Image sensor module, camera module, and method for manufacturing the same.

Abstract

The image sensor module disclosed in the embodiment includes an image sensor, an image signal processing chip that interfaces with the image sensor, a main substrate on which the image sensor is mounted on one side and the image signal processing chip is mounted on the other side, an adhesive member between the main substrate and the image sensor, and a first substrate bonded to the other side of the main substrate, wherein the first substrate includes a housing hole that penetrates from the other side to the one side, and the image signal processing chip is connected to the other side of the main substrate via the housing hole of the first substrate.

Description

Technical Field

[0001] The embodiments relate to an image sensor module and a camera module having the same.

[0002] The embodiments relate to an image sensor module and a method of manufacturing the same.

Background Art

[0003] Generally, image sensors can be broadly classified into CCD (Charge Couple Device) image sensors and CMOS image sensors (MOS image sensors). A CMOS image sensor converts an optical signal into an electrical signal using a CMOS process. The CMOS image sensor has a simpler driving method compared to a CCD image sensor, and a circuit for processing an electrical signal output from a pixel can be integrated into one chip by a CMOS process, enabling miniaturization of the product. Since the CMOS process is used, the manufacturing cost can be reduced, and it has the advantage of low power consumption. Also, a method of integrating all of a pixel array, an ADC (analog digital converter) that converts an analog signal output from the pixel array into a digital signal, and an ISP (Image Signal Processor) that processes the digital signal output from the ADC as an image signal into one chip is also used.

[0004] However, when a CMOS image sensor and an ISP are implemented on one chip using the same substrate, digital noise generated by the ISP may affect the CMOS image sensor.

Summary of the Invention

Problems to be Solved by the Invention

[0005] An embodiment of the invention provides an image sensor module and a method for manufacturing the same, which is equipped with an image signal processing chip and a first substrate mounted on the lower surface of a main substrate on which an image sensor is mounted.

[0006] An embodiment of the invention provides an image sensor module and a method for manufacturing the same, in which the bottom pin map of the lower part of the main substrate is arranged in a region that overlaps vertically with the image sensor.

[0007] One embodiment of the invention provides an image sensor module and a method for manufacturing the same, in which an image sensor is mounted on the upper part of a main substrate and an image signal processing chip is mounted on the lower part via a first substrate, thereby simplifying the interface between the image sensor and the image signal processing chip.

[0008] An embodiment of the invention provides a camera module and a method for manufacturing the same, in which an image sensor is mounted on the upper part of a main board and an image signal processing chip is mounted on the lower part via a first board, and a second board having a connector is placed below the first board. [Means for solving the problem]

[0009] An image sensor module according to an embodiment of the invention includes an image sensor, an image signal processing chip that interfaces with the image sensor, a main substrate on which the image sensor is mounted on one side and the image signal processing chip is mounted on the other side, an adhesive member between the main substrate and the image sensor, and a first substrate bonded to the other side of the main substrate, wherein the first substrate includes a housing hole that penetrates from the other side to the one side, and the image signal processing chip is connected to the other side of the main substrate via the housing hole of the first substrate.

[0010] According to an embodiment of the invention, the invention further includes a memory disposed on one side of the storage hole, the memory being connected to the other side of the main board via the storage hole. According to an embodiment of the invention, the invention further includes an electronic component disposed on at least one side of the storage hole, the electronic component being connected to the other side of the main board via the storage hole.

[0011] According to an embodiment of the invention, the invention further includes an oscillator disposed on one side of the housing hole, the oscillator being connected to the other side of the main board via the housing hole. According to an embodiment of the invention, the image signal processing chip may be a serializer IC. According to an embodiment of the invention, the image signal processing chip can be separated from the lower surface of the first board. The camera module according to an embodiment of the invention includes an image sensor, an image signal processing chip interface with the image sensor, a main board on which the image sensor is mounted on one side and the image signal processing chip is mounted on the other side, an adhesive member between the main board and the image sensor, a first board bonded to the other side of the main board, a second board bonded to the other side of the first board, and a power module and connector connected to the other side of the second board, wherein the first board includes a housing hole penetrating from the other side to the one side, and the image signal processing chip is connected to the other side of the main board via the housing hole of the first board.

[0012] According to an embodiment of the invention, a lens barrel having a plurality of lenses inside is included, which is arranged around the upper part of the second substrate. According to an embodiment of the invention, a memory or oscillator is further included, which is arranged on one side of the housing hole, and the memory or oscillator is connected to the other side of the main substrate via the housing hole. According to an embodiment of the invention, an electronic component is further included, which is arranged on at least one side of the housing hole, and the electronic component is connected to the other side of the main substrate via the housing hole.

[0013] According to an embodiment of the invention, the image signal processing chip is a serializer IC, and the image signal processing chip and the image sensor can be directly interfaced via the main board. According to an embodiment of the invention, the thickness of the first board may be greater than the thickness of the main board, the thickness of the second board may be greater than the thickness of the first board, and the length of at least one side of the second board may be greater than the length of at least one side of the first board. [Effects of the Invention]

[0014] According to an embodiment of the invention, since the image signal processing chip (Serializer IC) and the image sensor are mounted on opposite sides of the main board, the board for the image signal processing chip can be removed, simplifying the interface and improving the reliability of the image sensor module.

[0015] Furthermore, according to the embodiment of the invention, the image signal processing chip is housed in a housing hole on the first substrate and mounted on the main substrate, so the internal structure of the camera can be made smaller compared to existing models, and the substrate specifications can be relaxed and price competitiveness can be ensured.

[0016] According to an embodiment of the invention, by mounting the image sensor and image signal processing chip on the main board, the main board can be shared, eliminating the need for a separate image sensor reinforcement process in the final camera assembly process, thus simplifying the overall assembly process. Furthermore, even if the type of image sensor changes, it can be connected to a main board configured with the same pin map, enabling the SiP (System in Package) module to be used as a platform. [Brief explanation of the drawing]

[0017] [Figure 1] This is an example of a side cross-sectional view of a camera module having an image sensor module according to an embodiment of the invention.

[0018] [Figure 2] An example of the bottom view of the image sensor module of FIG. 1.

[0019] [Figure 3] A block configuration diagram showing the interface between the image sensor of FIG. 1 and the image signal processing chip.

[0020] [Figure 4] (a) and (b) of FIG. 4 are drawings showing the manufacturing process of the image sensor module.

[0021] [Figure 5] A side sectional view of a camera module in which an image sensor module and a connector module according to an embodiment of the invention are combined.

[0022] [Figure 6] (a) and (b) of FIG. 6 are a first modification showing a side sectional view and a rear example of the image sensor module of FIG. 1.

[0023] [Figure 7] (a) and (b) of FIG. 7 are a second modification showing a side sectional view and a rear example of the image sensor module of FIG. 1.

[0024] [Figure 8] (a) of FIG. 8 is a perspective view of a camera module according to an embodiment of the invention, and (b) and (c) are front views of examples of main boards on which different image sensors are mounted.

[0025] [[ID=,43]] [Figure 9] A plan view of a vehicle to which a camera module according to an embodiment of the invention is applied.

Embodiments for Carrying Out the Invention

[0026] The technical concept of the present invention is not limited to the embodiments described, but can be embodied in a variety of forms, and within the scope of the technical concept of the present invention, components between embodiments can be selectively combined or substituted. Furthermore, unless explicitly specified, terms used in the embodiments of the present invention (including technical and scientific terms) shall be interpreted as having a meaning generally understood by a person with ordinary skill in the art to which the present invention belongs, and commonly used terms, such as those defined in dictionaries, may be interpreted considering their meaning in the context of the technology in which they pertain.

[0027] The terms used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the invention. In this specification, singular nouns may also include plural nouns unless specifically limited in the description, and when it is stated that "at least one (or more) of A and B, C" it may include one or more of all possible combinations of A, B, and C. In addition, terms such as first, second, A, B, (a), (b), etc. may be used in the description of the components of the embodiments of the present invention. Such terms are used to distinguish a component from other components and do not limit the nature or order of the component. When it is stated that a component is "connected," "joined," or "connected" to another component, this may include cases where the component is directly connected or connected to the other component, as well as cases where other components are "connected," "joined," or "connected" between each component. Furthermore, when it is stated that a component is formed or positioned "above or below" each component, "above or below" includes not only cases where two components are in direct contact, but also cases where one or more other components are formed or positioned between the two components. Furthermore, when expressed as "up or down," it can include not only the upward direction but also the downward direction, based on one component. Hereinafter, the upper surface of each substrate can refer to one side of each substrate, and the lower surface of each substrate can refer to the other side opposite to the aforementioned side of each substrate.

[0028] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings. Figure 1 is an example of a side cross-sectional view of a camera module having an image sensor module according to an embodiment of the invention; Figure 2 is an example of a bottom view of the image sensor module of Figure 1; Figure 3 is a block diagram showing the interface between the image sensor and the image signal processing chip of Figure 1; Figures 4(a) and 4(b) are drawings showing the manufacturing process of the image sensor module; Figure 5 is a side cross-sectional view of a camera module in which an image sensor module and a connector module according to an embodiment of the invention are coupled; Figures 6(a) and 6(b) are first modified examples showing a side cross-sectional view and a rear view example of the image sensor module of Figure 1; Figures 7(a) and 7(b) are second modified examples showing a side cross-sectional view and a rear view example of the image sensor module of Figure 1; Figure 8(a) is a perspective view of a camera module according to an embodiment of the invention; and Figures 8(b) and 8(c) are front views of an example of a main board on which different image sensors are mounted.

[0029] Referring to Figures 1 and 2, the camera module 1000 according to an embodiment of the invention includes an image sensor unit 100 and a lens unit 110. The image sensor unit 100 may include an image sensor module 120 on which an image sensor 121 and an image signal processing chip 135 are mounted. The image sensor unit 100 includes a first substrate 131 through which the image signal processing chip 135 passes.

[0030] The lens section 110 includes a lens barrel 110 in which a number of lenses 112 are aligned along the optical axis. The number of lenses 112 may be two or more, for example, in the range of 2 to 10 or 3 to 7. The lens barrel 110 may be one or more coupled together, and if there are multiple lens barrels, it includes an object-side barrel or a sensor-side barrel, the object-side barrel or sensor-side barrel can move at least one lens in the optical axis direction by an actuator.

[0031] The image sensor module 120 includes a main board 125 and an image sensor 121 mounted on the main board 125. The image sensor module 120 may also include a first board 1311 and an image signal processing chip 135.

[0032] The image sensor 121 is bonded to the upper surface of the main substrate 125 by a bonding member 141 and electrically connected to the main substrate 125. An adhesive member 123 is placed between the image sensor 121 and the main substrate 125, and the adhesive member 123 protects the area around the bonding member 141 and allows the image sensor 121 to be bonded to the main substrate 125. The adhesive member 123 may be a resin material such as silicone or epoxy, or a thermally conductive insulating material.

[0033] The main board 125 may be a printed circuit board (PCB). The main board 125 may be formed in a single layer or a multilayer structure, and if it is multilayer, it may include via holes inside. The main board 125 may be a flexible or rigid PCB board. The main board 125 may include one or more via holes that penetrate the main board 125. The image signal processing chip 135 is electrically connected to the image sensor 121 located on the main board 125 via via holes. Electronic components such as resistors are electrically connected to each other on the main board 125.

[0034] The image sensor 121 may be any one of CCD (Charge Coupled Device), CMOS (Complementary Metal Oxide Semiconductor), CPD, and CID. The image sensor 121 may include an RGB (red, green, blue)-IR sensor. The horizontal and / or vertical length of the unit pixel (R, G, B, IR pixel) of the image sensor 121 may be 2 μm (micrometers) or less. Furthermore, as the number of pixels increases, the overall size of the image sensor 121 will increase. This allows it to be applied to camera modules 1000 with high pixel and / or pixel counts. The image sensor 121 may be coupled to the main substrate 125 by flip-chip technology. Flip-chip technology is a type of wireless bonding, a device packaging technology, that fuses a chip to a substrate using bonding members 141 such as lead bumps that serve as electrodes on the underside of the chip, without using additional connecting structures such as metal leads (wires) or intermediate media such as ball grid arrays (BGAs). This technology is advantageous for miniaturization and weight reduction because the package is the same size as the chip, and it offers excellent thermal stability, high current application rate, increased reaction speed, and the ability to significantly reduce the distance between electrodes.

[0035] The first substrate 131 may be a printed circuit board (PCB). The first substrate 131 may be formed in a single layer or multilayer configuration, and if multilayer, it may include via holes internally. The first substrate 131 may be a flexible or rigid PCB board. The first substrate 131 may be a double-sided PCB with pads 143 and 144 exposed on both sides. The first substrate 131 may include one or more via holes penetrating the first substrate 131 and electrically connected to the main substrate 125. The first substrate 131 may include an upper pad 143 and a lower pad 144, the upper pad being electrically connected to the main substrate 125. The first substrate 131 may include a storage hole 132 internally, the storage hole 132 penetrating from the bottom surface to the top surface of the first substrate 131. The size of the storage hole 132 may be larger than the lower surface area of ​​the image signal processing chip 135, for example, 1.2 times or more, and preferably in the range of 1.2 to 2 times or 1.2 to 1.8 times. If the size of the storage hole 132 is smaller than the area, it becomes difficult to insert the image signal processing chip 135, and if it is larger than the range, the rigidity of the first substrate 131 decreases. As shown in Figure 2, the shape of the storage hole 132 may be polygonal, and the first substrate 131 may be arranged around the outside.

[0036] The thickness of the first substrate 131 may be greater than the thickness of the main substrate 125. The length of at least one side of the first substrate 131 may be greater than the length of at least one side of the main substrate 125.

[0037] The depth T1 of the storage hole 132 may be the same as or greater than the thickness of the first substrate 131. The depth T1 of the storage hole 132 may be 1.5 mm or less. The distance D1 between the storage hole 132 and at least one inner surface of the first substrate 131 may be 0.5 mm or less, for example, in the range of 0.2 mm to 0.5 mm. The depth T1 of the storage hole 132 positions the image signal processing chip 135 at a distance from the lower surface of the first substrate 131.

[0038] The image signal processing chip 135 is connected to the lower pad 142 of the main substrate 125 and is electrically connected to the main substrate 125. The image signal processing chip 135 may be flip-bonded to the lower pad 142 of the main substrate 125. Electronic components such as resistors are electrically connected to each other on the first substrate 131. The lower pad 142 may be arranged in a first and second direction along the space between the housing hole 132 and the edge of the substrate, as shown in Figure 2. When the image signal processing chip 135 is housed inside the first substrate 131, the thickness of the first substrate 131 can be reduced, the image signal processing chip 135 does not need to be mounted inside the first substrate 131, the number of soldering points for internal mounting can be reduced, and the rigidity of the substrate can be prevented from decreasing due to groove formation for embedding. In addition, the cost of the first substrate 131 can be reduced, i.e., a low-cost substrate can be used.

[0039] The image signal processing chip 135 is inserted inside the first substrate 131 and mounted on the underside of the main substrate 125, and is electrically connected to the image sensor 121. This allows the bottom pinmap of the main substrate 131 to be designed independently of the image sensor 121 above it, and the first substrate 131 can be shared for various applications. In other words, since the image signal processing chip 135 does not need to be embedded inside the first substrate 131, it can be selected from a variety of substrate types and can be provided in a thinner form.

[0040] The image signal processing chip 135 may be any one of the following: an interface utilizing the LVDS (Low Voltage Differential Signaling) or V-By-One HS protocol, an interface that transmits five or more types of signals over a single cable (HD Base T), a MIPI A-PHY chipset, or a SerDes (Serializer-Deserializer). The image signal processing chip 135 may be any one of the various communication interfaces and may be in the form of a chip, element, or electronic component. The SerDes (Serializer-Deserializer) handles serialization and deserialization functions used in high-speed communication between chips.

[0041] The image signal processing chip 135, as shown in Figure 3, includes a serializer IC, which is an interface that provides a high-performance link between the image sensor 121 and the display and associated electronic control units (ECUs) in the automobile. This interface can be defined as MIPI (Mobile Industry Processor Interface) A-PHY (physical). MIPI is an interface specification for processors, including APs (Application Processors), and peripheral devices, established by the MIPI Alliance, which was formed by Intel, ARM, Nokia, Samsung, ST, TI, and others, to enhance reuse and compatibility in mobile and Internet of Things devices. MIPI standards include MIPI D-PHY, MIPI M-PHY, and MIPI C-PHY. In particular, MIPI A-PHY can be used when transmitting data at high speed between a camera, a display, and associated domain ECUs (electronic control units). MIPI A-PHY has a low error rate, thus possessing high stability, high resilience due to its extremely high level of tolerance in automotive environments, can be used over long-distance communication ranges, and can improve data speed.

[0042] The image sensor unit 100 simplifies the interface between the image sensor 121 and the image signal processing chip 135 by integrating the image sensor 121 and the image signal processing chip 135 into a system-in-package (SIP) module, thereby reducing the number of connectors and signal pins. The interface may include symmetric or asymmetric interfaces. The image sensor unit 100 can be applied to applications such as advanced driver-assistance systems (ADAS), digital cockpits, in-vehicle infotainment (IVI), and automated driving systems (ADS). Specifically, the image sensor unit 100 can be applied to next-generation applications using camera and display technologies, including high-performance instrument panels and infotainment displays in vehicles, in-vehicle driver and occupant monitoring systems, virtual side mirrors, and other ADAS, IVI (In-vehicle infotainment), and ADS applications.

[0043] The image signal processing chip 135 includes a serial converter and is configured to convert various parallel signals into serial signals. Specifically, the image signal processing chip 135 receives parallel data from a large number of signal pins, converts it into serial data, and outputs it via a small number of signal pins, thereby reducing the total number of pins by allowing one pin to perform multiple roles.

[0044] The RGB-IR sensor 110 and the MIPI A-PHY, a type of serializer IC, communicate via a large number of pins. In existing designs, the image sensor and serializer are placed on separate boards, requiring a flexible board to connect them. However, in the SiP (system in package) module, which is the image sensor unit 100 in this embodiment, the image sensor 121 is mounted on the upper surface of the main board 125, and the serializer IC is mounted on the lower surface of the main board 125, electrically connecting the image sensor 121 and the serializer to form a module.

[0045] The image sensor 121 and the image signal processing chip 135 are connected by a high-speed interface (MIPI CSI-2.4 lane), sensor clock, frame sync, reset (Reset_N), flash / shutter signal (flash / shutter ctrl), and serial communication (I2C) pins, and are connected to various peripheral memory (EEPROM), oscillator (OSC), etc. The image sensor 121 and the image signal processing chip 135 are supplied with various power from a power block. A high-frequency filter (Poc coax) filters all current transmitted through the cable to transmit it in an appropriate frequency band. One or more image sensors 121 may be mounted on the upper surface of the main board 125. A signal processing chip different from the image signal processing chip 135 may be further mounted on the lower surface of the main board 125. The housing hole 132 in which the image signal processing chip 135 is placed can be sealed by adding a thermally conductive member, which is an insulating material such as epoxy or resin with a heat dissipating agent added to it.

[0046] As shown in Figures 4(a) and 4(b), an image sensor 121 is mounted on the main board 125 using a bonding member 141 such as a solder ball, and an adhesive member 123 is formed around the bonding member 141 and between the main board 125 and the image sensor 121. A pad 143A is formed on the lower part of the main board 125. The first board 131 has a housing hole 132 formed inside and is bonded to the pads 143A and 143 on the main board 125. Here, the image signal processing chip 135 is mounted on the main board 125 before the first board 131 is mounted on the main board 125. As an alternative example, the image signal processing chip 135 may be mounted on the main board 125 after the first board 131 has been mounted on the main board 125.

[0047] As shown in Figure 5, when the first substrate 131 is connected to the main substrate 125, it is connected to the second substrate 151 via the lower pad 144 of the first substrate 131. The second substrate 151, as a connector substrate, may have electronic components such as resistors arranged at its lower end, and may be equipped with a power module IC (PMIC) which is a power module 153 and a connector 155.

[0048] The camera substrate section 150 may include a second substrate 151, a power module 153, and a connector 155. The lens barrel 111 shown in Figure 1 is fixedly mounted and supported on the second substrate 151. The thickness of the second substrate 151 may be greater than the thickness of the first substrate 131. The length of at least one side of the second substrate 151 may be greater than the length of at least one side of the first substrate 131. The upper surface of the second substrate 151 can be exposed so as to overlap the lens barrel 111 perpendicularly.

[0049] The power module 153 is coupled to the second board 151. The power module 153 may be a converter. The power module 153 can convert the level of power received from an external device (not shown) to the required level of power on the board and output power with the converted level to each electronic component. For example, the power module 153 may include at least one of a DC-DC converter (not shown) or a low voltage dropout (LDO) regulator (not shown). The connector 155 is coupled to the second board 151. The connector 155 is electrically connected to the second board 151. The connector 155 can supply external power to the camera device. The connector 155 may include a port for electrical connection to an external device. The cross-section of the connector 155 may be circular. In contrast, the cross-section of the connector 155 can be varied in various ways, such as elliptical or square.

[0050] The second substrate 151 can be separated from the lower surface of the image signal processing chip 135. The upper surface of the second substrate 151 has a heat dissipation member further arranged in a region that overlaps vertically with the image signal processing chip 135, allowing heat generated by the image signal processing chip 135 to be dissipated. The second substrate 151 may include a single-layer or multi-layer PCB and may be made of a flexible or rigid material. The second substrate 151 has a pad on its upper surface that is electrically connected to the pad of the first substrate 131. The second substrate 151 may have via holes inside.

[0051] The connector 155 and the power module 153 are connected to the main board 1125 on which the image sensor 121 is mounted via the second board 151 and the first board 131. As a result, the second board 151 and the main board 125 are connected via the first board 131, enabling power supply and high-speed communication. This eliminates the need for separate cables (power cables and high-speed signal lines) connecting the main board 125 and the second board 151, reducing the cable bonding process and preventing open defects in cable bonding.

[0052] Furthermore, since the main board 125 and the second board 151 are tightly bonded with the first board 131 in between, the thickness of the camera module can be reduced, allowing for a smaller size. In addition, since the second board 131 fixes the positions of the main board 125 and the second board 151, there is no need to install a separate component to fix the second board 131.

[0053] Figures 6(a) and 6(b) show a first modified example, a rear view of the first substrate and a side cross-section of the image sensor section according to the embodiment. As shown in Figure 6, the image sensor section may further include an image signal processing chip 135, a memory 136, and at least one or all of the electronic components 147, inside the housing hole 132 of the first substrate 131. The memory 136 is an EEPROM, and the electronic components 147 may include passive or active elements, such as a plurality of capacitors. The memory 136 and electronic components 147 are electrically connected to the main substrate 125 via the housing hole 132 of the first substrate 131. Therefore, the memory 136 and electronic components 147 can be arranged for SerDes (Serializer / Deserializer) operation.

[0054] Figures 7(a) and 7(b) show a second modified example, a rear view of the first substrate and a side cross-section of the image sensor section according to the embodiment. As shown in Figure 7, the image sensor section may further include an image signal processing chip 135, an oscillator 138, and at least one or all of the electronic components 139, inside the housing hole 132 of the first substrate 131. The oscillator 138 may be a passive or active oscillator, and may be a passive oscillator such as an X-Tal. The electronic components 139 may include passive or active elements, and may include, for example, a plurality of capacitors. The oscillator 138 and electronic components 139 are electrically connected to the main substrate 125 via the housing hole 132 of the first substrate 131. Thus, the oscillator 138 and electronic components 139 for SerDes operation are located outside the image signal processing chip 135 and are electrically connected to the main substrate 125. As shown in Figure 6(a), the capacitors of the memory 136 and electronic component 137 are located on one side of the housing hole 132. As shown in Figure 7(a), the capacitors of the memory 136 and electronic component 137 are located on one side of the housing hole 132, and the capacitors may be located between at least two sides of the housing hole 132 and the image signal processing chip 135.

[0055] Figure 8(a) is a perspective view of the camera module, and (b) and (c) are diagrams comparing image sensors mounted on the main board. A connector 155 is connected to the rear of the camera module, and an image sensor 121 is connected to the front. Various megapixels can be selectively mounted on the main board 125 for the image sensors 121 and 121A; they may be 2 megapixels or 5 megapixels. This is because an image signal processing chip 135 may be directly connected to the rear of the main board 125 via a first board 131, or other memory and electronic components may be mounted there, allowing for the mounting of image sensors with various resolutions from 2 megapixels to 5 megapixels or more. Image sensor 110 may be one of several types of image sensors. In other words, the type and size of image sensors 121 and 121A are variable depending on the specifications and pixel count of the camera module. Also, pins are formed on one side of the main board 121 at positions corresponding to connection terminals consisting of a single pin map. Different image sensors can be connected interchangeably to a single pin map-based connector, eliminating the need to manufacture separate SiP module boards for each type of image sensor. The SiP modules for each pixel of the image sensor can be constructed with the same size and pin map, allowing the camera module board to function as a platform.

[0056] According to this embodiment, the image signal processing chip 135 can be directly connected to the main substrate 125, reducing the thickness of the first substrate 131 and the gap between the first substrate 131 and the second substrate 151, thereby enabling the provision of a smaller camera module. Furthermore, by making the image sensor 121 and the image signal processing chip 135 into a SiP module, a separate image sensor reinforcement process is unnecessary in the final camera assembly process, thus simplifying the overall assembly process. In addition, even if the type of image sensor 121 changes, it can be connected to a SiP module substrate configured with the same pin map, allowing the SiP module to be used as a platform.

[0057] Figure 9 is an example of a plan view of a vehicle to which a camera module or optical system according to an embodiment of the invention is applied. Referring to Figure 9, the vehicle camera system according to an embodiment of the invention includes an image generation unit 11, a first information generation unit 12, second information generation units 21, 22, 23, 24, 25, 26, and a control unit 14. The image generation unit 11 may include at least one camera module 31 located in the vehicle, and can capture images of the front of the vehicle and / or the driver to generate images of the front of the vehicle and / or the interior of the vehicle. The image generation unit 11 can use the camera module 31 to capture images not only of the front of the vehicle but also of the area around the vehicle in one or more directions to generate images of the area around the vehicle. Here, the front image and surrounding image may be digital images and may include color images, monochrome images, and infrared images. The front image and surrounding image may also include still images and moving images. The image generation unit 11 provides the driver image, the front image, and the surrounding image to the control unit 14. Next, the first information generation unit 12 may include at least one radar and / or camera positioned on the vehicle, and generates first sensing information by sensing what is in front of the vehicle. Specifically, the first information generation unit 12 senses the position and speed of vehicles positioned in front of the vehicle, the presence and position of pedestrians, etc., and generates first sensing information.

[0058] The first sensing information generated by the first information generation unit 12 can be used to control the vehicle to maintain a constant distance between itself and the vehicle in front, thereby improving the stability of vehicle operation in specific cases, such as when the driver attempts to change the lane of the vehicle or when reversing into a parking position. The first information generation unit 12 provides the first sensing information to the control unit 14. The second information generation units 21, 22, 23, 24, 25, and 26 sense each side of the vehicle and generate second sensing information based on the forward image generated by the image generation unit 11 and the first sensing information generated by the first information generation unit 12. Specifically, the second information generation units 21, 22, 23, 24, 25, and 26 may include at least one radar and / or camera positioned on the vehicle, which can sense the position and speed of vehicles located on the sides of the vehicle and capture images. Here, the second information generation units 21, 22, 23, 24, 25, and 26 may be positioned at both front corners of the vehicle, the side mirrors, and the rear center and both rear corners, respectively.

[0059] At least one information generation unit in such a vehicle camera system may include the optical system and camera module having the same described in the embodiments disclosed above, and can provide or process information acquired through the front, rear, sides, or corner areas of the vehicle to the user to protect the vehicle and objects from autonomous driving or surrounding safety. The optical system of the camera module according to embodiments of the invention can be applied to a LiDAR camera or sensing device to recognize the surrounding environment of a moving object such as a vehicle in real time. Furthermore, multiple camera modules according to embodiments of the invention may be mounted in a vehicle to enhance safety regulations, autonomous driving functions, and convenience using ADAS (Advanced Driving Assistance System). In addition, the optical system of the camera module is applied in a vehicle as a component for control such as a lane keeping assistance system (LKAS), lane departure warning system (LDWS), and driver monitoring system (DMS). The optical system and camera module having the same disclosed in embodiments of the invention can embody stable optical performance even with changes in ambient temperature, providing a price-competitive module and ensuring the reliability of vehicle components.

[0060] The features, structures, and effects described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to one embodiment. Furthermore, the features, structures, and effects exemplified in each embodiment can be combined or modified for implementation in other embodiments by a person with ordinary skill in the art to which the embodiment belongs. Therefore, such combinations and modifications should be interpreted as being within the scope of the present invention.

[0061] Furthermore, although the above description has focused on examples, these are merely illustrative and do not limit the present invention. A person with ordinary skill in the art to which the present invention belongs will be able to make various modifications and applications not exemplified above, without departing from the essential characteristics of these examples. For example, each component specifically presented in the examples can be modified and implemented. Such differences in modifications and applications should be interpreted as being included within the scope of the present invention as defined in the appended claims.

Claims

1. Image sensor and An image signal processing chip that interfaces with the aforementioned image sensor, A main board having the aforementioned image sensor mounted on one side and an image signal processing chip mounted on the other side, An adhesive member is placed between the main circuit board and the image sensor. The main board includes a first board bonded to the other side of the main board, The first substrate includes a storage hole that penetrates from one side to the other, The image signal processing chip is connected to the other side of the main board via a housing hole in the first board, forming an image sensor module.

2. The memory further includes a memory located on one side of the storage hole, The image sensor module according to claim 1, wherein the memory is connected to the other side of the main board via the storage hole.

3. The system further includes an electronic component located on at least one side of the aforementioned storage hole, The image sensor module according to claim 1, wherein the electronic component is connected to the other side of the main board via the storage hole.

4. The system further includes an oscillator located on one side of the aforementioned storage hole, The image sensor module according to claim 1, wherein the oscillator is connected to the other side of the main board via the housing hole.

5. The image sensor module according to any one of claims 1 to 4, wherein the image signal processing chip is a serializer IC.

6. The image sensor module according to any one of claims 1 to 4, wherein the image signal processing chip is separated from the lower surface of the first substrate.

7. Image sensor and An image signal processing chip that interfaces with the aforementioned image sensor, A main board having the aforementioned image sensor mounted on one side and an image signal processing chip mounted on the other side, An adhesive member is placed between the main circuit board and the image sensor. A first substrate bonded to the other side of the main substrate, A second substrate bonded to the other side of the first substrate, The second substrate includes a power supply module and connector connected to the other side thereof, The first substrate includes a storage hole that penetrates from one side to the other, The image signal processing chip is connected to the other side of the main board via a housing hole in the first board, forming a camera module.

8. The camera module according to claim 7, comprising a lens barrel disposed around the upper part of the second substrate and having a plurality of lenses inside.

9. The system further includes a memory or oscillator located on one side of the aforementioned storage hole, The camera module according to claim 7, wherein the memory or oscillator is connected to the other side of the main board via the housing hole.

10. The system further includes an electronic component located on at least one side of the aforementioned storage hole, The camera module according to claim 7, wherein the electronic component is connected to the other side of the main board via the storage hole.

11. The aforementioned image signal processing chip is a serializer IC, The camera module according to claim 7, wherein the image signal processing chip and the image sensor are directly interfaced via the main board.

12. The thickness of the first substrate is greater than the thickness of the main substrate. The thickness of the second substrate is greater than the thickness of the first substrate. The camera module according to any one of claims 7 to 11, wherein the length of at least one side of the second substrate is greater than the length of at least one side of the first substrate.

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