Substrate container system and method for purging substrate containers

Abstract

This paper describes a useful support device for a substrate container used to hold or transport substrates in a clean environment, as well as related systems and methods for using the support device and the substrate container. The substrate container support system comprises a base having a horizontal base surface, a nozzle extending vertically from the base surface, the nozzle being capable of vertical movement relative to the base surface, a pressure sensor adapted to detect the fluid pressure of a fluid passing through the nozzle, and a control system comprising a hardware processor and memory, the control system configured to adjust the vertical position of the nozzle based on the fluid pressure.

Description

Technical Field

[0001] The present disclosure relates to a support device useful with a substrate container for holding or transporting a substrate in a clean environment, and related methods of using the support device and the substrate container.

Background Art

[0002] Microelectronic devices are prepared on semiconductor substrates by a series of precise processing steps, each of which is performed under extremely clean conditions. Between processing steps, the "substrate" on which the microelectronic device is formed may be moved from one processing location to a different processing location.

[0003] To move the substrate between processing steps or between separate processing locations, the substrate is held within a dedicated container designed to prevent the substrate from being damaged and at the same time to shield the substrate from contamination. Exemplary substrate containers may be referred to as "SMIF pods" (Standard Mechanical Interface pods), "FOUPs" (Front Opening Unified Pods), or "FOSBs" (Front Opening Shipping Boxes). In use, these containers surround a space for containing a plurality of semiconductor wafers or other substrates within an atmosphere that can be evacuated (i.e., under reduced pressure) or that can contain a gas different from air, such as an inert gas.

[0004] The substrate container may be in the form of a multifaceted container body (e.g., “shell”) that defines the interior of the container. The container body includes an opening on one side that allows multiple substrates to be inserted into or removed from the interior. The exemplary container also includes a removable door fitted to cover the opening and enclose the interior by an airtight seal. The container also includes one or more gas ports (one or more inlets or optional outlets) passing through the bottom of the container to allow control of the atmosphere inside the container by introducing and removing gas from the interior (e.g., “purging”). The gas ports are aligned with nozzles of a separate device that may be called a “substrate container support” (or “support plate” or “purging plate”) of the load port device. During the step of purging the interior atmosphere of the substrate container, the container is supported by the substrate container support and the nozzles engage with one or more gas ports of the substrate container. The gas flows into the interior of the container through the nozzles.

[0005] As microelectronic devices become smaller and the number of microelectronic features per unit area of ​​semiconductor devices increases, devices become more sensitive to particles and environmental contaminants. As microelectronic devices become smaller, even smaller and smaller contaminants, and even molecular-sized contaminants, can disrupt their performance. Consequently, continuously improved control of particle contamination is required throughout all stages of semiconductor substrate processing, including during substrate transfer between process steps.

[0006] To maintain a high level of cleanliness and avoid contamination of substrates during handling, there is a need for continuously improving systems and methods to control the gaseous environment within substrate containers. [Overview of the project]

[0007] During the use of a substrate container, for various reasons, the gaseous atmosphere inside the container may be replaced with a new gaseous atmosphere, i.e., "purged." For example, clean, dry air or a very pure, clean dry gas such as nitrogen (called a "purge gas") may be supplied to the inside of the container to replace (i.e., replace) the previous atmosphere.

[0008] To enable this, the container may include a gas port (i.e., an opening or "inlet") through which gas can be delivered into the interior of the container. During the purging step, the container is supported by a substrate container support which includes a nozzle that supplies purge gas into the container through the gas port at the bottom of the container. The gas flows into the interior of the container through the nozzle.

[0009] The methods and equipment used to fill the container with purge gas during the purge step can affect the yield of substrates held by the container. The seal formed between the nozzle of the substrate container support and the purge port of the substrate container can affect the efficiency of filling the container with purge gas. More specifically, an improved seal with no leaks between the nozzle and the purge port provides the best flow of purge gas entering the container through the nozzle. The location of the nozzle engaging with the purge port, including the height of the nozzle, affects the seal and the pressure of the gas flowing into the container through the nozzle. A better seal results in higher flow pressure ("back pressure") and a more efficient step of filling the container with purge gas.

[0010] This specification identifies a substrate container support, a system comprising the substrate container support and the substrate container, and related methods useful for purging a substrate container. The system includes an adjustable nozzle that can be moved vertically to adjust the position of the nozzle relative to a port of the substrate container in order to produce an effective seal, for example to reduce or eliminate leakage from the seal, and produces a tight seal that generates a high-pressure gas flowing into the substrate container through the nozzle.

[0011] In one embodiment, the present invention relates to a substrate container support system. The system includes a base having a horizontal base surface, a nozzle extending vertically from the base surface, wherein the nozzle is capable of vertical movement relative to the base surface, a pressure sensor adapted to detect the fluid pressure of a fluid passing through the nozzle, and a control system comprising a hardware processor and memory, wherein the control system is configured to adjust the vertical position of the nozzle based on the fluid pressure.

[0012] In another embodiment, the present invention relates to a method for moving a gaseous fluid into the interior of a substrate container supported by a substrate container support system. The substrate container support system includes a base having a horizontal base surface, a nozzle extending vertically from the base surface, wherein the nozzle is capable of vertical movement relative to the base surface, a pressure sensor adapted to measure the pressure of a fluid passing through the nozzle, and a control system comprising a hardware processor and memory, wherein the control system is configured to adjust the vertical position of the nozzle based on the fluid pressure. The substrate container is supported by the base and includes an inlet port, the inlet port having a surface that engages with the nozzle to form a seal between the nozzle and the inlet port. The method includes moving the nozzle to a vertical location, determined by the fluid pressure, where the nozzle forms a desired seal with the inlet port. [Brief explanation of the drawing]

[0013] [Figure 1] This is a perspective view of an exemplary wafer container being described. [Figure 2] The system being described is shown. [Figure 3A] This is a top perspective view of a portion of the substrate container support being described. [Figure 3B] This is a top perspective view of a portion of the substrate container support being described, and a detailed view (inset) of the nozzle and nozzle adjustment device. [Figure 3C] This is a bottom view of a portion of the substrate container support being described. [Modes for carrying out the invention]

[0014] All diagrams are schematic and not to scale.

[0015] This disclosure describes useful support devices (e.g., "substrate container supports," "support plates," or "load ports," and associated equipment) along with substrate containers (sometimes referred to as "substrate carriers" or "wafer containers") used for holding or transporting substrates (e.g., semiconductor wafers) in a clean environment, as well as related methods for using the support devices and substrate containers.

[0016] The substrate container includes a container body having an interior, an opening on one side of the body for accessing the interior, and a door fitted to cover and seal the opening. The container also includes one or more gas ports, including at least one inlet port ("inlet" or "inlet port") and one or more optional outlet ports ("outlet") useful for supplying gas (e.g., "purge gas") into the interior of the container.

[0017] The container may be used as a component of a system (e.g., a “substrate container system”) which includes a container support device and other components such as a control system and a source of raw materials (purge gas) used with the substrate container to handle the substrate in a clean environment.

[0018] The substrate container support includes a support base ("base") having a horizontal base surface, and at least one movable nozzle extending vertically from the surface of the base and engaging with at least one inlet port of the container while the container is supported by the substrate container support. During the purging step, the container is supported by the substrate container support, the nozzle engages with the inlet port, and a purge gas is supplied to the container through the nozzle to fill the container with the purge gas and replace the previous gaseous atmosphere.

[0019] The methods and equipment used to distribute purge gas into the vessel during the purge step can affect the yield of substrates held by the vessel. The location (height) of the nozzle of the substrate vessel support relative to the inlet port (or outlet port) of the substrate vessel, and the seal formed between the nozzle and the inlet port, can alter the effectiveness or efficiency of the purge step in supplying purge gas into the vessel. More specifically, an improved seal with minimal leakage between the nozzle and the inlet port provides an improved flow of purge gas entering the vessel through the nozzle. The location of the nozzle engaging with the purge port, including the nozzle height, affects the seal between the nozzle and the inlet port, and the pressure and flow rate of the purge gas flowing into the vessel through the nozzle. A more secure seal results in a higher flow pressure ("back pressure") of purge gas entering the vessel through the nozzle, and a more efficient step in filling the vessel with purge gas.

[0020] Accordingly, this specification describes systems and methods that may be used to generate a high-quality, tight (substantially leak-proof) seal between a nozzle and one or more ports of a vessel during a purging step. An exemplary system includes an adjustable nozzle that can be moved perpendicularly to the base of a substrate vessel support and perpendicularly to one or more ports of the substrate vessel while the vessel is supported by the substrate vessel support. While the vessel is supported by the substrate vessel support, the nozzle can be moved perpendicularly to the ports, and the quality of the seal can be evaluated to identify the nozzle location where a desired (e.g., optimal) seal will occur.

[0021] In a preferred example, the quality of a seal can be assessed by measuring the gas pressure within the system at a location that reflects the pressure at which the gas flows through the nozzle into the container. For example, the gas pressure can be measured at (inside) the nozzle or in a conduit connected to the nozzle. Based on the measured pressure, the nozzle position can be adjusted, and the height of the nozzle relative to the base of the substrate container support may be changed to provide a high-pressure flow of gas through the nozzle, which indicates a high-quality seal.

[0022] The wafer container includes a polyhedral container body (sometimes referred to as a “shell”) that defines an interior of the container adapted to house and support one or more semiconductor wafers. The body includes an opening (a “container opening” or an “opening”) that enables access to the interior of the container at one side of the container body. The container also includes a door adapted to cover the opening and form a seal across the opening between the interior of the container and the exterior of the container. The substrate container can typically include at least one inlet port adapted to enable a gas, such as a “purge gas,” to be delivered into the interior of the container, and at least one (optional) outlet port that enables gas from the interior of the container to flow out and pass to the exterior. Optionally, the container may also include one or more purge gas delivery devices, sometimes referred to as “diffusers,” connected to the inlet port. The diffuser can be used to distribute the purge gas throughout the interior of the container, for example, by supplying the purge gas along the length of the diffuser using a diffuser positioned vertically along the height of the interior of the container.

[0023] The substrate container is adapted to house a plurality of substrates. A “substrate” can be any of a variety of different generally flat structures that are known to be of a type that can be housed or transported within a substrate container device to enable safe and clean handling and transportation of the substrate without causing damage or contamination to the substrate. Exemplary substrates include semiconductor wafers, precursors thereof, derivatives thereof, and in-process versions of any of these, including in-process semiconductor wafers, in-process microelectronic devices, EUV (extreme ultraviolet) reticles, panels, or other structures known to be transported within or housed within a carrier described herein, all of which can generally be referred to as “wafers” or “substrates.”

[0024] The purge gas can be a dry gas such as clean dry air, an oxygen gas, or an inert gas such as nitrogen gas. As used herein, the term "nitrogen gas" refers to pure nitrogen gas containing at least 99.9 or 99.99 percent (mol) nitrogen and less than 0.01 or less than 0.001 percent (mol) moisture. The term "clean dry air" refers to a gas composition that can be considered clean dry air pure and free of moisture sufficient for use in commercial steps of processing semiconductor or microelectronic substrates, which includes a gas containing about 78 mole percent nitrogen (N2), about 21 mole percent oxygen (O2), and less than 0.01 or less than 0.001 percent (mol) moisture. An example of a clean dry air product is the Ultra High Purity Ultra Clean Dry Air (XCDA®) available from Entegris Inc., Billerica, Massachusetts. The term "oxygen gas" refers to pure oxygen gas containing at least 99.9 or 99.99 percent (mol) oxygen and less than 0.01 or less than 0.001 percent (mol) moisture.

[0025] FIG. 1 shows a substrate container that can be used as a component of the system to be described. The substrate container 1 includes a container body (e.g., a "shell") 2, a front opening 4, an interior 8, a port 10 in the form of an opening passing through the bottom wall of the shell 2, and slots 12 in opposing side walls. The slots 12 are adapted to engage and support the edges of a plurality of substrates (not shown) when the substrates are held within the interior 8. The substrate container 1 also includes a door 6 that can be used to cover and seal the interior 8 by closing the opening 4.

[0026] The substrate container 1 can be used to transport, house, or store semiconductor wafers (substrates) being processed by a series of processing steps (i.e., wafers that are "in process") between those series of steps. The substrate container 1 is, as shown, a front opening container, e.g., a "front opening unified pod" or "FOUP".

[0027] The container body 2 defines an interior 8 within the container 1, and an opening 4 is provided on one side of the container body 2 to allow access to the interior 8. The opening side 4 allows multiple wafers to be placed inside the interior 8 of the container body 2 while being supported in slots 12. A door 6 may be used to cover the opening 4. When the opening 4 is covered by the door 6, a seal is formed between the door and the container by a gasket (not shown). The sealed interior of the container 1 is a microenvironment protected from external contaminants of the container 1.

[0028] The substrate container described may be used as a “substrate container system” comprising, for example, a substrate container and one or more accessory devices that can engage with the substrate container during use, such as during steps of opening or closing the substrate container, inserting a substrate into or removing a substrate from the container, or adding a gaseous atmosphere to the container. As described herein, the system includes a substrate container support that supports the container from the bottom of the container and includes one or more nozzles for supplying purge gas into the container through an inlet port of the container. The substrate container support may be incorporated into a device called a “load port,” and may also include one or more sources of purge gas, a purge gas control unit (e.g., a valve) which may include a flow control device for controlling the volume or amount of the purge gas flow, a temperature control device for controlling the temperature of the purge gas, a mixing control unit for combining two flows of different purge gases into a single purge gas mixture, a measuring system for measuring or monitoring the state of the container (e.g., temperature, pressure, or humidity inside the container or the atmosphere), and a control system which communicates with the substrate container to affect or control the state inside the container, or to control the state (e.g., temperature) or flow rate of the purge gas.

[0029] The substrate container support includes one or more nozzles that engage with one or more input ports of the substrate container when the container is supported by the substrate container support. The substrate container support also includes or cooperates with a source of purge gas and is adapted to generate a flow of purge gas that flows through the nozzles to supply the purge gas into the container while the container is supported by the substrate container support. Also, as described, one or more nozzles can be moved perpendicular to the ports to adjust the effectiveness of the seal between the nozzles and the ports. In a preferred example, the effectiveness of the seal can be evaluated by the gas pressure of the gas flowing through the nozzles. Based on the measured pressure of the purge gas, the position of the nozzles can be adjusted, and the height of the nozzles relative to the base of the substrate container support and the ports may be changed to provide a high-pressure flow of gas through the nozzles.

[0030] The process of adjusting the nozzle height relative to the port to produce a desired seal between the nozzle and the port may include a control system adapted to receive input from a system that includes a measured pressure value, particularly one that reflects the pressure of the gas passing through the nozzle and the seal. With respect to a range of pressure values ​​that indicate the quality of the seal between a particular nozzle and a particular port, relatively high measured pressures indicate a better seal, and relatively low pressures indicate a lower quality seal, which can be improved by better positioning of the nozzle relative to the port.

[0031] The gas pressure may be measured at any location useful for evaluating the quality of the seal between the nozzle and the port. As used herein, the pressure of the gas flowing through the nozzle may be measured at a location effective for measuring the quality of the seal between the nozzle and the port of the vessel, such as within the nozzle, adjacent to the nozzle (upstream or downstream), upstream of the nozzle and within the conduit between the gas source and the nozzle, or within the substrate vessel. The nozzle height may be adjusted in response to one or a series of pressure readings performed while the gas flows through the nozzle while engaging with the port of the substrate vessel to form a seal. The height of one or more nozzles may be adjusted by any useful device or method step, preferably using an electronically controlled height adjustment device (or "adjustment device") such as a hydraulic device, a pneumatic device, or a mechanical device that may include a stepping motor.

[0032] An exemplary control system may monitor and control the system using at least a computerized hardware processor having a memory device operably connected to the processor. The memory can store instructions executed by the processor. According to various exemplary systems, the control system may include, as the computer processor, any form of microprocessor, such as a process logic controller (PLC controller) embodied in an application-specific integrated circuit (ASIC). The control system may also include a pressure sensor that measures a pressure value reflecting the pressure of the gas flowing into the vessel through the nozzle, and may communicate with one or more electronically controlled height adjustment devices that can be used to move the nozzle vertically up and down in response to the measured pressure value.

[0033] An exemplary system is shown in Figure 2. System 100 includes a substrate container 102 that houses a plurality of substrates 104 held within an interior 106. The container 102 includes an inlet port 110 that allows gas to flow into the interior 106, and an optional outlet port 116 that allows the gas to flow out of the container 102 from the interior 106 as exhaust gas 130. The container 102 is supported by a substrate container support 140 that includes an upper plate (also known as the “base”) having an upper horizontal plane 142. At least one nozzle 112 extends through the horizontal plane 142 to engage with the inlet port 110 of the container 102. System 100 also includes a purge gas source 120 that may be a source of any useful purge gas, such as nitrogen gas or clean dry air (e.g., “XCDA”). The flow meter and valve 124 control the flow of purge gas from the source 120 through the conduit 122, through the nozzle 112, and through the inlet 110 into the interior 106. The vessel 102 also includes an opening (not shown) through one side of the vessel that allows access to the interior 106, and a door (not shown) which may be selectively positioned above the opening or selectively removed from the opening.

[0034] The nozzle 112 is adjustable, i.e., it is vertically movable by the use of an adjustment device (not shown) to produce an effective seal between the nozzle 112 and the port 110. The system 100 also includes a pressure gauge 114 and a control device (e.g., a microprocessor) 130 that communicates with the pressure gauge 114, as well as an adjustment device adapted to adjust the vertical position of the nozzle 112 relative to the port 110 to produce an effective seal. The control device 130 may also communicate with other devices, monitors, sensors, etc. of the system 100, such as a flow meter 124 (illustrated) and an optional sensor (not illustrated) in the vessel 102.

[0035] Referring to Figures 3A and 3B, a portion of the substrate container support 140 is shown in further detail. As shown, the substrate container support 140 includes a plate (or "base") 146 having a top surface 142. Alignment pins 144 extend perpendicularly from the surface 142 and engage with an alignment surface (e.g., aperture) of a container (not shown) positioned to be supported by the substrate container support 140. Four nozzles 112 extend above the top surface 142. At least one of the nozzles 122 is an inlet nozzle that engages with the inlet port of the container to supply gas from a gas source (not shown) through the nozzle into the interior of the container. The remaining three nozzles may be inlet or outlet nozzles. Each nozzle includes a top surface 168, e.g., a solid or flexible grommet, which is adapted to engage with the inlet (or outlet) port of the container (e.g., 120) to form a seal.

[0036] The vertical position of the nozzles 112 can be adjusted using adjustment devices 150 (see Figure 3B) that engage with each nozzle 112 and are aligned below the plate 146. As shown, the system includes one adjustment device 150 for each nozzle 112, allowing the vertical position of each nozzle 112 to be adjusted independently of the others. In other exemplary systems, a single adjustment device 150 may be connected to two or more nozzles to adjust two or more nozzles simultaneously.

[0037] In Figure 3B, the inset shows an example of a portion of an adjustment device 150 useful for vertically adjusting the height of the nozzle 112. The adjustment device 150 includes a body 160, a threaded outer surface 166, a flange 164, and a threaded outer fitting 162. The threaded outer fitting 162, for example in the form of a nut, includes a threaded inner surface that engages with the threaded outer surface 166 of the body 160. The threaded outer fitting 162 can be held in a stationary position perpendicular to the flange 164 such that rotation of the threaded outer fitting 162 around the body 160 moves the body 160, valve 112, and surface 168 upward or downward perpendicular to the flange 164 and surface 142 depending on the direction of rotation of the threaded outer fitting 162.

[0038] During use, the main body 160 may pass through an opening in the plate 146 and be fixed to the plate 146 at the flange 164. The container 120 is positioned above the top surface 142 and rests in contact with one or more of the alignment pins 144, the nozzle 112, or the surface 142, and the nozzle 112 and surface 168 are aligned to engage with the port of the container 120. The vertical position of the nozzle 112 and the quality of the seal (degree of airtightness of the seal) between the nozzle 112 and the port of the container (on surface 168) can be monitored by monitoring the pressure in the system, which indicates the pressure of the gas in the nozzle 112 as the gas flows through the nozzle 112, and whether or not there is leakage in the seal. For a given valve and port, higher pressure indicates a tighter seal, and lower pressure indicates a less tighter seal. According to the method described, generally, the vertical position of the nozzle may be adjusted up or down to achieve a high pressure or maximum pressure in the nozzle 112, which means a desired seal in which there is substantially no gas leakage in the seal.

[0039] Figure 3C shows a detailed bottom view of an exemplary substrate container support 140. Below the plate 146 is the lower part of the nozzle 112, which includes a control system 130, a stepping motor 152, and a threaded outer coupling 162 engaged with the lower part of the body 160. To adjust the vertical position of one or more nozzles 112, the control system 130 communicates with the stepping motor 152, which is connected to the threaded outer coupling 162 by a belt 154, to rotate the outer coupling 162 around the threaded outer surface 166 of the outer body 160 of the nozzle 112.

[0040] This specification provides examples, and the figures show an example of a mechanical adjustment device including a screw engagement for controlling the vertical movement of a nozzle, but other mechanical engagements, such as gears or other mechanical engagements that do not use screw engagements, may also be used. Further examples of useful adjustment devices may be pneumatic or hydraulic. A pneumatic adjustment device moves a valve using a pressurized gas (e.g., air) that can be added to or removed from the space in contact with the movable valve. A hydraulic adjustment device moves a valve using a pressurized liquid that can be added to or removed from the space in contact with the movable valve.

[0041] The system may be used to generate a desired high-quality fluid-tight seal between a nozzle and one or more ports of a vessel during a purging step. In an exemplary method, a substrate vessel is lowered vertically from above onto a substrate vessel support. Alignment pins on the support engage with alignment surfaces (e.g., apertures) positioned at the bottom of the vessel to set the horizontal orientation (lateral, anterior-posterior, and lateral along the length and width) of the vessel relative to the horizontal top surface of the support. The nozzles on the support are aligned with the ports of the vessel. The vessel may be supported by the top surface of the substrate vessel, by one or more alignment pins engaging with the alignment surfaces of the vessel, or by the top surfaces of one or more nozzles in contact with the ports of the vessel. Generally, gas is flowed through one or more nozzles, and a pressure indicating the pressure of the gas flowing through one or more nozzles is measured. The vertical position of one or more nozzles may be adjusted based on the measured pressure until the desired high pressure is achieved and a tight seal is demonstrated.

[0042] The system can determine the final position of the nozzles used to perform the purge step by various criteria. For example, the system may set the final nozzle position based on a predetermined "target" pressure for a specific set of nozzles and vessels. For instance, the system may raise or lower the nozzle position to achieve the expected target pressure. Alternatively, the system may set the final nozzle position by identifying a constant (plateau) or maximum pressure achieved by the system. During the purge step, the system may continuously monitor the pressure through the nozzles and optionally adjust the vertical position of the nozzles during the purge step.

[0043] According to the exemplary steps, the substrate container is lowered vertically from above onto the substrate container support. The container and support are aligned laterally using the support's alignment pins and the opposing alignment surfaces of the container. Gas is flowed into the container through nozzles. Movable nozzles on the substrate container support are raised to engage with ports on the substrate container, lifting the container to a position where it is supported by one or more nozzles without being supported by the alignment pins. This position where the nozzles support the container may produce the maximum pressure reading of the gas flow ("target pressure") and a nozzle position that does not allow for the best or optimal seal, e.g., gas leakage through the seal. The vertical position of the nozzles can be lowered, and the pressure of the gas flowing through the nozzles can be measured, for example, continuously, preferably at a location within the nozzle or slightly upstream of the nozzle. With the pressure being monitored, one or more nozzles (individually or together) may be lowered to the lowest position where the pressure of the gas flow remains at or near the target (e.g., maximum) pressure. Preferably, but not necessarily, the nozzle can be lowered to a position where the alignment pin contacts the alignment surface of the container and supports the container, while the pressure remains at the maximum or target pressure and the purge step can be performed.

Claims

1. A base having a horizontal base surface, A nozzle extending vertically from the base surface, wherein the nozzle is capable of vertical movement relative to the base surface, A pressure sensor adapted to detect the fluid pressure of the fluid passing through the nozzle, A control system comprising a hardware processor and memory, wherein the control system is configured to adjust the vertical position of the nozzle based on the fluid pressure, A substrate container support system equipped with the following features.

2. The system according to claim 1, comprising a gas supply source and a conduit for supplying gas from the gas supply source to the nozzle, wherein the pressure sensor is positioned in the conduit to detect the fluid pressure of the gas in the conduit as the gas flows through the conduit and the nozzle.

3. The nozzle comprises a nozzle body having a threaded surface, The system comprises a threaded joint that engages with the threaded surface, The nozzle can be moved vertically by rotating the threaded joint with respect to the threaded surface of the nozzle body. The system according to claim 1 or 2.

4. The system according to any one of claims 1 to 3, wherein the control system includes a pressurized fluid that engages with the nozzle to control the vertical position of the nozzle.

5. The system according to claim 1, comprising two nozzles, including a first nozzle extending perpendicularly from the base surface and movable perpendicularly to the base surface, and a second nozzle extending perpendicularly from the base surface and movable perpendicularly to the base surface, wherein at least one of the nozzles is an input nozzle adapted to allow gas to flow from a gas supply source into the substrate container.

6. The system according to claim 5, wherein the control system comprises adjustment means for moving the first nozzle and the second nozzle vertically, and the adjustment means is adapted to move the nozzles vertically.

7. The system according to claim 5, wherein the control system comprises adjusting means for moving the first nozzle and the second nozzle vertically, and the adjusting means is adapted to move the first nozzle and the second nozzle together vertically.

8. The system according to claim 5, wherein the control system comprises adjusting means for moving the first nozzle and the second nozzle vertically, and the adjusting means is adapted to move the first nozzle vertically and move the second nozzle independently.

9. The system according to any one of claims 1 to 8, comprising a substrate container supported by a substrate container support, wherein the substrate container comprises an inlet port, and the inlet port comprises a surface that engages with the nozzle to form a seal between the nozzle and the inlet port.

10. The system according to claim 9, wherein the base comprises a plurality of alignment pins extending perpendicularly from the base, and each alignment pin contacts the alignment surface of the substrate container to align the substrate container with the base.

11. The system according to claim 9 or 10, wherein the control system is adapted to move the nozzle to a vertical position in which the nozzle forms a seal with a fluid passage, as determined by the maximum fluid pressure.

12. A method for moving a gaseous fluid into the interior of a substrate container supported by a substrate container support system, wherein the substrate container support system is A base having a horizontal base surface, A nozzle extending vertically from the base surface, wherein the nozzle is capable of vertical movement relative to the base surface, A pressure sensor adapted to measure the pressure of the fluid passing through the nozzle, A control system comprising a hardware processor and memory, wherein the control system is configured to adjust the vertical position of the nozzle based on fluid pressure, Equipped with, The substrate container is supported by the base, and the substrate container has an inlet port, and the inlet port has a surface that engages with the nozzle to form a seal between the nozzle and the inlet port, The method includes moving the nozzle to a vertical position where the nozzle forms a desired seal with the inlet port, as determined by the fluid pressure. method.

13. To form a fluid-tight seal, The nozzle is moved vertically to engage with the fluid passage surface, The fluid is passed through the nozzle, To measure the fluid pressure inside the nozzle, The vertical position of the nozzle is adjusted to generate a desired fluid pressure, The method according to claim 12, including the method described in claim 12.

14. To form a fluid-tight seal, Moving the nozzle vertically to engage the nozzle with the inlet port, To measure the maximum pressure inside the nozzle, The purging step is performed while maintaining the vertical position of the nozzle at the maximum pressure, The method according to claim 12 or 13, including the method described in claim 12 or 13.

15. The base comprises a plurality of alignment pins extending vertically from the base, each alignment pin having a tip at its end, each tip contacting the bottom surface of the substrate container to support the substrate container. The method according to any one of claims 12 to 14.

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