A method for joining a three-layer polymer adhesive film, a patterned substrate, a multilayer conductor, and a method for forming a multilayer conductor.

Abstract

A three-layer polymer film comprising a core layer and first and second outer layers facing the surface of the core layer. The composition of each layer is as described herein, wherein the first and second outer layers each independently contain a fluoropolymer having a melting temperature at least 15°C lower than that of the core layer. The film may be useful in the preparation of multilayer conductors and magnetic self-resonant structures.

Description

Technical Field

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 458,207, filed on April 10, 2023, the content of which is hereby incorporated by reference in its entirety.

[0002] This disclosure generally relates to three-layer polymer adhesive films and methods of using them, particularly methods of bonding patterned substrates.

Background Art

[0003] Inductive wireless power transfer provides a method of power supply and charging for mobile electronic devices such as smartphones. For example, a method that is inexpensive and allows for high-volume production (high volume method) is desirable for this technology. The technology enables power supply and charging for high-power products including electric vehicles, forklifts, material handling equipment, buses, or automated guided vehicles.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Existing methods for enabling inductive wireless power transfer can use magnetic self-resonant structures. These structures can include a plurality of conductors that are patterned and joined to each other, maintaining a constant z-axis distance between each series of conductors. Due to the thickness of the conductors and the required z-axis space between them, it becomes difficult to join the conductors to each other.

[0005] Therefore, it is desirable to provide a method of joining conductors that can solve the above technical problems. It is particularly advantageous to provide a joined multi-layer conductor having a predetermined and constant z-axis space between adjacent conductors. These structures may be particularly suitable for use as magnetic self-resonant structures for inductive wireless power transfer.

Means for Solving the Problems

[0006] The three-layer polymer adhesive film comprises a core layer containing polytetrafluoroethylene, a perfluoroalkoxy polymer, or a fluorinated ethylene propylene polymer, a first outer layer on the first surface of the core layer, and a second outer layer on the second surface of the core layer located opposite the first outer layer, wherein the first outer layer and the second outer layer each independently contain a fluoropolymer having a melting temperature at least 15°C lower than the melting temperature of the core layer.

[0007] A method for joining patterned substrates includes the steps of: bringing a first patterned substrate into contact with a film, wherein the pattern surface of the first patterned substrate is in contact with a first outer layer of the film; bringing a second patterned substrate into contact with the film on the side opposite to the first patterned substrate, wherein the pattern surface of the second patterned substrate is in contact with a second outer layer of the film; and laminating the first patterned substrate, the film, and the second patterned substrate to provide a bonding stack that is located between the first and second patterned substrates, in contact with the respective pattern surfaces of the first and second patterned substrates, and includes a polymer core layer containing polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer, wherein the voids in the respective pattern mechanisms of the first and second patterned substrates are filled with second polymer components derived from the first and second outer layers of the film.

[0008] The multilayer conductor comprises a first patterned conductor having a patterned surface, a second patterned conductor having a patterned surface, a polymer adhesive layer located between the first and second patterned conductors and in contact with the respective patterned surfaces of the first and second patterned conductors, comprising polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer, wherein the second polymer component comprises a fluoropolymer having a melting temperature at least 15°C lower than the melting temperature of the polymer core layer, the second polymer component is in contact with the first patterned conductor and the first side of the polymer core layer and is located between the second patterned conductor and the second side of the polymer core layer, and the voids in the respective pattern mechanisms of the first and second patterned conductors are filled with the second polymer component.

[0009] A method for forming a multilayer conductor is a step of providing a first layer having a first conductor joined to a first side of a first dielectric layer and a second conductor joined to a second side of the first dielectric layer, wherein each of the first and second conductors has a plurality of pattern conductor mechanisms located on the side facing the dielectric layer, where the first side of the dielectric layer faces the second side of the dielectric layer and defines a plurality of voids on the first and second conductors; a step of providing a second layer having a third conductor joined to a first side of a second dielectric layer and a fourth conductor joined to a second side of the second dielectric layer, wherein the first side of the second dielectric layer faces the second side of the second dielectric layer and is located on the side facing the second dielectric layer, where the plurality of pattern conductor mechanisms on the third and fourth conductors The process includes: a step in which each of the third and fourth conductors has a plurality of pattern conductor mechanisms that define a number of voids; a step in which the first layer and the first side of the first three-layer polymer film come into contact; a step in which the second layer and the second side of the first film come into contact, wherein the first side faces the second side of the first film, the pattern conductor mechanism of the first conductor comes into contact with the first outer layer of the first film, and the pattern conductor mechanism of the third conductor comes into contact with the second outer layer of the first film; and a step in which the first layer, the first film, and the second layer are laminated, wherein the voids in the respective pattern mechanisms of the first and third conductors are filled with polymer components derived from the first and second outer layers of the first film.

[0010] The features described above and other features are illustrated in the following diagrams and detailed explanations. [Brief explanation of the drawing]

[0011] The following diagrams illustrate exemplary embodiments, with similar components numbered similarly. [Figure 1] Figure 1 is an illustration of a cross-sectional view of a three-layer polymer film according to one aspect of the present disclosure. [Figure 2] Figure 2 shows cross-sectional views of the first pattern substrate, the three-layer polymer film, and the second pattern substrate before lamination. [Figure 3] Figure 3 is an illustration of a cross-sectional view of a bonding stack according to one aspect of the present disclosure. [Figure 4] Figure 4 is a cross-sectional image of a three-layer polymer film and a multi-pattern conductor bonded to each other. [Figure 5] Figure 5 is a high-magnification image of the cross-section of a multilayer patterned conductor. [Modes for carrying out the invention]

[0012] Conventional bonding materials are typically single-layer materials, optionally containing reinforcing materials. These materials can bond conductors by being injected and filled into structured conductors. Controlling the final layer thickness between structured conductor layers is difficult or impossible. Furthermore, due to the high fluidity of conventional bonding materials, excess bonding material can be extruded from multilayer structures without providing a consistent thickness between conductor layers.

[0013] The inventors unexpectedly discovered that the above technical problems for producing bonded multilayer conductors can be solved by using a specific three-layer polymeric film. One of the advantageous features is that the specific three-layer polymeric film described herein enables the bonding of patterned conductors, where the spacing between each conductor layer can be controlled.

[0014] Accordingly, one aspect of the present disclosure is a three-layer polymer film, which for brevity will also be described herein as a three-layer polymer adhesive film, a polymer film, and a film. An example of a three-layer polymer film is shown in Figure 1. As shown in Figure 1, the three-layer polymer film (100) includes a core layer (101), a first outer layer (102) on a first surface of the core layer, and a second outer layer (103) on a second surface of the core layer, opposite the first outer layer.

[0015] The inventors have found that careful selection of materials used in each layer enables efficient bonding of patterned conductors. The three-layer polymer film may be a freestanding three-layer polymer film. As used herein, the term “freestanding three-layer polymer film” refers to a film that is not adhered to or supported by any other layer, such as an underlying substrate. In one embodiment, the freestanding three-layer polymer film is a self-supporting film that can be mechanically manipulated or moved without the need to adhere or attach a substrate (or other supporting layer) to the film. Thus, in one embodiment, the freestanding three-layer polymer film of this disclosure refers to individual films that do not contain any other supporting layers. In some embodiments, the freestanding three-layer polymer film may consist of a core layer, a first outer layer, and a second outer layer. The first and second outer layers may each be directly above each surface of the core layer. In other words, in one embodiment, there is no layer between the first outer layer and the core layer, or between the second outer layer and the core layer.

[0016] The core layer contains polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer.

[0017] In one embodiment, the core layer contains polytetrafluoroethylene (PTFE). PTFE is a fluorinated polymer having CAS registry number 9002-84-0. PTFE is a polymer of formula (CF2CF2) n- repeating units. PTFE can be prepared by any suitable method, such as polymerization by dispersion or emulsion polymerization process, and is free from aggregation, irradiation, or thermal degradation. In one aspect, PTFE may include low molecular weight PTFE. PTFE is commercially available, for example, from Saint-Gobain.

[0018] In one aspect, the core layer may include a perfluoroalkoxy (PFA) polymer. PFA is a fluorinated copolymer containing structural -((C2F4) n -(C2F3OR) m - repeating units, where R is a perfluorinated C 1-6 alkyl group such as CF3. Exemplary PFA polymers are available from Saint-Gobain.

[0019] In one aspect, the core layer includes a fluorinated ethylene propylene (FEP) polymer. FEP is a fluorinated copolymer containing structural -(CF2CF2) n -(CF2CF(CF3)) m - repeating units. Exemplary FEP polymers are available from Saint-Gobain.

[0020] The core layer may comprise, may consist essentially of, or may consist of polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer. In one aspect, no other polymer components are present in the core layer.

[0021] The core layer may optionally further contain a reinforcing agent. The reinforcing filler may typically contain any reinforcing filler. In one aspect, the reinforcing filler may have a high aspect ratio (e.g., an aspect ratio greater than 1:1, or greater than 5:1, or greater than 10:1, or greater than 20:1, or greater than 40:1). For example, the reinforcing filler may include nanofibers or nanoplatelets. Preferred reinforcing agents are non-conductive. Non-conductive particles are defined as particles having a resistivity greater than 1×10 8 ohms. In one aspect, the conductive filler may be excluded from the core layer.

[0022] Exemplary reinforcing fillers may include, for example, mica, quartz, glass, calcium silicate, aluminum silicate, zirconium silicate, aluminum silicates, titanium dioxide, barium titanate, calcium carbonate, calcium sulfate, ferric oxide, lithium aluminum silicate, silicon carbide, magnesium silicate, zirconium oxide, or combinations thereof. The reinforcing filler may optionally be surface-treated to improve adhesion and dispersibility with the core layer.

[0023] In one embodiment, the reinforcing filler may preferably be a fiber-reinforcing filler, such as glass fiber. Glass fibers may include E, A, C, ECR, R, S, D, or NE glass. The reinforcing filler may be supplied in the form of monofilament or multifilament fibers and may be used alone or in combination with other types of fibers, such as co-weaving, core / sheath, side-by-side, orange-type, or matrix and fibril structures, or by other methods known to those skilled in the art in the field of fiber production. Fiber fillers may be supplied in the form of woven fibrous reinforcement, such as rovings, degree fabrics, continuous strand mats, chopped strand mats, tissue, paper, and felt. In one embodiment, the reinforcing filler, if present, may include glass fiber.

[0024] If present, the reinforcing filler may be present in the core layer in amounts exceeding 4 to 20 mass percent, for example, based on 0 to 20 mass percent, or based on the total mass of the core layer.

[0025] In one embodiment, the core layer may have a thickness of 1 to 25 micrometers, or 1 to 15 micrometers, or 1 to 10 micrometers, or 2 to 10 micrometers. In embodiments where a three-layer polymer film is used to bond patterned conductors, the core layer may have a thickness of no more than 10% of the dielectric layer, while maintaining a desired spacing between the bonded conductors. Thus, using the procedure specified herein, the thickness of the core layer may be selected based on the thickness of the dielectric layer of the conductor stack.

[0026] The first and second outer layers may each independently contain a fluoropolymer, provided that the fluoropolymer in each of the first and second outer layers has a melting temperature at least 15°C lower than the melting temperature of the core layer. Each of the first and second outer layers may contain the same fluoropolymer or different fluoropolymers. In one embodiment, the fluoropolymer in each of the first and second outer layers has a melting temperature 15 to 150°C or more lower than the melting temperature of the core layer, or 15 to 100°C or more lower than the melting temperature of the core layer, or 15 to 80°C or more lower than the melting temperature of the core layer, or 20 to 80°C or more lower than the melting temperature of the core layer. Some fluoropolymer materials useful for outer layer applications may exhibit a melting temperature range. As used herein, the term “melting temperature range” refers to the temperature range from the melting onset temperature to the temperature at which the material is completely melted. As used herein, the term “initiation temperature” refers to the temperature at which a molten material begins to show an increase in unit heat absorption per 1°C, as determined by differential scanning calorimetry. Below this initiation temperature, the transport material may be solid. For example, copolymer structures may melt within a range depending on their composition. In one embodiment, the term “initiation temperature” may refer to the initiation temperature.

[0027] In addition to selecting a material having a suitable melting temperature for the core layer described above, the first and second outer layer compositions may be further selected based on the dissipation factor of the material. In one embodiment, the fluoropolymers of the first and second outer layers are 10 3 At Hertz frequencies, the dissipation coefficient can be lower than 0.0006.

[0028] As used herein, “fluoropolymers” include homopolymers and copolymers comprising fluorinated alpha-olefin monomers, i.e., alpha-olefin monomers containing at least one fluorine atom substituent, and optionally repeating units derived from a non-fluorinated ethylene unsaturated monomer that reacts with the fluorinated alpha-olefin monomer. Exemplary fluoropolymers include poly(chlorotrifluoroethylene) (PCTFE), poly(chlorotrifluoroethylene-propylene), poly(ethylene-tetrafluoroethylene) (ETFE), poly(ethylene-chlorotrifluoroethylene) (ECTFE), poly(hexafluoropropylene), poly(tetrafluoroethylene) (PTFE), poly(tetrafluoroethylene-ethylene-propylene), poly(tetrafluoroethylene-hexafluoropropylene) (also known as fluorinated ethylene-propylene copolymer (FEP)), and poly(tetrafluoroethylene-propylene) ( These may include poly(tetrafluoroethylene-perfluoropropylene vinyl ether), poly(tetrafluoroethylene-perfluoropropylene vinyl ether), copolymers having fully fluorinated alkoxy side chains in a tetrafluoroethylene main chain (also known as perfluoroalkoxy polymers (PFAs)) (e.g., poly(tetrafluoroethylene-perfluoropropylene vinyl ether)), polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), poly(vinylidene fluoride-chlorotrifluoroethylene), perfluoropolyethers, perfluorosulfonic acids, or perfluoropolyoxetanes.

[0029] In one embodiment, each of the first and second outer layers may independently contain a perfluoroalkoxyalkane polymer or fluorinated ethylene propylene. In a particular embodiment, each of the first and second outer layers may independently contain a perfluoroalkoxyalkane polymer.

[0030] In one particular embodiment, the first outer layer and the second outer layer each independently contain a fluoropolymer comprising a perfluoroalkoxy polymer or a fluorinated ethylene propylene polymer.

[0031] Each of the first and second outer layers may independently contain, substantially consist of, or consist of a fluoropolymer, such as a perfluoroalkoxy polymer or a fluorinated ethylene propylene polymer. In one embodiment, no other polymer components are present in either the first or second outer layer.

[0032] In one embodiment, the first and second outer layers each have an independent thickness of 0.5 to 500 micrometers, for example, 1 to 250 micrometers, or 1 to 150 micrometers, or 1 to 100 micrometers, or 0.5 to 100 micrometers, or 0.5 to 75 micrometers, or 0.5 to 50 micrometers, or 0.5 to 20 micrometers, or 1 to 20 micrometers. In one embodiment, it may be desirable to have thin first and second outer layers, for example, 100 micrometers or less, or 50 micrometers or less, or 20 micrometers or less, or 10 micrometers or less. If the thickness is significantly thick, the outer layers may leak undesirably when a three-layer film is used as an adhesive, leading to the presence of polymer material in unintended locations.

[0033] In embodiments of a three-layer polymer film used in a bonded pattern conductor, it is understood that the first and second outer layers each have an effective thickness to provide a sufficient amount of material, including the first and second outer layer fluoropolymers, to fill the open volume of the pattern conductor. Therefore, preferred thicknesses for each of the first and second outer layers can be selected by those skilled in the art based on the open volume of the pattern conductor bonded using the three-layer film according to this disclosure.

[0034] In one particular embodiment, the three-layer polymer film includes a core layer containing polytetrafluoroethylene, and a first outer layer and a second outer layer, each containing a perfluoroalkoxy polymer.

[0035] In one particular embodiment, the three-layer polymer film includes a core layer containing polytetrafluoroethylene, and a first outer layer and a second outer layer, each containing a fluorinated ethylene propylene polymer.

[0036] In another specific embodiment, the three-layer polymer film includes a core layer containing a perfluoroalkoxy polymer, and a first outer layer and a second outer layer, each containing a fluorinated ethylene propylene polymer.

[0037] Three-layer polymer films can be produced using standard methods for preparing multilayer polymer films. For example, layers or films containing each of the desired materials for each layer can be assembled in a desired order and laminated under pressure. The pressure is sufficient to tack bond the layers of the film together and allow them to move as individual layers. Pressure can be applied, for example, by using a weighted roller such as a 1-pound (1b) (0.454 kilogram (kg)) roller.

[0038] The three-layer polymer film of this disclosure is particularly suitable for bonding patterned substrates. A method for bonding patterned substrates using the three-layer polymer film, therefore, represents another aspect of this disclosure.

[0039] This method includes a step of bringing a first pattern substrate into contact with a three-layer polymer film. The pattern surface of the first pattern substrate is in contact with the first outer layer of the three-layer polymer film. This method further includes a step of bringing a second pattern substrate into contact with the three-layer polymer film on the side opposite to the first pattern substrate. The pattern surface of the second pattern substrate is in contact with the second outer layer of the three-layer polymer film. Figure 2 shows the arrangement of the first pattern substrate (204) on the first outer layer (202) on the core layer (201) of the three-layer polymer film, and the second pattern substrate (205) on the second outer layer (203) of the three-layer polymer film after the contact step. Note that Figure 2 is not drawn to scale.

[0040] The method further includes a step of laminating a first pattern substrate, a three-layer polymer film, and a second pattern substrate to provide a bonded stack. The bonded stack includes the first pattern substrate, the second pattern substrate, and a polymer core layer comprising polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer, positioned between the first and second pattern substrates and in contact with the respective pattern surfaces of the first and second pattern substrates. The polymer core layer of the bonded stack corresponds to the core layer of the initial three-layer polymer film. The conditions of the lamination step are selected such that the first and second outer layers of the three-layer polymer film melt, while the core layer remains undamaged and substantially unchanged. Thus, the melted first and second outer layers are injected and filled into the voids of the pattern structures on the first and second pattern substrates, respectively. Consequently, the voids of the pattern mechanisms on the first and second pattern substrates are filled with polymer components derived from the first and second outer layers of the three-layer polymer film immediately after the formation of the bonded stack.

[0041] Figure 3 shows an illustration of a cross-sectional view of the bonding stack. As shown in Figure 3, the bonding stack includes a first pattern substrate (304), a second pattern substrate (305), and a polymer core layer (301). The voids in the pattern mechanism of the first and second pattern substrates are filled with polymer components (302, 303) derived from the first and second outer layers, respectively.

[0042] In some embodiments, the polymer components (derived from the first and second outer layers) may also exist as thin layers at the interface between the polymer core layer and the first pattern substrate, the second pattern substrate, or both.

[0043] Each of the first and second pattern substrates may independently have a thickness of, for example, 35 to 100 micrometers. The first and second pattern substrates may be pattern conductors, including, for example, copper or aluminum.

[0044] An advantageous feature is that the bonded stack has no voids between the patterned substrate and the polymer core layer.

[0045] In some embodiments, the dielectric layer may be present on one or both pattern conductors facing the polymer core layer (or facing the three-layer polymer film before the lamination process). The dielectric layer may include thermosetting compositions, thermoplastic compositions, ceramics, or combinations thereof. Exemplary materials may include glass-reinforced epoxy laminate materials known as FR4, or PTFE-based laminates available from Rogers as the RO3000® series, ceramic-filled or woven glass-reinforced PTFE laminates available from AGC, or circuit board materials from Panasonic.

[0046] A first dielectric layer may be disposed on a first patterned conductor on the side facing the triple polymer film, and a second dielectric layer may be disposed on a second patterned conductor on the side facing the triple polymer film. Optionally, each of the first and second dielectric layers may have additional patterned conductors disposed on them and facing the first and second patterned conductors. This method makes it possible to provide a multilayer conductor comprising layers of conductor-dielectric-conductor-polymer core layer-conductor-dielectric-conductor-polymer core layer-conductor-dielectric-conductor. The number of layers following this pattern may vary depending on the number of conductor-dielectric-conductor stacks laminated together using the triple polymer film of this disclosure.

[0047] A multilayer conductor represents another aspect of the present disclosure. The multilayer conductor includes a first patterned conductor having a patterned surface, a second patterned conductor having a patterned surface, and a polymer core layer located between the first and second patterned conductors, in contact with the respective patterned surfaces of the first and second patterned conductors, and comprising polytetrafluoroethylene, a perfluoroalkoxy polymer, or a fluorinated ethylene propylene polymer. The second polymer component fills the voids in the respective pattern mechanisms of the first and second patterned conductors, thereby eliminating voids.

[0048] The second polymer component contains a fluoropolymer, however, the melting temperature of the second polymer component is at least 15°C lower than the melting temperature of the polymer core layer.

[0049] The first pattern conductor, the second pattern conductor, and the polymer core layer may each be as described above.

[0050] The first dielectric layer may be placed on the first patterned conductor on the side facing the polymer core layer, and the second dielectric layer may be placed on the second patterned conductor on the side facing the polymer core layer. Since the thicknesses of the first and second dielectric layers and the polymer core layer are all within 10% of each other, the spacing between adjacent conductor layers is uniform.

[0051] A multilayer conductor can include multiple conductor layers alternately separated by dielectric layers and polymer core layers. In one embodiment, the conductor layers can provide curved electrical current paths, for example, defining spiral electrical current paths, which are useful in the manufacture of coil-type structures.

[0052] A method for producing a multilayer conductor represents another aspect of the present disclosure. The method includes a bonded conductor using a trilayer polymer dielectric polymer film of the present disclosure. In one aspect, the method includes the step of providing a first layer having a first conductor bonded to a first side of a first dielectric layer and a second conductor bonded to a second side of the first dielectric layer. The first side of the dielectric layer faces the second side of the dielectric layer. Each of the first and second conductors has a plurality of patterned conductor mechanisms located on the side facing the dielectric layer and defining a plurality of voids on the first and second conductors.

[0053] The method further includes the step of providing a second layer having a third conductor bonded to a first side of a second dielectric layer and a fourth conductor bonded to a second side of the second dielectric layer. The first side of the second dielectric layer faces the second side of the second dielectric layer. Each of the third and fourth conductors has a plurality of patterned conductor mechanisms located on the side facing the second dielectric layer and defining a plurality of voids on the third and fourth conductors.

[0054] The method further includes the steps of bringing a first layer into contact with a first side of a first three-layer polymer film, and bringing a second layer into contact with a second side of the first film, wherein the three-layer polymer is according to the present disclosure. The first side faces the second side of the three-layer polymer film, the patterned conductor mechanism of the first conductor is in contact with the first outer layer of the three-layer polymer film, and the patterned conductor mechanism of the third conductor is in contact with the second outer layer of the three-layer polymer film.

[0055] This method comprises a step of laminating a first layer, a three-layer polymer film, and a second layer, further comprising a step of filling the voids in the respective pattern mechanisms of the first and third conductors with polymer components derived from the first and second outer layers of the three-layer polymer film. The polymer core layers of the three-layer polymer film remain undamaged due to differences in melting temperatures, thereby providing the desired space between the conductor layers.

[0056] When multiple conductive layers are desired, a stack can be provided in which a desired number of conductor-dielectric-conductor-triple polymer film layers are arranged in a specific order. Any number of layers can be provided, laminated in the order described herein. Each of the first and second outer layers of the triple polymer film may have the same composition and therefore may have the same melting temperature. Once a stack of the desired number of layers is provided, the entire stack can be laminated to provide the desired multilayer conductor in a single step.

[0057] In another embodiment, if multiple conductor layers are desired, a multi-step process can be used to provide a first multilayer conductor stack and a second multilayer conductor stack, each having the following layers: conductor-dielectric-conductor-polymer core layer-conductor-dielectric-conductor. Additional layers may exist only if the stack is prepared using the single-step procedure described above. The first and second multilayer stacks may be positioned on the side facing the second three-layer polymer film, provided that the polymer core layer of the second film has a melting temperature at least 15°C lower than the melting temperatures of the first and second outer layers of the first film, and the first and second outer layers of the second film have a melting temperature at least 15°C lower than the melting temperature of the core layer of the second film. If the melting temperatures of the core layer and the first and second outer layers of the second film are not sufficiently different from those of the first and second outer layers of the three-layer polymer film used to prepare the first and second multilayer stacks, subsequent lamination may adversely affect the existing stack. The contact and lamination process can be repeated until the desired number of alternative layers are obtained, provided that the core layer of the three-layer polymer film used in all subsequent lamination processes is selected to have a melting temperature at least 15°C lower than the first and second outer layers of all previously used three-layer polymer films, and the first and second outer layers of the three-layer polymer film used in all subsequent lamination processes are selected to have a melting temperature at least 15°C lower than the melting temperature of the core layer of the film.

[0058] For example, the method may further include the step of providing a third layer having a fifth conductor bonded to a first side of a third dielectric layer and a sixth conductor bonded to a second side of the third dielectric layer. The first side of the third dielectric layer faces the second side of the third dielectric layer. Each of the fifth and sixth conductors has a plurality of patterned conductor mechanisms located on the side facing the third dielectric layer and defining a plurality of voids on the fifth and sixth conductors. The method may further include the steps of bringing the first layer (i.e., already bonded to the second layer by a triple polymer film) into contact with the first side of a second triple polymer film, and bringing the third layer into contact with the second side of the second film. The second film conforms to the disclosure. Its first side faces the second side of the triple polymer film. The patterned conductor mechanism of the second conductor is in contact with the first outer layer of the second film, and the patterned conductor mechanism of the fifth conductor is in contact with the second outer layer of the second film. This method comprises a step of laminating a first layer, a three-layer polymer film, and a third layer, further comprising a step of filling the voids in each patterned conductor mechanism of the second conductor and the fifth conductor with polymer components derived from the first and second outer layers of the second film.

[0059] The multilayer conductors of this disclosure may be useful in magnetic self-resonant structures (MSRS). A magnetic self-resonant structure includes multiple patterned conductor layers joined by a three-layer polymer film according to this disclosure. When joining the multilayer conductors, the outer layer of the three-layer polymer film further fills the gaps between the conductor mechanisms of the patterned conductor layers and seals the ends of the structure. Air provides very low dielectric breakdown strength. Therefore, it is preferable to replace the air with a polymer material that has higher dielectric breakdown strength. This prevents discharge and strengthens the structure so that mechanical vibrations or vibrations during use (e.g., when mounted on the underside of a vehicle) do not damage the structure. Therefore, since an additional step of filling gaps is not required, the use of the three-layer polymer film of this disclosure can offer the advantage of reducing the number of steps in the production of multilayer structures.

[0060] Therefore, a self-resonant structure prepared using the three-layer polymer film disclosed herein represents another aspect of the disclosure. MSRS may be useful in wireless power transmission.

[0061] This disclosure is further illustrated by the following embodiments, but is not limited thereto. [Examples]

[0062] The materials used in the following examples are listed in Table 1.

[0063] [Table 1]

[0064] The three-layer polymer film was prepared by manually stacking one layer during the preparation of the multilayer bonded stack. It can also be pre-prepared by manually laying up the three layers of adhesive and using a 1 lb (0.454 kg) roller to pressurize the stack. This pressure tack-bonds the three adhesive layers to each other, allowing them to move as individual layers.

[0065] The bonding process for a three-layer polymer film with patterned copper conductors was tested following the general procedure below. The three-layer polymer is a film sandwiched between two copper conductors, with each conductor in the pattern mechanism facing the polymer film. To bond the copper conductors to each other, copper-polymer film-copper was then laminated.

[0066] In the first embodiment, a three-layer polymer film having a PTFE core (3 mil (0.076 mm) thick) and PFA outer layers (2 mil (0.051 mm) thick) was used to bond patterned copper conductors, each of which was 70 micrometers thick. The copper-polymer film-copper layers were laminated at a pressure of 250 PSI (1,724 kilopascals (kPa)), a maximum temperature of 620°F (327°C), and a dwell time of 40 minutes at the maximum temperature.

[0067] In the second embodiment, a three-layer polymer film having a PTFE or PFA core (3 mil (0.076 mm) thick) and an FEP outer layer (2 mil (0.051 mm) thick) was used to bond patterned copper conductors, each of which was 70 micrometers thick. The copper-polymer film-copper layers were laminated at a pressure of 150 PSI (1,034 kilopascals (kPa)), a maximum temperature of 550°F (288°C), and a dwell time of 40 minutes at the maximum temperature.

[0068] The injection and filling of a polymer film outer layer into a patterned conductor mechanism was tested in voids. In one test, the bonded conductor layer was post-baked for 1 hour (h) at 200°F (93°C). The absence of delamination suggests that the polymer film outer layer was completely injected and filled into the conductor gaps. The presence of voids causes delamination. The presence of voids can also be measured by acoustic scanning. Visual analysis of the cross-section of the bonded material can reveal voids. Each of the aforementioned analytical techniques demonstrates that the polymer film according to this disclosure can be injected and filled into the conductor gaps, thereby providing an effective bonding mechanism.

[0069] Figure 4 shows a cross-sectional image of a multi-layer patterned conductor joined together by a three-layer adhesive. Figure 5 shows a high-magnification image of the cross-section of the multi-layer patterned conductor. The white layer (502) is the dielectric layer derived from the original two-layer patterned conductor. The dark gray layer (501) is the core layer remaining after lamination with the three-layer polymer film. The outer layer of the three-layer polymer film fills the openings and voids of the structural conductor. The spaces between the conductor layers (503) are maintained by the dielectric layer and the core layer.

[0070] This disclosure further encompasses the following aspects:

[0071] Embodiment 1: A three-layer polymer film comprising a core layer containing polytetrafluoroethylene, a perfluoroalkoxy polymer, or a fluorinated ethylene propylene polymer, a first outer layer on a first surface of the core layer, and a second outer layer on a second surface of the core layer located opposite the first outer layer, wherein the first outer layer and the second outer layer each independently contain a fluoropolymer having a melting temperature at least 15°C lower than the melting temperature of the core layer.

[0072] Embodiment 2: The film according to Embodiment 1, wherein the first outer layer and the second outer layer each contain the same fluoropolymer.

[0073] Embodiment 3: The film according to Embodiment 1, wherein the first outer layer and the second outer layer each contain different fluoropolymers.

[0074] Embodiment 4: A film according to any one embodiment of Embodiments 1 to 3, wherein the first outer layer and the second outer layer each contain a fluoropolymer including a perfluoroalkoxy polymer or a fluorinated ethylene propylene polymer.

[0075] Embodiment 5: The film according to any one embodiment of Embodiments 1 to 4, wherein the core layer further comprises a reinforcing agent.

[0076] Embodiment 6: The film according to Embodiment 5, wherein the reinforcing agent comprises woven or non-woven glass fibers.

[0077] Embodiment 7: A film according to any one embodiment of Embodiments 1 to 6, wherein the core layer has a thickness of 1 to 20 micrometers.

[0078] Embodiment 8: A film according to any one embodiment of Embodiments 1 to 7, wherein each of the first outer layer and the second outer layer has a thickness of 0.5 to 10 micrometers.

[0079] Embodiment 9: The film according to Embodiment 1, wherein the core layer comprises polytetrafluoroethylene, and the first outer layer and the second outer layer each comprise a perfluoroalkoxy polymer.

[0080] Embodiment 10: The film according to Embodiment 1, wherein the core layer contains polytetrafluoroethylene, and the first outer layer and the second outer layer each contain a fluorinated ethylene propylene polymer.

[0081] Embodiment 11: The film according to Embodiment 1, wherein the core layer comprises a perfluoroalkoxy polymer, and the first outer layer and the second outer layer each comprise a fluorinated ethylene propylene polymer.

[0082] Embodiment 12: A method for joining patterned substrates, comprising the steps of: bringing a first patterned substrate into contact with a film according to any one embodiment of Embodiments 1 to 11, wherein the pattern surface of the first patterned substrate is in contact with a first outer layer of the film; bringing a second patterned substrate into contact with the film on the side opposite to the first patterned substrate, wherein the pattern surface of the second patterned substrate is in contact with a second outer layer of the film; and laminating the first patterned substrate, the film, and the second patterned substrate to provide a bonding stack comprising a polymer core layer located between the first and second patterned substrates, in contact with the respective pattern surfaces of the first and second patterned substrates, and comprising the steps of filling the voids in the respective pattern mechanisms of the first and second patterned substrates with second polymer components derived from the first and second outer layers of the film.

[0083] Embodiment 13: The method according to Embodiment 12, wherein the first pattern substrate and the second pattern substrate are pattern conductors.

[0084] Embodiment 14: The method according to Embodiment 13, wherein the first pattern conductor and the second pattern conductor each independently contain copper or aluminum.

[0085] Embodiment 15: The method according to any one embodiment of Embodiments 12 to 14, wherein a layer of the second polymer component is present at the interface between the polymer core layer and the first pattern substrate, the second pattern substrate, or both.

[0086] Embodiment 16: The method according to any one embodiment of Embodiments 12 to 15, wherein the first pattern substrate and the second pattern substrate each independently have a thickness of 18 to 105 micrometers.

[0087] Embodiment 17: The method according to any one embodiment of Embodiments 12 to 16, wherein the bonding stack does not have an air gap between the substrate and the polymer core layer.

[0088] Embodiment 18: The method according to any one embodiment of Embodiments 12 to 17, wherein the first pattern substrate is a first pattern conductor, the second pattern substrate is a second pattern conductor, the first dielectric layer is disposed on the first pattern conductor on the side facing the film, and the second dielectric layer is disposed on the second pattern conductor on the side facing the film.

[0089] Embodiment 19: The method according to Embodiment 18, wherein each of the first dielectric layer and the second dielectric layer has a patterned conductor disposed thereon, and is located on the side facing the first patterned conductor and the second patterned conductor, respectively.

[0090] Embodiment 20: A multilayer conductor comprising a first patterned conductor having a patterned surface, a second patterned conductor having a patterned surface, a polymer core layer located between the first and second patterned conductors and in contact with the respective patterned surfaces of the first and second patterned conductors, comprising a polymer core layer containing polytetrafluoroethylene, a perfluoroalkoxy polymer, or a fluorinated ethylene propylene polymer, wherein the second polymer component comprises a fluoropolymer having a melting temperature at least 15°C lower than the melting temperature of the polymer core layer, the second polymer component in contact with the first patterned conductor and the first side of the polymer core layer, and located between the second patterned conductor and the second side of the polymer core layer, with the voids in the respective pattern mechanisms of the first and second patterned conductors being filled with the second polymer component.

[0091] Embodiment 21: The multilayer conductor according to Embodiment 20, wherein the first pattern conductor and the second pattern conductor each independently contain copper or aluminum.

[0092] Embodiment 22: The multilayer conductor according to Embodiment 20 or 21, wherein a layer of the second polymer component is present at the interface between the polymer core layer and the first pattern substrate, the second pattern substrate, or both.

[0093] Embodiment 23: A multilayer conductor according to any one embodiment of Embodiments 20 to 22, wherein the second polymer component comprises a perfluoroalkoxy polymer or a fluoropolymer containing a fluorinated ethylene propylene polymer.

[0094] Embodiment 24: A multilayer conductor according to any one embodiment of Embodiments 20 to 23, wherein the polymer core layer further comprises a reinforcing agent.

[0095] Embodiment 25: A multilayer conductor according to any one embodiment of Embodiments 20 to 24, wherein the polymer core layer comprises polytetrafluoroethylene and the second polymer component comprises a perfluoroalkoxy polymer.

[0096] Embodiment 26: A multilayer conductor according to any one embodiment of Embodiments 20 to 24, wherein the polymer core layer comprises polytetrafluoroethylene and the second polymer component comprises a fluorinated ethylene propylene polymer.

[0097] Embodiment 27: A multilayer conductor according to any one embodiment of Embodiments 20 to 24, wherein the polymer core layer comprises a perfluoroalkoxy polymer and the second polymer component comprises a fluorinated ethylene propylene polymer.

[0098] Embodiment 28: A multilayer conductor according to any one embodiment of Embodiments 20 to 27, further comprising a first dielectric layer disposed on the side of the first pattern conductor facing the polymer core layer, and a second dielectric layer disposed on the side of the second pattern conductor facing the polymer core layer.

[0099] Embodiment 29: The multilayer conductor according to Embodiment 28, wherein the thickness of the polymer core layer is within 10% of the thickness of the first and second dielectric layers, respectively.

[0100] Embodiment 30: A multilayer conductor according to any one embodiment of Embodiments 20 to 29, wherein there is no void between the first pattern conductor and the polymer core layer, or between the second pattern conductor and the polymer core layer.

[0101] Aspect 31: A step to provide a first layer having a first conductor joined to a first side of a first dielectric layer and a second conductor joined to a second side of the first dielectric layer, wherein each of the first and second conductors has a plurality of pattern conductor mechanisms, the first side of the dielectric layer facing the second side of the dielectric layer and located on the side facing the dielectric layer, defining a plurality of voids on the first and second conductors; a step to provide a second layer having a third conductor joined to a first side of a second dielectric layer and a fourth conductor joined to a second side of the second dielectric layer, wherein the first side of the second dielectric layer facing the second side of the second dielectric layer and located on the side facing the second dielectric layer, defining a plurality of pattern conductor mechanisms, the third and A method for forming a multilayer conductor, each having a fourth conductor, comprising the steps of: bringing the first layer into contact with the first side of the first three-layer polymer film; bringing the second layer into contact with the second side of the first film, wherein the first film is the film according to any one of embodiments 1 to 11, the first side facing the second side of the first film, the pattern conductor mechanism of the first conductor in contact with the first outer layer of the first film, and the pattern conductor mechanism of the third conductor in contact with the second outer layer of the first film; and laminating the first layer, the first film, and the second layer, wherein the cavities in the respective pattern mechanisms of the first conductor and the third conductor are filled with polymer components derived from the first and second outer layers of the first film.

[0102] Aspect 32: A step of providing a third layer having a fifth conductor joined to a first side of a third dielectric layer and a sixth conductor joined to a second side of a third dielectric layer, wherein the first side of the third dielectric layer faces the second side of the third dielectric layer and each of the fifth and sixth conductors has a plurality of pattern conductor mechanisms located on the side facing the third dielectric layer and defining a plurality of voids on the fifth and sixth conductors; a step of bringing the first side of the first layer and the second three-layer polymer film into contact; and a step of bringing the second side of the third layer and the second film into contact, wherein the second film is the film according to any one of aspects 1 to 11, provided that the second film The method according to embodiment 31, further comprising the steps of: the first and second outer layers of the film each having a melting temperature at least 15°C lower than the melting temperatures of the first and second outer layers of the first three-layer polymer film, the first side facing the second side of the second film, the pattern conductor mechanism of the second conductor in contact with the first outer layer of the second film, and the pattern conductor mechanism of the fifth conductor in contact with the second outer layer of the second film; and the step of laminating the first layer, the second film, and the third layer, wherein the cavities in the respective pattern mechanisms of the second conductor and the fifth conductor are filled with polymer components derived from the first and second outer layers of the second film.

[0103] Embodiment 33: The method according to Embodiment 31 or 32, wherein the contacting step and the laminating step are repeated until a desired number of layers are reached, wherein in each series of laminating steps, a three-layer polymer film having first and second outer layers is used, each having a melting temperature at least 15°C lower than the melting temperature of the first and second outer layers used in the previous laminating step.

[0104] Compositions, methods, and articles may, alternatively, include, consist of, or substantially consist of any suitable material, process, or component disclosed herein. Compositions, methods, and articles may, additionally, or alternatively, be formulated to contain, or substantially contain, any material (or type), process, or component that is not necessary for achieving the function or purpose of the composition, method, or article.

[0105] All scopes disclosed herein encompass endpoints, which are independently combinable. “Combination” includes blends, mixtures, alloys, reaction products, etc. Terms such as “first,” “second,” etc., do not imply any order, quantity, or importance, but rather are used to distinguish one element from another. The terms “a,” “an,” and “the” do not imply a limitation of quantity and are construed to encompass both singular and plural forms unless otherwise stated herein or the context clearly contradicts them. “Or” means “and / or” unless otherwise specified. References to “an aspect” throughout this specification mean a particular element described in relation to an aspect contained in at least one aspect described herein, which may or may not be present in other aspects. As used herein, the term “combination thereof” is an open concept that includes one or more of the described elements and allows for the presence of one or more undescribed similar elements. Furthermore, it should be understood that the described elements can be combined in any preferred manner in a variety of forms.

[0106] When an element is described as being "on" or "in contact" with another element, unless otherwise specified, it should be understood that it may be directly on the other element or any intervening element that may exist between them. On the other hand, when an element is described as being "directly on" or "directly in contact with" another element, there is no intervening element.

[0107] Exemplary embodiments are described herein with reference to schematic cross-sectional views of ideal embodiments. Therefore, variations in the shapes shown are expected, for example, as a result of production techniques and / or tolerances. Accordingly, embodiments described herein should be interpreted not as being limited to specific shapes of regions as illustrated herein, but as including variations in shape, for example, as a result of production. For example, a region illustrated or described as flat may typically have rough and / or nonlinear mechanisms. Furthermore, an acute angle illustrated may be an obtuse angle. Therefore, the illustrated regions are essentially schematic, and their shapes are not intended to illustrate the exact shape of a region, nor are they intended to limit the scope of these claims.

[0108] Unless otherwise specified herein, all test standards are the most current standards in effect as of the filing date of this application, or, if priority is claimed, as of the filing date of the earliest priority application in which such test standards are described. Unless otherwise defined, technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which this application pertains. All cited patents, patent applications, and other references are incorporated herein by reference in their entirety. However, in the event of any conflict or inconsistency between terms in this application and terms in the cited references, the terms in this application shall prevail over the conflicting terms in the cited references.

[0109] Compounds are described using standard nomenclature. For example, any position not substituted by any indicated substituent is understood to have its valency filled by the indicated bond or hydrogen atom. A dash ("-") without a space between two letters or symbols is used to indicate the bonding site of a substituent. For example, -CHO is bonded via the carbonyl group's carbon.

[0110] While specific embodiments have been described, alternatives, modifications, variations, improvements, and substantially equivalents may arise that are not currently foreseeable or may be foreseeable to the applicant or other persons skilled in the art. Accordingly, the attached claims as submitted, and any modified claims, are intended to encompass all such alternatives, modifications, variations, improvements, and substantially equivalents.

Claims

1. A core layer containing polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer, The first outer layer on the first surface of the core layer, and The second outer layer on the second surface of the core layer located on the opposite side of the first outer layer, Includes, The first outer layer and the second outer layer each independently contain a fluoropolymer having a melting temperature at least 15°C lower than the melting temperature of the core layer. Three-layer polymer adhesive film.

2. The film according to claim 1, wherein the first outer layer and the second outer layer each contain the same fluoropolymer.

3. The film according to claim 1, wherein the first outer layer and the second outer layer each contain different fluoropolymers.

4. The film according to any one of claims 1 to 3, wherein the first outer layer and the second outer layer each contain a fluoropolymer comprising a perfluoroalkoxy polymer or a fluorinated ethylene propylene polymer.

5. The film according to any one of claims 1 to 4, wherein the core layer further comprises a reinforcing agent.

6. The film according to claim 5, wherein the reinforcing agent comprises woven or non-woven glass fibers.

7. The film according to any one of claims 1 to 6, wherein the core layer has a thickness of 1 to 20 micrometers.

8. The film according to any one of claims 1 to 7, wherein each of the first outer layer and the second outer layer has a thickness of 0.5 to 10 micrometers.

9. The core layer contains polytetrafluoroethylene, The first outer layer and the second outer layer each contain a perfluoroalkoxy polymer. The film according to claim 1.

10. The core layer contains polytetrafluoroethylene, The first outer layer and the second outer layer each contain a fluorinated ethylene propylene polymer, The film according to claim 1.

11. The core layer comprises a perfluoroalkoxy polymer, The first outer layer and the second outer layer each contain a fluorinated ethylene propylene polymer, The film according to claim 1.

12. A step of bringing a first patterned substrate into contact with a film according to any one of claims 1 to 11, wherein the pattern surface of the first patterned substrate is in contact with the first outer layer of the film. A step of bringing a second pattern substrate into contact with the film on the side facing the first pattern substrate, wherein the pattern surface of the second pattern substrate is in contact with the second outer layer of the film, and The first pattern substrate, the film, and the second pattern substrate are laminated together. The first pattern substrate, The second pattern substrate, A polymer core layer located between the first pattern substrate and the second pattern substrate, in contact with the respective pattern surfaces of the first and second pattern substrates, comprising polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer. A step of providing a bonding stack comprising the steps of filling the voids in the pattern mechanisms of the first pattern substrate and the second pattern substrate with a second polymer component derived from the first and second outer layers of the film, A method for joining patterned circuit boards, including [specific component / feature].

13. The method according to claim 12, wherein the first pattern substrate and the second pattern substrate are pattern conductors.

14. The method according to claim 13, wherein the first patterned conductor and the second patterned conductor each independently contain copper or aluminum.

15. The method according to any one of claims 12 to 14, wherein the layer of the second polymer component is present at the interface between the polymer core layer and the first pattern substrate, the second pattern substrate, or both.

16. The method according to any one of claims 12 to 15, wherein the first pattern substrate and the second pattern substrate each independently have a thickness of 18 to 105 micrometers.

17. The method according to any one of claims 12 to 16, wherein the bonding stack does not have an air gap between the substrate and the polymer core layer.

18. The first pattern substrate is the first pattern conductor, The second pattern substrate is the second pattern conductor, The first dielectric layer is disposed on the first pattern conductor, on the side facing the film. The second dielectric layer is arranged on the second pattern conductor, on the side facing the film. The method according to any one of claims 12 to 17.

19. The method according to claim 18, wherein each of the first dielectric layer and the second dielectric layer has a patterned conductor disposed thereon, and is located on the side facing the first patterned conductor and the second patterned conductor, respectively.

20. A first patterned conductor having a patterned surface, A second patterned conductor having a patterned surface, A polymer adhesive layer located between the first pattern conductor and the second pattern conductor, in contact with the respective pattern surfaces of the first and second pattern conductors, comprising polytetrafluoroethylene, perfluoroalkoxy polymer, or fluorinated ethylene propylene polymer. Includes, The second polymer component includes a fluoropolymer having a melting temperature at least 15°C lower than the melting temperature of the polymer core layer. The second polymer component is in contact with the first pattern conductor and the first side of the polymer core layer, and is located between the second pattern conductor and the second side of the polymer core layer. The cavities in the pattern mechanisms of the first pattern conductor and the second pattern conductor are filled with the second polymer component. Multilayer conductor.

21. The multilayer conductor according to claim 20, wherein the first pattern conductor and the second pattern conductor each independently contain copper or aluminum.

22. The multilayer conductor according to any one of claims 20 or 21, wherein the layer of the second polymer component is present at the interface between the polymer core layer and the first pattern substrate, the second pattern substrate, or both.

23. The multilayer conductor according to any one of claims 20 to 22, wherein the second polymer component comprises a perfluoroalkoxy polymer or a fluoropolymer containing a fluorinated ethylene propylene polymer.

24. The multilayer conductor according to any one of claims 20 to 23, wherein the polymer core layer further comprises a reinforcing agent.

25. The polymer core layer contains polytetrafluoroethylene, The second polymer component comprises a perfluoroalkoxy polymer. A multilayer conductor according to any one of claims 20 to 24.

26. The polymer core layer contains polytetrafluoroethylene, The second polymer component comprises a fluorinated ethylene propylene polymer. The multilayer conductor according to claim 20.

27. The polymer core layer comprises a perfluoroalkoxy polymer, The second polymer component comprises a fluorinated ethylene propylene polymer. A multilayer conductor according to any one of claims 20 to 24.

28. A first dielectric layer is disposed on the first pattern conductor on the side facing the polymer core layer, A second dielectric layer is disposed on the side of the second pattern conductor facing the polymer core layer, A multilayer conductor according to any one of claims 20 to 27, further comprising:

29. The multilayer conductor according to claim 28, wherein the thickness of the polymer core layer is within 10% of the respective thicknesses of the first and second dielectric layers.

30. A multilayer conductor according to any one of claims 20 to 29, wherein there is no void between the first pattern conductor and the polymer core layer, or between the second pattern conductor and the polymer core layer.

31. A step of providing a first layer having a first conductor joined to a first side of a first dielectric layer and a second conductor joined to a second side of the first dielectric layer, wherein the first side of the dielectric layer faces the second side of the dielectric layer and each of the first and second conductors has a plurality of pattern conductor mechanisms located on the side facing the dielectric layer and defining a plurality of voids on the first and second conductors, A step of providing a second layer having a third conductor joined to a first side of a second dielectric layer, and a fourth conductor joined to a second side of the second dielectric layer, wherein the first side of the second dielectric layer faces the second side of the second dielectric layer, and each of the third and fourth conductors has a plurality of pattern conductor mechanisms located on the side facing the second dielectric layer, defining a plurality of voids on the third and fourth conductors, A step of bringing the first layer and the first side of the first film into contact, and a step of bringing the second layer and the second side of the first film into contact, wherein the first film is the film according to any one of claims 1 to 11, the first side of the first film faces the second side of the first film, the pattern conductor mechanism of the first conductor is in contact with the first outer layer of the first film, and the pattern conductor mechanism of the third conductor is in contact with the second outer layer of the first film, and A step of laminating the first layer, the first film, and the second layer, wherein the voids in the respective pattern mechanisms of the first conductor and the third conductor are filled with polymer components derived from the first and second outer layers of the first film. A method for forming a multilayer conductor, including [a specific component].

32. A step of providing a third layer having a fifth conductor joined to a first side of a third dielectric layer and a sixth conductor joined to a second side of the third dielectric layer, wherein the first side of the third dielectric layer faces the second side of the third dielectric layer and is located on the side facing the third dielectric layer, and each of the fifth and sixth conductors has a plurality of pattern conductor mechanisms that define a plurality of voids on the fifth and sixth conductors, A step of bringing the first layer and the first side of the second film into contact, and a step of bringing the third layer and the second side of the second film into contact, wherein the second film is the film according to any one of claims 1 to 11, wherein the polymer core layer of the second film has a melting temperature at least 15°C lower than the melting temperature of the first and second outer layers of the first film, the first and second outer layers of the second film each have a melting temperature at least 15°C lower than the melting temperature of the polymer core layer of the second film, the first side of the second film faces the second side of the second film, the pattern conductor mechanism of the second conductor is in contact with the first outer layer of the second film, and the pattern conductor mechanism of the fifth conductor is in contact with the second outer layer of the second film, and A step of laminating the first layer, the second film, and the third layer, wherein the cavities in the respective pattern mechanisms of the second conductor and the fifth conductor are filled with polymer components derived from the first and second outer layers of the second film. The method according to claim 31, further comprising:

33. The method according to claim 31 or 32, wherein the contact step and the lamination step are repeated until a desired number of layers are reached, wherein in each series of lamination steps, a three-layer polymer film having the first and second outer layers is used, each having a melting temperature at least 15°C lower than the melting temperature of the first and second outer layers used in the previous lamination step.

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