends of multiple wires, circuit boards may be connected to both ends, or a connector may be connected to one end and a circuit board to the other end. Furthermore, in Figures 1 and 2, the solder used to electrically connect the core wire and shield terminal to the terminal (also called a pad) is omitted from the illustration. In this specification and the drawings, the longitudinal direction of the wires is defined as the X direction, the direction in which multiple wires are arranged in parallel is defined as the Y direction, and the direction perpendicular to the X and Y directions is defined as the Z direction.
[0013] Furthermore, in this specification, "electric wires" is a comprehensive concept encompassing electric wires and cables, and includes those composed of a single electric wire (also called an insulated electric wire) and cables in which multiple electric wires are bundled together and covered with an insulating outer sheath. Also, in this specification, "end region" refers to the region where the insulation of electric wires is stripped in order to connect them to the terminals of the object to which they are connected (connectors, circuit boards, etc.). A configuration in which a connector or circuit board is connected to one or both ends of multiple electric wires constitutes an electric wire assembly.
[0014] The wire connection structure 10 comprises multiple (four in the figure) first to fourth layers 10a to 10d (see Figure 2) each containing multiple insulated wires 1A (only the third layer 10c is shown in Figure 1) arranged in parallel in the Y direction, a card edge substrate 2 to which the ends of the multiple insulated wires 1A are connected by solder (not shown) and the tip edge portion 2a becomes a card edge connector, multiple (for example, four) fixing members 3A to 3D (collectively referred to as "fixing member 3") that fix the relative positions between the insulated wires 1A for each layer, and a sealing member 4 (shown with dashed lines in Figure 1) that covers the fixing members 3A to 3D and watertightly covers the connection portions between the core wires 11a of the multiple insulated wires 1A and the corresponding terminals 221 to 228. Here, the insulated wire 1A is an example of a wire.
[0015] As a method for fixing the vicinity of the end regions of multiple parallel-arranged electric wires, methods such as sandwiching multiple cables (insulated wires) between two ground bars (e.g., Japanese Patent Publication No. 2008-181817) or sandwiching them between two tapes (e.g., Japanese Patent Publication No. 2019-67519) are known. In the method of sandwiching with ground bars, the gap between the ground bar and the cable is filled with solder, so if the outer diameters of the cables are different, the gap between the cable and the ground bar will be uneven, and a uniform bonding force cannot be obtained between the cables. In the method of sandwiching with tape, if the outer diameters of the cables are different, the contact area between the smaller diameter cable and the tape will be small, and combined with the difference in weight of the cables, a uniform bonding force cannot be obtained between the cables. Furthermore, in the method of fixing insulated wires drawn from a single round cable using a fixing means (Japanese Patent Publication No. 2007-317676), each insulated wire is fixed in an inclined state (a state in which bending stress remains) within the fixing means. Therefore, when the wire arranging jig is removed, there is a risk that the position of the tip of the core wire may shift due to the bending stress.
[0016] The fixing member 3 of this embodiment is formed by resin molding so as to contact the outer surfaces of multiple insulated wires 1A when multiple insulated wires 1A are arranged parallel to each other using a pair of wire arranging jigs (see Figure 6), as described later, thereby fixing the relative positions between the insulated wires 1A. By forming such a fixing member 3, no bending stress remains in the insulated wires 1A, so displacement of the tip of the core wire 11a after the wire arranging jigs are removed can be suppressed. Furthermore, since the fixing member 3 is formed to contact the outer surfaces of the insulated wires 1A, insulated wires 1A with different outer diameters can be fixed at any pitch.
[0017] In this embodiment, one end of multiple insulated wires 1A is shown, but both ends may be connected to a connector, for example, to a card edge substrate 2. Also, multiple insulated wires 1A may be arranged in parallel in the Y direction in one, two, three, or five or more layers of the four first to fourth layers 10a to 10d. Furthermore, in this embodiment, terminals 221 to 228 (see Figure 2) of the card edge substrate 2 of the connector are shown as an example of a connection target for the core wire 11a of the insulated wire 1A, but terminals of substrates other than the connector may also be used. In addition, the sealing member 4 does not cover the entire fixing members 3A to 3D, but it may cover the entire area. Furthermore, if there is no need to watertightly cover the connection portion between the core wire 11a and the shield conductor 13a and the terminals 221 to 228 with the sealing member 4, the sealing member 4 may not be provided.
[0018] (Insulated wire configuration) Multiple insulated wires 1A have the same outer diameter and are arranged in parallel at the same pitch in the Y direction on the fixing member 3. The insulated wire 1A is, for example, a coaxial wire and comprises a core wire 11a formed from a conductor, an insulating layer 12a covering the outer circumference of the core wire 11a, a shield conductor 13a formed on the outer circumference of the insulating layer 12a, and an outer sheath 14a made of insulating material covering the outer circumference of the shield conductor 13a. The core wire 11a may be a single wire or may be made of multiple strands twisted together. The insulating layer 12a may be made of, for example, polyethylene resin (low-density polyethylene, high-density polyethylene, etc.), fluororesin, etc. The shield conductor 13a may be made by spirally winding conductive tape over the outer surface of the insulating layer 12a, or by attaching it vertically along the longitudinal direction of the insulated wire 1A, or by horizontal winding or braiding of strands. The outer sheath 14a may be made of, for example, fluororesin, polyvinyl chloride (PVC), polyester resin, etc.
[0019] Furthermore, the multiple insulated wires 1A may have different outer diameters. Also, in the fixing member 3, the multiple insulated wires 1A may be arranged in parallel at different pitches in the Y direction according to the outer diameter of the insulated wires, and the outer sheaths 14a of adjacent insulated wires 1A may be in contact with each other. In addition, the insulated wires 1A may be other insulated wires such as single wires. Furthermore, the wires fixed by one fixing member 3 may consist only of insulated wires as in this embodiment, but may also consist of a mixture of insulated wires and cables, or only cables, or may include other linear members such as drain wires in addition to insulated wires and cables. Also, in Figures 1 and 2, the multiple insulated wires 1A are arranged parallel to each other in the Y direction near the fixing member 3, but at locations away from the fixing member 3, they do not have to be arranged parallel to each other in the Y direction, and may be bundled in an elliptical or circular shape using cable ties, for example.
[0020] The core wires 11a of the insulated wires 1A arranged in the first layer 10a and the second layer 10b have their tips positioned at a distance L1 from the fixing member 3, while the core wires 11a of the insulated wires 1A arranged in the third layer 10c and the fourth layer 10d have their tips positioned at a distance L2 from the fixing member 3 (where L2 > L1).
[0021] (Card edge board configuration) The card edge substrate 2 comprises a base material 21 formed from an insulating material, a plurality of first terminals 221, a first ground terminal 222, a plurality of second terminals 223, and a second ground terminal 224 formed on the surface 21a of the base material 21, and a plurality of third terminals 225, a third ground terminal 226, a plurality of fourth terminals 227, and a fourth ground terminal 228 formed on the back surface 21b of the base material 21.
[0022] Multiple first terminals 221 and first ground terminals 222 formed on the surface 21a correspond to multiple insulated wires 1A arranged on the first layer 10a. Multiple second terminals 223 and second ground terminals 224 formed on the back surface 21b correspond to multiple insulated wires 1A arranged on the second layer 10b. Multiple third terminals 225 and third ground terminals 226 formed on the surface 21a correspond to multiple insulated wires 1A arranged on the third layer 10c. Multiple fourth terminals 227 and fourth ground terminals 228 formed on the back surface 21b correspond to multiple insulated wires 1A arranged on the fourth layer 10d. In this embodiment, the number of first terminals 221 and the number of third terminals 225 are the same, but may be different. In this embodiment, the Y-direction positions of the first terminals 221 and the Y-direction positions of the third terminals 225 are the same, but may be different. In this embodiment, the number of second terminals 223 and the number of fourth terminals 227 are the same, but may be different. In this embodiment, the Y-direction positions of the second terminal 223 and the Y-direction positions of the fourth terminal 227 are the same, but they may be different.
[0023] Furthermore, the card edge substrate 2 has an edge portion 2a which becomes a card edge connector that is inserted into a female connector (not shown) at its leading end. Multiple edge terminals 23A are formed on the surface 21a of the base material 21 of the edge portion 2a, and multiple edge terminals 23B are formed on the back surface 21b of the base material 21 of the edge portion 2a.
[0024] The card edge substrate 2 is connected to terminals 221 to 228 formed on the front surface 21a and back surface 21b of the base material 21 and edge terminals 23A and 23B formed on the front surface 21a and back surface 21b of the edge portion 2a via wiring patterns (not shown) formed on the front surface 21a and back surface 21b of the base material 21.
[0025] (Configuration of fixing members) The fixing member 3 has a rectangular parallelepiped extending in the Y direction and a width W in the X direction. The fixing member 3 is formed from a resin material (e.g., polyamide resin, ABS, etc.) by resin molding (e.g., injection molding, compression molding, extrusion molding, calendering, transfer molding, lamination molding, etc.). The resin constituting the fixing member 3 is not limited to resin for injection molding, but may also be a heat-sensitive adhesive (hot melt adhesive, etc.), a moisture-curing adhesive (reactive hot melt adhesive, etc.), a photocurable resin (ultraviolet-curable resin, visible light-curable resin, etc.), a two-component reactive adhesive, etc., and the fixing member 3 may be formed by coating and curing these adhesives. Alternatively, the parts divided by reference lines 103a to 103d may be formed by resin molding or machining, and these may be joined by adhesive or fusion with an insulated wire 1A in between. When polyamide resin is used as the resin for injection molding, low-pressure injection molding at low pressure and low temperature (e.g., around 200°C) is possible because polyamide resin has a low melt viscosity.
[0026] The width W in the X direction is preferably a certain width so that the centerlines 1a of the insulated wires 1A remain parallel to each other after the wire arranging jig 100A is removed. Specifically, when the maximum outer diameter of the wires is Dmax, for example, Dmax ≤ W, 1.5Dmax ≤ W, 2Dmax ≤ W, etc. are preferred. The thickness in the Z direction is preferably greater than or equal to the maximum outer diameter of the wires, but the outer sheath of the wires may be partially exposed.
[0027] As shown in Figure 3, the fixing member 3A corresponding to the first layer 10a and the fixing member 3B corresponding to the second layer 10b have the same external dimensions and are formed so that the reference lines 103a and 103b are eccentrically positioned with respect to the center of the thickness in the Z direction. The fixing member 3C corresponding to the third layer 10c and the fixing member 3D corresponding to the fourth layer 10d have the same external dimensions and are formed so that the reference lines 103c and 103d are positioned at the center of the thickness in the Z direction. Note that the fixing members 3A and 3B corresponding to the first layer 10a and the second layer 10b may have the same external dimensions as the fixing members 3C and 3D corresponding to the third layer 10c and the fourth layer 10d. This allows the mold for forming the fixing members 3 to be shared.
[0028] (Configuration of sealing member) The sealing member 4 has a rectangular parallelepiped that covers the area including the four fixing members 3A to 3D, the connection portion between the core wire 11a of the insulated wire 1A and the terminals 221, 223, 225, and 227 of the card edge substrate 2, and the connection portion between the shield conductor 13a of the insulated wire 1A and the ground terminals 222, 224, 226, and 228 of the card edge substrate 2. The sealing member 4 can be formed in the same way as the fixing member 3. That is, the sealing member 4 is formed, for example, from a resin material (e.g., polyamide resin, ABS, etc.) by resin molding (e.g., injection molding, compression molding, extrusion molding, calendering, transfer molding, lamination molding, etc.). Note that the resin constituting the sealing member 4 is not limited to resin for injection molding, and the sealing member 4 may be formed by coating and curing a heat-sensitive adhesive (hot melt adhesive, etc.), a moisture-curing adhesive (reactive hot melt adhesive, etc.), a photocurable resin (ultraviolet-curable resin, visible light-curing resin, etc.), a two-component reactive adhesive, etc. Alternatively, the card edge substrate 2 may be divided at a position corresponding to the center of its thickness, and each portion may be formed by resin molding or machining, and the fixing members 3A to 3D may be sandwiched between these portions and joined by adhesive or fusion. When polyamide resin is used as the resin for injection molding, low-pressure injection molding at low pressure and low temperature (for example, around 200°C) is possible because polyamide resin has a low melt viscosity.
[0029] (Method for connecting the ends of insulated wires) Next, an example of a method for connecting the ends of insulated wires will be described with reference to Figures 4 to 9. Figure 4 is a plan view showing a state in which multiple insulated wires have been arranged using a pair of wire arranging jigs. Figure 5(a) is a front view showing an example of a wire arranging jig, Figure 5(b) is a detailed view of section C of Figure 5(a), and Figure 5(c) shows the state in which insulated wires have been placed in the wire arranging groove of the wire arranging jig shown in Figure 5(b). Figure 6 shows an example of a mold for a fixing member, where (a) is a cross-sectional view along the DD line of (b), (b) is a cross-sectional view along the X direction, and (c) is a cross-sectional view along the EE line of (b). Figure 7 is a plan view of a fixing member formed between wire arranging jigs. Figure 8 is a plan view showing the cutting process of multiple insulated wires. Figure 9 is a plan view showing the stripping process of multiple insulated wires. The following description will focus on the case where the insulated wires are cut and stripped after the fixing member 3 has been formed, but the fixing member 3 may also be formed after the insulated wire 1A has been cut and stripped. When the pitch of the insulated wires in the Y direction is relatively small, the cutting and stripping of the insulated wires can be performed more accurately by forming the fixing member 3 after cutting and stripping the wires.
[0030] (1) Arrangement of wire arranging jigs As shown in Figure 4, the first jig 100Aa (see Figure 5(a)) of the pair of wire tidying jigs 100A is arranged in the X direction at intervals d equal to the width W. As shown in Figure 5(a), the wire tidying jig 100A comprises a first jig 100Aa with a plurality of wire tidying grooves 101a formed therein, and a second jig 100Ab which is a flat rectangular bar shape without wire tidying grooves. As shown in Figure 5(b), the wire tidying grooves 101a are substantially U-shaped, with a depth (Z direction) and width (Y direction) equal to the outer diameter of the insulated wire 1A, and the bottom surface is formed in a semicircular shape centered on the wire tidying groove center 102a. The radius of the bottom surface of the wire tidying groove 101a is 1 / 2 of the outer diameter of the insulated wire 1A. In addition, each wire tidying groove center 102a is set on a single reference line 103 extending in the Y direction. As a result, the center line 1a of each insulated wire 1A after wiring coincides with the center 102a of the wiring groove. The interval d is an example of a predetermined distance.
[0031] Note that the center line 1a of the insulated wire 1A does not need to be aligned with the reference line 103. For example, the wire shaping groove 101a may be formed so that the tangents that contact the outer surface of the core wire 11a and face the card edge substrate 2 coincide among the insulated wires 1A. This makes it easier to connect the core wire 11a to terminals 221, 223, 225, and 227, as the tangents that contact the outer surface of the core wire 11a and face the card edge substrate 2 coincide among the insulated wires 1A.
[0032] (2) Arrangement of insulated wires Next, the insulated wires 1A are placed in each of the wire-tied grooves 101a of the first jig 100Aa of the pair of wire-tied jigs 100A. The insulated wires 1A are then pressed down from above with the second jig 100Ab, and the second jig 100Ab is attached to the first jig 100Aa with a fastening member (e.g., a bolt) 104 (see Figure 7). At this stage, the ends of the insulated wires 1A are not yet exposed. Alternatively, instead of the fastening member 104, a press from above or below or from the left or right for attaching the mold to the molding machine, or a press using a vise or toggle clamp mechanism may be used.
[0033] (3) Formation of fixing members Next, as shown in Figure 6, a mold 110 for a fixing member, which has a cavity 113 (first space) corresponding to the fixing member 3, is placed around the insulated wire 1A between a pair of wire arranging jigs 100A. The mold 110 for the fixing member is used as a master mold, and the wire arranging jigs 100A are used as inserts to be fitted into the master mold. The mold 110 for the fixing member comprises a first mold 111 and a second mold 112, which have a two-part structure. Note that the sprue and other parts of the mold 110 for the fixing member are not shown in the illustration. A pair of wire arranging jigs 100A with multiple insulated wires 1A arranged inside the first mold 111, and the second mold 112 is attached to the first mold 111.
[0034] Next, molten first resin (for example, polyamide resin) is injected into the cavity 113 (first space), and after the first resin cools and solidifies, the solidified molded product is released from the fixing member mold 110. At this time, the wire shaping jig 100A is removed from the insulated wire 1A. This forms, for example, the fixing member 3C for the third layer 10c. The fixing member 3D for the fourth layer 10d can also be formed using the fixing member mold 110 shown in Figure 6, but the fixing member 3A for the first layer 10a and the fixing member 3B for the second layer 10b use fixing member molds corresponding to their shapes. Also, as shown in Figure 5(c), there is a gap between the wire shaping groove 101a and the insulated wire 1A, and molten resin may enter there, but this part can be removed by cutting or the like after the fixing member 3C is formed.
[0035] (4) Cutting insulated wires Next, as shown in Figure 8, the insulated wire 1A is cut at a distance L2 from the fixing member 3C to prepare the insulated wire 1A before stripping for the third layer 10c. Similarly, the insulated wire 1A is arranged and the fixing member 3D is formed, and the insulated wire 1A is cut at a distance L2 from the fixing member 3D to prepare the insulated wire 1A before stripping for the fourth layer 10d. Similarly, the insulated wire 1A is arranged and the fixing member 3A is formed, and the insulated wire 1A is cut at a distance L1 from the fixing member 3A to prepare the insulated wire 1A before stripping for the first layer 10a. Similarly, the insulated wire 1A is arranged and the fixing member 3B is formed, and the insulated wire 1A is cut at a distance L1 from the fixing member 3B to prepare the insulated wire 1A before stripping for the second layer 10b.
[0036] (5) Stripping of insulated wires Next, the insulated wire 1A is stripped, and as shown in Figure 9, the shield conductor 13a, insulating layer 12a, and core wire 11a are sequentially exposed from the outer sheath 14a. This produces, for example, an insulated wire 1A for the third layer 10c. Similarly, the insulated wires 1A for the first layer 10a, second layer 10b, and fourth layer 10d are also stripped to produce insulated wires 1A for the first layer 10a, second layer 10b, and fourth layer 10d.
[0037] (6) Connection of core wires, etc. Next, solder the core wire 11a of the insulated wire 1A of the first layer 10a to the first terminal 221, and solder the shield conductor 13a to the first ground terminal 222. Solder the core wire 11a of the insulated wire 1A of the second layer 10b to the second terminal 223, and solder the shield conductor 13a to the second ground terminal 224. Solder the core wire 11a of the insulated wire 1A of the third layer 10c to the third terminal 225, and solder the shield conductor 13a to the third ground terminal 226. Solder the core wire 11a of the insulated wire 1A of the fourth layer 10d to the fourth terminal 227, and solder the shield conductor 13a to the fourth ground terminal 228.
[0038] (7) Formation of sealing member Next, a mold for a sealing member (not shown) having a second space corresponding to the sealing member 4 is placed around the card edge substrate 2 and the fixing member 3. Then, molten second resin (for example, polyamide resin) is injected into the second space, and after the second resin cools and solidifies, the mold for the sealing member is released. This forms a sealing member 4 made of the second resin.
[0039] (Effects of the first embodiment) This embodiment provides the following effects. (a) Since the vicinity of the end regions of multiple insulated wires 1A are fixed parallel to each other by fixing members 3, even if the outer diameters of the insulated wires 1A are different, high-density electrical connection is possible between the terminals of the exposed core wires 11a in the end region of the insulated wires 1A and the terminals of the object to be connected (connector, circuit board, etc.). (b) After fixing multiple insulated wires 1A with the fixing member 3, processing such as cutting the ends, stripping the insulation, and connecting can be performed simultaneously with high precision and ease. (c) If the external dimensions of the fixing member 3 are the same, the size and position of the wire lining groove 101a of the wire lining jig 100A can be changed to accommodate wires with different structures and outer diameters, variations in the number of wires, and variations in the wire spacing. Furthermore, when forming the sealing member 4, the combined external dimensions of the four fixing members 3A to 3D can be made the same, so the injection molding die for the sealing member 4 can be shared regardless of the configuration of the wires.
[0040] (Modifications 1 to 4) Figures 10(a) to (d) are front views of the main parts of the wire shaping jig 100A according to Modifications 1 to 4, respectively. Modification 1 shown in Figure 10(a) is characterized in that the wire shaping groove 101a formed in the first jig 100Aa is rectangular. According to Modification 1, the processing of the wire shaping groove 101a becomes easier. Modification 2 shown in Figure 10(b) is characterized in that a semicircular wire shaping groove 101a with a radius of 1 / 2 the outer diameter of the insulated wire 1A is formed in both the first jig 100Aa and the second jig 100Ab. According to Modification 2, the wire shaping groove can be made to fit tightly to the wires even if the outer diameters of the wires are different. Modification 3 shown in Figure 10(c) is characterized in that the wire shaping groove 101a shown in Figure 10(b) is rectangular. According to Modification 3, the processing of the wire shaping groove 101a becomes easier. Modification 4, shown in Figure 10(d), is a modification in which, in Figure 10(a), a portion of the wire shaping grooves 101a in the first jig 100Aa is made deeper. A protrusion 100a is formed in the second jig 100Ab corresponding to the deepened wire shaping groove 101a. According to Modification 4, by changing the depth of the wire shaping groove 101a, the center line 1a of the insulated wire 1A can be shifted from the reference line 103 depending on the object to be connected.
[0041] [Second Embodiment] Figure 11 is a perspective view showing an example of an insulated wire used in a wire connection structure according to the second embodiment of the present invention. In the first embodiment, a case was described in which multiple insulated wires 1A with the same outer diameter were used as multiple wires arranged in the first to fourth layers 10a to 10d. In this embodiment, however, multiple insulated wires 1A to 1D with different outer diameters and structures are used in any of the first to fourth layers 10a to 10d, or in all of the layers 10 to 10d. The following description will focus on the differences from the first embodiment.
[0042] Insulated wire 1A is a coaxial wire, similar to the first embodiment. Insulated wires 1B, 1C, and 1D are single wires with different structures and outer diameters. Insulated wire 1B is, for example, a single wire with a relatively small outer diameter and comprises a core wire 11b formed from a conductor and an outer sheath 12b formed from an insulating material that covers the outer circumference of the core wire 11b. Insulated wire 1C is, for example, a single wire with a medium outer diameter and comprises a core wire 11c formed from a conductor and an outer sheath 12c formed from an insulating material that covers the outer circumference of the core wire 11c. Insulated wire 1D is, for example, a single wire with a relatively large outer diameter and comprises a core wire 11d formed from a conductor and an outer sheath 12d formed from an insulating material that covers the outer circumference of the core wire 11d. The core wires 11b, 11c, and 11d are also thicker in proportion to the outer diameter of the outer sheaths 14b, 14c, and 14d.
[0043] Figure 12 is a front view of the wire tidying jig used in the second embodiment, viewed from the end side of the insulated wire. The wire tidying jig 100B according to the second embodiment comprises a first jig 100Ba and a second jig 100Bb, each having semicircular wire tidying grooves 101a to 101d with a radius of half the outer diameter of the insulated wires 1A to 1D that are arranged, as shown in Figure 12(a). The wire tidying grooves 101a to 101d are formed in a semicircular shape with the wire tidying groove centers 102a to 102d. Furthermore, each wire tidying groove center 102a to 102d is set on a single reference line 103 extending in the Y direction. As a result, as shown in Figure 12(b), the centerlines 1a to 1d of each insulated wire 1A to 1D after tidying coincide with the wire tidying groove centers 102a to 102d.
[0044] Note that the centerlines 1a to 1d of the insulated wires 1A to 1D do not need to be aligned with the reference line 103. For example, the wire shaping grooves 101a to 101d may be formed so that the tangents that contact the outer surface of the core wires 11a to 11d and face the card edge substrate 2 coincide between the insulated wires 1A to 1D. In this case, as shown in Figure 10(d), the wire shaping jig 100B can be prepared by forming a rectangular wire shaping groove on the first jig 100Ba and forming protrusions on the second jig 100Bb where necessary. As a result, the tangents that contact the outer surface of the core wires 11a to 11d and face the card edge substrate 2 coincide between the insulated wires 1A to 1D, making electrical connection of the core wires 11a to 11d to terminals 221, 223, 225, and 227 easier.
[0045] (Variation 5) Figure 12(c) is a front view of the main part of the wire tidying jig 100B according to Modification 5. The wire tidying jig 100B of Modification 5 shown in the figure comprises a first jig 100Ba having rectangular wire tidying grooves 101a to 101d formed thereon according to the outer diameter of the insulated wires 1A to 1D, and a second jig 100Bb which is a flat rectangular bar shape and does not have wire tidying grooves formed thereon. The wire tidying groove 101a is formed with the same depth (Z direction) and width (Y direction) as the outer diameter of the insulated wires 1A to 1D to be arranged. According to Modification 5, the processing of the wire tidying grooves 101a to 101d becomes easier. In the case of Modification 5, the positions of the centerlines 1a to 1d of the insulated wires 1A to 1D in the Z direction will differ according to the outer diameter of the insulated wire.
[0046] Figure 13 is a cross-sectional view of the fixing member 3 along the Y direction according to the second embodiment. Note that the insulated wires 1A to 1D are shown in a simplified manner in this figure. The fixing member 3 is formed as follows. That is, a pair of wire shaping jigs 100B shown in Figure 12 are arranged in the X direction with a spacing d equal to the width W, similar to the first embodiment, and insulated wires 1A to 1D corresponding to the wire shaping grooves 101a to 101d are arranged. Next, a mold for the fixing member having a cavity (first space) corresponding to the fixing member 3 is placed around the insulated wires 1A to 1D between the pair of wire shaping jigs 100B. As described in the first embodiment, a two-part structure is used as the master mold for the fixing member, and the wire shaping jigs 100B are used as inserts fitted into the master mold. Next, molten first resin (for example, polyamide resin) is injected into the cavity (first space), and after the first resin cools and solidifies, the first mold is released. This forms the fixing member 3 shown in Figure 13.
[0047] According to the second embodiment, the same effects as the first embodiment are achieved, and even when the outer diameter and arrangement pitch of the insulated wires are different, the insulated wires 1A to D can be fixed in parallel by the fixing member 3, just as in the first embodiment. This enables high-density electrical connection between the ends of the core wires 11a to 11d and the terminals 221, 223, 225, and 227 of the object to be connected.
[0048] [Third Embodiment] Figure 14 is a plan view showing a connection structure for electric wires according to the third embodiment of the present invention. Figure 15 is a cross-sectional view corresponding to Figure 3. In the first embodiment, the insulated wires 1A of the first to fourth layers 10a to 10d were arranged at the same position in the Y direction as shown in Figure 3. However, in this embodiment, as shown in Figure 15, the insulated wires 1A of the first layer 10a and the second layer 10b are arranged between the insulated wires 1A of the third layer 10c and the fourth layer 10d. The following description will focus on the differences from the first embodiment.
[0049] The card edge substrate 2, like the first embodiment, is provided with a first terminal 221, a first ground terminal 222, a second terminal 223, a second ground terminal 224, a third terminal 225, a third ground terminal 226, a fourth terminal 227, and a fourth ground terminal 228. However, the first terminal 221 is positioned between the third terminal 225 in the Y direction, and the second terminal 223 is positioned between the fourth terminal 227 in the Y direction. In the figure, the number of first terminals 221 and second terminals 223 is one less than the number of third terminals 225 and fourth terminals 227, but the number may be the same.
[0050] According to the third embodiment, in the Y direction, the first terminal 221 is positioned between the third terminal 225 and the second terminal 223 is positioned between the fourth terminal 227, which facilitates the connection of the insulated wire 1A.
[0051] [Fourth Embodiment] Figure 16 is a plan view showing a connection structure for electric wires according to the fourth embodiment of the present invention. Figure 17 is a cross-sectional view of the main part corresponding to Figure 3. Note that Figure 16 shows the insulated electric wire 1A of the third layer 10c. In this embodiment, the number of insulated electric wires 1A is increased compared to the first embodiment. The following description of this embodiment will focus on the differences from the first embodiment.
[0052] As shown in Figure 16, the third terminals 225 formed on the surface 21a of the card edge substrate 2 are arranged at a predetermined pitch on the same line along the Y direction.
[0053] The multiple insulated wires 1A constituting the third layer 10c are divided into multiple insulated wires 1A constituting the third first layer 10ca and multiple insulated wires 1A constituting the third second layer 10cb, such that the pitch of the insulated wires 1A is wider (for example, twice) than the pitch of the third terminal 225. Note that the number of divisions is not limited to two, and may be three or more. The multiple insulated wires 1A constituting the third first layer 10ca and the multiple insulated wires 1A constituting the third second layer 10cb are examples of wire groups.
[0054] As shown in Figure 17, the fixing member 3C for the third layer 10c is divided into a first member 3a corresponding to the third first layer 10ca and a second member 3b corresponding to the third second layer 10cb. The number of divisions of the fixing member 3C is not limited to two, similar to the multiple insulated wires 1A that constitute the third layer 10c, but may be three or more. The first member 3a and the second member 3b have contact surfaces 30 that come into contact with each other. The first member 3a fixes the multiple insulated wires 1A that constitute the third first layer 10ca at a position close to its own contact surface 30. The second member 3b fixes the multiple insulated wires 1A that constitute the third second layer 10cb at a position close to its own contact surface 30. The portions of the first member 3a and the second member 3b where the insulated wires 1A are close to the contact surfaces 30 are thin-walled portions 31. The thickness of the thin-walled portion 31 is not particularly limited, but may be 1 mm or less, 0.1 mm or less, or even 0 mm.
[0055] The first member 3a and the second member 3b are each formed in the same manner as the fixing member 3C of the first embodiment. With the contact surfaces 30 of the first member 3a and the second member 3b in contact with each other, the sealing member 4 is formed in the same manner as the first embodiment.
[0056] According to the fourth embodiment, after soldering the core wires 11a of multiple insulated wires 1A constituting the third single layer 10ca to the corresponding third terminals 225, the core wires 11a of multiple insulated wires 1A constituting the third double layer 10cb can be soldered to the corresponding third terminals 225, thereby increasing the mounting density of terminals arranged on the same line in the Y direction.
[0057] In addition, although the fourth embodiment described the third layer 10c, the same configuration as the third layer 10c may be applied to the fourth layer 10d, or to the first layer 10a and the second layer 10b.
[0058] [Fifth Embodiment] Figure 18 is a cross-sectional view of the wires according to the fifth embodiment of the present invention. In the first to fourth embodiments, only insulated wires were used as the wires, but in the fifth embodiment, a plurality of insulated wires and the cable shown in Figure 18 are used as the wires.
[0059] The cable 15 used in the fifth embodiment comprises a plurality (for example, two) of insulated wires 1E, a drain wire 16, a tape shield 17 that covers the outer circumference of the plurality of insulated wires 1E and the drain wire 16 together, and an outer sheath 18 made of insulating material that covers the outer circumference of the tape shield 17. The insulated wire 1E comprises a core wire 11e made of a conductor and an insulating layer 12e that covers the outer circumference of the core wire 11e. The tape shield 17 is, for example, a conductive tape that is spirally wound horizontally. The tape shield 17 is an example of a shield layer.
[0060] The fixing member 3 is positioned on a reference line 103 along the Y direction, with the centerlines 1e of the two insulated wires 1E and the centerline 16a of the drain wire 16 aligned thereto. It is formed by resin molding so as to contact the outer surface of the outer sheath 18 of the other insulated wires and cables 15, thereby fixing the relative positions between the wires.
[0061] According to the fifth embodiment, since the cable 15 is a side-drain type in which the drain wire 16 is positioned on the sides of the two insulated wires 1E, the cross-sectional shape of the cable 15 can be made into an elongated oval shape that is long in the Y direction, compared to a center-drain type in which the drain wire 16 is positioned to contact the outer surfaces of both insulated wires 1E. This allows the thickness of the fixing member 3 in the Z direction to be reduced. In addition, the drain wire 16 can be electrically connected to the terminal without bending it in the Y direction.
[0062] Although embodiments of the present invention have been described above, the embodiments of the present invention are not limited to those described above, and various modifications and implementations are possible. [Explanation of Symbols]
[0063] 1A~1E…Insulated wire, 1a~1e…Center wire, 2…Card edge substrate, 2a…Edge part, 3, 3A~3D…Fixing member, 3a…First member, 3b…Second member, 4…Sealing member, 10…Connection structure for wires, 10a…First layer, 10b…Second layer, 10c…Third layer, 10ca…Third 1st layer, 10cb…Third 2nd layer, 10d…Fourth layer, 11a~11e…Core wire, 12a, 12e…Insulation layer, 13a…Shield conductor, 14a~14d…Outer sheath, 15…Cable, 16…Drain wire, 16a…Center wire, 17…Tape shield, 18…Outer sheath, 21…Base material, 21a…Surface, 23A, 23B…Edge terminal 30...Contact surface, 31...Thin-walled section, 100A, 100B...Wire shaping jig, 100Aa, 100Ba...First jig, 100Ab, 100Bb...Second jig, 100a...Protrusion, 101a~101d...Wire shaping groove, 102a...Center of wire shaping groove, 103, 103a~103d...Reference line, 104...Bolt, 110...Mold for fixing member, 111...First mold, 112...Second mold, 113...Cavity, 221...First terminal, 222...First ground terminal, 223...Second terminal, 224...Second ground terminal, 225...Third terminal, 226...Third ground terminal, 227...Fourth terminal, 228...Fourth ground terminal, d...Spacing, W...Width
Claims
1. A wire connection structure for electrically connecting the ends of multiple parallel wires, each with its insulation stripped from its end region to expose the core wires, to corresponding terminal connection points on a circuit board, The system includes a fixing member formed to contact the outer circumferential surface of the multiple electric wires near the end region, in a state where the multiple electric wires are arranged parallel to each other in the vicinity of the end region, thereby fixing the relative positions between the electric wires. The aforementioned multiple wires include multiple wires with different outer diameters, The aforementioned fixing member fixes the relative positions between multiple electric wires with different outer diameters. Connection structure for electrical wires.
2. The aforementioned multiple electric wires with different outer diameters have their centerlines positioned differently in the thickness direction of the substrate according to their outer diameters. The connection structure for electric wires according to claim 1.
3. The multiple wires with different outer diameters are arranged so that they are in contact with the outer surface of their respective core wires, and the tangents facing the substrate coincide among the wires. The connection structure for electric wires according to claim 2.
4. A sealing member that covers the fixing member and the substrate together and seals the connection portion in a watertight manner, The wire connection structure according to claim 1, further comprising the above.
5. A manufacturing method for producing a connection structure for electric wires according to any one of claims 1 to 3, A pair of wire-tidying jigs, each having a plurality of wire-tidying grooves formed to correspond to the outer diameter of each of the plurality of wires, are arranged at a predetermined distance from each other. The plurality of electric wires are placed in the corresponding wire-tied grooves such that the vicinity of the end region is located between the pair of wire-tied jigs, and the plurality of electric wires are tied parallel to each other in the end region. A fixing member is formed between the pair of wire jigs so as to contact the outer circumferential surface near the end regions of the plurality of electric wires, thereby fixing the relative positions of the electric wires. Remove the pair of wire shaping jigs from the plurality of wires, The process of cutting the plurality of wires at a predetermined length from the fixing member, stripping the insulation from the end portions of the cut wires to expose the core wires, and connecting the exposed ends of the core wires to the corresponding terminal connections on the substrate is performed either before or after forming the fixing member. A method for manufacturing connection structures for electric wires.
6. Multiple parallel power lines, A connection target having a circuit board with multiple terminals to which the ends of multiple core wires, each with their respective end regions stripped of their insulation, are electrically connected, The system includes a fixing member formed to contact the outer circumferential surface of the multiple electric wires near the end region, in a state where the multiple electric wires are arranged parallel to each other in the vicinity of the end region, thereby fixing the relative positions between the electric wires. The aforementioned multiple wires include multiple wires with different outer diameters, The aforementioned fixing member fixes the relative positions between multiple electric wires with different outer diameters. Electrical wire assembly.