Electronic device with electrostatic discharge detent spring

Abstract

Various embodiments include an electronic device having electrostatic discharge (ESD) protection features that enhance connections. In some examples, the electronic device includes a housing and a detent spring internal to the housing, the detent spring (i) positioned to contact a feature that is at least partially external to the housing and (ii) acts as an electrostatic discharge (ESD) sink.

Description

[Technical Field]

[0001] Priority Claims and Cross-References to Related Applications This application claims priority to U.S. Patent Application No. 18 / 084,021, filed December 19, 2022, which is a continuation-in-part (CIP) of U.S. Patent Application No. 16 / 930,579, filed July 16, 2020, each of which is incorporated by reference herein in its entirety.

[0002] The present disclosure relates generally to electronic devices, and more particularly to electronic devices that provide electrostatic discharge (ESD) protection. [Background technology]

[0003] Electronic devices, such as audio headsets, can be prone to electrostatic discharge (ESD) events. Electronic devices used in aviation, military, industrial, and other applications can be particularly prone to the buildup of static charge. This buildup can lead to ESD events that adversely affect the performance of the electronic device. Additionally, loosely mating connectors within electronic devices can cause rattles in devices used in dynamic environments (e.g., aviation, military, etc.), also contributing to ESD events. Summary of the Invention [Means for solving the problem]

[0004] All examples and features mentioned below can be combined in any technically possible manner.

[0005] Various implementations of the present disclosure include electronic devices that provide electrostatic discharge (ESD) protection and beneficially secure component connections. Various additional implementations of the present disclosure include aviation headsets with headphones that have robust component connections and provide ESD protection.

[0006] In some particular aspects, an electronic device includes a housing and a detent spring within the housing, the detent spring i) positioned to contact a feature that is at least partially exterior to the housing, and ii) functions as an electrostatic discharge (ESD) sink.

[0007] In one particular aspect, an aviation headset includes a pair of earphones and a headband connecting the pair of earphones, at least one of the earphones including a slot with one or more snap-fit ​​and / or friction-fit connectors for connecting with an electronic device, the electronic device having a housing, a feature at least partially exterior to the housing, and a detent spring interior to the housing that contacts the feature exterior to the housing and acts as an electrostatic discharge (ESD) sink, the feature exterior to the housing configured to engage with the one or more snap-fit ​​and / or friction-fit connectors in the slot.

[0008] Implementations may include one or any combination of the following features.

[0009] In certain aspects, an ESD sink provides ESD protection from one or more components within an electronic device. In certain examples, an ESD sink directs ESD away from one or more components within an electronic device, e.g., discharges electrostatic potential away from such component(s).

[0010] In some cases, the detent spring also acts as a limiter for the feature and provides ESD protection for the components within the housing.

[0011] In certain implementations, the detent spring is contained within the housing.

[0012] In certain cases, exterior features of the housing allow the electronic device to be coupled to an audio headset.

[0013] In some implementations, the housing includes a data connector for connecting to a complementary data connector in the audio headset, hi some examples, the data connector includes a Universal Serial Bus (USB) connector and / or an audio connector.

[0014] In certain embodiments, the detent spring is configured to be proximate to an opening in the electronic device and to provide ESD protection for an audio headset through the opening.

[0015] In certain cases, the opening is blocked when the electronic device is coupled with an audio headset.

[0016] In some embodiments, the detent spring provides ESD protection to the electronic device of about 15 kilovolts (kV) or greater.

[0017] In some cases, the detent spring is grounded through a ground connection within the electronic device.

[0018] In certain aspects, the external movable part includes at least one movable arm for engaging a slot in the wearable audio device.

[0019] In certain implementations, a detent spring contacts each movable arm and provides friction against the movement of the movable arm.

[0020] In some embodiments, the electronic device further includes at least one fixed pin, each movable arm including a pivotable member for movement about the fixed pin, and the detent spring contacting the pivotable member.

[0021] In certain cases, the detent spring applies a force to each pivotable member that is perpendicular to the axis or rotation of each pivotable member.

[0022] In certain implementations, each pivotable member includes a recess for accommodating an arm of a detent spring. In some examples, the recess spans only a portion of the circumference around the pivot axis, e.g., from about 30 degrees to about 120 degrees. In certain examples, the recess can vary depending on the amount of rotation of the arm.

[0023] In certain aspects, the detent spring further contacts the housing and the wiring within the housing.

[0024] In certain cases, the exterior features of the housing include movable exterior parts that include metal. In some cases, the movable exterior parts include plastic or composite materials.

[0025] In some implementations, the electronic device further includes a first location feature on the housing and a second location feature on the detent spring, the first and second location features being complementary and helping to maintain the position of the detent spring relative to the housing. In some examples, the location features can include male / female protrusions and / or slots.

[0026] In some aspects, the electronic device further includes a first retention feature on the housing and a second retention feature on the detent spring, the first and second retention features being complementary. In some cases, the retention features include snap-fit ​​and / or friction-fit connectors.

[0027] In some cases, the electronic device further includes a cable assembly connected to the housing, the cable assembly including a ground plane (eg, a ground plane and / or a ground wire).

[0028] In certain implementations, the detent spring includes a ground tab connected to a ground plane within the cable assembly. In some examples, the ground tab includes a solder tab.

[0029] In some aspects, the detent spring further includes a plate coupled to the housing and a set of arms extending from the plate and contacting features on the exterior of the housing.

[0030] In certain cases, the detent spring includes a pair of arms that contact only exterior features of the housing.

[0031] In some implementations, the electronic device includes at least one of a boom microphone, a battery module, a power connector, a sensor module, a communication module, a self-powered communication module, or a microphone module.

[0032] In certain aspects, a portion of the housing is configured to be inserted in an insertion direction into a slot in the wearable audio device, the slot having one or more snap-fit ​​and / or friction-fit connectors, and an exterior feature of the housing includes a component having a movable arm configured to selectively engage with the one or more snap-fit ​​and / or friction-fit connectors, wherein when the movable arm is engaged with the one or more snap-fit ​​and / or friction-fit connectors, the one or more snap-fit ​​and / or friction-fit connectors apply a resistive force to the movable arm in response to a force on the portion in a direction opposite the insertion direction.

[0033] In certain cases, the snap-fit ​​and / or friction-fit connectors each include at least one locking projection within a slot sized to complement a movable arm within the electronic component in a fixed position.

[0034] In some embodiments, the detent spring acts as an ESD sink for features that are at least partially external to the housing.

[0035] In certain implementations, the detent spring acts as a limiter for the exterior features of the housing and acts as an ESD sink from at least one earbud.

[0036] In certain cases, the detent spring is contained within the housing.

[0037] In some embodiments, the pair of earphones includes a pair of ear cups.

[0038] In certain cases, the pair of ear cups comprises a pair of ear buds, a pair of on-ear headphones, or a pair of near-ear headphones.

[0039] In certain implementations, the aviation headset further includes an electro-acoustic transducer in each of the earcups to provide an audio output to the user.

[0040] In some cases, the detent spring provides ESD protection for aviation headsets in accordance with aviation-specific ESD thresholds.

[0041] Two or more features described in this disclosure, including features described in the Summary of the Invention section, may be combined to form implementations not specifically described herein.

[0042] The details of one or more implementations are set forth in the accompanying drawings and the description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims. [Brief explanation of the drawings]

[0043] [Figure 1] 1 is a schematic diagram of an audio device according to various implementations. [Figure 2] FIG. 1 is a schematic diagram of another audio device according to various implementations. [Figure 3] 1 is a schematic diagram of an additional audio device according to various implementations. [Figure 4] FIG. 1 is a schematic diagram of another audio device according to various implementations. [Figure 5] 1A-1C are side views of earpieces and electronic components according to various implementations. [Figure 6]1A-1C are perspective views of earpieces and electronic components according to various implementations. [Figure 7] 1A-1C are enlarged side views of an earpiece engaging electronic components according to various implementations. [Figure 8] 1A-1C are perspective views of an earpiece and a movable arm separated therefrom according to various implementations. [Figure 9] 10A-10C are side views of electronic components engaged with earpieces according to various additional implementations. [Figure 10] 9 is a perspective view of the movable arm of FIG. 8 separated and engaged with a protrusion of an electronic component. [Figure 11] 1A-1C are side views of an electronic component engaged with an earpiece, illustrating the resistance force of a movable arm, according to various implementations. [Figure 12] 1A-1D are cross-sectional views of an electronic component engaging with an earpiece according to various implementations. [Figure 13] 13 shows the electronics and earpiece of FIG. 12 in a fixed position. [Figure 14] 1A-1D illustrate exploded perspective views of electronic devices according to various implementations. [Figure 15] 15 shows an enlarged view of the electronic device of FIG. 14. [Figure 16] 1A-1C illustrate a detent spring separated from a housing in an electronic device according to various implementations. [Figure 17] 17 shows additional enlarged views of the electronic device of FIGS. 14-16. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0044] It should be noted that the drawings of the various implementations are not necessarily to scale. The drawings are intended to depict only typical aspects of the disclosure and therefore should not be considered limiting of the scope of the invention. In the drawings, like numbering represents like elements between the drawings.

[0045] As described herein, various aspects of the present disclosure generally relate to electronic devices that enable electrostatic discharge protection (ESD) and beneficially secure component connections. More particularly, aspects of the present disclosure relate to electronic devices that beneficially provide robust connections and have detent springs that also act as ESD sinks within the device. In particular cases, the electronic devices include or are otherwise part of a wearable audio device, such as an audio headset.

[0046] The electronic devices described herein may include a detent spring positioned to contact a feature at least partially external to the device housing and function as an ESD sink. The detent spring can provide a frictional force between the electronic device and the at least partially external feature(s), which reduces free rotation and / or rattle of the electronic device relative to the feature(s) and associated component(s). The ESD sink can provide ESD protection from one or more components within the electronic device. In certain examples, the ESD sink provides ESD directed away from one or more components within the electronic device, e.g., discharges electrostatic potential away from such component(s).

[0047] As described herein, electronic devices having detent springs that act as ESD sinks can be beneficially deployed in aviation devices, such as aviation headsets. Certain environments, such as aviation environments, are prone to static electricity buildup due, for example, to dry cabin air, dry surfaces within the cabin, and prolonged seating and movement within seats by crew members (e.g., pilots). Significant static charge buildup can cause large discharge events, also referred to herein as ESD events. For example, when a pilot moves into a seat or dismounts after a prolonged period of sitting, static charge accumulated in the pilot's headset may discharge near the headband, earcups, boom microphone, etc. If such an ESD event is directed at the electronics within the headset, the event may be severe enough to interrupt audio communications, render audio input or output to the headset inaudible, and / or cause failure of one or more of the communication and / or data connection components within the headset. Various implementations facilitate ESD routing away from such components within the headset, enhancing compliance with aviation safety standards as well as improving headset performance.

[0048] Commonly labeled parts in the figures are considered to be substantially equivalent parts for purposes of illustration, and redundant descriptions of those parts are omitted for clarity.

[0049] The aspects and implementations disclosed herein may be applicable to a wide variety of electronic devices. Particular examples of electronic devices include wearable audio devices and associated connectors, modular components, auxiliary components, data connectors, audio connectors, etc. It is understood that any number of electronic devices that accumulate static charge can benefit from the disclosed implementations.

[0050] In some cases, such as when the electronic device includes a wearable audio device, the wearable audio device can take various form factors, such as headphones (whether on-ear or off-ear), a headset, a watch, eyeglasses, audio accessories or clothing (e.g., audio hats, audio visors, audio jewelry), neck-worn speakers, shoulder-worn speakers, body-worn speakers, etc. Some disclosed aspects may be particularly applicable to personal (wearable) audio devices, such as over-ear headphones, on-ear headphones, in-ear headphones (also called earbuds), audio glasses, or other head-worn audio devices.

[0051] Wearable audio devices described according to various implementations may include features found in one or more other wearable electronic devices, such as smart glasses, smart watches, etc. These wearable audio devices may include additional hardware components, such as one or more cameras, position tracking devices, microphones, etc., and may be capable of voice recognition, visual recognition, and other smart device functions. The descriptions of wearable audio devices contained herein are not intended to exclude these additional capabilities in such devices.

[0052] As described herein, conventional electronic devices (e.g., modular wearable audio devices) can include loose-fitting and / or cumbersome attachment mechanisms, which can often result in poor mechanical and / or electrical connections. These poor connections can also adversely affect audio performance. Furthermore, conventional electronic devices, such as wearable audio devices, can generate static charges that can adversely affect performance and / or pose safety concerns for users.

[0053] Various implementations include electronic devices (e.g., wearable audio devices) and associated systems that enable snap-fit ​​and / or friction-fit connections between audio earpieces and electronic components. The snap-fit ​​and / or friction-fit connectors provide a secure connection between the electronic component and the earpiece. In various implementations, the electronic device includes a detent spring positioned to act as a contact feature (e.g., a limiter) to secure the connection with the earpiece and that functions as an ESD sink for the earpiece and / or electronic component.

[0054] Some exemplary implementations relate to audio devices, including aviation headsets. Aviation headsets are used by pilots in both general and commercial aviation. Such headsets can be connected to aircraft communication systems, for example, to communicate with air traffic control (ATC) or with other pilots. The headsets can also be used as public address systems, for example, for pilots to communicate with passengers on board the aircraft. Aircraft communication systems typically include analog communication systems, such as intercoms. In some cases, such intercom systems can be configured to communicate over the very high frequency (VHF) band (e.g., 18 MHz to 136.975 MHz), with each channel separated from adjacent channels by a pre-specified bandwidth (e.g., 8.33 kHz in Europe, 25 kHz elsewhere). Analog modulation techniques, such as amplitude modulation (AM), can be used for communication, and conversations can be conducted in simplex mode. In some cases, for example, for transoceanic flights, other frequency bands, such as the high frequency (HF) band, can be used for satellite communications. Aviation headsets can be used, for example, by pilots and air traffic controllers to communicate with each other.

[0055] FIG. 1 illustrates an example of a wearable audio device 10, including an aviation headset 100. In certain cases, the headset 100 includes a frame with at least one earpiece (e.g., earcup) 105 on each side, which fits over, around, or over the user's ears. In some cases, the frame is optional, such that the earpieces 105 are tethered or wirelessly connected to other components within the wearable audio device 100. Each of the earcups 105 houses an acoustic transducer or speaker. The headset 100 also includes a headband (e.g., an over-the-head bridge) 110 for connecting the two earpieces (e.g., earcups) 105. In various implementations, the headset 100 is configured to position at least one, and in some cases both, earpieces 105 in proximity to the user's ears. For example, headset 100 (and other headset forms of audio device 10 described herein) may be configured to position earpiece 105 in close proximity to the user's ear when worn by the user. In certain cases, this proximity includes positioning earpiece 105 on or over the ear (e.g., with an earcup), in the ear (e.g., with an earbud), resting on the ear (e.g., with an earhook), etc. In some cases, close positioning may result in full, partial, or no occlusion of the user's ear.

[0056] In some implementations, electronic components (e.g., a microphone such as a boom microphone) 115 can be physically connected to one of the earcups 105. Headset 100 can connect to an aircraft intercom system using connecting cable 120 and can also include a control module 125 that includes one or more controls for headset 100. In certain cases, analog signals to and from the aircraft intercom system are transmitted over the wired connection provided by connecting cable 120. In other or additional cases, headset 100 can include electronics 70 such as a control chip and / or circuitry, electroacoustic transducers, microphones and associated modules, power components such as batteries and / or connectors, and interface components such as capacitive touch interface components. In certain cases, electronics 70 includes a controller coupled to the electroacoustic transducers, the controller also configured to interface with the electronic components when in a fixed position with audio device 10.

[0057] It is further understood that the electronics 70 may include other components not specifically shown in the accompanying drawings, such as communication components (e.g., wireless transceivers (WTs)) configured to communicate with one or more other electronic devices connected via one or more wireless networks (e.g., a local WiFi network, a Bluetooth connection, or a radio frequency (RF) connection), as well as amplification and signal processing components. The electronics 70 may also include motion and / or position tracking components, such as an inertial measurement unit (IMU), such as a microelectromechanical systems (MEMS) device combining a multi-axis accelerometer, a gyroscope, and / or a magnetometer, an optical tracking system, etc.

[0058] While the example of FIG. 1 shows an aviation headset including around-ear earcups, aviation headsets with other form factors, including headsets with in-ear or on-ear headphones, are also compatible with the technology described herein. In examples including in-ear headphones, the overhead bridge may be omitted, and the boom microphone may be attached to the user via the headset or via a separate structure. The term headset, as used herein, also includes various types of acoustic devices that may be used for aviation purposes, including, for example, earphones and earbuds. Additional headset features are disclosed, for example, in U.S. Patent Application No. 15 / 238,259 ("Communications Using Aviation Headsets," filed August 16, 2016), the entire contents of which are incorporated herein by reference.

[0059] It is further understood that any component described as connected or coupled to another component in audio device 10 or other systems disclosed according to an implementation may communicate using any conventional wired connection and / or additional communication protocol. In some cases, the communication protocol(s) may include a communication protocol using a wireless local area network (LAN), such as a Wi-Fi protocol, IEEE 802.11b / g, a cellular network protocol (e.g., 3rd, 4th, or 5th generation (3G, 4G, 5G cellular networks)), or one of several Internet-of-Things (IoT) protocols, such as Bluetooth, BLE Bluetooth, ZigBee (mesh LAN), Z-wave (sub-GHz mesh network), 6LoWPAN (lightweight IP protocol), LTE protocol, RFID, ultrasonic audio protocol, etc. In various particular implementations, components housed separately within audio device 10 are configured to communicate using one or more conventional wireless transceivers.

[0060] It will be appreciated that the wearable audio device 10 according to various implementations can take on additional form factors. For example, FIG. 2 illustrates a wearable audio device 10 in the form of a personal communication headset 10 (e.g., an aviation headset). Reference numbers followed by "A" or "B" indicate features corresponding to the right or left side of the audio device 10, respectively. The audio device 10 includes a headband having an arcuate portion 130 and right and left ends. A right housing 132A and a left housing 132B are disposed at the right and left ends of the headband, respectively. The arcuate portion 130 functions as an over-the-head bridge between the left and right housings 132. A spring band 134 (e.g., spring steel) extends from the right housing 132A, through the arcuate portion 130, to the left housing 132B. The spring band 134 provides a clamping force to move the housings 132 toward each other (approximately along a horizontal plane passing through the wearer's head) while the headband is worn by a user. The left and right housings 132 can be moved a distance up or down toward or away from the arcuate portion 130 to accommodate smaller or larger heads, respectively.

[0061] A pad (right pad 136A or left pad 136B, generally 136) is attached to each housing 132 and is used to comfortably secure headset 10 to the head. As used herein, "pad" means a compliant member that can compress and / or deform under applied pressure and is configured to contact a user's head in a manner that supports the headband. In some cases, when audio device (headset) 10 is worn on the head, each pad 136 extends from its front end above the ear to its rear end below the head and behind the ear. In certain cases, pads 136 each have a contoured surface 138 for contacting the user's head. A boom 140 extends from a rotatable base 142 near the bottom of one of the housings (e.g., right housing 132A as shown) and is used to position and support a microphone 144 attached to the other end. The boom 140 can be adjusted in part by rotating it about its base 142 to properly position the microphone 144 relative to the user's mouth. The boom 140 may be permanently fixed to the housing 132A or may be detachable so that the audio device 10 can be used for both aviation and non-aviation applications (e.g., music playback). A connector 146 for a communications cable extends from the bottom of the right housing 132A. An earpiece (e.g., earbud) connector cable 148 extends at one end from each housing 132. The opposite end of the flexible cable 148 is suitable for connecting to an earpiece, such as an earbud or other type of in-ear headphone. Additional features of the audio device 10 of FIG. 2 are described in U.S. Pat. No. 10,187,718, the entire contents of which are incorporated herein by reference.

[0062] FIG. 3 illustrates an additional exemplary audio device 10, including audio glasses 210. As illustrated, audio glasses 210 may include a headband (e.g., frame) 220 having a lens region 230 and a pair of arms 240 extending from lens region 230. Similar to traditional eyeglasses, lens region 230 and arms 240 are designed to rest on a user's head. Lens region 230 may include a set of lenses 250, which may include prescription, non-prescription, and / or light-filtering lenses, as well as a bridge 260 (which may include padding) for resting on the user's nose. Arms 240 may include contours 265 for resting on each of the user's ears. Contained within frame 220 (or substantially housed such that components may extend beyond the boundaries of the frame) are electronics 70 and other components for controlling audio glasses 210, depending on the particular implementation. Electronics 70 may include portions of, or connectors for, one or more electronic components, such as those described with respect to audio device 10 herein. In some cases, separate or overlapping sets of electronics 70 are contained in multiple portions of the frame, such as in each of the corresponding arms 240 in frame 220. However, certain components described herein may exist in a single form.

[0063] FIG. 4 illustrates another audio device 10 including around-ear headphones 310. The headphones 310 may include a pair of earpieces (e.g., earcups) 320 configured to fit over or over a user's ears. A headband 330 spans between the pair of earpieces 320 and is configured to rest on the user's head (e.g., over the top of the head or around the head). The headband 330 may include a head cushion 340 in some implementations. One or both of the earpieces 320 house electronics 70 and other components for controlling the headphones 310, depending on the particular implementation. The electronics 70 may include one or more portions of electronic components, or connectors therefor, such as those described with respect to the audio device 10 herein. It should be understood that many of the wearable audio devices described herein can utilize features of various implementations, and the wearable audio device 10 shown and described with reference to FIGS. 1-4 is merely exemplary.

[0064] 5 and 6 show side and perspective views, respectively, of an earpiece 400 in audio device 10 according to various implementations. In some cases, earpiece 400 comprises an earcup, such as earcup 105 in the aviation headset of FIGS. 1 and / or 2, or the earcup in the over-ear headset shown in FIG. 4. In other cases, earpiece 400 can represent a portion of an in-ear or near-ear earpiece configured to output audio to a user's ear, for example, in arm 240 of audio glasses shown in FIG. 3.

[0065] In this exemplary implementation, earpiece 400 includes a slot 410 configured to engage with electronic component 420. In this example, electronic component 420 includes a connector 430, such as a cable connector (e.g., cable connector 120 of FIG. 1 ). However, electronic component 420 can take any form that can be selectively engaged with earpiece 400. For example, in some cases, electronic component 420 includes a boom microphone, a battery module, a power connector, a sensor module, a communication module (e.g., a Bluetooth module), a self-powered communication module (e.g., a self-powered Bluetooth module), and / or a microphone module. While one earpiece 400 is shown in various figures herein, it is understood that both earpieces 400 in audio device 10 can include slots 410 for accommodating one or more electronic components 420, e.g., for engaging the same type of electronic component or different types of electronic components.

[0066] In various implementations, the slot 410 includes at least one connector 440 for selectively engaging (e.g., mating with) the electronic component 420 and holding the electronic component 420 in contact with the earpiece 400. In particular implementations, the connector 440 includes one or more snap-fit ​​and / or friction-fit connectors. In particular examples, the snap-fit ​​connector(s) and / or friction-fit connector(s) (or "connectors") 440 each include at least one locking protrusion 450 in the slot 410 that is sized to complement a movable arm 460 in the electronic component 420 in a fixed position. In some examples, the connector 440 includes multiple locking protrusions 450, such as the pair of locking protrusions 450 shown in FIGS. 4 and 5, for selectively engaging a pair of movable arms 460 in the electronic component 420. In particular implementations, each locking protrusion 450 includes a ridge 470 with an opening 480 (FIG. 6) extending at least partially therethrough. In some cases, the movable arm 460 on the electronic component 420 is configured to engage and disengage with the opening 480 in the fixed protrusion 450. That is, in certain implementations, the movable arm 460 is configured to engage with the opening 480 of the fixed protrusion 450 in a locked position and disengage from the opening 480 in an unlocked position. FIGS. 7 and 8 show side and perspective views, respectively, illustrating the movable arm 460 in relation to the fixed protrusion 450 in an engaged but unlocked position. FIGS. 9 and 10 show side and perspective views, respectively, illustrating the movable arm 460 in relation to the fixed protrusion 450 in a locked position. FIGS. 8 and 10 show the movable arm(s) 460 separated from the fixed protrusion(s) 450.

[0067] In certain implementations, the movable arm 460 includes a tab (or protrusion) 490 shaped to complement the opening 480 of the fixed protrusion 450. That is, in various implementations, the tab 490 is configured to mate with the opening 480 to engage the movable arm 460 with the fixed protrusion 450. In certain cases, the tab 490 is sized to contact the fixed protrusion 450 on one or more surfaces inside the opening 480, and in certain cases, the tab 490 is sized to substantially fill the opening 480 when engaged. Additionally, the movable arm 460 may include at least one rotatable or pivotable member 500 for moving about a fixed pin (or post) 510 on the electronic component 420 ( FIGS. 7 , 9 , and 11 ). The rotatable or pivotable member 500 may include an opening 520 for slidably engaging with a fixed pin (or post) 510, thereby facilitating, for example, the rotation of the rotatable or pivotable member 500 around the fixed pin (or post) 510 to lock the movable arm 460 with the earpiece 400.

[0068] 5-10, and particularly with reference to FIGS. 9 and 10, it can be seen that connector 440, when in the locked position, is aligned to apply a resistive force to movable arm 460 in response to a downward force on electronic component 420. FIG. 11 shows an enlarged side view of electronic component 420 locked in slot 410. As shown in this figure, when a downward force (large arrow) is applied to electronic component 420 in the locked position, connector 440 applies a resistive force to arm(s) 460 to maintain coupling between electronic component 430 and connector. In certain cases, when in the locked position, connector 440 alone applies the necessary resistive force to prevent downward movement of electronic component 420 relative to earpiece 400. That is, in certain cases, electronic component 420 is configured to be inserted into slot 410 in a first direction, and once engaged (e.g., locked), connector 440 alone prevents movement of electronic component 420 relative to slot 410 in a second direction opposite the first direction. In some cases, the first direction is upward and the second direction is downward. However, in other cases, the first direction may be into the page (e.g., as shown in the side view of FIG. 11 ), while the second direction may be out of the page. In other words, once engaged, connector 440 alone holds electronic component 420 in a substantially fixed position with earpiece 400.

[0069] 5-11 , in various implementations, movable arm(s) 460 include actuatable portion 530 that is accessible from outside of electronic component 420, even when electronic component 420 is engaged with earpiece 400 (e.g., in a fixed position). That is, when connector 440 is inserted into slot 410, actuatable portion 530 of arm(s) 460 remains outside of slot 410, thereby allowing a user to control the engagement and disengagement of electronic component 420 from earpiece 400. In these cases, a user can push or pull actuatable portion(s) 530 to move arm(s) 460 to engage and / or disengage fixed protrusion 450. That is, in certain cases, such as those shown in FIGS. 5 and 7 , after engaging connector 440 with slot 410, a user can apply a clamping or inward force to actuable portion 530 to move arm 460 and lock arm 460 with locking projection 450. As described herein, once locked, connector 440 can only be removed by moving arm 460 via actuable portion 530, e.g., by pulling actuable portion 530 outward. In various implementations, actuation of arm 460 can be performed without the use of external tools, such as a screwdriver, pliers, wrench, or the like. That is, in contrast to traditional external electronic component connections for audio devices, audio device 10 includes connector 440 that allows earpiece 400 and electronic component 420 to be coupled and separated without tools. In other words, electronic component 420 and earpiece 400 are configured to be coupled and separated by hand without the aid of an external tool.

[0070] The example electronic component 420 of FIGS. 5-10 can include any number of electronic components described herein. In some cases, the earpiece 400 forms an acoustic seal around the user's ear and / or around the entrance to the user's ear canal. In particular cases, when connected with the earpiece 400 in the slot 410, the electronic component 420 and the earpiece 400 are positioned to form an acoustic seal around the user's ear. That is, in various implementations, when the electronic component 420 is engaged with the earpiece 400 (e.g., in a fixed position), they collectively seal the earpiece cavity. In particular implementations, such as when the audio device 10 includes noise cancellation capabilities, the acoustic seal around the user's ear can aid in the noise cancellation function. For example, the acoustic seal can assist in passive noise cancellation or passive noise reduction (PNC or PNR), and in some cases, active noise cancellation or reduction (ANC or ANR).

[0071] As seen in FIGS. 6, 8, and 10, earpiece 400 may also include an opening 540 connected with slot 410 for accommodating electronics connection 550 (e.g., FIGS. 5 and 6). In some cases, electronics connection 550 includes an electrical and / or data connection, such as a power connection to the earpiece, or a communication or other data connection. FIGS. 12 and 13 show cross-sectional views of portions of earpiece 400 and electronics 420 in two positions, e.g., a contacting but unlocked position in FIG. 12 (similar to FIG. 7), and an engaged or locked position in FIG. 13 (similar to FIGS. 9 and 11). In the locked position shown in FIG. 13, earpiece 400 is configured to engage gasket 560 proximate electronics connection 550 to seal the connection of electronics 420 with earpiece 400. In some cases, gasket 560 surrounds the connections of the electronic device, and in particular cases, gasket 560 seals the housing of electronic component 420 adjacent electronic component connection 550. In particular cases, electronic component 420 is potted to additionally seal electronic component connection 550 and slot 410 in a fixed position ( FIG. 13 ). In particular cases, the sealed electronic component connection 550 substantially isolates electrical noise from movement of electronic component 420 relative to earpiece 400. For example, in some cases, electronic component 420 is configured to move relative to earpiece 400 while in a fixed position. For example, if electronic component 420 includes a boom microphone, the boom microphone may be configured to rotate relative to earpiece 400. In these cases, gasket 560 isolates electrical noise from movement of the boom microphone relative to earpiece 400.

[0072] FIG. 14 illustrates an exploded perspective view of electronic device 420A according to various implementations. FIG. 15 illustrates an enlarged view of electronic device 420A of FIG. 14. In various implementations, electronic device 420A may include similar features (e.g., similar mounting features, such as electronic component connector 550 and connector 430) as those described with reference to electronic component 420 illustrated in FIGS. 5-13. Similar labeled components between the figures may be considered substantially similar in function. Furthermore, as described with respect to electronic component 420, electronic device 420A may include connector 430, such as a cable connector (e.g., cable connector 120 of FIG. 1). However, electronic device 420A may take any form capable of selectively engaging with another component, such as components of an audio headset. In this example, electronic device 420A may take any form capable of selectively engaging with earpiece 400. For example, in some cases, electronic device 420A includes a boom microphone, a battery module, a power connector, a sensor module, a communication module (e.g., a Bluetooth module), a self-powered communication module (e.g., a self-powered Bluetooth module), and / or a microphone module. Although one earpiece 400 is shown in various figures herein, it is understood that both earpieces 400 in audio device 10 can include slots 410 for accommodating one or more electronic components 420A, e.g., for engaging the same or different types of electronic components.

[0073] 14 and 15, in various implementations, an electronic device 420A includes a housing 600 having a detent spring 610 inside the housing 600. FIG. 16 shows a view of the detent spring 610 separated from the housing 600, allowing certain features of the detent spring 610 to be more easily visible. Please refer to FIGS. 14 through 16 simultaneously.

[0074] In certain implementations, housing 600 includes one or more portions that house internal components, such as detent spring 610. For example, as shown in FIG. 14 , housing 600 includes a base 620 and a cap 630 that fits over the base, e.g., to seal the components within housing 600, provide ingress protection, etc. In certain cases, cap 630 includes exterior surface 640, e.g., the outermost surface of housing 600 when component 420A is coupled with a headset (e.g., with earpiece 400). In some cases, cap 630 can include an accessory component 642, e.g., boom microphone 650 in the example shown in FIG. 14 . In other cases, cap 630 can include an interface, a button, a tactile feature (e.g., treads), etc. As discussed herein, in certain cases, detent spring 610 is internal to housing 600, such that detent spring 610 is contained within the walls of housing 600.

[0075] In various implementations, detent spring 610 (i) is positioned to contact feature 660 that is at least partially exterior to housing 600 (e.g., the exterior region labeled 662) and (ii) acts as an ESD sink for component 420A and / or a connected device (e.g., earpiece 400). In certain cases, feature 660 extends through housing 600, for example, through a slot 670 in housing 600 (shown as slot 670 in the base of housing 600 or through a sidewall of housing 600). In one example, feature 660 includes one or more movable arms 460 as described with reference to electronic component 420 ( FIGS. 11 , 12 ). In various implementations, feature 660 (e.g., movable arm(s) 460) includes metal. In additional implementations, feature 660 can include plastic or a composite material. In certain cases, the detent spring 610 directly contacts the feature 660 .

[0076] In certain examples, the detent spring 610 includes a plate 680 coupled to the housing 600. In some cases, as shown in FIGS. 14 and 15 , the plate 680 is coupled to the base 620 of the housing 600. In other cases, the plate 680 is coupled to a sidewall of the housing 600 and / or the cap 630. In certain examples, the detent spring 610 also includes a set of arms 690 extending from the plate 680 positioned to contact the features 660. In some examples, the set of arms 690 includes two arms, one for contacting each of the two features 660 (e.g., the movable arms 460). In certain non-limiting examples, the set of arms 690 contacts only the features 660, i.e., directly contacts only the features 660. In other examples, the set of arms 690 may be at least partially mounted on the housing 600 but primarily contacts the features 660. In some embodiments, each arm 690 can include one or more segments connected, for example, by a contour, a bend, or the like. In certain cases, the outer surface of each arm 690 that contacts feature 600 is rounded. In some examples, arm 690 is part of a single continuous piece that includes a bend to apply a spring-like force (e.g., an outward force) against feature(s) 660. In other cases, arm 690 is a separate piece configured to apply a force against feature 660. In certain examples, detent spring 610 includes or is formed substantially of a metal. In other cases, detent spring 610 includes a non-metal. In either case, detent spring 610 includes a conductive material, for example, a conductive material that can function as an ESD sink.

[0077] As described herein, according to certain implementations, detent spring 610 acts as a limiter for feature 660, providing ESD protection for components within housing 600. For example, feature 660 can couple electronic device 420A to an audio headset, such as earpiece 400. In such a case, detent spring 610 can act as a limiter for feature 660, for example, limiting the rotation of movable arm 460. Additionally, detent spring 610 can act as an ESD sink for feature 660, for example, providing an ESD path from feature 660 to a ground plane or ground path (e.g., within connector 430). In such a case, an ESD event (also referred to as an ESD strike) at feature 660 (either within housing 600 or external to housing 600) can be directed through detent spring 610 and away from other electronics within the headset and toward the ground plane or ground path.

[0078] In examples where electronic device 420A is configured to couple with an audio headset (e.g., earpiece 400), housing 600 can further include a data connector 700 for connecting with a complementary data connector in the audio headset (e.g., in earpiece 400). In certain cases, data connector 700 is similar to electronics connection 550 of FIGS. 5 and 6 and includes electrical and / or data connections, such as a power connection to the earpiece, or communication or other data connections. In certain cases, data connector 700 can include a USB connector and / or an audio connector for facilitating data and / or audio communication between electronic device 420A and earpiece 400. In certain cases, as shown in the partial cutaway view of electronic device 420A (with cap 630 removed) in FIG. 17 , detent spring 610 is positioned proximate to an opening 710 in electronic device 420A, e.g., opening 710 in base 620. In certain cases, opening 710 is located on the back side of housing 600, e.g., opposite cap 630. In certain cases, this opening 710 is blocked on a first side by cap 630 when electronic device 420A is assembled and on a second side (e.g., on the back side of housing 600) when electronic device 420A is coupled to a headset (e.g., earpiece 400). Because static charges can flow through low-resistance paths, openings and associated airways or passageways within a device may provide an opportunity for an ESD event. For example, opening 710 may provide an opportunity for an ESD event between one or more components within earpiece 400 and one or more components within electronic device 420A. Beneficially, detent spring 610 is proximate opening 710 and can provide ESD protection to the headset (e.g., earpiece) through opening 710. That is, the detent spring 610 can act as an ESD sink for static charges transmitted through and / or near the opening 710 .

[0079] In various implementations, the detent spring 610 provides ESD protection of approximately 15 kilovolts (kV) or greater to the electronic device 420A and connected components (e.g., the earpiece 400 and associated headset). In such cases, the detent spring 610 can provide the headset with sufficient ESD protection to comply with aviation and / or military ESD standards, such as Federal Aviation Administration (FAA) ESD standards or thresholds for aviation headsets. In various implementations, the detent spring 610 provides ESD protection as an ESD sink or static charge outlet. For example, with reference to FIGS. 15 and 16 , the detent spring 610 can be grounded by a ground connection 720 in the electronic device 420A. In certain cases, the ground connection 720 includes a ground tab 730 connected to a ground plane 740 in the connector 430. In some cases, the ground tab 730 includes a metal or other conductive tab, such as a solder tab. In certain aspects, the ground tab 730 contacts a ground plane 740 within the connector 430, which in the example shown in Figure 15 is a ground wire. In certain additional cases, the detent spring 610 further contacts the housing 600 and a wire 750 within the housing 600, e.g., the ground tab 730 contacts the ground plane (wire) 740.

[0080] 15-17 show further details of the interaction between the detent spring 610 and the feature 660, particularly the arm 690 and the feature 660 that is at least partially external to the housing 600. In operation, the arm 690 of the detent spring 610 is positioned to contact the feature 660 within the housing 600. As described herein, the feature 660 can include the rotating (or pivotable) member 500 of the movable arm 460 and provide friction against the movement of the movable arm 460. The pivotable member 500 can pivot or rotate about the fixed pin (or post) 510, while the arm 690 of the detent spring 610 contacts the pivotable member 500. In various implementations, the detent spring 610 (i.e., each arm 690) is positioned such that it is in contact with the pivotable member 500's axis of rotation (a R) to each pivotable member 500. In certain cases, as shown in FIGS. 15 and 17, for example, each pivotable member 500 may include a recess 760 for accommodating an arm 690 of a detent spring 610. In certain cases, the recess 760 may be configured to rotate relative to the axis of rotation (a R ), for example, from about 30 degrees to about 120 degrees. In certain cases, the frictional force exerted against each pivotable member 500 reduces vibratory movement or rattle of the pivotable member 500 and / or the connected movable arm 460. For example, during use of a headset including electronic device 420A, detent springs (particularly arms 690) exert sufficient frictional force against movable arms 460 (particularly at pivotable member 500) to reduce rattle that may be caused by environmental factors such as vibration and / or acoustic energy, as well as loosening of the interface between pivotable member 500 and fixed pin 510 that may result from use over time.

[0081] As described herein, in some cases, the detent spring 610 includes an arm 690 extending from a plate 680 positioned to contact the feature 660. Other types of detent springs having different configurations are possible. Looking at the example electronic device 420A in FIGS. 15 and 16 , a first position feature 770 is located on the housing 600 and a second position feature 780 is located on the detent spring 610. In certain cases, the first position feature 770 and the second position feature 780 are complementary and help maintain the position of the detent spring 610 relative to the housing 600. For example, the first position feature 770 and the second position feature 780 may include male / female protrusions / slots to mediate and limit the movement of the detent spring 610 relative to the housing 600. In certain cases, the positioning features 770, 780 engage with one another, for example, such that the arm 690 contacts the feature 660 (e.g., at the recess 760), to position the detent spring 610 in a beneficial location within the housing 600. In some implementations, the electronic device 420A further includes a first retention feature 790 on the housing 600 and a second retention feature 800 on the detent spring 610, for example, to retain the detent spring 610 relative to the housing 600. In certain aspects, the retention features 790, 800 are complementary and, in certain examples, include a snap-fit ​​and / or friction-fit connection to retain the detent spring 610 relative to the housing 600. In some cases, the retention features 790, 800 reduce movement (e.g., rattle) of the detent spring 610 relative to the housing 600 during use in high-vibration environments, for example, during aviation and / or military use.

[0082] In contrast to conventional devices, audio devices and related electronic devices according to various implementations offer several advantages. For example, the electronic devices disclosed herein can provide ESD protection for connected devices, such as connected audio devices. Furthermore, the electronic devices disclosed herein can enhance the fit of components within an audio device, such as a headset, by applying frictional forces against moving parts. In some examples, audio devices employing the electronic devices can benefit from detent springs that have two beneficial functions: as vibration reducers and as ESD sinks. Audio devices shown employing electronic devices according to various implementations can provide an enhanced user experience and improved performance compared to conventional audio devices.

[0083] In various implementations, components described as being "coupled" to one another can be joined along one or more interfaces. In some implementations, these interfaces can include joints between separate components, while in other cases, these interfaces can include rigidly and / or integrally formed interconnects. That is, in some cases, components "coupled" to one another can be formed simultaneously to define a single, continuous member. However, in other implementations, these coupled components can be formed as separate members and then joined by known processes (e.g., soldering, fastening, ultrasonic welding, bonding). In various implementations, electronic components described as being "coupled" can be linked via conventional wired and / or wireless means such that the electronic components can communicate data with one another. Additionally, subcomponents within a given component can be considered to be linked via conventional pathways, although not necessarily shown.

[0084] Other embodiments not specifically described herein are also within the scope of the following claims. Elements of different implementations described herein may be combined to form other embodiments not specifically described above. Elements may be removed from the structures described herein without adversely affecting the operation of the structures described herein. Furthermore, various separate elements may be combined into one or more individual elements to perform the functions described herein. [Explanation of symbols]

[0085] 70 Electronic equipment 100 Aviation Headset 105 earpiece 110 Headband 115 Electronic Components 120 connection cable 125 control module 130 Arcuate part 132 Housing 132A Right Housing 132B Left housing 134 bands 136 Pad 136A Right Pad 136B Left Pad 138 Contour Surface 140 Boom 142 Rotatable base 144 microphone 146 Connector 148 Earpiece connector cable 210 Audio Glasses 220 Headband 230 Lens Area 240 Arm 250 lens 260 Bridge 265 Contour 310 Around-Ear Headphones 320 earpiece 330 Headband 340 Head Cushion 400 earpieces 410 Slots 420 Electronic Components 420A Electronic Devices 430 Connector 440 Friction-fit Connector 450 Fixed protrusion 460 Movable Arm 470 Ridge 480 opening 490 tabs 500 pivotable member 510 Fixing pin 520 Opening 530 Operable part 540 Opening 550 Electronic component connection part 560 Gasket 600 Housing 620 base 630 Cap 640 Exterior 642 Accessory parts 650 Boom Microphone 660 Features 670 Slots 680 Plate 690 Arm 700 Data Connector 710 Opening 720 Ground Connection 730 Grounding Tab 740 Ground plane 750 Wiring 760 recess 770 first position feature 780 second location feature 790 first retention feature 800 Second Retaining Feature

Claims

1. Housing and a detent spring within the housing; The electronic device, wherein the detent spring i) is positioned to contact a feature that is at least partially exterior to the housing, and ii) acts as an electrostatic discharge (ESD) sink.

2. The electronic device of claim 1 , wherein the detent spring further acts as a limiter for the feature and provides ESD protection for components within the housing.

3. The electronic device of claim 1 , wherein the detent spring is contained within the housing.

4. The electronic device of claim 1 , wherein the features on the exterior of the housing enable coupling of the electronic device to an audio headset.

5. The electronic device of claim 4 , wherein the housing includes a data connector for connecting with a complementary data connector in the audio headset.

6. 5. The electronic device of claim 4, wherein the detent spring is configured to be proximate an opening in the electronic device and provide ESD protection for the audio headset through the opening.

7. The electronic device of claim 6 , wherein the opening is blocked when the electronic device is coupled to the audio headset.

8. 10. The electronic device of claim 1, wherein the detent spring provides ESD protection for the electronic device of about 15 kilovolts (kV) or greater.

9. The electronic device of claim 1 , wherein the detent spring is grounded via a ground connection within the electronic device.

10. The electronic device of claim 1 , wherein the external movable part includes at least one movable arm for engaging a slot in a wearable audio device.

11. The electronic device of claim 1 , wherein the detent spring further contacts the housing and wiring within the housing.

12. The electronic device of claim 1 , wherein the features on the exterior of the housing include movable exterior parts comprising metal.

13. 10. The electronic device of claim 1, wherein the detent spring further comprises a plate coupled to the housing and a pair of arms extending from the plate that contact the feature on the exterior of the housing.

14. The electronic device of claim 1 , wherein the detent spring includes a set of arms that contact only the feature on the exterior of the housing.

15. 10. The electronic device of claim 1, wherein a portion of the housing is configured to be inserted in an insertion direction into a slot in a wearable audio device, the slot having one or more snap-fit ​​and / or friction-fit connectors, and the feature on the exterior of the housing includes a component having a movable arm configured to selectively engage with the one or more snap-fit ​​and / or friction-fit connectors, wherein when the movable arm is engaged with the one or more snap-fit ​​and / or friction-fit connectors, the one or more snap-fit ​​and / or friction-fit connectors provide a resistive force against the movable arm in response to a force on the portion in a direction opposite the insertion direction.

16. 16. The electronic device of claim 15, wherein each of the snap-fit ​​and / or friction-fit connectors comprises at least one locking protrusion within the slot sized to complement the movable arm of the electronic component in the fixed position.

17. The electronic device of claim 1 , wherein the detent spring acts as an ESD sink for the features that are at least partially external to the housing.

18. A pair of earphones and a headband for connecting the pair of earphones; At least one of the earbuds includes a slot with one or more snap-fit ​​and / or friction-fit connectors for connecting with an electronic device, the electronic device comprising: Housing and a feature that is at least partially external to the housing; a detent spring internal to the housing that contacts the feature on the exterior of the housing and acts as an electrostatic discharge (ESD) sink; the features on the exterior of the housing are configured to engage with the one or more snap-fit ​​and / or friction-fit connectors in the slots; Aviation headset.

19. 20. The aviation headset of claim 18, wherein the detent spring acts as a limiter for the features on the exterior of the housing and acts as an ESD sink from the at least one earbud.

20. 20. The aviation headset of claim 19, wherein the detent spring is contained within the housing.

Images