Integrated cleaning and drying module for cleaning substrates

Abstract

In one embodiment, the cleaning and drying module includes a process rotor having gripping pins for holding a substrate. The process rotor rotates and moves between a lowered position and an elevated position. Each of the sweep arms has a nozzle mechanism for applying cleaning and / or drying fluid to the substrate. The collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by the bottom and inner surface of the collection rotor. The collection weir collects fluid and particles from the process rotor and the substrate. A drain hole is positioned within the collection weir and discharges the fluid and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor, defining an annular space between the rotor cover and the collection rotor. An exhaust air intake is drawn through the drain hole to receive the collected fluid and particles.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present disclosure relate generally to apparatus and methods for cleaning processed substrates, and more particularly to an integrated cleaning and drying module that can be used to clean the surface of a substrate. [Background technology]

[0002]

[0002] A substrate processing unit may perform chemical mechanical polishing (CMP), which is typically used to planarize or polish a material layer deposited on a substrate during the manufacture of high-density integrated circuits. In a typical CMP process, a substrate is held in a carrier head, which presses the backside of the substrate against a rotating polishing pad in the presence of a polishing fluid. Through a combination of the polishing fluid and the chemical and mechanical activity caused by the relative motion of the substrate and polishing pad, material is removed across the surface of the material layer of the substrate in contact with the polishing pad. Typically, after one or more CMP processes are completed, the polished substrate is further processed using one or more post-CMP substrate processing steps in a CMP processing system. For example, the polished substrate may be further processed using one or more cleaning steps in a cleaning unit. Various cleaning steps may be performed in a cleaning unit having multiple cleaning stations (i.e., cleaning modules). Once post-CMP processing is complete, the substrate can be removed from the CMP processing system and sent to a subsequent device manufacturing system (such as a lithography, etch, or deposition system).

[0003] Typically, a substrate enters a CMP tool's cleaning unit from a polisher and is inserted into one or more cleaning modules for processing. The substrate is then transferred to a drying module. As the substrate becomes increasingly "clean" as it moves through the process, the final transfer from the cleaning module to the drying module is the most critical, as it is where the potential for oxidation and contamination is greatest, depending on time and handling. In one example, particles can become deposited on the substrate as it passes from the cleaning module to the drying module. Therefore, the post-CMP cleaning process may not provide optimal particle-free performance.

[0004] Furthermore, during the final rinsing and drying steps performed in conventional drying modules, nozzles typically flow a fluid, such as deionized water, onto the substrate. The water flowing onto the substrate can splash and bounce back onto the substrate surface. On particularly hydrophobic surfaces, the splashes can bead up on the substrate. During the subsequent drying stage, the water can evaporate, leaving behind watermarks. Watermarks can result from the outline of a water bead, which can be the result of redepositing particles that were supposed to be removed by the rinsing step. Alternatively, these watermarks can result from the hydrolysis of deionized water, which produces small amounts of hydroxide ions that, in the presence of oxygen, oxidize the silicon substrate and form oxide deposits during final drying.

[0005] Therefore, there is also a need for an improved final drying process in the final cleaning module. Summary of the Invention

[0006] In one exemplary embodiment, the cleaning and drying module includes a process rotor having a plurality of gripper pins configured to releasably hold a substrate. The process rotor is configured to rotate and move between a lowered position and an elevated position. Each of a plurality of sweep arms includes a nozzle mechanism configured to apply a cleaning and / or drying fluid to the substrate. The collection rotor is configured to rotate synchronously with the process rotor. The collection rotor defines a processing space between the process rotor and an interior of the collection rotor. The collection rotor includes a sidewall extending above the process rotor in the lowered position, the inner surface of the sidewall sloping inward from the lower portion to the upper portion. The collection rotor further includes a collection weir defined by the bottom and inner surface of the collection rotor. The collection weir is configured to collect fluid and particles from the process rotor and the substrate. A plurality of drain holes are positioned within the collection weir adjacent the inner surface of the sidewall. The drain holes are configured to drain the collected fluid and particles from the collection weir. The rotor cover surrounds and extends above the sidewall of the collection rotor, defining an annular space between the rotor cover and the collection rotor. The process rotor extends above the rotor cover in the raised position. The exhaust is in communication with the drain hole. The exhaust is configured to draw air from the process space and the annular space through the drain hole and receive the collected fluid and particles.

[0007] In another exemplary embodiment, the cleaning and drying module includes a process rotor having a plurality of gripper pins configured to releasably hold a substrate. The process rotor is configured to rotate and move between a lowered position and an elevated position. At least one sweep arm has a nozzle mechanism configured to apply cleaning and / or drying fluid to the substrate. The collection rotor is configured to rotate synchronously with the process rotor. The collection rotor defines a processing space between the process rotor and an interior of the collection rotor. The collection rotor includes a sidewall extending above the process rotor in the lowered position, the inner surface of the sidewall sloping inward from the lower portion to the upper portion. The collection rotor further includes a collection weir defined by the bottom and inner surface of the collection rotor. The collection weir is configured to collect fluid and particles from the process rotor and the substrate. A plurality of drain holes are positioned within the collection weir adjacent the inner surface of the sidewall. The drain holes are configured to drain the collected fluid and particles from the collection weir. The rotor cover surrounds and extends above the sidewall of the collection rotor, defining an annular space between the rotor cover and the collection rotor. The process rotor extends above the rotor cover in the raised position. The exhaust is in communication with the drain hole. The exhaust is configured to draw air from the process space and the annular space through the drain hole and receive the collected fluid and particles. The housing covers the process rotor, the collection rotor, the rotor cover, and the sweep arm. The housing includes a first door on a first side of the housing and a second door on a second side of the housing different from the first side.

[0008] In another exemplary embodiment, a method for cleaning a substrate in a cleaning and drying module is provided. The method includes placing the cleaning and drying module in a first substrate transfer position. In the first substrate transfer position, a process rotor is in a raised position, multiple gripping pins on the process rotor are in a substrate release position, a first door on a first side of the enclosure is open, and a second door on a second side of the enclosure different from the first side is closed. The method further includes receiving the substrate through the first door on multiple standoff pins on the process rotor. The method further includes placing the cleaning and drying module in a substrate cleaning and drying position. In the substrate cleaning and drying position, the process rotor is in a lowered position, multiple gripping pins are in a substrate gripping position, and the first and second doors are closed. The method further includes performing a cleaning process on the substrate. The cleaning process includes rotating the substrate gripped by the process rotor and the gripping pins and applying a cleaning fluid to the substrate using a first nozzle mechanism attached to a first sweep arm. The method further includes performing a final rinse and dry process on the substrate. The final rinse and dry process includes rotating the substrate gripped by the process rotor and gripping pins and applying at least one of a rinsing fluid and a drying fluid to the substrate with a second nozzle mechanism attached to a second sweep arm. The method further includes placing the cleaning and drying module in a second substrate transfer position. In the second substrate transfer position, the process rotor is in a raised position, the plurality of gripping pins on the process rotor are in a substrate release position, the substrate is supported on standoff pins, the first door is closed, and the second door is open. The method further includes allowing the substrate to be removed through the second door.

[0009] An embodiment of the present disclosure includes a cleaning and drying module comprising a process rotor having a plurality of gripper pins configured to releasably hold a substrate, the process rotor configured to rotate and move between a lowered position and a raised position, a plurality of sweep arms, each sweep arm having a nozzle mechanism configured to apply a fluid to the substrate, and a collection rotor configured to rotate synchronously with the process rotor and defining a processing space between the process rotor and an interior of the collection rotor, the collection rotor having a sidewall extending above the process rotor in the lowered position, the inner surface of the sidewall sloping inward from a lower portion to an upper portion, the sidewall being defined by a bottom and inner surface of the collection rotor. a collection rotor including a collection weir configured to collect fluid applied to the substrate, and a plurality of drain holes positioned in the collection weir proximate an inner surface of the sidewall, the plurality of drain holes configured to drain the collected fluid; a rotor cover surrounding and extending above the sidewall of the collection rotor, the rotor cover defining an annular space between the rotor cover and the collection rotor, and a plurality of gripper pins of the process rotor extending above the rotor cover when positioned in the raised position; and an exhaust pipe in communication with the drain holes, the exhaust pipe configured to draw air from the processing space and the annular space through the drain holes and receive the collected fluid.

[0010]

[0010] So that the above-mentioned features of the present disclosure can be understood in detail, a more particular description of the present disclosure briefly summarized above can be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the present disclosure may admit of other equally effective embodiments, and therefore, that the accompanying drawings illustrate only typical embodiments of the present disclosure and should not be considered as limiting the scope of the present disclosure. [Brief explanation of the drawings]

[0011] [Figure 1]1 is a schematic top view of an exemplary chemical mechanical polishing (CMP) processing system in accordance with one or more embodiments. [Figure 2A]

[0012] 1 illustrates a cross-sectional view of an example of an integrated cleaning and drying (ICD) module in a CMP processing system with a process rotor in a lowered position, in accordance with one or more embodiments. [Figure 2B]

[0013] FIG. 1 is a detailed cross-sectional view of a portion of an ICD module with the process rotor in a lowered position, according to one or more embodiments. [Figure 2C]

[0014] FIG. 2C is another detailed cross-sectional view similar to FIG. 2B, with the process rotor in a raised position, according to one or more embodiments. [Figure 3]

[0015] FIG. 2B is another cross-sectional view similar to FIG. 2A, with the process rotor in a raised position, according to one or more embodiments. [Figure 4A]

[0016] FIG. 1 is a top perspective view of an ICD module with the housing omitted, according to one or more embodiments. [Figure 4B]

[0017] FIG. 1 illustrates a top view of a process rotor of an ICD module according to one or more embodiments. [Figure 5]

[0018] FIG. 1 is a bottom perspective view of an ICD module with the housing omitted, according to one or more embodiments. [Figure 6]

[0019] 1 is an example of a sequence of operations performed in an ICD module, according to one or more embodiments. [Figure 7A]

[0020] FIG. 10 is a top perspective view of an alternative embodiment of an ICD module with the rotor cover in a lowered position and the housing omitted, according to one or more embodiments. [Figure 7B]

[0021] FIG. 7B is another top perspective view similar to FIG. 7A, with the rotor cover in a raised position, according to one or more embodiments. [Figure 8A]

[0022] FIG. 7C is a cross-sectional view of the ICD module of FIGS. 7A-7B with the rotor cover in a lowered position, according to one or more embodiments. [Figure 8B]

[0023] FIG. 8B is another cross-sectional view similar to FIG. 8A, with the rotor cover in a raised position, according to one or more embodiments. [Figure 9]

[0024] FIG. 10 is a top perspective view of another alternative embodiment of an ICD module including a spray bar and omitting the housing, according to one or more embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0012]

[0025] For ease of understanding, the same reference numerals have been used, where possible, to designate identical elements common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation thereof.

[0013]

[0026] FIELD OF THE INVENTION The embodiments described herein relate generally to equipment used in the manufacture of electronic devices, and more particularly to an integrated cleaning and drying module that may be used to clean and dry surfaces of substrates in a semiconductor device manufacturing process.

[0014]

[0027] FIG. 1 is a schematic plan view illustrating one embodiment of a chemical mechanical polishing (CMP) system 100 using the integrated cleaning and drying module (ICD) described herein. The CMP system 100 includes a factory interface 102, a polishing unit 104, and a cleaning unit 106. The factory interface 102 may include one or more loading stations 102A. The loading stations 102A may be, for example, FOUPs or cassettes. Each loading station 102A may contain one or more substrates 150 for CMP processing within the CMP processing system 100. A first substrate handler 110 is provided to transfer the substrates 150 between the loading station 102A and the cleaning unit 106. The first substrate handler 110 may also transfer the substrates 150 from the cleaning unit 106 to the loading station 102A. A second substrate handler 112 is also provided to transfer the substrates 150 between the cleaning unit 106 and the polishing unit 104. For example, the first substrate handler 110 may transfer the substrate 150 from the loading station 102A to the cleaning system 106 (e.g., to the cleaner pass-through 107), where the substrate 150 may be picked up by the second substrate handler 112.

[0015]

[0028] 1 , the cleaning unit 106 may be composed of two cleaning units 106A and 106B arranged parallel to each other on opposite sides of the second substrate handler 112. The cleaning unit 106A may include multiple modules, such as a first cleaning module 160, a second cleaning module 162, a third cleaning module 164, and a fourth cleaning module 166. The cleaning unit 106B may include multiple modules, such as a first module 161, a second module 163, a third module 165, and a fourth module 167.

[0016]

[0029] The first cleaning module 160 may be, for example, a pre-cleaning module that performs a pre-cleaning process, such as a buffing process, on the substrate 150 before the substrate 150 is transferred using the second substrate handler 112. The second cleaning module 162 and the third cleaning module 164 may be either or a combination of contact and non-contact cleaning systems to remove polishing by-products from the surface of the substrate 150 before the substrate 150 is transferred using the second substrate handler 112, such as used in cleaning systems generally referred to as spray boxes and / or scrubber brush boxes. The fourth cleaning module 166 may be, for example, a drying unit or a final cleaning and drying unit.

[0017]

[0030] According to an embodiment, cleaning unit 106B may be substantially a mirror-duplicate of cleaning unit 106A. In such a case, first module 161 is similar to first cleaning module 160, second module 163 is similar to second cleaning module 162, third module 165 is similar to third cleaning module 166, and fourth module 167 is similar to fourth cleaning module 166. Accordingly, any description and depiction of cleaning unit 106A herein and in the figures is to be understood inferentially as a description and depiction of cleaning unit 106B as well.

[0018]

[0031] Alternatively, one or more of first module 161, second module 163, third module 165, and fourth module 167 may be modules configured to perform a process other than a cleaning process. For example, one or more of first module 161, second module 163, third module 165, and fourth module 167 may be a metrology station for measuring the thickness of a layer of material disposed on substrate 150 before and / or after polishing, inspect substrate 150 after polishing to determine whether a layer of material has been removed from its field surface, and / or inspect the substrate surface for defects before and / or after polishing. As another example, one or more of the first module 161, the second module 163, the third module 165, and the fourth module 167 may be a location specific (LSP) polishing module configured to polish only a portion of the substrate surface after the substrate 150 has been polished in the polishing module, for example, to touch up a relatively small portion of the substrate 150 (e.g., remove additional material from a relatively small portion of the substrate 150), for example, based on measurement results or surface inspection results obtained using a metrology station.

[0019]

[0032] The cleaning units 106A, 106B may be separated by a cleaner passage 107. A second substrate handler 112 may be positioned within the cleaner passage 107. The second substrate handler 112 may pick up the substrate 150 from the cleaner passage 107 and transfer the substrate 150 to the transfer station 104A within the polishing unit 104. After the CMP process on the substrate in the polishing unit 104, the second substrate handler 112 may remove the substrate 150 from the transfer station 104A within the polishing unit 104 and then transfer the substrate 150 to a first module 160 within the cleaning unit 106.

[0020]

[0033] According to some embodiments, the second substrate handler 112 may also transfer substrates 150 between the various modules (above) of the cleaning units 106A, 106B. According to alternative embodiments, a third substrate handler (not shown) may be provided to transfer substrates 150 between the various modules of the cleaning unit 106A, and a fourth substrate handler (not shown) may be provided to transfer substrates 150 between the various modules of the cleaning unit 106B.

[0021]

[0034] A controller 190, such as a programmable computer, is connected to and configured to operate the elements of the cleaning unit 106. For example, the controller 190 can control the loading, unloading, and cleaning of the substrate 150 by the cleaning unit 106.

[0022]

[0035] The controller 190 may include a central processing unit (CPU) 192, memory 194, and support circuits 196, such as input / output circuits, power supplies, clock circuits, cache, etc. The memory 194 and support circuits 196 are connected to the CPU 192. The memory 194 is a non-transitory, computable, readable medium and may be one or more readily available memories (e.g., random access memory (RAM), read-only memory (ROM), floppy disk, hard disk, or other form of digital storage). Additionally, while the controller 190 is depicted as a single computer, it may also be a distributed system including, for example, multiple processors and memories operating independently. This architecture is adaptable to various cleaning situations based on the programming of the controller 190 to control the sequence and timing of movement of the substrate 150 between the various modules of the cleaning unit 106 and to control the individual operation of each of the various modules of the cleaning unit 106.

[0023]

[0036] 2A and 3 are cross-sectional views of an exemplary integrated cleaning and drying (ICD) module 200 according to one or more embodiments. According to an embodiment, the fourth cleaning module 166 may be implemented as the ICD module 200 described herein. As discussed further below, FIG. 2A illustrates the ICD module in a substrate processing configuration, and FIG. 3 illustrates the ICD module in a substrate loading / unloading configuration. The ICD module 200 may receive a substrate (e.g., the substrate 150) for a final cleaning and drying process after the substrate (e.g., the substrate 150) has been cleaned in one or more modules of the cleaning unit 106. The ICD module 200 may be utilized to remove contaminants from the substrate 150 that, if not removed, could cause the substrate 150 to fail contamination and defect requirements. The ICD module 200 may also be utilized to remove residual moisture from the substrate 150. If this moisture is not removed, the substrate 150 may subsequently become recontaminated as the substrate 150 is further handled inside and / or outside the CMP system 100 .

[0024]

[0037] ICD module 200 includes a process rotor 202, a collection rotor 204, a rotor cover 206, a first sweep arm 210, a housing 218, a first front nozzle assembly 220, a second sweep arm 230, a second front nozzle assembly 240, a plenum 250, a primary exhaust 260, a secondary exhaust 270, and an intake 280, as well as a lower nozzle assembly 290. In one or more embodiments, a controller 190 (FIG. 1) may control the function of ICD module 200.

[0025]

[0038] The process rotor 202 includes a plurality of standoff pins 208 extending from its upper surface. According to an embodiment, the process rotor 202 is provided with three standoff pins 208. The standoff pins 208 are configured to support the substrate 150 delivered to the ICD module 200 by a substrate handler, such as the second substrate handler 112. Accordingly, the standoff pins 208 may be evenly positioned around the circumference of the process rotor 202. The standoff pins 208 may have an "L"-shaped upper profile to support the substrate 150 and ensure that the substrate 150 is centered on the process rotor 202. The standoff pins 208 may also have a minimal cross-section to minimize contact with the supported substrate 150.

[0026]

[0039] The process rotor 202 also includes a plurality of gripping pins 212. FIGS. 2B and 2C are detailed cross-sectional views of a portion of the ICD module 200 illustrating an example configuration of one of the gripping pins 212. As shown in FIGS. 2B and 2C, the gripping pins 212 extend from holes 213A in the top surface of the process rotor 202. A protruding element 212B extends from the bottom of the gripping pin 212 through a hole 213B in the side of the process rotor 202. According to an embodiment, the gripping pins 212 are movable between a gripping position (shown in FIG. 2B) and a release position (shown in FIG. 2C). For example, the gripping pins 212 can pivot about a gripping pin axis 212D between the gripping position and the release position. In the gripping position shown in FIG. 2B, the top of each gripping pin 212 is positioned to grip the outer periphery of the substrate 150. 2C , the top of each gripping pin 212 is positioned beyond the outer periphery of the substrate 150, thereby allowing the substrate 150 to be received on (or removed from) the process rotor 202, i.e., on the standoff pins 208. The gripping pins 212 may be biased toward the gripping position, for example, by a spring 212C. The gripping pins 212 may also include a shaped region configured to receive the substrate 150. For example, each gripping pin 212 may include a notch 212A shaped to receive the edge of the substrate 150.

[0027]

[0040] The gripping pins 212 can grip or hold the substrate 150 during the cleaning process. FIG. 4B shows a top view of the process rotor 202 with an example arrangement of the gripping pins 212 and standoff pins 208. According to some embodiments, the gripping pins 212 can be evenly spaced around the top surface of the process rotor 202 at an angle α relative to one another as measured in a plane generally parallel to the top surface of the process rotor 202 (e.g., the XY plane). The angle α, i.e., the angular position of the gripping pins 212 from one another, can be approximately 120°. Alternatively, the gripping pins 212 can be oriented less than 120° from one another or more than 120° from one another. Furthermore, the total number of gripping pins 212 can be three or more. Alternatively, the total number of gripping pins 212 is four or more. The gripping pins 212 can have minimal contact with the substrate 150 along the edge of the substrate 150. Thus, the gripping pins 212 do not collect a significant amount of fluid at the contacting interface and interfere with the cleaning process of the substrate 150 .

[0028]

[0041] The process rotor 202 is movable between a raised position and a lowered position using a lift assembly 227, which includes a second drive motor 228 and a shaft 224. In FIGS. 2A and 2B, the process rotor 202 is shown in the lowered position, while in FIGS. 2C and 3, the process rotor 202 is shown in the raised position. In the raised position, the standoff pins 208 and the gripping pins 212 are above the top of the collection rotor 204 and rotor cover 206, allowing the process rotor 202 to receive a substrate 150. As seen in FIG. 2C, the protruding element 212B is configured to contact the annular inner surface 214 of the collection rotor 204 as the process rotor 202 is moved toward the raised position. As the process rotor continues to move toward the raised position, the annular inner surface 214 exerts pressure on the protruding element 212B, which overcomes the biasing force of the spring 212C and imparts an outward rotational movement to one or more of the gripping pins 212, causing the gripping pins to move to the released position. Similarly, when the process rotor 202 moves to the lowered position, the protruding element 212B of each gripping pin 212 no longer contacts the surface 214 of the collection rotor 204, and the gripping pins 212 rotate to the gripping position where the substrate is held between the gripping pins 212. The lowered position is also referred to herein as the processing position where the cleaning and drying processes are performed.

[0029]

[0042] As described above, the collection rotor 204 includes an annular inner surface 214. The annular inner surface 214 defines a processing space 216 within the ICD module 200. For example, the substrate 150 may be cleaned within the processing space 216. Additionally, the annular inner surface 214 has an angled portion that is symmetrical about the rotational axis 226 of the process rotor 202 and the collection rotor 204.

[0030]

[0043] The first drive motor 222 may be coupled to the process rotor 202 via a shaft 224. The first drive motor 222 rotates the process rotor 202 and the collection rotor 204 about an axis of rotation 226. That is, the controller 190 may control the first drive motor 222 to rotate the process rotor 202 and the collection rotor 204 at various rotational speeds set by a process recipe contained in the memory 194 of the controller 190. The first drive motor 222 may be referred to as a rotation motor. The process rotor 202 and the collection rotor 204 may be rotatably fixed relative to one another (i.e., configured to rotate together).

[0031]

[0044] Additionally, a second drive motor 228 may also be coupled to the process rotor 202 via the shaft 224. The second drive motor 228 may impart linear motion to the process rotor 202 along the rotational axis 226 by using a ball screw assembly configured to generate linear motion of the process rotor 202 through relative rotational motion caused by the second drive motor 228 rotating the shaft 224 relative to a portion of the collection rotor 204. That is, the controller 190 may control the second drive motor 228 to move the process rotor 202 in the Z direction between a raised position and a lowered position. Additionally, the second drive motor 228 may be used to move the process rotor 202 in the Z direction to precisely position the substrate 150 at a desired distance from the first nozzle mechanism 220 and the second nozzle mechanism 240 or relative to the surface of the collection rotor 204 in preparation for or during a cleaning, rinsing, and / or drying process. Thus, the second drive motor 228 may be configured to move the rotor 202 in the Z direction while the rotor 202 is rotating and / or while the substrate 150 is being cleaned, rinsed, and / or dried. The second drive motor 228 may be referred to as a linear actuator. Furthermore, the second drive motor 228 may be one of a hydraulic motor, a pneumatic motor, an electromechanical motor, and a magnetic motor. The linear motion of the process rotor 202 may be independent of the motion of the collection rotor 204.

[0032]

[0045] The gripper pins 212 hold the substrate 150 when the process rotor 202 is in the lowered position, as described above. When the process rotor 202 is in the lowered position, the first drive motor 222 can rotate the process rotor 202 while a cleaning fluid is applied to the cleaning substrate 150. The cleaning fluid can be applied to the upper surface of the substrate 150 by the first nozzle mechanism 220 and the second nozzle mechanism 240 and to the lower surface of the substrate 150 via the lower nozzle mechanism 290 while the process rotor 202 and the collection rotor 204 are rotating. Because the collection rotor 204 rotates with the process rotor 202, splashing of the cleaning fluid against the inner surface 214 can be reduced.

[0033]

[0046] The cleaning and / or rinsing fluid may be supplied to a lower nozzle mechanism 290 coupled to a fluid source 223 via a shaft 224. In one or more embodiments, the cleaning and / or rinsing fluid may flow through the lower nozzle mechanism 290 to the backside of the substrate 150. The cleaning and / or rinsing fluid may be a rinse agent (e.g., deionized water or ozonated water) or a cleaning chemical. Further, the cleaning and / or rinsing fluid may be supplied from a fluid source to the lower nozzle mechanism 290 via the shaft 224.

[0034]

[0047] The process rotor 202 may include a drain 291 adjacent the lower nozzle mechanism 290 (described below) to allow drainage of fluid applied to the backside of the substrate 150. According to an embodiment, the drain 291 may be an annulus disposed circumferentially surrounding the lower nozzle mechanism 290. The drain 291 is routed through the shaft 224 to a suction connection (not shown), which may apply a negative pressure to the drain 291 to ensure complete drainage of the fluid.

[0035]

[0048] A first sweep arm drive motor 234 may be coupled to the first sweep arm 210. The first sweep arm drive motor 234 is configured to move the first sweep arm 210 in an arcuate path parallel to the surface of the wafer 150 during the cleaning process, so that the cleaning fluid output by the first nozzle mechanism 220 is uniformly distributed over the surface of the substrate 150. The first sweep arm drive motor 234 may also be configured to move the first sweep arm 210 axially to set the distance between the first nozzle mechanism 220 and the surface of the substrate 150. For example, the first sweep arm drive motor 234 may include an air cylinder for raising and lowering the first nozzle mechanism 220.

[0036]

[0049] Similarly, a second sweep arm drive motor 235 may be coupled to the second sweep arm 230. The second sweep arm drive motor 235 is configured to move the second sweep arm 230 in an arcuate path parallel to the surface of the wafer 150 during the cleaning process, so that the cleaning fluid output by the second nozzle mechanism 240 is uniformly distributed over the surface of the substrate 150. The second sweep arm drive motor 235 may also be configured to move the second sweep arm 230 axially to set the distance between the second nozzle mechanism 240 and the surface of the substrate 150. For example, the second sweep arm drive motor 235 may include an air cylinder for raising and lowering the second nozzle mechanism 240.

[0037]

[0050] First sweep arm 210 and second sweep arm 230 may each include one or more tubes for supplying fluid to first nozzle mechanism 220 and second nozzle mechanism 240, respectively. According to one embodiment, first sweep arm 210 and second sweep arm 230 each include a connection 210A for supplying fluid and / or electrical signals (e.g., control signals) to first nozzle mechanism 220 and second nozzle mechanism 240, respectively. For example, water and isopropyl alcohol (IPA) may be separately supplied to first nozzle mechanism 220 and second nozzle mechanism 240 via connection 210A. For example, first sweep arm 210 and second sweep arm 230 may also each include a connection 210A for supplying control signals from controller 190 to first nozzle mechanism 220 and second nozzle mechanism 240, respectively.

[0038]

[0051] The first nozzle mechanism 220 and the second nozzle mechanism 240 may each include one or more non-contact cleaning or drying technologies. The first nozzle mechanism 220 and the second nozzle mechanism 240 may each have one, two, three, or more nozzles, each capable of outputting any combination of liquid or gaseous media. One or more of the first nozzle mechanism 220 and the second nozzle mechanism 240 may be a megasonic nozzle, a fluid jet nozzle, a mist nozzle, a high-pressure nozzle, or a kinetic energy nozzle. The megasonic nozzle includes one or more elements, such as a piezoelectric element, configured to apply alternating compressional and rarefaction waves to the cleaning fluid according to a sinusoidal or other pattern to generate a megasonic working fluid. For example, the megasonic nozzle may be configured to apply alternating compressional and rarefaction waves in a sinusoidal pattern at a rate of 950 kHz to generate a megasonic working fluid. Alternatively, other frequencies may be used.

[0039]

[0052] According to embodiments, when one of first nozzle mechanism 220 and second nozzle mechanism 240 is a megasonic nozzle, the other of first nozzle mechanism 220 and second nozzle mechanism 240 may be configured to apply a chemical cleaning agent, a rinsing agent (e.g., deionized water), and / or a drying agent (e.g., IPA vapor). For example, according to the embodiment shown in FIG. 4A, first nozzle mechanism 220 may be a drying nozzle configured to apply a drying agent such as isopropyl alcohol (IPA) and / or deionized water, and second nozzle mechanism 240 may be a megasonic nozzle configured to deliver deionized water and megasonic energy to the surface of the substrate during processing. In some configurations, second nozzle mechanism 240 may also be configured to apply a chemical cleaning agent, a rinsing agent, and / or a drying agent.

[0040]

[0053] As previously described, cleaning, rinsing, and / or drying fluids may be provided to first nozzle mechanism 220 and second nozzle mechanism 240 via connections 210A. The number of connections may be based on the number of nozzles in the nozzle mechanism used and / or the number of different types of cleaning chemicals, rinsing agents, and / or drying agents utilized by first nozzle mechanism 220 and second nozzle mechanism 240. For example, if first nozzle mechanism 220 and second nozzle mechanism 240 are each configured to output two different cleaning fluids, two different connections 210A may be utilized for each of first nozzle mechanism 220 and second nozzle mechanism 240. Additionally, the flow rates of the different cleaning chemicals and / or rinsing agents through the different nozzles may be varied. For example, the flow rate of the cleaning chemical, rinsing agent, or drying agent from a first one of the nozzles may be different from the flow rate of the cleaning chemical, rinsing agent, or drying agent from a second one of the nozzles. Alternatively, the flow rate of the cleaning chemical, rinsing agent, or drying agent from at least one of the nozzles may be varied during the cleaning, rinsing, and / or drying process.

[0041]

[0054] The first sweep arm 210 and the second sweep arm 230 may include coupling arrangements for securing the first nozzle mechanism 220 and the second nozzle mechanism 240, respectively. According to an embodiment, the coupling arrangements between the first nozzle mechanism 220 and the second nozzle mechanism 240 and the first sweep arm 210 and the second sweep arm 230 are industry-standard coupling arrangements, and one or both of the first nozzle mechanism 220 and the second nozzle mechanism 240 may be commercially available nozzles. For example, the second nozzle mechanism 240 may be a megasonic nozzle head provided by KAIJO®. Each nozzle mechanism 220, 240 may be easily replaced as needed depending on the desired application or for repair and / or routine maintenance.

[0042]

[0055] The path of the first sweep arm 210 and the second sweep arm 230 during the cleaning process may be an arc-shaped path parallel to the front surface of the substrate 105. Alternatively, paths of other shapes and / or lengths may be utilized. For example, the range of motion of the first sweep arm 210 and the second sweep arm 230 may be varied. According to some embodiments, the first nozzle mechanism 220 and the second nozzle mechanism 240 coupled to the ends of the first sweep arm 210 and the second sweep arm 230, respectively, may pass over the center of the substrate 150 in an arc-shaped path. The positions of the first sweep arm 210 and the second sweep arm 230 and / or the first nozzle mechanism 220 and the second nozzle mechanism 240 may be adjusted to ensure that the first nozzle mechanism 220 and the second nozzle mechanism 240 pass over the center of the rotating substrate 150 during processing. Additionally, the nozzle mechanisms 220, 240 can be moved relative to the corresponding first and second sweep arms 210, 230 to vary the position of the first and second nozzle mechanisms 220, 240 relative to the surface of the substrate 150. Additionally, the axial distance between the first and second nozzle mechanisms 220, 240 and the surface of the substrate 150 can be varied to aid in the cleaning process.

[0043]

[0056] The first nozzle mechanism 220 and the second nozzle mechanism 240 may include mass flow controllers to provide mass flow control of the fluid sprayed onto the substrate 150 depending on the desired cleaning, rinsing, and / or drying process. The nozzle mechanisms 220, 240 may also include vaporizers to vaporize the IPA or water sprayed onto the substrate 150 depending on the desired cleaning, rinsing, and / or drying process. The nozzle mechanisms 220, 240 may also be configured to blow only air depending on the desired cleaning process. For example, the cleaning, rinsing, and / or drying process may optionally include a cycle in which one or both of the nozzle mechanisms 220, 240 blow air to dry the standoff pins 208 and the gripping pins 212.

[0044]

[0057] According to one embodiment, the housing 218 may encase the ICD module 200, i.e., define an interior space 285 of the ICD module 200. Alternatively, the ICD module 200 is "open" to the rest of the cleaning unit 106, i.e., the ICD module does not include the housing 218. In such an alternative embodiment, the surface of the substrate 150 is exposed to the atmosphere (of the cleaning unit 106) while being processed within the ICD module 200.

[0045]

[0058] According to embodiments having a housing 218 enclosing the ICD module 200, doors 219A, 219B may be selectively opened to provide access to an interior space 285 of the cleaning module 200 for inserting or removing a substrate 150 from the ICD module 200. In one or more embodiments, during the cleaning process, the doors 219A, 219B are closed to seal the ICD module 200 from the factory interface 102 and the cleaning unit 106. When both doors 219A, 219B are closed, the interior space 285 of the ICD module 200 may be isolated from the rest of the cleaning unit 106 so that, for example, fumes, liquids, or particles generated and / or used elsewhere in the cleaning unit 106 or polishing unit 104 do not enter the ICD module 200 during the cleaning process. Similarly, fumes or liquids used and / or generated during the cleaning process in the ICD module 200 are removed from the cleaning module 200 in a controlled manner via the primary exhaust 260 and / or secondary exhaust 270 so that the fumes, liquids, or particles generated and / or used during the cleaning process in the ICD module 200 do not enter the factory interface 102 or elsewhere in the cleaning unit 106. The ICD module 200 is in a substrate processing configuration when both doors 219A, 219B are closed and the process rotor 202 is in the processing position with the gripper pins 212 holding the substrate 150.

[0046]

[0059] The housing 218 may also include, for example, a substrate sensor 294 that communicates to verify whether the substrate 150 is properly positioned within the ICD module 200. The housing may also include an ion bar 298 or the like to prevent static buildup within the ICD module 200.

[0047]

[0060] The primary exhaust 260 and / or secondary exhaust 270 may be utilized to remove excess moisture and / or any fluids from the ICD module 200 during and / or after a cleaning cycle. In one embodiment, moisture enters the primary exhaust 260 through the drain holes 295B. For example, as the substrate 150 rotates, the drain holes 295B are configured to ensure that moisture does not pool on the substrate 150 but is removed through the primary exhaust 260. In one embodiment, one or more O-rings or other sealing members may be positioned where the primary exhaust 260 interfaces with the housing 218. FIG. 5 illustrates one primary exhaust 260 and one secondary exhaust 270 on one side of the ICD module 200. According to an embodiment, the opposite side of the ICD module may also include a second primary exhaust 260 and a second secondary exhaust 270 arranged in a mirror configuration relative to those shown in FIG. 5. That is, the ICD module 200 may have two primary exhaust pipes 260, one on each side of the ICD module 200. Similarly, the ICD module 200 may have two secondary exhaust pipes 270, one on each side of the ICD module 200.

[0048]

[0061] According to an embodiment, door 219A may be provided on the side of housing 218 facing factory interface 102 ( FIG. 1 ), i.e., at a position where first substrate handler 110 can receive substrate 150. Additionally, door 219B may be provided on the side of housing 218 facing the interior of cleaning unit 106, i.e., at a position where second substrate handler 112 can insert substrate 150 into ICD module 200. During a substrate loading process, door 219B is opened to allow substrate 150 to be inserted into ICD module 200, while door 219A is closed to isolate factory interface 102 from the interior of ICD module 200 and cleaning unit 106. When door 219A is closed, door 219B is opened, process rotor 202 is in the raised position, and gripper pins 212 are in the released position, ICD module 200 is in a substrate loading configuration.

[0049]

[0062] Additionally, during the substrate unloading process, door 219A is opened to allow substrate 150 to be extracted from ICD module 200, while door 219B is closed to continue isolating factory interface 102 from the interior of ICD module 200 and cleaning unit 106. ICD module 200 is in the substrate unloading configuration when door 219A is open, door 219B is closed, process rotor 202 is in the raised position, and gripper pins 212 are in the released position.

[0050]

[0063] Positive airflow through the interior space 285 and the processing space 216 may be provided by a fan / filter unit (FFU) 242. The FFU 242 may be connected to the housing 218, for example. The FFU 242 includes an air intake 280 and a plenum 250. The air intake 280 may include, for example, a HEPA filter and a fan. Airflow flows from the air intake 280 through the plenum 250 into the interior space 285 and the processing space 216 and is exhausted through the primary exhaust 260 and the secondary exhaust 270.

[0051]

[0064] An annular collection weir 295 may be formed below the outer portion of the collection rotor 204. The primary exhaust pipe 260 is connected to the collection weir 295. An annular space 295A is defined between the outer surface of the collection rotor 204 and the inner surface of the rotor cover 206. Therefore, air supplied by the FFU 242 may also flow through the annular space 295A into the collection weir 295 and be discharged from the primary exhaust pipe 260. According to an embodiment, this configuration enables a large amount of laminar airflow through the annular space 295A between the rotor cover 206 and the collection rotor 204, which may reduce the amount of residual vapor and liquid droplets generated during processing and remaining in this area. This may reduce substrate contamination and improve the cleaning process. Furthermore, any liquid that may be accidentally introduced into the annular space 295A may be discharged from the primary exhaust pipe 260 with the assistance of the air flow through the annular space 295A.

[0052]

[0065] A plurality of drain holes 295B may be formed in the base of the collection rotor 204. For example, according to embodiments, the drain holes 295B may be formed near the inner surface 214 of the collection rotor 204. The drain holes allow fluid applied during the cleaning process of the substrate 150 to drain from the collection rotor 204 to the collection weir 295. According to one embodiment, the inner surface 214 of the collection rotor 204 includes a portion that slopes inward relative to vertical from a lower portion to an upper portion. This configuration may improve drainage of fluid from the processing space 216 due to rotation of the collection rotor 204. According to some embodiments, the plurality of drain holes 295B is configured to allow a laminar flow of air to flow over the surface of the substrate, through the inner region of the collection rotor 204 and the drain holes 295B, reducing the amount of residual vapor and liquid droplets generated during processing and remaining in this region, thereby reducing contamination of the substrate and improving the cleaning process. Additionally, air supplied by the FFU 242 may also flow through the processing volume 216, into the drain holes 295B, and then into the collection weir 295 and out the primary exhaust pipe 260. According to an embodiment, this configuration may provide a large amount of airflow through the processing volume 216, which may provide an improved cleaning process.

[0053]

[0066] Additionally, according to some embodiments, the collection rotor 204 may include a rotor extension 215 that extends diagonally downward and outward from the bottom of the collection rotor 204. The rotor extension 215 (FIG. 2A) may further improve fluid evacuation from the processing space by drawing and directing fluid through the drain holes 295B as the collection rotor 204 rotates. The rotor extension 215 is generally configured to extend beyond the outer edges of the drain holes 295B and beyond the outer diameter of the collection rotor at the height of the drain holes 295B.

[0054]

[0067] The rotor cover 206 includes a plurality of vents 207 ( FIG. 2A ) and annular duct 207A used to evacuate the interior space 285. Each of the vents 207 connects the interior space 285 to the annular duct 207A. The secondary exhaust pipe 270 is connected to the annular duct 207A through a channel (not shown) formed in the drain pan 296. Thus, air supplied by the FFU 242 can flow through the vents 207 into the annular duct 207A of the rotor cover 206 and be exhausted through the secondary exhaust pipe 270. According to an embodiment, this configuration can provide a large amount of airflow around the rotor cover 206 and into the vents 207. This reduces the amount of residual gases and vapors that form during processing and remain within this outer region of the ICD module 200. The residual vapors and gases can include IPA vapor, water vapor, and / or cleaning chemical vapors that form or are distributed into the interior space 285 during processing. In some embodiments, the secondary exhaust 270 can be coupled to a scrubbed exhaust adapted to remove residual gases and vapors. This can be important for removing vapors with airborne permissible exposure limits (PELs), lower explosive limits (LELs), and / or upper explosive limits (UELs), such as IPA. Additionally, any liquid that may be inadvertently introduced into the annular duct 207A can be evacuated from the secondary exhaust 270, aided by the airflow through the annular duct 207A.

[0055]

[0068] Plenum 250 may be configured to control airflow and minimize recirculation within ICD module 200. For example, plenum 250 may increase and / or decrease the amount of air entering ICD module 200 to minimize recirculation. Airflow recirculation may be minimized, for example, by the configuration of collection rotor 204, rotor cover 206, vent openings 207, annular duct 207A, collection weir 295, primary exhaust duct 260, secondary exhaust duct 270, and intake vent 280 disclosed herein.

[0056]

[0069] In one embodiment, a uniform airflow across the surface of the substrate 150 during the cleaning process is primarily generated by the primary exhaust 260 and the plenum 250. In various embodiments, the primary exhaust 260 is configured to provide a path for air to exit the ICD module 200 to prevent particles from redepositing on the surface of the substrate 150. As described above, air may be supplied to the plenum 250 by the air inlet 280 and exhausted from the ICD module 200 by the primary exhaust 260 and secondary exhaust 270. The plenum 250 may be a showerhead-style plenum. Furthermore, the geometry of the primary exhaust 260, the shape of the collection rotor 204, the shape of the rotor cover 206, and / or the shape of the collection weir 295 may be optimized to reduce recirculation within the ICD module 200. Reducing recirculation may minimize redeposition of particles and vaporized cleaning agent fluid on at least the substrate. The geometries of the collection rotor 204, rotor cover 206, and collection weir 295 may be optimized to define the annular space 295 and minimize recirculation. Additionally, the primary exhaust 260 and secondary exhaust 270 provide a path for cleaning and rinsing fluids to be removed from the ICD module 200, minimizing recirculation within the ICD module 200. The plenum 250 may be positioned proximate to the first nozzle mechanism 220 and the second nozzle mechanism 240. The substrate 150 may be positioned between the plenum 250 and the primary exhaust 260.

[0057]

[0070] The rotor cover 206 also includes two nozzle cups 225 ( FIG. 4A ), each positioned on opposite sides of the top surface of the rotor cover 206. The nozzle cups 225 are each configured and positioned to receive one of the nozzle mechanisms 220, 240. That is, when a nozzle mechanism 220 is not in use, such as when the ICD module is in a substrate loading or unloading configuration during transfer of a substrate 150 to or from the ICD module 200, or when the current cleaning process step does not require use of the nozzle mechanism 220, the first sweep arm motor 234 positions the first sweep arm 210 so that the corresponding first nozzle mechanism 220 is positioned in one of the nozzle cups 225. Similarly, when the nozzle mechanism 240 is not in use, for example, when the ICD module is in a substrate loading or unloading configuration during transfer of a substrate to or from the ICD module 200, or when the current cleaning processing step does not require the use of the nozzle mechanism 240, the second sweep arm motor 235 positions the second sweep arm 230 so that the corresponding second nozzle mechanism 240 is positioned on the other side of the nozzle cup 225.

[0058]

[0071] FIG. 4A shows a top perspective view of the ICD module 200, omitting the housing 218. FIG. 5 shows a bottom perspective view of the ICD module 200, also omitting the housing 218. All cleaning fluid applied during the cleaning process is intended to be contained within the collection rotor 204 and rotor cover 206 and exhausted through the primary exhaust 260 and / or secondary exhaust 270. However, cleaning fluid may accidentally leak outside the collection rotor and rotor cover 206, for example, due to a failure or defect in one or more components. Therefore, to prevent contamination of the exterior of the ICD module 200 in the event of an accidental leak, a drain pan 296 is provided surrounding the rotor cover 206. The inner surface of the drain pan 296 is visible in FIG. 4A, and the outer surface of the drain pan is visible in FIG. 5. A leak detection sensor 297 may also be positioned at the bottom of the drain pan 296. The leak detection sensor 297 can alert an operator if a leak is detected in the drain pan 296.

[0059]

[0072] According to some embodiments, the footprint of the ICD module 200 in the XY plane is substantially square or rectangular. In some embodiments, the ICD module 200 may be sized to perform cleaning processes on a 300 mm diameter substrate 150 while having a footprint of approximately 550 mm by 550 mm. In some embodiments, the longest side of the ICD module 200 may be less than approximately twice the diameter of the substrate 150. In some embodiments, the overall height of the ICD module 200 may be approximately 500 mm. In some embodiments, the overall height of the ICD module may be less than approximately one and two-thirds times the diameter of the substrate 150. Conventional cleaning modules may require a relatively large size to provide sufficient interior space for proper ventilation during the cleaning process. In contrast, the ICD module 200 according to embodiments disclosed herein can be relatively small, allowing multiple ICD modules 200 to be stacked and / or reducing the footprint of the cleaning unit 106. The relatively small size can be due, for example, to the high flow rate of air from the air source 280, through the ICD module 200, and out the primary exhaust 260 and secondary exhaust 270.

[0060]

[0073] ICD module 200 may include one or more inlet connections 292. Inlet connections 292 provide a path for cleaning fluid to be supplied to ICD module 200 during a cleaning process. The cleaning fluid may be supplied to, for example, first nozzle mechanism 220, second nozzle mechanism 240, lower nozzle mechanism 290, and / or fluid source 223. Additionally, ICD module 200 may include electrical connections 293 configured to connect to power and / or communication cables external to ICD module 200.

[0061]

[0074] 6 illustrates a method 600 for cleaning a substrate (e.g., substrate 150) in the ICD module 200 described above, according to one or more embodiments. In step 610, the ICD module 200 is placed in a first substrate transfer position. As described above, for example, the second drive motor 228 raises the process rotor 202 to the raised position, and the gripper pins 212 rotate to the released position. Further, for example, as described above, the door 219B (i.e., the door facing the interior of the cleaning unit 106) is opened, and the door 219A (i.e., the door facing the factory interface 102) remains closed. Further, for example, as described above, the first sweep arm motor 234 and the second sweep arm motor 235 control the first sweep arm 210 and the second sweep arm 230, respectively, to position the first nozzle mechanism 220 and the second nozzle mechanism 240 over the nozzle cup 225. The controller 190 may provide instructions to, for example, the second drive motor 228, the door 219A, the first sweep arm motor 234, and the second sweep arm motor 235 in connection with placing the ICD module 200 in the first substrate loading position.

[0062]

[0075] At step 620 of method 600, the substrate 150 is received by the ICD module 200 for cleaning and drying. For example, according to the embodiment described above, the second substrate handler 112 inserts the substrate 150 through the opened door 219B so that the substrate 150 rests on the standoff pins 208. After the substrate 150 is fully inserted into the ICD module and loaded onto the standoff pins 208, the substrate handler 112 releases and retracts the substrate 150 from the ICD module 200. According to the embodiment, for example, the controller 190 may instruct the substrate handler 112 to place the substrate 150 on the standoff pins 208 and then retract. The controller 190 may also receive an indication, for example from the substrate sensor 294, that the substrate 150 has been properly received by the ICD module 200.

[0063]

[0076] In step 630 of method 600, the ICD module 200 and the held substrate 150 are placed in a substrate cleaning and drying position. For example, according to an embodiment as described above, the door 219A is closed (and the door 219B remains closed). Further, for example, as described above, the second drive motor 228 lowers the process rotor 202 to the lowered position, and the gripping pins 212 rotate to the gripping position to grip the substrate 150. According to an embodiment, for example, the controller 190 can provide instructions to the second drive motor 228 and the door 219A in connection with placing the ICD module and the substrate 150 in the substrate cleaning and drying position.

[0064]

[0077] In step 640 of method 600, the ICD module 200 performs a cleaning process on the substrate 150 held in the substrate cleaning and drying position. For example, according to the embodiment described above, the first drive motor 222 rotates the process rotor 202 and the collection rotor 204 at a predetermined rotational speed. Further, as described above, for example, the second sweep arm motor 235 rotates the second sweep arm 230 and the second nozzle mechanism 240 while sweeping at a predetermined angle over the substrate 150 held on the process rotor 202 by the gripper pins 212. In addition, as described above, for example, the second drive motor 228 and / or the second sweep arm motor 235 can also adjust the Z-direction distance between the second nozzle mechanism 240 and the top surface of the substrate 150 to a predetermined distance. Additionally, for example, as described above, the second nozzle mechanism 240 applies megasonic cleaning fluid to the upper surface of the substrate 150 while the substrate 150 is rotated by the process rotor 202 and while the second sweep arm 230 is rotated through a predetermined angular sweep. Once the cleaning process is complete, the second sweep arm motor 235 rotates the second sweep arm 230 so that the second nozzle mechanism 240 is positioned within the corresponding nozzle cup 225. According to an embodiment, for example, the controller 190 may provide instructions to the first drive motor 222, the second drive motor 228, the second sweep arm motor 235, and / or the second nozzle mechanism 240 in connection with performing a cleaning process on the substrate 150.

[0065]

[0078] Additionally, for example, as described above, the lower nozzle mechanism 290 applies a rinsing fluid, such as deionized water, to the lower surface of the substrate 150. According to some embodiments, the backside nozzle mechanism 290 applies the rinsing fluid to the lower surface of the substrate 150 as part of a cleaning process (i.e., step 640) performed on the substrate 150. Alternatively, the backside nozzle mechanism 290 applies the rinsing fluid to the lower surface of the substrate 150 as part of a final rinsing and drying process (i.e., step 650, described below) performed on the substrate 150.

[0066]

[0079] At step 650 of method 600, the ICD module 200 performs a final rinse and drying process on the substrate 150 held in the substrate cleaning and drying position. For example, according to the embodiment described above, the first drive motor 222 continues to rotate the process rotor 202 and the collection rotor 204 at a predetermined rotational speed. Furthermore, as described above, for example, the first sweep arm motor 234 rotates the first sweep arm 210 and the first nozzle mechanism 220 while sweeping at a predetermined angle over the substrate 150 held on the process rotor 202 by the gripper pins 212. Additionally, as described above, for example, the second drive motor 228 and / or the first sweep arm motor 234 may also adjust the Z-direction distance between the first nozzle mechanism 220 and the top surface of the substrate 150 to a predetermined distance. Additionally, for example, as described above, the first nozzle mechanism 220 applies a rinsing and / or drying fluid to the upper surface of the substrate 150 while the substrate 150 is rotated by the process rotor 202 and while the first sweep arm 210 is rotated through a predetermined angular sweep. For example, the application of the rinsing and / or drying fluid may include applying deionized water to the substrate 150. For example, the application of the rinsing and / or drying fluid may also include applying vaporized IPA. According to some embodiments, the application of the deionized water and the vaporized IPA occurs simultaneously or sequentially. According to some embodiments, the vaporized IPA is dispensed at a position inward of the position of the deionized water (i.e., closer to the center of the substrate) as the two nozzles move from the center to the edge of the substrate.

[0067]

[0080] After a predetermined time and / or a predetermined amount of rinsing and / or drying fluid has been applied to the substrate 150 by the first nozzle mechanism 220, the first nozzle mechanism 220 stops applying the rinsing and / or drying fluid, and the substrate 150 continues to be rotated by the process rotor 202 at a predetermined rotational speed for a predetermined time. For example, the process rotor 202 rotates at approximately 2,000 RPM for a predetermined time while no additional fluid is being applied to the substrate 150. The rotation of the process rotor 202 and the collection rotor 204 urges the fluid applied to the substrate 150 toward the inner surface 214 of the collection rotor 204 and then through the drain holes 295B into the collection weir 295. The collected fluid and air provided by the fan / filter unit 242 are then drawn into the primary exhaust 260 for exhaust treatment. Once the final rinse and dry process is complete, the first sweep arm motor 234 rotates the first sweep arm 210 so that the first nozzle mechanism 220 is positioned within the corresponding nozzle cup 225. Additionally, the first drive motor 222 stops the rotation of the process rotor 202 and the collection rotor 204. According to an embodiment, for example, the controller 190 may provide instructions to the first drive motor 222, the second drive motor 228, the first sweep arm motor 234, and / or the first nozzle mechanism 220 in connection with performing the final rinse and dry process on the substrate 150.

[0068]

[0081] In step 660, the ICD module 200 is placed in a second substrate transfer position. As described above (similar to the first substrate transfer position), for example, the second drive motor 228 raises the process rotor 202 to the raised position, the gripping pins 212 rotate to the released position, and the substrate 150 is released from the gripping pins and supported by the standoff pins 208. Further, for example, as described above, door 219A (i.e., the door facing the factory interface 102) is opened, and door 219B (i.e., the door facing the interior of the cleaning unit 106) remains closed. This is in contrast to the first substrate transfer position, in which door 219B is opened and door 219A remains closed. Further, for example, as described above, first sweep arm motor 234 and second sweep arm motor 235 control first sweep arm 210 and second sweep arm 230, respectively, to position first nozzle mechanism 220 and second nozzle mechanism 240 over nozzle cup 225. Controller 190 may provide instructions to, for example, second drive motor 228, door 219A, first sweep arm motor 234, and second sweep arm motor 235 in connection with placing the ICD module in the second substrate loading position.

[0069]

[0082] In step 670, the substrate 150 is transferred from the ICD module 200 to the factory interface 102. For example, according to the embodiment described above, the first substrate handler 110 grasps the substrate 150 and removes it through the opened door 219A. The controller 190 may receive sensor data from the detection device 294 indicating that the substrate 150 has been removed from the ICD module 200 and may initiate a new process in response to the sensor data.

[0070]

[0083] Additionally, the ICD module 200 may undergo additional processing during method 600. For example, in step 680, the ICD module may perform a post-cleaning and drying process after the substrate 150 is removed. For example, as described above, at least one of the first sweep arm motor 234 and the second sweep arm motor 235 may move each of the first sweep arm 210 and the second sweep arm 230, thereby positioning each of the first nozzle mechanism 220 and the second nozzle mechanism 240 at a position corresponding to the circumferential position of the standoff pin 208 and the gripping pin 212. Furthermore, the corresponding at least one of the first nozzle mechanism 220 and the second nozzle mechanism 240 may apply a drying fluid, such as air or other gas, to the standoff pin 208 and the gripping pin 212 while the first drive motor 222 rotates the process rotor 202 to dry the standoff pin 208 and the gripping pin 212.

[0071]

[0084] Additionally or alternatively, a lower purge gas nozzle (not shown) may apply purge gas to the underside of the process rotor 202 to dry the process rotor 202 and push any residual liquid from the underside of the process rotor 202 into the drain 291 and discharge into the collection weir 295.

[0072]

[0085] An alternative embodiment of an ICD module 700 is depicted in Figures 7A, 7B, 8A, and 8B. Where the ICD module 700 has similar features to the above-described ICD module 200, the same reference numerals are used in the figures and redundant description is omitted. The primary difference between the ICD module 700 and the ICD module 200 is that the ICD module 700 includes a rotor cover 706 that is different from the rotor cover 206 of the ICD module 200. For example, the rotor cover 706 is configured to be positioned at different positions in the Z direction during cleaning, rinsing, drying, etc., of the substrate 150.

[0073]

[0086] Rotor cover 706 includes flanges 701A, 701B, and 701C. Flanges 701A-C extend from the outer edge of rotor cover 706 in the XY plane. Lifters 702A-C are positioned between drip pan 296 and each of flanges 701A-C. Lifters 702A-C support rotor cover 706. Lifters 702A-C are configured to move and position rotor cover 706 at least between a lowered position shown in FIGS. 7A and 8A and a raised position shown in FIGS. 7B and 8B.

[0074]

[0087] One or more of the lifters 702A-C include an actuator, such as an air cylinder, a ball screw assembly, or a linear motor, that is coupled to the rotor cover 706. According to one embodiment, a portion of each of the lifters 702A-C extends below the drip pan 296. Alternatively, the lifters 702A-C may utilize one or more other lifting mechanisms, such as, for example, a hydraulic cylinder or a direct drive lifter. Notably, FIGS. 8A and 8B show a cross section of the lifter 702A, which represents an actuator that includes a pneumatic cylinder, and can be understood to be representative of the other lifters 702B-C.

[0075]

[0088] As shown, the lifter 702A includes a push rod 718 that is connected at its upper end to the flange 701A by a fastener 720. According to an embodiment, the fastener 720 (as well as all other fasteners and hardware exposed to the interior space 285 and the processing space 216) may be formed of a non-metallic material, for example, to minimize susceptibility to corrosion. The lower end of the push rod 718 may be connected to a lifter piston 710. The lifter piston 710 is slidably positioned within a lifter cylinder 712. The lifter cylinder 712 includes a first pneumatic channel 714 that communicates with a portion of the lifter cylinder 712 below the lifter piston 710. The lifter cylinder 712 also includes a second pneumatic channel 716 that communicates with a portion of the lifter cylinder 712 above the lifter piston 710. The first pneumatic channel 714 and the second pneumatic channel 716 are connected to a pneumatic controller (not shown), which, controlled by, for example, controller 190, applies positive and / or negative air pressure to the first pneumatic channel 714 and the second pneumatic channel 716, thereby raising and lowering the lifter piston 710 and, thus, the rotor cover 706 (through the push rod 718) as needed. For example, according to an embodiment, the rotor cover 706 can be raised approximately 50 mm in the Z direction and lowered the same amount.

[0076]

[0089] In the embodiments of FIGS. 7A, 7B, 8A, and 8B, the second sweep arm 230 includes an alternative nozzle mechanism 740. The alternative nozzle mechanism 740 may be, for example, a droplet jet nozzle. However, the alternative nozzle mechanism 740 may be any suitable type of nozzle mechanism, such as those described above in connection with the second nozzle mechanism 240. The alternative nozzle mechanism 740 may be connected to the second sweep arm 230 via a drop neck 750. As shown in FIGS. 7B and 8B, during cleaning, rinsing, and drying of the substrate 150, a lifter supports the rotor cover 706 in a raised position while the process rotor 202 is in a lowered position (as described above). The drop neck 750 thus allows the alternative nozzle mechanism 740 to be positioned as close to the substrate 150 as necessary for cleaning and / or rinsing of the substrate 150 while maintaining sufficient clearance between the second sweep arm 230 and the upper surface of the rotor cover 706.

[0077]

[0090] As described above, the second sweep arm drive motor 235 is configured to move the second sweep arm 230 in an arcuate path parallel to the surface of the wafer 150 during the cleaning process so that the cleaning fluid output by the alternative nozzle mechanism 740 is evenly distributed over the surface of the substrate 150. The second sweep arm drive motor 235 may also be configured to move the second sweep arm 230 axially to set the distance between the alternative nozzle mechanism 740 and the surface of the substrate 150.

[0078]

[0091] In accordance with one or more embodiments, an alternative ICD module 700 (instead of ICD module 200) may be utilized in connection with the above-described method 600. For example, in addition to certain process steps described above in connection with FIG. 6, rotor cover 706 may be raised or lowered during such steps.

[0079]

[0092] For example, according to one embodiment, placing the alternative ICD module 700 in the first substrate transfer position at step 610 of method 600 may further include controlling the lifters 702A-C to lower the rotor cover 706 to the lowered position shown in Figures 7A and 8A. The controller 190 may, for example, provide instructions to the lifters 702A-C in connection with placing the alternative ICD module 700 in the first substrate loading position. In some embodiments, the controller 190 is configured to control, by using actuators in the lifters 702A-C, the position of the rotor cover 706 relative to the collection rotor 204 such that the rotor cover 706 is in a first position (Figure 8A) relative to the collection rotor 204 when the ICD module 700 is in the first substrate loading position.

[0080]

[0093] In step 620 of method 600, substrate 150 may be received in an alternative ICD module 700 for cleaning and drying processes as described above.

[0081]

[0094] At step 630 of method 600, the alternative ICD module 700 and the substrate 150 held therein may be placed in a substrate cleaning and drying position. In one embodiment, placing the alternative ICD module 700 in the substrate cleaning and drying position may further include controlling the lifters 702A-C to raise the rotor cover 706 to the raised position shown in FIGS. 7B and 8B . The controller 190 may, for example, provide instructions to the lifters 702A-C in connection with placing the alternative ICD module 700 in the substrate cleaning and drying position. In some embodiments, the controller 190 is configured to control, by using actuators in the lifters 702A-C, the position of the rotor cover 706 relative to the collection rotor 204 such that when the process rotor 202 is positioned in the cleaning and drying position (e.g., the lowered position) for performing a substrate cleaning process on the substrate, the rotor cover 706 is in a second position ( FIG. 8B ) relative to the collection rotor 204.

[0082]

[0095] At step 640 of method 600, the alternative ICD module 700 may perform a cleaning process on the substrate 150 held in the substrate cleaning and drying position. For example, as described above, the second sweep arm motor 235 may rotate the second sweep arm 230 and the alternative nozzle mechanism 740 to sweep a predetermined angle over the substrate 150 held on the process rotor 202 by the gripper pins 212. Further, for example, as described above, the second drive motor 228 and / or the second sweep arm motor 235 may adjust the Z-direction distance between the alternative nozzle mechanism 740 and the upper surface of the substrate 150 to a predetermined distance. Further, for example, the alternative nozzle mechanism 740 may apply one or more fluids in a droplet jet stream to the upper surface of the substrate 150 while the substrate 150 is rotated by the process rotor 202 and while the second sweep arm 230 is rotated through a sweep of a predetermined angle. Once the cleaning process is complete, the second sweep arm motor 235 rotates the second sweep arm 230 so that the alternate nozzle mechanism 740 is positioned within its corresponding nozzle cup 225. According to an embodiment, for example, the controller 190 may provide instructions to the first drive motor 222, the second drive motor 228, the second sweep arm motor 235, the lifters 702A-C, and / or the alternate nozzle mechanism 740 in connection with performing a cleaning process on the substrate 150.

[0083]

[0096] In step 650 of method 600, the alternative ICD module 700 may perform a final rinse and dry process on the substrate 150 held in the substrate cleaning and drying position, as described above.

[0084]

[0097] In step 660, the alternative ICD module 700 may be placed in a second substrate transfer position, similar to the first substrate transfer position. For example, according to one embodiment, placing the alternative ICD module 700 in the second substrate transfer position in step 610 of method 600 may further include controlling the lifters 702A-C to lower the rotor cover 706 to the lowered position shown in FIGS. 7A and 8A . The controller 190 may, for example, provide instructions to the lifters 702A-C in connection with placing the alternative ICD module 700 in the second substrate loading position. In some embodiments, the controller 190 is configured to control the position of the rotor cover 706 relative to the collection rotor 204 by using actuators in the lifters 702A-C such that the rotor cover 706 is in the first position ( FIG. 8A ) relative to the collection rotor 204 when the ICD module 700 is in the second substrate loading position.

[0085]

[0098] In step 670, the substrate 150 may be transferred from the alternative ICD module 700 to the factory interface 102, as described above. Additionally, in step 680, the alternative ICD module may perform a post-cleaning and drying process after the substrate 150 is removed. For example, the second sweep arm motor 235 may move the second sweep arm 230 so that the alternative nozzle mechanism 240 is at a position corresponding to the circumferential position of the standoff pins 208 and the gripping pins 212. Additionally, the alternative nozzle mechanism 740 may apply a drying fluid, such as air or other gas, while the first drive motor 222 rotates the process rotor 202 to dry the standoff pins 208 and the gripping pins 212.

[0086]

[0099] The alternative ICD module 700 may include a spray bar 800, as shown in Figure 9. Although the spray bar 800 is described herein in connection with the alternative ICD module 700, the spray bar 800 may also be applicable to the embodiments described above in connection with the ICD module 200. According to an embodiment, the spray bar 800 may be positioned proximate to the door 219A (i.e., proximate to the interior of the cleaning unit 106). Thus, the spray bar 800 may apply a fluid (e.g., deionized water) to the substrates 150 transferred into the alternative ICD module 700 by the second substrate handler 112.

[0087]

[0100] The spray bar 800 may include a vertical support 801 and a fluid applicator 802. The vertical support 801 may include one or more fluid supply lines for supplying fluid to the fluid applicator 802. For example, the vertical support 801 may be fluidly coupled to an inlet connection 292 for supplying fluid to the fluid applicator 802. The fluid applicator 802 may be configured to apply fluid to the substrate 150 being transported within an alternative ICD module via an array of linear holes in its bottom. According to embodiments, the fluid applicator 802 is configured to apply fluid to the substrate 150 in a laminar flow (i.e., non-turbulent flow) to minimize splashing of the applied fluid. The fluid may be collected in the drip pan 296 and drained via the drip pan drain 804. Thus, according to embodiments, the spray bar 800 may improve the final rinsing and drying of the substrate 150 by pre-applying a rinsing fluid to the substrate 150 before the substrate 150 is placed on the process rotor 202.

[0088]

[0101] While the foregoing is directed to embodiments of the present disclosure, other and additional embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. A cleaning and drying module comprising: a process rotor having a plurality of gripper pins configured to releasably hold a substrate, the process rotor configured to rotate and move between a lowered position and a raised position; a plurality of sweep arms, each sweep arm having a nozzle mechanism configured to apply a fluid to the substrate; a collection rotor configured to rotate synchronously with the process rotor and defining a processing space between the process rotor and an interior of the collection rotor; a sidewall extending above the process rotor in the lowered position, the inner surface of the sidewall sloping inwardly from a lower portion to an upper portion; a collection weir defined by a bottom of the collection rotor and the inner surface, the collection weir configured to collect the fluid applied to the substrate; and a plurality of drain holes positioned within the collection weir proximate the inner surface of the sidewall, the drain holes configured to drain the collected fluid; a collection rotor including: a rotor cover surrounding and extending above the side wall of the collection rotor, the rotor cover defining an annular space between the rotor cover and the collection rotor, the plurality of gripper pins of the process rotor extending above the rotor cover when positioned in the raised position; an exhaust pipe in communication with the drain hole, the exhaust pipe configured to draw air from the processing space and the annular space through the drain hole and to receive the collected fluid; A cleaning and drying module comprising:

2. 2. The washing and drying module of claim 1, wherein the collection rotor further includes a rotor extension extending diagonally downward and outward from a lower end of the side wall, the rotor extension being positioned adjacent to the drain hole.

3. a housing enclosing the process rotor, the collection rotor, the rotor cover, and the sweep arm; a fan filter unit attached to the housing and configured to provide a positive air flow through the processing space, the annular space, and the drain hole toward the exhaust pipe; The cleaning and drying module of claim 1 further comprising:

4. Second exhaust pipe Furthermore, The washing and drying module of claim 1 , wherein the rotor cover includes an annular duct having a plurality of vents providing fluid communication between an outer surface of the rotor cover and the annular duct.

5. 2. The cleaning and drying module of claim 1, wherein each gripping pin of the plurality of gripping pins includes a respective protruding element configured to contact the inner surface of the collection rotor when the process rotor is moved to the raised position, thereby moving the gripping pin from a substrate gripping position to a substrate release position.

6. the plurality of sweep arms include a first sweep arm and a second sweep arm; the nozzle mechanism of the first sweep arm includes a megasonic nozzle configured to apply megasonic energy to the fluid being applied to the substrate; 10. The cleaning and drying module of claim 1, wherein the nozzle mechanism of the second sweep arm includes a drying nozzle configured to apply isopropyl alcohol vapor to the substrate.

7. a bottom nozzle mechanism disposed within the process rotor and configured to apply at least one of a cleaning fluid and a rinsing fluid to a backside of the substrate held by the gripper pins; The cleaning and drying module of claim 1 further comprising:

8. an actuator coupled to the rotor cover and configured to position the rotor cover relative to the collection rotor; The cleaning and drying module of claim 1 further comprising:

9. A cleaning and drying module comprising: a process rotor having a plurality of gripper pins configured to releasably hold a substrate, the process rotor configured to rotate and move between a lowered position and a raised position; at least one sweep arm having a nozzle mechanism configured to apply fluid to the substrate; a collection rotor configured to rotate synchronously with the process rotor and defining a processing space between the process rotor and an interior of the collection rotor; a sidewall extending above the process rotor in the lowered position, the inner surface of the sidewall sloping inwardly from a lower portion to an upper portion; a collection weir defined by a bottom of the collection rotor and the interior surface, the collection weir configured to collect the fluid applied to the substrate; and a plurality of drain holes positioned within the collection weir proximate the inner surface of the sidewall, the plurality of drain holes configured to drain the collected fluid and particles from the collection weir; a collection rotor including: a rotor cover surrounding and extending above the side wall of the collection rotor, the rotor cover defining an annular space between the rotor cover and the collection rotor, the plurality of gripper pins of the process rotor extending above the rotor cover when positioned in the raised position; an exhaust pipe in communication with the drain hole, the exhaust pipe configured to draw air from the processing space and the annular space through the drain hole and to receive the collected fluid; a housing enclosing the process rotor, the collection rotor, the rotor cover, and the sweep arm, a first door provided on a first side of the housing; and a second door provided on a second side surface of the housing different from the first side surface; Including the housing A cleaning and drying module comprising:

10. 10. The cleaning and drying module of claim 9, wherein a controller is configured to control the position of the rotor cover relative to the collection rotor by using an actuator, such that the rotor cover is in a first position relative to the collection rotor during a loading or unloading process, and the rotor cover is in a second position relative to the collection rotor when the process rotor is positioned in the lowered position to perform a substrate cleaning process on a substrate.

11. moreover, The controller is further configured to control the process rotor, such that: the process rotor is in the raised position during the loading and unloading processes; The cleaning and drying module of claim 10 , wherein the process rotor is in at least one of the lowered position and an intermediate position between the raised position and the lowered position during the substrate cleaning process.

12. the process rotor has a plurality of standoff pins; 12. The cleaning and drying module of claim 11, wherein during the loading and unloading processes, the plurality of gripper pins are positioned a distance from an edge of the substrate, and the substrate is supported on the plurality of standoff pins.

13. an actuator coupled to the rotor cover and configured to position the rotor cover relative to the collection rotor; The cleaning and drying module of claim 9 further comprising:

14. 10. The washing and drying module of claim 9, wherein the collection rotor further includes a rotor extension extending diagonally downward and outward from a lower end of the side wall, the rotor extension being positioned adjacent to the drain hole.

15. a housing enclosing the process rotor, the collection rotor, the rotor cover, and the sweep arm; a fan filter unit attached to the housing and configured to provide a positive air flow through the processing space, the annular space, and the drain hole toward the exhaust pipe; The cleaning and drying module of claim 9 further comprising:

16. Second exhaust pipe Furthermore, The washing and drying module of claim 9 , wherein the rotor cover includes an annular duct having a plurality of vents providing fluid communication between an outer surface of the rotor cover and the annular duct.

17. the at least one sweep arm includes a first sweep arm and a second sweep arm; the nozzle mechanism of the first sweep arm includes a megasonic nozzle configured to apply megasonic energy to the fluid being applied to the substrate; 10. The cleaning and drying module of claim 9, wherein the nozzle mechanism of the second sweep arm includes a drying nozzle configured to apply isopropyl alcohol vapor to the substrate.

18. 1. A method for cleaning a substrate in a cleaning and drying module, the method comprising: placing the cleaning and drying module at a first substrate transfer position, wherein at the first substrate transfer position: The process rotor is in the raised position. a plurality of gripper pins on the process rotor in a substrate release position; a first door on a first side of the housing is open; placing the cleaning and drying module with a second door on a second side of the housing different from the first side closed; receiving a substrate through the first door onto a plurality of standoff pins on the process rotor; placing the cleaning and drying module in a substrate cleaning and drying position, wherein the substrate cleaning and drying position comprises: the process rotor is in a lowered position; the plurality of gripping pins are in a substrate gripping position; placing the cleaning and drying module with the first door and the second door closed; performing a cleaning process for the substrate, the cleaning process including rotating the substrate gripped by the process rotor and the gripping pins and applying a cleaning fluid to the substrate using a first nozzle mechanism attached to a first sweep arm; performing a final rinse and dry process on the substrate, including rotating the substrate gripped by the process rotor and gripping pins and applying at least one of a rinsing fluid and a drying fluid to the substrate using a second nozzle mechanism attached to a second sweep arm; placing the cleaning and drying module at a second substrate transfer position, wherein at the second substrate transfer position: the process rotor is in the raised position; the plurality of gripper pins on the process rotor are in a substrate release position and the substrate is supported on the standoff pins; the first door is closed; placing the cleaning and drying module with the second door open; allowing the substrate to be removed through the second door; A method comprising:

19. the cleaning fluid comprises a megasonic working fluid; 20. The method of claim 18, wherein the at least one rinsing and drying fluid comprises isopropyl alcohol vapor.

20. applying a drying fluid to the gripper pins and the standoff pins using one of the first nozzle mechanism and the second nozzle mechanism after the substrate is removed; 20. The method of claim 18, further comprising:

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