Apparatus and method for heat adjustability in a processing chamber

Abstract

[0003] Embodiments herein are generally directed to electronic device manufacturing, and more particularly, to systems and methods for lamp heating in thermal processing chambers. In one embodiment, an adjustable reflector assembly includes a plurality of elements including at least one fixed element and at least one rotating element, wherein a first surface of each of the plurality of elements is a reflective surface, and at least one actuation mechanism configured to actuate the at least one rotating element relative to the fixed element. A method for processing a substrate includes measuring a heat intensity of a thermal profile of an area of ​​the substrate beneath the lamp and reflector assembly, determining whether the heat intensity deviates from desired parameters, and adjusting a reflector profile of the reflector assembly in response to the heat intensity deviating from the desired parameters.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present disclosure relate generally to systems and methods for use in thermal processing chambers, such as semiconductor processing chambers. In particular, embodiments include apparatus and methods for lamp heating in thermal processing chambers. [Background technology]

[0002]

[0002] Processing chambers such as epitaxial deposition (EPI) chambers and rapid thermal processing (RTP) chambers are employed in semiconductor chip manufacturing to create or chemically alter semiconductor substrates. Such processing chambers typically rely on arrays of high-intensity incandescent lamps mounted in lampheads that shine light toward the substrate. These lamps are powered by electricity and can be switched on and off very rapidly, allowing a significant percentage of their radiation to be directed toward the substrate. As a result, the substrate can be heated very quickly without substantially heating the chamber, and can cool almost as quickly when power to the lamps is removed. However, control of substrate heating in current thermal processing chambers is limited to adjusting the power to the lamps in the kilowatt range.

[0003]

[0003] Therefore, there is a need for improved thermal processing chambers in semiconductor processing. Summary of the Invention

[0004]

[0004] Embodiments of the present disclosure relate generally to systems and methods for use in processing chambers, such as semiconductor processing chambers. More specifically, embodiments include apparatus and methods for lamp heating in thermal processing chambers.

[0005] In one embodiment, an adjustable reflector is provided. The adjustable reflector includes a plurality of reflector elements. Each of the plurality of elements has a first surface, a second surface, and a plurality of sidewalls. The first surface is a reflective surface and is configured to face the lamp. The adjustable reflector includes one or more actuation mechanisms coupled to the plurality of elements.

[0006]

[0006] In another embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body having a lid, a floor, and a processing space between the lid and the floor. The substrate processing chamber also has an upper window between the lid and the processing space and a lower window between the floor and the processing space. A substrate support is disposed within the processing space, and a lamp head is disposed either below the lower window or above the upper window, with at least one lamp disposed within the lamp head. Furthermore, a reflector assembly is disposed on one side of the at least one lamp. The reflector assembly includes a plurality of elements and one or more actuation mechanisms coupled to the plurality of elements, and a first surface of each of the plurality of elements is a reflective surface.

[0007] In yet another embodiment, a method for thermally processing a substrate is provided that includes measuring a heat intensity of a thermal profile of an area of ​​the substrate under or over a lamp and a reflector assembly having multiple elements, determining whether the heat intensity deviates from desired parameters, and adjusting a reflector profile of the reflector assembly along a centerline path using an actuation mechanism coupled to the reflector assembly in response to the heat intensity deviating from the desired parameters.

[0008] In one embodiment, an adjustable reflector assembly is provided that includes a plurality of elements including at least one fixed element and at least one rotating element, wherein a first surface of each of the plurality of elements is a reflective surface, and at least one actuation mechanism configured to actuate the at least one rotating element relative to the fixed element.

[0009]

[0009] In another embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body including a lid, a floor, and a processing space between the lid and the floor. An upper window is disposed between the lid and the processing space, and a lower window is disposed between the floor and the processing space. A lamp head is positioned either below the lower window or above the upper window, and a substrate support assembly is disposed within the processing space. At least one lamp is disposed within the lamp head, and a reflector assembly is disposed on one side of the at least one lamp. The reflector assembly includes a plurality of elements, at least one of which is a fixed element and at least one of which is a rotating element.

[0010] In yet another embodiment, a method for processing a substrate is provided that includes measuring a heat intensity of a thermal profile of an area of ​​the substrate beneath a lamp and a reflector assembly having a fixed element and a plurality of rotating elements, where first surfaces of the fixed element and the plurality of rotating elements form the reflector profile, determining whether the heat intensity deviates from desired parameters, and adjusting the reflector profile of the reflector assembly using an actuation mechanism coupled to the reflector assembly in response to the heat intensity deviating from the desired parameters.

[0011] In one embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body including a lid, a floor, and a processing space disposed between the lid and the floor. An upper window is disposed between the lid and the processing space, and a lower window is disposed between the floor and the processing space. A lamphead is disposed either between the upper window and the lid or between the lower window and the floor, and a substrate support assembly is disposed within the processing space. At least one lamp is disposed within the lamphead, and a lens is disposed between the lamphead and the processing space.

[0012] In another embodiment, a substrate processing chamber is provided. The substrate processing chamber includes a chamber body including a lid, a floor, and a processing space between the lid and the floor. An upper window is disposed between the lid and the processing space, a lower window is disposed between the floor and the processing space, and a substrate support assembly is disposed within the processing space. A lamp head is disposed between the lower window and the floor or between the upper window and the lid. A plurality of lamps are disposed within the lamp head, wherein the plurality of lamps includes at least one first lamp operating at a first wavelength and at least one second lamp operating at a second wavelength different from the first wavelength.

[0013] In yet another embodiment, a method of heating a substrate is provided that includes measuring a heat intensity of a thermal profile of a region of the substrate on the substrate support near a lamp and a lens between the lamp and the substrate support, determining whether the heat intensity deviates from desired parameters, and adjusting a focal length of the lens assembly using an actuation mechanism coupled to the lens assembly in response to the heat intensity deviating from the desired parameters.

[0014]

[0014] In order that the features of the present disclosure described above may be understood in detail, a more particular description of the present disclosure briefly summarized above will be obtained by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary embodiments and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a schematic cross-sectional side view of a processing apparatus according to one embodiment. [Figure 2A]

[0016] 1 shows a schematic axonometric view of a reflector assembly according to one embodiment. [Figure 2B]

[0017] 2B shows a schematic front view of the reflector assembly shown in FIG. 2A, according to certain embodiments. [Figure 2C] 2B shows a schematic front view of the reflector assembly shown in FIG. 2A, according to certain embodiments. [Figure 2D] 2B shows a schematic front view of the reflector assembly shown in FIG. 2A, according to certain embodiments. [Figure 3A]

[0018] 1 shows a schematic axonometric view of a reflector assembly according to an embodiment; [Figure 3B]

[0019] 3B shows a schematic front view of the reflector assembly shown in FIG. 3A, according to an embodiment. [Figure 3C]

[0020] 3B shows a schematic side view of the reflector assembly shown in FIG. 3A, according to an embodiment. [Figure 4]

[0021] 1 shows a schematic front view of a reflector assembly according to an embodiment. [Figure 5A]

[0022] 1 shows a schematic front view of a reflector assembly according to an embodiment. [Figure 5B]

[0023] 5B illustrates a top view of the reflector assembly shown in FIG. 5A, according to an embodiment. [Figure 5C]

[0024] 5B shows a schematic front view of the reflector assembly shown in FIG. 5A, according to an embodiment. [Figure 6]

[0025] 1A to 1D show schematic front views of a reflector assembly according to an embodiment. [Figure 7A]

[0026] 1 shows an axonometric view of a lamphead according to an embodiment. [Figure 7B]

[0027] 1 illustrates a front view of a reflector assembly according to an embodiment. [Figure 8A]

[0028] 1 shows a schematic cross-sectional view of a processing chamber according to an embodiment. [Figure 8B]

[0029] 9B illustrates an axonometric view of an edge reflector assembly of the processing chamber shown in FIG. 9A, according to an embodiment. [Figure 8C]

[0030] 1 shows a simplified schematic cross-sectional view of a processing chamber, according to an embodiment. [Figure 9A]

[0031] 1 shows a schematic cross-sectional view of a processing chamber according to an embodiment. [Figure 9B]

[0032] 9B shows a schematic cross-sectional view of the lens assembly of FIG. 9A, according to an embodiment. [Figure 9C]

[0033] 9B shows a schematic cross-sectional view of the lens assembly of FIG. 9A, according to an embodiment. [Figure 9D]

[0034] 9B shows a schematic cross-sectional view of the lens assembly of FIG. 9A, according to an embodiment. [Figure 9E]

[0035] 9B shows a schematic cross-sectional view of the lens assembly of FIG. 9A, according to an embodiment. [Figure 9F] 9B shows a schematic cross-sectional view of the lens assembly of FIG. 9A, according to an embodiment. [Figure 10A]

[0036] 1 shows a simplified cross-sectional view of a processing chamber, according to an embodiment. [Figure 10B] 1 shows a simplified cross-sectional view of a processing chamber according to an embodiment. [Figure 10C]

[0037] 1 illustrates a method for closed-loop operation of a reflector assembly according to one embodiment. [Figure 10D]

[0038] 1 illustrates a method for open-loop operation of a reflector assembly according to one embodiment. [Figure 11A]

[0039] 1 shows a top view of a lamphead assembly according to an embodiment. [Figure 11B]

[0040] 1 shows a top view of a lamphead assembly according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0016]

[0041] For ease of understanding, where possible, like reference numerals have been used to designate like elements common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0017]

[0042] SUMMARY OF THE INVENTION Embodiments herein are directed generally to processing chambers, and more particularly to systems and methods for controlling or regulating radiant heat from lamps in a thermal processing chamber directed at a substrate.

[0018]

[0043] The present disclosure provides a thermal processing chamber for epitaxial processes for controlling radiation from lamps in a lamphead. In one embodiment, a reflector assembly is used to control the focal length of radiation reflected from the lamphead toward a substrate in the thermal processing chamber. In another embodiment, a lens is used to control the focal length of radiation directed from the lamphead toward the substrate. Furthermore, the lamps in the lamphead operate at different peak wavelengths to control the radiation emitted toward the substrate.

[0019]

[0044] 1 is a schematic cross-sectional side view of a processing chamber 100 according to one embodiment. The processing chamber 100 is a processing chamber for performing a thermal process, such as an epitaxial deposition process. The processing chamber 100 includes a chamber lid 104, a chamber body 102, a chamber floor 106, a cover 134, a processing space 112, an array of radiant heat lamps 108, 110 for heating, and a susceptor 114 disposed within the processing chamber 100. The arrays of radiant heat lamps 108, 110 are disposed above and below the susceptor 114, although either the upper array of radiant heat lamps 108 or the lower array of radiant heat lamps 110 may be omitted.

[0020]

[0045] The array of radiant heat lamps 108, 110 can be independently controlled in zones to control the temperature of various regions of the substrate 118 as process gas passes therethrough, thus facilitating deposition of material on the upper surface of the substrate 118. The upper lamps 108 and lower lamps 110 can include bulbs configured to heat the substrate 118 to temperatures ranging from approximately 200 degrees Celsius to approximately 1600 degrees Celsius. Each of the upper lamps 108 and lower lamps 110 is coupled to a power distribution board (not shown), which supplies power to each of the upper lamps 108 and lower lamps 110. The upper lamps 108 and lower lamps 110 are positioned within a lamp head 145, which can be cooled during or after processing, for example, by a cooling fluid introduced into channels (not shown) located between the upper lamps 108 and / or lower lamps 110. The lamp head 116, in part due to its proximity to the lower window 130, thermally conductively and radiatively cools the lower window 130. The lamp head 116 may also cool the walls of the lamp and the walls of the reflector 140 around the lamp. Alternatively, the lower window 130 may be cooled by convection.

[0021]

[0046] The susceptor 114 is a disk-shaped substrate support as shown, but may alternatively include a ring-shaped substrate support that supports the substrate 118 from its edge and exposes the backside of the substrate 118 to heat from the lower radiant heat lamps 110. The susceptor 114 is formed from silicon carbide or silicon carbide-coated graphite and absorbs radiant energy from the radiant heat lamps 108, 110 and conducts the radiant energy to the substrate 118, facilitating heating of the substrate 118.

[0022]

[0047] The susceptor 114 is positioned within the processing chamber 100 between an upper window 120 and a lower window 130. The upper window 120 and the lower window 130 are each dome-shaped. However, it is contemplated that the upper window 120 and the lower window 130 may have other shapes, including planar. A base ring 170 is disposed between the upper window 120 and the lower window 130. The upper window 120 and the lower window 130 are each optically transparent to the radiant energy provided by the arrays of radiant heat lamps 108, 110. The upper window 120 is disposed between the chamber lid 104 and the susceptor 114. The upper radiant heat lamp 108 is disposed above the first window 120. One or more reflectors 140 facilitate directing thermal energy from the upper radiant heat lamps 108 toward the top surface of the substrate 118. Similarly, the lower radiant heat lamps 110 may also include one or more reflectors 140 disposed below the second window 130 and positioned to direct heat energy from the lower radiant heat lamps 110 to the underside of the substrate 118.

[0023]

[0048] The susceptor 114 includes a shaft or stem 114a coupled to a motion assembly 190. The motion assembly 190 includes one or more actuators or adjustment devices that effect movement, adjustment, or rotation of the stem 114a or the susceptor 114. The susceptor 114 may rotate between about 5 RPM and about 100 RPM (e.g., between about 10 RPM and about 50 RPM). A process gas inlet 162, a purge gas inlet 164, and a gas outlet 166 are provided in the base ring 170 to facilitate exposure of the substrate 118 to process gases during processing. A process gas source 152 supplies process gas to the process gas inlet 162, and a purge gas source 154 supplies purge gas to the purge gas inlet 164. The process gas and purge gas flow through the gas outlet 166 to an exhaust assembly (not shown).

[0024]

[0049] The reflector 140 may be mounted on the outside of the upper window 120, the lower window 130, or both to reflect light emitted from the substrate 118 back onto the substrate 118. The reflector 140 may be secured above the upper window 120 using one or more clamp rings 142. Another reflector 140 may be secured below the lower window 130 using one or more additional clamp rings 142. The reflector 140 may be made of a metal such as aluminum, brass, or stainless steel. The reflective efficiency may be improved by applying a highly reflective coating such as gold to the reflector area. Alternatively, mirror polishing may be used to improve the reflectivity of the reflector. The reflector 140 may have one or more channels 144 connected to a cooling source (not shown). The channels 144 are connected to passages (not shown) formed in the side of the reflector 140 to cool the reflector 140. The passages are configured to carry a flow of cooling fluid, such as deionized water or a forced flow of air, and may extend horizontally along the sides of the reflector 140 in any desired pattern covering part or the entire surface of the reflector 140.

[0025]

[0050] The present disclosure contemplates that other lamps may be used in addition to or in place of the various lamps described herein. For example, resistive heaters, light emitting diodes (LEDs), or lasers such as solid-state vertical cavity surface emitting lasers (VCSELs) may be used with the various lamps described herein.

[0026]

[0051] The upper and lower windows 120, 130 may be transparent to infrared radiation, such as by transmitting at least 95% of infrared radiation. The upper and lower windows 120, 130 may be a quartz material (e.g., clear quartz). Alternatively, the upper and lower windows may be sapphire.

[0027]

[0052] A circular shield 146 is disposed around the susceptor 114 and is coupled to a base ring 170 or liner 172 to prevent or minimize heat leakage from the radiant heat lamps 108, 110. The substrate temperature may be measured indirectly by a sensor configured to measure the temperature at the bottom of the susceptor 114. The sensor may be a pyrometer disposed in a port formed in the lamphead 116. Additionally, one or more temperature sensors 174, such as a pyrometer, are configured to measure the temperature of the device side of the substrate 118. The one or more temperature sensors 174 are disposed through the chamber lid 104 and configured to sense the substrate 118.

[0028]

[0053] The processing chamber 100 described above is controlled by a processor-based system controller, such as a controller 180, which may be coupled to a user interface 188. For example, the controller 180 is configured to control the pressure, temperature, and flow rates within the processing chamber 100. As a further example, the controller 180 is configured to operate upper and lower lamps and reflector actuators (described further below). The controller 180 includes a programmable central processing unit (CPU) 182 operable with memory 184, support circuits 186, such as power supplies, clocks, cache, input / output (I / O) circuits, and mass storage devices, input control units, and display units (not shown), which are coupled to various components of the processing chamber 100 to facilitate control of substrate processing. The controller 180 also includes hardware for monitoring substrate processing through sensors within the processing chamber 100, including sensors that monitor the flow of precursors, process gases, and purge gases. Other sensors measuring system parameters, such as substrate temperature and chamber pressure, may also provide information to the controller 180.

[0029]

[0054] 2A shows a schematic axonometric view of a reflector assembly 200, such as reflector 140, positioned above a lamp 220, such as one or more of the upper lamps 108. It should be noted that the reflector assembly 200 can also be positioned below a lamp 220, such as one or more of the lower lamps 110. As shown, the reflector assembly 200 includes a reflector 210 including multiple reflector elements 212. The reflector elements 212 have a first surface 214a facing the lamp 220, a second surface 214b or top surface opposite the first surface 214a, and a sidewall 216 having a sidewall surface 216a. The reflector elements may include highly polished or mirror-polished metals such as aluminum or brass, or metals, polymers, or ceramics with a highly reflective coating 218 on the first surface 214a. The reflective coating 218, such as a gold or silver coating, may reflect radiation from the lamp 220. Other surfaces may include a reflective coating 218, such as the sidewall surface 216a that is exposed to radiation from the lamp 220 when the elements 212 are activated. The total reflective surface consists of all surfaces of the reflector 210 that have the reflective coating 218, including the first surface 214a and the sidewall surface 216a of each of the elements 212.

[0030]

[0055] 2B, 2C, and 2D are schematic front views of the reflector assembly 200 shown in FIG. 2A. As shown in FIG. 2B, the plurality of elements 212 can be actuated to create a concave reflective surface by positioning the center point of each of the plurality of elements 212 along a concave centerline path 230a. When the center point of each of the plurality of elements 212 is aligned with the concave centerline path 230a, the first surface 214a of each element is exposed to the lamp 220. Furthermore, a portion of the inner sidewall 216b of each of the plurality of elements 212 (i.e., the sidewall 216 facing the lamp 220) is exposed to the lamp 220. These exposed portions of the inner sidewall 216b, together with each first surface 214a, create a reflector having a concave reflective surface.

[0031]

[0056] 2C , each of the plurality of elements 212 can be positioned within an asymmetrically angled reflector by aligning the center point of each of the plurality of elements 212 along the asymmetrically angled centerline path 230b. When the center of each of the plurality of elements 212 is aligned along the asymmetrically angled centerline path 230b, different portions of each of the inner sidewalls 216b are exposed to the lamp 220. These portions of the inner sidewalls 216b, along with the first surface 214a of each of the plurality of elements 212, form an asymmetrically angled reflector according to desired specifications.

[0032]

[0057] 2D , each of the plurality of elements 212 can be positioned within a convex reflector by aligning the center point of each of the plurality of elements 212 along the convex centerline path 230c. When the center of each of the plurality of elements 212 is aligned along the convex centerline path 230c, different portions of the inner sidewall 216b of each of the plurality of elements 212 are exposed. These portions of the inner sidewall 216b, together with the first surface 214 of each of the plurality of elements 212, form a convex reflector.

[0033]

[0058] Although specific centerline paths are described in FIGS. 2B-3D, any desired centerline path can be used and tailored to a particular recipe according to the desired specifications (e.g., flat reflector, angled reflector).

[0034]

[0059] By aligning the reflector assembly along a desired centerline path, the reflector can be adjusted per recipe or in a closed loop control system, and the power intensity or irradiance pattern heating the substrate can be adjusted as needed, allowing a means to redefine zones on the substrate, redistribute the irradiance of each zone, or a combination thereof.

[0035]

[0060] FIG. 3A shows a schematic axonometric view of the reflector assembly 300. FIG. 3B shows a schematic front view of the reflector assembly 300, and FIG. 3C shows a schematic side view of the reflector assembly 300. Similar to the reflector assembly 200 of FIG. 2A, the reflector assembly 400 includes a reflector 310 having multiple reflector elements 312. The reflector elements 312 are stacked one on top of the other, and each reflector element 312 has a first surface 314a, a second surface 314b opposite the first surface 314a, and multiple sidewalls 316. The first surface 314a is configured to face a lamp 320, such as the upper lamp 108 or the lower lamp 110. The first surface 314a has a reflective coating 318, such as a gold coating, that reflects radiation from the lamp 320. Each sidewall 316 of the multiple reflective elements 312 includes an inner sidewall 316b facing the lamp 320. The inner sidewall 316 b of each of the plurality of elements 312 also has a reflective coating 318 .

[0036]

[0061] 3A-3C, the reflector assembly 310 also includes an actuator assembly 340 configured to actuate each of the plurality of reflective elements 312 along a motion path 350 perpendicular or normal to the emission surface of the lamp 320. The actuator assembly 340 may include a plurality of actuators 342, such as pneumatic actuators, attached to each of the plurality of elements 312 through connectors 344. As shown in FIG. 3B, an actuator (e.g., actuators 342a-442e) may be connected to a pair of elements (e.g., a pair of elements 312a-412e) of the plurality of elements 312 and configured to cooperatively actuate the pair of elements 312a-312e. Upon actuation, each pair of elements 312a-312e slides relative to the adjacent element (e.g., element 312d slides relative to element 312a). The actuator assembly 340 can then position the multiple elements 312 along a centerline path as described in FIGS. 2B-2D (eg, 230a, 230b, 230c, or other desired centerline path).

[0037]

[0062] The reflector assembly 300 allows the reflector to reflect the radiation of the lamps 320 (e.g., the upper lamps 108 or the lower lamps 110) toward a target at a desired focus. The target may be a portion of a substrate (e.g., the substrate 118) in a processing chamber (e.g., the processing chamber 100). By actuating each element of the reflector assembly 310, the focus of the radiation from the lamps 320 may be adjusted as desired, such as before or during processing. The tunability of the disclosed subject matter enables additional thermal tunability for multiple process recipes.

[0038]

[0063] As shown in FIGS. 3A and 3C , the reflector assembly 300 may also include cooling channels 360 extending through each element. The cooling channels 360 include at least one aperture 362 extending through the sidewall 316 of each element. Each of the apertures 362 may be aligned during operation of the elements 312 to form a continuous channel through the reflector assembly 310. The at least one aperture 362 may have any desired cross-sectional shape, such as rectangular, circular, triangular, or a combination thereof. In one embodiment, the at least one aperture 362 may have an oval cross-sectional shape. The cooling channels 360 may be configured to allow a desired cooling fluid, such as water, refrigerant, or air, to flow through the reflector assembly 310. The cooling channels 360 enable the reflector assembly 310 to maintain a desired operating temperature during operation, even if the reflective coating 318 erodes with repeated use.

[0039]

[0064] 4 shows a schematic front view of a reflector assembly 400. The reflector assembly 400 includes multiple reflector elements 412. Each of the reflector elements 412 has a first surface 414 facing a lamp 420, such as the upper lamp 108 or the lower lamp 110, and one or more sidewalls that do not face the lamp 420. The first surface 414 may have a reflective coating 418 configured to reflect radiation from the lamp 420. The reflective coating 418 may include a gold or silver coating. Alternatively, the reflector elements 412 may include a mirror-polished metal, such as aluminum or an aluminum alloy, with an optically transparent coating that prevents surface oxidation.

[0040]

[0065] At least one of the plurality of elements 412 is a fixed element 430 coupled to the remaining plurality of elements 412 (e.g., a rotating element 432). The fixed element 430 may have a plurality of actuators 440 rotatably coupled between the fixed element 430 and two rotating elements 432. The plurality of actuators 440 may be any suitable actuators 440, such as a rotary motor, such as a servo motor or a pneumatic motor. An outer surface 442 of each of the plurality of actuators 440 may be coated with a reflective coating 418 similar to the reflective coating 418 on the first surface 414 of the plurality of elements 412. The first surface 414 of the plurality of elements 412 and the outer surfaces 442 of the plurality of actuators 440 form a reflector surface.

[0041]

[0066] The reflector surface can be adjusted by actuating the rotating element 432 relative to the fixed element 430 using multiple actuators 440. The reflector surface can then reflect the radiation of the lamp 420 at a focal point toward a target, such as a portion of a substrate (e.g., substrate 118). The focal point of the reflector surface can be adjusted as desired, such as before or during processing, by actuating the rotating element 432. The tunability of the disclosed subject matter reduces the overall cost and complexity of processing multiple types of substrates or recipes in a given processing chamber.

[0042]

[0067] Optionally, the plurality of elements 412 may include at least one aperture extending through each of the plurality of elements to form a cooling channel (not shown) similar to cooling channel 360 .

[0043]

[0068] FIG. 5A shows a schematic front view of a reflector assembly according to an embodiment. FIG. 5B shows a top view of the reflector assembly shown in FIG. 5A according to an embodiment. FIG. 5C shows a schematic front view of the reflector assembly shown in FIG. 5A according to an embodiment. As shown in FIGS. 5A-5C, the reflector assembly 500 can be configured with multiple actuators embedded within multiple elements 512. As shown in FIGS. 5A and 5B, the inner edges 532a of the rotating elements 532 can overlap and be axially coupled along multiple parallel axes 534 disposed along opposing edges 530a of the fixed element 530. Each of the multiple elements 512 has a reflective coating 518 on a first surface 514 facing a lamp 520, such as the upper lamp 108 or the lower lamp 110. The multiple elements 512 can be actuated to form a substantially flat and stepped reflector surface. 5C, the rotation element 532 can be actuated to rotate along multiple parallel axes 534 as desired, such as before or during processing. Actuating the rotation element 532 can then adjust the focus of the reflected radiation of the lamp 520 toward a target, such as a substrate 118 within the processing chamber 100.

[0044]

[0069] 6A-6D illustrate a reflector assembly 600. As shown in FIG. 6A, the reflector assembly 600 includes a reflector 610, such as an angled reflector, with a reflective surface for reflecting radiation from a lamp 620 (e.g., the upper lamp 108 or the lower lamp 110) toward a target (e.g., the substrate 118) at a focal length and focal point. The reflector assembly 600 also includes an actuator 640 coupled to the apex of the angled reflector 610 configured to effect rotational displacement of the angled reflector 610 along movement paths 630a, 630b around the lamp 620. Alternatively, the reflector 610 may be a convex or planar reflector, and the actuator 640 may be coupled to a center point of the reflector. The actuator 640 may be a pneumatic actuator 640, a motor, or a combination thereof. As shown in FIGS. 6B and 6C, actuator 640 can rotate angled reflector 610 along a motion path 630a, changing the focus of lamp 620 radiation.

[0045]

[0070] Additionally, the actuator 640 may move the reflector 610 along a linear motion path 630b to increase or decrease the linear displacement (e.g., linear distance) of the reflector 610 around the lamp 620, as shown in Figure 6D. The lamp 620 may be fixed or may include a separate actuator 640 that cooperates with the actuator 640 to linearly actuate the lamp 620 and linearly displace the reflector 610 from the lamp 620.

[0046]

[0071] 7A shows a lamphead assembly 700 that can be configured for use in the processing chamber 100 in either the upper lamp 108 position or the lower lamp 110 position. The lamphead assembly 700 includes a lamphead body 710 and a plurality of lamps 720 disposed therein. The lamps are arranged in a pattern around the exterior of the lamphead body 710 and can be any desired lamps, such as polygonal lamps, linear lamps, or small horizontal or vertical lamps.

[0047]

[0072] As shown in FIG. 7B, the reflector assembly 730 can be arranged similarly to the reflector assembly 600 described in FIGS. 6A-6B. The system of reflector assemblies 730 can face a subset of the lamps 722 of the plurality of lamps 720, such that the entirety of the plurality of lamps 720 faces the system of reflector assemblies 730. Each of the reflector assemblies 730 includes a rotating element 742 coupled to a fixed element 740 by multiple actuators 750 and can be actuated independently of or simultaneously with the other reflector assemblies 730. The system of reflector assemblies 730 reflects radiation from each of the subset of lamps 722 toward a substrate (e.g., substrate 118) at a focal length and focus. The system of reflectors can be actuated to adjust the focal length and focus of each of the subset of lamps 722 as desired, such as before or during processing.

[0048]

[0073] Figure 8A shows a schematic cross-sectional view of a processing chamber 800. Processing chamber 800 is similar to processing chamber 100 shown in Figure 1, and therefore, for purposes of clarity, similar features are designated with the same reference numerals.

[0049]

[0074] As shown, an upper reflector 840 may optionally be mounted outside the upper window 120 to reflect light emitted from the substrate 118 back to the substrate 118. An edge reflector 854 may be mounted outside the upper window 820 and above the outermost upper lamp 108. Although not shown, an edge reflector 854 could also be configured around the outermost lower lamp 110.

[0050]

[0075] 8B illustrates an edge reflector 854 of the processing chamber 800 shown in FIG. 8A. The edge reflector 854 may be configured similarly to the reflector assembly of FIG. 3A. The edge reflector 854 may include a plurality of elements 862 with a first surface 864 having a reflective coating 868 that forms a reflector with a reflector profile 872 facing the upper lamps 108. The plurality of elements 862 may be actuated by at least one actuator 870 to adjust the reflector profile 872 as desired, such as before or during processing.

[0051]

[0076] FIG. 8C shows a schematic cross-sectional view of a portion of the processing chamber 800 including the edge reflector 854 of FIGS. 8A and 8B. The reflector profile 872 of the edge reflector 854 reflects radiation from the upper lamps 108 toward a portion of the substrate 118 on the susceptor 114. The reflected radiation forms a thermal profile 880 having a heat intensity across a portion of the substrate 818. In particular, the thermal profile 880 is concentrated at the outer edge of the substrate 818. While a top reflector 804 with upper lamps (e.g., centrally located upper lamps 108) can provide a thermal profile 880 across the central region of the substrate 118, the edge of the substrate 118 is often difficult to thermally treat in a satisfactory manner. An edge reflector 854 with upper lamps 108 along the periphery enables controlled, focused thermal treatment of the edge of the substrate 118.

[0052]

[0077] 9A shows a schematic diagram of a processing chamber 900. The processing chamber 900 is similar to the processing chamber 100 shown in FIG. 1, and therefore, for purposes of clarity, similar features are designated with the same reference numerals. The processing chamber 900 also includes one or more lower lamps 110 below a lower window 130 disposed below the substrate 118. At least one lens assembly 960 may be mounted between one or more of the upper lamps 108 and the upper window 120. Additionally, at least one lens assembly 960 may be mounted between the substrate 118 and any of the lamps in the processing chamber 900, such as the lower lamps 110 or the upper lamps 108.

[0053]

[0078] 9B shows a schematic cross-sectional view of the lens assembly 960 of FIG. 9A, according to an embodiment. As shown in FIG. 9B, the lens assembly 960a can include at least one convex lens 962a disposed between a lamp (e.g., the lower lamp 108) and the substrate 118. The lamp (e.g., the upper lamp 110) emits radiation at a focal length toward the at least one convex lens 962a to form a focal point on the substrate 118. The lens assembly 960a redirects radiation 964 from the lamp (e.g., the upper lamp 108) and focuses the radiation 964 at the focal point to generate a desired thermal profile on the substrate 118.

[0054]

[0079] FIG. 9C shows a schematic cross-sectional view of the lens assembly 960 of FIG. 9A according to another embodiment. As shown in FIG. 9C, the lens assembly 960b can include at least one Fresnel lens 962b with multiple sections. Here, radiation 964 from a lamp (e.g., the upper lamp 108) is directed to a focal point through the Fresnel lens 962b. The Fresnel lens 962b can capture more of the oblique radiation 964 from the lamp (e.g., the upper lamp 108) and provide a larger focal length range than a simple convex lens. The Fresnel lens 962b requires less material to manufacture and provides a thinner lens profile. Alternatively, the lens assembly 960B can also include a Luneburg lens instead of a Fresnel lens. A Luneburg lens includes a lens having a circular cross-sectional area with a refractive index that decreases radially from the center point to the outer surface.

[0055]

[0080] 9D shows a schematic cross-sectional view of the lens assembly 960 of FIG. 9A according to another embodiment. As shown in FIG. 9D, the lens assembly 960c may alternatively include an accommodating lens 962c including a lens 966 coupled to an actuator 968. The actuator 968 may be a linear actuator (such as a pneumatic actuator), a rotary actuator 968, or a combination thereof. The accommodating lens 962c may be actuated to shorten or lengthen the distance between a lamp (e.g., the upper lamp 108) and the lens 966, thereby adjusting the focus on the substrate 118.

[0056]

[0081] 9E-10F show schematic cross-sectional views of the lens assembly 960 of FIG. 9A according to yet another embodiment. As shown in FIGS. 9E-10F, the lens assembly 960d can include a fluid-filled lens 962d. The fluid-filled lens 962d includes a fluid-filled cavity 970 partially surrounded by a deformable polymer membrane 972. Adjusting the volume of fluid in the cavity 970 deforms the membrane 972, changing the curvature of the lens 962d. The cavity 970 can be deformed mechanically or electrically, for example, by actuators 974 on two opposite sides of the cavity 970 or by application of an electric current.

[0057]

[0082] As shown in Figure 9E, when actuator 974 compresses polymer membrane 972, the fluid within fluid-filled cavity 970 compresses axially in response to the compression applied by actuator 974. Simultaneously, the fluid within fluid-filled cavity 970 expands along actuation path 976, which is perpendicular to the compression axis of actuator 974. In Figure 9F, actuator 974 depressurizes fluid-filled cavity 970, resulting in a contraction of fluid-filled cavity 970 along actuation path 976.

[0058]

[0083] 10A-10B show simplified cross-sectional views of a processing chamber, according to an embodiment. As shown in FIGS. 10A and 10B, a substrate heating system 1000 can include a reflector assembly 140 (e.g., any of reflector assemblies 300, 400, 500, 600, 700, or 850) and a system of pyrometers 1002 that monitor a thermal profile 1010 of an area of ​​interest on a substrate 118 below (or above) an upper lamp 108 (or lower lamp 110). The reflector assembly 140 has a reflector profile 1042 and is configured to reflect lamp 108 radiation at a focal length and focus. The system of pyrometers 1002 can be adjusted to measure different areas of interest on the substrate 118 as desired by rotating or displacing the pyrometers 1002 along a path 1004. The pyrometer 1002 system emits a beam 1006 to measure the heat intensity 1012 of a thermal profile 1010 of a region of interest. Upon receiving input, either through user input or through feedback instructions from a controller (e.g., controller 160), as described in Figures 10C and 10D regarding a desired thermal parameter, the reflector assembly 140 can be actuated to change the reflector profile 1042, thereby changing the focus of the radiation of the lamp 108. For example, the reflector profile 1042 can be widened to widen the thermal profile 1010 of the region of interest on the substrate 118.

[0059]

[0084] 10C illustrates a method 1050A for closed-loop operation of the reflector assembly 140, further illustrated in FIGS. 10C and 10D. The method 1050A begins in block 1052 by measuring a thermal profile 1010 of a region of interest of the substrate 118 using a system of pyrometers 1002. The system of pyrometers 1002 may include multiple pyrometers 1002 measuring different portions of the substrate 118. One or more of the pyrometers 1002 may be slaved to a master pyrometer that monitors a primary region of interest. The system of pyrometers 1002 monitors the thermal profile 1010 of the substrate 118.

[0060]

[0085] The pyrometer 1002 system may be coupled to a controller (e.g., controller 160) and a reflector assembly 140 (e.g., reflector assembly 300, reflector assembly 400, reflector assembly 500, reflector assembly 600, reflector assembly 700, or reflector assembly 850) or a lens assembly (e.g., lens assemblies 1060a-1060d). In block 1054, based on input from the pyrometer 1002 system, the controller determines whether the heat intensity 1012 of the thermal profile 1010 is outside of desired parameters (e.g., too low or too high). In block 1056, the reflector profile 1042 is adjusted. A controller coupled to the pyrometer 1002 system and the reflector assembly 1040 may operate the reflector assembly 1040 to adjust the reflector profile 1042. In a lens assembly (e.g., lens assemblies 1060a-1060d), the controller can actuate the lens, such as linearly displacing a convex or Fresnel lens or changing the volume of the cavity of a fluid-filled lens, to adjust the focal length and focus of the lens relative to a predetermined focal length.

[0061]

[0086] At block 1058, the pyrometer 1002 system may then continue to monitor the thermal profile 1010 of the region of interest of the substrate 118. If the heat intensity 1012 again falls outside the desired parameters, as determined at block 1060, the controller may then return to block 1056 and readjust the reflector profile 1042 by actuating the reflector assembly 140 as necessary.

[0062]

[0087] 10D illustrates a method 1050B for open-loop operation of the reflector assembly 140. Similar to method 1050A, method 1050B may begin at block 1062 by measuring different portions of the substrate 118 using the pyrometer 1002 system. The pyrometer 1002 may provide real-time measurements to a user interface (e.g., user interface 188) coupled to a controller (e.g., controller 180). The controller (e.g., controller 180) may receive input to operate the reflector assembly 140 to match a predetermined reflector profile 1042 stored in memory (e.g., memory 184). The predetermined reflector profile 1042 may be based on a recipe for the thermal process or a type of substrate and may be one of a plurality of predetermined reflector profiles 1042. Here, the position of each of the plurality of elements is actuated to a desired position to achieve a desired focal length and orientation. Optionally, the pyrometer 1002 system may provide a measurement of the heat intensity 1012 in the region of interest of the substrate 118. The user interface may then receive input to adjust the reflector assembly 140 to a different predetermined reflector profile 1042. Alternatively, the user interface may receive input to adjust the reflector profile 1042 to parameters that differ from the predetermined reflector profile 1042.

[0063]

[0088] 11A shows a top view of a lamp head 1100A having multiple lamps 1110 (e.g., either the upper lamps 108 or the lower lamps 110 of FIG. 1) disposed therein. The multiple lamps 1110 include at least two lamps (e.g., at least one infrared (IR) lamp and at least one ultraviolet (UV) lamp) operating in two different frequency bands. The at least one IR lamp 1112 may operate in the IR wavelength band, i.e., at wavelengths between about 750 nm and about 1300 nm. The at least one UV lamp 1114 may operate in the UV wavelength range, i.e., at wavelengths between about 100 nm and about 400 nm.

[0064]

[0089] The at least one UV lamp 1114 can also be a different shape, such as a circular UV lamp 1114 on the periphery of the lamp head 1100A. The at least one IR lamp 1112 can be an array of IR lamps 1112 arranged within the circular UV lamp 1114. Using lamps operating at different frequencies can pre-activate gaseous precursors used in epitaxy deposition, such as silicon-containing compositions such as silane (SiH). Pre-activation allows the silicon-containing composition to react and form deposits with less thermal energy. Additionally, using UV lamps improves the efficiency of pre-cleaning during the bake-out process.

[0065]

[0090] FIG. 11B shows a top view of a lamp head 1100B with a plurality of lamps 1120 (e.g., either the upper lamps 108 or the lower lamps 110 of FIG. 1) formed from a plurality of IR lamps 1122 and a plurality of UV lamps 1124. The plurality of IR lamps 1122 can be an IR lamp array 1154 interspersed among the UV lamp array 1134. As shown in FIG. 11B, the IR lamp array 1112 can be located between the UV lamp array 1134. The IR lamp array 1154 can include any desired number of elements (e.g., three elements) interspersed among any number of elements (e.g., one element) of the UV lamp array 1134. The IR lamp array 1154 and the UV lamp array 1134 can form a repeating pattern across the emitting surface 1140 of the lamp head 1100B.

[0066]

[0091] When introducing elements of the present disclosure or exemplary aspects or embodiments thereof, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the element.

[0067]

[0092] The terms "comprising," "including," and "having" are intended to be inclusive and mean that additional elements may be present.

[0068]

[0093] The term "coupled" is used herein to refer to a direct or indirect coupling between two objects. For example, if object A physically contacts object B, and object B contacts object C, objects A and C are considered to be coupled to each other, even though they are not in direct physical contact with each other. For example, a first object can be coupled to a second object even though the first object is not in direct physical contact with the second object.

[0069]

[0094] While the foregoing is directed to embodiments of the present disclosure, other and additional embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. 1. An adjustable reflector assembly, comprising: a plurality of elements including at least one fixed element and at least one rotating element, wherein a first surface of each of the plurality of elements is a reflective surface; at least one actuation mechanism configured to actuate the at least one rotating element relative to the at least one fixed element; 1. An adjustable reflector assembly comprising:

2. 10. The adjustable reflector assembly of claim 1, wherein the adjustable reflector assembly is an edge reflector assembly configured to reflect heat to an outer edge of a substrate.

3. 10. The adjustable reflector assembly of claim 1, wherein an exterior surface of the at least one actuation mechanism is exposed and further comprises a reflective coating, and the first surface of each of the plurality of elements comprises the reflective coating.

4. The adjustable reflector assembly of claim 1 , wherein the at least one actuation mechanism is embedded in the plurality of elements.

5. 10. The adjustable reflector assembly of claim 1, wherein the plurality of elements further comprises at least one aperture extending through each of the plurality of elements to form a cooling channel through the adjustable reflector assembly.

6. 10. The adjustable reflector assembly of claim 1, wherein the at least one rotational element is configured for linear or rotational displacement about the circumference of a lamp, including a polygonal lamp.

7. 10. The adjustable reflector assembly of claim 1, wherein the at least one rotating element comprises two rotating elements rotatably coupled to the at least one fixed element along parallel axes on opposite edges of the at least one fixed element.

8. 1. A substrate processing chamber comprising: a chamber body including a lid, a floor, and a processing space disposed between the lid and the floor; an upper window disposed between the lid and the processing space; a lower window disposed between the floor and the processing space; a substrate support assembly disposed within the processing space; a lamp head located either below the lower window or above the upper window; at least one lamp disposed within the lamphead; a reflector assembly disposed on one side of the at least one lamp, the reflector assembly including a plurality of elements, at least one of the plurality of elements being a fixed element and at least one of the plurality of elements being a rotating element; and 1. A substrate processing chamber comprising:

9. The substrate processing chamber of claim 8 , wherein the plurality of elements further comprises a plurality of rotating elements coupled to the stationary element, each of the plurality of elements including a reflective coating on a surface thereof.

10. The substrate processing chamber of claim 9 , wherein the plurality of rotating elements are configured to be actuated relative to the fixed element by an actuation mechanism.

11. The substrate processing chamber of claim 10 , wherein the actuation mechanism is a rotary motor.

12. The substrate processing chamber of claim 10 , wherein an exterior surface of the actuation mechanism is exposed and further comprises the reflective coating.

13. The substrate processing chamber of claim 10 , wherein the actuation mechanism is embedded in the plurality of elements.

14. The substrate processing chamber of claim 8 , wherein the plurality of elements further comprises at least one aperture extending through each of the plurality of elements.

15. 15. The substrate processing chamber of claim 14, wherein the at least one aperture in each of the plurality of elements forms a cooling channel through the reflector assembly.

16. 1. A method of processing a substrate, comprising: using a pyrometer system to measure the heat intensity of a thermal profile of an area of ​​the substrate beneath the lamp and a reflector assembly having a fixed element and a plurality of rotating elements, wherein a first surface of the fixed element and the plurality of rotating elements form a reflector profile; determining whether the heat intensity is outside of desired parameters; adjusting the reflector profile of the reflector assembly using an actuation mechanism coupled to the reflector assembly in response to the heat intensity being outside of desired parameters; A method comprising:

17. measuring the heat intensity in response to adjusting the reflector profile and determining whether the heat intensity is within desired parameters.

17. The method of claim 16, further comprising:

18. The method of claim 16 , wherein adjusting the reflector profile includes receiving input from a user interface.

19. 17. The method of claim 16, wherein adjusting the reflector profile comprises receiving instructions from a controller coupled to the actuation mechanism and a system of the pyrometer to adjust to a predetermined reflector profile.

20. receiving input from a user interface; in response to receiving the input, adjusting the reflector profile based on the input; and 17. The method of claim 16, further comprising:

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