Vibration absorbing structure and electronic equipment

Abstract

This application discloses a vibration absorbing structure for mounting on an electronic device 10 and the electronic device, the electronic device 10 having an inner cavity 20 for acoustoelectric transducer modules 30 and vibration absorbing members 40, at least a portion of the acoustoelectric transducer modules 30 being located in the inner cavity 20, the inner cavity 20 being partitioned by at least one component in the electronic device 10 and a portion of the acoustoelectric transducer modules 30 to form a vibration damping space 21, and the vibration absorbing members 40 being located in the vibration damping space 21. This application solves the problem of resonance of the case of the electronic device 10 by inducing airflow from vibration generation, thereby reducing the impact of the airflow on the case and reducing the resonance of the electronic device 10, thereby optimizing the user experience.

Description

[Technical Field]

[0001] [Related Applications] This application claims priority from a Chinese utility model application bearing application number 202320170994.6, filed on January 20, 2023, and titled "Vibration-absorbing structure and electronic device."

[0002] This application relates to the field of acoustoelectric technology, and more particularly to vibration absorbing structures and electronic devices. [Background technology]

[0003] Current mainstream electronic devices often adopt an open acoustic cavity design to achieve high-quality sound from speakers and earpieces. That is, the rear cavities of the speaker module and earpiece module are not closed, allowing airflow into the acoustic cavity inside the device. However, the movement of airflow often causes resonance in the device case, resulting in a noticeable vibration when the user holds the device. The vibration becomes more intense as the sound increases, resulting in a relatively poor user experience. Therefore, how to design the acoustic cavity structure of electronic devices to meet the needs of optimizing the user's holding experience is an issue that needs to be addressed urgently.

[0004] Prior art electronic devices use a half-open cavity design, and a damper element is attached to the leakage hole of the rear cavity to improve the compliance of the rear cavity itself and control the amount of leakage, thereby reducing resonance to a certain extent. Other prior art electronic devices add a sound conduction channel to the rear cavity of the speaker module and then connect an open cavity to it. This absorbs air vibration energy through multiple deflections and reflections within the vibration damping channel, thereby attenuating airflow energy and reducing case resonance to a certain extent. However, whether it is a half-open cavity design or a cavity with an additional sound conduction channel, in actual applications, only a slight reduction in case resonance is achieved, and the case resonance problem caused by the open cavity design of electronic devices still needs to be further improved. Summary of the Invention

[0005] The present application provides a vibration absorbing structure and electronic device that solves the problem of the electronic device case resonating by causing airflow movement from existing vibration noise by filling the vibration damping space with a vibration absorbing material, reduces the impact on the case caused by the airflow, reduces the resonance of the electronic device, and optimizes the user experience.

[0006] The above object of the present application is mainly achieved by the following technical solutions.

[0007] The present application provides a vibration absorbing structure to be attached to an electronic device, the electronic device having an inner cavity for placing at least one component, the vibration absorbing structure having at least one acoustoelectric transducer module and a vibration absorbing member, at least a portion of the acoustoelectric transducer module being located within the inner cavity, the inner cavity being partitioned by at least one component in the electronic device and a portion of the acoustoelectric transducer module to form a vibration damping space, the vibration absorbing member being located within the vibration damping space, the acoustoelectric transducer module having at least one air vent communicating with the vibration damping space, and at least one of the air vents having an isolation mesh cloth attached thereto.

[0008] The present application provides a vibration absorbing structure attached to an electronic device, the electronic device having an inner cavity for placing at least one component, the vibration absorbing structure having at least one screen vibration excitation module and a vibration absorbing member, the inner cavity being partitioned by the at least one screen vibration excitation module and at least one component of the electronic device to form a vibration damping space, the vibration absorbing member having an isolation mesh cloth and a vibration absorbing medium, the vibration absorbing medium being positioned within the vibration damping space, and the isolation mesh cloth being arranged to separate the vibration absorbing medium from the at least one screen vibration excitation module.

[0009] The present application provides an electronic device including a case and the above vibration absorbing structure attached within the case.

[0010] Compared with the prior art, the technical solution of the present application has the following features and advantages:

[0011] By filling the interior of electronic devices with vibration-absorbing materials, the impact on the electronic device case caused by internal airflow can be reduced, and the resonance of the electronic device can be further reduced, optimizing the user experience and increasing the market competitiveness of the electronic device. [Brief explanation of the drawings]

[0012] In order to more clearly explain the technical solutions of the embodiments of the present application or the prior art, the drawings necessary for the embodiments or the prior art will be briefly described. However, the drawings below are only some of the embodiments of the present application, and it goes without saying that a person skilled in the art of the present invention can derive other drawings from these drawings without any innovative ideas. [Figure 1] FIG. 1 is a structural schematic diagram of the first embodiment according to the present application. [Figure 2] FIG. 2 is a structural schematic diagram of the second embodiment according to the present application. [Figure 3] FIG. 3 is a structural schematic diagram of a third embodiment according to the present application. [Figure 4] FIG. 4 is a structural schematic diagram of a fourth embodiment according to the present application. [Figure 5] FIG. 5 is a structural schematic diagram of the fifth embodiment of the present application. [Figure 6] FIG. 6 is a structural schematic diagram of the sixth embodiment of the present application. [Figure 7] FIG. 7 is a structural schematic diagram of the seventh embodiment of the present application. [Explanation of symbols]

[0013] 10, electronic device; 11, intermediate frame; 12, sealing cover; 13, back cover; 20, inner cavity; 21, vibration damping space; 22, sub-space; 30, acoustic-electrical conversion module; 31, ventilation hole; 40, vibration absorbing member; 50, isolation mesh cloth; 60, screen vibration excitation module; 70, vibration absorbing medium; 81, processor; 82, lens module; 83, battery; 90, screen. DETAILED DESCRIPTION OF THE INVENTION

[0014] In the following, in order to help those skilled in the art to which the invention pertains to better understand the technical solution of the present application, the technical solution of the present application in the embodiments will be clearly and completely described in combination with the drawings in the embodiments of the present application, but it is obvious that the embodiments described herein are only some of the embodiments of the present application and do not represent all of the embodiments, and it should be understood that all other embodiments that those skilled in the art to which the invention pertains can obtain based on the embodiments of the present application without any innovative ingenuity are within the scope of protection of the present application.

[0015] It should be noted that when an element is described as being "mounted" on another element, it may be directly connected to the other element, or there may be other elements between them. When an element is described as being "connected" to another element, it may be directly connected to the other element, or there may be other elements between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and are not intended to be exclusive examples.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used in the specification of this application are used only for the purpose of describing specific examples, and the application is not limited thereto. The term "and / or" used herein should be interpreted as including any and all combinations of one or more associated items.

[0017] First embodiment The vibration absorbing structure of the present application is attached to an electronic device 10. As shown in FIGS. 1 and 2, the electronic device 10 has an inner cavity 20 for acoustoelectric transducer modules 30 and vibration absorbing members 40. At least a portion of the acoustoelectric transducer modules 30 are located in the inner cavity 20. The inner cavity 20 is partitioned by at least one component and some of the acoustoelectric transducer modules 30 within the electronic device 10 to form a vibration damping space 21. The vibration absorbing members 40 are located within the vibration damping space 21. The acoustoelectric transducer modules 30 have at least one ventilation hole 31 communicating with the vibration damping space 21. An isolation mesh cloth 50 is attached to the at least one ventilation hole 31.

[0018] A vibration absorbing member 40 is provided in the vibration damping space 21 of the inner cavity 20 of the electronic device 10, and this vibration absorbing member 40 can reduce the effect of resonance on the electronic device 10 caused by the operation of the acoustoelectric transducer module 30. This vibration absorbing structure can significantly reduce the impact on the case of the electronic device 10 caused by the movement of air when the acoustoelectric transducer module 30 is in operation, thereby reducing resonance of the electronic device 10. In addition, the end surface of the acoustoelectric transducer module 30 facing the vibration damping space 21 is covered with an isolation mesh cloth 50, which can effectively separate the vibration absorbing member 40 from the acoustoelectric transducer module 30 and prevent the vibration absorbing member 40 from entering the interior of the acoustoelectric transducer module 30.

[0019] 1 , the acoustoelectric transducer module 30 is fixed to an intermediate frame 11, and an inner cavity 20 for housing components of the electronic device 10 is provided between the intermediate frame 11 and the back cover 13. In this embodiment, a sealing cover 12 for fixing the components of the electronic device 10 is provided between the intermediate frame 11 and the back cover 13. A vibration damping space 21 is provided between the sealing cover 12 and the back cover 13. A vibration absorbing member 40 is provided within the vibration damping space 21. The internal space of the acoustoelectric transducer module 30 communicates with the vibration damping space 21. The acoustoelectric transducer module 30 has a plurality of air vents 31 on its end surface facing the vibration damping space 21. Airflow within the acoustoelectric transducer module 30 is exhausted or drawn in through the air vents 31. The air vents 31 are covered with an isolation mesh cloth 50 to prevent the vibration absorbing member from entering the interior of the acoustoelectric transducer module 30. In this embodiment, the acoustoelectric transducer module 30 is a speaker module.

[0020] Furthermore, as shown in FIG. 2, in this embodiment, the acoustic-electric conversion module 30 is fixed to the intermediate frame 11, to which the processor 81, the lens module 82, the intermediate frame 11, the back cover 13, and the acoustic-electric conversion module 30 are further fixed, and a vibration damping space 21 is formed between the processor 81 and the lens module 82, and a vibration absorbing member 40 is provided inside the vibration damping space 21.

[0021] In one possible embodiment of the present application, as shown in Figures 3 and 4, the vibration damping space 21 is composed of a plurality of sub-spaces 22, and each sub-space 22 is provided with a vibration absorbing member 40, or some of the sub-spaces 22 are provided with a vibration absorbing member 40.

[0022] The interior of the electronic device 10 is always divided into a plurality of sub-spaces 22 according to the mounting positions of the respective components, and vibration absorbing components 40 are installed in some or all of the sub-spaces 22 or in some of the sub-spaces 22 to reduce the impact on the case of the electronic device 10 caused by the movement of airflow when the acoustic-electric conversion module 30 is operating, and further optimize the user experience.

[0023] 3, in this embodiment, a battery 83 is installed inside the vibration damping space 21 between the sealing cover 12 and the back cover 13, and the vibration damping space 21 is divided into two sub-spaces 22 that communicate with each other by the battery 83, and each sub-space 22 is provided with a vibration absorbing member 40. The embodiment shown in FIG. 3 is merely an example, and other components are also provided inside the actual electronic device 10, and the vibration damping space 21 is divided into multiple sub-spaces 22, and each sub-space 22 is provided with a vibration absorbing member 40. In another possible embodiment, vibration absorbing members 40 may be provided in some of the sub-spaces 22 according to the actual size of the internal space of the electronic device 10 and the needs for vibration reduction.

[0024] 4, in this embodiment, a battery 83 is mounted inside the vibration damping space 21 between the intermediate frame 11 and the back cover 13, a processor 81 and a lens module 82 are further fixed to the intermediate frame 11, and the battery 83, processor 81 and lens module 82 divide the vibration damping space 21 into a plurality of sub-spaces 22, and each of the sub-spaces 22 is provided with a vibration absorbing member 40. However, the embodiment shown in FIG. 4 is merely illustrative and not limiting. In another possible embodiment, vibration absorbing members 40 are provided in some of the sub-spaces 22 based on the actual size of the internal space of the electronic device 10 and the needs for vibration damping.

[0025] In one embodiment of the present application, the vibration absorbing member 40 is filled into the vibration damping space 21, or the vibration absorbing member 40 is formed into a vibration absorbing coating layer on the cavity wall of the vibration damping space 21 by dipping, coating or pasting.

[0026] Specifically, in this embodiment, the vibration-absorbing member 40 is directly filled into the vibration-damping space 21. In another possible embodiment, the vibration-absorbing member 40 is formed as a vibration-absorbing coating layer on the cavity wall of the vibration-damping space 21 by dipping, painting, pasting, or other methods.

[0027] In one embodiment of the present application, the vibration absorbing member 40 is a granular, sheet or fibrous structure made of a porous carbon material, which may be activated carbon, graphene or carbon nanotubes.

[0028] Specifically, in one possible embodiment, the vibration absorbing member 40 has a granular structure, a sheet structure, or a fibrous structure formed by processing a porous carbon material, and the vibration absorbing member 40 having the granular structure, the sheet structure, or the fibrous structure is directly filled inside the vibration damping space 21 of the electronic device 10.

[0029] In another possible embodiment, the vibration absorbing member 40 is a granular, sheet or fibrous structure made of a porous carbon material and a substrate medium, and the material of the substrate medium can be a sound absorbing sponge, a foam sponge, a carbon skeleton or an organic skeleton.

[0030] Specifically, the substrate medium and the porous carbon material are bonded by a method such as painting. For example, when the substrate medium has a granular or sheet-like structure, the porous carbon material and adhesive are first mixed with a solvent to form a uniformly dispersed suspension, and the suspension is then mixed with the granular substrate medium by immersion or painting, or the suspension is painted or immersed on the surface of the sheet-like substrate medium, and then dried and cured to obtain the manufactured product, i.e., the vibration-absorbing member 40.

[0031] In order to verify that the vibration absorbing member 40 filled between the speaker module and the back cover 13 of the present application effectively reduces the impact on the back cover 13 caused by the movement of airflow when the speaker module is operating, and to verify the effectiveness of different materials for the vibration absorbing member 40, sound vibration tests were conducted on three groups of vibration absorbing structures under different conditions, and the results are described as follows.

[0032] The vibration absorbing structures with different filling materials inside the vibration damping space 21 were subjected to a sound vibration test, and the maximum acceleration value of the back cover 13 of each group of vibration absorbing structures was measured under the same test environment.

[0033] Test group 1: The vibration absorbing structure equipped with the speaker module of the present application was adopted, in which the vibration damping space 21 was not filled with the vibration absorbing member 40.

[0034] Test group 2: The vibration absorbing structure provided with the speaker module of the present application was adopted, in which the vibration attenuation space 21 was filled with the vibration absorbing member 40, and the vibration absorbing member 40 was made of zeolite.

[0035] Test group 3: The vibration absorbing structure provided with the speaker module of the present application was adopted, in which the vibration attenuation space 21 was filled with the vibration absorbing member 40, and the vibration absorbing member 40 was made of a porous carbon material.

[0036] Test conditions: The effective radiation area of ​​the diaphragm of each of the above speaker modules is 70mm 2 The resonance frequency of each of the speaker modules is 800Hz, the maximum amplitude of each of the speaker modules is 0.5mm, and the volume of the rear cavity of each of the speaker modules is 4cm. 3 (wherein the length*width*height of the rear cavity is 150mm*60mm*0.45mm), and the thickness of the back cover 13 is 0.6mm.

[0037] The test results are shown in the table below. [Table 1]

[0038] As can be seen from the maximum acceleration of the back cover 13 of each group obtained from the test, the maximum acceleration of group 3 filled with vibration absorbing material 40 (porous carbon) is significantly smaller than the maximum acceleration of the other three groups. Therefore, when vibration absorbing material 40 (porous carbon) is filled between the speaker module and the back cover 13, it effectively reduces the impact on the back cover 13 caused by airflow movement when the speaker module is operating, and further reduces the resonance of the electronic device 10. In addition, the vibration absorbing material 40 made of porous carbon material has better vibration absorption effect than other materials.

[0039] 1 and 3, in one possible embodiment of the present application, the isolating mesh cloth 50 is tightly attached to at least one ventilation hole 31. By tightly attaching the isolating mesh cloth 50 to the ventilation hole 31 of the acoustic-electric transducer module 30, the space occupied by the isolating mesh cloth 50 inside the electronic device 10 can be effectively reduced.

[0040] 2 and 4, in another possible embodiment of the present application, the isolating mesh cloth 50 is covered at one end of the acoustoelectric transducer module 30 facing the vibration damping space 21, with a certain gap between the isolating mesh cloth 50 and the end face of the acoustoelectric transducer module 30 where at least one ventilation hole 31 is provided. By covering all of the isolating mesh cloths 50 at one end of the acoustoelectric transducer module 30, the acoustoelectric transducer module 30 can be more effectively protected and the vibration absorbing member 40 can be prevented from penetrating into the interior of the acoustoelectric transducer module 30.

[0041] In one possible embodiment of the present application, since the vibration absorbing member 40 made of porous carbon material is prone to adsorbing moisture, the isolation mesh cloth 50 is made of a waterproof and breathable film to prevent contact between moisture and the porous carbon material.

[0042] Second embodiment The present application provides another vibration absorbing structure to be mounted on an electronic device 10, as shown in Figures 5 to 7, in which the electronic device 10 has an inner cavity 20 for placing at least one component, and the vibration absorbing structure has at least one screen vibration excitation module 60 and a vibration absorbing member 40, the inner cavity 20 is partitioned by the at least one screen vibration excitation module 60 and at least one component of the electronic device 10 to form a vibration damping space 21, the vibration absorbing member 40 has an isolation mesh cloth 50 and a vibration absorbing medium 70, the vibration absorbing medium 70 is positioned within the vibration damping space 21, and the isolation mesh cloth 50 is arranged to separate the vibration absorbing medium 70 from the at least one screen vibration excitation module 60.

[0043] A vibration absorbing member 40 is provided in the vibration damping space 21 in the inner cavity 20 of the electronic device 10, and this vibration absorbing member 40 can reduce the resonance effect on the electronic device 10 when the screen vibration excitation module 60 is operating. This vibration absorbing structure can significantly reduce the impact on the case of the electronic device 10 caused by the movement of airflow when the screen vibration excitation module 60 is operating, thereby reducing the resonance of the electronic device 10. By providing an isolation mesh cloth 50 between the screen vibration excitation module 60 and the vibration absorbing medium 70, the screen vibration excitation module 60 and the vibration absorbing medium 70 can be effectively protected.

[0044] 5, the electronic device 10 includes a screen vibration excitation module 60 below the screen 90, which drives the screens 90 to vibrate. An inner cavity 20 for mounting components of the electronic device 10 is formed between the screen 90 and the back cover 13. An intermediate frame 11 is mounted between the screen 90 and the back cover 13, and a processor 81 and a lens module 82 are fixedly mounted on the intermediate frame 11. The screen 90, intermediate frame 11, processor 81, and lens module 82 form a vibration damping space 21 within the inner cavity 20. A vibration absorbing member 40 is mounted within the vibration damping space 21, and the vibration absorbing member 40 includes an isolation mesh cloth 50 and a vibration absorbing medium 70. In this embodiment, the isolation mesh cloth 50 covers the screen vibration excitation module 60, and the vibration absorbing medium 70 is mounted in the vibration damping space 21 outside the isolation mesh cloth 50, separating the vibration absorbing medium 70 from the screen vibration excitation module 60.

[0045] In one possible embodiment of the present application, as shown in FIG. 5, the vibration damping space 21 is composed of a plurality of sub-spaces 22, and each sub-space 22 is provided with a vibration absorbing medium 70, or some of the sub-spaces 22 are provided with a vibration absorbing member 40.

[0046] According to the mounting position of each component inside the electronic device 10, the vibration damping space 21 is always divided into multiple sub-spaces 22, and by providing vibration absorbing media 70 in some or all of the sub-spaces 22 or in some of the sub-spaces 22, the impact on the case of the electronic device 10 caused by airflow movement when the screen vibration excitation module 60 is operating can be further reduced, and the user experience can be further optimized.

[0047] Specifically, as shown in Fig. 5, in this embodiment, the processor 81 and lens module 82 fixedly mounted on the intermediate frame 11 divide the vibration damping space 21 into a plurality of sub-spaces 22, each of which is provided with a vibration absorbing medium 70. The embodiment shown in Fig. 5 is merely an example, and in an actual electronic device 10, other components may be present inside, and the vibration damping space 21 may be divided into a plurality of sub-spaces 22, each of which is provided with a vibration absorbing medium 70. In another possible embodiment of the present application, vibration absorbing members 40 may be provided in some of the sub-spaces 22 based on the actual size of the internal space of the electronic device 10 and the needs for vibration damping.

[0048] 6 and 7, in a preferred embodiment of the present application, the isolation mesh cloth 50 and the components of the electronic device 10 are sealed to form an internal space, and the internal space is filled with a vibration absorbing medium 70. The isolation mesh cloth 50 covers the vibration absorbing medium 70 and separates it from the screen vibration excitation module 60.

[0049] 6, in this embodiment, the isolation mesh cloth 50 is sealed to the middle frame 11 of the electronic device 10, forming an internal space between them for filling with the vibration absorbing medium 70, and the isolation mesh cloth 50 is in a slack state. Furthermore, as shown in FIG. 7, in this embodiment, the isolation mesh cloth 50 is in a tension state, and the tensioned isolation mesh cloth 50 can effectively reduce the spatial volume of the vibration absorbing medium 70.

[0050] In one embodiment of the present application, the vibration absorbing medium 70 is a granular, sheet or fibrous structure made of a porous carbon material, and the porous carbon material is activated carbon, graphene or carbon nanotubes.

[0051] Specifically, in one possible embodiment, the vibration absorbing medium 70 is a granular structure, a sheet structure, or a fibrous structure processed from a porous carbon material, and the granular, sheet structure, or fibrous structure vibration absorbing medium 70 is directly filled inside the vibration damping space 21 of the electronic device 10.

[0052] In another possible embodiment, the vibration absorbing medium 70 is a granular structure, a sheet structure, or a fibrous structure formed by a porous carbon material and a substrate medium, and the material of the substrate medium can be a sound absorbing sponge, a foam sponge, a carbon skeleton, or an organic skeleton.

[0053] Specifically, the substrate medium and the porous carbon material are bonded by a method such as painting. For example, when the substrate medium has a granular or sheet-like structure, the porous carbon material, adhesive, and solvent are first mixed to form a uniformly dispersed suspension, and the suspension is then mixed with the granular substrate medium by immersion or painting, or the suspension can be painted on the surface of the sheet-like substrate medium, immersed, and then dried and cured to obtain the product, i.e., the vibration-absorbing medium 70.

[0054] The vibration absorbing effect test of the vibration absorbing medium 70 made of different materials has already been described in detail in the first embodiment using test data, so a duplicated description will be omitted here.

[0055] Third embodiment This application provides an electronic device 10 including a case and the above-described vibration absorbing structure mounted within the case. The specific structure, operating principle, and beneficial effects of the vibration absorbing structure are the same as those of the vibration absorbing structures described in the first and second embodiments, so redundant description will be omitted here. The vibration absorbing structure within the electronic device 10 significantly reduces resonances generated during use of the electronic device 10, optimizing the user experience.

[0056] Specifically, the electronic device 10 may be a mobile phone, audio equipment, laptop computer, tablet, teleconferencing device, wearable device or AR / VR device, automobile, smart home, etc., equipped with the above-mentioned vibration absorbing structure, and is not specifically limited here.

[0057] The above specific examples have described in detail the objectives, technical solutions and beneficial effects of the present application, but the above descriptions are merely specific examples of the present application, and the protection scope of the present application is not limited thereto. It should be understood that any amendments, equivalent substitutions, improvements, etc. made within the scope of the spirit and principles of the present application are all within the protection scope of the present application.

Claims

1. A vibration absorbing structure attached to an electronic device, The electronic device has an inner cavity for receiving at least one component, the vibration absorbing structure includes at least one acoustic-electrical transducer module and a vibration absorbing member; At least a portion of the acoustoelectric transducer module is located within the inner cavity; the inner cavity is partitioned by at least one member in the electronic device and a part of the acoustoelectric transducer module to form a vibration damping space; The vibration absorbing member is located within the vibration damping space, the acoustoelectric transducer module is provided with at least one vent hole communicating with the vibration attenuation space, At least one of the vent holes has an isolation mesh fabric attached thereto, forming a vibration absorbing structure.

2. The vibration damping space is composed of a plurality of subspaces, 2. The vibration absorbing structure according to claim 1, wherein the vibration absorbing members are provided in all of the sub-spaces, or in some of the sub-spaces.

3. The vibration absorbing structure according to claim 1, wherein the vibration absorbing material is filled into the vibration damping space, or the vibration absorbing material is formed into a vibration absorbing coating layer on the cavity wall of the vibration damping space by dipping, coating or pasting.

4. 4. The vibration absorbing structure according to claim 3, wherein the vibration absorbing member is made of a porous carbon material and has a granular structure, a sheet structure, or a fibrous structure.

5. 5. The vibration absorbing structure according to claim 4, wherein the porous carbon material is activated carbon, graphene, or carbon nanotubes.

6. 4. The vibration absorbing structure according to claim 3, wherein the vibration absorbing member has a granular structure, a sheet structure, or a fibrous structure made of a porous carbon material and a substrate medium.

7. 7. The vibration-absorbing structure according to claim 6, wherein the material of the substrate medium is a sound-absorbing sponge, a foam sponge, an organic framework, a hydrogel, or an aerogel.

8. The vibration absorbing structure according to claim 1, wherein the isolation mesh cloth is tightly attached to at least one of the ventilation holes.

9. 2. The vibration absorbing structure of claim 1, wherein the isolation mesh cloth is covered at one end of the acoustoelectric conversion module facing the vibration attenuation space, and a certain gap is provided between the isolation mesh cloth and the end face of the acoustoelectric conversion module where at least one air hole is provided.

10. A vibration absorbing structure attached to an electronic device, The electronic device has an inner cavity for receiving at least one component, The vibration absorbing structure includes at least one screen vibration exciting module and a vibration absorbing member; The inner cavity is defined by at least one of the screen vibration excitation module and at least one component of the electronic device to form a vibration damping space; The vibration absorbing member includes an isolation mesh cloth and a vibration absorbing medium; the vibration absorbing medium is located within the vibration damping space; The isolation mesh cloth is disposed to separate the vibration absorbing medium from at least one of the screen vibration excitation modules.

11. 11. The vibration absorbing structure according to claim 10, wherein the vibration damping space is made up of a plurality of sub-spaces, and the vibration absorbing medium is provided in each of the sub-spaces, or in some of the sub-spaces.

12. 11. The vibration absorbing structure according to claim 10, wherein the isolation mesh cloth and the electronic device component are sealed and connected to form an internal space, and the vibration absorbing medium is filled in the internal space.

13. 11. The vibration absorbing structure according to claim 10, wherein the vibration absorbing medium is made of a porous carbon material and has a granular structure, a sheet structure, or a fibrous structure.

14. 14. The vibration absorbing structure according to claim 13, wherein the porous carbon material is activated carbon, graphene, or carbon nanotubes.

15. 11. The vibration absorbing structure according to claim 10, wherein the vibration absorbing medium has a granular structure, a sheet structure, or a fibrous structure formed by a porous carbon material and a substrate medium.

16. 16. The vibration-absorbing structure according to claim 15, wherein the material of the substrate medium is a sound-absorbing sponge, a foam sponge, an organic framework, a hydrogel, or an aerogel.

17. 17. An electronic device comprising: a case; and the vibration absorbing structure according to claim 1 provided in the case.

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