Pixel structure and display panel

The pixel structure with a cathode overlap unit improves the overlap between the cathode and boundary conductive layer, addressing the poor overlap issue in diamond-shaped or polygonal pixels, thereby enhancing the yield rate and display quality.

JP2026510990APending Publication Date: 2026-04-10HKC CORP LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-05-30
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

The overlap effect between the cathode and the boundary conductive layer is poor, and non-overlap phenomena occur when manufacturing diamond-shaped or polygonal pixels using evaporation photolithography technology, affecting the yield rate of OLED products.

Method used

A pixel structure is designed with a cathode overlap unit comprising a spacer, conductive unit, and canopy structure, where the metal wires extend perpendicular to the deposition direction, ensuring the conductive unit communicates with the boundary conductive layer, thereby improving the overlap effect.

Benefits of technology

Enhances the overlap between the cathode and boundary conductive layer, improving the yield rate of the product and maintaining display effectiveness.

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Abstract

This application provides a pixel structure and a display panel, and in the field of the display technology, the pixel structure includes a plurality of subpixels, and for each subpixel, the subpixel includes a cathode overlap unit (60), the cathode overlap unit (60) includes a spacer (61) installed from bottom to top, a conductive unit (62), and a canopy structure (63), the direction of extension of the metal wire formed on the conductive unit (62) is perpendicular to a first direction, the first direction is the deposition direction of the display panel, the spacer (61) is located above the anode of the subpixel, the light-emitting layer (40) of the subpixel covers the anode and the spacer (61), the cathode of the subpixel covers the light-emitting layer (40) and overlaps with the conductive unit (62), a pixel boundary layer (70) is installed between adjacent subpixels, the pixel boundary layer (70) includes a pixel definition layer (71) installed from bottom to top, a boundary conductive layer (72), and a canopy structure (73), and the conductive unit (62) is in communication with the boundary conductive layer (72). The technical solution provided in this application can improve the overlap effect between the pixel cathode and the boundary conductive layer (72), thereby improving the yield rate of the product.
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Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims the priority of a Chinese patent application with an application number of 202310275143.2 and an application title of "Pixel Structure and Display Panel", which was filed with the Patent Office of the State Intellectual Property Office of the People's Republic of China on March 21, 2023, and all of its contents are incorporated herein by reference.

[0002] This application relates to the field of display technology, particularly to pixel structure and display panel.

Background Art

[0003] Light - emitting devices such as Organic Light Emitting Diodes (OLEDs) have characteristics such as being thin, energy - saving, having a wide color gamut, and high contrast, and thus are being increasingly widely applied to products such as televisions and mobile phones.

[0004] When manufacturing OLEDs, more and more manufacturers use the evaporation process to perform full - surface film formation, and then use photolithography technology to etch the substrate after full - surface film formation to form each pixel.

[0005] However, when manufacturing diamond - shaped or polygonal pixels with good display effects using the evaporation photolithography technology, the overlap effect between the cathode of the pixel and the boundary conductive layer becomes poor, and even a phenomenon of non - overlap occurs, which affects the yield rate of the product.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the purposes of the embodiments of this application is to provide a pixel structure and a display panel for solving the problem that when manufacturing diamond - shaped or polygonal pixels with good display effects using the evaporation photolithography technology, the overlap effect between the cathode of the pixel and the boundary conductive layer is poor and further non - overlap occurs. [Means for solving the problem]

[0007] In a first aspect, the embodiment of the present application includes a plurality of subpixels, and for each subpixel, the subpixel includes a cathode overlap unit.

[0008] The cathode overlap unit includes a spacer, a conductive unit, and a canopy structure installed from bottom to top, and the direction in which the metal wires formed on the conductive unit extend is perpendicular to the first direction, which is the deposition direction of the display panel.

[0009] The spacer is located above the anode of the subpixel, the light-emitting layer of the subpixel covers the anode and the spacer, and the cathode of the subpixel covers the light-emitting layer and overlaps the conductive unit.

[0010] A pixel structure is provided in which a pixel boundary layer is provided between adjacent subpixels, the pixel boundary layer includes a pixel definition layer, a boundary conductive layer, and a canopy structure arranged from bottom to top, and the conductive unit communicates with the boundary conductive layer.

[0011] In an optional embodiment of the present invention, one end of a metal wire formed on the conductive unit protrudes by a target length from the edge of the subpixel in a direction perpendicular to the first direction.

[0012] In an optional embodiment of the present invention, one end of the metal wire formed in the conductive unit communicates with the boundary conductive layer.

[0013] In an optional embodiment of the present invention, the length of the cathode overlap unit is less than the maximum length of the subpixel perpendicular to the first direction.

[0014] In an optional embodiment of the present invention, both ends of the metal wire formed in the conductive unit are in communication with the boundary conductive layer.

[0015] As an optional embodiment of the embodiment of the present application, there are a plurality of cathode overlap units, the plurality of cathode overlap units are arranged at intervals along the first direction, and each cathode overlap unit communicates with the boundary conductive layer.

[0016] In an optional embodiment of the present invention, the regions of the subpixel located on both sides of the cathode overlap unit are symmetrical with respect to the cathode overlap unit.

[0017] In an optional embodiment of the present invention, there are two cathode overlap units, the extension direction of the metal wire formed in the conductive unit of one cathode overlap unit is perpendicular to the first direction, and the extension direction of the metal wire formed in the conductive unit of the other cathode overlap unit is parallel to the first direction, and for each cathode overlap unit, the regions of the subpixel located on both sides of the cathode overlap unit are symmetrical with respect to the cathode overlap unit.

[0018] In an optional embodiment of the present invention, at least one of the two cathode overlap units communicates with the boundary conductive layer.

[0019] As an optional embodiment of the embodiments of the present application, the cathode overlap unit includes a plurality of intersecting cathode overlap units.

[0020] In an optional embodiment of the present invention, at least one of the multiple intersecting cathode overlap units communicates with the boundary conductive layer.

[0021] In an optional embodiment of the present invention, the material of the conductive unit is the same as the material of the boundary conductive layer outside the subpixel.

[0022] In an optional embodiment of the present invention, the material of the spacer is the same as the material of the pixel definition layer.

[0023] As an optional embodiment of the embodiments of the present application, the shape of the subpixel includes at least one of rhombic, circular, elliptical, and diamond-like shapes.

[0024] In a second embodiment, the present invention provides a display panel comprising a base substrate provided from bottom to top, a drive layer, a packaging layer, and a plurality of pixel structures as described in the first embodiment or any one of the first embodiments, wherein the pixel structures are located between the drive layer and the packaging layer. [Effects of the Invention]

[0025] The pixel structure and display panel according to the embodiments of the present application include a plurality of sub-pixels, and each sub-pixel includes a cathode overlap unit. The cathode overlap unit includes a spacer, a conductive unit, and a shielding structure installed from bottom to top. The extending direction of the metal wire formed on the conductive unit is perpendicular to the first direction (i.e., the deposition direction of the display panel). The spacer is located above the anode of the sub-pixel. The light-emitting layer of the sub-pixel covers the anode and the spacer. The cathode of the sub-pixel covers the light-emitting layer and overlaps with the conductive unit. A pixel boundary layer is provided between adjacent sub-pixels. The pixel boundary layer includes a pixel definition layer, a boundary conductive layer, and a shielding structure provided from bottom to top. The conductive unit communicates with the boundary conductive layer. In the above technical solution, since the extending direction of the metal wire formed on the conductive unit is perpendicular to the deposition direction, the extending direction of the shielding structure on the upper surface of the conductor is also perpendicular to the deposition direction. That is, in the deposition direction, the shielding of the lower conductive unit by the shielding structure in the cathode overlap unit is the least. Thus, when depositing the cathode layer, in the case of the same evaporation angle (restricted by the process, the evaporation angle is not too large), the conductive unit of the cathode overlap unit of each sub-pixel is more likely to overlap with the cathode of each sub-pixel than the boundary conductive layer in the pixel boundary layer between each sub-pixel. And because the conductive unit of the cathode overlap unit communicates with the boundary conductive layer, that is, compared with the direct overlap and communication of the cathode of each sub-pixel with the boundary conductive layer, the cathode of each sub-pixel can easily communicate with the boundary conductive layer through the conductive unit of the cathode overlap unit. This technical solution can improve the overlap effect between the cathode of each sub-pixel and the boundary conductive layer and improve the yield rate of the product.

Brief Description of the Drawings

[0026] To more clearly explain the technical solutions in the embodiments of the present application, the drawings required for the description of the embodiments are briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative labor. [Figure 1]It is a schematic diagram of any pixel structure in the display panel of the exemplary technology. [Figure 2] It is a cross-sectional view of the display panel along the A-A' direction of FIG. 1. [Figure 3] It is a schematic diagram of the evaporation angles of rectangular sub-pixels and diamond-shaped sub-pixels in the same process. [Figure 4] It is a plan view of the pixel structure according to one embodiment of the present application. [Figure 5] It is a cross-sectional view of the display panel along the C-C' direction of FIG. 4. [Figure 6] It is a plan view of the pixel structure according to another embodiment of the present application. [Figure 7] It is a plan view of the pixel structure according to another embodiment of the present application. [Figure 8] It is a plan view of the pixel structure according to another embodiment of the present application. [Figure 9] It is a plan view of the pixel structure according to another embodiment of the present application.

Description of Reference Numerals

[0027] 10: Base substrate, 20: Driving layer, 30: Anode layer, 40: Light-emitting layer, 50: Cathode layer, 60: Cathode overlap unit, 70: Pixel boundary layer, 80: Packaging layer, 61: Spacer, 62: Conductive unit, 63: Shelter structure, 71: Pixel definition layer, 72: Boundary conductive layer, 73: Shelter structure

Modes for Carrying Out the Invention

[0028] To make the objectives, technical solutions, and advantages of the present application clearer, the embodiments of the present application will be described in more detail below with reference to the drawings. <0000​​​​​The light-emitting device in the embodiments of this application may be any one of OLED, inorganic light-emitting diodes (LED), quantum dot light-emitting diodes (QLED), and submillimeter light-emitting diodes (Mini LED). In this embodiment, the light-emitting device will be described later as an example when it is an OLED.

[0031] Currently, there are three mass production methods for light-emitting devices in display panels: first, using a fine metal mask as a mask and depositing three-color pixels by a vapor deposition process; second, accurately printing pixels at different positions by an inkjet printing process; and third, performing full-surface film deposition by a vapor deposition process, followed by etching the deposited substrate using a photolithography process to separate the three-color pixels. As the size of the display panel increases, the amount of sagging of the metal mask becomes too large when using method 1. Therefore, employing a vapor deposition process to perform full-surface film deposition and then etching the substrate after full-surface film deposition using photolithography technology has become a challenge that has been actively researched in the industry.

[0032] Figure 1 is a schematic diagram of one of the pixel structures in the display panel of the exemplary technology, and as shown in Figure 1, the pixel structure includes three subpixels, which may be a red subpixel, a blue subpixel, and a green subpixel, respectively.

[0033] Figure 2 is a cross-sectional view of the display panel along the A-A' direction in Figure 1. As shown in Figure 2, a pixel boundary layer 70 may be provided between adjacent subpixels, and the pixel boundary layer 70 may include a pixel definition layer 71, a boundary conductive layer 72, and a canopy structure 73 arranged from bottom to top.

[0034] The light-emitting layer 40 of the display panel covers the anode layer 30, the cathode layer 50 covers the light-emitting layer 40, and the cathode layer 50 overlaps the boundary conductive layer 72.

[0035] Figure 3 is a schematic diagram of the evaporation angles of rectangular and rhombic subpixels in the same process. As shown in Figure 3, under the same process conditions, the vertical distance between the edge of the eaves structure 73 and the edge of the boundary conductive layer 72 for both rectangular and rhombic subpixels is a.

[0036] In the deposition direction, the distance between the edge of the eaves structure 73 of a rectangular subpixel and the edge of the boundary conductive layer 72 is still a, while the distance between the edge of the eaves structure 73 of a rhombic subpixel and the edge of the boundary conductive layer 72 is a / sinθ, where θ is the angle between any side of the rhombic subpixel and the deposition direction. In other words, under the same process conditions, the eaves structure 73 of a rhombic subpixel covers more of the boundary conductive layer 72 than that of a rectangular subpixel in the deposition direction. This means that in order to achieve overlap between the cathode layer 50 and the boundary conductive layer 72, the rhombic subpixel requires a larger evaporation angle than the rectangular subpixel.

[0037] Due to process limitations, the evaporation angle is usually not large enough. In other words, under the same process and the same evaporation angle, the overlap effect between the cathode and the boundary conductive layer 72 of a rhombic subpixel is worse than that of a rectangular subpixel, and consequently, overlap may not occur at all.

[0038] As understood, under the same process and the same evaporation angle, compared to rectangular subpixels, circular, elliptical, diamond-like, or other polygonal subpixels, in addition to rhomboid subpixels, all exhibit poor overlap effect between the cathode and the boundary conductive layer 72, and consequently, a phenomenon where overlap is not possible.

[0039] In view of this, the embodiment of the present application provides a pixel structure for improving the overlap effect between the sub-pixel cathode and the boundary conductive layer 72, thereby improving the yield rate of the product.

[0040] Figure 4 is a plan view of a pixel structure according to one embodiment of the present invention, and Figure 5 is a cross-sectional view of a display panel along the C-C' direction in Figure 4. As shown in Figures 4 and 5, the display panel according to this embodiment may include a base substrate 10, a drive layer 20, a pixel structure, and a packaging layer 80, all installed from bottom to top.

[0041] The base substrate 10 may be a rigid substrate or a flexible substrate. The material of the rigid substrate may be glass, and the material of the flexible substrate may be a polymer material such as polyimide.

[0042] The driving layer 20 is located above the base substrate 10 and may include a plurality of thin-film transistors (TFTs) for driving the light-emitting layer 40 to emit light.

[0043] The pixel structure may include an anode layer 30, an emissive layer 40, and a cathode layer 50 arranged in order above the driving layer 20.

[0044] The anode layer 30 may include multiple anode units, and the corresponding region of the light-emitting layer 40 above each anode unit may emit light of a different color.

[0045] Each anode unit corresponds to one subpixel. For example, when the region of the light-emitting layer 40 above the anode unit emits red light, the anode unit corresponds to a red subpixel. When the region of the light-emitting layer 40 above the anode unit emits green light, the anode unit corresponds to a green subpixel. When the region of the light-emitting layer 40 above the anode unit emits blue light, the anode unit corresponds to a blue subpixel.

[0046] Each subpixel includes at least one cathode overlap unit 60. The cathode overlap unit 60 may include a spacer 61 installed from bottom to top, a conductive unit 62, and a canopy structure 63. The direction of extension of the metal wires formed on the conductive unit 62 is perpendicular to the first direction, which is the deposition direction of the display panel.

[0047] The spacer 61 is located above the anode unit corresponding to the subpixel, the light-emitting layer 40 of the subpixel covers the anode unit and the spacer 61, and the cathode of the subpixel covers the light-emitting layer 40 and overlaps the conductive unit 62.

[0048] A pixel boundary layer 70 is provided between adjacent subpixels, and the pixel boundary layer 70 includes a pixel definition layer 71, a boundary conductive layer 72, and a canopy structure 73, which are provided from bottom to top, and the conductive unit 62 is in communication with the boundary conductive layer 72.

[0049] Since the extension direction of the metal wires formed on the conductive unit 62 is perpendicular to the deposition direction, the extension direction of the overhang structure 63 on the upper surface of the conductive unit 62 is also perpendicular to the deposition direction. In other words, in the deposition direction, the shielding of the conductive unit 62 below by the overhang structure 63 of the cathode overlap unit 60 is minimized. Thus, when depositing the cathode layer 50, at the same evaporation angle, the conductive unit 62 of the cathode overlap unit 60 of each subpixel is more likely to overlap with the cathode of each subpixel than the boundary conductive layer 72 in the pixel boundary layer 70 between each subpixel. Furthermore, since the conductive unit 62 of the cathode overlap unit 60 communicates with the boundary conductive layer 72, that is, compared to the cathode of each subpixel directly overlapping and communicating with the boundary conductive layer 72, the cathode of each subpixel is more likely to communicate with the boundary conductive layer 72 via the conductive unit 62 of the cathode overlap unit 60. Therefore, this invention can improve the overlap effect between the cathode of each subpixel and the boundary conductive layer 72, thereby improving the yield rate of the product.

[0050] The material of the conductive unit 62 may be the same as the material of the boundary conductive layer 72 outside the subpixel. In this way, the same metal layer can be etched during manufacturing to form the corresponding conductive unit 62 and boundary conductive layer 72, saving costs.

[0051] The material of the spacer 61 may be the same as the material of the pixel definition layer 71, and may be, for example, organic polyimide, or inorganic SiNx, SiOx, or SiOxNx.

[0052] The packaging layer 80 covers the cathode layer 50, the boundary conductive layer 72, the conductive unit 62, and the eaves structure.

[0053] In a direction perpendicular to the first direction, one end of the metal wire formed on the conductive unit 62 protrudes a certain length from the edge of the subpixel, enabling communication with the boundary conductive layer 72 outside the subpixel.

[0054] As shown in Figure 4, the cathode overlap unit 60 is located in the center of the subpixel, with the subpixels positioned in the regions on both sides of the cathode overlap unit 60. It is symmetrical with respect to the cathode overlap unit 60, and the subpixel is divided into two identical subpixels by the cathode overlap unit 60. In this way, the light-emitting area of ​​each pixel is the same, which is advantageous for improving the display effect.

[0055] In order to ensure communication between the conductive unit 62 and the boundary conductive layer 72, both ends of the metal wire formed on the conductive unit 62 may be in communication with the boundary conductive layer 72.

[0056] Considering that the cathode overlap unit 60 occupies a certain display area of ​​the subpixel, the metal wire formed on the conductive unit 62 may communicate with the boundary conductive layer 72 at only one end. Figure 6 is a plan view of a pixel structure according to another embodiment of the present invention, and as shown in Figure 6, the length of the metal wire formed on the conductive unit 62 is short and smaller than the maximum length perpendicular to the first direction of the subpixel, thereby reducing the impact on the display effect.

[0057] Figure 7 is a plan view of a pixel structure according to another embodiment of the present invention, and as shown in Figure 7, each subpixel may include two cathode overlap units 60, the two cathode overlap units 60 are spaced apart along a first direction, and each cathode overlap unit 60 communicates with the boundary conductive layer 72. This ensures communication between the conductive unit 62 of each subpixel and the boundary conductive layer 72.

[0058] The two cathode overlap units 60 may be symmetrical with respect to a vertical center line along the first direction of the subpixel, making the light-emitting region corresponding to each subpixel divided by the cathode overlap units 60 more uniform and improving the display effect.

[0059] It can be understood that each subpixel may include more cathode overlap units 60 spaced apart along the first direction.

[0060] Figure 8 is a plan view of a pixel structure according to another embodiment of the present invention. In the manufacturing process of the display panel, different product layouts may differ. To ensure that products with different layouts can all achieve good overlap between the subpixel cathode and the boundary conductive layer 72, as shown in Figure 8, each subpixel in the pixel structure includes two cross-shaped cathode overlap units 60. The extension direction of the metal wire formed in the conductive unit 62 of one cathode overlap unit 60 is perpendicular to the first direction, and the extension direction of the metal wire formed in the conductive unit 62 of the other cathode overlap unit 60 is parallel to the first direction. The regions located on both sides of each cathode overlap unit 60 of the subpixel are symmetrical with respect to the cathode overlap unit 60. In this way, it can be ensured that the conductive unit 62 of one cathode overlap unit 60 can overlap the cathode of the subpixel regardless of the layout.

[0061] As shown in Figure 9, each pixel in the pixel structure of the present invention may include multiple cathode overlap units 60 whose horizontal axes intersect, ensuring that products with different layouts can all achieve good overlap between the cathode of the subpixel and the boundary conductive layer 72.

[0062] Furthermore, for each subpixel in Figures 8 and 9, if at least one cathode overlap unit 60 of each pixel is ensured to communicate with the external boundary conductive layer 72, the overlap effect between the cathode of each subpixel and the boundary conductive layer 72 can be ensured.

[0063] In this application, subpixels may be circular, elliptical, diamond-shaped, or other polygonal subpixels, in addition to rhombic, and it should be understood that this application does not specifically limit them.

[0064] The pixel structure and display panel according to the embodiment of the present application include a plurality of subpixels, each subpixel including a cathode overlap unit. The cathode overlap unit includes a spacer, a conductive unit, and a canopy structure installed from bottom to top, and the direction of extension of the metal wires formed on the conductive unit is perpendicular to the first direction (i.e., the deposition direction of the display panel). The spacer is located above the anode of the subpixel, the light-emitting layer of the subpixel covers the anode and the spacer, and the cathode of the subpixel covers the light-emitting layer and overlaps with the conductive unit. A pixel boundary layer is provided between adjacent subpixels, and the pixel boundary layer includes a pixel definition layer, a boundary conductive layer, and a canopy structure installed from bottom to top, and the conductive unit communicates with the boundary conductive layer. In the above proposed technology, since the extension direction of the metal wires formed in the conductive unit is perpendicular to the deposition direction, the extension direction of the overhang structure on the conductive upper surface is also perpendicular to the deposition direction. In other words, in the deposition direction, the shielding of the lower conductive unit by the overhang structure in the cathode overlap unit is minimized. Thus, when the cathode layer is deposited, at the same evaporation angle (limited by the process and not excessively large), the conductive unit of the cathode overlap unit of each subpixel is more likely to overlap with the cathode of each subpixel than the boundary conductive layer in the pixel boundary layer between each subpixel. Furthermore, since the conductive unit of the cathode overlap unit communicates with the boundary conductive layer, that is, compared to the cathode of each subpixel directly overlapping and communicating with the boundary conductive layer, the cathode of each subpixel is more likely to communicate with the boundary conductive layer via the conductive unit of the cathode overlap unit. Therefore, this proposed technology can improve the overlap effect between the cathode of each subpixel and the boundary conductive layer, thereby improving the yield rate of the product.

[0065] In the above embodiments, each embodiment has its own emphasis, and for parts not described or elaborated upon in one embodiment, you can refer to the relevant descriptions in other embodiments.

[0066] Furthermore, the dimensional ratios between each component shown in the drawings are schematic and do not reflect the actual dimensional ratios between each component.

[0067] In this description, the directions or positional relationships indicated by terms such as "center," "vertical," "horizontal," "up," "down," "front," "back," "left," "right," "perpendicular," "horizontal," "top," "bottom," "inside," and "outside" are based on the directions or positional relationships shown in the drawings and are merely for the convenience and simplification of the explanation of the present invention. They do not indicate or imply that a specified device or element has a specific direction or must be configured and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0068] In this description, unless otherwise specifically defined and limited, the terms “attachment,” “connection,” and “connection” should be understood in a broad sense, for example, a fixed connection, a removable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or internal communication between two elements. A person skilled in the art will be able to understand the specific meaning of these terms in this invention from the specific context.

[0069] As used in the specification and appended claims of this application, the term “including” should be understood to indicate the presence of the described features, wholes, steps, operations, elements and / or components, but not to exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or sets thereof. In the description of this application, unless otherwise specified, " / " indicates that the related objects before and after it are in an "or" relationship. For example, A / B can mean A or B. In this application, "and / or" is merely a related relationship that describes the related objects, and there may be three such relationships. For example, A and / or B indicates three cases: A existing alone, A and B existing simultaneously, and B existing alone. A and B may be singular or plural.

[0070] Furthermore, in the description of this application, unless otherwise specified, “plural” means two or more. “At least one of the following” or similar expressions refer to any combination of these terms, including any combination of single or plural terms. For example, at least one of a, b, or c can represent a, b, c, ab, ac, bc, or abc, where a, b, and c may be single or plural.

[0071] Furthermore, in this specification and the attached claims, terms such as "first," "second," and "third" are used to distinguish similar subjects and not to describe a specific order or sequence. It should be understood that the data used in this manner are interchangeable where appropriate so that the embodiments described herein can be carried out in an order other than that illustrated or described herein.

[0072] References such as “one embodiment” or “several embodiments” as described in the specification of this application mean that one or more embodiments of this application include certain features, structures, or properties described in relation to this embodiment. Accordingly, phrases such as “in one embodiment,” “several embodiments,” “several other embodiments,” and “several other embodiments” as described in different parts of this specification do not necessarily refer to the same embodiment, but mean “one or more embodiments, but not all embodiments” unless otherwise specifically emphasized.

[0073] Finally, it should be noted that the above embodiments are merely for illustrating the technical proposal of the present application and do not limit it. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical proposal described in the above embodiments or make equivalent substitutions for some or all of its technical features, and that such modifications or substitutions do not cause the essence of the corresponding technical proposal to deviate from the scope of the technical proposal of each embodiment of the present application. (Other possible items) (Item 1) A pixel structure comprising a plurality of subpixels, wherein each subpixel includes a cathode overlap unit. The cathode overlap unit includes a spacer, a conductive unit, and a canopy structure installed from bottom to top, and the direction in which the metal wires formed on the conductive unit extend is perpendicular to the first direction, which is the deposition direction of the display panel. The spacer is located above the anode of the subpixel, the light-emitting layer of the subpixel covers the anode and the spacer, and the cathode of the subpixel covers the light-emitting layer and overlaps the conductive unit. A pixel boundary layer is provided between adjacent subpixels, and the pixel boundary layer includes a pixel definition layer, a boundary conductive layer, and a canopy structure arranged from bottom to top, and the conductive unit communicates with the boundary conductive layer. A pixel structure characterized by the following features. (Item 2) In a direction perpendicular to the first direction, one end of the metal wire formed in the conductive unit protrudes a target length from the edge of the subpixel. The pixel structure described in item 1, characterized by the features described herein. (Item 3) One end of the metal wire formed in the conductive unit communicates with the boundary conductive layer. The pixel structure described in item 1, characterized by the features described herein. (Item 4) The length of the cathode overlap unit is less than the maximum length of the subpixel in the direction perpendicular to the first direction. The pixel structure described in item 3, characterized by the features described herein. (Item 5) Both ends of the metal wire formed in the conductive unit are in communication with the boundary conductive layer. The pixel structure described in item 1, characterized by the features described herein. (Item 6) There are multiple cathode overlap units, which are arranged at intervals along the first direction, and each cathode overlap unit communicates with the boundary conductive layer. The pixel structure described in item 1, characterized by the features described herein. (Item 7) The regions of the subpixel located on both sides of the cathode overlap unit are symmetrical with respect to the cathode overlap unit. The pixel structure described in item 1, characterized by the features described herein. (Item 8) There are two cathode overlap units, the direction of extension of the metal wire formed on the conductive unit of one cathode overlap unit is perpendicular to the first direction, and the direction of extension of the metal wire formed on the conductive unit of the other cathode overlap unit is parallel to the first direction, and for each cathode overlap unit, the regions of the subpixel located on both sides of the cathode overlap unit are symmetric with respect to the cathode overlap unit. The pixel structure described in item 7, characterized by the features described herein. (Item 9) At least one of the two cathode overlap units communicates with the boundary conductive layer. The pixel structure described in item 8, characterized by the features described above. (Item 10) The cathode overlap unit includes a plurality of intersecting cathode overlap units. The pixel structure described in item 1, characterized by the features described herein. (Item 11) Of the multiple intersecting cathode overlap units, at least one cathode overlap unit communicates with the boundary conductive layer. The pixel structure described in item 10, characterized by the features described herein. (Item 12) The material of the conductive unit is the same as the material of the boundary conductive layer outside the subpixel. The pixel structure described in item 1, characterized by the features described herein. (Item 13) The material of the spacer is the same as the material of the pixel definition layer. The pixel structure described in item 1, characterized by the features described herein. (Item 14) The shape of the subpixel includes at least one of rhombic, circular, elliptical, and diamond-shaped. A pixel structure according to any one of items 1-13, characterized by the features described above. (Item 15) The device comprises a base substrate provided from bottom to top, a drive layer, a packaging layer, and a plurality of pixel structures as described in any one of items 1-14, wherein the pixel structures are located between the drive layer and the packaging layer. A display panel characterized by the following features.

Claims

1. A pixel structure comprising a plurality of subpixels, wherein each subpixel includes a cathode overlap unit. The cathode overlap unit includes a spacer, a conductive unit, and a canopy structure installed from bottom to top, and the direction in which the metal wires formed on the conductive unit extend is perpendicular to the first direction, which is the deposition direction of the display panel. The spacer is located above the anode of the subpixel, the light-emitting layer of the subpixel covers the anode and the spacer, and the cathode of the subpixel covers the light-emitting layer and overlaps the conductive unit. A pixel boundary layer is provided between adjacent subpixels, and the pixel boundary layer includes a pixel definition layer, a boundary conductive layer, and a canopy structure arranged from bottom to top, and the conductive unit communicates with the boundary conductive layer. Pixel structure.

2. In a direction perpendicular to the first direction, one end of the metal wire formed in the conductive unit protrudes from the edge of the subpixel by a target length. The pixel structure according to claim 1.

3. One end of the metal wire formed in the conductive unit communicates with the boundary conductive layer. The pixel structure according to claim 1.

4. The length of the cathode overlap unit is less than the maximum length of the subpixel in the direction perpendicular to the first direction. The pixel structure according to claim 3.

5. Both ends of the metal wire formed in the conductive unit are in communication with the boundary conductive layer. The pixel structure according to claim 1.

6. There are multiple cathode overlap units, which are arranged at intervals along the first direction, and each cathode overlap unit communicates with the boundary conductive layer. The pixel structure according to claim 1.

7. The regions of the subpixel located on both sides of the cathode overlap unit are symmetrical with respect to the cathode overlap unit. The pixel structure according to claim 1.

8. There are two cathode overlap units, the direction of extension of the metal wire formed on the conductive unit of one cathode overlap unit is perpendicular to the first direction, and the direction of extension of the metal wire formed on the conductive unit of the other cathode overlap unit is parallel to the first direction, and for each cathode overlap unit, the regions of the subpixel located on both sides of the cathode overlap unit are symmetric with respect to the cathode overlap unit. The pixel structure according to claim 7.

9. At least one of the two cathode overlap units communicates with the boundary conductive layer The pixel structure according to claim 8.

10. The cathode overlap unit includes a plurality of intersecting cathode overlap units. The pixel structure according to claim 1.

11. Of the multiple intersecting cathode overlap units, at least one cathode overlap unit communicates with the boundary conductive layer. The pixel structure according to claim 10.

12. The material of the conductive unit is the same as the material of the boundary conductive layer outside the subpixel. The pixel structure according to claim 1.

13. The material of the spacer is the same as the material of the pixel definition layer. The pixel structure according to claim 1.

14. The shape of the subpixel includes at least one of rhombic, circular, elliptical, and diamond-shaped. The pixel structure according to any one of claims 1 to 13.

15. The device comprises a base substrate provided from bottom to top, a drive layer, a packaging layer, and a plurality of pixel structures according to any one of claims 1 to 13, wherein the pixel structures are located between the drive layer and the packaging layer. Display panel.