Electroplating Equipment

Abstract

The electroplating apparatus of the present invention provides a solid anode, mesh anode, or perforated anode as an inert anode in the anode region, maintaining a certain distance from the substrate to form a stable electric field on the substrate surface and improve electroplating uniformity. The provision of an active anode below the inert anode in the anode region continuously replenishes metal ions during the electroplating process, allowing the metal ions to be more effectively transferred to the substrate and improving electroplating uniformity. The provision of a rectifying plate, fluid dispersion pipe, agitator, or other components in the anode region to uniformly distribute the anolyte further improves electroplating uniformity.

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor manufacturing devices, and more particularly to electroplating equipment. [Background technology]

[0002] Semiconductor electroplating refers to the electroplating of metal ions in an electroplating solution onto a substrate (e.g., wafer) surface to form metal interconnects in a chip manufacturing process.

[0003] The metal block acts as an anode, replenishing metal ions consumed by the electroplating solution. During the electroplating process, the surface of the metal block continues to wear away, increasing the distance between the metal block and the cathode, the substrate. Furthermore, the flat surface of the metal block becomes uneven as the process progresses, changing the distance between different points on the metal block surface and the substrate. This affects the metal deposition rate on the substrate surface and causes unevenness in the electroplating film thickness distribution on the substrate surface.

[0004] Therefore, improvements in electroplating equipment are needed to improve the uniformity of substrate electroplating. Summary of the Invention

[0005] SUMMARY OF THE INVENTION The present invention aims to provide an electroplating apparatus that solves the problem of uneven electroplating of substrates in the prior art.

[0006] To achieve the above and other related objects, the present invention provides an electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a solid anode, which is an inert anode disposed below the substrate and facing parallel to the substrate; an active anode disposed below the solid anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; at least one internal fluid passage disposed within a wall of the anode region for directing the anolyte flow from the anolyte inlet to the anolyte outlet.

[0007] To achieve the above and other related objects, the present invention further provides an electroplating apparatus, the electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a mesh anode, which is an inert anode, disposed below the substrate and facing parallel to the substrate; an active anode disposed below the mesh anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; and at least one anolyte outlet for draining the anolyte from the anode region.

[0008] To achieve the above and other related objects, the present invention further provides an electroplating apparatus, the electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode disposed below the substrate and facing parallel to the substrate; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; The through-hole anode has a through-hole formed therein and a first surface, the first surface being parallel to the substrate, and the first surfaces of the through-hole anodes in each anode region together form an electric field generating surface, the dimensions of which are equal to the dimensions of the effective electroplating surface of the substrate.

[0009] To achieve the above and other related objects, the present invention further provides an electroplating apparatus, the electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode having a through-hole formed therein and disposed below the substrate and facing the substrate in parallel; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; At least one anode region has a straightening vane disposed therein, the straightening vane being disposed between the anolyte inlet of the anode region in which it is located and the active anode.

[0010] To achieve the above and other related objects, the present invention further provides an electroplating apparatus, the electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode having a through-hole formed therein and disposed below the substrate and facing the substrate in parallel; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; a stirring section disposed within at least one anode region; The stirring unit is a magnetic stirrer located between the active anode in the anode region and the anolyte inlet; a magnetic field generator located outside the anode region in which the magnetic stirrer is located so as to drive rotation of the magnetic stirrer.

[0011] To achieve the above and other related objects, the present invention further provides an electroplating apparatus, the electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode having a through-hole formed therein and disposed below the substrate and facing the substrate in parallel; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; A fluid dispersion pipe and an anolyte inlet pipe are disposed in at least one anode region, and the fluid dispersion pipe is disposed above the through-hole anode of the anode region in which it is located and communicates with the anolyte inlet of the anode region in which it is located via the anolyte inlet pipe, thereby uniformly dispersing the anolyte.

[0012] As described above, the present invention provides an electroplating apparatus having the following effects.

[0013] 1) A solid anode, mesh anode, or through-hole anode is provided as an inert anode in the anode region, and a certain distance is maintained between the anode and the substrate, thereby forming a stable electric field on the substrate surface and improving the uniformity of electroplating.

[0014] 2) By providing an active anode below the inactive anode in the anode region, metal ions can be continuously replenished during the electroplating process, allowing the metal ions to be more fully transferred to the substrate and improving the uniformity of electroplating.

[0015] 3) The uniformity of electroplating can be further improved by providing a member such as a flow rectifier, a fluid dispersion pipe, or an agitator in the anode region so as to uniformly distribute the anolyte. [Brief explanation of the drawings]

[0016] The features and performance of the present invention are further illustrated by the following embodiments and drawings. FIG. 1 is a schematic diagram of an electroplating apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic diagram of another electroplating apparatus according to the first embodiment of the present invention. FIG. 3 is a schematic plan view of the anode chamber in the first embodiment of the present invention. FIG. 4 is a schematic diagram of an electroplating apparatus according to a second embodiment of the present invention. FIG. 5 is a schematic diagram of an electroplating apparatus according to a third embodiment of the present invention. FIG. 6 is a schematic diagram of another electroplating apparatus according to the third embodiment of the present invention. FIG. 7 is a schematic diagram of an electroplating apparatus according to a fourth embodiment of the present invention. FIG. 8 is a schematic plan view of an anode chamber according to a fourth embodiment of the present invention. FIG. 9 is a schematic diagram of an electroplating apparatus according to a fifth embodiment of the present invention. FIG. 10 is a schematic diagram of an electroplating apparatus according to a sixth embodiment of the present invention. FIG. 11 is a schematic diagram of another electroplating apparatus according to the sixth embodiment of the present invention. FIG. 12a shows a schematic plan view of a fluid dispersion pipe according to a sixth embodiment of the present invention. FIG. 12b is a schematic plan view of a modified fluid dispersion pipe according to the sixth embodiment of the present invention. FIG. 13 is a schematic diagram of an electroplating apparatus according to the seventh embodiment of the present invention. FIG. 14 is a schematic diagram of another electroplating apparatus according to the seventh embodiment of the present invention. FIG. 15 is a schematic diagram of an electroplating apparatus according to the eighth embodiment of the present invention. FIG. 16 is a schematic diagram of another electroplating apparatus according to the eighth embodiment of the present invention. FIG. 17 is a schematic plan view of an anode chamber according to the eighth embodiment of the present invention. FIG. 18 is a schematic diagram of an electroplating apparatus according to a ninth embodiment of the present invention. FIG. 19 is a schematic diagram of an electroplating apparatus according to a tenth embodiment of the present invention. FIG. 20 is a schematic diagram of an electroplating apparatus according to an eleventh embodiment of the present invention. FIG. 21 is a schematic diagram of another electroplating apparatus according to the eleventh embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to specific examples. However, those skilled in the art will easily understand other advantages and effects of the present invention from the contents disclosed in the present specification. The present invention can be implemented or applied in accordance with further different specific embodiments. The description in the present specification can be modified or changed in various ways based on different perspectives and applications without departing from the spirit of the present invention.

[0018] It should be noted that the illustrations provided in this embodiment are for a schematic explanation of the basic concept of the present invention, and only parts relevant to the present invention are shown in the drawings. Therefore, the drawings are not based on the number, shape, and dimensions of parts in an actual implementation, and the shape, quantity, and ratio of each part in an actual implementation can be changed arbitrarily, and the arrangement of each part can also be more complicated. Furthermore, parts indicated by the same drawing symbols in multiple drawings represent the same or equivalent parts or parts.

[0019] Embodiment 1 As shown in FIG. 1, this embodiment provides an electroplating apparatus including a clamp 100 and an electroplating chamber 200. The clamp 100 is for holding a substrate w. The clamp 100 can rotate, tilt, and raise and lower the substrate w. The clamp 100 is provided with a seal member 101 that separates the surface of the substrate w into a first region w1 and a second region w2. The first region w1 is enclosed by the seal member 101 and is not in contact with the electroplating solution. On the other hand, the second region w2 is exposed outside the clamp 100 and is in contact with the electroplating solution. Here, the second region w2 is the effective electroplating surface of the substrate w, and metal ions are deposited on the second region w2 during electroplating.

[0020] The electroplating chamber 200 includes an anode chamber 201, a cathode chamber 202 provided above the anode chamber 201, an ionic membrane 203 separating the anode chamber 201 from the cathode chamber 202, an outer chamber 204 surrounding the exterior of the anode chamber 201 and the cathode chamber 202, and a protective cover 205 provided above the outer chamber 204. The anode chamber 201 is used to store an anolyte, and the cathode chamber 202 is used to store a catholyte; the anolyte and the catholyte are collectively referred to as an electroplating solution.

[0021] The cathode chamber 202 includes a cathode liquid inlet 221, a cathode liquid supply pipe 222, and a diffuser plate 223. As indicated by solid arrows in Fig. 1 , the cathode liquid enters the cathode liquid supply pipe 222 from the cathode liquid inlet 221, is supplied from the cathode liquid supply pipe 222 to the cathode chamber 202, passes through the diffuser plate 223, overflows upward into the outer cavity 204, and is finally discharged from a cathode liquid outlet 241 opened at the bottom of the outer cavity 204. The diffuser plate 223 is disposed above the cathode liquid supply pipe 222 and is used to uniformly distribute the cathode liquid within the cathode chamber 202. The cathode liquid outlet 241 may be in communication with the cathode liquid inlet 221 via an external circulation pipe (not shown) to allow the cathode liquid to circulate.

[0022] The anode chamber 201 includes at least one independent anode region 212, each of which includes a solid anode 213, an active anode 214, and an anolyte supply. In this embodiment, although not limiting the present invention, a partition wall 211 is provided inside the anode chamber 201, dividing the anode chamber 201 into two independent anode regions 212, which are arranged concentrically. In each anode region 212, an active anode 214 is disposed below the solid anode 213. During the electroplating process, the active anode 214 is constantly consumed to replenish metal ions. The active anode 214 may be a metal block or particle, such as a copper block or particle.

[0023] The solid anode 213 is an inert anode and is made of an inert material, such as titanium metal (Ti). The surface of the solid anode 213 may also be coated with gold (Au) or platinum (Pt). During the electroplating process, the solid anode 213 can supply a stable potential, is not consumed, and maintains a constant distance from the substrate w. Therefore, the electric field generated by the solid anode 213 on the substrate w does not change over the course of electroplating, which can improve the uniformity of the electroplating to a certain extent.

[0024] The solid anode 213 is flat and divides the anode region 212 in which it is located into an upper space and a lower space that are independent of each other, and the anolyte in the lower space flows upward into the upper space only via an internal fluid passage 217, which will be described later. This reduces the influence of the electric field generated in the solid anode 213 on the flow of the anolyte. To prevent the anolyte in the lower space from flowing upward into the upper space via the side wall of the solid anode 213, the solid anode 213 is in tight contact with the wall surface (e.g., side wall surface) of the anode region 212 in which it is located, and for example, an O-ring 2130 is provided between the side wall of the solid anode 213 and the side wall of the anode region 212 in which it is located.

[0025] The solid anode 213 is positioned below the substrate w and is arranged parallel to and facing the substrate w. The solid anode 213 has a first surface 2131, which is a flat, enclosed plane and arranged facing the effective electroplating surface of the substrate w. The first surfaces 2131 of the solid anodes 213 in each anode region 212 together form an electric field generation surface. The dimension B of this electric field generation surface is equal to the dimension A of the effective electroplating surface of the substrate w (i.e., the second region w2) so that the solid anode 213 forms a uniform electric field across the effective electroplating surface of the substrate w. Here, "equal" allows for a certain degree of error, i.e., it may include the case of being approximately equal.

[0026] The electroplating apparatus also includes an electroplating power supply 300 for controlling the current (or voltage) at the substrate w. The negative pole of the electroplating power supply 300 is connected to the clamp 100 via a wire 301 to supply power to the substrate w within the clamp 100. Each anode region 212 is further provided with a conductive post 218. The conductive post 218 may be made of titanium metal (Ti). The electroplating power supply 300 is connected to the conductive post 218 via a wire 302, and the conductive post 218 is electrically connected to the solid anode 213 and the active anode 214. The electroplating power supply 300 supplies power to the solid anode 213 and the active anode 214 via the conductive post 218.

[0027] 1, the active anode 214 may be a metal block that is flipped over and directly mounted below the solid anode 213. In this case, the solid anode 213 may be electrically connected to the electroplating power supply 300 via the conductive posts 218, and the solid anode 213 may act as a conductive plate to supply power to the active anode 214. In another embodiment, as shown in FIG. 2, the active anode 214 may be a metal particle that is laid flat on a conductive plate 219 disposed below the solid anode 213. In this case, the solid anode 213 may be electrically connected to the electroplating power supply 300 via the conductive posts 218, and the conductive plate 219 may be electrically connected to the electroplating power supply 300 via the conductive posts 218 to supply power to the active anode 214.

[0028] In the above description, an example has been given in which the solid anode 213 and the active anode 214 share the conductive post 217. However, in other embodiments, the solid anode 213 and the active anode 214 may each have an independent conductive post 217 electrically connected to the electroplating power supply 300, so that the electroplating power supply 300 can control the solid anode 213 and the active anode 214 independently.

[0029] The electroplating power supply 300 may control each anode independently, or may synchronously control some of the anodes. For example, the electroplating power supply 300 may independently control the current (or voltage) at the solid anode 213 and the active anode 214 in the same anode region 212, or may synchronously control the current (or voltage) at the solid anode 213 and the active anode 214 in the same anode region 212.

[0030] Each anode region 212 is provided with an independent anolyte supply unit for supplying anolyte to the anode region 212. As shown in Figure 1, the anolyte supply unit for each anode region 212 includes at least one anolyte inlet 215 located below the active anode 214 for supplying anolyte to the anode region 212, at least one anolyte outlet 216 located above the solid anode 213 for discharging anolyte from the anode region 212, and at least one internal fluid passage 217 located within a sidewall of the anode region 212 for guiding the anolyte from the anolyte inlet 215 to the anolyte outlet 216.

[0031] In this embodiment, two anolyte inlets 215 are disposed at the bottom of the anode region 212a located in the inner ring, and two anolyte inlets 215 are disposed at the bottom of the anode region 212b located in the outer ring. The anolyte in each anode region 212 can flush the active anode 214 from bottom to top, which is advantageous for promoting the diffusion of metal ions generated by the active anode 214 and removing anode slime from the surface of the active anode 214. In one embodiment, as shown in FIG. 1 , the active anode 214 is a metal block. The anolyte enters each anode region 212 through the anolyte inlets 215 and flushes the bottom surface of the active anode 214, allowing the metal ions generated in the active anode 214 to be uniformly dispersed in the anolyte and more efficiently transported toward the cathode region via the internal fluid passages 217 disposed in each anode region 212. In another embodiment, as shown in FIG. 2 , the active anodes 214 are metal particles, and anolyte enters each anode region 212 through anolyte inlets 215 and continues to flow into the voids between the metal particles, transporting metal ions produced by the active anodes 214 toward the cathode region via internal fluid passages 217 disposed in each anode region 212.

[0032] One anolyte outlet of the at least one anolyte outlet 216 arranged in each anode region 212 is provided at the highest position of the anode region 212 in which it is located. In a preferred embodiment, referring to Fig. 3 , each anode region 212 includes one first anolyte outlet 2161 and at least a pair of second anolyte outlets 2162. The first anolyte outlet 2161 is provided at the highest position (vertical direction in Fig. 2 ) of the anode region 212 in which it is located, and the second anolyte outlets 2162 are arranged in pairs on both sides of the first anolyte outlet 2161 of the anode region 212 in which it is located. In Fig. 3 , each of the anode regions 212a and 212b is provided with one first anolyte outlet 2161 and a pair of second anolyte outlets 2162.

[0033] 1 , in each anode region 212, the inlet end 2171 of the internal fluid passage 217 is in fluid communication with the anolyte inlet 215 via the space below the active anode 214, and the outlet end 2172 of the internal fluid passage 217 is in fluid communication with the anolyte outlet 216 via the space above the solid anode 213. In the example shown in FIG. 2 , in each anode region 212, the inlet end 2171 of the internal fluid passage 217 may be in fluid communication with the anolyte inlet 215 via voids between the metal particles.

[0034] In the present embodiment, three internal fluid passages 217 are disposed within the sidewall of each anode region 212. Referring to Fig. 1 and Fig. 3 , in each anode region 212, the outlet end 2172 of the internal fluid passage 217 is disposed opposite the anolyte outlet 216. Specifically, as indicated by the dashed arrow in Fig. 3 , the outlet end 2172 of the internal fluid passage 217 and the anolyte outlet 216 are disposed on the wall surface opposite the anode region 212 so that the anolyte flows smoothly from one side to the other side of the solid anode 213.

[0035] It should be noted that FIG. 3 is merely one embodiment and is not intended to limit the number of internal fluid passages 217 and anolyte outlets 216 provided in each anode region 212 or the relative positional relationship therebetween. The number and relative positions of the internal fluid passages 217 and anolyte outlets 216 in each anode region 212 can be rationally optimized according to parameters such as the fluid flow rate and flow field distribution in the anode region 212.

[0036] Embodiment 2 4, this embodiment provides an electroplating apparatus, which differs from embodiment 1 in that a rectifying plate 2101 is further disposed inside at least one anode region 212, and is disposed between the anolyte inlet 215 of the anode region 212 in which the rectifying plate 2101 is located and the active anode 214. The rectifying plate 2101 can promote uniform dispersion of the anolyte, allowing metal ions to be uniformly and quickly transferred to the substrate w, thereby improving the uniformity of electroplating.

[0037] When the active anode 214 is made of metal particles, the metal particles may be laid flat on the rectifying plate 2101, and in this case, the rectifying plate 2101 may be made of a conductive material (e.g., titanium metal) for supplying power to the active anode 214. Specifically, the rectifying plate 2101 may be electrically connected to the electroplating power supply 300 via the conductive post 218 to supply power to the active anode 214.

[0038] Embodiment 3 5, this embodiment provides an electroplating apparatus, which differs from the first embodiment in that an agitator 2102 is further disposed in at least one anode region 212. The agitator 2102 is disposed between the active anode 214 and the anolyte inlet 215 of the anode region 212 in which it is located, so as to uniformly distribute the anolyte and improve the uniformity of electroplating. In this embodiment, which is not intended to limit the present invention, the agitator 2102 is disposed in the anode region 212a located in the inner ring.

[0039] The stirring unit 2102 is a magnetic stirrer and includes a magnetic stirrer 21021 and a magnetic field generator 21022. The magnetic stirrer 21021 is rotatably disposed inside the anode region 212 in which it is located. In one embodiment, as shown in Fig. 5, the magnetic stirrer 21021 is freely disposed inside the anode region 212 in which it is located. In another embodiment, as shown in Fig. 6, the magnetic stirrer 21021 is rotatably attached to the bottom wall of the anode region 212 in which it is located via a bearing 21023.

[0040] The magnetic field generator 21022 is positioned outside the anode region 212 where it is located so as to drive the rotation of the magnetic stirrer 21021. The magnetic field generator 21022 rotates the magnetic stirrer 21021 by constantly alternating polarities at both ends, thereby uniformly dispersing the anolyte.

[0041] Embodiment 4 As shown in FIG. 7 , this embodiment provides an electroplating apparatus including a clamp 100 and an electroplating chamber 400. The clamp 100 is for holding a substrate w. The clamp 100 can rotate, tilt, and raise and lower the substrate w. The clamp 100 is provided with a sealing member 101 that separates the surface of the substrate w into a first region w1 and a second region w2. The first region w1 is enclosed by the sealing member 101 and does not contact the electroplating solution. On the other hand, the second region w2 is exposed outside the clamp 100 and contacts the electroplating solution. Here, the second region w2 is the effective electroplating surface of the substrate w, and metal ions are deposited on the second region w2 during electroplating.

[0042] The electroplating chamber 400 includes an anode chamber 401, a cathode chamber 202 provided above the anode chamber 401, an ionic membrane 203 separating the anode chamber 401 from the cathode chamber 202, an outer chamber 204 surrounding the exterior of the anode chamber 401 and the cathode chamber 202, and a protective cover 205 provided above the outer chamber 204. The anode chamber 401 is used to store an anolyte, and the cathode chamber 202 is used to store a catholyte; the anolyte and the catholyte are collectively referred to as an electroplating solution.

[0043] The cathode chamber 202 includes a cathode liquid inlet 221, a cathode liquid supply pipe 222, and a diffuser plate 223. As indicated by solid arrows in Fig. 7 , the cathode liquid flows from the cathode liquid inlet 221 into the cathode liquid supply pipe 222, is supplied from the cathode liquid supply pipe 222 to the cathode chamber 202, passes through the diffuser plate 223, overflows upward, and is finally discharged from a cathode liquid outlet 241 opened at the bottom of the outer cavity 204. The diffuser plate 223 is disposed above the cathode liquid supply pipe 222 and is used to uniformly distribute the cathode liquid within the cathode chamber 202. The cathode liquid outlet 241 may be in communication with the cathode liquid inlet 221 via an external circulation pipe to allow the cathode liquid to circulate.

[0044] The anode chamber 401 includes at least one independent anode region 412, each of which includes a mesh anode 413, an active anode 414, an anolyte inlet 415, and an anolyte outlet 416. In this embodiment, although not limiting to the present invention, a partition wall 411 is provided inside the anode chamber 401, dividing the anode chamber 401 into two independent anode regions 412, which are arranged concentrically. The active anode 414 is disposed below the mesh anode 413 and is continuously consumed to replenish metal ions during the electroplating process. The active anode 414 may be a metal block or metal particle, such as a copper block or copper particle.

[0045] The mesh anode 413 is an inert anode and is made of an inert material, such as titanium metal (Ti). The surface of the mesh anode 413 may be coated with gold (Au) or platinum (Pt). During the electroplating process, the mesh anode 413 can supply a stable potential, is not consumed, and maintains a constant distance from the substrate w. This prevents the electric field generated by the mesh anode 413 on the substrate w from changing over time, thereby improving the uniformity of the electroplating to a certain extent.

[0046] The mesh anode 413 has several mesh holes formed therein, through which the anolyte can freely flow. The mesh holes may have any shape, such as circular, elliptical, or polygonal. The mesh anode 413 is positioned below the substrate w and parallel to and facing the substrate w. The mesh anode 413 has a first surface 4131 facing the effective electroplating surface of the substrate w. Several mesh holes are formed in the first surface 4131. The first surfaces 4131 of the mesh anodes 413 in each anode region 412 together form an electric field generation surface. The dimension B of this electric field generation surface is equal to the dimension A of the effective electroplating surface of the substrate w (i.e., the second region w2) so that the mesh anode 413 generates a uniform electric field across the effective electroplating surface of the substrate w. Here, "equal" allows for a certain degree of error, i.e., it may include the case of being approximately equal.

[0047] The electroplating apparatus also includes an electroplating power supply 300 for controlling the current flowing through the substrate w. The negative pole of the electroplating power supply 300 is connected to the clamp 100 via a wire 301 to supply power to the substrate w within the clamp 100. Each anode region 412 is provided with a conductive post 418 and a conductive plate 419, which may be made of titanium (Ti). The conductive plate 419 may be directly attached to the bottom of the anode region 412 in which it is located, or may be spaced apart to ensure a space for the anolyte to flow from the bottom of the anode region 412 in which it is located. The active anode 414 is disposed on the conductive plate 419. The conductive post 418 is electrically connected to the mesh anode 413 and the conductive plate 419. The positive terminal of the electroplating power supply 300 is connected to the conductive post 418 via a wire 302 to supply power to the mesh anode 413 and the active anode 414 disposed on a conductive plate 419 .

[0048] In the above description, an example has been given in which the mesh anode 413 and the active anode 414 share the conductive post 217. However, in other embodiments, the mesh anode 413 and the active anode 414 may each have an independent conductive post 418 electrically connected to the electroplating power supply 300, so that the electroplating power supply 300 can control the mesh anode 413 and the active anode 414 independently.

[0049] The electroplating power supply 300 may control each anode independently or may synchronously control some of the anodes. For example, the electroplating power supply 300 may independently control the current (or voltage) at the mesh anode 413 and the active anode 414 in the same anode region 412, or may synchronously control the current (or voltage) at the mesh anode 413 and the active anode 414 in the same anode region 412.

[0050] Each anode region 412 is provided with at least one anolyte inlet 415 for supplying anolyte to the anode region 412. In FIG. 7 , three anolyte inlets 415 are provided at the bottom of the inner anode region 412a, and two anolyte inlets 415 are provided at the bottom of the outer anode region 412b. In this embodiment, the active anode 414 is a metal block, and the active anode 414 and a conductive plate 419 below the active anode 414 have through-holes 417 that communicate with the anolyte inlets 415 for circulating anolyte. Specifically, as shown in FIG. 7 , the anolyte inlet 415 directly penetrates the active anode 414 and the conductive plate 419 below the active anode 414 to form the through-hole 417. The dashed arrows in FIG. 7 indicate the flow direction of the anolyte in the anode region 412, where the anolyte flows upward from the anolyte inlet 415, immerses in the active anode 414, and then flows through the mesh anode 413 to the anolyte outlet 416.

[0051] Each anode region 412 is provided with at least one anolyte outlet 416 for discharging anolyte from that anode region 412. One of the at least one anolyte outlet 416 arranged in each anode region 412 is provided at the highest position of the anode region 412 in which it is located. In a preferred embodiment, referring to FIG. 8 , each anode region 412 includes one first anolyte outlet 4161 and at least a pair of second anolyte outlets 4162. Among these, the first anolyte outlet 4161 is provided at the highest position (vertical direction in FIG. 7 ) of the anode region 412 in which it is located, and the second anolyte outlets 4162 are provided in pairs on both sides of the first anolyte outlet 4161 of the anode region 412 in which it is located. 8, anode regions 412a and 412b are each provided with one first anolyte outlet 4161 and a pair of second anolyte outlets 4162. The dashed arrows in Fig. 8 indicate the flow direction of anolyte above mesh anode 413. Specifically, above mesh anode 413, anolyte flows smoothly in approximately one direction to anolyte outlet 416.

[0052] It should be noted that FIG. 8 is merely one embodiment and is not intended to limit the number of anolyte outlets 416 that can be installed. The number of anolyte outlets 416 can be reasonably optimized according to the process flow rate and flow field distribution parameters of the anolyte.

[0053] Embodiment 5 9, this embodiment provides an electroplating apparatus, which is different from the fourth embodiment in that the active anode 414 is made of metal particles. The particulate active anode 414 is laid flat on a conductive plate 419.

[0054] Because the anolyte can freely flow through the gaps between the metal particles, in this embodiment, only the conductive plate 419 is provided with through-holes 417 for allowing the anolyte to flow therethrough. The through-holes 417 may be formed by directly penetrating the conductive plate 419 with the anolyte inlet 415. The dashed arrows in FIG. 9 indicate the flow direction of the anolyte in the anode region 412. As shown in FIG. 9 , the anolyte flows upward from the anolyte inlet 415 into the gaps between the metal particles, soaks the metal particles, then flows upward through the mesh anode 413, and finally flows out via the anolyte outlet 416.

[0055] Embodiment 6 10 , this embodiment provides an electroplating apparatus, which differs from embodiment 4 in that at least one anode region 412 further includes a fluid dispersion pipe 4101 and an anolyte inlet pipe 4102. The fluid dispersion pipe 4101 is located above the active anode 414 of the anode region 412, and communicates with the anolyte inlet 415 of the anode region 412 via the anolyte inlet pipe 4102 to uniformly distribute the anolyte. In this embodiment, which is not intended to limit the scope of the present invention, the fluid dispersion pipe 4101 is located in the anode region 412a located in the inner ring.

[0056] In this embodiment, as shown in Fig. 12a, the fluid dispersion pipe 4101 includes multiple branch pipes 41011. The multiple branch pipes 41011 are radially distributed around the anolyte introduction pipe 4102 and are connected to the anolyte introduction pipe 4102. The branch pipes 41011 are straight and have multiple outlets 41012 formed along their length. The outlets 41012 are inclined downward. To further enhance the anolyte dispersion effect of the fluid dispersion pipe 4101, as shown in Fig. 12a, each of the multiple branch pipes 41011 is provided with a row of outlets 41012 along its length. The rows of outlets 41012 are oriented in the same rotational direction (counterclockwise as in Fig. 12a).

[0057] Figure 12b shows another modified example of the fluid dispersion pipe. As shown in Figure 12b, the fluid dispersion pipe 4103 has at least one annular pipe 41031, and the annular pipe 41031 has a plurality of outlets 41032. In Figure 12b, the fluid dispersion pipe 4103 has two annular pipes 41031 arranged concentrically.

[0058] The specific form of the fluid dispersion pipe can be reasonably designed depending on the parameters such as the shape and dimensions of the anode region in which it is located, and is not limited to the examples shown in Figures 12a and 12b. Different types of fluid dispersion pipes can be used depending on the anode region. For example, fluid dispersion pipe 4101 is used for anode region 412a located in the inner ring, and fluid dispersion pipe 4103 is used for anode region 413b located in the outer ring.

[0059] The fluid dispersion pipe 4101 is located above the active anode 414. In one embodiment, the fluid dispersion pipe 4101 is located between the active anode 414 and the mesh anode 413, as shown in FIG. 10 . In the anode region 412a located in the inner ring, the anolyte is discharged downward from the discharge port 41012, as indicated by the dashed arrow in FIG. 10 , to rinse the active anode 414, and then flows upward via the mesh anode 413 toward the anolyte outlet 416. In another embodiment, the fluid dispersion pipe 4101 is located above the mesh anode 413, as shown in FIG. 11 . In the anode region 412a located in the inner ring, the anolyte is discharged downward from the discharge port 41012, as indicated by the dashed arrow in FIG. 11 , to sequentially rinse the mesh anode 413 and the active anode 414, and then flows via the mesh anode 413 toward the anolyte outlet 416.

[0060] Embodiment 7 13, this embodiment provides an electroplating apparatus, which differs from embodiment 4 in that an agitator 4102 is further provided to uniformly distribute the anolyte in at least one anode region 412. In this embodiment, which is not intended to limit the present invention, the agitator 4102 is provided in the anode region 412a located in the inner ring.

[0061] 13, the stirring unit 4102 is a magnetic stirrer and includes a magnetic stirrer 41021 and a magnetic field generator 41022. The magnetic stirrer 41021 is rotatably mounted inside the anode region 412 where it is located. Specifically, the magnetic stirrer 41021 is attached to the upper end of a rotating shaft 41023, and the lower end of the rotating shaft 41023 passes through the through-holes 417 in the active anode 414 and the conductive plate 419 and is rotatably attached to the bottom wall of the anode region 412 via a bearing 41024. The magnetic field generator 41022 is disposed outside the anode region 412 where it is located so as to drive the rotation of the magnetic stirrer 41021.

[0062] A magnetic stir bar 41021 is positioned above the active anode 414. In one embodiment, as shown in Figure 13, the magnetic stir bar 41021 is positioned between the mesh anode 413 and the active anode 414. In another embodiment, as shown in Figure 14, the magnetic stir bar 41021 is positioned above the mesh anode 413.

[0063] Embodiment 8 As shown in FIG. 15 , this embodiment provides an electroplating apparatus including a clamp 100 and an electroplating chamber 500. The clamp 100 is for holding a substrate w. The clamp 100 can drive the substrate w to perform operations such as rotation, tilt, and elevation. The clamp 100 is provided with a sealing member 101 that separates the surface of the substrate w into a first region w1 and a second region w2. The first region w1 is enclosed by the sealing member 101 and does not come into contact with the electroplating solution, while the second region w2 is exposed outside the clamp 100 and comes into contact with the electroplating solution. Here, the second region w2 is the effective electroplating surface of the substrate w, and metal ions are deposited on the second region w2 during electroplating.

[0064] The electroplating chamber 500 includes an anode chamber 501, a cathode chamber 202 provided above the anode chamber 501, an ionic membrane 203 separating the anode chamber 501 from the cathode chamber 202, an outer chamber 204 surrounding the exterior of the anode chamber 501 and the cathode chamber 202, and a protective cover 205 provided above the outer chamber 204. The anode chamber 501 is used to store an anolyte, and the cathode chamber 202 is used to store a catholyte; the anolyte and the catholyte are collectively referred to as an electroplating solution.

[0065] The cathode chamber 202 includes a cathode liquid inlet 221, a cathode liquid supply pipe 222, and a diffuser plate 223. As indicated by solid arrows in Fig. 15 , the cathode liquid flows from the cathode liquid inlet 221 into the cathode liquid supply pipe 222, is supplied from the cathode liquid supply pipe 222 to the cathode chamber 202, passes through the diffuser plate 223, and overflows into the upper outer cavity 204, and is finally discharged from a cathode liquid outlet 241 opened at the bottom of the outer cavity 204. The diffuser plate 223 is disposed above the cathode liquid supply pipe 222 and is used to uniformly distribute the cathode liquid within the cathode chamber 202. The cathode liquid outlet 241 may be in communication with the cathode liquid inlet 221 via an external circulation pipe to allow the cathode liquid to circulate.

[0066] The anode chamber 501 includes at least one independent anode region 512, each of which includes a through-hole anode 513, an active anode 514, an anolyte inlet 515, and an anolyte outlet 516. In this embodiment, although not limiting the present invention, a partition wall 511 is provided inside the anode chamber 501, which divides the anode chamber 501 into two independent anode regions 512, which are arranged concentrically. The active anode 514 is located below the through-hole anode 513 and serves to replenish metal ions.

[0067] The through-hole anode 513 is an inert anode, and is made of an inert material such as titanium metal (Ti). The surface of the through-hole anode 513 may be coated with gold (Au) or platinum (Pt). During the electroplating process, the through-hole anode 513 can supply a stable potential, is not consumed, and can maintain a constant distance from the substrate w. This prevents the electric field generated by the through-hole anode 513 on the substrate w from changing over the course of electroplating, thereby improving the uniformity of the electroplating to a certain extent.

[0068] The through-hole anode 513 has through-holes 5130 formed therein for the free flow of anolyte. The through-hole anode 513 is located below the substrate w and is arranged parallel to and facing the substrate w. The through-hole anode 513 has a first surface 5131 arranged facing the effective electroplating surface of the substrate w. Preferably, the through-holes 5130 are perpendicular to the substrate w.

[0069] The first surfaces 5131 of the through-hole anodes 513 of each anode region 512 together form an electric field generating surface, and the dimension B of this electric field generating surface is equal to the dimension A of the effective electroplating surface of the substrate w (i.e., the second region w2) so that the through-hole anodes 513 form a uniform electric field across the effective electroplating surface of the substrate w. Here, "equal" allows for a certain degree of error, i.e., may include cases where they are approximately equal.

[0070] The electroplating apparatus also includes an electroplating power supply 300 for controlling the current in the substrate w. The negative pole of the electroplating power supply 300 is connected to the clamp 100 via a wire 301 to supply power to the substrate w in the clamp 100. Each anode region 512 further includes a conductive post 518, which may be made of titanium metal (Ti). The electroplating power supply 300 is connected to the conductive post 518 via a wire 302, which is electrically connected to the through-hole anode 513 and the active anode 514, and the electroplating power supply 300 supplies power to the through-hole anode 513 and the active anode 514 via the conductive post 518.

[0071] 15, the active anode 514 may be a metal block and may be inverted and mounted directly below the through-hole anode 513. In this case, the through-hole anode 513 may be electrically connected to the electroplating power supply 300 via a conductive post 518, and the through-hole anode 513 may supply power to the active anode 514 as a conductive plate 519. In another embodiment, as shown in FIG. 16, the active anode 514 may be a metal particle and may be laid flat on a conductive plate 519 disposed below the through-hole anode 513. In this case, the through-hole anode 513 may be electrically connected to the electroplating power supply 300 via a conductive post 518, and the conductive plate 519 may be electrically connected to the electroplating power supply 300 via the conductive post 518 to supply power to the active anode 514.

[0072] In the above description, an example has been given in which the through-hole anode 513 and the active anode 514 share the conductive post 518, but in other embodiments, the through-hole anode 513 and the active anode 514 may each have an independently arranged conductive post 518 electrically connected to the electroplating power supply 300, so that the electroplating power supply 300 can independently control the through-hole anode 513 and the active anode 514.

[0073] The electroplating power supply 300 may control each anode independently or may synchronously control some of the anodes. For example, the electroplating power supply 300 may independently control the current (or voltage) at the through-hole anode 513 and the active anode 514 in the same anode region 512, or may synchronously control the current (or voltage) at the through-hole anode 513 and the active anode 514 in the same anode region 512.

[0074] Each anode region 512 is provided with at least one anolyte inlet 512 for supplying anolyte to that anode region 515. In Fig. 15 , three anolyte inlets 515 are provided at the bottom of anode region 512a located in the inner ring, and two anolyte inlets 515 are provided at the bottom of anode region 512b located in the outer ring. As indicated by the dashed arrows in Fig. 15 , anolyte is supplied from the anolyte inlet 515 to each anode region 512 from below upward, and in each anode region 512, the anolyte flows sequentially through active anodes 514 and through-hole anodes 513 and finally to anolyte outlet 516.

[0075] In one embodiment, as shown in FIG. 15 , the active anode 514 is a metal block having through-holes 517 formed therein. The through-holes 517 connect the anolyte inlet 515 to the through-holes 5130 of the through-hole anode 513, allowing the anolyte to flow through. In another embodiment, as shown in FIG. 16 , the active anode 514 is made of metal particles, and voids exist between the metal particles. The voids connect the anolyte inlet 515 to the through-holes 5130 of the through-hole anode 513, allowing the anolyte to flow through. In another embodiment, a slit may be provided between the sidewall of the through-hole anode 513 and the sidewall of the anode region 512 where the void is located, as a passage for the anolyte to flow through. Similarly, even when the active anode 514 is a metal block, a slit may be provided between the sidewall of the active anode 514 and the sidewall of the anode region 512 where the void is located, as a passage for the anolyte to flow through.

[0076] At least one anolyte outlet 516 is disposed in each anode region 512 for discharging anolyte from the anode region 512. As shown in FIG. 15 , an anolyte outlet 516 is disposed in each anode region 512 above the through-hole anode 513. One of the at least one anolyte outlet 516 disposed in each anode region 512 is provided at the highest position of the anode region 512 in which it is located. In a preferred embodiment, referring to FIG. 17 , each anode region 512 includes one first anolyte outlet 5161 and at least a pair of second anolyte outlets 5162. The first anolyte outlet 5161 is provided at the highest position of the anode region 512 in which it is located, and the second anolyte outlets 5162 are disposed in pairs on both sides of the first anolyte outlet 5161 of the anode region 512 in which it is located. 17, each of anode regions 512a and 512b is provided with one first anolyte outlet 5161 and a pair of second anolyte outlets 5162. The dashed arrows in Fig. 17 indicate the flow direction of anolyte above through-hole anode 513. Specifically, above through-hole anode 513, anolyte flows smoothly in approximately one direction to anolyte outlet 516.

[0077] It should be noted that FIG. 17 is merely one embodiment and is not intended to limit the number of anolyte outlets 516 that can be installed. The number of anolyte outlets 516 can be rationally optimized according to the process flow rate and flow field distribution parameters of the anolyte.

[0078] Embodiment 9 18, this embodiment provides an electroplating apparatus, which differs from embodiment 8 in that at least one anode region 512 further includes a fluid dispersion pipe 4101 and an anolyte inlet pipe 4102. The fluid dispersion pipe 4101 is located above the through-hole anode 513 of the anode region 512 in which it is located, and communicates with the anolyte inlet 515 of the anode region 512 in which it is located via the anolyte inlet pipe 4102, so as to uniformly distribute the anolyte. In this embodiment, which is not intended to limit the present invention, the fluid dispersion pipe 4101 is located in the anode region 512a located in the inner ring.

[0079] 12a, the fluid dispersion pipe 4101 includes multiple branch pipes 41011. The multiple branch pipes 41011 are distributed radially around the anolyte introduction pipe 4102 and are connected to the anolyte introduction pipe 4102. The branch pipe 41011 is straight and has multiple outlets 41012 formed along its length. The outlets 41012 are provided at an angle facing downward. In this embodiment, as shown in FIG. 18, the anolyte introduction pipe 4102 is provided in a through-hole 5130 of a through-hole anode 513. One end of the anolyte introduction pipe 4102 is located above the through-hole anode 513 and connected to the multiple branch pipes 41011, and the other end of the anolyte introduction pipe 4102 is located below the through-hole anode 513 and connected to an anolyte inlet 515.

[0080] In order to further enhance the dispersion effect of the anolyte by the fluid dispersion pipe 4101, as shown in FIG. 12a, each of the branch pipes 41011 is provided with a row of outlets 41012 along its length, and the rows of outlets 41012 are oriented in the same rotational direction (e.g., counterclockwise).

[0081] Figure 12b shows another modified example of the fluid dispersion pipe. As shown in Figure 12b, the fluid dispersion pipe 4103 has at least one annular pipe 41031, and the annular pipe 41031 has a plurality of outlets 41032. In Figure 12b, the fluid dispersion pipe 4103 has two annular pipes 41031 arranged concentrically.

[0082] Embodiment 10 19, this embodiment provides an electroplating apparatus, which differs from embodiment 8 in that a rectifying plate 5102 is further disposed inside at least one anode region 512, and the rectifying plate 5102 is disposed between the anolyte inlet 515 of the anode region 512 in which the rectifying plate 5102 is located and the active anode 514. The rectifying plate 5102 can promote uniform dispersion of the anolyte and allow metal ions to be uniformly and quickly transferred to the substrate w, thereby improving the uniformity of electroplating.

[0083] When the active anode 514 is made of metal particles, the metal particles may be laid flat on the rectifying plate 5102, and in this case, the rectifying plate 5102 may be made of a conductive material (e.g., titanium metal) for supplying power to the active anode 514. Specifically, the rectifying plate 5102 may be electrically connected to the electroplating power supply 300 via the conductive post 518 to supply power to the active anode 514.

[0084] Embodiment 11 20, this embodiment provides an electroplating apparatus, which differs from embodiment 8 in that an agitator 5103 is further disposed in at least one anode region 512. The agitator 5103 is disposed between the anolyte inlet 515 of the anode region 512 in which it is located and the active anode 514, and is used to uniformly distribute the anolyte. In this embodiment, which is not intended to limit the present invention, the agitator 5103 is disposed in the anode region 512a located in the inner ring.

[0085] The stirring unit 5103 is a magnetic stirrer and includes a magnetic stirrer 51031 and a magnetic field generator 51032. The magnetic stirrer 51031 is rotatably disposed within the anode region 512 in which it is located. Specifically, the magnetic stirrer 51031 is rotatably disposed between the anolyte inlet 515 and the active anode 514 of the anode region 512 in which it is located. In one embodiment, as shown in FIG. 20 , the magnetic stirrer 51031 is freely disposed within the anode region 512 in which it is located. In another embodiment, as shown in FIG. 21 , the magnetic stirrer 51031 is rotatably attached to the bottom wall of the anode region 512 in which it is located via a bearing 51033.

[0086] The magnetic field generator 51032 is disposed outside the anode region 512 where it is located so as to drive the rotation of the magnetic stirrer 51031. The magnetic field generator 51032 constantly changes polarity at both ends, thereby rotating the magnetic stirrer 51031 and uniformly dispersing the anolyte.

[0087] The above-described embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the scope of the present invention. Those skilled in the art may modify or change the above-described embodiments without departing from the spirit and technical scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention are considered to be within the scope of the claims of the present invention.

Claims

1. 1. An electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a solid anode, which is an inert anode disposed below the substrate and facing parallel to the substrate; an active anode disposed below the solid anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; at least one internal fluid passage disposed within a sidewall of the anode region for directing the anolyte to flow from the anolyte inlet to the anolyte outlet.

2. 2. The electroplating apparatus of claim 1, the solid anode has a first surface, the first surface is parallel to the substrate, the first surfaces of the solid anodes of each anode region together form an electric field generating surface, the dimensions of the electric field generating surface are equal to the dimensions of the effective electroplating surface of the substrate.

3. 2. The electroplating apparatus of claim 1, An electroplating apparatus wherein there is sealed contact between said solid anode and the wall of the anode area where it is located.

4. 2. The electroplating apparatus of claim 1, the at least one anolyte outlet disposed in each anode region includes one first anolyte outlet and at least one pair of second anolyte outlets, the first anolyte outlet being provided at the highest position of the anode region in which it is located, and the second anolyte outlets being provided in pairs on both sides of the first anolyte outlet of the anode region in which it is located.

5. 2. The electroplating apparatus of claim 1, The electroplating apparatus wherein the anolyte inlet is located at the bottom of each anode region, allowing the anolyte to wash over the active anode from bottom to top.

6. 6. The electroplating apparatus according to claim 5, An electroplating apparatus, wherein at least one of the anode regions further comprises a current plate disposed between the anolyte inlet of the anode region in which the current plate is located and the active anode.

7. 6. The electroplating apparatus according to claim 5, An electroplating apparatus, wherein at least one of the anode regions further comprises an agitation unit disposed between the anolyte inlet of the anode region in which the agitation unit is located and the active anode.

8. 8. The electroplating apparatus according to claim 7, The stirring unit is a magnetic stir bar disposed within the anode region; a magnetic field generator positioned outside the anode region where the magnetic stirrer is located so as to drive rotation of the magnetic stirrer.

9. 9. The electroplating apparatus according to claim 8, The electroplating apparatus, wherein the magnetic stirrer is freely disposed inside the anode region where it is located, or is rotatably attached via a bearing to the bottom wall of the anode region where it is located.

10. 2. The electroplating apparatus of claim 1, The solid anode is made of metallic titanium (Ti).

11. 11. The electroplating apparatus of claim 10, The surface of the solid anode has a coating of gold (Au) or platinum (Pt).

12. 2. The electroplating apparatus of claim 1, The electroplating apparatus, wherein the active anode is a metal block or metal particles.

13. 1. An electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a mesh anode, which is an inert anode, disposed below the substrate and facing parallel to the substrate; an active anode disposed below the mesh anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; and at least one anolyte outlet for draining the anolyte from the anode region.

14. 14. The electroplating apparatus of claim 13, the mesh anode has a first surface, the first surface is parallel to the substrate, the first surfaces of the mesh anodes in each anode region together form an electric field generating surface, the dimensions of the electric field generating surface are equal to the dimensions of the effective electroplating surface of the substrate.

15. 14. The electroplating apparatus of claim 13, the at least one anolyte outlet disposed in each anode region includes one first anolyte outlet and at least one pair of second anolyte outlets, the first anolyte outlet being provided at the highest position of the anode region in which it is located, and the second anolyte outlets being provided in pairs on both sides of the first anolyte outlet of the anode region in which it is located.

16. 14. The electroplating apparatus of claim 13, At least one of the anode regions further includes a stirring section, The stirring unit is a magnetic stirrer located above the active anode in the anode region and rotatably connected to the bottom wall of the anode region via a bearing; a magnetic field generator positioned outside the anode region where the magnetic stirrer is located so as to drive rotation of the magnetic stirrer.

17. 14. The electroplating apparatus of claim 13, at least one of the anode zones further comprises a fluid dispersion pipe and an anolyte inlet pipe, the fluid dispersion pipe being disposed above the active anode of the anode zone in which it is located and communicating with the anolyte inlet of the anode zone in which it is located via the anolyte inlet pipe, thereby uniformly dispersing the anolyte.

18. 18. The electroplating apparatus of claim 17, the fluid dispersion pipe includes a plurality of branch pipes, each of which is straight and has a plurality of discharge ports formed therethrough, the plurality of branch pipes being radially distributed around the anolyte introduction pipe and communicating with the anolyte introduction pipe.

19. 20. The electroplating apparatus of claim 18, The discharge port is provided so as to be inclined downward.

20. 20. The electroplating apparatus of claim 18, In the electroplating apparatus, each of the plurality of branch pipes has a row of outlets arranged along its length, and the outlets in the plurality of rows are oriented in the same rotational direction.

21. 18. The electroplating apparatus of claim 17, The electroplating apparatus, wherein the fluid dispersion pipe comprises at least one annular pipe having a plurality of outlets formed therein.

22. 14. The electroplating apparatus of claim 13, The electroplating apparatus, wherein the active anode is a metal particle or a metal block.

23. 1. An electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode disposed below the substrate and facing parallel to the substrate; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; an electroplating apparatus, wherein the through-hole anode has a through hole formed therein and a first surface, the first surface being parallel to the substrate, the first surfaces of the through-hole anodes in each anode region together forming an electric field generating surface, the dimensions of the electric field generating surface being equal to the dimensions of the effective electroplating surface of the substrate.

24. 1. An electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode having a through-hole formed therein and disposed below the substrate and facing the substrate in parallel; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; An electroplating apparatus, wherein a current plate is disposed in at least one anode region, and the current plate is disposed between the anolyte inlet of the anode region in which the current plate is located and the active anode.

25. 1. An electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode having a through-hole formed therein and disposed below the substrate and facing the substrate in parallel; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; a stirring section disposed within at least one anode region; The stirring unit is a magnetic stirrer located between the active anode in the anode region and the anolyte inlet; a magnetic field generator located outside the anode region in which the magnetic stirrer is located so as to drive rotation of the magnetic stirrer.

26. 26. The electroplating apparatus of claim 25, An electroplating apparatus, wherein the magnetic stirrer is freely disposed inside the anode region where it is located, or is rotatably attached via a bearing to the bottom of the anode region where it is located.

27. 1. An electroplating apparatus comprising: a clamp for gripping the substrate; an anode chamber including at least one independent anode region, each anode region comprising: a through-hole anode, which is an inert anode having a through-hole formed therein and disposed below the substrate and facing the substrate in parallel; an active anode disposed below the through-hole anode for replenishing metal ions; at least one anolyte inlet for supplying anolyte to the anode region; at least one anolyte outlet for draining anolyte from the anode region; an electroplating apparatus, wherein a fluid dispersion pipe and an anolyte inlet pipe are disposed in at least one anode region, the fluid dispersion pipe being disposed above the through-hole anode of the anode region in which the fluid dispersion pipe is located and communicating with the anolyte inlet of the anode region in which the fluid dispersion pipe is located via the anolyte inlet pipe, thereby uniformly dispersing the anolyte.

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