Pedestal and showerhead with resistive and radiant heating

Abstract

The substrate processing system includes a pedestal that supports a substrate, a resistive heater disposed within the pedestal that heats the substrate, and a radiant heater disposed within the pedestal that heats the substrate. The substrate processing system also includes a showerhead including a faceplate and a radiant heater disposed within the showerhead. The faceplate includes a plurality of through-holes. The radiant heater includes a plurality of optical elements spaced apart from the plurality of through-holes in the faceplate. The substrate processing system also includes a pedestal that supports a substrate, a resistive heater disposed within the pedestal that heats the substrate, a first radiant heater disposed within the pedestal that heats the substrate, the showerhead spaced apart from the pedestal, and a second radiant heater disposed within the showerhead that heats the substrate.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of U.S. Provisional Application No. 63 / 432,485, filed December 14, 2022. The entire disclosures of the above-referenced applications are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to substrate processing systems, and more particularly to pedestals and showerheads with resistive and radiant heating. [Background technology]

[0003] The background discussion provided herein is intended to generally present the contents of the present disclosure. To the extent described in this Background section, the work of the currently named inventors, as well as aspects of the description that may not otherwise be considered prior art at the time of filing, are not admitted, expressly or impliedly, as prior art to the present disclosure.

[0004] A substrate processing system typically includes multiple processing chambers (also referred to as process modules) for performing deposition, etching, and other processing on substrates, such as semiconductor wafers. Examples of processes that may be performed on a substrate include chemical vapor deposition (CVD), plasma-enhanced CVD (PECVD), chemically enhanced plasma vapor deposition (CEPVD), atomic layer deposition (ALD), and plasma-enhanced ALD (PEALD). Additional examples of processes that may be performed on a substrate include etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.).

[0005] During processing, a substrate is placed on a substrate support or susceptor, such as a pedestal or electrostatic chuck (ESC), in a processing chamber of a substrate processing system. In some processes, during deposition, a gas mixture containing one or more precursors may be introduced into the processing chamber and a plasma may be struck to activate a chemical reaction. In other processes, during etching, a gas mixture containing an etching gas may be introduced into the processing chamber and a plasma may be struck to activate a chemical reaction. Computer-controlled robots are used to transfer substrates from one processing chamber to another according to the order in which the substrates are processed.

[0006] Atomic layer deposition (ALD) is a thin-film deposition technique that uses sequential gas chemical processes to deposit thin films on the surface of a material (e.g., the surface of a substrate such as a semiconductor wafer). Most ALD reactions use at least two chemicals, called precursors (reactants), that react sequentially, one precursor at a time, with the surface of the material in a self-limiting manner. Thin films are gradually deposited on the surface of the material through repeated exposure to distinct precursors. Thermal ALD (T-ALD) is typically performed in a heated processing chamber. The processing chamber is maintained at a subatmospheric pressure using a vacuum pump and a controlled flow of inert gas. The substrate to be coated with the film is placed in the processing chamber and allowed to equilibrate to the temperature of the processing chamber before initiating the ALD process. Summary of the Invention

[0007] The substrate processing system includes a pedestal that supports the substrate, a resistive heater disposed within the pedestal that heats the substrate, and a radiant heater disposed within the pedestal that heats the substrate.

[0008] In additional features, a substrate processing system includes a showerhead including a faceplate and a radiant heater disposed within the showerhead, the faceplate including a plurality of through-holes, and the radiant heater including a plurality of optical elements interstitially disposed with the plurality of through-holes in the faceplate.

[0009] In additional features, a substrate processing system includes a pedestal supporting a substrate, a resistive heater disposed within the pedestal for heating the substrate, a first radiant heater disposed within the pedestal for heating the substrate, a showerhead spaced apart from the pedestal, and a second radiant heater disposed within the showerhead for heating the substrate.

[0010] Further scope of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief explanation of the drawings]

[0011] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0012] [Figure 1A] FIG. 1A illustrates a first example of a substrate processing system that combines resistive and radiative heating within the pedestal of a processing chamber according to the present disclosure.

[0013] [Figure 1B] FIG. 1B illustrates a second example of a substrate processing system according to the present disclosure, where the processing chamber has resistive heating within the pedestal and radiative heating below the pedestal.

[0014] [Figure 1C] FIG. 1C illustrates a third example of a substrate processing system according to the present disclosure, where resistive heating is provided in the pedestal of the processing chamber and radiant heating is provided in the showerhead.

[0015] [Figure 1D] FIG. 1D illustrates a fourth example of a substrate processing system in accordance with the present disclosure, where resistive heating is provided in the pedestal of the processing chamber and radiative heating is provided in both the pedestal and showerhead.

[0016] [Figure 1E]FIG. 1E illustrates a third example of a substrate processing system in accordance with the present disclosure, where resistive heating is provided in the pedestal of the processing chamber and radiative heating is provided below the pedestal and in the showerhead.

[0017] [Figure 2] FIG. 2 illustrates a schematic diagram of an example of the pedestal of FIG. 1A including a resistive heater and a radiative heater both disposed within the pedestal for heating a substrate in accordance with the present disclosure.

[0018] [Figure 3] FIG. 3 shows in more detail the resistive and radiative heaters co-located within the pedestal of FIG.

[0019] [Figure 4A] FIG. 4A shows a schematic diagram of an example of an annular pattern in which resistive and radiative heaters are arranged together within the pedestal of FIG.

[0020] [Figure 4B] FIG. 4B shows in more detail the annular pattern in which resistive and radiative heaters are arranged together within the pedestal of FIG.

[0021] [Figure 4C] FIG. 4C shows an example of zones that can be formed in a radiant heater when a resistive heater and a radiant heater are placed together in the pedestal of FIG. 2 in the annular pattern shown in FIGS. 4A and 4B.

[0022] [Figure 5] FIG. 5 shows a schematic example of a circular pattern of resistive heaters and a spoke-like pattern of radiative heaters, both arranged within the pedestal of FIG.

[0023] [Figure 6] FIG. 6 shows a schematic example of a spoke-like pattern in which resistive and radiative heaters are arranged together within the pedestal of FIG.

[0024] [Figure 7A] FIG. 7A shows examples of segments and zones that can be formed within the radiant heater in the example shown in FIGS. [Figure 7B] FIG. 7B shows examples of segments and zones that may be formed within the radiant heater in the example shown in FIGS. [Figure 7C] FIG. 7C shows examples of segments and zones that may be formed within the radiant heater in the example shown in FIGS.

[0025] [Figure 8] FIG. 8 illustrates a schematic diagram of an example of the pedestal of FIG. 1B with a resistive heater embedded within the pedestal and a radiative heater located below the pedestal for heating a substrate in accordance with the present disclosure.

[0026] [Figure 9] FIG. 9 shows a schematic of a lens placed over an optical element in a radiant heater in the example shown in FIG.

[0027] [Figure 10] FIG. 10 illustrates a schematic diagram of an example of an optical element disposed within a radiant heater according to the present disclosure.

[0028] [Figure 11] FIG. 11 illustrates a schematic diagram of an example of the showerhead of FIG. 1C and the pedestal of FIG. 1C including a radiant heater for heating a substrate according to the present disclosure.

[0029] [Figure 12] FIG. 12 schematically illustrates an example of the pedestal of FIG. 1D including a resistive heater and a first radiative heater, and the showerhead of FIG. 1D including a second radiative heater, for heating a substrate according to the present disclosure.

[0030] [Figure 13] FIG. 13 illustrates an example of the pedestal of FIG. 1E with a first radiant heater including a resistive heater disposed below the pedestal for heating a substrate in accordance with the present disclosure, and schematically illustrates an example of the showerhead of FIG. 1E including a second radiant heater.

[0031] [Figure 14] FIG. 14 illustrates an example cross-sectional view of the pedestal of FIG. 1A according to the present disclosure. [Figure 15] FIG. 15 illustrates an example cross-sectional view of the pedestal of FIG. 1A according to the present disclosure.

[0032] [Figure 16] FIG. 16 shows an example block diagram of a system for controlling the resistive heaters and radiative heaters shown in FIGS. 1A-13 according to the present disclosure.

[0033] [Figure 15] FIG. 15 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters illustrated in FIGS. 2-15 and the controller illustrated in FIG. [Figure 16] FIG. 16 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters illustrated in FIGS. 2-15 and the controller illustrated in FIG. [Figure 17] FIG. 17 illustrates an example of a method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 18] FIG. 18 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 19] FIG. 19 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 20] FIG. 20 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 21]FIG. 21 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters illustrated in FIGS. 2-15 and the controller illustrated in FIG. [Figure 22] FIG. 22 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 23] FIG. 23 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 24] FIG. 24 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 25] FIG. 25 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 26] FIG. 26 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 27] FIG. 27 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 28] FIG. 28 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 29] FIG. 29 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 30]FIG. 30 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 31] FIG. 31 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters illustrated in FIGS. 2-15 and the controller illustrated in FIG. [Figure 32] FIG. 32 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 33] FIG. 33 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG. [Figure 34] FIG. 34 illustrates an example method for heating a substrate in the substrate processing system of FIGS. 1A-1E using the resistive and radiative heaters shown in FIGS. 2-15 and the controller shown in FIG.

[0034] In the drawings, reference numbers may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0035] In some processing chambers, a resistive heater is embedded in the base plate of the pedestal and is used to heat a substrate disposed on the base plate of the pedestal. The base plate comprises a thermally conductive material, such as a metallic material. The resistive heater heats the base plate. The heat is distributed throughout the base plate. The heat distributed throughout the base plate heats a substrate disposed on the base plate. Resistive heating has limited ability to adjust or regulate localized heating of the substrate in a recipe-controllable manner. For example, heat from the resistive heater may not heat the substrate uniformly, which may result in cold spots in the center and / or peripheral regions of the substrate. Such temperature non-uniformity at the center and / or peripheral edge of the substrate reduces yield.

[0036] The present disclosure provides a system and method for improving temperature uniformity across a substrate through localized temperature compensation using a combination of resistive heating and LED-based radiant heating. In a first example of resistive heating and radiant heating according to the present disclosure, a resistive heater and an LED-based heater are co-disposed within a pedestal base plate comprising a ceramic material. The LED-based heater (hereinafter referred to as an LED heater) includes one or more LED strings. The one or more LED strings may be arranged within the pedestal base plate in an annular concentric pattern alternating with the resistive heater, which is also arranged concentrically within the pedestal base plate in an annular pattern. Alternatively, the one or more LED strings may be arranged in a spoke-like pattern within the pedestal base plate, while the resistive heater is arranged in an annular pattern within the pedestal base plate. In another embodiment, both the resistive heater and the LED strings may be arranged in an interleaved (e.g., alternating) spoke-like pattern within the pedestal base plate.

[0037] In a second example of resistive heating and radiative heating according to the present disclosure, the resistive heater and the LED-based heater are not co-located. Instead, the resistive heater is embedded in the base plate of the pedestal, and the LED heater is located below the pedestal. In the second example, the LED heater may include a lens disposed over the LED. In addition to the resistive heater, the LED heater heats the pedestal, and heat from the pedestal heats the substrate. Because the resistive heater and the LED heater are not co-located, the pedestal may include a ceramic or metallic material. The resistive heater in the base plate of the pedestal and the LEDs in the LED heater may be arranged in a circular pattern, an interleaved (e.g., alternating) spoke-like pattern, or any combination thereof.

[0038] In a third example of resistive heating and radiative heating according to the present disclosure, the resistive heater and the LED heater are not co-located. Instead, the resistive heater is embedded in the base plate of the pedestal, and the LED heater is located in the showerhead. In the third example, multiple strings of LEDs may be arranged in a circular concentric pattern within the showerhead. Alternatively, multiple strings of LEDs may be arranged in a spoke-like pattern within the showerhead. The resistive heater within the base plate of the pedestal may be arranged in a circular pattern or a spoke-like pattern that may be interleaved (e.g., alternating) with the spoke-like pattern of LEDs within the LED heater within the showerhead. Because the resistive heater and the LED heater are not co-located, the pedestal may include a ceramic or metallic material. The showerhead may also include a ceramic or metallic material.

[0039] In a fourth example of resistive heating and radiant heating according to the present disclosure, the resistive heater and the LED-based heater are co-located within the base plate of the pedestal, which includes a ceramic material, as in the first example, and an additional LED-based heater is located within the showerhead, as in the third example. Thus, the fourth example combines the first and third examples. In a fifth example of resistive heating and radiant heating according to the present disclosure, the resistive heater and the LED heater are not co-located. Instead, the resistive heater is embedded within the base plate of the pedestal, the LED heater is located below the pedestal, as in the second example, and an additional LED-based heater is located within the showerhead, as in the third example. Thus, the fifth example combines the second and third examples.

[0040] In the above examples, the LED strings may be continuous or segmented (zoned). For example, in each circle of the circular pattern, the LEDs may form a single string that can be controlled as a single string. Alternatively, in each circle of the circular pattern, the LEDs may not form a single string. Instead, in each circle of the circular pattern, the LEDs in the string may be divided into individually controllable segments (zones). Alternatively, the LEDs in the circle of the circular pattern may be grouped into quadrants or pie-shaped zones, with each zone or portion thereof being individually controlled. In a spoke-like pattern, each spoke may contain one or more strings of LEDs that can be individually or collectively controlled. Alternatively, each spoke may be divided into regions (zones), with the LEDs in each region (zone) being individually controlled. Many other variations are possible.

[0041] Furthermore, when the resistive heater and the LED heater are disposed together within the base plate of the pedestal, cooling channels may be provided within the base plate of the pedestal to control the temperature of the substrate and also prevent the LEDs from overheating. Furthermore, as described in more detail below, the resistive heaters and LEDs (e.g., LEDs within a string, segment, or zone) may be individually controlled (e.g., staggered in time and with different illumination intensities) to prevent the LEDs from overheating. Furthermore, in addition to individually controlling the resistive heaters and LEDs, rotating the substrate to allow different portions of the substrate to be heated at different times by different ones of the resistive heaters and / or LEDs may also prevent the LEDs from overheating. Furthermore, one or more resistive heating elements of the resistive heater may be individually or collectively controlled in conjunction with individually or collectively controlling the zones of the LED heater by controlling the illumination intensity of the LEDs.

[0042] In the disclosed systems and methods, resistive heating can be used for general or bulk heating of the substrate, while LED-based radiant heating can be used for fine or adjustable heating of the substrate to compensate for and eliminate temperature non-uniformities across the substrate. Thus, LED-based radiant heating can be integrated (combined) with resistive heating to heat specific regions of the substrate in a controlled manner to achieve uniform heating of the substrate. In some examples, LED-based radiant heating can be used to heat the central region of the substrate and resistive heating can be used to heat the outer regions of the substrate to compensate for and eliminate cold spots in the central region of the substrate. In some examples, LED-based radiant heating can be used to heat the outer (peripheral) region of the substrate and resistive heating can be used to heat the remainder of the substrate to compensate for and eliminate cold spots in the outer (peripheral) region of the substrate. A combination of these two features can be used to compensate for and eliminate cold spots in the central and outer (peripheral) regions of the substrate. Furthermore, the power of the LED radiant heating can be controlled (e.g., modulated) along the azimuthal direction to compensate for and eliminate azimuthal temperature non-uniformities within the substrate. These and other features of the present disclosure are described in detail below.

[0043] (Example of a substrate processing system) FIG. 1A illustrates a first example of a substrate processing system (hereinafter, system 100-1) including resistive and radiative heating according to the present disclosure. System 100-1 can be used to process substrates using a chemical vapor deposition (CVD) process, a plasma-enhanced CVD (PECVD) process, a chemically enhanced plasma vapor deposition (CEPVD) process, an atomic layer deposition (ALD) process, or a plasma-enhanced ALD (PEALD) process. System 100-1 includes a processing chamber 101 and a gas distribution system 102. Gas distribution system 102 includes multiple gas sources 104, multiple valves 106 connected to the gas sources 104, and multiple mass flow controllers (MFCs) 108 connected to the valves 106. Gas sources 104 supply various gases, including process gases, precursors, purge gases, inert gases, cleaning gases, etc. MFCs 108 control the mass flow rates of the gases.

[0044] In some applications, the gas distribution system 102 further includes a vapor delivery system 110 for supplying one or more vaporized precursors through one or more valves 112. The one or more gases from the MFC 108, and the one or more vaporized precursors, if used, are supplied to a mixing manifold 114. The gas or gas mixture from the mixing manifold 114 is supplied to the process chamber 101 through a valve assembly (e.g., a pulse valve manifold or PVM assembly) 116.

[0045] The processing chamber 101 includes a showerhead 120 and a pedestal 130. The showerhead 120 is attached to the top plate of the processing chamber 101. The showerhead 120 receives a gas or gas mixture from a mixing manifold 114 through a valve assembly 116. The showerhead 120 includes a base portion 122 and a stem portion 124. The stem portion 124 extends from the center of the base portion 122 and is attached to the top plate of the processing chamber 101. The base portion 122 is cylindrical and includes a plurality of through-holes (not shown) through which the gas or gas mixture is supplied into the processing chamber 101.

[0046] The showerhead 130 includes a base portion 132 and a stem portion 134. The stem portion 134 may be generally cylindrical or Y-shaped with a tapered portion (i.e., the top of the Y) attached to the bottom of the base portion 132. The stem portion 134 extends from the base portion 132 and is attached to the bottom of the processing chamber 101. The base portion 132 is also cylindrical. The stem portion 134 has a smaller diameter than the base portion 132. The substrate 140 is placed on the upper surface of the base portion 132 of the pedestal 130 during processing.

[0047] Although not shown, the base portion 132 of the pedestal 130 may include lift pins for holding, lowering, and raising the substrate 140 relative to the base portion 132 of the pedestal 130. Optionally, a shaft (shown and described below) extending through the stem portion 134 and base portion 132 of the pedestal 130 may be used to hold, lower, and raise the substrate 140 relative to the base portion 132 of the pedestal 130. The combined use of the lift pins and shaft may allow the substrate 140 to be held, lowered, and raised relative to the base portion 132 of the pedestal 130.

[0048] The substrate 140 can be clamped to the base 132 using one of many clamping methods. Examples of clamping methods include vacuum clamping, electrostatic clamping, and mechanical clamping. An example of a pedestal 130 including a vacuum clamp is shown and described below. Any of the pedestals shown and described below can be used as the pedestal 130 in the processing chamber 101.

[0049] Base portion 132 includes an LED heater 150 and a resistive heater 151, as shown and described in detail below, for heating substrate 140. For example, resistive heater 151 may include one or more resistive heating elements (as shown and described in detail below). Resistive heater 151 heats base portion 132, thereby heating substrate 140. As described in detail below, resistive heater 151 provides coarse heating, while LED heater 150 provides fine (adjustable) heating.

[0050] The LED heater 150 includes an array of optical elements (e.g., LEDs) and a transparent window (shown and described below) through which light from the optical elements in the LED heater 150 is incident on the underside of the substrate 140, heating the substrate 140. Because the LED heater 150 heats the substrate by radiation from the optical elements (i.e., the LED heater 150 provides radiative heating by emitting light to optically heat the substrate 140), the LED heater 150 may also be referred to as a radiative heater 150.

[0051] The substrate 140 may be heated while being held above the LED heater 150 (e.g., by lift pins passing through the LED heater 150 or by a shaft). The substrate 140 may also be heated when placed loose on the LED heater 150 (e.g., on a mesa on the upper surface of the base portion 132, not shown). The substrate 140 may be fixed to the pedestal 130 using any clamping method and heated when placed on the LED heater 150. The LED in the LED heater 150 emits light having a wavelength preferably selected between 530 nm and 1000 nm to optically heat the substrate 140.

[0052] A purge gas (e.g., an inert gas) from one of the gas sources 104 is supplied to the stem portion 134 through a valve 152. The purge gas flows radially over and across the window of the LED heater 150 to clean the window and maintain its transparency, as described in more detail below. An example of a pedestal 130 including an LED heater 150 and employing a purge scheme is shown and described below with reference to subsequent figures.

[0053] In some applications (e.g., in PECVD and PEALD processes), a plasma may be used to process a substrate 140. The system 100-1 includes a radio frequency (RF) system 142 used to generate a plasma in the processing chamber 101. The RF system 142 includes an RF generator 144 and a matching circuit 146. The RF system 142 supplies RF power to the showerhead 120 while the pedestal 130 is grounded. Alternatively, although not shown, the RF power can be supplied to the pedestal 130 while the showerhead 120 is grounded. The RF power activates a gas or gas mixture supplied through the showerhead 120, generating a plasma between the showerhead 120 and the substrate 140 disposed on the pedestal 130.

[0054] The showerhead 120 and the pedestal 130 include temperature sensors 126, 136 for sensing the temperature of the showerhead 120 and the pedestal 130. The showerhead 120 and the pedestal 130 include cooling channels (not shown). A coolant is circulated through the cooling channels to control the temperature of the showerhead 120 and the pedestal 130. A coolant supply 160 can supply coolant to the cooling channels in the showerhead 120 and the pedestal 130 via valves 162, 164.

[0055] One or more actuators, generally designated 170, may be used to move the pedestal 130 relative to the showerhead 120. One of the actuators 170 may also be used to move and rotate a shaft (shown and described in detail below) that passes through the stem portion 134 of the pedestal 130 to lift and rotate the substrate 140. Purge gas used to clean the window of the LED heater 150 is supplied via a conduit in the shaft through a valve 152, as shown and described in detail below.

[0056] A vacuum pump 180 is connected to the bottom of the processing chamber 101 through a valve 182. The vacuum pump 180 is used to maintain a vacuum within the processing chamber 101 and to evacuate reactants and process by-products from the processing chamber 101. Additionally, if a vacuum clamp is used, the vacuum pump 180 is connected to the stem 134 of the pedestal 130 through a valve 184. The vacuum pump 180 maintains a vacuum through an annular volume (shown and described below) around a shaft within the stem 134 of the pedestal 130, securing the substrate 140 to the pedestal 130.

[0057] Additionally, stem portion 134 includes conduits (shown and described below) that provide electrical connections therethrough to various electrical elements disposed within base portion 132 of pedestal 130. For example, the electrical elements include resistive heater 151, LED heater 150, temperature sensors 126, 136, and other electrical elements (e.g., clamp electrodes shown and described below) disposed within base portion 132 of pedestal 130.

[0058] Controller 190 controls various elements of system 100-1 (e.g., gas distribution system 102, valves, RF system 142, resistive heater 151, LED heater 150, coolant supply 160, actuator 170, vacuum pump 180, etc.). Controller 190 receives data from temperature sensors 126, 136 and controls the temperature of showerhead 120 and pedestal 130 by controlling resistive heater 151, LED heater 150, and coolant supply 160. These and other features of system 100-1 are described in further detail below.

[0059] FIG. 1B illustrates a second example of a substrate processing system (hereinafter, system 100-2) including resistive and radiant heating according to the present disclosure. System 100-2 is identical to system 100-1 shown in FIG. 1A, except that LED heater 150 is disposed below base 132 of pedestal 130 rather than within the pedestal's base 132. LED heater 150 heats base 132 of pedestal 130, which is also heated by resistive heater 151. As described in more detail below, resistive heater 151 provides coarse heating, while LED heater 150 provides fine (adjustable) heating. The combined heat from resistive heater 151 and LED heater 150 is used to heat substrate 140. All other elements of system 100-2 shown in FIG. 1B are identical to system 100-1 shown in FIG. 1A and will not be described again for the sake of brevity.

[0060] FIG. 1C illustrates a third example of a substrate processing system (hereinafter, system 100-3) including resistive and radiant heating according to the present disclosure. System 100-3 is identical to system 100-1 shown in FIG. 1A, except that LED heater 150 is located in showerhead 120 rather than in base 132 of pedestal 130. LED heater 150 in showerhead 120 heats substrate 140 from above. Resistive heater 151 in base 132 of pedestal 130 heats substrate 140 from below. As described in more detail below, resistive heater 151 provides coarse heating, while LED heater 150 provides fine (adjustable) heating. The combined heat from resistive heater 151 and LED heater 150 is used to heat substrate 140. All other elements of system 100-3 shown in Figure 1C are identical to system 100-1 shown in Figure 1A and will not be described again for the sake of brevity. Systems 100-1, 100-2, and 100-3 are collectively referred to as system 100.

[0061] FIG. 1D illustrates a fourth example of a substrate processing system (hereinafter, system 100-4) including resistive heating and radiative heating according to the present disclosure. System 100-4 is a combination of systems 100-1 and 100-3 illustrated in FIGS. 1A and 1C. Specifically, in system 100-4 illustrated in FIG. 1D, a first LED heater 150-1 identical to the LED heater 150 of system 100-1 illustrated in FIG. 1A is disposed within the base 132 of the pedestal 130. Additionally, a second LED heater 150-2 identical to the LED heater 150 of system 100-3 illustrated in FIG. 1C is disposed within the showerhead 120. The resistive heater 151 and the first LED heater 150-1 in the base 132 of the pedestal 130 heat the substrate 140 from below. An LED heater 150-2 in the showerhead 120 heats the substrate 140 from above the substrate 140. As described in detail below, a resistive heater 151 provides coarse heating, while LED heaters 150-1 and 150-2 provide fine (adjustable) heating. The combined heat from the resistive heater 151 and the LED heaters 150-1 and 150-2 is used to heat the substrate 140. All other elements of the system 100-4 shown in FIG. 1D are identical to the systems 100-1 and 100-3 shown in FIGS. 1A and 1C and will not be described again for the sake of brevity.

[0062] FIG. 1E illustrates a fifth example of a substrate processing system (hereinafter, system 100-5) including resistive heating and radiative heating according to the present disclosure. System 100-5 is a combination of systems 100-2 and 100-3 illustrated in FIGS. 1B and 1C. Specifically, in system 100-5 illustrated in FIG. 1E, a first LED heater 150-1 identical to the LED heater 150 of system 100-2 illustrated in FIG. 1B is disposed within the base 132 of the pedestal 130. Furthermore, a second LED heater 150-2 identical to the LED heater 150 of system 100-3 illustrated in FIG. 1C is disposed within the showerhead 120. The resistive heater 151 and the first LED heater 150-1 in the base 132 of the pedestal 130 heat the substrate 140 from below. An LED heater 150-2 in the showerhead 120 heats the substrate 140 from above the substrate 140. As described in detail below, a resistive heater 151 provides coarse heating, while LED heaters 150-1 and 150-2 provide fine (adjustable) heating. The combined heat from the resistive heater 151 and the LED heaters 150-1 and 150-2 is used to heat the substrate 140. All other elements of the system 100-5 shown in FIG. 1E are identical to the systems 100-2 and 100-3 shown in FIGS. 1B and 1C and will not be described again for brevity. Systems 100-1, 100-2, 100-3, 100-4, and 100-5 are collectively referred to as system 100.

[0063] (First example of resistive and radiative heating) FIG. 2 schematically illustrates a first example of resistive heating and radiative heating according to the present disclosure. In this example, a resistive heater 151 and an LED heater 150 are disposed within a base portion 132 of a pedestal 130. The pedestal 130 includes a ceramic material. The LED heater 150 may be disposed above the resistive heater 151 or may be closer to the substrate 140 than the resistive heater 151. In some examples illustrated and described below, the resistive heater 151 and the LED heater 150 may be coplanar. A cooling channel 153 is disposed below the resistive heater 151 within the base portion 132 of the pedestal 130. Coolant from a coolant supply 160 (shown in FIG. 1A ) flows through the cooling channel 153. Various configurations and arrangements of the resistive heater 151 and the LED heater 150 within the base portion 132 of the pedestal 130 are illustrated and described in detail below with reference to subsequent figures.

[0064] 3 shows the LED heater 150, the resistive heater 151, and the cooling channels 153 in further detail. The LED heater 150 includes LEDs 200. The LEDs 200 may be arranged in an LED string in a variety of ways. For example, the LEDs 200 may be arranged in concentric circles, pokes, pie-shaped zones, etc. Various configurations and arrangements of the LEDs 200 and additional structural details (e.g., windows) within the LED heater 150 are illustrated and described in detail below with reference to subsequent figures.

[0065] The resistive heater 151 may include one or more resistive heating elements 203. For example, the resistive heating elements 203 may be arranged in a concentric ring pattern, a spoke-like pattern, a pie-shaped zone pattern, or the like. Various configurations and arrangements of the resistive heating elements 203 in the resistive heater 151 are illustrated and described in detail below with reference to subsequent figures. The cooling channel 153 may include one or more conduits 155. For example, the conduits 155 may be arranged in a concentric ring pattern, a spiral pattern, or the like. Coolant supplied by the coolant supply 160 (shown in FIG. 1A ) flows through the conduits 155 of the cooling channel 153. The cooling channel 153 controls the temperature of the pedestal 130. The cooling channel 153 prevents the LED heater 150 in the base portion 132 of the pedestal 130 from overheating.

[0066] 4A to 4C show examples of different configurations and arrangements of the LEDs 200 in the LED heater 150 and the resistive heating element 203 in the resistive heater 151 in the base portion 132 of the pedestal 130. 4A to 4C show top views of the LED heater 150 and the resistive heater 151 disposed in the base portion 132 of the pedestal 130. The LED heater 150 may be disposed above the resistive heater 151 in the base portion 132 of the pedestal 130. Alternatively, the LED heater 150 and the resistive heater 151 disposed in the base portion 132 of the pedestal 130 may be on the same plane.

[0067] 4A schematically illustrates an example of an annular concentric pattern in which the LEDs 200 in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 are arranged within the base 132 of the pedestal 130. Specifically, the LEDs 200 in the LED heater 150 are arranged within the base 132 of the pedestal 130 in one or more concentric groups of LED strings 205-1, 205-2, 205-3, 205-4 (collectively referred to as groups 205 of LEDs 200 in the LED heater 150). The resistive heating elements 203 in the resistive heater 151 are also arranged within the base 132 of the pedestal 130 in an annular concentric pattern, as shown by 203-1, 203-2, 203-3, 203-4 (collectively referred to as the resistive heating elements 203 in the resistive heater 151).

[0068] The LED strings in the group 205 of LED strings in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 are arranged in a non-overlapping annular concentric pattern within the base 132 of the pedestal 130. For example, the LED strings in the group 205 of LED strings in the LED heater 150 and the resistive heating elements 203-1, 203-2, 203-3, 203-4 in the resistive heater 151 are arranged in an alternating (staggered) pattern from the inner diameter (ID) of the base 132 of the pedestal 130 to the outer diameter (OD) of the base 132 of the pedestal 130.

[0069] FIG. 4B further illustrates the annular concentric pattern in which the LEDs 200 in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 are arranged within the base 132 of the pedestal 130. For example, each group 205 of LED strings can include one or more strings of LEDs 200. Furthermore, within each group 205 of LED strings, the one or more strings of LEDs 200 can be segmented and arranged within zones, as illustrated and described below with reference to FIGS. 7A-7C . Within each group 205 of LED strings, the segments and zones can be individually controlled, as illustrated and described below with reference to subsequent figures. As used herein, a segment is a portion of an LED string, and a zone is a group of portions of an LED string. Furthermore, the resistive heating elements 203-1, 203-2, 203-3, and 203-4 within the resistive heater 151 can also be individually controlled in combination with individually controlling the segments and zones within each group 205 of LED strings, as illustrated and described below with reference to subsequent figures.

[0070] Throughout this disclosure, controlling the LEDs 200 and controlling the resistive heating elements 203 includes controlling the amount of current supplied to the LEDs 200 and resistive heating elements 203. The amount of current can range from zero, which turns off the corresponding LED 200 and the corresponding resistive heating element 203, to any value greater than zero, which controls the amount of radiant and resistive heat supplied by the corresponding LED 200 and the corresponding resistive heating element 203.

[0071] FIG. 4C illustrates that the group 205 of LED strings in the LED heater 150 can be divided into pie-shaped zones (e.g., zones 1 through 8 as shown). As illustrated and described below with reference to subsequent figures, each zone can be individually controlled. Furthermore, portions of the group 205 within each zone can also be individually controlled, as illustrated and described below with reference to subsequent figures. In some examples, the group 205 of LED strings in the LED heater 150 can be divided into radially overlapping zones, as illustrated and described below with reference to FIGS. 7A-7C. Furthermore, within each portion of the group 205, one or more strings of LEDs 200 can be segmented, as illustrated and described below with reference to FIGS. 7A-7C. As illustrated and described below with reference to subsequent figures, the segments, zones, and portions of the LED strings can be individually controlled. Additionally, the resistive heating elements 203-1, 203-2, 203-3, 203-4 within the resistive heater 151 can also be individually controlled in combination with individually controlling the segments and zones within each group 205 of LED strings, as shown and described below with reference to subsequent figures.

[0072] 5 and 6 show additional examples of different configurations and arrangements of the LEDs 200 in the LED heater 150 and the resistive heating elements 203 in the resistive heater 151 disposed within the base portion 132 of the pedestal 130. FIG. 5 shows that the resistive heating elements 203 of the resistive heater 151 are disposed in the same annular concentric pattern as shown in FIGS. 4A-4C. However, the LEDs 200 in the LED heater 150 are disposed in a spoke-like pattern. FIG. 6 shows that both the resistive heating elements 203 of the resistive heater 151 and the LEDs 200 in the LED heater 150 are disposed in a spoke-like pattern. FIGS. 5 and 6 show top views of the LED heater 150 and the resistive heater 151 disposed within the base portion 132 of the pedestal 130. The LED heater 150 may be disposed above the resistive heater 151 within the base portion 132 of the pedestal 130, as shown in FIG. 5. Alternatively, the LED heater 150 and the resistive heater 151 may be coplanar, as shown in Figure 6. In these different configurations and arrangements of the resistive heater 151 and the LED heater 150, the arrangement of the cooling channels 153 in the base portion 132 of the pedestal 130 relative to the resistive heater 151 and the LED heater 150 remains as shown and described with reference to Figures 2 and 3.

[0073] 5, resistive heating elements 203-1, 203-2, 203-3, 203-4 (collectively referred to as resistive heating elements 203 in resistive heater 151) in the resistive heater 151 are arranged in a circular pattern in the base 132 of the pedestal 130. The LEDs 200 in the LED heater 150 are arranged in one or more radially extending, spoke-like groups 207-1, 207-2, ..., 207-8 (collectively referred to as groups 207 of LEDs 200 in the LED heater 150) in the base 132 of the pedestal 130. The groups 207 of LEDs 200 in the LED heater 150 extend radially from the inner diameter of the base 132 of the pedestal 130 to the outer diameter of the base 132 of the pedestal 130.

[0074] For example, each group 207 of LED strings may include one or more strings of LEDs 200 extending radially from the inner diameter of the base 132 of the pedestal 130 to the outer diameter of the base 132 of the pedestal 130. Furthermore, within each group 207 of LED strings, the one or more strings of LEDs 200 may be segmented and arranged within zones, as illustrated and described below with reference to FIGS. 7A-7C . Within each group 207 of LED strings, the segments and zones may be individually controlled, as illustrated and described below with reference to subsequent figures. In some examples, the group 207 of LED strings within the LED heater 150 may be divided into radially overlapping zones, as illustrated and described below with reference to FIGS. 7A-7C . Furthermore, the resistive heating elements 203-1, 203-2, 203-3, and 203-4 within the resistive heater 151 may also be individually controlled in combination with individually controlling the segments and zones within each group 207 of LED strings, as illustrated and described below with reference to subsequent figures.

[0075] 6, the LEDs 200 in the LED heater 150 are arranged in one or more radially extending, spoke-like groups of LED strings 207-1, 207-2, ..., 207-8 (collectively referred to as groups 207 of LEDs 200 in the LED heater 150) within the base 132 of the pedestal 130, as shown in FIG. 5. The resistive heater 151 includes resistive heating elements 209-1, 209-2, ..., 209-8 (collectively referred to as resistive heating elements 209 in the resistive heater 151) within the base 132 of the pedestal 130. The resistive heating elements 209 in the resistive heater 151 are also arranged in a radially extending, spoke-like pattern, similar to the groups 207 of LEDs 200 in the LED heater 150.

[0076] The groups 207 of LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 are arranged so that they do not overlap. For example, the groups 207 of LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 are arranged in an alternating (staggered) pattern. That is, the groups 207 of LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 are radially offset from one another. The groups 207 of LEDs 200 in the LED heater 150 and the resistive heating elements 209 in the resistive heater 151 extend radially from the inner diameter of the base 132 of the pedestal 130 to the outer diameter of the base 132 of the pedestal 130.

[0077] For example, each group 207 of LED strings may include one or more strings of LEDs 200 extending radially from the inner diameter of the base 132 of the pedestal 130 to the outer diameter of the base 132 of the pedestal 130. Furthermore, within each group 207 of LED strings, the one or more strings of LEDs 200 may be segmented and arranged within zones, as illustrated and described below with reference to FIGS. 7A-7C . Within each group 207 of LED strings, the segments and zones may be individually controlled, as illustrated and described below with reference to subsequent figures. In some examples, the group 207 of LED strings within the LED heater 150 may be divided into radially overlapping zones, as illustrated and described below with reference to FIGS. 7A-7C . Furthermore, the resistive heating elements 203-1, 203-2, 203-3, and 203-4 within the resistive heater 151 may also be individually controlled in combination with individually controlling the segments and zones within each group 207 of LED strings, as illustrated and described below with reference to subsequent figures.

[0078] 7A-7B show example arrangements of LEDs 200 within the groups 205 and 207 described above. FIGS. 7A-7C show only a portion of one of the groups 205 and one of the groups 207. The following description applies to each of the groups 205 and 207. In FIG. 7A, the groups 205 and 207 of LEDs 200 may include one or more strings of LEDs 200. For example, three strings of LEDs 200 are shown. However, any number of strings may be used. One or more of the strings of LEDs 200 may be segmented, as shown at 211, 213, 215, 217, and 219. For example, segment 215 overlaps with segments 211, 213, 217, and 219. The LEDs 200 within segment 215 may be controlled separately from the LEDs 200 within segments 211, 213, 217, and 219. The LEDs 200 in segment 215 can be controlled in combination with the LEDs 200 in segments 211 and 213. The LEDs 200 in segment 215 can be controlled in combination with the LEDs 200 in segments 217 and 219. Controlling the LEDs 200 in segments 211, 213, 215, 217, and 219 in this manner, combined with the individual control of the resistive heating elements 203 and 209, provides the ability to precisely heat the substrate 140.

[0079] For example, in FIGS. 7B and 7C, each of the groups 205 and 207 of the LEDs 200 may include a zone (e.g., two zones 221 and 223 shown in FIG. 7B and three zones 221, 223, and 225 shown in FIG. 7C). For example, referring to FIGS. 4A-4C, 5, and 6, assume that the group 205 (or 207) shown in FIG. 7B is group 205-1 (or 207-1) and the group 205 (or 207) shown in FIG. 7B is group 205-2 (or 207-2). In this example, zone 225 in group 205-2 (or 207-2) overlaps with zones 221 and 223 in group 205-1 (or 207-1). Additionally, although not shown to avoid cluttering the figures, the portions of groups 205 and 207 shown in Figures 7B and 7C can be further segmented similar to the segmentation shown in Figure 7A. Thus, in addition to overlapping zones, groups 205 and 207 of LEDs 200 can also include overlapping segments. Controlling these segments and zones individually or in any combination, and further combining with individual control of resistive heating elements 203, 209, can provide even greater granularity for precise heating of substrate 140.

[0080] The above-described segments and zones can be formed within the LED heater 150 by electrically connecting portions of the LEDs 200 and LED strings in different configurations as described above. For example, the connections can be wired on a printed circuit board (PCB) on which the LEDs 200 are disposed within the LED heater 150. Alternatively, the different connections and configurations of the LEDs 200 can be achieved using combinatorial logic circuitry to form different segments and zones of the LEDs 200 within the LED heater 150. In some examples, the above-described segmentation and zoning can also be achieved by controlling the current through different portions of the LED heater 150.

[0081] (Second example of resistive and radiative heating) FIG. 8 schematically illustrates a second example of resistive heating and radiative heating according to the present disclosure. In this second example, the resistive heater 151 and the LED heater 150 are not co-located within the base portion 132 of the pedestal 130. Instead, the resistive heater 151 is located within the base portion 132 of the pedestal 130, and the LED heater 150 is located adjacent to and below the base portion 132 of the pedestal 130. The LED heater 150 includes a through-hole 204 in its central region. The stem portion 134 of the pedestal 130 passes through the through-hole 204. Because the resistive heater 151 and the LED heater 150 are not co-located within the base portion 132 of the pedestal 130, the pedestal 130 may comprise a ceramic or metallic material. A cooling channel 153 is located below the resistive heater 151 within the base portion 132 of the pedestal 130. Coolant from a coolant supply 160 (shown in FIG. 1A ) flows through the cooling channel 153.

[0082] 4A-7C and described above for the first example, can be implemented in the second example shown in FIG. 8, except that in the second example, the LED heater 150 is disposed below the base portion 132 of the pedestal 130, rather than being disposed within the base portion 132 of the pedestal 130. Therefore, the description of the various configurations and arrangements of the resistive heater 151 and the LED heater 150 in the first example will not be repeated for the second example for the sake of brevity.

[0083] In addition to the different location, the LED heater 150 shown in FIG. 8 differs from the LED heater 150 shown in FIGS. 2-6 only in that the LED heater 150 of FIG. 8 further includes a lens 231, as shown and described below with reference to FIG. 9. The LED heater 150 shown in FIG. 8 also includes a window 210 (shown and described below with reference to FIG. 9). Although not shown in FIGS. 2-6, the LED heaters 150 shown in FIGS. 2-6 also include a window 210. Furthermore, as described below, all of the LED heaters 150 described throughout this disclosure include a PCB 201 having disposed thereon the LEDs 200 and a driver 206 (shown and described below with reference to FIG. 10) that drives the LEDs 200.

[0084] FIG. 9 schematically illustrates an LED heater 150 including a lens 231. FIG. 9 illustrates a simplified cross-sectional view of the LED heater 150 including the lens 231. Specifically, the LED heater 150 includes a PCB 201 having LEDs 200 disposed thereon, as illustrated and described above with reference to FIGS. 4A to 7C. A lens array 233 including the lenses 231 is disposed above the LEDs 200. The lenses 231 in the lens array 233 are vertically aligned with the LEDs 200. In some examples, the lenses 231 may be incorporated into (i.e., integrated with) the LEDs 200. That is, the LEDs 200 may be manufactured to include the lenses 231 integrally within the packaging of the LEDs 200. In other words, in some examples, each of the LEDs 200 may include one of the corresponding lenses 231.

[0085] The window 210 is disposed over the lens 231 (if the lens 231 is used). For example, the window 210 may comprise an optically transparent, chemically resistant, and electrically insulating material such as quartz or sapphire. If the lens 231 is not used (e.g., in the first and third examples), the window 210 is disposed over the LED 200. When the LED heater 150 shown in FIG. 9 is mounted below the base 132 of the pedestal 130 as shown in FIG. 8, the lens 231 focuses the light emitted by the LED 200 toward the base 132 of the pedestal 130.

[0086] In the first and second examples described above, the LED heater 150 (specifically, the window 210, the PCB 201 of the LED heater 150, and the lens array 233, if used) includes a through-hole 204 in a central region. The diameter of the through-hole 204 is equal to or smaller than the diameter of the stem portion 134 of the base 130. For example, the diameter of the through-hole 204 can be smaller than the diameter of the stem portion 134 of the base 130 in the first example. The diameter of the through-hole 204 is equal to the diameter of the stem portion 134 of the base 130 in the second example.

[0087] The through-hole 204 is provided so that a shaft (described below) can pass through the stem portion 134 of the base 130 and through the through-hole 204 to move and rotate the substrate 140 (e.g., to raise the substrate 140 above the window 210 to purge the window 210, as described below). In embodiments that do not use a shaft, the through-hole 204 need not be provided and the LEDs 200 can be positioned throughout the LED heater 150, from the outer diameter to the center of the LED heater 150.

[0088] The inner and outer peripheries of the window 210 are sealingly attached to the inner and outer peripheries, respectively, of the LED heater 150. Thus, the LED heater 150 and the window 210 form a sealed enclosure that houses the LED 200 and the PCB 201 therein. Furthermore, a portion of the inside of the sealed enclosure (e.g., the bottom and sides) can be shaped and / or include a reflective material (e.g., a reflective ring) to reflect and / or direct light emitted by the LED 200 onto the substrate 140 in the first example, and onto the bottom of the base portion 132 of the pedestal 130 in the second example.

[0089] Because the window 210 (and lens 231, if used) is integrated with the LED heater 150, which includes the LED 200 and driver 206 disposed on the PCB 201, the entire assembly, including the PCB 201, the LED 200, the driver 206, the lens 231, if used, and the window 210, is collectively referred to as the LED heater 150.

[0090] FIG. 10 shows a top view of the LED heater 150. The lens 231 has been omitted to reduce clutter and to clearly show the LEDs 200 and drivers 206. Each driver 206 may control a set of LEDs 200. For example, the driver 206 may control the LEDs 200 in segments, zones, and portions of an LED string in the LED heater 150, as described above with reference to FIGS. 4A-7C in the first, second, and third examples. The controller 190 (shown in FIGS. 1A-1C) may control the LEDs 200 by controlling the drivers 206.

[0091] In FIG. 10 , reference numeral 202 denotes an LED string arranged in the concentric pattern described above. For simplicity of illustration, the LED string 202 is shown as a single string, but each LED string designated by 202 can include multiple LED strings, as shown in FIGS. 4A-4C . That is, the description of the LED string 202, its portions (e.g., segments and zones), and its control is not limited to a concentric arrangement of the LEDs 200 but also includes a spoke-like arrangement of the LEDs 200. Furthermore, the LEDs 200 within the LED string 202 can be configured and controlled as segments, zones, and portions as described above. Furthermore, in a third example in which the LED heater 150 is disposed within the showerhead 120, the LED string 202 can extend from the center of the LED heater 150 to the outer diameter of the LED heater 150. That is, when disposed within the showerhead 120, the LED heater 150 can be completely filled with LEDs 200. When the LED heater 150 is disposed within the showerhead 120 , the LED heater 150 also does not include the through-hole 204 .

[0092] For example, after substrate 140 is loaded into processing chamber 101 and before substrate 140 is lowered onto pedestal 130 to deposit a film thereon, driver 206 may supply power to LEDs 200 at a first power level to preheat substrate 140 while holding substrate 140 above pedestal 130. Then, after a predetermined time of preheating substrate 140, driver 206 may supply a reduced amount of power to LEDs 200 at a second power level to heat substrate 140 before or after substrate 140 is lowered onto pedestal 130. Then, after a film has been deposited on substrate 140 and before substrate 140 is lifted from pedestal 130 and removed from processing chamber 101, driver 206 may supply a reduced amount of power to LEDs 200 at a third power level.

[0093] Additionally, in any of the above steps, the driver 206 may further control the power supplied to the LEDs 200. For example, each driver 206 may control the duty cycle (on / off time) of each LED 200. For example, each driver 206 may control the intensity (brightness) of each LED 200. For example, the controller 190 may control the driver 206 so that only the LEDs 202 in a selected LED string 202 or portion thereof are turned on or off at different times. For example, the controller 190 may control the driver 206 so that only one or more LEDs 200 in a set (e.g., a zone or portion of the LED heater 150) are turned on or off at different times. For example, the controller 190 may control the driver 206 so that the LED 200 or different portions of the LEDs 200 output different amounts of light (i.e., light heating power) at different times. The driver 206 may gradually or stepwise control the power supplied to the LEDs 200. Any combination of these and additional controls may be used to control the LEDs 200.

[0094] In some examples, some or all of the control of the LEDs 200 provided by the controller 190 may be offloaded (in the form of hardware, firmware, or a combination thereof) into one or more drivers 206. In some examples, one or more drivers 206 may control the remaining drivers 206. The controller 190 and / or drivers 206 may control the LEDs 200 differently before and after the substrate 140 rotates. In addition to controlling the LEDs 200 as described above, the controller 190 may control the resistive heater 151 in combination with the LED heater 150, as described above with reference to FIGS. 4A-7C in the first, second, and third examples. Furthermore, the controller 190 may also control the rotation of the substrate 140 and the flow of coolant through the cooling channels 153 from the coolant supply. Thus, by controlling the resistive heater 151, the LED heater 150, the rotation of the substrate 140, and the flow of coolant through the cooling channels 153, a combination of resistive and radiant heating of different portions of the substrate 140 can be controlled.

[0095] (Third example of resistive and radiative heating) FIG. 11 illustrates a third example of resistive heating and radiative heating according to the present disclosure. In this third example, the resistive heater 151 and the LED heater 150 are not both disposed within the base 132 of the pedestal 130. Instead, the resistive heater 151 is disposed within the base 132 of the pedestal 130, and the LED heater 150 is disposed within the showerhead 120 adjacent to the faceplate 125 of the base 122 of the showerhead 120. The LED heater 150 disposed within the showerhead 120 is similar to the LED heater 150 disposed within the base 132 of the pedestal 130. The LED heater 150 disposed within the showerhead 120 includes the PCB 201, window 210, and driver 206 illustrated and described above with reference to FIGS. 8-10, except that the LED heater 150 disposed within the showerhead 120 does not include the lens 231. The LED heater 150 disposed within the showerhead 120 also does not include the through-hole 204. Furthermore, the LED heater 150 disposed within the showerhead 120 is completely filled with LEDs 200 from the center of the LED heater 150 to the outer diameter of the LED heater 150. The layout of the LEDs 200 within the LED heater 150 disposed within the showerhead 120 can be any of the layouts shown and described with reference to Figures 4A-4C, 5, 7A-7C, or 10.

[0096] In a third example, the base 122 of the showerhead 120 includes a plenum 235 defined by a faceplate 125, a sidewall 129, and a top surface 131 of the base 122 of the showerhead 120. The stem 124 of the showerhead includes an inlet 133 through which one or more process gases are supplied to the showerhead 120 by the gas distribution system 102. A conduit (or bore) 135 is drilled through the center of the stem 124 of the showerhead 120 from the inlet 133 to the plenum 235. The faceplate 125 includes a plurality of through-holes 127.

[0097] The LED heater 150 is disposed within or below a plenum 235 in the base 124 of the showerhead 120. A window 210 of the LED heater 150 faces the substrate 140 and the pedestal 130. The window 210 of the LED heater 150 is flush with the faceplate 125 of the showerhead 120. In some examples, the faceplate 125 can be an annular ring, which together with the window 210 forms the faceplate 125 of the showerhead 120. Thus, the plenum 235 is defined by the top surface 131, the sidewall 129 of the base 122 of the showerhead 120, and the bottom surface of the LED heater 150 opposite the window 210.

[0098] The diameters of the LED heater 150 and the plenum 235 are smaller than the outer diameter of the base 122 of the showerhead 120. The diameter of the LED heater 150 is equal to the diameter of the plenum 235. The LED heater 150 and the plenum 235 extend radially from the center of the base 122 of the showerhead 120 to the outer diameter of the base 122 of the showerhead 120. The diameters of the LED heater 150 and the plenum 235 are equal to or greater than the diameter of the substrate 140.

[0099] The through-holes 127 extend vertically through the LED heater 150 (i.e., through the bottom surface of the LED heater 150, the PCB 201, and the window 210). The through-holes 127 are parallel to a vertical axis of the showerhead 120, which is perpendicular to the diameter of the base 122 of the showerhead 120. The through-holes 127 are distributed from the center of the base 122 of the showerhead 120 to the outer diameter of the base 122 of the showerhead 120. The through-holes 127 are in fluid communication with the plenum 235, the conduit 135, and the inlet 133 of the showerhead 120. The LEDs 200 are positioned on the PCB 201 of the LED heater 150 with clearance from the through-holes 127 in the faceplate 125.

[0100] A cooling plate 157 is disposed on the top surface 131 of the base 122 of the showerhead 120. The cooling plate 157 includes one or more cooling channels 159. Coolant supplied by a coolant supply 160 (shown in FIG. 1C) flows through the cooling channels 159. The cooling plate 157 controls the temperature of the showerhead 120. The coolant flowing through the cooling channels 159 prevents the LED heater 150 in the showerhead 120 from overheating. The base 132 of the pedestal 130 also includes a resistive heater 151 and cooling channels 153. The coolant supplied by the coolant supply 160 (shown in FIG. 1C) also flows through the cooling channels 153.

[0101] 4A-7C for the first example can be implemented in the second example shown in FIG. 8 , except that in the third example, the LED heater 150 is disposed within the showerhead 120 rather than within the base 132 of the pedestal 130. Accordingly, the description of the various configurations and arrangements of the resistive heater 151 and the LED heater 150 in the first and second examples will not be repeated for the second example for the sake of brevity. Furthermore, the various controls of the LED heater 150 and the resistive heater 151 for the first and second examples described above with reference to FIGS. 4A-10 also apply to the third example and will therefore not be repeated for the third example for the sake of brevity.

[0102] (Fourth example of resistive and radiative heating) FIG. 12 illustrates a fourth example of resistive heating and radiative heating for use in the system 100 of FIG. 1D according to the present disclosure. In this fourth example, a resistive heater 151 and a first LED heater 150-1 are co-located within the base 132 of the pedestal 130, as illustrated and described above with reference to FIGS. 1A and 2-7C. The resistive heater 151 and the first LED heater 150-1 shown in FIG. 12 are identical to the resistive heater 151 and the LED heater 150, respectively, shown in FIGS. 1A and 2-7C, and therefore will not be described again for the sake of brevity. Furthermore, the second LED heater 150-2 disposed within the showerhead 120 is identical to the LED heater 150 disposed within the showerhead 120, as illustrated and described above with reference to FIG. 11, and therefore will not be described again for the sake of brevity.

[0103] The shape of the first and second LED heaters 150-1, 150-2 is identical to the shape of the LED heater 150 described above with reference to Figures 2-11 and below with reference to Figures 14 and 15, and therefore will not be described again for the sake of brevity. The geometric relationship of the first and second LED heaters 150-1, 150-2 to the resistive heater 151, the pedestal 130, components of the pedestal 130 (e.g., base portion 132, cooling channels 153 and 159, etc.), the showerhead 120, and components of the showerhead 120 is identical to the relationship of the LED heater 150 described above with reference to Figures 2-11 and below with reference to Figures 14 and 15, and therefore will not be described again for the sake of brevity.

[0104] The second LED heater 150-2 can be controlled in a manner similar to the first LED heater 150-1. The second LED heater 150-2 can be controlled in combination with the resistive heater 151 in a manner similar to the first LED heater 150-1, which can be controlled in combination with the resistive heater 151. The second LED heater 150-2 can be controlled in any manner in combination with the first LED heater 150-1. The first and second LED heaters 150-1 and 150-2 can be controlled in any manner in combination with the resistive heater 151. The various controls of the LED heater 150 and the resistive heater 151 for the first and third examples described above with reference to Figures 4A-11 and below with reference to Figures 14-34 also apply to the fourth example and therefore will not be repeated for the third example for brevity.

[0105] (5th example of resistive and radiative heating) FIG. 13 illustrates a fifth example of resistive heating and radiative heating for use in the system 100 shown in FIG. 1E according to the present disclosure. In the fifth example, a resistive heater 151 is disposed within the base 132 of the pedestal 130, as illustrated and described above with reference to FIGS. 1A and 2-7C. A first LED heater 150-1 is disposed below the base 132 of the pedestal 130, as illustrated and described above with reference to FIGS. 8-10. The resistive heater 151 and the first LED heater 150-1 are identical to the resistive heater 151 and the LED heater 150 shown in FIGS. 8-10, respectively, and therefore will not be described again for the sake of brevity. Furthermore, the second LED heater 150-2 disposed within the showerhead 120 is identical to the LED heater 150 disposed within the showerhead 120, as illustrated and described above with reference to FIG. 11, and therefore will not be described again for the sake of brevity.

[0106] Additionally, the shape of the first and second LED heaters 150-1, 150-2 is identical to the shape of the LED heater 150 described above with reference to Figures 2-11 and below with reference to Figures 14 and 15, and therefore will not be described again for the sake of brevity. The geometric relationship of the first and second LED heaters 150-1, 150-2 to the resistive heater 151, pedestal 130, components of the pedestal 130 (e.g., base portion 132, cooling channels 153 and 159, etc.), showerhead 120, and components of the showerhead 120 is identical to the relationship of the LED heater 150 described above with reference to Figures 2-11 and below with reference to Figures 14 and 15, and therefore will not be described again for the sake of brevity.

[0107] The second LED heater 150-2 can be controlled in a manner similar to the first LED heater 150-1. The second LED heater 150-2 can be controlled in combination with the resistive heater 151 in a manner similar to the first LED heater 150-1, which can be controlled in combination with the resistive heater 151. The second LED heater 150-2 can be controlled in any manner in combination with the first LED heater 150-1. The first and second LED heaters 150-1 and 150-2 can be controlled in any manner in combination with the resistive heater 151. The various controls of the LED heater 150 and the resistive heater 151 for the second and third examples described above with reference to Figures 8-11 and below with reference to Figures 14-34 also apply to the fifth example and therefore will not be repeated for the third example for brevity.

[0108] (Example of substrate rotation and window purging) 14 and 15 show an example of an LED heater 150 mounted within a pedestal 130 according to the first example described above, with a vacuum clamp used to secure the substrate 140 to the pedestal 130. Additionally, these figures show the vacuum clamp as well as the purging and rotation methods used to keep the window 210 clean and to rotate the substrate 140 relative to the LED heater 150. FIG. 14 shows an example of a vacuum clamp. FIG. 15 shows the purging of the window 210 as the substrate 140 is lifted from the pedestal 130 and rotated. Elements already shown and described above will not be described again for the sake of brevity.

[0109] In FIG. 14 , the LED heater 150, along with the window 210, is positioned within an annular cavity 138 formed within the base 132 of the pedestal 130. The annular cavity 138 is formed by removing material from the top surface of the base 132 of the pedestal 130. The depth of the annular cavity 138 is equal to the height of the LED heater 150 and the window 210. The LED heater 150 and the base 132 of the pedestal 130 are coplanar. Therefore, the top surface of the window 210 is flush with the top edge 139 of the base 132 of the pedestal 130. The substrate 140 is positioned on top of the window 210 during processing. A vacuum clamp, described below, is used to secure the substrate 140 to the pedestal 130.

[0110] The stem portion 134 of the pedestal 130 includes a shaft 250. The shaft 250 extends through the center of the stem portion 134 and the base portion 132 of the pedestal 130. The shaft 250 includes a T-shaped end (i.e., a horizontal portion forming the upper portion of the T) and a distal end (i.e., a vertical portion forming the lower portion of the T). The T-shaped end of the shaft 250 extends through the through-hole 204 in the LED heater 150 and a central region of the upper surface of the base portion 132 of the pedestal 130. The upper surface of the T-shaped end of the shaft 250 is flush with the upper surface of the window 210. The lower surface of the T-shaped end of the shaft 250 is flush with and rests on the central region of the upper surface of the base portion 132 of the pedestal 130. The diameter of the T-shaped end of the shaft 250 is slightly smaller than the diameter of the through-hole 204 in the LED heater 150 and the through-hole 204 in the LED heater 150.

[0111] The distal end of the shaft 250 extends through the resistive heater 151 and the cooling channel 153, and through the lower end of the stem portion 134 of the pedestal 130. The distal end of the shaft 250 extends through a vacuum pump 180 attached to the lower end of the stem portion 134 of the pedestal 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can move the shaft 250 through the vacuum pump 180 and through the stem portion 134 and base portion 132 of the pedestal 130 to raise and lower the substrate 140. In FIG. 15 , when lifted, the substrate 140 is held by the T-shaped end of the shaft 250. When lifted, the actuator 170 can further rotate the shaft 250 to rotate the substrate 140 relative to the LED heater 150.

[0112] A conduit 252 is drilled through the shaft 250. The conduit 252 and the shaft 250 are coaxial. The conduit 252 extends through the shaft 250 to the T-shaped end of the shaft 250. The shaft 250 includes a plurality of holes 254 drilled radially through the T-shaped end of the shaft 250. Near the T-shaped end of the shaft 250, one end of the conduit 252 connects to the plurality of holes 254. The distal end of the conduit 252 extends from the distal end of the shaft 250. The distal end of the conduit 252 is connected to one of the gas sources 104 through a valve 152 (shown in FIG. 1A ). In FIG. 15 , when the shaft 250 lifts the substrate 140, purge gas is supplied through the conduit 252. Purge gas flows through conduit 252 and exits through holes 254, flowing radially over and across window 210 in the direction of the arrows shown, cleaning window 210.

[0113] The stem portion 134 of the pedestal 130 further includes a conduit 256 through which an electrical connection (e.g., an insulated wire or conductor) to the electrical elements (e.g., the resistive heater 151 and the LED heater 150) in the base portion 132 of the pedestal 130 is routed. The distal end of the electrical connection is connected to the controller 190 (shown in FIG. 1A ). The conduit 256 is drilled and extends through the stem portion 134 of the pedestal 130. The conduit 256 extends through the resistive heater 151 and the cooling channel 153 into the base portion 132 of the pedestal 130 and to the through-hole 204 of the LED heater 150. The conduits 252, 256 and the shaft 250 are coaxial. The diameter of the conduit 256 is larger than the diameter of the shaft 250.

[0114] The stem portion 134 of the pedestal 130 further includes a conduit 258. The diameter of the conduit 258 is larger than the diameter of the conduit 256 and smaller than the diameter of the stem portion 134 of the pedestal 130. The conduits 258, 252, 256 and the shaft 250 are coaxial. A first end of the conduit 258 is in fluid communication with the vacuum pump 180. A second end of the conduit 258 extends through the stem portion 134 of the pedestal 130 and into the base portion 132 of the pedestal 130. The second end of the conduit 258 extends into the base portion 132 of the pedestal 130 to a position below the cooling channels 153. At the second end, the conduit 258 connects to a first set of conduits (or passages) 260 that are radially drilled through the base portion 132 of the pedestal 130. Conduit 260 extends radially to the outer diameter of base portion 132 of pedestal 130. Conduit 260 is in fluid communication with conduit 258.

[0115] A second set of conduits 262 are drilled through the base 132 of the pedestal 130 perpendicular to the first set of conduits 260. The conduits 262 extend from the conduits 260, through the cooling channels 153, the resistive heater 151, and the LED heater 150, to the top surface of the base 132 of the pedestal 130, where the substrate 140 rests during processing. The conduits 262 are in fluid communication with the conduits 260, 258.

[0116] To secure substrate 140 to pedestal 130, controller 190 activates vacuum pump 180 and opens valve 184 (shown in FIG. 1A ) to create a vacuum in conduits 258, 260, and 262. The vacuum in conduits 258, 260, and 262 secures substrate 140 to base 132 of pedestal 130. After substrate 140 is secured to base 132 of pedestal 130, controller 190 controls resistive heater 151, LED heater 150, and cooling channels 153 to heat substrate 140 as described above in accordance with the process being performed on substrate 140.

[0117] 15 , when it is necessary to rotate the substrate 140 relative to the LED heater 150, the controller 190 controls the vacuum pump 180 and the valve 184 to reduce the vacuum in the conduits 258, 260, and 262. The vacuum in the conduits 258, 260, and 262 is reduced sufficiently to allow the shaft 250 to lift the substrate 140 against the vacuum force. The controller 190 activates the actuator 170 to cause the shaft 250 to lift and rotate the substrate 140. In some applications, the pedestal 130 can be rotated to lift and hold the substrate 140 stationary and rotate the LED heater 150 relative to the substrate 140.

[0118] Once substrate 140 is lifted, controller 190 opens valve 152 (shown in FIG. 1A ) to allow purge gas to flow through conduit 252 and through hole 254. The purge gas flows radially over and throughout window 210 through conduit 252 and hole 254, as shown by the arrows in FIG. 15 . Flowing purge gas over and throughout window 210 removes any material that may have deposited on window 210. Controller 190 controls valves 152 and 184 (shown in FIG. 1A ) so that vacuum pump 180 continues to draw suction through conduits 258, 260, and 262 and processing chamber 101 (shown in FIG. 1A ). Thus, material removed from window 210 is evacuated from processing chamber 101.

[0119] The actuator 170 then lowers the shaft 250 to reposition the substrate 140 on the base 132 of the pedestal 130. The substrate 140 is then vacuum clamped as described above. The controller 190 again controls the resistive heater 151, the LED heater 150, and the cooling channels 153 to heat the substrate 140 as described above. This procedure is repeated as necessary until processing of the substrate 140 is complete.

[0120] 14 and 15 describe the rotation of the substrate 140 and the purging of the window 210 of the LED heater 150 with reference to the LED heater 150 and the resistive heater 151 arranged in the concentric pattern shown and described above with reference to FIGS. 4A-4C. When the LED heater 150 and the resistive heater 151 are arranged as shown and described with reference to FIGS. 5 and 6, the substrate 140 can be lifted and rotated, and the window 210 of the LED heater 150 can be purged in a similar manner. When the first LED heater 150-1 and the resistive heater 151 are arranged as shown and described with reference to FIG. 12, the substrate 140 can be lifted and rotated, and the window 210 of the first LED heater 150-1 can be purged in a similar manner. Furthermore, when the LED heater 150 is arranged below the base portion 132 of the pedestal 130 as shown and described with reference to FIG. 8, and when the LED heater 150 is arranged within the showerhead 120 as shown and described with reference to FIG. 11, the substrate 140 can be lifted and rotated in a similar manner. Furthermore, when the first LED heater 150-1 is positioned below the base portion 132 of the pedestal 130 as shown and described with reference to FIG. 13, and when the second LED heater 150-2 is positioned within the showerhead 120 as shown and described with reference to FIG. 13, the substrate 140 can be lifted and rotated in a similar manner.

[0121] 14 and 15 illustrate and describe a vacuum clamp as an example of a clamping mechanism used to secure the substrate 140 to the pedestal base 132. Alternatively, any other clamping mechanism may be used. Non-limiting examples of other clamping mechanisms include electrostatic clamps and mechanical clamps that may be employed within the pedestal 130.

[0122] Additionally, although not shown, in some examples, instead of using a clamping method, a mesa can be used to support the substrate 140 on the pedestal 130. In a first example, in which the resistive heater 151 and the LED heater 150 are both disposed within the base portion 132 of the pedestal 130, the mesa is a small protrusion or generally cylindrical element that rises above the top surface of the window 210 and projects toward the substrate 140. The mesa can be integrally (i.e., homogeneously) formed on the top surface of the window 210. The mesa comprises the same optically transparent, chemically resistant, and electrically insulating material as the window 210, such as quartz or sapphire. The mesas can be distributed anywhere on the top surface of the window 210 (e.g., between the LEDs 200), with gaps between them.

[0123] In a third example, in which the resistive heater 151 is disposed within the base 132 of the pedestal 130 and the LED heater 150 is disposed within the showerhead 120, the mesas are small protrusions or generally cylindrical elements that protrude above the top surface of the base 132 of the pedestal 130. The mesas can be integrally (i.e., homogeneously) formed on the top surface of the base 132 of the pedestal 130. The mesas comprise the same material as the base 132 of the pedestal 130. The mesas can be distributed anywhere on the top surface of the base 132 of the pedestal 130. In the first and third examples, the number, size, and shape of the mesas can be varied. The mesas can be circular, square, hexagonal, or any other polygonal shape (or any combination thereof).

[0124] 16 shows an example of a system for controlling resistive heater 151, LED heater 150, first and second LED heaters 150-1 and 150-2, and cooling channels 153 and 159 in the first to fifth examples of resistive heating and radiant heating described above. Controller 190 controls resistive heater 151, LED heater 150, first and second LED heaters 150-1 and 150-2, and cooling channels 153 and 159 as described above with reference to FIGS. 2-15 and in more detail below with reference to FIGS. 15-34. Controller 190 and driver 206 perform the control operations described above with reference to FIGS. 2-15 and the methods described below with reference to FIGS. 15-34.

[0125] Briefly, in the first through fifth resistive and radiative heating examples above, the controller 190 controls the driver 206, which in turn controls the LEDs 200 in different portions (e.g., segments and zones) of the LED heaters 150, 150-1, and 150-2, as described above and below. The controller 190 also controls the resistive heating elements 203 and 207 of the resistive heater 151, as described above and below. The controller 190 controls the different portions (e.g., segments and zones) of the LED heaters 150, 150-1, and 150-2 and the different portions of the resistive heating elements 203 and 207 of the resistive heater 151 in a time-shifted manner, as described in further detail below. Additionally, the controller 190 rotates the substrate 140, as described above and below. Additionally, the controller 190 controls the flow of coolant supplied by the coolant supply 160 through the cooling channels 153 and 159, as described above and below. The controller 190 can perform any combination of these control actions to fine-tune the heating of the substrate 140 using any combination of these controls.

[0126] In the following description, for the sake of generality, only the names of the individual components of the resistive heater 151 and the LED heaters 150, 150-1, and 150-2 will be used, and the reference numerals of the individual components of the resistive heater 151 and the LED heaters 150, 150-1, and 150-2 will be omitted. Furthermore, the method described below applies to resistive heating and radiative heating of the substrate 140 using any of the first to fifth examples of resistive heating and radiative heating described above.

[0127] (Resistance heating and radiation heating methods) 17 illustrates a method 300 for resistively and radiatively heating a substrate 140 according to the present disclosure. At 302, the substrate 140 is heated using resistive heating (also referred to as coarse heating) provided by a resistive heater 151 disposed within the base 132 of the pedestal 130. At 304, the substrate 140 is heated using radiative heating (also referred to as finely tuned heating) provided by an LED heater 150 disposed within the base 132 of the pedestal 130, beneath the pedestal 130, or within the showerhead 120. Methods for combining coarse and finely tuned heating provided by controlling the resistive heater 151 and the LED heater 150 are described in detail below. In all of the following methods, although not shown, in combination with controlling the resistive heater 151 and the LED heater 150, the controller 190 also controls the flow of coolant through the cooling channels 153, 159 to control the temperatures of the substrate 140, the showerhead 120, and the LED heater 150.

[0128] 18 illustrates a method 310 for resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 312, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base 132 of the pedestal 130. At 314, the controller 190 activates the shaft 250 to rotate the substrate 140. At 316, the controller 190 adjusts the current supplied to the resistive heating elements of the resistive heater 151. Additionally, the controller 190 and / or the driver 206 adjust the illumination intensity of different portions (e.g., the segments and / or zones described above) of the LED heater 150. For example, the controller 190 controls various combinations of the resistive heating elements of the resistive heater 151 and the segments and / or zones of the LED heater 150. These various controls of the resistive heater 151 and the LED heater 150 minimize cold spots on the substrate 140, improve temperature uniformity across the substrate 140, and reduce overheating of the LEDs 200 within the LED heater 150.

[0129] 19 illustrates a method 320 for resistive and radiative heating of a substrate 140 including substrate rotation according to the present disclosure. At 322, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base portion 132 of the pedestal 130. At 324, the controller 190 selects a first portion (e.g., a first zone) of the LED heater 150 to heat the substrate 140. At 326, the controller 190 activates the shaft 250 to rotate the substrate 140. At 328, the controller 190 deselects the first portion and selects a second portion (e.g., a second zone) of the LED heater 150 to heat the substrate 140.

[0130] In this manner, the controller 190 can again rotate the substrate 140 and select different portions of the LED heater 150 to heat the substrate 140. By also periodically rotating the substrate 140 and selecting different portions of the LED heater 150 to heat the substrate 140 at different times, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 within the LED heater 150 is reduced.

[0131] 20 illustrates a method 340 of resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 342, the controller 190 selects a first set of resistive heating elements of the resistive heater 151 disposed within the base portion 132 of the pedestal 130 to heat the substrate 140. At 344, the controller 190 selects a first portion (e.g., a first zone) of the LED heater 150 to heat the substrate 140. At 346, the controller 190 activates the shaft 250 to rotate the substrate 140. At 348, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the LED heater 150, and selects a second set of resistive heating elements of the resistive heater 151 and a second portion (e.g., a second zone) of the LED heater 150 to heat the substrate 140.

[0132] In this manner, the controller 190 can again rotate the substrate 140 and select and deselect different sets of resistive heating elements of the resistive heater 151 and different portions of the LED heater 150 to heat the substrate 140. By also periodically rotating the substrate 140 and selecting different sets of resistive heating elements of the resistive heater 151 and different portions of the LED heater 150 to heat the substrate 140 at different times, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 within the LED heater 150 is reduced.

[0133] FIG. 21 illustrates a method 360 for resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 362, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base portion 132 of the pedestal 130. At 364, the controller 190 selects a portion (e.g., a first zone) of the LED heater 150 to heat the substrate 140. The controller 190 controls the selected portion (e.g., the first zone) of the LED heater 150 to heat the substrate 140 with a first illumination intensity of the LEDs 200 within the selected portion. At 366, the controller 190 activates the shaft 250 to rotate the substrate 140. At 368, the controller 190 controls the selected portion (e.g., the first zone) of the LED heater 150 to heat the substrate 140 with a second illumination intensity of the LEDs 200 within the selected portion.

[0134] In this manner, the controller 190 can again rotate the substrate 140 and vary the illumination intensity of selected portions of the LED heater 150 to heat the substrate 140. By selecting different illumination intensities of selected portions of the LED heater 150 to heat the substrate 140 at different times while also periodically rotating the substrate 140, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 within the LED heater 150 is reduced.

[0135] 22 illustrates a method 380 for resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 382, ​​the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base portion 132 of the pedestal 130. At 384, the controller 190 selects first and second portions (e.g., first and second zones) of the LED heater 150 to heat the substrate 140. The controller 190 controls the selected portions (e.g., first and second zones) of the LED heater 150 to heat the substrate 140 with first and second illumination intensities of the LEDs 200 within the first and second portions, respectively. At 386, the controller 190 actuates the shaft 250 to rotate the substrate 140. In 388, the controller 190 controls selected portions (e.g., the first and second zones) of the LED heater 150 to heat the substrate 140 with the third and fourth illumination intensities of the LEDs 200 within the selected portions.

[0136] In this manner, the controller 190 can again rotate the substrate 140 and vary the illumination intensity of selected portions of the LED heater 150 to heat the substrate 140. By selecting different illumination intensities of selected portions of the LED heater 150 to heat the substrate 140 at different times while also periodically rotating the substrate 140, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 within the LED heater 150 is reduced.

[0137] 23 illustrates a method 400 for resistive and radiative heating of a substrate 140 including substrate rotation according to the present disclosure. At 402, the controller 190 selects first and second sets of resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 disposed within the base portion 132 of the pedestal 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying first and second currents to the first and second sets of resistive heating elements, respectively.

[0138] At 404, the controller 190 selects first and second portions (e.g., first and second zones) of the LED heater 150 to heat the substrate 140. The controller 190 controls the selected portions (e.g., first and second zones) of the LED heater 150 to heat the substrate 140 with first and second illumination intensities of the LEDs 200 in the first and second portions, respectively. At 406, the controller 190 actuates the shaft 250 to rotate the substrate 140.

[0139] At 408, the controller 190 controls selected resistive heating elements (e.g., the first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying third and fourth currents to the first and second sets of resistive heating elements, respectively. The controller 190 controls selected portions (e.g., the first and second zones) of the LED heater 150 to heat the substrate 140 with third and fourth illumination intensities of the LEDs 200 in the first and second portions, respectively.

[0140] In this manner, the controller 190 can again rotate the substrate 140, vary the current supplied to selected resistive heating elements of the resistive heater 151, and vary the illumination intensity of selected portions of the LED heater 150 to heat the substrate 140. By also periodically rotating the substrate 140 while supplying different currents to selected resistive heating elements of the resistive heater 151 at different times and selecting different illumination intensities of selected portions of the LED heater 150 to heat the substrate 140 at different times, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 within the LED heater 150 is reduced.

[0141] 24 illustrates a method 420 of resistive and radiative heating of a substrate 140 including substrate rotation according to the present disclosure. At 422, the controller 190 selects first and second sets of resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 disposed within the base portion 132 of the pedestal 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying first and second currents to the first and second sets of resistive heating elements, respectively.

[0142] At 424, the controller 190 selects first and second portions (e.g., first and second zones) of the LED heater 150 to heat the substrate 140. The controller 190 controls the selected portions (e.g., first and second zones) of the LED heater 150 to heat the substrate 140 with first and second illumination intensities of the LEDs 200 in the first and second portions, respectively. At 426, the controller 190 actuates the shaft 250 to rotate the substrate 140.

[0143] At 428, the controller 190 controls selected resistive heating elements (e.g., the first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying third and fourth currents to the first and second sets of resistive heating elements, respectively. The controller 190 controls selected portions (e.g., the first and second zones) of the LED heater 150 to heat the substrate 140 with third and fourth illumination intensities of the LEDs 200 in the first and second portions, respectively.

[0144] At 430, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the LED heater 150, and selects a third set of resistive heating elements of the resistive heater 151 and a third portion (e.g., a third zone) of the LED heater 150 to heat the substrate 140. At 432, the controller 190 controls the selected resistive heating elements (e.g., the second and third resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying second and third currents to the second and third sets of resistive heating elements, respectively. The controller 190 controls the selected portion (e.g., the second and third zones) of the LED heater 150 to heat the substrate 140 with second and third illumination intensities of the LEDs 200 in the second and third portions, respectively. In step 432, the controller 190 can also vary the current supplied to the second set of resistive heating elements, which can vary the illumination intensity of the LEDs 200 in the second portion.

[0145] In this manner, the controller 190 can again rotate the substrate 140, select and deselect different sets of resistive elements of the resistive heater 151, vary the current supplied to selected resistive heating elements of the resistive heater 151, select and deselect different portions of the LED heater 150, and vary the illumination intensity of selected portions of the LED heater 150 to heat the substrate 140. By also periodically rotating the substrate 140, selecting different sets of resistive heating elements of the resistive heater 151 at different times, supplying different currents to selected different sets of resistive heating elements of the resistive heater 151 at different times, selecting different portions of the LED heater 150 at different times, and selecting different illumination intensities of selected different portions of the LED heater 150 to heat the substrate 140 at different times, minimizing cold spots on the substrate 140, improving temperature uniformity across the substrate 140, and reducing overheating of the LEDs 200 within the LED heater 150.

[0146] 25 illustrates a method 440 of resistively and radiatively heating a substrate 140 according to the present disclosure. At 442, the substrate 140 is heated using resistive heating (also referred to as coarse heating) provided by a resistive heater 151 disposed within the base 132 of the pedestal 130. At 444, the substrate 140 is heated using radiative heating (also referred to as finely tuned heating) provided by an LED heater 150 disposed below the base 132 of the pedestal 130. The method of combining coarse and finely tuned heating provided by controlling the resistive heater 151 and the LED heater 150, as described in detail above, also applies when the resistive heater 151 is disposed within the base 132 of the pedestal 130 and the LED heater 150 is disposed below the base 132 of the pedestal 130. In all of the above methods, although not shown, in combination with controlling the resistive heater 151 and the LED heater 150, the controller 190 also controls the flow of coolant through the cooling channels 153, 159 to control the temperature of the substrate 140 and the LED heater 150.

[0147] 26 illustrates a method 460 for resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 462, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed beneath the base 132 of the pedestal 130. At 464, the controller 190 actuates the shaft 250 to rotate the substrate 140. At 466, the controller 190 adjusts the current supplied to the resistive heating elements of the resistive heater 151. Additionally, the controller 190 and / or the driver 206 adjust the illumination intensity of different portions of the LED heater 150 (e.g., the aforementioned segments and / or zones) as described in the methods above. For example, the controller 190 controls various combinations of the resistive heating elements of the resistive heater 151 and the segments and / or zones of the LED heater 150 as described in the methods above. These various controls of the resistive heater 151 and the LED heater 150 minimize cold spots on the substrate 140, improve temperature uniformity across the substrate 140, and reduce overheating of the LEDs 200 within the LED heater 150.

[0148] 27 illustrates a method 500 for resistive and radiative heating of a substrate 140 according to the present disclosure. At 502, the substrate 140 is heated using resistive heating (also referred to as coarse heating) provided by a resistive heater 151 disposed within the base 132 of the pedestal 130. At 504, the substrate 140 is heated using radiative heating (also referred to as finely tuned heating) provided by a first LED heater 150-1 disposed within or below the base 132 of the pedestal 130 and / or by a second LED heater 150-2 disposed within the showerhead 120. The method for combining coarse and finely tuned heating provided by controlling the resistive heater 151 and the first and second LED heaters 150-1 and 150-2 is described in more detail below.

[0149] In all of the following methods, although not shown, in combination with controlling the resistive heater 151 and the first and second LED heaters 150-1 and 150-2, the controller 190 also controls the flow of coolant through the cooling channels 153, 159 to control the temperatures of the substrate 140, the showerhead 120, and the first and second LED heaters 150-1 and 150-2. Furthermore, in the following methods, the descriptions of the first and second LED heaters 150-1 and 150-2 are interchangeable (i.e., the first LED heater 150-1 can be read as the second LED heater 150-2, and vice versa).

[0150] 28 illustrates a method 510 for resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 512, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base 132 of the pedestal 130. At 514, the controller 190 activates the shaft 250 to rotate the substrate 140. At 516, the controller 190 adjusts the current supplied to the resistive heating elements of the resistive heater 151. Additionally, the controller 190 and / or the driver 206 adjust the illumination intensity of different portions (e.g., the segments and / or zones described above) of the first and second LED heaters 150-1 and 150-2. For example, the controller 190 controls various combinations of the resistive heating elements of the resistive heater 151 and the segments and / or zones of the first and second LED heaters 150-1 and 150-2. These various controls of the resistive heater 151 and the first and second LED heaters 150-1, 150-2 minimize cold spots on the substrate 140, improve temperature uniformity across the substrate 140, and reduce overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2.

[0151] 29 illustrates a method 520 of resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 522, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base portion 132 of the pedestal 130. At 524, the controller 190 selects a first portion (e.g., a first zone) of the first LED heater 150-1 to heat the substrate 140. At 526, the controller 190 activates the shaft 250 to rotate the substrate 140. At 528, the controller 190 deselects the first portion of the first LED heater 150-1 and selects a second portion (e.g., a second zone) of the second LED heater 150-2 to heat the substrate 140.

[0152] Although not shown, the controller 190 can also alternately activate and deactivate the first and second LED heaters 150-1, 150-2. Additionally, the controller 190 can vary the duration for which the first and second LED heaters 150-1, 150-2 are activated and deactivated. The controller 190 can also control the resistive heater 151, as described throughout this disclosure, and in this manner control the first and second LED heaters 150-1, 150-2 while rotating the substrate 140.

[0153] In this manner, the controller 190 can again rotate the substrate 140 and select different selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. By also periodically rotating the substrate 140 while selecting different portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 at different times, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 within the first and second LED heaters 150-1, 150-2 is reduced.

[0154] 30 illustrates a method 540 of resistive and radiative heating of a substrate 140 including substrate rotation according to the present disclosure. At 542, the controller 190 selects a first set of resistive heating elements of the resistive heater 151 disposed within the base 132 of the pedestal 130 to heat the substrate 140. At 544, the controller 190 selects a first portion (e.g., a first zone) of the first LED heater 150-1 to heat the substrate 140. At 546, the controller 190 actuates the shaft 250 to rotate the substrate 140. In 548, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the first LED heater 150-1 (or the second LED heater 150-2) and selects the second set of resistive heating elements of the resistive heater 151 and the second portion (e.g., the second zone) of the second LED heater 150-2 to heat the substrate 140.

[0155] In this manner, the controller 190 can again rotate the substrate 140 and select and deselect different sets of resistive heating elements of the resistive heater 151 and different portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. By also periodically rotating the substrate 140 while selecting different sets of resistive heating elements of the resistive heater 151 and different portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 at different times, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2 is reduced.

[0156] 31 illustrates a method 560 of resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 562, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base portion 132 of the pedestal 130. At 564, the controller 190 selects a first portion (e.g., a first zone) of the first LED heater 150-1 and a second portion (e.g., a second zone) of the second LED heater 150-1 to heat the substrate 140. The first portion (e.g., the first zone) of the first LED heater 150-1 and the second portion (e.g., the second zone) of the second LED heater 150-1 may or may not overlap. The controller 190 controls the selected portion (e.g., the first zone of the first LED heater 150-1 and the second zone of the second LED heater 150-2) to heat the substrate 140 with the first and second irradiation intensities of the LEDs 200 in the selected portion, respectively. At 566, the controller 190 actuates the shaft 250 to rotate the substrate 140. At 568, the controller 190 controls the selected portion (e.g., the first zone of the first LED heater 150-1 and the second zone of the second LED heater 150-2) to heat the substrate 140 with the second and first irradiation intensities of the LEDs 200 in the selected portion, respectively.

[0157] In this manner, the controller 190 can again rotate the substrate 140 and vary the illumination intensities of the LEDs 200 in selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. By selecting different illumination intensities for selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 at different times while also periodically rotating the substrate 140, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2 is reduced.

[0158] 32 illustrates a method 580 for resistively and radiatively heating a substrate 140 including substrate rotation according to the present disclosure. At 582, the substrate 140 is heated using resistive heating provided by a resistive heater 151 disposed within the base portion 132 of the pedestal 130. At 584, the controller 190 selects first and second portions (e.g., first and second zones) of the first LED heater 150-1 to heat the substrate 140 without changing the state of the second LED heater 150-2 (i.e., leaving the second LED heater 150-2 partially or fully on or off). The controller 190 controls the selected portions (e.g., first and second zones) of the first LED heater 150-1 to heat the substrate 140 with first and second illumination intensities of the LEDs 200 within the first and second portions, respectively. At 586, the controller 190 actuates the shaft 250 to rotate the substrate 140. At 588, the controller 190 controls selected portions (e.g., first and second zones) of the first LED heater 150-1 to heat the substrate 140 with third and fourth illumination intensities of the LEDs 200 within the selected portions without changing the state of the second LED heater 150-2.

[0159] In this manner, the controller 190 can again rotate the substrate 140 and change the illumination intensity of the LEDs 200 in selected portions of the first LED heater 150-1 to heat the substrate 140 without changing the state of the second LED heater 150-2. By also periodically rotating the substrate 140 and selecting different illumination intensities of selected portions of the first LED heater 150-1 to heat the substrate 140 at different times while not changing the state of the second LED heater 150-2, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 in the first LED heater 150-1 is reduced.

[0160] 33 illustrates a method 600 for resistive and radiative heating of a substrate 140 including substrate rotation according to the present disclosure. At 602, the controller 190 selects first and second sets of resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 disposed within the base portion 132 of the pedestal 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying first and second currents to the first and second sets of resistive heating elements, respectively.

[0161] In 604, the controller 190 selects first and second portions (e.g., first and second zones) of the first and second LED heaters 150-1, 150-2, respectively, to heat the substrate 140. The controller 190 controls the selected portions (e.g., first and second zones) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 with first and second irradiation intensities of the LEDs 200 in the first and second portions, respectively. In 606, the controller 190 actuates the shaft 250 to rotate the substrate 140.

[0162] In 608, the controller 190 controls selected resistive heating elements (e.g., the first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying third and fourth currents to the first and second sets of resistive heating elements, respectively. The controller 190 controls selected portions (e.g., the first and second zones) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 with third and fourth illumination intensities of the LEDs 200 in the first and second portions, respectively.

[0163] In this manner, the controller 190 can again rotate the substrate 140, vary the current supplied to selected resistive heating elements of the resistive heater 151, and vary the illumination intensities of selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. By also periodically rotating the substrate 140 while supplying different currents to selected resistive heating elements of the resistive heater 151 at different times and selecting different illumination intensities of selected portions of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 at different times, the controller 190 minimizes cold spots on the substrate 140, improves temperature uniformity across the substrate 140, and reduces overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2.

[0164] 34 illustrates a method 620 of resistive and radiative heating of a substrate 140 including substrate rotation according to the present disclosure. In 622, the controller 190 selects first and second sets of resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 disposed within the base portion 132 of the pedestal 130 to heat the substrate 140. The controller 190 controls the selected resistive heating elements (e.g., first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying first and second currents to the first and second sets of resistive heating elements, respectively.

[0165] In 624, the controller 190 selects first and second portions (e.g., first and second zones) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140. The controller 190 controls the selected portions (e.g., first and second zones) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 with the first and second irradiation intensities of the LEDs 200 in the first and second portions, respectively. In 426, the controller 190 actuates the shaft 250 to rotate the substrate 140.

[0166] In 628, the controller 190 controls selected resistive heating elements (e.g., the first and second resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying third and fourth currents to the first and second sets of resistive heating elements, respectively. The controller 190 controls selected portions (e.g., the first and second zones) of the first and second LED heaters 150-1, 150-2 to heat the substrate 140 with third and fourth illumination intensities of the LEDs 200 in the first and second portions, respectively.

[0167] In 630, the controller 190 deselects the first set of resistive heating elements of the resistive heater 151 and the first portion of the first LED heater 150-1 and selects a third set of resistive heating elements of the resistive heater 151 and a third portion (e.g., a third zone) of the first LED heater 150-1 to heat the substrate 140. In 632, the controller 190 controls selected resistive heating elements (e.g., second and third resistive heating elements) of the resistive heater 151 to heat the substrate 140 by supplying second and third currents to the second and third sets of resistive heating elements, respectively. The controller 190 controls selected portions (e.g., second and third zones) of the second and first LED heaters 150-2, 150-1 to heat the substrate 140 with second and third illumination intensities of the LEDs 200 in the second and third portions, respectively. In step 632, the controller 190 can also vary the current supplied to the second set of resistive heating elements of the resistive heater 151, which can vary the illumination intensity of the LEDs 200 in the second portion of the second LED heater 150-2.

[0168] In this manner, the controller 190 can heat the substrate 140 by again rotating the substrate 140, selecting and deselecting different sets of resistive elements of the resistive heater 151, varying the current supplied to selected resistive heating elements of the resistive heater 151, selecting and deselecting different portions of the first and second LED heaters 150-1, 150-2, and varying the illumination intensity of selected portions of the first and second LED heaters 150-1, 150-2. By heating the substrate 140 at different times while also periodically rotating the substrate 140 by selecting different sets of resistive heating elements of the resistive heater 151 at different times, supplying different currents to the selected different sets of resistive heating elements of the resistive heater 151 at different times, selecting different portions of the first and second LED heaters 150-1, 150-2 at different times, and selecting different irradiation intensities of the selected different portions of the first and second LED heaters 150-1, 150-2, cold spots on the substrate 140 are minimized, temperature uniformity across the substrate 140 is improved, and overheating of the LEDs 200 in the first and second LED heaters 150-1, 150-2 is reduced.

[0169] The method of combining coarse heating, finely tuned heating, and substrate rotation provided by controlling the resistive heater 151, the LED heater 150, the first and second LED heaters 150-1 and 150-2, as described in detail above, also applies when the resistive heater 151 is positioned within the base 132 of the pedestal 130 and the LED heater 150 is positioned below the base 132 of the pedestal 130, as described in the above method, and when the resistive heater 151 and the first and second LED heaters 150-1 and 150-2 are positioned as shown and described above with reference to Figures 12 and 13. Furthermore, in all of the above methods, although not shown, in combination with controlling the resistive heater 151, the LED heater 150, and the first and second LED heaters 150-1 and 150-2, the controller 190 also controls the flow of coolant through the cooling channels 153, 159 to control the temperatures of the substrate 140, the showerhead 120, and the LED heater 150.

[0170] Thus, the systems and methods of the present disclosure provide various ways of combining resistive heating and radiant (LED) heating to minimize or eliminate cold spots on the substrate 140 and improve temperature uniformity across the substrate 140. The resistive heater 151 provides coarse heating, while the LED heater 150 and first and second LED heaters 150-1 and 150-2 complement the resistive heater 151 by providing finely tuned heating as described above. When the resistive heater and LED heaters 151, 150, 150-1 are co-located within the pedestal 130, as in the first and fourth examples, controlling (turning on and off and adjusting the power supplied) different portions of the resistive heater and LED heater 151, 150, 150-1 at different times (i.e., staggered), in combination with substrate rotation, prevents the radiant heaters 151, 150, 150-1 from overheating. Overheating of the LED heaters 150, 150-1 can be further reduced by separating the LED heater 150 from the resistive heater 151 and placing the LED heaters 150, 150-1 under the pedestal 130 as in the second and fifth examples, or by separating the LED heater 150 from the resistive heater 151 and placing the LED heaters 150, 150-2 inside the showerhead 120 as in the third and fourth examples. Furthermore, in the second and fourth examples, overheating of the LED heaters 150, 150-1 can be prevented by controlling different portions of the resistive heater and the LED heaters 151, 150, 150-1 in a time-shifted manner in combination with substrate rotation as in the first example. In the fourth and fifth examples, as in the first example, overheating of the LED heater 150-1 can be prevented by controlling different portions of the resistive heater 151 and the LED heaters 150-1, 150-2 in a time-shifted manner in combination with rotating the substrate.

[0171] In the first through fifth examples, in addition to preventing overheating of the LED heaters 150, 150-1, and 150-2, the staggered control of different portions of the resistive heaters and LED heaters 151, 150, 150-1, and 150-2, combined with substrate rotation, further minimizes or eliminates cold spots on the substrate 140 and improves temperature uniformity across the substrate 140. The provision of cooling channels 153, 159 in the pedestal 130 and showerhead 120 also further controls the temperatures of the pedestal 130 and showerhead 120, further preventing overheating of the LED heaters 150 and further improving temperature uniformity across the substrate 140.

[0172] The foregoing description is merely exemplary in nature and is not intended to limit the disclosure, its application, or its uses. The broad teachings of the disclosure can be embodied in a variety of forms. Accordingly, while the disclosure includes specific embodiments, the true scope of the disclosure should not be so limited, as other variations will become apparent upon review of the drawings, this specification, and the following claims.

[0173] It should be understood that one or more steps of the method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure can be implemented with and / or combined with any feature of any other embodiment, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with each other remain within the scope of the present disclosure.

[0174] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." When a relationship between first and second elements is described in the above disclosure, unless expressly described as "direct," the relationship may be a direct relationship where no other intervening elements exist between the first and second elements, or an indirect relationship where one or more intervening elements exist (both spatially and functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a non-exclusive logical "or" (A or B or C), and not to mean "at least one of A, at least one of B, and at least one of C."

[0175] In some embodiments, the controller is part of a system, which may be part of the examples described above. Such a system may include semiconductor processing equipment, including one or more processing tools, one or more chambers, one or more processing platforms, and / or specific processing components (such as a wafer pedestal, gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of semiconductor wafers or substrates. This electronics may be referred to as a "controller" and may control various components or subportions of one or more systems.

[0176] The controller may be programmed to control any of the processes disclosed herein depending on the processing requirements and / or type of system, including process gas delivery, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer loading and unloading into the tool, and wafer loading and unloading into other transfer tools and / or load locks connected or interfaced with the particular system.

[0177] Broadly, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receives instructions, issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software).

[0178] Program instructions may be instructions communicated to the controller in the form of various personalizations (or program files) that define operational parameters for performing a particular process on or for a semiconductor wafer or for a system. In some embodiments, the operational parameters may be part of a recipe defined by a process engineer to accomplish one or more processing steps during fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0179] In some embodiments, the controller may be part of a computer integrated with, coupled to, or otherwise networked to the system, or may be coupled to such a computer, or a combination thereof. For example, the controller may be in the "cloud" or may be all or part of a fab host computer system, thereby enabling remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a fabrication operation, analyze the history of past fabrication operations, analyze trends or performance metrics from multiple fabrication operations, and modify parameters of a current process, set up processing steps following the current process, or initiate a new process.

[0180] In some examples, a remote computer (e.g., a server) can provide the process recipe to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that allows for entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each of the processing steps performed during one or more operations. It should be understood that the parameters can be specific to the type of process being performed and the type of tool the controller is configured to interface with or control.

[0181] Thus, as noted above, the controller may be distributed, such as by including one or more individual controllers networked together and working toward a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would include one or more integrated circuits on the chamber that are in communication with one or more integrated circuits located remotely (e.g., at the platform level or as part of a remote computer) and that are coupled to control the process on the chamber.

[0182] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a metal plating chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system related to or that may be used in the fabrication and / or manufacturing of semiconductor wafers.

[0183] As noted above, depending on the process step or steps being performed by the tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to and from tool locations and / or load ports within the semiconductor fabrication factory to transport containers of wafers.

Claims

1. 1. A substrate processing system, comprising: a pedestal configured to support a substrate; a resistive heater disposed within the pedestal and configured to heat the substrate; a radiant heater disposed within the pedestal and configured to heat the substrate; A substrate processing system comprising:

2. 10. The substrate processing system of claim 1, the resistive heater includes one or more resistive heating elements; The substrate processing system, wherein the radiant heater includes a plurality of optical elements.

3. 3. The substrate processing system according to claim 2, The substrate processing system, wherein the optical element comprises a light emitting diode.

4. 10. The substrate processing system of claim 1, the pedestal includes a base portion and a stem portion; The resistive heater and the radiative heater are disposed within the base portion of the pedestal.

5. 5. The substrate processing system according to claim 4, the base portion is cylindrical; The resistive heater and the radiative heater extend from a central region of the base toward an outer diameter of the base.

6. 5. The substrate processing system according to claim 4, the radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the radiative heater.

7. 5. The substrate processing system according to claim 4, The substrate processing system, wherein the resistive heater and the radiative heater are coplanar.

8. 5. The substrate processing system according to claim 4, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in a first concentric circle within the base; the radiant heater includes a plurality of optical elements arranged in a second concentric circle within the base; The first and second concentric circles are alternately arranged with one another and extend from a central region of the base toward an outer diameter of the base.

9. 9. The substrate processing system according to claim 8, the radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the radiative heater.

10. 9. The substrate processing system according to claim 8, The substrate processing system, wherein the resistive heater and the radiative heater are coplanar.

11. 5. The substrate processing system according to claim 4, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged concentrically within the base; the radiant heater includes a plurality of optical elements arranged in radially extending spokes within the base; The concentric circles and the radially extending spokes extend from a central region of the base toward an outer diameter of the base.

12. 12. The substrate processing system of claim 11, the radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the radiative heater.

13. 5. The substrate processing system according to claim 4, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in spokes extending in a first radial direction within the base; the radiant heater includes a plurality of optical elements arranged in spokes extending in a second radial direction within the base; The first and second radially extending spokes are interleaved with one another and extend from a central region of the base toward an outer diameter of the base.

14. 14. The substrate processing system of claim 13, the radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the radiative heater.

15. 15. The substrate processing system of claim 14, The substrate processing system, wherein the resistive heater and the radiative heater are coplanar.

16. 5. The substrate processing system according to claim 4, The substrate processing system further includes a cooling channel disposed within the base below the resistive heater and the radiative heater.

17. 5. The substrate processing system according to claim 4, the resistive heater includes a plurality of resistive heating elements; the radiant heater includes a plurality of optical elements; The substrate processing system further includes a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-shifted manner.

18. 18. The substrate processing system of claim 17, a shaft disposed through the stem portion and the base portion; an actuator coupled to the shaft; further comprising The controller is configured to move the substrate relative to the pedestal.

19. 5. The substrate processing system according to claim 4, The radiant heater is a plurality of optical elements disposed on a printed circuit board (PCB); one or more drivers disposed on the PCB and configured to control the optical elements; an optically transparent window covering the optical element and hermetically attached to the PCB; A substrate processing system comprising:

20. 20. The substrate processing system of claim 19, The base is a shaft disposed through the stem portion, the base portion, and a center of the PCB, the shaft including a conduit configured to receive a gas and a plurality of holes in fluid communication with the conduit near a first end of the shaft proximate the radiant heater; an actuator coupled to a second end of the shaft, the actuator configured to move the substrate perpendicular to a plane in which the base extends; further comprising The plurality of holes supply the gas radially above the window when the shaft rises above the window.

21. 10. The substrate processing system of claim 1, the pedestal includes a base portion and a stem portion; the resistive heater is disposed within the base of the pedestal; The substrate processing system, wherein the radiant heater is positioned below the base and around the stem adjacent the base.

22. 22. The substrate processing system of claim 21, the base portion is cylindrical; The resistive heater and the radiative heater extend from a central region of the base toward an outer diameter of the base.

23. 22. The substrate processing system of claim 21, The radiant heater is a plurality of optical elements disposed on a printed circuit board (PCB); one or more drivers disposed on the PCB and configured to control the optical elements; a plurality of lenses disposed on the optical element; an optically transparent window covering the optical element and the lens, the window being hermetically attached to the PCB; A substrate processing system comprising:

24. 22. The substrate processing system of claim 21, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in a first concentric circle within the base; the radiant heater includes a plurality of optical elements arranged in a second concentric circle within the base; The first and second concentric circles are alternately arranged with one another and extend from a central region of the base toward an outer diameter of the base.

25. 22. The substrate processing system of claim 21, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged concentrically within the base; the radiant heater includes a plurality of optical elements arranged in radially extending spokes within the base; The concentric circles and the radially extending spokes extend from a central region of the base toward an outer diameter of the base.

26. 22. The substrate processing system of claim 21, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in spokes extending in a first radial direction within the base; the radiant heater includes a plurality of optical elements arranged in spokes extending in a second radial direction within the base; The first and second radially extending spokes are interleaved with one another and extend from a central region of the base toward an outer diameter of the base.

27. 22. The substrate processing system of claim 21, The substrate processing system further includes a cooling channel disposed within the base below the resistive heater.

28. 22. The substrate processing system of claim 21, the resistive heater includes a plurality of resistive heating elements; the radiant heater includes a plurality of optical elements; The substrate processing system further includes a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-shifted manner.

29. 29. The substrate processing system of claim 28, a shaft disposed through the stem portion and the base portion; an actuator coupled to the shaft; further comprising The controller is configured to move the substrate relative to the pedestal.

30. 1. A substrate processing system, comprising: a showerhead including a faceplate having a plurality of through holes; a radiant heater disposed within the showerhead, the radiant heater including a plurality of optical elements spaced apart from the plurality of through-holes of the faceplate; and A substrate processing system comprising:

31. 31. The substrate processing system of claim 30, The substrate processing system, wherein the optical element comprises a light emitting diode.

32. 31. The substrate processing system of claim 30, the showerhead is cylindrical; The substrate processing system, wherein the radiant heater extends from a center of the showerhead toward an outer diameter of the showerhead.

33. 31. The substrate processing system of claim 30, The radiant heater is a printed circuit board (PCB) on which the optical element is disposed; one or more drivers disposed on the PCB and configured to control the optical elements; an optically transparent window covering the optical element, hermetically attached to the PCB, and flush with the faceplate; A substrate processing system comprising:

34. 34. The substrate processing system of claim 33, the showerhead includes a plenum defined by a sidewall and a top surface of the showerhead and a face of the radiant heater opposite the window; The through-hole extends through the radiant heater and is in fluid communication with the plenum.

35. 31. The substrate processing system of claim 30, the showerhead is cylindrical; The substrate processing system, wherein the optical elements are concentrically arranged within the radiant heater.

36. 31. The substrate processing system of claim 30, the showerhead is cylindrical; A substrate processing system wherein the optical elements are arranged in radially extending spokes within the radiant heater.

37. 31. The substrate processing system of claim 30, further comprising a pedestal configured to support the substrate; The substrate processing system, wherein the pedestal includes a resistive heater configured to heat the substrate.

38. 38. The substrate processing system of claim 37, the base is cylindrical; The resistive heater extends from a central region of the pedestal toward an outer diameter of the pedestal.

39. 38. The substrate processing system of claim 37, the base is cylindrical; The resistive heater includes resistive heating elements arranged concentrically within the pedestal.

40. 38. The substrate processing system of claim 37, the base is cylindrical; The resistive heater includes resistive heating elements arranged in radially extending spokes within the pedestal.

41. 38. The substrate processing system of claim 37, the pedestal and the showerhead are cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in a first concentric circle within the pedestal, the first concentric circle extending from a central region of the pedestal toward an outer diameter of the pedestal; The optical elements are arranged in a second concentric circle within the radiant heater, the second concentric circle extending from a central region of the showerhead toward an outer diameter of the showerhead.

42. 42. The substrate processing system of claim 41, The first and second concentric circles are arranged alternately with each other.

43. 38. The substrate processing system of claim 37, the pedestal and the showerhead are cylindrical; the resistive heater includes a plurality of resistive heating elements arranged concentrically within the pedestal, the concentric circles extending from a central region of the pedestal toward an outer diameter of the pedestal; The optical elements are arranged in radially extending spokes within the radiant heater, the radially extending spokes extending from a center of the showerhead toward an outer diameter of the showerhead.

44. 38. The substrate processing system of claim 37, the pedestal and the showerhead are cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in spokes extending in a first radial direction within the pedestal, the spokes extending in the first radial direction from a central region of the pedestal toward an outer diameter of the pedestal; the optical elements are arranged in second radially extending spokes within the radiant heater, the second radially extending spokes extending from a center of the showerhead toward an outer diameter of the showerhead.

45. 45. The substrate processing system of claim 44, The first and second radially extending spokes are interleaved with one another.

46. 38. The substrate processing system of claim 37, the showerhead includes a first cooling channel disposed in an upper surface of the showerhead; The pedestal includes a second cooling channel disposed below the resistive heater.

47. 38. The substrate processing system of claim 37, the resistive heater includes a plurality of resistive heating elements; The substrate processing system further includes a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-shifted manner.

48. 48. The substrate processing system of claim 47, a shaft disposed through the center of the base; an actuator coupled to the shaft; further comprising The controller is configured to move the substrate relative to the pedestal.

49. 1. A substrate processing system, comprising: a pedestal configured to support a substrate; a resistive heater disposed within the pedestal and configured to heat the substrate; a first radiant heater disposed within the pedestal and configured to heat the substrate; a showerhead spaced apart from the base; a second radiant heater disposed within the showerhead and configured to heat the substrate; and A substrate processing system comprising:

50. 50. The substrate processing system of claim 49, the resistive heater includes one or more resistive heating elements; The substrate processing system, wherein the first and second radiant heaters include a plurality of optical elements.

51. 51. The substrate processing system of claim 50, The substrate processing system, wherein the optical element comprises a light emitting diode.

52. 50. The substrate processing system of claim 49, the pedestal includes a base portion and a stem portion; The resistive heater and the first radiant heater are disposed within the base portion of the pedestal.

53. 53. The substrate processing system of claim 52, the base portion is cylindrical; The resistive heater and the first radiant heater extend from a central region of the base toward an outer diameter of the base.

54. 53. The substrate processing system of claim 52, the first radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the first radiant heater.

55. 53. The substrate processing system of claim 52, The resistive heater and the first radiant heater are coplanar.

56. 53. The substrate processing system of claim 52, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in a first concentric circle within the base; the first radiant heater includes a second plurality of concentrically arranged optical elements within the base; The first and second concentric circles are alternately arranged with one another and extend from a central region of the base toward an outer diameter of the base.

57. 57. The substrate processing system of claim 56, the first radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the first radiant heater.

58. 57. The substrate processing system of claim 56, The resistive heater and the first radiant heater are coplanar.

59. 53. The substrate processing system of claim 52, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged concentrically within the base; the first radiant heater includes a plurality of optical elements arranged in radially extending spokes within the base; The concentric circles and the radially extending spokes extend from a central region of the base toward an outer diameter of the base.

60. 60. The substrate processing system of claim 59, the first radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the first radiant heater.

61. 53. The substrate processing system of claim 52, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in spokes extending in a first radial direction within the base; the first radiant heater includes a plurality of optical elements arranged in spokes extending in a second radial direction within the base; The first and second radially extending spokes are interleaved with one another and extend from a central region of the base toward an outer diameter of the base.

62. 62. The substrate processing system of claim 61 , the first radiant heater is positioned proximate a surface of the base on which the substrate is disposed; The resistive heater is disposed within the base below the first radiant heater.

63. 63. The substrate processing system of claim 62, The resistive heater and the first radiant heater are coplanar.

64. 53. The substrate processing system of claim 52, The substrate processing system further includes a cooling channel disposed within the base below the resistive heater and the first radiant heater.

65. 53. The substrate processing system of claim 52, the resistive heater includes a plurality of resistive heating elements; the first radiant heater includes a plurality of optical elements; The substrate processing system further includes a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-shifted manner.

66. 66. The substrate processing system of claim 65, a shaft disposed through the stem portion and the base portion; an actuator coupled to the shaft; further comprising The controller is configured to move the substrate relative to the pedestal.

67. 53. The substrate processing system of claim 52, The first radiant heater comprises: a plurality of optical elements disposed on a printed circuit board (PCB); one or more drivers disposed on the PCB and configured to control the optical elements; an optically transparent window covering the optical element and hermetically attached to the PCB; A substrate processing system comprising:

68. 68. The substrate processing system of claim 67, The base is a shaft disposed through the stem portion, the base portion, and a center of the PCB, the shaft including a conduit configured to receive a gas and a plurality of holes in fluid communication with the conduit near a first end of the shaft proximate the first radiant heater; an actuator coupled to a second end of the shaft, the actuator configured to move the substrate perpendicular to a plane in which the base extends; further comprising The plurality of holes supply the gas radially above the window when the shaft rises above the window.

69. 50. The substrate processing system of claim 49, the pedestal includes a base portion and a stem portion; the resistive heater is disposed within the base of the pedestal; The substrate processing system, wherein the first radiant heater is positioned below the base and around the stem adjacent the base.

70. 70. The substrate processing system of claim 69, the base portion is cylindrical; The resistive heater and the first radiant heater extend from a central region of the base toward an outer diameter of the base.

71. 70. The substrate processing system of claim 69, The first radiant heater comprises: a plurality of optical elements disposed on a printed circuit board (PCB); one or more drivers disposed on the PCB and configured to control the optical elements; a plurality of lenses disposed on the optical element; an optically transparent window covering the optical element and the lens, the window being hermetically attached to the PCB; A substrate processing system comprising:

72. 70. The substrate processing system of claim 69, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in a first concentric circle within the base; the first radiant heater includes a second plurality of concentrically arranged optical elements within the base; The first and second concentric circles are alternately arranged with one another and extend from a central region of the base toward an outer diameter of the base.

73. 70. The substrate processing system of claim 69, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged concentrically within the base; the first radiant heater includes a plurality of optical elements arranged in radially extending spokes within the base; The concentric circles and the radially extending spokes extend from a central region of the base toward an outer diameter of the base.

74. 70. The substrate processing system of claim 69, the base portion of the pedestal is cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in spokes extending in a first radial direction within the base; the first radiant heater includes a plurality of optical elements arranged in spokes extending in a second radial direction within the base; The first and second radially extending spokes are interleaved with one another and extend from a central region of the base toward an outer diameter of the base.

75. 70. The substrate processing system of claim 69, The substrate processing system further includes a cooling channel disposed within the base below the resistive heater.

76. 70. The substrate processing system of claim 69, the resistive heater includes a plurality of resistive heating elements; the first radiant heater includes a plurality of optical elements; The substrate processing system further includes a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-shifted manner.

77. 77. The substrate processing system of claim 76, a shaft disposed through the stem portion and the base portion; an actuator coupled to the shaft; further comprising The controller is configured to move the substrate relative to the pedestal.

78. 50. The substrate processing system of claim 49, the showerhead includes a faceplate having a plurality of through holes; The second radiant heater includes a plurality of optical elements spaced apart from the plurality of through holes in the faceplate.

79. 79. The substrate processing system of claim 78, The substrate processing system, wherein the optical element comprises a light emitting diode.

80. 79. The substrate processing system of claim 78, the showerhead is cylindrical; The second radiant heater extends from a center of the showerhead toward an outer diameter of the showerhead.

81. 79. The substrate processing system of claim 78, The second radiant heater comprises: a printed circuit board (PCB) on which the optical element is disposed; one or more drivers disposed on the PCB and configured to control the optical elements; an optically transparent window covering the optical element, hermetically attached to the PCB, and flush with the faceplate; A substrate processing system comprising:

82. 82. The substrate processing system of claim 81, the showerhead includes a plenum defined by a sidewall and a top surface of the showerhead and a face of the second radiant heater opposite the window; The through-hole extends through the second radiant heater and is in fluid communication with the plenum.

83. 79. The substrate processing system of claim 78, the showerhead is cylindrical; The substrate processing system, wherein the optical element is concentrically disposed within the second radiant heater.

84. 79. The substrate processing system of claim 78, the showerhead is cylindrical; The substrate processing system, wherein the optical elements are arranged in radially extending spokes within the second radiant heater.

85. 79. The substrate processing system of claim 78, the base is cylindrical; The resistive heater extends from a central region of the pedestal toward an outer diameter of the pedestal.

86. 79. The substrate processing system of claim 78, the base is cylindrical; The resistive heater includes resistive heating elements arranged concentrically within the pedestal.

87. 79. The substrate processing system of claim 78, the base is cylindrical; The resistive heater includes resistive heating elements arranged in radially extending spokes within the pedestal.

88. 79. The substrate processing system of claim 78, the pedestal and the showerhead are cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in a first concentric circle within the pedestal, the first concentric circle extending from a central region of the pedestal toward an outer diameter of the pedestal; the optical elements are arranged in a second concentric circle within the second radiant heater, the second concentric circle extending from a center of the showerhead toward an outer diameter of the showerhead.

89. 89. The substrate processing system of claim 88, The first and second concentric circles are arranged alternately with each other.

90. 79. The substrate processing system of claim 78, the pedestal and the showerhead are cylindrical; the resistive heater includes a plurality of resistive heating elements arranged concentrically within the pedestal, the concentric circles extending from a central region of the pedestal toward an outer diameter of the pedestal; the optical elements are arranged in radially extending spokes within the second radiant heater, the radially extending spokes extending from a center of the showerhead toward an outer diameter of the showerhead.

91. 79. The substrate processing system of claim 78, the pedestal and the showerhead are cylindrical; the resistive heater includes a plurality of resistive heating elements arranged in spokes extending in a first radial direction within the pedestal, the spokes extending in the first radial direction from a central region of the pedestal toward an outer diameter of the pedestal; the optical elements are arranged in second radially extending spokes within the second radiant heater, the second radially extending spokes extending from a center of the showerhead toward an outer diameter of the showerhead.

92. 92. The substrate processing system of claim 91, The first and second radially extending spokes are interleaved with one another.

93. 79. The substrate processing system of claim 78, the showerhead includes a first cooling channel disposed in an upper surface of the showerhead; The pedestal includes a second cooling channel disposed below the resistive heater.

94. 79. The substrate processing system of claim 78, the resistive heater includes a plurality of resistive heating elements; The substrate processing system further includes a controller configured to control different ones of the resistive heating elements and different ones of the optical elements in a time-shifted manner.

95. 50. The substrate processing system of claim 49, the pedestal and the showerhead are cylindrical; The first and second radiant heaters have diameters smaller than outer diameters of the pedestal and the showerhead.

96. 79. The substrate processing system of claim 78, the resistive heater includes a plurality of resistive heating elements; the first radiant heater includes an additional optical element; the substrate processing system further comprising a controller configured to control different ones of the resistive heating elements, different ones of the optical elements of the second radiant heater, and different ones of the additional optical elements of the first radiant heater in a time-staggered manner.

97. 95. The substrate processing system of claim 94, a shaft disposed through the center of the base; an actuator coupled to the shaft; further comprising The controller is configured to move the substrate relative to the pedestal.

Images