Microfluidic devices

Abstract

The present invention provides a microfluidic device and a method for manufacturing the same, which facilitate the miniaturization of microfluidic devices that can be connected to flow channels. [Solution] The microfluidic device according to the present disclosure comprises a first substrate having a first surface and a first side surface, and a second substrate having a second surface and a second side surface, wherein the first substrate and the second substrate are joined at the first surface and the second surface, and the first side surface and the second side surface are connected at the joined first surface and second surface, and the first substrate includes a groove having an extending direction along the first surface, and a first cavity that is in fluid communication with the groove and has a first open end on the first side surface, wherein in a plan view of the first surface, the first open end has a width greater than the groove width of the groove, and the inside of the first cavity has a screw groove arranged from the first open end toward the groove.

Description

Technical Field

[0001] The present disclosure relates to a microchannel device, and specifically to a microchannel device having a substrate laminated structure.

Background Art

[0002] A microchannel device is a device including a minute channel through which a fluid flows. The fluid is a general term for liquids and gases. A microchannel device can generally be formed of a material such as glass, resin, silicone, etc. into an adhesive-free substrate laminated structure. A microchannel device using a glass substrate has excellent chemical resistance and environmental resistance, and thus has attracted attention in the fields of medicine, biology, etc.

[0003] A microchannel device is used, for example, for mixing, separating, analyzing or reacting a fluid. For example, a system formed by connecting the channels of a plurality of microchannel devices can replace a large chemical plant and perform analysis or reaction precisely and rapidly with a small channel system. A microchannel device with connectable channels includes, for example, the ultramicro droplet preparation device disclosed in Patent Document 1.

[0004] The ultramicro droplet preparation device of Patent Document 1 is composed of a laminated structure of three substrates including a plate-shaped channel forming body, an upper substrate and a lower substrate disposed with the channel forming body interposed therebetween. The channel formed on the surface of the central channel forming body communicates with a connection port provided on the side surface of the lower substrate through a communication path in the substrate thickness direction and is connected to an inflow channel or an outflow channel.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The ultra-fine droplet preparation device described in Patent Document 1 is constructed by stacking three substrates, and a connection port is provided on a substrate separate from the substrate on which the flow channels are formed, thereby connecting the flow channels to the outside. With such a configuration, a problem arises in that it is difficult to miniaturize the microfluidic device.

[0007] In light of these circumstances, this disclosure aims to provide a microfluidic device and a method for manufacturing the same that can facilitate the miniaturization of microfluidic devices to which flow channels can be connected. [Means for solving the problem]

[0008] To achieve the above objective, a microfluidic device according to one aspect of the present disclosure comprises a first substrate having a first surface and a first side surface, and a second substrate having a second surface and a second side surface, wherein the first substrate and the second substrate are joined at the first surface and the second surface, and the first side surface and the second side surface are connected at the joined first surface and second surface, and the first substrate includes a groove having an extending direction along the first surface, and a first cavity that is in fluid communication with the groove and has a first open end on the first side surface, wherein in a plan view of the first surface, the first open end has a width greater than the groove width of the groove, and the first cavity has a screw groove arranged from the first open end toward the groove.

[0009] To achieve the aforementioned objective, another aspect of the present disclosure provides a microfluidic device comprising: a first substrate having a first surface; a second substrate having a second surface; and a connecting member, wherein the first substrate and the second substrate are joined at the first surface and the second surface; the first substrate includes a first cavity having a groove having an extending direction along the first surface; a first open end on a first back surface opposite to the first surface; and a second open end on the first surface that is in fluid communication with the groove; in a plan view of the first surface, the first open end has a width greater than the groove width; the connecting member is fitted into the first cavity and includes a threaded hole penetrating at the first end and a hole communicating with the threaded hole and penetrating in the side wall, the first end being close to the first open end and the hole being in fluid communication with the groove.

[0010] Furthermore, in order to achieve the above objective, a method for manufacturing a microfluidic device according to one aspect of the present disclosure is a method for manufacturing a microfluidic device comprising a first substrate having a first surface and a first side surface, and a second substrate having a second surface and a second side surface, the method comprising: a substrate molding step including molding a groove having an extending direction along the first surface and a first cavity fluidly communicating with the groove onto the first substrate; stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other; and heating the stacked first substrate and second substrate to join the first surface and the second surface, and connecting the first side surface and the second side surface at the joined first surface and second surface, The substrate forming step includes, the first cavity having a first open end on a first side surface and having a semicircular cross-sectional shape when viewed from the first side surface, and in a plan view of the first surface, the first open end having a width greater than the groove width of the groove, and the substrate forming step includes, the second cavity having a second open end on a second side surface and having a semicircular cross-sectional shape when viewed from the second side surface, and the second cavity having screw grooves in at least a portion of the inner walls of the first cavity and the second cavity, and the substrate bonding step includes, stacking the first substrate and the second substrate, arranging the first substrate and the second substrate such that the first cavity and the second cavity face each other.

[0011] Furthermore, in order to achieve the above objective, a method for manufacturing a microfluidic device according to another aspect of the present disclosure is a method for manufacturing a microfluidic device comprising: a first substrate having a first surface and a first side surface; a second substrate having a second surface and a second side surface; and a connecting member having a screw hole, comprising: a substrate molding step including molding a groove having an extending direction along the first surface and a first cavity fluidly communicating with the groove onto the first substrate; stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other; and heating the stacked first substrate and second substrate to join the first surface and the second surface, and joining the first side surface and the second side surface to the joined first surface and second surface. The substrate bonding step includes, the first cavity having a first open end on a first side surface and, in a plan view of the first surface, the first open end having a width greater than the groove width of the groove, and the substrate forming step includes, the second cavity having a second open end on a second side surface, and the lamination of the first and second substrates in the substrate bonding step includes, the first and second substrates being positioned such that the first and second cavities face each other, and the connecting member being positioned between the first and second cavities such that the screw holes penetrate from the first and second open ends toward the groove.

[0012] Furthermore, in order to achieve the above objective, a method for manufacturing a microfluidic device according to yet another aspect of the present disclosure is a method for manufacturing a microfluidic device comprising a first substrate having a first surface, a second substrate having a second surface, and a connecting member, comprising a substrate molding step including molding a groove having an extending direction along the first surface and a first cavity fluidly communicating with the groove onto the first substrate, stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other, and heating the stacked first substrate and second substrate to bond the first surface and the second surface. The substrate bonding step includes stacking a first substrate and a second substrate, wherein the first cavity has a first open end on a first back surface opposite to the first surface and a second open end on the first surface that is in fluid communication with a groove, and in a plan view of the first surface, the first open end has a width greater than the groove width, and the substrate bonding step includes placing a connecting member in the first cavity, the connecting member having a screw hole through at the first end and a hole that communicates with the screw hole and penetrates at the side wall, the first end being positioned close to the first open end and the hole being in fluid communication with the groove. [Effects of the Invention]

[0013] According to one aspect of this disclosure, a microfluidic device or a method for manufacturing a microfluidic device can be easily miniaturized. [Brief explanation of the drawing]

[0014] [Figure 1] A schematic perspective view showing an example configuration of a microfluidic device according to Embodiment 1. [Figure 2A] Schematic cross-sectional view along the cutting line C1-C1 in Figure 1. [Figure 2B] Perspective view showing the substrate constituting the microfluidic device in Figure 1. [Figure 2C] Enlarged plan view showing area A1 in Figure 2B [Figure 3] A schematic enlarged cross-sectional view showing the connection portion of the microfluidic device according to Embodiment 1. [Figure 4]Schematic perspective view showing a configuration example of a microchannel device according to Embodiment 2 [Figure 5A] Schematic partial cross-sectional view taken along cutting line C2-C2 of FIG. 4 [Figure 5B] Perspective view showing a substrate constituting the microchannel device of FIG. 4 [Figure 5C] Enlarged plan view showing region A2 of FIG. 5B [Figure 6A] Schematic enlarged cross-sectional view showing a connection part of a microchannel device according to Embodiment 2 [Figure 6B] Schematic perspective view showing a connection member of the connection part according to Embodiment 2 [Figure 7] Schematic perspective view showing a configuration example of a microchannel device according to Embodiment 3 [Figure 8A] Schematic cross-sectional view taken along cutting line C3-C3 of FIG. 7 [Figure 8B] Perspective view showing a substrate constituting the microchannel device of FIG. 7 [Figure 8C] Enlarged plan view showing region A3 of FIG. 8B [Figure 9A] Schematic enlarged cross-sectional view showing a connection part of a microchannel device according to Embodiment 3 [Figure 9B] Schematic perspective view showing a connection member of the connection part according to Embodiment 3 [Figure 10] Schematic perspective view showing a configuration example of a microchannel device according to Embodiment 4 [Figure 11A] Exploded perspective view showing members constituting the microchannel device of FIG. 10 [Figure 11B] Enlarged plan view showing region A4 of FIG. 11A [Figure 11C] Enlarged plan view showing region A5 of FIG. 11A [Figure 12] Schematic enlarged cross-sectional view showing a connection part of a microchannel device according to Embodiment 4 [Figure 13] Flowchart showing an example of a manufacturing process of a microchannel device according to Embodiment 5 [Figure 14] Schematic diagram showing a configuration example of a molding device used for manufacturing a microchannel device according to Embodiment 5 [Figure 15A]A partial perspective view showing an example of a substrate manufactured through the substrate molding process. [Figure 15B] A partial perspective view showing an example of a microfluidic device fabricated through a substrate bonding process. [Figure 16A] A partial perspective view showing another example of a substrate manufactured through the substrate molding process. [Figure 16B] A partial perspective view showing another example of a microfluidic device fabricated via a substrate bonding process. [Figure 17A] A partial perspective view showing yet another example of a substrate manufactured through the substrate molding process. [Figure 17B] A partial perspective view showing yet another example of a microfluidic device fabricated through a substrate bonding process. [Modes for carrying out the invention]

[0015] According to a first aspect of the present disclosure, a microfluidic device is provided comprising a first substrate having a first surface and a first side surface, and a second substrate having a second surface and a second side surface, wherein the first substrate and the second substrate are joined at the first surface and the second surface, the first side surface and the second side surface are connected at the joined first surface and second surface, the first substrate includes a groove having an extending direction along the first surface, and a first cavity that is in fluid communication with the groove and has a first open end on the first side surface, in a plan view of the first surface, the first open end has a width greater than the groove width of the groove, and the first cavity has a screw groove arranged from the first open end toward the groove.

[0016] According to this embodiment, it is possible to easily miniaturize microfluidic devices that can be connected to flow channels on their sides.

[0017] According to a second aspect of the present disclosure, the present invention provides a microfluidic device as described in the first aspect, wherein the second substrate includes a second cavity having a second open end on a second side surface, the first cavity and the second cavity having a semicircular cross-sectional shape when viewed from the first and second side surfaces, a screw groove is formed in at least a portion of the inner wall of the first cavity, a screw groove substantially similar to the screw groove is formed in at least a portion of the inner wall of the second cavity, the first cavity and the second cavity are joined facing each other to form a joint cavity, the first open end and the second open end are connected facing each other to form an opening, and within the joint cavity, the screw grooves formed in the inner walls of the first cavity and the second cavity form a screw hole through which the opening penetrates toward the groove.

[0018] According to a third aspect of the present disclosure, the second substrate includes a second cavity having a second open end on a second side surface, the first cavity and the second cavity are joined facing each other to form a bonding cavity, the first open end and the second open end are connected facing each other to form an opening, and the second substrate further includes a connecting member fitted into the bonding cavity, the connecting member having a screw hole including a screw groove that penetrates from the opening toward a groove, provides the microfluidic device according to the first aspect.

[0019] According to a fourth aspect of this disclosure, the microfluidic device described in the third aspect is provided, wherein the connecting member has a length of at least half of its total length in the direction from the opening to the groove that is located within the bonding cavity.

[0020] A fifth aspect of the present disclosure provides a microfluidic device comprising a first substrate having a first surface, a second substrate having a second surface, and a connecting member, wherein the first substrate and the second substrate are joined at the first surface and the second surface, and the first substrate includes a first cavity having a groove having an extending direction along the first surface, a first open end on the first back surface opposite to the first surface, and a second open end on the first surface that is in fluid communication with the groove, and in a plan view of the first surface, the first open end has a width greater than the groove width, and the connecting member is fitted into the first cavity and includes a screw hole penetrating at the first end and a hole portion communicating with the screw hole and penetrating at the side wall, the first end being close to the first open end and the hole portion being in fluid communication with the groove.

[0021] According to this embodiment, it is possible to easily miniaturize microfluidic devices that can be connected via channels on a surface.

[0022] A sixth aspect of the present disclosure provides a microfluidic device according to the fifth aspect, wherein the second substrate includes a second cavity having a third open end on the second surface, and the first cavity and the second cavity are joined to each other at the second and third open ends.

[0023] According to a seventh aspect of this disclosure, a microfluidic device according to the fifth or sixth aspect is provided, wherein the first cavity has a tapered shape that narrows from the second opening end to the first opening end.

[0024] According to an eighth aspect of the present disclosure, a microfluidic device according to any one of the fifth to seventh aspects is provided, wherein the hole includes a notch in which a portion of the side wall is cut out.

[0025] According to the ninth aspect of this disclosure, the first substrate and the second substrate are made of glass, the coefficient of thermal expansion between the first substrate and the second substrate is α1 or greater, the connecting member is made of metal or ceramic, the coefficient of thermal expansion of the connecting member is α2, α1 > α2, and within a temperature range of 400°C to 600°C, α1 - α2 ≤ 3 × 10 -6A microfluidic device according to any one of the third to eighth embodiments is provided, satisfying / K.

[0026] According to the tenth aspect of this disclosure, the first substrate and the second substrate are made of a first resin, the coefficient of linear expansion between the first substrate and the second substrate is α3 or greater, the connecting member is made of a second resin, the coefficient of linear expansion of the connecting member is α4, α3 > α4, and within a temperature range of 100°C to 200°C, α3 - α4 ≤ 3 × 10 -6 A microfluidic device according to any one of the third to eighth embodiments is provided, satisfying / K.

[0027] According to an eleventh aspect of the present disclosure, a flow path system is provided comprising at least one microfluidic device as described in any one of the second to tenth aspects, at least one connecting member, and at least one tubular communicating member, wherein the connecting member includes a shaft portion having a perforation that penetrates axially and a threaded portion around the shaft portion, the threaded portion being screwed into a threaded hole in the microfluidic device, and the tubular communicating member being inserted into the perforation and being in fluid communication with a groove.

[0028] A twelfth aspect of the present disclosure relates to a method for manufacturing a microfluidic device comprising a first substrate having a first surface and a first side surface, and a second substrate having a second surface and a second side surface, comprising: a substrate forming step of molding a groove having an extending direction along the first surface and a first cavity fluidly communicating with the groove onto the first substrate; a substrate joining step of stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other, and heating the stacked first substrate and second substrate to join the first surface and the second surface, and connecting the first side surface and the second side surface at the joined first surface and second surface, wherein the first cavity is located on the first side surface The present invention provides a method for manufacturing a microfluidic device, wherein the first cavity has a first open end and a semicircular cross-sectional shape when viewed from a first side, and in a plan view of the first surface, the first open end has a width greater than the groove width of the groove, the substrate forming step includes molding a second cavity into a second substrate, which has a second open end on a second side and a semicircular cross-sectional shape when viewed from a second side, and molding substantially similar screw grooves into at least a portion of the inner walls of the first cavity and the second cavity, and the substrate bonding step includes stacking the first substrate and the second substrate, which includes arranging the first substrate and the second substrate such that the first cavity and the second cavity face each other.

[0029] According to this embodiment, it is possible to easily miniaturize microfluidic devices that can be connected to flow channels on their sides.

[0030] A thirteenth aspect of this disclosure relates to a method for manufacturing a microfluidic device comprising a first substrate having a first surface and a first side surface, a second substrate having a second surface and a second side surface, and a connecting member having a screw hole, the method comprising: a substrate forming step including molding a groove having an extending direction along the first surface and a first cavity fluidly communicating with the groove onto the first substrate; stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other; and a substrate joining step including heating the stacked first substrate and the second substrate to join the first surface and the second surface, and connecting the first side surface and the second side surface at the joined first surface and second surface. The present invention provides a method for manufacturing a microfluidic device, comprising: a first cavity having a first open end on a first side surface, and in a plan view of the first surface, the first open end having a width greater than the groove width of the groove; a substrate forming step comprising molding a second cavity having a second open end on a second side surface onto a second substrate; and a substrate bonding step comprising stacking the first substrate and the second substrate by arranging the first substrate and the second substrate such that the first cavity and the second cavity face each other, and arranging a connecting member between the first cavity and the second cavity such that the screw holes penetrate from the first and second open ends toward the groove.

[0031] According to this embodiment, it is possible to easily miniaturize microfluidic devices that can be connected to flow channels on their sides.

[0032] According to a fourteenth aspect of this disclosure, a method for manufacturing a microfluidic device comprising a first substrate having a first surface, a second substrate having a second surface, and a connecting member, comprising: a substrate molding step including molding a groove having an extending direction along the first surface and a first cavity fluidly communicating with the groove onto the first substrate; and a substrate bonding step including stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other, and heating the stacked first substrate and second substrate to bond the first surface and the second surface, wherein the first cavity is A microfluidic device manufacturing method is provided, comprising a first back surface opposite to one surface having a first open end, a second open end on the first surface having fluid communication with a groove, and in a plan view of the first surface, the first open end having a width greater than the groove width, and in the substrate bonding step, stacking the first substrate and the second substrate includes placing a connecting member in a first cavity, the connecting member including a screw hole penetrating at the first end and a hole communicating with the screw hole and penetrating in the side wall, the first end being positioned close to the first open end and the hole being positioned to fluidly communicate with the groove.

[0033] According to this embodiment, it is possible to easily miniaturize microfluidic devices that can be connected via channels on a surface.

[0034] A method for manufacturing a microfluidic device according to the 14th aspect of the present disclosure, wherein the substrate forming step further includes molding a second cavity having a third open end on a second surface onto a second substrate, and the substrate bonding step further includes stacking a first substrate and a second substrate such that the first and second substrates are bonded to each other at the second and third open ends.

[0035] Furthermore, by appropriately combining any of the above various embodiments, the effects of each can be achieved.

[0036] <<Embodiment>> The embodiments will be described in detail below, with reference to the drawings as appropriate. However, unnecessarily detailed explanations may be omitted. For example, detailed explanations of already well-known matters and redundant explanations of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily verbose and to facilitate understanding for those skilled in the art.

[0037] A microfluidic device and a method for manufacturing a microfluidic device according to embodiments of this disclosure will be described with reference to Figures 1 to 17B. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand this disclosure and are not intended to limit the subject matter described in the claims. In addition, elements in each figure are exaggerated to facilitate explanation. Substantially identical components in the drawings are denoted by the same reference numerals.

[0038] <Embodiment 1> (Configuration of microfluidic device 100) The configuration of the microfluidic device according to Embodiment 1 will be described with reference to Figures 1 to 3. Figure 1 is a schematic perspective view showing an example of the configuration of the microfluidic device 100 according to Embodiment 1. Figure 2A is a schematic cross-sectional view along the cutting line C1-C1 in Figure 1. Figure 2B is a perspective view showing the substrate 11 constituting the microfluidic device 100 in Figure 1. Figure 2C is an enlarged plan view showing region A1 in Figure 2B. Figure 3 is a schematic enlarged cross-sectional view showing the connection portion 51 of the microfluidic device 100 according to Embodiment 1.

[0039] As shown in Figures 1 and 2A, the microfluidic device 100 according to this embodiment 1 is constructed by stacking a first substrate 11 and a second substrate 12. In the microfluidic device 100 with a substrate stacking structure, the surface 11a of the first substrate 11 and the surface 12a of the second substrate 12 are arranged opposite each other and joined. The side surfaces 11A and 11B of the first substrate 11 and the side surfaces 12A and 12B of the second substrate 12 are connected at the joined surfaces 11a and 12a, respectively, forming the side ends 100A and 100B of the microfluidic device 100. Between the joined first substrate 11 and second substrate 12, a channel 21 and bonding cavities 31 and 32 communicating with the channel 21 are formed. The bonding cavities 31 and 32 each have openings 312 and 322 at the side ends 100A and 100B of the microfluidic device 100.

[0040] Figure 2A shows a cross-section of the channel 21 along the cutting line C1-C1 in Figure 1. As shown, the bonding cavities 31 and 32 communicate with the channel 21 at one end 311 and 321, and the other end forms an opening 312 and 322 at the side ends 100A and 100B of the microfluidic device 100. In this embodiment, screw holes are formed within the bonding cavities 31 and 32, penetrating from the openings 312 and 322 toward the channel 21. In other words, in this embodiment, the bonding cavities 31 and 32 constitute a connection part 51 for communicating the channel 21 with the outside, for example, an external device or channel. The connection part 51 will be described in detail later.

[0041] In the microfluidic device 100 according to this embodiment, the first substrate 11 and the second substrate 12 are formed similarly. Figure 2B shows the configuration of the substrates constituting the microfluidic device 100, with the first substrate 11 as an example. However, this disclosure is not limited thereto. The substrates constituting the microfluidic device 100 may have different configurations.

[0042] As shown in Figure 2B, the first substrate 11 has a groove 21A extending along the surface 11a and cavities 31A and 32A that are in fluid communication with the groove 21A. The cavities 31A and 32A each have open ends 312A and 322A on the side surfaces 11A and 11B of the first substrate 11, respectively.

[0043] Figure 2C shows an enlarged view of region A1 in Figure 2B, illustrating the configuration of cavities 31A and 32A in a plan view of the surface 11a of the first substrate 11, with cavity 31A as an example. As shown in Figure 2C, cavity 31A communicates with groove 21A at one end 311A, and the other end forms an open end 312A on the side surface 11A of the first substrate 11. In this embodiment, cavities 31A and 32A have a semicircular cross-sectional shape when viewed from the side surfaces 11A and 11B of the first substrate 11. Furthermore, a screw groove 41 is formed on the inner wall of cavity 31A, extending from the open end 312A toward groove 21A. The screw groove 41 may be formed on a part of the inner wall of the bonding cavity 31, or it may be formed on the entire inner wall of the bonding cavity 31. In a plan view of the surface 11a of the first substrate 11, the open end 312A has a width w1, and the groove 21A has a groove width t1, with the width w1 of the open end 312A being greater than the groove width t1. Although not shown, the cavity 32A may be configured similarly to the cavity 31A in this embodiment. In a plan view of the surface 11a of the first substrate, the open end 322A of the cavity 32A has a width w1 substantially equal to that of the open end 312A of the cavity 31A. However, the cavities 31A and 32A are not necessarily configured in the same way, and in a plan view of the surface 11a of the first substrate, the open ends 312A and 322A may have different widths.

[0044] As schematically shown in Figure 2A, in this embodiment, the surface 12a of the second substrate 12 has a groove 21B having an extending direction along the surface of the substrate, and cavities 31B and 32B that are in fluid communication with the groove 21B. The cavities 31B and 32B each have open ends 312B and 322B on the side surfaces 12A and 12B of the second substrate 12. The grooves 21A and 21B have substantially equal groove widths t1 on the surfaces 11a and 12a of the substrates to which the first substrate 11 and the second substrate 12 are joined. In this embodiment, the cavities 31B and 32B, like the cavities 31A and 32A, have a substantially semicircular cross-sectional shape when viewed from the side surfaces 12A and 12B of the second substrate 12. Furthermore, the open end 312B of cavity 31B has a width w1 substantially equal to the width of the open end 312A of cavity 31A on the surface 12a of the substrate, and the open end 322B of cavity 32B has a width substantially equal to the width of the open end 322A of cavity 32A on the surface 12a of the substrate. In this embodiment, the open ends 312A, 322A and the open ends 312B, 322B have substantially equal widths w1 on the surfaces 11a, 12a of the substrate. In addition, on the inner walls of cavities 31B, 32B, respectively, screw grooves (not shown) substantially similar to the screw grooves 41 formed on the inner walls of cavities 31A, 32A are formed, extending from the open ends 322B, 322B toward the groove 21B. In this specification, "substantially similar screw grooves" refers to, for example, screw grooves having substantially equal pitch threads and allowing, for example, the same bolt to be screwed in.

[0045] In this specification, "substantially similar" or "substantially identical" does not mean completely identical, but rather takes into account actual manufacturing tolerances, and may include, for example, an error of about ±10%, preferably an error of about ±5%.

[0046] The first substrate 11 and the second substrate 12 are joined at their surfaces 11a and 12a, so that grooves 21A and 21B are joined facing each other to form a flow channel 21. Cavities 31A and 32A and cavities 31B and 32B are joined facing each other to form joined cavities 31 and 32. At the side ends 100A and 100B of the microfluidic device 100, the open ends 312A and 322A and the open ends 322B and 322B are connected to each other to form openings 312 and 322. The formed openings 312 and 322 have a width w1 that is larger than the flow channel width t1 of the flow channel 21 formed by grooves 21A and 21B when viewed in plan on the surface of the substrate.

[0047] In this embodiment, the bonding cavities 31 and 32, composed of cavities 31A and 32A and cavities 31B and 32B, have a circular cross-sectional shape when viewed from the side ends 100A and 100B of the microfluidic device 100. Within the bonding cavities 31 and 32, screw grooves 41 formed on the inner walls of cavities 31A and 32A and cavities 31B and 32B are connected to each other, thereby forming screw holes that penetrate from openings 312 and 322 within the bonding cavities 31 and 32 toward the fluid channels 21.

[0048] In this embodiment, a flow path 21 has been described in which grooves 21A and groove 21B formed on the surfaces 11a and 12a of the substrate are joined together. However, this disclosure is not limited thereto. The flow path 21 may also be formed by a groove formed on one of the surfaces 11a and 12a of the substrate to be joined and the other surface, and the formed flow path may have any cross-sectional shape.

[0049] Furthermore, in this embodiment, the cavities 31A and 32A in the first substrate 11 and the cavities 31B and 32B in the second substrate 12 similarly have a semicircular cross-sectional shape, but the disclosure is not limited thereto. The cavities 31A and 32A and the cavities 31B and 32B may have different cross-sectional shapes, and the configured bonding cavity may have any cross-sectional shape when viewed from the side edge of the microfluidic device.

[0050] Furthermore, in this embodiment, the bonding cavities 31 and 32 are constructed by bonding cavities 31A and 32A and cavities 31B and 32B facing each other, but the disclosure is not limited thereto. For example, a cavity is formed on the surface of the first substrate that communicates with grooves constituting a flow path and has an open end on the side surface of the substrate, while the second substrate remains a flat surface without a cavity. The first substrate and the second substrate are then bonded on their surfaces, and a bonding cavity is formed between the cavity of the first substrate and the flat surface of the second substrate.

[0051] The formed bonding cavities 31 and 32 constitute the connection portion 51 of the microfluidic device 100 in this embodiment. The flow path 21 of the microfluidic device 100 can be fluidly connected to the outside at the side ends 100A and 100B via the connection portion 51. The connection portion 51 of this embodiment will be described in detail below with reference to Figure 3.

[0052] (Configuration of connection section 51) Figure 3 shows an example of a connecting member 71 that can be connected to the connecting portion 51 at the side end 100A of the microfluidic device 100. In this embodiment, the connecting portion 51 is composed of a bonding cavity 31 made up of cavities 31A and 31B, and is located between the first substrate 11 and the second substrate 12. As shown in the figure, the connecting portion 51 is in fluid communication with the flow path 21 at one end 311 of the bonding cavity 31, and has an opening 312 at the other end of the bonding cavity 31 at the side end 100A of the microfluidic device 100. In this embodiment, the connecting portion 51 has a screw hole 511 located inside the bonding cavity 31.

[0053] Although a chamfered tip 512 is provided at the tip of the screw hole 511 adjacent to the flow path 21 shown in Figure 3, this disclosure is not limited thereto. The tip of the screw hole 511 of the connecting portion 51 may have any shape.

[0054] The connecting member 71 connected to the connecting portion 51 may, but is not limited to, have a bolt configuration as shown in the figure. As illustrated in Figure 3, the connecting member 71 includes a shaft portion 710 and a threaded portion 713 around the shaft portion 710. The shaft portion 710 has a perforation 715 that penetrates axially between both ends 711, 712.

[0055] The connecting member 71 can be connected to the connecting part 51 by screwing its threaded portion 713 into the threaded hole 511 of the connecting part 51. Furthermore, it can be fluidly connected to the flow path 21 by inserting, for example, a tubular connecting member (not shown), such as a tube, into the perforation 715. This allows the flow path of the microfluidic device 100 to be fluidly connected to other flow paths or devices, thereby forming a flow path system.

[0056] Although Figure 3 shows the perforation 715 having an inner diameter approximately the same as the width of the flow path 21, the disclosure is not limited thereto. The perforation 715 only needs to be able to allow the tubular connecting member to be inserted and to communicate fluidly with the flow path 21, and may have an inner diameter approximately the same as the width of the flow path 21, or it may have a different inner diameter. Also, although the tip 711 of the connecting member 71 shown in Figure 3 has a chamfered edge, the disclosure is not limited thereto. The connecting member connected to the connection part 51 is not limited to the configuration of the connecting member 71.

[0057] Furthermore, in this embodiment, the connecting portion 51 and the connecting member 71 are connected by screw engagement, but the disclosure is not limited thereto. Depending on the application, through holes having a configuration other than screw holes may be provided inside the joining cavities 31 and 32, and the connecting portion 51 and the connecting member may be connected by any engagement means other than screw engagement.

[0058] As described above, the microfluidic device 100 of this embodiment has a connection portion 51 at its side end, extending across both stacked substrates between the substrates constituting the fluid channel. With this configuration, even with a stacked structure made of thin substrates, it is possible to secure a cross-sectional area for providing a connection portion on the sides of the two joined substrates, enabling fluid connection of the fluid channel and facilitating miniaturization of the microfluidic device.

[0059] The microfluidic device 100 is not limited to the shape or channel configuration shown in Figure 1. For example, the microfluidic device 100 may have other surface shapes such as a circle. Also, although Figure 1 shows an exemplary straight channel 21, this disclosure is not limited to the number or layout of channels included in the microfluidic device 100. The microfluidic device may include multiple channels, and the layout of the channels may be, for example, straight, branched, comb-shaped, curved, spiral, zigzag, or any other shape depending on the intended use.

[0060] The channel width of the microchannel included in the microfluidic device of this disclosure is not particularly limited and can be configured according to the intended application to facilitate the transfer of fluid flowing within the channel.

[0061] Furthermore, the substrate material constituting the microfluidic device can be, for example, a glass material including low-melting-point glass or borosilicate glass, or a quartz material such as quartz or synthetic quartz, or a resin material including polydimethylsiloxane (PDMS), cycloolefin polymer (COP), or cycloolefin copolymer (COC). The substrate may also be made of a transparent or opaque material. Microfluidic devices made of a transparent substrate may be convenient, for example, when visually observing the fluid in the channel or when measuring the optical properties of the fluid.

[0062] The connection portion 51 of the microfluidic device 100 in Embodiment 1 is composed of bonding cavities 31 and 32 formed by a first substrate 11 and a second substrate 12, and the connecting member connected to the connection portion 51 is directly engaged with and connected to the substrate constituting the microfluidic device. The connection portion of the microfluidic device according to this disclosure is equipped with a connecting member, and the flow path can be fluidly connected to the outside via the connecting member. The following describes an example of the configuration of a microfluidic device equipped with a connection portion and a connecting member.

[0063] <Embodiment 2> The configuration of the microfluidic device 200 according to Embodiment 2 will be described with reference to Figures 4 to 6B. The microfluidic device 200 according to Embodiment 2 differs from Embodiment 1 described above in the configuration of the connection portion 52. In Figures 4 to 6B, components that are substantially the same as those in Embodiment 1 described above are denoted by the same reference numerals.

[0064] (Configuration of microfluidic device 200) Figure 4 is a schematic perspective view showing an example configuration of the microfluidic device 200 according to Embodiment 2. Figure 5A is a schematic partial cross-sectional view along the cutting line C2-C2 in Figure 4. Figure 5B is a perspective view showing the substrate 13 constituting the microfluidic device 200 in Figure 4. Figure 5C is an enlarged plan view showing region A2 in Figure 5B. Figure 6A is a schematic enlarged cross-sectional view showing the connection portion 52 of the microfluidic device 200 according to Embodiment 2. Figure 6B is a schematic perspective view showing the connecting member 62 of the connection portion 52 according to Embodiment 2.

[0065] As shown in Figures 4 and 5A, the microfluidic device 200 according to this second embodiment is constructed by laminating a first substrate 13 and a second substrate 14. The surfaces 13a and 14a of the substrates are positioned opposite each other and joined. The sides 13A and 13B of the substrates and the sides 14A and 14B of the substrates are connected to the joined surfaces 13a and 14a, respectively, forming the side ends 200A and 200B of the microfluidic device 200. In this embodiment, a straight channel 23, branched channels 24 and 25, and bonding cavities 33, 34 and 35 communicating with the channels 23, 24 and 25, respectively, are formed between the joined first substrate 13 and the second substrate 14. The bonding cavities 33, 34 and 35 each have openings 332, 342 and 352 at the side ends 200A and 200B of the microfluidic device 200. Note that the channels 23, 24, and 25 shown in Figure 4 are illustrative examples, and this disclosure is not limited to the number or layout of channels in a microfluidic device.

[0066] Figure 5A shows a cross-section of the channel 23 along the cutting line C2-C2 in Figure 4. As shown, the bonding cavity 33 communicates with the channel 23 at one end 331, and the other end forms an opening 332 at the side end 200A of the microfluidic device 200. In this embodiment, a connecting member 62 is fitted inside the bonding cavity 33. In this embodiment, the bonding cavity 33 and the connecting member 62 constitute a connecting portion 52 for communicating the channel 23 with the outside, for example, an external device or channel. Although not shown, the bonding cavities 34 and 35 and the connecting member 62 may similarly constitute a connecting portion 52 for communicating the channels 24 and 25 with the outside. The connecting portion 52 will be described in detail later.

[0067] In the microfluidic device 200 according to this embodiment, the first substrate 13 and the second substrate 14 are formed similarly. Figure 5B shows the configuration of the substrates constituting the microfluidic device 200, with the first substrate 13 as an example. However, this disclosure is not limited thereto. The substrates constituting the microfluidic device 200 may have different configurations.

[0068] As shown in Figure 5B, grooves 23A, 24A, and 25A constituting the flow channels 23, 24, and 25, and cavities 33A, 34A, and 35A communicating with grooves 23A, 24A, and 25A respectively and constituting the bonding cavities 33, 34, and 35, are formed on the surface 13a of the first substrate 13. The cavities 33A, 34A, and 35A each have open ends 332A, 342A, and 352A on the side surfaces 13A and 13B of the first substrate 13, respectively.

[0069] Figure 5C shows an enlarged view of region A2 in Figure 5B, illustrating the configuration of cavities 33A, 34A, and 35A in a plan view of the surface 13a of the first substrate 13, with cavity 33A as an example. As shown in Figure 5C, cavity 33A communicates with groove 23A at one end 331A, and the other end forms an open end 332A on the side surface 13A of the first substrate 13. In a plan view of the surface 13a, the open end 332A has a width w2, and groove 23A has a width t2, with the width w2 of the open end 332A being greater than the groove width t2 of groove 23A. Although cavities 34A and 35A are not shown, in this embodiment they may be configured similarly to cavity 33A.

[0070] As schematically shown in Figure 5A, in this embodiment, grooves 23B, 24B (not shown), and 25B (not shown) having an extending direction along the surface of the substrate, and cavities 33B, 34B (not shown), and 35B (not shown) that are in fluid communication with the grooves 23B, 24B, and 25B are formed on the surface 14a of the second substrate 14. The cavities 33B, 34B, and 35B each have open ends 332B, 342B (not shown), and 352B (not shown) on the side surfaces 14A and 14B of the second substrate 14, respectively. In this embodiment, grooves 23A, 24A, 25A and grooves 23B, 24B, 25B have substantially equal groove widths t2 on the surfaces 13a, 14a of the substrates to which the first substrate 13 and the second substrate 14 are joined, and cavities 33A, 34A, 35A and cavities 33B, 34B, 35B have substantially equal widths w2 on the surfaces 13a, 14a of the substrates.

[0071] The first substrate 13 and the second substrate 14 are joined at the substrate surfaces 13a and 14a, so that grooves 23A, 24A, 25A and grooves 23B, 24B, 25B are joined facing each other to form channels 23, 24, and 25. Cavities 33A, 34A, 35A and cavities 33B, 34B, 35B are joined facing each other to form joined cavities 33, 34, and 35. At the side ends 200A and 200B of the microfluidic device 200, open ends 332A, 342A, 352A and open ends 332B, 342B, 352B are connected to each other to form openings 332, 342, and 352. The formed openings 332, 342, and 352 have a width w2 that is larger than the channel width t2 of channels 23, 24, and 25 when viewed in plan on the substrate surface.

[0072] In this embodiment, we have described flow channels 23, 24, and 25 formed by joining grooves 23A, 24A, and 25A and grooves 23B, 24B, and 25B formed on the surfaces 13a and 14a of the substrate, but the disclosure is not limited thereto. The flow channels 23, 24, and 25 may also be formed by a groove formed on one of the surfaces 13a and 14a of the substrate to be joined and the other surface, and the formed flow channels may have any cross-sectional shape.

[0073] Furthermore, the cavities 33A, 34A, and 35A in the first substrate 13 and the cavities 33B, 34B, and 35B in the second substrate 14 may have different cross-sectional shapes, and the formed bonding cavity may have any cross-sectional shape when viewed from the side edge of the microfluidic device.

[0074] In this embodiment, the bonding cavities 33, 34, and 35 are formed by bonding cavities 33A, 34A, and 35A to cavities 33B, 34B, and 35B facing each other; however, the disclosure is not limited thereto. For example, a cavity is formed on the surface of the first substrate that communicates with grooves constituting a flow path and has an open end on the side surface of the substrate, while the second substrate remains a flat surface without a cavity. The first substrate and the second substrate are then bonded on their surfaces, forming a bonding cavity between the cavity of the first substrate and the flat surface of the second substrate.

[0075] As shown in Figure 5A, the microfluidic device 200 of this embodiment further includes a connecting member 62. The connecting member 62 is positioned between cavities 33A, 34A, 35A and cavities 33B, 34B, 35B, and when the first substrate 13 and the second substrate 14 are joined, the connecting member 62 is fitted into the joining cavities 33, 34, 35 and installed. Each of the joining cavities 33, 34, 35 and the connecting member 62 fitted inside them constitute the connection portion 52 of the microfluidic device 200 of this embodiment. The fluid channels 23, 24, 25 of the microfluidic device 200 can be fluidly connected to the outside at the side ends 200A, 200B via the connection portion 52. The connection portion 52 of this embodiment will be described in detail below with reference to Figures 6A and 6B.

[0076] (Configuration of connection section 52) Figure 6A shows a connection portion 52 at the side end 200A of the microfluidic device 200, along with a connecting member 71 as an example of a connecting member that can be connected to the connection portion 52. In this embodiment, the connection portion 52 is composed of a bonding cavity 33 formed by cavities 33A and 33B, and a connecting member 62 installed inside the bonding cavity 33, and is located between the first substrate 13 and the second substrate 14. As shown in the figure, the connection portion 52 is in fluid communication with the flow path 23 at one end 331 of the bonding cavity 33, and has an opening 332 at the other end of the bonding cavity 33 at the side end 200A of the microfluidic device 200.

[0077] Figure 6B is a schematic perspective view of the connecting member 62. As shown in the figure, in this embodiment, the connecting member 62 has a cylindrical outer shape. However, the disclosure is not limited thereto. The connecting member 62 may have other shapes that can be fitted into the joining cavity 33.

[0078] The connecting member 62 is fixed and attached to the inner wall of the joining cavity 33 by interference fit on its outer surface. When attached, the end 621 of the connecting member 62 may abut against the end 311 of the joining cavity 33, or there may be a gap between the end 311 and the connecting member 62. The end 622 of the connecting member 62 may be positioned inside the joining cavity 33, or it may protrude from the opening 332. In this embodiment, the connecting member 62 has a total length Lb between its ends 621 and 622 in the X direction, of which a portion with length La is positioned inside the joining cavity 33. Length La is 1 / 2 or more of the total length Lb. The attachment of the connecting member 62 will be described in detail later.

[0079] By positioning the connecting member 62 so that a portion of its total length protrudes from the opening 332, the length of the connecting member 62 can be adjusted according to the application, for example, to match the connecting member connected to the connection part 52, without changing the flow path configuration of the microfluidic device. This increases the design flexibility of the connecting member. Furthermore, by positioning more than half of the total length of the connecting member 62 within the bonding cavity 33, the connecting member 62 can be stably attached.

[0080] Furthermore, the interior of the connecting member 62 has a through hole 620 that penetrates between both ends 621 and 622. When installed, the through hole 620 is positioned to penetrate in the direction toward the flow path 23 from the opening 332. In this embodiment, the through hole 620 is a threaded hole and includes a threaded portion 623 with a threaded groove 42 formed on its inner wall and a reduced diameter portion 624 adjacent to the end 621. However, the disclosure is not limited thereto. The through hole 620 of the connecting member 62 may have any internal configuration.

[0081] The connecting member connected to the connection part 52 may be similar to the connecting member 71 shown in Figure 3, for example, and may have a bolt configuration. The connecting member 71 can be connected to the connection part 52 by screwing the threaded portion 713 into the threaded hole 620 of the connecting member 62. Furthermore, a tubular communication member (not shown), such as a tube, can be inserted into the perforation 715 to fluidly communicate with the flow path 23. This allows the flow path of the microfluidic device 200 to be fluidly connected to other flow paths or devices, etc., thereby forming a flow path system.

[0082] Furthermore, the perforation 715 only needs to be able to allow the tubular connecting member to be inserted and to communicate fluidly with the flow path 23. It may have an inner diameter that is approximately the same as the width of the flow path 23, or it may have an inner diameter that is different. Also, the connecting member connected to the connection part 52 is not limited to the configuration of the connecting member 71.

[0083] In this embodiment, the connecting member 62 of the connecting portion 52 and the connecting member 71 are connected by screw engagement, but the disclosure is not limited thereto. Depending on the application, a through hole having a configuration other than a screw hole may be provided inside the connecting member 62, and the connecting portion 52 and the connecting member may be connected by any engagement means other than screw engagement.

[0084] As described above, the microfluidic device 200 of this embodiment has a connection portion 52 at its side end, extending across both stacked substrates between the substrates constituting the fluid channel. With this configuration, even with a stacked structure made of thin substrates, it is possible to secure a cross-sectional area for providing a connection portion on the sides of the two joined substrates, enabling fluid connection of the fluid channel and facilitating miniaturization of the microfluidic device.

[0085] Furthermore, the connection portion 52 of the microfluidic device 200 in Embodiment 2 is connected to the connecting member 71 via a connecting member 62. The connecting member 62 can be made of a highly durable material, such as metal or ceramic. This improves the durability of the microfluidic device.

[0086] The connection portion of the microfluidic device according to this disclosure can also be configured on the surface of the substrate constituting the fluid channel. An example of the configuration of a microfluidic device equipped with a connection portion configured on the surface of the substrate is described below.

[0087] <Embodiment 3> The configuration of the microfluidic device 300 according to Embodiment 3 will be described with reference to Figures 7 to 9B. The microfluidic device 300 according to Embodiment 3 differs from Embodiments 1 or 2 described above in the configuration of the connection portion 53. Hereinafter, Embodiment 3 will be described focusing on the configuration of the connection portion 53. Note that in Figures 7 to 9B, components that are substantially the same as those in the embodiments described above are denoted by the same reference numerals.

[0088] (Configuration of microfluidic device 300) Figure 7 is a schematic perspective view showing an example configuration of the microfluidic device 300 according to Embodiment 3. Figure 8A is a schematic cross-sectional view along the cutting line C3-C3 in Figure 7. Figure 8B is a perspective view showing the substrate 15 constituting the microfluidic device 300 in Figure 7. Figure 8C is an enlarged plan view showing region A3 in Figure 8B. Figure 9A is a schematic enlarged cross-sectional view showing the connection portion 53 of the microfluidic device 300 according to Embodiment 3. Figure 9B is a schematic perspective view showing the connecting member 63 of the connection portion 53 according to Embodiment 2.

[0089] As shown in Figures 7 and 8A, the microfluidic device 300 according to this third embodiment is constructed by stacking a first substrate 15 and a second substrate 16. The surfaces 15a and 16a of the substrates are arranged opposite each other and joined. The sides 15A and 15B of the substrates and the sides 16A and 16B of the substrates are connected at the joined surfaces 15a and 16a, respectively, forming the side ends 300A and 300B of the microfluidic device 300. In this embodiment, a linear channel 26 is formed between the joined first substrate 15 and the second substrate 16, and the first substrate 15 has bonding cavities 36 and 37 that communicate with the channel 26. The bonding cavities 36 and 37 each have openings 362 and 372 on the surface 15b of the first substrate 15. Note that the channel 26 shown in Figure 7 is illustrative, and this disclosure is not limited to the number or layout of channels in the microfluidic device.

[0090] Figure 8A shows a cross-section of the channel 26 along the cutting line C3-C3 in Figure 7. As shown, the bonding cavities 36 and 37 extend in the thickness direction of the first substrate 15, communicating with the channel 26 at one end 361 and 371, and forming openings 362 and 372 on the surface 15b of the first substrate 15 which constitutes the surface of the microfluidic device 100 at the other end. In this embodiment, a connecting member 63 is fitted inside the bonding cavities 36 and 37. In this embodiment, each of the bonding cavities 36 and 37 and the connecting member 63 constitute a connecting portion 53 for communicating the channel 26 with the outside, for example, an external device or channel. The connecting portion 53 will be described in detail later.

[0091] In the microfluidic device 300 according to this embodiment, grooves and cavities may be formed on the first substrate 15, while the second substrate 16 may be flat and not have grooves and cavities. However, the disclosure is not limited thereto. Grooves and / or cavities may be formed on both the first substrate 15 and the second substrate 16.

[0092] Figure 8B shows the configuration of the first substrate 15 of the microfluidic device 300 according to this embodiment. For clarity, Figure 8B shows the surface 15a of the first substrate 15 facing upwards.

[0093] As shown in Figure 8B, the surface 15a of the first substrate 15 has a groove 26A that constitutes a flow path 26, and cavities 36A and 37A that communicate with the groove 26A and constitute bonding cavities 36 and 37. In this embodiment, the groove 26A has a trapezoidal cross-sectional shape when viewed from the sides 15A and 15B of the first substrate 15, and has a larger groove width on the surface 15a of the substrate. The cavities 36A and 37A extend in the thickness direction of the first substrate 15 and have open ends 361 and 371 on the surface 15a of the substrate and open ends 362 and 372 on the surface 15b of the substrate, and are configured to penetrate the first substrate 15. The open ends 361 and 371 communicate with the groove 26A which has an extending direction along the surface 15a of the substrate.

[0094] Figure 8C shows an enlarged view of area A3 in Figure 8B, and, using cavity 37A as an example, shows the configuration of cavities 36A and 37A in a plan view of the surface 15a of the first substrate 15. As shown in Figure 8C, groove 26A has a groove width t3 on the surface 15a of the substrate, the opening end 372A has a width w3, and the opening end 371A has a width w4. In this embodiment, cavities 36A and 37A have a circular cross-sectional shape in a plan view of the surface 15a of the substrate and a trapezoidal cross-sectional shape when viewed from the side of the substrate. They are configured to have a tapered shape that narrows from the opening ends 361A and 371A to the opening ends 362A and 372A. The width of the opening ends 371A and 372A and the groove width of groove 26A on the surface 15a of the substrate satisfy w4 > w3 > t3. Although cavity 36A is not shown, in this embodiment it may be configured similarly to cavity 37A.

[0095] In this embodiment, as schematically shown in Figure 8A, the first substrate 15 and the flat second substrate 16 are joined at the surfaces 15a and 16a of the substrates, so that the groove 26A and the cavities 36A and 37A are closed by the surface 16a of the second substrate 16. As a result, a flow path 26 is formed in the groove 26A formed on the surface 15a of the substrate, and joining cavities 36 and 37 are formed in the cavities 36A and 37A. The formed joining cavities 36 and 37 have open ends 361 and 371 and open ends 362 and 372. Furthermore, the joining cavities 36 and 37 have a circular cross-sectional shape when viewed from the surface 15b, a trapezoidal cross-sectional shape when viewed from the side ends 300A and 300B, and a tapered shape that narrows from the open ends 361 and 371 to the open ends 362 and 372. The openings 362 and 372 on the surface 15b of the microfluidic device 300 have a width w3 that is greater than the channel width t3 of the channel 26 when viewed in plan view of the substrate surface.

[0096] In this embodiment, the flow path 26 is formed by a groove 26A formed on the surface 15a of the first substrate 15, but the disclosure is not limited thereto. The flow path 26 may also be formed by grooves formed on both the surfaces 15a and 16a of the substrate joining together, and the formed flow path may have any cross-sectional shape.

[0097] Furthermore, in this embodiment, the bonding cavities 36 and 37 are constructed by bonding cavities 36A and 37A formed on the first substrate 15 to a flat second substrate 16, but the disclosure is not limited thereto. The bonding cavities 36 and 37 can also be constructed by bonding cavities formed on both the first substrate 15 and the second substrate 16. The constructed bonding cavities may have any shape.

[0098] As shown in Figure 8A, the microfluidic device 300 of this embodiment further includes a connecting member 63 disposed within the bonding cavities 36 and 37. When the first substrate 15 and the second substrate 16 are bonded together, the connecting member 63 is fitted into the bonding cavities 36 and 37 and installed. The bonding cavities 36 and 37, and the connecting member 63 fitted inside each of them, constitute the connection portion 53 of the microfluidic device 300 of this embodiment. The flow path 26 of the microfluidic device 300 can be fluidly connected to the outside at the upper surface 15b via the connection portion 53. The connection portion 53 of this embodiment will be described in detail below with reference to Figures 9A and 9B.

[0099] (Configuration of connection section 53) Figure 9A shows a connecting portion 53 formed in the bonding cavity 37. In this embodiment, the connecting portion 53 is composed of a bonding cavity 37 formed by the cavity 37A and a connecting member 63 installed inside the bonding cavity 37, and is arranged on the first substrate 15. The connecting portion 53 is bonded to the surface 16a of the second substrate 16 at one open end 371 of the bonding cavity 37, and has an open end 372 at the other open end of the bonding cavity 37 on the upper surface 15b of the microfluidic device 300.

[0100] Figure 9B is a schematic perspective view showing the connecting member 63. As shown in Figure 9B, in this embodiment, the connecting member 63 has a frustoconical shape. However, the disclosure is not limited thereto. The connecting member 63 may have other shapes that can be fitted into the joint cavity 37.

[0101] The connecting member 63 is fixed and attached to the inner wall of the bonding cavity 37 by interference fit on its outer surface. When attached, the end 631 of the connecting member 63 may abut the surface 16a of the second substrate 16 at the open end 371, or there may be a gap between it and the surface 16a of the second substrate 16. The end 632 of the connecting member 63 may be positioned inside the bonding cavity 37, or it may protrude from the open end 372. In this embodiment, the bonding cavity 37 has a tapered shape that narrows from the open end 371 to the open end 372, which prevents the connecting member 63 from coming out of the bonding cavity 37 when, for example, the connecting member 63 is subjected to stress toward the surface 15b. This improves the stability of the connection 53 and prevents fluid leakage.

[0102] The connecting member 63 has opposing ends 631 and 632, and includes a hole 630 that penetrates through the end 632, and a hole 635 that communicates with the hole 630 and penetrates near the end 631 of the side wall of the connecting member 63. When installed, the open end 632 is positioned close to the open end 372 of the bonding cavity 37, and the hole 630 extends from the open end 632 toward the end 631. The hole 635 is positioned to communicate with the flow path 26. As a result, the open end 632 on the upper surface 15b of the microfluidic device 300 is fluidly connected to the flow path 26. The end 631 of the connecting member 63 may have an opening or it may be closed.

[0103] In this embodiment, the hole 630 is a screw hole with a screw groove 43 formed in its inner wall. The hole 635 is formed by a notch in which a part of the side wall of the connecting member 63 is cut out, as shown in Figure 9B. However, this disclosure is not limited to the internal configuration of the connecting member 63. The connecting member 63 may have other internal configurations that can engage with the connecting member.

[0104] The connecting portion 53 may be connected, for example, to a connecting member 71 having the bolt configuration shown in Figure 3 or Figure 6A by screw engagement. A detailed description of the connecting member connected to the connecting portion 53 is omitted. Furthermore, the means of engagement between the connecting portion 53 and the connecting member is not limited to screw engagement. Depending on the application, the connecting member 63 may be connected to the connecting member by any means other than screw engagement.

[0105] As described above, the microfluidic device 300 of this embodiment has a connection portion 53 on the surface of the substrate constituting the fluid channel. This enables fluid connection of the fluid channel and facilitates miniaturization of the microfluidic device. The connection portion 53 is connected to a connecting member via a connecting member 63. The connecting member 63 can be made of a highly durable material, such as metal or ceramic. This improves the durability of the microfluidic device.

[0106] Furthermore, the connection portion 53 of the microfluidic device 300 in Embodiment 3 is provided on the upper surface of the microfluidic device. This configuration makes it possible to connect the channels from the upper surface of the microfluidic device to form a channel system, thereby increasing the design flexibility of the channel system.

[0107] This disclosure is not limited to providing a single microfluidic device with a connection section having a similar configuration. A single microfluidic device may have a connection section with a different configuration. Examples of microfluidic device configurations with connection sections having different configurations are described below.

[0108] <Embodiment 4> The configuration of the microfluidic device 400 according to Embodiment 4 will be described with reference to Figures 10 to 12. The microfluidic device 400 according to Embodiment 4 is equipped with different types of connection parts. In Figures 10 to 12, components that are substantially the same as those in the above-described embodiment are denoted by the same reference numerals.

[0109] (Configuration of microfluidic device 400) Figure 10 is a schematic perspective view showing an example configuration of the microfluidic device 400 according to Embodiment 4. Figure 11A is an exploded perspective view showing the components constituting the microfluidic device 400 of Figure 10. Figure 11B is an enlarged plan view showing region A4 of Figure 11A. Figure 11C is an enlarged plan view showing region A5 of Figure 11A. Figure 12 is a schematic enlarged cross-sectional view showing the connection portion 54 of the microfluidic device 400 according to Embodiment 4.

[0110] As shown in Figures 10 and 11A, the microfluidic device 400 according to this embodiment 4 is constructed by stacking a first substrate 17 and a second substrate 18. The surfaces 17a and 18a of the substrates are positioned opposite each other and joined together. The side surfaces 17A and 17B of the substrates and the side surfaces 18A and 18B of the substrates are connected at the joined surfaces 17a and 18a, respectively, forming the side ends 400A and 400B of the microfluidic device 400.

[0111] In this embodiment, a straight channel 23, branched channels 24, 25, 28, and bonding cavities 33, 34, 35, 38 communicating with channels 23, 24, 25, 28 are formed between the bonded first substrate 17 and the second substrate 18.

[0112] As shown in Figures 10 and 11A, the bonding cavities 33, 34, and 35, each with a connecting member 62 embedded inside them, constitute the connection portion 52 described in Embodiment 2, and the channels 23, 24, and 25 are fluidly connected to an external device or channel at the side ends 400A and 400B of the microfluidic device 400. The bonding cavity 38 and the connecting member 63 embedded inside it constitute a connection portion 54, and the connection portion 54 has an open end 382A on the surface 17b of the microfluidic device 400, and the channel 28 is fluidly connected to the outside. The connection portion 54 is a modified example of the connection portion 53 described in Embodiment 3. The following description will focus on the configuration of the connection portion 54, and a detailed description of other configurations of the microfluidic device 400 will be omitted. Although not shown, the microfluidic device 400 may also include the connection portion 51 described in Embodiment 1.

[0113] In this embodiment, the bonding cavity 38 constituting the connection portion 54 differs from the connection portion 53 described in Embodiment 3 in that the cavities 38A and 38B formed on both the first substrate 17 and the second substrate 18 are bonded to each other on the bonded surfaces 17a and 18a.

[0114] As shown in Figure 11A, the surface 17a of the first substrate 17 has a groove 28A and a cavity 38A that is fluidly in communication with the groove 28A, and the surface 18a of the second substrate 18 has a groove 28B and a cavity 38B that is fluidly in communication with the groove 28B. The cavities 38A and 38B are joined to each other at the open ends 381A and 383A on the surfaces 17a and 18a of the substrates to form a joint cavity 38.

[0115] Figure 11B shows an enlarged view of region A4 on the surface 17a of the first substrate 17, illustrating the configuration of cavity 38A in a plan view of the substrate surface. Figure 11C shows an enlarged view of region A5 on the surface 18a of the second substrate 18, illustrating the configuration of cavity 38B in a plan view of the substrate surface.

[0116] Cavity 38A may have a configuration similar to that of cavity 37A shown in Figures 8B and 8C of Embodiment 3. In this embodiment, cavity 38A is configured to extend in the thickness direction of the substrate and penetrate the first substrate 17. Cavity 38A has an open end 382A on the surface 17b of the substrate and an open end 381A on the surface 17a of the substrate. The open end 381A communicates with a groove 28A having an extending direction along the surface 17a of the substrate.

[0117] The cavity 38A has a circular cross-sectional shape when viewed from above the surface 17a of the substrate, and is configured to have a tapered shape that narrows from the opening end 381A to the opening end 382A, and has a trapezoidal cross-sectional shape when viewed from the sides 17A and 17B of the substrate 17. As shown in the plan view of the surface 17a of the substrate in Figure 11B, in this embodiment, the groove 28A has a groove width t4 on the surface 17a of the substrate, the opening end 382A of the cavity 38A on the surface 17b of the substrate has a width w5, and the opening end 381A on the surface 17a of the substrate has a width w6. The widths of the opening ends 381A and 382A and the groove width of the groove 28A satisfy the condition w6 > w5 > t4.

[0118] In this embodiment, the cavity 38B has an inverted trapezoidal shape that extends in the thickness direction of the second substrate 18 when viewed from the sides 18A and 18B of the substrate 18. The cavity 38B has an open end 383A on the surface 18a of the substrate and an open end 384A on the surface 18b of the substrate, and communicates with a groove 28B that has an extending direction along the surface 18a of the substrate.

[0119] As shown in the plan view of the substrate surface 18a in Figure 11C, in this embodiment, groove 28B has a groove width t4 substantially equal to groove 28A. The opening end 383A of cavity 38B has a width w6 substantially equal to the opening end 382A of cavity 38A, and the opening end 384A has a width w7 smaller than the width w6 of opening end 383A.

[0120] When the first substrate 17 and the second substrate 18 are joined at their surfaces 17a and 18a, grooves 28A and 28B are joined facing each other to form a flow channel 28. Cavities 38A and 38B are joined at their open ends 382A and 383A on the surfaces 17a and 18a of the substrates to be joined, forming a joint cavity 38. The formed joint cavity 38 has an open end 382 on the surface 17b and an open end 384 inside the second substrate 18. In a plan view of the substrate surface, the open end 382 on the surface 17b of the microfluidic device 400 has a width w6 that is greater than the flow channel width t4 of the flow channel 28.

[0121] In this embodiment, the flow path 28 is constructed by joining grooves 28A and 28B facing each other, but the disclosure is not limited thereto. The flow path 28 may also be constructed by grooves formed in either the first substrate 17 or the second substrate 18, and the constructed flow path may have any cross-sectional shape.

[0122] Furthermore, this disclosure does not limit the shape of the bonding cavity 38. The cavities 38A and 38B constituting the bonding cavity 38 only need to have open ends that can be bonded on the surfaces 17a and 18a of the substrate to be bonded, and each may be configured in any shape.

[0123] (Configuration of connection section 54) The configuration of the connection portion 54 will be described with reference to Figure 12. In this embodiment, the connection portion 54 is composed of a bonding cavity 38 formed by cavities 38A and 38B, and a connecting member 63 installed inside the bonding cavity 38. The connection portion 54 is bonded to the second substrate 18 at one open end 381 of the bonding cavity 38, and has an open end 382 at the other open end of the bonding cavity 38 on the upper surface 17b of the microfluidic device 400.

[0124] The connecting member attached to the connecting portion 54 may be the connecting member 63 described in Embodiment 3. However, the disclosure is not limited thereto. The connecting member attached to the connecting portion 54 may be another connecting member that can be fitted into the joining cavity 38.

[0125] The connecting member 63 is fixed and attached to the inner wall of the bonding cavity 38 by interference fit on its outer surface. In the attached state, the end 631 of the connecting member 63 is positioned inside the bonding cavity 38 and may abut the second substrate 18 at its open end 384, or there may be a gap between it and the second substrate 18. The end 632 of the connecting member 63 may be positioned inside the bonding cavity 38, or it may protrude from the open end 382.

[0126] In the installed state, the open end 632 of the connecting member 63 is positioned close to the open end 382 of the bonding cavity 38, and the hole 630 extends from the open end 632 toward the end 631. The hole 635 is positioned to communicate with the flow path 28. As a result, the open end 632 on the upper surface 17b of the microfluidic device 400 is fluidly connected to the flow path 28. The end 631 of the connecting member 63 may have an opening or it may be closed.

[0127] The hole 630 may be a screw hole with a screw groove 43 formed in its inner wall, and the hole 635 may be a notch formed by cutting out at least a portion of the side wall of the connecting member 63. This disclosure is not limited to the internal configuration of the connecting member 63. The connecting member 63 may have other internal configurations that can engage with the connecting member.

[0128] The connecting portion 54 may be connected, for example, by screw engagement to a connecting member 71 having the bolt configuration shown in Embodiment 1 or 2 (Figure 3 or Figure 6A). A detailed description of the connecting member connected to the connecting portion 54 is omitted. Furthermore, the engagement means between the connecting portion 54 and the connecting member is not limited to screw engagement. Depending on the application, the connecting member 64 may be connected to the connecting member by any engagement means other than screw engagement.

[0129] As described above, the microfluidic device 400 of this embodiment has a connection portion 54 on the surface of the substrate that constitutes the fluid channel. This enables fluid connection of the fluid channel and facilitates miniaturization of the microfluidic device. Furthermore, the connection portion 54 is connected to a connecting member by a connecting member 63. The connecting member 63 can be made of a highly durable material, such as metal or ceramic. This improves the durability of the microfluidic device.

[0130] The microfluidic device 400 according to this embodiment is equipped with different types of connection parts, which allows for the connection of fluid channels from the surface and side ends of the microfluidic device to form a fluid channel system, thereby increasing the design flexibility of the fluid channel system and enabling the creation of a compact fluid channel system.

[0131] <Embodiment 5> (Manufacturing process for microfluidic devices) Next, the manufacturing process of a microfluidic device according to Embodiment 5 of this disclosure will be described with reference to Figures 13 to 17B. Figure 13 is a flowchart showing an example of the manufacturing process of a microfluidic device according to Embodiment 5. Figure 14 is a schematic diagram showing an example of the configuration of a molding apparatus 800 used in the manufacturing of a microfluidic device according to Embodiment 5. Figures 15A to 17B are partial perspective views showing examples of substrates and microfluidic devices manufactured through the manufacturing process shown in Figure 13.

[0132] As shown in Figure 13, the method for manufacturing a microfluidic device may include steps S01 to S03.

[0133] In step S01, the material for substrate molding is prepared. In this embodiment, a microfluidic device was manufactured using a glass material. The glass material used was an L-BSL7 borosilicate glass plate manufactured by Ohara Corporation, which has a glass transition temperature (Tg) of 498°C, a flexing point (At) of 549°C, and a coefficient of thermal expansion α of 7.1 × 10⁻⁶. -6 The value is / K. Note that the shape of the glass material used for substrate molding is not limited.

[0134] Next, step S02 is a substrate molding process, in which a substrate having grooves and cavities is formed by mold molding. Here, the grooves are formed along the surface direction of the substrate and constitute the channels of a microfluidic device. The cavities are fluidly in communication with the grooves and are configured to have an open end on at least one of the side surface of the substrate and the back surface of the substrate opposite to the surface of the substrate where the grooves are formed. In a plan view of the surface of the substrate, the open end has a width greater than the groove width of the grooves.

[0135] In this embodiment, the substrate molding process in step S02 was carried out by mold molding using a molding apparatus 800 schematically shown in Figure 14. The molding apparatus 800 shown in Figure 14 comprises a pair of punches 810a and 810b arranged opposite each other. The molding apparatus 800 also has a body mold 830 that surrounds the punches 810a and 810b and the area to which the substrate molding material is supplied, and can be heated by a pair of heater blocks 820a and 820b. During mold molding, the upper punch 810a mounted on the heater block 820a is moved along the load axis toward the lower punch 810b, bringing the upper punch 810a into contact with the substrate molding material.

[0136] In this embodiment, during the substrate molding process, an upper punch 810a having an inverted shape for the groove and cavity to be formed was mounted on a heater block 820a, and a flat material 811A was placed on a lower punch 810b. The heater block 820a and the upper punch 810a were lowered until the upper punch 810a contacted the flat material 811A, and the substrate was heated to 580°C by the heater blocks 820a and 820b, while a pressure of 500 kgf was applied in the load direction F. After pressurization, the molded substrate was cooled to below 60°C and removed.

[0137] Examples of substrates formed through the substrate molding process are shown in Figures 15A, 16A, and 17A.

[0138] In the fabrication example shown in Figure 15A, grooves 121A and 121B and cavities 131A and 131B communicating with grooves 121A and 121B were formed on the surfaces 111a and 112a of the first substrate 111 and the second substrate 112, respectively. Each of the cavities 131A and 131B has a semicircular opening end with a width greater than the groove width on the side surfaces 111A and 112A of the substrates 111 and 112, and substantially similar screw grooves are formed on the inner walls of the cavities 131A and 131B, extending from the opening end toward grooves 121A and 121B.

[0139] In the fabrication example shown in Figure 16A, grooves 123A and 123B, and cavities 133A and 133B communicating with the grooves 123A and 123B were formed on the surfaces 113a and 114a of the first substrate 113 and the second substrate 114, respectively. The cavities 133A and 133B each have an open end on the side surfaces 113A and 114A of the substrates 113 and 114, respectively, with a width greater than the groove width.

[0140] In the fabrication example shown in Figure 17A, a groove 126A was formed on the surface 115a of the first substrate 115, and a cavity 136 communicating with the groove 126A was formed in the thickness direction of the first substrate 115. The cavity 136 has open ends on the surfaces 115a and 115b of the substrate 115 and penetrates the substrate 115. The open ends on surfaces 115a and 115b have a width greater than the groove width. In this fabrication example, the second substrate 116 was not molded and remained in a flat plate shape.

[0141] Next, step S03 is a substrate bonding process in which the first substrate and the second substrate formed in step S02 are stacked, and the stacked first substrate and the second substrate are heated to bond them on the surface of the substrates.

[0142] In step S03, the substrate bonding process was carried out using the molding apparatus 800, similar to step S02, to bond the first substrate and the second substrate by heat welding. In the bonding process, the first substrate and the second substrate molded in step S02 were placed on the upper punch 610c and the lower punch 810b, respectively, and the first substrate and the second substrate were stacked. The heater block 820a and the upper punch 610c were lowered until the stacked first substrate and the second substrate were in contact at the surface of the substrate. The heater blocks 820a and 820b heated the substrate to 550°C, and a pressure of 100 kgf was applied in the load direction F in the substrate thickness direction to bond the first substrate and the second substrate at the surface of the substrate. The sides of the first substrate and the second substrate were connected at the surface of the bonded substrate. After bonding, the fabricated microfluidic device was cooled to below 60°C and removed.

[0143] Examples of microfluidic devices manufactured through a substrate bonding process are shown in Figures 15B, 16B, and 17B.

[0144] In the fabrication example shown in Figure 15B, the grooves 121A, 121B and cavities 133A, 133B were arranged facing each other during the lamination of the first and second substrates. The first substrate 111 and the second substrate 112, laminated in this manner, were thermally bonded to fabricate a microfluidic device 110. The fabricated microfluidic device 110 has a connection portion 510 at its side end 110A, which is formed by cavities 133A and 133B.

[0145] In the fabrication example shown in Figure 16B, the first substrate 113 and the second substrate 114 were arranged in a laminated state, and a connecting member 62 having a through hole 620 was also placed. Specifically, the first substrate 113 and the second substrate 114 were arranged so that the grooves 123A, 123B and cavities 133A, 133B faced each other. The connecting member 62 was placed between the cavities 133A, 133B such that the through hole 620 penetrated from the opening end of the cavities 133A, 133B toward the grooves 123A, 123B. The laminated first substrate 113 and the second substrate 114 were then thermally bonded with the connecting member 62 in place to fabricate a microfluidic device 210. The fabricated microfluidic device 210 includes a connection portion 520 at its side end 210A, which is composed of cavities 133A and 133B and a connecting member 62.

[0146] In the fabrication of the microfluidic device 210, the substrate material for the first substrate 113 and the second substrate 114 has a coefficient of thermal expansion α1 of 3 × 10⁻⁶. -6 / K or higher, 9×10 -6 Low melting point glass or borosilicate glass with a melting point of 0.5K or less may be used. The connecting member 62 may be made of metal or ceramic, and may have a linear expansion coefficient α2 smaller than the linear expansion coefficient α1 within a temperature range of 400°C to 600°C. Furthermore, the linear expansion coefficient α1 of the substrate material and the linear expansion coefficient α2 of the connecting member are such that α1 - α2 ≤ 3 × 10⁻¹⁰ -6 The material may be selected to satisfy / K. The material of such connecting member may be a metallic material such as cemented carbide, Invar alloy, tungsten, molybdenum, or titanium alloy, or a ceramic material such as zircon, alumina, silicon carbide, or aluminum nitride.

[0147] The connecting member 62, having a coefficient of linear expansion α2 smaller than the coefficient of linear expansion α1 of the substrate material, is firmly fixed and installed in the bonding cavity formed by cavities 133A and 133B by interference fit during the thermal bonding process in which the substrate is heated and then cooled to room temperature. Also, α1-α2≦3×10 -6By satisfying the / K condition, it is possible to prevent excessive shrinkage of the substrate material when it cools, which could lead to failure due to stress from the connecting members.

[0148] Furthermore, in this disclosure, the substrate material of the substrate constituting the microfluidic device is not limited to glass. The material of the connecting member is also not limited to metal or ceramic material. For example, resin materials may be used for both the substrate and the connecting member. When resin materials are used, for example, the coefficient of thermal expansion α3 of the first resin used as the substrate material and the coefficient of thermal expansion α4 of the second resin used as the connecting member material are such that α3 > α4, and within a temperature range of 100°C to 200°C, α3 - α4 ≤ 3 × 10⁻¹⁰ -6 The material may be selected to satisfy / K. This allows the connecting member to be fitted into the bonding cavity formed in the substrate by an interference fit during the thermal bonding process, and prevents the substrate material from being damaged by stress from the connecting member.

[0149] Next, in the fabrication example shown in Figure 17B, a connecting member 63 was placed in the lamination of the first substrate and the second substrate. The connecting member 63 includes a hole 630 that penetrates through the open end 632 and a hole 635 that communicates with the hole 630 and penetrates through the side wall of the connecting member 63. The connecting member 63 was placed in the cavity 136 such that the open end 632 is close to the open end on the surface 115b and the hole 635 communicates with the groove 126A. The first substrate 115 and the second substrate 116, which were laminated in this manner, were thermally bonded with the connecting member 63 in place to fabricate a microfluidic device 310. The fabricated microfluidic device 310 has a connecting portion 530 on the surface 115b, which is formed by the cavity 136 and the connecting member 63.

[0150] Furthermore, in the fabrication of the microfluidic device 310, the substrate material and the material of the connecting member 63 can be the same as those used for the connecting member 62 described above. This allows the connecting member to be fitted into the bonding cavity formed in the substrate by an interference fit during the thermal bonding process, and prevents the substrate material from being damaged by stress from the connecting member.

[0151] Although the manufacturing process of microfluidic devices has been explained using examples shown in Figures 15A to 17B, various microfluidic devices, including the embodiments described above, can be manufactured by adjusting the details of the substrate molding process and / or substrate bonding process, for example. Furthermore, the manufacturing process of the microfluidic device shown in Figure 13 is merely an example, and the manufacturing of the microfluidic device according to this disclosure is not limited to the process shown in Figure 13. In addition, the materials or manufacturing conditions used in this embodiment are also just examples, and the manufacturing process of the microfluidic device is not limited to the contents of the embodiments described above.

[0152] Furthermore, although the above-described embodiment explained that the bonding cavity configured in the microfluidic device has an opening on only one outer surface of the microfluidic device, this disclosure is not limited thereto. Depending on the application, for example, the bonding cavity can be configured to have openings on two or more outer surfaces of the microfluidic device. This makes it possible to realize a microfluidic device having a connecting portion that allows for fluidic connection in multiple directions.

[0153] As described above, the attached drawings and detailed description are provided to illustrate the embodiments of the technology described herein. Therefore, the components described in the attached drawings and detailed description may include not only components essential for solving the problem, but also components that are not essential for solving the problem, in order to illustrate the technology described above. Therefore, the mere presence of such non-essential components in the attached drawings and detailed description should not be immediately assumed to mean that those non-essential components are essential.

[0154] While this disclosure is fully described in relation to preferred embodiments with reference to the accompanying drawings, various modifications are possible within the scope of the claims. Such modifications, as well as embodiments obtained by appropriately combining the technical means disclosed in different embodiments, are also included in the technical scope of this disclosure. [Industrial applicability]

[0155] This disclosure is applicable to microfluidic devices, and is applicable to microfluidic devices with a substrate stacked structure. [Explanation of Symbols]

[0156] 11,12,13,14,15,16,17,18 Circuit boards 21, 23, 24, 25, 26, 28 Channels 21A,23A,24A,25A,26A,28A Groove 31, 32, 33, 34, 35, 36, 37, 38 Joint cavities 31A, 32A, 33A, 34A, 35A, 36A, 37A, 38A Cavity 31B, 32B, 33B, 34B, 35B, 36B, 37B, 38B Cavity 41, 42, 43 Screw grooves 51, 52, 53, 54 Connection part 62, 63 Connecting members 71 Connecting member 100, 200, 300, 400 microfluidic devices 110, 210, 310 Microfluidic Devices 510, 520, 530 Connection part 800 Molding equipment 810a, 810b punch 820a, 820b Heater Block 830 Body Type

Claims

1. A microfluidic device comprising a first substrate having a first surface and a first side surface, and a second substrate having a second surface and a second side surface, The first substrate and the second substrate are joined together at the first surface and the second surface. The first side and the second side are connected at the joined first surface and second surface, The first substrate includes a groove having an extending direction along the first surface and a first cavity that is in fluid communication with the groove and has a first open end on the first side surface. In a plan view of the first surface, the first open end has a width greater than the groove width of the groove. The first cavity has a screw groove arranged from the first opening end toward the groove, Microfluidic devices.

2. The second substrate includes a second cavity having a second open end on the second side surface, The first cavity and the second cavity have a semicircular cross-sectional shape when viewed from the first side and the second side, The screw groove is formed in at least a portion of the inner wall of the first cavity. A screw groove substantially similar to the screw groove is formed in at least a portion of the inner wall of the second cavity, The first cavity and the second cavity are joined facing each other to form a joint cavity, and the first open end and the second open end are connected facing each other to form an opening. Within the joining cavity, the screw grooves formed on the inner walls of the first cavity and the second cavity constitute a screw hole that penetrates from the opening toward the groove. The microfluidic device according to claim 1.

3. The second substrate includes a second cavity having a second open end on the second side surface, The first cavity and the second cavity are joined facing each other to form a joint cavity, and the first open end and the second open end are connected facing each other to form an opening. The joining cavity further comprises a connecting member fitted into the aforementioned joining cavity, The connecting member penetrates from the opening toward the groove and has a screw hole including the screw groove, The microfluidic device according to claim 1.

4. The connecting member is positioned such that at least half of its total length in the direction from the opening toward the groove is located within the joining cavity. The microfluidic device according to claim 3.

5. A microfluidic device comprising a first substrate having a first surface, a second substrate having a second surface, and a connecting member, The first substrate and the second substrate are joined together at the first surface and the second surface. The first substrate is A groove having an extending direction along the first surface, A first cavity having a first open end on the first back surface opposite to the first surface and a second open end on the first surface that is in fluid communication with the groove, Includes, In a plan view of the first surface, the first open end has a width greater than the groove width of the groove. The connecting member is fitted into the first cavity and includes a threaded hole that penetrates through the first end and a hole that communicates with the threaded hole and penetrates through the side wall. The first end is positioned close to the first open end, and the hole is arranged to be in fluid communication with the groove. Microfluidic devices.

6. The second substrate includes a second cavity having a third open end on the second surface, The first cavity and the second cavity are joined to each other at the second opening end and the third opening end. The microfluidic device according to claim 5.

7. The first cavity has a tapered shape that narrows from the second opening end to the first opening end. The microfluidic device according to claim 5.

8. The aforementioned hole includes a notch in which a part of the side wall is cut out. The microfluidic device according to claim 5.

9. The first substrate and the second substrate are made of glass, and the coefficient of thermal expansion between the first substrate and the second substrate is α1 or greater. The connecting member is made of metal or ceramic, and the coefficient of linear expansion of the connecting member is α2. α1 > α2, and within the temperature range of 400°C to 600°C, α1 - α2 ≤ 3 × 10⁻⁶ / K. A microfluidic device according to any one of claims 3 to 8.

10. The first substrate and the second substrate are made of a first resin, and the coefficient of linear expansion between the first substrate and the second substrate is α3 or greater. The connecting member is made of a second resin, and the coefficient of linear expansion of the connecting member is α4. α3 > α4, and within the temperature range of 100°C to 200°C, α3 - α4 ≤ 3 × 10⁻⁶ / K. A microfluidic device according to any one of claims 3 to 8.

11. At least one microfluidic device according to any one of claims 2 to 8, At least one connecting member, At least one tubular connecting member, Equipped with, The connecting member includes a shaft portion having a perforation that penetrates in the axial direction, and a threaded portion around the shaft portion. The threaded portion is screwed into the threaded hole of the microfluidic device. The tubular connecting member is inserted into the hole and is in fluid communication with the groove. Flow channel system.

12. A method for manufacturing a microfluidic device comprising a first substrate having a first surface and a first side surface, and a second substrate having a second surface and a second side surface, A substrate molding step includes molding a groove having an extending direction along the first surface and a first cavity that is in fluid communication with the groove onto the first substrate, A substrate bonding step comprising stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other, heating the stacked first substrate and the second substrate to bond the first surface and the second surface, and connecting the first side surface and the second side surface at the bonded first surface and the second surface, Includes, The first cavity has a first open end on the first side surface and has a semicircular cross-sectional shape when viewed from the first side surface. In a plan view of the first surface, the first open end has a width greater than the groove width of the groove. The substrate molding step includes molding a second cavity into the second substrate having a second open end on the second side surface and a semicircular cross-sectional shape when viewed from the second side surface, and molding substantially similar screw grooves into at least a portion of the inner walls of the first cavity and the second cavity. In the substrate bonding step, stacking the first substrate and the second substrate includes arranging the first substrate and the second substrate such that the first cavity and the second cavity face each other. A method for manufacturing microfluidic devices.

13. A method for manufacturing a microfluidic device comprising a first substrate having a first surface and a first side surface, a second substrate having a second surface and a second side surface, and a connecting member having a screw hole, A substrate molding step includes molding a groove having an extending direction along the first surface and a first cavity that is in fluid communication with the groove onto the first substrate, A substrate bonding step comprising stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other, heating the stacked first substrate and the second substrate to bond the first surface and the second surface, and connecting the first side surface and the second side surface at the bonded first surface and the second surface, Includes, The first cavity has a first open end on the first side surface, In a plan view of the first surface, the first open end has a width greater than the groove width of the groove. The substrate molding step includes molding a second cavity having a second open end on the second side surface onto the second substrate, In the substrate bonding step, stacking the first substrate and the second substrate is The first substrate and the second substrate are arranged such that the first cavity and the second cavity face each other, The connecting member is positioned between the first cavity and the second cavity such that the screw holes penetrate from the first and second open ends toward the groove. including, A method for manufacturing microfluidic devices.

14. A method for manufacturing a microfluidic device comprising a first substrate having a first surface, a second substrate having a second surface, and a connecting member, A substrate molding step includes molding a groove having an extending direction along the first surface and a first cavity that is in fluid communication with the groove onto the first substrate, A substrate bonding step includes stacking the first substrate and the second substrate so that the first surface and the second surface are facing each other, and heating the stacked first substrate and the second substrate to bond the first surface and the second surface together, Includes, The first cavity has a first open end on the first back surface opposite to the first surface, and a second open end on the first surface that is in fluid communication with the groove. In a plan view of the first surface, the first open end has a width greater than the groove width of the groove. In the substrate bonding step, stacking the first substrate and the second substrate includes placing the connecting member in the first cavity, The connecting member includes a threaded hole that penetrates through the first end and a hole that communicates with the threaded hole and penetrates through the side wall. The first end is positioned close to the first open end, and the hole is arranged to communicate fluidly with the groove. A method for manufacturing microfluidic devices.

15. The aforementioned substrate molding step is The method further includes molding a second cavity having a third open end on the second surface onto the second substrate, In the substrate bonding step, stacking the first substrate and the second substrate is The first substrate and the second substrate are arranged such that the first cavity and the second cavity are joined to each other at the second opening end and the third opening end. A method for manufacturing a microfluidic device according to claim 14.

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