Auxiliary elastic portion for signal connection and substrate assembly including the same

Abstract

To provide an auxiliary elastic part for signal connection that can not only reduce the manufacturing cost of the product but also maintain RF characteristics with only low-cost components. The auxiliary elastic member for signal connection includes an elastic pressing member that applies elastic force to a first substrate member and a second substrate member stacked so that one surface of the second substrate member is in surface contact with the first substrate member, thereby maintaining electrical connection between the opposing surfaces of the first substrate member and the second substrate member. The elastic pressing member includes an elastic sleeve that presses the second substrate member with the elastic force of its own material.

Description

[Technical Field]

[0001] The present invention relates to an auxiliary elastic part for signal connection and a substrate assembly including the same, and more particularly to an auxiliary elastic part for signal connection and a substrate assembly including the same that can maintain stable signal connection and connection between at least two surface-contacting members (including substrates) without a separate soldering process. [Background technology]

[0002] Generally, a printed circuit board (PCB, Plastic Circuit Board) is a board-shaped component made of a dielectric material having a predetermined dielectric constant, and has predetermined signal lines printed on both sides or at least one side of the board with a conductive material pattern, forming a transmission path for branching or integrating signals.

[0003] Meanwhile, the most commonly used materials for printed circuit boards these days are glass fiber epoxy (FR-4) material or Teflon material. FR-4 material is advantageous for through-hole processing and is generally used in the form of a main board for products with multi-layered layers that can provide various transmission paths. On the other hand, Teflon material is a high-strength material with a low dielectric constant, so it has excellent high-frequency characteristics and is used for RF (high frequency, UHF, SHF, EHF) circuits. However, since it is difficult to process due to its high strength, it can only be produced with a portion of the PCB, and it has the disadvantage of being expensive. Therefore, it is used to replace part of the main board or as a sub-board stacked on the main board to demonstrate the desired circuit performance (RF characteristics).

[0004] FIG. 1 is a partial cross-sectional view illustrating a signal connection structure between two general components (including substrates).

[0005] As shown in FIG. 1, electrical components (not shown) may be mounted on one side of a main board 10 made of a multi-layered FR-4 material, and a sub-board 15 made of a double-sided PCB made of Teflon may be stacked on the other side of the main board 10 to provide predetermined bonding surfaces for interconnection.

[0006] For reference, as shown in Figure 1, analog RF-related components 15a (e.g., PA elements among the components of an antenna device) may be mounted on the sub-board 15, and the RF-related components 15a may be adopted as heat-generating electrical elements that generate heat while operating in response to the application of a power supply signal.

[0007] Here, the main board 10 and the sub-board 15 are two members that are in surface contact with each other, and electrical signals can be connected through mutual stacked surface contact.

[0008] For this purpose, as shown in FIG. 1, a first main conductive pattern 10P1 may be pre-printed on the surface of the main board 10 opposite to the surface facing the sub-board 15 (hereinafter referred to as the "lower surface"), and a second main conductive pattern 10P2 may be pre-printed on the lower surface of the main board 10.

[0009] At the same time, a first sub-conductive pattern 15P1 may be pre-printed on the surface of the sub-board 15 that faces the bottom surface of the main board 10 (hereinafter referred to as the "top surface"), and when stacked and bonded, the second main conductive pattern 10P2 and each signal connection point (not shown) of the first sub-conductive pattern 15P1 are electrically connected to each other via a flat soldering material such as solder paste (see reference numeral "13a" in FIG. 1).

[0010] Here, the first main conductive pattern 10P1 and the second main conductive pattern 10P2 of the main board 10 can be electrically connected to each other through a first via hole 10V1 formed to extend from the upper surface to the lower surface of the main board 10.

[0011] Meanwhile, the main board 10 having multiple layers does not necessarily have to have the first main conductive pattern 10P1 and the second main conductive pattern 10P2 only on the top and bottom surfaces. As shown in FIG. 1, a fourth main conductive pattern 10P4 may be formed in advance by printing at another location on the bottom surface of the main board 10, other than the second main conductive pattern 10P2, so as to receive signal transmission via a third main conductive pattern 10P3 formed in advance by printing between the multiple layers and a second via hole 10V2 formed therethrough for electrical connection between the layers.

[0012] In particular, when an electrical element is mounted on the underside of sub-board 15 as RF-related component 15a, as shown in FIG. 1, a signal transmitted from third main conductive pattern 10P3 of main board 10 is transmitted to fourth main conductive pattern 10P4 on the underside via second via hole 10V2, and then the signal is transmitted via through pattern portion 15P3 of sub-board 15, which is made of a double-sided PCB, to second sub-conductive pattern 15P2 pre-printed and formed on the underside of sub-board 15, and then power can be supplied to RF-related component 15a.

[0013] However, in this electrical signal connection structure in which two components (substrate components) are directly joined without any separation distance, a soldering process using a separate soldering material such as solder paste is required to ensure connection reliability of the mutual signal connection points, which leads to problems such as excessive assembly time and labor consumption as well as increased product costs.

[0014] Furthermore, when RF-related components 15a are mounted on the underside of sub-board 15, the fourth main conductive pattern 10P4 at the portion where it is joined to main board 10 is inevitably exposed to the outside, and a connection hole processing process must also be performed to process signal connection holes 15-1 that penetrate a portion of sub-board 15 to form through-pattern portion 15P3. In this case, an additional soldering process is required in which fourth main conductive pattern 10P4 and through-pattern portion 15P3 are connected by soldering using a soldering material (see reference numeral 13b in FIG. 1).

[0015] In particular, for the signal connection between two components (substrates) where RF characteristics must be prioritized, regardless of whether the opposing surfaces are spaced apart by a predetermined distance, it is most preferable to use a type of RF connector, as described in Korean Patent Registration Publication No. 10-1301772 (now extinct), which is a well-known technology. However, RF connectors have a very high unit price, which increases the overall manufacturing cost of the product and increases the burden on consumers.

[0016] Therefore, research is being actively conducted to develop new connection structures that minimize the increase in costs when connecting signals between two components. However, in this case, for signal connection structures between two components where maintaining RF characteristics is important, impedance matching design remains a very important challenge to overcome in order to ensure signal quality reliability even in unreasonable installation environments such as external vibrations. Summary of the Invention [Problem to be solved by the invention]

[0017] The present invention has been devised to solve the above technical problems, and its object is to provide an auxiliary elastic part for signal connection, which can eliminate the soldering process that is conventionally required for signal connection between two board members, thereby reducing product manufacturing costs, and a board assembly including the same.

[0018] At the same time, another object of the present invention is to provide a signal connection auxiliary elastic part and a substrate assembly including the same, which ensures good return loss and isolation values, is advantageous in maintaining RF characteristics, prevents degradation of signal quality, and is applicable to automated assembly processes.

[0019] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0020] According to one embodiment of the present invention, the auxiliary elastic member for signal connection includes an elastic pressing member that applies an elastic force to a second substrate member of a substrate assembly including a first substrate member and a second substrate member stacked so that one surface of the second substrate member is in surface contact with the first substrate member, thereby maintaining an electrical connection between the opposing surfaces of the first substrate member and the second substrate member, and the elastic pressing member includes an elastic sleeve configured to press the second substrate member with the elastic force of its own material.

[0021] Here, the first substrate member is a main board having at least one main conductive pattern printed on a surface facing the second substrate member, and the second substrate member is a sub-board having at least one sub-conductive pattern printed on a surface facing the first substrate member, the sub-conductive pattern being electrically connected to the main conductive pattern, and the elastic pressing portion can prevent a signal connection between the main conductive pattern and the sub-conductive pattern from being interrupted.

[0022] In addition, the elastic pressing part may further include a support pad for supporting the elastic sleeve on one side by sandwiching the first substrate member, and an elastic means provided on the other side of the support pad to apply an elastic force to the support pad.

[0023] The elastic sleeve may be made of a non-conductive material and may be made of a dielectric material having a dielectric constant between 2.7 and 3.5.

[0024] The elastic sleeve may also be formed to have a hardness between 60 and 75 (HV).

[0025] In addition, the first and second substrate members may be stacked on a front inner surface of a heat dissipation housing such that the first substrate member is positioned relatively forward, and when a clamshell cover is positioned in front of the first substrate member to cover the at least one main conductive pattern, the elastic pressing portion may have a size such that at least a portion of the elastic pressing portion is exposed further forward than a rib installation groove formed on the inner surface of the heat dissipation housing.

[0026] The elastic rib may be a single rib having a rectangular vertical cross section and inserted into the rib installation groove extending in the length direction, or a plurality of rib ribs having circular vertical cross sections and inserted into a plurality of spaced apart rib installation grooves, respectively.

[0027] In addition, when the elastic rib has a circular horizontal cross section with a predetermined diameter, the rib installation groove may have a rectangular vertical cross section with a width smaller than the diameter of the elastic rib, and may include a rectangular groove portion extending in a lengthwise direction and a plurality of circular groove portions spaced apart from each other within the rectangular groove portion to receive the outer circumferential surface of the elastic rib. A plurality of the elastic ribs may be provided, each inserted into the circular groove portion of the rib installation groove.

[0028] In addition, the elastic ribs may be elastically deformed when the first substrate member or the clamshell cover is fixed to the heat dissipation housing with a predetermined assembly force, thereby elastically supporting the second substrate member toward the first substrate member.

[0029] In addition, a plurality of the main conductive patterns may be provided on the first substrate member such that main signal connection points, which are connection points with the sub conductive patterns, are spaced apart by a predetermined distance, and a plurality of the sub conductive patterns may be provided on the second substrate member such that sub signal connection points, which are connection points with the main conductive patterns, are disposed at positions corresponding to the main signal connection points, respectively. The elastic ribs may be provided in numbers corresponding to the main signal connection points and the sub signal connection points to ensure optimal isolation values ​​in signal channels provided through the main signal connection points and the sub signal connection points, respectively.

[0030] Also, at least one of the elastic ribs may be disposed to support the second substrate member in a direction in which two or more of the main signal connection points and the sub signal connection points are in close contact with each other according to the optimum isolation value.

[0031] The first substrate member may comprise a first main board and a second main board arranged separately to have matching back surfaces on the heat dissipation housing, and the second substrate member may comprise a signal connection PCB that electrically connects the first main board and the second main board, and at least one or more elastic ribs may be provided to simultaneously elastically support the signal connection PCBs at their respective back surfaces including the dividing line between the first main board and the second main board.

[0032] In addition, the first main board may be an RF transceiver PCB, and the second main board may be a digital board PCB, and the number of the elastic sleeves may correspond to the number of signal connection points of a main conductive pattern formed on a rear surface of each of the first main board and the second main board and a sub conductive pattern formed on the second substrate member.

[0033] The substrate assembly according to an embodiment of the present invention may include the auxiliary elastic portion for signal connection. [Effects of the Invention]

[0034] The auxiliary elastic portion for signal connection and the board assembly including the same according to an embodiment of the present invention can achieve the following various effects.

[0035] First, the soldering process for connecting signals between two substrate members arranged in surface contact with each other is completely eliminated, thereby reducing the overall manufacturing cost of the product.

[0036] Second, it is easy to design impedance matching between signal channels to maintain RF characteristics, and it has the effect of improving the signal quality of an antenna device to which not only TDD but also FDD frequency systems are applied. [Brief explanation of the drawings]

[0037] [Figure 1] FIG. 1 is a partial cross-sectional view illustrating a signal connection structure between two general components (including substrates). [Figure 2] 1A is a cross-sectional view showing a substrate assembly including an auxiliary elastic portion for signal connection according to a first embodiment of the present invention, and FIG. 1B is a plan view of a portion thereof; [Figure 3] 10A is a cross-sectional view showing a substrate assembly including an auxiliary elastic portion for signal connection according to a second embodiment of the present invention, and FIG. 10B is a plan view of a portion thereof; [Figure 4a] 4A and 4B are cross-sectional views showing various embodiments of substrate assemblies to which auxiliary elastic portions for signal connection according to the first and second embodiments of the present invention are applied, as shown in FIGS. 2 and 3. [Figure 4b] 4A and 4B are cross-sectional views showing various embodiments of substrate assemblies to which auxiliary elastic portions for signal connection according to the first and second embodiments of the present invention are applied, as shown in FIGS. 2 and 3. [Figure 5]10 is a perspective view of a simulation design of a part of a board assembly designed to confirm the function and effect of the auxiliary elastic portion for signal connection according to the third embodiment of the present invention through simulation. FIG. [Figure 6a] 6A and 6B are exploded perspective views looking downward and upward, respectively, of FIG. 5. [Figure 6b] 6A and 6B are exploded perspective views looking downward and upward, respectively, of FIG. 5. [Figure 7] FIG. 6 is a perspective cutaway view taken along line AA in FIG. 5. [Figure 8] 6A and 6B are a perspective view and a plan view showing signal connection patterns of a first substrate member and a second substrate member in the configuration of FIG. 5. [Figure 9] 10A and 10B are plan views and a side view of each configuration showing a substrate assembly including an auxiliary elastic portion for signal connection according to a third embodiment of the present invention; [Figure 10] 10 is a cross-sectional view showing a state of stacking on the heat dissipation housing of FIG. 9 and a partially enlarged view thereof. [Figure 11] 10A to 10C are plan, front, side, and bottom views showing various types of signal connection patterns of the first and second substrate members and various types of auxiliary elastic portions for signal connection supported thereon in the configuration of FIG. 9. [Figure 12a] 12A to 12C are plan, front, side, and bottom views showing different design aspects according to the required value of isolation between ports in accordance with the signal connection pattern in the configuration of FIG. 11. [Figure 12b] 12A to 12C are plan, front, side, and bottom views showing different design aspects according to the required value of isolation between ports in accordance with the signal connection pattern in the configuration of FIG. 11. [Figure 13] 10 is a graph showing frequency characteristic values ​​using the simulation design diagram of FIG. 9. DETAILED DESCRIPTION OF THE INVENTION

[0038] Hereinafter, a signal-connecting auxiliary elastic portion and a board assembly including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0039] In assigning reference numerals to components in each drawing, it should be noted that the same components are assigned the same numerals as much as possible even if they are displayed in different drawings. Furthermore, in describing the embodiments of the present invention, if a detailed description of related publicly known configurations or functions is deemed to hinder understanding of the embodiments of the present invention, the detailed description thereof will be omitted.

[0040] In describing components of embodiments of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. These terms are merely used to distinguish a component from other components and do not limit the nature, order, or procedure of the components. Furthermore, unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

[0041] FIG. 2 is a cross-sectional view (a) and partial plan views (b) and (c) of a substrate assembly including an auxiliary elastic portion for signal connection according to a first embodiment of the present invention; FIG. 3 is a cross-sectional view (a) and partial plan views (b) and (c) of a substrate assembly including an auxiliary elastic portion for signal connection according to a second embodiment of the present invention; and FIGS. 4a and 4b are cross-sectional views showing various embodiments of substrate assemblies to which auxiliary elastic portions for signal connection according to the first and second embodiments of the present invention applied in FIGS. 2 and 3 are applied.

[0042] The auxiliary elastic member for signal connection according to the present invention includes an elastic pressing member 160 that applies an elastic force to the sub-board 150 of a board assembly including a first board member 110 (hereinafter referred to as the "main board") having at least one main conductive pattern printed thereon, and a second board member 150 (hereinafter referred to as the "sub-board") having a sub-conductive pattern printed thereon so as to be electrically connected to the main conductive pattern formed on the main board 110, the second board member 150 being stacked so as to be in surface contact with the main board 110, and the sub-conductive pattern printed thereon so as to be electrically connected to the main conductive pattern formed on the main board 110, thereby preventing disconnection of the signal connection between the main conductive pattern and the sub-conductive pattern.

[0043] Here, the first embodiment of the auxiliary elastic part for signal connection according to the present invention can be defined as including an elastic sleeve 165 provided so that the elastic pressing part 160 presses the sub-board 150 by the elastic force of its own material, as shown in FIG.

[0044] More specifically, the board assembly to which the auxiliary elastic portion for signal connection of the first embodiment is applied is configured to elastically support the sub-board 150 toward the main board 110 by an elastic pressing portion 160 provided with an elastic sleeve 165 having elastic force due to its own material, as shown in FIG. 2.

[0045] Here, the main board 110 may be pattern-printed with a first main conductive pattern 110P1 and a second main conductive pattern 110P2 on both sides thereof as the above-mentioned main conductive patterns, and a third main conductive pattern 110P3 and a fourth main conductive pattern 110P4 on an interlayer portion of the main board 110 provided in a multi-layer structure and on a corresponding back surface of the main board 110, and a first via hole 110V1 may be formed to pass through the first main conductive pattern 110P1 and the second main conductive pattern 110P2 to electrically connect them, and a second via hole 110V2 may be formed to pass through the third main conductive pattern 110P3 and the fourth main conductive pattern 110P4 to electrically connect them.

[0046] However, in one embodiment of the present invention, for the sake of convenience of explanation, it is assumed that the second main conductive pattern 110P2 and the fourth main conductive pattern 110P4 are provided, respectively. However, the second main conductive pattern 110P2 and the fourth main conductive pattern 110P4 may be omitted or removed as long as the ends of the first via hole 110V1 and the second via hole 110V2 are directly connected to the first sub-conductive pattern 150P1 and the second sub-conductive pattern 150P2 of the sub-board 150 described below.

[0047] At the same time, the front surface of the sub-board 150 may include a first sub-conductive pattern 150P1 and a second sub-conductive pattern 150P2, which are pattern-printed at positions corresponding to the rear ends of the second main conductive pattern 110P2 and the fourth main conductive pattern 110P4 or the first via hole 110V1 and the second via hole 110V2, respectively.

[0048] In FIG. 2, the second main conductive pattern 110P2 and the first sub-conductive pattern 150P1, and the fourth main conductive pattern 110P4 and the second sub-conductive pattern 150P2 are shown using the same indicator lines due to the difficulty in distinguishing them, but it should be understood that they are formed to be physically separated from each other.

[0049] The auxiliary elastic portion for signal connection of the present invention embodied in the first embodiment is provided as an elastic rib 165 inserted into a rib installation groove 17 pre-formed on the inner surface of the heat sink housing 10 in which the main board 110 and the sub-board 150 are stacked, as shown in FIG.

[0050] For reference, the main board 110 and the sub-board 150 stacked on the inner surface of the heat dissipation housing 10 may each be mounted with a number of digital semiconductor components (see reference numeral "115" in Figures 4a and 4b) (e.g., FPGA elements) and analog RF-related components 155 (e.g., PA elements among the components of an antenna device), and in particular, the RF-related components 155 may be adopted as heat-generating electrical elements that generate heat while operating in response to the application of a power supply signal.

[0051] Here, when mounting the RF-related components 155 on the front surface of the sub-board 150 stacked on the back surface of the main board 110, the main board 110 can be cut open in the front and rear directions to form an exposure portion 117, and then the RF-related components 155 can be mounted after exposing the front surface of the sub-board 150 to the outside.

[0052] At the same time, a clamshell cover 30 may be placed on the front surface of the main board 110, on which the aforementioned exposed portion 117 is processed so that the RF-related components 115 can be mounted, to shield the signal channel formed by the RF-related components 155 from interference with external signals.

[0053] An EMI shielding sleeve 35 may be interposed at the tip of the clamshell cover 30 that contacts the front surface of the main board 110. The EMI shielding sleeve 35 may be applied to the main board 110 in advance using an EMI dispensing method, so that it can be fixed when assembling the clamshell cover 30.

[0054] However, when the sub-board 150 is stacked on top of the main board 110, it is natural that the EMI shielding sleeve 35 interposed at the tip of the clamshell cover 30 can be applied to the sub-board 150 in advance and fixed in place.

[0055] Heat generated from the RF-related components 155 mounted on the front surface of the sub-board 150 is transferred to the inner surface of the heat dissipation housing 10 through a plurality of heat transfer holes 157 that penetrate the back surface of the sub-board 150 and are filled with a heat transfer material having a predetermined thermal conductivity, and can be dissipated to the outside through a plurality of heat transfer fins 11 integrally formed on the back surface of the heat dissipation housing 10.

[0056] 2(a), the elastic rib 165 may be sized so that at least a portion thereof is exposed to the outside from the rib installation groove 17 formed on the front end of the clamshell cover 30 or the heat dissipation housing 10. However, the rib installation groove 37 may be formed on the front end (or partition rib) of the clamshell cover 30 as shown in FIG. 4(c) and FIG. 4(c), and the same applies in this case.

[0057] The clamshell cover 30 is assembled to the heat dissipation housing 10 by fastening a number of assembly screws (not shown) and can be fixed to the heat dissipation housing 10 while providing an assembly force that tightly adheres at least one of the main board 110 or the sub-board 150 to the inner surface of the heat dissipation housing 10.

[0058] However, the assembly force transmitted by the sub-board 150 is not limited to the assembly force provided when assembling the clamshell cover 30, but can be fixed to the main board 110 or the inner surface of the heat dissipation housing 10 by assembly screws (not shown). In this case, it is natural that the assembly force of the clamshell cover 30 can be additionally transmitted in addition to the assembly force of the main board 110.

[0059] The assembling force for the clamshell cover 30 here can act as an external force that elastically deforms the exposed portion of the elastic rib 165 inserted into the rib installation groove 17 described later.

[0060] Meanwhile, the elastic rib 165 may be provided as a single piece inserted linearly into the rib installation groove 17 arranged so as to be continuous in a linear (e.g., straight line) shape, as shown in FIG. 2(b), or as a plurality inserted dot-shaped into the rib installation groove 17 arranged so as to be spaced apart in a dot-shaped shape, as shown in FIG. 2(c).

[0061] More specifically, the rib mounting groove 17 formed on the inner surface of the heat dissipation housing 10 may have a rectangular vertical cross section and may be elongated in the longitudinal direction, as shown in FIG. 2(b), and a single elastic rib 165 may be disposed in such rib mounting groove 17.

[0062] In addition, as shown in FIG. 2(c), the rib installation groove 17 formed on the inner surface of the heat sink housing 10 may have a circular vertical cross section and may be provided in a plurality of spaced-apart positions, and a plurality of elastic ribs 165 having a circular vertical cross section may be arranged in the rib installation groove 17.

[0063] Meanwhile, the auxiliary elastic member for signal connection according to the second embodiment of the present invention may include an elastic pressing member 160 provided in an assembly form, as shown in FIG.

[0064] As shown in FIG. 3, the elastic pressing unit 160 may further include a support pad 161 that sandwiches the sub-board 150 and supports the elastic sleeve 165 on one side, and an elastic means 163 that is provided on the other side of the support pad 161 to apply an elastic force to the support pad 161.

[0065] Here, as shown in (b) and (c) of FIG. 3, the elastic means 163 is provided in the form of a coil spring, and at least two or more elastic means 163 may be provided to elastically support a single support pad 161 in a balanced manner.

[0066] The auxiliary elastic portion for signal connection according to the second embodiment of the present invention, configured as described above, similarly to the first embodiment, when the sub-board 150 together with the main board 110 is completely attached to the inner surface of the heat dissipation housing 10 by the assembly force applied when assembling the clamshell cover 30 to the heat dissipation housing 10 using the assembly screws, the elastic sleeve 165 is elastically deformed, and the sub-board 150 is elastically attached to the main board 110.

[0067] At this time, it is necessary to ensure an optimum return loss value for each signal channel formed by the main board 110 or sub-board 150 and the clamshell cover 30 as the portion on which the RF-related components 155 are mounted.

[0068] For this purpose, the elastic sleeve 165 provided on the elastic pressing part 160 may be made of a non-conductive material, and may be made of a dielectric material having a dielectric constant between 2.7 and 3.5.

[0069] In addition, the elastic sleeve 165 may be formed to have a hardness between 60 and 75 (HV) since it must elastically support the sub-board 150 due to the assembly force transmitted during assembly of the clamshell cover 30 described above.

[0070] Meanwhile, as shown in Figures 4a and 4b, when the sub-board 150 is stacked on the front surface of the main board 110 (see (a) and (c) of Figures 4a and 4b), the signal connection auxiliary elastic member according to the first and second embodiments of the present invention may be configured so that the elastic rib 165 presses the front end of the clamshell cover 30 or the front end of the partition rib (not shown in the drawings) that partitions each signal channel. In this case, it goes without saying that the rib installation groove 37 into which the elastic rib 165 of the first embodiment or the elastic pressing member 160 of the second embodiment is inserted may be formed in the front end of the clamshell cover 30 or the partition rib.

[0071] At the same time, it can be said that the auxiliary elastic portion for signal connection according to the first and second embodiments of the present invention can be equally applied not only when the RF-related components 155 are mounted on the front surface of the sub-board 150 as shown in FIG. 4a, but also when the RF-related components 155 are mounted on the back surface of the sub-board 150 (i.e., on the inner surface side of the heat dissipation housing 10) as shown in FIG. 4b.

[0072] Conventionally, the signal connection points (not shown) and heat-generating surface (not shown) of the RF-related components 155 mounted on the sub-board 150 were formed only on the same surface, and as shown in Figure 4a, the RF-related components 155 could only be mounted on the front surface of the sub-board 150 for electrical signal connection while dissipating heat. However, recently, the signal connection points and heat-generating surface of the RF-related components 155 can be formed on different surfaces, and as shown in Figure 4b, the RF-related components 155 can also be mounted on the back surface of the sub-board 150, which is seen as a distinct difference.

[0073] FIG. 5 is a perspective view of a simulation design drawing of a portion of a substrate assembly designed to confirm the function and effect of the auxiliary elastic portion for signal connection in the third embodiment of the present invention through simulation; FIGS. 6a and 6b are a bottom-up exploded perspective view and a top-up exploded perspective view of FIG. 5; FIG. 7 is a cutaway perspective view cut along line AA in FIG. 5; and FIG. 8 is a perspective view and a plan view showing the signal connection patterns of the first substrate member and the second substrate member in the configuration of FIG. 5.

[0074] The auxiliary elastic portion for signal connection according to the third embodiment of the present invention may be arranged to ensure an optimal isolation value between each signal channel, as shown in FIGS.

[0075] More specifically, as shown in FIGS. 5 to 8, a plurality of main conductive patterns 110P are provided on the front surface of the main board 110 such that main signal connection points 110P-1, which are connection points with a plurality of sub-conductive patterns 150P formed on the front surface of a sub-board 150 described later, are spaced apart by a predetermined distance, and a plurality of sub-conductive patterns 150P may be provided on the front surface of the sub-board 110 such that the sub-signal connection points 150P-1, which are connection points with the main conductive patterns 110P, are located at positions corresponding to the main signal connection points 110P-1, respectively.

[0076] Here, as shown in FIG. 8, the main board 110 may be comprised of a first main board 110A and a second main board 110B arranged separately in two pieces so that their back surfaces match each other in the heat dissipation housing 10, and the sub-board 150 may be comprised of a signal connection PCB that electrically connects the first main board 110A and the second main board 110B.

[0077] The elastic ribs 165 may be provided to simultaneously elastically support at least one or more sub-boards 150 each having a signal connection PCB toward the rear surface including the division boundary line 110T that divides the first main board 110A and the second main board 110B.

[0078] Meanwhile, as shown in FIG. 6a, the elastic ribs 165 may be provided in a number of pieces, which are inserted into rib installation grooves 17 provided on the inner surface of the heat sink housing 110 for installation.

[0079] More specifically, when the elastic rib 165 is provided to have a circular horizontal cross section with a predetermined diameter, the rib installation groove 17 may be formed to have a rectangular vertical cross section with a width smaller than the diameter of the elastic rib 165, as shown in FIG. 6a, and include a rectangular groove portion 17a extending in the length direction and a plurality of circular groove portions 17b spaced apart from each other within the rectangular groove portion 17a to accommodate the outer circumferential surface of the elastic rib 165, and in this case, a plurality of elastic ribs 165 may be provided to be inserted into each of the circular groove portions 17b.

[0080] 9 is a plan view (a), (b) and a side view (c) of each configuration showing a board assembly including an auxiliary elastic portion for signal connection according to a third embodiment of the present invention; FIG. 10 is a cross-sectional view and a partially enlarged view showing the stacked installation on the heat dissipation housing of FIG. 9; FIG. 11 is a plan view, front view, side view and bottom view showing various types of signal connection patterns of the first board member and the second board member and various types of auxiliary elastic portions for signal connection supported thereon in the configuration of FIG. 9; FIGS. 12a and 12b are plan views, front view, side view and bottom view showing different design aspects depending on the required isolation value between ports according to the signal connection pattern in the configuration of FIG. 11; and FIG. 13 is a graph showing frequency characteristic values ​​using the simulation design diagram of FIG. 9.

[0081] As shown in Figures 11, 12a and 12b, the front surface of the sub-board 150 provided in the signal connection PCB is pattern-printed with sub-signal connection points 150P-1 that are in contact with each of the main signal connection points 110P-1 of the multiple main conductive patterns 110P formed on the back surface of the first main board 110A and the second main board 110B (see Figure 11(b)), and the back surface of the sub-board 150 may be provided with element connection points 150P-2 in the form of signal channels for connection to RF-related components 155 (see Figure 11(a)).

[0082] Here, as shown in FIG. 12a, the elastic ribs 165 may be provided in a number corresponding to the main signal connection point 110P-1 and the sub-signal connection point 150P-1 so as to ensure an optimal isolation value within the signal channel provided through each of the main signal connection point 110P-1 and the sub-signal connection point 150P-1.

[0083] However, the number of elastic reels 165 does not necessarily have to correspond to the number of signal channels, and the elastic reels 165 may be arranged in such a number that at least one of them simultaneously supports two or more main signal connection points 110P-1 and sub-signal connection points 150P-1 according to the optimum isolation value.

[0084] For example, as shown in FIG. 12a, the first main board 110A and the second main board 110B may be pattern-printed with main signal connection points 110P-1 and sub-signal connection points 150P-1, assuming only mutual RF multipath signal connection, and it is preferable that the placement position and number of elastic sleeves 165 are designed to correspond to each RF multipath (signal channel). However, as shown in FIG. 12b, if a connection pattern 150P-3 for power and control signals is provided not only for multipath but also regardless of RF multipath (signal channel), the elastic sleeves 165 may be arranged so that at least one supports two or more main signal connection points 110P-1 and sub-signal connection points 150P-1 simultaneously, depending on the optimal isolation value.

[0085] In this way, by providing the auxiliary elastic portion for signal connection according to an embodiment of the present invention as an elastic reed 165 or an elastic pressing portion 160 in the form of an assembly including the elastic reed 165 and elastically supporting the sub-board 150, not only can the sub-conductive pattern 150P and the sub-signal connection point 150P-1 of the sub-board 150 always maintain contact with the main conductive pattern 110P and the main signal connection point 110P-1 of the main board 110, but also the isolation value of the signal channel formed between each RF-related component 155 and the desired return loss value can be secured, thereby improving signal quality, as confirmed by the following simulation.

[0086] That is, as shown in Figures 5 to 8, the applicant of the present invention designed the maximum length in the longitudinal direction to be 14 mm, separated the first main board 110A and the second main board 110B, and simulated the return loss value and isolation value in the signal channel space between the main conductive pattern 110P and the sub-conductive pattern 150P in a state where the first main board 110A and the second main board 110B were signal-connected by the sub-board 150 provided as a signal connection PCB.

[0087] As a result, as shown in Figure 13, it was confirmed that not only was it possible to secure a perfect matching value of 31 dB or less as a return loss value in the 4 GHz min frequency range, but also that the isolation value for each signal channel space was also able to secure an optimal value of 91 dB in the 4 GHz min frequency range.

[0088] In particular, a simulation was conducted by adjusting the interval between signal channels by 5 mm. As a result, it was confirmed that the designer can secure the desired optimum isolation value and return loss value by adjusting the interval between the elastic reeds 165 or the elastic pressing portion 160, which are specific configurations of the auxiliary elastic portion for signal connection according to an embodiment of the present invention.

[0089] Therefore, there is no need to use an expensive soldering process for electrical connection (or signal connection) like the first substrate member 110 and the second substrate member 150, and even in antenna devices including RF-related components where maintaining RF characteristics is very important, the soldering process can be replaced with the low-cost elastic sleeve 165 or elastic pressing part 160, which can create the advantage of significantly reducing the manufacturing cost of the product.

[0090] Meanwhile, although a detailed description of the board assembly according to an embodiment of the present invention is not provided, it is sufficient to understand it as a concept including the auxiliary elastic portion for signal connection according to the various embodiments described above.

[0091]

[0033] The auxiliary elastic portion for signal connection and the board assembly including the same according to the embodiment of the present invention have been described in detail above with reference to the accompanying drawings. However, the embodiment of the present invention is not necessarily limited to the above-described embodiment, and it is understood that various modifications and equivalents may be made by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is determined by the following claims. [Industrial Applicability]

[0092] The present invention provides an auxiliary elastic part for signal connection and a substrate assembly including the same, which can reduce product manufacturing costs by eliminating the soldering process that has been conventionally required for signal connection between two substrate members, ensures good return loss and isolation values, is advantageous for maintaining RF characteristics, prevents degradation of signal quality, and allows for the application of automated assembly processes. [Explanation of symbols]

[0093] 10: Heat dissipation housing 11: Heat transfer fin 30: Clamshell cover 35: EMI shield sleeve 110: First board member (main board) 110P: Main conductive pattern 110P-1, 110P-2: Signal connection points 150: Second board member (sub-board) 150P: Sub-conductive pattern 160: Elastic pressing part 161: Support pad 163: Elastic means 165: Elastic Reeve

Claims

1. a substrate assembly including a first substrate member and a second substrate member stacked so that one surface of the second substrate member is in surface contact with the first substrate member, the substrate assembly including an elastic pressing portion that applies an elastic force to the second substrate member to maintain electrical signal connection between surfaces of the first substrate member and the second substrate member facing each other; The elastic pressing portion is an elastic sleeve configured to press the second substrate member by elastic force due to its own material; and an auxiliary elastic portion for signal connection.

2. the first substrate member is a main board having at least one main conductive pattern printed on a surface facing the second substrate member; the second substrate member is a sub-board having at least one sub-conductive pattern printed on a surface facing the first substrate member, the sub-conductive pattern being electrically connected to the main conductive pattern; The auxiliary elastic member for signal connection according to claim 1 , wherein the elastic pressing member prevents a disconnection of the signal connection between the main conductive pattern and the sub-conductive pattern.

3. The elastic pressing portion is a support pad that sandwiches the first substrate member and supports the elastic sleeve on one surface; and 2. The auxiliary elastic portion for signal connection according to claim 1, further comprising: elastic means provided on the other surface of the support pad to apply an elastic force to the support pad.

4. 2. The auxiliary elastic portion for signal connection according to claim 1, wherein the elastic sleeve is made of a non-conductive dielectric material having a dielectric constant between 2.7 and 3.

5.

5. 2. The auxiliary elastic portion for signal connection according to claim 1, wherein the elastic sleeve is formed to have a hardness of between 60 and 75 (HV).

6. When the first and second substrate members are stacked on a front inner surface of a heat sink housing such that the first substrate member is disposed relatively forward, and a clamshell cover is disposed in front of the first substrate member to cover the at least one main conductive pattern, The auxiliary elastic member for signal connection according to claim 1 , wherein the elastic pressing member has a size such that at least a portion of the elastic pressing member is exposed further forward than a rib installation groove formed on the front inner surface of the heat sink housing.

7. The elastic sleeve is 7. The signal-connecting auxiliary elastic member according to claim 6, wherein the auxiliary elastic member is provided in a single piece having a rectangular vertical cross section and inserted into the rib installation groove extending in the length direction, or in a plurality of pieces having circular vertical cross sections and inserted into a plurality of spaced apart rib installation grooves.

8. When the elastic sleeve is provided to have a circular horizontal cross section having a predetermined diameter, The rib installation groove has a rectangular vertical cross section having a width smaller than the diameter of the elastic rib, and includes a rectangular groove portion extending in a lengthwise direction, and a plurality of circular groove portions spaced apart from each other within the rectangular groove portion, the circular groove portions configured to receive the outer circumferential surface of the elastic rib, 7. The auxiliary elastic member for signal connection according to claim 6, wherein the elastic ribs are provided in a number and are inserted into the circular grooves of the rib installation grooves, respectively.

9. 7. The auxiliary elastic portion for signal connection according to claim 6, wherein the elastic rib is elastically deformed when the first substrate member or the clamshell cover is fixed to the heat dissipation housing with a predetermined assembly force, thereby elastically supporting the second substrate member toward the first substrate member.

10. The main conductive pattern is provided in a plurality on the first substrate member such that main signal connection points, which are connection points with the sub conductive patterns, are spaced apart by a predetermined distance; a plurality of the sub conductive patterns are provided on the second substrate member such that sub signal connection points, which are connection points with the main conductive patterns, are disposed at positions corresponding to the main signal connection points, respectively; 7. The auxiliary elastic portion for signal connection according to claim 6, wherein the number of the elastic reeds corresponds to the number of the main signal connection points and the sub-signal connection points so as to ensure an optimal isolation value in a signal channel provided through each of the main signal connection points and the sub-signal connection points.

11. 11. The auxiliary elastic portion for signal connection according to claim 10, wherein at least one of the elastic sleeves is arranged to support the second substrate member in a direction in which two or more of the main signal connection points and the sub signal connection points are in close contact with each other according to the optimal isolation value.

12. the first board member includes a first main board and a second main board that are separately disposed to have back surfaces that are matched to each other on the heat dissipation housing; the second substrate member is a signal connection PCB that electrically connects the first main board and the second main board, 7. The auxiliary elastic portion for signal connection according to claim 6, wherein the elastic ribs are configured to simultaneously elastically support at least one or a plurality of second substrate members provided in the signal connection PCB toward a rear surface including a dividing boundary line between the first main board and the second main board.

13. the first main board is an RF Transceiver PCB, and the second main board is a Digital board PCB; 13. The auxiliary elastic member for signal connection according to claim 12, wherein the number of the elastic sleeves corresponds to the number of signal connection points of the main conductive pattern formed on the rear surface of each of the first main board and the second main board and the sub-conductive pattern formed on the second substrate member.

14. A substrate assembly comprising the auxiliary elastic portion for signal connection according to any one of claims 1 to 13.

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